Volume 9, Issue 2, February 2024 International Journal of Innovative Science and Research Technology

ISSN No:-2456-2165

PCB Advanced Via/Holes Technologies

Jayasekar Micheal1
PCB Design Engineer, Intel Corporation, Santa Clara, CA, USA-95054

Abstract:- Printed Circuit Boards (PCBs) Via is the Vias are essential for connecting different layers within
arrangement of different layers to make up a PCB. It a multi-layer PCB, and Vias play a crucial role in PCB
involves determining the number of layers, their order, Stackup design, which involves planning the arrangement of
and the materials used for each layer. PCB Via is a plated layers in a printed circuit board. The proper use of vias in
hole in a circuit board that connects different layers of stackup design can significantly impact the PCB's
the board, allowing electrical signals and power to pass performance, cost, manufacturability, and reliability.
between them. They serve as electrical connections
between different circuit board layers and help in They act as vertical bridges, allowing signals, power,
efficiently routing signals and power. This article and ground planes to flow between layers, ensuring the
provides an in-depth understanding of PCB vias, electrical functionality of the board. Designers must carefully
discussing their types, design considerations, advanced consider where vias are placed to achieve the best
Via technologies, and best practices. combination of signal routing, thermal management, and
overall board performance. Via placement can influence the
Keywords:- PCB Vias, Blind Via, Buried Via, Microvia, choice of layer stack and component placement. How layers
Sequential Laminations, Aspect Ratio, Via Filling, Via are stacked within the PCB affects signal integrity, power
Plating, Annular Ring, Stackup. distribution, and overall performance.

I. INTRODUCTION This article will dive into PCB vias, exploring their
types, functions, and best practices in design and
In the ever-evolving world of electronics, Printed implementation.
Circuit Boards (PCBs) remain the unsung heroes, and PCBs
are the connectors of innovation. These tiny yet essential II. TYPES OF PCB VIAS
conduits are pivotal in ensuring our electronic devices are
smaller, more efficient, and increasingly powerful. Vias are the copper-plated holes in the PCB that allow
Understanding PCB vias' various types and the layers to connect. There are several types of vias in PCB
functions and adhering to best practices in their design and design and manufacturing. The major types of vias are
implementation is essential for engineers and designers Through Hole Vias, Blind Vias, Micro Vias, and Buried
looking to create cutting-edge electronics. Vias. In addition to that, there are a few subcategories of via
arrangements like stacked vias, staggered vias, skip vias,
As we delve further into the 21st century, the demand ELIC, and back-drilled vias. Some other common factors
for smaller, more powerful, and energy-efficient electronic applying to vias are tented vias, plugged vias, Via stitching,
devices is ever-increasing. PCB vias are adapting to these and via-in Pad.
demands through modern technologies and techniques. As
consumer electronics become more compact and lightweight, These various types of PCB vias provide designers with
Microvias use becomes increasingly prevalent. These multiple options to tailor their designs to specific
incredibly small vias allow for high-density PCB layouts, requirements, whether achieving high density, optimizing
making advanced features like high-speed network signal integrity, or enhancing overall reliability. The choice
connectivity, AI processors, smartphones, other portable of Via type depends on the electronic device's particular
gadgets, and augmented reality Devices. needs and the design's constraints. Fig 1 shows the overall
commonly used via types and filling.
In addition to performance enhancements, modern PCB
manufacturing also focuses on sustainability. Some
manufacturers can fabricate HDI boards with microvias up to
60 layers. Eco-friendly materials and manufacturing
processes are becoming more prevalent, ensuring that PCBs
and their vias align with the global push for greener
electronics. The importance of vias in PCB layout design
cannot be overstated. Vias are the vital connectors that enable
modern electronic devices' functionality, reliability, and
miniaturization.

Fig 1 Types of Vias

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A. Plated Through Hole Vias annular ring is 5mil, as seen in Fig 3. A mechanical drill
A through-hole via is a plated hole that traverses all through-hole is the most cost-effective in a multilayer PCB.
layers of a PCB, connecting traces and components on Laser drilling through holes in full-thickness boards will have
different layers (Top to Bottom). These vias come in various limitations based on the hole diameter and the over-PCB
sizes and shapes but share the same fundamental purpose: thickness.
establishing electrical and mechanical connections between
layers. Through-hole vias enable electrical signals to travel B. Blind Via
seamlessly between a PCB's different layers. This capability Blind Vias connect the outer layers to one or more inner
is fundamental for the interconnected world of modern layers, ensuring high-density routing without needing
electronics. As electronic devices evolve and demand higher through-hole vias. A Blind Via connects an outer layer to one
performance, through-hole vias will remain the backbone of or more inner layers but does not go through all the layers on
PCB design. the board. Blind vias can be drilled with a laser or
mechanical drill with an aspect ratio of 1:1 or less. Blind vias
Beyond the electrical function, through-hole vias add with laser drills must be filled with copper. Blind Via with
mechanical and thermal stability to the PCB, which is mechanical drill can be filled with epoxy and plated over.
instrumental in connecting these layers and providing the
interconnectivity required for complex circuitry. Fig 2 Shows
the through-via structure and thermal Via on a PCB. These
vias also serve as anchor points for components. They help
secure components on the PCB and maintain their alignment
during manufacturing and use.

Fig 4 Blind Vias

Blind vias decrease the via stub length for high-speed

Fig 2 Through Hole Via/Thermal Via signals, reducing the parasitic capacitance and producing
good Signal integrity. Blind vias can be added to the boards
Vias should be sized appropriately and spaced by different methods based on the manufacturing process by
according to the PCB's specifications, ensuring that they do vendors like Sequential lamination, Photo-defined, controlled
not interfere with each other or near the same net vias or depth, and laser Drilling. Fig 4 Shows the various types of
different net vias. The copper area surrounding a through- blind via constructions.
hole via, known as the annular ring, should be sized correctly
to ensure reliable electrical connections and sufficient  Blind Vias with Sequential lamination
mechanical support. A balanced Stackup is required for this process with
very thin laminate starting from both outer layers. This is an
expensive process due to multiple subassemblies laminated
manufacturing steps.

 Blind Vias with Photo defined

This process involves laminating a sheet of
photosensitive resin to a core. The pattern-covered
photosensitive sheet is exposed to light, causing the residual
material to harden. The material in the holes created is
removed using an etching solution. Copper is plated in the
hole and on the outer surface to create the outermost layer of
the PCB. This is cost-effective when there are many blind
Fig 3 Through Hole Via Pad/Drill vias on a PCB.

As per IPC 6012 Claas2 Specification, a 5-mil annular  Blind Vias with Controlled depth
ring or more is recommended. The PCB via size is also This method drills the controlled depth through blind
necessary in Vias, the most popular vias - the 20/10mil via. vias, like through-hole vias. In this process, the drill is set to
This means the via hole is 10mil, the pad is 20mil, and the penetrate only partway through the PCB. Generally, drilling

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is a cost driver, but this method is the least expensive way to D. Micro-Vias
create blind vias. As our devices become increasingly compact and
powerful, the more complex technology that needs circuits
 Blind Vias with Laser-Drilled fits in a smaller area of PCB. This is where advanced PCB
This process is done after all layers of the PCB have Microvias come into play. These tiny, precision-engineered
been laminated but before the etching & and lamination of wonders are at the forefront of the miniaturization revolution,
the outer layer. A via can be created by laser drilling the allowing designers to push the boundaries of what's possible
copper and the dielectric material between layers 1 and 2 in a in modern electronics. Microvias are a specialized type of
single stage, and it could be better than mechanical-drilled Via used to construct high-density, ultra-compact printed
vias to reduce cost. circuit boards.

C. Buried Via Microvias are essentially different from the other two
Buried Vias (Commonly known as Conventional Buried types because they’re not drilled with a regular drill bit.
via) exist entirely within the inner layers, connecting those Instead, a laser is used to drill a Microvia, which is usually
layers while remaining invisible from the outer layers. Most done before the lamination of layers occurs. Microvias have
often, buried vias are drilled separately in each layer before the smallest pad sizes, which allow for maximum routing
any board layers are combined. Buried vias connect the channel width. Microvias can reduce the layer count for
internal layers but don’t extend to the top or bottom layer. PCBs and ease the fine-pitch BGA breakout.
There are several buried vias manufacturing processes in the
PCB industry. Fig 5 shows the various types of buried via
stacking like Standard Buried via, Stacked Buried via, and
staggered Buried vias.

Fig 6 Micro Vias

To reduce layer count and the overall size of PCBs,

Fig 5 Buried Vias
micro vias contribute to cost savings in manufacturing.
Smaller PCBs mean fewer materials used in production,
Space Optimization is the primary advantage of buried
leading to more sustainable electronics manufacturing.
vias. Buried vias can enhance signal integrity by avoiding the
Subsequently, this layer is laminated with all the other layers
need to route signals through the outer layers. This is
of the PCB. The reliability of micro vias can be significantly
especially valuable in high-speed applications where signal
impacted by the materials selected for use on the printed
quality is paramount. Buried vias are essential in high-density
circuit board. For micro vias to be reliable, the materials used
designs, such as advanced computing systems, servers,
in their construction must be of a high grade.
mobile devices, consumer electronics, medical devices, and
networking equipment.
IPC-T-50M and IPC-6012 define the structure of
microvias. Microvia blind structure with a maximum aspect
Buried vias help reduce the aspect ratio of the PCB.
ratio of 1:1 hole diameter and depth, with a total depth of no
Aspect ratios for buried vias must be 1:10 or higher; 1:12 is
more than 0.25mm when measured from the land foil to the
recommended (Core Via with multiple Layers mechanical
target land. Usually, the micro via minimum drill aspect ratio
drill follows the through-hole aspect ratio rules). However,
is between 0.6:1 and 1:1. The Most common Microvia min
using buried vias can reduce the PCB thickness. By their
drill size is 100 microns. With advanced technology, it can
nature, buried vias cannot be drilled after the board is entirely
go down from 40 to 50 microns with fragile dielectric
fabricated. Buried vias must be drilled at prior stages in the
material.
PCB’s manufacturing process as a subset of sub-laminated
metal layers. Buried vias are typically filled with conductive
or non-conductive material to create a low-impedance
connection between the different layers of the PCB.

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 Stacked Microvias
Stacking microvias are microvias that layered directly
on top of each other. Stacked Microvias, compound
structures, are stacked one on top of another to achieve the
highest possible routing density, which can further optimize
PCB designs by improving density and performance.

 Stacked Microvias on Buried Via

Stacked Microvias over buried Vias create more space
for the high-density wiring and fanout from low-pitch BGAs.
It requires an additional Cu cap plating process for the buried
vias. Stacking vias on the Buried vias is not advisable; it
causes reliability issues and increases the manufacturing cost.

 Staggered Microvia
Staggered Microvias are microvias where the position
on each layer is not directly on top of each other. Staggered
Fig 7 Blind and Buried Microvia via also means the vias from 2 layers are connected after
copper plating, but the two vias are not precisely at the same
Is Microvias can act as Blind Via? Yes, that can serve place. Staggered microvias are also very common in HDI
as Blind Vias when only running from the external layer to PCBs, which is a highly reliable and cost-effective method.
the next layer. Microvias can be either Blind Microvia or
Buried micro via. Fig 7 shows the difference between both.  Skip Microvia:

 Blind Microvia:
Blind microvias start in the surface layer and terminate
one layer below the surface. However, they could terminate
to 2 layers below the surface layer if the aspect ratio is kept
low.

 Buried Microvia:
Buried Microvias have the same structure as blind vias,
span between two interior layers, and do not reach either
circuit board surface.

 Microvia Stacking Types

Fig 9 Skip Microvia

A skipped via (known as variable depth Via) connects

at least two lay-up layers directly connecting the outer layer
with an inner layer electrically without connecting the
intermediate layer, for example, a Laser hole from layer 1 to
layer three without connecting layer 2. Fig 9 shows the
typical 2-level Skip via.

III. HDI VIA STRUCTURE

Fig 8 Micro Via Types Microvias are commonly used in high-density

interconnect (HDI) PCBs to connect very fine-pitch surface-
There are two types of Microvia stacking in PCB: mount components, such as ball grid array (BGA) and chip-
Stacked Microvia and Staggered Microvia. Fig-8 shows the scale package (CSP) devices. The small size of micro vias
different structures of Microvias such as Stacked, Staggered allows for higher routing density and better signal integrity in
Vias, and Stacked Microvias on buries. these demanding applications.

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The standard method of Vias structures is inner portion of the layer stack is linked to the outer sections
Blind/Microvia, Staggered, and Stacked Vias, stacked via at the top and bottom ends with a buried via, and the buried
over buried via, and Skip Via, which is used in PCB via portion (called a core via) also connects to the other inner
fabrication. Designing HDI (High-Density Interconnect) layers. If the fabrication house can produce it, we could
PCBs or Substrate/Package Design requires a more precise conceivably use any sequentially laminated layers outside the
and complex design with a fine pitch Pad, trace Spacing, and Stackup. For example, 3+N+3 and 4+N+4 layer stacks are
vias. standard options HDI PCB fabrication houses provide.

A. Sequential Lamination Configuration 2+N+2 Stackup is the standard option for fine-pitch
Sequential lamination is one of the critical technologies BGA with a high pin count. The manufacture of a PCB
used in HDI PCBs. This process utilizes advanced consists of layering an epoxy pre-impregnated fiberglass
technologies like the sequential stacking and bonding of the sheet between each copper layer and laminating together
various layers of the PCB. This is achieved through under high temperature and pressure using a hydraulic press.
Microvias drilling each layer and bonding all layers added at The IPC-2226 standards defined the HDI stackup/lamination
a time. Its precision, flexibility, high density, and mechanical in six types, from Type I to Type VI.
and thermal stability make it an essential tool for modern
PCB design and manufacturing.  Type: I Lamination

The first lamination cycle in HDI PCB sequential

lamination is the core lamination. This process involves the
lamination of the core material, typically a glass-reinforced
epoxy or polyimide material. The second lamination cycle is
the prepreg lamination. This process consists of the
lamination of a layer of prepreg material, typically a glass-
reinforced epoxy or polyimide material pre-impregnated with
a curing agent.

Fig 11 Type-I Lamination

The HDI Stackup type I has a single layer of micro vias

on one or both sides, with a laminated core. Type I Stackup
only permits blind vias and PTH. They can originate from
either the top or bottom surface. These are the simplest HDIs
that can be designed or fabricated and, consequently, the
most limited type of stackup. It’s also the cheapest to
manufacture.

 Type: II Lamination
Fig 10 Three Lamination Cycle

The sequential lamination cycle is one of the most used

methods in HDI PCB fabrication. This method involves
laminating two or more laminate layers in a specific sequence
to achieve a final product with the desired properties. Based
on the complexity, the lamination cycles go up to 9 levels
with advanced manufacturing technology (Higher cost). A
commonly standard cost-effective method for an HDI board
is four lamination cycles. The Microvias and Buried Vias
determine the lamination cycles used with the X+N+X
configuration in the PCB.

B. Lamination Types
This structure is generally known as an X+N+X or
i+N+i stackup, where the outer sections consist of “X” Fig 12 Type-II Lamination
sequentially laminated layers connected with microvias. The

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It has a laminated core and is constructed using micro  Type: V Lamination
vias, blind vias, and buried vias. It requires a single layer of
micro vias on both sides or at least one side. Type II Stackup
allows buried vias in the core, but the blind vias are limited to
just one HDI layer. The use of buried via helps reduce the
overall board thickness, which allows for smaller via
diameters.

 Type: III Lamination

Fig 15 Type-V Lamination

Type V is a coreless Stackup. It uses plated Microvias

and a conductive paste layer interconnect. The layers are co-
laminated, so there is a single lamination step and no buildup
or sequential lamination. This is the rarely used expensive
manufacturing process.

 Type: VI Lamination
Fig 13 Type-III Lamination

It is also constructed using blind vias, micro vias, and

blind vias but requires two layers of micro vias (Stacked or
staggered vias) on one or both sides. Type III Stackup is the
most used HDI Stackup, especially for high-density
requirements. It allows for two or more HDI layers, with
blind microvias that can be staggered or stacked in all HDI
layers.

 Type: IV Lamination

Fig 16 Type-VI Lamination

The most complex is Type VI, better known as every

layer interconnect (ELIC), where stacked/staggered
Microvias are placed throughout the Stackup. The sequential
or core lamination process involves inserting a dielectric
between a layer of copper and an already laminated sub-
composite using an antistrophic film.

C. ELIC (Every layer Interconnect)

ELIC is commonly known as any layer HDI PCB. To
adapt to the development of CSP and inverted chip packaging
(FC), it is necessary to use high-density PCB with an internal
via-hole (IVH) structure.
Fig 14 Type-IV Lamination
To break through the limitation of traditional HDI high-
Type IV uses a passive core, which means the core has density interconnection laminates, it is necessary to import
no electrical properties. It can, however, still be used for heat higher-order any-layer interconnection technology so that
dissipation, shielding, or CTE management. Over-core any layer can be arbitrarily connected to another layer to
involves depositing dielectric over an internal core layer and form internal conduction.
is less common among HDI Stackup.
The interconnection structure of via hole (IVH) is
designed for higher-level HDI products to achieve lightness,
thinness, shortness, and trimness.

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This is the most complex HDI PCB design structure  Conductive Fill:
where all the layers are high-density interconnection layers, Conductive via filling involves filling the vias with a
which allow the conductors on any layer of the PCB to be conductive material such as conductive epoxy or copper to
interconnected freely with copper-filled stacked microvias establish electrical continuity between layers.
structures (Fig-17). This structure provides a reliable
interconnect solution for highly complex large pin-count  Non-Conductive Fill:
devices, such as CPU and GPU chips utilized on handheld This involves using a non-conductive material such as
and mobile devices, while producing superior electrical epoxy or resin to seal the vias. This method is suitable when
characteristics. Examples include smartphones, ultra-mobile electrical isolation between layers is required, and it helps
PCs, Smartwatches, AR Glasses, GPS, Memory cards, and prevent signal interference.
small electronic devices.
 Copper-Filled Vias:
Copper-filled vias are filled with either pure copper or
epoxy resin with copper. Many kinds of via can be filled with
copper, including standard vias, micro vias, blind vias, and
buried vias. Designs with Microvias in BGA pads or similar
small soldering pads can benefit from copper filling since this
will eliminate the possibility of air voids in the solder joints.

 Buried Via Filling:

Filling buried vias in a Printed Circuit Board (PCB) is a
common practice that involves sealing the vias with a
material to enhance reliability and protect against various
environmental factors.

 Via Filling Types

Fig 17 ELIC Via Structure
IPC-4761 guided for approval via filling and protection
for Printed circuit boards on various options.
ELIC is one technology that lets PCB designers create
very thin, Rigid-Flex, flexible PCBs with high functional
density. When using ELIC on an HDI board, each layer has  Type-I
its own copper-filled, laser-drilled microvias. ELIC uses only Via is tented using a non-conductive dry film mask on
stacked copper-filled Microvias to make connections through one or both sides. It is not recommended for the modern PCB
each layer. Once the layers are stacked, this allows SMT assembly process. Masking one side is Type I (a), and
connections between any two layers in the PCB. The ELIC the dual side is Type I (b).
manufacturing process starts with two significant things.
These are ultra-thin cores with laser micro vias and a solid
copper base. The micro vias are filled with copper internally.
The next step is to include a dielectric layer during the
lamination process.

Laser drilling is on the recent layer to complete the

ELIC PCB stack. The process is conducted in a loop unless
the desired PCB stack that contains copper-packed micro vias
develops. The benefit of using copper filling is the structural
integrity of the board. Another reason to use this filling is to
prevent dimpling/voiding in the interior micro vias. For
portable devices like Smartwatches, ELIC PCB is the best
solution. It has the option for flexible mounting, running
faster, excellent thermal performance, high reliability, short
lead time, and low power consumption, but the cost is higher. Fig 18 Type I Via Dry Film Mask
IV. VIA FILLING  Type-II
Via is tented and coated on one or both sides using a
PCB Via hole filling is a process where the via holes are
non-conductive Soldermask. Tenting/Masking: one side is
filled with a solder mask or resin. Via holes that are Type II (a), and the dual side is Type II (b).
filled/plugged improve the PCB reliability by decreasing the
possibility of trapped air/liquid in the Via holes, thus
ensuring good yield when PCB assembly. There are two
methods of Via filling: Conductive fill and Non-Conductive
Fill.

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 Type-V
This Via is fully filled with conductive or non-
conductive material.

Fig 19 Type II Via Tenting/Masking

 Type-III
Fig 22 Type-V Via Filling
This Via is partially filled or plugged with
nonconductive epoxy paste to prevent solder flow through
 Type VI
holes on one or both sides. Filling one side is Type III (a),
This Via is fully filled with conductive or non-
and the dual side is Type III (b).
conductive material and covered with Soldermask on one or
both sides. Masking one side is Type VI (a), and the dual side
is Type VI (b).

Fig 20 Type III Via Filling

 Type-IV Fig 23 Type-VI Via Filling/Masking

This Via is partially filled or plugged with
nonconductive epoxy paste to avoid solder flow through via  Type VII
holes on one or both sides with an additional solder mask This Via is filled with a conductive or non-conductive
layer on one or both sides. Filling/Masking one side is Type material and capped with a metalized coating on both sides.
IV (a), and the dual side is Type IV (b). Caping one side is Type VI (a), and the dual side is Type VI
(b). This method is commonly used for Via-In-Pad for SMT
assembly.

Fig 21 Type-IV Via Filling/Masking Fig 24 Type-VI Via Filling/Capping

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V. VIA DRILLING Mechanical drilling uses physical drill bits to remove
material and create holes in the PCB. It's a contact-based
PCB drilling is the process of creating holes in bare process. It's often faster than laser drilling, making it suitable
circuit boards. This process is carried out to facilitate for large-scale production. Mechanical drilling is versatile
component placement and the interconnection of electrical and compatible with a wide range of PCB materials.
nets between various PCB layers. Drilling is the most Mechanical drilling involves physical tools, such as drill bits,
expensive and time-consuming step in PCB manufacturing. which can wear out and require regular replacement. The
contact-based nature of mechanical drilling can sometimes
The PCB drilling process acts as the foundation for vias lead to material stress and potential damage, especially in
and the interconnectivity of different layers. A key element in delicate PCB layers.
this quest for miniaturization is the drilling of micro vias, tiny
holes that allow for high-density interconnections on PCBs. B. Laser Drilling Technology
Once the lamination process has been completed, the PCB This is not like mechanical drills, the laser drilling
enters the drilling phase, following the specifications in the process doesn’t physically contact the PCB material it works
PCB NC drill files. The drilling process of adding holes in with. The high influence beam of the UV laser machine can
the PCB is carried out to facilitate the positioning of the drill through copper and organic dielectric to create the tiny
creation of vias, and the electrical connection between the Via hole. The UV laser has excellent reflection, absorption,
different layers of the PCB. and transmission capacity on different materials. Laser
drilling is a non-contact method that uses high-intensity laser
beams to ablate material, creating micro vias. It is precise and
controlled, making it ideal for tiny holes in PCBs.

 Standard Laser Drilling:

Laser drilling offers exceptional precision and control,
producing highly accurate micro vias, even with diameters 50
to 150um. The flexibility of laser drilling allows for creating
complex and intricate patterns. Laser drilling removes
minimal material, reducing the risk of damaging delicate
PCB layers. Since it's a non-contact process, laser drilling
does not involve physical tools that wear out.

Laser drilling equipment can be expensive, making it

less cost-effective for large-scale PCB manufacturing.

Laser drilling may not be suitable for all PCB materials,

and it may require specific materials and coatings for optimal
results. The process can be slower than mechanical drilling,
particularly for large PCBs or high-via-count designs.

 Laser Direct Imaging Technology:

Fig 25 Mechanical/Laser Drilling A new technique that can be used to drill holes in the
printed circuit board is direct exposure (also known as direct
There are two types of PCB drilling available in PCB imaging). Based on the image processing principle, this new
manufacturing; one is mechanical drilling, and the other one method increases accuracy and speed by creating a digital
is laser drilling. The choice between laser drilling and image of the PCB and converting it into a map of positions
mechanical drilling in PCB manufacturing depends on the used by the laser as references for drilling holes.
specific requirements of the design, budget, and intended
scale of production. C. Back Drilling Vias
It is a process to remove the unused section of plated
A. Mechanical Drilling through holes/Vias. Via Stub is a non-functional part of Via,
Mechanical drilling is the most cost-effective method causing significant signal integrity in high-speed design.
for drilling holes for high-volume PCB manufacturing PCBs. Stubs are the source of impedance discontinuities and signal
The drilling process is controlled by Automatic pre- reflections, which become more critical as data rates
programmed Computer Numeric Control (CNC) machines. increase. To resolve this, a fabricator can employ back
Depending on the Via holes and aspect ratio type, holes can drilling, where most via stubs are removed by re-drilling with
be drilled like Blind, Buried, and through-hole vias. a slightly larger drill bit. Fig-26 Shows that back-drilling.
Mechanical drilling may not achieve the same level of
precision as laser drilling, particularly for extremely small
vias.

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The aspect ratio of a through via in a Printed Circuit
Board (PCB) refers to the ratio between the length of the via
(from the top to the bottom of the Board) and the diameter of
the drilled hole.

TH Aspect ratio = Hole height/drilled hole Diameter

The hole height is the same as the PCB thickness if the

start and finish layers of the hole are the top and bottom
layers of the PCB. Most manufacturers can do a Vias aspect
ratio from 6:1 to 12:1; the preferred is 8:1.

 Blind and Buried Via Aspect Ratio

Fig 26 Back Drilling

Back drilling or controlled depth drilling (CDD) is a

method to remove stubs of copper from a through hole. It is
the preferred method in High-speed designs.

D. Aspect Ratio
The aspect ratio in the context of PCBs refers to the
ratio between the thickness of the PCB and the diameter of
the drilled Via holes. The aspect ratio (hole diameter to board Fig 28 Blind and Buried Microvias Aspect Ratio
thickness) plays a role in manufacturability, and an
appropriate aspect ratio is necessary to ensure proper plating For Blind and Buried Microvias, it is the ratio between
and reliability during manufacturing. The aspect ratio is the hole depth and the diameter of the drilled hole. It is
determined by the overall thickness of the printed circuit calculated through the formula AR=h/a where h=hole depth
board during primary drilling without plating applied and the (dielectric thickness + Copper foil thickness). The preferred
diameter of the smallest drilled hole. and cost-effective aspect ratio for Microvias is 0.75:1, and
the larger aspect ratios, such as 1:1 to 2:1, can be fabricated,
This is an important ratio due to its effect on the plating but they have reliability concerns.
that is within the vias, and also affected by the annular rings.
 PCB Via Plating
 Through Via Aspect ratio PCB Via plating process starts after the PCB has been
laminated in the heat press. It refers to coating the inside
walls of drilled holes, such as vias or through holes, with a
conductive material to establish electrical connections
between different layers of the printed circuit board. The total
amount of copper is now electroplated on the exposed metal
areas of the board, including in the via holes.

This is done by connecting the board to an electrical

charge so that the boards act as cathodes for the
electroplating process and then dipped in chemical baths.
Copper plating thickness is usually about 20um.

The larger the aspect ratio is, the more complex the
plating process becomes. A simple rule of thumb is thicker
boards need larger vias. Longer plating time and processing
can increase the chances of cracks in the hole wall due to
expansion. The lower aspect ratio has more muscular bonded
hole walls and less chance of cracking.
Fig 27 Through-Hole Aspect Ratio

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during fabrication is misaligned holes and undesirable
breakouts due to drill wander. PCB teardrop yielding on the
vias, and landing pads helps ensure a missed drill hit can still
form a reliable connection while preventing track separation.

Fig 29 Via Plating

 Annular Rings:
The copper area surrounding a through-hole Via, known Fig 31 Teardrops
as the annular ring, this should be sized correctly to ensure
reliable electrical connections and sufficient mechanical The purpose of this teardrop is to reinforce the
support. mechanical strength of the PTH and prevent it from breaking
or being damaged due to stress during installation or use.

 Via-in-Pad
PCB via-in-pad (VIP) technology revolutionizes PCB
design by allowing vias to be placed directly within
The size of the annular ring is equal to half of the component pads of Surface Mount Components. VIP
technology is particularly beneficial in high-density designs
difference between the diameter of the pad and the diameter
where space optimization and signal integrity are paramount,
of the Hole. Ex: 20 mil Pad 10 mil Drill ( 20-10/2=5mils
Annular ring). especially on BGA, which allows place Vias to SMT Pads
directly.

Fig 32 Via-in-Pad

Fig 30 Annular Ring In the via-in-pad process, the vias are typically filled
with a non-conductive epoxy, capped, and then plated over to
The size of the annular ring, including its diameter and avoid short circuits or empty soldering caused by tin leakage.
width, is critical for ensuring proper electrical and This method ensures the vias are filled, reducing the risk of
mechanical performance. The width of the annular ring is voids and improving plating consistency.
determined by factors such as the via or hole diameter, the
minimum clearance requirements, and the manufacturing  Size and Spacing
capabilities of the PCB fabrication process. A wider annular The spacing between a PCB Vias and a nearby trace is a
ring provides increased mechanical stability and solder joint critical design parameter that influences the PCB's electrical
reliability. performance, manufacturability, and reliability. Vias should
be sized appropriately and spaced according to the PCB's
 Teardrops specifications, ensuring they do not interfere with each other
Teardrop is named because of its droplet-shaped or nearby copper. With advanced technology, the through
structure, and it is an extra future that adds additional copper vias hole/Pads/Trace can be 125/250um spacing, and laser
at the Junction between Via and trace. One common problem drilled micro Vias can be 50/150um spacing.

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Volume 9, Issue 2, February 2024 International Journal of Innovative Science and Research Technology
ISSN No:-2456-2165
VI. CONCLUSION [8]. Rush PCB https://rushpcb.com
[9]. Sierra Circuits https://www.protoexpress.com/blog/
PCB vias are the lifelines of PCB layout design. They [10]. Hemeixin PCB, https://www.hemeixinpcb.com
enable the interconnections that power our modern electronic [11]. Altium PCB Design, https://resources.altium.com
world. One essential component of PCBs is the VIA, a
seemingly humble but crucial element that bridges the gaps
between different layers of a PCB.

Understanding the types of vias, their functions, and

best practices for design and implementation is critical for
PCB designers looking to create efficient, reliable, and
innovative electronic devices. As technology advances, vias
will remain at the heart of PCB layout design, adapting to
meet the evolving demands of the electronics industry.

PCB vias are the unsung heroes of modern electronics,

enabling the functionality and miniaturization of our favorite
gadgets. Their diverse types and crucial roles in signal
routing, power distribution, and thermal management make
them a fundamental element in PCB design. By
understanding their functions, following design best
practices, and leveraging advanced technologies, engineers
can continue to push the boundaries of what's possible in the
world of electronics. As PCB technology evolves, vias will
remain a cornerstone in connecting the dots of innovation.

In conclusion, PCB vias are the connective tissue of our

increasingly interconnected and compact world. They enable
the technology that drives innovation and makes our lives
more efficient, convenient, and entertaining. As new
technologies continue to emerge, PCB vias will remain at the
forefront of modern electronics, adapting and evolving to
meet the demands of the ever-advancing electronic
landscape. Whether it's enabling lightning-fast data
transmission or supporting the latest advancements in
artificial intelligence, PCB vias will continue to play a crucial
role in the relentless march of technological progress. So, the
next time you marvel at your smartphone, tablet, or any other
electronic marvel, remember the unsung hero – the PCB Via
– quietly but indispensably connecting the dots of modern
technology.

REFERENCES

[1]. PCB Stackup Design for Modern Electronics

https://ijisrt.com/pcb-stackup-design-for-modern-
electronics
[2]. PCB Material Selection for High-Speed Application
https://ijisrt.com/pcb-material-selection-for-
highspeed-application
[3]. In-Situ De-embedding (ISD) by AtaiTec Corporation.
www.ataitec.com
[4]. Acceptability of Printed Boards, IPC-612, IPC-4101,
IPC-2581, IPC-2221, IPC-4761, IPC-D-317A,
http://www.ipc.org
[5]. Proto-Electronics: https://www.proto-electronics.com
[6]. NCAB Group: https://www.ncabgroup.com/
microvias/
[7]. CAMPTECH: https://camptechii.com

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