AME Module 5
AME Module 5
3 MARKS QUESTIONS
1) Explain the applications of LIGA process
• MEMS Components
• Sensors
• Actuators
• Micro Optical Components
• Components such as micro lenses, mirrors, and filters
2) Write a note on Elastic Emission Machining.
• A process of machining where material is removed by the elastic fracture without plastic
deformation in the order of atomic size is called EEM.
• Using ultra fine particles to collide with the work piece surface, it may be possible to
finish the surface in the atomic scale.
• The ultra fine abrasive particles mechanically hit the workpiece top surface atoms and
remove them individually or in a group by elastic fracture without plastic deformation at
atomic scale.
• EEM processing is conducted in a machining slurry in which ultra fine powder particles
(ZrO2 or Al2O3) are suspended in pure water.
• The removal process in EEM solely depends on the contact between powder particles and
the work piece surface.
• Fine powder particles are brought to the work piece surface by a flow of pure water, and
the reaction between the medium and the surfaces of the work piece results in the
removal of surface atoms from the work piece
• A rotating sphere is used as a tool in EEM.
• The rotation of the sphere close to the work piece surface produces the flow of slurry
with dynamic pressure at the gap.
• This enables the powder particles to attack the surface while maintaining the noncontact
state between both surfaces.
• Each abrasive particle removes several atoms after coming in contact with the workpiece
surface.
• The force exerted by the abrasives on the atoms is more than their bonding force, then
atom will remove.
• The abrasive grain size is in micro-nano range.
• The material removal can occur on atomic size units, then the finish generated can be
close to the order of atomic dimensions (0.2 nm to 0.4 nm).
•
5) What are the applications of magnetic abrasive finishing process?
10 MARKS QUESTIONS
1) What is Laminated Object Manufacturing? Explain the process with sketches.
• In this process, layers of adhesive-coated paper, plastic, or metal laminates are
successively glued together and cut to shape with a knife or laser cutter.
• The main components of the system are a feed mechanism that advances a sheet
over a build platform, a heated roller to apply pressure to bond the sheet to the
layer below, and a laser to cut the outline of the part in each sheet layer.
• Parts are produced by stacking, bonding, and cutting layers of adhesive-coated
sheet material on top of the previous one.
• A laser cuts the outline of the part into each layer.
• After each cut is completed, the platform lowers by a depth equal to the sheet
thickness and another sheet is advanced on top of the previously deposited layers.
• The platform then rises slightly, and the heated roller applies pressure to bond the
new layer.
• The laser cuts the outline, and the process is repeated until the part is completed.
• After a layer is cut, the extra material remains in place to support the part during
build.
2) What is LIGA process? Explain it with neat sketches.
• The LIGA consists of three main processes:
1. Lithography,
2. Electro-forming/electroplating,
3. Molding
• Steps involved:
• Deposit
• Expose
• Develop
• Electroplating
• Planarize
• Strip
• Release (Mold or Metal Part)
• In the process, an X-ray sensitive polymer photoresist, typically PMMA (Poly
methyl meth acrylate), a transparent thermoplastic bonded to an electrically
conductive substrate.
• The polymer is exposed to parallel beams of high-energy X-rays from a radiation
source through a mask.
• Chemical removal of exposed photoresist results in a three-dimensional structure,
which can be filled by the electrodeposition of metal.
• The resist is chemically stripped away to produce a metallic mold insert or even
the part itself.
• The mold insert can be used to produce parts in polymers or ceramics through
injection molding.
• The substrate is conductive material which holds the resist initially.
• The substrate (base plate) is conductive to facilitate electroplating.
• Ex: Steel, silicon wafer with titanium coating, copper plated with gold, titanium,
nickel, etc.
• The photoresist material must be sensitive to X-ray radiation.
• It must have high thermal stability up to 140℃.
• The unexposed resist must be insoluble during development.
• It should show very good adhesion property to the substrate during electroplating.
• PMMA (Poly methyl meth acrylate) is one of the most used photo resist material.
• Other materials are POM (poly oxy methylene), PAS (Polyalkensulfone), PMI
(Polymethacrylimide), PLG (Poly lactide-co glycolide), etc.