SKiiP 11NAB12T4V1

Absolute Maximum Ratings

Symbol Conditions Values Unit
Inverter - IGBT
VCES Tj = 25 °C 1200 V
IC λpaste=0.8 W/(mK) Ts = 25 °C 18 A
Tj = 175 °C Ts = 70 °C 14 A
IC λpaste=2.5 W/(mK) Ts = 25 °C 19 A
Tj = 175 °C Ts = 70 °C 16 A
ICnom 8 A
MiniSKiiP® 1 ICRM 24 A
VGES -20 ... 20 V
VCC = 800 V
Converter-Inverter-Brake tpsc VGE ≤ 15 V Tj = 150 °C 10 µs
(CIB) VCES ≤ 1200 V
Tj -40 ... 175 °C
Chopper - IGBT
VCES Tj = 25 °C 1200 V
IC λpaste=0.8 W/(mK) Ts = 25 °C 18 A
SKiiP 11NAB12T4V1
Tj = 175 °C Ts = 70 °C 14 A
IC λpaste=2.5 W/(mK) Ts = 25 °C 19 A
Tj = 175 °C Ts = 70 °C 16 A
Features*
• Trench 4 IGBTs ICnom 8 A
• Robust and soft switching freewheeling ICRM 24 A
diodes in CAL technology VGES -20 ... 20 V
• Highly reliable spring contacts for VCC = 800 V
electrical connections tpsc VGE ≤ 15 V Tj = 150 °C 10 µs
• UL recognized: File no. E63532 VCES ≤ 1200 V
Typical Applications Tj -40 ... 175 °C
• Inverter up to 8 kVA Inverse - Diode
• Typical motor power 4 kW VRRM Tj = 25 °C 1200 V
Remarks IF λpaste=0.8 W/(mK) Ts = 25 °C 15 A
Tj = 175 °C Ts = 70 °C 12 A
• Max. case temperature limited to
TC=125°C IF λpaste=2.5 W/(mK) Ts = 25 °C 17 A
• Product reliability results valid for Tj = 175 °C Ts = 70 °C 13 A
Tj≤150°C (recommended
IFRM 24 A
Tj,op=-40...+150°C)
• MiniSKiiP “Technical Explanations” IFSM tp = 10 ms, sin 180°, Tj = 150 °C 36 A
and “Mounting Instructions” are part of Tj -40 ... 175 °C
the data sheet. Please refer to both Freewheeling - Diode
documents for further information
VRRM Tj = 25 °C 1200 V
IF λpaste=0.8 W/(mK) Ts = 25 °C 15 A
Tj = 175 °C Ts = 70 °C 12 A
IF λpaste=2.5 W/(mK) Ts = 25 °C 17 A
Tj = 175 °C Ts = 70 °C 13 A
IFRM 24 A
IFSM tp = 10 ms, sin 180°, Tj = 150 °C 36 A
Tj -40 ... 175 °C

NAB

© by SEMIKRON Rev. 5.0 – 19.04.2022 1

SKiiP 11NAB12T4V1
Absolute Maximum Ratings
Symbol Conditions Values Unit
Rectifier - Diode
VRRM Tj = 25 °C 1600 V
IF λpaste=0.8 W/(mK) Ts = 25 °C 39 A
Tj = 150 °C Ts = 70 °C 29 A
IF λpaste=2.5 W/(mK) Ts = 25 °C 42 A
Tj = 150 °C Ts = 70 °C 32 A
IFSM tp = 10 ms Tj = 25 °C 220 A
MiniSKiiP® 1 sin 180° Tj = 150 °C 200 A
i2t tp = 10 ms Tj = 25 °C 242 A2s
sin 180° Tj = 150 °C 200 A2s
Converter-Inverter-Brake Tj -40 ... 150 °C
(CIB) Module
It(RMS) Tterminal = 80 °C, 12 A
Tstg module without TIM -40 ... 125 °C
Visol AC sinus 50 Hz, 1 min 2500 V
SKiiP 11NAB12T4V1
Characteristics
Symbol Conditions min. typ. max. Unit
Features*
Inverter - IGBT
• Trench 4 IGBTs
VCE(sat) IC = 8 A Tj = 25 °C 1.85 2.10 V
• Robust and soft switching freewheeling
VGE = 15 V
diodes in CAL technology Tj = 150 °C 2.25 2.45 V
chiplevel
• Highly reliable spring contacts for
electrical connections VCE0 Tj = 25 °C 0.80 0.90 V
chiplevel
• UL recognized: File no. E63532 Tj = 150 °C 0.70 0.80 V
rCE VGE = 15 V Tj = 25 °C 131 150 mΩ
Typical Applications
chiplevel Tj = 150 °C 194 206 mΩ
• Inverter up to 8 kVA
• Typical motor power 4 kW VGE(th) VGE = VCE, IC = 1 mA 5 5.8 6.5 V
ICES VGE = 0 V, VCE = 1200 V, Tj = 25 °C 1 mA
Remarks
Cies f = 1 MHz 0.49 nF
• Max. case temperature limited to VCE = 25 V
Coes f = 1 MHz 0.05 nF
TC=125°C VGE = 0 V
• Product reliability results valid for Cres f = 1 MHz 0.03 nF
Tj≤150°C (recommended QG VGE = - 8 V...+ 15 V 45 nC
Tj,op=-40...+150°C) RGint Tj = 25 °C 0 Ω
• MiniSKiiP “Technical Explanations” VCC = 600 V
td(on) Tj = 150 °C 31 ns
and “Mounting Instructions” are part of IC = 8 A
the data sheet. Please refer to both tr Tj = 150 °C 31 ns
RG on = 47 Ω
documents for further information Eon Tj = 150 °C 0.87 mJ
RG off = 47 Ω
td(off) Tj = 150 °C 290 ns
tf Tj = 150 °C 70 ns

Eoff VGE = +15/-15 V Tj = 150 °C 0.74 mJ

Rth(j-s) per IGBT, λpaste=0.8 W/(mK) 1.84 K/W

Rth(j-s) per IGBT, λpaste=2.5 W/(mK) 1.58 K/W

NAB

2 Rev. 5.0 – 19.04.2022 © by SEMIKRON

SKiiP 11NAB12T4V1
Characteristics
Symbol Conditions min. typ. max. Unit
Chopper - IGBT
VCE(sat) IC = 8 A Tj = 25 °C 1.85 2.10 V
VGE = 15 V
chiplevel Tj = 150 °C 2.25 2.45 V
VCE0 Tj = 25 °C 0.80 0.90 V
chiplevel
Tj = 150 °C 0.70 0.80 V
rCE VGE = 15 V Tj = 25 °C 131 150 mΩ
chiplevel Tj = 150 °C 194 206 mΩ
MiniSKiiP® 1 VGE(th) VGE = VCE, IC = 1 mA 5 5.8 6.5 V
ICES VGE = 0 V, VCE = 1200 V, Tj = 25 °C 1 mA
Converter-Inverter-Brake Cies
VCE = 25 V
f = 1 MHz 0.49 nF
Coes f = 1 MHz 0.05 nF
(CIB) VGE = 0 V
Cres f = 1 MHz 0.03 nF
QG VGE = - 8 V...+ 15 V 45 nC
RGint Tj = 25 °C 0 Ω
td(on) VCC = 600 V Tj = 150 °C 31 ns
SKiiP 11NAB12T4V1 IC = 8 A
tr Tj = 150 °C 31 ns
RG on = 47 Ω
Eon Tj = 150 °C 0.87 mJ
RG off = 47 Ω
td(off) Tj = 150 °C 290 ns
Features*
tf Tj = 150 °C 70 ns
• Trench 4 IGBTs
• Robust and soft switching freewheeling
Eoff VGE = +15/-15 V Tj = 150 °C 0.74 mJ
diodes in CAL technology
• Highly reliable spring contacts for
electrical connections Rth(j-s) per IGBT, λpaste=0.8 W/(mK) 1.84 K/W
• UL recognized: File no. E63532 Rth(j-s) per IGBT, λpaste=2.5 W/(mK) 1.58 K/W
Inverse - Diode
Typical Applications
VF = VEC IF = 8 A Tj = 25 °C 2.33 2.65 V
• Inverter up to 8 kVA
VGE = 0 V
• Typical motor power 4 kW Tj = 150 °C 2.35 2.68 V
chiplevel
Remarks VF0 Tj = 25 °C 1.30 1.50 V
chiplevel
• Max. case temperature limited to Tj = 150 °C 0.90 1.10 V
TC=125°C rF Tj = 25 °C 129 144 mΩ
• Product reliability results valid for chiplevel
Tj = 150 °C 181 198 mΩ
Tj≤150°C (recommended
IRRM IF = 8 A Tj = 150 °C 8.3 A
Tj,op=-40...+150°C)
Qrr di/dtoff = 380 A/µs T = 150 °C 1.35 µC
• MiniSKiiP “Technical Explanations” j
VGE = -15 V
and “Mounting Instructions” are part of Err Tj = 150 °C 0.57 mJ
VCC = 600 V
the data sheet. Please refer to both
documents for further information Rth(j-s) per Diode, λpaste=0.8 W/(mK) 2.53 K/W
Rth(j-s) per Diode, λpaste=2.5 W/(mK) 2.2 K/W
Freewheeling - Diode
VF = VEC IF = 8 A Tj = 25 °C 2.33 2.65 V
VGE = 0 V
chiplevel Tj = 150 °C 2.35 2.68 V
VF0 Tj = 25 °C 1.30 1.50 V
chiplevel
Tj = 150 °C 0.90 1.10 V
rF Tj = 25 °C 129 144 mΩ
chiplevel
Tj = 150 °C 181 198 mΩ
IRRM IF = 8 A Tj = 150 °C 8.3 A
Qrr di/dtoff = 380 A/µs T = 150 °C 1.35 µC
j
VGE = -15 V
Err VCC = 600 V T j = 150 °C 0.57 mJ
Rth(j-s) per Diode, λpaste=0.8 W/(mK) 2.53 K/W
Rth(j-s) per Diode, λpaste=2.5 W/(mK) 2.2 K/W

NAB

© by SEMIKRON Rev. 5.0 – 19.04.2022 3

SKiiP 11NAB12T4V1
Characteristics
Symbol Conditions min. typ. max. Unit
Rectifier - Diode
VF = VEC IF = 8 A Tj = 25 °C 1.00 1.21 V
chiplevel Tj = 125 °C 0.90 1.10 V
VF0 Tj = 25 °C 0.88 0.98 V
chiplevel
Tj = 125 °C 0.73 0.83 V
rF Tj = 25 °C 15 29 mΩ
chiplevel
Tj = 125 °C 21 34 mΩ
MiniSKiiP® 1 IR Tj = 145 °C, VRRM 1.1 mA
Rth(j-s) per Diode, λpaste=0.8 W/(mK) 1.5 K/W
Rth(j-s) per Diode, λpaste=2.5 W/(mK) 1.29 K/W
Converter-Inverter-Brake Module
(CIB) Ms to heat sink 2 2.5 Nm
w 30 g
LCE - nH
Temperature Sensor
SKiiP 11NAB12T4V1 1670 ±
R100 Tr=100°C (R25=1000Ω) Ω
3%
R(T)=1000Ω[1+A(T-25°C)+B(T-25°C)2]
Features* R(T) , A = 7.635*10-3°C-1,
• Trench 4 IGBTs B = 1.731*10-5°C-2
• Robust and soft switching freewheeling
diodes in CAL technology
• Highly reliable spring contacts for
electrical connections
• UL recognized: File no. E63532

Typical Applications
• Inverter up to 8 kVA
• Typical motor power 4 kW

Remarks
• Max. case temperature limited to
TC=125°C
• Product reliability results valid for
Tj≤150°C (recommended
Tj,op=-40...+150°C)
• MiniSKiiP “Technical Explanations”
and “Mounting Instructions” are part of
the data sheet. Please refer to both
documents for further information

NAB

4 Rev. 5.0 – 19.04.2022 © by SEMIKRON

SKiiP 11NAB12T4V1

Fig. 1: Typ. output characteristic Fig. 2: Typ. rated current vs. temperature Ic = f(Ts)

Fig. 3: Typ. turn-on /-off energy = f (IC) Fig. 4: Typ. turn-on /-off energy = f (RG)

Fig. 5: Typ. transfer characteristic Fig. 6: Typ. gate charge characteristic

© by SEMIKRON Rev. 5.0 – 19.04.2022 5

SKiiP 11NAB12T4V1

Fig. 7: Typ. switching times vs. IC Fig. 8: Typ. switching times vs. gate resistor RG

Fig. 9: Typ. transient thermal impedance Fig. 10: Typ. CAL diode forward characteristic

Fig. 11: Typ. CAL diode peak reverse recovery current Fig. 12: Typ. input bridge forward characteristic

6 Rev. 5.0 – 19.04.2022 © by SEMIKRON

SKiiP 11NAB12T4V1

Pinout and Dimensions

Pinout

© by SEMIKRON Rev. 5.0 – 19.04.2022 7

SKiiP 11NAB12T4V1
This is an electrostatic discharge sensitive device (ESDS) due to international standard IEC 61340.

*IMPORTANT INFORMATION AND WARNINGS

The specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics
("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in
typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective
application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their
applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical
injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is
compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written
document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of
the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is
given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation,
warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the
applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual
property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of
intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain
dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document
supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make
changes.

8 Rev. 5.0 – 19.04.2022 © by SEMIKRON