ZXMP M820

Product Description
 ZXMP M820 Product Description

ZXMP M820
Product Description
Version Date Author Reviewer Notes

V2.4 2009-07-02 Zhao Shuai Wei Xiaoqiang Not open to the Third Party

V2.5 2010-04-14 Chi Yongjie Wei Xiaoqiang Not open to the Third Party

V2.51 2010-02-28 Zhao Shuai Wei Xiaoqiang Not open to the Third Party

V2,52 2012-06-30 Zhao Shuai Tu Yong Not open to the Third Party

V2,60 2013-1-30 Zhao Shuai Xu Kun Not open to the Third Party

© 2011 ZTE Corporation. All rights reserved.

ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be disclosed or used
without the prior written permission of ZTE.
Due to update and improvement of ZTE products and technologies, information in this document is subjected to
change without notice.

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ZXMP M820 Product Description

TABLE OF CONTENTS

1 Overview .......................................................................................................... 13

2 Highlight Features ........................................................................................... 15

2.1 Large Capacity and Easy Upgrade .................................................................... 15
2.2 Single 100Gbit/s system .................................................................................... 15
2.3 Single 40Gbit/s system ...................................................................................... 15
2.4 Super-long-haul Transmission ........................................................................... 16
2.5 Multi-service Access Mode ................................................................................ 17
2.6 Flexible networking modes ................................................................................. 17
2.7 Wavelength Add/Drop Functions........................................................................ 17
2.8 Reliable Protection Functions ............................................................................ 18
2.9 Performance Monitoring Technology.................................................................. 18
2.10 Power Management Technology........................................................................ 18
2.11 Powerful NM ...................................................................................................... 18
2.12 WASON ............................................................................................................. 19

3 Functionality .................................................................................................... 20
3.1 Functions ........................................................................................................... 20
3.1.1 Large Transmission Capacity ............................................................................. 20
3.1.2 Ultra-long-haul Distance Optical Source ............................................................ 20
3.1.3 Optical Amplifier ................................................................................................. 21
3.1.4 Power Management ........................................................................................... 22
3.1.5 Performance Detection Function ........................................................................ 25
3.1.6 OTN Description ................................................................................................ 26
3.1.7 Dispersion Management .................................................................................... 26
3.1.8 Service Functions .............................................................................................. 27
3.1.9 Wavelength Add/Drop Function ......................................................................... 28
3.1.10 Communication and Monitoring Functions ......................................................... 29
3.1.11 Time/Clock Synchronization Service .................................................................. 32
3.1.12 Alarm Input /Output Function ............................................................................. 33
3.1.13 System Level Protection .................................................................................... 33
3.1.14 Network level Protection .................................................................................... 34
3.1.15 Network management channel backup .............................................................. 37
3.1.16 L0/L1/L2 integrated transport technologies ........................................................ 39
3.1.17 ROADM Function ............................................................................................... 39
3.1.18 Electrical Cross-Connect Function ..................................................................... 41
3.1.19 Wavelength Tuning Function ............................................................................. 43
3.1.20 IWF Function ..................................................................................................... 45
3.2 Networking ......................................................................................................... 47

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 ZXMP M820 Product Description

3.2.1 System Applications........................................................................................... 47

3.2.2 Networking Modes ............................................................................................. 53
3.3 Transmission Codes Supported ......................................................................... 56

4 System Architecture ........................................................................................ 61

4.1 Description of System Functional Platform ......................................................... 61
4.1.1 Optical transfer platform ..................................................................................... 61
4.1.2 Service convergence platform ............................................................................ 62
4.1.3 OM/OD platform ................................................................................................. 62
4.1.4 Add/drop platform .............................................................................................. 63
4.1.5 Optical amplifying platform ................................................................................. 63
4.1.6 Monitoring platform ............................................................................................ 63
4.2 Hardware Architecture ....................................................................................... 63
4.2.1 Sub-rack ............................................................................................................ 63
4.2.2 Board Description .............................................................................................. 66
4.3 The NM Software System Structure ................................................................... 78
4.3.1 Hierarchical structure ......................................................................................... 79
4.3.2 Interface description........................................................................................... 81
4.4 System Configuration ......................................................................................... 82
4.4.1 Optical Terminal Multiplexer (OTM) ................................................................... 82
4.4.2 Optical Add/Drop Multiplexer (OADM) ................................................................ 82
4.4.3 Optical Line Amplifier (OLA) ............................................................................... 85

5 Technical Specifications ................................................................................. 87

5.1 Working Wavelength Requirements ................................................................... 87
5.1.1 Wavelength Allocation in 8/16/32/40-Channel Systems ..................................... 87
5.1.2 Wavelength Allocation in 48/96 Wavelength System .......................................... 88
5.1.3 Wavelength Allocation in 80/160 Wavelength System ........................................ 90
5.1.4 Wavelength Allocation in 176-Channel Systems ................................................ 94
5.1.5 Wavelength Allocation in 192-Channel Systems ................................................ 94
5.2 System Component Indices ............................................................................... 98
5.3 OMU/ODU Unit Specifications ........................................................................... 99
5.3.1 Specifications of OMU Board ............................................................................. 99
5.3.2 Specifications of ODU Board............................................................................ 101
5.3.3 Specifications of ODUB Board ......................................................................... 102
5.3.4 Specifications of VMUX Board ......................................................................... 103
5.3.5 Specifications of VMUXB Board ....................................................................... 104
5.3.6 Specifications of OCI Board ............................................................................. 104
5.3.7 Specifications of OBM Board ........................................................................... 105
5.4 WSUA/WSUD & WBU Unit Specifications........................................................ 106
5.5 OADM Unit Specifications ................................................................................ 110
5.6 OA Unit Specifications ..................................................................................... 110

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ZXMP M820 Product Description

5.6.1 Specifications of EOBA (Enhanced Optical Booster Amplifier) Board............... 111

5.6.2 Specifications of EOLA (Enhanced Optical Line Amplifier) Board .................... 117
5.6.3 Specifications of EOPA (Optical preamplifier) Board ........................................ 118
5.6.4 Specifications of EONA (Enhanced Optical Node Amplifier) Board .................. 124
5.6.5 Specifications of SEOBA Board ....................................................................... 127
5.6.6 Specifications of SEOPA Board ....................................................................... 129
5.6.7 Specifications of SEOLA Board........................................................................ 131
5.6.8 Specifications of EDFA+RAMAN Board ........................................................... 133
5.6.9 Specifications of RPOA Board ......................................................................... 135
5.6.10 Specifications of LAC Board ............................................................................ 135
5.7 OTU Unit Specifications ................................................................................... 136
5.7.1 Specifications of 2.5Gbit/s Board ..................................................................... 136
5.7.2 Specifications of 10Gbit/s Board ...................................................................... 138
5.7.3 Specifications of 40Gbit/s Board ...................................................................... 141
5.7.4 Specifications of 100Gbit/s Board .................................................................... 143
5.8 Service Convergence Technical Specifications ................................................ 145
5.8.1 Specifications of SRM41 Board........................................................................ 145
5.8.2 Specifications of SRM42 Board........................................................................ 147
5.8.3 Specifications of MQT3 Board.......................................................................... 149
5.8.4 Specifications of MX2 Board ............................................................................ 151
5.8.5 Specifications of FCA Board ............................................................................ 153
5.8.6 Specifications of MOM2 Board ......................................................................... 154
5.8.7 Specifications of GEM8 Board ......................................................................... 155
5.8.8 Specifications of SDSA Board .......................................................................... 157
5.8.9 Specifications of DSA Board ............................................................................ 158
5.8.10 Specifications of DSAF Board .......................................................................... 160
5.8.11 Specifications of GEM2/GEMF Board .............................................................. 161
5.8.12 Specifications of ASMA Board ......................................................................... 162
5.8.13 Specifications of TD2C Board .......................................................................... 164
5.8.14 Specifications of MQA1 Board ......................................................................... 165
5.8.15 Specifications of MQA2 Board ......................................................................... 167
5.8.16 Specifications of MJA Board ............................................................................ 168
5.9 Electrical Cross-connection Subsystem Specifications .................................... 169
5.9.1 Specifications of CH1 Board ............................................................................ 169
5.9.2 Specifications of CO2 Board ............................................................................ 170
5.9.3 Specifications of CQ2 Board ............................................................................ 171
5.9.4 Specifications of CS3 Board ............................................................................ 172
5.9.5 Specifications of CD3 Board ............................................................................ 172
5.9.6 Specifications of LO2 Board ............................................................................. 175
5.9.7 Specifications of LQ2 Board ............................................................................. 176
5.9.8 Specifications of LD2B Board........................................................................... 178
5.9.9 Specifications of LS3 Board ............................................................................. 178

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5.10 Tributary overhead processing of convergence board ...................................... 180

5.11 OS Channel (SOSC) Unit Specifications .......................................................... 181
5.12 Supervision Unit Specifications ........................................................................ 181
5.13 Dispersion Compensation Unit Specifications .................................................. 182
5.14 Dispersion compensation unit (DCU) Performance Indices .............................. 182
5.15 Physical Performance ...................................................................................... 183
5.15.1 Structure Indices .............................................................................................. 183
5.15.2 Bearing Requirements of the Equipment Room ............................................... 188
5.15.3 Power Supply Indices ...................................................................................... 188
5.16 Environment Conditions ................................................................................... 193
5.16.1 Grounding Requirements ................................................................................. 193
5.16.2 Temperature and Humidity Requirements ........................................................ 194
5.16.3 Requirements for Cleanness ............................................................................ 194
5.16.4 Dustproof and Corrosion-Proof Requirements ................................................. 195
5.16.5 Environment for Storage .................................................................................. 195
5.16.6 Environment for Transportation ........................................................................ 196
5.16.7 Electronic Static Discharge (ESD) .................................................................... 197
5.16.8 Safety requirements ......................................................................................... 199
5.17 Introduction to Interfaces.................................................................................. 202
5.17.1 Interface on SEIA board ................................................................................... 202
5.17.2 Interface on SPWA board ................................................................................ 206

6 Abbreviation .................................................................................................. 209

7 Followed Standards and Recommendations............................................... 214

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ZXMP M820 Product Description

FIGURES

Figure 1-1 Rack Diagram of Unitrans® ZXMP M820 ...........................................................13

Figure 1-2 ZTE’s New-Generation Digital Transmission Product Family ............................14
Figure 3-1 Principles of RA ................................................................................................22
Figure 3-2 Power management sub-system .......................................................................24
Figure 3-3 Dispersion management ...................................................................................27
Figure 3-4 Position of supervision subsystem ....................................................................32
Figure 3-5 The Block Diagram of Optical Path 1: N Protection Function ............................34
Figure 3-6 Optical Path Layer 1+1 Protection (Chain Networking) .....................................35
Figure 3-7 Ring Networking ...............................................................................................36
Figure 3-8 Functional Block Diagram for MS 1+1 Protection ..............................................36
Figure 3-9 Schematic diagram of 2-fiber bidirectional path shared protection ....................37
Figure 3-10 Network management through supervisory channel .......................................38
Figure 3-11 Network management through backup supervisory channel ...........................39
Figure 3-12 Electrical Cross-Connect System Structural Diagram .....................................42
Figure 3-13 Functional Blocks of IWF Function (External Wavelength Feedback) .............46
Figure 3-14 Whole Network Application with the ZXMP M820 (the System less than
48-Wavelength) ....................................................................................................................47
Figure 3-15 Whole Network Application with the ZXMP M820 (the System with
80/96-Wavelength) ...............................................................................................................49
Figure 3-16 Whole Network Application with the ZXMP M820 (160/176- Wavelength).......50
Figure 3-17 Whole Network Application with the ZXMP M820 (the System with
192-Wavelength) ..................................................................................................................52
Figure 3-18 Point-to-Point Networking (Short-Haul) ...........................................................54
Figure 3-19 Point-to-Point Networking (Long-Haul) ............................................................54
Figure 3-20 Application of Chain Networking .....................................................................54
Figure 3-21 Application of Ring Networking .......................................................................55
Figure 3-22 Ring-with-Chain Networking............................................................................55
Figure 3-23 Cross Connection Networking.........................................................................56
Figure 4-1 Functional Blocks of the ZXMP M820 ...............................................................61

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Figure 4-2 Layout of ZXMP M820 NX Sub-rack (21 inch) ..................................................64

Figure 4-3 Layout of ZXMP M820 NX Sub-rack (19 inch) ..................................................64
Figure 4-4 Slot Arrangement of CX Sub-rack .....................................................................65
Figure 4-5 Slot Arrangement of DX Sub-rack .....................................................................65
Figure 4-6 Hierarchical Structure of the Element Management Software ...........................79
Figure 4-7 Functional Blocks of the OTM ...........................................................................82
Figure 4-8 Functional Blocks of the FOADM ......................................................................83
Figure 4-9 Optical Connection of ROADM Equipment with WBU Boards ...........................84
Figure 4-10 Optical Connection of ROADM Equipment with WBM Boards .........................84
Figure 4-11 Optical Connection of ROADM Equipment with WSU Boards .........................85
Figure 4-12 Functional Blocks of the OLA ..........................................................................86
Figure 5-1 Schematic Diagram of the DWDM System ........................................................98
Figure 5-2 Common Interface Area of the OTU Sub-rack ................................................202
Figure 5-3 Interfaces on the SPWA board ........................................................................206

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ZXMP M820 Product Description

TABLES

Table 3-1 Characteristics of dual/single pump source ........................................................22

Table 3-2 ZTE Networking Scheme and Application Environment .....................................40
Table 3-3 ZTE/ ROADM Solutions .....................................................................................41
Table 3-4 Boards Supporting Wavelength Tuning Function ...............................................44
Table 3-5 Transmission Codes Supported by 40 2.5Gbit/s System (G.652&G.655) .........56
Table 3-6 Transmission Codes Supported by 40 /48 10Gbit/s System (G.652&G.655) ....57
Table 3-7 Transmission Codes Supported by 80/96  10Gbit/s System (G.652&G.655) ....57
Table 3-8 Transmission Codes Supported by 192  10Gbit/s System (G.652&G.655) .......58
Table 3-9 Transmission Codes Supported by 40/48  40Gbit/s System (G.652&G.655) ....58
Table 3-10 Transmission Codes Supported by 80/96  40Gbit/s System (G.652&G.655) ..58
Table 3-11 Transmission Codes Supported by 80  100Gbit/s System (G.652 with DCM) .59
Table 3-12 Transmission Codes Supported by 80  100Gbit/s System (G.652 without DCM)
.............................................................................................................................................59
Table 3-13 Transmission Codes Supported by 80  100Gbit/s System (G.655 with DCM) .59
Table 3-14 Transmission Codes Supported by 80  100Gbit/s System (G.655 without DCM)
.............................................................................................................................................60
Table 4-1 Board Description ..............................................................................................66
Table 5-1 Wavelength Allocation (8/16/32/40-channel, C band) .........................................87
Table 5-2 Wavelength Allocation (48/96-channel, C band).................................................88
Table 5-3 Wavelength Allocation (80-channel, C band) .....................................................90
Table 5-4 Wavelength Allocation (80-channel, L band) ......................................................92
Table 5-5 Wavelength Allocation (192-channel, C band) ...................................................94
Table 5-6 Meaning of Components and Interfaces of the DWDM System ..........................98
Table 5-7 Technical specifications of OMU Board ..............................................................99
Table 5-8 Technical specifications of ODU Board ............................................................101
Table 5-9 Technical Specifications of the ODUB Board ...................................................102
Table 5-10 Technical specifications of VMUX Board ........................................................103
Table 5-11 Technical specifications of VMUXB Board .....................................................104

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Table 5-12 Technical Specifications of the OCI Board (100GHz-50GHz) .........................104

Table 5-13 Technical Specifications of the OCI Board (50GHz-25GHz) ...........................105
Table 5-14 Technical Specifications of the OBM Board ...................................................105
Table 5-15 Technical specifications of WBU Board ..........................................................106
Table 5-16 Technical specifications of WSUA/WSUD Board............................................107
Table 5-17 Technical specifications of WBM Board .........................................................107
Table 5-18 Technical specifications of PDU-4-X Board ....................................................108
Table 5-19 Technical specifications of PDU-5-X Board ....................................................108
Table 5-20 Technical specifications of PDU-8-X board ....................................................109
Table 5-21 Technical specifications of PDU-9-X Board ....................................................109
Table 5-22 Technical specifications of PDU-16-X Board ..................................................109
Table 5-23 Technical specifications of OADM Board .......................................................110
Table 5-24 Technical specifications of 40-channel EOBA Board (C/L-band) ....................111
Table 5-25 Technical specifications of 80-channel EOBA Board (C/L-band) ....................112
Table 5-26 Technical specifications of 48-channel EOBA Board (C-band) .......................114
Table 5-27 Technical specifications of 96-channel EOBA Board (C-band) .......................115
Table 5-28 echnical specifications of 40/80-channel EOLA Board (C/L-band) .................117
Table 5-29 Technical specifications of 40-channel EOPA Board (C/L-band) ....................119
Table 5-30 Technical specifications of 40-channel EOPA Board (C/L-band) ....................120
Table 5-31 Technical specifications of 48-channel EOPA Board (C-band) .......................122
Table 5-32 Technical specifications of 96-channel EOPA Board (C-band) .......................123
Table 5-33 Technical specifications of 40/80-channel EONA Board (C/L-band) ...............124
Table 5-34 Technical specifications of 48/96-channel EONA Board (C/L-band) ...............126
Table 5-35 Technical specifications of 40/80-channel SEOBA Board (C- Band) ..............128
Table 5-36 Technical specifications of 40-channel SEOPA Board (C-band) ....................129
Table 5-37 Technical specifications of 80-channel SEOPA Board (C-band) .....................130
Table 5-38 Technical specifications of 40/80-channel SEOLA Board (C-band) ................131
Table 5-39 Technical specifications of RAMAN_P amplifier .............................................133
Table 5-40 Technical specifications of EDFA+RAMAN Amplifier .....................................133
Table 5-41 Performance Parameters of RAMAN_B amplifier ...........................................134

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ZXMP M820 Product Description

Table 5-42 Technical specifications of RPOA amplifier ....................................................135

Table 5-43 Technical Specifications of LAC Board ..........................................................136
Table 5-44 Technical specifications of 2.5Gbit/s Board at Client-side ..............................136
Table 5-45 Technical specifications: of 2.5Gbit/s Board at Line-side................................137
Table 5-46 Technical specifications of 10Gbit/s Board at Client-side ...............................138
Table 5-47 Technical specifications of 10Gbit/s Board at Line-side..................................139
Table 5-48 Technical specifications of 40Gbit/s Board at Client-side ...............................141
Table 5-49 Technical specifications of 40Gbit/s Board at Line-side..................................142
Table 5-50 Technical specifications of 100Gbit/s Board at Client-side .............................143
Table 5-51 Technical specifications of 100Gbit/s Board at Line-side................................144
Table 5-52 Technical specifications of SRM41 board.......................................................145
Table 5-53 Technical specifications of SRM42 Board ......................................................147
Table 5-54 Client-Side Technical specifications of MQT3 board ......................................149
Table 5-55 Line-side Technical specifications of MQT3 Board .........................................150
Table 5-56 Client-Side Technical specifications of MX2 board .........................................151
Table 5-57 Line-side Technical specifications of MX2 Board ...........................................152
Table 5-58 Technical specifications of FCA Board ...........................................................153
Table 5-59 Specification of MOM2 Board.........................................................................154
Table 5-60 Technical specifications of GEM8 Board ........................................................155
Table 5-61 Specification of SDSA Board..........................................................................157
Table 5-62 Technical specifications of DSA Board ...........................................................158
Table 5-63 Technical specifications of DSAF Board.........................................................160
Table 5-64 Technical specifications of GEM2/GEMF Board .............................................161
Table 5-65 Technical specifications of ASMA Board ........................................................162
Table 5-66 Technical specifications of TD2C board .........................................................164
Table 5-67 Technical specifications of MQA1 board ........................................................165
Table 5-68 Technical specifications of MQA2 Board ........................................................167
Table 5-69 Technical specifications of MJA board ...........................................................168
Table 5-70 Technical specifications of CH1 Board ...........................................................169
Table 5-71 Technical specifications of CO2 board ...........................................................170

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Table 5-72 Technical specifications of CQ2 board ...........................................................171

Table 5-73 Technical specifications of CS3 board ...........................................................172
Table 5-74 Technical specifications of CD3 Board for 40GBASE-LR4 .............................172
Table 5-75 Technical specifications of CD3 board for 40G POS ......................................174
Table 5-76 Technical specifications of LO2 card ..............................................................175
Table 5-77 Technical specifications of LQ2 board ............................................................177
Table 5-78 Technical specifications of LD2B board .........................................................178
Table 5-79 Technical specifications of LS3 board ............................................................178
Table 5-80 Tributary overhead processing of convergence board ....................................180
Table 5-81 Technical specifications of SOSC Board ........................................................181
Table 5-82 Technical specifications of supervision unit at boards ....................................181
Table 5-83 Technical specifications of dispersion compensation Board ...........................182
Table 5-84 Main technical specifications of DCU Board ...................................................183
Table 5-85 Dimensions and Weight of ZXMP M820 .........................................................183
Table 5-86 ZXMP M820 Board Weight.............................................................................184
Table 5-87 Power Consumption of Commonly Used Boards/Units of ZXMP M820 ..........188
Table 5-88 Temperature and Humidity Requirements ......................................................194
Table 5-89 Requirements for Harmful Gases in the Equipment Room .............................195
Table 5-90 Climate requirement .......................................................................................196
Table 5-91 Requirements for mechanical stress ..............................................................196
Table 5-92 Climate requirement .......................................................................................196
Table 5-93 Static discharge anti-interference ...................................................................197
Table 5-94 RF electromagnetic radiated susceptibility .....................................................197
Table 5-95 Electrical fast transient burst susceptibility at the DC power port ....................197
Table 5-96 Electrical fast transient burst susceptibilities at the signal cable and control cable
ports ...................................................................................................................................198
Table 5-97 Surge susceptibility of DC power ...................................................................198
Table 5-98 Surge susceptibility of the outdoor signal cable ..............................................198
Table 5-99 Surge susceptibility of the indoor signal cable ................................................198
Table 5-100 Conductivity susceptibility of RF field ...........................................................199

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ZXMP M820 Product Description

Table 5-101 Conductive emission electromagnetic interference at the direct current port 199
Table 5-102 Radio active emission electromagnetic interference .....................................199
Table 5-103 Definitions and Description for the Common Interface on SEIA1 ..................204
Table 5-104 Definitions and Description for the Common Interface on SEIA2 ..................205
Table 5-105 Definitions and Description for the Common Interface on SPWA .................207

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 ZXMP M820 Product Description

1 Overview
Unitrans ZXMP M820 Dense Wavelength Division Multiplexing Optical Transmission
Equipment is a metro oriented transmission system. It can multiplex up to 192
wavelengths (uni-direction) in a single-core fiber, with total transmission capacity of
1.92Tbit/s in 10G system, 3.84Tbit/s in 40G system and 8Tbit/s in 100G system. It offers
full-rate optical access capability from STM-1/OC-3 to 100GE, as well as complete
access capability for other services, such as POS, ATM, Ethernet and PDH. ZXMP M820
rack is illustrated in Figure 1-1.

Figure 1-1 Rack Diagram of Unitrans® ZXMP M820

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ZXMP M820 Product Description

Based on the development idea of “creating free, powerful and scalable optical
transmission networks”, ZTE develops its new-generation of digital transmission
products including Unitrans ZXWM M920 DWDM equipment which provides large
bandwidth and long-haul transmission at the backbone layer, ZXMP M820 DWDM
equipment, ZXONE 8000 DWDM equipment, ZXMP M721 DWDM/CWDM equipment,
and ZXMP M600 CWDM equipment.

The new-generation digital transmission products of ZTE can satisfy all applications from
the backbone network to end user access, and provide users with future-oriented overall
transmission solutions. The applications of ZTE’s optical transmission products is shown
in Figure 1-2

Figure 1-2 ZTE’s New-Generation Digital Transmission Product Family

ZXMP M820 is mainly applied to the metro core and m.

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 ZXMP M820 Product Description

2 Highlight Features
This chapter introduces the salient features of ZXMP M820.

2.1 Large Capacity and Easy Upgrade

ZXMP M820 can provide 1.92/3.84/8Tbit/s transmission capacity, fully satisfying the
ever-growing requirements on bandwidth. The system is designed with modular structure
and multi-rack management technology. It can be smoothly upgraded to 192-wavelength.
Its good scalability and expansibility can protect user’s investment maximally.

2.2 Single 100Gbit/s system

ZXMP M820 can support single 100Gbit/s system, and has following features:

 Support 80 wavelengths

Support 80*100GE transmission and the capacity of at most 8T

 PM-QPSK Coherent Rx modulation for ULH transmission

PM-QPSK Coherent Rx coding with SD-FEC has good OSNR tolerance and can
restrain the non-linear effect well. It can reach over 1500KM without the REG with
50GHZ spacing.

 Embedded high-speed DSP technology realizes the compensation of dispersion

and PMD, so that the additional boards of PMD and CD compensation are reduced.

PM-QPSK coding can restrain the non-linear effect well. With DSP technology, the
PMD tolerance can support 30ps and CD tolerance can support +/-50000ps/nm.

2.3 Single 40Gbit/s system

ZXMP M820 can support single 40Gbit/s system, and has following features:

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ZXMP M820 Product Description

 Support 96 wavelengths

Support 80/96*40G transmission and the capacity of at most 3.84T;

 P-DPSK and RZ-DQPSK modulation for ULH transmission

Improved DPSK coding has good OSNR tolerance and can restrain the non-linear
effect well. It can reach 1500KM without the REG with 50GHz spacing.

RZ-DQPSK coding has good PMD tolerance and can restrain the non-linear effect
well. It can reach 2000KM without the REG with 50GHZ spacing.

 Embedded TODC and EDFA and the same dispersion tolerance & power budget as
10G system.

OTU board is embedded with TODC and EDFA, the system allows the biggest
dispersion tolerance of -700ps/nm ~+700ps/nm, and the dispersion tolerance &
power budget are the same as 10G system.

 Ultra high integration

40G board only needs 2 slots, with high integration and low power consumption.
Single rack supports 21×40G wavelengths.

For the OTN electrical cross-connection subsystem, this supports 2*40G in a single
slot for client side and 1*40G in a single slot for line side.

 Smooth network upgrade

The 40G board can plug and play in the legacy equipment because the system is
developed on the existing WDM platform. It supports smooth upgrade from 10G to
40G without any service interruption.

2.4 Super-long-haul Transmission

With different optical transponder units (OTU), EDFA, FEC, AFEC and SD FEC
technologies, RZ/SRZ coding technology, P-DPSK/DQPSK/PM-QPSK coding
technology, distributed Raman amplifier(RAMAN), Remote pumped optical amplifier

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(RPOA) and dispersion management technology, ZXMP M820 can perform super long
non-electric relay transmission from several kilometers up to thousands of kilometers.

2.5 Multi-service Access Mode

ZXMP M820 adopts an open design. The accessed optical signals can be converted to
ITU-T G.692 recommendation compliant wavelength signals for output by employing
optical/electric/optical conversion technology.

It supports transparent transmission of optical signals in multiple formats, such as

STM-N (N=1, 4, 16, 64,256), POS, GE/10GE/100GE, OTU1/2, ATM, ESCON,
FICON,DVB and FC, which protect users’ benefit and provide an ideal means for network
expansion.

ZXMP M820 also can multiplex low-rate services into 100GE, 40G, 10G or 2.5G rates
transparently to improve the availability of system wavelength.

2.6 Flexible networking modes

Functionality of ZXMP M820 can be changed from OLA to OADM to OTM by choosing
different combination of functional modules, making it more flexible for complicated
network topologies, such as chain, star, cross, tangent-ring and mesh networks.

2.7 Wavelength Add/Drop Functions

Filters in the ZXMP M820 can be configured flexibly to implement the adding/dropping of
1 to 80 wavelengths. With this kind of design, the ZXMP M820 supports both the FOADM
and the ROADM functions.

FOADM: This function is to implement the adding/dropping of fixed wavelengths.

ROADM: With this function, wavelengths to be added/dropped can be reconfigured.

Besides, add/drop ports can be assigned to these wavelengths flexibly, that is the
port-assignment function. ZXMP M820 support ROADM function based on WSS

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technologies.

2.8 Reliable Protection Functions

ZXMP M820 can provide multiple and effective protection modes: Optical subnet
connection protective switchover(OSNCP); Unidirectional optical line protective
switchover (ULSR); Unidirectional optical channel protective switchover(UPSR);
Bidirectional optical line share protective switchover (BLSR); Bidirectional optical
channel share protective switchover(BPSR) etc. which with the switching time shorter
than 50ms. When ZXMP M820 is configured as OADM node on a ring network, route
protection of channels can be accomplished.

2.9 Performance Monitoring Technology

ZXMP M820 uses a board performance monitoring unit to capture board performance
data, which can be viewed to accurately locate a fault via NMS.

2.10 Power Management Technology

ZXMP M820 adopts excellent power management technology to adjust and control the
power and power spectrum at each point in the system.

ZXMP M820 system supports LAC(line attenuation control), APC(automatic power

control), AGC(automatic gain control) etc. technologies. The gain adjustment range of
LAC card is: 2-26dB; the gain adjustment range of general optical amplifier is ±5dB
which can both be adjusted via NM.

APC and AGC technologies can control the launched power/gain on MS level to ensure
hitless in-service insertion or removal of channels.

2.11 Powerful NM

NetNumenTM U31 (BN), adopted by ZXMP M820, can manage CWDM, DWDM, SDH,

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PTN and Data equipments. The new generation network management system on NE
management layer/ subnet management layer is used to manage and supervise NE
equipment in the bearer network (BN).

Based on OSPF algorithm, the NMS has ECC automatic route function, that is to say the
ECC route between NEs can be set up automatically without manual configuration,
which could make the networking application easily and fast.

In addition, the NMS supports remote and online upgrade of NE software and board
software, provides management at multiple layers, i.e. NE layer, NE management layer
and network management layer, and offers the fault management, performance
management, security management, configuration management, maintenance
management and system management.

2.12 WASON

ZXMP M820 supports GMPLS/WASON control plane load, and has following features:

 Rapid automatic route discovery

 Strong ability for automatic resource discovery

 Versatile resource management functions

 Fast end-to-end service provisioning

 Multi-level SLA

 Standard technology and open platform

 Flexible equipment upgradeability

 Highly operable and maintainable

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3 Functionality
This chapter introduces the functions of ZXMP M820 in detail, including transmission,
ultra-long-haul distance transmission, power management, performance test, dispersion
management, service capability, communication monitoring, alarm input/output and
protection.

3.1 Functions

3.1.1 Large Transmission Capacity

 Transmission system less than 48-wavelength employs on the C band with 100
GHz channel spacing.

 80/96-wavelength transmission system employs on the C band via inter-leaver

technology with 50 GHz channel spacing.

3.1.2 Ultra-long-haul Distance Optical Source

ZXMP M820 employs the ultra-long-haul distance optical source technologies including
forward error correction (FEC) coding, advanced out band FEC coding, soft-decision (SD)
FEC coding, RZ code pattern and self-adaptive receiving.

 FEC technique

i Description

FEC is a signal data processing technique. At the transmitting end, it sends the data with
the redundant code generated by the specific algorithm, while, at the receiving end,
according to the relevant algorithm, it checks and corrects the bit errors occurring during
transmission with the redundant codes, and restores the original signals.

ii Features

Improve the error tolerance capability of the transmission signals to reduce signal/noise
ratio required by the system, and extend the transmission distance.

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The conventional FEC based on G.709 can increase the OSNR tolerance about 5~6 dB,
and the advanced FEC technique adopting more effective coding algorithm can increase
the OSNR tolerance about 7~9dB.

 PM-QPSK Coherent Rx modulation for ULH transmission

PM-QPSK Coherent Rx coding with SD-FEC has good OSNR tolerance and can
restrain the non-linear effect well. It can reach over 1500KM without the REG
with 50GHZ spacing.  Return to zero (RZ) technique

RZ code allows higher peak value of power than NRZ code, and the mean transmitting
optical power of RZ and NRZ code are on the same level, so it improves the signal/noise
ratio for receiving signals of the system.

And RZ code reduces signal power spectral density to effectively suppress non-linear
impact during transmission, so RZ code is more suitable for ultra-long-haul transmission.

 Super RZ (SRZ) technique

With lower spectrum power density and higher suppression of the non linear effect than
RZ technique, the OSNR tolerance of back to back is less than 9dB, so it is suitable for
the long-haul or super long-haul transmission distance.

 Self-adaptive receiving technology

The receiver adjusts the judgment point level and phase automatically according to the
signal receiving conditions, in order to obtain a higher Q value and lower bit error rate.

3.1.3 Optical Amplifier

Optical fiber amplifier of ZXMP M820 system is based on single-stage mode or

double-stage mode. Enhanced Optical Booster Amplifier (EOBA),,Enhanced Optical
Line Amplifier (EOLA) and Enhanced Optical Preamplifier (EOPA) is based on
single-stage mode , and Enhanced Optical Node Amplifier(EONA) is based on
double-stage mode. EOBA,,EOLA and EONA use dual pumps, and EOPA use single
pump or dual pumps. The wavelength of single pump source is 980nm, and the
wavelengths of dual pump sources are 980nm and 1480nm. Gain flatness is ±1dB. Extra
metal ion and Gain Flattening Filter (GFF) can be added to ensure OA gain flatness.

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Characteristics of dual/single pump source of EDFA are shown as below:

Table 3-1 Characteristics of dual/single pump source

Quantity
Output Power Power stableness
of pump Wavelength
power stability technique
source

Dual 980nm 100-150mW ±0.02dB Automatic gain control

pumps 1480nm 200-350mw ±0.02dB Automatic gain control

Single
980nm 100-150mW ±0.02dB Automatic gain control
pump

ZXMP M820 employs ultra-long-haul distance technologies, such as RAMAN amplifier

and large power EDFA. Working principles of Raman amplifier (RA) are shown as
following:

Figure 3-1 Principles of RA

Compared with EDFA, the RAMAN fiber amplifier enjoys low noise merit. The equivalent
noise factor of the distributed RAMAN amplifier board (DRA) of ZXMP M820 is 0 dB, and
switching gain is 10 dB.

ZXMP M820 also provides large power EDFA, which directly improves OSNR to extend
the transmission distance.

3.1.4 Power Management

To guarantee the network performance, ZXMP M820 adopts power management

technology to adjust and control the power and power spectrum at each point in the

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system.

 Intelligent Power Management

The intelligent power management is implemented by the line attenuation card (LAC),
optical amplifier board and EMS. It can detect the changing state of the optical line power
and make relevant adjustments accordingly, so as to maintain the receiving power and
OSNR ratio at the normal value during ZXMP M820’s operation.

Attenuation of LAC can be adjusted from 2dB to 26dB. And attenuation of LAC with
attenuation slope compensation can be adjusted from 5dB to 26dB. The gain of optical
amplifier in ZXMP M820 system can be adjusted via NM, and the typical range is ±5dB.

ZXMP M820 can provide APR or APSD protection process, that is, the EDFA
automatically reduces the power or switches off the power in case of no input light, so as
to make operator safety.

 Protection process is fulfilled as follows:

i. Optical power supervision device detects signal loss at active optical channel.

ii. Reversing pump of RA shuts down.

iii. Co-directional EDFA output at downstream node of breakpoint remains (APR)

or shuts down (APSD).

iv. Inverse EDFA at downstream node of breakpoint shuts down and

automatically checks system recovery in intervals specified.

v. Inverse EDFA output at upstream node of breakpoint remains (APR) or shuts

down (APSD).

vi. Co-directional EDFA at upstream node of breakpoint shuts down and

automatically checks system recovery in intervals specified.

vii. After bidirectional fibers of the system recover, the output of EDFA and RA at
the transmission section of breakpoint returns to normal.

In ZXMP M820 system, RA can automatically shut down and manually restart.

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 Auto Performance Optimization

When APO (Auto Performance Optimization) is adopted, the power management

subsystem plane can intelligently adjust LAC and EDFA gain to automatically optimize
and manage DWDM system parameters such as optical power and OSNR.

The power management subsystem is composed of controller, executor, monitor,

communication (within a NE or between NEs) interface and protocols, as shown in the
following figure:

Figure 3-2 Power management sub-system

Optical board Optical board

Monitor Monitor
Executor Executor

Backplane Backplane
Interface Interface
Board control/ management backplane
interface (across subracks and racks)

Communication control
Backplane Backplane interface between NEs
Interface Interface
SNCP SOSC

Communication control interface within a NE

EMS SNMS

Power management functions are at SNMS level. The controller is embedded in

Manager.

i. It takes the data from EMS database and analyzes it according to system
service and network topology.

ii. It makes the management scheme (comprising the setting states of the power
adjustment executors of the NEs) in accordance with the power management
algorithm.

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iii. It supplies the scheme to the operator to view, and then sends it to the NEs to
optimize the power.

The network power optimization starts under the command of auto performance
optimization. After the automatic optimization completion, it can be executed with the
operator’s approval.

The automatic power management starts after operation, and monitors the system
performances. It can handle a fault automatically, store and display the result.

3.1.5 Performance Detection Function

ZXMP M820 systems can provide OPM to supervise optical parameters at each optical
channel, e.g., optical channel power, central wavelength and OSNR. It can supervise
active optical channel in real time without disconnecting services, send related data to
NMS and check the associated physical quantity at NM in two view modes: illustration
and data. Measurement precision of central wavelength is ±0.1nm, power ±1.0dB and
OSNR ±1.5dB.

OPM functions are shown as following:

 Supervise path wavelength, optical power and OSNR of WDM signals in real-time.

 Automatic self-calibration.

 Supervise four channels of input optical signals (with optical switch);

 Process data on boards, and find out power, wavelength and OSNR at peak points.

If OPM is not configured, NMS can supervise OA and OTU input and output power.
Precision of optical power is ±1dB.

The OTU part has performance monitoring and overhead processing functions,
which can accurately locate faulty point and type by layer.

 OTN layer: Monitor loss of frame alarm (OTUk-LOF) and bit interleaver parity check
(OTUk-BIP8), and process overhead SM-TTI.

 SDH signal: Monitor and check B1, B2 and J0 bytes.

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 GE signal: Monitor and collect error packets and error packet rate statistics.

ZXMP M820 equipment provides monitoring port in each board for the carrier to test and
monitor the signal quality by accessing the apparatus.

3.1.6 OTN Description

In OTN architecture, the OTH (Optical Transport Hierarchy), which is based on the ITU-T
G.709 Recommendation, can be adopted to build a flexible transmission sub-layer. At
present, the OTH provides electronic cross-connect and convergence for ODU1
(2.5Gbit/s) and ODU2 (10Gb/s), which helps to improve wavelength utilization.

The G.709-based OTN provides rich overhead resources and enables strong
management ability on the optical layer. OTN maintenance signals are used for fault
isolation and alarm suppression, which greatly reduces system maintenance burden.

In a configurable optical network, powerful monitoring management is very important.

Carriers always find that data signals cannot be properly received, though the optical
power of the receiving end is normal. The TCM overhead on the ODU (Optical
Demultiplexer Unit) layer supports trans-domain or trans-network end-to-end optical
channel monitoring and management; together with optical channel detection technology,
it enables optical power monitoring, alarm correlation check, fault location, QoS
confirmation, and protection switchover triggering.

The OTU boards of ZXMP M820 comply with G.709 recommendations. M820 supports
OTN overhead detection and processing such as OTUk/ODUk/OPUk-based LOF
detection, multi-frame detection, FEC performance detection and SM/PM/TCM/PT
overhead detection which enable precise fault location and easy network maintenance
management.

ZXMP M820 supports electrical cross-connect based on

ODU0/ODU1/ODU2/2e/ODU3/3e2 which can achieve sub-wavelength grooming.

3.1.7 Dispersion Management

Dispersion restrictions must be taken into consideration in long-haul transmission for

10G and 40G system. Certain amounts of the dispersion compensation modules are

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configured in the dispersion compensation plug-in box (DCM) of ZXMP M820 on actual
demands.

By configuring the values of line compensation, pre-compensation and

post-compensation reasonably, the system could actualize the balance compensation,
as shown in Figure 3-3

Figure 3-3 Dispersion management

3.1.8 Service Functions

Service Access Function

ZXMP M820 can access the following services:

 SDH services including STM-1/4/16/64/256

 SONET services including OC-3/12/48/192/768

 ATM or POS services including VC4, VC4-4c and VC4-16c

 Ethernet services including FE, GE, 10GE, 100GE

 Enterprise intranet services such as ESCON, FICON, DVB and FC.

 Any rate services between 34Mbit/s ~ 2.67Gbit/s

Service Convergence Function

ZXMP M820 can converge and de-multiplex the low rate signals.

 Each SRM42 board converge 4 STM-1/4 SDH signals or ATM signals to STM-16

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signal.

 Each SRM41 board converge 4 STM-16 SDH signals or ATM signals to STM-64
signal.

 Each MQT3 board converge 4 STM-64/OC-192/10GE/OTU2 signals to OTU3

signal.

 Each MX2 board converge 10 STM-64/OC-192/10GE/OTU2 signals to OTU4

signal.

 Each SDSA/GEM2/GEMF board converge 2 GE signals to 2.5Gbit/s rate.

 Each MOM2 board converge 8 GE/FC or 4* 2GFC or 4*2.5G to OTU2 signal.

 DSA board implements the multiplexing/demultiplexing between eight data service

signals at tributary side and two STM-16 signals at aggregate side.

 MQA1 board can access four channels of any rate service ranging from 100Mbps to
2.67Gbps, the typical types of services include STM-1/4/16(OC-3/12/48),OTU1,
FE/GE, 1G/2GFC, DVB_ASI/ESCON/FICON/HDTV, PDH.

 MQA2 board can access four channels of any rate service ranging from
1.0625Gbps to 4.25Gbps.

 MJA board can upgrade smoothly from 4 to 10 any rate service access on client
side by collaborating with MQA1, and can upgrade smoothly from 4 to 22 any rate
service access on client side by collaborating with MQA2. MJA supports any rate
service from 100Mbps to 2.67Gbps.

 It is applicable to different networking conditions by selecting tributary modules and

aggregation module type.

3.1.9 Wavelength Add/Drop Function

The ZXMP M820 supports the adding/dropping of wavelengths in the granularity of 1

wavelength, 4 wavelengths or 8 wavelengths. The quantity of wavelengths to be
added/dropped can be expanded from 1 to 80.

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An optical add/drop multiplexer subsystem can be configured as a fixed one (FOADM) or

a reconfigurable one (ROADM).

FOADM: In such subsystem, OAD board is needed to add/drop fixed wavelengths in the
system.

ROADM: In such subsystem, additional WBU or WSU board is needed. Configure the
system in the EMS to implement the adding/dropping and direct transmission of any
specified wavelengths in the same direction. Moreover, the ROADM subsystem provides
the port assignment function, with which wavelengths can be added/dropped through
assigned ports.

In ROADM subsystems, it is unnecessary to adjust fibers manually when the quantity of

wavelength to be added/dropped changes or some other wavelengths need to be
added/dropped.

3.1.10 Communication and Monitoring Functions

The supervision and communication subsystem of ZXMP M820 is composed of SNP,

SOSC and SEI boards.

The functions are:

Main control board (SNP)

SNP board is used as an NE control processor in the supervision subsystem

implementing NE-level network management function. SNP board provides the following
functions:

 Provides S interfaces that are used to communicate with the other boards in an
NE, collect and process alarm and performance messages of the other boards, and
report to the EMS.

 Stores configuration data of an NE. After configuration, SNP boards can work
independently without the EMS.

 Provides Qx interfaces for upper-layer management system. In the supervision

subsystem, Qx interface is provided by SEI board.

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 Implements Automatic Protection Switch (APS) function to ensure that the

communication speed of APS data meets the requirement of the APS conversion
time.

 When optical supervision channel fails, SNP board ensures the transfer and
exchange of supervision information through standby route (accessed via SOSC
board).

 Provides alarm input/output signals for SEI board, through which output the
alarms to head cabinet or other user alarm equipments.

 Provides management function for multiple racks. An SNP board can manage
16 racks, that is, 1 master rack and 15 slave racks.

 Provides SD card to store EMS historical data.

 PCB board provides RJ45 interface to facilitate the board de- bugging. The
panel provides RS232 interface to output the board debugging information.

 Supports the online update of board software.

Optical supervision channel card (SOSC)

SOSC board is used in 100M supervision systems to implement the transmission and
exchange of ECC data, channel data of order and transparent user, and APS information.
The main functions are described as follows:

 In 100 M supervision system, pack the data between NEs in the form of IP
packet, such ECC data, APS data, transparent user channel data and order voice
data. And transmit and exchange all these data in the Ethernet data frame.

 The SOSC board provides three 10/100BASE-T Ethernet electric interfaces

with the automatic cross function (the physical interface is provided by SEI board).
The SNP board, EMS, slave SOSC board and backup route are accessed by these
interfaces to implement the supervision information exchange within the NEs.

 The front panel of SOSC board provides four 100BASE-FX Ethernet optical
interfaces to access 1510 nm supervision channel and realize the supervision

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information transmission between the NEs. 100BASE-FX is an optical interface with

the rate at 100Mbit/s.

 Based on the board hardware, the SOSC board provides the capability to
transmit supervision information within the three-level.

 The SOSC board adopts OSPF protocol to dynamically search the route.

Extension Interface Board (SEIA)

SEIA board is used to lead various external interfaces and cascaded interface of
sub-rack to the panel for connection. The functions are described as follows:

 Provides four FE Ethernet interfaces to be used as Qx interface to connect to

the EMS computer, or as the transparent user channel interface and IP phone
interface based on Ethernet.

 Provides a 26–pin interface for external alarm input.

 Provides a 15–pin interface for external alarm output, alarm LED or ringing
output.

 Provides a 15–pin alarm cascaded interface.

 Provides alarm ring switch.

Through the 100Mb/s Ethernet technologies, the 100Mbit/s supervision system

encapsulates ECC data, APS data, transparent user channel data, and order wire voice
data in IP packets, and transmits/exchanges them in the Ethernet data frame. The 100
Mb/s supervision systems can increase communication bandwidth between control
boards in the NE, and reduce quantity and type of backplane buses.

The position of supervision subsystem is shown in Figure 3-4

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Figure 3-4 Position of supervision subsystem

3.1.11 Time/Clock Synchronization Service

ZXMP M820 supports clock and time synchronization. It meets the requirements of the
3G base station for precise time synchronization.

By abstracting clock information from serial stream of transmission link physical path, the
clock synchronization mechanism in the physical layer can realize synchronous
frequency.

Time synchronization follows IEEE 1588 V2 protocol. ZXMP M820 provides out-of-band
1pps+TOD and FE time synchronous interface to realize out-of-band time transmission.

Time synchronization service supported by ZXMP M820 includes:

 Use BMC algorithm to choose clock. BMC (Best Master Clock) algorithm
decide clock source by comparing descriptive data of two or more clocks.

 Support OC, BC and TC.

 Support clock and time SSM processing.

 Support latency compensation service

 Support switchover of active and standby clock sources.

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SEIA2 card installed in CX sub-rack provides the input/output of 2M Hz or 2M bits clock.

The selection of analog or digital clock is realized by the switch. M2SEIA2 supports two
groups of clock input or output.

3.1.12 Alarm Input /Output Function

 Alarm input function

ZXMP M820 uses the optical coupler isolation signal to access the alarm inputted
by the external monitoring equipment, and displays it on the NMS through the
ALARM_IN interface on the SEIA board.

The system can access 10 external alarms at most. The alarm type can be set
through the NMS for detection of external environment alarms, such as fan, doors
and temperature.

 Alarm output function

The equipment alarm is outputted to the WARN interface in the SEIA board and
then outputted to the monitoring display cabinet or other monitoring units in the
equipment room via the ALARM_OUT interface of the SEIA board. Signals are
isolated by relays.

3.1.13 System Level Protection

 OTU board 1:N protection

The WDM networks generally require spare OTU boards and elements. When
configured in protective mode, spare part can realize real-time protection, which is
much quicker, safer and saves maintenance cost.

1:N protection only need to configure OTU and OMCP units at both ends of OTM,
and may utilize the spare OTU board also, which has a low cost.

The processes are shown in Figure 3-5

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Figure 3-5 The Block Diagram of Optical Path 1: N Protection Function

When several paths of services are faulty simultaneously, it is required to protect

the services with higher priority set in the NMS. One OMCP board can perform 1: 8
protections.

 Common Units Protection

Firstly, ZXMP M820 supports 1+1 power protection on the sub-rack with two power
inputs. The sub-rack power module SPWA fulfills reverse connection prevention,
soft start, balance and supervision of two power inputs. The information is sent to
Power Distribution Unit on the top of rack for processing and reporting to NM via
alarm cable.

Secondly, ZXMP M820 supports 1+1 SNP board protection, so that guarantee the
communication among all the boards in the NE, and Implements various functions,
such as control, communication and GMPLS protocol processing more security.

Thirdly, ZXMP M820 supports ring protection for the inner-connection of sub-racks,
so that avoids the communication interruption between sub-racks. .

3.1.14 Network level Protection

 Optical Path 1+1 Protection

i Protection principles

The optical path 1+1 protection is implemented with the OP board, by sending
concurrently and receiving selectively in both working path and protection path.

ii Applications

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One OP board is used to protect a pair of bidirectional services with the same
wavelength. Under the 1+1 protection case, the number of OP boards configured is
the same as that of protected channels.

iii Chain networking

The protection path and the protected path are transmitted in the same fiber. On the
chain networking, 1+1 protection can only perform equipment protection instead of
route protection, as shown in Figure 3-6

Figure 3-6 Optical Path Layer 1+1 Protection (Chain Networking)

iv Ring networking

On the ring networking, the protection path and the protected path reach the
receiving end through different paths. 1+1 path protection can protect both route
and the equipment. The ring networking is shown in Figure 3-7.

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Figure 3-7 Ring Networking

C
Protection
path

B D

Work
path A

 MS 1+1 Protection

The MS 1+1 protection of ZXMP M820 adopts 1+1 protection mode section by section,
as shown in Figure 3-8.

Figure 3-8 Functional Block Diagram for MS 1+1 Protection

 2-fiber bidirectional path shared protection

In the 2-fiber bidirectional path shared protection ring, λ1 of the external ring forms the
working path, and λ1 of the internal ring forms the protection path. The working path
allows wavelength multiplexing of multiple unidirectional services, and the protection

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path shares protection of all services on the working path. Meanwhile, the optical switch
can be connected via OPCS (path shared protection board) to control the adding status
of adding protection wavelengths, so as to avoid conflict, on the protection ring, of
multiple services that use the same working wavelength.

In Figure 3-9 for example, as optical fibers on a certain span failed (indicated by the
symbol of ×), services passing this span are broken, thus the access switch starts
operation at the transmitting end, and services are transmitted along the protection route.
When the two switching switches at the receiving end start operation, services are
received from the protection route and the service protection is actualized.

Figure 3-9 Schematic diagram of 2-fiber bidirectional path shared protection

3.1.15 Network management channel backup

In DWDM transmission networks, network management information is transmitted

through an optical supervisory channel, which is generally transmitted through the same
optical fiber with main channel. In case of any failure in main channel, it will also affect
the supervisory channel, i.e. loss of control on NE. In the condition of high traffic and
backbone network, it is not affordable to lose control. To solve such problems, ZXMP
M820 provides abundant measurements and protection to the supervisory channel.

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In ring network, when certain section fails (e.g. optical fiber damage) in a certain direction,
network management information automatically switch to the optical supervisory channel
in the other direction of the ring without affecting the management of the whole network.

In chain network, the situation is more critical, because breakage in optical fiber means
breakage of supervisory channel. Consequently, network management administrators
are unable to get the supervisory information of failed station. To avoid this accident,
network management information should use the backup channel. By using data
communication network (DCN) and routers, ZXMP M820 can provide backup network
management channel.

When the network is normal, network management information is transmitted over the
main supervisory channel, as shown in Figure 3-10

Figure 3-10 Network management through supervisory channel

On the failure of main supervisory channel, network elements automatically switch the
management information to the backup channel to guarantee that the network
management system can supervise and operate the entire network, as illustrated in the
Figure 3-11

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Figure 3-11 Network management through backup supervisory channel

3.1.16 L0/L1/L2 integrated transport technologies

ZXMP M820 WDM platform integrates L0/L1/L2 transport technologies and enables the
flexible accessing and dispatching of service, especially the prevailing Ethernet service.

ZXMP M820 offers three kinds of ROADM technology aiming at different scenarios to
provide the most cost-effective solution for the customer. ZXMP M820’s multi-degree
ROADM based on WSS technology enables the wavelength routing and accelerates the
deployment of new services.

To better transport the Ethernet service, ZXMP M820 offers both transparent
transmission and statistic multiplexing of Ethernet service, the former is based on TDM
technology without affecting the Ethernet service, the latter is based on L2 switch
technology to enhance the transport efficiency of Ethernet service and reduce the
CAPEX and OPEX of the network. ZXMP M820’s L2 switch supports E-Line (EPL &
EVPL) and E-LAN.

3.1.17 ROADM Function

ROADM supports dynamic wavelengths add/drop through remote control from NMS. In
directionless configuration, the wavelength can be retrieved or assigned from/to any
direction. In colorless configuration, any port can add/drop any wavelength. ZTE ROADM
solutions are based on the WB (wavelength blocker), PLC (Planar Lightwave Circuit) and
WSS (Wavelength Selective Switch) technology, which can support 2~9 directions
ROADM solution.

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ROADM provides node reconfiguration, implements connection between any two nodes,
wavelength-level add/drop and pass-through configuration without manual intervention,
thus addressing service demands and cutting operation & maintenance cost. In addition,
the adoption of ULH WDM techniques greatly reduces full-band service terminations and
undesirable O-E regeneration, enabling a highly scalable network, and saving equipment
investment. With ROADM, multi-ring, mesh and star can be formed flexibly, adapting to
dynamic characteristics and networking requirements for future service networks.

ZXMP M820 supports colorless and directionless ROADM solutions which are the most
flexible. Colorless means any wavelength can be assigned to any port. Directionless
means any direction can be assigned to any port.

ZXMP M820 ROADM supports multiple networking modes, meets networking

requirements at different levels. The Comparison of ROADM networking schemes is
shown as below table.

Table 3-2 ZTE Networking Scheme and Application Environment

Scheme Linear ROADM Ring ROADM Mesh ROADM

Main application
Long-haul trunk line Metro network Metro network
environment

WB ROADM
WB ROADM
Technology PLC ROADM WSS ROADM
PLC ROADM
WSS ROADM

Wavelength
add/drop,
Wavelength add/drop,
Available Spectrum balancing, wavelength
wavelength scheduling,
functions wavelength add/drop scheduling,
wavelength grooming
wavelength
grooming

ZTE ROADM system provides multiple solutions, complete networking modes, meeting
requirements of the customers with different network status and at various levels. The
below table lists the recommended ROADM configuration targeting customers’ different
requirements:

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Table 3-3 ZTE/ ROADM Solutions

Solution Characteristics Target customer

Uncertainty in service
Add/drop wavelengths can growth, large traffic of future
WSS ROADM with tunable be provisioned randomly, services, or requiring
port in add channel wavelength grooming extremely high network
flexibly. flexibility and wavelength
route.

Add/drop wavelengths are

Services are relatively fixed,
WSS ROADM with fixed fixed, supports complex
future networks may evolve
port in add channel network architecture in the
towards Mesh.
future.

Services are relatively fixed,

PLC ROADM with fixed port Add/drop wavelengths are
future services are
in add/drop channels fixed, the cost is low.
predictable.

Services are relatively fixed,

WB ROADM with fixed port Add/drop wavelengths are
future services are
in add/drop channels fixed, the cost is low.
predictable.

3.1.18 Electrical Cross-Connect Function

Electrical Cross-Connect system can access data services including GE, FC, FICON,
ESCON, SDH and DVB. The services can be aggregated into multiple ODUk services on
the tributary convergence board and be cross connected at a granularity of
ODU0/1/2/2e/3/3e2. Then the cross connected signals are aggregated into OTU2/OTU3
on the group convergence board and are eventually output from the line-side interface.

Electrical Cross-Connect system is categorized as centralized or distributed switching

platform in Figure 3-12

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Figure 3-12 Electrical Cross-Connect System Structural Diagram

2x40G
（STM-256/40G POS） CD3 LS3 1xOTU3/3e2
1x40G CS3 LS3 1xOTU3/3e2
（STM-256/40G POS） ODUk Switch Core
8x10G Any LQ2 4xOTU2/2e
（10GE LAN/WAN/STM-64） CO2

4x10G Any LO2 8xOTU2/2e

（10GE LAN/WAN/STM-64） CQ2

16x Any CH1

(GE/STM-1/4/16/FC100/200)
LO2B 8xOTU2/2e
(PIC)

ZXMP M820 equipment can provides CX20 electrical switching sub-rack, which can
implements ODU0/1/2/2e/3/3e2-based centralized non-blocking switching and realize
flexible service scheduling in electrical layer. At the same time, client-side and line-side
are separated. They share the line bandwidth and effectively improve network bandwidth
utilization.

 Client-side card or line-side card can be flexibly added or deleted based on practical
needs to protect operators’ investment.

 Client-side and line-side cards can be combined flexibly. Network spare parts types
can be reduced from M×N to M+N (M is client-side card and N is line-side card, M,
N>2) to reduce CapEx.

 Client-side and line-side cards are separated, which can improve flexible
scheduling and reduce OAM pressure.

The DSS (Distributed Service Switch Platform) consists of four cards, and each card is
composed of line side unit, client unit and switching matrix. Client unit can access any
rate service from 100Mbit/s to 4.25Gbit/s. The non-blocking service switching among
these four cards can realize sub-wavelength service dispatching or multicasting during
multiple directions. The switching granularity can be ODU0 or ODU1. Total switching
capacity of each DSS group is 80G and single sub-rack can support multiple DSS. The
cross connected signals are aggregated into OTU1/OTU2 on these group convergence
cards and are eventually output from the line-side unit. DSS can also realize 1+1
protection on ODUk and BPSR on ODUk based on ODU0/ODU1 granularity.

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In DSS subsystem, switching matrix is distributed on service card and doesn’t occupy
other service slots. Such highly integrated cards can reduce power consumption
effectively.

3.1.19 Photonic Integrated Circuit (PIC) Technique

LO2B board uses PIC technique to improve integration and facilitate maintenance.

Figure 3-13 Principle of PIC module (TX and RX)

2 9 2 2 2

TEC Ther Ther

mister mister
heater EML
heater EML PD
PD
heater EML
PD
Optical
8×10Gb/s PD output
AWG
Mux

electrical PD
signal input
PD
.. .. ..
. . .
PD

PD
8 8
Bias Moniter power GND

bias
2 2 8

themi
2x8
ster
PIN TIA
PIN TIA

8×10Gb/s
AWG
DMux

electrical
Optical signal
inout .. .. ..output

. . .

heater

3.1.20 Wavelength Tuning Function

Traditional DWDM systems use fixed wavelength lasers as light sources, which only
output fixed wavelengths complying with the specifications of ITU-T G.692. Fixed

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wavelength lasers cannot be fully utilized when they are used as standby light sources,
which results in the increase of cost. With the continuous development of light source
technology, a kind of tunable wavelength laser that can meet the requirement for
multi-wavelength tuning appears.

The “tunable wavelength laser” refers to a laser module that can be controlled to output
different wavelengths in a certain bandwidth. The channel quantity and channel spacing
of the output wavelengths meet the specifications of ITU-T G.692. With the application of
tunable wavelength lasers, wavelengths can be selected dynamically for signals in a
DWDM system according to the actual application of wavelengths. Especially when the
system uses standby light sources, using tunable wavelength lasers can improve the
utilization ratio of wavelengths.

Some service boards of the ZXMP M820 support both fixed wavelength output and
tunable wavelength output. The below table lists the boards supporting tunable
wavelengths and their tuning ranges (relationship among operating band, channel
quantity and channel spacing).

Table 3-4 Boards Supporting Wavelength Tuning Function

Channel Quantity @ Channel

Board Operating Band
Spacing

100G boards (with SD-FEC)

TS4 C band 80 CH@50 GHz

MX2 C band 80 CH@50 GHz

40G boards (with FEC or AFEC)

TST3 40 CH@100 GHz

C band 80 CH@50 GHz
MQT3
96 CH@50 GHz (CE band)

10 G boards (with FEC or AFEC)

EOTU10G
40 CH@100 GHz
SRM41
C band 80 CH@50 GHz
FCA
96 CH@50 GHz (CE band)
LD2B

SOTU10G 40 CH@100 GHz

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Channel Quantity @ Channel

Board Operating Band
Spacing
80 CH@50 GHz
96 CH@50 GHz (CE band)

2.5 G boards (with FEC)

OTUF C band 4 CH@100 GHz (continuous

wavelengths)
GEMF C band 16 CH@50 GHz (continuous
wavelengths)

16 CH@100 GHz (continuous

DSAF C band
wavelengths)

2.5 G boards (without FEC)

OTU 4 CH@100 GHz (continuous

wavelengths)
C band
SRM42 16 CH@50 GHz (continuous
wavelengths)

3.1.21 IWF Function

The IWF function can control wavelength and make wavelength stable in a DWDM
system with channel spacing of 50GHz. Stable wavelength means that frequency has no
wander.

In a DWDM system with channel spacing of 100 GHz, the system has relatively greater
tolerance for frequency wander. However, with the channel rate increasing and channel
spacing decreasing, e.g., the channel spacing of 80/96–channel system is 50GHz;
frequency wander will directly affect the system reliability.

ZXMP M820 provides different methods for systems with different channel spacing to
make wavelength stable.

 The system with 100 GHz channel spacing: Uses automatic power control,
temperature feedback, and internal wavelength feedback. They are implemented by
optical transponder boards.

 The system with 50 GHz channel spacing: Uses internal wavelength feedback and
external wavelength feedback to improve stability and accuracy of wavelength

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control.

i. Internal wavelength feedback: It is implemented by optical transponder boards.

ii. External wavelength feedback: It is implemented by IWF function. IWF function

employs integrated supervision and ordered adjustment to realize wavelength
feedback control. OWM board, multiplex boards, optical transponder boards, SNP
board, and EMS work together to realize IWF function. Figure 3-14 shows the
functional blocks of IWF function.

Figure 3-14 Functional Blocks of IWF Function (External Wavelength Feedback)

OWM board receives the aggregate optical signal sent by the MON interface of optical
amplification board. Then it tests the wavelength offset of each channel in the
multiplexed signal. If the offset is out of limit, OWM board informs SNP about this. Then
SNP sends the wavelength adjustment command to the corresponding OTU board, so as
to adjust wavelength offset to satisfy wavelength offset requirement.

EMS configures parameters, enables/disables the function of wavelength adjustment,

and sends command to OWM board.

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3.2 Networking

3.2.1 System Applications

3.2.1.1 Application of 8/16/32/40/48-Wavelength System

For less than 48-wavelength system, ZXMP M820 whole network application is illustrated
in Figure 3-15.

Figure 3-15 Whole Network Application with the ZXMP M820 (the System less than
48-Wavelength)

The module shown in the diagram is board in ZXMP M820.

1. Working wavelength range and channel spacing

C band (191.3 THz ~ 196.0 THz) at 100 GHz channel spacing

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2. System composition

 OTM: Optical terminal equipment. As shown in Figure 3-15. OTU belongs to

the optical transfer platform, OMU and ODU belong to the OM and OD platform,
EOBA and EOPA belong to the optical amplifying platform, SOSC belongs to the
monitoring platform. At the receiving end of the OTM, modules should be added for
dispersion compensation after long distance transmission. The wavelength spacing
transferred by OTU is 100 GHz.

 OLA: Optical line amplifier, including EOLA and SOSC. As shown in Figure
3-15, EOLA belongs to the optical amplifying platform; SOSC belongs to the
monitoring platform.

 OADM: Optical add/drop multiplexer. As shown in Figure 3-15, OAD belongs to

the add/drop platform, OTU belongs to the optical transfer platform, and SOSC
belongs to the monitoring platform.

3.2.1.2 Application of 80/96-Wavelength System

Take a unidirectional 2-segment transmission for example, and the whole network
application of the 80/96-wavelength ZXMP M820 is illustrated in Figure 3-16.

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Figure 3-16 Whole Network Application with the ZXMP M820 (the System with
80/96-Wavelength)

The module shown in the diagram is board in ZXMP M820.

1. Working wavelength range and channel spacing

C band at 50 GHz spacing

2. System composition

 OTM: Optical terminal equipment

OTU: belongs to the optical transfer platform in Figure 3-16.

OMU, ODU and OCI: The OM and OD platforms in Figure 3-16

OMU/ODU: Multiplex/de-multiplex C band (191.3 THz ~ 196.0 THz), C+ band

(191.35 THz ~ 196.05 THz), with the channel spacing of 100 GHz.

OCI: By adopting the inter-leaver technology, it multiplexes/de-multiplexes C band

and C+ band, and integrates them into the C band multiplexing signals with 50 GHz
channel spacing.

EOBA, EOPA: Belong to the optical amplifying platform in Figure 3-16. In an

80/96-wavelength system, they amplify the C band signals. At the receiving end of

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the OTM, modules should be added for dispersion compensation and power
balance after long distance transmission.

SOSC: Monitoring platform in Figure 3-16.

 OLA: Optical line amplifier

EOBA and EOPA: Belong to the optical amplifying platform in Figure 3-16. In
96/176-wavelength systems, they amplify the C band and L band signals.

SOSC and OPM: Belong to the monitoring platform in Figure 3-16. SOSC transmits
and receives monitoring information, while OPM tests the optical performance of
the optical interfaces.

3.2.1.3 Application of 160/176-Wavelength System

Take a unidirectional 2-segment transmission for example, and the whole network
application of the 160/176-wavelength ZXMP M820 is illustrated in Figure 3-17.

Figure 3-17 Whole Network Application with the ZXMP M820 (160/176- Wavelength)

The module shown in the diagram is board in ZXMP M820.

1. Working wavelength range and channel spacing

C+L band at 50 GHz spacing

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2. System composition
 OTM: Optical terminal equipment

OTU: belongs to the optical transfer platform in Figure 3-17.

OMU, ODU, OCI and OBM: The OM and OD platform in Figure 3-17

OMU/ODU: Multiplex/de-multiplex C band (191.3 THz ~ 196.0 THz), C+ band

(191.35 THz ~ 196.05 THz), L band (187.0 THz ~ 190.9 THz) and L+ band (186.95
THz ~ 190.85 THz) with the channel spacing of100 GHz.

OCI: By adopting the inter-leaver technology, it multiplexes/de-multiplexes C band

and C+ band, L band and L+ band, and integrates them into the C band and L band
multiplexing signals with 50 GHz channel spacing.

OBM: At the transmitting end, the OBM feeds the amplified C/L band signals via the
C/L pass band OM into the fiber. At the receiving end, it de-multiplexes the received
signals into the C/L band multiplexing signals and sends them to the relevant
amplifiers.

EOBA and EOPA: Optical amplifying platform in 0. In 160/176-wavelength system,

they amplify the C band and L band signals. At the receiving end of the OTM,
modules should be added for dispersion compensation and power balance after
long distance transmission.

SOSC: Monitoring platform in Figure 3-17.

 OLA: Optical line amplifier. Compared with the 40/48-wavelength system, an OM

part is added for C/L band signals.

OBM: Multiplexes/de-multiplexes signals of C/L band to the C band and L band.

EOBA, DCM and EOPA: Optical amplifying platform in Figure 3-17. In

160/176-wavelength system, they amplify the C band and L band signals. Among them,
DCM compensates dispersion for long distance transmission.

SOSC and OPM: Monitoring platform in Figure 3-17. SOSC transmits and receives
monitoring information, while OPM tests the optical performance of the optical interfaces.

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3.2.1.4 Application of 192-Wavelength System

Take a unidirectional 2-segment transmission for example, and the whole network
application of the 192-wavelength ZXMP M820 is illustrated in Figure 3-18.

Figure 3-18 Whole Network Application with the ZXMP M820 (the System with
192-Wavelength)

The module shown in the diagram is board in ZXMP M820.

1. Working wavelength range and channel spacing

C band at 25 GHz spacing

2. System composition

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 OTM: Optical terminal equipment

OTU: belongs to the optical transfer platform in Figure 3-18.

OMU, ODU, OCI: The OM and OD platform in Figure 3-18.

OMU/ODU: Multiplex/de-multiplex C1001 sub-band (191.300 THz ~ 196.000 THz),

C1002 sub-band (191.350 THz ~ 196.050 THz), C1003 sub-band (191.325 THz ~
196.025 THz) and C1003 sub-band (191.375 THz ~ 196.075 THz) with the channel
spacing of100 GHz.

OCI:

OCI1 and OCI2, by adopting the inter-leaver technology, it

multiplexes/de-multiplexes C1001 sub-band and C1002 sub-band, C1003sub-band
and C1004 sub-band integrates them into the C band multiplexing signals with 50
GHz channel spacing.

OCI3, by adopting the inter-leaver technology, it multiplexes/de-multiplexes C501

and C502 sub-band integrates them into the C band multiplexing signals with 25
GHz channel spacing

EOBA and EOPA: Optical amplifying platform in 0. In 192-wavelength system, they

amplify the C band signals. At the receiving end of the OTM, modules should be
added for dispersion compensation and power balance after long distance
transmission.

SOSC: Monitoring platform in 0.

SOSC and OPM: Monitoring platform in 0. SOSC transmits and receives monitoring
information, while OPM tests the optical performance of the optical interfaces.

3.2.2 Networking Modes

To satisfy the need of various networking modes and functions, ZXMP M820 can be
configured as an OTM, OADM and OLA.

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3.2.2.1 Point-to-Point Networking

 For short-haul transmission, ZXMP M820 can provide point-to-point network without
OLA, as shown in Figure 3-19.

Figure 3-19 Point-to-Point Networking (Short-Haul)

 For long-haul distance, trunk amplification mode is employed. An EOLA is added

between OTMs, as shown in Figure 3-20, which consists of three optical amplifying
segments.

Figure 3-20 Point-to-Point Networking (Long-Haul)

3.2.2.2 Chain Networking

The chain networking application with the OADM function is shown in Figure 3-21.

Figure 3-21 Application of Chain Networking

3.2.2.3 Ring Networking

The ring networking application is shown in Figure 3-22

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Figure 3-22 Application of Ring Networking

3.2.2.4 Ring-with-Chain Networking

The ring-with-chain networking application is shown in Figure 3-23.

Figure 3-23 Ring-with-Chain Networking

3.2.2.5 Cross Connection Networking

Cross connection networking is shown in Figure 3-24

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Figure 3-24 Cross Connection Networking

3.3 Transmission Codes Supported

By adopting the ultra-long-haul distance optical source and optical amplifying

technologies, the transmission codes supported by ZXMP M820 are listed in the
following tables.

Table 3-5 Transmission Codes Supported by 40 2.5Gbit/s System (G.652&G.655)

Category Specifications Target Distance (km)

1  36 dB 1  144 km

Without FEC 2  33 dB 2  132 km

(OSNR > 20 dB) 3 31dB 3  124 km

10 23 dB 10 92 km

FEC without RAMAN 1  41 dB 1×164km

(OSNR>15dB) 2  38 dB 2×152km

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Category Specifications Target Distance (km)

3 36dB 3×144km

20  25dB 20×100km

1  45dB 1×180km

FEC+ RAMAN 2 42dB 2×168km

(OSNR >15 dB) 3 40dB 3×160km

20  28 dB 20×112km

Table 3-6 Transmission Codes Supported by 40 /48 10Gbit/s System (G.652&G.655)

Category Specifications Target Distance (km) remark

1  61 dB 1  244km RPOA,40 10Gbit/s

1  49 dB 1 196km DRA, 40 10Gbit/s

1  57 dB 1228km RPOA,48 10Gbit/s

AFEC NRZ
1  48 dB 1  192 km DRA, 4810Gbit/s

30  22 dB 30  88 km -

12  30 dB 12  120 km -

1  64 dB 1  256km RPOA,40 10Gbit/s

1  52 dB 1 208km DRA, 40 10Gbit/s

1  60 dB 1240km RPOA,48 10Gbit/s

AFEC RZ
1  51 dB 1  204 km DRA, 48 10Gbit/s

50  22 dB 50  88 km -

18 30 dB 18  120 km -

Table 3-7 Transmission Codes Supported by 80/96  10Gbit/s System (G.652&G.655)

Category Specifications Target Distance (km) remark

1  45 dB 1 180km DRA, 80 10Gbit/s

1  44 dB 1  176km DRA, 9610Gbit/s

AFEC NRZ
20  22 dB 20  88 km -

8  30 dB 8  120 km -

1  48 dB 1 192km DRA, 80 10Gbit/s

AFEC RZ
1  47 dB 1  188km DRA, 96 10Gbit/s

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Category Specifications Target Distance (km) remark

30  22 dB 30  88 km -

12 30 dB 12  120 km -

Table 3-8 Transmission Codes Supported by 192  10Gbit/s System (G.652&G.655)

Category Specifications Target Distance (km) remark

1  41 dB 1 164km DRA

AFEC NRZ 10  22 dB 10  88km -

3  30 dB 3  120 km -

Table 3-9 Transmission Codes Supported by 40/48  40Gbit/s System (G.652&G.655)

Category Specifications Target Distance (km) remark

1  47 dB 1 188km DRA, 40 40Gbit/s

1  46 dB 1  184km DRA, 4840Gbit/s

AFEC+DPSK 22 22 dB 22  88 km -

5  30 dB 5  120 km -

12  30 dB 12  120 km DRA

1  48 dB 1 192km DRA, 40 40Gbit/s

1  47 dB 1 188km DRA, 48 40Gbit/s

AFEC+DQPSK 25 22dB 25 88 km

6  30dB 6  120 km

13 30 dB 13 120 km DRA

Table 3-10 Transmission Codes Supported by 80/96  40Gbit/s System (G.652&G.655)

Category Specifications Target Distance (km) remark

1  44 dB 1 176km DRA, 80 40Gbit/s

1  43 dB 1  172km DRA, 9640Gbit/s

AFEC+DPSK 16 22 dB 16  88 km -

3 30 dB 3  120 km -

6 30 dB 6  120 km DRA

AFEC+DQPSK 1  45dB 1 180km DRA, 80 40Gbit/s

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Category Specifications Target Distance (km) remark

1  44 dB 1 176km DRA, 96 40Gbit/s

18 22 dB 18  88 km
4 30 dB 4 120km

7 30 dB 7  120 km DRA

Table 3-11 Transmission Codes Supported by 80 100Gbit/s System (G.652 with

DCM)

Category Specifications Target Distance (km) remark

1x45dB 1x180km DRA, 80x100Gbit/s

SD+FEC+PM- 16x22 dB 16x88 km

QPSK 4x30 dB 4x120km

7x30 dB 7x120 km DRA

Table 3-12 Transmission Codes Supported by 80  100Gbit/s System (G.652 without

DCM)

Category Specifications Target Distance (km) remark

1x45dB 1x180km DRA, 80x100Gbit/s

SD+FEC+PM- 20x22 dB 20x88 km

QPSK 4x30 dB 4x120km

7x30 dB 7x120 km DRA

Table 3-13 Transmission Codes Supported by 80  100Gbit/s System (G.655 with

DCM)

Category Specifications Target Distance (km) remark

1x45dB 1x180km DRA, 80x100Gbit/s

SD+FEC+PM- 10x22 dB 10x88 km

QPSK 3x30 dB 3x120km

6x30 dB 6x120 km DRA

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Table 3-14 Transmission Codes Supported by 80  100Gbit/s System (G.655 without

DCM)

Category Specifications Target Distance (km) remark

1x45dB 1x180km DRA, 80x100Gbit/s

SD+FEC+PM- 12x22 dB 12x88 km

QPSK 3x30 dB 3x120km

6x30 dB 6x120 km DRA

Note: SD-FEC is soft decision FEC coding and decoding, and  means that the channel difference should be

included. Target Distance is calculated at 0.25dB/km.

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4 System Architecture
This chapter briefly introduces the overall structure of ZXMP M820, including hardware
and software, and its applications.

4.1 Description of System Functional Platform

The functional block diagram of ZXMP M820 is shown in Table 4-1

Figure 4-1 Functional Blocks of the ZXMP M820

ZXMP M820 consists of hardware system and NM software system, which are
independent of each other and work coordinately.

ZXMP M820 hardware system consists of optical transfer platform, service convergent
platform, optical wavelength multiplexing (OM) and optical wavelength de-multiplexing
(OD) platforms, add/drop platform, optical amplifying platform and monitoring platform.

4.1.1 Optical transfer platform

It employs Optical/electric/optical conversion mode to convert wavelengths between the

service signals and line signals.

The service signals support the SDH signals at STM-1/4/16/64/256 rates, OC-3/12/48/
192/768 and other service signals (i.e. POS, FC, FICON, ESCON, DVB, FDDI, FE, GE,

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10GE, 100GE, ATM and PDH) at the client side, satisfying the G.957, G691 and
IEEE802.3 recommendation.

The line signals are compliant with the G.692 recommendation.

4.1.2 Service convergence platform

It converge multiple low-speed signals into one wavelength for transmission, and
completes its reversion process.

The low-speed signals include STM-1, STM-4, STM-16, STM-64, GE, 10GE, 40GE and
100GE.

The maximum rate at the line side is 120Gbit/s.

4.1.3 OM/OD platform

It consists of two parts: the OM and OD.

The OM: It couples and multiplexes multiple optical signals with different wavelengths
from the optical transfer platform and service convergent platform into one fiber for
transmission.

The OD: It separates the line optical signals from the optical amplifying platform by
wavelengths, and sends them to different optical transfer platforms and service
convergent platforms.

The OM and OD of ZXMP M820 employ C band with 100 GHz/50GHz channel spacing
in less than 40-wavelength /80/96-wavelength transmission.

The OM and OD of ZXMP M820 employ C/L band by using interleaver technology with
50 GHz channel spacing in 40-176-wavelength super-large capacity transmission.

The OM and OD of ZXMP M820 employ C band by using interleaver technology with 25
GHz channel spacing in 192-wavelength super-large capacity transmission.

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4.1.4 Add/drop platform

It implements add/drop and multiplexing function for the wavelength of the optical line
signals. The ZXMP M820 can be configured as a fixed optical add/drop multiplexer
(FOADM) or a reconfigurable optical add/drop multiplexer (ROADM) depending on
whether the wavelengths to be added/dropped are fixed.

4.1.5 Optical amplifying platform

It compensates optical signal power in long distance transmission with optical amplifying
technology. Normally, it is located at the back and in front of the OM/OD platform, as well
as in the middle of the line transmission.

The optical amplifying part of ZXMP M820 employs C band EDFA in less than
40-wavelength/80/96 wavelength transmission.

The optical amplifying platform of ZXMP M820 amplifies the C band and L band
respectively in 40-176-wavelength transmission. The amplifier types involve C band
EDFA, L band EDFA, C+L band RAMAN/EDFA hybrid amplifiers.

4.1.6 Monitoring platform

It collects handles and reports various information such as platform configurations,

alarms and performance to the NMS.

It receives the commands sent by the NMS and transfers them to the target board.

It transmits the NMS information with the specified monitoring optical channel. The
wavelength of the monitoring channel is 1510 nm at 100Mbit/s.

The NM Software System is introduced in chapter 4.3

4.2 Hardware Architecture

4.2.1 Sub-rack

ZXMP M820 has three kinds of sub-racks, NX sub-rack and CX sub-rack and DX

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sub-rack

NX sub-rack can be installed in 21 inch or 19 inch cabinet. One 21 inch and 2.2 m high
cabinet can install 4 NX-sub-racks or CX sub-racks or DX sub-racks. One 19 inch and
2.2 m high cabinet can install 3 NX-sub-racks.

Figure 4-2 Layout of ZXMP M820 NX Sub-rack (21 inch)

SFANA SFANA SFANA SFANA

SOSC
SNP

SPWA
SPWA

Wirin
Area
g
SNP

SEIA

Fiber Cable Area

Dust Proof Net

Figure 4-3 Layout of ZXMP M820 NX Sub-rack (19 inch)

SFANA SFANA SFANA SFANA

SPWA
SPWA

1 3 5 7 9 11 13 15 17 19 21
Wiring
AreaSEIA

2 4 6 8 10 12 14 16 18 20 22 14

Fiber Cable Area

Dust Proof Net

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Figure 4-4 Slot Arrangement of DX41 Sub-rack

FCC

CCP
CCP
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31

PWE
PWE
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32
Fiber Cable Area

Figure 4-5 Slot Arrangement of CX20 Subrack

FCC
20 21 22 23
CCP
CCP
XCA
XCA

PWD
PWD

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
Fiber Cable Area

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Figure 4-6 Slot Arrangement of CX22Subrack

M3FCC

SOGMDB
SOSCB

CCP
CCP
SNP

100G slot

100G slot
100G slot
100G slot
100G slot
100G slot
100G slot
100G slot

XCA
XCA
1 3 5 7 9 11 13 25 27

PWF
PWF
SNP

EIC
TIS

2 4 6 8 10 12 14 15 16 17 18 19 20 21 22 23 24 26 28
Fiber Cable Area

4.2.2 Board Description

Table 4-1 Board Description

Board Name Description Remarks

Service Access and Convergence Boards

Transforms the 2.5Gb/s optical

signals into electrical signals, and
Compact 2.5Gb/s Optical
SOTU2.5G then transform the electrical signals
transponder unit
into the required optical signals
complying with G.692.

Performs the same the functions as

2.5Gb/s Optical transponder
OTUF the OTU, and conducts forward error
unit with the FEC function
correction (FEC) coding/decoding.

Realizes G.709 recommendation

Enhanced 10Gb/s optical compliant wavelength conversion of
EOTU10G transponder unit with 10Gb/s optical signals in one
FEC/AFEC channel, and conducts FEC/AFEC
coding/decoding on the signal.

Realizes G.709 recommendation

Type B Enhanced Optical
EOTU10GB compliant wavelength conversion of
Transponder
10Gb/s optical signals in one

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Board Name Description Remarks

Unit for 10Gbit/s channel, and conducts FEC/AFEC
coding/decoding on the signal.

Realizes G.709 recommendation

Compact 10Gb/s optical compliant wavelength conversion of
SOTU10G transponder unit with 10Gb/s optical signals in one
FEC/AFEC channel, and conducts FEC/AFEC
coding/decoding on the signal.

Realizes STM256, OTU3 access,

complaint with G.709
recommendation, supports
40Gb/s optical transponder
TST3 wavelength conversion of 40Gb/s
unit with FEC/AFEC
optical signals into one DWDM
channel, and conducts FEC/AFEC
coding/decoding on the signal.
Realizes 100GE, OTU4 access,
complaint with G.709
Single-channel 100Gb/s recommendation, supports
TS4 Optical Channel Transport wavelength conversion of 100Gb/s
Unit optical signals into one DWDM
channel, and conducts SD FEC
coding/decoding on the signal.
Realizes 4* STM64, 10GE LAN,
OTU2, complaint with G.709
MQT3 Multi 10G aggregation board recommendation, and conducts
FEC/AFEC coding/decoding on the
signal
Realizes 10* STM64, 10GE LAN,
OTU2, complaint with G.709
MX2 Ten 10G SubRate Mux Unit
recommendation, and conducts SD
FEC coding/decoding on the signal
Realizes the multiplex/de-multiplex
SRM41 Sub-rate Multiplex Board function of four STM-16 signals to
one STM-64 signal.

Realizes the multiplex/de-multiplex

SRM42 Sub-rate multiplex Board function of four STM-4/STM-1
signals to one STM-16 signal

Aggregation Switch ASMA aggregates up to 24 GEs into

ASMA
Muxponder (Type A) 10GE LAN with rich L2 feature sets,

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Board Name Description Remarks

such as IEEE 802.1ad(Q-in-Q),
IEEE 802.1P, IEEE 802.3ad

converges 8GE or 42GFC or

MOM2 Eight GE/FC Muxponder 81GFC or 42.5G or their
combination into OTU2

FCA is used to implement the

multiplexing/de-multiplexing
Fiber Channel or Gigabit between eight GE signals, or two
FCA
Ethernet Access Board 4GFC, or four 2GFC or no more than
eight 1GFC signals and OTU2
through O/E/O conversion.

GEM8 is used to implement the

Gigabit Ethernet Access multiplexing/de-multiplexing
GEM8
Board between eight GE signals and
OTU2 .

SDSA used to implement the

multiplexing/demultiplexing between
Compact Data Service
SDSA two optical GE signals or 1G FC
Aggregation Board
signals and an STM-16/OTU1 signal
through O/E/O conversion.

DSAF used to implement the

multiplexing/demultiplexing between
two optical GE signals and an
Data Service Aggregation
DSAF STM-16/OTU1 signal through O/E/O
with FEC
conversion. However, the line-side
rate is up to 2.667 Gbit/s due to the
application of FEC.

DSA board implements the

multiplexing/demultiplexing between
Data Service Aggregation eight data service signals, such as
DSA
Board GE, FC, ESCON, FICON and DVB
signals, and two STM-16 signals
through O/E/O conversion.

Multiplexes two IEEE802.3Z

Gigabit Ethernet Multiplex recommendation compliant standard
GEM2
Board GE optical signals into one
G.692-compliant optical signal.

GEMF Gigabit Ethernet Multiplex Multiplexes two IEEE802.3Z

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Board Name Description Remarks

Board with FEC function recommendation compliant standard
GE into one G.692-compliant optical
signal with FEC.

Access the service of STM-64

(9.953Gbit/s), OTU2 (10.709Gbit/s),
Transponder of 2 ports
TD2C 10 GE (10.3125Gbit/s), OTU2e
10Gb/s
(11.1Gbit/s) and 10G FC
(10.518Gbit/s)

Access four channels of any rate

Muxponder of 4 ports any
MQA2 service ranging from 1.0625Gbps to
rate to OTU2
4.25Gbps.

Access four channels of any rate

service ranging from 100Mbps to
2.67Gbps.
Typical types of services:
Muxponder of 4 ports any STM-1/4/16(OC-3/12/48),
MQA1
rate to OTU1 OTU1, FE/GE, 1G/2GFC,
DVB_ASI/ESCON/FICON/HDTV,
PDH.
Interconnection with backplane at
granularity of ODU0/1.

Upgrade smoothly from 4 to 10 any

rate service access on client side by
collaborating with MQA1;
Upgrade smoothly from 4 to 22 any
Muxponder of 6 ports any rate service access on client side by
MJA
rate to main board collaborating with MQA2.
MJA supports any rate service from
100Mbps to 2.67Gbps.
Interconnection with backplane at
granularity of ODU0/1.

800G Centralized Cross-Connect Subsystem Boards

FCC Fan Board

Two PWD card should be configured

PWD Power Supply Board
for single CX20 switching subrack

Two CCP card should be configured

CCP Subrack Management Board
for single CX20 switching subrack

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Board Name Description Remarks

Two XCA card should be configured

XCA Switching Board
for single CX20 switching subrack

To implement conversion between

CS3 Client board for Single OTU3 1-port 40Gbit/s optical signal and
1-port ODU3 electrical signal.

To implement conversion between

Client board for Double
CD3 2-port 40Gbit/s optical signal and
OTU3
2-port ODU3 electrical signal.

To implement conversion between

CO2 Client board for 8*OTU2 4-port 10Gbit/s optical signal and
4-port ODU2 electrical signal.

To implement conversion between

CQ2 Client board for 4*OTU2 8-port 10Gbit/s optical signal and
8-port ODU2 electrical signal.

To implement conversion between

Client board for 16*GE or 16-port optical signal at any rate and
CH1
8*OTU1 16-port ODU0 or 16-port ODU1
electrical signals.

It has mapping of 32-port ODU0 or

16-port ODU1, 4-port ODU2, or
1-port ODU3 signal sent by
switching card to OTU3, and
Line board for single OTU3 converts it to DWDM standard
LS3(2 slots)
(2 slots) wavelength conforming to ITU-T
G.694.1. At the same time the
reverse process of the above can be
implemented. it supports hybrid
transmission of ODU0/1/2.

It has mapping of 32-port ODU0 or

16-port ODU1, 4-port ODU2, or
1-port ODU3 signal sent by
switching card to OTU3, and
Line board for single OTU3 converts it to DWDM standard
LS3(1 slot)
(1slot) wavelength conforming to ITU-T
G.694.1. At the same time the
reverse process of the above can be
implemented. it supports hybrid
transmission of ODU0/1/2.

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Board Name Description Remarks

It has mapping of 64-port ODU0 or

32-port ODU1, 8-port ODU2 signal
sent by switching card to OTU2, and
converts it to DWDM standard
LO2 Line board for 8*OTU2 wavelength conforming to ITU-T
G.694.1. At the same time the
reverse process of the above can be
implemented. it supports hybrid
transmission of ODU0/1.

It has mapping of 64-port ODU0 or

32-port ODU1, 8-port ODU2 signal
sent by switching card to OTU2, and
converts it to DWDM standard
Line board for 8*OTU2 with
LO2B wavelength conforming to ITU-T
PIC technique
G.694.1. At the same time the
reverse process of the above can be
implemented. it supports hybrid
transmission of ODU0/1.

It has mapping of 32-port ODU0 or

16-port ODU1, 4-port ODU2 signal
sent by switching card to OTU2, and
converts it to DWDM standard
LQ2 Line board for 4*OTU2 wavelength conforming to ITU-T
G.694.1. At the same time the
reverse process of the above can be
implemented. it supports hybrid
transmission of ODU0/1.

It has mapping of 16-port ODU0 or

8-port ODU1, 2-port ODU2 signal
sent by switching card to OTU2, and
converts it to DWDM standard
LD2B Line board for 2*OTU2 wavelength conforming to ITU-T
G.694.1. At the same time the
reverse process of the above can be
implemented. it supports hybrid
transmission of ODU0/1.

Optical Amplification Subsystem Boards

It is equipped with the erbium-doped

EOBA Enhanced Optical booster
fiber amplifier (EDFA) to boost

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Board Name Description Remarks

amplifier optical power of signals. It is usually
used at the transmitting end.

It is equipped with the erbium-doped

Enhanced Optical line fiber amplifier (EDFA) to amplify
EOLA
amplifier optical signals. It is usually used at
the optical relay segment.

It is equipped with the erbium-doped

Enhanced Optical fiber amplifier (EDFA) to pre-amplify
EOPA
pre-amplifier optical signals. It is usually used at
the receiving end.

It is equipped with the erbium-doped

Compact Enhanced Optical fiber amplifier (EDFA) to boost
SEOBA
booster amplifier optical power of signals. It is usually
used at the transmitting end.

It is equipped with the erbium-doped

Compact Enhanced Optical fiber amplifier (EDFA) to amplify
SEOLA
line amplifier optical signals. It is usually used at
the optical relay segment.

It is equipped with the erbium-doped

Compact Enhanced Optical fiber amplifier (EDFA) to pre-amplify
SEOPA
pre-amplifier optical signals. It is usually used at
the receiving end.

It is equipped with erbium-doped

fiber amplifier (EDFA) to amplify
optical signals. The gain range can
be adjusted greatly to meet the
requirements of different
EONA Enhanced node amplifier
regeneration distances. DCM
module can be inserted in the middle
for the dispersion compensation. It is
usually Configured in the middle of
an Optical Multiplex Section.

It is equipped with erbium-doped

fiber amplifier (EDFA) to amplify
High power enhanced node optical signals and offer high output
EONAH
amplifier power. The gain range can be
adjusted greatly to meet the
requirements of different

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Board Name Description Remarks

regeneration distances. DCM
module can be inserted in the middle
for the dispersion compensation. It is
usually Configured in the middle of
an Optical Multiplex Section.

It is equipped with the erbium-doped

High power optical booster fiber amplifier (EDFA)\ to offer high
EOBAH
amplifier output power. It is used at the
transmitting end.

Feeds the Raman pump light to the

transmission fiber backward so as to
achieve distributed amplification of
DRA Distributed Raman amplifier
the optical signal. The range of the
amplified wavelength covers C Band
and L Band.

RPOA is new type optical

amplification technology: the pump
laser is put on OTM station, while
gain unit is put on the indicated
Remote Pump Optical
RPOA location of line optical fiber. When
Amplifier
the pump light is transmitted through
gain unit, it will be interacted with
gain unit, thus realizes the
amplification function to the signals.

Provides the function of combining

Supervision add/drop
SSDM the main path optical signal and
multiplexer
monitoring signal.

Includes NM-controlled attenuator, it

Line Attenuation is configured at the end of line to
LAC
Compensator make remote adjustment according
to line fiber attenuation change.

Mux/DeMux Subsystem Boards

Optical add/drop multiplex

SOAD1 Implements add/drop for
Board of 1 Wavelength
1–channel/2
Optical add/drop multiplex
SOAD2 –channel/4–channel, and
Board of 2 Wavelength
pass-through wavelength.
SOAD4 Optical add/drop multiplex

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Board Name Description Remarks

board of 4 Wavelength

Multiplexes/de-multiplexes four
Compact Optical Group
SOGMD group of wavelengths through
Mux/DeMux Board
red-blue ribbon filters.

Multiplex optical signals with

different wavelengths to one fiber,
OMU Optical multiplex unit and provides 8-wave, 16-wave,
32-wave, 40-wave, 48-wave and
80-wave multiplexers.

Separates optical signals of different

channels in one fiber from each
other, and provides 8-wave,
ODU Optical de-multiplex unit
16-wave, 32-wave, 40-wave,
48-wave and 80-wave
de-multiplexers.

Multiplex unit with channel power

pre-balance. With AWG+VOA
technique, it adjusts attenuations of
channels, and then multiplexes them
into one channel for output via
VMUX Variable attenuation MUX
voltage or current control.
Configured at OTM site, it can
independently adjust optical power
of each channel for channel power
pre-balance.

Variable Insertion Loss Multiplexes signals of 40 optical

VMUXB Multiplexer (B channels in C band, and implements
Type) the channel power pre-equalization.

De-multiplexes signals of 40 optical

Optical De-Multiplexing Unit channels, and provides online
ODUB
(B Type) monitoring interface of multiplexed
optical signal.

Completes the
Optical channel multiplex multiplex/de-multiplex of the C band
OCI /de-multiplex inter-leaver or L band channel interleave at the
board same time, applying in 80-wave
system.

OBM Broadband multiplex board Multiplexes/de-multiplexes the C/L

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Board Name Description Remarks

band signals and the 1510nm
(1625nm) monitoring channel,
applying in 160/176-wave system.

WSU (Wavelength Selective Unit)

board is configured in an ROADM
(Reconfigurable Optical Add/Drop
Multiplexer) subsystem to implement
WSU Wavelength Selective Unit
the reconfiguration of add/drop
wavelengths. It makes the
maintenance convenient when the
add/drop wavelengths change.

WBU (Wavelength Blocking Unit)

board is configured in an ROADM
(Reconfigurable Optical Add/Drop
Multiplexer) subsystem to implement
WBU Wavelength Blocking Unit
the reconfiguration of add/drop
wavelengths. It makes the
maintenance convenient when the
add/drop wavelengths change.

WBU (Wavelength Blocking Unit)

board is configured in an ROADM
(Reconfigurable Optical Add/Drop
Wavelength Blocking Multiplexer) subsystem to implement
WBM
Multiplexing the reconfiguration of add/drop
wavelengths. It makes the
maintenance convenient when the
add/drop wavelengths change.

Assigns power of optical input signal

PDU Power Distribution Unit
to optical output ports.

Protection Subsystem Boards

Provides 1+1 protection for the

optical multiplex section or optical
SOP Optical protection board
channel mainly in the “concurrent
sending/optimum receiving” mode.

Realizes the channel fault detection

Optical protect for channel and the optical channel changeover
SOPCS
section function when there is any fault in
the lines.

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Board Name Description Remarks

Mainly serves to implement the

Optical protect for Mux
SOPMS changeover function of the optical
section
multiplex section shared protection.

Performs service add/drop and

protection switching by means of
Optical Protect for Mux optical signal cross-connect. The
OMCP
Section optical switching module in OMCP
board implements the function of
OMCP board.

Optical Layer Management Subsystem Boards

Provides optical performance

monitoring function for each optical
channel with measuring parameters
Optical performance
OPM including optical power, central
monitoring board
wavelength and optical S/N ratio and
reports the corresponding data to
the NMS.

Monitors optical channel

wavelength, optical power and
OSNR of 4-channel or 8-channel
Enhanced Optical Channel WDM optical signals. Measures
EOPM
Performance Monitor parameters of each optical channel,
including optical power, central
wavelength and OSNR. Reports
measured data to NMS.

OWM could automatic detect the

abnormal wavelength shift of the
OTU, and send adjustment
OWM Optical Wavelength Monitor
command to the aim OTU until the
wavelength shift is in the normal
range.

Monitors the central frequency

wander of optical channels after the
Enhanced Optical
EOWM multiplexing and reports the
Wavelength Monitor Board
frequency adjustment information to
the SNP board.

Dispersion Compensation Used for dispersion compensation of

DCU
Board 40G NRZ-DPSK, RZ-DQPSK or

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Board Name Description Remarks

other advanced modulation and
coding patterns. Working with the
OP board to implement 1+1
protection switching to 40G line-side
optical channel. Presetting
dispersion compensation and
automatically searching the optimum
dispersion compensation for
protected channel by analyzing error
code information on receiver.
Dispersion compensation-related
optical performance indicators meet
system demands.

Supervision Subsystem

Collects and processes alarm and

SNP Node Processor performance information of the local
NE.

Implements routing and transfer of

Communication Control management and control message
SCC
Board among boards of sub-racks within an
NE.

The subrack control card is located

CCP The subrack control card in switching subrack to forward the
information between SNP cards.

Receives 1510nm optical

supervision signals from the
adjacent NE and sends them to the
SNP after the optical-to-electrical
Optical supervision channel
SOSC conversion, then receives electrical
board
signals from the SNP and sends
them to the adjacent NE after the
generation of the 1510nm optical
signals with supervision information.

Transfers and exchanges ECC data,

orderwire and transparent user
Optical supervision channel
SOSCB channel data, and APS information
board for Fast Ethernet
between NEs of the 100M
monitoring system.

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Board Name Description Remarks

Support time synchronization
following 1588V2 protocol.

Provide time synchronization

TIS Time interface supply card following 1588V2 protocol and
input/output of 2M Hz/bit clock

Leads external interfaces and

Compact Extension Interface cascade interface of the sub-rack to
SEIA
Board(type A) the front panel, so as to facilitate the
connection.

Compact Extension Interface Leads external interfaces and

SEIB
Board(type B) makes communication with SNP

Power Supply Subsystem

SPWA board supports 1+1 hot

backup, provides stable power
Compact Power Box Board supply for all the boards in the
SPWA
(A-type) sub-rack, and satisfies the
requirements for EMC. It also
supports 1+1 backup for sub-racks.

SPWE board supports 1+1 hot

backup, provides stable power
Compact Power Box Board supply for all the boards in the
SPWE
(E-type) sub-rack, and satisfies the
requirements for EMC. It also
supports 1+1 backup for sub-racks.

Provides heat dissipation for the

SFANA Compact Fan Board
system.

4.3 The NM Software System Structure

ZXMP M820 implements software management via NetNumenTM U31 (BN) Element
/Network Management Platform for Unix/Windows. It can perform various management
functions for faults, performance, security, configuration, and maintenance of the system.

Designs for NetNumenTM U31 (BN) are based on a four-layered structure including the
equipment layer, the NE layer, the NE management layer and the subnet management
layer. It can also provide the Corba interface for the network management layer.

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The hierarchical structure of NetNumenTM U31 (BN) is shown in Figure 4-7

Figure 4-7 Hierarchical Structure of the Element Management Software

NMS NMS

NML Corba Corba

GUI(Cient)

Subnet
Subnet Manager 3
management layer
F F

GUI(Cient) GUI(Cient) GUI(Cient)

F
F F F
NE/Subnet LMT NE/Subnet NE/Subnet
Manager 1 ...
Manager 2 Manager n
NEL
Qx Qx Qx
f
GNE/Agent
GNE/Agent
ECC
ECC ECC
ECC

NE/Agent NE/Agent
NE/Agent NE/Agent

ECC ECC
ECC ECC
NE/Agent ECC
NE/Agent NE/Agent GNE/Agent
NEL
S S S S S S
Equipment
layer
MCU
…
MCU MCU
...
MCU MCU …..
… MCU

4.3.1 Hierarchical structure

The equipment layer (MCU-Manager Control Unit)

The functions of the equipment layer are:

 Monitoring alarm and performance status of boards

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 Receiving EMS commands

 Controlling boards to implement certain operations

The NE layer, which is the Agent in the EMS

The functions of the NE layer are:

 Managing each NE

 Configuring each board when NE is powered on for initialization

 Monitoring alarm and performance status of whole NEs under normal running
conditions

 Receiving and processing the monitoring commands of NE manager layer through

gateway NE (GNE)

The NE management layer (Manager): controls and coordinates a series of NEs,

including Manager, graphical user interface (GUI) and Local Maintenance Terminal
(LMT).

The functions of the NE management layer are:

 The core of the NE manager layer is the Manager (or Server), which can manage
multiple subnets, control and coordinate NE equipment.

 GUI provides graphic user interfaces and converts the requirements of user
management into the commands of the internal formats and sends them down to
the Manager.

 LMT simply combines GUI and Manager via controlling user rights and software
functional parts, provides some of NE management functions for local NEs
commissioning and maintenance.

The subnet management layer: its structure is similar to that of NE management layer,
and the NEs configuration and maintenance commands are indirectly performed through
NE management layer.

The subnet management system sends a command to the NE management system, via

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which forwards it to the NE. After then, the NE responds to the subnet management
system through the NE management system. In addition, it can provide the network
management layer with the Corba interface.

4.3.2 Interface description

 Qx interface:
As shown in Figure 4-7, t is the interface between the Agent and the Manager, i.e.,
the interface between the SNP board and the computer where the Manager
program resides. It complies with the TCP/IP.

 F interface:
As shown in Figure 4-7, t is the interface between the GUI and the Manager, i.e., the
interface between the GUI and the computer where the Manager program resides. It
complies with the TCP/IP.

 f interface:
As shown in Figure 4-7, t is the interface between the Agent and LMT, i.e. the
interface between the SNP board and the local maintenance terminal. On the local
maintenance terminal, related NM software is installed. This interface complies with
the TCP/IP.

 S interface:
As shown in Figure 4-7, t is the interface between Agent and MCU, i.e., the
communication interface between the SNP board and other boards. S interface
adopts the point-to-multi-point communication mode based on the HDLC
communication mechanism.

 ECC interface:
As shown in Figure 4-7, t is the interface between Agents, i.e. the communication
interface between NEs. It uses DCC for communication, supports customized
communication protocol and standard protocol at the same time, and implements
bridge function on Agent.

Please refer to the element management manuals for more details.

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4.4 System Configuration

ZXMP M820 can be configured as the optical terminal multiplexer (OTM), the optical
add/drop multiplexer (OADM) and optical line amplifier (OLA).

4.4.1 Optical Terminal Multiplexer (OTM)

The OTM can add/drop all the services to implement the line terminal node function. As
an OTM, the relationship between platforms is illustrated in Figure 4-8

Figure 4-8 Functional Blocks of the OTM

4.4.2 Optical Add/Drop Multiplexer (OADM)

The ZXMP M820 supports both the Fixed Optical Add/Drop Multiplexer (FOADM)
function and the Reconfigurable Optical Add/Drop Multiplexer (ROADM) function.

FOADM: This function is used to add/drop fixed wavelengths.

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ROADM: Wavelengths to be added/ dropped can be reconfigured. In addition, the port

assignment function is available when ROADM is enabled.

The following port assignment function is controlled via the EMS.

In a ROADM node, optical signals with special wavelengths can be assigned to any drop
ports and then dropped through these ports. The wavelengths of these signals meet the
specification of the drop ports assigned for them.

On the other hand, the wavelengths of optical signals input from different add ports can
be converted into the wavelengths of those optical signals having been dropped in the
same node. After that, these optical signals are added at the node.

FOADM equipment

The FOADM can add/drop the specified fixed wavelengths services and pass straight
through other services. As an FOADM, the relationship between platforms is illustrated in
Figure 4-9

Figure 4-9 Functional Blocks of the FOADM

ROADM equipment

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ZXMP M820 Product Description

Take bidirectional ROADM equipment that adds/drops eight wavelengths as example.

Figure 4-10, Figure 4-11, and Figure 4-12 illustrates the optical connection in the
equipment configured with WBU board ,WBM board and WSU board respectively.

Figure 4-10 Optical Connection of ROADM Equipment with WBU Boards

OTU8
OTU1
OTU2
OTU3

OTU3
OTU2
OTU1
OTU8
:
:
:
:

U
M
O
U
D
O

OPA OBA
D1 A1
IN EX OUT EX IN OUT
WB
WBU WBU
OUT EX IN EX OUT IN
WB
OBA A1 D1 OPA
M
O

O
U

D
U
OTU3
OTU2
OTU1

OTU3
OTU2
OTU1
OTU8

OTU8
:
:

:
:

Figure 4-11 Optical Connection of ROADM Equipment with WBM Boards

OTU40
OTU1
OTU2
OTU3
:
:

OTU40

OTU3
OTU2
OTU1
:
:
U
D
O

OPA OBA
D1 A1
IN EX OUT EX IN OUT
PLC
WBM WBM
OUT EX IN EX OUT IN
PLC
OBA A1 D1 OPA
O
D
U
OTU40

OTU3
OTU2
OTU1
:
:

OTU40

OTU3
OTU2
OTU1
:
:

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Figure 4-12 Optical Connection of ROADM Equipment with WSU Boards

TL1(B)
TL2(B)
TL3(B)

TL8(B)
:
OTU2(A)

OTU3(A)

OTU4(A)

OTU5(A)

OTU6(A)

OTU7(A)

OTU8(A)
OTU1(A)

8
:
MON

DROP1

DROP2

DROP3

DROP4

DROP5

DROP6

DROP7

DROP8

ADD
OPA(A) A1 OBA(A)

WSS
OUT
EX IN
IN EX OUT

A B

OSCL WSU/MA1 WSU/MA1 OSCL

EX OUT
IN
OUT EX IN

WSS

OBA(A) OPA(B)
ADD

A1

DROP8
DROP1

DROP2

DROP3

DROP4

DROP5

DROP6

MON DROP7
8

1
:

OTU1(B)

OTU2(B)

OTU3(B)

OTU4(B)

OTU5(B)

OTU6(B)

OTU7(B)

OTU8(B)
TL1(A)
TL2(A)
TL3(A)

TL8(A)
:

4.4.3 Optical Line Amplifier (OLA)

The OLA is used to compensate the optical signal power for long distance transmission.
As an OLA, the relationship between platforms is illustrated in Figure 4-13.

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Figure 4-13 Functional Blocks of the OLA

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5 Technical Specifications
This chapter introduces technical indices of ZXMP M820, including structure, power
supply, performances of boards and the system component indices of OMU/ODU,
OADM, OA and OTU etc.

5.1 Working Wavelength Requirements

The working wavelength of the system strictly complies with the specific central
wavelength and central frequency values used in the multi-channel system, as specified
in the ITU-T Recommendation G.692 and G.694.1.

5.1.1 Wavelength Allocation in 8/16/32/40-Channel Systems

Table 5-1 lists the wavelength allocation in a system consisting of ZXMP M820 with no
more than 40 wavelengths in C band. The spacing between wavelengths is 100GHz (The
spacing for 8-channel system is 200GHz).

Table 5-1 Wavelength Allocation (8/16/32/40-channel, C band)

Sub- Central Sub- Central

Central Central
S/N band Frequenc S/N band Frequenc
Wavelength Wavelength
. Nam y . Nam y
(nm) (nm)
e (THz) e (THz)

1 C 192.1 1560.61 21 C 194.1 1544.53

2 C 192.2 1559.79 22 C 194.2 1543.73

3 C 192.3 1558.98 23 C 194.3 1542.94

4 C 192.4 1558.17 24 C 194.4 1542.14

5 C 192.5 1557.36 25 C 194.5 1541.35

6 C 192.6 1556.55 26 C 194.6 1540.56

7 C 192.7 1555.75 27 C 194.7 1539.77

8 C 192.8 1554.94 28 C 194.8 1538.98

9 C 192.9 1554.13 29 C 194.9 1538.19

10 C 193.0 1553.33 30 C 195.0 1537.40

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Sub- Central Sub- Central

Central Central
S/N band Frequenc S/N band Frequenc
Wavelength Wavelength
. Nam y . Nam y
(nm) (nm)
e (THz) e (THz)

11 C 193.1 1552.52 31 C 195.1 1536.61

12 C 193.2 1551.72 32 C 195.2 1535.82

13 C 193.3 1550.92 33 C 195.3 1535.04

14 C 193.4 1550.12 34 C 195.4 1534.25

15 C 193.5 1549.32 35 C 195.5 1533.47

16 C 193.6 1548.51 36 C 195.6 1532.68

17 C 193.7 1547.72 37 C 195.7 1531.90

18 C 193.8 1546.92 38 C 195.8 1531.12

19 C 193.9 1546.12 39 C 195.9 1530.33

20 C 194.0 1545.32 40 C 196.0 1529.55

Note: Sub-band C refers to the first sub-band in C band with the wavelength spacing at 100 GHz.

5.1.2 Wavelength Allocation in 48/96 Wavelength System

Table 5-2 lists the wavelength allocation in a system consisting of ZXMP M820 with
48/96 wavelengths in C band. The spacing between wavelengths is 100GHz/50GHz.

Table 5-2 Wavelength Allocation (48/96-channel, C band)

Central Central
Sub-b Central Sub-b Central
S/N Frequenc S/N Frequenc
and Wavelength and Wavelength
. y . y
Name (nm) Name (nm)
(THz) (THz)

1 C1002 196.05 1529.16 49 C1002 193.65 1548.11

2 C1001 196.00 1529.55 50 C1001 193.60 1548.51

3 C1002 195.95 1529.94 51 C1002 193.55 1548.91

4 C1001 195.90 1530.33 52 C1001 193.50 1549.32

5 C1002 195.85 1530.72 53 C1002 193.45 1549.72

6 C1001 195.80 1531.12 54 C1001 193.40 1550.12

7 C1002 195.75 1531.51 55 C1002 193.35 1550.52

8 C1001 195.70 1531.90 56 C1001 193.30 1550.92

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Central Central
Sub-b Central Sub-b Central
S/N Frequenc S/N Frequenc
and Wavelength and Wavelength
. y . y
Name (nm) Name (nm)
(THz) (THz)

9 C1002 195.65 1532.29 57 C1002 193.25 1551.32

10 C1001 195.60 1532.68 58 C1001 193.20 1551.72

11 C1002 195.55 1533.07 59 C1002 193.15 1552.12

12 C1001 195.50 1533.47 60 C1001 193.10 1552.52

13 C1002 195.45 1533.86 61 C1002 193.05 1552.93

14 C1001 195.40 1534.25 62 C1001 193.00 1553.33

15 C1002 195.35 1534.64 63 C1002 192.95 1553.73

16 C1001 195.30 1535.04 64 C1001 192.90 1554.13

17 C1002 195.25 1535.43 65 C1002 192.85 1554.54

18 C1001 195.20 1535.82 66 C1001 192.80 1554.94

19 C1002 195.15 1536.22 67 C1002 192.75 1555.34

20 C1001 195.10 1536.61 68 C1001 192.70 1555.75

21 C1002 195.05 1537.00 69 C1002 192.65 1556.15

22 C1001 195.00 1537.40 70 C1001 192.60 1556.55

23 C1002 194.95 1537.79 71 C1002 192.55 1556.96

24 C1001 194.90 1538.19 72 C1001 192.50 1557.36

25 C1002 194.85 1538.58 73 C1002 192.45 1557.77

26 C1001 194.80 1538.98 74 C1001 192.40 1558.17

27 C1002 194.75 1539.37 75 C1002 192.35 1558.58

28 C1001 194.70 1539.77 76 C1001 192.30 1558.98

29 C1002 194.65 1540.16 77 C1002 192.25 1559.39

30 C1001 194.60 1540.56 78 C1001 192.20 1559.79

31 C1002 194.55 1540.95 79 C1002 192.15 1560.20

32 C1001 194.50 1541.35 80 C1001 192.10 1560.61

33 C1002 194.45 1541.75 81 C1002 192.05 1561.02

34 C1001 194.40 1542.14 82 C1001 192.00 1561.42

35 C1002 194.35 1542.54 83 C1002 191.95 1561.83

36 C1001 194.30 1542.94 84 C1001 191.90 1562.24

37 C1002 194.25 1543.33 85 C1002 191.85 1562.64

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Central Central
Sub-b Central Sub-b Central
S/N Frequenc S/N Frequenc
and Wavelength and Wavelength
. y . y
Name (nm) Name (nm)
(THz) (THz)

38 C1001 194.20 1543.73 86 C1001 191.80 1563.05

39 C1002 194.15 1544.13 87 C1002 191.75 1563.46

40 C1001 194.10 1544.53 88 C1001 191.70 1563.87

41 C1002 194.05 1544.92 89 C1002 191.65 1564.27

42 C1001 194.00 1545.32 90 C1001 191.60 1564.68

43 C1002 193.95 1545.72 91 C1002 191.55 1565.09

44 C1001 193.90 1546.12 92 C1001 191.50 1565.5

45 C1002 193.85 1546.52 93 C1002 191.45 1565.91

46 C1001 193.80 1546.92 94 C1001 191.40 1566.32

47 C1002 193.75 1547.32 95 C1002 191.35 1566.73

48 C1001 193.70 1547.72 96 C1001 191.30 1567.14

Note: Sub-band C1001 and C1002 respectively refer to the first and the second sub-bands in C band with the

wavelength spacing at 100 GHz. Each sub-band includes 48 wavelengths.

5.1.3 Wavelength Allocation in 80/160 Wavelength System

Table 5-3 lists the wavelength allocation in a system consisting of ZXMP M820 with 80
wavelengths in C band. The spacing between wavelengths is 50 GHz.

Table 5-3 Wavelength Allocation (80-channel, C band)

Sub
-ban Central Central Sub-b Central Central
S/N S/N
d Frequency Wavelength and Frequency Wavelength
. .
Nam (THz) (nm) Name (THz) (nm)
e

1 C+ 196.05 1529.16 41 C+ 194.05 1544.92

2 C 196.00 1529.55 42 C 194.00 1545.32

3 C+ 195.95 1529.94 43 C+ 193.95 1545.72

4 C 195.90 1530.33 44 C 193.90 1546.12

5 C+ 195.85 1530.72 45 C+ 193.85 1546.52

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Sub
-ban Central Central Sub-b Central Central
S/N S/N
d Frequency Wavelength and Frequency Wavelength
. .
Nam (THz) (nm) Name (THz) (nm)
e

6 C 195.80 1531.12 46 C 193.80 1546.92

7 C+ 195.75 1531.51 47 C+ 193.75 1547.32

8 C 195.70 1531.90 48 C 193.70 1547.72

9 C+ 195.65 1532.29 49 C+ 193.65 1548.11

10 C 195.60 1532.68 50 C 193.60 1548.51

11 C+ 195.55 1533.07 51 C+ 193.55 1548.91

12 C 195.50 1533.47 52 C 193.50 1549.32

13 C+ 195.45 1533.86 53 C+ 193.45 1549.72

14 C 195.40 1534.25 54 C 193.40 1550.12

15 C+ 195.35 1534.64 55 C+ 193.35 1550.52

16 C 195.30 1535.04 56 C 193.30 1550.92

17 C+ 195.25 1535.43 57 C+ 193.25 1551.32

18 C 195.20 1535.82 58 C 193.20 1551.72

19 C+ 195.15 1536.22 59 C+ 193.15 1552.12

20 C 195.10 1536.61 60 C 193.10 1552.52

21 C+ 195.05 1537.00 61 C+ 193.05 1552.93

22 C 195.00 1537.40 62 C 193.00 1553.33

23 C+ 194.95 1537.79 63 C+ 192.95 1553.73

24 C 194.90 1538.19 64 C 192.90 1554.13

25 C+ 194.85 1538.58 65 C+ 192.85 1554.54

26 C 194.80 1538.98 66 C 192.80 1554.94

27 C+ 194.75 1539.37 67 C+ 192.75 1555.34

28 C 194.70 1539.77 68 C 192.70 1555.75

29 C+ 194.65 1540.16 69 C+ 192.65 1556.15

30 C 194.60 1540.56 70 C 192.60 1556.55

31 C+ 194.55 1540.95 71 C+ 192.55 1556.96

32 C 194.50 1541.35 72 C 192.50 1557.36

33 C+ 194.45 1541.75 73 C+ 192.45 1557.77

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Sub
-ban Central Central Sub-b Central Central
S/N S/N
d Frequency Wavelength and Frequency Wavelength
. .
Nam (THz) (nm) Name (THz) (nm)
e

34 C 194.40 1542.14 74 C 192.40 1558.17

35 C+ 194.35 1542.54 75 C+ 192.35 1558.58

36 C 194.30 1542.94 76 C 192.30 1558.98

37 C+ 194.25 1543.33 77 C+ 192.25 1559.39

38 C 194.20 1543.73 78 C 192.20 1559.79

39 C+ 194.15 1544.13 79 C+ 192.15 1560.20

40 C 194.10 1544.53 80 C 192.10 1560.61

Note: Sub-band C and C+ respectively refer to the first and the second sub-bands in C band with the wavelength

spacing at 100 GHz. Each sub-band includes 40 wavelengths.

Table 5-4 lists the wavelength allocation in a system consisting of ZXMP M820 with 80
wavelengths in L band. The spacing between wavelengths is 50GHz.

Table 5-4 Wavelength Allocation (80-channel, L band)

Sub
-ban Central Central Sub-b Central Central
S/N S/
d Frequency Wavelength and Frequency Wavelength
. N.
Nam (THz) (nm) Name (THz) (nm)
e
1 L 190.90 1570.42 41 L 188.90 1587.04

2 L+ 190.85 1570.83 42 L+ 188.85 1587.46

3 L 190.80 1571.24 43 L 188.80 1587.88

4 L+ 190.75 1571.65 44 L+ 188.75 1588.30

5 L 190.70 1572.06 45 L 188.70 1588.73

6 L+ 190.65 1572.48 46 L+ 188.65 1589.15

7 L 190.60 1572.89 47 L 188.60 1589.57

8 L+ 190.55 1573.30 48 L+ 188.55 1589.99

9 L 190.50 1573.71 49 L 188.50 1590.41

10 L+ 190.45 1574.13 50 L+ 188.45 1590.83

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Sub
-ban Central Central Sub-b Central Central
S/N S/
d Frequency Wavelength and Frequency Wavelength
. N.
Nam (THz) (nm) Name (THz) (nm)
e

11 L 190.40 1574.54 51 L 188.40 1591.26

12 L+ 190.35 1574.95 52 L+ 188.35 1591.68

13 L 190.30 1575.37 53 L 188.30 1592.10

14 L+ 190.25 1575.78 54 L+ 188.25 1592.52

15 L 190.20 1576.20 55 L 188.20 1592.95

16 L+ 190.15 1576.61 56 L+ 188.15 1593.37

17 L 190.10 1577.03 57 L 188.10 1593.79

18 L+ 190.05 1577.44 58 L+ 188.05 1594.22

19 L 190.00 1577.86 59 L 188.00 1594.64

20 L+ 189.95 1578.27 60 L+ 187.95 1595.06

21 L 189.90 1578.69 61 L 187.90 1595.49

22 L+ 189.85 1579.10 62 L+ 187.85 1595.91

23 L 189.80 1579.52 63 L 187.80 1596.34

24 L+ 189.75 1579.93 64 L+ 187.75 1596.76

25 L 189.70 1580.35 65 L 187.70 1597.19

26 L+ 189.65 1580.77 66 L+ 187.65 1597.62

27 L 189.60 1581.18 67 L 187.60 1598.04

28 L+ 189.55 1581.60 68 L+ 187.55 1598.47

29 L 189.50 1582.02 69 L 187.50 1598.89

30 L+ 189.45 1582.44 70 L+ 187.45 1599.32

31 L 189.40 1582.85 71 L 187.40 1599.75

32 L+ 189.35 1583.27 72 L+ 187.35 1600.17

33 L 189.30 1583.69 73 L 187.30 1600.60

34 L+ 189.25 1584.11 74 L+ 187.25 1601.03

35 L 189.20 1584.53 75 L 187.20 1601.46

36 L+ 189.15 1584.95 76 L+ 187.15 1601.88

37 L 189.10 1585.36 77 L 187.10 1602.31

38 L+ 189.05 1585.78 78 L+ 187.05 1602.74

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Sub
-ban Central Central Sub-b Central Central
S/N S/
d Frequency Wavelength and Frequency Wavelength
. N.
Nam (THz) (nm) Name (THz) (nm)
e

39 L 189.00 1586.20 79 L 187.00 1602.17

40 L+ 188.95 1586.62 80 L+ 186.95 1603.57

Note: Sub-band L and L+ respectively refer to the first and the second sub-bands in L band with the wavelength

spacing at 100 GHz. Each sub-band includes 40 wavelengths.

Table 5-3 and Table 5-4 list the wavelength allocation in a system consisting of ZXMP
M820 with 160 wavelengths in C+L band. The spacing between wavelengths is 50GHz.

5.1.4 Wavelength Allocation in 176-Channel Systems

When the system is extended to 176-channel system (C+L band) with the spacing at
50GHz, wavelength allocations in 96-channel band (C band) and 80-channel system (L
band) are adopted.

5.1.5 Wavelength Allocation in 192-Channel Systems

Table 5-5 lists the wavelength allocation in a system consisting of ZXMP M820 with 192
wavelengths in C band. The spacing between wavelengths is 25GHz.

Table 5-5 Wavelength Allocation (192-channel, C band)

Central Sub- Central

Sub-b Central Central
Frequenc band Frequenc
S/N. and Wavelength S/N. Wavelength
y Nam y
Name (nm) (nm)
(THz) e (THz)

1 C1004 196.075 1528.97 97 C1004 193.675 1547.92

2 C1002 196.05 1529.16 98 C1002 193.65 1548.11

3 C1003 196.025 1529.36 99 C1003 193.625 1548.31

4 C1001 196 1529.55 100 C1001 193.6 1548.51

5 C1004 195.975 1529.75 101 C1004 193.575 1548.71

6 C1002 195.95 1529.94 102 C1002 193.55 1548.91

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Central Sub- Central

Sub-b Central Central
Frequenc band Frequenc
S/N. and Wavelength S/N. Wavelength
y Nam y
Name (nm) (nm)
(THz) e (THz)

7 C1003 195.925 1530.14 103 C1003 193.525 1549.11

8 C1001 195.9 1530.33 104 C1001 193.5 1549.32

9 C1004 195.875 1530.53 105 C1004 193.475 1549.52

10 C1002 195.85 1530.72 106 C1002 193.45 1549.72

11 C1003 195.825 1530.92 107 C1003 193.425 1549.92

12 C1001 195.8 1531.12 108 C1001 193.4 1550.12

13 C1004 195.775 1531.31 109 C1004 193.375 1550.32

14 C1002 195.75 1531.51 110 C1002 193.35 1550.52

15 C1003 195.725 1531.7 111 C1003 193.325 1550.72

16 C1001 195.7 1531.9 112 C1001 193.3 1550.92

17 C1004 195.675 1532.09 113 C1004 193.275 1551.12

18 C1002 195.65 1532.29 114 C1002 193.25 1551.32

19 C1003 195.625 1532.49 115 C1003 193.225 1551.52

20 C1001 195.6 1532.68 116 C1001 193.2 1551.72

21 C1004 195.575 1532.88 117 C1004 193.175 1551.92

22 C1002 195.55 1533.07 118 C1002 193.15 1552.12

23 C1003 195.525 1533.27 119 C1003 193.125 1552.32

24 C1001 195.5 1533.47 120 C1001 193.1 1552.52

25 C1004 195.475 1533.66 121 C1004 193.075 1552.73

26 C1002 195.45 1533.86 122 C1002 193.05 1552.93

27 C1003 195.425 1534.05 123 C1003 193.025 1553.13

28 C1001 195.4 1534.25 124 C1001 193 1553.33

29 C1004 195.375 1534.45 125 C1004 192.975 1553.53

30 C1002 195.35 1534.64 126 C1002 192.95 1553.73

31 C1003 195.325 1534.84 127 C1003 192.925 1553.93

32 C1001 195.3 1535.04 128 C1001 192.9 1554.13

33 C1004 195.275 1535.23 129 C1004 192.875 1554.34

34 C1002 195.25 1535.43 130 C1002 192.85 1554.54

35 C1003 195.225 1535.63 131 C1003 192.825 1554.74

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Central Sub- Central

Sub-b Central Central
Frequenc band Frequenc
S/N. and Wavelength S/N. Wavelength
y Nam y
Name (nm) (nm)
(THz) e (THz)

36 C1001 195.2 1535.82 132 C1001 192.8 1554.94

37 C1004 195.175 1536.02 133 C1004 192.775 1555.14

38 C1002 195.15 1536.22 134 C1002 192.75 1555.34

39 C1003 195.125 1536.41 135 C1003 192.725 1555.55

40 C1001 195.1 1536.61 136 C1001 192.7 1555.75

41 C1004 195.075 1536.81 137 C1004 192.675 1555.95

42 C1002 195.05 1537 138 C1002 192.65 1556.15

43 C1003 195.025 1537.2 139 C1003 192.625 1556.35

44 C1001 195 1537.4 140 C1001 192.6 1556.55

45 C1004 194.975 1537.59 141 C1004 192.575 1556.76

46 C1002 194.95 1537.79 142 C1002 192.55 1556.96

47 C1003 194.925 1537.99 143 C1003 192.525 1557.16

48 C1001 194.9 1538.19 144 C1001 192.5 1557.36

49 C1004 194.875 1538.38 145 C1004 192.475 1557.57

50 C1002 194.85 1538.58 146 C1002 192.45 1557.77

51 C1003 194.825 1538.78 147 C1003 192.425 1557.97

52 C1001 194.8 1538.98 148 C1001 192.4 1558.17

53 C1004 194.775 1539.17 149 C1004 192.375 1558.38

54 C1002 194.75 1539.37 150 C1002 192.35 1558.58

55 C1003 194.725 1539.57 151 C1003 192.325 1558.78

56 C1001 194.7 1539.77 152 C1001 192.3 1558.98

57 C1004 194.675 1539.96 153 C1004 192.275 1559.19

58 C1002 194.65 1540.16 154 C1002 192.25 1559.39

59 C1003 194.625 1540.36 155 C1003 192.225 1559.59

60 C1001 194.6 1540.56 156 C1001 192.2 1559.79

61 C1004 194.575 1540.76 157 C1004 192.175 1560

62 C1002 194.55 1540.95 158 C1002 192.15 1560.2

63 C1003 194.525 1541.15 159 C1003 192.125 1560.4

64 C1001 194.5 1541.35 160 C1001 192.1 1560.61

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Central Sub- Central

Sub-b Central Central
Frequenc band Frequenc
S/N. and Wavelength S/N. Wavelength
y Nam y
Name (nm) (nm)
(THz) e (THz)

65 C1004 194.475 1541.55 161 C1004 192.075 1560.81

66 C1002 194.45 1541.75 162 C1002 192.05 1561.02

67 C1003 194.425 1541.94 163 C1003 192.025 1561.22

68 C1001 194.4 1542.14 164 C1001 192 1561.42

69 C1004 194.375 1542.34 165 C1004 191.975 1561.62

70 C1002 194.35 1542.54 166 C1002 191.95 1561.83

71 C1003 194.325 1542.74 167 C1003 191.925 1562.03

72 C1001 194.3 1542.94 168 C1001 191.9 1562.24

73 C1004 194.275 1543.13 169 C1004 191.875 1562.44

74 C1002 194.25 1543.33 170 C1002 191.85 1562.64

75 C1003 194.225 1543.53 171 C1003 191.825 1562.84

76 C1001 194.2 1543.73 172 C1001 191.8 1563.05

77 C1004 194.175 1543.93 173 C1004 191.775 1563.25

78 C1002 194.15 1544.13 174 C1002 191.75 1563.46

79 C1003 194.125 1544.33 175 C1003 191.725 1563.66

80 C1001 194.1 1544.53 176 C1001 191.7 1563.87

81 C1004 194.075 1544.72 177 C1004 191.675 1564.07

82 C1002 194.05 1544.92 178 C1002 191.65 1564.27

83 C1003 194.025 1545.12 179 C1003 191.625 1564.47

84 C1001 194 1545.32 180 C1001 191.6 1564.68

85 C1004 193.975 1545.52 181 C1004 191.575 1564.88

86 C1002 193.95 1545.72 182 C1002 191.55 1565.09

87 C1003 193.925 1545.92 183 C1003 191.525 1565.29

88 C1001 193.9 1546.12 184 C1001 191.5 1565.5

89 C1004 193.875 1546.32 185 C1004 191.475 1565.7

90 C1002 193.85 1546.52 186 C1002 191.45 1565.91

91 C1003 193.825 1546.72 187 C1003 191.425 1566.11

92 C1001 193.8 1546.92 188 C1001 191.4 1566.32

93 C1004 193.775 1547.12 189 C1004 191.375 1566.52

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Central Sub- Central

Sub-b Central Central
Frequenc band Frequenc
S/N. and Wavelength S/N. Wavelength
y Nam y
Name (nm) (nm)
(THz) e (THz)

94 C1002 193.75 1547.32 190 C1002 191.35 1566.73

95 C1003 193.725 1547.52 191 C1003 191.325 1566.93

96 C1001 193.7 1547.72 192 C1001 191.3 1567.14

Note: Sub-band C1001, C1002, C1003 and C1004 respectively refer to the first, second, third and fourth sub-bands in

C band with the wavelength spacing at 100 GHz. Each sub-band includes 48 wavelengths. Sub-band C501 with

wavelength spacing at 50 GHz is composed of sub-band C1001 and C1002, while sub-band C502 with wavelength

spacing at 50 GHz is composed of sub-band C1003 and C1004.

5.2 System Component Indices

The schematic diagram of the system is illustrated in Figure 5-1, and meaning of each
component and interface is listed in Table 5-6.

Figure 5-1 Schematic Diagram of the DWDM System

f1 Rm1
TX1 SD1 R1 RX1
S1 MPI-S MPI-R
f2 Rm2 OM OD
TX2 SD2 R2 RX2
S2 / OA /
R' S'
OA OA
fn Rmn
TXn SDn Rn RXn
Sn
OSC
R1 SD1 f1
RX1 TX1
S1
R2 SD2 OD S' OM f2
RX2 R' TX2
/ OA / S2
OA OA
MPI-R MPI-S
Rn SDn fn
RXn TXn
Sn

Table 5-6 Meaning of Components and Interfaces of the DWDM System

Code Description
TX1 … TXn The OTU for multiplexing paths 1 … n

F1 … fn The wavelength occupied by multiplexing paths 1 … n (in unit of frequency)

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Code Description

Reference points on the optical fibre at the output optical connectors of the
S1 … Sn
transmitters for channels 1...n respectively

Reference points on the optical fibre just before the OM/OA input optical
RM1 … RMn
connectors for channels 1...n respectively

OM Optical Multiplexer

OA Optical amplifier

OD Optical demultiplexer

MPI Main optical channel

Reference point on the optical fibre just after the OM/OA output optical
MPI-S
connector

Reference point on the optical fibre just before the OA/OD input optical
MPI-R
connector

Reference point on the optical fibre just before the line OA input optical
R’
connector

S’ Reference point just after the line OA output optical connector

SD1 … SDn Reference points at the OA/OD output optical connectors

R1 … Rn Reference points at the inputs to the receiver optical connectors.

RX1 … RXn The OTU for multiplexing paths 1 … n

OSC Optical supervisory channel

5.3 OMU/ODU Unit Specifications

Technical specifications of OM U and ODU for ZXMP M820 are listed below:

5.3.1 Specifications of OMU Board

The OMU technical specifications of ZXMP M820 are listed in Table 5-7.

Table 5-7 Technical specifications of OMU Board

Specifi
Specifications (32 Specifications (40 cations Specifications
Item Unit
Channels) Channels) (48 (80 Channels)
Chann

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els)

Coupl
Coupler AWG TFF AWG TFF AWG Coupler AWG
er

Insertio
dB <17 <10 <10 <19 <10 <10 <10 <23 <10
n loss

Max.
differen
ce of
insertio
dB <3 <3 <3 <3 <3 <3 <3 <3.5 <3
n losses
of
channel
s

Channe
l GHz - 100 100 - 100 100 100 - 50
spacing

Optical
return dB >40 >40 >40 >40 >40 >40 >40 >40 >40
loss

1529
Working 1529- 1529- 1529- - 1529- 1529-
wavelen 1529-15 1561 1561 1529-1 1561 1561 1561 1529-15 1561
nm
gth 61 /1570- /1570- 561 /1570- /157 /1570-1 68 /1570
range 1605 1605 1605 0-16 605 -1605
05

Polariza
tion-rela dB <0.5 <0.5 <0.5 <0.6 <0.5 <0.5 <0.5 <0.7 <0.5
ted loss

Polariza
tion-mo
de ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dispersi
on

Temper
ature
nm/C --- <0.005 --- --- <0.005 --- --- --- ---
charact
eristics

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Note: 1529 nm ~ 1561 nm corresponds to the C band OMU, while 1570nm ~ 1605 nm corresponds to the L band

OMU.

5.3.2 Specifications of ODU Board

Technical specifications of ZXMP M820 ODU are listed in Table 5-8.

Table 5-8 Technical specifications of ODU Board

Specific Specif
ations ication
Specifications (32 Specifications (40
(48 s (80
Item Unit Channels) Channels)
Channel Chann
s) els)

AWG TFF AWG TFF AWG AWG

Insertion
dB < 10 < 10 < 10 < 10 < 10 < 10
loss

Max.
differenc
e of
insertion
dB <3 <3 <3 <3 <3 <3
losses
of
channel
s

Channel
GHz 100 100 100 100 100 50
spacing

Optical
return dB > 40 > 40 > 40 > 40 > 40 > 40
loss

1529-1 1529-156 1529-156 1529-156 1529-1

Working 1529-15
561 1 1 8 561
wavelen 61
nm / / / / /
gth /1570-16
1570-1 1570-160 1570-160 1570-160 1570-1
range 05
605 5 5 5 605

Separati
on of
dB > 25 > 25 > 25 > 25 > 25 > 25
adjacent
channel

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Specific Specif
ations ication
Specifications (32 Specifications (40
(48 s (80
Item Unit Channels) Channels)
Channel Chann
s) els)

AWG TFF AWG TFF AWG AWG

s

Separati
on of
non-adj
dB > 30 > 30 > 30 > 30 > 30 > 30
acent
channel
s

Polariza
tion-rela dB < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5
ted loss

Polariza
tion-mo
de ps < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5
dispersi
on

Temper
ature nm/ <
< 0.005 --- < 0.005 --- < 0.005
characte C 0.005
ristics

-1dB
bandwid nm > 0.3 > 0.3 > 0.3 > 0.3 > 0.3 > 0.3
th
Note: 1529 nm ~ 1561 nm corresponds to the C band ODU, while 1570 nm ~ 1605 nm corresponds to the L band

ODU.

5.3.3 Specifications of ODUB Board

Technical specifications of the ODUB board are listed in Table 5-9.

Table 5-9 Technical Specifications of the ODUB Board

Item Unit Specification(40-Channel)

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Item Unit Specification(40-Channel)

Insertion loss dB <10

Maximum insertion loss difference between

dB <2
channels

Channel spacing GHz 100

Optical return loss dB > 40

Operating wavelength range nm 1529 - 1561 / 1570 - 1605

Isolation of adjacent channel dB >25

Isolation of non-adjacent channel dB >30

Polarization dependent loss (PDL) dB <0.5

Polarization mode dispersion (PMD) Ps <0.5

Temperature characteristics nm/℃ -

-1 dB bandwidth nm >0.2

5.3.4 Specifications of VMUX Board

Configured at OTM site, VMUX can independently adjust optical power of each channel
to pre-weight channel power. Technical specifications of ZXMP M820 VMUX are listed in
Table 5-10.

Table 5-10 Technical specifications of VMUX Board

Item Unit Specification

Number of channels --- 40/48

Channel spacing GHz 100

40-channel: 1529-1561/1570-1605
Working wavelength range nm
48-channel: 1529-1568

-1dB bandwidth nm > 0.2

Insertion loss (@0dB VOA) dB <8

Polarization-mode dispersion ps 0.5

Polarization-related loss dB 0.8

Optical return loss dB > 40

Channel adjustment range dB 0~10

VOA adjustment accuracy dB < 0.5

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5.3.5 Specifications of VMUXB Board

Configured at OTM site, VMUX can independently adjust optical power of each channel
to pre-weight channel power. Technical specifications of ZXMP M820 VMUXB are listed
in Table 5-11.

Table 5-11 Technical specifications of VMUXB Board

Item Unit Specification

Number of channels --- 40

Channel spacing GHz 100

Working wavelength range nm 40-channel: 1529-1561/1570-1605

-1dB bandwidth nm > 0.2

Insertion loss (@0dB VOA) dB <8

Polarization-mode dispersion ps 0.5

Polarization-related loss dB 0.8

Optical return loss dB > 40

Channel adjustment range dB 0~10

VOA adjustment accuracy dB < 0.5

5.3.6 Specifications of OCI Board

Technical specifications of the OCI board are illustrated in Table 5-12 and Table 5-13.

Table 5-12 Technical Specifications of the OCI Board (100GHz-50GHz)

Item Unit Specification

C band wavelength range nm 1529 - 1568

CE band wavelength range nm 1529-1568

L band wavelength range nm 1570 - 1605

Input optical power range dBm < +23

Input wavelength spacing GHz 100

Output wavelength spacing GHz 50

Insertion loss dB <3

Max. difference of insertion losses of channels dB <1

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Item Unit Specification

Optical return loss dB > 40

Separation of adjacent channels dB > 25

Separation of non-adjacent channels dB > 25

Polarization-related loss dB < 0.5

Polarization-mode dispersion ps < 0.5

-1dB bandwidth nm > 0.1

Table 5-13 Technical Specifications of the OCI Board (50GHz-25GHz)

Item Unit Specification

CE band wavelength range THz 1529-1568

Input optical power range dBm < +23

Input wavelength spacing GHz 50

Output wavelength spacing GHz 25

Insertion loss dB <3

Max. difference of insertion losses of channels dB <2

Optical return loss dB > 40

Isolation of de-multiplexing procedure dB > 21

Isolation of multiplexing procedure dB > 16

Polarization dependent loss (PDL) dB < 0.5

Polarization mode dispersion (PMD) ps < 0.2

-1dB bandwidth nm > 20

5.3.7 Specifications of OBM Board

Technical Specifications of the OBM Board for ZXMP M820 are listed in Table 5-14.

Table 5-14 Technical Specifications of the OBM Board

Item Unit Specification

C band wavelength range nm 1529 -1561

CE band wavelength range nm 1529-1568

L band wavelength range nm 1570 -1605

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Item Unit Specification

C band insertion loss dB < 1.5

CE band insertion loss dB < 1.5

L band insertion loss dB < 1.5

Isolation dB 15

Optical return loss dB > 40

Polarization-related loss dB < 0.5

Polarization-mode dispersion ps < 0.5

5.4 WSUA/WSUD & WBU Unit Specifications

Technical specifications of WBU are listed in Table 5-15.

Table 5-15 Technical specifications of WBU Board

Item Unit Specification

Optical Spectrum range nm 1529-1568

100
Channel spacing GHz
50

40/48
Channel quantity -
80/96

A1/A2-OUT dB <1.5

Straight IN-D1/D2 dB <4

insertion loss EXIN-OUT dB <14

IN-EXOUT dB <4

Attenuation tunable range dB 0~15

Attenuation tunable precision(ER) dB <0.5

Blocked extinction ratio dB >35

Return loss dB >40

Maximum total input optical power dBm ≤25

Maximum Single-channel input optical power dBm ≤16

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Technical specifications of WSUA/WSUD for ZXMP M820 are listed in Table 5-16.

Table 5-16 Technical specifications of WSUA/WSUD Board

Item Unit Specification

WSUD WSUA

Optical Spectrum range nm 1529-1561 1529-1561

100 100
Channel spacing GHz
50 50

40 40
Channel quantity -
80 80

A1-OUT dB <2 <2

A2-OUT dB <10 <10

IN-D1~D8 dB <6 <6

Straight
insertion loss EXIN-OUT dB <9 <6

<6（WSUD/MA1） <9（WSUA/MD1）
IN-EXOUT dB <16 <16
（WSUD/MA2） （WSUA/MD2）

Attenuation tunable range dB 0~15 0~15

Attenuation tunable precision(ER) dB <0.5 <0.5

Blocked extinction ratio dB >35 >35

Return loss dB >40 >40

Maximum total input optical power dBm ≤25 ≤25

Maximum Single-channel input

dBm ≤16 ≤16
optical power

Technical specifications of WBM are listed in Table 5-17.

Table 5-17 Technical specifications of WBM Board

Item Unit Specification

Optical spectrum range nm 1529-1561

Channel spacing GHz 100

Channel quantity - 40

insertion loss An-OUT (n=1-40) dB <8

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Item Unit Specification

IN-DROP dB <7

EXIN-OUT dB <13

IN-EXOUT dB <3

Attenuation adjustment range dB 0-15

< (0.5 or ±10% of the

Attenuation adjustment precision dB adjustment precision,
select the larger one)

Return loss dB >40

Technical specifications of PDU Boards are listed in following tables.

Table 5-18 Technical specifications of PDU-4-X Board

Item Unit Indices (PDU-4-X)

1529~1561(C-band)
wavelength range Nm 1529~1568(CE-band)
1570~1605(L-band)

Insertion
INx→Ox-1/2/3/4 dB <8.0
Loss

Polarization-related loss dB <0.4

Optical Return Loss dB >40

Table 5-19 Technical specifications of PDU-5-X Board

Item Unit Indices (PDU-5-X)

1529~1561(C-band)
wavelength range Nm 1529~1568(CE-band)
1570~1605(L-band)

INx →
dB <12.0
Insertion Loss Ox-1/2/3/4

INx→Dx dB <4.0

Polarization-related loss dB <0.5

Optical Return Loss dB >40

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Table 5-20 Technical specifications of PDU-8-X board

Item Unit Indices (PDU-8-X)

1529~1561(C-band)
wavelength range Nm 1529~1568(CE-band)
1570~1605(L-band)

INx →
Insertion Loss dB <11.0
Ox-1/2/3/4/5/6/7/8

Polarization-related loss dB <0.5

Optical Return Loss dB >40

Table 5-21 Technical specifications of PDU-9-X Board

Item Unit Indices (PDU-9-X)

1529~1561(C-band)
wavelength range Nm 1529~1568(CE-band)
1570~1605(L-band)

INx →
Insertion dB <15.0
Ox-1/2/3/4/5/6/7/8
Loss
INx→Dx dB <4.0

Polarization-related loss dB <0.5

Optical Return Loss dB >40

Table 5-22 Technical specifications of PDU-16-X Board

Indices
Item Unit
(PDU-16-X)

1529~1561(C-ba
nd)
1529~1568(CE-b
wavelength range Nm
and)
1570~1605(L-ban
d)

Insertion Inx
dB <14.0
Loss Ox-1/2/3/4/5/6/7/8/9/10/11/12/13/14/15/16

Polarization-related loss dB <0.5

Optical Return Loss dB >40

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5.5 OADM Unit Specifications

The OADM of ZXMP M820 is used to add/drop 4 or 8-wavelength signals. Take the C
band 8-wavelength OADM for example, its main Technical specifications are listed in
Table 5-23.

Table 5-23 Technical specifications of OADM Board

Name Specification Unit

Central frequency range 191.3~196.0 THz

Central channel range 1529.16 ~1567.14 nm

- 0.5dB bandwidth > 0.2 nm

- 20dB bandwidth <1.2 nm

Channel spacing 100 GHz

Number of add/drop channels 8/4 ---

Between In-Drop and

> 25 dB
adjacent channel

Between In-Drop and

>35 dB
Isolation non- adjacent channel

Between In-Midl and

>14 dB
Drop

Between In-Out and

> 28 dB
Drop

Optical return loss >40 dB

Directivity > 60 dB

In-drop <4.0 dB
Insertion
Add-out <4.0 dB
loss
In-out <6.0 dB

Working relative humidity 5 ~95 %RH

Max. allowed optical power <500 mW

5.6 OA Unit Specifications

To achieve smooth expansion of DWDM systems from 2.5Gbit/s and 10Gbit/s to 40Gbit/s,

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optical amplifiers used in the ZXWMM820 are compatible with both 2.5Gbit/s, 10Gbit/s
and 40Gbit/s systems.

5.6.1 Specifications of EOBA (Enhanced Optical Booster Amplifier) Board

 40-channel C/L band optical booster amplifiers

As shown in Table 5-24, the single channel power is applicable to 40-channel

system.

Table 5-24 Technical specifications of 40-channel EOBA Board (C/L-band)

Indices (40-channel system)

Item Unit
EOBA17/17 EOBA27/26 EOBA22/20 EOBA20/20 EOBA24/24

1529~1561 1529~1561 1529~1561 1529~1561 1529~1561 (C

Working
(C band) (C band) (C band) (C band) band)
wavelength nm
1570~1605 1570~1605 1570~1605 1570~1605 1570~1605(L
range
(L band) (L band) (L band) (L band) band)

Total input
dBm -32 ~3 -32 ~2 -32 ~1 -32 ~3 -32 ~3
power range

Input power
range of the dBm -32 ~-13 -32 ~-14 -32~ -15 -32 ~-13 -32 ~-13
channel

Output power
range of the dBm -2~4 7~13 1~7 1~7 5~11
channel

Total output
dBm -2~17 7~26 1~20 1~20 5~24
power range

Max. total
dBm 17 26 20 20 24
output power

Noise
dB <6 <6 <6 <6 <6
coefficient

Polarization-r
dB <0.5 <0.5 <0.5 <0.5 <0.5
elated loss

Pump leak at
dBm <-30 <-30 <-30 <-30 <-30
input

Pump leak at dBm <-30 <-30 <-30 <-30 <-30

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Indices (40-channel system)

Item Unit
EOBA17/17 EOBA27/26 EOBA22/20 EOBA20/20 EOBA24/24
output

Input return
dB >40 >40 >40 >40 >40
loss

Output return
dB >40 >40 >40 >40 >40
loss

Channel gain dB 17 27 22 20 24

Max.
bearable
dB <-30 <-30 <-30 <-30 <-30
reflectance at
input

Max.
bearable
dB <-30 <-30 <-30 <-30 <-30
reflectance at
output

Gain flatness dB ±1 ±1 ±1 ±1 ±1

Gain
response
time when
channels are ms <10 <10 <10 <10 <10
added or
reduced
(stable state)

Polarization-
mode ps <0.5 <0.5 <0.5 <0.5 <0.5
dispersion

 80-channel C/L band optical booster amplifiers

As shown in Table 5-25, the single channel power is applicable to 80-channel
system.

Table 5-25 Technical specifications of 80-channel EOBA Board (C/L-band)

Indices (80-channel system)

Item Unit
EOBA17/17 EOBA27/26 EOBA22/20 EOBA20/20 EOBA24/24

Working nm 1529~1561 1529~1561 1529~1561 1529~1561 1529~1561 (C

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Indices (80-channel system)

Item Unit
EOBA17/17 EOBA27/26 EOBA22/20 EOBA20/20 EOBA24/24
wavelength (C band) (C band) (C band) (C band) band)
range 1570~1605 1570~1605 1570~1605 1570~1605 1570~1605(L
(L band) (L band) (L band) (L band) band)

Total input
dBm -32 ~ 3 -32 ~2 -32 ~ 1 -32 ~ 3 -32 ~3
power range

Input power
range of the dBm -32 ~ -16 -32 ~ -17 -32 ~ -18 -32 ~ -16 -32 ~ -16
channel

Output power
range of the dBm -5~1 4~10 –2~4 –2~4 2~8
channel

Total output
dBm -5~17 4~26 –2~20 –2~20 2~24
power range

Max. total
dBm 17 26 20 20 24
output power

Noise
dB <6 <6 <6 <6 <6
coefficient

Polarization-r
dB <0.5 <0.5 <0.5 <0.5 <0.5
elated loss

Pump leak at
dBm <-30 <-30 <-30 <-30 <-30
input

Pump leak at
dBm <-30 <-30 <-30 <-30 <-30
output

Input return
dB >40 >40 >40 >40 >40
loss

Output return
dB >40 >40 >40 >40 >40
loss

Channel gain dB 17 27 22 20 24

Max.
bearable
dB <-30 <-30 <-30 <-30 <-30
reflectance at
input

Max.
bearable dB <-30 <-30 <-30 <-30 <-30
reflectance at

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Indices (80-channel system)

Item Unit
EOBA17/17 EOBA27/26 EOBA22/20 EOBA20/20 EOBA24/24
output

Gain flatness dB ±1 ±1 ±1 ±1 ±1

Gain
response
time when
channels are ms <10 <10 <10 <10 <10
added or
reduced
(stable state)

Polarization-
mode ps <0.5 <0.5 <0.5 <0.5 <0.5
dispersion

 48-channel C band optical booster amplifiers

As shown in Table 5-26, the single channel power is applicable to 48-channel

system.

Table 5-26 Technical specifications of 48-channel EOBA Board (C-band)

Indices (48-channel system)

Item Unit
EOBA17/17 EOBA23/21 EOBA26/24 EOBA28/26

Operating
1529-1568 1529-1568 1529-1568 1529-1568
wavelength nm
(C-band) (C-band) (C-band) (C-band)
range

Total input
dBm -32 ~3 -32 ~1 -32 ~1 -32 ~1
power range

Channel input
dBm -32 ~-14 -32 to -19 -32 to -19 -32 to -19
power range

Channel output
dBm –3~3 1~7 4~10 6~12
power range

Total output
dBm –3~17 1~21 4~24 6~26
power range

Maximum total
dBm 17 21 24 26
output power

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Indices (48-channel system)

Item Unit
EOBA17/17 EOBA23/21 EOBA26/24 EOBA28/26

Noise figure dB <6 <6 <6 <6

Polarization
dB <0.5 <0.5 <0.5 <0.5
dependent loss

Pump leakage
dBm <-30 <-30 <-30 <-30
at input

Pump leakage
dBm <-30 <-30 <-30 <-30
at output

Input return loss dB >40 >40 >40 >40

Output return
dB >40 >40 >40 >40
loss

Channel gain dB 17 23 26 28

Allowed
Maximum input dB <-30 <-30 <-30 <-30
reflectance

Allowed
maximum output dB <-30 <-30 <-30 <-30
reflectance

Gain flatness dB ±1 ±1 ±1 ±1

Gain response
time while
adding/reducing ms <10 <10 <10 <10
channels (stable
status)

Polarization
ps <0.5 <0.5 <0.5 <0.5
mode dispersion

 96-channel C band optical booster amplifiers

The single channel power is applicable to 96-channel system.

Table 5-27 Technical specifications of 96-channel EOBA Board (C-band)

Indices (96-channel system)

Item Unit
EOBA17/17 EOBA23/21 EOBA26/24 EOBA28/26

Operating nm 1529-1568 1529-1568 1529-1568 1529-1568

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Indices (96-channel system)

Item Unit
EOBA17/17 EOBA23/21 EOBA26/24 EOBA28/26
wavelength (C-band) (C-band) (C-band) (C-band)
range

Total input
dBm -32 ~ 3 -32 ~ 1 -32 ~ 1 -32 ~ 1
power range

Channel input
dBm -32 ~ -17 -32 ~ -19 -32 ~ -19 -32 ~ -19
power range

Channel output
dBm -6 ~ 0 -2 ~ 4 1~7 3~9
power range

Total output
dBm -6 ~ 17 -2 ~ 21 1 ~ 24 3 ~ 26
power range

Maximum total
dBm 17 21 24 26
output power

Noise figure dB <6 <6 <6 <6

Polarization
dB <0.5 <0.5 <0.5 <0.5
dependent loss

Pump leakage
dBm <-30 <-30 <-30 <-30
at input

Pump leakage
dBm <-30 <-30 <-30 <-30
at output

Input return loss dB >40 >40 >40 >40

Output return
dB >40 >40 >40 >40
loss

Channel gain dB 17 23 26 28

Allowed
Maximum input dB <-30 <-30 <-30 <-30
reflectance

Allowed
maximum
dB <-30 <-30 <-30 <-30
output
reflectance

Gain flatness dB ±1 ±1 ±1 ±1

Gain response
time while ms <10 <10 <10 <10
adding/reducing

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Indices (96-channel system)

Item Unit
EOBA17/17 EOBA23/21 EOBA26/24 EOBA28/26
channels
(stable status)

Polarization
mode ps <0.5 <0.5 <0.5 <0.5
dispersion

5.6.2 Specifications of EOLA (Enhanced Optical Line Amplifier) Board

 40/80-channel C/L band optical line amplifiers

Technical specifications of the 40/80-channel C/L band EOLA are listed in Table
5-28.

Table 5-28 Technical specifications of 40/80-channel EOLA Board (C/L-band)

Indices (40-channel system) Indices (80-channel system)

Item Unit
EOLA22/20 EOLA27/20 EOLA32/20 EOLA22/20 EOLA27/20 EOLA32/20

1529~1561 1529~1561 1529~1561 1529~1561 1529~1561 1529~1561

Working
(C band) (C band) (C band) (C band) (C band) (C band)
wavelength nm
1570~1605 1570~1605 1570~1605 1570~1605 1570~1605 1570~1605
range
(L band) (L band) (L band) (L band) (L band) (L band)

Total input
dBm -35 ~ 1 -35 ~ -4 -35 ~ -9 -35 ~ 1 -35 ~ -4 -35 ~ -9
power range

Input power
range of the dBm -35 ~ -15 -35 ~ -20 -35 ~ -25 -35 ~ -18 -35 ~ -23 -35 ~ -28
channel

Output power
range of the dBm 1~7 1~7 1~7 -2~4 -2~4 -2~4
channel

Total output
dBm 1~20 1~20 1~20 -2~20 -2~20 -2~20
power range

Max. total
dBm 20 20 20 20 20 20
output power

Noise
dB <6 <6 <6 <6 <6 <6
coefficient

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Indices (40-channel system) Indices (80-channel system)

Item Unit
EOLA22/20 EOLA27/20 EOLA32/20 EOLA22/20 EOLA27/20 EOLA32/20

Polarization-r
dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
elated loss

Pump leak at
dBm <-30 <-30 <-30 <-30 <-30 <-30
input

Pump leak at
dBm <-30 <-30 <-30 <-30 <-30 <-30
output

Input return
dB >40 >40 >40 >40 >40 >40
loss

Output return
dB >40 >40 >40 >40 >40 >40
loss

Channel gain dB 22 27 32 22 27 32
Max.
bearable
dB <-30 <-30 <-30 <-30 <-30 <-30
reflectance at
input

Max.
bearable
dB <-30 <-30 <-30 <-30 <-30 <-30
reflectance at
output

Gain flatness dB ±1 ±1 ±1 ±1 ±1 ±1
Gain
response
time when
channels are Ms <10 <10 <10 <10 <10 <10
added or
reduced
(stable state)

Polarization-
mode Ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dispersion

5.6.3 Specifications of EOPA (Optical preamplifier) Board

 40-channel C/L band optical preamplifiers

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Technical specifications of the 40-channel C/L band optical preamplifiers are listed
in Table 5-29.

Table 5-29 Technical specifications of 40-channel EOPA Board (C/L-band)

Indices (40-channel system)

Item Unit
EOPA17/17 EOPA22/17 EOPA27/17

Channels 1529~1561/ 1529~1561/ 1529~1561/

nm
allocation 1570~1605 1570~1605 1570~1605

Total input
dBm -35 ~ 3 -35 ~ -2 -35 ~ -7
power range

Input power
range of the dBm -35 ~ -13 -35 ~ -18 -35 ~ -23
channel

Output power
range of the dBm -2 ~ 4 -2 ~ 4 -2 ~ 4
channel

Total output
dBm -2 ~ 17 -2 ~ 17 -2 ~ 17
power range

Max. total
dBm 17 17 17
output power

Noise
dB <5.5 <5.5 <5.5
coefficient

Polarization-r
dB <0.5 <0.5 <0.5
elated loss

Pump leak at
dBm <-30 <-30 <-30
input

Pump leak at
dBm <-30 <-30 <-30
output

Input return
dB >40 >40 >40
loss

Output return
dB >40 >40 >40
loss

Channel gain dB 17 22 27

Max.
bearable dB <-30 <-30 <-30
reflectance at

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Indices (40-channel system)

Item Unit
EOPA17/17 EOPA22/17 EOPA27/17
input

Max.
bearable
dB <-30 <-30 <-30
reflectance at
output

Gain flatness
dB ±1 ±1 ±1

Gain
response
time when
channels are ms <10 <10 <10
added or
reduced
(stable state)

Polarization-
mode ps <0.5 <0.5 <0.5
dispersion

 80-channel C/L band optical preamplifiers

Technical specifications of the 80-channel C/L band optical preamplifiers are listed
in Table 5-30.

Table 5-30 Technical specifications of 40-channel EOPA Board (C/L-band)

Indices (80-channel system)

Item Unit
EOPA17/17 EOPA22/17 EOPA27/17

Channels 1529~1561/ 1529~1561/ 1529~1561/

nm
allocation 1570~1605 1570~1605 1570~1605

Total input
dBm -35 ~ 3 -35 ~ -2 -35 ~ -7
power range

Input power
range of the dBm -35 ~ -16 -35 ~ -21 -35 ~ -26
channel

Output power
dBm -5 ~ 1 -5 ~ 1 -5 ~ 1
range of the

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Indices (80-channel system)

Item Unit
EOPA17/17 EOPA22/17 EOPA27/17
channel

Total output
dBm -5 ~ 17 -5 ~ 17 -5 ~ 17
power range

Max. total
dBm 17 17 17
output power

Noise
dB <5.5 <5.5 <5.5
coefficient

Polarization-r
dB <0.5 <0.5 <0.5
elated loss

Pump leak at
dBm <-30 <-30 <-30
input

Pump leak at
dBm <-30 <-30 <-30
output

Input return
dB >40 >40 >40
loss

Output return
dB >40 >40 >40
loss

Channel gain dB 17 22 27

Max.
bearable
dB <-30 <-30 <-30
reflectance at
input

Max.
bearable
dB <-30 <-30 <-30
reflectance at
output

Gain flatness
dB ±1 ±1 ±1

Gain
response
time when
channels are ms <10 <10 <10
added or
reduced
(stable state)

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Indices (80-channel system)

Item Unit
EOPA17/17 EOPA22/17 EOPA27/17

Polarization-
mode ps <0.5 <0.5 <0.5
dispersion

 48-channel C band optical preamplifiers

Technical specifications of the 48-channel C band optical preamplifiers are listed in

Table 5-31.

Table 5-31 Technical specifications of 48-channel EOPA Board (C-band)

Indices (48-channel system)

Item Unit
EOPA17/17 EOPA22/17 EOPA27/17

Operating wavelength 1529-1568 1529-1568 1529-1568

nm
range (C-band) (C-band) (C-band)

Total input power

dBm -35 ~ 3 -35 ~ -2 -35 ~ -7
range

Channel input power

dBm -35 ~ -14 -35 ~ -19 -35 ~ -24
range

Channel output power

dBm -3 ~ 3 -3 ~ 3 -3 ~ 3
range

Total output power

dBm -3 ~ 17 -3 ~ 17 -3 ~ 17
range

Maximum total output

dBm 17 17 17
power

Noise figure dB <5.5 <5.5 <5.5

Polarization
dB <0.5 <0.5 <0.5
dependent loss

Pump leakage at
dBm <-30 <-30 <-30
input

Pump leakage at
dBm <-30 <-30 <-30
output

Input return loss dB >40 >40 >40

Output return loss dB >40 >40 >40

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Indices (48-channel system)

Item Unit
EOPA17/17 EOPA22/17 EOPA27/17

Channel gain dB 17 22 27

Allowed maximum
dB <-30 <-30 <-30
input reflectance

Allowed maximum
dB <-30 <-30 <-30
output reflectance

Gain flatness dB ±1 ±1 ±1

Gain response time

while adding/
ms <10 <10 <10
reducing channels
(stable status)

Polarization mode
ps <0.5 <0.5 <0.5
dispersion

 96-channel C band optical preamplifiers

Technical specifications of the 96-channel C band optical preamplifiers are listed in

Table 5-32.

Table 5-32 Technical specifications of 96-channel EOPA Board (C-band)

Indices (96-channel system)

Item Unit
EOPA17/17 EOPA22/17 EOPA27/17

Operating wavelength 1529-1568 1529-1568 1529-1568

nm
range (C-band) (C-band) (C-band)

Total input power

dBm -35 ~ 3 -35 ~ -2 -35 ~ -7
range

Channel input power

dBm -35 ~ -17 -35 ~ -22 -35 ~ -27
range

Channel output power

dBm -6 ~ 0 -6 ~ 0 -6 ~ 0
range

Total output power

dBm -6 ~ 17 -6 ~ 17 -6 ~ 17
range

Maximum total output

dBm 17 17 17
power

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Indices (96-channel system)

Item Unit
EOPA17/17 EOPA22/17 EOPA27/17

Noise figure dB <5.5 <5.5 <5.5

Polarization
dB <0.5 <0.5 <0.5
dependent loss

Pump leakage at
dBm <-30 <-30 <-30
input

Pump leakage at
dBm <-30 <-30 <-30
output

Input return loss dB >40 >40 >40

Output return loss dB >40 >40 >40

Channel gain dB 17 22 27

Allowed maximum
dB <-30 <-30 <-30
input reflectance

Allowed maximum
dB <-30 <-30 <-30
output reflectance

Gain flatness dB ±1 ±1 ±1

Gain response time

while adding/
ms <10 <10 <10
reducing channels
(stable status)

Polarization mode
ps <0.5 <0.5 <0.5
dispersion

5.6.4 Specifications of EONA (Enhanced Optical Node Amplifier) Board

 40/80 channel C Enhanced Optical Node Amplifier

Technical specifications of the 40/80-channel C/L band optical Node amplifiers are
listed in Table 5-33.

Table 5-33 Technical specifications of 40/80-channel EONA Board (C/L-band)

Indices (40-channel system) Indices (80-channel system)

Item Unit
EONA25/20 EONA33/20 EONA27/24 EONA25/20 EONA33/20 EONA27/24

Working nm 1529~1567 1529~1567 1529~1567 1529~1567 1529~1567 1529~1567

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Indices (40-channel system) Indices (80-channel system)

Item Unit
EONA25/20 EONA33/20 EONA27/24 EONA25/20 EONA33/20 EONA27/24
wavelength (C-band) (C-band) (C-band) (C-band) (C-band) (C-band)
range 1570~1605 1570~1605 1570~1605 1570~1605 1570~1605 1570~1605
(L-band) (L-band) (L-band) (L-band) (L-band) (L-band)

Total input
dBm -35 ~ -2 -35 ~ -10 -35 ~ 0 -35 ~ -2 -35 ~ -10 -35 ~ 0
power range

Input power
range of the dBm -35 ~ -18 -35 ~ -26 -35 ~ -16 -35 ~ -21 -35 ~ -29 -35 ~ -19
channel

Output power
range of the dBm 1~7 1~7 5 ~ 11 -2 ~ 4 -2 ~ 4 2~8
channel

Total output
dBm 1 ~ 20 1 ~ 20 5 ~ 24 -2 ~ 20 -2 ~ 20 2 ~ 24
power range

Max. total
dBm 20 20 24 20 20 24
output power

20~22: 8.0 22~24: 8.5 20~22: 8.0 22~24: 8.5

Noise 28~30: 6.5 28~30: 6.5
dB 22~25: 7.0 24~27: 7.5 22~25: 7.0 24~27: 7.5
coefficient 30~38: 6.0 30~38: 6.0
25~30: 6.5 27~32: 6.5 25~30: 6.5 27~32: 6.5

Polarization-r
dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
elated loss

Pump leak at
dBm <-30 <-30 <-30 <-30 <-30 <-30
input

Pump leak at
dBm <-30 <-30 <-30 <-30 <-30 <-30
output

Input return
dB >40 >40 >40 >40 >40 >40
loss

Output return
dB >40 >40 >40 >40 >40 >40
loss

Channel gain dB 25 33 27 25 33 27

Max.
bearable
dB <-30 <-30 <-30 <-30 <-30 <-30
reflectance at
input

Max. dB <-30 <-30 <-30 <-30 <-30 <-30

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Indices (40-channel system) Indices (80-channel system)

Item Unit
EONA25/20 EONA33/20 EONA27/24 EONA25/20 EONA33/20 EONA27/24
bearable
reflectance at
output

Gain flatness dB ±1 ±1 ±1 ±1 ±1 ±1

Gain
response
time when
channels are ms <10 <10 <10 <10 <10 <10
added or
reduced
(stable state)

Polarization-
mode ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dispersion

 48/96-channel C Enhanced Optical Node Amplifier

Technical specifications of the 48/96-channel C band optical Node amplifiers are

listed in Table 5-34.

Table 5-34 Technical specifications of 48/96-channel EONA Board (C/L-band)

Indices (48-channel system)) Indices (96-channel system))

Item Unit
EONA25/21 EONA33/21 EONA27/24 EONA25/21 EONA33/21 EONA27/24

Operating
1529-1568 1529-1568 1529-1568 1529-1568 1529-1568 1529-1568
wavelength nm
(C-band) (C-band) (C-band) (C-band) (C-band) (C-band)
range

Total input
dBm -35 ~ -1 -35 ~ -9 -35 ~ 0 -35 ~ -1 -35 ~ -9 -35 ~ 0
power range

Channel input
dBm -35 ~ -18 -35 ~ -26 -35 ~ -17 -35 ~ -21 -35 ~ -29 -35 ~ -20
power range

Channel output
dBm 1~7 1~7 4 ~ 10 -2 ~ 4 -2 ~ 4 1~7
power range

Total output
dBm 1 ~ 21 1 ~ 21 4 ~ 24 -2 ~ 21 -2 ~ 21 1 ~ 24
power range

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Indices (48-channel system)) Indices (96-channel system))

Item Unit
EONA25/21 EONA33/21 EONA27/24 EONA25/21 EONA33/21 EONA27/24

Maximum total
dBm 21 21 24 21 21 24
output power

20~22: 8.0 22~24: 8.5 20~22: 8.0 22~24: 8.5

28~30: 6.5 28~30: 6.5
Noise figure dB 22~25: 7.0 24~27: 7.5 22~25: 7.0 24~27: 7.5
30~38: 6.0 30~38: 6.0
25~30: 6.5 27~32: 6.5 25~30: 6.5 27~32: 6.5

Polarization
dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dependent loss

Pump leakage
dBm <-30 <-30 <-30 <-30 <-30 <-30
at input

Pump leakage
dBm <-30 <-30 <-30 <-30 <-30 <-30
at output

Input return loss dB >40 >40 >40 >40 >40 >40

Output return
dB >40 >40 >40 >40 >40 >40
loss

Channel gain dB 25 33 27 25 33 27

Allowed
maximum input dB <-30 <-30 <-30 <-30 <-30 <-30
reflectance

Allowed
maximum
dB <-30 <-30 <-30 <-30 <-30 <-30
output
reflectance

Gain flatness dB ±1 ±1 ±1 ±1 ±1 ±1

Gain response
time while
adding/reducing ms <10 <10 <10 <10 <10 <10
channels
(stable status)

Polarization
mode ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dispersion

5.6.5 Specifications of SEOBA Board

 40/80-channel C band optical booster amplifiers.

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Table 5-35 Technical specifications of 40/80-channel SEOBA Board (C- Band)

Indices (40-channel Indices (80-channel

Item Unit system) system)

SEOBA17/17 SEOBA22/20 SEOBA17/17 SEOBA22/20

Working 1529~1561 1529~1561 1529~1561 1529~1561

wavelength nm (C band) (C band) (C band) (C band)
range

Total input
dBm -32 ~ 3 -32 ~1 -32 ~ 3 -32 ~ 1
power range

Input power
range of the dBm -32 ~-13 -32~ -15 -32 ~ -16 -32 ~ -18
channel

Output
power range
dBm -2~4 1~7 -5~1 -2~4
of the
channel

Total output
dBm -2~17 1~20 -5~17 -2~20
power range

Max. total
dBm 17 20 17 20
output power

Noise
dB <6 <6 <6 <6
coefficient

Polarization-r
dB <0.5 <0.5 <0.5 <0.5
elated loss

Pump leak at
dBm <-30 <-30 <-30 <-30
input

Pump leak at
dBm <-30 <-30 <-30 <-30
output

Input return
dB >40 >40 >40 >40
loss

Output return
dB >40 >40 >40 >40
loss

Channel gain dB 17 22 17 22

Max.
bearable dB <-30 <-30 <-30 <-30
reflectance

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Indices (40-channel Indices (80-channel

Item Unit system) system)

SEOBA17/17 SEOBA22/20 SEOBA17/17 SEOBA22/20

at input

Max.
bearable
dB <-30 <-30 <-30 <-30
reflectance
at output

Gain flatness dB ±1 ±1 ±1 ±1

Gain
response
time when
channels are ms <10 <10 <10 <10
added or
reduced
(stable state)

Polarization-
mode ps <0.5 <0.5 <0.5 <0.5
dispersion

5.6.6 Specifications of SEOPA Board

 40/80-channel C band optical preamplifiers.

Table 5-36 Technical specifications of 40-channel SEOPA Board (C-band)

Indices (40-channel system)

Item Unit
SEOPA17/17 SEOPA22/17 SEOPA27/17

Channels allocation nm 1529~1561 1529~1561 1529~1561

Total input power

dBm -35~3 -35~-2 -35~-7
range

Input power range of

dBm -35 ~ -13 -35 ~ -18 -35 ~ -23
the channel

Output power range of

dBm -2 ~ 4 -2 ~ 4 -2 ~ 4
the channel

Total output power

dBm -2 ~ 17 -2 ~ 17 -2 ~ 17
range

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Indices (40-channel system)

Item Unit
SEOPA17/17 SEOPA22/17 SEOPA27/17

Max. total output

dBm 17 17 17
power

Noise coefficient dB <5.5 <5.5 <5.5

Polarization-related
dB <0.5 <0.5 <0.5
loss

Pump leak at input dBm <-30 <-30 <-30

Pump leak at output dBm <-30 <-30 <-30

Input return loss dB >40 >40 >40

Output return loss dB >40 >40 >40

Channel gain dB 17 22 27

Max. bearable
dB <-30 <-30 <-30
reflectance at input

Max. bearable
dB <-30 <-30 <-30
reflectance at output

Gain flatness dB ±1 ±1 ±1

Gain response time

when channels are
ms <10 <10 <10
added or reduced
(stable state)

Polarization-mode
ps <0.5 <0.5 <0.5
dispersion

Table 5-37 Technical specifications of 80-channel SEOPA Board (C-band)

Indices (80-channel system)

Item Unit
SEOPA17/17 SEOPA22/17 SEOPA27/17

Channels allocation nm 1529~1561 1529~1561 1529~1561

Total input power

dBm -35 ~ 3 -35 ~ -2 -35 ~ -7
range

Input power range of

dBm -35 ~ -16 -35 ~ -21 -35 ~ -26
the channel

Output power range of

dBm -5 ~ 1 -5 ~ 1 -5 ~ 1
the channel

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Indices (80-channel system)

Item Unit
SEOPA17/17 SEOPA22/17 SEOPA27/17

Total output power

dBm -5 ~ 17 -5 ~ 17 -5 ~ 17
range

Max. total output

dBm 17 17 17
power

Noise coefficient dB <5.5 <5.5 <5.5

Polarization-related
dB <0.5 <0.5 <0.5
loss

Pump leak at input dBm <-30 <-30 <-30

Pump leak at output dBm <-30 <-30 <-30

Input return loss dB >40 >40 >40

Output return loss dB >40 >40 >40

Channel gain dB 17 22 27

Max. bearable
dB <-30 <-30 <-30
reflectance at input

Max. bearable
dB <-30 <-30 <-30
reflectance at output

Gain flatness dB ±1 ±1 ±1

Gain response time

when channels are
ms <10 <10 <10
added or reduced
(stable state)

Polarization-mode
ps <0.5 <0.5 <0.5
dispersion

5.6.7 Specifications of SEOLA Board

 40/80-channel C band optical line amplifiers.

Table 5-38 Technical specifications of 40/80-channel SEOLA Board (C-band)

Indices (40-channel Indices (80-channel

Item Unit system) system)

SEOLA22/20 SEOLA22/20

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Indices (40-channel Indices (80-channel

Item Unit system) system)

SEOLA22/20 SEOLA22/20

Working wavelength
nm 1529~1561 (C band) 1529~1561 (C band)
range

Total input power

dBm -35 ~ 1 -35 ~ 1
range

Input power range of

dBm -35 ~ -15 -35 ~ -18
the channel

Output power range

dBm 1-7 -2~4
of the channel

Total output power

dBm 1~20 -2~20
range

Max. total output

dBm 20 20
power

Noise coefficient dB <6 <6

Polarization-related
dB <0.5 <0.5
loss

Pump leak at input dBm <-30 <-30

Pump leak at output dBm <-30 <-30

Input return loss dB >40 >40

Output return loss dB >40 >40

Channel gain dB 22 22

Max. bearable
dB >30 >30
reflectance at input

Max. bearable
dB >30 >30
reflectance at output

Gain flatness dB ±1 ±1

Gain response time

when channels are
Ms <10 <10
added or reduced
(stable state)

Polarization-mode
Ps <0.5 <0.5
dispersion

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5.6.8 Specifications of EDFA+RAMAN Board

The DRA_P board applies RAMAN amplifier to amplify the optical signals, and its
specifications are listed in Table 5-39.

Table 5-39 Technical specifications of RAMAN_P amplifier

Item Unit Parameters

Type Inverse distributed pump

Pump wavelength and quantity nm/piece C:2~3, CE: 2~3,L:2~3

Pump power mW 750

Total output power dBm 12

Type of output connector SC/UPC (APC)

C,CE, L and C+L gain (G652) dB 10/10/10

C, CE,L and C+L gain (LEAF) dB 12/12/12

C, CE,L and C+L gain (TW RS) dB 13/13/13

C,CE, L and C+L equivalent noise

dB 0/0/0
figure (G652)

C, CE,L and C+L equivalent noise

dB -1/-1/-1
figure (LEAF)

C, CE,L and C+L equivalent noise

dB -1.5/-1.5/-1.5
figure (TW RS)

Associated polarization loss dB <0.5

Temperature feature pm/C <500

Note: C band amplifier module pump wavelength: 1421.5/1455.0nm and 1425/1440/1456nm; L band amplifier module

pump wavelength: 1439.0/1495.0nm.

Practically, we adopt EDFA+RAMAN technologies, which is the combination of the EOA

board and the DRA_P board, to amply the optical signals. The specifications are listed in
Table 5-40.

Table 5-40 Technical specifications of EDFA+RAMAN Amplifier

Item Unit Specification

1529 ~ 1561 (C band)
Working wavelength range Nm
1529~1568(CE band)

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Item Unit Specification

1570 ~ 1605 (L band)

Max. total output power dBm > 20

Noise coefficient dB <3

Polarization-related gain dB < 0.5

Input reflectance dB >40

Output reflectance dB >40

Max. bearable reflectance at input dB <-30

Max. bearable reflectance at output dB <-30

Gain flatness dB 1
Gain response time when channels
Ms < 10
are added or reduced (stable state)

Polarization-mode dispersion Ps < 0.5

The DRA_B board applies RAMAN amplifier to amplify the optical signals, and its
specifications are listed in Table 5-41.

Table 5-41 Performance Parameters of RAMAN_B amplifier

Item Unit Parameters

Type Inverse distributed pump

1529 ~ 1561 (C band)

Pump wavelength nm 1529~1568(CE band)
1570 ~ 1605 (L band)

Pump power mW 850

Total output power dBm 12

Band gain(G.652) dB 1-6

Noise figure dB <1

Polarization dependent loss dB <0.2

Input return loss dB >45

Output return loss dB >45

Gain flatness dB <4

Polarization mode dispersion ps <0.5

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Item Unit Parameters

Insertion loss dB <1.5

5.6.9 Specifications of RPOA Board

RPOA amplifier technical specifications are listed in Table 5-42.

Table 5-42 Technical specifications of RPOA amplifier

Item RPOA with GFF sub-system RPOA without GFF sub-system

Working
wavelength 1529~1561nm 1546~1561nm
range

Noise
<7dB <7dB
coefficient

Gain >17dB >17dB

Gain
<2dB <2dB
flatness

Total input
power -44～-18dBm -44～-18dBm
range

Total output
power -30～2dBm -34～8dBm
range

Working
-40～65°C （RGU）, -40～65°C (RGU)
temperature
-10～60°C（RPU） -10～60°C(RPU)
range

Storage
temperature -40～85°C -40～85°C
range
Notes: RPOA subsystems without Gain Flatness Filter (GFF) meet the requirements of systems with capacity below 16

wavelengths, while RPOA subsystems with GFF meet the requirements of systems with capacity of 40 wavelengths.

5.6.10 Specifications of LAC Board

Technical specifications of LAC board are listed in Table 5-43.

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Table 5-43 Technical Specifications of LAC Board

Item Unit Specification

1529~1561(C band)
Application wavelength range nm 1529~1568(CE band)
1570~1605(L band)

Input power detection range dBm -39 to +20

Output power detection range dBm -40 to +18

Optical power detection Precision dB ≤±0.5

Attenuation adjustment precision dB ≤±0.5

Attenuation adjustment step length dB ≤±0.2

Attenuation adjustment range dB ≥20

Attenuation adjustment rate dB ≤10

5.7 OTU Unit Specifications

This section describes the specifications of transponder boards, including the

transponders of 2.5Gbit/s, 10Gbit/s, 40Gbit/s and 100Gbit/s.

5.7.1 Specifications of 2.5Gbit/s Board

Client-side: Transmitting part of receiving end and receiving part of transmitting end.

Line-side: Receiving part of receiving end, transmitting part of transmitting end and
transmitting/receiving part of regenerator.

Technical specifications of 2.5Gbit/s board at Client-Side and Line-Side are listed in

Table 5-44 and Table 5-45.

Table 5-44 Technical specifications of 2.5Gbit/s Board at Client-side

Item Unit Parameter

Parameters of optical receive port at client side (S point)
Type of Receiver --- PIN

-12
Receiving sensitivity (BER10 ) dBm -18

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Item Unit Parameter

Max. reflection of Receiver dB <-27

Overload power dBm 0

Input signals wavelength range nm 1280~1625

Parameters of optical transmit port at client side (R point)
Mean launched Maximum 0
power
(near-end dBm
Minimum -5
optical port
S-16.1)
Mean launched Maximum 3
power
(near-end dBm
optical port Minimum -2

L-16.2)

Minimum extinction ratio dB 8.2

Compliance with ITU-T

Eye diagram -
G.957

Table 5-45 Technical specifications: of 2.5Gbit/s Board at Line-side

Item Unit Parameter

Parameters of optical transmit port at line side (Sn point)

Type of nominal light source --- DFB-LD

Max. -20dB 0.2(EA)

nm
spectral width 0.5(direct modulation)
Spectral
characteristics Min. side mode
suppression dB 35
ratio

Nominal
central THz 192.1-196.0
Central frequency
frequency Central
frequency GHz  12.5 (100 GHz spacing)
deviation

Mean Max. dBm 0

transmission Min. dBm -10

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Item Unit Parameter

power

+10(EA)
Min. extinction ratio dB
8.2 (direct modulation)

12800(EA)
Dispersion holding value ps/nm
6400 (direct modulation)

In compliance with ITU-T

Eye pattern mask ---
Recommendation G.957
Parameters of optical receive port at line side (Rn point)
Receiving sensitivity
-21(PIN)
dBm
-12 -28(APD)
(BER10 )

Max. reflection of Receiver dB <-27

0(PIN)
Overload power dBm
-9(APD)

Input signals wavelength range nm 1280~1565

Note 1: Mean transmitting power includes two types: long-haul optical interface and intra office interface.

5.7.2 Specifications of 10Gbit/s Board

Client-side: Transmitting part of receiving end and receiving part of transmitting end.

Line-side: Receiving part of receiving end, transmitting part of transmitting end and
transmitting/receiving part of regenerator.

Technical specifications of 10Gbit/s Board at Client-side and Line-side are listed in Table
5-46 and Table 5-47.

Table 5-46 Technical specifications of 10Gbit/s Board at Client-side

Item Unit Parameter

Parameters of optical receive port at client side (S point)

Type of Receiver --- PIN/APD

-14 PIN
-12
Receiving sensitivity (BER10 ) dBm
-21 APD

Max. reflection of Receiver dB <-27

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Item Unit Parameter

0 PIN
Overload power dBm
-9 APD

Input signals wavelength range nm 1280 ~ 1625

Parameters of optical transmit port at client side (R point)

Type of nominal light source --- MQW-DFB

Mean launched Maximum dBm -1
power (far-end
optical port Minimum dBm -5
S-64.2a)
Mean launched Maximum dBm 2
power (far-end
optical port Minimum dBm -1
S-64.2b)

Mean launched Maximum dBm -1

power
(near-end
Minimum dBm -5
optical
port I-64.2r)

Mean launched Maximum dBm -1

power
(near-end
Minimum dBm -6
optical
port I-64.1)

Min. extinction ratio dB 10/8.2

In compliance with ITU-T

Eye pattern mask ---
Recommendation G.691

Table 5-47 Technical specifications of 10Gbit/s Board at Line-side

Item Unit Parameter

Parameters of optical transmit port at line side (Sn point)

Type of nominal light source --- MQW-DFB

Max. -20dB
Spectral nm 0.3(NRZ)
spectral width
characteristics
Min. side mode dB 30

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Item Unit Parameter

suppression
ratio

Nominal
central THz ITU.T .694.1 compliant
frequency

Central
≤12.5 (spacing: 100 GHz)
frequency
Central GHz
deviation
frequency ≤5 (spacing: 50 GHz)
(EOL)

Central
≤10 (spacing: 100 GHz)
frequency
GHz
deviation
≤3(spacing: 50 GHz)
(BOL)

+1(NRZ)
Mean Max. dBm
-2(ERZ)
transmission
-3(NRZ)
power Min. dBm
-5(ERZ)

Chirp modulus --- 0.3 ~ 0.7

Min. extinction ratio dB +8.2

-300~800(NRZ)
Dispersion holding value ps/nm
400(ERZ)

In compliance with ITU-T

Recommendation
G.691(STM-64)
Eye pattern mask ---
In compliance with ITU-T
Recommendation
G.959.1(OTU2)
Parameters of optical receive port at line side (Rn point)

Receiving sensitivity PIN -14 (STM-64)

dBm
-12
(BER10 )
APD -21 (STM-64)

Max. reflection of Receiver dB <–27

0 (PIN)
Overload power dBm
-9 (APD)

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Item Unit Parameter

Input signals wavelength range nm 1280 ~ 1565

5.7.3 Specifications of 40Gbit/s Board

Client-side: Transmitting part of receiving end and receiving part of transmitting end.

Line-side: Receiving part of receiving end, transmitting part of transmitting end and
transmitting/receiving part of regenerator.

Technical specifications of 40Gbit/s Board at Client-side and Line-side are listed in Table
5-48 and Table 5-49.

Table 5-48 Technical specifications of 40Gbit/s Board at Client-side

Item Unit Specification

39.813 (NRZ), 39.813 (NRZ),

Bit rate (optical modulation mode) Gbps
43.018 43.018

P1I13D1 and
Optical interface category --- VSR2000-3R2
1I13D1F

Goal distance km 2 10

Parameters of optical receive port at client side (S point)

Frequency range nm 1280-1625 1280-1625

Sensitivity (BER=10–12) dBm -6 -7

Overload power(BER=10–12) dBm +3 +4

Receiver reflectance dB <-27 <-27

Parameters of optical transmit port at client side (R point)

Frequency range --- 1280-1625 1307–1317

Mean launched Maximum +3 +4

dBm
power Minimum 0 0

Minimum side mode compression

dB 35 35
ratio(SMCR)

Minimum extinction ratio dB 8.2 8.2

Complies with Complies with

Jitter transfer characteristics ---
GR-253, Issue GR-253, Issue

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4 4

Complies with Complies with

Eye diagram --- G.959.1 NRZ G.959.1 NRZ
40G 40G

Table 5-49 Technical specifications of 40Gbit/s Board at Line-side

Item Unit Specification

Optical signal modulation

- P-DPSK RZ-DQPSK
mode

Bit rate Gbps 44.6 44.6

Parameters of optical receive port at line side (Rn point)

Frequency range nm 1528 - 1568 1528 – 1568

Sensitivity (BER=1×10–12) dBm -18 -18

Minimum overload power

dBm 1 1
(BER=1×10–12)

Maximum input power

dBm 20 20
(damage)

Receiver reflectance dB <-27 <-27

Dispersion tolerance (including ps/n

-700~+700 -700~+700
TDC) m

Complies with Complies with

Jitter transfer characteristics -
G.8251 G.8251

FEC gain dB >8(AFEC) >8(AFEC)

Parameters of optical transmit port at line side (Sn point)

G694.1 compliant G694.1 compliant

Nominal central frequency THz

Maximum central frequency ≤±5 (100GHz) ≤±5 (100GHz)

GHz
offset (EOL) ≤±2.5 (50GHz) ≤±2.5 (50GHz)

Maximum central frequency ≤±3 (100GHz) ≤±3 (100GHz)

GHz
offset(BOL) ≤±1.5 (50GHz) ≤±1.5 (50GHz)

Mean launched Maximum +5 +5

dBm
power Minimum -5 -5

Launched power offset dB ±1 ±1

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Item Unit Specification

Maximum
Spectral
–20 dB nm 0.7 0.7
characteristics
bandwidth

Minimum side mode

dB 35 35
compression ratio (SMCR)

5.7.4 Specifications of 100Gbit/s Board

Client-side: Transmitting part of receiving end and receiving part of transmitting end.

Line-side: Receiving part of receiving end, transmitting part of transmitting end and
transmitting/receiving part of regenerator.

Technical specifications of 100Gbit/s Board at Client-side and Line-side are listed in

Table 5-50 and Table 5-51.

Table 5-50 Technical specifications of 100Gbit/s Board at Client-side

Item Unit Specification

100GE 4x25.78 100GE 4x25.78
Bit rate (optical modulation mode) Gbps
OTU4 4x27.95 OTU4 4x27.95

Optical interface category --- LR4 ER4

Target distance km 10 40

Parameters of optical receive port at client side (S point)

1294.53–1296.59 1294.53–1296.59
1299.02–1301.09 1299.02–1301.09

Frequency range nm 1303.54–1305.63 1303.54–1305.63

1308.09–1310. 1308.09–1310.
19 19

-8.6(PIN) -21.4(APD)
Sensitivity (BER=10–12) dBm (single (single
channel) channel)

+4.5 +4.5
Overload power(BER=10–12) dBm (single (single
channel) channel)

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Item Unit Specification

Receiver reflectance dB <-27 <-27

Parameters of optical transmit port at client side (R point)

+4.5 +2.9
Maximum (single (single
Mean output channel) channel)
dBm
power -4.3 -2.9
Minimum (single (single
channel) channel)

Minimum extinction ratio dB 4 8

Table 5-51 Technical specifications of 100Gbit/s Board at Line-side

Item Unit Specification

Optical signal modulation format - PM-QPSK

Bit rate Gbps 120

192.10~196.05(C band)
Frequency range THz
191.30~196.05 ( CE band)

Channel spacing GHz 50

Parameters of optical receive port at line side (Rn point)

Power sensitivity (BER=1×10–12) dBm -15

Minimum overload power

dBm 0
(BER=1×10–12)

OSNR sensitivity(B2B) dB 13

Dispersion tolerance ps/nm +/-50000

PMD tolerance ps 30

Receiver reflectance dB <-27

Jitter transfer characteristics - TBD

Parameters of optical transmit port at line side (Sn point)

Maximum central frequency offset GHz ±2.5

Transmitter output Maximum 0

dBm
power Minimum -5

Launched power offset dB ±1

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Maximum optical –3 dB 20
GHz
spectral Bandwidth
-15dB 60

Minimum side mode suppression

dB 35
ratio (SMSR)

Transmitter reflectance dB <-27

OTU jitter transfer characteristics

In ZXMP M820, the wavelength converter of the OTU has the same jitter transfer
characteristics with that of SDH regenerative repeater, which is compliant with ITU-T
G.825, G.958, and G.783 recommendation.

OTU input jitter tolerance

In ZXMP M820, the input jitter template that can be tolerated by the OTU input port is
complaint with ITU-T G.825, G.958, and G.783 Recommendation.

5.8 Service Convergence Technical Specifications

This section describes the specifications of convergence boards, including SRM41,

SRM42, MQT3, MX2, FCA, MOM2, GEM8, SDSA, DSAF, GEM2/GEMF, ASMA, TD2C,
MQA1, MQA2 and MJA.

5.8.1 Specifications of SRM41 Board

Table 5-52 Technical specifications of SRM41 board

Item Unit Specification

Parameters of optical receiving port at line side (Rn point)

-14 (PIN)
Receiving sensitivity dBm
-21 (APD)

Receiver reflection dB <-27

0 (PIN)
Overload power dBm
-9 (APD)

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Item Unit Specification

Wavelength area of input signals nm 1280-1625

Parameters of optical transmitting port at line side (Sn point)

Maximum –20 dB
nm 0.3
bandwidth
Spectral
Minimum side mode
characteristics
compression ratio dB 35
(SMCR)

192.10~196.05(C-band)
Nominal central
THz 191.30~196.075(CE-band)
frequency
Central 186.95~190.90(L-band)
frequency ≤ 12.5 (spacing: 100 GHz)
Central frequency
GHz ≤ 5 (spacing: 50 GHz)
offset
≤ 2.5G (spacing: 25 GHz)

Mean launched power dBm -4~+1(ERZ)/-3~+1(NRZ/SRZ)

Minimum extinction ratio dB 10

Dispersion tolerance ps/nm 800(NRZ)/400(ERZ/SRZ)

Eye diagram - Compliance with ITU-T G.959.1

Parameters of optical receiving port at client side (S point)

-18 (I-16)

-18 (S-16)

Receiving sensitivity dBm -27 (L-16.1)

-28 (L-16.2)

-27 (L-16.3)

Receiver reflection dB <-27

-3 (I-16)

Overload power dBm 0 (S-16)

-9 (L-16)

Wavelength area of input signals nm 1280-1625

Parameters of optical transmitting port at client side (R point)

-10 to -3 (I-16)

Mean launched power dBm -5 to 0 (S-16)

-2 to +3 (L-16)

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Item Unit Specification

Minimum extinction ratio dB 8.2

Eye diagram - Compliant with ITU-T G.957

5.8.2 Specifications of SRM42 Board

Table 5-53 Technical specifications of SRM42 Board

Item Unit Specification

Parameters of optical receiving port at line side (Rn point)

-18 (PIN)
Receiving sensitivity dBm
-28 (APD)

Receiver reflection dB <-27

0 (PIN)
Overload power dBm
-9 (APD)

Wavelength area of input signals nm 1280-1625

Parameters of optical transmitting port at line side (Sn point)

Maximum –20 dB 0.2 (EA)

nm
bandwidth 0.4 (DM)
Spectral
characteristics Minimum side mode
compression ratio dB 35
(SMCR)

192.10~196.05(C-band)
Nominal central
THz 191.30~196.075(CE-band)
frequency
Central 186.95~190.90(L-band)
frequency ≤ 12.5 (spacing: 100 GHz)
Central frequency offset GHz ≤ 5 (spacing: 50 GHz)
≤ 2.5 (spacing: 50 GHz)

Mean launched power dBm -10 to 0

10 (EA)
Minimum extinction ratio dB
8.2 (DM)

12800 (EA)
Dispersion tolerance ps/nm
3200 (DM)

Eye diagram - Compliance with ITU-T G.957

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Item Unit Specification

Parameters of optical receiving port at client side (S point)

-23 (I-4)

-18 (S-4)

-28 (L-4)
Receiving sensitivity dBm
-23 (I-1)

-28 (S-1)

-34 (L-1)

<-27 (S-4.2)

<-14 (L-4.1)

<-27 (L-4.2)
Receiver reflection dB
<-14 (L-4.3)

<-25 (L-1.2)

NA (others)

-8 (I-4)

-8 (S-4)

-8 (L-4)
Overload power dBm
-8 (I-1)

-8 (S-1)

-10 (L-1)

Wavelength area of input signals nm 1280-1625

Parameters of optical transmitting port at client side (R point)

-15 to -8 (I-4)

-15 to -8 (S-4)

-3 to +2 (L-4)
Mean launched power dBm
-15 to -8 (I-1)

-15 to -8 (S-1)

-5 to 0 (L-1)

8.2 (I-4)

8.2 (S-4)
Minimum extinction ratio dB
10 (L-4)

8.2 (I-1)

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Item Unit Specification

8.2 (S-1)

10 (L-1)

Eye diagram - Compliance with ITU-T G.957

5.8.3 Specifications of MQT3 Board

Table 5-54 Client-Side Technical specifications of MQT3 board

Item Unit Specification

Parameters of client-side optical receive port (S point)

-14 (I64.1)

-16 (S64.2b)
Receiver sensitivity (BER10-12) dBm
-14 (10GBASE-LR/LW)

-16 (10GBASE-ER/EW

<–14 (I64.1)

<–27 (S64.2b)
Receiver reflectance dB
<–14 (10GBASE-LR/LW)

<–27 (10GBASE-ER/EW)

0 (I64.1)

-1 (S64.2b)
Overload power dBm
0 (10GBASE-LR/LW)

-1 (10GBASE-ER/EW)

Wavelength range of receiving signal nm 1280-1625

Parameters of client-side optical transmitting port (R point)

-6 to -1 (I64.1)

-1 to 2 (S64.2b)
Mean launched power dBm
-6 to -1 (10GBASE-LR/LW)

-1 to 2 (10GBASE-ER/EW)

6 (I64.1)
Minimum extinction ratio dB
8.2 (S64.2b)

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Item Unit Specification

6 (10GBASE-LR/LW)

8.2 (10GBASE-ER/EW)

Eye diagram - Complies with ITU-T G.691

Table 5-55 Line-side Technical specifications of MQT3 Board

Item Unit Specification

Optical signal modulation mode - P-DPSK RZ-DQPSK

Bit rate Gbps 43.018 43.018

Parameters of line-side optical transmit port (Sn point)

192.10–196.05 (C
band) 192.10–196.05 (C
Frequency range THz
191.30–196.075 band)
(CE band)

Sensitivity (BER=1×10–12) dBm -18 -18

Minimum overload
dBm 0 0
(BER=1×10–12)

Max. reflectance dB <-27 <-27

Dispersion tolerance (including

ps/nm -700~+700 -700~+700
TDC)

Complies with Complies with

Jitter Transfer Characteristics -
ITU-T G.8251 ITU-T G.8251

FEC code gain dB >8 (AFEC) >8 (AFEC)

Parameters of line-side optical receive port (Rn point)

192.10–196.05 192.10–196.05
(C band) (C band)
191.30–196.075 191.30–196.075
(CE band) (CE band)
Nominal central frequency THz
186.95–190.90 186.95–190.90
(L band) (L band)

Wavelength spacing GHz 50 50

Maximum central frequency

GHz ±2.5 ±2.5
offset

Mean launched Maximum dBm +5 +5

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Item Unit Specification

power Minimum -5 -10

Launched power offset dB ±1 ±1

Maximum
Spectral
–20 dB GHz 0.7 0.7
characteristics
bandwidth

Minimum side mode

dB 35 35
compression ratio (SMCR)

5.8.4 Specifications of MX2 Board

Table 5-56 Client-Side Technical specifications of MX2 board

Item Unit Specification

Parameters of client-side optical receive port (S point)

-14 (I64.1)

-16 (S64.2b)
Receiver sensitivity (BER10-12) dBm
-14 (10GBASE-LR/LW)

-16 (10GBASE-ER/EW

<–14 (I64.1)

<–27 (S64.2b)
Receiver reflectance dB
<–14 (10GBASE-LR/LW)

<–27 (10GBASE-ER/EW)

0 (I64.1)

-1 (S64.2b)
Overload power dBm
0 (10GBASE-LR/LW)

-1 (10GBASE-ER/EW)

Wavelength range of receiving signal nm 1280-1625

Parameters of client-side optical transmitting port (R point)

-6 to -1 (I64.1)

-1 to 2 (S64.2b)
Mean launched power dBm
-6 to -1 (10GBASE-LR/LW)

-1 to 2 (10GBASE-ER/EW)

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Item Unit Specification

6 (I64.1)

8.2 (S64.2b)
Minimum extinction ratio dB
6 (10GBASE-LR/LW)

8.2 (10GBASE-ER/EW)

Eye diagram - Complies with ITU-T G.691

Table 5-57 Line-side Technical specifications of MX2 Board

Item Unit Specification

Optical signal modulation format - PM-QPSK

Bit rate Gbps 120

192.10~196.05(C band)
Frequency range THz
191.30~196.05 ( CE band)

Channel spacing GHz 50

Parameters of optical receive port at line side (Rn point)

Power sensitivity (BER=1×10–12) dBm -15

Minimum overload power

dBm 0
(BER=1×10–12)

OSNR sensitivity(B2B) dB 13

Dispersion tolerance ps/nm +/-50000

PMD tolerance ps 30

Receiver reflectance dB <-27

Jitter transfer characteristics - TBD

Parameters of optical transmit port at line side (Sn point)

Maximum central frequency offset GHz ±2.5

Transmitter output Maximum 0

dBm
power Minimum -5

Launched power offset dB ±1

Maximum optical –3 dB 20
GHz
spectral Bandwidth
-15dB 60

Minimum side mode suppression

dB 35
ratio (SMSR)

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Item Unit Specification

Transmitter reflectance dB <-27

5.8.5 Specifications of FCA Board

Table 5-58 Technical specifications of FCA Board

Item Unit Specification

Parameters of optical receive port at line side (Rn)

-14 (PIN)
Receiving sensitivity dBm
-21 (APD)

Receiver reflection dB <-27

0 (PIN)
Overload power dBm
-9 (APD)

Wavelength area of input signals nm 1280-1565

Parameters of optical transmit port at line side (Sn point)

Maximum –20 dB
nm 0.3
bandwidth
Spectral
Minimum side mode
characteristic
compression ratio dB 35
(SMCR)

Nominal central
THz 192.1-196.05
Central frequency
frequency ≤ 12.5 (spacing: 100 GHz)
Central frequency offset GHz
≤ 5 (spacing: 50 GHz)

Mean launched power dBm -4~+1(ERZ)/-3~+1(NRZ/SRZ)

Minimum extinction ratio dB 10

Dispersion tolerance ps/nm 800(NRZ)/400(ERZ/SRZ)

Eye diagram - Compliance with ITU-T G.957

Parameters of optical receive port at client side (S point)

FC dBm -18
Receiving
2GFC dBm -18
sensitivity
4GFC dBm -18

Overload power FC dBm 0

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Item Unit Specification

2GFC dBm 0

4GFC dBm 0

Parameters of optical transmit port at client side (R point)

FC dBm -4.5

Output power 2GFC dBm -4.5

4GFC dBm -4.5

5.8.6 Specifications of MOM2 Board

Table 5-59 Specification of MOM2 Board

Item Unit Specification

Parameters of optical receive port at line side (Rn point)

-14 (PIN)
Receiving sensitivity dBm
-21 (APD)

Receiver reflection dB <-27

0 (PIN)
Overload power dBm
-9 (APD)

Wavelength area of input signals nm 1280-1565

Parameters of optical transmit port at line side (Sn point)

Maximum –20 dB
nm 0.3
bandwidth
Spectral
Minimum side mode
characteristic
compression ratio dB 35
(SMCR)

Nominal central
THz 192.1-196.05
frequency
Central
≤ 12.5 (spacing: 100
frequency
Central frequency offset GHz GHz)
≤ 5 (spacing: 50 GHz)
-4~+1(ERZ)/-3~+1(NRZ/SR
Mean launched power dBm
Z)

Minimum extinction ratio dB 10

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Item Unit Specification

Dispersion tolerance ps/nm 800(NRZ)/400(ERZ/SRZ)

Compliance with ITU-T

Eye diagram -
G.957

Parameters of optical receive port at client side (S point)

FC -18

2GFC -18

4GFC -18
Receiving dBm
1000BASE-SX -17
sensitivity
1000BASE-LX -19

1000BASE-LH1 -20

1000BASE-ZX -22

FC 0

2GFC 0

4GFC 0
dBm
Overload power 1000BASE-SX 0

1000BASE-LX -3

1000BASE-LH1 -3

1000BASE-ZX -3

Parameters of optical transmit port at client side (R point)

FC -4.5

2GFC -4.5

4GFC -4.5
dBm
Output power 1000BASE-SX -9.5 to -3 (1000BASE-SX)

1000BASE-LX -11 to -3 (1000BASE-LX)

1000BASE-LH1 -4 to 0 (1000BASE-LH1)

1000BASE-ZX -2 to +3 (1000BASE-ZX)

5.8.7 Specifications of GEM8 Board

Table 5-60 Technical specifications of GEM8 Board

Item Unit Specification

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Item Unit Specification

Parameters of optical receive port at line side (Rn point)

-14 (PIN)
Receiving sensitivity dBm
-21 (APD)

Receiver reflection dB <-27

0 (PIN)
Overload power dBm
-9 (APD)

Wavelength area of input signals nm 1250-1620

Parameters of optical transmit port at line side (Sn point)

Maximum –20 dB
nm 0.3
Spectral bandwidth
characteristics Minimum side mode
dB 35
compression ratio (SMCR)

192.10~196.05(C-band)
Nominal central frequency THz
191.30~196.075(CE-band)
Central
≤ 12.5 (spacing: 100
frequency
Central frequency offset GHz GHz)
≤ 5 (spacing: 50 GHz)

Mean launched power dBm -5 to 0

Minimum extinction ratio dB 10

Dispersion tolerance ps/nm 800

Compliance with ITU-T

Eye diagram -
G.959.1

Parameters of optical receive port at client side (S point)

-17 (1000BASE-SX)
Receiving sensitivity dBm
-19 (1000BASE-LX)

0 (1000BASE-SX)
Overload power dBm
-3 (1000BASE-LX)

Parameters of optical transmit port at client side (R point)

-9.5 to -3 (1000BASE-SX)
Mean launched power dBm
-11 to -3 (1000BASE-LX)

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5.8.8 Specifications of SDSA Board

Table 5-61 Specification of SDSA Board

Item Unit Specification

Parameters of optical receive port at line side (Rn point)

-18 (PIN)
Receiving sensitivity dBm
-25 (APD)

Receiver reflection dB <-27

0 (PIN)
Overload power dBm
-9 (APD)

Wavelength area of input signals nm 1280-1565

Parameters of optical transmit port at line side (Sn point)

Maximum –20 dB 0.2 (EA)

nm
bandwidth 0.4 (DM)
Spectral
Minimum side mode
characteristic
compression ratio dB 35
(SMCR)

Nominal central 192.1-196.05 (C band)

THz
frequency 191.30~196.05 (CE band)
Central
≤ 12.5 (100 GHz
frequency Central frequency
GHz spacing)
offset
≤ 5 (50 GHz spacing)
Mean launched power dBm -10 to 0

10 (EA)
Minimum extinction ratio dB
8.2 (DM)
12800 (EA)/3200/6400
Dispersion tolerance ps/nm
(DM)

Compliance with ITU-T

Eye diagram -
G.957

Parameters of optical receive port at client side (S point)

-17 (1000BASE-SX)

-19 (1000BASE-LX)
Receiving sensitivity dBm
-20 (1000BASE-LH1)

-22 (1000BASE-ZX)

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Item Unit Specification

0 (1000BASE-SX)

-3 (1000BASE-LX)
Overload power dBm
-3 (1000BASE-LH1)

-3 (1000BASE-ZX)

Parameters of optical transmit port at client side (R point)

-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)
Mean launched power dBm
-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

5.8.9 Specifications of DSA Board

Table 5-62 Technical specifications of DSA Board

Item Unit Specification

Parameters of optical receive port at line side (Rn point)

-18 (PIN)
Receiving sensitivity dBm
-25 (APD)

Receiver reflection dB <-27

0 (PIN)
Overload power dBm
-2 (APD)

Wavelength area of input signals nm 1250-1620

Parameters of optical transmit port at line side (Sn point)

Maximum –20 dB 0.2 (EA)

nm
bandwidth 0.4 (DM)
Spectral
characteristic Minimum side mode
compression ratio dB 35
(SMCR)

Nominal central 192.10~196.05(C-band)

THz
Central frequency 191.30~196.075(CE-band)
frequency ≤ 12.5 (spacing: 100 GHz)
Central frequency offset GHz
≤ 5 (spacing: 50 GHz)

Mean launched power dBm -10 to 0

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Item Unit Specification

10 (EA)
Minimum extinction ratio dB
8.2 (DM)

Dispersion tolerance ps/nm 12800 (EA)/3200 (DM)

Eye diagram - Compliance with ITU-T G.957

Parameters of optical receive port at client side (S point)

-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

Receiving sensitivity dBm -22 (1000BASE-ZX)

-25 (100-SM-LL-L)

-20 (100-SM-LL-I)

-13 (100-M5-SL-I)

0 (1000BASE-SX)

-3 (1000BASE-LX)

-3 (1000BASE-LH1)

Overload power dBm -3 (1000BASE-ZX)

-3 (100-SM-LL-L)

-3 (100-SM-LL-I)

-1.3 (100-M5-SL-I)

Parameters of optical transmit port at client side (R point)

-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

Mean launched power dBm -2 to +3 (1000BASE-ZX)

-9 to -3 (100-SM-LL-L)

-12 to -3 (100-SM-LL-I)

-7.3 to +1.3 (100-M5-SL-I)

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5.8.10 Specifications of DSAF Board

Table 5-63 Technical specifications of DSAF Board

Item Unit Specification

Parameters of optical receiving port at line side (Rn point)

-21 (PIN)
Receiving sensitivity dBm
-25 (APD)

Receiver reflection dB <-27

0 (PIN)
Overload power dBm
-9 (APD)

Wavelength area of input signals nm 1250-1620

Parameters of optical transmitting port at line side (Sn point)

Maximum –20 dB 0.2 (EA)

nm
bandwidth 0.5 (DM)
Spectral
characteristics Minimum side mode
compression ratio dB 30
(SMCR)

Nominal central 192.10~196.05(C-band)

THz
Central frequency 191.30~196.075(CE-band)
frequency ≤ 12.5 (spacing: 100 GHz)
Central frequency offset GHz
≤ 5 (spacing: 50 GHz)

Mean launched power dBm -10 to 7

10 (EA)
Minimum extinction ratio dB
8.2 (DM)

12800 (EA)
Dispersion tolerance ps/nm
6500 (DM)

Eye diagram - Compliance with ITU-T G.957

Parameters of optical receiving port at client side (S point)

-17 (1000BASE-SX)

-19 (1000BASE-LX)
Receiving sensitivity dBm
-20 (1000BASE-LH1)

-22 (1000BASE-ZX)

Overload power dBm 0 (1000BASE-SX)

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Item Unit Specification

-3 (1000BASE-LX)

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)

Parameters of optical transmitting port at client side (R point)

-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)
Mean launched power dBm
-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

5.8.11 Specifications of GEM2/GEMF Board

Table 5-64 Technical specifications of GEM2/GEMF Board

Item Unit Specification

Parameters of optical receiving port at line side (Rn point)

-21 (PIN)
Receiving sensitivity dBm
-28 (APD)

Receiver reflection dB <-27

0 (PIN)
Overload power dBm
-9 (APD)

Wavelength area of input signals nm 1250-1620

Parameters of optical transmitting port at line side (Sn point)

Maximum –20 dB 0.2 (EA)

nm
bandwidth 0.4 (DM)
Spectral
characteristics Minimum side mode
compression ratio dB 35
(SMCR)

Nominal central 192.10~196.05(C-band)

THz
Central frequency 191.30~196.075(CE-band)
frequency ≤ 12.5 (spacing: 100 GHz)
Central frequency offset GHz
≤ 5 (spacing: 50 GHz)

Mean launched power dBm -10 to 0

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Item Unit Specification

10 (EA)
Minimum extinction ratio dB
8.2 (DM)

12800 (EA)
Dispersion tolerance ps/nm
3200 (DM)

Eye diagram - Compliance with ITU-T G.957

Parameters of optical receiving port at client side (S point)

-17 (1000BASE-SX)

-19 (1000BASE-LX)
Receiving sensitivity dBm
-20 (1000BASE-LH1)

-22 (1000BASE-ZX)

0 (1000BASE-SX)

-3 (1000BASE-LX)
Overload power dBm
-3 (1000BASE-LH1)

-3 (1000BASE-ZX)

Parameters of optical transmitting port at client side (R point)

-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)
Mean launched power dBm
-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

5.8.12 Specifications of ASMA Board

Table 5-65 Technical specifications of ASMA Board

Item Unit Specification

Parameters of WDM-side optical receive port (Rn point)

<-14 (PIN)
Receiver sensitivity dBm
<-21 (APD)

Receiver reflection dB <–27

>0 (PIN)
Overload power dBm
>-9 (APD)

Wavelength range of input signal nm 1280~1625

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Item Unit Specification

Parameters of WDM-side optical transmit port (Sn point)

Maximum -20 dB bandwidth nm 0.3

Minimum side mode suppression

dB 35
ratio

192.10~196.05 (C band)
Nominal central frequency THz
191.30~196.075 (CE band)

≤±12.5 (wavelength spacing:

100GHz)
Central frequency offset GHz
≤±5 (wavelength spacing:
50GHz)

Mean launched power dBm -3~+1(NRZ)

Minimum extinction ratio dB 10

Dispersion tolerance ps/nm 800

Comply with ITU-T G.691

Eye diagram -
Recommendation

Parameters of client-side optical receive port (S point)

<-17 (1000BASE-SX)

<-19 (1000BASE-LX)
Receiver sensitivity dBm
<-14 (10GBASE-LR)

<-15 (10GBASE-ER

>0 (1000BASE-SX)

>-3 (1000BASE-LX)
Overload power dBm
>0.5 (10GBASE-LR)

>-1 (10GBASE-ER)

Parameters of client-side optical transmit port (R point)

-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)
Mean launched power dBm
-8.2 to 0.5 (10GBASE-LR)

-4.7 to 4.0 (10GBASE-ER)

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5.8.13 Specifications of TD2C Board

Table 5-66 Technical specifications of TD2C board

Item Unit Specification

Parameters of input port (S point)

-14 (I64.1)

-16 (S64.2b)

Receiving sensitivity (BER10-12) dBm -12.6 (10GBASE-LR/LW)

-14.1 (10GBASE-ER/EW)

-14 (1200-SM-LL-L)

0 (I64.1)

-1 (S64.2b)

Overload power dBm 0 (10GBASE-LR/LW)

-1 (10GBASE-ER/EW)

0 (1200-SM-LL-L)

Wavelength of input signals nm 1280 to 1565

Parameters of output port (Sn point)

Maximum bandwidth @ -20 dB nm 0.3

Minimum side mode compression ratio

dB 35
(SMCR)

Nominal central frequency THz 192.1 to 196.0

≤±12.5 (spacing: 100

Central frequency offset GHz
GHz)

Mean launched power dBm -3 to +1

Minimum extinction ratio dB 8.2

Dispersion tolerance ps/nm 800 (G.652)

Eye diagram - ITU-T G.691

Parameters of input port (Rn point)

-14 (PIN)
Receiving sensitivity (BER10-12) dBm
-21 (APD)

Receiver reflection dB <-27

Overload power dBm 0 (PIN)

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Item Unit Specification

-9 (APD)

Wavelength area of input signals nm 1280 to 1565

Parameters of output port (R point)

-6 ~ -1 (I64.1)

-1 ~ 2 (S64.2b)

-8.2 ~ 0.5
Mean launched power dBm (10GBASE-LR/LW)

-4.7 ~ 4
(10GBASE-ER/EW)

-6 ~ -1 (1200-SM-LL-L)

6 (I64.1)

8.2 (S64.2b)

Minimum extinction ratio dB 6 (10GBASE-LR/LW)

8.2 (10GBASE-ER/EW)

6 (1200-SM-LL-L)

Compliance with ITU-T

Eye diagram -
G.691

5.8.14 Specifications of MQA1 Board

Table 5-67 Technical specifications of MQA1 board

Item Unit Specification

Parameters of input port (S point)

-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)
Receiving sensitivity dBm
-22 (1000BASE-ZX)

-19 (100-SM-LL-I)

-20 (200-SM-LL-I)

0 (1000BASE-SX)
Overload power dBm
-3 (1000BASE-LX)

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Item Unit Specification

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)

-3 (100-SM-LL-I)

0 (200-SM-LL-I)

Parameters of output port (Sn point)

Light source type

Maximum bandwidth @ -20 dB nm 0.4

Minimum side mode compression ratio

dB 30
(SMCR)

192.1 to 196.0
Nominal central frequency THz
(spacing: 100 GHz)

Central frequency offset GHz ≤±12.5 (spacing: 100 GHz)

Mean launched power dBm 0~5

Minimum extinction ratio dB 8.2

Dispersion tolerance ps/nm 3600

Compliance with ITU-T

Eye diagram -
G.957

Parameters of input port (Rn point)

-18 (PIN)
Receiving sensitivity (BER10-12) dBm
-25 (APD)

Receiver reflection dB <-27

0 (PIN)
Overload power dBm
-9 (APD)

Wavelength area of input signals nm 1280 to 1565

Parameters of output port (R point)

-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)
Mean launched power dBm
-2 to +3 (1000BASE-ZX)

-11 to -3 (100-SM-LL-I)

-12 to -3 (200-SM-LL-I)

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5.8.15 Specifications of MQA2 Board

Table 5-68 Technical specifications of MQA2 Board

Item Unit Specification

Parameters of input port (S point)

FC -18

2G FC -18
Receiving sensitivity dBm
4G FC -18

GE -19

1G FC 0

2G FC 0
Overload power dBm
4G FC 0

GE -3

Parameters of output port (Sn point)

Maximum bandwidth @ -20 dB nm 0.3

Minimum side mode compression ratio

dB 35
(SMCR)

Nominal central frequency THz 192.1 to 196.0

Central frequency offset GHz ≤±12.5 (spacing: 100 GHz)

Mean launched power dBm -3 to +1

Minimum extinction ratio dB 8.2

ps/n
Dispersion tolerance 800 (G.652)
m

Compliance with ITU-T

Eye diagram -
G.691

Parameters of input port (Rn point)

-14 (PIN)
Receiving sensitivity dBm
-21 (APD)

Receiver reflection dB <-27

0 (PIN)
Overload power dBm
-9 (APD)

Wavelength of input signals nm 1280 to 1565

Parameters of output port (R point)

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Item Unit Specification

1G FC -4.5

2G FC -4.5
Mean launched power dBm
4G FC -4.5

GE -11~0

5.8.16 Specifications of MJA Board

Table 5-69 Technical specifications of MJA board

Item Unit Specification

Parameters of input port (S point)

-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)
Receiving sensitivity dBm
-22 (1000BASE-ZX)

-19 (100-SM-LL-I)

-20 (200-SM-LL-I)

0 (1000BASE-SX)

-3 (1000BASE-LX)

-3 (1000BASE-LH1)
Overload power dBm
-3 (1000BASE-ZX)

-3 (100-SM-LL-I)

0 (200-SM-LL-I)

Parameters of output port (R point)

-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)
Mean launched power dBm
-2 to +3 (1000BASE-ZX)

-11 to -3 (100-SM-LL-I)

-12 to -3 (200-SM-LL-I)

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5.9 Electrical Cross-connection Subsystem

Specifications

5.9.1 Specifications of CH1 Board

Table 5-70 Technical specifications of CH1 Board

Item Unit Specification

Parameters of optical receiving port (S point) at client side

-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

-22 (1000BASE-ZX)

-25 (100-SM-LL-L)

-20 (100-SM-LL-I)
-12
Receiving sensitivity (BER10 ) dBm
-13 (100-M5-SL-I)

-18 (I-16)

-18 (S-16.1)

-18 (S-16.2)

-27 (L-16.1/L-16.2/L-16.3)

-27 (L-16.1/L-16.2/L-16.3)

0 (1000BASE-SX)

-3 (1000BASE-LX)

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)

-3 (100-SM-LL-L)

Overload power dBm -3 (100-SM-LL-I)

-1.3 (100-M5-SL-I)

-3 (I-16)

0 (S-16.1)

0 (S-16.2)

-9 (L-16.1/L-16.2/L-16.3)

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Item Unit Specification

-9 (L-16.1/L-16.2/L-16.3)

Parameters of optical transmit port (R point) at client side

-9.5 ~ -3 (1000BASE-SX)

-11 ~ -3 (1000BASE-LX)

-4 ~ 0 (1000BASE-LH1)

-2 ~ 3 (1000BASE-ZX)

-9 ~ -3 (100-SM-LL-L)

-12 ~ -3 (100-SM-LL-I)

-7.3 ~ 1.3 (100-M5-SL-I)

Average optical transmit power dBm
-10 ~ -3 (I-16)

-5 ~ 0 (S-16.1)

-5 ~ 0 (S-16.2)

-2 ~ 3
(L-16.1/L-16.2/L-16.3)

-2 ~ 3
(L-16.1/L-16.2/L-16.3)

5.9.2 Specifications of CO2 Board

Table 5-71 Technical specifications of CO2 board

Item Unit Specification

Parameters of optical receiving port (S point) at client side

-14 (I-64.1)

-16.5 (S-64.2b)
-12
Receiving sensitivity (BER10 ) dBm -24 (L-64.2c)

-14 (10GBASE-LR/LW)

-16 (10GBASE-ER/EW)

-1 (I-64.1)

-1 (S-64.2b)
Overload power dBm
-9 (L-64.2c)

0 (10GBASE-LR/LW)

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Item Unit Specification

-1 (10GBASE-ER/EW)

Parameters of optical transmit port (R point) at client side

-5 ~ -1 (I-64.1)

0~2 (S-64.2b)

Average optical transmit power dBm -1 ~ 4 (L-64.2c)

-6~ -1 (10GBASE-LR/LW)

-1 ~ 2 (10GBASE-ER/EW)

5.9.3 Specifications of CQ2 Board

Table 5-72 Technical specifications of CQ2 board

Item Unit Specification

Parameters of optical receiving port (S point) at client side

-14 (I-64.1)

-16.5 (S-64.2b)
-12
Receiving sensitivity (BER10 ) dBm -24 (L-64.2c)

-14 (10GBASE-LR/LW)

-16 (10GBASE-ER/EW)

-1 (I-64.1)

-1 (S-64.2b)

Overload power dBm -9 (L-64.2c)

0 (10GBASE-LR/LW)

-1 (10GBASE-ER/EW)

Parameters of optical transmit port (R point) at client side

-5 ~ -1 (I-64.1)

0~2 (S-64.2b)

Average optical transmit power dBm -1 ~ 4 (L-64.2c)

-6~ -1 (10GBASE-LR/LW)

-1 ~ 2 (10GBASE-ER/EW)

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5.9.4 Specifications of CS3 Board

Table 5-73 Technical specifications of CS3 board

Item Unit Specification

Parameters of optical receiving port (S point) at client side

Frequency range nm 1280 ~1625

Sensitivity (BER  1×10–12) dBm -6

Overload power dBm 3

Maximum reflectance dB 27

Ps/n
Chromatic Dispersion tolerance -10 ~ 60
m

Mean DGD tolerance ps 2.5

Parameters of optical transmit port (R point) at client side

Mean output power dBm 0~3

ITU-T G.693
VSR2000-3R2/3/5 compliant
Frequency range (STM-256)
G.959.1 P1S1 3C2/3/5
compliant (OTU3)

Minimum SMSR dB 35

jitter performance Conform to G.8251

Conform to G.959.1 NRZ

Eye Mask
40G

5.9.5 Specifications of CD3 Board

Table 5-74 Technical specifications of CD3 Board for 40GBASE-LR4

Item Unit Specification

Parameters of optical receiving port (S point) at client side

Signaling rate, each lane (range) GBd 10.3125 ± 100 ppm

1264.5 to 1277.5
Lane wavelengths (range) nm 1284.5 to 1297.5
1304.5 to 1317.5

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Item Unit Specification

1324.5 to 1337.5

Damage threshold a (min) dBm 3.3

Average receive power, each lane (max)

dBm 2.3

Average receive power, each lane b (min) dBm -13.7

Receive power, each lane (OMA) (max) dBm 3.5

Difference in receive power between any

dB 7.5
two lanes (OMA) (max)

Receiver reflectance (max) dB -26

Receiver sensitivity (OMA), each lane c

dBm -11.5
(max)

Receiver 3 dB electrical upper cutoff

GHz 12.3
frequency, each lane (max)

Stressed receiver sensitivity (OMA),

dBm -9.6
each lane d (max)

Conditions of stressed receiver sensitivity test:

Vertical eye closure penalty, e each lane dB 1.9

Stressed eye J2 Jitter, e each lane UI 0.3

Stressed eye J9 Jitter, e each lane UI 0.47

Parameters of optical transmit port (R point) at client side

Signaling rate, each lane (range) dB 10.3125 ± 100 ppm

1264.5 to 1277.5
1284.5 to 1297.5
Lane wavelengths (range) dBm
1304.5 to 1317.5
1324.5 to 1337.5

Side-mode suppression ratio (SMSR),

dBm 30
(min)

Total average launch power (max) dBm 8.3

Average launch power, each lane (max) dBm 2.3

Average launch power, each lane a (min) dBm -7

Optical Modulation Amplitude (OMA),

dBm 3.5
each lane (max)

Optical Modulation Amplitude (OMA), dBm -4

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Item Unit Specification

each lane (min)b

Difference in launch power between any

dB 6.5
two lanes (OMA) (max)

Launch power in OMA minus TDP, each

dBm -4.8
lane (min)

Transmitter and dispersion penalty

dB 2.6
(TDP), each lane (max)

Average launch power of OFF

dBm -30
transmitter, each lane (max)

Extinction ratio (min) dB 3.5

RIN20OMA (max) dB/Hz -128

Optical return loss tolerance (max) dB 20

Transmitter reflectance c (max) dB -12

Transmitter eye mask definition {X1, X2, {0.25, 0.4, 0.45, 0.25, 0.28,
X3, Y1, Y2, Y3} 0.4}

Receiver side note:

a The receiver shall be able to tolerate, without damage, continuous exposure to an optical input
signal having this average power level
b Average receive power, each lane (min) is informative and not the principal indicator of signal
strength. A received power below this value cannot be compliant; however, a value above this does
not ensure compliance.
c Receiver sensitivity (OMA), each lane (max) is informative.
d Measured with conformance test signal at TP3 (see 87.8.11) for BER = 10–12.
e Vertical eye closure penalty, stressed eye J2 Jitter, and stressed eye J9 Jitter are test conditions
for measuring stressed receiver sensitivity. They are not characteristics of the receiver.
Transmit side note:
a Average launch power, each lane (min) is informative and not the principal indicator of signal
strength. A transmitter with launch power below this value cannot be compliant; however, a value
above this does not ensure compliance.
b Even if the TDP < 0.8dB, the OMA (min) must exceed this value.
c
Transmitter reflectance is defined looking into the transmitter.

Table 5-75 Technical specifications of CD3 board for 40G POS

Item Unit Specification

Parameters of optical receiving port (S point) at client side

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Item Unit Specification

Frequency range nm 1280 ~1625

Sensitivity (BER  1×10–12) dBm -6

Overload power dBm 3

Maximum reflectance dB 27

Ps/n
Chromatic Dispersion tolerance -10 ~ 60
m

Mean DGD tolerance ps 2.5

Parameters of optical transmit port (R point) at client side

Mean output power dBm 0~3

ITU-T G.693
VSR2000-3R2/3/5 compliant
Frequency range (STM-256)
G.959.1 P1S1 3C2/3/5
compliant (OTU3)

Minimum SMSR dB 35

jitter performance Conform to G.8251

Conform to G.959.1 NRZ

Eye Mask
40G

5.9.6 Specifications of LO2 Board

Table 5-76 Technical specifications of LO2 card

Item Unit Specification

Parameters of optical receiving port (Rn point) at line side

-14 (PIN)
-12
Receiving sensitivity (BER10 ) dBm
-21 (APD)

Maximum reflectance dB -27

0 (PIN)
Overload power dBm
-9 (APD)

Wavelength range of input signals nm 1280 ~ 1565

Parameter of transmitter at line side Sn point

Spectrum Maximum -20 dB nm 0.3

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Item Unit Specification

characteristics spectrum width

Minimum side mode

compression ratio dB 35
(SMCR)

Central frequency THz 192.10~196.05

≤ 12.5 (spacing: 100

Central Central frequency
GHz GHz)
frequency offset
≤ 5 (spacing: 50 GHz)

Average optical transmit power dBm -5 ~ -1

Minimum extinction ratio dB 10

Dispersion tolerance ps/nm 800

Eye diagram template - Comply with ITU-T G.691

5.9.7 Specifications of LO2B Board

Table 5-77 Technical specifications of LO2B card

Item Unit Specification

Parameters of optical receiving port (Rn point) at line side

-12
Receiving sensitivity (BER10 ) dBm -15

Maximum reflectance dB -27

Overload power dBm -0.5

Wavelength range of input signals nm 1290 ~ 1565

Parameter of transmitter at line side Sn point

Maximum -20 dB
nm 0.3
spectrum width
Spectrum
Minimum side mode
characteristics
compression ratio dB 35
(SMCR)

Central frequency THz 192.10~196.05

Central
Central frequency GHz ≤ 12.5 (spacing: 100
frequency

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Item Unit Specification

offset GHz)
≤ 5 (spacing: 50 GHz)

Average optical transmit power dBm -3 ~0

Minimum extinction ratio dB 9.5

Dispersion tolerance ps/nm -600~800

Eye diagram template - Comply with ITU-T G.959.1

5.9.8 Specifications of LQ2 Board

Table 5-78 Technical specifications of LQ2 board

Item Unit Specification

Parameters of optical receiving port (Rn point) at line side

-14 (PIN)
-12
Receiving sensitivity (BER10 ) dBm
-21 (APD)

Maximum reflectance dB -27

0 (PIN)
Overload power dBm
-9 (APD)

Wavelength range of input signals nm 1280 ~ 1565

Parameter of transmitter at line side Sn point

Maximum -20 dB
nm 0.3
spectrum width
Spectrum
Minimum side mode
characteristics
compression ratio dB 35
(SMCR)

Central frequency THz 192.10~196.05

≤ 12.5 (spacing: 100

Spectrum Central frequency
GHz GHz)
characteristics offset
≤ 5 (spacing: 50 GHz)

Average optical transmit power dBm -5 ~ -1

Minimum extinction ratio dB 10

Dispersion tolerance ps/nm 800

Eye diagram template - Comply with ITU-T G.691

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5.9.9 Specifications of LD2B Board

Table 5-79 Technical specifications of LD2B board

Item Unit Specification

Parameters of optical receiving port (Rn point) at line side

-14 (PIN)
Receiving sensitivity
-12
(BER10 ) dBm
-21 (APD)

Maximum reflectance dB -27

0 (PIN)
Overload power dBm
-9 (APD)

Wavelength range of input signals nm 1280 ~ 1565

Parameter of transmitter at line side Sn point

Maximum -20 dB 0.3(NRZ)

nm
spectrum width 0.4(SRZ, RZ)
Spectrum
characteristics Minimum side mode
compression ratio dB 35
(SMCR)

Central frequency THz 192.10~196.05

≤ 12.5 (spacing: 100

Spectrum Central frequency
GHz GHz)
characteristics offset
≤ 5 (spacing: 50 GHz)

+1~-4(ERZ)
Average optical transmit power dBm
+1 ~-3(NRZ/SRZ)

Minimum extinction ratio dB 10

Dispersion tolerance ps/nm 800(NRZ)/400(ERZ/SRZ)

Eye diagram template - Comply with ITU-T G.691

5.9.10 Specifications of LS3 Board

Table 5-80 Technical specifications of LS3 board

Item Unit Specification

Optical signal modulation

- P-DPSK RZ-DQPSK
mode

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Item Unit Specification

Bit rate Gbps 43.018 43.018

Parameters of optical receive port at line side (Rn point)

192.10~196.05(C
band) 192.10~196.05(C
Frequency range THz
191.30~196.075 band)
( CE band)

Sensitivity (BER=1×10–12) dBm -18 -18

Minimum overload power

dBm 0 0
(BER=1×10–12)

Receiver reflectance dB <-27 <-27

Dispersion tolerance (including ps/n

-700~+700 -700~+700
TDC) m

Complies with Complies with

Jitter transfer characteristics -
G.8251 G.8251

FEC gain dB >8(AFEC) >8(AFEC)

Parameters of optical transmit port at line side (Sn point)

192.10~196.05(C 192.10~196.05(C
band) band)
191.30~196.075 191.30~196.075
( CE band) ( CE band)
Nominal central frequency THz
186.95~190.90(L 186.95~190.90(L
band) band)

Channel spacing GHz 50 50

Maximum central frequency

GHz ±2.5 ±2.5
offset

Mean launched Maximum +5 +5

dBm
power Minimum -5 -10

Launched power offset dB ±1 ±1

Maximum
Spectral
–20 dB nm 0.7 0.7
characteristics
bandwidth

Minimum side mode

dB 35 35
compression ratio (SMCR)

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5.10 Tributary overhead processing of convergence

board

Convergence board processes segment overhead bytes at each tributary in accordance

with the following table. OTU2 signal at the line can supervise FEC error, uncorrectable
error and SM-BIP8.

Table 5-81 Tributary overhead processing of convergence board

Overhead
byte at
Processing mode
tributary
segment

Frame localization bytes A1 and A2 at each tributary are regenerated

A1, A2
to ensure proper frame encapsulation.

B1 B1 at each tributary are terminated.

If B2 at the line are not modified at multiplexing segment, bit error

B2
information of B2 will be transmitted transparently. Otherwise, the
de-multiplexer will write the information into B2 at related tributary.

D1~D12 They ensure transparency of DCC channel at each tributary.

They ensure transparency of order wire channel at each tributary,

E1,E2
that is, transparency of E1 and E2.

F1 It ensures transparency of F byte at each tributary.

It can supervise J0 at each tributary and ensure transparent

J0
transmission.

After multiplexed and de-multiplexed by transparent sub-rate

multiplexer, APS byte K1 and K2 at each tributary retain accuracy of
K1,K2
original state, transparent sub-rate multiplexer do not affect services
protection at each tributary.

When S1 at each tributary is terminated, new clock is calculated

S1 again and used. Line interface of transparent sub-rate multiplexer
should support SSM function (processed as SDH equipment).

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5.11 OS Channel (SOSC) Unit Specifications

The SOSC interface technical specifications of ZXMP M820 are listed in Table 5-82

Table 5-82 Technical specifications of SOSC Board

Item Unit Specification

Optical signal type 100BASE-FX

Operating wavelength nm 1510±10

Signal code 4B/5B

Supervision rate 100

Signal transmission power dBm -5 to 0 -1 to 6 ≥+4

Minimum receiving sensitivity dBm -34 -35 -43

5.12 Supervision Unit Specifications

In ZXMP M820 system, each DWDM TM, de-multiplexer and optical amplifier provide
service supervision interface SC/PC to supervise active optical channel in real time
without disconnecting services. Optical power difference between supervision interface
and active optical channel can be found in the following Table 5-83

Table 5-83 Technical specifications of supervision unit at boards

Division ratio at input Division ratio at output supervision

Board
supervision interface interface

OMU None 2.5%

ODU 2.5% None

OCI 0.5% 2.5%

OBM 2.5% 0.5%

0.1% for 24dBm output OA, and 0.5%

OA None
for others

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5.13 Dispersion Compensation Unit Specifications

Dispersion compensation fiber is located before EOBA, EOPA and EOLA. When
EOPA+EOBA mode and EONA are adopted, DCM is between them.

Broadband dispersion compensation fiber is used to compensate optical channel

dispersion, which is a negative value just like slope. Slope compensation rate is up to
90%~110%.

Table 5-84 Technical specifications of dispersion compensation Board

Maximum insertion loss

Item DGD(ps)
Unit Parameter

20km dB 2.5 <0.6

40km dB 4 <0.8
Maximum insertion loss
60km dB 6 <1.0
& DGD
80km dB 7 <1.1
G.652 fiber
100km dB 8 <1.2

120km dB 10 <1.2

20km dB 2 <0.45

40km dB 4 <0.60
Maximum insertion loss
60km dB 5 <0.75
& DGD
80km dB 6 <0.80
G.655 fiber
100km dB 7 <0.90

120km dB 8 <1.0

5.14 Dispersion compensation unit (DCU) Performance

Indices

The DCU interface technical specifications of ZXMP M820 are listed in Table 5-85

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Table 5-85 Main technical specifications of DCU Board

Item Unit Specification

Optical input power dBm -14 ~ +2

Dispersion adjustment range GHz +/- 700

5.15 Physical Performance

5.15.1 Structure Indices

The dimensions and weight of ZXMP M820 are shown in Table 5-86 and Table 5-87

Table 5-86 Dimensions and Weight of ZXMP M820

Weight
Components Dimensions
(kg)

2,000 mm (H) × 600 mm (W) × 300 mm (D) 58.50

Unified cabinets of ZTE
2,200 mm (H) × 600 mm (W) × 300 mm (D) 64.50
transmission equipment
2,600 mm (H) × 600 mm (W) × 300 mm (D) 76.00

sub-rack ( 21 inch ) 422 mm (H) × 533mm (W) × 286 mm (D) 12.50

sub-rack ( 19 inch ) 422 mm (H) × 473mm (W) × 286 mm (D) 11.20

CX4 447 mm (H) x 535 mm (W) x 275 mm (D) 18

CX20 447 mm (H) x 535 mm (W) x 275 mm (D) 18

CX22 447 mm (H) x 535 mm (W) x 275 mm (D) 18

Power supply distribution

88.1 (height) × 535 (width) × 258 (depth) 3.8
box

ODF sub-rack 88 mm (H) × 482.6 mm (W) × 269.5 mm (D) 6.50

DCM chassis 47 mm (H) × 533 mm (W) × 286.5 mm (D) 5.60

Conversion bracket 29.6mm (H) × 345.6mm (W) 0.30

Fan unit 30 mm (H) × 122.9 mm(W) × 276.8mm(D) 0.68

PCB:320 mm (W) × 210 mm (D)

Full-height board --
Front panel: 345.6 mm (H) × 29.8 mm (W)

Compact board PCB:152 mm (W) × 210 mm (D) --

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Weight
Components Dimensions
(kg)

Front panel: 155.6 mm (H) × 25.1 mm (W)

Note: The cabinet weight refers to the empty cabinet.

Table 5-87 ZXMP M820 Board Weight

Board ID Board Description Weight (kg)

SNP Compact Node Process Board 0.60

Compact Communication Control

SCC 0.47
Board

CCP Subrack Management Board 0.7

FCC Fan Board 3.6

PWD Power Supply Board 1.05

Compact Optical Supervision

SOSC 0.60
Channel Board

Optical supervision channel board for Fast

SOSCB 0.5
Ethernet

TIS Time interface supply card 0.5

XCA Switching Board 1.85

Compact Optical Group

SOGMD 0.60
Mux/DeMux Board

Compact Optical
SOAD1 Adding/Dropping Board of 1 0.60
Wavelength

Compact Optical
SOAD2 Adding/Dropping Board of 2 0.60
Wavelength

Compact Optical
SOAD4 Adding/Dropping Board of 4 0.60
Wavelength

Compact Optical Protection

SOP 0.60
Board

SOPCS Compact Optical Protection 0.60

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Board ID Board Description Weight (kg)

Board for Channel Section

Compact Optical Protection

SOPMS 0.60
Board for Mux Section

Compact Supervisory Division

SSDM 0.60
Multiplexing Board

Compact Power Supply Board

SPWA 1.80
(A-type)

SEIA Compact Extension Interface Board 0.45

SFANA Compact Fan Board 0.68

OTU Optical Transparent Unit 1.55

Compact Optical Transponder

SOTU2.5G 0.60
Unit for 2.5 Gbit/s

SOTU10G Compact OTU 10Gb/s Transceiver 0.70

OTU10G Optical Transponder Unit for 10Gb/s 1.65

Enhanced Optical Transponder Unit for 10

EOTU10G 1.65
Gbit/s

Type B Enhanced Optical Trans-

EOTU10GB 1.65
ponder Unit for 10 Gbit/s

TST3 (using DPSK

Optical Transponder Unit for 40Gb/s 3.5
module)

TST3 (using DQPSK

Optical Transponder Unit for 40Gb/s 3.3
module)

Single-channel 100Gb/s Optical Channel

TS4 5.5
Transport Unit

Single-channel 100Gb/s Optical Channel

TS4(Regeneration) 5
Transport Unit

MQT3 (using DPSK

Four 10G Sub Rate Mux Board 3.25
module)

MQT3 (using
Four 10G Sub Rate Mux Board 3.05
DQPSK module)

MX2 Ten 10G SubRate Mux Unit 3.5

SDSA Compact Data Service Aggregation Board 0.6

DSAF Data Service Aggregation with FEC 1.4

DSA Data Service Aggregation Board 1.6

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Board ID Board Description Weight (kg)

Gigabit Ethernet Mux Board with

GEMF 1.50
FEC

GEM2 Two Gigabit Ethernet Mux Board 1.50

GEM8 Eight Gigabit Ethernet Mux Board 2.05

FCA FC service Access unit 1.5

MOM2 Eight GE/FC Muxponder 1.5

Four 622 M/155 M SubRate Mux

SRM42 1.25
Board

SRM41 Four 2.5 G SubRate Mux Board 1.25

Type A Convergence Switching

ASMA 0.6
Board

CS3 Client board for Single OTU3 1.4

CD3 Client board for Double OTU3 2.325

CO2 Client board for 8*OTU2 2.1

CQ2 Client board for 4*OTU2 1.8

CH1 Client board for 16*GE or 8*OTU1 1.075

LS3(2 slots) Line board for single OTU3( 2 slots) 3.25

LS3(DPSK)(1 slot) Line board for single OTU3 (1slot) 2.225

LS3(DQPSK)(1 slot) Line board for single OTU3 (1slot) 2.32

LO2 Line board for 8*OTU2 2.1

LQ2 Line board for 4*OTU2 1.8

LD2B Line board for 2*OTU2 1.95

TD2C Transponder of 2 ports 10Gb/s 0.7

MQA2 Muxponder of 4 ports any rate to OTU2 0.6

MQA1 Muxponder of 4 ports any rate to OTU1 0.6

Muxponder of 6 ports any rate to main

MJA 0.5
board

EOBA Enhanced Optical Booster Amplifier 1.80

EOPA Enhanced Optical Pre-Amplifier 1.80

EOLA Enhanced Optical Line Amplifier 1.80

EONA Enhanced Optical Node Amplifier 2.00

SEOBA Enhanced Optical Booster Amplifier 0.60

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Board ID Board Description Weight (kg)

SEOPA Enhanced Optical Pre-Amplifier 0.60

SEOLA Enhanced Optical Line Amplifier 0.60

DRA_P Distributed Raman Amplifier 2.00

DRA_B 2.00

LAC Line Attenuation Compensator 1.10

DSA Data Service Aggregation Board 1.60

DSAC Data Service Aggregation Board 0.6

SAUC SDH Service Access Unit 0.6

OMU Optical Multiplexing Unit 1.60

ODU Optical De-Multiplexing Unit 1.60

ODUB Optical De-Multiplexing Unit(B Type) 1.60

OCI Optical Channel Interleaver 1.95

VMUX Variable Insertion Loss Multiplexer 2.10

VMUXB Variable Insertion Loss Multiplexer(B Type) 2.10

PDU Power Distribution Unit 1.40

WBU Wavelength Blocking Unit 2.60

WSU Wavelength Selective Unit 2.60

WBM Wavelength Blocking Multiplexer 2.10

OMCP Optical Multi-Channel Protection 1.25

OPM Optical Performance Monitor 1.15

Enhanced Optical Channel Performance

EOPM 0.96
Monitor

OWM Optical Wavelength Monitor 1.10

Enhanced Optical Wavelength Monitor

EOWM 0.9
Board

RPU Remote Pump Unit 2.00

RGU Remote Gain Unit 0.50

DCU Dispersion Compensation Board 0.55

Enhanced Optical Wavelength Monitor

EOWM 0.90
Board

Enhanced Optical Channel

EOPM 0.96
Performance Monitor

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5.15.2 Bearing Requirements of the Equipment Room

The bearing capability of the equipment room should be over 450 kg/m2 in case of only
considering ZXMP M820.

5.15.3 Power Supply Indices

Voltage requirements

Input voltage: -48 VDC

Allowable fluctuation range: -60 V ~ -36 V

Power consumption requirements

The power consumption of each board and unit in ZXMP M820 is illustrated in Table
5-88.

Table 5-88 Power Consumption of Commonly Used Boards/Units of ZXMP M820

Max. Power
Consumption (W) @
Abbreviation Unit Name
25 C Environment
Temperature

OTU 2.5G optical transfer unit 14

Compact Optical
SOTU2.5G Transponder Unit for 14
2.5Gbit/s

2.5G optical transfer unit with

OTUF 14
FEC

10G optical transfer unit with

Board OTU10G 29.2
FEC/AFEC

OTU10G 10G optical transfer unit with

22.2
(regenerator) FEC/AFEC

Enhanced 10G optical

EOTU10G 28
transfer unit with FEC/FEC

EOTU10G Enhanced 10G optical

21
(regenerator) transfer unit with FEC/FEC

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Max. Power
Consumption (W) @
Abbreviation Unit Name
25 C Environment
Temperature

Type B Enhanced OTU

EOTU10GB 28
10Gbit/s Transceiver

Semi 10G optical transfer unit

SOTU10G 25
with FEC/FEC

40G optical transfer unit with

TST3 90
FEC/AFEC

TST3 40G optical transfer unit with

79
(regenerator) FEC/AFEC

Four 10G SubRate Mux

MQT3 120
Board

Single-channel 100Gb/s
TS4 Optical Channel Transport 190
Board

MX2 Ten 10G Sub Rate Mux

185
(no SFP++) Board

MX2 Ten 10G Sub Rate Mux

200
(with SFP++) Board

Four 2.5G SubRate Mux

SRM41 33
Board

Four 622M/155M SubRate

SRM42 20
Mux Board

Compact Data Service

SDSA 25
Aggregation Board

Data Service Aggregation

DSAF 22
with FEC

Data Service Aggregation

DSA 25
Board

Dual-channel gigabit
GEM2 13
Ethernet convergence board

Dual-channel gigabit
GEMF Ethernet convergence board 18
with FEC

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Max. Power
Consumption (W) @
Abbreviation Unit Name
25 C Environment
Temperature

Eight Gigabit Ethernet Mux

GEM8 35
Board

FCA FC service Access unit 40

MOM2 Eight GE/FC Muxponder 40

Aggregation Switch
ASMA 80
Muxponder
Transponder of 2 ports
TD2C 25
10Gb/s
Muxponder of 4 ports any
MQA2 28
rate to OTU2
Muxponder of 4 ports any
MQA1 28
rate to OTU1
Muxponder of 6 ports any
MJA 28
rate to main board
Client board for Double
CD3 101
OTU3

CS3 Client board for Single OTU3 70

CO2 Client board for 8*OTU2 90

CQ2 Client board for 4*OTU2 50

Client board for 16*GE or

CH1 56
8*OTU1

Line board for single OTU3( 2 84 (DPSK)

LS3(2 slots)
slots) 93 (DQPSK)

Line board for single OTU3 80(DPSK)

LS3(1 slot)
(1slot) 86(DQPSK)

LO2 Line board for 8*OTU2 92

LQ2 Line board for 4*OTU2 50

LD2B Line board for 2*OTU2 53

XCA Switching Board 55

OMU OM board TFF/AWG 3(TFF)/13.2(AWG)

ODU OD board TFF/AWG 3(TFF)/13.2(AWG)

ODUB Optical De-Multiplexing Unit 38

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Max. Power
Consumption (W) @
Abbreviation Unit Name
25 C Environment
Temperature
(B Type)

Variable insertion loss

VMUX 30
Multiplexer

Variable Insertion Loss

VMUXB 30
Multiplexer (B Type)

Optical multiplex/demultiplex
OCI 3
interleaver

Optical broadband
OBM 3
multiplexer

SOAD1 Compact Optical Add/ 4

SOAD2 Drop Board of 1/2/4 Wave 4

SOAD4 length 5

WBU Wavelength Blocking Unit 15

WSU Wavelength Selective Unit 15

Wavelength Blocking
WBM 32
Multiplexing
PDU Power Distribution Unit 3

EOBA 20

EOBAS Enhanced Optical power 14.5

EOBAH2424 amplifier 30

EOBAH2726 40

Enhanced Optical
EOPA 11
preamplifier

Enhanced Optical line

EOLA 14.5
amplifier

Enhanced Optical node

EONA 25
amplifier

Enhanced Optical Booster

SEOBA 14
Amplifier

Enhanced Optical
SEOPA 11
PreAmplifier

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Max. Power
Consumption (W) @
Abbreviation Unit Name
25 C Environment
Temperature

Enhanced Optical Line

SEOLA 14
Amplifier

RPU Remote Pump Unit 80

RGU Remote Gain Unit 0

DRA Distributed Raman amplifier 35

SOP Optical protection board 5

Compact Optical Protection

SOPCS 3
Board for Channel Section

Compact Optical Protection

SOPMS 3
Board for Mux Section

Optical Protect for Mux

OMCP 5
Section

Optical performance
OPM 5
monitoring board

Optical Wavelength
OWM 3
Monitor

Enhanced Optical Channel

EOPM 10
Performance Monitor

Enhanced Optical
EOWM Wavelength Monitor 10
Board

Optical supervision channel

SOSC 12
board

Optical supervision channel

SOSCB 18
board for Fast Ethernet

TIS Time interface supply card 15

CCP Subrack Management Board 18

FCC Fan Board 67

SNP Net control processor 10

Communication Control
SCC 10
Board

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Max. Power
Consumption (W) @
Abbreviation Unit Name
25 C Environment
Temperature

Compact Extension Interface

SEIA 5
Board

Transmitter supervisory
SDMT 4
add/drop multiplexer board

Receiver supervisory
SDMR 4
add/drop multiplexer board

Line attenuation control

LACG 3
board (generator)

Line attenuation control

LACT 3
board (terminal)

SEI Extension Interface Board 5

SPWA Power Board (A-type) 28

PWD Power Supply Board 5.8

SFAN Compact Fan Board 10

Sub-ra - Master Sub-rack(NX) 733

ck
Slave Sub-rack(NX) 721

Note: The power values of the sub-rack is for full configuration of 10G OTU (SOTU 10G).

The power consumption in the table is the maximum value at normal temperature.

5.16 Environment Conditions

5.16.1 Grounding Requirements

Internal grounding requirements of the system

 The board shielding plate is grounded via the panel to the case, and there is no
electronic connection inside a board.

 The cabinet and sub-rack case are connected to the protective ground.

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The equipment room grounding requirements

 Grounding resistance of the AC working ground:  4 

 Grounding resistance of the safety protection ground:  4 

 Grounding resistance of the lightning protection ground:  4 

 Combined grounding, with resistance  1 

 If the equipment room provides the working ground and the protection ground, the
working and protection grounds of the equipment shall be connected to the relevant
grounding copper bar. If the equipment room only provides a copper ground bar, it
is allowed to jointly earth the working and protection grounds. The resistance values
shall meet the above requirements.

5.16.2 Temperature and Humidity Requirements

The requirements on ambient temperature and relative humidity of ZXMP M820 are
shown in Table 5-89.

Table 5-89 Temperature and Humidity Requirements

Item Indices
Long term running: 0 C + 45 C
Ambient temperature
Short term running: -5 C ~ +50 C
Long term running: 10% ~ 90%
Relative humidity (35 C)
Short term running: 5% ~ 95%

In normal working environment, the measuring spot of humidity and temperature is the
data measured at the spot 1.5 m above the floor and 0.4 m in front of the equipment.

5.16.3 Requirements for Cleanness

Cleanness involves dust and harmful gases in the air. The equipment should be
operated in the equipment room that meets the cleanness requirements described
below:

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In the transmission equipment room, there is no explosive, electrically conductive,

magnetically conductive or corrosive dust.

The concentration of dust particles with the diameter greater than 5µm should be less
than or equal to 3  104 particles/m3.

There is no corrosive metal or gases that are detrimental to the insulation in the
equipment room. For details, please refer to Table 5-90

Table 5-90 Requirements for Harmful Gases in the Equipment Room

Harmful Gas Mean Value (mg/m3) Max. Value (mg/m3)

SO2 0.2 1.5

H2S 0.006 0.03

NO2 0.04 0.15

NH3 0.05 0.15

CL2 0.01 0.3

The equipment room should be always kept clean, with doors and windows being closed.

5.16.4 Dustproof and Corrosion-Proof Requirements

According to the application range recommended in GB798, the dustproof and antisepsis
requirements of ZXMP M820 are as follows:

Storage environment conditions: For 1K5/1Z1/1B2/1C2/1S3/1M3, the storage duration is

180 days.

Transportation environment conditions: For 2K4P/2B2/2C2/2S3/2M3, the transportation

duration is 30 days.

Application environment conditions: For 3K5/3Z2/3Z7/3B2/3C2/3S2/3M3, the continuous

operation time is 20 years.

5.16.5 Environment for Storage

Climate

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Table 5-91 Climate requirement

Item Range

Altitude < 4000m

Air pressure 70 ~ 106kPa

Temperature -40℃~ +70℃

Temperature change rate < 1℃/min

Relative humidity 5% ~ 100%

Solar radiation 1120W/s²

Air speed < 20m/s²

Mechanical stress

Table 5-92 Requirements for mechanical stress

Item unit value

Acceleration m/S2 0.1

Frequency range Hz 5～100, 100～5

direction X,Y,Z

duration Min 90

The earthquake-proof performance detection reaches the eight-level intensity

5.16.6 Environment for Transportation

Climate

Table 5-93 Climate requirement

Item Range
Altitude < 4000m

Air pressure 70 ~ 106kPa

Temperature -40℃~ +70℃

Temperature change rate < 1 ℃/min

Relative humidity 5% ~ 100%

Solar radiation < 1120W/s²

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Air speed < 20m/s²

5.16.7 Electronic Static Discharge (ESD)

Anti-interference for static discharging

The static discharge anti-interference index of ZXMP M820 equipment is shown in Table
5-94. During the operation in the interface area, be sure to wear an antistatic wrist strap.

Table 5-94 Static discharge anti-interference

Contact discharge Air discharge Criterion for test results

6kV 8kV Performance B

8kV 15kV Performance R

RF electromagnetic radiated susceptibility

The RF electromagnetic radiated susceptibility of ZXMP M820 equipment is shown in

Table 5-95.

Table 5-95 RF electromagnetic radiated susceptibility

Test frequency (80MHz~1000MHz)

Electric field intensity Amplitude modulation Criterion for test results

10V/m 80%AM (1kHz) Performance A

Electrical fast transient burst susceptibility

The electrical fast transient burst susceptibility of ZXMP M820 equipment is shown in
Table 5-96 and Table 5-97.

Table 5-96 Electrical fast transient burst susceptibility at the DC power port

Generator waveform 5/50ns

Test voltage Repeated frequency Criterion for test results

1kV 5kHz Performance B

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Table 5-97 Electrical fast transient burst susceptibilities at the signal cable and control
cable ports

Generator waveform 5/50ns

Test voltage Repeated frequency Criterion for test results

1kV 5kHz Performance B

Surge susceptibility

The surge susceptibility of ZXMP M820 equipment is shown in and Table 5-100

Table 5-98 , Error! Reference source not found. and Table 5-100

Table 5-98 Surge susceptibility of DC power

The waveform of generators 1.2/50us (8/20μs), internal resistance 12

Test mode Test voltage Criterion for test results

Line to ground 1kV Performance B

Line to ground 2kV Performance R

Table 5-99 Surge susceptibility of the outdoor signal cable

The waveform of generators 10/700µs, internal resistance 40

Test mode Test voltage Criterion for test results

Line to line
2kV Performance B
Line to ground

Line to line
4kV Performance R
Line to ground

Table 5-100 Surge susceptibility of the indoor signal cable

Generator waveform 1.2/50μs (8/20μs), internal resistance 42

Test mode Test voltage Criterion for test results

Line to ground 1kV Performance B

Line to ground 2kV Performance R

Conductivity susceptibility of RF field

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The conductivity susceptibility of RF field of ZXMP M820 equipment is shown in Table

5-101

Table 5-101 Conductivity susceptibility of RF field

Test frequency 0.15MHz ~ 80MHz

Test intensity Amplitude modulation Criterion for test results

3V 80%AM (1kHz) Performance A

Conductive emission electromagnetic interference

The conductive emission electromagnetic interference of ZXMP M820 equipment is

shown in Table 5-102

Table 5-102 Conductive emission electromagnetic interference at the direct current port

Limits (dBuV)
Testing frequency (MHz)
Quasi-peak Mean value

0.02~0.15 79 --

0.15~0.5 79 66

0.5~30 73 60

Radioactive emission electromagnetic interference

The radioactive emission electromagnetic interference of the ZXMP M820 equipment is

shown in Table 5-103

Table 5-103 Radio active emission electromagnetic interference

Quasi-peak demodulating limit (dBµV/m)

Testing frequency (MHz)
10m 3m

30~230 40 50

230~1000 47 57

5.16.8 Safety requirements

This product adopts the technical requirements specified in the following standard:

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IEC/EN 60950:2000 Safety of information technology equipment

Working voltage and current

Rated working voltage: -48V

Max. working voltage: -60V

Min. working voltage: -36V

Insulation classification of the equipment

The power supply of the equipment provides the SELV circuit with safe and excessively
low voltage, without self-generating dangerous voltage. It belongs to the equipment of
the class III insulation (Class III equipment).

Optical interface

The optical module of the maximum power belongs to (Class 3A). All the optical modules
shall be under strict control and certified by authorities (such as UL, TUV and NEMKO),
and comply with EN60825.

Fuse

All the fuses and power modules, including recoverable fuses, shall be certified by
authorities such as CE, UL and TUV.

Safety mark

On the package of the equipment, there are striking labels about antistatic, fragile,
waterproof, and damp-proof.

The maximum optical power satisfies the 3A safety standard. An obvious label warning
against the laser shall be pasted at the optical interface.

Cables of different colors shall be used for the power input, shielding GND and lightening
protection GND to avoid incorrect connection. Different power connectors shall use
coding keys. There shall be a power label at the power inlet.

Both the equipment and each board shall have an antistatic label.

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Grounding symbol .” ” indicates switch-on, and” ” indicates switch-off.

Mechanical structure

In installation, four bolts are designed at the rack bottom (may also be used to adjust
balance) to fix the rack to the ground. At the rack top, the corresponding screws are
designed to fix the rack to the cabling rack. When installed in the equipment room, the
rack shall be fixed both at the top and bottom to ensure the stability and safety of the
equipment.

The corners of both the rack and sub-rack are processed to avoid hurting people.

Fire protection

The materials of the circuit boards in the equipment use the fireproof materials of the V-2
level to prevent the circuits from burning in case of failure.

The structural parts use unburnable materials with a good fireproof performance,
including surface processing materials.

With the effective heat dissipation design, it ensures that the temperature does not
exceed 70ºC to prevent heat aggregation and reduce the possibility of burning.

Safe parts passing the safety authentication (CE, UL, etc.) are used.

High temperature protection

In abnormal conditions, the temperature does not exceed 70ºC. The plastic parts,
components, wires and cables, and safety labels shall all comply with the requirements
specified in the safety standard-GB4943/EN60950.

Lightening protection

In this system, good grounding and isolation and protection of electrical interfaces are
used to prevent the dangerous voltage of lightening.

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5.17 Introduction to Interfaces

This chapter briefly introduces types and functions of the interfaces used in ZXMP M820.

5.17.1 Interface on SEIA board

SEIA has two subclasses: SEIA1 and SEIA2, the former used in main sub-rack, the latter
used in slave sub-rack

Figure 5-2 Common Interface Area of the OTU Sub-rack

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FE Ethernet interface

Testing switch

Subrack cascaded data interface

Bell control

External alarm input interface

Subrack indicators

Interface of cascaded alarm

Interface of alarm output, ring output and rack indicators signal

The definitions and descriptions of the interface area on SEI board are listed in Table
5-104 and Table 5-105

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Table 5-104 Definitions and Description for the Common Interface on SEIA1

Board
SEIA1
Item

Board ID SEIA1

FE RJ45 socket is used as Qx interface to access EMS

Ethernet J4 computer, and also as the transparent user channel
interface interface or IP phone interface based on Ethernet.

Subrack
D-type 36–pin straight PCB jointing socket (female) to
cascaded
J1, J3 connect to subrack cascaded data interface of other
data
subarcks.
interface

External
alarm
J2 Inputs external alarms.
input
interface

Interface
of
J5 Inputs alarms from other subrack
cascaded
alarm

Interface
of alarm
output,
ring Outputs alarm signal, ring driving signal and rack
J6
output indicator signal
and rack
indicators
signal

Testing
TST Reserved
switch

Bell control Control the ON state or OFF state of the ring.

Indicates the state of the subrack, green light for

Subrack indicators normal state, red light for critical alarm, orange for
major alarm, yellow for minor alarm

Number of occupied slot 1

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Table 5-105 Definitions and Description for the Common Interface on SEIA2

Board Item SEIA2

Board ID SEIA2

FE RJ45 socket is used as Qx interface to access EMS

Ethernet J3 computer, and also as the transparent user channel
interface interface or IP phone interface based on Ethernet.

Sub rack
D-type 36–pin straight PCB jointing socket (female) to
cascaded
J1, J2 connect to subrack cascaded data interface of other
data
subarcks.
interface

Testing
TST Reserved
switch

Number of occupied slot 1

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5.17.2 Interface on SPWA board

Figure 5-3 Interfaces on the SPWA board

Terminal block

Sub rack cascaded GE interface

Sub rack cascaded GE optical interface connection indicator

Power switch

RS232 console interface

RJ-45 console interface

Indicators

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Laser warning sign

Laser level sign

The definitions and descriptions of the interface area on SPWA board are listed in Table
5-106

Table 5-106 Definitions and Description for the Common Interface on SPWA

Board
SPWA
Item

Board ID SPWA

If the switch is in the status of “ON", the external

power supply is connected to the SPWA. On the
Power switch other hand, if the switch is in the status of "OFF”, the
connection between SPWA and the external power is
cut off.

NOM Running indicator, green

ALM Alarm indicator, red

M/S Master/slave indicator, green

0, 1, 2, 3-1, 3-2,
3-3, 3-4, 4, 5-1,
5-2, 5-3, 5-4, 6,
Indicator
7, 8, 9, 10, 11,
12, 13, 14, 15,
Board internal communication indicator, green.
16, 17, 18, 19,
20-1, 20-2, 21,
22-1, 22-2, 23,
24-1, 24-2, 25,
26-1, 26-2

Sub rack
cascaded Connects to sub rack cascaded GE interface of other
J1, J2
GE sub racks, LC/PC connector
interface
Do not look at optical interfaces directly while
Laser warning sign plugging/unplugging fiber pigtails to avoid burning
eyes.

Laser class sign Indicates that the laser class of SPWA board is

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CLASS 1

Number of occupied slot 1

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6 Abbreviation
Abbreviation Full English Description

AFEC Advance Forward Error Correction

AFR Absolute Frequency Reference

AIS Alarm Indication Signal

APO Automatic Power Optimization

APR Automatic Power Reduction

APS Automatic Protection Switching

APSD Automatic Power Shutdown

APSF Automatic Protection Switching for Fast Ethernet

ASE Amplified Spontaneous Emission

AWG Array Waveguide Grating

ADM Add/Drop Multiplexer

ATM Asynchronous Transfer Mode

ASON Automatically Switched Optical Network

AWG Array Waveguide Grating

BA Booster (power) Amplifier

BER Bit Error Ratio

BLSR Bidirectional Line Switching Ring

BSHR Bidirectional Self-Healing Ring

CBR Constant Bit Rate

CDR Clock and Data Recovery

CMI Code Mark Inversion

CODEC Code and Decode

CPU Center Process Unit

CRC Cyclic Redundancy Check

DBMS Database Management System

DCC Data Communications Channel

DCF Dispersion Compensation Fiber

DCG Dispersion Compensation Grating

DCN Data Communications Network

DCM Dispersion Compensation Module

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Abbreviation Full English Description

DRA Distributed RAMAN fiber Amplifier

DVB Digital Video Broadcasting

DDI Double DAFECt Indication

DFB-LD Distributed Feedback Laser Diode

DSF Dispersion Shifted Fiber

DGD Differential Group Delay

DTMF Dual Tone Multi Frequency

DWDM Dense Wavelength Division Multiplexing

DXC Digital Cross-connect

EAM Electrical Absorption Modulation

ESCON Enterprise System Connection

ECC Embedded Control Channel

EDFA Erbium Doped Fiber Amplifier

EX Extinction Ratio

EMS Network Element Management System

EMC Electromagnetic Compatibility

EMI Electromagnetic Interference

ERZ Electrical Return to Zero

EOBA Enhanced Optical Booster Amplifier

EOPA Enhanced Optical Preamplifier Amplifier

FDI Forward DAFECtion Indication

FEC Forward Error Correction

FPDC Fiber Passive Dispersion Compensator

FAS Frame Alignment Signal

FC Fiber Channel

FICON Fiber Connection

FEC Forward Error Correction

FWM Four Wave Mixing

FOADM Fixed Optical Add/Drop Multiplexer

GCC General Communication Channel

GE Gigabits Ethernet

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Abbreviation Full English Description

GFP Generic Framing Procedure

GUI Graphical User Interfaces

IP Internet Protocol

International Telecommunication Union – Telecommunication

ITU-T
Standardization Sector

IWF Inter-Working Function

LD Laser Diode

LA Line Amplifier

LOF Loss of Frame

LOS Loss of Signal

LAN Local Area Network

LCK Locked

MAN Metropolitan Area Network

MFAS MultiFrame Alignment Signal

MS-AIS Multiplex Section - Alarm Indication Signal

MDI Multiple Document Interface

MCU Management and Control Unit

MOADM Metro Optical Add Drop Multiplexer Equipment

MBOTU Sub-rack backplane for OUT

MQW Multiple Quantum Well

MSP Multiplex Section Protection

MST Multiplex Section Termination

NE Network Element

NNI Network Node Interface

NMCC Network Manage Control Center

NRZ Non Return to Zero

NT Network Termination

NZDSF Non-Zero Dispersion Shifted Fiber

OA Optical Amplifier

OAC Optical Access

OADM Optical Add/Drop Multiplexer

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Abbreviation Full English Description

Och Optical Channel

ODF Optical fiber Distribution Frame

ODU Optical Demultiplexer Unit

OGMD Optical Group Mux/DeMux Board

OCI Open Connection Indication

OHP Order wire

OLA Optical Line Amplifier

OLT Optical Line Termination

OMU Optical Multiplexer Unit

OMS Optical Multiplex Section

ONU Optical Network Unit

OPU Optical Protection Unit

OPM Optical Performance Monitor

Optical Protect for Mux Section (without preventing

OPMSN
resonance switch)

Optical Protect for Mux Section (with preventing resonance

OPMSS
switch)

OSPF Open Shortest Path First

OSC Optical Supervision Channel

OSNR Optical Signal-Noise Ratio

OTM Optical Terminal Multiplexer

OTN Optical Transport Network

OTU Optical Transponder Unit

OXC Optical Cross-connect

PA Pre-Amplifier

PDL Polarization Dependent Loss

PDC Passive Dispersion Compensator

PM Path Monitoring

POS Packet Over SDH

PSI Payload Structure Identifier

PT Payload Type

PMD Polarization Mode Dispersion

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Abbreviation Full English Description

ROADM Reconfigurable Optical Add/Drop Multiplexer

REG Regenerator

RES Reserved for Future International Standardization

RSOH Regenerator Section OverHead

SNP Net Control Processor for Fast Ethernet

SM Section Monitoring

SOH Section Overhead

SONET Synchronous Optical NETwork

SDH Synchronous Digital Hierarchy

SDM Supervision add/drop multiplexing board

SOSC Optical Supervisory Channel

SEF Severely Errored Frame

SES Severely Errored Block Second

SFP Small Form Factor Pluggable

SLIC Subscriber Line Interface Circuit

SMCC Sub-network Management Control Center

SMT Surface Mount

SRS Stimulated RAMAN Scattering

SNMP Simple Network Management Protocol

STM Synchronous Transfer Mode

TCP Transmission Control Protocol

TCM Tandem Connection Monitor

TIM Trace Identifier Mismatch

TTI Trail Trace Identifier

TFF Thin Film Filter

TMN Telecommunications Management Network

VOA Variable Optical Attenuator

XFP 10-Gigabit Small Form-Factor Pluggable

WDM Wavelength Division Multiplexing

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7 Followed Standards and Recommendations

The ZXMP M820 is designed with reference to the following recommendations and
standards:
Standard/
Title
Recommendation

ITU-T G.652 Characteristics of a single-mode optical fiber and optical cable

ITU-T G.653 Characteristics of Dispersion-Shifted Single-Mode Fiber

Characteristics of Non-Zero Dispersion-Shifted Single-Mode

ITU-T G.655
Fibers

Definition and test methods for the relevant generic parameters of

ITU-T G.661
optical amplifier devices and subsystems

Generic characteristics of optical fiber amplifier devices and

ITU-T G.662
subsystems

Application related aspects of optical amplifier devices and

ITU-T G.663
subsystems

Optical safety procedures and requirements for optical transport

ITU-T G.664
systems

Definitions and Test Methods for Generic Characteristics

ITU-T G.665 Amplifiers
and Raman Amplified Subsystems

ITU-T G.671 Transmission characteristics of passive optical components

Functional characteristics of interoffice and long-haul line systems

ITU-T G.681
using optical amplifiers, including optical multiplexing

Optical interfaces for single channel STM-64, STM-256 systems

ITU-T G.691
and other SDH systems with optical amplifiers

ITU-T G.692 Optical interface for multichannel systems with optical amplifiers

ITUT-T G.694.1 Spectral grids for WDM application: DWDM frequency grid

ITU-T G.693 Optical interfaces for intra-office systems

ITU-T G.696.1 Optical transport network physical layer interfaces

ITU-T G.697 Optical monitoring for DWDM systems

ITU-T G.709 Interfaces for the Optical Transport Network

ITU-T G.709-2003 Optical Transport Network (OTN) Interfaces

ITU-T G.783 Characteristics of synchronous digital hierarchy (SDH) equipment

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Standard/
Title
Recommendation
functional blocks

Characteristics of optical transport network hierarchy equipment

ITU-T G.798
functional blocks

Error performance parameters and objectives for multi-operator

ITU-T G.8201
international paths within the Optical Transport Network (OTN)

The control of jitter and wander within digital networks which are
ITU-T G.825
based on the synchronous digital hierarchy (SDH)

The control of jitter and wander within the optical transport network
ITU-T G.8251
(OTN)

Optical input jitter and wander control based on the synchronous

ITU-T G.828
digital hierarchy (SDH)

Error performance parameters and indexes for international,

ITU-T G.826
constant bit rate digital paths at or above the primary group

ITU-T G.841 Types and characteristics of SDH network protection architectures

The APS protocol and protection switching operation for the linear
ITU-T G.873.1 protection schemes for the Optical Transport Network at the
Optical Channel Data Unit (ODUk) level

Management aspects of the Optical Transport Network Element

ITU-T G.874 containing transport functions of one or more of the layer networks
of the optical transport network.

ITU-T G.957 Optical interfaces for SDH equipment and systems

ITU-T G.959.1 Optical transport networks physical layer interfaces

ITU-T G.707 Network Node Interface for the SDH equipment

ITU-T G.975 Forward Error Correction for Submarine Systems

Carrier sense multiple access with collision detection (CSMA/CD)

IEEE Std 802.3
access method and physical layer specification

Carrier wave interception multi-address access method with

IEEE 802.3-2002
collision test and physical layer characteristics

EMC, Safety and Environmental Standard

EMI Standard---CISPR22 (EN55022)

EMC Standard: EN50082-1: 1992 or EN55024: 1998 (Mandatory by 1 July 2001)
(EN61000-4-2, 3, 4, 5, 6 series)

TNE ETSI EN 300 386 V1.2.1 (2000-03)

(Telecommunicatio Electromagnetic compatibility and Radio spectrum Matters (ERM);

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Standard/
Title
Recommendation
n network Telecommunication network equipment; Electromagnetic
equipment) Compatibility (EMC) requirements

Safety Standard IEC950(EN60950)

Safety of laser products-Part 1: Equipment classification,

IEC 60825-1
requirements and user’s guide

Safety of laser products-Part2: Safety of optical fiber

IEC 60825-2
communication systems

Environmental
ETS 300 019 (T/TR02-12)
standard

ETSI EN 300 119-3 Environmental Engineering (EE) European telecommunication

standard for equipment practice; Part 3: Engineering requirements
for miscellaneous racks and cabinets

ETSI EN 300 119-4 Environmental Engineering (EE); European telecommunication

standard for equipment practice; Part 4: Engineering requirements
for sub-racks in miscellaneous racks and cabinets.

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