LSM6DS33 STMicroelectronics
LSM6DS33 STMicroelectronics
Description
The LSM6DS33 is a system-in-package featuring a 3D
digital accelerometer and a 3D digital gyroscope
performing at 1.25 mA (up to 1.6 kHz ODR) in high-
performance mode and enabling always-on low-power
features for an optimal motion experience for the
LGA-16L (3 x 3 x 0.86 mm) typ. consumer.
The LSM6DS33 supports main OS requirements,
offering real, virtual and batch sensors with 8 kbyte for
Features dynamic data batching.
Power consumption: 0.9 mA in combo normal mode ST’s family of MEMS sensor modules leverages the
and 1.25 mA in combo high-performance mode up to robust and mature manufacturing processes already
1.6 kHz. used for the production of micromachined
“Always-on” experience with low power accelerometers and gyroscopes.
consumption for both accelerometer and gyroscope The various sensing elements are manufactured using
Smart FIFO up to 8 kbyte based on features set specialized micromachining processes, while the IC
Compliant with Android K and L interfaces are developed using CMOS technology that
allows the design of a dedicated circuit which is
±2/±4/±8/±16 g full scale trimmed to better match the characteristics of the
±125/±250/±500/±1000/±2000 dps full scale sensing element.
Analog supply voltage: 1.71 V to 3.6 V The LSM6DS33 has a full-scale acceleration range of
Independent IOs supply (1.62 V) ±2/±4/±8/±16 g and an angular rate range of
Compact footprint, 3 mm x 3 mm x 0.86 mm ±125/±250/±500/±1000/±2000 dps.
SPI/I2C serial interface with main processor data High robustness to mechanical shock makes the
synchronization feature LSM6DS33 the preferred choice of system designers
Embedded temperature sensor for the creation and manufacturing of reliable products.
ECOPACK®, RoHS and “Green” compliant The LSM6DS33 is available in a plastic land grid array
(LGA) package.
Applications
Table 1. Device summary
Pedometer, step detector and step counter
Temp.
Significant motion and tilt functions Part number Package Packing
range [°C]
Indoor navigation
LSM6DS33 -40 to +85 Tray
Tap and double-tap detection LGA-16L
(3 x 3 x 0.86 mm) Tape &
IoT and connected devices LSM6DS33TR -40 to +85
Reel
Intelligent power saving for handheld devices
Vibration monitoring and compensation
Free-fall detection
6D orientation detection
Contents
1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4 Module specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.4 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.4.1 SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.4.2 I2C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.6 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.6.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.6.2 Zero-g and zero-rate level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2 Gyroscope power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.3 Accelerometer power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.4 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.4.1 Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.4.2 FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.4.3 Continuous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.4.4 Continuous-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.4.5 Bypass-to-Continuous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.4.6 FIFO reading procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.4.7 Filter block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7.1 LSM6DS33 electrical connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7.2 Pin compatibility with LSM6DS0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8 Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
9 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.1 FUNC_CFG_ACCESS (01h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.2 FIFO_CTRL1 (06h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.3 FIFO_CTRL2 (07h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.4 FIFO_CTRL3 (08h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
9.5 FIFO_CTRL4 (09h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
9.6 FIFO_CTRL5 (0Ah) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
9.7 ORIENT_CFG_G (0Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
9.8 INT1_CTRL (0Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
9.9 INT2_CTRL (0Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
9.10 WHO_AM_I (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
9.11 CTRL1_XL (10h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
9.12 CTRL2_G (11h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
9.13 CTRL3_C (12h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
9.14 CTRL4_C (13h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
9.15 CTRL5_C (14h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
9.16 CTRL6_C (15h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
9.17 CTRL7_G (16h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
9.18 CTRL8_XL (17h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
9.19 CTRL9_XL (18h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
9.20 CTRL10_C (19h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
12 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
13 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
13.1 LGA-16 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
13.2 LGA-16 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
List of tables
List of figures
1 Overview
The LSM6DS33 has been designed to be fully compliant with Android, featuring the
following on-chip functions:
8 kbyte data buffering
– 100% efficiency with flexible configurations and partitioning
– possibility to store timestamp
Event-detection interrupts (fully configurable):
– free-fall
– wakeup
– 6D orientation
– tap and double-tap sensing
– activity / inactivity recognition
Specific IP blocks with negligible power consumption and high-performance:
– pedometer functions: step detector and step counters
– tilt (Android compliant, refer to Section 2.1: Tilt detection for additional info
– significant motion (Android compliant)
3 Pin description
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4 Module specifications
±2
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Linear acceleration output data 208
LA_ODR
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G_ODR Angular rate output data rate
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416
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Top Operating temperature range -40 +85 °C
1. Typical specifications are not guaranteed.
2. Sensitivity values after factory calibration test and trimming.
3. Measurements are performed in a uniform temperature setup.
4. Values after soldering.
For details related to the LSM6DS33 operating modes, refer to 5.2: Gyroscope power
modes and 5.3: Accelerometer power modes.
Note: Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output
ports.
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4.6 Terminology
4.6.1 Sensitivity
Linear acceleration sensitivity can be determined, for example, by applying 1 g acceleration
to the device. Because the sensor can measure DC accelerations, this can be done easily
by pointing the selected axis towards the ground, noting the output value, rotating the
sensor 180 degrees (pointing towards the sky) and noting the output value again. By doing
so, ±1 g acceleration is applied to the sensor. Subtracting the larger output value from the
smaller one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This
value changes very little over temperature and over time. The sensitivity tolerance describes
the range of sensitivities of a large number of sensors.
An angular rate gyroscope is device that produces a positive-going digital output for
counterclockwise rotation around the axis considered. Sensitivity describes the gain of the
sensor and can be determined by applying a defined angular velocity to it. This value
changes very little over temperature and time.
5 Functionality
5.4 FIFO
The presence of a FIFO allows consistent power saving for the system since the host
processor does not need continuously poll data from the sensor, but it can wake up only
when needed and burst the significant data out from the FIFO.
LSM6DS33 embeds 8 kbytes data FIFO to store the following data:
gyroscope
accelerometer
step counter and timestamp
temperature
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6 Digital interfaces
The registers embedded inside the LSM6DS33 may be accessed through both the I2C and
SPI serial interfaces. The latter may be SW configured to operate either in 3-wire or 4-wire
interface mode. The device is compatible with SPI modes 0 and 3.
The serial interfaces are mapped onto the same pins. To select/exploit the I2C interface, the
CS line must be tied high (i.e connected to Vdd_IO).
SPI enable
CS I2C/SPI mode selection (1: SPI idle mode / I2C communication enabled;
0: SPI communication mode / I2C disabled)
I2C Serial Clock (SCL)
SCL/SPC
SPI Serial Port Clock (SPC)
I2C Serial Data (SDA)
SDA/SDI/SDO SPI Serial Data Input (SDI)
3-wire Interface Serial Data Output (SDO)
SPI Serial Data Output (SDO)
SDO/SA0
I2C less significant bit of the device address
There are two signals associated with the I2C bus: the serial clock line (SCL) and the Serial
DAta line (SDA). The latter is a bidirectional line used for sending and receiving the data
to/from the interface. Both the lines must be connected to Vdd_IO through external pull-up
resistors. When the bus is free, both the lines are high.
The I2C interface is implemeted with fast mode (400 kHz) I2C standards as well as with the
standard mode.
In order to disable the I2C block, (I2C_disable) = 1 must be written in CTRL4_C (13h).
Table 14. Transfer when master is receiving (reading) one byte of data from slave
Master ST SAD + W SUB SR SAD + R NMAK SP
Slave SAK SAK SAK DATA
Table 15. Transfer when master is receiving (reading) multiple bytes of data from slave
Master ST SAD+W SUB SR SAD+R MAK MAK NMAK SP
Slave SAK SAK SAK DATA DATA DATA
Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number
of bytes transferred per transfer is unlimited. Data is transferred with the Most Significant bit
(MSb) first. If a receiver can’t receive another complete byte of data until it has performed
some other function, it can hold the clock line, SCL LOW to force the transmitter into a wait
state. Data transfer only continues when the receiver is ready for another byte and releases
the data line. If a slave receiver doesn’t acknowledge the slave address (i.e. it is not able to
receive because it is performing some real-time function) the data line must be left HIGH by
the slave. The master can then abort the transfer. A LOW to HIGH transition on the SDA line
while the SCL line is HIGH is defined as a STOP condition. Each data transfer must be
terminated by the generation of a STOP (SP) condition.
In the presented communication format MAK is Master acknowledge and NMAK is No
Master Acknowledge.
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CS is the serial port enable and it is controlled by the SPI master. It goes low at the start of
the transmission and goes back high at the end. SPC is the serial port clock and it is
controlled by the SPI master. It is stopped high when CS is high (no transmission). SDI and
SDO are, respectively, the serial port data input and output. Those lines are driven at the
falling edge of SPC and should be captured at the rising edge of SPC.
Both the read register and write register commands are completed in 16 clock pulses or in
multiples of 8 in case of multiple read/write bytes. Bit duration is the time between two falling
edges of SPC. The first bit (bit 0) starts at the first falling edge of SPC after the falling edge
of CS while the last bit (bit 15, bit 23, ...) starts at the last falling edge of SPC just before the
rising edge of CS.
bit 0: RW bit. When 0, the data DI(7:0) is written into the device. When 1, the data DO(7:0)
from the device is read. In latter case, the chip will drive SDO at the start of bit 8.
bit 1-7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written into the device (MSb first).
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
In multiple read/write commands further blocks of 8 clock periods will be added. When the
CTRL3_C (12h) (IF_INC) bit is ‘0’, the address used to read/write data remains the same for
every block. When the CTRL3_C (12h) (IF_INC) bit is ‘1’, the address used to read/write
data is increased at every block.
The function and the behavior of SDI and SDO remain unchanged.
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The SPI Read command is performed with 16 clock pulses. A multiple byte read command
is performed by adding blocks of 8 clock pulses to the previous one.
Figure 9. Multiple byte SPI read protocol (2-byte example) (in mode 3)
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The SPI Write command is performed with 16 clock pulses. A multiple byte write command
is performed by adding blocks of 8 clock pulses to the previous one.
bit 0: WRITE bit. The value is 0.
bit 1 -7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written inside the device (MSb
first).
bit 16-... : data DI(...-8). Further data in multiple byte writes.
Figure 11. Multiple byte SPI write protocol (2-byte example) (in mode 3)
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8 Register mapping
The table given below provides a list of the 8/16 bit registers embedded in the device and
the corresponding addresses.
Status data
STATUS_REG r 1E 00011110 output
register
RESERVED - 1F 00011111 - Reserved
OUT_TEMP_L r 20 00100000 output Temperature
output data
OUT_TEMP_H r 21 00100001 output register
OUTX_L_G r 22 00100010 output
OUTX_H_G r 23 00100011 output
OUTY_L_G r 24 00100100 output Gyroscope
OUTY_H_G r 25 00100101 output output register
Interrupt
FUNC_SRC r 53 01010011 output
register
RESERVED - 54-57 - Reserved
TAP_CFG r/w 58 01011000 00000000
TAP_THS_6D r/w 59 01011001 00000000
INT_DUR2 r/w 5A 01011010 00000000
WAKE_UP_THS r/w 5B 01011011 00000000 Interrupt
WAKE_UP_DUR r/w 5C 01011100 00000000 registers
Registers marked as Reserved must not be changed. Writing to those registers may cause
permanent damage to the device.
The content of the registers that are loaded at boot should not be changed. They contain the
factory calibration values. Their content is automatically restored when the device is
powered up.
9 Register description
The device contains a set of registers which are used to control its behavior and to retrieve
linear acceleration, angular rate and temperature data. The register addresses, made up of
7 bits, are used to identify them and to write the data through the serial interface.
FTH_[7:0] Watermark flag rises when the number of bytes written to FIFO after the next write is
greater than or equal to the threshold level.
Minimum resolution for the FIFO is 1 LSB = 2 bytes (1 word) in FIFO
1. For a complete watermark threshold configuration, consider FTH_[11:8] in FIFO_CTRL2 (07h).
Pitch X X Y Y Z Z
Roll Y Z X Z X Y
Yaw Z Y Z X Y X
0 0 0 0 Power-down Power-down
0 0 0 1 12.5 Hz (low power) 12.5 Hz (high performance)
0 0 1 0 26 Hz (low power) 26 Hz (high performance)
0 0 1 1 52 Hz (low power) 52 Hz (high performance)
0 1 0 0 104 Hz (normal mode) 104 Hz (high performance)
0 1 0 1 208 Hz (normal mode) 208 Hz (high performance)
0 1 1 0 416 Hz (high performance) 416 Hz (high performance)
0 1 1 1 833 Hz (high performance) 833 Hz (high performance)
1 0 0 0 1.66 kHz (high performance) 1.66 kHz (high performance)
1 0 0 1 3.33 kHz (high performance) 3.33 kHz (high performance)
1 0 1 0 6.66 kHz (high performance) 6.66 kHz (high performance)
1. This bit must be set to ‘0’ for the correct operation of the device.
000 No rounding
001 Accelerometer only
010 Gyroscope only
011 Gyroscope + accelerometer
0 0 Normal mode
0 1 Positive sign self-test
1 0 Not allowed
1 1 Negative sign self-test
0 0 Normal mode
0 1 Positive sign self-test
1 0 Negative sign self-test
1 1 Not allowed
0 0 0.0081 Hz
0 1 0.0324 Hz
1 0 2.07 Hz
1 1 16.32 Hz
Table 65. Accelerometer slope and high-pass filter selection and cutoff frequency
HPCF_XL[1:0] Applied filter HP filter cutoff frequency [Hz]
00 Slope ODR_XL/50
01 High-pass ODR_XL/100
10 High-pass ODR_XL/9
11 High-pass ODR_XL/400
The table given below provides a list of the registers for the embedded functions avaialble in
the device and the corresponding addresses. Embedded functions registers are accessible
when FUNC_CFG_EN is set to ‘1’ in FUNC_CFG_ACCESS (01h).
Note: All modifications of the content of the embedded functions registers have to be performed
with the device in power-down mode.
Registers marked as Reserved must not be changed. Writing to those registers may cause
permanent damage to the device.
The content of the registers that are loaded at boot should not be changed. They contain the
factory calibration values. Their content is automatically restored when the device is
powered up.
Note: All modifications of the content of the embedded functions registers have to be performed
with the device in power-down mode.
12 Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and "Green" standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave "Pin 1 Indicator" unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
13 Package information
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A (max) 330
B (min) 1.5
C 13 ±0.25
D (min) 20.2
N (min) 60
G 12.4 +2/-0
T (max) 18.4
14 Revision history
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Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
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Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.