[2SMPB-02E] Datasheet Rev.05(Jun.

,2017)

2SMPB-02E
Digital Barometric Pressure Sensor
High accuracy and small size barometric pressure sensor
with low current consumption
 Measure barometric pressure and temperature with high accuracy

 Built in low noise 24bit ADC

 Digital control and output via I²C/SPI interface
 Automatically power down non-working circuit to minimize power consumption
 Individual calibration parameters stored in OTP*
(*One Time Programmable - ROM)

RoHS compliant

Application Example
・Indoor navigation (floor detection)
・Car navigation (to distinguish highway and frontage road)
・Altimeter
・Activity monitor (to detect up and down of stairs)
・Life log
・Weather forecast

Target Devices Example

・Smart Phones / Tablet PCs
・Wearable devices, such as watch type, band type, clip type or glasses type ・
GPS devices
・Healthcare devices such as pedometer

Packaging Information
■Standard Models with Surface Mounting Terminals
Structure Packaging Model Minimum Packing Unit
LGA 9pin Tape and Reel 2SMPB-02E 3,500

1 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

Table of Contents

1. Ratings, Specifications and Functions 3

1.1 Use conditions and recommended operating conditions 3
1.2 Absolute Maximum Ratings 3
1.3 Operating Ratings 3
1.4 Electrical Characteristics 3
1.5 Digital Interface Characteristics 4
1.6 Characteristics by Oversampling setting (Force mode) 4
1.7 rms Noise by IIR Filter Selection 4
1.8 Bandwidth by IIR Filter Selection 5
1.9 Filter selection based on use cases 5

2. Connection 6
2.1 Block Diagram 6
2.2 Pin Description and Layout 6
2.3 Typical Connection Diagram 7

3. Dimensions8
3.1 Package 8
3.2 Mounting PAD Dimensions 8
3.3 Marking structure 8

4. Operations 9
4.1 Communication Mode 9
4.2 Power Mode 9
4.3 Compensation of Pressure and Temperature 10
4.4 Implementing Register List 12
4.5 I²C Protocol 15
4.6 SPI Protocol 16
4.7 Interface specifications 17
4.8 Reset Function 19
4.9 Recommended conditions of communication 19

5. Packaging 20
5.1 Configuration of shipment20
5.2 Taping 20
5.3 Reel 21
5.4 Individual packaging 21

6. Recommended Soldering Method 22

7. Precautions22

8. Warranty and Limited Warranty 23

2 Copyright 2017 OMRON Corporation. All Rights Reserved.
 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

1. Ratings, Specifications and Functions

1.1 Use conditions and recommended operating conditions
Type of Pressure Absolute pressure
Medium Air (*1)
Operating Pressure Range 30kPa to 110kPa
Note. *1: Never use corrosive gases.

1.2 Absolute Maximum Ratings

Item Symbol Rating Unit Remark
Power Supply Voltage Vddmax 4.0 V
Input Voltage (other than power) Vmax -0.2～Vopr+0.2 V
Maximum Pressure Pmax 800 kPa
Storage Temperature Tstr -40～85 degC with no condensation or icing
Storage Humidity Hstr 10～95 %RH with no condensation or icing
ESD (HBM) Vhbm ±2000 V
ESD (MM) Vmm ±200 V
ESD (CDM) Vcdm ±500 V

1.3 Operating Ratings

Item Symbol Min Typ Max Unit Remark
Vopr 1.71 1.8 3.6 V VDD
Operating Voltage
Vio 1.20 1.8 3.6 V VDDIO
Operating Temperature Topr -40 - 85 degC

1.4 Electrical Characteristics

Item Symbol Condition Min Typ Max Unit
1sample/s force-mode
Average Current Ihp - 21.4 - uA
Ultra High Accuracy
Operating Current Iddp Pressure mode - 640 800 uA
Consumption Iddt Temperature mode - 410 520 uA
Sleep Mode Current
Isleep - 1.1 2.3 uA
Consumption
Measureable
Popr 30 - 110 kPa
Pressure Range
30-110kPa,
Absolute Pabs1 - ±50 -
0-65℃ Pa
Pressure Accuracy
Pabs2 30-110kPa,-20-0℃ ±80
Relative
Prel1 Ultra High Accuracy - ±3.9 - Pa
Pressure Accuracy
rms Noise Pnois Ultra High Accuracy - 1.3 - Pa
Absolute Temperature
Tabs 30-110kPa,-20-65℃ -2 - 2 degC
Accuracy
Pressure Resolution Pres - 0.06 - Pa
Temperature Resolution Tres - 0.0002 - degC
101.3kPa,0-40℃,
Power Supply
Ppsrr 1.71-3.6V -9.4 - 9.4 Pa
Rejection Ratio (DC)
Base on VDD=1.8V
（At Ta=25 degC, VDD=1.8V, unless otherwise noted）
Note : Typical specifications are not guaranteed

3 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

1.5 Digital Interface Characteristics

Item Symbol Condition MIN TYP MAX Unit
Digital Input Low Voltage Vil_d - - Vio*0.2 V
Digital Input High Voltage Vih_d Vio*0.8 - - V
Digital Input Hysterisis Voltage Vidhys Vio*0.1 - - V
Digital Output Low Voltage(I²C) Vol_d1 Io=3mA (SDI) *1) 0 - Vio*0.2 V
Io=1mA (SDI,SDO)
Digital Output Low Voltage(SPI) Vol_d2 *1) 0 - Vio*0.2 V
Digital Output High Voltage1 (SPI) Io=1mA (SDI,SDO)
Voh_d1 Vio*0.8 - - V
(Vio>=1.62V) *1)
Digital Output High Voltage2 (SPI) Io=1mA (SDI,SDO)
Voh_d2 Vio*0.6
(Vio>=1.2V) *1)
Leakage Current at Output OFF Ioff SDI,SDO -10 - 10 uA
Internal Pullup Resistor Rpullup CSB 70 120 190 kohm
I²C Load Capacitance Cb SDI,SCK - - 400 pF
Load Capacitance of
Crst - - 20 pF
Reset Terminal
Pulse Width of
Trst 100 - - ìsec
Asynchronous Reset
Power On Startup Time Tstart - - 10 msec
Note. *1) “Io” is the load current of the output terminal.
*2) Undescribed items are compliant with the I²C specification.
About detailed I²C bus information, please refer to the I²C bus specification and user manual
presented by NXP.

1.6 Characteristics by Oversampling setting (Force mode)

Average
ODR
Pressure Temperature Measurement Current Typ. rms Noise
Oversampling setting oversampling oversampling time Typ.
@standby 1ms
@1sample/sec Typ.
Typ.
force-mode
unit - - msec Hz uA Pa
High speed 2 1 5.5 153 4.1 5.2
Low power 4 1 7.2 121 5.2 3.7
Standard 8 1 10.6 86 7.3 2.6
High accuracy 16 2 18.3 51 12.0 1.8
Ultra High accuracy 32 4 33.7 28 21.4 1.3
（At Ta=25 degC, VDD=1.8V, CPU Clock Frequency=300kHz, unless otherwise noted） Note.
*1) These characteristics are guaranteed by design.
*2) ODR is defined as Output data rate at standby time 1msec.

1.7 rms Noise by IIR Filter Selection

Typical rms Noise in Pressure [Pa]
Oversampling setting IIR filter coefficient
off 2 4 8 16 32
High speed 5.2 2.5 1.6 1.1 0.8 0.5
Low power 3.7 1.8 1.1 0.8 0.5 0.4
Standard 2.6 1.3 0.8 0.5 0.4 0.3
High accuracy 1.8 0.9 0.6 0.4 0.3 0.3
Ultra High accuracy 1.3 0.6 0.4 0.3 0.3 0.2
（At Ta=25 degC, VDD=1.8V, unless otherwise noted）
Note. *1) IIR : Infinite Impulse Response.
*2) These characteristics are guaranteed by design.
*3) Initial setting of the IIR filter coefficient is “off”.

4 Copyright 2017 OMRON Corporation. All Rights Reserved.

[2SMPB-02E] Datasheet Rev.05(Jun.,2017)
1.8 Bandwidth by IIR Filter Selection
Typical Bandwidth [Hz]
Oversampling setting IIR filter coefficient
off 2 4 8 16 32
High speed 153.0 35.3 14.7 6.8 3.3 1.6
Low power 121.0 28.0 11.6 5.4 2.6 1.3
Standard 86.0 19.9 8.3 3.8 1.8 0.9
High accuracy 51.0 11.8 4.9 2.3 1.1 0.5
Ultra High accuracy 28.0 6.5 2.7 1.2 0.6 0.3
（At Ta=25 degC, VDD=1.8V, unless otherwise noted）
Note. *1) These characteristics are guaranteed by design.
*2) Initial setting of the IIR filter coefficient is “off”.

1.9 Filter selection based on use cases

Pressure Temp. Specification (Typ.)
Example Oversampling over over IIR Current
use case setting sampling sampling filter consumption ODR [Hz] rms Noise
(Example) [Pa]
times times coefficient [uA]
Weather
High speed ×2 ×1 off 1.2 0.05 5.2
monitoring
Drop detection Low power ×4 ×1 off 407 100 3.7

Elevator detection Standard ×8 ×1 4 63.4 10 0.8

Stair detection High accuracy ×16 ×2 8 219 20 0.4

Ultra high
Indoor navigation ×32 ×4 32 570 28 0.2
accuracy
（At Ta=25 degC, VDD=1.8V, unless otherwise noted）

Note. These characteristics are guaranteed by design.

5 Copyright 2017 OMRON Corporation. All Rights Reserved.

[2SMPB-02E] Datasheet Rev.05(Jun.,2017)
2. Connection
2.1 Block Diagram
VDD GND RST

SB
Voltage CLK Gen. POR
Supply
Pressure/ Sp
Temperature
sensing Sm ADC
element
It
Analog
MUX
front-end Logic
CSB

GND I/O SDI

SCK
NVM
SDO

VPP VDDIO
2.2 Pin Description and Layout
Pin 1 indicator

⑧ ⑨ ① ① ⑨ ⑧

⑦ ② ② ⑦

⑥ ③ ③ ⑥

⑤ ④ ④ ⑤

Top View Bottom View

Pin Description
Description
No. Symbol
SPI I²C
１ RST Asynchronous Reset *1)
２ CSB CSB VDDIO
３ SDI SDI/SDO SDA
４ SCK SCK SCL
５ SDO SDO ADDR
６ VDDIO Power Terminal for Digital IO
７ GND Ground Terminal
８ VDD Power Terminal
９ VPP NVM Writing Terminal *2)

Note. *1) If you do not need the reset function, please just have the layout design of PCB of
connecting both No. 1 (RST) pin and No. 7 (GND) pin into the ground of PCB.
Please refer "4.8 Reset Function" for the case of using the reset function.
*2) Pin 9 is only used internally in OMRON. Please leave the pin disconnected.
If Pin 9 is connected with any other Pin electrically, the sensor will not work properly.

6 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

2.3 Typical Connection Diagram

(1) I²C mode

Corresponding to 100Kbit/s (at Standard Mode), 400Kbit/s (at Fast Mode) and 3.4Mbit/s (at High Speed Mode)

VPP
VDD
8 RST

GND
7

VDDIO
6 SDA

SDO
5 SCL

1uF Slave address SEL (gnd or VDDIO)

1uF

VDDIO VDD

(2) 4-wire SPI mode (Corresponding

to 10Mbit/s)

1uF
1uF

VDDIO VDD

(3) 3-wire SPI mode (Corresponding

to 10Mbit/s)

1uF
1uF

VDDIO VDD
7 Copyright 2017 OMRON Corporation. All Rights Reserved.
 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

3. Dimensions
(unit: mm)
3.1 Package
Package Type ： LGA (Land Grid Array) 9pin
Package Size ： 2.00×2.50×0.85 mm

3.2 Mounting PAD Dimensions

(Top View) : Recommended

002.

3.3 Marking structure

◎ Pin 1 indicator
PB2E
XXXXX
Pressure Port

8 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

4. Operations
4.1 Communication Mode
This sensor is corresponding to I²C and SPI communication.
Digital interface terminal functions for each communication mode are as below.
Communication mode CSB SDI SCK SDO Remark
I²C VDDIO SDA SCL GND/VDDIO SDO=GND→70h、SDO=VDDIO→56h
SPI 3 Wires CSB SDI/O SCK - spi3w Register = 1
SPI 4 Wires CSB SDI SCK SDO spi3w Register = 0
When changing the communication mode, also see Typical Connection Diagram section.
1) I²C mode becomes effective by pulling CSB up to VDDIO.
2) SPI mode becomes effective by pulling CSB down to GND.
3) Once CSB is pulled down, SPI mode would not be changed unless otherwise Power on Reset (POR) or Asyn-
chronous Reset. Switching between SPI 3-Wire mode and SPI 4-Wire mode can be configured with the register
value of “spi3w”. Refer to IO_SETUP register section for more detail.
4) Default mode after POR or Asynchronous Reset will be I²C mode.

4.2 Power Mode

This sensor has three power modes and it can be switched by setting CTRL_MEAS register.
Refer to the “CTRL_MEAS” register section for more detail.
・ Sleep mode
・ Normal mode
・ Forced mode
Transition diagram for each mode is as follows.

Power ON

POR

Asynchronous Reset
(Reset [ 7 : 0 ] = E6h

Down load OTP

Power_mode[1:0]=11
Sleep Mode Normal Mode
Power_mode[1:0]=00

Power_mode[1:0]=01 or 10 Power_mode[1:0]=01 or 10

Forced Mode

1) Sleep Mode (Power Reduction Mode)

No measurements are performed.
I²C/SPI interface and each register can be accessed even if the sensor is in sleep mode.

2) Forced Mode
In case of Forced Mode, a single measurement is performed. When the set up measurement is finished,
the sensor returns to Sleep Mode after storing the measurement data to the register.
Pow er on

Pow er Off ・・・

・・ POR Dow nload OTP sleep Temperature Measurement x temp_av erage[2:0] Pressure Measurement x temp_av erage[2:0] sleep Temperature Measurement x temp_av erage[2:0] ・

Read COE_** pow er_mode[1:0] = 01 or 10 pow er_mode[1:0] = 01 or 10

3) Normal Mode
In case of Normal Mode, the measurements are performed repeatedly between a measurement period and a
standby period. The standby time can be configured by “t_stanby[1:0]” register. Be sure to consider
that the data must be read from the master side after a Normal Mode.
Pow er on

Pow er Off ・・・

・・ POR Dow nload OTP sleep Temperature Measurement x temp_av erage[2:0] Pressure Measurement x temp_av erage[2:0] sleep Temperature Measurement x temp_av erage[2:0] ・

Read COE_** pow er_mode[1:0] = 11 t_stanby [s]

9 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

4.3 Compensation of Pressure and Temperature

This section describes a typical measurement procedure and a calculation method after POR. This sensor has com-
pensation coefficients in internal Non Volatile Memory (NVM). The compensated pressure can be calculated by
using these values.

START

⑥ Co
① Configure IO mode setting by mp : Read/Write Values through
“IO_STUP” register ens Digital I/F
ate
Te
② Read Compensation Coefficients from mp
: Calculation by User MCU
N.V.M. ( COE_** ) era
tur
e
③ Configure Averaging Times Val
and Power Mode ue

④ Read Uncompensated Temperature

Value ( TEMP_TXDx )

⑤ Read Uncompensated
Pressure Value ( PRESS_TXDx )

Tr

⑦ Compensate Calc
Pressure Value ulatio
n
Resu
lt of
MSB of PRESS_TXDx, Tem
TEMP_TXDx and COE_** perat
are sign bit. ure
(
Tr/25
① Configure IO mode setting. Refer
6=
to IO_SETUP register section for Tem
more detail. perat
② Read compensation ure
coefficients which [degr
are stored in NVM. eeC]
This procedure is )
sufficient just once e.g.) If Tr Value is 6400 LSB,
after POR. These
values are used for
a compensation Dt Raw Temperature Data [digit] ( 20-24bits measurement value of TEMP_TXDx
calculation at the a0 Compensation Coefficient of PTAT (NVM resister: COE_a0_ex, COE_a0_0, C
step ⑥ and ⑦. a1 Compensation Coefficient of PTAT (NVM resister: COE_a1_0, COE_a1_1 )
③ Configure averaging times and a2 Compensation Coefficient of PTAT (NVM resister: COE_a2_0, COE_a2_1 )
power mode. Refer to
CTRL_MEAS register section for
more detail.
④ Read raw temperature data which
are stored in TEMP_TXDx registers.
⑤ Read raw pressure data which are
stored in PRESS_TXDx registers.
⑥ Compensated temperature can be
calculated by using the below formula
and the values of the step ② and ④.

Tr  a0  a1 Dt 
a2  Dt
2
10 Copyright 2017 OMRON Corporation. All Rights Reserved.
 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

⑦ Correction pressure without temperature compensation can be calculated by using the below formula and the values
of the step ② and ⑥.
Pr  b00  bt1Tr  bp1 Dp  b11 Dp Tr  bt2 Tr 2  bp2  Dp2
 b12  Dp Tr 2  b21 Dp2 Tr  bp3  Dp3
e [degreeC] )
Pr Calcu Raw Pressure Data [digit] ( 20-24bits
Tr lation measurement value of PRESS_TXDx Reg. )
Dp Resul Compensation Coefficient of Pressure ( NVM resister:
b00 t of COE_b00_ex, COE_b00_0, COE_b00_1 )
bt1 Press Compensation Coefficient of Pressure ( NVM
bp1 ure resister: COE_bt1_0, COE_bt1_1 )
b11 [Pa] Compensation Coefficient of Pressure ( NVM
bt2 Calcu resister: COE_bp1_0, COE_bp1_1 )
bp2 lation Compensation Coefficient of Pressure ( NVM
b12 Resul resister: COE_b11_0, COE_b11_1 )
b21 t of Compensation Coefficient of Pressure ( NVM
bp3 Temp resister: COE_bt2_0, COE_bt2_1 )
eratur Compensation Coefficient of Pressure ( NVM
e resister: COE_bp2_0, COE_bp2_1 )
( Compensation Coefficient of Pressure ( NVM
Tr/25 resister: COE_b12_0, COE_b12_1 )
6= Compensation Coefficient of Pressure ( NVM
Temp resister: COE_b21_0, COE_b21_1 )
eratur Compensation Coefficient of Pressure ( NVM
resister: COE_bp3_0, COE_bp3_1 )
nt
 How to get compensation
coefficients
Each compensation coefficients can
※ values
Dn are
be calculated by using the below (D unsign
formula and conversion factors. 23 ed
～ 24bits
・・・ D0
K  A  S  OTP a1,a2,bt1,bt2,bp1,b11,bp2,b12,b21,bp3
):
values.
The
32767 Se
values
ns
Conversion factor or need
K to do
A Da
a1 -6.3E-03 ta subtra
a2 -1.9E-11 … ction
bt1 1.0E-01 … with
bt2 1.2E-08 23
Th 2 at
bp1 3.3E-02 e 24bits
b11 2.1E-07 val
bp2 -6.3E-10
output
ue mode.
b12 2.9E-13 of
b21 2.1E-15 Here is
n
bp3 1.3E-16
bit a
(1 progra
Conversion factor or ming
K
0) exampl
a0 Offset value (20Q16) ※ e for
b00 Offset value (20Q16) Dt and
T
h Dp
e calcula
tion.
 r
TEMP(PRESS)_TXDx :
Temperature and Pressure data : TXD0, a Dt  ((TEMP _ TXD2)
TXD1 or TXD2 w 16)  ((TEMP _
This sensor holds ADC data with TXD1)  8)  (TEMP
22 to 24 bits accuracy. It can be m
obtained as each 24 bits data. If _ TXD0)  pow(2,23)
e
there are redundant data, the low a Dp  ((PRESS _ TXD2)
order positions will be filled by zero
(0). The shaded regions as shown
s 16)  ((PRESS _
below are valid data area.
u TXD1)  8)  (PRESS
r
bit 24 23 22 _ TXD0)  pow(2,23)
e
22bits output D21 D20 D19
m
23bits output D22 D21 D20
e
11 Copyright 2017 OMRON Corporation. All Rights Reserved.
 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

4.4 Implementing Register List

Register Name Address Length R/W Data Discription Initial

I2C SPI bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
TEMP_TXD0 0xFC 0x7C 8bit R/- t_txd0[7:0] Temperature DATA[8:1] in 24bit 00h
TEMP_TXD1 0xFB 0x7B 8bit R/- t_txd1[7:0] Temperature DATA[16:9] in 24bit 00h
TEMP_TXD2 0xFA 0x7A 8bit R/- t_txd2[7:0] Temperature DATA[24:17] in 24bit (*) 00h
PRESS_TXD0 0xF9 0x79 8bit R/- p_txd0[7:0] Pressure DATA[8:1] in 24bit 00h
PRESS_TXD1 0xF8 0x78 8bit R/- p_txd1[7:0] Pressure DATA[16:9] in 24bit 00h
PRESS_TXD2 0xF7 0x77 8bit R/- p_txd2[7:0] Pressure DATA[24:17] in 24bit (*) 00h
t_stanby[2:0] : Standby time setting
spi3_s
IO_SETUP 0xF5 0x75 8bit R/W t_stanby[2:0] - - spi3w spi3w : SPI mode setting (4 or 3 wire) 00h
dim
spi3_sdim : Select output type of SDI terminal
temp_average[2:0] : Temperature Averaging times
CTRL_MEAS 0xF4 0x74 8bit R/W temp_average[2:0] press_average[2:0] power_mode[1:0] press_average[2:0] : Pressure Averaging times 00h
power_mode[1:0] : Power mode setting
DEVICE_STAT 0xF3 0x73 8bit R/- - - - - measure - - otp_update measure : Status of measurement 00h
otp_update : Status of OTP data access
I2C_SET 0xF2 0x72 8bit R/W - - - - - master_code[2:0] Master code setting at I2C HS mode 01h
IIR_CNT 0xF1 0x71 8bit R/W - - - - - filter[2:0] IIR filter co-efficient setting 00h
When inputting"E6h",
RESET 0xE0 0x60 8bit W reset[7:0] 00h
a software reset will be occurred
CHIP_ID 0xD1 0x51 8bit R/- chip_id[7:0] CHIP_ID: 5Ch 5Ch
COE_b00_a0_ex 0xB8 0 ｘ 38 8bit R/- b00[3:0] / a0[3:0] Compensation Coefficient -
COE_a2_0 0xB7 0 ｘ 37 8bit R/- a2[7:0] Compensation Coefficient -
COE_a2_1 0xB6 0 ｘ 36 8bit R/- a2[15:8] Compensation Coefficient (*) -
COE_a1_0 0xB5 0 ｘ 35 8bit R/- a1[7:0] Compensation Coefficient -
COE_a1_1 0xB4 0 ｘ 34 8bit R/- a1[15:8] Compensation Coefficient (*) -
COE_a0_0 0xB3 0 ｘ 33 8bit R/- a0[11:4] Compensation Coefficient -
COE_a0_1 0xB2 0 ｘ 32 8bit R/- a0[19:12] Compensation Coefficient (*) -
COE_bp3_0 0xB1 0 ｘ 31 8bit R/- bp3[7:0] Compensation Coefficient -
COE_bp3_1 0xB0 0 ｘ 30 8bit R/- bp3[15:8] Compensation Coefficient (*) -
COE_b21_0 0xAF 0 ｘ 2F 8bit R/- b21[7:0] Compensation Coefficient -
COE_b21_1 0xAE 0 ｘ 2E 8bit R/- b21[15:8] Compensation Coefficient (*) -
COE_b12_0 0xAD 0 ｘ 2D 8bit R/- b12[7:0] Compensation Coefficient -
COE_b12_1 0xAC 0 ｘ 2C 8bit R/- b12[15:8] Compensation Coefficient (*) -
COE_bp2_0 0xAB 0 ｘ 2B 8bit R/- bp2[7:0] Compensation Coefficient -
COE_bp2_1 0xAA 0 ｘ 2A 8bit R/- bp2[15:8] Compensation Coefficient (*) -
COE_b11_0 0xA9 0x29 8bit R/- b11[7:0] Compensation Coefficient -
COE_b11_1 0xA8 0x28 8bit R/- b11[15:8] Compensation Coefficient (*) -
COE_bp1_0 0xA7 0x27 8bit R/- bp1[7:0] Compensation Coefficient -
COE_bp1_1 0xA6 0x26 8bit R/- bp1[15:8] Compensation Coefficient (*) -
COE_bt2_0 0xA5 0x25 8bit R/- bt2[7:0] Compensation Coefficient -
COE_bt2_1 0xA4 0x24 8bit R/- bt2[15:8] Compensation Coefficient (*) -
COE_bt1_0 0xA3 0x23 8bit R/- bt1[7:0] Compensation Coefficient -
COE_bt1_1 0xA2 0x22 8bit R/- bt1[15:8] Compensation Coefficient (*) -
COE_b00_0 0xA1 0x21 8bit R/- b00[11:4] Compensation Coefficient -
COE_ b00_1 0xA0 0x20 8bit R/- b00[19:12] Compensation Coefficient (*) -
(*) MSB of PRESS_TXDx, TEMP_TXDx and COE_** are sign bit.

12 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

IO_SETUP : IO SETUP Register

Register Name I²C Addr. SPI Addr. Length R/W bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 initial
IO_SETUP 0xF5 0x75 8bits R/W t_stanby[2:0] - - spi3_sdim - spi3w 0x00
bit7～5 t_stanby[2:0] : Standby time setting
000 001 010 011 100 101 110 111
1ms 5ms 50ms 250ms 500ms 1s 2s 4s
bit3～4 Reserved : keep these bits at 0
bit2 spi3_sdim : Select output type of SDI terminal
0 : Lo / Hi-Z output
1 : Lo / Hi output
bit1 Reserved : keep this bit at 0
bit0 spi3w : Change mode between SPI 4-wire and SPI 3-wire
0 : 4-wire (Default)
1 : 3-wire

CTRL_MEAS : Measurement Condition Control Register

Register Name I²C Addr. SPI Addr. Length R/W bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 initial
CTRL_MEAS 0xF4 0x74 8bits R/W temp_average[2:0] press_average[2:0] power_mode[1:0] 0x00

bit7,6,5 temp_average[2:0] Averaging times setting for Temperature measurement (skip means no measurement.）
000 001 010 011 100 101 110 111
skip 1 2 4 8 16 32 64
Averaging times setting for Pressure measurement（skip means no
bit4,3,2 press_average[2:0] measurement.）
000 001 010 011 100 101 110 111
skip 1 2 4 8 16 32 64
bit1,0 power_mode[1:0] Operation mode setting
0 : Sleep
mode 01,10 :
Forced mode
11 : Normal mode

DEVICE_STAT : Device Status Register

Register Name I²C Addr. SPI Addr. Length R/W bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 initial

DEVICE_STAT 0xF3 0x73 8bits R - - - - measure - - otp_update 0x00

bit7～4 Reserved : keep these bits at 0

bit3 measure Device operation status. This value automatically changes.
0: Finish a measurement -- waiting for next measurement
1: On a measurement -- waiting for finishing the data store
bit2,1 Reserved : keep these bits at 0
bit0 otp_update The status of OTP data access. This value automatically changes.
0: No accessing OTP data
1: While accessing OTP data

I²C_SET : Master code setting

Register Name I²C Addr. SPI Addr. Length R/W bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 initial

I²C_SET 0xF2 0x72 8bits R/W - - - - - master_code[2:0] 0x01

bit7～3 Reserved : keep these bits at 0

bit2,1,0 master code[2:0] Master code setting at I²C high-speed mode.
000 001 010 011 100 101 110 111
0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F
 13 Copyright 2017 OMRON Corporation. All Rights Reserved.
[2SMPB-02E] Datasheet Rev.05(Jun.,2017)

IIR_CNT : IIR filter co-efficient setting Register

Register Name I²C Addr. SPI Addr. Length R/W bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 initial
IIR_CNT 0xF1 0X71 8bits R/W - - - - - filter[2:0] 0x00
bit7～3 Reserved : keep these bits at 0
bit2,1,0 filter[2:0] IIR filter co-efficient setting
Write access to this register address, IIR filter will be initialized.

Note. Initial setting of the IIR filter coefficient is “OFF”

.

IN 1/N OUT

N-1 Z-1

000 001 010 011 100 101 110 111

OFF N=2 N=4 N=8 N=16 N=32 N=32 N=32

RESET : Reset Control Register

Register Name I²C Addr. SPI Addr. Length R/W bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 initial
RESET 0xE0 0x60 8bits W reset[7:0] 0x00
bit7～0 reset[7:0] When input "E6h", the software reset will be effective.
Except for that, nothing is to happen.

CHIP_ID : Chip ID Confirmation Register

Register Name I²C Addr. SPI Addr. Length R/W bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 initial
CHIP_ID 0xD1 0x51 8bits R chip_id[7:0] 0x5C
bit7～0 chip_id[7:0] 5C
14 Copyright 2017 OMRON Corporation. All Rights Reserved.
 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

4.5 I²C Protocol

(1) I²C Slave Address
The 2SMPB-02 module I²C slave address is shown below.
I²C Slave bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
SDO Bit
Address (7bits) Add[6] Add[5] Add[4] Add[3] Add[2] Add[1] Add[0] R/W
High(1) 56h+R/W Value 1 0 1 0 1 1 0 1/0
Low(0) 70h+R/W Value 1 1 1 0 0 0 0 1/0
For example, in case of SDO=Low (0),
Write Access ： Please set LSB of slave address as “0”, then the address is E0h(1110_0000b). (70h<<1+WR(0))
Read Access ： Please set LSB of slave address as “1”, then the address is E1h(1110_0001b). (70h<<1+RD(1))

(2) I²C Access Protocol Examples

Symbol
・ START ： START condition
・ STOP ： STOP condition
・ Re-START ： Re-START condition for Read
・ SACK ：Acknowledge by Slave
・ MACK ：Acknowledge by Master
・ MNACK： Not Acknowledge by Master

(3) Register Write Access Protocol

After the START condition, a Device Address is sent. This address is seven bits long followed by an eighth bit which is a
data direction bit. A ‘zero’ indicates a transmission “WRITE”. After that, the register address and the writing data shall be
one set and it should be continuously transmitted until a STOP condition. A data transfer is always terminated by a STOP
condition generated by the master.

SCL 7 6 5 4 3 2 1 0

SD A Start DeviceAddress 0 ACK

7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0

Register Address ACK Write Data ACK

・・
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 ・

・・
Register Address ACK Write Data ACK ・ ACK Stop

※Black characters : Master → Slave / Blue characters : Slave → Master

(4) Register Read Access Protocol

After a START condition, the Device Address with WRITE sign (“0”) and Word Address intended to read a fir st data
are transmitted. Next, “STOP–START” or “Re-START” condition are transmitted by the master. After th at, Device
Address with READ sign (“1”) is transmitted by the master. Then, the slave will output the first dat a that is intended to
read. In case of incrementing Register Address automatically, the slave will output the d ata repeatedly until NACK is
input by the master. If Register Address becomes "0xFF", please continue to out put "0xFF." Below example shows 3
bytes reading method from "0xFA" register.

SCL 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0

SD A Start DeviceAddress 0 ACK Register Address"0xFA" ACK

7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0

Start DeviceAddress 1 ACK Read Data of "0xFA" ACK

7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0

Read Data of "0xFB" ACK Read Data of "0xFC" NACK Stop

15 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

4.6 SPI Protocol

(1) SPI write
“SPI Write” needs to transmit the one set data of Register Address(Ctl.=”0”+Address) and a writing data in the situation
where CSB is "L". Two or more writing can be possible during CSB is “L”. If CSB becomes "H", SPI communication
will finish. (as well as I²C write)

CSB

SCK ・・・ ・・・ ・・・ ・・・ ・・・

SDI/O Start 0 Address(7bit) Write Data(8bit) 0 Address(7bit) Write Data(8bit) ・・・Stop

(2) SPI read

First, “SPI read” needs to transmit Register Address(Ctl.=”1”+Address) in a situation where CSB is "L".
Next, the data of the requested register address will be output from SDO. (in case of 3-wire mode, the data will be output
from SDI). After that, the register address is automatically incremented by one until CSB becomes
“H”, the device will output the data repeatedly. (as well as I²C read) Below
shows an example of the 2 bytes reading from "0xFA" register.

CSB

SCK ・・・ ・・・ ・・・

SDI/O Start 1 Address"0x7A"(7bit) Read Data of "0x7A" Read Data of "0x7B" Stop

16 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

4.7 Interface specifications

(1) I²C timings
All timings apply to 100kbps（at Standard Mode） , 400kbps (at Fast Mode) and 3.4Mbps(at High Speed Mode).
For I²C timings, the following abbreviations are used :
*1) S&F Mode = standard and fast mode
*2) Cb = bus capacitance on SDI line
All other naming refers to I²C specification 2.1 (January 2000).

Undescribed items and symbols are compliant with the I²C specification.

Items Symbol Condition min typ max Units Remark

S&F Mode *1) 160 - - ns
SDI setup time t SUDAT HS Mode *2) Vio=1.62V 30 - - ns
HS Mode Vio=1.2V 55 - - ns
S&F Mode,Cb≦100pF 80 - - ns
S&F Mode,Cb≦400pF 90 - - ns
HS Mode,Cb≦ Vio=1.62V 18 - 115 ns
SDI hold time t HDDAT
100pF Vio=1.2V 25 - 140 ns
HS Mode,Cb≦ Vio=1.62V 24 - 150 ns
400pF Vio=1.2V 45 170 ns
HS Mode,Cb≦ Vio=1.62V 160 - - ns
SCK low pulse t Low
100pF Vio=1.2V 210 - - ns

17 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

(2) SPI timings

All timings are applied both to 4- and 3-wire SPI.
To reduce external noise in High-Z state, we recommend the following; ・In
4-wire mode, SDO terminal is pulled up to Vio via the resister.
・In 3-wire mode, SDI terminal is pulled up to Vio via the resister.
e.g.) Rpullup = 3.6kΩ ＠Vio=1.8V.

Items Symbol Condition min typ max Units Remark

SCK frequency f_spi — — 10 MHz

SCK low pulse t_low_sck 40 — — ns

SCK high pulse t_high_sck 40 — — ns

SDI setup time t_setup_sdi 20 — — ns

SDI hold time t_hold_sdi 20 — — ns

Cb=25pF,Vio=1.62V min — — 30 ns
SDO output delay t_delay_sdo
Cb=25pF,Vio=1.2V min — — 40 ns

CSB setup time t_setup_csb 40 — — ns

CSB hold time t_hold_csb 40 — — ns

CSB_HI time t_csb_hi 100 — — ns

18 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

4.8 Reset Function

The sensor is capable of resetting the operation with "Asynchronous Reset Terminal (RST pin)".
The procedure is as follows:
① Input high voltage to RST pin. (100us ≧)
② Turn off (input low voltage) and wait 10ms.

◆Reset sequence

VDD/VDDIO

RST

Logic reset POR reset

IO state disable enable disable enable

10ms 100us0s≧ 10ms

4.9 Recommended conditions of communication

In case that this sensor and other sensors are connected with a common bus line, if you use this sensor at a communica-
tion speed more than 400kbit/s,
after finishing the communication with other sensors, we recommend to provide 1 ms or more waiting time
before starting the communication with this sensor in order to ensure a stable communication (see diagram below).

◆Typical connection diagram ◆Example of communication

・
・
MCU
Sensor Sensor 2SMPB Sensor Sensor
1msec≧
2SMPB Sensor ・
A B -02E A B -02E A
time

19 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

5. Packaging
5.1 Configuration of shipment
Packaging Embossed Carrier Tape
Quantity 3,500 pcs / 1 reel
1 reel / 1 Interior box
Max. 20 Interior boxes / 1 exterior box
Reel 180 mm dia.
Insert method see below
Specification of taping & reel comply with JIS C 0806-3 (IEC 60286-3).

5.2 Taping

Emboss pitch 4 mm type & tape width 8 mm type.

A-A cross-section

B-B cross-section

Symbol Rating
W 8.0 +0.03/-0.1
E1 1.75 +/- 0.1
F 3.50 +/- 0.05
P0 4.0 +/- 0.1
P1 4.0 +/- 0.1
P2 2.00 +/- 0.05

Trailer (no Sensor) Embossed Carrier Tape

> 160 mm Sensor housing unit

No Sensor unit

> 100 mm

Direction to pull out

20 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

5.3 Reel

Direction to pull out

Label

Reel 180 mm dia.

comply with JIS C 0806-3 requirements

5.4 Individual packaging

Aluminium-laminated bag Label

Reel

Aluminium-laminated bag

Label

21 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

6. Recommended Soldering Method

■ Soldering method : Air Reflow ( Max 2 times )
■ Condition of Temperature : Max.260 degreeC, within 40seconds
■ Recommended Soldering Method :

Temperature profile conditions of

T4 reflow soldering should set the tem-
perature condition as shown in the
T3 below table and then confirm that
actual conditions are met them in the
( ℃)

T2
t2 table.
Soldering
Temperat

Preheating
ure

T1

t1
chips b sed under dusty or damp
may e condition.
cause 8) Do not wash the print
fluctuati d circuit board after the
on of r pressure sensor is
Ti sen-sor o mounted using
output p solvent. It may cause
m
and p a mal-function.
e other e 9) Please connect the
(s) troubles d sensor terminals
. according to the
4) The a connection diagram.
product n 10) The product shall not be
Item Preheating (T1 to T2, t1) shall be d used under high-
Terminal 150 degreeC to 200 degreeC used frequency vibration
60sec to 180sec. within h including ultrasonic wave.
・ Since the rated a 11) This product uses the
pressure sensor pressure. n elastic adhesive for
chip is exposed Usage at d bonding the lid, so do not
to atmosphere, pressure l add excessive stress to
cleaning fluid out of the e the lid.
shall not be range d 12) If soldering is not fit, then
allowed to enter may this product may catch
inside the cause r fire or get hot.
sensor’s case. breakage. o 13) There is a possibility
・ We recommend that it should 5) The u that the peripheral
product g circuit board or some
be used the recommended
may be h electronic part
mounting PAD dimensions for generates heat while
damage l
the land pattern. d by driving this product.
y
static . Please handle with
electricit 7) T care.
y. h 14) Do not tear down this
Charged e product.
7. Precautions material 15) Please do not use the
(1) Handling s (e.g. a sensor after following
1) Only air can be used as
p
workben r case;
pressure media on the ch and a - excessive shock added
product directly. It is
o
floor) d to the terminal of the
prohibited to use and sensor
pressure media
u
workers - the sensor lid
including corrosive
c
should decapped
t
gases (e.g. organic pro-vide - the sensor dropped
solvents gases, sulfur measure 16) If you use other
s
dioxide and hydrogen s conditions described in
sulfide gases), fluid and against h
a this document, please
any other foreign static check yourself in
materials. electricit l
l advance.
2) The products are not y,
includin n
water proof. The product
g o
shall be kept dry in use
ground t
excluding the sensor port.
3) The product shall not connecti
on. b
be used under dew-
condensing conditions. 6) The e
Frozen fluid on sensor product
shall not u
22 Copyright 2017 OMRON Corporation. All Rights Reserved.
 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

(2) Environmental conditions for transport and storage

1) The product shall not be kept with corrosive gases (e.g. organic solvents gases, sulfur dioxide and hydrogen sulfide gases).
2) The products are not water proof. The product shall be kept dry during storage.
3) The outer box strength may be degraded depending on the storage conditions. Please use the product in order.
4) For this product, please keep away from direct sunlight or ultraviolet rays.
5) The product shall be kept in appropriate conditions of temperature and humidity.
6) The product shall not be kept under dusty or damp condition.

8. Warranty and Limited Warranty

(1) Definition
The definition of terms used in these Terms and Conditions are as follows:
1) Usage conditions: Usage conditions, rating, performance, operating environment, handling instructions, cau-
tions, prohibited use, etc. of Omron products described in specifications, documentations or manuals.
2) Customer application: Application of Omron products by customers which include embedding and/or using
Omron products in their parts/components, electronic substrates, devices, equipment or systems manufactured
by customers.
3) Fitness: (a) performance, (b) non-infringement of third-party intellectual property, (c) compliance with laws
and regulations and (d) conformity to various standards.

(2) Caution on Descriptions

Attention is required to the following points on descriptions in specifications.
1) Rated values and performance values are the product of tests performed for separate single conditions, includ-

ing but not limited to temperature and humidity. It is not intended to warrant rated values and performance
values for multiple combined conditions.
2) Reference data are provided for reference only. Omron does NOT warrant that Omron products work properly
at all time in the range of reference data.
3) Application examples are provided for reference only. Omron does NOT warrant the Fitness of Omron prod-
ucts under such application.
4) Omron may discontinue the production of Omron products or change the specifications of them for the purpose
of improving such products or other reasons entirely at its own discretion.

(3) Precautions
Please be aware of and accept the following when you introduce or use Omron products:
1) Please use Omron products in compliance with usage conditions including rating and performance.
2) Please confirm fitness of Omron products in your application and use your own judgment to determine the ap-
propriateness of using them in such application. Omron shall not warrant the fitness of Omron products in cus-
tomer application.
3) Please confirm that Omron products are properly wired and installed for their intended use in your overall sys-
tem.
4) When using Omron products, please make sure to (i) maintain a margin of safety vis-à-vis the published rated
and performance values, (ii) design to minimize risks to customer application in case of failure of Omron
products, such as introducing redundancy, (iii) introduce system-wide safety measures to notify risks to users,
and (iv) conduct regular maintenance on Omron products and customer application.
5) Omron products are designed and manufactured as general-purpose products for use in general industrial
products. They are not intended to be used in the following applications. If you are using Omron products in
the following applications, Omron shall not provide any warranty for such Omron products.
(1) Applications with stringent safety requirements, including but not limited to nuclear power control
equipment, combustion equipment, aerospace equipment, railway equipment, elevator/lift equipment,
amusement park equipment, medical equipment, safety devices and other applications that could cause
danger/harm to people’s body and life.
(2) Applications that require high reliability, including but not limited to supply systems for gas, water and
electricity, etc., 24 hour continuous operating systems, financial settlement systems and other applications
that handle rights and property.
(3) Applications under severe condition or in severe environment, including but not limited to outdoor
equipment, equipment exposed to chemical contamination, equipment exposed to electromagnetic inter-
ference and equipment exposed to vibration and shocks
(4) Applications under conditions and environment not described in specification

23 Copyright 2017 OMRON Corporation. All Rights Reserved.

 [2SMPB-02E] Datasheet Rev.05(Jun.,2017)

6) In addition to the applications listed from (a) to (d) above, Omron products are not intended for use in automo-
tive applications (including two wheel vehicles). Please do NOT use Omron products for automotive applica-
tions. Please contact Omron sales staff for products for automotive use.

(4) Warranty Terms and Conditions

The terms and conditions for warranty of Omron products are as follows:
1) Warranty period: One year after the purchase.
2) Coverage: Omron will provide free replacement of the malfunctioning Omron products with the same number
of replacement/alternative products
3) Exceptions: Omron will not cover Omron products under its warranty if the cause of the malfunction falls un-
der any of the following.
(1) Usage in a manner other than the original intended use for the Omron product.
(2) Usage outside of the usage conditions.
(3) Cause which could not have been foreseen with the level of science and technology at the time of ship-
ping from Omron.
(4) Causes originating from other than Omron or Omron products (including force majeure such as but not
limited to natural disasters).

(5) Limitation of Liability

The warranty set out in these Terms and Conditions is the whole and sole liability for Omron products. There
are no other warranties, expressed or implied. Omron and the distributors of Omron products are not liable for
any damages which may arise from or be related to Omron products.

(6) Export Controls

Customers of Omron products shall comply with all applicable laws and regulations of other relevant countries
with regard to security export control, when exporting Omron products and/or technical documents or
providing such products and/or documents to a non-resident. Omron may not provide customers with Omron
products and/or technical documents should they fail to comply with such laws and regulations.

(Intentionally left blank)

24 Copyright 2017 OMRON Corporation. All Rights Reserved.