Dell VxRail™ E560, E560F, and E560N

Technical Specifications

June 2023
Rev. 2
Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

© 2021 - 2023 Dell Inc. or its subsidiaries. All rights reserved. Dell Technologies, Dell, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be trademarks of their respective owners.
 Contents
Revision history..........................................................................................................................................................................4

Chapter 1: Introduction................................................................................................................. 5

Chapter 2: Technical specifications...............................................................................................6

Chassis dimensions..............................................................................................................................................................6
Chassis weight..................................................................................................................................................................... 6
Processor specifications.................................................................................................................................................... 7
Power supply unit specifications......................................................................................................................................7
Battery specifications......................................................................................................................................................... 7
Expansion bus specifications............................................................................................................................................ 7
Memory specifications....................................................................................................................................................... 8
Storage controller specifications..................................................................................................................................... 8
Hard drive specifications................................................................................................................................................... 8
Ports and connectors specifications...............................................................................................................................8
USB ports........................................................................................................................................................................ 8
NIC ports..........................................................................................................................................................................8
Serial port........................................................................................................................................................................ 9
Video graphic array ports.............................................................................................................................................9
Internal dual SD Module............................................................................................................................................... 9
Environmental specifications............................................................................................................................................ 9
Particulate and gaseous contamination specifications....................................................................................... 10
Standard operating temperature...............................................................................................................................11
Expanded operating temperature............................................................................................................................. 11
Expanded operating temperature restrictions...................................................................................................... 12
Thermal restrictions.....................................................................................................................................................12
Ambient temperature limitations.............................................................................................................................. 12

Contents 3
 Revision history
Date Revision Description of change
June 2023 2 Minor updates.
October 2021 1 Initial release.

4 Revision history
 1
Introduction
Technical and environmental specifications are provided for the VxRail E560 Series system.
The target audience for this document includes customers, field personnel, and partners who want to operate and maintain a
VxRail. This document is designed for people familiar with:
● Dell Technologies systems and software
● VMware virtualization products
● Data centers and infrastructure
See the Installation and Service Manual for your VxRail for procedures to install your VxRail. See the VxRail Documentation
Quick Reference List for a complete list of VxRail documents.

Introduction 5
 2
Technical specifications
The technical and environmental specifications of your VxRail are outlined in this section.

Chassis dimensions
The following figure provides chassis dimensions:

The following table provides details of the dimensions of the VxRail:

VxRail Xa Xb Y Za (with Za (w/o Zb * Zc

bezel) bezel)

10 x 2.5 inches 482.0 mm 434.0 mm 42.8 mm 35.84 mm 22.0 mm 733.82 mm 772.67 mm

(18.9 inches) (17.08 inches) (1.68 (1.41 inches) (0.87 (29.61 inches) (30.42
inches) inches) inches)

Chassis weight
System Maximum weight (with all hard drives/SSDs)
VxRail E560 21.9 kg

6 Technical specifications
System Maximum weight (with all hard drives/SSDs)

(48.28 lbs)

Processor specifications
The VxRail E560, E560F, and E560N supports the following processors:
● Up to two Intel Xeon Processor Scalable Family processors
● Up to two 2 nd generation Intel Xeon Scalable processors

Power supply unit specifications

The VxRail E560, E560F, and E560N supports two AC or DC power supply units (PSUs).

PSU Class Heat dissipation Frequency Voltage

(maximum)
1100 W DC Gold 4416 BTU/hr 50/60 Hz –(48–60) V DC
1100 W Mixed Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC and 200–380 V DC
Mode HVDC (for
China and Japan
only)
1100 W AC Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC, autoranging

If a VxRail with 1100 W AC or HVDC PSU operates from 100 to 120V, the power rating per PSU is derated to 1050 W.Heat
dissipation is calculated using the PSU wattage rating.
This is designed to connect to the IT power systems with a phase to phase voltage not exceeding 240 V.

Battery specifications
The VxRail E560, E560F, and E560N supports CR 2032 3.0-V lithium coin cell battery.

Expansion bus specifications

The VxRail E560, E560F, and E560N supports PCI express (PCIe) generation 3 expansion cards, which must be available on the
system board by using expansion card risers.
The following table provides information about the expansion card riser configuration for VxRail E560, E560F, and E560N:

Supported VxRail Riser configuration and Slot PCIe slots (Height Processor
configurations supported risers description and length) connection
Slot 1: x16 low profile, Processor 1
half length
Riser configuration 2 Slot 2: x16 low profile, Processor 1
Three x16 slots
(1A+2A) half length
VxRail E560, E560F, and E560N
Slot 3: x16 low profile, Processor 2
half length
Slot 2: x16 low profile, Processor 1
Riser configuration 4 (1A) Two x16 slots
half length

Technical specifications 7
Memory specifications
The following table shows the memory specifications for the VxRail E560, E560F, and E560N:

DIMM DIMM Single processor Dual processors

DIMM rank
type capacity Minimum RAM Maximum RAM Minimum RAM Maximum RAM
LRDIMM Quad rank 64 GB 256 GB 768 GB 512 GB 1536 GB
LRDIMM Quad rank 128 GB 512 GB 1.5 TB 1 TB 3 TB
RDIMM Dual rank 16 GB 96 GB 192 GB 192 GB 384 GB
RDIMM Dual rank 32 GB 192 GB 384 GB 384 GB 768 GB
RDIMM Dual rank 64 GB 256 GB 768 GB 512 GB 1536 GB

NOTE:
● If your VxRail is running on Intel Xeon Scalable processors, use 64 GB LRDIMM.
● If your VxRail is running on 2 nd generation Intel Xeon Scalable processors, use 64 GB RDIMM.

Storage controller specifications

The VxRail E560, E560F, and E560N supports the following internal storage controller cards: HBA330 and Boot Optimized
Server Storage (BOSS-S1).

Hard drive specifications

The VxRail E560, E560F, and E560N supports NVMe, SAS, SATA, Nearline SAS hard drives or SSDs.
For the VxRail E560, E560F, and E560N, up to ten 2.5 inch, hot swappable NVMe, SAS, SAS/SATA SSD, or Nearline SAS hard
drives are supported.

Ports and connectors specifications

The VxRail E560, E560F, and E560N supports USB ports, NIC ports, VGA ports, serial connector, and an IDSDM card that
supports two internal dual SD module.

USB ports
The following table provides more information about the USB specifications:

VxRail Front panel Back panel Internal

Ten hard drive Two 4-pin, USB 2.0-compliant Two 9-pin, USB 3.0-compliant One 9-pin, USB 3.0-compliant
port ports ports
One 5-pin micro USB 2.0 N/A N/A
management port

The micro USB 2.0-compliant port on the front panel can only be used as an iDRAC Direct or a management port.

NIC ports
The VxRail E560, E560F, and E560N supports four Network Interface Controller (NIC) ports on the back panel, which is
available in one of the following NIC configurations:

8 Technical specifications
● Four RJ45 ports that support 100 M, 1 G, and 10 Gbps
● Four SFP+ ports that support 10 Gbps

Serial port
The serial connector connects a serial device to the VxRail. The VxRail E560, E560F, and E560N supports one serial connector
on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

Video graphic array ports

The Video Graphic Array (VGA) port enables you to connect the VxRail to a VGA display. The VxRail E560, E560F, and E560N
supports one 15-pin VGA port on the front and back of the VxRail.

Video specifications
The VxRail E560, E560F, and E560N supports integrated VGA controller with 4 MB SPI capacity.
The following table describes the supported video resolution options:

Resolution Refresh rate (Hz) Color depth (bits)

640 x 480 60, 70 8, 16, 32
800 x 600 60, 75, 85 8, 16, 32
1024 x 768 60, 75, 85 8, 16, 32
1152 x 864 60, 75, 85 8, 16, 32
1280 x 1024 60, 75 8, 16, 32
1440 x 900 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Internal dual SD Module

The Internal Dual SD module (IDSDM) provides a redundant SD card solution. The IDSDM card offers the following feature:
● Dual card operation — Maintains a mirrored configuration by using SD cards in both the slots and provides redundancy.
NOTE: The IDSDM on the VxRail appliance is pre-configured for appliance bare metal recovery. It is recommended not to
change any settings.

Environmental specifications
For additional information about environmental measurements for specific appliance configurations, see Dell.com/
environmental_datasheets.
The following table shows the optimal working temperature specifications:

Temperature Specifications
Storage –40 °C–65°C (–40 °F–149°F)
Continuous operation 10 °C–35°C (50 °F–95°F) with no direct sunlight on the equipment.
(for altitude less than NOTE: Maximum of 205 W, 28 core processor is supported in appliances.
950 m or 3117 ft)
NOTE: Certain configurations may have ambient temperature restrictions. For more information,,
see the Ambient temperature limitations section.

Fresh air For information about fresh air, see Expanded Operating Temperature section.

Technical specifications 9
Temperature Specifications
Maximum temperature 20°C/h (68°F/h)
gradient (operating
and storage)

The following table shows the relative humidity specification during operations and storage:

Relative humidity Specifications

Storage 5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all
times.
Operating 10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.

The following table shows the maximum vibration specifications during operations and storage:

Maximum Specifications
vibration
Operating 0.26 G rms at 5 Hz to 350 Hz (all operation orientations).
Storage 1.88 G rms at 10 Hz to 500 Hz for 15 min (all six sides tested).

The following table shows the maximum shock specifications during operations and storage:

Maximum shock Specifications

Operating Six consecutively run shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.
Storage Six consecutively run shock pulses in the positive and negative x, y, and z axes (one pulse on each side of
the appliance) of 71 G for up to 2 millisecond.

The following table shows the maximum altitude specifications during operations and storage.

Maximum altitude Specifications

Operating 3048 m (10,000 ft)

Storage 12,000 m (39,370 ft)

The following table shows the operating temperature de-rating specifications:

Operating temperature de- Specifications

rating
Up to 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
35 °C–40°C (95 °F–104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
40 °C–45°C (104 °F–113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous
contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage
or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility
of the customer.

Table 1. Particulate contamination specifications

Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO
14644-1 with a 95% upper confidence limit.

10 Technical specifications
Table 1. Particulate contamination specifications (continued)
Particulate contamination Specifications

NOTE: This condition applies only to data center

environments. Air filtration requirements do not apply to
IT equipment designed to be used outside a data center, in
environments such as an office or factory floor.

NOTE: Air entering the data center must have MERV11 or

MERV13 filtration.

Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data
center environments.

Corrosive dust ● Air must be free of corrosive dust.

● Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data
center environments.

Table 2. Gaseous contamination specifications

Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/
ISA71.04-1985.
Silver coupon corrosion rate <200 Å/month as defined by AHSRAE TC9.9.

NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Standard operating temperature

The standard operating temperature for altitude less than 950 meters or 3117 feet ranges from 10°C to 35°C (50°F to 95°F)
with no direct sunlight on the equipment.

Expanded operating temperature

The following table shows expanded operating temperature specifications:

Expanded operating Specifications

temperature
Continuous operation 5°C to 40°C at 5% to 85% RH with 29°C dew point.
NOTE: Outside the standard operating temperature (10 °C–35°C), the appliance can
operate continuously in temperatures as low as 5°C and as high as 40°C.
For temperatures 35 °C – 40°C, de-rate maximum allowable temperature by 1°C per 175 m
above 950 m (1°F per 319 ft).

≤ 1% of annual operating –5 °C–45°C at 5% to 90% RH with 29°C dew point.

hours NOTE: Outside the standard operating temperature (10 °C–35°C), the appliance can
operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours.
For temperatures 40 °C – 45°C, de-rate maximum allowable temperature by 1°C per 125 m
above 950 m (1°F per 228 ft).

When operating in the expanded temperature range:

● The performance of the VxRail may be impacted.

Technical specifications 11
● The ambient temperature warnings may be reported in the System event log.

Expanded operating temperature restrictions

● Do not perform a cold startup below 5°C.
● The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
● Redundant power supply units are required.
● Non-Dell Technologies qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.

Thermal restrictions
The following table lists the configurations required for efficient cooling:

Config # of Heatsink Proc/DIMM DIMM blanks Max number of DIMM Fan

processor blank blanks
2.5 inch 1 One 1U standard Not required Required for 11 blanks Five standard fans
hard drives heat sink for CPU ≤ processor 1
x 10 165 W
One 1U 2-pipe Required Eight high
heat sink for performance fans
CPU=200/205 W
2 Two 1U standard Not required Eight standard fans
heat sink for CPU ≤
165 W
Two 1U 2-pipe Required 22 blanks Eight high
heat sink for performance fans
CPU=200/205 W

Ambient temperature limitations

The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess processor throttling, which may
impact performance.
The following table lists configurations that require ambient temperature less than 35°C:

Appliance Front backplane Processor Processor Heat Fan Type Ambient

Thermal Design Sink Restriction
Power
VxRail E560, 10 x 2.5-inch SAS/ 200 W, 205 W 2 pipe 1U high High-performance 30°C
E560F, and SATA hard drives performance fan
E560N

12 Technical specifications