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FCBGA带Core基板制造工艺流程 FCBGAProcessflow

The document describes the FCBGA process which includes 3 main layers: core layer, build-up layer, and final finish. The core layer involves baking the panel, drilling, and copper plating through holes. The build-up layer includes laminating ABF material, laser drilling, lithography, and semi-additive or subtractive copper plating. The final finish involves applying solder mask, surface treatment, and backend processes like routing, presoldering, sawing, and electrical/visual testing.

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hhaiddao
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129 views

FCBGA带Core基板制造工艺流程 FCBGAProcessflow

The document describes the FCBGA process which includes 3 main layers: core layer, build-up layer, and final finish. The core layer involves baking the panel, drilling, and copper plating through holes. The build-up layer includes laminating ABF material, laser drilling, lithography, and semi-additive or subtractive copper plating. The final finish involves applying solder mask, surface treatment, and backend processes like routing, presoldering, sawing, and electrical/visual testing.

Uploaded by

hhaiddao
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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FCBGA Process introduction

ABF FCBGA Process Flow


(Final finish)

(Build-up layer)

(core layer)

Core Build-up Final


Backend
layer layer Finish
Core layer
Core Layer

Panel release Baking Reduce Copper

Mechanical
Drill

Cu Plating
(Through hole)

Plug Hole

Lithography I
Core layer
Core Layer

Panel release

Mechanical De-burr
Drill
Drill

Cu Plating
(Through hole)

Plug Hole

Lithography I Mechanical machine


Core layer
Core Layer

Panel release

Mechanical
Drill

Cu Plating Electro-less (C Line) Copper plating (Q Line)


(Through hole)

Plug Hole

Lithography I
Core layer
Core Layer

Panel release

Mechanical
Drill

Cu Plating
(Through hole)

Plug Hole plugging (Ink) Sanding

Lithography I
Core layer
Core Layer

Panel release

Mechanical
Drill

Cu Plating
(Through hole)

Plug Hole

Lithography I Subtractive process


Build-up layer
Build-up Layer

ABF MEC treatment Lamination Curing


Lamination

Laser Drill

Lithography II

Cu Plating
ABF Material
Build-up layer
Build-up Layer

ABF
Lamination

Laser Drill Laser drill De-smear E’less Cu

Lithography II

Cu Plating
Build-up layer
Build-up Layer

ABF
Lamination

Laser Drill

Lithography II Semi-additive

Cu Plating
D/F Material
Build-up layer
Build-up Layer

ABF
Lamination

Laser Drill

Lithography II

Cu Plating Cu plating Stripping


Final Finish
Final Finish

Solder Mask MEC treatment coating Exposure Develop Baking ( UV & Oven

Surface treatment
Final Finish
Final Finish

Solder Mask

Surface treatment Pre-treatment Surface treatment( IT, OSP ENEPIG)

Surface Finishing
表面處理
Backend
Backend

Routing Routing ( Panel to MP or to strip)

Presolder

Saw

Electric test

Final
visual test
Backend
Backend

Routing

Presolder Pre-solder Paste Reflow De-flux

Saw

Electric test

Final
visual test
Backend
Backend

Routing

Presolder

Saw Unit saw Coining

Electric test

Final
visual test
Backend
Backend
4W TST VI Picture

Routing

Presolder

Saw

Electric test TST

Final Bump AVI & VI WPG


visual test inspection inspection inspection
Thanks for attention

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