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What Is IC Substrate ?
Integrated circuit substrates have shot to prominence in recent times. It

has resulted from the emergence of integrated circuit types such as

chip-scale package (CSP) and ball grid package (BGP). Such IC

packages call for novel package carriers, something that gets accounted

for by IC substrate. As an electronics designer or engineer, it no longer

proves sufficient to understand the importance of IC package substrate.

You have to comprehend the IC substrate manufacturing process, the role

substrate ICs play in the proper functioning of electronics, and its

application areas.

Table of Contents

IC Substrate

IC substrate is a baseboard type utilized in the packaging of bare

integrated circuit chips. The substrate IC proves important in connecting

the chip and the circuit board. Integrated circuits fall under a transitional

product that serves to capture semiconductor integrated circuit

chip, routing to link the chip with the PCB, and safeguard, support, and

reinforce the IC chip, thereby giving it a thermal dissipation tunnel.

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Integrated circuit substrate plays a crucial role as connectors of the

printed circuit boards to the semiconductor chip. It acts as the conduit and

thus requires capacity on IC fabricators to provide interconnect densities

that surpass those of PCB fabricators during the IC substrate

manufacturing process. Consequently, manufacturers will need a

possessing proven specialty and solutions in chemical expertise

regarding high-density designs.

Integrated circuit substrates are diverse and fall under different

classifications. To comprehend all of this better, we will look at each

classification and the various types under each class.

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Integrated Circuit Substrates

Integrated Circuit Substrates

Classification by Packaging Types

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 BGA Integrated Circuit Substrate. It is an IC substrate that performs

well in electrical and thermal dissipation performance. Since it can

radically increase the chip pins, it becomes suitable for integrated

circuit packages with pin counts that exceed three hundred.

 CSP Integrated Circuit Substrate. It is a lightweight single chip

package type with a miniaturized scale. The CSP IC substrate mainly

gets deployed in telecommunication and memory products having

a small pins number.

 FC Integrated Circuit Substrate. The flip-chip type package features

low circuit loss, low signal interference, effective and

well-performed thermal dissipation.

 MCM Integrated Circuit Substrate. The MCM stands for multi-chip

module. It is an IC substrate that absorbs chips performing diverse

functions housed in a single package. Consequently, the product

comes as an ideal solution because of thinness, lightness,

miniaturization, and shortness. Naturally, this substrate type cannot

perform well in thermal dissipation, signal interference, fine routing,

etc., because multiple chips get packaged into one.

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Classification by material characteristics

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 Rigid Integrated Circuit Substrate. Primarily constituted of ABF

resin, BT resin, or epoxy resin. It has a coefficient of thermal

expansion of approximately 13-17ppm/°C.

 Flex Integrated Circuit Substrate. The IC substrate has PE or PI resin

as its primary constituents and features a CTE of 13-27ppm/°C

 Ceramic Integrated Circuit Substrate. It contains the ceramic

materials like Aluminium nitride, Aluminium oxide, or silicon

carbide. The ceramic IC has a comparatively low CTE ranging from

6-8ppm/°C

Classification by bonding technology

 Tape Automated Bonding (TAB)

 Wire Bonding

 FC Bonding

While the importance of IC substrate cannot get understated, it is

impossible to talk about it without touching on IC packaging. Remember, it

is one of the prominent classification types of the integrated circuit

substrate.

IC packaging refers to the material that contains the semiconductor device.

As a package encasing the IC substrate, it protects it against physical

damage or corrosion besides allowing for mounting of electrical contacts.

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It is especially vital in connecting the electrical contacts to the PCB. Diverse

design types of integrated circuits packaging systems exist. Considerations

for these varied types become important as each possesses distinctive

needs regarding their outer shell.

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IC Packaging

It often comes as the last step in semiconductor devices production. At

this stage, the semiconductor receives a casing that protects the

integrated circuit from detrimental external elements or age-related

corrosion. The casing by design protects the block besides promoting

electrical contacts, which deliver signals to an electronic device’s circuit

board.

The IC packaging tech evolved from the BGA packages of the 1970s when

they became popular among EPMs (electronic packaging manufacturers).

However, from the onset of the 21st century, fresher versions and options

overshadowed pin grid array packages. Such technologies included the

small thin outline and the plastic quad flat pack packages. Currently, more

advanced packaging technologies exist like the FCBGA (flip-chip ball grid

arrays), an upgrade of the land grid array packages.

IC packaging designs

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IC packaging designs also have different categorizations dependent on

formation. It includes the substrate type and the lead-frame type. While

the two form the primary categorization of IC packaging designs, other

secondary categorization forms exist. Here, you will find the following.

 Pin-grid array. It gets deployed in socketing.

 Dual-inline and lead-frame packages

 Such packages get used for assemblies that require pins to go

through holes.

 Chip scale package. It is a direct surface mountable single-die

package. It has a small area (1.2 times smaller than that of the die)

 Quad flat pack. It is a leadless package type, though it has a lead

frame.

 Quad flat no-lead. It is a tiny package, close to resembling a chip

size and primarily deployed for surface mounting.

 Multichip package. Also referred to as multichip modules, the

package integrates discrete components, semiconductor dies, and

multiple ICs onto a substrate. Consequently, such an arrangement

makes it a multichip package and resembles a bigger IC.

 Area array package. It is a type of package that provides maximum

performance and conserves space by utilizing any remaining area of

the chip’s surface for interconnection.

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You should note that most companies, including RayMing PCB ad

Assembly, use the area array packages like the BGA one. It arises because

of the need for multichip structures. Such packages and modules present

leading options to solutions utilizing the system-on-chip format. If you,

therefore, want to get yourself an ideal IC with the correct substrate and

packaging, it helps to consider all these before contacting us.

However, we also offer world-class customer care services. You will get

guided appropriately if you cannot figure out the best substrate or

packaging type for your integrated circuit.

Applications of Integrated Circuit Substrate PCB

IC substrate PCB mainly applies to specific electronic products. Such

products have to prove thin, lightweight, and with advanced functions.

Therefore, you will find IC substrate PCB on smartphones, tablet PCs,

laptops, and networks primarily in medical care, telecommunication,

aerospace, industrial control, and the military. In most instances, you will

find it as a mini-led PCB, though micro led is one of the IC

substrate applications as well.

Most rigid printed circuit boards have transformed through multiple

innovations, ranging from multilayer PCB, substrate-like PCBs, or SLPs,

traditional HDI printed circuit boards to integrated circuit substrate PCB.

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Features of an Integrated Circuit

An IC substrate needs to have specific characteristics that can align with

the features of an integrated circuit. Electronic engineers and designers

have to understand the attributes of an integrated circuit to select the

best IC substrates when designing their ICs. So what are some of these

crucial IC features?

 Small circuit. An integrated circuit is usually miniaturized, and thus

the design, installation, and debugging processes need to prove

uniform and simple.

 Cost-effectiveness. All integrated circuits often exhibit higher

performance coupled with relatively low costs compared to their

discrete components.

 Reliability. Integrated circuits come highly reliable as a lot of work

has enhanced their reliability over the years, especially in their

performance and consistency. Soldering joints get reduced

significantly in integrated circuits. Additionally, the need for virtual

welding is also reduced, making the IC extra reliable.

 Lower failure. Integrated circuits possess a lesser failure rate

compared to ordinary circuits.

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 Energy-efficient. Integrated circuits are also energy efficient as they

consume less energy or power, come in smaller volumes and fetch

at lower prices.

Such attributes also double up as some of the most vital benefits of

integrated circuits. However, it does not stop there. Consideration should

also get placed on the IC substrate characteristics, especially when

designing your electronic product’s IC.

Attributes of an IC Substrate

 Integrated circuits have numerous and diverse features. It includes

the following.

 Light when it comes to weight

 Fewer lead wires and soldered joints

 Highly reliable

 Enhanced performance when other attributes such as reliability,

durability, and weight get factored in

 Small size

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Manufacturing Process of IC Substrate PCB

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IC Substrate PCB

As already explained, integrated circuit substrate acts as the primary

connection between a printed circuit board and the IC chip. It

accomplishes this by the network of conductive traces and holes. But what

does the manufacturing process of an IC substrate look like?

Manufacturing Steps

 Copper patterning and plating. This is the first step in the

manufacturing process. It involves the copper platting tech and

patterning, which correlates to diverse technological aspects like

circuit and control compensation technology, uniform control of

copper plating thickness, and fine-line fabrication technology.

 Solder mask. It follows the copper patterning and plating process.

The solder mask for integrated circuit substrate PCB consists of hole

filling and solder mask printing technologies. IC substrate PCBs

have consistently permitted less than ten-micrometer height

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difference of substrate between solder mask and pad. However,

more than fifteen micrometers is not recommendable.

 Surface finishing. In this step, it is crucial to ensure a uniform

thickness of the surface finish. It involves the use

of ENEPIG and ENIG surface finishes, which are acceptable across

the board.

 Inspection and reliability tests. It comes as the last step in the

manufacture of IC substrate. Here, the integrated circuit substrate

has to get tested for reliability besides getting inspected to certify

quality. However, the technology deployed in testing reliability and

inspection proves different from those utilized in standard printed

circuit boards.

However, it is prudent to understand that the manufacturing process of

integrated circuit substrate PCB is not straight forward, despite the steps

enumerated above. To better bring everything into perspective regarding

the fabrication or manufacturing process, we will look into the different

technologies involved in-depth.

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Technologies Involved in the Integrated Circuit Production

Process

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Plenty of diverse and advanced technologies get involved in every stage of

the IC production process. The technologies help manufacturers

ensure high quality, high-capacity, and high precision interconnection

products for progressive IC packaging and simultaneously optimize their

cost-efficiency and productivity.

· Direct Imaging Systems

The direct imaging technology solution aims to specifically handle most of

the challenging FCBGA (flip-chip ball grid array), FCCSP (flip-chip chip scale

package), module, and BGA/CSP (ball grid array/chip scale package)

applications. It thus enables fabricators or manufacturers to realize higher

yields besides lowering their TCO (total cost of ownership). The technology

delivers unmatched results, including fine-line imaging down to about

8µm, greater and high throughput registration accuracy. Such ascertained

systems back the modified semi-additive process and semi-additive

process, besides other novel substrate processes.

It finds its application in fine-line direct imaging of plate-resist and

etch-resist FCBGA), FCCSP, and BGA/CSP.

· Automated Optical Inspection Systems

An automated optical inspection enables high throughput and

high-resolution inspection. It harnesses numerous light sources in the

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inspection of the integrated circuit substrate panel through a solo scan.

Consequently, it delivers unparalleled detection precision and supreme

production efficiency.

It finds its application in fine pattern inspection of FCBGA and FCCSP

integrated circuit substrates.

· AOS or Automated Optical Shaping Systems

The AOS has a range of solutions that deliver the ultimate quality shaping

of short defects in top cutting-edge integrated circuit substrate boards.

The action of accurately shaping complicated or fine panel defects that

might otherwise have gotten scrapped enables integrated circuit substrate

manufacturers to enhance the yield drastically besides reducing their

scrap. It thus ensures high volumes of high-quality boards. This is a fully

automated and easy-to-operate process coupled with high throughput. It,

therefore, delivers noteworthy savings when it comes to staffing, complete

with a low TCO (total cost of ownership).

It finds its application in the AOS of short defects in FCGBA and FCCSP

integrated substrates.

· UV Laser Drilling Systems

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The ultraviolet laser drilling ability answers some of the most challenging

integrated circuit substrate app questions. It delivers extreme

performance besides production yield. The UV-laser drilling system has

an incredible beam quality, superior accuracy of 6μm, and a fine via size of

20µm diameter. Therefore, it is ideal for advanced integrated circuit

substrate applications like FCBGA. Further, it is boosted to support

progressive packaging applications such as embedded die, organic

interposers, and LTCC (low temperature co-fired ceramic). It primarily

applies in drilling through-hole and blind vias in embedded dies, FCBGA,

and LTCC.

· Inkjet or Additive Printing Systems

The technology delivers high accuracy, high productivity, and high-quality

printing at low TCOs. It aims to print dams for FCCSP, BGA, and SiP

(advanced system in package) modules by design. Consequently, it

enables fabricators to save costs and space when limiting underfill leakage

by depositing a protective barrier to close off the adjoining die area. The

technology also allows selective insulation layer printing like the QFN

(quad flat no-lead) package, an integrated circuit substrate, etc. It,

therefore, eliminates the costly lithography steps, simplifies the orthodox

process, and limits the operational costs. Additionally, it enables a quicker

ramp-up and time to the market for fresh or new products.

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The additive printing systems technology provides a smart and safe

CAM-ready (computer-aided manufacturing) option for 2D and legend

barcode package marking. Such markings eradicate the damage risks

arising from contact or heat. It provides accurate and uniform material

deposition on complex and uneven surfaces, complete with precise

pattern alignment at high contrast, high speed, and fine-feature printing.

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Design Consideration for Integrated Circuits

If you want to settle for an ideal IC package or IC substrate, it helps to

comprehend and consider the various technical details regarding the

integrated circuit design. A case in point involves knowing the correct

material composition and substrate for your integrated circuit package.

Additionally, it is vital to comprehend the difference that exists between

the tape and rigid package substrate. Other companies also opt to use

laminates as a substitute to select substrates and lead frames, especially

those that function properly with metal conductors. So, what design

considerations should you focus on?

· Material Composition

An integrated circuit performance relies heavily on its electrical, chemical,

material, and electrical makeup. While the laminate packages and

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lead-frame have functional differences, they both depend on material

composition. Lead-frame packages, the predominant format, utilize gold

or silver wire-bond finishes attached through the spot-plating method. It

simplifies the process and makes it affordable.

Ceramic packages predominantly deploy alloy 42 as the metal type as it

functions with the core material. On the other hand, plastic packages

prefer copper lead frames to protect the solder joint besides providing

conductivity. Certain countries have policies that encourage material

consideration as a critical factor on SM (surface mount) plastic packages.

Frequent revisions of the European standards have subjected the lead

finish to intense scrutiny regarding the next-level packaging assembly. It

has stemmed from the need to get possible replacements for the tin-lead

solders that prove simple to apply besides becoming an industry staple.

However, fabricators are yet to coalesce around one solution because of

widespread competition between suppliers. Therefore, the lead question

proves one that will stay unresolved for some time.

Since the 1970s, laminates have emerged as viable options to lead frames

in chip-to-board assemblies. Currently, laminates are prevalent in the

integrated circuit packaging solutions industry due to their considerable

cost-effectiveness when contrasted against ceramic substrates.

High-temperature and organic substrates remain among the top and

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common laminates. Such laminates offer superior electrical attributes

besides proving affordable.

· Applicable Substrates

The rise of semiconductor packages and their popularity has prompted an

increase in demand for applicable interposers and substrates. A substrate

forms an integral part of the integrated circuit package, and it provides the

board with mechanical strength besides allowing it to link with external

components and devices. The interposer, on the other hand, enables

connective routing within the package. It is also ideal to note that the

terms “interposer” and “substrate” get used interchangeably in some

instances.

· Difference Between Tape and Rigid Package Substrates

Package substrates often come as tape or rigid varieties. Rigid substrates

come firm with a defined shape, while the tape substrates prove flexible

and slim. At the onset, integrated circuits featured ceramic material in

terms of composition, though it currently consists of the organic substrate

material.

Whenever a substrate contains a stack of multiple and thin layers that give

rise to a rigid substrate, it gets inferred as a laminate substrate. Integrated

circuit manufacturing features two predominant and standard laminate

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substrates in bismaleimide-triazine (BT) and FR-4. An FR-4 comprises

epoxy, while the BT comprises of a high-grade resin material.

BT resin’s emergence as a favorite in the industry stems from its

low dielectric constant and insulation qualities. BT gets deployed in almost

every other substrate when it comes BGAs. Additionally, it also proves

adept as a resin option for CSP (chip scale package) laminates. However,

many industry players are fabricating new epoxy-blends and epoxy

alternatives that should provide a stern competition to the BT. The

outcome of this competition will encompass a possible reduction of prices

in due course.

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Tape substrates come as an ideal alternative to a rigid substrate. It mainly

gets constituted by polyimide and other temperature-tolerant and durable

materials. The benefits of tape substrates encompass their capacity to

carry circuits while moving. Consequently, the flexibility makes it a popular

option in mobile devices such as disk drives. Additionally, tape substrates

have a low weight that ensures no additional weight to the surface upon

which they get applied to.

· Substrates Designed to Assist Metal Conductors

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Integrated circuit packages should also have metal conductors capable of

routing signals to various interconnecting features. Because of this, the

substrate needs to facilitate the process. Substrates often route the

output and input signals of the chip to various features in packages.

Copper, typically the placement foil, get bonded to the substrate’s

laminate to achieve metal conductivity. Nickel or gold immersion layers

get applied atop the copper as finishes to stop oxidation and

inter-diffusion.

Final Thoughts

IC substrates are crucial for linking the PCB and IC chip in electronics.

Because of this, understanding everything you can about them can

become the difference when it comes to a successful or faulty IC design

for your electronic application. Therefore, consider the aspects discussed

when designing your IC for a better outcome.

Related Posts:

1. What is Substrate in a PCB?

2. What is Alumina Substrate?

3. How to Choose the Best PCB Substrate for Board

4. What Is Multilayer Fr4 PCB Substrate Material?

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