Lecture 5 – EMC Standards & Compliance Verification Prof. M. J.

Akhtar
EE 644A – EMI/EMC Techniques

Electromagnetic Interference and

Compatibility Techniques

Prof. M. Jaleel Akhtar

Department of Electrical Engineering

Indian Institute of Technology Kanpur
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Kanpur – 208016 (U.P.)

 Lecture 5 – EMC Standards & Compliance Verification Prof. M. J. Akhtar
EE 644A – EMI/EMC Techniques

Radiated Emission Limits for Class A and Class B Products - CISPR

 Standards for Class A and Class B equipment are measured at 10 m distance.
 Since the FCC and CISPR 22 limits for Class A equipment are both measured at 10 m,
no scaling is required.
 In order to scale FCC standards to the CISPR 22 Class B measurement distance of 10 m
we use the inverse distance rule and subtract 20 log10 ( 10/ 3 ) = 10.46 dB from the FCC
Class B limits at 3 m.

 CISPR 22 Radiated Emission Limits for Class B  CISPR 22 Radiated Emission Limits for Class A
ITE Equipment (10 m) ITE Equipment (10 m)

 The CISPR 22 Class B limits are more restrictive than the FCC Class-B limits
in the frequency range of 88 –230 MHz.
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Ref. Electromagnetic Compatibility by C. R. Paul

 Lecture 5 – EMC Standards & Compliance Verification Prof. M. J. Akhtar
EE 644A – EMI/EMC Techniques

Radiated Emission Limits for Class A and Class B Products - CISPR

 Standards for Class A and Class B equipment are measured at 10 m distance.

 CISPR 22 Radiated Emission Limits for Class B IT Equipment (10 m)  CISPR 22 Radiated Emission Limits for Class A IT Equipment (10 m)

CISPR 22 v/s FCC for Class A

CISPR 22 v/s FCC for Class B

 The CISPR 22 Class B limits are more restrictive than the FCC Class-B limits in the
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frequency range of 88 –230 MHz.

 Lecture 5 – EMC Standards & Compliance Verification Prof. M. J. Akhtar
EE 644A – EMI/EMC Techniques

Standards for Class A and Class B Products - CISPR

 Products to be also tested for their susceptibility (immunity) to conducted

and radiated emissions from other sources.

 This is in contrast to FCC regulations, which mainly regulates emissions

from the product.

 The product must be able to function properly without any degradation in

surrounding of harsh electromagnetic environment.

 The product may start malfunctioning due to a variety of factors;

 Electrostatic Discharge (ESD), EM fields radiated by external sources,
Electrical fast transient, surge immunity test, pulsed magnetic field immunity
test, damped oscillatory magnetic field test, voltage dips, harmonics at ac port,
common-mode disturbances up to 150 kHz, power quality tests.
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 Lecture 5 – EMC Standards & Compliance Verification Prof. M. J. Akhtar
EE 644A – EMI/EMC Techniques

MILITARY STANDARDS
 A large portion of the products of commercial firms are produced for military
applications.
 Specification of limits on emissions for control of interference is more critical for
military products than those of commercial products since interference can affect
mission performance of the system containing the product.

 The military emphasizes critically on the susceptibility issue: it is important to

control the susceptibility (immunity) of the electronic devices in the system to other
electromagnetic sources, e.g., high-power radars.
 The typical electromagnetic environment of a military system is usually considered
to be harsher than that of a commercial product.

 Military requirements can sometimes be waived and/or tailored as per requirement,

which is in contrast to the commercial product.
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 Lecture 5 – EMC Standards & Compliance Verification Prof. M. J. Akhtar
EE 644A – EMI/EMC Techniques

MILITARY STANDARDS
 The EMC requirements for products that are produced for use by the U.S. military are
contained in the military standard MIL-STD-461E
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Emission and Susceptibility Requirements of MIL-STD-461E

 Lecture 5 – EMC Standards & Compliance Verification Prof. M. J. Akhtar
EE 644A – EMI/EMC Techniques

MILITARY STANDARDS
 The emission measurements for the military standards are taken using a peak detector.
 The conducted emission measurements are carried out using a LISN inserted into the power leads.

 MIL-STD-461E CE102 limit for all applications  MIL-STD-461E RE102 limit for aircraft and space applications

 For military standards, all the radiated electric fields are measured at a distance of
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1 meter.
 Lecture 5 – EMC Standards & Compliance Verification Prof. M. J. Akhtar
EE 644A – EMI/EMC Techniques

Measurement of Emissions for Verification of Compliance

 Every standard that sets out limits on radiated and conducted emissions clearly
defines how the data are to be measured. This includes:
 Test procedure
 Test equipment
 Bandwidth
 Test antennas
 Specification of method for measurement is quite important so that the data gathered
on a product at one company’s test site can be validly compared to the limits and to
data gathered at another test site.
 The measurement procedure for the FCC measurements is contained in the
American National Standards Institute (ANSI) standard ANSI C63.4-2003
 The measurement procedures for CISPR 22 (EN 55022) and for MIL-STD-461E are
self-contained in the same standard that defines the limits.
 Design of an electronic product to comply with the regulatory limit might be sometimes
quite difficult, which is altogether different as compared to that of the functional
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performance.
 Lecture 5 – EMC Standards & Compliance Verification Prof. M. J. Akhtar
EE 644A – EMI/EMC Techniques

ADDITIONAL PRODUCT REQUIREMENTS

 Radiated Susceptibility (Immunity)
 The purpose of these tests is to ensure that the
product will operate properly when it is installed in the
vicinity of high-power transmitters.
 Manufacturers test their products by illuminating the
product with a typical waveform and signal level
representing the worst-case exposure of the product
and determining whether the product will perform
satisfactorily.
 Conducted Susceptibility (Immunity)
 The product must be insensitive to momentary power
interruptions as well as the transient spikes that are
generated on the power line.
 Manufacturers subject their products to these scenarios  EU & MIL regulatory standards
by intentionally injecting spikes into the product’s ac include susceptibility test.
power cord to simulate lightning induced transients.
 The ac voltage is also momentarily reduced and/or  FCC standards don’t include
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interrupted to check the functionality of the device. susceptibility test.

 Lecture 5 – EMC Standards & Compliance Verification Prof. M. J. Akhtar
EE 644A – EMI/EMC Techniques

ADDITIONAL PRODUCT REQUIREMENTS

 Electrostatic Discharge (ESD)
 The phenomenon is becoming quite challenging with the modern IC technology.
 Buildup of static charge on a person’s body, which may discharge to the product resulting into
static voltage of up to 25 kV thereby allowing large currents to momentarily flow through the
product. These large currents may cause IC memories to clear, machines to reset.
 The susceptibility to ESD phenomenon of any product is usually tested by subjecting it to a
controlled ESD environment and checking the functionality of the device.
 The EU standards include the ESD test for compliance, but the FCC and MIL don’t include it.
 Requirement for Commercial Aircraft
 The voluntary requirements for the commercial aircraft are documented by the Radio Technical
Commission for Aeronautics (RTCA).
 The RTCA-DO-160E standard contains limits for susceptibility, conducted and radiated emissions,
ESD and lightning under which the commercial aircraft and related electronics equipment are
tested.
 Requirement for Commercial Vehicles
 The onboard electronics in automobile in constantly increasing, leading to EM emissions as well
as being susceptible to external EM emissions.
 The vehicles should be tested as per CISPR 12 and CISPR 25 standards, US Society of
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Automotive Engineers (SAE J551, SAE J1113).

 Lecture 5 – EMC Standards & Compliance Verification Prof. M. J. Akhtar
EE 644A – EMI/EMC Techniques

RADOMES
 Rugged insulating material to safeguard RF antennas and other equipment.

 We introduce our test device to high power surge and ensure the device functioning.

PRODUCT DESIGN FROM EMC POINT OF VIEW

 From the beginning (designing of PCB land)  We should conceptualize product design so that EM
emissions are minimized.
 Device should be EMI/EMC conformity at no extra cost.
 Like using a metal shield for device appearance at the
SOURCE DETECTOR
market

 Field of EMI/EMC evolved due to several

advancements- High end automobiles and electronic
Txn LINE
circuitry functioning properly.
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 Lecture 5 – EMC Standards & Compliance Verification Prof. M. J. Akhtar
EE 644A – EMI/EMC Techniques

DESIGN CONSTRAINTS FOR PRODUCTS

 Compliance not always easy, but sometimes certain simple steps may be taken.
 For example, a digital device found to be susceptible to disturbances on the ac power cord may be
operated using internal batteries.
 The regulatory compliance should be done at NO extra cost.
 For radiated emissions, metal shielding box may be employed but the cables and wires for power
and data signals may act like efficient antennas.

 Few extra components may be added to reduce the level of emissions, but it would incur more cost
to the end product.
 Product marketability including appearance, ease of use, acceptability by the consumer etc.
 Extra components should be added during the automated manufacturing cycle without any manual
intervention.
 Product Development Schedule: EMC may cause delay to the originally planned schedule.
 It becomes usually difficult to diagnose the real source of emissions, and to reduce it in a cost-
effective manner. For example, which land of PCB or system cable is radiating??
 The effective diagnosis at an early stage of the design cycle may be quite helpful.
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 Lecture 5 – EMC Standards & Compliance Verification Prof. M. J. Akhtar
EE 644A – EMI/EMC Techniques

ADVANTAGE OF EFFECTIVE EMC DESIGN

 Minimize the additional cost due to extra suppression element in order to satisfy the regulatory
requirement;
 Maintain the actual product development schedule;
 Ensure product operation even in the harsh EM environment in order to minimize customer
complaints.
 Early & continuous applications of the EMC design throughout the product development cycle;
 Clock oscillator should not be located near to the cable connectors on PCBs;
 Implementation of EMC suppression measures at an early stage to minimize any customer delays;
 For example, placing holes or pads at the output of the clock or PCB to insert capacitor and/or
resistor at some stage to avoid emissions.

 Experienced EMC Engineer should be a part of the whole electronic design team so that the
EMC issues can be handled right from the early stage of design and any delay or the extra
cost may be avoided.

 Pre-compliance EMC Testing;

 Full compliance EMC Testing;
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