Digital
Digital
2. DMA is ____
a. Direct memory access b. direct memory analysis c. Data memory access d. direct
main access.
3. RAM chips are termed as_________
a. Non-volatile b. volatile c. chip d. board
4. DIP stands for _______
a. Dual in –link package b. dual in-line packet c. dual in-line package d. dual in-line
process.
5. Single in-line memory module uses _______ pin memory
a. 32 pin b. 16 pin c. 8 pin d. 72 pin
6. A ________ uses pins rather edge connector to connect to the motherboard.
a. SIPP b. SIMM c. DIP d. DIMM
7. Memory chips are organized in ______ on motherboards and memory cards.
a. Circuits b. Pin c. Banks d. chips
8. For 286 system ______ bit banks are used.
a. 18 bit b. 32 bit c. 16 bit d. 64 bit
9. In modern 64 –bit systems _____ pin SIMMs are used.
a. 72 pin b. 16 pin c. 8 pin d. 32 pin
10. The physical orientation used on a motherboard or memory card is ________ and determined by
the boards designers.
a. Synchronized b. arbitrary c. asynchronized d. none
11. ______ are available with and without parity bits
a. SIPP b. SIMM c. DIM d. DIMM
12. IBM established the ________ check standard for error checking.
a. Even parity b. Single bit c. odd parity d. double bit
13. DRAM stands for ____
a. Dynamic RAM b. Digital RAM c. Dual RAM d. none
14. SIMMs had _________ slowest speed.
a. 110 ns b. 120 ns c. 50 ns d. 80 ns
15. SDRAM supports bus speeds up to _______
a. 100 MHz b. 100 MHz & more c. 120MHz d. 80 MHz
16. ______ occurs when chip works its way out of socket.
a. Chip creep b. Chip crack c. Chip wrack d. none
17. PC memory speeds vary from about ________
a. 10 ns to 150 ns b. 10 ns to 190 ns c. 10ns to 200 ns d. 5ns to 200ns
18. EDO stands for__________
a. Extended Data online b. Extended Data out c. External data out d. Extended digital out
19. ________ Media is manufactured by placing the media material on the disk with an electroplating
mechanism.
a. Thin film media b. thin film spluttered media c. thin film plated media d. none
20. The platters are covered with a thin layer of a magnetically retentive substance called____
a. Disk b. Cylinder c. Medium d. Media
1. Write note on BIOS basics.
2. What is ROM? Explain
3. Give the Rom Chip types
4. Explain Tracks in disk.
5. Write note on SDRAM.
6. Explain keyboard types.
7. Write note on DRAM.
8. Explain LCD display.
9. Explain optical misc.
1. Briefly explain BIOS.
2. Explain in detail about motherboard ROM .
3. Explain Bootstrap loader.
4. Explain memory basics in detail.
5. Explain memory modules in detail.
6. Explain the HDD operations
7. Explain HDD components.
8. Explain Disk formatting in detail
9. Explain input devices in detail.
10. Write note on CRT,LCD,PLASMA.