A High-Frequency PCB-Winding Transformer

Design with Medium Voltage Insulation for Solid-

State Transformer
Zheqing Li, Feng Jin, Yi-Hsun Hsieh, and Qiang Li
Center for Power Electronic Systems
Bradley Department of Electrical and Computer Engineering
Virginia Polytechnic and State University
Blacksburg, VA 24061, USA
[email protected]

Abstract— A Solid-state transformer directly reduces medium

voltage to low voltage (e.g. 400 V) with minimized power
conversion stages. Insulation structure is the bottleneck of DC-DC
module in SST from insulation effectiveness, manufacturing
process, thermal management, and power density point of view. In
this paper, a compact PCB-winding transformer structure is
proposed to handle the medium voltage insulation by FR4 in PCB-
winding. The primary side winding is built in PCB-winding and
secondary side winding is still Litz wire for a lower loss. With semi-
conductive shielding and stress grading layer design, the E-field
can be restrained in the primary side PCB for a partial discharge
free insulation. An arc section winding structure is proposed to
reduce the high E-field inside the insulation layer to improve
insulation performance. The layer-to-layer winding resistance and
overall loss/footprint trade-off is analyzed for a low loss design.
Finally, the design is demonstrated on an 800/400V, 15-kW, 200-
kHz CLLC converter with 98.8% peak efficiency and 130W/in3
power density, whose transformer achieves partial discharge free Fig. 1 (a) Traditional power delivery system in data center application, (b)
up to 14.6kV. power delivery system with Solid-state transformer in data center

Keywords—Solid-State Transformer (SST), PCB-Winding,

CLLC, Resonant converter, Insulation design

I. INTRODUCTION
The solid-state transformer (SST) is one of the most popular
concepts in power electronics. SST steps down the medium-
voltage AC (MVAC) directly to low-voltage DC with minimal
power conversion stages [1]-[2]. The traditional approach in
medium voltage application requires a line frequency bulky
transformer to step down MVAC to low voltage system that can
be used directly to the load as shown in Fig. 1(a) [3]- [8]. To
overcome the disadvantages of using the line frequency
transformer, SST utilize wide-band gap (WBG) devices to Fig. 2 SST system architecture for data center
operate at high frequency with modular design [9]. The SST
system is shown in Fig. 2 with CHB as first stage and resonant Although the core size may shrink, the insulation size is the
converter as second. With SST applied in the data center power bottleneck to further reduce the footprint [10]. The insulation
delivery, the power conversion stages can be minimized and the effectiveness is another issue. Epoxy potting which is widely
overall efficiency can be increased at least 10%, as shown in Fig. used in line-frequency transformer are proposed to deal with the
1(b) [10]. The footprint can be reduced since lower applied volt- insulation issue [16]-[21]. In these solutions, at least primary
seconds. This concept has been widely used in resonant side winding should be encapsulated in the epoxy. However, due
converter concepts to improve the power density [11]-[15]. to high-frequency high-power requirement, Litz wire must be
However, the footprint cannot be reduced reverse proportional utilized to reduce the winding loss. The Litz wire is composed
to the operating frequency. by hundreds of strands for a low winding loss. The gaps between
the small strands are difficult to be filled with potting material
[21]. To solve such insulation issue, other literature proposes The dielectric constant of insulation material is much higher
solution by selecting proper Litz wire type and using complex than air, which means only a small air gap or air voids on the
bobbin to fix the position of the Litz wire [21]. Other researchers surface or inside the insulation encapsulation will reaches
apply two layers of insulation material in 2 steps [18]. The first 3kV/mm E-field leading to breakdown. Such a small breakdown
layer of insulation uses low viscosity material to fill with the finally leads to an insulation failure in long term. Compared with
small gaps between Litz strands. When the first layer is fully epoxy insulation, Printed circuit board (PCB) may be a solution
cured, the second layer with higher thermal conductivity and for such partial discharge failure. The manufacturing process for
higher viscosity is applied to ensure good thermal management. PCB is in the total vacuum environment. The lamination process
This method is even more intricate. To avoid the epoxy potting, is with high pressure. These processes help to avoid air voids
some air-core based transformer is proposed using air as the within the insulation layer. Bus bar design has already proved
insulation [22]-[23]. However, air is a bad insulator whose the reliability of using PCB as the insulation to handle over
dielectric strength is only 3kV/mm. Long insulation distance 22kV insulation [27]. The comparison between epoxy and FR4
increase the total footprint. Another issue is the air core. In the for PCB is shown in TABLE I. Compared with low viscosity
high-power applications, the EMI is huge without the constrain insulation material, selected PCB have almost 2 times higher
from the magnetic core, which is difficult for system design dielectric strength and higher thermal conductivity. Considering
[24]-[25]. Some papers discuss the possibility using oil for the standard manufacturing process for the PCB, the air-voids-
insulation and cooling [26]. This solution also has limitations. free insulation is naturally ensured and the margin won’t come
the oil-based transformer is hard to manufacture and to over 50%. This means the insulation layer thickness of PCB
maintenance, especially for MV applications. winding can be much smaller than epoxy in litz-wire
transformer. The thermal resistance is lower for easier thermal
In this paper, considering the fabrication issue in management. The highest E-field for the PCB winding is
conventional Litz-wire-based insulation, a hybrid transformer designed to be smaller than 20kV/mm, which is over two times
structure is proposed with primary winding in PCB winding and higher than the typical 6-8kV/mm highest E-field utilized in
secondary winding still in Litz wire. Such an insulation structure epoxy insulation [16], [21].
lifts the partial-discharge inception voltage with an even thinner
FR4 thickness. As for the winding loss issue, the sandwich TABLE I
structure is utilized to mitigate the AC winding loss. Also, Winding Insulation Material Candidate Comparison
winding resistance per layer is analyzed to manage the winding
loss. The transformer loss is optimized considering high winding Material candidate FR4-TG180 50-3182NC SilGel 612
loss at primary side PCB winding. The paper is organized as Dielectric strength 45 kV/mm 22 kV/mm 23 kV/mm
following. In Section II, a hybrid transformer structure is Thermal conductivity 0.3 W/(m·K) 1.7 W/(m·K) 0.2 W/(m·K)
proposed with primary side winding as PCB, while secondary Viscosity / 15,000 cps 1,000 cps
side winding still Litz wire to a higher efficiency. The section III
discussed the electric performance and the transformer
optimization process in detail. The insulation design for the
PCB-winding transformer is also mentioned. An arc section
winding structure is proposed to increase the insulation
capability. The design is demonstrated on a 15-kW, 200-kHz
CLLC converter with 98.8% efficiency and 130 W/in3 power
density, whose PD free level reaches 14.6kV, in Section IV.
Finally, the conclusion, in Section V, ends the paper.

II. PROPOSED HIGH-FREQUENCY HYBRID TRANSFORMER WITH

PCB-WINDING FOR PRIMARY WINDING
Given the aforementioned prior art above, Litz-wire-based (a)
transformer as its intrinsic issue in the MV insulation. An
alternative solution should be proposed to solve all issues in the
medium voltage application, such as good insulation capability,
especially partial discharge (PD) free, easy for manufacturing,
high efficiency, and good thermal management. Among these
challenges, insulation with PD free is always the first priority in
SST design. Partial discharge is one of the most common
degradation reasons in long term operation. [18] It always
happens on the interface between two different materials, mostly
in the air. Consider the electric displacement vector (1), at the (b)
interface the insulation structure should satisfy (2).
Fig. 3 (a) Proposed hybrid transformer with PCB-winding at primary side,
⃗ = 𝜀𝐸⃗
𝐷 (1) (b) section view of the transformer

⃗⃗⃗⃗⃗⃗⃗⃗
𝐷 ⃗⃗⃗⃗⃗⃗⃗
𝑎𝑖𝑟 = 𝐷𝑖𝑛𝑠 (2)
 Compared with other literature working at relatively low
frequency [16]-[17], the proposed transformer aims to work at
hundred-kilohertz region due to the limitation of the layer
number in the PCB winding. The transformer typically has
around 8-16 turns [10], [18], which makes PCB-winding
possible. To achieve better insulation performance, the semi-
conductive shielding and the termination idea [10], [18] still
works to cover the primary PCB with ground potential to
confine all the E-field inside the primary winding encapsulation.
In this case, there is no need for secondary side winding using
PCB as well, so the secondary winding is still Litz-wire-based.
The proposed transformer structure is shown in Fig. 3. With
hybrid structure, a higher efficiency can be achieved. A parallel Fig. 5 H-field comparison between separate winding and sandwich winding
secondary side is applied to reduce both transformer winding
loss and device loss. To further reduce the winding loss, a
sandwich winding structure is applied to reduce the MMF of the
winding. The PCB-winding provides the opportunity to utilize a
more complex core structure. In such a high-power high-
frequency application, some researchers observed the
dimensional resonant effect in the UI core, which leads to high
core loss [28]. That is because all the flux flows through the only
UI path, which leads to the B-field crowding in the upper/bottom
plate. ER core is applied in this high-power application. There
are 3 flux paths inside the ER core and only 1/2 flux flow
through each path. The B-field has a more evenly distributed
flux distribution for a lower loss compared with UI core, as
shown in Fig. 4. A detailed electric and insulation performance
is conducted in next Chapter. Fig. 6 Normalized ACR evaluation for 16-turn sandwich winding

A. Electric Performance Optimization

To have a clear view on the interleaving impact, two
simulation results is shown in Fig. 5. From the H-field, the MMF
accumulation with sandwich structure is only 50% of the MMF
accumulation with separate structure. Such a high MMF leads
generates high AC winding loss. At 200kHz, the sandwich core
structure saves 62% AC winding loss at primary side based on
the simulation. Although sandwich structure is utilized, the
primary side winding loss is still the bottleneck of the
transformer due to PCB-Winding. To understand the layers
Fig. 4 B-field simulation in ER core impact on primary winding loss, an 8 turns layer-to-layer
winding resistance plot is drawn and shown in Fig. 6. With 2
core legs, this 8-turn analysis represent a 16-turn transformer.
III. TRANSFORMER DESIGN PROCEDURE FOR ELECTRICAL AND Fig. 5 illustrate the relationship between the normalization factor
INSULATION PERFORMANCE ℎ0 /𝛿 and the normalized ACR. Here, ℎ0 is the copper thickness
The proposed 15-kW transformer design parameter is shown and 𝛿 represents the skin depth. Based on the skin depth
in TABLE II. The input and output of CLLC converter is 800V equation (3),
and 400V and the switching frequency is 200kHz. The rms 𝛿 = √𝜌/𝜋𝜇0 𝑓𝑠 (3)
current for the primary side winding reaches 21.6A. To have a
lower current density, the copper thickness is selected as 4Oz, where 𝜌 is the conductivity of the copper and 𝜇0 is the
which is similar with the skin depth of 200kHz to avoid skin permeability of vacuum, 𝑓𝑠 is the switching frequency. In Fig. 5,
effect vertically. with given copper thickness, ℎ0 /𝛿 can be regarded as a function
TABLE II of 𝑓𝑠 and the normalized ACR will increase with the switching
frequency increase. From Fig. 5, due to a partial interleaved
Transformer design parameters structure, the MMF still accumulated from middle turns to the
top and bottom. Which lead to almost 2 times higher winding
Power Level 15kW Input Current 21.6A
resistance at layer 1 and 8, compared with 4 and 5. If total
Input/Output Voltage 800/400 V Output Current 20.8A×2
Switching frequency 200kHz Secondary AWG 42
transformer turns reduce from 16 to 12, from 8 to 6 per leg, the
Insulation Rating 4.16kV Secondary strands 660 primary winding loss can reduce almost 33% with the same core
and winding width.
 However, the volt-second impact on the footprint of the core
is indicated as (4)
𝑉 × 𝑇𝑠
𝐴𝑒 = (4)
4 × 𝐵𝑚 × 𝑁
where 𝐴𝑒 is the cross-section area of the core, 𝑉 represents the
input voltage, 𝑇𝑠 is the switching period, 𝐵𝑚 means the
maximum magnetic flux density, and 𝑁 illustrates the turns
number. The turns number reduction leads to either higher 𝐵𝑚
with higher core loss, or larger 𝐴𝑒 with longer winding
conduction path. To find a result with proper loss and footprint
trade-off, an optimization process is proposed.
Fig. 9 Total loss and footprint trade-off on 12-turn transformer

Fig. 7 Optimization parameters for the hybrid transformer

As shown in Fig. 7, the transformer is optimized based on

sweeping the core radius (𝑟), and winding width (𝑐). Need to
Fig. 10 Loss and footprint trade-off in the optimal line on 12-turn design
mention, the side leg of the core can be manufactured following
the shape of the primary winding PCB. Only the minimum
thickness of 2mm in the middle part impacts the overall
footprint. The other part of the side leg of the core can be
regarded as a free gift from footprint point of view. The core loss
and the winding loss with 12-turn transformer design is shown
in a contour as Fig. 8. From Fig. 8(a), the core loss will decrease
with the core radius increase. However, such a phenomenon gets
less benefits with larger core. That is because the B-field
distribution is unevenly with core radius increase, especially in
the top/bottom plate. The unevenly B-field also leads to high
eddy current in the core. In addition, the core loss increases with
wider winding width because of bigger core footprint. As for the Fig. 11 Loss and footprint trade-off between different turns number
winding loss, the wider the winding is, the smaller DC winding performance in the primary side winding, the orange region is
resistance. However, wide winding makes the winding preferred. The design with 8-turn, 12-turn, and 16-turn
conducting path longer, which makes the loss reduction not so comparison is demonstrated in Fig. 11. 8-turn case is with
significant with large winding width. The total loss as the sum purple, 12-turn case is with solid line, and 16-turn design is in
of core loss and winding loss is drawn in Fig. 9. Each contour dash line. With larger turns number increase, the winding loss
line represents a total loss. The blue dash tangential line means increase drastically. That meets the conclusion from the
different footprint (w/o termination) and the yellow dot means previous analysis on winding loss per layer. Due to the MMF
the minimum loss at such footprint. In this case, another line can accumulation, 8-turn and 12-turn design are proved having a
be drawn to connect different yellow point for an optimized loss much smaller winding loss. The turns number cannot be further
vs. footprint curve in Fig. 10. Considering the thermal reduced due to core loss and size limitation considering volt-
second. In order to have a higher light load efficiency, 12-turn
design is selected with 12mm winding width and 16.2mm core
radius as the design point with total loss 60.3W and 105cm2
footprint finally.

B. Insulation Design
To handle medium voltage for partial discharge test and the
applied voltage test [29], extra 2.5mm-thick insulation layer
covers the PCB winding encapsulation in Fig. 3(b) in orange.
Fig. 8 Core loss and winding loss contour with 12-turn transformer design Not like the epoxy potted transformer, no bobbin is required as
 Fig. 14 Winding width optimization for lower E-field
Fig. 12 E-field simulation with PCB-winding based transformer

Fig. 13 E-field simulation with arc section

Fig. 15 Primary side transformer fabrication process
the inner fixture. Which means the FR4 is the only material as
the insulation. Such a simple structure and the standardized
manufacturing process help create an air-voids-free insulation
winding. The E-field simulation is shown in Fig. 12. As
illustrated in the simulation, most part of the E-field is
6.8kV/mm under a 12kVrms 60Hz sinusoidal excitation, which is
much lower than 20kV/mm limitation. However, high E-field
occurs at the corner due to the right angle at the edge of the PCB
winding. The highest E-field is 17.7kV/mm which is more than
2.6 times of the other part. It is not wise to sacrifice the insulation
thickness for the small corner. An arc section area of the winding
structure is proposed, as shown in Fig. 13. Compared with the Fig. 16 Partial discharge setup and test results
conventional PCB winding, who has the same winding width,
the section is a curve rather than a line. In this way, sharp right 0.2mm after three sprays. The final version with stress control
corner is eliminated, and E-field reduces. The shape of the arc is layer 3M-2220 is shown in Fig. 15(c). A fast-cure insulation
designed carefully. If the curvature of the arc is small, layer in putty is applied to seal the gap between the stress control tape
the middle will see the highest E-field. If the curvature is large, and the shielding for better insulation performance. The board is
the effect to reduce the E-field at the corner is not significant. 140mm in length, 107mm in width, and 7.2 mm in height
This phenomenon is shown in Fig. 13. With additional width (consider the termination sleeve). The partial discharge test is
𝑑1 = 0𝑚𝑚, the highest E-field occurs at the top and bottom done via MPD-600 PD checker as shown in Fig. 16. From the
layer. With 𝑑1 = 0.8𝑚𝑚, the inner layers suffer high E-field. A PD pattern, no PD exceeds 50pC at 14.6kVpeak, which satisfies
superposition method is applied to determine the additional the 4.16kV system requirement is only 7.7kVpeak. The hardware
width 𝑑1 and 𝑑2 for the transformer as shown in Fig. 14. Finally, prototype of an 800/400V, 15-kW, 200-kHz CLLC converter is
with 1st and 6th layer width still 12mm, 2nd and 5th layer is built to verify the transformer electrical performance in Fig. 17.
12.4mm, and 3rd and 4th layer is 13mm width. The highest E- The overall power density is 130W/in3, which is over two times
field drops from 17.7kV/mm to 10.8kV/mm. higher than Litz-wire-based converter with the same voltage and
power level [5]. The waveform at 15kW and the efficiency are
IV. HARDWARE PROTOTYPE AND PRELIMINARY EXPERIMENTAL shown in Fig. 18 and 19. ZVS can be achieved for Vds. The peak
VERIFICATION efficiency reaches 98.8%, and the efficiency at full load is
98.7%. Both efficiencies are better compared with the Litz wire
The primary side winding PCB is shown in Fig. 15. Fig. design under the same frequency.
15(a) shows the bare PCB. Besides the PCB, the extra 2.5-mm
FR4 covers the top and the bottom. No mask and silk are printed
on the surface. The shielding material 838AR is easier to adhere V. CONCLUSIONS
to the bare FR4 rather than the mask. Fig. 15(b) demonstrates In this paper, a novel high-frequency hybrid transformer is
the winding with semi-conductive shielding, whose thickness is proposed for the medium voltage Solid-state Transformer in
 This work was supported in part by the Power Management
Consortium in CPES, Virginia Tech.
The authors would like to thank Prof. Fred C. Lee of
Virginia Tech for his valuable and constructive suggestions
during the planning and development of this research work. His
willingness to give his time so generously has been very much
appreciated.
This work was conducted with the use of core samples
donated in kind by DMEGC, and the devices samples donated
by Infineon. The PCB-winding transformer is manufactured by
Storm Circuit and Journey Circuits.
Fig. 17 Transformer prototype
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