2136 IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. 71, NO.

3, MARCH 2023

140-GHz Wideband Array Antenna-in-Package

Using Multimode Resonance
Hyunjin Kim , Member, IEEE, and Jungsuek Oh , Senior Member, IEEE

Abstract— A 140-GHz wideband array antenna-in-package (mmWave) communication technologies [8]. Therefore, it is
(AiP) that uses multimode resonance is proposed based on a necessary to study and develop wideband antenna elements.
low-profile multilayer printed circuit board (PCB), which can Several studies have been conducted on the design of
be incorporated with flip-chip technology and an integrated
transceiver. Using the multiple resonances of a patch and λ/4 wideband antennas in the multilayered fabrication process in
monopole-type feeder, a simulated impedance bandwidth of 53% the D-band. Substrate-integrated waveguide (SIW)-fed anten-
and stable radiation performance over the operating band were nas [9], [10] were designed using a low-temperature co-fired
achieved. A 4 × 4 antenna array achieves a gain of up to ceramic (LTCC) substrate. In [11], a D-band resonant cavity
18.1 dBi, a radiation efficiency of 80%, and a cross-polarization antenna with a bandwidth of 14.2% was fabricated using
discrimination (XPD) of over 20 dB. By combining the elements
with a feed network composed of striplines, single and 4 × 4 3-D printing methods was presented. In [12], an impedance
antenna arrays were designed and fabricated. The capacitance bandwidth of 42.8% was achieved using multiple high-order
caused by the limitations of the fabrication process was analyzed modes of the SIW-fed slot antenna. However, these antennas
and overcome using a novel capped-cavity structure. From are fed by waveguides and cannot be interconnected using
the experiment, a −10 dB impedance bandwidth of 31% was mmWave radio-frequency integrated circuits (RFICs). Most
measured.
antennas for silicon-based mmWave modules are designed and
Index Terms— Antenna array, D-band, multilayer PCB, sixth- integrated through a multilayered fabrication process with the
generation (6G), via transition.
interconnection of an RFIC [13], [14], [15]. This is because
antenna-in-package (AiP) can reduce interconnection loss,
I. I NTRODUCTION making the packaging effective and increasing manufacturing
reliability. In addition, AiPs can be scalably extended if they
D -BAND frequencies (ranging from 110 to 170 GHz) have
received considerable attention owing to the wide band-
width. Radar transceivers are used in industrial applications
are connected to an RFIC using flip-chip bonding.
For lower mmWave frequencies, several types of wide-
that require scientific and medical bands, such as 122 GHz, band antennas that can be interconnected with RFICs have
to achieve a wide bandwidth for high-resolution radar sys- been studied and reported. An LTCC L-probe feed patch
tems [1], [2], [3]. Moreover, the D-band frequency is a antenna with an impedance bandwidth of 29% (53–71 GHz)
candidate frequency spectrum for sixth-generation (6G) com- and a soft-surface structure that suppresses the substrate
munication systems [4], [5], [6]. Despite the application of surface wave was reported [16]. Several types of wideband
D-band for satellites, terrestrial exploration, and so on, there patch antennas, such as circular pad or L-probe-fed anten-
are vast wideband channels, including 130–134, 141–148.5, nas, have been proposed [17], [18]. Magnetoelectric (ME)
and 151.5–164 GHz [7]. These wide bandwidths allow for the dipole antenna is widely studied because its broad bandwidth
6G requirement of the Tbps data rate. The opening of the is realized by combining an electric dipole and a short
frequency range between 95 and 3000 GHz by the Federal patch antenna [19], [20], [21]. The ME dipole antennas fed
Communications Commission (FCC) for trial applications by L-shaped probes have impedance bandwidths of 51%
also motivates the development of advanced millimeter-wave (46–70 GHz) [19] and 42.5% (25.5–40.2 GHz) [21].
This article presents a wideband patch antenna that uses
Manuscript received 7 September 2022; revised 5 December 2022; multimode resonance and is organized as follows. Section II
accepted 11 December 2022. Date of publication 24 January 2023; date of
current version 6 March 2023. This work was supported in part by the Institute
presents the multilayer printed circuit board (PCB) layer con-
of Information and Communications Technology Planning and Evaluation figuration and design rules. The design of the antenna element
(IITP) Grant funded by the Korean Government through Ministry of Science and its operating principles are also presented. Section III
and ICT (MSIT) (Innovative Fusion Technologies of Intelligent Antenna
Material/Structure/Network for THz 6G) under Grant 2021-0-00763 and in
presents the 4 × 4 array antenna performance and analysis.
part by the Basic Science Research Program through the National Research In Section IV, a new feedline design is proposed to overcome
Foundation of Korea (NRF) funded by the Ministry of Education under Grant the high capacitance, and it is validated using the experimental
2022R1A6A3A01085999. (Corresponding author: Jungsuek Oh.)
The authors are with the Department of Electrical and Computer
results. Finally, conclusion is presented in Section V.
Engineering, Institute of New Media and Communications (INMC), II. A NTENNA E LEMENT D ESIGN
Seoul National University, Seoul 08826, South Korea (e-mail: hyzinki@
snu.ac.kr; [email protected]). A. Antenna Configuration
Color versions of one or more figures in this article are available at
https://doi.org/10.1109/TAP.2023.3237162. Typical PCB manufacturing processes have difficulty satis-
Digital Object Identifier 10.1109/TAP.2023.3237162 fying the requirements of integrating antenna arrays operating
0018-926X © 2023 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.
See https://www.ieee.org/publications/rights/index.html for more information.

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KIM AND OH: 140-GHz WIDEBAND ARRAY ANTENNA-IN-PACKAGE USING MULTIMODE RESONANCE 2137

Fig. 2. (a) Bird’s eye view and (b) top view of antenna element design.
Fig. 1. Antenna layer structure in advanced multilayer PCB technology.

is demonstrated by considering the capacitance, as shown in

at the D-band frequency, which have minimum trace and spac- Fig. 1.
ing widths of approximately 50–100 µm and a minimum diam- The ANSYS electromagnetic (EM) simulation model of the
eter of approximately 75–100 µm. Under these conditions, antenna element is shown in Fig. 2 with a bird’s eye and
it is difficult to realize its configuration via transition from top view. The antenna consists of a patch, a monopole-type
the RFIC, and the ground space is insufficient to draw signal feeder, and a via the fence. For 45◦ slant polarization, the
traces and power lines. However, a multilayer PCB fabrication feeder was located at the corner of the patch. Although an
process has been established, and advanced technology can L-probe patch antenna typically uses 0.1 0.15λ0 [16], the
provide a minimum trace width and spacing of 30 µm. The antenna is designed using a feeder with a height of λg /4 to
via and pad diameters differ depending on the thickness of achieve a wider bandwidth. The antenna design parameters are
the core and the preimpregnated (prepreg or ppg) layers, shown in Figs. 1 and 2, which are the height of the feeder,
which are presented in Fig. 1. The PCB consists of 12 layers: HM = 0.302 mm, length of the probe, L M = 0.16 mm, width
metallization, core, prepreg, and laser microvias. The steps of the patch, W P = 0.35 mm, length of the patch, L P =
in the fabrication process are illustrated in [22]. The process 0.35 mm, width of the via fence, WV F = 0.65 mm, length of
begins with the core, and the prepreg functions as an adhesive the via fence, L V F = 0.65 mm, and position of the feeder,
to stick the substrates together. After the prepreg solidifies, the PX = PY = 0.19 mm.
metal routes or laser-drilled microvias are fabricated. In this
study, although the drilling of the plated through-holes was B. Antenna Operation Principle
used as the core substrate, both sides of the core substrate
In Fig. 3, the layer structures of various antenna types are
were laser-drilled, and cone-shaped microvias were used. The
shown, and the real part of the input impedance is plotted
relative dielectric permittivity (εr ) of the core and prepreg
to compare the resonant antenna modes. The patch antenna
substrate was 3.4 and 3.2, respectively, and the loss tangent
with direct feed shown in Fig. 3(a) is designed to resonate at
of both substrates was 0.004.
a low D-band (110–120 GHz), as plotted, and a top-loaded
Fig. 1 shows the cross section of the via transition from the
λg /4 monopole antenna in Fig. 3(b) is designed to resonate
bottom metal layer to the upper layers, comprising several via
at the mid-D-band (140–150 GHz), as shown. The proposed
holes and capture pads. The capacitances of the model shown
antenna, as shown in Fig. 3(c), is designed to incorporate both
in Fig. 1 are the pad barrel-to-plate coaxial capacitances,
a coupled feed patch antenna and λg /4 monopole antenna;
C B P , the via barrel-to-plate capacitances, C V P , and fringing
hence, a wideband characteristic can be achieved with a
capacitances, C f [23]. The capacitances C B P and C V P can be
combination of two antenna resonant modes and higher-order
obtained by [24], [25], [26] modes, as shown in Fig. 3(e), respectively. The stacked patch
2π εr ε0 T antenna shown in Fig. 3(d) was designed for comparison with
CBP = (1) the proposed antenna [27], [28], [29], [30]. Although the
ln(R A /R P )
π εr ε0 h B0 stacked patch antenna also exhibits additional resonance, its
CVP = (2) bandwidth is narrower than that of the proposed antenna. The
ln(R A /R0 )
monopole-type feeder of the proposed antenna can provide a
where B0 is the constant coefficient and T and h are the wider bandwidth than the coupled feed structure of the stacked
thicknesses of the copper layer and substrate, respectively, patch antenna.
which indicate that the capacitance increases with increasing T The electric field distributions of the proposed antenna are
and h. From the equations, a larger antipad radius R A , smaller shown in Fig. 4 from 120 to 160 GHz. The electric-field
capture pad radius R P , and smaller via radius R0 are required distribution of the patch antenna T M10 mode can be observed
to achieve a smaller capacitance. Although advanced multi- at 120 GHz, as shown in Fig. 3(a), whereas the electric-field
layer PCB technology can reduce the capacitance using a finer distribution at 140 GHz in Fig. 3(b) and 160 GHz in
fabrication process, the capacitance can affect the performance Fig. 3(c) approaches a top-loaded monopole-type antenna
of the antenna in the D-band. The antenna element design mode at 160 GHz in Fig. 3(d).

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2138 IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. 71, NO. 3, MARCH 2023

Fig. 3. Layer structure of (a) patch, (b) monopole, (c) proposed, and
(d) stacked patch antenna. (e) Compared real part of the input impedance
of various types of antennae.
Fig. 5. S11 of the proposed antenna according to (a) patch size variation and
(b) heights of the monopole feeder.

than −10 dB (S11 < −10 dB) is between 145 and 180 GHz,
as shown in Fig. 5(a). An additional resonant mode can be cre-
ated with a coupled feed patch and adjusted with a patch size
variation. In Fig. 5(b), the S11 values of the different antenna
heights and feeders are plotted. With a decrease in the total
number of antenna layers from 6 to 4, the height of the antenna
feeder also decreases from 0.302 to 0.116 mm. As the height
of the monopole-type feeder decreases, the resonant frequency
increases, and the bandwidth of the total reflection coefficients
decreases. The antenna design and operation using multimode
resonances are confirmed from the simulation results.
In Fig. 6(a), the S11 parametric results of the proposed
antenna are plotted according to the length of the probe feeder.
As the length of the probe feeder increases, inductive coupling
between the probe and patch increases, and the resonant mode
shifts to a lower frequency. In addition, the monopole resonant
Fig. 4. Electric field distributions of the proposed antenna at (a) 120, (b) 140,
mode shifts to a lower frequency with an increase in the length,
(c) 160, and (d) 160 GHz without a patch. and the reflection coefficient decreases with an increase in
inductance. S11 of the proposed antenna is shown in Fig. 6(b)
according to the position of the monopole feeder. As the
C. Parametric Studies and Performance position of the feeder moves outward from the patch, the
S11 of the proposed antenna is shown in Fig. 5 according to coupling points between the probe and patch move outward
the patch size variation and heights of the monopole feeder. from the patch, and the frequency of the resonant mode
The resonant mode of the proposed antenna without a patch is decreases. In addition, the monopole resonant mode shifts to a
approximately 160 GHz, and the reflection coefficient smaller higher frequency because the coupling between the feeder and

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KIM AND OH: 140-GHz WIDEBAND ARRAY ANTENNA-IN-PACKAGE USING MULTIMODE RESONANCE 2139

Fig. 6. S11 of the proposed antenna according to (a) lengths of the probe
feeder and (b) position of the monopole feeder.

the patch decreases; therefore, a lower reflection coefficient

and wider bandwidth can be achieved. Fig. 7. Radiation patterns of antenna element at (a) 120, (b) 130, (c) 140,
The radiation patterns of the proposed antenna elements (d) 150, (e) 160, and (f) 170 GHz.
are shown in Fig. 7. The width and length of the element
ground size, L E L = W E L = 1.6 mm, are determined as
0.75λ0 at 140 GHz to provide suitable antenna gain. The
maximum antenna gain can be stably maintained at approxi-
mately 5.5 dBi from 120 to 170 GHz. The half-power beam
widths (HPBWs) are maintained at approximately 85◦ . As the
frequency increases, the radiation pattern becomes sharper
with an increase in the relative ground size.

III. A NTENNA A RRAY P ERFORMANCE

A 4 × 4 array antenna was designed to verify array
performance, as shown in Fig. 8. The element spacing was
determined as 1.2 mm, which is 0.56λ0 at 140 GHz. Half
of the antenna array was rotated by 180◦ to achieve higher
Fig. 8. Antenna array configuration with rotated feeders.
cross-polarization discrimination (XPD) and port-to-port isola-
tion [31], [32]. The via fences were also incorporated from the
antenna element design stage, which can improve port-to-port frequency in Fig. 9. The isolation, reflection coefficients, and
isolation; hence, the antenna array performance can improve realized gain deteriorate without the via fences because of
the realized gain and bandwidth [33], [34]. A via fence with a the surface wave along the ground plane. In particular, S11 of
lower height was used to achieve a wider bandwidth, as shown the monopole mode resonance at a higher frequency decay
in Fig. 1. The S-parameters and realized gain of the antenna severely. However, a better performance of S11 is established,
array with and without the via fences are plotted against the and the realized gain can be achieved using via fences. Both

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2140 IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. 71, NO. 3, MARCH 2023

Fig. 9. S-parameters and realized gain of the antenna array (a) without via
fences and (b) with via fences.

the S11 bandwidth and 3 dB gain bandwidth are greater

than 70 GHz (120–190 GHz). Although a via fence is used
with a lower height, a port-to-port isolation higher than 15 dB
can be achieved. If greater isolation is required, the height of Fig. 10. Radiation patterns of antenna array at (a) 120, (b) 145, and
the via fence can be adjusted. (c) 170 GHz.
The radiation patterns of the antenna array are plotted at
120, 145, and 170 GHz, as shown in Fig. 10(a)–(c), respec-
tively. The relative element spacing with 1.2 mm becomes
0.48λ0 , 0.58λ0 , and 0.68λ0 at each frequency, respectively.
From the beamformed radiation patterns in the figure, the 6 dB
beam coverage is reduced from ±64 to ±50◦ , as the relative
element spacing increases. With a 180◦ physical rotation
of half the number of antenna arrays, as shown in Fig. 8,
a high-boresight XPD of over 25 dB can be achieved for all
frequencies.

IV. F EEDLINE D ESIGN AND VALIDATION

A. Feedline Design
A stripline is designed to interconnect the antenna element Fig. 11. Geometry of the proposed antenna with feedline (module A).
and the RFIC, as shown in Fig. 11. The stripline is located
between layers 9 and 11, and the other RF routings can
In particular, the capacitance between the capture pad and
be situated from layers 6 to 12. The via transitions are
upper ground, C P P , in Fig. 12(a) can be obtained by
also adapted to connect the bottom to the upper layers. The
capacitance between the capture pads and the ground plane εr ε0 π D 2P
CPP = (3)
can be a bottleneck for performance in terms of bandwidth. h

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KIM AND OH: 140-GHz WIDEBAND ARRAY ANTENNA-IN-PACKAGE USING MULTIMODE RESONANCE 2141

Fig. 14. Measurement setup for S11 of a single antenna.

Fig. 12. E-field distribution of feedline with (a) conventional via transition
and (b) proposed via transition.

Fig. 15. (a) Layer structures and simulation model for S11 validation and
radiation pattern (module B). (b) Photograph of the fabricated modules.

can convert C P P to C B P in (1), and the field intensity

can be decreased significantly. The effect of the proposed
transition can also be found in Fig. 13. The S11 values of
the antenna and feedline with a conventional via transition are
plotted in Fig. 13(a), which deteriorates and exhibits a narrow
Fig. 13. S11 of antenna and feedline with (a) conventional via transition and bandwidth. In contrast, S11 of the antenna and feedline with the
(b) proposed via transition.
proposed via transition in Fig. 13(b) shows better performance
and a wider bandwidth of approximately 40 GHz. Fig. 13 also
where D P is the diameter of the capture pad and h is the plots S11 with the variation in D P , and the degradation of S11
thickness of the substrate. The capacitance should be high can be confirmed by the increase in the diameter in both cases.
because of the limited capture pad size and substrate thickness.
The E-field distribution of the feedline with conventional via B. Antenna With Feedline Validation
transition is shown in Fig. 12(a), and a high field intensity The measurement setup for validating the antenna modules
is observed near the capture pad. A capped cavity, which is shown in Fig. 14. A vector network analyzer (VNA) was
has a hole and surrounding vias, was proposed to reduce the used for measurements with waveguide-connected ground-
capacitance, as shown in Fig. 12(b). The proposed structure signal-ground (GSG) probes and a frequency extension unit.

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2142 IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. 71, NO. 3, MARCH 2023

Fig. 18. Radiation patterns of antenna element with the line at (a) 130,
(b) 140, (c) 150, and (d) 160 GHz.

prevent the warpage of the AiP module. Because of the effect

of the feedline with the via transition and feeder position
adjustment, PX = 0.14 mm, and the simulated bandwidth is
reduced, as shown in Fig. 13(b). The bandwidth was decreased,
and the fractional bandwidth was reduced to approximately
Fig. 16. Compared S11 of modules (a) A and (b) B.
31%. The module structure for S11 validation is illustrated in
Fig. 11(a), and its photograph is shown in Fig. 15(b). The
module could be measured on a ROHACELL foam, and the
measured result shows a similar S11 , as shown in Fig. 16(a).
The figure also shows the effects of the proposed capped
cavity, which plots the bandwidth degradation without the
proposed structure.
The measurement setup for the radiation pattern is illus-
trated in Fig. 17. The VNA is also used with GSG probes and
a frequency extension unit, and a horn antenna is fixed with
a jig, which can manually adjust the measurement angle from
−45◦ to 45◦ . The module structure for validating the radiation
pattern is illustrated in Fig. 15(a), and its photograph is shown
in Fig. 15(b). Although the bandwidth is reduced to 36 GHz,
as shown in Fig. 16(b), because of the via transition, S11 is
sufficient for measuring the radiation pattern. The radiation
patterns of the antenna element with the stripline are plotted
Fig. 17. Measurement setup for radiation pattern of antenna modules. for φ = 0◦ and 90◦ in Fig. 18. The normalized radiation
patterns are plotted at 18(a) 130 GHz, 18(b) 140 GHz, 18(c)
150 GHz, and 18(d) 160 GHz. Measurements were conducted
The extension unit can expand the operating range of the VNA, from −45◦ to 45◦ for increments of every 1◦ , and the results
and frequencies from 110 to 170 GHz can be measured. Fig. 11 show a similar tendency to the simulated results. The radiation
shows the geometry for validating the proposed antenna with a patterns of the antenna array are also plotted for φ = 0◦ and
feedline. An additional cavity structure was appended between 90◦ in Fig. 19. The normalized radiation patterns are plotted
layers 2 and 5 to enhance the copper ratio by over 40% and at 140 GHz, from −45◦ to 45◦ for measurement results.

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KIM AND OH: 140-GHz WIDEBAND ARRAY ANTENNA-IN-PACKAGE USING MULTIMODE RESONANCE 2143

TABLE I
C OMPARISON W ITH P REVIOUS S TUDIES

the 3 dB gain bandwidth of the antenna array achieved a

simulated impedance bandwidth of 53%.

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[21] Y. Li, C. Wang, and Y. X. Guo, “A Ka-band wideband dual-polarized versity, Seoul, South Korea, in 2006, and the M.S.
magnetoelectric dipole antenna array on LTCC,” IEEE Trans. Antennas and Ph.D. degrees in electrical engineering from
Propag., vol. 68, no. 6, pp. 4985–4990, Jun. 2020. Seoul National University, Seoul, in 2009 and 2021,
[22] H. Aliakbari, M. Mosalanejad, C. Soens, G. A. Vandenbosch, and respectively.
B. K. Lau, “Wideband SIW-based low-cost multilayer slot antenna From 2009 to 2020, he was a Staff Engineer at
array for E-band applications,” IEEE Trans. Compon., Packag., Manuf. Samsung Electronics, Suwon, South Korea, respon-
Technol., vol. 9, no. 8, pp. 1568–1575, Aug. 2019. sible for research on advanced antenna technolo-
[23] G. Hernandez-Sosa, R. Torres-Torres, and A. Sanchez, “Impedance gies for communications, advanced network devices,
matching of traces and multilayer via transitions for on-package links,” and mmWave antenna systems. He is currently a
IEEE Microw. Wireless Compon. Lett., vol. 21, no. 11, pp. 595–597, Post-Doctoral Research Fellow at the Department of Electrical and Computer
Nov. 2011. Engineering, Institute of New Media and Communications, Seoul National
[24] I. Ndip et al., “Modeling, quantification, and reduction of the impact of University. His research interests include D-band antenna design, mmWave
uncontrolled return currents of vias transiting multilayered packages and array antenna systems, and metasurfaces.
boards,” IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 421–435,
May 2010.
[25] M. Friedrich, M. Leone, and C. Bednarz, “Exact analytical solution
for the via-plate capacitance in multiple-layer structures,” IEEE Trans. Jungsuek Oh (Senior Member, IEEE) received the
Electromagn. Compat., vol. 54, no. 5, pp. 1097–1104, Oct. 2012. B.S. and M.S. degrees from Seoul National Univer-
sity, Seoul, South Korea, in 2002 and 2007, respec-
[26] H. Lim, D.-H. Lee, J. Kim, and S. Hong, “Spectroscopic sensing method
tively, and the Ph.D. degree from the University of
of liquid permittivity with on-chip capacitor,” J. Electromagn. Eng. Sci.,
Michigan, Ann Arbor, MI, USA, in 2012.
vol. 22, no. 1, pp. 28–33, Jan. 2022.
From 2007 to 2008, he worked with Korea
[27] H. Xu, J. Zhou, K. Zhou, Q. Wu, Z. Yu, and W. Hong, “Planar wide-
Telecom, Seongnam, South Korea, as a Hardware
band circularly polarized cavity-backed stacked patch antenna array for
Research Engineer, working on the development of
millimeter-wave applications,” IEEE Trans. Antennas Propag., vol. 66,
flexible RF devices. In 2012, he was a Post-Doctoral
no. 10, pp. 5170–5179, Oct. 2018.
Research Fellow at the Radiation Laboratory, Uni-
[28] H. Kim et al., “60 GHz digitally controllable and sequentially rotated versity of Michigan. From 2013 to 2014, he was
fed antenna array,” Electron. Lett., vol. 53, no. 13, pp. 821–822, 2017. a Staff RF Engineer with Samsung Research America, Dallas, TX, USA,
[29] M. Stanley et al., “A dual-band dual-polarised stacked patch antenna working as a Project Leader for the 5G/millimeter-wave antenna system.
for 28 GHz and 39 GHz 5G millimetre-wave communication,” in Proc. From 2015 to 2018, he was a Faculty Member with the Department of
13th Eur. Conf. Antennas Propag. (EuCAP), Mar./Apr. 2019, pp. 1–4. Electronic Engineering, Inha University, Incheon, South Korea. He is cur-
[30] I.-J. Hwang, H.-W. Jo, B. K. Ahn, J.-I. Oh, and J.-W. Yu, “Cavity- rently an Associate Professor at the School of Electrical and Computer
backed stacked patch array antenna with dual polarization for mmWave Engineering, Seoul National University. He has published over 50 technical
5G base stations,” in Proc. 13th Eur. Conf. Antennas Propag. (EuCAP), journals and conference papers. His research areas include mmWave beam
Mar./Apr. 2019, pp. 1–5. focusing/shaping techniques, antenna miniaturization for integrated systems,
[31] S. Bhardwaj and Y. Rahmat-Samii, “Revisiting the generation of cross- and radio-propagation modeling for indoor scenarios.
polarization in rectangular patch antennas: A near-field approach,” IEEE Dr. Oh was a recipient of the 2011 Rackham Predoctoral Fellowship
Antennas Propag. Mag., vol. 56, no. 1, pp. 14–38, Feb. 2014. Award at the University of Michigan. He has served as a TPC Member
[32] Y. Kim, H. Kim, I. Yoon, and J. Oh, “4×8 patch array-fed FR4-based and the Session Chair for the IEEE AP-S/USNC-URSI and ISAP. He has
transmit array antennas for affordable and reliable 5G beam steeringFR4- served as a Technical Reviewer for IEEE T RANSACTIONS ON A NTENNAS
based transmit array antennas for affordable and reliable 5G beam AND P ROPAGATION and IEEE A NTENNAS AND W IRELESS P ROPAGATION
steering,” IEEE Access, vol. 7, pp. 88881–88893, 2019. L ETTERS.

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