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How to Control Flex PCB Impedance ?

Introduction

Maintaining controlled impedances on flexible printed circuit boards (flex

PCBs) is critical for high frequency applications like RF circuits, high

speed networking, automated testers, and medical imaging equipment.

The challenges of variable dielectric thickness, dynamic bending, and

conductor adhesion require special modeling and fabrication methods to

achieve consistent impedances.

This article provides an overview of techniques to design and manufacture

controlled impedance flexible circuits to ensure signal integrity and

maximize performance.

Impedance Control Importance

Properly controlling impedance on flex PCBs provides several benefits:

 Minimizes signal reflections that cause noise and interference

 Allows matching with drivers, transmission lines, and receivers

 Enables high frequency performance beyond just physical flexibility

 Reduces EMI generation and susceptibility

 Avoids resonances that can impact signal quality

 Optimizes power transfer and efficiency up to microwave

frequencies

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Flex PCBs without impedance control should be limited to low

frequency analog or digital signals below 10-20MHz that are more tolerant

to impedance mismatches and reflections.

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Modeling Flexible PCB Impedance

Single-sided Flex PCB

Accurate modeling of impedance on flex PCBs considers:

 Thin, variable dielectric thickness

 Lack of solid reference plane

 Impact of bends/folds on dielectric spacing

 Deformation when bent that changes spacing

 Varying conductor width and profile

Common modeling approaches include:

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2D Field Solvers

Most PCB modeling tools rely on 2D field solvers. Requires detailed

cross-section definition considering bending, spacing, dielectric properties,

and adhesive thicknesses. Provides good correlation to actual flex

impedance with proper inputs.

3D Electromagnetic Solvers

Full 3D EM solvers offer the highest accuracy by modeling complex effects

of bending, dielectric variations, and component placement. The

computational requirements limit applications to smaller flex regions.

Lumped Element Models

A lumped parameter model approximates the distributed transmission

line as discrete inductive, capacitive, and resistive elements. Quicker

computations but reduced accuracy. Useful for initial estimates.

Validation Prototypes

Building controlled impedance test coupons allows empirical

measurement and refinement of the models. This tuning of

the simulation tools improves correlation and accuracy.

Developing accurate models requires careful attention to all physical

construction details of the flex laminate materials and stackup.

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Flex Stackup Design

Key considerations when developing the flexible PCB stackup include:

 Select flexible laminate materials with tight

impedance tolerances and stability over bending.

 Minimize number of laminate layers which makes modeling easier.

 Add reference planes wherever feasible to provide low impedance

AC return paths.

 Maintain symmetry between layer dielectric materials and

thicknesses.

 Use thicker copper layers to reduce resistive losses. 1oz baseline

with 2oz in high current areas.

 Model effects of solder mask thickness on impedance.

 Ensure good registration between layers to prevent variations.

An optimized stackup minimizes the variability of parameters impacting

impedance as circuits flex during use.

Trace Geometry Planning

With the stackup defined, transmission line trace geometry can be

selected:

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 Choose initial trace width based on target impedance, typically

between 100-250μm for 50Ω.

 Ensure sufficient insulation clearance around traces based on

voltage.

 Use thicker traces than rigid PCBs due to greater roughness.

 Increase spacing between adjacent traces to control coupling.

 Minimize number of tight bend angles which cause impedance

spikes.

Simulation of actual circuit trace geometry with the defined stackup

provides the route to optimizing widths and spacings to hit target

impedances.

Maintaining Impedance Under Bending

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Special considerations help maintain consistency when flexed:

 Model effects of dynamic bending and folding during use to

quantify impedance deviations.

 Limit the minimum bend radius to reduce impedance variations

and conductor strain.

 Use thinner laminate materials to provide better flexibility without

deforming spacing and dielectric thickness.

 Select laminate materials with elasticity to return to uniform

spacing after bending.

 Increase spacing between conductors to compensate for thickness

changes under bend stress.

Understanding impedance variability under bending through modeling,

material selection, and design allows mitigating changes when circuits are

flexed in actual use.

Manufacturing Processes for Controlled Impedance

Fabrication processes must be optimized for impedance tolerances:

 Surface preparation to remove oxides and promote polymer

adhesion

 Etch processes tuned to achieve precise trace geometry and

minimize undercuts

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 Registration between layers of +/- 0.05mm or better

 Symmetrical bond and lamination pressures to maintain dielectric

spacing

 Minimize adhesive voids which allow variability in dielectric

constant

 Conductor thickness uniformity within 5% across panel

 Cure oven with airflow control to prevent temperature gradients

Tight tolerances and process controls are critical for consistent, repeatable

results compared to standard flex PCBs.

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Validation Testing

To ensure accuracy, testing production boards is necessary:

 Test coupon evaluation – measure impedance on multi-point

coupons for statistical analysis

 Microsectioning – inspect critical layers for proper geometry,

spacing and thickness

 Time domain reflectometry – verify impedance uniformity along

trace length

 Gain-phase analysis – validate performance meets RF

signal response requirements

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Correlating measurements with modeled predictions allows further

refinement of models and improvement of processes to achieve target

impedances.

Summary

 Controlling impedance on flex PCBs requires accurate modeling

considering bending and materials.

 Stackup symmetry, smaller layer count, and reference planes aid

impedance control.

 Tight trace dimensions, controlled fabrication processes,

and microsection validation enable repeatability.

 Modeling and measuring impedance under dynamic bending

improves reliability.

 With robust design-manufacturing coordination, flexible PCBs can

deliver controlled impedances.

Following comprehensive guidelines allows developing flex PCBs with the

impedance control needed for mission-critical and high frequency

applications.

FAQ

How much does bending decrease the impedance on flex PCBs?

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Typical drop is 10-25% when flexed to moderate bend radii. Sharp, tight

bends can reduce impedance by over 50% in extreme cases. The effect

worsens with thinner flex materials.

Does solder mask thickness impact impedance on flex circuits?

Yes, variability in solder mask thickness and its proximity to traces impacts

the capacitance to ground, affecting impedance. Keeping thickness

uniform through tight process control is important.

Can flex PCBs use microstrips instead of striplines?

Yes, but a microstrip construction lacks a controlled reference plane and is

more susceptible to bending variations. A stripline provides the most

consistent impedance under dynamic flexing.

Are there impedance test points on flex PCBs?

Test coupons containing impedance measurement points are often

included in the fabrication panel. This allows characterization and

correlation to modeling predictions.

How often should controlled impedance models be updated?

Models should be refined based on measured results every 6-12 months.

This compensates for any process changes over time. More frequent

updates are recommended when first characterizing.

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Related Posts:

1. How to Measure Impedance Using the Circuit Impedance Formula

2. What is an Inductor Impedance Calculator?

3. Explaining the Electrical Impedance Formula

4. Kicad rigid flex VS Altium flex PCB

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