Precision Signal Conditioning AFE for MAX40109

Pressure Sensor Applications

General Description Benefits and Features

The MAX40109 is a low-power, precision sensor
• Analog Front-End to Interface with Resistive
interface SoC that includes a high-precision,
Bridge-Based Pressure Sensors
programmable Analog frontend (AFE), Analog-to-Digital
• Temperature Measurement either directly from the
Converter (ADC), calibration memory, and digital signal
Resistive Bridge or from an External Thermistor
processing. It also includes a Digital-to-Analog
• Analog Zero-Pressure Offset Compensation
Converter (DAC) with an output buffer to support analog
• High-Precision PGA Front-End with 20 Gain Options
voltage output and a 4mA–20mA current loop. It is
• Analog and Digital Outputs
designed for sensor applications such as strain gauges,
• Digital 1-Wire, Power Line Communication (PLC)
pressure, force, and temperature.
and I2C interfaces
This Sensor AFE has both analog and digital outputs. • Calibration Memory with Third-Order Polynomial for
The digital 1-Wire/I2C interfaces program the calibration Compensation from Temperature and Non-Linearity
memory, the front-end Programmable gain amplifier • Internal Electromagnetic Interference (EMI)
(PGA)'s gain, and the internal current source that drives Rejection
the sensors' bridge. The digital I2C interface can also be • Supply Voltage Range: 3V to 36V
used to retrieve the digital output data and generate • Low 2mA (typ.) Supply Current
alarms. • Available in TQFN package
The MAX40109 operates from 3V to 36V, is available in
the Thin quad flat no-lead (TQFN) package and is Ordering Information appears at end of data sheet.
specified over the -40°C to +125°C operating
temperature range.

Applications
• Pressure Sensors
• Strain Gauges
• Force Sensors
• Temperature Sensors
• Wheatstone-Bridge

19-101790; Rev 0; 12/23

© 2023 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

TABLE OF CONTENTS
General Description ............................................................................................................................................................ 1
Applications......................................................................................................................................................................... 1
Benefits and Features ......................................................................................................................................................... 1
Simplified Block Diagram .................................................................................................................................................... 5
Absolute Maximum Ratings ............................................................................................................................................... 6
Package Information ........................................................................................................................................................... 6
Electrical Characteristics ..................................................................................................................................................... 7
Typical Operating Characteristics ..................................................................................................................................... 13
Pin Configurations............................................................................................................................................................. 17
Pin Descriptions ................................................................................................................................................................ 17
Detailed Description .......................................................................................................................................................... 18
Register Function .......................................................................................................................................................... 18
Configuration Register ............................................................................................................................................... 20
PGA Input Mux........................................................................................................................................................... 20
ALERT Mode ............................................................................................................................................................. 20
Pressure Digital Output cases: .................................................................................................................................. 21
Temp Current ............................................................................................................................................................. 21
Shutdown ................................................................................................................................................................... 22
Current Source Reference Resistor........................................................................................................................... 22
Reference .................................................................................................................................................................. 22
Digital Filter ................................................................................................................................................................ 22
Pressure Cal Bypass ................................................................................................................................................. 23
Temp Cal Bypass....................................................................................................................................................... 23
MTP_EN .................................................................................................................................................................... 23
Status Register .......................................................................................................................................................... 23
PGA Pressure Gain ................................................................................................................................................... 24
Current Source........................................................................................................................................................... 24
Uncalibrated Pressure ............................................................................................................................................... 25
Uncalibrated Temperature ......................................................................................................................................... 25
ADC Sample Rate...................................................................................................................................................... 25
Interrupt Enable ......................................................................................................................................................... 26
Bridge Drive ............................................................................................................................................................... 26
PGA Temperature Gain ............................................................................................................................................. 26
Calibrated Pressure ................................................................................................................................................... 27
Calibrated Temperature ............................................................................................................................................. 27
Temp Mode ................................................................................................................................................................ 27
Sensor Offset Cal Config ........................................................................................................................................... 28

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Analog Filter BW ........................................................................................................................................................ 28

Zero Pressure Offset RAM Override.......................................................................................................................... 28
Zero Pressure Offset Select....................................................................................................................................... 28
Analog Output Stage.................................................................................................................................................. 29
SLP_MR..................................................................................................................................................................... 29
SLP_MREF ................................................................................................................................................................ 29
CP_Control_1 ............................................................................................................................................................ 29
CP_Control_2 ............................................................................................................................................................ 29
MTP_Control .............................................................................................................................................................. 29
MTP_Status ............................................................................................................................................................... 30
MTP_PROT_ADDR ................................................................................................................................................... 30
MTP_PROT_WDATA ................................................................................................................................................ 30
MTP_PROT_RDATA ................................................................................................................................................. 30
MTP_LEVEL .............................................................................................................................................................. 30
SLP_MRV .................................................................................................................................................................. 30
SLP_MREFV.............................................................................................................................................................. 30
MTP_DATA0.............................................................................................................................................................. 30
MTP_ADDR ............................................................................................................................................................... 30
MTP Memory and Functions ...................................................................................................................................... 31
Bridge Sensor Calibration .......................................................................................................................................... 34
Scratch Pad Memory ................................................................................................................................................. 35
Diagnostics ................................................................................................................................................................ 35
Pressure Thresholds on ALERT ................................................................................................................................ 36
Zero Pressure Offset.................................................................................................................................................. 36
Config Register .......................................................................................................................................................... 37
I2C Client Address ..................................................................................................................................................... 37
Lock MTP ................................................................................................................................................................... 37
Zero-pressure Offset Enable...................................................................................................................................... 37
Sensor Polarity........................................................................................................................................................... 38
Output Clipping Enable .............................................................................................................................................. 38
Analog Diagnostic Enable.......................................................................................................................................... 38
Temperature Offset .................................................................................................................................................... 38
MTP Re-programmability ........................................................................................................................................... 39
Output Clipping Thresholds ....................................................................................................................................... 39
Analog Output Diagnostic Levels ............................................................................................................................... 39
Initializing MTP........................................................................................................................................................... 40
Burning to MTP .......................................................................................................................................................... 40
Digital Interface Management .................................................................................................................................... 40

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MAX40109 Precision Signal Conditioning AFE for Pressure
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1-Wire Interface ......................................................................................................................................................... 40

Power Line Communication (PLC)............................................................................................................................. 40
I2C-Compatible Bus Interface.................................................................................................................................... 42
1-Wire Bus System .................................................................................................................................................... 43
64-Bit ROM Code....................................................................................................................................................... 44
CRC Generation ........................................................................................................................................................ 44
Hardware Configuration ............................................................................................................................................. 45
Transaction Sequence ............................................................................................................................................... 45
Initialization ................................................................................................................................................................ 45
ROM Commands ....................................................................................................................................................... 45
Search ROM [F0h] ..................................................................................................................................................... 47
Read ROM [33h] ........................................................................................................................................................ 47
Match ROM [55h]....................................................................................................................................................... 47
Skip ROM[ CCh] ........................................................................................................................................................ 47
Function Command.................................................................................................................................................... 47
Data Format ............................................................................................................................................................... 48
1-Wire Signaling......................................................................................................................................................... 48
Initialization Procedure: Reset and Presence Pulses ................................................................................................ 48
Read/ Write Time Slots .............................................................................................................................................. 49
Write Time Slots......................................................................................................................................................... 49
Read Time Slots ........................................................................................................................................................ 50
Applications Information.................................................................................................................................................... 51
Temperature Measurement ........................................................................................................................................... 51
Use External Resistor for Bridge Current Source.......................................................................................................... 52
Ratio-metric Voltage Output .......................................................................................................................................... 52
Sensor Offset Calibration .............................................................................................................................................. 52
Using the MAX40109 to Perform Sensor Calibration .................................................................................................... 53
Analog Output Stage ..................................................................................................................................................... 53
Layout Recommendations............................................................................................................................................. 54
Typical Application Circuits ............................................................................................................................................... 55
Analog Sensor with Ratio-metric Voltage Output .......................................................................................................... 56
Analog Sensor with Ratio-metric Voltage Output and External Resistors to Set the Gain ............................................ 57
Digital Sensor with I2C Interface ................................................................................................................................... 58
Ordering Information ......................................................................................................................................................... 58

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MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

Simplified Block Diagram

VDD = 24V

REFIN VDD2V VDD5V VDDHV

VREF PLC
MAX40109
5V LDO INPUT

DRV
V/I 1.8V LDO DIAGNOSTICS
DRIVER 1.25V
INT
REFERENCE DQ (1-Wire)
SCRATCHPAD MCU
AND MTP
DRV SDA
REXT* INT 1-Wire,
DIAGNOSTIC
MUX INP+ PLC, AND SCL
CAL MTP
INP- MEMORY I2C

PGA

9-BIT DAC
MUX 16-BIT DAC
PGA GAIN/OFFSET
INP+ AND NL 14-BIT DAC
SENSOR COMPENSATION
BRIDGE

BRIDGE OFFSET COMPENSATION

OUT

INP- OP-AMP

FB+ FB- GND

*(THERMISTOR OR CURRENT SETTING)

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MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

Absolute Maximum Ratings

VDDHV to GND .................................................... -40V to +40V DQ to GND .......................................................... -1.5V to +6V
OUT to GND ........................................................ -40V to +40V Continuous current into any input/output pin 10mA Continuous
Power Dissipation TQFN (Single Layer Board) (T A = +70°C,
Pin Voltage Differential (Voltage between any of these two
derate 20.8 mW/°C above +70°C.) ........................ 1666.70mW
pins: VDD, OUT, GND) ........................................ -40V to +40V
Continuous Power Dissipation TQFN (Four-Layer Board)
VDD5V, DRV, FB-, INP+, INP-, INT, SCL, SDA, ALERT to GND (Derate 30.3 mW/°C above +70°C.) ..................... 2,424.20mW
............................................................................. -0.3V to +6V
Operating Temperature Range ........................ -40°C to 125°C
VDD2V, REFIN to GND ......................................... -0.3V to +2V
Junction Temperature .................................................. +150°C
FB+ to GND .......................................................... -1.5V to +5V

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress rati ngs only, and functional operation of the device at these or
any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to abs olute maximum rating conditions for extended periods may affect
device reliability.

Package Information
TQFN
Package Code T2044-5C
Outline Number 21-0139
Land Pattern Number 90-0429
Thermal Resistance, Single Layer Board:
Junction to Ambient (θJA) 48
Junction to Case (θJC) 2
Thermal Resistance, Four Layer Board:
Junction to Ambient (θJA) 33
Junction to Case (θJC) 2

For the latest package outline information and land patterns (footprints), go to https://www.analog.com/en/design-
center/packaging-quality-symbols-footprints/package-index.html. Note that a “+”, “#”, or “-” in the package code indicates
RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package
regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to https://www.analog.com/en/technical-
articles/thermal-characterization-of-ic-packages.html.

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MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

Electrical Characteristics
(Global conditions unless otherwise stated. VDDHV = 5V, VDRV = 4V, VIN+ = VIN- = VDRV/2, Analog Filter BW = 1.2kHz, Typical values
at 25°C, Min\Max Temperature = -40°C ≤ TA ≤ +125°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
VDRV = 4V, 10kΩ bridge, VINP+ –VINP- =
System Level 4mV (DC), G = 252V/V, Noise BW 3dB = 12.4
Performance: Noise- 1kHz, GOUT = 4V/V
bits
Free Effective IDRV = 500μA, 3.5kΩ bridge, VINP+ –
Resolution VINP- = 75mV (DC), G = 15V/V, Noise 12.8
BW 3dB = 1kHz, GOUT = 1V/V
INPUT PGA
G = 15V/V 0.6V < VCM < 1.7V 180 850
Zero-pressure
offset
1.7V < VCM < 2.8V 440 2000
compensation
disabled
Input Offset Voltage VOS µV
G = 144V/V
Zero-pressure 0.6V < VCM < 2.8V
offset 76 450
compensation
disabled
VCM > 1.7V 0.062 1.6
Input Offset Drift TCVOS μV/°C
VCM < 1.7V 0.018 0.8
TA = +25°C 60 400
Input Bias Current IB pA
-40°C ≤ TA ≤ +125°C 3860
Input Offset Current IOS 9.2 400 pA
VDDHV ≥ 4.4V 0.6 2.8
Zero-pressure
3.8V ≤ VDDHV ≤
offset 0.6 2.6
compensation 4.4V
Input Common Mode VCM VVDDHV
Range disabled VDDHV ≤ 3.8V 0.6
-1.2
Zero-pressure offset compensation 0.37 x 0.63 x
VDRV VDRV V
enabled
5, 10,
15, 20,
24, 40,
60,
72,
90,
108,
Programmable Internal ADC Input 126,
Range of Gain G through 1-wire Full-Scale Range is 144, V/V
and/or I2C 1.25V 160,
180,
200,
252,
540,
1080,
1440,
2520
Gain Selection Settling
10 ms
Time

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MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

(Global conditions unless otherwise stated. VDDHV = 5V, VDRV = 4V, VIN+ = VIN- = VDRV/2, Analog Filter BW = 1.2kHz, Typical values
at 25°C, Min\Max Temperature = -40°C ≤ TA ≤ +125°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
G = 15V/V 0.15 0.9
Gain Error GE %
G = 144V/V 0.45 1.4
Gain Error Temperature G = 15V/V 4
TCGE ppm/ºC
Coefficient G = 144V/V 9
INPUT PGA/AC SPECIFICATIONS
G = 15V/V 55
Signal Bandwidth BW3dB kHz
G = 144V/V 24.5
Zero-pressure
offset
2.5
compensation
disabled
0.1Hz ≤ f ≤ 1kHz,
Zero-pressure
G = 15V/V
offset
compensation 2.7
enabled (at
30mV/V)
Input Voltage-Noise VN μVRMS
Zero-pressure
offset
0.23
compensation
disabled
0.1Hz ≤ f ≤ 10Hz,
Zero-pressure
G = 144V/V
offset
compensation 0.78
enabled (at
80mV/V)
VRFpeak = 100mVp, f = 400MHz,
EMI Rejection Ratio EMIRR
900MHz, 1800MHz, 2400MHz, both IN+ 80 dB
and IN-
INPUT PGA/ZERO-PRESSURE OFFSET COMPENSATION
Corresponds to
Resolution Including sign 12 bits
44μV/V
Offset Range 80 93 mV/V
TEMPERATURE MEASUREMENT
150,
Sourced at INT pin
Current Source Range VINT = 0V to 1.6V 250, uA
500, 750
Input Common Mode VCM Guaranteed by CMRR parameter 0.25 1.6 V
Range
Common Mode VCM = 0.25V to 1.6V
CMRR 95 dB
Rejection Rate
1.5, 2, 3,
G = 1, 1.5, and 2 5, 6, 10,
Programmable are for single- 15, 20,
Range of Gain G through 1-wire ended only. G = 3 24, 30, V/V
and/or I2C is for differential 36, 40,
only 45, 60,
72, 90
Input Offset Voltage VOS 50 2,000 µV
Gain Error GE Gain = 10V/V ±0.4 ±2.5 %

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MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

(Global conditions unless otherwise stated. VDDHV = 5V, VDRV = 4V, VIN+ = VIN- = VDRV/2, Analog Filter BW = 1.2kHz, Typical values
at 25°C, Min\Max Temperature = -40°C ≤ TA ≤ +125°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Gain-Bandwidth Product GBW 200 kHz
Input Voltage-Noise VN f = 1kHz 180 nV/√Hz
Density
BRIDGE DIAGNOSTICS
Applies to all: OV_INP+,
OV_INP-, UV_INP+,
UV_INP-,
Diagnostic Voltage
OV_DRV, UV_DRV, 8 bits
Threshold Resolution
OV_INT,
UV_INT

Applies to all:
OV_INP+,
OV_INP-,
UV_INP+,
UV_INP-, From 0% to 90% of
VDD5V ±3
OV_DRV,
UV_DRV,
OV_INT,
UV_INT
Diagnostic Voltage
LSB
Threshold Accuracy Applies to all:
OV_INP+,
OV_INP-,
UV_INP+,
UV_INP, Above 90% of
VDD5V -3 ±2
OV_DRV,
UV_DRV,
OV_INT,
UV_INT

ANALOG-TO-DIGITAL CONVERTER
1, 2, 4,
Sample Frequency ksps
8, 16
SENSOR BRIDGE VOLTAGE SOURCE
Programmable
VDRV IDRV = 0mA to 2mA 1.8, 2.3,
Voltage Source Range through Digital V
3.3, 4.0
Interfaces
Voltage Source Range ΔVDRV IDRV = 0mA to 2mA 3.5 %
Accuracy
SENSOR BRIDGE CURRENT SOURCE
250,
300,
400,
Programmable
IDRV VDRV = 4V 450,
Current Source Range through 1-wire µA
500,
and/or I2C
550,
650,
750
Current Source Range ΔIDRV VDRV = 0V to 4V 5 %
Accuracy

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MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

(Global conditions unless otherwise stated. VDDHV = 5V, VDRV = 4V, VIN+ = VIN- = VDRV/2, Analog Filter BW = 1.2kHz, Typical values
at 25°C, Min\Max Temperature = -40°C ≤ TA ≤ +125°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Zero-pressure
compensation
offset enabled
VDDHV ≥ 4.65V 1.8 4.2
Guaranteed by
Input Referred
Voltage Range at Bridge Residual Voltage
VDRV V
Top Zero-pressure
compensation
offset enabled 3 x ln
3V ≤
1.8 (VDDHV)
VDDHV ≤ 4.65V
Guaranteed by -0.41
Input Referred
Residual Voltage
Applies over "Voltage Range at Bridge
Top" specification. Zero-pressure
Input Referred Residual VRES compensation offset = FS/4 ±3 mV
Voltage
Input PGA Gain = 15
INTERNAL/EXTERNAL REFERENCE
Reference Voltage VREF 1.25 V
Internal Reference VREFTC 15 ppm/ºC
Voltage Temp-Co
OUTPUT AMPLIFIER AND DIGITAL TO ANALOG CONVERTER
Current (4mA–20mA) Output 1
DAC Full-Scale
Voltage Output, 5V 1.25V, VDDHV = 4
Gain GOUT 5.5V V/V
DAC Full-Scale
Voltage Output, 3V 0.5V, VDDHV = 6
3.3V
Output Voltage High VOH VDD5V - VOUT RL= 10KΩ to GND 94 160 mV
Output Voltage Low VOL VOUT - GND RL = 10KΩ to GND 3 15 mV
Slew Rate SR 0.12 V/µs
Capacitive Loading CLOAD AV = 4V/V 500 pF
Stability
POWER SUPPLY
Guaranteed by PSRR, -40°C < TA <
Supply Voltage VDDHV 3 36 V
+125°C
Internal Digital Supply VDD2V 1.7 1.8 1.9 V
Voltage
Internal Analog Supply VDD5V VDDHV ≥ 6V 5.05 5.28 5.5 V
Voltage
VDDHV –
VDDHV = 5V 121 201
Internal Analog Supply VDD5V
mV
LDO Dropout VDDHV –
VDDHV = 3V 121 199
VDD5V
Power Supply Rejection 6 ≤ VDDHV≤ 36V
PSRR 105 dB
Ratio

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MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

(Global conditions unless otherwise stated. VDDHV = 5V, VDRV = 4V, VIN+ = VIN- = VDRV/2, Analog Filter BW = 1.2kHz, Typical values
at 25°C, Min\Max Temperature = -40°C ≤ TA ≤ +125°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Current IDD 2 2.57 mA
Communication
2
ready
Power-Up Time tON VDDHV = 0V to 5V ADC Calibration ms
completed – Ready 140
for Measurements
Low-Power Mode ISHDN -40ºC ≤ TA ≤ +125ºC 250 μA
Supply Current
Turn-On Time tONSD From Low-Power Mode (through I2C) 50 µs
I2C LOGIC DC CHARACTERISTICS
0.7 x
Input High Voltage VIH V
VDD5V
0.3 x
Input Low Voltage VIL V
VDD5V
Input High Leakage IIH Logic Input to VDD5V -1 ±0.005 +1 µA
Current
Input Low Leakage IIL Logic Input to 0V -1 ±0.005 +1 µA
Current
Input Capacitance CIN 5 pF
Output Low Voltage VOL IOL = 3mA 0 0.3 V
Output High Leakage VOUT = VDD5V ±0.005 1 µA
Current
I2C TIMING
Serial Clock Frequency fSCL 50 1M Hz
Bus Free Time Between
Start and Stop tBUF 0.5 µs
Conditions
START Condition Hold tHD:STA 0.26 µs
Time
STOP Condition Setup tSU:STO 90% of SCL to 10% of SDA 0.26 µs
Time
Clock Low Period tLOW 0.5 µs
Clock High Period tHIGH 0.26 µs
START Condition Setup tSU:STA 90% of SCL to 90% of SDA 0.26 µs
Time
Data Setup Time tSU:DAT 10% of SDA to 10% of SCL 50 ns
Data In Hold Time tHD:DAT 10% of SCL to 10% of SDA 0 µs
SCL/SDA Rise Time tR 120 ns
SCL/SDA Fall Time tF 20 120 ns
20 x
Transmit SDA Fall Time tF Bus capacitance = 550pF. VDD ≥ 2.4V (VDD 120 ns
/5.5V)
SCL Time Low for Reset tTIMEOUT 20 45 ms
of Serial Interface
Maximum Pulse Width
of Spikes That Must Be
50 ns
Suppressed by the Input
Filter

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MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

(Global conditions unless otherwise stated. VDDHV = 5V, VDRV = 4V, VIN+ = VIN- = VDRV/2, Analog Filter BW = 1.2kHz, Typical values
at 25°C, Min\Max Temperature = -40°C ≤ TA ≤ +125°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Capacitive Load for CB 550 pF
Each Bus Line
1-Wire LOGIC DC CHARACTERISTICS (DQ)
VDDHV = 3V to 0.8 x
Input Voltage Level High VIH DQ only V
5.5V VDDHV
VDDHV = 3V to 0.2 x
Input Voltage Level Low VIL DQ only V
5.5V VDDHV
Output Voltage Level VDDHV = 3V to 0.75 x
VOH DQ only 4 V
High 5.5V VDD5V
VDDHV = 3V to
Output Voltage Level VOL DQ only 5.5V, ISINK = 200 mV
Low
500μA
PLC LOGIC DC CHARACTERISTICS (INPUT V DDHV, OUTPUT OUT)
Input Voltage Level High VIN_HIGH 31 V
Input Voltage Level Low VIN_LOW 24 V
DAC output ≥
Output Voltage Level VOH 0.82 x
Analog OUT only 0x3665 (85% of V
High FS
full-scale)
DAC output ≤
Output Voltage Level VOL 0.18 x
Analog OUT only 0x0999 (15% of 0 V
Low FS
full-scale)
1-Wire TIMING ON DQ
Time Slot tSLOT 60 120 μs
Recovery Time tREC 1 μs
Write-Zero Low Time tLOW0 60 120 µs
Write-One Low Time tLOW1 1 15 µs
Read Data Valid tRDV 20 µs
Reset Time High tRSTH 480 µs
Reset Time Low tRSTL 480 µs
Presence-Detect High tPDHIGH 15 60 μs
Presence-Detect Low tPDLOW 60 240 µs
DQ (Data) Capacitance CIN/OUT 25 pF
PLC TIMING WITH VDDHV AS INPUT AND OUT AS OUTPUT
Time Slot tSLOT 480 960 μs
Recovery Time tREC 8 μs
Write-Zero Low Time tLOW0 480 960 µs
Write-One Low Time tLOW1 100 120 µs
Read Data Valid tRDV 120 µs
Reset Time High tRSTH 3.84 ms
Reset Time Low tRSTL 3.84 ms
Presence-Detect High tPDHIGH 120 480 μs
Presence-Detect Low tPDLOW 480 1920 µs

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MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

Typical Operating Characteristics

VDDHV = 5V, VDRV = 4V, VIN+ = VIN- = VDRV/2, Analog Filter BW = 1.2kHz, Typical values at 25°C, Min\Max Temperature = -40ºC ≤
TA ≤ +125ºC.

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MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

VDDHV = 5V, VDRV = 4V, VIN+ = VIN- = VDRV/2, Analog Filter BW = 1.2kHz, Typical values at 25°C, Min\Max Temperature = -40ºC ≤
TA ≤ +125ºC.

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MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

VDDHV = 5V, VDRV = 4V, VIN+ = VIN- = VDRV/2, Analog Filter BW = 1.2kHz, Typical values at 25°C, Min\Max Temperature = -40ºC ≤
TA ≤ +125ºC.

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MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

VDDHV = 5V, VDRV = 4V, VIN+ = VIN- = VDRV/2, Analog Filter BW = 1.2kHz, Typical values at 25°C, Min\Max Temperature = -40ºC ≤
TA ≤ +125ºC.

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MAX40109 Precision Signal Conditioning AFE for Pressure
Sensor Applications

Pin Configurations

TOP VIEW

VDD2V
(PINS AT THE BOTTOM)

OUT

FB-
DQ

NC
15 14 13 12 11

SCL 16 10 FB+

VDD5V 17 9 SDA
MAX40109
18 8 INT

VDDHV 19 7 DGND
EP
NC 20 + 6 DRV

1 2 3 4 5

AGND
REFIN

NC
INP+

INP-
20-PIN TQFN
(4mm × 4mm)

Pin Descriptions
PIN NAME FUNCTION
Sensor Bridge Drive: Drive either current or voltage. It is also used to measure the temperature (as a
6 DRV
voltage) from the bridge.
2 INP+ Non-inverting Pressure Sensor Input. Users can connect up to 10nF between INP+ and INP-.
4 INP- Inverting Pressure Sensor Input. Users can connect up to 10nF between INP+ and INP-.
5 AGND Analog Ground
7 DGND Digital Ground

VDDHV Main positive supply voltage and power line communication serial interface input. The range is from 3V
19
to 36V. The suggested (but not required) bypass capacitor is from 10nF to 100nF.
8 INT Input Temperature: Connect to either a diode or a thermistor.
Input reference and also bypass capacitor (100nF) for the Internal reference: A bit in the Config Regist er
1 REFIN
selects between external and internal voltage reference.
9 SDA I2C Data
16 SCL I2C Clock
14 DQ 1-Wire Serial Input/Output. It must be held to a logic level high when idle.
18 ALERT Active Low Alert Interrupt Output. See the ALERT Mode section for the functionality of this output.
10 FB+ Output Amplifier Feedback Input, Positive.
11 FB- Output Amplifier Feedback Input, Negative.
12 OUT Analog output, as well as PLC serial interface output.
17 VDD5V Internal 5V output from LDO: Bypass with a 220nF capacitor.
15 VDD2V Internal 1.8V output from LDO: Bypass with a 220nF capacitor.
3, 13, 20 NC Do not connect.
EP EP Exposed Pad. Connect to analog ground.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Detailed Description
The MAX40109 is a low-power, precision sensor interface SoC that includes a high-precision, programmable AFE, ADC,
calibration memory, and digital signal processing. It also includes a DAC with an output buffer to support analog voltage
output and a 4mA–20mA current loop. It is designed for sensor applications such as strain gauges, pressure, force, and
temperature.
Register Function
The registers are accessible from all digital interfaces such as 1-Wire, I2C, and PLC.
All digital interfaces follow the same sequence of sending the register address first (command field), followed by the data
field. Data can be either one byte or two bytes, depending on the type of register.
Upon power-up, all registers listed in Table 1 as both Random-access memory (RAM) and Multi-time programmable
(MTP) memory will initialize with the last saved content in the MTP memory. Such content can be overwritten during
normal functionality, but unless saved in the MTP memory, this new content will be lost once the device is powered down.
See the section Burning to MTP for the procedure of saving the register content in the MTP memory.

Table 1. Register Functions and POR States

ADDRESS NUMBER POR STATE
REGISTER NAME READ/WRITE DESCRIPTION
(HEX) OF BITS (HEX)

The configuration register contains bit control

for MTP enable, temperature calibration enable,
Configuration 00h 16 0000h R/W digital filter, reference input, current source
reference resistor, shutdown, temperature
current, alert mode, and PGA input mux.

The status register reports all the anomalies

Status 02h 12 000h R/W that generate an interrupt on the ALERT output
pin.

The PGA pressure gain register selects

PGA Pressure Gain 04h 8 00h R/W
between 20 settings.
The current source register selects between 8
Current Source 05h 3 0h R/W
settings.

The uncalibrated pressure register holds the

Uncalibrated
06h 16 0000h RO last pressure measurement data from the ADC
Pressure
before the digital calibration.

The uncalibrated temperature register holds the

Uncalibrated
08h 16 0000h RO last temperature measurement from the ADC
Temperature
before the digital calibration.

The ADC sample rate register contains bits to

control the sample rate pressure, sample rate
ADC Sample Rate 0Ah 4 0h R/W
temperature, and system switch time between
samples.

The interrupt enable register includes the

Interrupt Enable 0Bh 10 3FFh R/W enables for interrupt generation flags with the
same bit order as the status register.

The bridge drive register connects the sensor

Bridge Drive 0Dh 3 0h R/W
bridge to either a current or a voltage source.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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ADDRESS NUMBER POR STATE

REGISTER NAME READ/WRITE DESCRIPTION
(HEX) OF BITS (HEX)

PGA Temperature The PGA temperature gain register selects

0Eh 8 0h R/W
Gain between 16 settings.

The calibrated pressure register holds the last

Calibrated Pressure 0Fh 16 0000h RO pressure measurement after the digital
calibration.

The calibrated temperature register holds the

Calibrated
11h 16 0000h RO last temperature measurement after the digital
Temperature
calibration.

The temp mode register configures the

Temp Mode 13h 5 00h R/W
temperature channel at the INT and DRV pins.

The sensor offset cal configuration register is

Sensor Offset Cal
14h 3 0h R/W used during the sensor offset calibration
Config
procedure to cancel out the sensor offset.

The analog filter BW register is used to select

Analog Filter BW 15h 2 0h R/W the internal analog filter for the pressure
channel.

The zero pressure filter offset RAM override

register can override and replace the content of
Zero Pressure Offset
1Ah 16 0000h R/W the MTP register "zero pressure offset". This
RAM Override
register is only temporary since it is a RAM
register.

Zero Pressure Offset Sets the zero pressure offset RAM override
1Ch 1 0h R/W
Select value.
The analog output stage register sets the signal
Analog Output Stage 1Eh 4 0h R/W
at the OUT pin.
SLP_MR 9Bh 16 0000h R/W Register for initializing MTP.
SLP_MREF 9Dh 16 0000h R/W Register for initializing MTP.
CP_Control_1 9Fh 8 00h R/W Control register 1.
CP_Control_2 A0h 8 00h R/W Control register 2.
MTP_Control A2h 8 00h R/W MTP control.
MTP_Status A3h 8 00h R/W MTP status.
MTP_PROT_ADDR A4h 8 00h R/W MTP prototyping write address.
MTP_PROT_WDATA A5h 16 0000h R/W MTP prototyping write data.
MTP_PROT_RDATA A7h 16 0000h RO MTP prototyping read data
MTP_LEVEL A9h 16 00h RO MTP burn count.
SLP_MRV ABh 16 0000h R/W Register for initializing MTP.
SLP_MREFV ADh 16 0000h R/W Register for initializing MTP.
MTP_DATA0 AFh 16 0000h R/W Setting MTP data.
MTP_ADDR B1h 8 00h R/W Setting MTP address.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Configuration Register
The configuration register contains 16 bits of data.

Table 2. Configuration Register

BIT 15 BIT 14 BIT 13 BIT 12 BIT 11 BIT 10 BIT 9 BIT 8

REFIN Current Source

Temp Cal Pressure Cal
MTP_EN Digital Filter Digital Filter Digital Filter internal/external Reference
Bypass Bypass
selection Resistor

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

Temp PGA Input
Shutdown Reserved Temp Current ALERT Mode ALERT Mode ALERT Mode
Current MUX

PGA Input Mux

Bit 0 is used to select the input MUX in front of the PGA.

BIT = 0 (DEFAULT) BIT = 1

INP+ INP-

PGA PGA
INP– INP+

Figure 1. PGA Mux Input

ALERT Mode
The ALERT mode contains 3-bit of data, as shown in Table 3.

Table 3. ALERT Bits [3:1]

BIT 3 BIT 2 BIT 1 ALERT MODE
0 0 0 ALERT issues interrupts
0 0 1 ALERT issues temperature data in PWM fashion
0 1 0 ALERT issues pressure digital output - case 1
0 1 1 ALERT issues pressure digital output - case 2
1 0 0 ALERT issues pressure digital output - case 3
1 0 1 ALERT issues pressure digital output - case 4
1 1 0 Not Used
1 1 1 Not Used

000: The ALERT output is used to issue interrupts as defined in the "Status" register by using the "Interrupt Enable"
register as a mask.
001: The ALERT output generates a PWM signal based on the most significant 12-bit of the data from the "Calibrated
Temperature" register. The PWM frequency is fixed at 2MHz / 4,096 = 488Hz.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Pressure Digital Output cases:

Table 4. Cases for Alert

CASE # THRESHOLD 1 (PRIMARY) THRESHOLD 2 (HYSTERESIS) OUTPUT STATE
Rising above threshold Low to high
1
Falling below threshold High to low
Rising above threshold High to low
2
Falling below threshold Low to high
Falling below threshold Low to high
3
Rising above threshold High to low
Falling below threshold High to low
4
Rising above threshold Low to high

Figure 2. ALERT Cases

Temp Current
Current Source for temperature measurement. This current is generated to the INT pin when an external thermistor is
used.
Table 5. Source Current [5:4]
BIT 5 BIT 4 SOURCE CURRENT (µA)
0 0 150
0 1 250
1 0 500
1 1 750

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Shutdown
Bit 7 is used to shutdown the MAX40109.
Bit 7 = 0: The MAX40109 is active (default).
Bit 7 = 1: The MAX40109 is in shutdown mode. In this mode, all analog functionality is disabled, and the device only
responds to 1-Wire and I2C commands.
Current Source Reference Resistor
Bit 8 is used to select a reference resistor for the current source between the internal resistor and the external resistor
connected to the INT pin.
See the Applications Information section "Use External Resistor for Bridge Current Source" for more details.
Bit 8 = 0: Internal resistor (default).
Bit 8 = 1: External resistor.
If an external resistor is selected, it is not possible to set the temp mode to thermistor.
Reference
Bit 9 is used to select between the internal and external references.
Bit 9 = 0: Use internal reference (default).
Bit 9 = 1: Use external reference.
Digital Filter
This option calculates the average among samples. See Table 6 for more details.

Table 6. Digital Filter [12:10]

BIT 12 BIT 11 BIT 10 FUNCTION
0 0 0 No Average
0 0 1 Average among 4 samples
0 1 0 Average among 8 samples
0 1 1 Average among 16 samples
1 0 0 Average among 32 samples
1 0 1 Average among 64 samples
1 1 0 Average among 128 samples

The output data rate is as follows:

Table 7. Output Data Rate

OUTPUT DATA RATE
ADC SAMPLE RATE
OPTION # NO
OPTIONS (ksps) x4 x8 x16 x32 x64 x128
FILTER
1 1 1 0.25 0.125 0.0625 0.03125 0.015625 0.0078125
2 2 2 0.5 0.25 0.125 0.0625 0.03125 0.015625
3 4 4 1 0.5 0.25 0.125 0.0625 0.03125
4 8 8 2 1 0.5 0.25 0.125 0.0625
5 16 16 4 2 1 0.5 0.25 0.125

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Pressure Cal Bypass

Bit 13 = 0: Pressure calibration is enabled (default).
Bit 13 = 1: Pressure calibration is bypassed (Raw Mode).
In this Raw Mode, the MAX40109 only measures pressure (no temperature) and provides at the analog output (OUT) the
raw sensor data without any digital correction. Analog chain settings must be programmed (PGA gain, coarse offset
correction, bridge current/voltage, ADC sample rate).
Temp Cal Bypass
Bit 14 = 0: Temperature calibration is enabled (default).
Bit 14 = 1: Temperature calibration is bypassed (Raw Mode) In this Raw Mode, the MAX40109 only measures temperature
(no pressure) and provides at the analog output (OUT) the raw temp sensor data (either from the sensor bridge or from
the external thermistor) without any digital correction. Analog chain settings must be programmed (PGA gain, coarse
offset correction, bridge current/voltage, and ADC sample rate).
MTP_EN
Bit 15 = 0: User can access MTP memory for read/write via any Interfaces (1-Wire and I2C) – Default at power up.
Bit 15 = 1: MTP memory is disabled (to save power in the digital interface).
Status Register
The status register reports all anomalies. The ones enabled in the "Interrupt Enable" register will also generate an interrupt
on the ALERT output pin.
Pressure Data Ready is not an anomaly. It informs the Host Processor that new data is available in the Pressure register.
Temperature Data Ready is not an anomaly either. It informs the Host Processor that new data is available in the register
Temperature. Each alert can be masked out with the register Interrupt Enable with the exception of DRV Fault and INT
Fault. These two faults are not masked because they must be reported whenever they occur.
• DRV Fault: Occurs when the voltage at the DRV pin exceeds 4.25V or when the inputs INP+ and INP- wander away
from the DRV/2 point by more than 30%. The latter condition, combined with checking the levels at INP+ and INP-
(through OV_INP+, UV_INP+, OV_INP-, UV_INP-) enables detecting whether or not the inputs INP+ and/or INP- are
open (not connected to the sensor bridge).
• INT Fault: Occurs when the voltage at the INT pin exceeds 2V.

In case any of these faults happen, the user has the possibility to shutdown the MAX40109 by accessing the shutdown
bit in the Configuration register. The user can select which faults to receive on the ALERT pin by using the Interrupt
Enable register.

Table 8. Status Register

BIT 11 BIT 10 BIT 9 BIT 8 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
Temp Pressure
INT
DRV Fault Data Data UV_DRV OV_DRV UV_INT OV_INT UV_INP- OV_INP- UV_INP+ OV_INP+
Fault
Ready Ready

To clear each flag in bits D11 to D0, a write to this register with the same word that was read is required. Writing 1 will
clear the bit that reads 1. When doing this flag clearing, what is written in the upper byte is meaningless and will not affect
this register.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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PGA Pressure Gain

This register selects the PGA Pressure Gain.
Bits [7:6] are reserved bits.
Table 9. PGA Pressure Gain
BIT [7:6] BIT [5:4] BIT 3 BIT 2 BIT 1 BIT 0 GAIN (V/V)
xx 00 1 1 1 1 5
xx 00 0 0 0 0 10
xx 00 0 0 0 1 15
xx 00 0 0 1 0 20
xx 00 0 0 1 1 24
xx 00 0 1 0 0 40
xx 00 0 1 0 1 60
xx 00 0 1 1 0 72
xx 00 0 1 1 1 90
xx 00 1 0 0 0 108
xx 00 1 0 0 1 126
xx 00 1 0 1 0 144
xx 00 1 0 1 1 160
xx 00 1 1 0 0 180
x 00 1 1 0 1 200
xx 00 1 1 1 0 252
xx 01 0 0 0 0 540
xx 01 0 0 0 1 1080
xx 01 0 0 1 0 1440
xx 01 0 0 1 1 2520

Current Source
This register selects the current source values.
Table 10. Current Source
BIT 2 BIT 1 BIT 0 CURRENT (µA)
0 0 0 250
0 0 1 300
0 1 0 400
0 1 1 450
1 0 0 500
1 0 1 550
1 1 0 650
1 1 1 750

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Uncalibrated Pressure
16-bit read-only register that holds the last pressure measurement data from the ADC before the digital calibration.
The pressure format is normalized. The smallest pressure is 1.0/32768 (0x0001), and the largest is 32767/32768
(0x7FFF).

Table 11. Uncalibrated Pressure Format

SIGN 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Two's complement format:
• 0x7FFF (equates to 32,767): corresponds to pressure max positive range.
• 0x0000 (equates to 0): corresponds to mid-scale or zero-pressure.
• 0x8000 (equates to -32,768): corresponds to pressure max negative range.

Uncalibrated Temperature
16-bit read-only register that holds the last temperature measurement data from the ADC prior to the calibration.
The temperature measurement is effectively a voltage measurement performed by the MAX40109.
See the Applications Information section for more details.
Users can choose the unit scale (oC or oK) in their MCU firmware. The MAX40109 is agnostic to the unit scale.

Table 12. Uncalibrated Temperature Format

SIGN 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Units

ADC Sample Rate

Select ADC Sample Frequency
Table 13. Sample Rate Selection
SAMPLE RATE SAMPLE RATE SYSTEM SWITCH TIME BETWEEN
BIT 3 BIT 2 BIT 1 BIT 0
PRESSURE (ksps) TEMPERATURE (sps) P SAMPLE AND T SAMPLE (μs)
0 0 0 0 1 1 500
0 0 0 1 1 10 500
0 0 1 0 2 1 250
0 0 1 1 2 10 250
0 1 0 0 4 1 125
0 1 0 1 4 10 125
0 1 1 0 8 1 62.5
0 1 1 1 8 10 62.5
1 0 0 0 16 1 31.25
1 0 0 1 16 10 31.26

The temperature sample must be interleaved between two pressure samples seamlessly, meaning that the pressure data-
rate must never be interrupted.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Interrupt Enable
This register includes the enables for interrupt generation flags with the same bit order as they are reported in the status
register. 1 = Interrupt is enable (default). 0 = Interrupt is disabled POR condition is 0xFF.
Table 14. Interrupt Register
BIT 9 BIT 8 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

Temp Pressure
Data Data UV_DRV OV_DRV UV_INT OV_INT UV_INP- OV_INP- UV_INP+ OV_INP+
Ready Ready

Bridge Drive
Table 15. Bridge Drive
BIT BIT
BRIDGE DRIVE BIT 1 COMMENT
2 0
Disconnected 0 0 0 Default mode at device power up
Current Source 0 0 1 The ADC reference is connected to the internal reference
Voltage Source at 4V 0 1 0 The ADC reference is connected to the bridge voltage
Voltage Source at 3.3V 0 1 1 The ADC reference is connected to the bridge voltage
Voltage Source at 1.8V 1 0 0 The ADC reference is connected to the bridge voltage
Voltage Source at 2.3V 1 0 1 The ADC reference is connected to the bridge voltage

PGA Temperature Gain

This register selects the PGA Temperature Gain.
Bits [7:4] are spare bits for future use.
Table 16. PGA Temperature Gain
BITS [7:4] BIT 3 BIT 2 BIT 1 BIT 0 Gain (V/V)
xxxx 0 0 0 0 1.5
xxxx 0 0 0 1 2
xxxx 0 0 1 0 3
xxxx 0 0 1 1 5
xxxx 0 1 0 0 6
xxxx 0 1 0 1 10
xxxx 0 1 1 0 15
xxxx 0 1 1 1 20
xxxx 1 0 0 0 24
xxxx 1 0 0 1 30
xxxx 1 0 1 0 36
xxxx 1 0 1 1 40
xxxx 1 1 0 0 45
xxxx 1 1 0 1 60
xxxx 1 1 1 0 72
xxxx 1 1 1 1 90

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Calibrated Pressure
16-bit read-only register that holds the last pressure measurement data after the digital calibration.
The pressure format is normalized. The smallest pressure is 1.0/32768 (0x0001), and the largest is 32767/32768
(0x7FFF).

Table 17. Calibrated Pressure Format

SIGN 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

Two's complement format:

• 0x7FFF (equates to 32,767): corresponds to pressure max positive range.
• 0x0000 (equates to 0): corresponds to mid-scale or zero-pressure.
• 0x8000 (equates to -32,768): corresponds to pressure max negative range.
Calibrated Temperature
16-bit read-only register that holds the last temperature measurement data after the digital temp calibration.
The temperature measurement is effectively a voltage measurement performed by the MAX40109.
See the Applications Information section for more details.
The user may choose the unit scale (°C or °K) in their MCU firmware. The MAX40109 is agnostic to the unit scale.

Table 18. Calibrated Temperature Format

SIGN 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Units

Temp Mode
Select how to configure the temperature channel at INT and DRV pins.
See the Temperature Measurement section Applications Information for more details.

Table 19. Temp Mode

BITS [4:3] BITS [2:0]
Voltage Divider (DRV input only) Temp Mode

Table 20. Temp Mode [2:0]

BIT 2 BIT 1 BIT 0 INPUT PIN INVOLVED FUNCTION
0 0 0 INT Single-ended with G = 1.
0 0 1 INT Single-ended with G>1.
0 1 0 INT Differential with DAC’s Offset.
0 1 1 DRV Single-ended with G = 1.
1 0 0 DRV Differential with DAC’s Offset.
1 0 1 n/a Not Used.
1 1 0 n/a Not Used.
1 1 1 n/a Not Used.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Table 21. Temp Mode [4:3]

BIT 4 BIT 3 INPUT PIN INVOLVED FUNCTION
0 0 DRV Scale Input Voltage at DRV by 1.
0 1 DRV Scale Input Voltage at DRV by 0.5.
1 0 DRV Scale Input Voltage at DRV by 0.375.
1 1 DRV Scale Input Voltage at DRV by 0.25.

Sensor Offset Cal Config

This register is used during the sensor offset calibration procedure with the purpose of cancelling out the sensor offset.
See the Sensor Offset Calibration section in Applications Information for more details.

Table 22. Sensor Offset Calibration Configuration

BIT 2 BIT 1 BIT 0

1 = Connect Trim Resistor 1 = Connect Offset Calibration Current Source

1 = Set Pressure PGA into bypass mode (G = 2V/V)
0 = Short out Trim Resistor 0 = Disconnect Offset Calibration Current
0 = Normal PGA functionality (default)
(default) Source (default)

Analog Filter BW
This register is used to select the internal analog filter for the pressure channel.

Table 23. Analog Filter Bandwidth

BIT 1 BIT 0 ANALOG FILTER BANDWIDTH (-3dB)
0 0 1.2kHz
0 1 9kHz
1 0 37kHz
1 1 45kHz

Zero Pressure Offset RAM Override

This register can override and replace the content of the MTP register "Zero Pressure Offset". This replacement is only
temporary since this is a RAM register. At the next power cycle, the content of the MTP register "Zero Pressure Offset" is
restored.
The replacement only happens if the Zero Pressure Offset Select register is set to 1.
16-bit register that sets the amount of bridge sensor offset that feeds the offset cancellation circuit in the analog PGA.
Two's complement format for ZERO_PRESSURE_OFFSET:
• 0x3FFF (equates to 32,767): corresponds to +90mV/V.
• 0x0000 (equates to 0): corresponds to mid-scale or 0mV/V.
• 0x8000 (equates to -32,768): corresponds to -90mV/V.
Zero Pressure Offset Select
Bit 0 is used to select a zero pressure offset value from the RAM.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Analog Output Stage

The MAX40109 uses four bits to configure the analog output stage as follows.
See the Analog Output Stage section in Applications Information.

Table 24. Analog Output Setting (AOS)

AOS FUNCTION RESISTOR VDDHV (MIN) FULL SCALE V/I COMMENTS UNITS
0 shutdown — 3V — — —
1 reserved — — — — —
2, D, E, F 1 x VDDHV —
3 Int 3V 0.91 x VDDHV Use when VDDHV = 3.3V
ratio-metric 0.6 * VDDHV Use when VDDHV = 5.0V
4 V
voltage
5 0.1515 x VDDHV x extGain —
Ext 3V
6 0.25 x VDDHV x extGain —
absolute 0.96 x REFIN/RSENSE
7 — 5V — A
current
8 4 x REFIN REFIN = 1.25V, 5V FS
Int 3V
9, A absolute 6 x REFIN REFIN = 0.5V, 3V FS
V
B voltage 0.4 x REFIN x extGain —
Ext 3V
C 1 x REFIN x extGain —

SLP_MR
16-bit register reserved for MTP initialization.
SLP_MREF
16-bit register reserved for MTP initialization.
CP_Control_1
8-bit register reserved for MTP burning.
CP_Control_2
8-bit register reserved for MTP burning.
MTP_Control
Table 25. MTP_Control Register
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
MTP_RESTORE RESERVED RESERVED MTP_PROT_EN RESERVED RESERVED STOP_PROG SRT_PROG

The MTP_Control register is used in MTP prototyping to the shadow register and burning to the MTP registers.
SRT_PROG: Used to start MTP burn.
STOP_PROG: Used to stop MTP burn.
MTP_PROT_EN: Used for prototype an MTP write to the shadow registers before burning to the MTP registers.
MTP_RESTORE: Used for restoring the MTP registers during prototyping of an MTP write to the shadow registers.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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MTP_Status
Table 26. MTP_Status
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
DONE ECC_ERR_2BIT ECC_ERR_1BIT RESERVED VPP_INIT_FAIL MTP_FULL VERI_FAIL VPP_ACT

The MTP_Status register provides MTP status during a burn procedure.

VPP_ACT: VPP is high (or low) voltage before the burn starts. Therefore, we abandoned the burn as we cannot control
over external programming voltage.
VERI_FAIL: The burn was attempted three times, but all three times, the verification failed.
MTP_FULL: There is no space left in the MTP to burn.
VPP_INIT_FAIL: VPP does not reach the desired voltage before the burn starts, so the burn is abandoned.
ECC_ERR_1BIT: One or more active records that were loaded on boot have a 1-bit error that was corrected. If a record
contains a 1-bit error, but a new record comes and overwrites the data, the 1-bit error status will be cleared.
ECC_ERR_2BIT: The records that were loaded on boot have a 2-bit error that was detected and not corrected. This
indicates a catastrophic failure that needs to be dealt with at the system level (eg: go to a safe mode). Once any record
contains a 2-bit error, this status bull will never get cleared by another record.
DONE: Indicates a burn is completed.
MTP_PROT_ADDR
MTP_PROT_ADDR is used to prototype a desired 8-bit MTP address.
MTP_PROT_WDATA
MTP_PROT_WDATA is used to prototype a desired 16-bit data before burning into MTP.
MTP_PROT_RDATA
MTP_PROT_RDATA is used to read the 16-bit prototype data before burning to MTP.
MTP_LEVEL
The MTP_LEVEL register indicates the number of burns remaining in the MTP register.
SLP_MRV
16-bit register reserved for MTP initialization.
SLP_MREFV
16-bit register reserved for MTP initialization
MTP_DATA0
MTP_DATA0 is the 16-bit data to burn into the desired MTP register.
MTP_ADDR
The MTP_ADDR register is the desired 8-bit MTP register to burn

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MAX40109 Precision Signal Conditioning AFE for Pressure
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MTP Memory and Functions

An MTP (Multi-Time-Programmable) memory is used to perform the functions in the following paragraphs.

Table 27. MTP Registers

ADDRESS NUMBER OF POR
REGISTER NAME READ/WRITE DESCRIPTION
(HEX) BITS STATE
CAL_DATA0 00h 16 0000h R/W K0 Coefficient [15:0].

CAL_DATA1 01h 16 0000h R/W K0 Coefficient [31:16].

CAL_DATA2 02h 16 0001h R/W K1 Coefficient [15:0].

CAL_DATA3 03h 16 0000h R/W K1 Coefficient [31:16].

CAL_DATA4 04h 16 0000h R/W K2 Coefficient [15:0].

CAL_DATA5 05h 16 0000h R/W K2 Coefficient [31:16].

CAL_DATA6 06h 16 0000h R/W K3 Coefficient [15:0].

CAL_DATA7 07h 16 0000h R/W K3 Coefficient [31:16].

CAL_DATA8 08h 16 0000h R/W H0 Coefficient [15:0].

CAL_DATA9 09h 16 0000h R/W H0 Coefficient [31:16].

CAL_DATA10 0Ah 16 0000h R/W H1 Coefficient [15:0].

CAL_DATA11 0Bh 16 0000h R/W H1 Coefficient [31:16].

CAL_DATA12 0Ch 16 0000h R/W H2 Coefficient [15:0].

CAL_DATA13 0Dh 16 0000h R/W H2 Coefficient [31:16].

CAL_DATA14 0Eh 16 0000h R/W H3 Coefficient [15:0].

CAL_DATA15 0Fh 16 0000h R/W H3 Coefficient [31:16].

CAL_DATA16 10h 16 0001h R/W G0 Coefficient [15:0].

CAL_DATA17 11h 16 0000h R/W G0 Coefficient [31:16].

CAL_DATA18 12h 16 0000h R/W G1 Coefficient [15:0].

CAL_DATA19 13h 16 0000h R/W G1 Coefficient [31:16].

CAL_DATA20 14h 16 0000h R/W G2 Coefficient [15:0].

CAL_DATA21 15h 16 0000h R/W G2 Coefficient [31:16].

CAL_DATA22 16h 16 0000h R/W G3 Coefficient [15:0].

.CAL_DATA23 17h 16 0000h R/W G3 Coefficient [31:16].

CAL_DATA24 18h 16 0000h R/W N0 Coefficient [15:0].

CAL_DATA25 19h 16 0000h R/W N0 Coefficient [31:16].

CAL_DATA26 1Ah 16 0000h R/W N1 Coefficient [15:0].

CAL_DATA27 1Bh 16 0000h R/W N1 Coefficient [31:16].

CAL_DATA28 1Ch 16 0000h R/W N2 Coefficient [15:0].

CAL_DATA29 1Dh 16 0000h R/W N2 Coefficient [31:16]

CAL_DATA30 1Eh 16 0000h R/W N3 Coefficient [15:0].

CAL_DATA31 1Fh 16 0000h R/W N3 Coefficient [31:16].

CAL_DATA32 20h 16 0000h R/W M0 Coefficient [15:0].

CAL_DATA33 21h 16 0000h R/W M0 Coefficient [31:16].

CAL_DATA34 22h 16 0000h R/W M1 Coefficient [15:0].

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MAX40109 Precision Signal Conditioning AFE for Pressure
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ADDRESS NUMBER OF POR

REGISTER NAME READ/WRITE DESCRIPTION
(HEX) BITS STATE
CAL_DATA35 23h 16 0000h R/W M1 Coefficient [31:16].

CAL_DATA36 24h 16 0000h R/W M2 Coefficient [15:0]..

CAL_DATA37 25h 16 0000h R/W M2 Coefficient [31:16]

CAL_DATA38 26h 16 0000h R/W M3 Coefficient [15:0].

CAL_DATA39 27h 16 0000h R/W M3 Coefficient [31:16].

Scratchpad memory for general

SP_DATA0 28h 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA1 29h 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA2 2Ah 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA3 2Bh 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA4 2Ch 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA5 2Dh 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA6 2Eh 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA7 2Fh 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA8 30h 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA9 31h 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA10 32h 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA11 33h 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA12 34h 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA13 35h 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA14 36h 16 0000h R/W
purpose and device identification.
Scratchpad memory for general
SP_DATA15 37h 16 0000h R/W
purpose and device identification.
[15:8] bits: overpressure +,
DIAG_DATA0 38h 16 FF00h R/W
[7:0] under pressure +.
[15:8] bits: overpressure -,
DIAG_DATA1 39h 16 FF00h R/W
[7:0] under pressure -.
[15:8] bits: overvoltage temperature,
DIAG_DATA2 3Ah 16 FF00h R/W
[7:0] under voltage temperature.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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ADDRESS NUMBER OF POR

REGISTER NAME READ/WRITE DESCRIPTION
(HEX) BITS STATE

[15:8] bits: overvoltage drive,

DIAG_DATA3 3Bh 16 FF00h R/W
[7:0] under voltage drive.

[15:8] bits: primary threshold

PRESSURE_THRESOLD 3Ch 16 0000h R/W pressure value, [7:0] hysteresis
threshold pressure value.

ZERO_PRESSURE_OFFSET 3Dh 16 0000h R/W PGA sensor offset.

TEMP_OFFSET 3Eh 16 0000h R/W [8:0] bits: temperature offset.
Bit 10 clipping threshold enabled,
CLIPPING_THRESHOLD 3Fh 16 0000h R/W
upper [9:5] bits, lower [4:0] bits.
Bit 8 diagnostic range enable,
DIAGNOSTIC_RANGE 40h 16 0000h R/W
upper [7:4] bits, lower [3:0] bits.

The configuration register contains

bit control temperature calibration
enable, digital filter, reference input,
FUNC_CONFIGURATION 41h 16 0000h R/W
current source reference resistor,
shutdown, temperature current, alert
mode, and PGA input mux.

PGA temperature; [11:8] bits, PGA

PGA_TEMP_PRES_GAIN 42h 16 0000h R/W
pressure gain; [5:0].

[14:13] bits, voltage divider; [12:10]

bits, temperature mode; [9:7]
MISCELLANEOUS 43h 16 0000h R/W bits, bridge drive; [6:3] bits,
ADC sample rate; [2:0] bits,
current source.

bit 15: MTP lock; bit 14: zero

pressure offset enabled, bit
CONFIG MTP 44h 16 004Dh R/W 13; sensor polarity, [12:9]
bits; analog output stage,
[6:0] bits, I2C client address.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Bridge Sensor Calibration

A small digital signal processor (DSP) is used for processing the converted bridge sensor data and perform temperature
and non-linearity corrections (calibration).
The MAX40109 uses an MTP (Multi-Time Programmable) memory to store the calibration coefficients for pressure and
temperature measurements.
The coefficients in the memory are used to build a third-order polynomial correction for both pressure and temperature
non-linearity:
T0 = (k0 + k1 x T + k2 x T2 + k3 x T3)
POUT = (h0 + h1 x T0 + h2 x T0 2 + h3 x T03) + (g0 + g1 x T0 + g2 x T02 + g3 x T03) x P + (n0 + n1 x T0 + n2 x T02 + n3 x
T03) x P2 + (m0 + m1 x T0 + m2 x T02 + m3 x T03) x P3

Figure 3. Bridge Sensor Calibration Diagram

The calibration can be bypassed through the Configuration Register. By bypassing the calibration the MAX40109 is
providing raw sensor data (Raw Mode).
The format of the coefficients is shown in Table 28.
Table 28. Offset Coefficients, k0 and h0:
BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Sign Data
BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Data
- All other coefficients.
Table 29. All Other Coefficients
BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Sign Integer Fraction
BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Fraction

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MAX40109 Precision Signal Conditioning AFE for Pressure
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See Figure 4 for the calibration DSP block diagram.

Figure 4. Calibration DSP Block Diagram

Scratch Pad Memory

The MAX40109 features 32 bytes of Scratch Pad memory (SP) for general purpose and device identification. This is a
16x16 memory-free for the user.
Diagnostics
The MAX40109 performs voltage out-of-bounds monitoring/diagnostics on the four critical sensor signals: DRV, INP+,
INP-, and INT. Internally, it has an 8-bit reference DAC, which has a full-scale that is automatically set to either 5.5V or
3.6V, based on the Analog Output Stage (AOS) register bits. There are 4 AOS settings which will select the 3.6V full-
scale: AOS<0×3>, AOS<0×5>, AOS<0×9>, AOS<0×B>. All other AOS settings will select the 5.5V full-scale. Note that
this diagnostic reference DAC has fixed LSB steps for its full-scale voltage, LSB(V) = full-scale(V)/255, but VDD5V voltage
likely will bound the upper range of this DAC. Code 0xFF, which is the out-of-the-way default for overvoltage monitoring,
is set to VDD5V, independent of full-scale setting.
The diagnostics are as follows:
• Bridge sensor under/over voltage to monitor for sensor connectivity faults. The device compares the voltage at INP+
and INP– pins with programmable (thorough MTP memory registers) over-voltage and under-voltage thresholds:
• OV_INP+
• OV_INP-
• UV_INP+
• UV_INP-
• Bridge supply under/over voltage to monitor for sensor connectivity faults. The device compares the voltage at the
DRV pin with programmable (thorough MTP memory registers) over-voltage and under-voltage thresholds:
• OV_DRV
• UV_DRV
• Temperature sensor under/over voltage to monitor for sensor connectivity faults. The device compares the voltage at
INT with the programmable (thorough MTP memory registers) over-voltage and under-voltage thresholds:
• OV_INT
• UV_INT

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MAX40109 Precision Signal Conditioning AFE for Pressure
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MA

Figure 5. Diagnostic Diagram

Pressure Thresholds on ALERT

The MAX40109 uses two 8-bit MTP registers to store primary/hysteresis thresholds compared against the measurements
collected in the upper 8-bit of the register "Pressure".
The output of this comparison is routed to the pin ALERT if such a feature is enabled in the Configuration Register. See
the description in that register for more details.
Zero Pressure Offset
In pressure measurement systems, some bridge offset from the sensor interferes with the desired signal. MAX40109
offers a solution to calibrate this offset out. This is done by sourcing and sinking a current through a resistor at the input
of the front-end amplifier.
There are 16 total bits reserved for bridge offset calibration (br_trim<15:0>), Table 30 describes the function of each bit:
Table 30. Zero Sensor Offset Register
BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT BIT
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Sign 7 bits shared by both p and n sides P-side specific trim bits N-side trim specific trim bits

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MAX40109 Precision Signal Conditioning AFE for Pressure
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As shown in Table 30, there are four bits, each reserved for both the p- and n- sides of the trim. Together with 7 bits
shared by both p- and n- sides, we have 11 total bits of offset trim for each side.
The independently controlled/programmable "LSB" bits for p- and n- sides can be used to minimize the mismatch between
p- and n- currents. If the p/n current mismatch residue after the trim is 0 then the sensor offset compensation remains
valid for any gain setting.
If this is important, then this residue must be minimized and confirmed for the required gain values.
Table 31 shows the typical value of bridge offset compensation bit-weights. For example, when the bridge sensor input
has zero pressure, if we set sign bit to 0, B14 to 1, and B13-B0 to 0 (0x4000), the typical value of offset compensation is
4.5e-2 V/V, for 2.3V bridge drive voltage, we see an effective input voltage of -103.5mV at the input. For the 1.8V bridge
drive voltage, we are seeing an effective input voltage of -81mV.

Table 31. Typical Value of Bridge Offset Compensation Bit-weights (V/V)

B0, B4 B1, B5 B2, B6 B3, B7 B8 B9 B10 B11 B12 B13 B14
4.395e- 8.789e- 1.758e- 3.516e- 7.031e- 1.406e- 2.813e- 5.625e- 1.125e- 2.250e- 4.500e-
05 05 04 04 04 03 03 03 02 02 02

This feature can be enabled/disabled with the zero-pressure offset enable MTP bit, which by default is disabled.
Config Register
Configuration register includes miscellaneous functions.
I2C Client Address
The MAX40109 uses a 7-bit MTP register to store the I2C address.
Such a register can only be written and read through the 1-wire interface.

Table 32. I2C Address

BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT1 BIT 0
7-bit I2C register accessible only by 1-wire interface
Default value at power up is binary 100_1101

Lock MTP
The MTP lock bit is located in the MTP register CONFIG MTP (0x44), bit 15.
0 = MTP memory is not locked (default).
1 = MTP memory is locked, and no further changes are possible.
Once the MTP lock bit is burned in memory, it will stay locked and cannot be changed. MTP registers will be read-only.
Zero-pressure Offset Enable
The zero-pressure offset enable bit is located in the MTP register COMFIG MTP (0x44), bit 14.
0 = The "Zero-pressure offset" compensation is enabled.
1 = The "Zero-pressure offset" compensation is disabled.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Sensor Polarity
The sensor polarity bit is in the MTP register CONFIG MTP (0x44), bit 13.
0 = The sensor is unipolar (default).
1 = The sensor is bipolar.

Figure 6. Sensor Polarity Data Flow

Output Clipping Enable

The output clipping enable bit is located in the MTP register CLIPPING_THRESHOLD (0x3F), bit 10.
0 = No clipping.
1 = Analog output clipping is enabled. See lower/upper clipping thresholds in the MTP memory space.
Analog Diagnostic Enable
The analog diagnostic enable bit is located in the MTP register DIAGNOSTIC_RANGE (0x40), bit 8.
0 = No analog diagnostics (ALERT and status register)
1 = Analog diagnostic is enabled. See LDR/UDR in the MTP memory space.
Temperature Offset
The MAX40109 uses 9 MTP bits to provide a DC offset value for the temperature channel when used in differential mode.
See also Configuration Register "Temp Input" bit and Temperature Measurement section in Applications Information for
more details.

Table 33. Temperature Offset

MTP REGISTER NAME MTP REGISTER DATA FIELD (9 BITS)
TEMP_OFFSET Data. Default is 0x000

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MAX40109 Precision Signal Conditioning AFE for Pressure
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MTP Re-programmability
The MTP memory can be re-programmed a finite number of times.
In particular, the calibration memory (see "Bridge Sensor Calibration") can be re-programmed 40 times.
All other memories and registers can be re-programmed ten times.
Output Clipping Thresholds
The MAX40109 uses two thresholds (upper and lower) to program the analog output clipping levels.
Each of the two thresholds is a 5-bit register.
See the MTP register "Analog Output Stage" to determine whether the analog output is in voltage mode or current mode.
The clipping range is different in the two cases.
See "Output Clipping Enable" to see whether this feature is enabled.

Table 34. MTP Register

MTP REGISTER NAME DATA FIELD (BITS) V-OUTPUT I-OUTPUT
0_0000 2.5% of FS 3.8mA
Lower Clipping Threshold
1_1111 25% of FS 4mA
0_0000 75% of FS 20mA
Upper Clipping Threshold
1_1111 100% of FS 24mA

Analog Output Diagnostic Levels

The MAX40109 uses two diagnostic registers (upper and lower diagnostic range) to program the analog output diagnostic
levels.
Each of the two registers is 4-bit.
Any conditions that generate an ALERT interrupt due to a fault are usually reported to the Status Register. In addition to
that, it will also generate an analog output alert condition by forcing the analog output (OUT) to either of the two diagnostic
levels.
In particular (see "Status Register"):
• DRV fault, INT fault, OV_DRV, OV_INT, OV_INP+, OV_INP- will map to Upper Diagnostic Range
• UV_DRV, UV_INT, UV_INP+, UV_INP- will map to Lower Diagnostic Range.
• Temp Data Ready and Pressure Data Ready are not mapped to the analog output.
See MTP bit "Analog Diagnostic Enable" for this feature to be enabled or disabled.

Table 35. Diagnostic Register

MTP REGISTER NAME DATA FIELD (BITS) V-OUTPUT I-OUTPUT
0000 0% of FS 3.6mA
Lower Diagnostic Range (LDR)
1111 2.5% of FS 3.9mA
0000 97.5% of FS 21mA
Upper Diagnostic Range (UDR)
1111 100% of FS 24mA

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Initializing MTP
When the user is ready to burn to MTP, the user will need to apply a minimum of 12V at the V DDHV supply pin. The
following I2C/1-Wire sequence of commands must be performed.
• Write CP_Control_1 register with 8’h80.
• Write CP_Control_2 register with 8’h1B.
• Write SLP_MR register with 16’h0302.
• Write SLP_MREF register with 16’h0200.
• Write SLP_MRV register with 16’h0300.
• Write SLP_MREFV register with 16’h0401.
Burning to MTP
When burning to MTP, 12V is the minimum supply voltage at VDDHV. For each register, the user will need to burn in the
data by using the following procedure.
• Write to the MTP_ADDR register with 8’hxx where xx is the desired MTP register.
• Write to the MTP_DATA0 register with 16’hxxxx where xxxx is the desired MTP data.
• Write to the MTP_Control register with 8'h01.
Example: To set the TEMP_OFFSET register in MTP, the user would set the MTP_ADDR0 register to 0x3E. Next, write
0x0FF to set the MTP_DATA register to half scale of the 9-bit DAC. Lastly, write 0x01 to the MTP_Control register.
Repeat the above steps until all the MTP registers are burned to the desired settings. Once completed, the user should
power down and power up to check the MTP settings. To confirm the settings, a read must be performed.
• Write to the MTP_Control with 8'h10;
• Set the MTP_PROT_ADDR to the desired MTP address to read.
• Read from the MTP_PROT_RDATA register.
Digital Interface Management
All internal RAM registers as well as various MTP memories and registers can be accessed by any of the digital interfaces.
The only exceptions are the MTP register for I2C address that can only be accessed through 1-wire.
The MAX40109 responds to either of its digital interfaces, meaning either to 1-wire or I2C. In case of concurrent access,
1-Wire takes the priority.
1-Wire Interface
The MAX40109 1-Wire interface is a bi-directional communication through the DQ pin. The DQ line should be held to the
logic level when 1-Wire is idle.
Power Line Communication (PLC)
The MAX40109 power line communication is a two-wire uni-directional interface that takes input data on the VDDHV line
and output data coming out from the analog OUT pin. The DQ line must also be held high to enable PLC functions. These
protocols do not function if DQ is low ever.
To use the PLC, the digital signal must have a VIH above 31V and a VIL below 24V. DQ must be connected to a high
logic level. VDDHV one-wire is activated if a particular key-code is entered within 1 second of the power applied.
The VDDHV key-code timer starts with a rising edge of VDDHV through the VIH level. There are three 50ms periods from
that rising edge point in time.
In the first 50ms period, the sequence starts from a rising edge at 0ms, and there must be exactly four pulses of ≥1ms
high and ≥1ms low in the first 45ms. At least the last 5ms of the 50ms period must be low for timing tolerance.
In the second 50ms period, there must be at least 5ms of low time before pulses, again, a minimum of 1ms high and 1ms
low and a minimum 5ms low before the 100ms time. In this second period, there must be 1 to 4 whole pulses applied.
The pulse count, 1-4, will override the 2 LSB bits of Analog Output Stage register bits (in a shadow temporary register).
In the third 50ms period, there must be at least 5ms of low time before pulses, again, a minimum of 1ms high and 1ms
low. In this third period, there must be 1.5 to 4.5 pulses applied, ending at a high state. There must be a minimum of 10ms
high time before the 150ms time, and 10ms held past the 150ms time to accommodate timing tolerances. The pulse
count, 1.5-4.5, will override the 2 MSB bits of Analog Output Stage register bits (in a shadow temporary register).

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MAX40109 Precision Signal Conditioning AFE for Pressure
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The overall number of pulses in the second and third 50ms periods will determine the analog output configuration by
overriding the Analog Output Stage MTP register with a shadow 4-bit RAM register, as follows:
In Group 2, 50ms duration:
• if we have 1 pulse (high +low) then AOS[1:0] = 00.
• if we have 2 pulses (high +low) then AOS[1:0] = 01.
• if we have 3 pulses (high +low) then AOS[1:0] = 10.
• if we have 4 pulses (high +low) then AOS[1:0] = 11.

In Group 3, 50ms duration:

• if we have 1.5 pulse then AOS[3:2] = 00.

• if we have 2.5 pulses then AOS[3:2] = 01.
• if we have 3.5 pulses then AOS[3:2] = 10.
• if we have 4.5 pulses then AOS[3:2] = 11.
where AOS is equivalent to Analog Output Stage.
See the Analog Output Stage register in the MTP section for more details of what each code corresponds to regarding
analogue output functionality.
After the VDDHV one-wire activation is complete, the VDDHV one-wire protocol follows the DQ protocol but at 8x slower
timing in both directions. So, the initialization sequence is the next step, with a reset pulse from the bus host and a
presence pulse returned from the OUT pin. All read data will be present on the OUT pin.
To exit the PLC and activate the bi-directional communication on DQ, create a transition from high to low on the DQ line.

Figure 7. Power Line Communication Activation Timing

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MAX40109 Precision Signal Conditioning AFE for Pressure
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I2C-Compatible Bus Interface

A standard I2C-compatible 2-wire serial interface reads current/voltage data from the current and voltage registers and
reads and writes control bits to and from the configuration registers. The DQ line must also be held high to enable I2C
functions.

Figure 8. I2C Timing Diagram

Normal transactions consist of 2-byte writes and reads, however some registers are single byte read. Attempting longer
transactions is not recommended. A transaction always begins with a START (S) condition followed by the client address
and the Write/Read bit.
A 2-byte write transaction (Write Word) begins with the host generating a START condition and then transmitting the
MAX40109's client address, followed by the Write bit. The MAX40109 acknowledges with an ACK (A) bit, and the host
transmits the target register, followed by another ACK from the MAX40109. The host then writes the two data bytes, and
the MAX40109 ACKs each. The host ends the transaction by generating a STOP (P) condition. Writing more bytes (not
recommended) will overwrite the register (e.g., DATA HIGH - DATA LOW - DATA HIGH - DATA LOW for a 4-byte write).

Figure 9. 2-Byte Write (Write Word)

A 2-byte read (Read Word) is more complex than a write. After transmitting the register byte and receiving an ACK from
the MAX40109, the host generates a REPEAT START (Sr) and writes the address and a Read bit. The MAX40109 then
ACKs the address/read byte and transmits the two data bytes. The host ACKs the first and NACKs the second, signaling
that the transaction is complete, and generating the STOP condition.

Figure 10. 2-Byte Read (Read Word)

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MAX40109 Precision Signal Conditioning AFE for Pressure
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A one-byte read is similar to the Read Word above, but only one byte is read; see Figure 11.

Figure 11. One-Byte Read

1-Wire Bus System

The 1-Wire bus system uses a single bus host to control one or more client devices. The MAX40109 is always a client.
When there is only one client on the bus, the system is called as a single-drop system; the system is multidrop if there
are multiple clients on the bus. All data and commands are transmitted the least significant bit first over the 1-Wire bus.
The following discussion of the 1-Wire bus system is broken down into three topics: hardware configuration, transaction
sequence, and 1-Wire signaling (signal types and timing).

Figure 12. 1-Wire Bus Timing Diagram

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MAX40109 Precision Signal Conditioning AFE for Pressure
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64-Bit ROM Code

Each 1-Wire component contains a unique 64-bit code stored in ROM (Figure 13). The least significant 8 bits of the ROM
code have the sensor’s 1-Wire family code, 76h. The following 48 bits contain a unique serial number. The most significant
8 bits contain a cyclic redundancy check (CRC) byte that is calculated from the first 56 bits of the ROM code. See CRC
Generation for a detailed explanation of the CRC bits. The 64-bit ROM code and associated ROM function control logic
allow the device to operate as a 1-Wire device using the protocol detailed in the 1-Wire Bus System.

Figure 13. 64-bit ROM Code

CRC Generation
CRC bytes are provided as part of the device’s 64-bit ROM code in the 9th byte of the Scratchpad. The ROM code CRC
is calculated from the first 56 bits of the ROM code and is contained in the most significant byte of the ROM. The
Scratchpad CRC is calculated from the data in the Scratchpad and, therefore, changes when the data in the Scratchpad
changes. The CRC provides the bus host with a method of data validation when data is read from the device. To verify
that data has been read correctly, the bus host must recalculate the CRC from the received data and then compare this
value to either the ROM code CRC (for ROM reads) or the Scratchpad's CRC (for Scratchpad reads). If the calculated
CRC matches the read CRC, the data has been received error-free. The comparison of CRC values and the decision to
continue with an operation are determined entirely by the bus host. No circuitry inside the device prevents a command
sequence from proceeding if the CRC (ROM or scratchpad) does not match the value generated by the bus host.
The equivalent polynomial function of the CRC (ROM or scratchpad) is:
CRC = X8 + X5 + X4 + 1
The bus host can recalculate the CRC and compare it to the CRC values from the device using the polynomial generator,
as shown in Figure 14. This circuit consists of a shift register and XOR gates, and the shift register bits are initialized to
0. Starting with the least significant bit of the ROM code or the least significant bit of byte 0 in the scratchpad, one bit at
a time should shifted into the shift register. After shifting in the 56th bit from the ROM or the most significant bit of byte 7
from Scratchpad 1 or byte 10 from Scratchpad 2, the polynomial generator contains the recalculated CRC. Next, the
device’s 8-bit ROM code or Scratchpad CRC must be shifted into the circuit. At this point, if the recalculated CRC was
correct, the shift register contains all zeros. Additional information about the Maxim 1-Wire CRC is available in Application
Note 27: Understanding and Using Cyclic Redundancy Checks with Maxim iButton® Products.

Figure 14. CRC Polynomial Generator

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Hardware Configuration
The MAX40109 supports two hardware options using asynchronous serial data interfaces.
These options are one-time programmed at the factory.
1. 1-Wire serial data has an independent input/output pin (DQ).
2. Serial data input is shared with VDDHV, and serial data output is shared with the analog voltage output (OUT).
The 1-Wire bus has, by definition, only a single data line. Each device (host or client) interfaces to the data line using an
open-drain or three-state port. This allows each device to “release” the data line when the device is not transmitting data,
making the bus available for use by another device. The device’s 1-Wire port (DQ) is an open drain with an internal circuit
equivalent to that shown in [[Hardware Configuration]].
The 1-Wire bus requires an external pullup resistor of approximately 5kΩ; thus, the idle state for the 1-Wire bus is high.
If, for any reason, a transaction needs to be suspended, the bus must be left in the idle state if the transaction is to resume.
Infinite recovery time can occur between bits so long as the 1-Wire bus is in the inactive (high) state during the recovery
period. If the bus is held low for more than 480µs, all components on the bus are reset.

MA

Figure 15. 1-Wire Hardware Configuration

Transaction Sequence
The transaction sequence for accessing the device is as follows:
Step 1: Initialization.
Step 2: ROM Command (followed by any required data exchange).
Step 3: Function Command (followed by any required data exchange).
It is very important to follow this sequence every time the MAX40109 is accessed, as the MAX40109 only responds if any
steps in the sequence are in order. An exception to this rule is the Search ROM command. After issuing this ROM
command, the host must return to step 1 in the sequence.
Initialization
All transactions on the 1-Wire bus begin with an initialization sequence. The initialization sequence consists of a reset
pulse transmitted by the bus host followed by a presence pulse(s) transmitted by the client(s). The presence pulse lets
the bus host know that client devices (MAX40109) are on the bus and are ready to operate. Timing for the reset and
presence pulses is detailed in 1-Wire Signaling section.
ROM Commands
After the bus host has detected a presence pulse, it can issue a ROM command. These commands operate on the unique
64-bit ROM codes of each client device and allow the host to single out a specific device if many are present on the
1-Wire bus. These commands also allow the host to determine how many and what types of devices are present on the

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MAX40109 Precision Signal Conditioning AFE for Pressure
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bus. There are four ROM commands, and each command is 8 bits long. The host device must issue an appropriate ROM
command before issuing a MAX40109 function command. An exception to the rule is when the detect address is used to
communicate with devices. ROM commands are not used when selecting an address to communicate. [[MAX40109
ROMs Command Flowchart]] shows a flowchart for the operation of the ROM commands.

Figure 16. MAX40109 ROMs Command Flowchart

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Search ROM [F0h]

When a system is initially powered up, the host must identify the ROM codes of all client devices on the bus, which allows
the host to determine the number of clients and their device types. The host learns the ROM codes through a process of
elimination that requires the host to perform a Search ROM cycle (i.e., Search ROM command followed by data exchange)
as many times as necessary to identify all the client devices. If there is only one client on the bus, the simpler Read ROM
command can be used in place of the Search ROM process. For a detailed explanation of the Search ROM command
procedure, refer to Application Note 937: Book of iButton® Standards. After every Search ROM cycle, the bus host must
return to step 1 (initialization) in the transaction sequence.
Read ROM [33h]
This command can be used only when one client on the bus. The bus host can read the client’s 64-bit ROM code without
using the Search ROM command procedure. If this command is used when there is more than one client present on the
bus, a data collision occurs when all the clients attempt to respond at the same time.
Match ROM [55h]
The Match ROM command, followed by a 64-bit ROM code sequence, allows the bus host to address a specific client
device on a multidrop or single-drop bus. Only the client that exactly matches the 64-bit ROM code sequence responds
to the function command issued by the host; all other clients on the bus wait for a reset pulse.
Skip ROM[ CCh]
The host can use this command to address all devices on the bus simultaneously without sending out any ROM code
information.
Note that the Read Scratchpad command can follow the Skip ROM command only if there is a single client device on the
bus. In this case, time is saved by allowing the host to read from the client without sending the device’s 64-bit ROM code.
A Skip ROM command followed by a Read Scratchpad command causes a data collision on the bus if there is more than
one client because multiple devices attempt to transmit data simultaneously.
Function Command
After the bus host has used a ROM command to address the MAX40109 with which it wishes to communicate, the host
can issue one of the MAX40109 function commands. These commands allow the host to write and read the device’s MTP
memories as well as write and read all the RAM registers. See the MTP Memory and Functions and Internal Registers
(Volatile, RAM) sections for more details of all the MAX40109 functions.
Function Commands are used to access the registers mapped with the device. Here, function commands are used to
access the MTP and RAM registers of the OZ98. The following commands can be used to access registers.
• Write Register (CCh)
• Read Register (33h)

Table 36. Command Format

Command (CCh) Address (A) Length (n) Data (byte(A), byte(A+1), …., byte(A+(n-1)))

Command: Will indicate whether it is writing or read.

Address: Start address of the write/read operation.
Length: How many bytes of data need to be written (length = length + 1).
Data: Write/Read data.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Data Format
The data format for a Command Field (either ROM or Function Command) is shown in Figure 17 and Figure 18.

Figure 17. Command Field

Figure 18. Data Field

1-Wire Signaling
Using a strict 1-Wire communication protocol helps to ensure data integrity. This protocol defines several signal types:
reset pulse, presence pulse, write-zero, write-one, read-zero, and read-one. The bus host initiates all these signals except
the presence pulse.
Initialization Procedure: Reset and Presence Pulses
All communication with the device begins with an initialization sequence that consists of a reset pulse from the host
followed by a presence pulse from the device (illustrated in [[Initialization Timing]]). When the device sends the presence
pulse in response to the reset, it indicates to the host that it is on the bus and ready to operate.
During the initialization sequence, the bus host transmits (Tx) the reset pulse by pulling the 1-Wire bus low for 480µs
(min). The bus host then releases the bus and enters receive mode (Rx). When the bus is released, the pullup resistor
pulls the 1-Wire bus high. When the device detects this rising edge, it waits for 15µs to 60µs and then transmits a presence
pulse by pulling the 1-Wire bus low for 60µs to 240µs.

Figure 19. 1-Wire Initialization Timing

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Read/ Write Time Slots

The bus host writes data to the device during write time slots and reads data from the device during read time slots. One
bit of data is transmitted over the 1-Wire bus per time slot.
Write Time Slots
There are two types of write time slots: write-one time slots and write-zero time slots. The bus host uses a write-one time
slot to write a logic 1 to the device and a write-zero time slot to write a logic 0 to the device. All write time slots must have
a 60µs (min) duration with a 1µs (min) recovery time between individual write slots. Both types of write time slots are
initiated by the host pulling the 1-Wire bus low [[Read/Write Time Slot Timing Diagram]].
To generate a write-one time slot, after pulling the 1-Wire bus low, the bus host must release the 1-Wire bus within 15µs.
When the bus is released, the pullup resistor pulls the bus high. To generate a write-zero time slot, after pulling the 1-
Wire bus low, the bus host must continue to hold the bus low for the duration of the time slot (at least 60µs).
The device samples the 1-Wire bus during a window that lasts from 15µs to 60µs after the host initiates the write time
slot. If the bus is high during the sampling window, 1 is written to the device. If the line is low, a 0 is written to the device.

Figure 20. 1-Wire Read/Write Time Slot Timing Diagram

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Read Time Slots

The device can only transmit data to the master when the master issues read time slots. Therefore, the master must
generate read time slots immediately after issuing a Read Scratchpad command so that the device can provide the
requested data.
All read time slots must be 60µs (min) in duration with a 1µs (min) recovery time between slots. A read time slot is initiated
by the master device pulling the 1-Wire bus low for a minimum of 1µs (tINIT) and then releasing the bus ([[Read/Write
Time Slot Timing Diagram]]). After the master initiates the read time slot, the device begins transmitting a 1 or 0 on the
bus. The device transmits a 1 by leaving the bus high and transmits a 0 by pulling the bus low. When transmitting a 0, the
device releases the bus by the end of the time slot, and the pullup resistor pulls the bus back to its high idle state. Output
data from the device is valid for 15µs after the falling edge that initiated the read time slot. Therefore, the master must
release the bus and then sample the bus state within 15µs from the start of the slot. Figure 21 illustrates that the sum of
tINIT, tRC, and the master sample window must be less than 15µs for a read time slot. tRC is the rise time due to the
resistive and capacitive characteristics of the bus. Figure 22 shows that the system timing margin is maximized by keeping
tINIT and tRC as short as possible and by locating the master sample time during read time slots near the end of the 15µs
period.

Figure 21. Detailed Master Read-One Timing

Figure 22. Recommended Master Read-One Timing

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Applications Information
Temperature Measurement
The MAX40109 offers two modes to collect temperature measurements:
1. Directly from the bridge resistance. In this mode, the sensor bridge must be driven with current through the DRV
output pin. The device measures the voltage directly at DRV. Temperature measurements from DRV (as voltage
signals) are collected seamlessly from pressure measurements by automatically inserting a temperature
measurement within two pressure measurements. The data rate ratio between pressure and temperature samples
is determined in the register ADC Sample Rate.
2. By connecting a thermistor to the input INT.
See register Temp Mode for details on enabling each mode and the "Configuration" register for the driving current at the
INT pin.
In addition, the temperature channel input amplifier may be configured as either single-ended or differential, as shown in
Figure 23.

Table 37. Temperature Channel Input Configuration

INPUT PIN CONFIGURATION ADC K1 K2 K6 K7 K8
Single-ended with G = 1 SE X X
INT Single-ended with G > 1 SE X X
Differential-ended with DAC’s offset DE X X X
Single-ended with G = 1 SE X X
DRV
Differential-ended with DAC’s offset and G = 1 DE X X X

IB
K1
INT
RT

IB0 PGA (G)

BUFFER
K2
VOLTAGE DIVER
DRV A1 X-CODE
1/0.5/0.375/0.25 ADC

G1

BRIDGE G2
SENSOR K6
A2
K7
K8

Y-CODE
9-BIT DAC

Figure 23. Temperature Circuit

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Use External Resistor for Bridge Current Source

The MAX40109 can drive the sensor bridge with either voltage or current.
When driving with current, the current source is integrated into the device. The temperature coefficient of the current
source is dominated by the temperature drift of the internal resistor, which is 50ppm/°C (typ).
The user may use an external resistor with a lower temperature coefficient, as shown in the following diagram. The
external sense resistor (REXT) is connected to the input pin INT. Its nominal value should be 100kΩ. The internal
resistor (RINT) is 50kΩ nominally. In this case, it will not be possible to connect a thermistor to INT. However, the
temperature measurement from the bridge resistor (through DRV) is still allowed.

CURRENT
MIRROR
MAX40109
DRV

INT

BRIDGE
VREF SENSOR
REXT
RINT EXTERNAL
CURRENT SET
RESISTOR

Figure 24. External Resistor for Current Bridge Source

Ratio-metric Voltage Output

To create a 0-5V voltage output that is ratio-metric with the supply voltage, the following step is required:
• Program the MTP memory register Analog Output Stage to select option 0x1.
It is possible to drop VDDHV to a level below the internal LDO output voltage of VDD5V. In this case, the internal LDO is
in drop-out mode. See the Electrical Characteristics table for the drop-out voltage.
Sensor Offset Calibration
This section describes the procedure required to calibrate the sensor offset.
• User activates “pressure_cal_bypass” (configuration register, bit 13) to enter bridge offset calibration mode. Start at
room temp.
• Bypass the pressure PGA gain (see register Sensor Offset Cal Config).
• User measures offset with a default setting of gain = 2V/V.
• If preferred, for more accuracy, the user can adjust gain such that the signal at the input of the ADC is within ½ ADC
full-scale and ADC full-scale.
• User determines the correct offset calibration code based on the table below (to be added).
• Highly recommended: If the user wants to check offset calibration code accuracy without writing to MTP, they can load
trim code into a register “ZERO_PRESSURE_OFFSET<15:0>” and reconnect the internal trim resistor and the offset
calibration current source to measure the residue (set bits 2 and 1 of Sensor Offset Cal Config).
• Adjust trim code to achieve acceptable residue. It is highly recommended to confirm residue with the final trim code.
• User deactivates “pressure_cal_bypass”
• Write trim code into MTP.

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Using the MAX40109 to Perform Sensor Calibration

All the following calibration steps are performed through the 1-Wire interface. The first calibration step is to calibrate the
external temperature sensor:
• Set the device into Temp Cal Bypass (through Configuration Register).
• Default temperature coefficients are already preset with k0 = 0, k1 = 1, k2 = 0, and k3 = 0. Set PGA gain, Bridge Drive,
ADC sample rate, and sensor offset correction.
• Collect all required temperature measurements.
• User calculates the k0—k3 coefficient with own software/algorithm.
• User programs k0—k3 coefficients in the MTP memory. The second step is to calibrate the sensor bridge pressure
measurement.
• Set the device into Pressure Cal Bypass (through Configuration Register).
• Measure the zero-pressure sensor offset.
• Correct the zero-pressure sensor offset using the MTP register "ZERO_PRESSURE_OFFSET".
• Set PGA gain, Bridge Drive, and ADC sample rate.
• Collect all required pressure measurements.
• User calculates the 16 coefficients hx, gx, mx, and nx with own software/algorithm.
• The user programs the 16 coefficients in the MTP memory. See the Bridge Sensor Calibration section for additional
details.
Analog Output Stage
The analog output stage can provide either current output (4mA–20mA) or voltage output in many fashions, either with
internal gain or external resistors to set a custom gain. See MTP register Analog Output Stage for more details. See
Typical Application Circuits for examples.
The internal circuit at that output will vary depending on the analog output stage settings. R1 = 395kΩ and R2 = 379kΩ
applies for all AOS, R3 = 279kΩ (AOS = 8) or 310kΩ (AOS = 9, A), R4 = 93kΩ (AOS = 8) or 62kΩ (AOS = 9, A). Resistors
R1, R2, R3, and R4 are rated typically at 200 ppm/°C. The external resistor in a 4-20mA output configuration (Figure 25)
would have a typical ROUT = 1kΩ and RSENSE = 49.9Ω. For ratio-metric analog output voltage with external gain resistors
(Figure 26) the gain will be 1 + R1EXT/R2EXT.

24V

MAX40109

OUT ROUT
R1

OP-AMP R3

R2
R4

FB+ FB- GND

RSENSE

Figure 25. 4mA-20mA Output Setting

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MAX40109 Precision Signal Conditioning AFE for Pressure
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MAX40109

OUT ANALOG
R1 OUTPUT
OP-AMP R3 STAGE

R2
R4

FB+ FB- GND

R1EXT

R2EXT

Figure 26. Ratio-Metric Voltage Output with External Resistors Setting

Layout Recommendations
Some critical layout guidelines are as follows.
• Place bypass capacitors near supply and reference pins (VDDHV, VDD5V, VDD2V, REFIN).
• Use PCB with ground planes when possible. Avoid crossing analog and digital signals.
• Connect the EP to the analog ground.
• Create a star connection between AGND and DGND (TQFN package only).

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Typical Application Circuits

Analog Sensor with 4mA–20mA Output and 1-Wire Communication through DQ

VDD = 24V

REFIN VDD2V VDD5V VDDHV

VREF PLC
MAX40109
5V LDO INPUT

DRV
V/I 1.8V LDO DIAGNOSTICS
DRIVER 1.25V
INT
REFERENCE DQ (1-Wire)
SCRATCHPAD MCU
AND MTP
DRV SDA
REXT* INT 1-Wire,
DIAGNOSTIC
MUX INP+ PLC, AND SCL
CAL MTP
INP- MEMORY I2C

PGA

9-BIT DAC
MUX 16-BIT DAC
PGA GAIN/OFFSET
INP+ AND NL 14-BIT DAC
SENSOR COMPENSATION
BRIDGE

BRIDGE OFFSET COMPENSATION

OUT

INP- OP-AMP

FB+ FB- GND

*(THERMISTOR OR CURRENT SETTING)

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Analog Sensor with Ratio-metric Voltage Output

SUPPLY VOLTAGE

REFIN VDD2V VDD5V VDDHV

VREF PLC
MAX40109
5V LDO INPUT

DRV
V/I 1.8V LDO DIAGNOSTICS
DRIVER 1.25V
INT
REFERENCE DQ (1-Wire)
SCRATCHPAD
AND MTP MCU
DRV SDA
REXT* INT 1-Wire,
DIAGNOSTIC
MUX INP+ PLC, AND SCL
CAL MTP
INP- MEMORY I2C

PGA

9-BIT DAC
MUX 16-BIT DAC
PGA GAIN/OFFSET
INP+ AND NL 14-BIT DAC
SENSOR COMPENSATION
BRIDGE

BRIDGE OFFSET COMPENSATION

OUT ANALOG
OUTPUT
STAGE
INP- OP-AMP

FB+ FB- GND

*(THERMISTOR OR CURRENT SETTING)

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Analog Sensor with Ratio-metric Voltage Output and External Resistors to Set the Gain

SUPPLY VOLTAGE

REFIN VDD2V VDD5V VDDHV

VREF PLC
MAX40109
5V LDO INPUT

DRV
V/I 1.8V LDO DIAGNOSTICS
DRIVER 1.25V
INT
REFERENCE DQ (1-Wire)
SCRATCHPAD
AND MTP MCU
DRV SDA
REXT* INT 1-Wire,
DIAGNOSTIC
MUX INP+ PLC, AND SCL
CAL MTP
INP- MEMORY I2C

PGA

9-BIT DAC
MUX 16-BIT DAC
PGA GAIN/OFFSET
INP+ AND NL 14-BIT DAC
SENSOR COMPENSATION
BRIDGE

BRIDGE OFFSET COMPENSATION

OUT ANALOG
OUTPUT
OP-AMP STAGE
INP-

FB+ FB- GND

*(THERMISTOR OR CURRENT SETTING)

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Digital Sensor with I2C Interface

SUPPLY VOLTAGE

REFIN VDD2V VDD5V VDDHV

VREF PLC
MAX40109
5V LDO INPUT

DRV
V/I 1.8V LDO DIAGNOSTICS
DRIVER 1.25V
INT
REFERENCE DQ (1-Wire)
SCRATCHPAD
AND MTP MCU
DRV SDA
REXT* INT 1-Wire,
DIAGNOSTIC
MUX INP+ PLC, AND SCL
CAL MTP
INP- MEMORY I2C

PGA

9-BIT DAC
MUX 16-BIT DAC
PGA GAIN/OFFSET
INP+ AND NL 14-BIT DAC
SENSOR COMPENSATION
BRIDGE

BRIDGE OFFSET COMPENSATION

OUT

INP- OP-AMP

FB+ FB- GND

*(THERMISTOR OR CURRENT SETTING)

Ordering Information
PART NUMBER PIN-PACKAGE DIGITAL INTERFACES
MAX40109IATP+ 20-TQFN I2C, 1-Wire, and PLC

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MAX40109 Precision Signal Conditioning AFE for Pressure
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Revision History
REVISION REVISION PAGES
DESCRIPTION
NUMBER DATE CHANGED
0 12/23 Initial release —

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assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may
result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise
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respective owners.

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