AURIX™ TC37x variants

About this document

Scope and purpose
This document is an addendum to the TC37x Product Data Sheet and User's Manual, listing all planned product
variants, key parameters such as memory size and optional features.
The User's Manual lists functions implemented on the Silicon, but this document counts functions that are
pinning dependent; i.e. functions are counted that are connected to at least one package pin. As pins are
overlaid with several functions the pinning needs to be checked (see Product Data Sheet) to determine the
number of usable functions in an application.
Naming conventions
Prefix:
• SAK: Tambient Temperature Range from -40 °C up to +125 °C.
• SAL: Tambient Temperature Range from -40 °C up to +150 °C (packaged device).
Feature Package:
• P: Standard feature.
• E: Emulation device with all features of the emulated standard type, additionally full MCDS, overlay
functionality for calibration, AGBT as trace interface for development (depending on the package). Refer to
the Emulation devices Data Sheet for further details.
• C,I,V,Z: Customer Specific.
• A: ADAS ext. Memory.
• T: ADAS + emulation.
• X: Extended Feature device. These products contain the extended memory (EMEM) of the ADAS subsystem.
The ADAS peripherals SPU and RIF are not available.
• M: MotionWise software.
• F: Extended Flash.
• G: Additional Connectivity.
• H: ADAS Standard feature.
• N: Standard feature with AMU.

Datasheet addendum Please read the Important Notice and Warnings at the end of this document v1.5
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AURIX™ TC37x variants

Table of contents

Table of contents

About this document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1 TC37x AA step variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 TC37x AA step (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 TC37x AA step (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Memory maps of TC37x variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Datasheet addendum 2 v1.5

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AURIX™ TC37x variants

1 TC37x AA step variants

1 TC37x AA step variants

1.1 TC37x AA step (part 1)

A table listing the TC37x AA step variants.

Table 1 TC37x_AA step (part 1)

SAL- SAL- SAK- SAK- SAK- SAL- SAK-
TC377TP-96F3 TC375TP-96F TC377TP-96F TC375TP-96F TC377DP-96F TC377DP-96F TC375DP-96F
00S 300W 300S 300W 300S 300S 300W
Step
AA AA AA AA AA AA AA
Production Status
Standard Standard Standard Standard Customer Customer Customer
Specific Specific Specific
Package Type
PG-LFBGA-292 PG-QFP-176 PG-LFBGA-292 PG-QFP-176 PG-LFBGA-292 PG-LFBGA-292 PG-QFP-176
Pinout
LFBGA 0.8 mm LQFP 0.5 mm LFBGA 0.8 mm LQFP 0.5 mm LFBGA 0.8 mm LFBGA 0.8 mm LQFP 0.5 mm
Reference Silicon
TC37x TC37x TC37x TC37x TC37x TC37x TC37x
Temperature Range (Ambient)
SAL SAL SAK SAK SAK SAL SAK
Chip ID
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.

0x89007780 0x89007580 0x89007780 0x89007580 0xC9007780 0xC9007780 0x89007580

Cores / Checker Cores
3/2 3/2 3/2 3/2 2/2 2/2 2/2
Max. Freq. (MHz)
300 300 300 300 300 300 300
Program Flash (MB)
6 6 6 6 6 6 6
Data Flash0 (single-ended) (KB)
256 256 256 256 256 256 256
Total SRAM (without EMEM and Cache) (KB)
992 992 992 992 768 768 768
EMEM Size (KB)
0 0 0 0 0 0 0

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1 TC37x AA step variants

Table 1 TC37x_AA step (part 1) (continued)

SAL- SAL- SAK- SAK- SAK- SAL- SAK-
TC377TP-96F3 TC375TP-96F TC377TP-96F TC375TP-96F TC377DP-96F TC377DP-96F TC375DP-96F
00S 300W 300S 300W 300S 300S 300W
DSPR (KB)
240 in CPU0&1; 240 in 240 in 240 in 240 in 240 in 240 in
96 other CPU0&1; 96 CPU0&1; 96 CPU0&1; 96 CPU0&1 CPU0&1 CPU0&1; 96
other other other other
DLMU (KB)
64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU
PSPR (KB)
64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU
LMU (KB)
0 0 0 0 0 0 0
DAM (KB)
32 32 32 32 32 32 32
AMU1)
No No No No No No No
ADC (Primary Groups/Channels)
4/32 4/25 4/32 4/25 4/32 4/32 4/25
ADC (Secondary Groups/Channels)
4/60 4/45 4/60 4/45 4/60 4/60 4/45
ADC (Fast Compare Channels)
4 4 4 4 4 4 4
ADC (EDSADC Channels)
6 6 6 6 6 6 6
CAN (Modules/Nodes)
2/2x4 2/2x4 2/2x4 2/2x4 2/2x4 2/2x4 2/2x4
FlexRay (Modules/Channels)
1/1x2 1/1x2 1/1x2 1/1x2 1/1x2 1/1x2 1/1x2
HSSL Modules
1 1 1 1 1 1 1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI
12/12/11 12/12/10 12/12/11 12/12/10 12/12/11 12/12/11 12/12/10
QSPI Modules / with LVDS

1 AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon
Representative
Datasheet addendum 4 v1.5
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AURIX™ TC37x variants

1 TC37x AA step variants

Table 1 TC37x_AA step (part 1) (continued)

SAL- SAL- SAK- SAK- SAK- SAL- SAK-
TC377TP-96F3 TC375TP-96F TC377TP-96F TC375TP-96F TC377DP-96F TC377DP-96F TC375DP-96F
00S 300W 300S 300W 300S 300S 300W
5/2 5/2 5/2 5/2 5/2 5/2 5/2
SENT Channels
15 15 15 15 15 15 15
MSC Modules
2 2 2 2 2 2 2
PSI5 Channels
2 2 2 2 2 2 2
PSI5-S Module
Yes Yes Yes Yes Yes Yes Yes
SDMMC Module
No No No No No No No
Max. Ethernet Availability: 1GBit/100Mbit/No
1Gbit/s 100Mbit/s 1Gbit/s 100Mbit/s 1Gbit/s 1Gbit/s 100Mbit/s
(RMII) (RMII) (RMII)
MCDS Availability
miniMCDS miniMCDS miniMCDS miniMCDS miniMCDS miniMCDS miniMCDS
ADAS Cluster Available
No No No No No No No
CIF
No No No No No No No
HSM Available
Yes Yes Yes Yes Yes Yes Yes

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AURIX™ TC37x variants

1 TC37x AA step variants

1.2 TC37x AA step (part 2)

A continuation table listing the TC37x AA step variants.

Table 2 TC37x_AA step (part 2)

SAL-TC375DP-96F300W SAK-TC375TI-96F300W SAL-TC375TI-96F300W
Step
AA AA AA
Production Status
Customer Specific Customer Specific Customer Specific
Package Type
PG-QFP-176 PG-QFP-176 PG-QFP-176
Pinout
LQFP 0.5 mm LQFP 0.5 mm LQFP 0.5 mm
Reference Silicon
TC37x TC37x TC37x
Temperature Range (Ambient)
SAL SAK SAL
Chip ID
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.

0x89007580 0xE9007580 0xE9007580

Cores / Checker Cores
2/2 3/2 3/2
Max. Freq. (MHz)
300 300 300
Program Flash (MB)
6 6 6
Data Flash0 (single-ended) (KB)
256 256 256
Total SRAM (without EMEM and Cache) (KB)
768 992 992
EMEM Size (KB)
0 0 0
DSPR (KB)
240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other
DLMU (KB)
64 per CPU 64 per CPU 64 per CPU

Datasheet addendum 6 v1.5

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AURIX™ TC37x variants

1 TC37x AA step variants

Table 2 TC37x_AA step (part 2) (continued)

SAL-TC375DP-96F300W SAK-TC375TI-96F300W SAL-TC375TI-96F300W
PSPR (KB)
64 per CPU 64 per CPU 64 per CPU
LMU (KB)
0 0 0
DAM (KB)
32 32 32
AMU2)
No No No
ADC (Primary Groups/Channels)
4/25 4/25 4/25
ADC (Secondary Groups/Channels)
4/45 4/45 4/45
ADC (Fast Compare Channels)
4 4 4
ADC (EDSADC Channels)
6 6 6
CAN (Modules/Nodes)
2/2x4 2/2x4 2/2x4
FlexRay (Modules/Channels)
1/1x2 1/1x2 1/1x2
HSSL Modules
1 1 1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI
12/12/10 12/12/10 12/12/10
QSPI Modules / with LVDS
5/2 5/2 5/2
SENT Channels
15 15 15
MSC Modules
2 2 2
PSI5 Channels
2 2 2

2 AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon
Representative
Datasheet addendum 7 v1.5
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AURIX™ TC37x variants

1 TC37x AA step variants

Table 2 TC37x_AA step (part 2) (continued)

SAL-TC375DP-96F300W SAK-TC375TI-96F300W SAL-TC375TI-96F300W
PSI5-S Module
Yes Yes Yes
SDMMC Module
No No No
Max. Ethernet Availability: 1GBit/100Mbit/No
100Mbit/s (RMII) 100Mbit/s (RMII) 100Mbit/s (RMII)
MCDS Availability
miniMCDS miniMCDS miniMCDS
ADAS Cluster Available
No No No
CIF
No No No
HSM Available
Yes Yes Yes

Datasheet addendum 8 v1.5

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AURIX™ TC37x variants

2 Memory maps of TC37x variants

2 Memory maps of TC37x variants

This section describes the influence of the available feature variants on the memory map.

Cores / checker cores

Variants:
• 3/2: umbrella, see User's Manual.
• 2/2: reduced CPU variant, not available is CPU2 including its RAMs (DSPR, DCACHE, DTAG, PSPR, PCACHE,
PTAG, DLMU).

HSM
Variants:
• Yes: umbrella, see User's Manual.
• No: HSM and DF1 are not available.

Ethernet availability
• 1Gbit/s: umbrella, see User's Manual.
• 100Mbit/s (RMII): due to pin limitations in this package the GETH module can be only used in RMII mode.

ADC availability
• Limitation on availability of ADC channels are caused by pin limitations. See Data Sheet for the pinning
table of the package.

Datasheet addendum 9 v1.5

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AURIX™ TC37x variants

Revision history

Revision history
Document Date of Description of changes
version release
V1.0 2019-02-05 • First release.
V1.1 2019-03-01 • Removed devices: SAK-TC377T-96F300S and SAK-TC375T-96F300W.
• Added devices: SAK-TC377DP-96F300S and SAL-TC377DP-96F300S.
V1.2 2019-06-12 • Chapter 1: TC37x AA step variants table format changed to fit all the
contents.
• Chapter 1: Added new row in the variant tables called "AMU" with the
footnote for additional details.
• Chapter: About this document: Feature package definitions are updated
to consistent with the product naming nomenclature definition.
V1.3 2020-01-10 • Chapter 1: New TC37x AA step variants added: SAK-
TC375DP-96F300W,SAL-TC375DP-96F300W .
• Page 1: About the document:Feature Package 'X' definition is updated to
remove CIF.
• Chapter 1:Added new row in the variant tables called "CIF" indicating the
Camera Interface availability.
V1.4 2020-04-30 • Chapter 1: New TC37x AA step variants added: SAK-TC375TI-96F300W,SAL-
TC375TI-96F300W .
• About this document section: Added an additional note for the Feature
package 'E'.
V1.5 2020-11-18 • Chapter 1: Removed Bare Die Marking variant SAL-TC370TP-96F300.

Datasheet addendum 10 v1.5

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