BG085
BG085
Contacts A B
2.54
2.54
4 2.54 5.08
6 5.08 7.62
Ø1. 8 7.62 10.16
02
5.00
10 10.16 12.70
G 12 12.70 15.24
14 15.24 17.78
16 17.78 20.32
2.54 Recommended PCB Layout Specifications 18 20.32 22.86
20 22.86 25.40
Material
22 25.40 27.94
Contact: Copper Alloy
F B±0.38 5.00 Insulator Material: 24 27.94 30.48
2° Max. Sway & Toe Standard: Polyamide, Nylon 6T, UL 94V-0 26 30.48 33.02
2.54 Options: Polymer, LCP, UL 94V-0 28 33.02 35.56
A±0.25 (Either Direction At The top)
Polyester, PBT, UL 94V-0
1.23 30 35.56 38.10
C±0.2
40 48.26 50.80
Insulator Resistance: 1000 MΩ min.
2.54
Contact Resistance: 20 mΩ max. 42 50.80 53.34
E±0.2
Dielectric Withstanding: AC 600 V 44 53.34 55.88
46 55.88 58.42
Environmental & Mechanical
48 58.42 60.96
Operating Temperature: -40° to +105°C
D Soldering Process: 50 60.96 63.50
Nylon 6T (Standard) - 52 63.50 66.04
2.54
IR Reflow: 260°C for 10 sec. 54 66.04 68.58
Wave: 230°C for 5-10 sec.
56 68.58 71.12
Manual Solder: 350°C for 3-5 sec
LCP (Option) - 58 71.12 73.66
Ordering Grid IR Reflow: 260°C for 10 sec. 60 73.66 76.20
Revision
F PCN
F2
X. ± 0.30
X.X ± 0.20
X.° ± 5°
X.X° ± 2° C Technology, Ltd (GCT).
This drawing must not be copied
or disclosed without written Not to Drawn By Sheet No.
X.XX ± 0.15 X.XX° ± 1°
Date 10/10/17 X.XXX ± 0.10 X.XXX° ± 0.5° 3rd Angle Projection consent. E & OE Scale LYH 1/1
1 2 3 4 5 6 7 8