Standard VDSS ID25 RDS(on)

Power MOSFET IXTH / IXTM 6N90 900 V 6A 1.8 Ω

IXTH / IXTM 6N90A 900 V 6A 1.4 Ω

N-Channel Enhancement Mode

Symbol Test Conditions Maximum Ratings TO-247 AD (IXTH)

VDSS TJ = 25°C to 150°C 900 V

VDGR TJ = 25°C to 150°C; RGS = 1 MΩ 900 V
VGS Continuous ±20 V D (TAB)

VGSM Transient ±30 V

ID25 TC = 25°C 6 A
TO-204 AA (IXTM)
IDM TC = 25°C, pulse width limited by TJM 24 A
PD TC = 25°C 180 W
TJ -55 ... +150 °C
TJM 150 °C
T stg -55 ... +150 °C G

Md Mounting torque 1.13/10 Nm/lb.in. G = Gate, D = Drain,

S = Source, TAB = Drain
Weight TO-204 = 18 g, TO-247 = 6 g
Maximum lead temperature for soldering 300 °C
1.6 mm (0.062 in.) from case for 10 s
Features
l International standard packages
l Low RDS (on) HDMOSTM process
l Rugged polysilicon gate cell structure
l Low package inductance (< 5 nH)
- easy to drive and to protect
l Fast switching times

Symbol Test Conditions Characteristic Values

(TJ = 25°C, unless otherwise specified) Applications
min. typ. max.
l Switch-mode and resonant-mode
VDSS VGS = 0 V, ID = 3 mA 900 V power supplies
l Motor controls
VGS(th) VDS = VGS, ID = 250 µA 2 4.5 V l Uninterruptible Power Supplies (UPS)
l DC choppers
IGSS VGS = ±20 VDC, VDS = 0 ±100 nA

IDSS VDS = 0.8 • VDSS TJ = 25°C 250 µA

VGS = 0 V TJ = 125°C 1 mA Advantages
l Easy to mount with 1 screw (TO-247)
R DS(on) VGS = 10 V, ID = 0.5 ID25 6N90 1.8 Ω
6N90A 1.4 Ω (isolated mounting screw hole)
l Space savings
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
l High power density

IXYS reserves the right to change limits, test conditions, and dimensions. 91543E(5/96)

© 2000 IXYS All rights reserved 1-4

 IXTH 6N90 IXTH 6N90A
IXTM 6N90 IXTM 6N90A

Symbol Test Conditions Characteristic Values

(TJ = 25°C, unless otherwise specified) TO-247 AD (IXTH) Outline
min. typ. max.

gfs VDS = 10 V; ID = 0.5 • ID25, pulse test 4 6 S

Ciss 2600 pF 1 2 3

Coss VGS = 0 V, VDS = 25 V, f = 1 MHz 180 pF

Crss 45 pF

t d(on) 35 100 ns
tr VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 ID25 40 110 ns
td(off) RG = 4.7 Ω, (External) 100 200 ns Terminals: 1 - Gate 2 - Drain
3 - Source Tab - Drain
tf 60 100 ns
Dim. Millimeter Inches
Min. Max. Min. Max.
Q g(on) 88 130 nC
A 4.7 5.3 .185 .209
Q gs VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 ID25 21 30 nC A1 2.2 2.54 .087 .102
A2 2.2 2.6 .059 .098
Q gd 38 70 nC b 1.0 1.4 .040 .055
b1 1.65 2.13 .065 .084
R thJC 0.7 K/W b2 2.87 3.12 .113 .123
C .4 .8 .016 .031
R thCK 0.25 K/W D 20.80 21.46 .819 .845
E 15.75 16.26 .610 .640
e 5.20 5.72 0.205 0.225
L 19.81 20.32 .780 .800
L1 4.50 .177
Source-Drain Diode Characteristic Values
∅ P 3.55 3.65 .140 .144
(TJ = 25°C, unless otherwise specified) Q 5.89 6.40 0.232 0.252
Symbol Test Conditions min. typ. max. R 4.32 5.49 .170 .216
S 6.15 BSC 242 BSC
IS VGS = 0 V 6 A

ISM Repetitive; pulse width limited by TJM 24 A

TO-204AA (IXTM) Outline
VSD IF = IS, VGS = 0 V, 1.5 V
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %

t rr IF = IS, -di/dt = 100 A/µs, VR = 100 V 900 ns

Pins 1 - Gate 2 - Source

Case - Drain

Dim. Millimeter Inches

Min. Max. Min. Max.
A 6.4 11.4 .250 .450
A1 3.42 .135
∅b .97 1.09 .038 .043
∅D 22.22 .875
e 10.67 11.17 .420 .440
e1 5.21 5.71 .205 .225
L 7.93 .312
∅ p 3.84 4.19 .151 .165
∅p 1 3.84 4.19 .151 .165
q 30.15 BSC 1.187 BSC
R 13.33 .525
R1 4.77 .188
s 16.64 17.14 .655 .675

© 2000 IXYS All rights reserved IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715
2-4
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
 IXTH 6N90 IXTH 6N90A
IXTM 6N90 IXTM 6N90A

Fig. 1 Output Characteristics Fig. 2 Input Admittance

9 9
VGS = 10V 7V
8 8
TJ = 25°C
7 7
6 6

ID - Amperes
ID - Amperes

5 5
TJ = 25°C
4 4
3 3
6V
2 2
1 1
0 0
0 5 10 15 20 25 30 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5

VDS - Volts VGS - Volts

Fig. 3 RDS(on) vs. Drain Current Fig. 4 Temperature Dependence

of Drain to Source Resistance
3.0 2.50
TJ = 25°C
2.25
2.8
RDS(on) - Normalized

2.00
RDS(on) - Ohms

2.6
1.75
2.4 1.50
VGS = 10V ID = 2.5A
1.25
2.2
VGS = 15V 1.00
2.0
0.75

1.8 0.50
0 2 4 6 8 10 -50 -25 0 25 50 75 100 125 150

ID - Amperes TJ - Degrees C

Fig. 5 Drain Current vs. Fig. 6 Temperature Dependence of

Case Temperature Breakdown and Threshold Voltage
7 1.2
BVCES VGS(th)
6 1.1
6N90A
BV/VG(th) - Normalized

5 1.0
ID - Amperes

6N90
4 0.9

3 0.8

2 0.7

1 0.6

0 0.5
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150

TC - Degrees C TJ - Degrees C

© 2000 IXYS All rights reserved 3-4

 IXTH 6N90 IXTH 6N90A
IXTM 6N90 IXTM 6N90A

Fig.7 Gate Charge Characteristic Curve Fig.8 Forward Bias Safe Operating Area
10
10µs
9 VDS = 500V
ID = 3.0A
8 I = 10mA 10
G Limited by RDS(on) 100µs
7

ID - Amperes
VGE - Volts

6
1ms
5
4 1
10ms
3
2 100ms
1
0 0.1
0 10 20 30 40 50 60 70 80 1 10 100 1000

Gate Charge - nCoulombs VDS - Volts

Fig.9 Capacitance Curves Fig.10 Source Current vs. Source

to Drain Voltage
2750 9
Ciss
2500 8
2250
7
2000
Capacitance - pF

6
ID - Amperes

1750
f = 1 MHz 5
1500 VDS = 25V
1250 4
1000 3
750 TJ = 125°C
2
500 TJ = 25°C
Coss
250 1
Crss
0 0
0 5 10 15 20 25 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4

VCE - Volts VDS - Volts

Fig.11 Transient Thermal Impedance

1.000
D=0.5
Thermal Response - K/W

D=0.2

0.100 D=0.1
D=0.05
D=0.02
D=0.01
0.010
Single Pulse

0.001
0.00001 0.0001 0.001 0.01 0.1 1 10

Time - Seconds

© 2000 IXYS All rights reserved 4-4

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