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Verilog Design Flow

The Verilog design flow consists of 8 steps: 1) System specification defines objectives, costs and architecture. 2) Architectural design decides layout to meet specifications. 3) Functional design refines specifications into system behavior. 4) Logic design adds structure while optimizing for performance. 5) Circuit design replaces logic with electronic components and simulates timing. 6) Physical design finalizes component placement and interconnects. 7) Fabrication manufactures the design onto silicon wafers using photolithography. 8) Packaging and testing seals packaged chips and tests them before sending to customers.

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42 views

Verilog Design Flow

The Verilog design flow consists of 8 steps: 1) System specification defines objectives, costs and architecture. 2) Architectural design decides layout to meet specifications. 3) Functional design refines specifications into system behavior. 4) Logic design adds structure while optimizing for performance. 5) Circuit design replaces logic with electronic components and simulates timing. 6) Physical design finalizes component placement and interconnects. 7) Fabrication manufactures the design onto silicon wafers using photolithography. 8) Packaging and testing seals packaged chips and tests them before sending to customers.

Uploaded by

2229029
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
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Verilog Design Flow

1. System specification: The objective of the desired final product is written in this
step. During system specification, the designated cost of the system, its performance,
architecture, and how the system will communicate with the external world are to be
determined. During this step, the design specification should be provided by the users
or clients.

2. Architectural design: The basic architecture of the desired design must meet the
system specifications of the desired design. The architecture of the desired design is
decided and the layout for the same is designed by design engineers. Architectural
design includes the integration of analog and mixed-signal blocks, memory
management, internal and external communication, power requirements, and choice
of process technology and layer stacks.

3. Functional design or Behavioural design: It consists of refining the design


specification of the desired design in order to design the functional behavior of the
desired system. The main objective of this is to generate design a high-performance
architectural design within the cost requirements posed by the specifications.

4. Logic Design: In this step, the structure of the desired design is added to the
behavioral representation of the desired design. The main specifications to be
considered for logic design are logic minimization, performance enhancement, and
testability. Logic design must also consider the problems associated with test vector
generation, error detection, and error correction. Many logic synthesis tools have been
developed for the automation of the process of logic design.

5. Circuit Design: In this step, the logic blocks of the desired design are replaced by
the electronic circuits, which are consists of electronic devices such as resistors,
capacitors, and transistors. Circuit simulation of the desired design is done at this
stage, in order to verify the timing behavior of the desired system. Kirchhoff’s laws
are used to know the behavior of the electronic circuit in terms of node voltages and
branch circuits. The result of integrodifferential equations is then solved in discrete-
time. SPICE is a well-known program for circuit simulation.

6. Physical Design: In this step, the actual layout of the desired system is done, where
all the components will be placed in the circuit and all these components are
interconnected. The actual layout of the desired system can affect the area, correctness,
and performance of the final desired product. The correctness of the chip is also
controlled by the physical design. A circuit design that passes the test of a circuit
simulator may be faulty after it has been packaged. This is because of geometric
design rule errors. These design rules must be followed to ensure the correctness of
the chip fabrication. Errors such as short circuits, open circuits, open channels, etc
may result if the design rules are not respected.

7. Fabrication: After the actual layout and verification of the desired design, the
design is sent for manufacturing. The handoff of the desired design to the
manufacturing process is called tapeout. Generation of the data for manufacturing is
referred to as streaming out. The desired design is onto the different layers of the
design using the photolithographic process. ICs are manufactured on round silicon
wafers with a diameter from 200mm to 300mm, these ICs are then tested and are
marked as either functional or defective ICs.

8. Packaging and Testing: After fabrication of desired design, functional chips are
then packed. Packaging is configured early in the desired design process and the
application along with the cost and form factor requirements. Packaged types may
include Dual In-Line Packaged (DIPs), Pin Grid Array (PGAs), and Ball Grid Arrays
(BGAs). After a die is positioned in the package cavity, its pins are connected to the
pins of the package, e.g., with wire bonding or solider bumps (flip-chip). The package
of the desired design is then sealed and then sent to the end-users or clients.

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