NASA-STD-6016 Standard Materials and Processes Requirements For Spacecraft
NASA-STD-6016 Standard Materials and Processes Requirements For Spacecraft
STANDARD
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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FOREWORD
This standard is published by the National Aeronautics and Space Administration (NASA)
to provide uniform engineering and technical requirements for processes, procedures,
practices, and methods that have been endorsed as standard for NASA programs and
projects, including requirements for selection, application, and design criteria of an item.
This standard is approved for use by NASA Headquarters and NASA Centers, including
Component Facilities.
This standard defines the minimum requirements for Materials and Processes (M&P) and
provides a general control specification for incorporation in NASA program/project hardware
procurements and technical programs.
Requests for information, corrections, or additions to this standard should be submitted via
“Feedback” in the NASA Technical Standards System at http://standards.nasa.gov.
Original Signed By
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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TABLE OF CONTENTS
SECTION PAGE
1. SCOPE............................................................................................................. 7
1.1 Purpose ............................................................................................................. 7
1.2 Applicability ..................................................................................................... 7
4. REQUIREMENTS ......................................................................................... 16
4.1 General Requirements ...................................................................................... 17
4.1.1 Materials and Processes Selection, Control, and Implementation Plan ........... 17
4.1.1.1 Coordination, Approval, and Tracking............................................................. 17
4.1.1.2 Approval Signature........................................................................................... 17
4.1.1.3 M&P Controls................................................................................................... 18
4.1.1.4 Commercial Off-The-Shelf (COTS) Hardware................................................ 19
4.1.1.5 M&P Control Board ......................................................................................... 20
4.1.2 M&P Usage Documentation............................................................................. 20
4.1.2.1 Human-Rated Spacecraft.................................................................................. 20
4.1.2.2 Non-Human Rated Spacecraft .......................................................................... 21
4.1.2.3 MIUL Content .................................................................................................. 21
4.1.3 MUAs ............................................................................................................... 22
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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SECTION PAGE
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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SECTION PAGE
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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1. SCOPE
This document is directed toward materials and processes (M&P) used in the design, fabrication,
and testing of flight components for all NASA manned, unmanned, robotic, launch vehicle,
lander, in-space and surface systems, and spacecraft program/project hardware elements. All
flight hardware is covered by the M&P requirements of this document, including vendor-
designed, off-the-shelf, and vendor-furnished items.
M&P used in interfacing ground support equipment (GSE), test equipment, hardware processing
equipment, hardware packaging, and hardware shipment shall be controlled to prevent damage to
or contamination of flight hardware.
1.1 Purpose
The purpose of this document is to define the minimum requirements for M&P and to provide a
general control specification for incorporation in NASA program/project hardware procurements
and technical programs.
1.2 Applicability
The controls described here are applicable to all NASA spacecraft programs.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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This standard may be cited in contract, program, and other Agency documents as a technical
requirement. Requirements are indicated by the word “shall”; explanatory/guidance text is
indicated in italics in section 4.
2. APPLICABLE DOCUMENTS
2.1 General
The documents listed in this section contain provisions that constitute requirements of this
standard as cited in the text of section 4. The applicable documents are accessible via the NASA
Technical Standards System at http://standards.nasa.gov or may be obtained directly from the
Standards Developing Organizations or other document distributors.
Materials and Processes Materials Selection List for Space Hardware Systems
Technical Information
System (MAPTIS)
References 4.1.2.1 and
4.2.1.2
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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AWS C-3.2M/C3.2 (2001) Standard Method for Evaluating the Strength of Brazed Joints
Reference 4.2.4.5
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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NAS 412 (1997) Foreign Object Damage/Foreign Object Debris (FOD) Prevention
Reference 4.2.6.6
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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SAE-AMS 2774A (2005) Heat Treatment, Wrought Nickel Alloy and Cobalt Alloy Parts
Reference 4.2.2.10.1
This document establishes minimum requirements for M&P for spacecraft but does not
supersede nor waive established Agency requirements found in other documentation.
Conflict between this standard and other requirements documents shall be resolved by the
responsible Technical Authority.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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3.2 Definitions
Catastrophic Hazard: Hazard that can result in the potential for a disabling or
fatal personnel injury, or cause major system destruction.
Critical Hazard: Hazard that can result in the potential for severe injury, severe
occupational illness, or major property/equipment damage.
Primary Structure: Principal or main structure that sustains the significant applied
loads or provides main load paths for distributing reactions to applied loads and that, if it
fails, creates a catastrophic hazard.
Refractory Alloys: Alloys with a melting point above 2000 °C (3632 °F), plus
osmium and iridium.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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Structural Adhesive Bond: Structural joint using adhesive bonds for the purpose
of transferring structural load between structures.
Structure, Primary: That part of a flight vehicle or element that sustains the
significant applied loads and provides main load paths for distributing reactions to
applied loads. Also the main structure that is required to sustain the significant applied
loads, including pressure and thermal loads, and that, if it fails, creates a catastrophic
hazard. If a component is small enough and in an environment where no serious threat is
imposed if it breaks, then it is not primary structure.
Useful Life: Total life span including storage life, installed life in a nonoperating
mode, and operational service life.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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4. REQUIREMENTS
Requirements for materials used in the fabrication and processing of flight hardware are as
follows:
b. The operational requirements shall include, but are not limited to, the following:
c. Properties that shall be considered in material selection include, but are not limited to,
the following:
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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e. Nonflight materials used in processing and testing of flight hardware shall not cause
degradation of the flight hardware.
a. Each organization that is responsible for the design and fabrication of spacecraft
flight hardware shall provide a Materials and Processes Selection, Control, and Implementation
Plan.
b. The Materials and Processes Selection, Control, and Implementation Plan shall
document the degree of conformance and method of implementation for each requirement in this
standard, identifying applicable in-house specifications used to comply with the requirement.
c. The Materials and Processes Selection, Control, and Implementation Plan shall also
describe the methods used to control compliance with these requirements by subcontractors and
vendors.
d. The Materials and Processes Selection, Control, and Implementation Plan, upon
approval by the procuring activity, shall become the M&P implementation document used for
verification.
e. The Materials and Processes Selection, Control, and Implementation Plan shall
include what follows in the next sections.
The Materials and Processes Selection, Control, and Implementation Plan shall identify the
method of coordinating, approving, and tracking all engineering drawings, engineering orders,
and other documents that establish or modify materials and/or processes usage.
a. The Materials and Processes Selection, Control, and Implementation Plan shall
include a requirement that all design drawings and revisions contain an M&P approval block, or
equivalent, to ensure that the design has been reviewed and complies with the intent of this
document.
b. Design drawings and revisions shall be signed by the responsible M&P authority
prior to release.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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c. The Materials and Processes Selection, Control, and Implementation Plan shall
identify those M&P standards and specifications used to implement specific requirements in this
document.
e. Rationale for the selection of company specifications over government and industry
voluntary consensus standards and specifications shall be documented in the Materials and
Processes Selection, Control, and Implementation Plan.
f. The rationale for selection of company specifications over government and industry
voluntary consensus standards and specifications shall include an identification of government or
industry specifications or standards examined and an explanation of why each was unacceptable.
h. All M&P specifications used to produce flight hardware shall be made available to
the responsible NASA Program or Project Office and M&P organization.
j. Process specifications shall define process steps at a level of detail that ensures a
repeatable/controlled process that produces a consistent and reliable product.
Small changes to the chemical composition of nonmetallic materials may sometimes occur
without affecting the materials specification.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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l. The Materials and Processes Selection, Control, and Implementation Plan shall
identify materials where chemical fingerprinting is required to ensure the properties are
controlled.
Note: The process requirements in this standard do not provide the detailed process and quality
assurance requirements that ensure a process is repeatable. Instead, they are intended as higher
level documents that state minimum requirements and provide general directions for the design
of hardware.
During a long-term program, M&P standards and specifications identified in this document or
in contractor materials control plans could become obsolete. Continued use of obsolete
standards and specifications is acceptable for manufacturing series or new-design hardware.
(1) Updating the Materials and Processes Selection, Control, and Implementation
Plan upon approval of a meets/exceeds analysis for process standard or
specification changes by the responsible NASA M&P organization and program
or project office.
b. The procedure shall include special considerations for off-the-shelf hardware where
detailed M&P information may not be available or it may be impractical to impose all the
detailed requirements specified in this standard.
c. The procedure shall include provisions for ensuring that this hardware is satisfactory
from an overall M&P standpoint.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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b. The M&P control board charter and membership shall be described in the Materials
and Processes Selection, Control, and Implementation Plan.
The M&P control board has the responsibility for the planning, management, and coordination
of the selection, application, procurement, control, and standardization of M&P for the contract.
The board also has the responsibility for directing and dispositioning M&P problem resolution.
The responsible NASA M&P organization that is also an active member of the board has the
right of disapproval of board decisions.
b. The procedures and formats for documentation of M&P usage depends upon specific
hardware but shall cover the final design as delivered.
For human-rated spacecraft, a copy of the stored data shall be provided to NASA in a form
compatible with the Materials and Processes Technical Information System (MAPTIS).
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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For non-human-rated spacecraft, the program/project shall define the MIUL documentation
approach in the Materials and Processes Selection, Control, and Implementation Plan.
a. The parts list, or MIUL, shall identify the following applicable information:
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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b. MAPTIS shall be consulted to obtain material codes and ratings for materials,
standard and commercial parts, and components.
c. New material codes shall be assigned by NASA’s Marshall Space Flight Center
(MSFC).
d. Where batch/lot testing is required, traceability of specific test reports for batch/lot
used shall be provided in the remarks field.
e. Wire, cable, and exposed surfaces of connectors shall meet the requirements of this
document and be reported on the MIUL.
Materials used in hermetically sealed electronic containers (maximum leak rate less than
1 x 10-4 cm3/sec) are exempt from inclusion in the MIUL.
4.1.3 MUAs
The use of M&P that do not comply with the requirements of this standard may still be
acceptable in the actual hardware applications.
a. MUAs shall be submitted for all M&P that are technically acceptable but do not meet
the requirements of this standard, as implemented by the approved Materials and Processes
Selection, Control, and Implementation Plan.
b. The MUA shall include sufficient information to demonstrate that the application is
technically acceptable.
c. MUAs shall not be used to change the M&P requirements for a nonconforming
product.
When the nonconformance is a deviation from M&P requirements and is acceptable for future
series hardware, an MUA may be generated to provide technical support for a change to the
product baseline. If MUA approval is not granted, a waiver request may be submitted per the
program/project Configuration Management Control Plan.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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For human-rated spacecraft, a tiered MUA system with three categories shall be used.
Category I MUAs are those that involve M&P usage that could affect the safety of the mission,
crew, or vehicle or affect the mission success, but must be used for functional reasons.
Category I MUAs are delivered by the hardware developer, and approval by the responsible
NASA M&P organization and the NASA Program/Project Office shall be required.
Category II MUAs are those that involve M&P usage that fails a screening of M&P
requirements and is not considered a hazard in its use application but for which no Category III
rationale code exists.
Category II MUAs are delivered by the hardware developer, and approval by the responsible
NASA M&P organization shall be required.
Category III MUAs are those that involve M&P that have not been shown to meet these
requirements but have an approved rationale code listed in Appendix B. They are evaluated and
determined to be acceptable at the configuration/part level.
Approved category III MUAs shall be reported in the MIUL system or electronic data system
utilizing the approved rationale codes in Appendix B.
Category III MUAs are approved by the hardware developer and responsible M&P organization
through acceptance of the MIUL. A key may be provided to correlate contractor Category III
MUA database codes to the codes in Appendix B. No MUA form is submitted.
For nonhuman-rated spacecraft, the MUA system shall be defined in the Materials and Processes
Selection, Control, and Implementation Plan as approved in accordance with paragraph 1.2.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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b. Parts and materials used in critical applications, such as life-limited materials and/or
safety- and fracture-critical parts, shall be traceable through all processing steps defined in the
engineering drawing to the end-item application.
b. When high-strength metallic materials are heat treated, the adequacy of the heat
treatment process shall be verified by test (see section 4.2.2 of this standard).
Note: Values for allowable mechanical properties of structural materials listed in later versions
of MMPDS than that specified in section 2 may be used, provided the methodology used to
develop the allowable mechanical properties is at least as conservative.
c. Material “B” allowable values shall not be used except in redundant structure in
which the failure of a component would result in a safe redistribution of applied loads to other
load-carrying members.
d. Material “S” allowables not listed in MMPDS or MIL-HDBK-17 shall not be used
in primary structure or fracture-critical hardware without an approved MUA to document that the
“S” allowables have been properly derived in accordance with the procedures in MMPDS or
MIL-HDBK-17.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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Material “S” allowables developed with this methodology may be used in noncritical
applications without an MUA.
f. The hardware developer shall develop a plan describing its philosophy on how it will
determine what material design properties will be used; and if those properties do not exist, how
they will be developed including, but not limited to, the statistical approaches to be employed.
g. All mechanical and physical property data shall be provided to the responsible NASA
M&P organization.
Material flammability ratings and tests based on NASA-STD-(I)-6001 for many materials are
found in the MAPTIS database.
(1) The use of ceramics, metal oxides, and inorganic glasses shall be accepted
without test.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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(b) If a material passes the flammability test on a metal substrate, it shall be used
on metal substrates of the same thickness or greater.
Materials that are considered flammable by default may still be accepted through the MUA
approval process.
Many situations arise where flammable materials are used in an acceptable manner without test,
using mitigation practices and the MUA approval system. Guidelines for hardware flammability
assessment and mitigation can be found in JSC 29353, Flammability Configuration Analysis for
Spacecraft Applications.
a. All materials used in habitable flight compartments shall meet the offgassing
requirements of Test 7 of NASA-STD-(I)-6001.
Offgassing testing is not required for metallic materials or for ceramics and metal
oxides.
c. For compounds for which no SMAC values are found in JSC 20584, the values in
MAPTIS shall be used.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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NASA-STD-(I)-6001, Test 15, is a screening test for short-term exposure to fuels and oxidizers.
b. Appropriate long-term tests shall be conducted for materials with long-term exposure
to fuels, oxidizers, and other hazardous fluids.
c. The test conditions shall simulate the worst-case use environment that would enhance
reactions or degradation of the material or fluid.
e. The effect of material condition (for example, parent versus weld metal or heat-
affected zone) shall be addressed in the compatibility determination.
a. Liquid and gaseous oxygen (LOX/GOX) systems shall use materials that are
nonflammable in their worst-case use configuration, as defined by NASA-STD-(I)-6001, Test
17, for upward flammability in GOX (or Test 1 for materials used in oxygen pressures that are
less than 50 psia (350 kPa)).
Material flammability ratings and tests based on NASA-STD-(I)-6001 for many materials are
found in the MAPTIS database.
d. When the oxygen compatibility assessment shows the risk is above an acceptable
level, then configurational testing shall be conducted to support the compatibility assessment.
1
For the purpose of this standard, the definition of hazardous fluids includes gaseous oxygen, liquid oxygen, fuels,
oxidizers, and other fluids that could cause corrosion, chemically or physically degrade materials in the system, or
cause an exothermic reaction.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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e. The configurational testing shall exercise the ignition mechanism in question using an
accepted test method.
f. The configurational test method and acceptance criteria shall be reviewed and
approved as part of the MUA process described in paragraph 4.1.3.
h. For compressed air systems and pressurized systems containing enriched oxygen, the
need for an oxygen compatibility assessment shall be addressed in the Materials and Processes
Selection, Control, and Implementation Plan.
Compressed air systems and pressurized systems containing enriched oxygen are inherently less
hazardous than systems containing pure oxygen; the hazard increases with oxygen concentration
and pressure.
Guidelines on the design of safe oxygen systems are contained in ASTM MNL 36, Safe Use of
Oxygen and Oxygen Systems: Handbook for Design, Operation, and Maintenance; ASTM G88,
Standard Guide for Designing Systems for Oxygen Service; ASTM G63, Standard Guide for
Evaluating Nonmetallic Materials for Oxygen Service; ASTM G94, Standard Guide for
Evaluating Metals for Oxygen Service; and NASA/TM-2007-213740, Guide for Oxygen
Compatibility Assessments on Oxygen Components and Systems.
a. Oxygen and enriched air system components that operate at pressures above 1.83
MPa (265 psia) shall undergo oxygen compatibility acceptance testing at maximum design
pressure for a minimum of ten cycles to ensure that all oxygen system flight hardware is exposed
to oxygen prior to launch.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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Arc tracking testing is not required for polytetrafluoroethylene (PTFE), PTFE laminate, ethylene
tetrafluoroethlyene (ETFE), or silicone-insulated wires since the resistance of these materials to
arc tracking has already been established.
4.2.2 Metals
MSFC-STD-3029, Guidelines for the Selection of Metallic Materials for Stress Corrosion
Cracking Resistance in Sodium Chloride Environments, shall be used to select metallic materials
to control stress corrosion cracking of metallic materials in sea and air environments.
Note: When released, NASA-STD-6004, Selection of Metallic Materials for Stress Corrosion
Cracking Resistance, may be used in place of MSFC-STD-3029.
4.2.2.1 Aluminum
b. 5000-series alloys containing more than 3 percent magnesium shall not be used in
applications where the temperature exceeds 66 °C (150 °F), because grain boundary precipitation
above this temperature can create stress-corrosion sensitivity.
c. Heat treatment of aluminum alloy parts shall meet the requirements of SAE-AMS
2772, Heat Treatment of Aluminum Alloy Raw Materials, SAE-AMS 2770, Heat Treatment of
Wrought Aluminum Alloy Parts, or SAE-AMS 2771, Heat Treatment of Aluminum Alloy
Castings.
e. The requirement for process control coupons shall be specified on the engineering
drawing for the part.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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4.2.2.2 Steel
Carbon and low alloy steels heat-treated to strength levels at or above 1240 MPa (180 ksi)
ultimate tensile strength (UTS) are sensitive to stress corrosion and shall not be used without an
approved MUA.
Note: Many applications are covered by Category III MUA rationale code 506 (see Appendix
B).
b. When high-strength steels (>200 ksi (1380 MPa) UTS), tool steels, and maraging
steel alloys are heat-treated to high strength levels, process-control tensile-test coupons shall be
taken from the production part (or from the same material lot and processed identically to the
production part) to verify the adequacy of the heat treatment process.
(1) The requirement for process control coupons shall be specified on the engineering
drawing for the part.
(2) For all other steels (including alloy steels), the adequacy of the heat treatment
process shall be verified by hardness measurements.
(3) Hardenability limits of low alloy steels shall be taken into consideration when
design is constrained by part size and uniformity of material mechanical
properties.
c. When acid cleaning baths or plating processes are used, the part shall be baked in
accordance with SAE-AMS 2759/9, Hydrogen Embrittlement Relief (Baking) of Steel Parts, to
alleviate potential hydrogen embrittlement problems.
a. The drilling of holes, including beveling and spot facing, in martensitic steel hardened
to 1340 MPa (180 ksi) UTS or above, shall be avoided.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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d. The edges of the drilled holes shall be deburred by a method that has been
demonstrated not to cause untempered martensite.
e. The surface roughness of finished holes shall not be greater than 63 roughness-height
ratio.
a. Unstabilized, austenitic steels shall not be used above 371 °C (700 °F).
b. Welded assemblies shall be solution heat-treated and quenched after welding except
for the stabilized or low carbon grades such as 321, 347, 316L, and 304L.
c. Service-related corrosion issues are common for free-machining alloys such as 303,
and these alloys shall not be used in applications where they can get wet.
4.2.2.3 Titanium
a. Heat treatment of titanium and titanium alloy parts shall meet the requirements of
SAE-AMS-H-81200, Heat Treatment of Titanium and Titanium Alloys.
b. When titanium alloys are heat treated, process-control tensile-test coupons shall be
taken from the production part (or from the same material lot and processed identically to the
production part) to verify the adequacy of the heat treatment process.
c. The requirement for process control coupons shall be specified on the engineering
drawing for the part.
a. All cleaning fluids and other chemicals used during manufacturing and processing of
titanium hardware shall be verified to be compatible and not detrimental to performance before use.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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titanium alloys by cadmium can occur as low as 149 °C (300 °F), and solid-metal-induced
embrittlement of titanium alloys by cadmium can occur as low as room temperature.
b. The surfaces of titanium and titanium alloy mill products shall be 100 percent
machined, chemically milled, or pickled to a sufficient depth to remove all contaminated zones
and layers formed while the material was at elevated temperature.
Contaminated zones and layers may be formed as a result of mill processing, heat treating, and
elevated temperature-forming operations.
Titanium and its alloys exhibit very poor resistance to wear. Fretting that occurs at interfaces
with titanium and its alloys has often contributed to crack initiation, especially fatigue initiation.
The preferred policy is a design that avoids fretting and/or wear with titanium and its alloys.
If fretting and/or wear is unavoidable, the subject region shall be anodized per SAE-AMS 2488,
Anodic Treatment – Titanium and Titanium Alloys Solution, pH 13 or Higher, or hard-coated
utilizing a wear-resistance material such as tungsten carbide/cobalt thermal spray.
a. Titanium and its alloys shall be welded with alloy-matching fillers or autogenously.
b. Extra Low Interstitial (ELI) filler wires shall be used for cryogenic applications and
are preferred for general applications.
c. Commercially Pure (CP) titanium filler shall not be used on 6-4 titanium or other
alloyed base material; hydride formation can occur in the weld, which can produce a brittle,
catastrophic failure.
d. Nitrogen, hydrogen, carbon dioxide, and mixtures containing these gases shall not be
used in welding titanium and its alloys.
A great deal of care needs to be exercised to ensure complete inert gas (argon or helium)
coverage during welding.
(1) The inert gas shall have a dew point of -60º C (-76º F) or lower.
e. Welded alpha and alpha-plus-beta alloys shall be stress relieved in a vacuum or inert
gas environment (Ar or He).
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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f. Beta alloys that are welded shall be evaluated on a case-by-case basis with respect to
stress relief.
a. Titanium alloys shall not be used with LOX or GOX at any pressure or with air at
oxygen partial pressures above 35 kPa (5 psia).
b. Titanium alloys shall not be machined inside spacecraft modules during ground
processing or in flight, because machining operations can ignite titanium turnings and cause fire.
4.2.2.4 Magnesium
a. Magnesium alloys shall not be used except in areas where minimal exposure to
corrosive environments can be expected and protection systems can be maintained with ease and
high reliability.
b. Magnesium alloys shall not be used in primary structure or in other areas subject to
wear, abuse, foreign object damage, abrasion, erosion, or at any location where fluid or moisture
entrapment is possible.
c. Magnesium alloys shall not be machined inside spacecraft modules during ground
processing or in flight, because machining operations can ignite magnesium turnings and cause
fire.
4.2.2.5 Beryllium
b. Beryllium alloys containing more than 4 percent beryllium by weight shall not be
used for any application within spacecraft crew compartments unless suitably protected to
prevent erosion or formation of salts or oxides.
c. Design of beryllium parts shall include consideration of its low-impact resistance and
notch sensitivity, particularly at low temperatures, and its directional material properties
(anisotropy) and sensitivity to surface finish requirements.
d. All beryllium parts shall be processed to ensure complete removal of the damaged
layer (twins and microcracks) produced by surface-metal-working operations such as machining
and grinding.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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Chemical/milling and etching are recognized successful processes for removal of the damaged
layer.
e. Beryllium alloys and oxides of beryllium shall not be machined inside spacecraft
crew compartments at any stage of manufacturing, assembly, testing, modification, or operation.
f. All beryllium parts shall be penetrant-inspected for crack-like flaws with a high-
sensitivity fluorescent dye penetrant in accordance with section 4.2.5.
4.2.2.6 Cadmium
4.2.2.7 Zinc
b. Owing to zinc’s ability to grow whiskers, zinc plating shall not be used.
4.2.2.8 Mercury
b. Flight hardware (including fluorescent lamps) containing mercury shall have three
levels of containment to prevent mercury leakage.
c. The bulbs of nonflight lamps containing mercury, such as those used in hardware
ground processing and fluorescent dye penetrant inspection of flight parts, shall be protected by a
nonshatterable, leak-proof outer container.
a. Since engineering data on refractory alloys (alloys with a melting point above 2000 °C
(3600 °F), plus osmium and iridium) are limited, especially under extreme environmental
conditions of spacecraft, an MUA shall be required for all applications of such alloys.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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b. Appropriate tests shall be performed to characterize the material for the intended
application and the data documented in the MUA.
a. Heat treatment of nickel- and cobalt-based alloy parts shall meet the requirements of
SAE-AMS 2774, Heat Treatment, Wrought Nickel Alloy and Cobalt Alloy Parts.
b. When nickel- and cobalt-based alloys are work strengthened before age hardening,
resulting in age-hardened tensile strengths greater than 1030 MPa (150 ksi) UTS, process-control
tensile-test coupons shall be taken from the production part (or from the same material lot and
processed identically to the production part) to verify the adequacy of the heat treatment process.
c. The requirement for process control coupons shall be specified on the engineering
drawing for the part.
d. When tensile test coupons are not required, the adequacy of the heat treatment
process shall be verified by hardness measurements.
4.2.2.11 Tin
a. Tin and tin plating shall not be used in any applications unless the tin is alloyed with
at least 3 percent lead to prevent tin whisker growth.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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a. Elastomeric materials shall be selected to operate within design parameters for the life
of the vehicle after a storage time of 5 years.
c. Room Temperature Vulcanizing (RTV) silicones that liberate acetic acid during cure
shall not be used since they can cause corrosion.
d. When rubbers or elastomers are used at low temperatures, the ability of these
materials to maintain and provide required elastomeric properties shall be verified.
4.2.3.2 Polyvinylchloride
b. Material property design allowables for composites shall be developed using the
methodology described in MIL-HDBK-17-1, -2, -3, -4, and -5.
4.2.3.4 Lubricants
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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a. All materials shall be selected to meet the useful life (to include storage life, installed
life in a nonoperating mode, and operational service life) of the hardware with no maintenance.
b. Materials that are not expected to meet the design life requirements but must be used
for functional reasons shall be identified as limited-life items, requiring maintainability.
a. Nonmetallic materials that are exposed to space vacuum shall be tested using the
technique of ASTM-E595, Total Mass Loss and Collected Volatile Condensable Materials From
Outgassing in a Vacuum Environment, Standard Test Method for, with acceptance criteria of
≤0.1 percent collected volatile condensable materials (CVCM) and ≤1.0 percent total mass loss
(TML).
A TML greater than 1.0 percent is permitted if this mass loss has no effect on the functionality of
the material itself and no effect on the functionality of any materials, components, or systems
that could be adversely affected by the subject mass loss.
Contamination-sensitive surfaces include windows, lenses, star trackers, solar arrays, radiators,
and other surfaces with highly controlled optical properties.
c. Hardware items (components, assemblies, etc.) containing materials that fail the
CVCM requirement and/or having unidentified materials, shall be vacuum baked at a
temperature of 125 ºC (257 ºF) until the outgassing condensation rate, as measured by a quartz
crystal microbalance at 25 ºC (77 ºF), is less than 1 x 10-9 g cm-2 s-1.
When a vacuum-bake temperature of 125 ºC (257 ºF) could damage flight hardware, lower
temperatures may be used with an approved MUA.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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(1) The test chamber shall be verified to have a background outgassing condensation rate
less than 6 x 10-10 g cm-2 s-1 before hardware exposure, and the test pressure shall be
less than 5 x 10-5 torr.
(2) A hardware functionality bench test shall be performed to re-verify performance after
baking.
b. The critical properties of the material shall survive exposure to the environments of
atomic oxygen, solar ultraviolet (UV) radiation, ionizing radiation, plasma, vacuum, thermal
cycling, and contamination.
d. Meteoroids and orbital debris shall also be considered in the analysis of long-term
degradation.
a. Organic materials used in the pressurized environment shall be evaluated for fungus
resistance prior to selection and qualification.
(2) Materials are used in crew areas, where fungus would be visible and easily
removed.
(3) Materials are used inside environmentally sealed containers with internal
container humidity less than 60 percent relative humidity (RH) at ambient
conditions.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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(4) Materials are used inside electrical boxes where the temperature is always greater
than or equal to the ambient cabin temperature.
(6) Materials are normally stowed with no risk of condensation in stowage locations.
c. When fungus-nutrient materials shall be used, they shall be treated to prevent fungus
growth.
d. Materials not meeting this requirement shall be identified including any action
required such as inspection, maintenance, or replacement periods.
e. Fungus treatment shall not adversely affect unit performance or service life or
constitute a health hazard to higher order life.
4.2.3.9 Glycols
a. When solutions containing ethylene or propylene glycol are used aboard spacecraft
that have electrical or electronic circuits containing silver or silver-coated copper, a silver
chelating agent such as benzotriazole (BZT) shall be added to the solution to prevent
spontaneous ignition from the reaction of silver with the glycol.
b. When solutions containing other glycols (aliphatic dihydric alcohols) are used in
these conditions, testing shall be conducted to determine if the same spontaneous ignition
reaction can occur as with ethylene and propylene glycol.
c. A silver chelating agent shall be added to the solution, if ignition can occur.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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a. The etching of fluorocarbons shall meet the requirements of SAE-AMS 2491, Surface
Treatment of Polytetrafluoroethylene, Preparation for Bonding.
c. Etched surfaces packaged per SAE-AMS 2491 shall be processed within 1 year.
d. Electrical wire or cable insulated or coated with fluorocarbons shall be etched prior to
potting to ensure mechanical bond strength and environmental seal.
4.2.4 Processes
4.2.4.1 Forging
a. Because mechanical properties are optimum in the direction of material flow during
forging, forging techniques shall be used that produce an internal grain-flow pattern such that the
direction of flow is essentially parallel to the principal stresses, whenever possible.
b. If forging techniques do not allow for the direction of the flow to be parallel to the
principal stresses, parts shall be designed such that the weakest grain flow direction is not in line
with the principal stresses.
c. The forging pattern shall be essentially free from re-entrant and sharply folded flow
lines.
d. After the forging technique, including degree of working, is established, the first
production forging shall be sectioned to show the grain-flow patterns and to determine
mechanical properties at control areas.
e. The procedure shall be repeated after any change in the forging technique.
f. The information gained from this effort shall be utilized to redesign the forging as
necessary.
g. These data and results of tests on the redesign shall be retained and made available
for review by the procuring activity.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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j. In addition, trim ring or protrusion specimens shall be obtained for each forging and
shall be tested for required minimum mechanical properties.
4.2.4.2 Castings
Castings shall meet the requirements of SAE-AMS-2175, Castings, Classification and Inspection of.
Retesting of adhesives used for production parts is not required if they are within shelf life.
(1) Bond sensitivity studies shall be conducted to verify that the required adhesive
properties are maintained after exposure to potential contaminant species and
concentrations.
c. Bonded primary structural joints shall demonstrate cohesive failure modes in shear.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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4.2.4.4 Welding
a. The design selection of parent materials and weld methods shall be based on
consideration of the weldments, including adjacent heat-affected zones, as they affect operational
capability of the parts concerned.
b. Welding procedures shall be selected to provide the required weld quality, minimum
weld energy input, and protection of the heated metal from contamination.
d. The processing and quality assurance requirements for manual, automatic, and
semiautomatic welding for space flight applications shall meet the requirements of NASA-STD-
5006, General Fusion Welding Requirements for Aerospace Materials Used in Flight Hardware.
These welding processes include, but are not limited to, arc welding, solid state welding,
resistance welding, and high energy density welding.
4.2.4.5 Brazing
c. Torch, induction, and furnace brazing shall meet the requirements of AWS C-3.4,
Specification for Torch Brazing; AWS C-3.5, Specification for Induction Brazing; and
AWS C-3.6, Specification for Furnace Brazing, respectively.
e. Brazed joints shall be designed for shear loading and not be relied upon for strength
in axial loading for structural parts.
f. The shear strength of brazed joints shall be evaluated in accordance with AWS
C3.2M/C3.2, Standard Method for Evaluating the Strength of Brazed Joints.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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g. For furnace brazing of complex configurations, such as heat exchangers and cold
plates, destructive testing shall be conducted on pre-production brazed joints to verify that the
braze layer that extends beyond the fillet area is continuous and forms a uniform phase.
(2) In addition, the recast layer and the heat-affected zone shall be removed from
bearing, wear, fatigue or fracture-critical surfaces, and from crack- or notch-
sensitive materials.
The recast layer and heat-affected zone may be left on a part if an engineering evaluation shows
that they are not of consequence to the required performance of the part.
a. The NDE Plan shall address the process for establishment, implementation,
execution, and control of NDE through design, manufacturing, operations, and maintenance of
flight hardware.
In case of conflict between the requirements of the two standards, the requirements of NASA-
STD-5009 are applicable.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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a. All metallic fracture-critical parts shall be NDE etched prior to fluorescent dye-
penetrant inspection.
Nickel and aluminum form a strong galvanic cell at the nickel-aluminum interface, and exposure
of the aluminum alloy to a corrosive environment can produce rapid disbonding of the nickel
plate.
Residual tensile stresses are induced into manufactured parts as a result of forging, machining,
heat treating, welding, special metal-removal processes, or the straightening of warped parts.
Residual stresses may be harmful in structural applications when the part is subjected to fatigue
loading, operation stresses, or corrosive environments.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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c. The use of stress equalization in concert with the straightening of warped parts shall
require an approved MUA.
b. Honeycomb sandwich assemblies that will be subjected to heating shall use a metallic
or glass-reinforced core to minimize the absorption of moisture.
d. Test methods for sandwich constructions and core materials shall meet the
requirements of SAE-AMS-STD-401, Sandwich Constructions and Core Materials: General
Test Methods.
a. All parts, assemblies, and equipment, including spares, shall be finished to provide
protection from corrosion in accordance with the requirements of MSFC-SPEC-250, Protective
Finishes for Space Vehicle Structures and Associated Flight Equipment, General Specification
for.
b. Corrosion control of galvanic couples shall be in accordance with MIL-STD-889,
Dissimilar Metals.
c. Galvanic couples for alloy combinations not listed in MIL-STD-889 shall not exceed
0.25 volts.
(1) Faying surfaces of metal alloys shall be sealed for Classes I, II, & III protective
finish classes.
(2) All contacts between graphite-based composites and metallic materials shall be
treated as dissimilar metal couples and sealed per MSFC-SPEC-250.
(3) All electrical bonding connections shall be faying-surface sealed, except for
nickel-plated surfaces utilized in Class III applications.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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For hardware in the mild corrosive environment of standard habitable spacecraft volumes where
condensation is precluded, the following changes may be made:
Exposed aluminum surfaces may have anodic coatings instead of the organic coatings specified
in MSFC-SPEC-250. Conversion coatings may be used as the sole corrosion protection for
5000 and 6000 series corrosion-resistant aluminum alloys. They are not acceptable as the sole
corrosion protection for 2000 and 7000 series aluminum alloys.
(1) These techniques shall include the application of engineering design and analysis,
quality assurance, NDI, manufacturing, operations, and support technologies used
to prevent the initiation of corrosion, avoid functional impairment due to
corrosion, and provide processes for the tracking and repair of corrosion.
(2) Specific corrosion prevention and control techniques shall be defined in the
Materials and Processes Selection, Control, and Implementation Plan.
4.2.6.3.1 Passivation
4.2.6.3.2 Sealing
Removable panels and access doors in exterior or interior corrosive environments shall be sealed
either by mechanical seals or by separable, faying-surface sealing.
Overall, hydrogen embrittlement of materials is not very well understood, and there are only
limited materials property data generated and reported in MAPTIS.
Test data may have to be generated in a simulated environment to support the rationale.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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Guidelines for the design of safe hydrogen systems are contained in ANSI/AIAA G-095, Guide to
Safety of Hydrogen and Hydrogen Systems.
a. Self-locking fastener reuse shall be allowed when the running torque prior to clamp-up
remains between the maximum self-locking torque and the minimum breakaway torque.
c. Fastener management and control policy, responsibilities, and practices for structural
fasteners, fracture-critical fasteners, and safety-critical fasteners that are procured, received, tested,
inventoried, or installed for space flight shall meet the requirements of NASA-STD-6008, NASA
Fastener Procurement, Receiving Inspection, and Storage Practices for Spaceflight Hardware.
d. The installation of titanium fasteners and associated parts shall meet the requirements
of MSFC-STD-557, Threaded Fasteners, 6 Al-4V Titanium Alloy, Usage Criteria for Spacecraft
Applications.
a. Liquid locking compounds shall not be used as secondary locking features on safety-
critical fasteners2.
2
For the purposes of this requirement, “safety-critical” fasteners are defined as
(a) All primary or secondary structural fasteners used in the exterior and interior of flight modules.
(b) All non-structural fasteners used exterior to flight modules, which may pose a FOD risk to vehicle operations
and which have not been vibration tested during qualification or acceptance of the hardware.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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Silver reacts rapidly with atomic oxygen to generate a loose, friable, black oxide that can cause
contamination and affect the operation of mechanisms.
Silver-plated fasteners shall not be used in external applications where the silver plating is
directly exposed to atomic oxygen.
c. The FOD prevention program shall be established for all ground operations of
mechanical and electrical systems of flight hardware including the design, development,
manufacturing, assembly, repair, processing, testing, maintenance, operation, and check out of
the equipment to ensure the highest practical level of cleanliness.
d. The FOD prevention program shall conform to NAS 412, Foreign Object
Damage/Foreign Object Debris (FOD) Prevention.
e. Cleanliness levels for all hardware shall be identified on the engineering drawings.
4.2.6.7 Packaging
Packaging shall protect hardware from corrosion and contamination during shipping and storage.
4.3 Verification
a. Verification of compliance with the requirements of this document shall consist of the
following steps as a minimum:
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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(2) Contractor M&P signature on engineering drawings to verify compliance with the
requirements of this document or the Materials and Processes Selection,
Implementation, and Control Plan.
(3) NASA audits of contractor M&P activities relating to hardware design and
manufacturing.
(4) Establishment and operation of the M&P control board in accordance with section
4.1.1.5 of this standard.
NOTE: Per section 4.1.3: The use of M&P that do not comply with the technical requirements of this standard may be acceptable in the actual
hardware applications. MUAs shall be submitted for all M&P that are technically acceptable but do not meet the technical requirements of this
standard, as implemented by the approved Materials and Processes Selection, Control, and Implementation Plan.
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APPENDIX A
TYPICAL MUA FORM
NONHABITABLE
APPLICATION:
EFFECTIVITY:
ORIGINATING CONTRACTOR
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APPENDIX B
CATEGORY III MUA RATIONALE CODES
CODE RATIONALE
101 Approved Materials Usage Agreement (MUA) Category I.
102 Approved Materials Usage Agreement (MUA) Category II.
103 Materials passed requirements when tested in configuration.
104 Unexposed, overcoated, or sandwiched between nonflammable materials
and no ignition source or propagation path.
105 Minor usage (less than 45 g (0.1 lb) mass and 13 cm2 (2 in2) surface area);
no propagation path or ignition source.
106 Material is used in hermetically sealed container.
107 Passes test No. 10 of NASA-STD-(I)-6001, Flammability Test for
Materials in Vented Containers, by test or analysis.
108 Off-the-shelf equipment having material acceptable in configuration; no
ignition source or propagation path.
109 Material not exposed; totally immersed in fluid; evaluated for fluid
compatibility only.
110 Material is acceptable when used on a metal substrate that provides a good
heat sink. Material considered noncombustible in this configuration by test
or analysis.
111 Material is flammable but is sandwiched between nonflammable materials
with edges only exposed and is more than 5 cm (2 in) from an ignition
source or more than 30 cm (12 in) from other flammable materials.
112 Material is flammable but is unexposed or is overcoated with a
nonflammable material.
113 Material is flammable but has a thickness less than 0.25 mm (0.010 in) and
is sprayed or bonded to a metallic surface greater than 1.6 mm (0.062 in)
thick.
114 Material is flammable but is used in “small amounts” and is more than 5
cm (2 in) from an ignition source or more than 30.5 cm (12 in) from other
flammable materials. “Small amounts” for flammability may be quantified
as follows: total weight less than 45 g (0.1 lb) and less than 13 cm2 (2.0
in2) surface area.
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CODE RATIONALE
501 Approved Material Usage Agreement (MUA) Category I.
502 Approved Material Usage Agreement (MUA) Category II.
503 Maximum tensile stress <50% of yield strength for part on
electrical/electronic assemblies.
504 Martensitic or PH stainless steels used in ball bearing, race, or similar
applications where the primary loading is compressive.
505 Metal not listed in table 1 of MSFC-STD-3029 for stress corrosion
cracking is not exposed to a corrosive environment after final assembly
through end-item use.
506 Carbon and low alloy high strength steels greater than 1240 MPa (180 ksi)
used in ball bearings, springs, or similar applications where primary
loading is compressive, low tensile stresses, or history of satisfactory
performance.
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GENERAL CODES
CODE RATIONALE
702 Generic materials controlled by military or industry specification using
MAPTIS averages for ratings or test results. Material codes for generic
material shall be used.
703 Military specification or industry specification allowing several material
options where all options have acceptable ratings.
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APPENDIX C
RECOMMENDED DATA REQUIREMENTS DOCUMENTS
Examples of DRD content are provided on the following pages. However, the specific DRDs
and the content of those DRDs should be tailored to each spacecraft program, and additional
DRDs may be appropriate.
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7. DESCRIPTION/USE:
This plan shall document the degree of conformance and method of implementation for each requirement in
this standard, identifying applicable in-house specifications used to comply with the requirement. It shall
also describe the methods used to control compliance with these requirements by subcontractors and
vendors. The Materials and Processes Selection, Control, and Implementation Plan, upon approval by the
procuring activity, shall become the Materials and Processes implementation document used for
verification.
11. REMARKS:
13.3 CONTENTS:
The necessary interfaces with procuring activity in the operation of this plan shall be defined. The method
for materials control and verification of subcontractors and vendors shall be included in the hardware
developer's plan. As a minimum and as applicable, the plan shall address the following:
Conformance – The Plan shall address each applicable paragraph of NASA-STD-6016 and describe the
method of implementation and degree of conformance for each applicable requirement. If tailoring of the
requirements is planned or necessary, alternate approaches to NASA-STD-6016 may be submitted in this
plan, which meet or exceed the stated requirements. This tailoring approach will allow for NASA approval
of alternate requirements.
Hardware Developer's Organization - Authority shall be assigned to an individual or group who shall be
responsible for review and approval of all M&P specified prior to release of engineering documentation.
Materials and Processes Identification - Identification and documentation of the M&P used, both in the
original design and in any changes, shall be contained in the Material and Process Identification and Usage
List DRD.
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Testing - Logic, procedures and data documentation for any proposed test program to support materials
screening and verification testing. Any material/process testing to be performed by the hardware developer
shall require prior NASA approval.
Materials Usage Agreement (MUA) Procedures - Logic, procedures and documentation involved in
documenting and approving materials/processes as indicated in NASA-STD-6016 shall be defined,
including those that do not meet the established requirements, but are proposed for use due to lack of
replacement materials/processes or other considerations and shall be contained in the Materials Usage
Agreement DRD.
Material Design Properties – The plan shall contain the philosophy describing how material properties will
be determined, and if those properties do not exist, how the material properties will be developed including,
but not limited to the statistical approaches to be employed.
Process Controls – The plan shall identify all process specifications used to implement specific
requirements in NASA-STD-6016. All materials processes used in manufacturing shall be documented in
process specifications and all applicable process specifications shall be identified on the engineering
drawing. Each processing step in the process specification shall be identified in a level of detail that
ensures the process is repeatable.
13.4 FORMAT: Electronic, Word®-compatible document or Adobe® PDF. For each paragraph in section 4 of
NASA-STD-6016, the plan shall state the requirement from NASA-STD-6016, identify the degree of
conformance under the subheading “Degree of Conformance,” and identify the method of implementation
under the subheading “Method of Implementation.”
13.5 MAINTENANCE: Contractor-proposed changes to document shall be submitted to NASA for approval.
Complete re-issue of the document is required.
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7. DESCRIPTION/USE:
MUAs shall be submitted for all materials and processes that are technically acceptable but do not meet the
technical requirements of NASA-STD-6016, as implemented by the approved Materials and Processes
Selection, Control, and Implementation Plan. [The use of materials and processes that do not comply with
the technical requirements of this standard may be technically acceptable if hardware reliability and vehicle
safety are not affected.]
10. SUBMISSION FREQUENCY: At PDR and as the need for new MUAs is identified during the detailed
design process. MUAs shall be revised and resubmitted whenever design modifications affect the part
numbers identified on the MUA or the MUA rationale.
11. REMARKS:
Category I MUAs – Category I MUAs are those that involve material/processes usage that could affect the
safety of the mission, crew, or vehicle or affect the mission success, but must be used for functional
reasons. Approval by the responsible NASA Materials and Processes organization and the NASA
Program/Project Office shall be required.
Category II MUAs - Category II MUAs are those that involve material/processes usage that fails a
screening of Material and Processes requirements and is not considered a hazard in its use application but
for which no Category III rationale code exists. Approval by the responsible NASA Materials and
Processes organization shall be required.
Category III MUAs - Category III MUAs are those that involve materials or processes that have not been
shown to meet these requirements but have an approved rationale code listed in Appendix B of NASA-
STD-6016. They are evaluated and determined to be acceptable at the configuration/part level. Category
III MUAs shall be reported in the Materials Identification and Usage List (MIUL) system or electronic data
system utilizing the approved rationale codes in Appendix B. A key may be provided to correlate contractor
Category III MUA database codes to the codes in Appendix B. No MUA form is submitted. [Category III
MUAs are identified here for completeness, but are not required until after PDR.]
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13.3 CONTENTS:
The MUA package shall include all technical information required to justify the application. MUAs for
stress corrosion shall include a Stress Corrosion Cracking Evaluation Form per MSFC-STD-3029 (see
NASA-STD-6016) and a stress analysis.
13.4 FORMAT: Electronic. A sample MUA form is provided in NASA-STD-6016; however, Contractor
format is acceptable. The complete MUA package shall be provided in Adobe® PDF format; the MUA
form shall also be provided in a format that is compatible with the NASA Materials and Processes
Technical Information System (MAPTIS) database.
13.5 MAINTENANCE: Contractor updates to the Category I and Category II MUAs shall be submitted to
NASA for approval. Complete re-issue of the MUA is required.
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7. DESCRIPTION/USE:
The MIUL is an electronic searchable parts list or separate electronic searchable materials identification
and usage list. The MIUL identifies all Materials and Processes (M&P) usages contained in the end item,
excluding piece part electronics, for evaluation of the acceptability of M&P selected and utilized.
11. REMARKS:
13.3 CONTENTS:
The parts list or MIUL shall identify the following applicable information:
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NASA-STD-6016
- Subsystem
- Maximum operating temperature
- Minimum operating temperature
- Fluid type
- Surface area (nonmetallic materials)
- Associate contractor number
- Project
- Document title
- Criticality
- Line number
- Overall evaluation
- Overall configuration test
- Maximum operating pressure
- Minimum operating pressure
- MUA number or rationale code
- Cure codes
- Materials rating
- Remarks (comments field)
13.4 FORMAT: Contractor format is acceptable. However, Contractor format for electronic submittal of MIUL
data shall be compatible with the NASA Materials and Processes Technical Information System (MAPTIS)
database.
13.5 MAINTENANCE: Contractor updates to the MIUL shall be submitted to NASA for approval. Complete
re-issue of the document is not required.
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7. DESCRIPTION/USE:
The contamination control plan defines implementation measures to control contamination of flight
hardware and fluid systems during manufacturing, assembly, test, transportation, launch site processing,
and post-flight refurbishment.
10. SUBMISSION FREQUENCY: The contractor may submit updates/revisions at any time. Final
submission shall be at CDR.
11. REMARKS:
a. A FOD control plan to prevent damage to flight hardware and injury to the flight crew by foreign
object debris (FOD) during manufacture, assembly, test, transportation, launch site processing,
operation, repair, modification, refurbishment, and maintenance. The FOD prevention program shall
conform to NAS 412, Foreign Object Damage/Foreign Object Debris (FOD) Prevention, as specified
by NASA-STD-6016.
b. Definition of cleanliness level acceptance limits and verification methods for fluid systems, and for
general flight hardware internal and external surfaces. The plan shall also contain a list identifying all
system fluids, together with the fluid specifications (for procurement or custom mixing) and the
required cleanliness levels for the fluid system.
13.3 CONTENTS:
The FOD control plan shall address the following elements:
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The contractor shall define cleanliness level acceptance limits and verification methods for fluid systems,
and for general flight hardware internal and external surfaces. The contractor shall also provide a list
identifying all system fluids, together with the fluid specifications (for procurement or custom mixing) and
the required cleanliness levels for the fluid system.
13.5 MAINTENANCE:
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7. DESCRIPTION/USE:
The Nondestructive Evaluation (NDE) plan shall address the NDE requirements necessary to assure the
health and integrity of the flight hardware throughout its life cycle. This plan shall identify all
Nondestructive Evaluation (NDE) standards employed in the inspection of materials.
10. SUBMISSION FREQUENCY: The contractor may submit updates/revisions at any time.
11. REMARKS:
12. INTERRELATIONSHIP:
The NDE Plan shall address the process for establishment, implementation, execution, and control of NDE.
The plan shall meet the intent of MIL-HDBK-6870A, Inspection Program Requirements, Nondestructive
for Aircraft and Missile Materials and Parts and the requirements of NASA-STD-5009, Nondestructive
Evaluation Requirements for Fracture-Critical Metallic Components as specified by NASA-STD-6016,
Standard Materials and Processes Requirements for Spacecraft
13.3 CONTENTS:
NDE Specifications and Standards -- The NDE plan shall address the selection and the order of precedence
of applicable government, industry, and prime contractor NDE specifications and standards and how the
requirements contained therein are implemented through internal procedures and how-to documents. The
oversight of subcontractor implementation and flow down of the NDE requirements shall also be
addressed. The plan shall address commonly used aerospace industry NDE methods including, but not
limited to, fluorescent dye penetrant, radiographic (film radiography, digital radiography, computed
tomography), ultrasonic, neutron radiography, magnetic particle, eddy current, infrared thermography, and
visual inspection. The plan shall address how all NDE specifications and standards will be approved by the
appropriate government authority.
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NDE Requirements During Hardware Design -- The NDE plan shall address how the processes are
implemented to ensure that all designs are reviewed to establish NDE inspection requirements and to
ensure that the parts are inspectable. The plan shall address how the areas or zones of the part to be
inspected are identified on the drawing. The plan shall address how the operations and maintenance NDE
requirements will be integrated in the design of the hardware.
Part Classification -- The plan shall address appropriate flight hardware and GSE part classification in
accordance with MIL-HDBK-6870A.
NDE Sensitivity Levels -- NDE sensitivity levels shall be classified as Standard NDE, Special NDE,
Custom NDE, and Visual Inspection in the NDE plan. The plan shall address minimum detectable flaw size
for Standard NDE for each material group of flight hardware in compliance with NASA-STD-5009 where
applicable. The plan shall address procedures for defining NDE acceptance criteria for each of the
sensitivity levels and identify organizations and their responsibilities in establishing NDE acceptance
criteria, NDE drawing call outs, and NDE Operations and Maintenance criteria. Note: Custom sensitivity
level refers to an NDE sensitivity level that is not covered under the other three NDE sensitivity levels and
is applicable to non-fracture-critical parts.
NDE Acceptance Criteria -- The plan shall address how NDE acceptance criteria are determined and
implemented for each sensitivity level. For flight hardware, the plan shall require rejection of any crack-
like flaw irrespective of the sensitivity level of the inspection. The plan shall address how significant flaw
indications, irrespective of the acceptance criteria, will be dispositioned.
NDE During Manufacturing --The plan shall address establishment of minimum NDE acceptance
requirements in terms of NDE sensitivity level, methods of inspection (fluorescent dye penetrant,
ultrasonic, etc.), sampling frequency, and NDE inspection coverage (e.g., 100% surface area or selected
area) for manufactured hardware as grouped by classification of the part, material type, and form. The NDE
plan shall address how NDE is sequenced such that inspection reliability is optimized by performing NDE
before manufacturing processes that may significantly reduce flaw detection capability. The requirements
for etching of metal parts prior to penetrant inspection shall be specifically addressed in the plan.
NDE Material Compatibility -- The plan shall address compatibility of NDE materials and processes with
the hardware.
Fracture-Critical Parts -- The Plan shall address how the listing of all Fracture-Critical parts, created
according to the Fracture Control Plan, will be integrated with NDE requirements. The plan shall address
Special NDE and Standard NDE methods in accordance with NASA-STD-5009.
NDE During Operations and Maintenance: --The NDE plan shall address the NDE requirements necessary
to assure the health and integrity of the hardware throughout its life cycle. The NDE plan shall address
NDE requirements during operations and maintenance of those parts that are susceptible to damage such as
impact, corrosion, material degradation and wear, etc. The NDE plan shall address NDE requirements for
inspecting repaired parts. The plan shall address the NDE procedures and physical standards required to
perform the operations and maintenance NDE inspections.
NDE Reporting and Record Retention -- The NDE plan shall describe the NDE nonconformance reporting
system, record retention, and traceability.
Process Audit -- The plan shall address periodic auditing of NDE processes at prime contractor, vendors,
and subcontractors to verify compliance with the NDE requirements established in the plan.
Personnel Training -- The NDE plan shall identify formal training and certification requirements for NDE
Inspection in accordance with NAS 410.
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13.5 MAINTENANCE: Changes to the document proposed by the contractor shall be submitted to NASA for
approval. Complete re-issue of the document is required.
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APPENDIX D
GUIDANCE
D.1 Reference Documents
The documents in this paragraph are provided as reference material for background information
only. In case of conflict, refer to paragraph 2.4.
ASTM MNL 36-2nd (2007) Safe Use of Oxygen and Oxygen Systems: Handbook for Design,
Reference 4.2.1.4 Operation, and Maintenance
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