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DS9030 05

The RT9030 is a 150mA low dropout linear regulator with several features making it suitable for portable RF and wireless applications. It has a low dropout voltage of 100mV at 150mA, ultra-low noise, fast response times, and high power supply rejection ratio. No bypass capacitor is required for stability due to its ability to work with low-ESR ceramic capacitors. It comes in SC-70-5 and WDFN-6L 1.6x1.6 packages.

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0% found this document useful (0 votes)
36 views

DS9030 05

The RT9030 is a 150mA low dropout linear regulator with several features making it suitable for portable RF and wireless applications. It has a low dropout voltage of 100mV at 150mA, ultra-low noise, fast response times, and high power supply rejection ratio. No bypass capacitor is required for stability due to its ability to work with low-ESR ceramic capacitors. It comes in SC-70-5 and WDFN-6L 1.6x1.6 packages.

Uploaded by

Jois Lanza
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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®

RT9030

150mA, Low Input Voltage, Low Dropout, Low Noise Ultra-


Fast Without Bypass Capacitor CMOS LDO Regulator
General Description Features
The RT9030 is a high-performance, 150mA LDO regulator,  Wide Operating Voltage Ranges : 1.65V to 5.5V
offering extremely high PSRR and ultra-low dropout. Ideal  Output Voltage Ranges : 1V to 3.3V
for portable RF and wireless applications with demanding  Low Dropout : 100mV at 150mA
performance and space requirements.  Ultra-Low-Noise for RF Application
 Ultra-Fast Response in Line/Load Transient
The RT9030 quiescent current as low as 25μA, further
 Current Limiting Protection
prolonging the battery life. The RT9030 also works with
 Thermal Shutdown Protection
low-ESR ceramic capacitors, reducing the amount of board
 High Power Supply Rejection Ratio
space necessary for power applications, critical in hand-
 Only 1μμF Output Capacitor Required for Stability
held wireless devices.
 TTL-Logic-Controlled Shutdown Input
The RT9030 consumes typical 0.7μA in shutdown mode  RoHS Compliant and Halogen Free
and has fast turn-on time less than 40μs. The other features
include ultra-low dropout voltage, high output accuracy, Applications
current limiting protection, and high ripple rejection ratio.
 CDMA/GSM Cellular Handsets
Available in the SC-70-5 and WDFN-6L 1.6x1.6 package.
 Portable Information Appliances

 Laptop, Palmtops, Notebook Computers

Ordering Information  Hand-Held Instruments

RT9030 -  Mini PCI & PCI-Express Cards

Package Type PCMCIA & New Cards


U5 : SC-70-5
QW : WDFN-6L 1.6x1.6 (W-Type) Pin Configuration
Lead Plating System (TOP VIEW)
G : Green (Halogen Free and Pb Free)
VOUT NC
Fixed Output Voltage
10 : 1.0V 5 4
11 : 1.1V
: 2 3

32 : 3.2V
VIN GND EN
33 : 3.3V
1B : 1.25V SC-70-5
1H : 1.85V
2H : 2.85V EN 1 6 GND
GND

1K : 1.05V NC 2 5 NC
7
VIN 3 4 VOUT
1C : 1.15V
Note : WDFN-6L 1.6x1.6
Richtek products are :
 RoHS compliant and compatible with the current require- Marking Information
ments of IPC/JEDEC J-STD-020.
For marking information, contact our sales representative
 Suitable for use in SnPb or Pb-free soldering processes.
directly or through a Richtek distributor located in your
area.

Copyright © 2016 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

DS9030-05 November 2016 www.richtek.com


1
RT9030
Typical Application Circuit

VIN VIN VOUT VOUT


CIN COUT
1µF/X7R 1µF/X7R
RT9030

Chip Enable EN NC
GND

Functional Pin Description


Pin Number
WDFN-6L Pin Name Pin Function
SC-70-5
1.6x1.6
5 4 VOUT Regulator output.
4 2, 5 NC No internal connection.
6, Ground. The exposed pad must be soldered to a large PCB and
2 GND
7 (Exposed Pad) connected to GND for maximum power dissipation.
Enable input Logic, active high. When the EN pin is open it will be pulled
3 1 EN
to low internally.
1 3 VIN Supply input.

Functional Block Diagram

POR Current
EN OTP Limit VIN
VREF
1µA - MOS
+ Driver
VOUT

GND

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2
RT9030
Absolute Maximum Ratings (Note 1)
 Supply Input Voltage ---------------------------------------------------------------------------------------------------- 6V
 EN Input Voltage --------------------------------------------------------------------------------------------------------- 6V
 Power Dissipation, PD @ TA = 25°C
SC-70-5 -------------------------------------------------------------------------------------------------------------------- 0.3W
WDFN-6L 1.6x1.6 -------------------------------------------------------------------------------------------------------- 0.571W
 Package Thermal Resistance (Note 2)
SC-70-5, θJA --------------------------------------------------------------------------------------------------------------- 333°C/W
WDFN-6L 1.6x1.6, θJA -------------------------------------------------------------------------------------------------- 175°C/W
 Lead Temperature (Soldering, 10 sec.) ----------------------------------------------------------------------------- 260°C
 Junction Temperature --------------------------------------------------------------------------------------------------- 150°C
 Storage Temperature Range ------------------------------------------------------------------------------------------- −65°C to 150°C
 ESD Susceptibility (Note 3)
HBM (Human Body Model) -------------------------------------------------------------------------------------------- 2kV
MM (Machine Model) ---------------------------------------------------------------------------------------------------- 200V

Recommended Operating Conditions (Note 4)


 Input Voltage Range ----------------------------------------------------------------------------------------------------- 1.65V to 5.5V
 Junction Temperature Range ------------------------------------------------------------------------------------------ −40°C to 125°C
 Ambient Temperature Range ------------------------------------------------------------------------------------------ −40°C to 85°C

Electrical Characteristics
(VIN = VOUT + 0.5V, VEN = VIN, CIN = COUT = 1μF/X5R (Ceramic), TA = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Output Noise Voltage VON IOUT = 0mA -- 30 -- μVRMS
Output Voltage Accuracy
VOUT IOUT = 150mA 2 0 2 %
(Fixed Output Voltage)
Quiescent Current (Note 5) IQ IOUT = 0mA -- 25 50 μA
Shutdown Current ISHDN VEN = 0V -- 0.7 1.5 μA
Current Limit ILIM RLOAD = 0, 1.65V  VIN < 5.5V 170 285 400 mA
VOUT = 1.7V to 2.4V,
50 -- 200
IOUT = 150mA, 1.65V  VIN  5.5V
Dropout Voltage (Note 6) VDROP mV
VOUT = 2.5V to 3.3V,
20 -- 150
IOUT = 150mA, 1.65V  VIN  5.5V
Load Regulation (Note 7) 1mA < IOUT < 150mA
VLOAD -- -- 1 %
(Fixed Output Voltage) 1.65V  VIN  5.5V
Logic-Low Voltage VIL 0 -- 0.3
EN Threshold V
Logic-High Voltage VIH 1.6 -- 5.5
Enable Pin Current IEN -- 1 3 μA
f = 1kHz -- 67 --
Power Supply
f = 10kHz PSRR -- 55 -- dB
Rejection Rate
f = 100kHz -- 40 --

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DS9030-05 November 2016 www.richtek.com


3
RT9030
Parameter Symbol Test Conditions Min Typ Max Unit
VIN = (VOUT + 0.5) to 5.5V,
Line Regulation VLINE -- 0.01 0.2 %/V
IOUT = 1mA to 150mA
Thermal Shutdown Temperature TSD -- 150 --
C
Thermal Shutdown Hysteresis T SD -- 20 --

Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a low effective thermal conductivity single-layer test board per JEDEC 51-3.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Quiescent, or ground current, is the difference between input and output currents. It is defined by IQ = IIN - IOUT under no
load condition (IOUT = 0mA). The total current drawn from the supply is the sum of the load current plus the ground pin
current.
Note 6. The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) - 100mV.
Note 7. Regulation is measured at constant junction temperature by using a 2ms current pulse. Devices are tested for load
regulation in the load range from 10mA to 120mA.

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4
RT9030
Typical Operating Characteristics
Output Voltage vs. Temperature Quiescent Current vs. Temperature
1.80 31
RT9030-33GU5, VIN = 4.2V
29
1.75

Quiescent Current (µA)


27
Output Voltage (V)

1.70
25

1.65 23 RT9030-17GU5, VIN = 3.3V

21
1.60
RT9030-10GU5, VIN = 1.65V
19
1.55
17
RT9030-17GU5, VIN = 3.3V, VOUT = 1.7V
1.50 15
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C) Temperature (°C)

Dropout Voltage vs. Load Current Dropout Voltage vs. Load Current
0.12 0.18

0.16 125°C
0.10 125°C
0.14
Dropout Voltage (V)
Dropout Voltage (V)

25°C
25°C
0.08 0.12

0.10
0.06 -40°C
-40°C 0.08

0.04 0.06

0.04
0.02
0.02
RT9030-33GU5 RT9030-17GU5
0.00 0.00
0 25 50 75 100 125 150 0 25 50 75 100 125 150
Load Current (mA) Load Current (mA)

Power On from EN Power Off from EN


RT9030-17GU5, VIN = 3.3V, ILOAD = 50mA RT9030-17GU5, VIN = 3.3V, ILOAD = 50mA

VEN VEN
(5V/Div) (5V/Div)

VOUT VOUT
(500mV/Div) (500mV/Div)

Time (10μs/Div) Time (50μs/Div)

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DS9030-05 November 2016 www.richtek.com


5
RT9030

Line Transient Response Line Transient Response

VIN 4.5 VIN 4.5


(V) (V)
3.5 3.5

VOUT VOUT
(10mV/Div) (10mV/Div)

RT9030-17GU5, VIN = 3.5V to 4.5V, ILOAD = 10mA RT9030-17GU5, VIN = 3.5V to 4.5V, ILOAD = 100mA

Time (100μs/Div) Time (100μs/Div)

Load Transient Response Load Transient Response

IOUT IOUT
(50mA/Div) (50mA/Div)

VOUT VOUT
(50mV/Div) (50mV/Div)

RT9030-17GU5, VIN = 3V, ILOAD = 1mA to 50mA RT9030-17GU5, VIN = 3V, ILOAD = 1mA to 120mA

Time (100μs/Div) Time (100μs/Div)

Noise PSRR
30
RT9030-17GU5, VIN = 3.3V ±50mV
20
IOUT = 120mA
10
0
-10 IOUT = 50mA
PSRR (dB)

VOUT -20
IOUT = 10mA
(100uV/Div) -30
-40
-50
-60
-70
RT9030-17GU5, VIN = 4.5V (Battery), ILOAD = 50mA
-80
Time (10ms/Div) 10 100 1000 10000 100000 1000000
Frequency (Hz)

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6
RT9030
Applications Information
Capacitor Selection Thermal Shutdown Protection
In order to confirm the regulator stability and performance, As the die temperature is > 150°C , the chip will enter
X7R/X5R or other better quality ceramic capacitor should protection mode. The power MOSFET will turn-off during
be selected. protection mode to prevent abnormal operation.
Like any low-dropout regulator, the external capacitors used
Thermal Considerations
with the RT9030 must be carefully selected for regulator
stability and performance. Using a capacitor whose value Thermal protection limits power dissipation in the RT9030.
is larger than 1μF on the RT9030 input and the amount of When the operation junction temperature exceeds 170°C
capacitance can be increased without limit. The input , the OTP circuit starts the thermal shutdown function
capacitor should be located in a distance of no more than and turns the pass element off. The pass element turn on
0.5 inch from the input pin of the IC and returned to a again after the junction temperature cools by 30°C.
clean analog ground. The capacitor with larger value and For continuous operation, do not exceed absolute
lower ESR (equivalent series resistance) provides better maximum operation junction temperature 125°C. The
PSRR and line-transient response. power dissipation definition in device is :
The output capacitor must meet both requirements for PD = (VIN − VOUT) x IOUT + VIN x IQ
minimum amount of capacitance in all LDOs application. The maximum power dissipation depends on the thermal
The RT9030 is designed specifically to work with low ESR resistance of IC package, PCB layout, the rate of
ceramic output capacitor in space-saving and performance surroundings airflow and temperature difference between
consideration. Using a ceramic capacitor whose value is junction to ambient. The maximum power dissipation can
at least 1μF on the RT9030 output ensures stability. Output be calculated by following formula :
capacitor with larger capacitance can reduce noise and
PD(MAX) = ( TJ(MAX) − TA ) / θJA
improve load transient response, stability, and PSRR. The
output capacitor should be located in a distance of no Where T J(MAX) is the maximum operation junction
more than 0.5 inch from the VOUT pin of the RT9030 and temperature, TA is the ambient temperature and the θJA is
returned to a clean analog ground. the junction to ambient thermal resistance.
For recommended operating conditions specification the
Enable
maximum junction temperature of the die is 125°C. The
The RT9030 goes into shutdown mode when the EN pin
junction to ambient thermal resistance θJA for WDFN-6L
is in a logic low condition. During this condition, the pass
1.6x1.6 package is 165°C/W and SC-70-5 package is
transistor, error amplifier, and bandgap are turned off,
333°C/W on the standard JEDEC 51-3 single-layer thermal
reducing the supply current to 0.7μA typical. The EN pin
test board. The maximum power dissipation at TA = 25°C
can be directly tied to VIN to keep the part on.
can be calculated by following formula :

Current limit PD(MAX) = (125°C − 25°C) / (165°C/W) = 0.606W for


The RT9030 contains an independent current limiter, which WDFN-6L 1.6x1.6 packages
monitors and controls the pass transistor's gate voltage, PD(MAX) = (125°C − 25°C) / (333°C/W) = 0.300W for
limiting the output current to 285mA (typ.). The output SC-70-5 packages
can be shorted to ground indefinitely without damaging
The maximum power dissipation depends on operating
the part.
ambient temperature for fixed T J(MAX) and thermal
resistance θJA. The Figure 3 of derating curves allows the

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DS9030-05 November 2016 www.richtek.com


7
RT9030
designer to see the effect of rising ambient temperature Layout Considerations
on the maximum power allowed. Careful PCB Layout is necessary for better performance.
0.8 The following guidelines should be followed for good PCB
Single Layer PCB
layout.
0.7
WDFN-6L 1.6x1.6
 Place the input and output capacitors as close as
Power Dissipation (W)

0.6
possible to the IC.
0.5
 Keep VIN and VOUT trace as possible as short and wide.
0.4
SC-70-5  Use a large PCB ground plane for maximum thermal
0.3
dissipation.
0.2

0.1 CIN should be placed as close COUT should be placed as close


as possible to VIN pin for good as possible to VOUT pin for good
0 filtering. filtering.
0 25 50 75 100 125 VIN VOUT
Ambient Temperature (°C)
VIN 1 5 VOUT
CIN COUT
Figure 3. Derating Curve of Maximum Power Dissipation
GND 2

EN 3 4 NC

GND
The through hole of the GND pin is
recommended to be as many as possible.

Figure 4

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8
RT9030
Outline Dimension

H
D
L

C B

A
A1
e

Dimensions In Millimeters Dimensions In Inches


Symbol
Min Max Min Max
A 0.800 1.100 0.031 0.044
A1 0.000 0.100 0.000 0.004
B 1.150 1.350 0.045 0.054
b 0.150 0.400 0.006 0.016
C 1.800 2.450 0.071 0.096
D 1.800 2.250 0.071 0.089
e 0.650 0.026
H 0.080 0.260 0.003 0.010
L 0.210 0.460 0.008 0.018

SC-70-5 Surface Mount Package

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DS9030-05 November 2016 www.richtek.com


9
RT9030

D D2

E E2

SEE DETAIL A
1
2 1 2 1

e
b
A DETAIL A
A3 Pin #1 ID and Tie Bar Mark Options
A1
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.

D imensions In Millimeters Dimensions In Inches


Symbol
Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250 0.007 0.010
b 0.200 0.300 0.008 0.012
D 1.550 1.650 0.061 0.065
D2 0.950 1.050 0.037 0.041
E 1.550 1.650 0.061 0.065
E2 0.550 0.650 0.022 0.026
e 0.500 0.020
L 0.190 0.290 0.007 0.011

W-Type 6L DFN 1.6x1.6 Package

Richtek Technology Corporation


14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789

Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
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10

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