Service Manual

Internal Use Only

Service Manual
LG-P500h

Model : LG-P500h

Date: October, 2010 / Issue 1.0

 Table Of Contents
1. INTRODUCTION...................................................................5 4.4 Checking GSM TX Module(GSM PAM + FEM) Block........82
1.1 Purpose................................................................................................ 5 4.5 Checking WCDMA Block.............................................................85
1.2 Regulatory Information................................................................ 5 4.6 Checking GSM Block....................................................................97
1.3 Abbreviations.................................................................................... 7 4.7 GPS/WIFI/BT RF Component.................................................. 105
4.8 GPS/WIFI/BT SIGNAL PATH...................................................... 107
2. PERFORMANCE....................................................................9
4.9 GPS/WIFI/BT Trouble shooting.............................................. 109
2.1 Product Name................................................................................... 9
4.10 Power ON Troubleshooting................................................. 117
2.2 Supporting Standard..................................................................... 9
4.11 Charging Trouble shooting.................................................. 120
2.3 Main Parts : GSM Solution............................................................ 9
4. 12 3M AF Camera trouble.......................................................... 122
2.4 HW Features.....................................................................................10
4. 13 Main LCD trouble.................................................................... 125
2.5 SW Features.....................................................................................12
4.14 Proximity Sensor on/off trouble........................................ 127
2.6 HW SPEC. .........................................................................................14
4.15 Motion Sensor on/off trouble............................................. 129
3. TECHNICAL BRIEF..............................................................22 4.16 Compass Sensor on/off trouble......................................... 131
3.1 GENERAL DESCRIPTION..............................................................22 4.17 Q coin Motor.............................................................................. 133
3.2 GSM MODE.......................................................................................24
5. DOWNLOAD.................................................................... 136
3.3 UMTS MODE....................................................................................26
3.4 GPS RECEIVER..................................................................................29 6. BLOCK DIAGRAM............................................................ 149
3.5 LO GENERATION and DISTRIBUTION CIRCUIT....................29
7. CIRCUIT DIAGRAM......................................................... 155
3.6 OFF-CHIP RF COMPONENTS.....................................................29
3.7 Digital Baseband(DBB/MSM7227)..........................................35 8. BGA Pin Map................................................................... 163
3.8 Hardware Architecture................................................................36
9. PCB LAYOUT.................................................................... 167
3.9 Subsystem (MSM7227)...............................................................38
3.10 Power Block...................................................................................41 10. RF CALIBRATION.......................................................... 171
3.11 External memory interface.....................................................46 10.1 Configuration of Tachyon..................................................... 171
3.12 H/W Sub System..........................................................................47 10.2 How to use Tachyon................................................................ 173
3.13 Audio and sound.........................................................................54
11. STAND ALONE TEST..................................................... 176
3.14 Display.............................................................................................60
3.15 Proximity Sensor.........................................................................62 12. EXPLODED VIEW & REPLACEMENT PART LIST ......... 183
3.16 Vibrators (Q-Coin Motor)..........................................................63 12.1 EXPLODED VIEW....................................................................... 183
3.17 Compass Sensor..........................................................................64 12.2 Replacement Parts.................................................................. 185
3.18 Motion Sensor..............................................................................66 12.3 Accessory.................................................................................... 204
3.19 Main Features...............................................................................67

4. TROUBLE SHOOTING........................................................75
4.1 RF Component...............................................................................75
4.2 SIGNAL PATH...................................................................................77
4.3 Checking TCXO Block...................................................................80

Copyright © 2010 LG Electronics. Inc. All right reserved. -- LGE Internal Use Only
Only for training and service purposes
LGE Internal Use Only -- Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 1. INTRODUCTION

1. INTRODUCTION
1. INTRODUCTION

1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features
of this model.

1.2 Regulatory Information

A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune
from the above case but will prevent unauthorized use of common carrier telecommunication service of
facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that
result from such unauthorized use.

B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.

D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.

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Copyright © 2010 LG Electronics. Inc. All right reserved.
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑ -- LGE Internal Use Only
Only for training and service purposes
͑
1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.

F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.

Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards. • When
repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
• Use a suitable, grounded soldering iron. • Keep sensitive parts in these protective packages until these are
used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

LGE Internal Use Only -- Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

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 1. INTRODUCTION

1. INTRODUCTION

1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current – Constant Voltage

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

OPLL Offset Phase Locked Loop

ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ 6/140 ʹΠΡΪΣΚΘΙΥ͑ι ͣͨ͑͡͡ͽ͸͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟

΀ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ

Copyright © 2010 LG Electronics. Inc. All right reserved. -- LGE Internal Use Only
Only for training and service purposes
 1. INTRODUCTION

1. INTRODUCTION

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

PSRAM Pseudo SRAM

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ 7/140 ʹΠΡΪΣΚΘΙΥ͑ι ͣͨ͑͡͡ͽ͸͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟

΀ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ

LGE Internal Use Only -- Copyright © 2010 LG Electronics. Inc. All right reserved.
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 2. PERFORMANCE

2. PERFORMANCE
2. PERFORMANCE

2.1 Product Name

LGP500h : WCDMA850/1900/2100+EGSM/GSM850/DCS/PCS
(HSDPA 7.2Mbps GPRS Class 10 / EDGE Class 10)

2.2 Supporting Standard

Item Feature Comment
Supporting Standard WCDMA(FDD1,2,5)/EGSM/GSM850/DCS1800/PCS1900
with seamless handover
͑
Phase 2+(include AMR)
SIM Toolkit: Class 1, 2, 3, C-E
Frequency Range WCDMA(FDD1) TX : 1920 – 1980 MHz
WCDMA(FDD1) RX : 2110 – 2170 MHz
WCDMA(FDD2) TX : 1850 – 1910 MHz
WCDMA(FDD2) RX : 1930 – 1990 MHz
WCDMA(FDD5) TX : 824 – 849 MHz
WCDMA(FDD5) RX : 869 – 894 MHz
EGSM TX: 880 – 915 MHz
͑
EGSM RX: 925 – 960 MHz
GSM850 TX: 824 – 849 MHz
GSM850 RX: 869 – 894 MHz
DCS1800 TX : 1710 – 1785 MHz
DCS1800 RX: 1805 – 1880 MHz
PCS1900 TX: 1850 – 1910 MHz
PCS1900 RX: 1930 – 1990 MHz
Application Standard WAP 2.0 ͑

2.3 Main Parts : GSM Solution

Item Part Name Comment
Digital Baseband MSM7227 : Qualcomm ͑
Analog Baseband PM7540 : Qualcomm ͑
RF Chip RTR6285 : Qualcomm ͑

͑
Copyright © 2010 LG Electronics. Inc. All right reserved.
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͑
2. PERFORMANCE

2.4 HW Features
Item Feature Comment
Form Factor DOP type ͑
1) Capacity
͑
Battery Standard : Li-Ion polymer, 1500mAh
2) Packing Type : Soft Pack ͑
Standard :
Size ͑
113.5 x 59 x 13.3 mm
Weight 127g With Battery ͑
Volume TBD ͑
PCB L1B1 type, 10 Layers , 0.8t ͑
2G Up to 350 hrs @ Paging Period 9 (2G)
Stand by time
3G Up to 3500 hrs @ DRX 7 (3G)
Charging time 3 hrs @ Power Off / 1500mAh
2G Up to 250mins @ Power Level 5 (2G)
Talk time
3G Up to 250mins @ Tx = 12dBm (3G)
WCDMA(FDD1) : -106.7 dBm
WCDMA(FDD2) : -104.7 dBm
WCDMA(FDD5) : -104.7 dBm
RX sensitivity EGSM : -105 dBm ͑
GSM850 : -105 dBm
DCS 1800 : -105 dBm
PCS 1900 : -105 dBm
WCDMA : 24dBm/3.84MHz,+1/-3dBm Class3(WCDMA)
WCDMA/ EGSM : 33dBm Class4 (EGSM)
GSM/ GSM850 : 33 dBm Class4 (GSM850)
TX
GPRS DCS 1800 : 30 dBm Class1 (PCS)
output
PCS 1900 : 30 dBm Class1 (DCS)
power
GSM 900 : 27 dBm E2 (GSM900)
EDGE DCS 1800 : 26 dBm E2 (PCS)
PCS 1900 : 26 dBm E2 (DCS)
GPRS compatibility GPRS Class 10 ͑
EDGE compatibility EDGE Class 10 ͑
Plug-In SIM
SIM card type ͑
3V /1.8V

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 2. PERFORMANCE

Main LCD
Display ͑
TFT Main LCD(3.2’, 320 x 480)
Built-in Camera 3M CMOS Camera ͑
Status Indicator No ͑
Function Key:
Home, Back, Menu, Search
Function Key : 4
Keypad Side Key :
Side Key : 3
Volume up/down,
Power Key
ANT Main : Internal Fixed Type ͑
System connector 5 Pin ͑
Ear Phone Jack 3.5Phi, 4 Pole, Stereo ͑
PC synchronization Yes ͑
NAND Flash : 4Gbit
Memory ͑
SDRAM : 4Gbit
Speech coding FR, EFR, HR,AMR ͑
Data & Fax Built in Data & Fax support ͑
Vibrator Built in Vibrator ͑
Blue Tooth V2.1+ EDR ͑
MIDI(for Buzzer Function) SW Decoded 72Poly ͑
Music Player MP3/ WMA/AAC/HE-AAC/EAAC+ ͑
Video Player MPEG4, H.263, WMV9 ͑
Camcorder MPEG4, H.263, ͑
Voice Recording Yes ͑
Speaker Phone mode
Yes ͑
Support
Travel Adapter Yes ͑
CDROM No ͑
Stereo Headset Yes ͑
Data Cable Yes ͑
T-Flash
Yes ͑
(External Memory)

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2. PERFORMANCE

2.5 SW Features
Item Feature Comment
RSSI 0 ~ 4 Levels ͑
Battery Charging 0 ~ 6 Levels ͑
Key Volume 0 ~ 7 Level ͑
Audio Volume 1 ~ 15 Level ͑
Time / Date Display Yes ͑
English/French/German/Spanish/Italia
Multi-Language Yes
n/Danish/Dutch/Korean
Dialing/ Contact / Menu / Message /
Quick Access Mode ͑
Camera
PC Sync No ͑
Speed Dial No Voice mail center -> 1 key
Profile Yes not same with feature phone setting
CLIP / CLIR Yes ͑
Name / Number / Email / Chat Id/ There is no limitation on the number
Website/Postal of items.
Phone Book
addresses/Organizations/Groups/ It depends on
BirthdayNotes / Ringtone available memory amount.
Last Dial Numbers, Last Received
Last Dial Number Yes Numbers and Last Missed Numbers
can store up to a total of 500.
Last Dial Numbers, Last Received
Last Received
Yes Numbers and Last Missed Numbers
Number
can store up to a total of 500.
Last Dial Numbers, Last Received
Last Missed Number Yes Numbers and Last Missed Numbers
can store up to a total of 500.
Search by Number
Name ͑
/ Name
There is no limitation on the number
Group Yes of items. It depends on
available memory amount.
Fixed Dial Number Yes ͑

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 2. PERFORMANCE

Service Dial Number No ͑

Read only
Own Number Yes (add/edit/delete are not
supported)
Voice Memo Yes ͑
Call Reminder No ͑
Network Selection Automatic ͑
Mute Yes ͑
Call Divert Yes ͑
Call Barring Yes ͑
Call Charge (AoC) Yes ͑
Call Duration Yes ͑
There is no limitation on the
number of items. It depends on
SMS (EMS) EMS does not support.
available memory
amount.
SMS Over GPRS No ͑
EMS Melody / Picture No ͑
Send / Receive / Save No ͑
MMS MPEG4
Yes ͑
Send / Receive / Save
Long Message MAX 459 characters SMS 3pages
Cell Broadcast Yes ͑
Download Over the Web ͑
Game Yes ͑
Calendar Yes ͑
There is no limitation on the number
of items.
Memo Yes
It depends on available memory
amount.
World Clock No ͑
Unit Convert No ͑
Stop Watch No ͑
Wall Paper Yes ͑

Copyright © 2010 LG Electronics. Inc. All right reserved. - 13 - LGE Internal Use Only
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2. PERFORMANCE

Support only web browser based on

WAP Browser No webkit. WAP stack and wml are not
supported.
Download Melody /
Yes Over web browser
Wallpaper
SIM Lock Yes Operator Dependent
SIM Toolkit Class 1, 2, 3, C ͑
MMS Yes Google MMS Client
EONS Yes ͑
CPHS Yes V4.2
ENS No ͑
5M AF /
Camera Yes
Digital Zoom : x4

CLDC V1.1 / MIDP V2.1

JAVA Yes
Download Over Web

Voice Dial No ͑
IrDa No ͑
Ver. 2.1+EDR
Bluetooth Yes
(HSP,HFP,A2DP,AVRCP)
FM radio Yes ͑
GPRS Yes Class 10
EDGE Yes Class 10
Hold / Retrieve Yes ͑
Conference Call Yes Max. 6
DTMF Yes ͑
Memo pad No ͑
TTY No ͑
AMR Yes ͑
SyncML Yes ͑
IM Yes ͑
Email Yes ͑

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 2. PERFORMANCE

2.6 HW SPEC.
1) GSM transceiver specification

Item Specification
Rms : 5°
Phase Error
Peak : 20 °
GSM : 0.1 ppm
Frequency Error
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission
GSM/DCS : < -28dBm
Disturbance)
Transmitter Output power and Burst GSM : 5dBm – 33dBm ± 3dB
Timing DCS/PCS : 0dBm – 30dBm ± 3dB
Burst Timing <3.69us
Spectrum due to modulation out to 200kHz : -36dBm
less than 1800kHz offset 600kHz : -51dBm/-56dBm
GSM :
1800-3000kHz :< -63dBc(-46dBm)
Spectrum due to modulation out to 3000kHz-6000kHz : <-65dBc(-46dBm)
larger than 1800kHz offset to the 6000kHz < : < -71dBc(-46dBm)
edge of the transmit band DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
400kHz : -19dBm/-22dBm(5/0), -23dBm
Spectrum due to switching transient
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection – Speech ± 800kHz, ± 1600kHz
channels : -98dBm/-96dBm (2.439%)
AM Suppression
T GSM : -31dBm -98dBm/-96dBm (2.439%)
- DCS : -29dBm
Timing Advance ± 0.5T

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2. PERFORMANCE

2) WCDMA transmitter specification

Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz
Band2 : 1850MHz ~ 1910 MHz
Band5 : 824MHz ~ 849MHz
Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB

Frequency Error within ±0.1 PPM

Open Loop Power Control Normal Conditions : within ±9 dB,
Extreme Conditions : within ±12 dB
Minimum Transmit Power < -50 dBm /3.84 MHz

Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)

Adjacent Channel Leakage > 33 dB @ ±5 MHz,
Power Ratio (ACLR) > 43 dB @ ±10 MHz
Spurious Emissions < -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz

|f-fc| > 12.5 MHz < -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz

< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz

< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz

< -60 dBm / 3.84 MHz RW @ 869 MHz ≤ f ≤ 894 MHz

< -60 dBm / 3.84 MHz RW @ 1930 MHz ≤ f ≤ 1900 MHz

< -60 dBm / 3.84 MHz RW @ 2110 MHz ≤ f ≤ 2155 MHz

< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz

< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz

< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz

< -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6 MHz

Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm
Peak Code Domain Error < -15 dB at Pout t -20 dBm

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 2. PERFORMANCE

3) WCDMA receiver specification

Item Specification
Receive Frequency Band1 : 2110 ~ 2170 MHz
Band2 : 1930 ~ 1990 MHz
Band5 : 869 ~ 894MHz
Reference Sensitivity Level Band1 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz
Band2 : BER < 0.001 when Îor = -104.7 dBm / 3.84 MHz
Band5 : BER < 0.001 when Îor = -104.7 dBm / 3.84 MHz
Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz
Adjacent Channel Selectivity ACS > 33 dB where BER < 0.001 when
(ACS) Îor = -92.7 dBm / 3.84 MHz
& Ioac = –52 dBm / 3.84 MHz @ ±5 MHz
Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz
Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -44 dBm
Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz
& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz
Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz
< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4
Inner Loop Power Control 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
In Uplink -1 -0.5/-1.5 -1/-3 -1.5/-4
group(10equal command group)
+1 +8/+12 +16/+24

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2. PERFORMANCE

4) HSDPA transmitter specification

Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz
Band2 : 1850MHz ~ 1910 MHz
Band5: 824MHz ~ 849MHz
Maximum Output Power Sub-Test
1=1/15, 2=12/15 21~25dBm / 3.84 MHz
3=13/15 4=15/8 20~25dBm / 3.84 MHz
5=15/7 6=15/0 19~25dBm / 3.84 MHz

Sub-test Power
Power Power step slot Transmitter power
in table step size,
step boundary step tolerance [dB]
C.10.1.4 P [dB]
1 Start of 6 +/- 2.3
HS-DPCCH
Ack/Nack
5 2 Start of CQI 1 +/- 0.6
3 Middle of CQI 0 +/- 0.6
4 End of CQI 5 +/- 2.3

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Frequency offset Measurement

Minimum requirement
Spectrum Emission Mask from carrier ୞f Bandwidth
2.5 ~ 3.5 MHz -35-15×(୞f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1×(୞f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10×(୞f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz

Adjacent Channel Leakage Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
Power Ratio (ACLR) > 33 dB @ ±5 MHz
> 43 dB @ ±10 MHz
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm

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 2. PERFORMANCE

5) HSDPA receiver specification

Item Specification
Receive Frequency Band1 : 2110 ~ 2170 MHz
Band2 : 1930 ~ 1990 MHz
Band5 : 869 ~ 894MHz
Maximum Input Level Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
(BLER or R), 16QAM Only
BLER < 10% or R >= 700kbps

6) WLAN 802.11b transceiver specification

Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)

Frequency Tolerance within ±25 PPM

Chip clock Frequency within ±25 PPM
Tolerance
Spectrum Mask ≤ -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz
≤ -50 @ f < fc-22MHz and f > fc+22MHz
Power ramp on/off time ≤ 2us
Carrier Suppression ≤ -15dB
Modulation Accuracy ≤ 35%
(Peak EVM)
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity ≤ -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Max input Sensitivity ≥ -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Adjacent Channel ≥ 35dB @FER ≤ 8%,
Rejection interference input signal -70dBm@fc±25MHz(11Mbps)

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2. PERFORMANCE

7) WLAN 802.11g transceiver specification

Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)

Frequency Tolerance within ±25 PPM

Chip clock Frequency within ±25 PPM
Tolerance
Spectrum Mask ≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)
≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz)
≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error ≤ -5dB
(rms EVM)
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER ≤ 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%
Rx Adjacent Channel PER ≤ 10%,
Rejection ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps,
ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps,
ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps
ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps
୔ACR shall be measured by setting the desired signal's strength 3 dB
above the rate-dependent
sensitivity specified in min input sensitivity

8) GPS receiver specification

Item Specification
Receive Frequency 1574.42 MHz ~ 1576.42 MHz
Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding

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 Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%
Rx Adjacent Channel PER ≤ 10%,
Rejection ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps,
ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps,
ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps
2. PERFORMANCE
ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps
୔ACR shall be measured by setting the desired signal's strength 3 dB
above the rate-dependent
sensitivity specified in min input sensitivity

8) GPS receiver specification

Item Specification
Receive Frequency 1574.42 MHz ~ 1576.42 MHz
Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding

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 3. TECHNICAL BRIEF

3. TECHNICAL
3. TECHNICALBRIEF BRIEF

3.1 GENERAL DESCRIPTION

The LG-P500h supports UMTS-850, UMTS-1900, UMTS-2100, GSM-850, GSM-850, GSM-900, GSM-1800, and
GSM-1900 based GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF
architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband.
The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked
RF loop that
Block translates the GMSK-modulated or 8-PSK-modulated signal to RF.
Diagram

[Figure 1-1] Block diagram of RF part

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 3. TECHNICAL BRIEF

A generic, high-level functional block diagram of LGP509

LGP500h is shown in Figure 1-1. One antenna collects base
station forward link signals and radiates handset reverse link signals. The antenna connects with receive and
transmit paths through a ASM(Antenna-Switch-Module).
The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that translate the
signal directly from RF-to-baseband using radioOne ZIF techniques. The RFIC’s Rx analog baseband outputs,
for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same
inputs to the MSM IC.
For the transmit chains, the RTR6285 IC directly translates the Tx baseband signals (from the MSM device) to
an RF signal using an internal LO generated by integrated onchip PLL and VCO. The RTR6285 IC outputs
deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective
UMTS PAs. In the GSM receive path, the received RF signals are applied through their band-pass filters and
down-converted directly to baseband in the RTR6285 transceiver IC. These baseband outputs are shared with
the UMTS receiver and routed to the MSM IC for
further signal processing.
The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency, is
divided into phase and amplitude components to produce an open-loop Polar topology:

1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated signal, to
a constant envelope phase signal at RF;
2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier
from a DAC within the MSM LGP509
LGP500h power supply voltages are managed and regulated by the PM7540
Power Management IC. This versatile device integrates all wireless handset power management, general
housekeeping, and user interface support functions into a single mixed signal IC.
It monitors and controls the external power source and coordinates battery recharging while maintaining the
handset supply voltages using low dropout, programmable regulators.
The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring
on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as
temperature, RF output power, and battery ID.
Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters
such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against
detrimental conditions.

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3. TECHNICAL BRIEF

3.2 GSM MODE

3.2.1 GSM RECEIVER

The GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs of RTR6285 are connected directly to the
transceiver front-end Module. GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs use differential
configurations to improve common-mode rejection and second-order non-linearity performance. For
example Figure 1-2 shows receiver input topologies for DCS and PCS (GSM-850/900 have the same receiver
input topologies). The balance between the complementary signals is critical and must be maintained from
the RF filter outputs all the way into the IC pins.

[Figure 1-2] DCS and PCS Receiver Inputs Topologies

Since GSM-850, GSM-900, GSM-1800, and GSM-1900 signals are time-division duplex (the handset can only
receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency
duplexers – this is accomplished in the switch module. The GSM-850, GSM-900, GSM-1800, and GSM-1900
receive signals are routed to the RTR6285 through band selection filters and matching networks that
transform single-ended 50-ΩG sources to differential impedances optimized for gain and noise figure. The
RTR input uses a differential configuration to improve second-order intermodulation and common mode
rejection performance. The RTR6285 input stages include MSM-controlled gain adjustments that maximize
receiver dynamic range.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The
downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having
passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC
offset corrections. The filter outputs are buffered and passed on to the MSM7227 IC for further processing
asshown in Figure 1-2.

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 3. TECHNICAL BRIEF

3.2.2 GSM TRANSMITTER

The RTR6285 transmitter outputs(HB_RF_OUT1 and LB_RF_OUT1) include on-chip output matching
inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The
capacitor value may be optimized for specific applications and PCB characteristics based on pass-band
symmetry about the band center frequency as shown in Figure 1-3.

[Figure 1-3] GSM Transmitter Outputs Topologies

The RTR6285 IC is able to support GSM 850/900 and GSM 1800/1900 mode transmitting. This design
guideline shows a tri-band GSM application. Both high-band and low band outputs are followed by resistive
pads to ensure that the load presented to the outputs remains close to 50ohm.

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3. TECHNICAL BRIEF

3.3 UMTS MODE

3.3.1 UMTS RECEIVER

The UMTS duplexer receiver output is routed to LNA circuits within the RTR6285 device as shown in
Figure 1-4. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second
stage filter that provides differential downconverter as shown in Figure 1-5. This second stage input is
configured differentially to optimize secondorder intermodulation and common mode rejection
performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier are
adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS Rx
amplifiers drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted UMTS
Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for
UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential outputs are
buffered to interface shared with GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when
the RTR6285 is downconverting GSM signals and on when the UMTS is operating.

[Figure 1-4] UMTS Receiver Inputs Topologies

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 3. TECHNICAL BRIEF

3.3.2 UMTS TRANSMITTER

The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These analog
input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The up-converter
output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is
filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that
simplifies the external matching network to a single series capacitor to achieve the desired 50-Ω interface.
The RTR6285 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-
level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the
antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6285 IC with
the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for
multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback
divider, and digital logic generator.
UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals for nine
different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal
directly from baseband to RF. This requires FLO to equal FRF, and the RTR6285 IC design achieves this
without allowing FVCO to equal FRF. The RTR6285 IC is able to support UMTS 2100/1900/1800/1700 and 850
mode transmitting. This design guideline shows only UMTS 2100 applications.

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3. TECHNICAL BRIEF

[Figure 1-5] RTR6285 IC Functional Block Diagram

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 3. TECHNICAL BRIEF

3.4 GPS RECEIVER

The GPS receiver input employs a single-ended connection realized by this pin. The GPS input is routed from
the GPS antenna switch, through a band pass filter and then an impedance transformer circuit that optimally
matches the impedance looking into the GPS LNA. The impedance transformer circuit topology is shown in
Figure 1-6.

[Figure 1.6] GPS Input Network Topology

3.5 LO GENERATION and DISTRIBUTION CIRCUIT

The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes
to yield highly flexible quadrature LO outputs that drive all GSM/EDGE, UMTS band and GPS up-converters
and down-converters; with the help of these LO generation and distribution circuits, true zero-IF architecture
is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RFto-
baseband and from baseband-to-RF. Two fully functional fraction-N synthesizers, including VCOs and loop
filters, are integrated within the RTR6285 IC. In addition, the RTR6285 has a third synthesizer used for GPS
operation. The first synthesizer (PLL1) in the RTR6285 creates the transceiver Los that support the UMTS
transmitter, and all four GSM band receivers and transmitters including: GSM850, GSM900, GSM1800, and
GSM1900. The second synthesizer (PLL2) in the RTR6285 IC provides the LO for the UMTS primary receiver.
For the RTR6285 IC only, the second synthesizer also provides the LO for the secondary UMTS receiver. The
third synthesizer (PLL3), only in the RTR6285 IC, provides the LO for the GPS receiver. An external TCXO input
signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency
locked. The RTR6285 ICs integrate most of the PLL loop filter components on-chip except for three off-chip
loop filter-series capacitors, which significantly reduces off-chip component requirement. With the
integrated fractional-N PLL synthesizers, the RTR6285 ICs have the advantage of more flexible loop
bandwidth control, fast lock time, and low-integrated phase error.

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3. TECHNICAL BRIEF

3.6 OFF-CHIP RF COMPONENTS

3.6.1. UMTS PAM

3.6.1.1 W2100, W850 (U1003,SKY77197)

The SKY77197 Power Amplifier Module (PAM) is a fully matched, 14-pad, surface mount module
developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient
module packs full WCDMA Band I and Band VIII coverage into a single compact package. The SKY77197
meets the stringent spectral linearity requirements of WCDMA transmission, with high
power added efficiency for power output to 27.5 dBm (Band I) and 28 dBm (Band V). The SKY77197
meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA)
data transmission with high power added efficiency. A directional coupler is integrated into the
module thus eliminating the need for any external coupler.
The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active
circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching
circuits. Output match into a 50-ohm load is realized off-chip within the module package to optimize
efficiency and power performance.
The SKY77197 PAM is manufactured with Skyworks’ InGaP GaAs Heterojunction Bipolar Transistor
(HBT) BiFET process that provides for all positive voltage DC supply operation while maintaining high
efficiency and good linearity. No VREF voltage is required. Power down is accomplished by setting the
voltage on VENABLE to zero volts. No external supply side switch is needed as typical “off” leakage is
a few microamperes with full primary voltage supplied from the battery.

SKY77197 (W2100,W850)

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 3. TECHNICAL BRIEF

3.6.1.2 W1900 (U1005, SKY77702)

The SKY77702 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module developed for
Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient module packs full
1850–1910 MHz bandwidth coverage into a single compact package. Because of high efficiencies attained
throughout the entire power range, the SKY77702 delivers unsurpassed talk-time advantages. The SKY77702
meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA), High
Speed Uplink Packet Access (HSUPA), and Long Term Evolution (LTE) data transmission with high power
added efficiency. A directional coupler is integrated into the module thus eliminating the need for any
external coupler. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC)
contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and
interstage matching circuits. Output match into a 50-ohm load is realized off-chip within the module
package to optimize efficiency and power performance. The SKY77702 PAM is manufactured with Skyworks’
InGaP GaAs Heterojunction Bipolar Transistor (HBT) BiFET process that provides for all positive voltage DC
supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77702 is
supplied directly from any three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the
3.2 to 4.2 volt range. No VREF voltage is required. Power down is accomplished by setting the voltage on
VENABLE to zero volts. No external supply side switch is needed as typical “off” leakage is a few
microamperes with full primary voltage supplied from the battery.

G
G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G SKY77702 (W1900)

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3. TECHNICAL BRIEF

3.6.2 19.2MHz VCTCXO (X250, KT3225L19200DCW28RA0)

The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference
frequency for all RFIC synthesizers as well as clock generation functions within the MSM6285 IC. The oscillator
frequency is controlled by the MSM6285 ICs.
TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ.
A two-pole RC lowpass filter is recommended on this control line.
The PM7540 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval
before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is
enabled by the MSM TCXO_EN line . The PM7540 IC VREG_TCXO regulated output voltage is used to power
the VCTCXO and is enabled before most other regulated outputs. Any GSM mode power control circuits
within the MSM7227 IC require a reference voltage for proper operation and sufficient accuracy. Connecting
the PM7540 IC REF_OUT directly to the MSM7227 IC GSM_PA_PWR_CTL_REF provides this reference. This
sensitive analog signal needs a 0.1 μF low frequency filter near to MSM side, and isolate from digital logic and
clock traces with ground on both sides, plus ground above and below if routed on internal layers.

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 3. TECHNICAL BRIEF

3.6.3 ASM + GSM PAM (U1002, SKY77544)

SKY77544 is a transmit and receive Front End Module (FEM) designed in a very low profile (0.9 mm), compact
form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation — a
complete transmit VCO-to-Antenna and Antenna-toreceive SAW filter solution. The FEM also supports Class
12 General Packet Radio Service (GPRS) multi-slot operation and EDGE Polar Modulation. WCDMA switch-
through support is provided by three dedicated high-linearity ports.
The module consists of a GSM850/900 PA and DCS1800/PCS1900 PA block, impedancematching circuitry for
50 Ω input and output impedances, Tx harmonic filtering, high linearitylow insertion loss switches, and a
CMOS Power Amplifier Control (PAC) block. A custom silicon integrated circuit contains decoder circuitry to
control the RF switch while providing a low current external control interface. An integrated temperature
sensor provides an analog voltage based on the temperature of the module.
Fabricated in InGaP/GaAs, the Heterojunction Bipolar Transistor (HBT) PA blocks support the GSM850/900
bands and DCS1800/PCS1900 bands. Both PA blocks share common power
supply pads to distribute current. The output of the PA block and the outputs to the seven
receive pads connect to the antenna pad through a highly linear antenna switch. The WCDMA
and Rx ports feature a 0 volts DC offset level, which eliminates any need for external blocking capacitors. The
InGaP/GaAs die, switch die, Silicon (Si) controller die, and passive components are mounted on a multi-layer
laminate substrate and the entire assembly is encapsulated with plastic overmold.
RF input and output ports of the SKY77544 are internally matched to a 50 Ω load to reduce the number of
external components for a quad-band design. Extremely low leakage current of the FEM maximizes handset
standby time. Band selection and control of transmit and receive RF signal flows are performed by use of four
external control pads. See Figure 1.9 shown on overleaf. Mode of operation Tx, Rx, Band (GSM850, GSM900,
DCS, PCS, and UMTS) is controlled with 4 logic inputs: BS1, BS2, Mode, and TxEN. Proper timing of the TxEN
input and the VAPC input ensures high isolation between the antenna and Tx-VCO while the VCO is being
tuned prior to the transmit burst. The Enable input controls the initial turn-on of the PAC circuitry to
minimize battery drain.
The integrated power amplifier control (PAC) function provides envelope amplitude control by reducing
sensitivity to input drive, temperature, power supply, and process variation.

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3. TECHNICAL BRIEF

[Figure 1.9] SKY77544 Block Diagram

[Figure 1.10] SKY77544 Control Logic

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3.6.4 GPS LNA (U1004, RF2815)

The RF2815 is a GPS Low Noise Amplifier with an integrated SAW filter at the output. Low noise figure, along
with high gain, achieved by the RF2815 makes it ideal for GPS recievers requiring high sensitivity. This
module builds upon RFMD’s leading edge pHEMT process and integrates input matching and low loss high
rejection SAW filter at the output. This results in high performance and a reduced solution size. The ease of
implementation simplifies the reciever design.
The RF2185 is packaged in a compact 3.3 mm x 2.1 mm x 1.0 mm package with low external component
count required to achieve the best-in-class performance.

3.7 Digital Baseband(DBB/MSM7227)

3.7.1 General Description

A. Features(MSM7227)
The basic MSM7227 system solution consists of the MSM7227, RTR6285™, and PM7540™ ICs, plus AMSS™
system software with the SURF7227™ platform available for development. General features include:

-WCDMA Rel ‘99 plus HSDPA and HSUPA

-GSM/GPRS/EDGE
-High-performance ARM1136JF-S™ application processor at up to 600 MHz; QDSP5000™ at 320 MHz
-High-performance ARM926EJ-S™ modem processor at up to 400 MHz; QDSP4000™ at 122.88 MHz
-Java® hardware acceleration for faster Java-based games and other applets
-Support for Bluetooth® 2.1 EDR via an external Bluetooth System-on-Chip (SoC)
-High-speed, serial mobile display digital interface (MDDI) that optimizes the interconnection cost
between the MSM device and the LCD panel
-Receive diversity support for WCDMA mode, thereby providing improved capacity and data throughput
-USB 2.0 compliant high-speed USB core with limited OTG capabilities
-Integrated high-speed USB PHY
-Integrated wideband stereo codec for digital audio applications
-Direct interface to digital camera module with video front-end (VFE) image processing
-GPS position location capabilities
-Vocoder support (GSM-HR, FR, EFR, AMR, and AMR-WB/+)
-Advanced 12 × 12 ×1.05 mm, 0.4 mm pitch, 560 NSP

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3. TECHNICAL BRIEF

3.8 Hardware Architecture

<System HW Block>
System HW Block Diagram All System
BT_UART BT &
MDDI Interface MDDI Interface Bluetooth v2.1 Wi-Fi
BT_PCM
TOUCH I2C WLAN_SDIO Wi-Fi 802.11b/g
Capacitive Touch FM_L&R
3.2" HVGA LINE_L& R FM Radio
FM_L&R
(Melpas + LGIT) TOUCH INT FM
320*480 TCXO_ F_CLK_IN
LBEH19UNBC-338
26MHz
CLK_REQ GSM & WCDMA
LCD Backlight IC TX_IQ, PRX_IQ PRX_IQ
BL_I2C RF I/F FEM
FEM
AAT2862 DRX_IQ DRX_IQ (SKY77544)
(SKY77544)
GPIO59 SBDTTransceiver
Transceiver
(RTR6285)
(RTR6285)TCXO GPS
Fuel
FuelGauge
Gauge
FUEL_I2C GPS
(MAX17040G))
(MAX17040G
DDR SDRAM(4G) EBI1 (DDR)
MCP(Micron) NAND FRESH (4G) EBI2 (NAND) LIN_PWM_FREQ
GPIO_28 Q-Motor
Q-Motor
MT29C4G96MAZAPCJA-5 IT
MSM7227 MIC MIC
(WHVM-1030Q10)
(WHVM-1030Q10)

CAM I/F RTR_TRK_LO_ADJ TCXO_RTR_19.2MHz

CAM 3M TCXO_19.2MHz TCXO_PM_19.2MHz
CAM_I2C
(Kyocera) Speaker &
EAR1_OP&ON RCV_P & N Receiver
LINE_ON&OP LINE_OP, LINE_ON SPK_RCVP, N
Digital Compass COMPASS_I2C HPH_R, HPH_L
Audio Sub
COMPASS_INT HPH_L&R WM9093ECS-R EAR_L, R 3.5 pi
(AMI304) AUDIO_I2C
GPIO_27 Earjack
MOTION Sensor I2C
MOTION_I2C PROX_I2C Prox Sensor
Back Key (KR3DM) MOTION_INT (GP2AP002S00F) TCXO_IN

Send Key QTKEY_I2C

USIM USIM I/F KPD_PWR_N PWR/End Key
USIM
Home Key Key COL, Key ROW PMIC_SSBI
GPIO106 SBDT_SSBI
AMUX_OUT
Menu Key MMC HKAIN2 AMUX_OUT SIM
PM_INT_N USIM
GPIO24 MSM_INT_N
GPIO36 ~ 38
GPIO25 PS_HOLD PS_HOLD
Volume Key
I2C RESIN_N
MUIC_I2C
PM7540 Backlight_Key
UART3 Key
UART3 KPD_DRV_N KeyLED
LED
Connector
5pin_USB
Connector
5pin_USB

USBPHY JTAG MPP3,4

MUIC
MUIC PON_RESET_N
(TS5USBA)
(TS5USBA)
USBH DM & DP JTAG_PS_HOLD
REMOTE_PWR_ON nJTAG_RESOUT
Array TP JTAG(TCK,TDI,TDO…) JTAG CONN.
UART3_TX/RX

Main Board Sub FPCB

Figure. Block Diagram

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 3. TECHNICAL BRIEF

<Power Block>

Figure. Simplified Block Diagram

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3. TECHNICAL BRIEF

3.9 Subsystem (MSM7227)

3.9.1. ARM Microprocessor Subsystem

The MSM7227 device uses an embedded ARM1136JF-S, ARM926EJ-S microprocessor. This microprocessor,
through the system software, controls most of the functionality for the MSM, including control of the
external peripherals such as the keypad, LCD, SDRAM, and NANDFlash devices. Through a QUALCOMM
proprietary single-wire SBI (SSBI) the ARM926EJ-S configures and controls the functionality of the RTR6285
and PM7540 devices.

3.9.2. WCDMA Subsystem

The WCDMA subsystem performs the data conversions and signal processing necessary to maintain the
WCDMA air interface between the handset and the base station (and also the WCDMA network). The
subsystem components include:
-Searcher engine
-Demodulating fingers
-Combining block
-Frame deinterleaver
-Viterbi decoder
-Reverse link subsystem
-Turbo decoder
On the forward link traffic channel, the WCDMA subsystem searches, demodulates, and decodes incoming
pilot, sync, paging, and traffic channel information. It extracts low bit-rate packet data from the forward link
traffic channel and sends the packet data to the vocoder for processing. On the reverse link, the WCDMA
subsystem processes the packet data from the vocoder and modulates the reverse traffic channel.

3.9.3. GSM Subsystem

The GSM subsystem performs the data conversions and signal processing necessary to maintain the GSM air
interface, including PA gain control for GPRS support. For GSM, the power profile ramps up before the burst
and ramps down afterward. For GPRS, transmit bursts can occur in as many as four sequential slots and the
PA must be ramped up and down smoothly between each slot, holding the desired output power level
during each burst. GSM support includes:

-GSM release ‘99 (circuit switching)

-GPRS (packet switching)
-EDGE E2 power class for 8 PSK

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 3. TECHNICAL BRIEF

3.9.4. RF Interface

The RF interface communicates with the mobile station’s external RF and analog baseband circuits. Signals to
these circuits control signal gain in the Rx and Tx signal path and maintain The system’s frequency reference.

3.9.5. Single-wire serial bus interface (SSBI)

The MSM7227 device’s SSBI is designed specifically to be a quick, low pin count control protocol for
QUALCOMM’s RTR6285 and PM7540 ASICs. Using the SSBI, the RTR6285 and PM7540 devices can be
configured for different operating modes and for minimum power consumption, extending battery life in
Standby mode. The SBI also controls DC baseband offset errors.

3.9.6. Audio function

MSM7227 audio functions include the analog Rx and Tx paths (or stereo wideband codec), audio digital
signal processing (DSP) that provides adjustable gains and filtering, PCM circuits for interfacing with external
devices, and additional audio DSP that actually implements encoding and decoding. Other key features
include:

-The wideband codec supports stereo music/ringer melody applications in addition to the 8 kHz voice
band applications on the forward link.
-A PCM interface allows an external codec to be used instead of the internal codec; this supports inter-IC
Sound (I2S) modes that allow an external stereo DAC or SADC to be used.
-Currently in AMSS baseline only I2S output mode is supported (SDAC-only, no SADC support).
-Audio decoder summing and headset switch detection are included.
-Audio DSP includes the Rx and Tx filters needed to meet ITU-T G.712 requirements.
-A programmable sidetone path provides for summing part of the Tx audio into the Rx path.
-Many codec parameters are configurable via SBI registers.
-The audio processing is configured through QDSP5 command types and is not directly controlled by the
microprocessor.

3.9.7. Vocoder Subsystem

The MSM7227 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to
support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls,
Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal Echo Canceller (ESEC),
Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx
compensation filters. The MSM7227 device’s integrated ARM9TDMI processor downloads the firmware into
the QDSP4000 and configures QDSP4000 to support the desired functionality.

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3. TECHNICAL BRIEF

3.9.8. Mode Select and JTAG Interfaces

The mode pins to the MSM7227 device determine the overall operating mode of the ASIC. The options under
the control of the mode inputs are Native mode, which is the normal subscriber unit operation, ETM mode,
which enables the built-in trace mode, and test mode for factory testing. The MSM7227 device meets the
intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects
between devices within the mobile station during manufacture.

3.9.9. General-Purpose Input/Output Interface

The MSM7227 IC includes 133 general purpose input/output (GPIO) pins, and each can be configured as a
digital input or digital output. Inputs can be set to have a pull-up, pull-down, keeper, or no-pull. Output drive
strength is also programmable. Software assigns functions to the GPIOs and their configurations are set
accordingly. Some of the GPIO pins have alternate functions supported on them. The alternate functions
include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART
interface. The function of these pins is documented in the various software releases.

3.9.10. UART

The MSM7227 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share
multiplexed pins.

-UART1 for Bluetooth

-UART2 for USIM interface
-UART3 for data
.

3.9.11. USB

The MSM7227 IC supports one High Speed USB (HS-USB) USBH port with built-in PHY and one Full Speed
USB-UICC port. The MSM7227 IC supports USB interfaces using two controllers:

-The primary controller is the HS-USB port with an integrated physical layer (PHY). Thisଝ HS-USB port is
also capable of supporting USB operations at low-speed and full-speed.
-The secondary controller is the FS USB-UICC port, which only supports host mode functionality.

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 3. TECHNICAL BRIEF

3.10 Power Block

3.10.1. General

MSM7227, included RF, is fully covered by PM7540 (Qualcomm PMIC). PM7540 cover the power of MSM7227,
MSM memory, RF block, Bluetooth, USIM and TCXO.
Major power components are :

PM7540 (U403) : Phone main PMIC

3.10.2 PM7540

The PM7540 device (Figure) integrates all wireless handset power management. The power management
portion accepts power from all the most common sources – battery, external charger, adapter, coin cell back-
up – and generates all the regulated voltages needed to power the appropriate handset electronics. It
monitors and controls the power sources, detecting which sources are applied, verifying that they are within
acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the
handset electronics supply voltages. Eight programmable output voltages are generated using low dropout
voltage regulators, all derived from a common trimmed voltage reference. A dedicated controller manages
the TCXO warm-up and signal buffering, and key parameters (under-voltage lockout and crystal oscillator
signal presence) are monitored to protect against detrimental conditions. MSM device controls and statuses
the PM7540 IC using Single-wire SBI(SSBI) supplemented by an Interrupt Manager for time-critical
information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-
on sequence.

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3. TECHNICAL BRIEF

Figure. PM7540
Figure. PM7540functional
functionalblock
blockdiagram
diagram

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 3. TECHNICAL BRIEF

3.10.3. Charging control

A programmable charging block in PM7540 is used for battery charging. It is possible to set limits for the
charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin
(VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For
additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping
ADC via the analog multiplexer. PM7540 circuits monitor voltages at VCHARGER and ICHARGE pins to
determine which supply should be used and when to switch between the two supplies. These pins are
connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.

3.10.3.1. Trickle Charging

Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the
PM7540 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to
pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance
specified below (3.2V). The charging current is set to 80mA.

Parameter Min Typ Max Unit

Trickle Current 60 80 100 mA

Figure. PM7540 Charging Flow (TC Charging)

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3. TECHNICAL BRIEF

3.10.3.2. Constant Current Charging

The PM7540 IC supports constant current charging of the main battery by controlling the charger pass
transistor and the battery transistor. The constant current charging continues until the battery reaches its
target voltage, 4.2V.

u|z\\ZW

Figure. PM7540 Charging Flow (CC Charging)

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 3. TECHNICAL BRIEF

3.10.3.3. Constant Voltage Charging

Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of
constant voltage charging is commonly detected 10% of the full charging current.

3.10.3.4. LGP509
LGP500h Charging Specification
-Charging Method : CC & CV (Constant Current & Constant Voltage)
-Maximum Charging Voltage : 4.2V
-Maximum Charging Current : 700mA
-Nominal Battery Capacity : 1500mAh
-Charging time : Max. 3h 30m
- Full charge indication current (icon stop current) : 50mA

3.10.3.5. LGP509
LGP500h battery bar icon display

Battery Bar Number Specification

BAR 6 (Full) 90% over

BAR 6 --> 5 90% Æ 89%

BAR 5 --> 4 70% Æ 69%

BAR 4 --> 3 50% Æ 49%

BAR 3 --> 2 30% Æ 29%

Remain %
BAR 2 --> 1 15% Æ 14%

BAR 1 --> 0 5% Æ 4%

Low Battery Pop-up 4% ~ 15% : One Time popup (No call)

Critical Low Battery Pop-up 0% ~ 3% : Level changeⰞ┺ popup (No call)

POWER OFF 0%

Table. LGP509
LGP500h battery bar specification

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3. TECHNICAL BRIEF

3.11 External memory interface

3.11.1. MSM7227

The MSM7227 device was designed to provide two distinct memory interfaces. EBI1 was targeted for
supporting DDR synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous
devices such as LCD, NAND flash, SRAM, NOR flash etc. To support the high-bandwidth, high-density, and
low-latency requirements of the advanced on-chip applications, the MSM7227 IC has two high-speed, high-
performance memory slave interfaces: the external bus interface 1 (EBI1) and the stack memory interface
(SMI). To achieve higher bandwidth and better use of the memory device interface, the SMI accepts multiple
commands for the external memory
device. The SMI interface acts as a slave device to all of the bus masters within the MSM device. The masters
arbitrate to gain access to the SMI, and upon obtaining the access, they issue commands to the SMI. The bus
masters are connected to the SMI through an advanced extensible interface (AXI) bus bridge (or global
interconnect block) and communicate over a 64-bit, non-blocking AXI bus protocol. The AXI bus bridge
provides the arbitration logic for all of the bus masters.
EBI1 Features
- Support for only low-power memories at 1.8-V I/O power supply voltage
- AXI bus frequencies up to 133 MHz
- A 16-bit/32-bit static and dynamic memory interface
DDR SDRAM interface features include:
- Supports both 32-bit DDR SDRAM devices, up to 133-MHz bus speed
- Supports auto precharge and manual precharge
- Supports partial refresh
- Separate CKE pin per chip-select to support partial operation mode
- Idle power down to save idling power consumption
EBI2 Features
- Support for asynchronous FLASH and SRAM(16bit & 8bit).
- Interface support for byte addressable 16bit devices(UB_N & LB_N signals).
- 2Mbytes of memory per chip select.
- Support for 8 bit/16bit wide NAND flash.
- Support for parallel LCD interfaces, port mapped of memory mapped(8 or 16 bit)

3.11.2.LGP509
LGP500h External memory Interface

-Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package
-4Gbit Mobile DDR SDRAM / 4Gbit NAND Flash

Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
K524G2GACB-A050 NAND SEC 1.8V 42ns
SDRAM 1.8V 200MHz

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 3. TECHNICAL BRIEF

3.12 H/W Sub System

3.12.1. RF Interface

3.12.1.1. RTR6285 (WCDMA_Tx, GSM_Tx/Rx)

MSM7227 controls RF part(RTR6285) using these signals.
-RTR6285_SSBI : SSBI I/F signals for control Sub-chipset
-RTR_TXON : Power AMP on RF part
-RTR_RX_I/Q_M/P, RTR_TX_I/Q_M/P : I/Q for T/Rx of RF
-RTR_DAC_REF : Reference input to the MSM Tx data DACs

3.12.1.2. the others

TRK_LO_ADJ : TCXO(19.2M) Control
PA_ON0/PA_RANGE0 : WCDMA(2100) TX Power Amp Enable
ANT_SEL[0-3] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)
GSM_PA_RAMP : Power Amp Gain Control of APC_IC

3.12.1.3. RF2815 (GPS LNA)

* GPS_LNA_EN : GPS LNA Enable Signal (GPS LNA Shutdown)

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3. TECHNICAL BRIEF

3.12.1.4. LBEH19UNBC-338 (BT / WiFi module )

WiFi
* WLAN_CMD : WLAN SDIO Command Line.
* WLAN_CLK : WLAN SDIO Clock Input.
* WLAN_SDIO[3:0] : WLAN SDIO Data Line.
* WLAN_RESET_N : Low asserting reset for WLAN core.
* WLAN_HOST_WAKEUP : WL_HOST_WAKEUP signal output.
BT
* BT_UART_RXD : Bluetooth UART Serial Input.
* BT_UART_RTS : Bluetooth UART Request to Send. Active-low request.
* BT_UART_CTS : Bluetooth UART Clear to Send. Active-low clear.
* BT_UART_TXD : Bluetooth UART Serial Output.
* BT_PCM_CLK : BT PCM clock, can be PCM-master (output) or PCM-slave (input).
* BT_PCM_DIN : BT PCM data input.
* BT_PCM_SYNC : BT PCM sync signal, can be PCM-master (output) or PCM-slave (input).
* BT_PCM_OUT : BT PCM data output.
* BT_WAKEUP : BT Wakeup Input.
* BT_HOST_WAKEUP : BT Host Wakeup Output
* BT_RESET_N : Low asserting reset for BT core.
Common
* WLAN_REG_ON : If low the internal regulators will be disabled.
* SLEEP_CLK : LPO clock (32.768kHz) input. Used for low-power mode timing.
* CLK_IN : Crystal amplifier input or frequency reference input.
* CLK_REQ : Crystal Circuit / Reference Clock Enable (active-high)
FM Radio
* FM_ANT : FM RF input.
* SLEEP CLK : External reference oscillator input. (32.768KHz)
* FM_R : Right audio line output – digital input data.
* FM_L : Left audio line output – digital frame synchronization.

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 3. TECHNICAL BRIEF

WiFi/BT/FM Radio Block Diagram

mt†y
spul†y†pw h|kpvY
mt†s 3.5䑀㢨
spul†s†pw h|kpvX FM_ANT Ear Jack
mt†hu{
~shu†ovz{†~hrl|w

lˆ™‘ˆŠ’
lˆ™‘ˆŠ’
nwpv`[ ~shu†ovz{†~hrl|w

~†~hrl†i
~shu†jtk
nwpv]Z zkpv†jtk

~shu†jsr
nwpv]Y zkpv†jsr hu{
~shu†yln†vu
nwpvYZ yln†vu

~shu†ylzl{†u
nwpv`Z ~s†yz{†u

~shu†zkpv‚ZaW„
nwpv‚][a]^„ zkpv‚ZaW„

LBEH19UNBC
MSM7227

i{†|hy{†{k
nwpv[] i{†|hy{†yk

i{†|hy{†yk
nwpv[\ i{†|hy{†{k

i{†|hy{†j{z
nwpv[[ i{†|hy{†yz{†u

i{†|hy{†y{z
nwpv[Z i{†|hy{†j{z†u

i{†ylzl{†u
nwpvXYZ i{†yz{†u

i{†wjt†z€uj
nwpv^W i{†wjt†z€uj SLEEP_CLK(LPO Clock:
32.768KHz)
i{†wjt†kpu
nwpv]` i{†wjt†v|{
z†jsr†pu
PM7540
i{†wjt†kv|{
nwpv]_ i{†wjt†pu
32.768KHz
i{†wjt†jsr
nwpv^X i{†wjt†jsr
i{†~hrl|w
nwpv[Y i{†nwpv†W CLK_IN 26MHz
m†jsr†pu
nwpv_Z
i{†ovz{†~hrl|w
i{†nwpv†X
TCXO

Figure. Wifi/BT/FM Interface Block Diagram

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3. TECHNICAL BRIEF

3.12.2 MSM Sub System

3.12.2.1. USIM Interface

SIM interface scheme is shown in Figure.
And, there control signals are followed
-USIM_CLK : USIM Clock
-USIM_Reset : USIM Reset
-USIM_Data : USIM Data T/Rx

3.12.2.2. UART Interface

UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.

GPIO_Map Name Note

GPIO_86 UART3_RX Data_Rx
GPIO_87 UART3_TX Data_Tx

Table. UART Interface

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 3. TECHNICAL BRIEF

3.12.2.3. HS-USB
The High-Speed USB module contains an embedded UTMI+ core with a built-in transceiver eliminating the
need for an external PHY. The HS-USB port is a standard 4-pin interface that connects directly to the USB
connector (USBPHY_DP, USBPHY_DN, USBPHY_ID and USBPHY_VBUS). Two additional pins are required for
PHY operations which include an external reference resistor pin (USBPHY_REXT) and a USB system clock pin
which the USB PHY uses to lock its internal PLL (SYS_CLK)

Figure. HS-USB connections and architecture

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3. TECHNICAL BRIEF

3.12.3 KEY

3.12.3.1 Side key

There are 3 side key buttons that are controlled by MSM7227.
Refer to the circuit.

CN3
R610 470 1
KEY_ROW[0] 2
R25 470
KEY_ROW[1] 3
R613 470
KEY_COL[2] 4

VA609 0603

VA610
VA1

Figure. Volume Side key

CN5

KPD_PWR_N 2
1
VA2

Figure. Power key

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 3. TECHNICAL BRIEF

3.12.3.3 KEY Backlight

There are 4 White side view LED, 4 white LED in key backlight circuit

+VPWR

LD1 LD4 LD3 LD2

R1174

R1172

R1173

R1175
1

1
BACKLIGHT_KEY

C1931
2.2u

Figure. KEY Backlight

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 3. TECHNICAL BRIEF

3.13 Audio and sound

3.13.1 Overview of Audio path
Audio Block Diagram

3.5Ȱ
qˆŠ’

1.8V LDO
RP103K181D

Figure. Block diagram of Audio & Sound path

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 3. TECHNICAL BRIEF

3.13.2. Audio signal processing & interface

3.13.2.1 MSM7227 audio interface

The MSM7227A audio front end comprises the stereo wideband codec, PCM interface, and additional DSP
audio processing. The stereo wideband codec allows the MSM7227 device to support stereo music/ringer
melody applications in addition to the 8 kHz voice band applications on the forward link.
In the audio transmit path, the device operates as 13-bit linear converter with software, selectable 8 kHz and
16 kHz sampling rate. In the audio receive path, the device operates as a software-selectable 13-bit or 16-bit
linear converter with software selectable 8 kHz,16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz
sampling rate. Through software, the Rx path can be configured as either a mono or stereo output. New to
the MSM7227 device is a transmit (Tx) ADC path that now supports stereo wideband sampling. The
integrated codec contains all of the required conversion and amplification stages for the audio front end. The
codec operates as a 13-bit linear codec with the transmit (Tx) and receive (Rx) filters designed to meet ITU-T
G.712 requirements.
The codec includes a programmable side tone path for summing a portion of the Tx audio into the Rx path.
An on-chip voltage/current reference is provided to generate the precise voltages and currents required by
the codec. This circuit requires a single capacitor of 0.1 μF to be connected between the CCOMP and GND
pins. The on-chip voltage reference also provides a microphone bias voltage required for electret condenser
microphones typically used in handset applications. The MICBIAS output pin is designed to provide 1.8 V DC
while delivering as much as 1 mA of current.
Audio decoder summing and headset switch detection are included. The codec interface includes the
amplification stages for both the microphone and earphone. On the transmit (Tx) path, the interface
supports two differential microphone inputs, a differential auxiliary input, and a stereo line input. On the
receive (Rx) path the interface supports one differential earphone output, a stereo single-ended headphone
output, one differential auxiliary output, and stereo single-ended line outputs. The codec is configured by
the codec SBI registers. The codec interface is shown in Figure.
Also part of the audio front end is the PCM interface. The PCM interface allows for an external codec to be
used instead of the internal codec. This interface can be used in I2S mode which will allows for an external
stereo DAC to be used. Finally, the audio front end includes additional DSP audio processing that does gains,
filtering and other audio processing.
The DSP audio processing is configured through the QDSP5000 command types and is
not directly controlled by the microprocessor.

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3. TECHNICAL BRIEF

Figure. Detailed diagram of MSM7227 audio interface

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 3. TECHNICAL BRIEF

3.13.2.2 WM9093 audio interface

The WM9093 is a high performance low power audio subsystem, including headphone driver and Class AB/D
earpiece/speaker driver. The Class D speaker driver support 650mV output power at 3.6V, 1%THD.
The unique dual mode charge pump architecture provides ground referenced headphone outputs removing
the requirement for external coupling capacitors. Class G technology is integrated to increase the efficiency
and extend playback time by optimizing the headphone driver supply voltages according to the volume
control.
The flexible input configuration allows single ended or differential stereo inputs. Mixers allow highly flexible
routing to the outputs, A ‘voice Bypass’ path is also available for low-power voice applications.
The WM9093 is controlled using a two-wire I2C interface. An integrated oscillator generates all internal clocks.
Removing the need to provide any external clock.
Separate mixer and volume controls are provided for each headphone and speaker driver. Automatic Gain
control limits the speaker output signal in order to prevent clipping. DC offset correction to less than 1mV
Guarantees a pop/click-free headphone start up.
The WM9093 is available in a 2.0mm × 2.5mm 20-bump CSP package.

Figure. Detailed diagram of WM9093 audio interface

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Only for training and service purposes
͑
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
3. TECHNICAL BRIEF

MIC
changed 12/28
MIC_BIAS

MIC1
1800
FB700 1
MIC_1P OUT
2
G1
3
1800 G2
FB701 4
MIC_1N G3
5
PWR
6
G4
2
C700 VA615C702 C703
33p 33p 33p
1

3.5pi Ear Jack Connector

VREG_MSMP_2.6V

U502

4 1
VIN VOUT 10.04.08 Changed Rev.C
3 2
PGND

HS_MIC_BIAS_EN STBY GND

C537 C538 VREG_MSMP_2.6V
10u 33p
5

C539
2.2u
Q601
R507

2.2K

EARJACK_SENSE
D

R1168

1M
R1169

47K

FB500
1800
FM_ANT M6_GND 2
R509 12
EAR_R
M1_R 3

FB501
1800 M4D-DETECT 6

R515 12 M3_DETECT 5
EAR_L
FB502 1800 M4_L 4
HS_MIC J2
M5_MIC 1

C542 C543 C544 C545

L504 R520 R521
47p 47p 33p 15p
270n 10K 10K
D500

D501

D502

D503

D504

EAR_SENSE STATE
LOW(DEFAULT) UNMATING
HIGH MATING

2009.11.16 added

LGE Internal Use Only - 58 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 3. TECHNICAL BRIEF

+VPWR_AUDIO

Audio SUB SYSTEM

10u
39p

1u
C505 47p

C502

C504
C503
C506 47p

D4
SVDD
C5
OUT+ SPK_RCV+
D5
OUT- SPK_RCV-
C507 1u C2
HPH_R IN1-
C508 1u C1
HPH_L IN1+
A2
C509 33n R1171 2.2K D2
IC500 HPL
A1
EAR_L
LINE_OP IN2- HPR EAR_R
C510 33n R1170 2.2K D1
LINE_ON IN2+

R1177 10 D3

0.1u

0.1u
C511 1u
RCV_P IN3-
R1176 10 C514 1u C3 B5
RCV_N IN3+ CPVDD
A3
CPVSS

C512

C513
A4
CP
VREG_MSMP_2.6V A5
CN
HPVDD
C515 2.2u
BIAS

GND
SDA
SCL

20

20
4.7K
4.7K

C518 C519
B3
B2

B1

C4

B4

R502

R503
2.2u 2.2u
R504
R505

C522 C523
AUDIO&MOTION_I2C_SCL
AUDIO&MOTION_I2C_SDA 2.2u 2.2u

VREG_HPVDD_1.8V

Copyright © 2010 LG Electronics. Inc. All right reserved. - 59 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.14 Display
LCD module is connected to Main PCB with 24-pin connector.
The LCD is controlled by MDDI Interface in MSM7227.

3.2" HVGA LCD Connector

VREG_LCD_1.8V VREG_LCD_2.8V

CN601
1 24

LCD_RESET_N
2 23
FL6031 5
P1 P5 MDDI_P_DATA_P
2 6
3 22 P2 P6 MDDI_P_DATA_M
3 7
P3 P7 MDDI_P_STB_P
4 8
4 21 P4 P8 MDDI_P_STB_M
LCD_MAKERID_LOW

G1
G2
5 20
9
10
LCD_VSYNC_O
6 19

7 18

8 17

WLED7 WLED6
9 16

WLED5 WLED4
10 15

WLED3 WLED2
11 14

WLED1 WLED_PWR
12 13
C616 C617
D600 2.2u 2.2u
6 1

5 2 C4
4.7u
4 3
ZD1

Figure. Schematic of LCD connector (Main Board)

LGE Internal Use Only - 60 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

͑
 3. TECHNICAL BRIEF

Table. Interface between LCD Module and MAIN Board

͑
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
Copyright
͑ © 2010 LG Electronics. Inc. All right reserved. - 61 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.15 Proximity Sensor

When call connected, the object is moved nearer to the proximity sensor.
LCD backlight and Touch screen is disable operation automatically.
U700 : GP2AP002S00F IC used I2C interface to MSM7227

VREG_MSMP_2.6V

VREG_PROX_2.8V

R701 R702 R700

4.7Kohms 4.7Kohms
U700 10
8 1 R703
PROX_COMPASS_I2C_SCL SCL LEDA
10
7 2 C705
PROX_COMPASS_I2C_SDA SDA LEDC
10u
6 3
VIO VCC

5 VOUT 4
GND PROX_OUT

C707 C708 C709

0.1u 4.7u
1u

Figure. Proximity Sensor Schematic

Figure. Proximity Sensor Block Diagram

LGE Internal Use Only - 62 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

͑
 3. TECHNICAL BRIEF

3.16 Vibrators (Q-Coin Motor)

The strength of vibration is determined by the duty cycle of PWM (LIN_PWM_FREQ)
U602 : EUSY0404001 is Q-Coin motor driver IC.

VREG_MOTOR_3.3V VREG_MOTOR_3.3V

R612 100K

1%
U602

BYPASS GND
C1 B2

_SHUTDOWN VO- MTR_P_2sub

B1 A1
R614 R615 R616
1% IN+ VO+ MTR_N_2sub
1%51K C2 B3
4.7Kohms 1K
R617
IN- VDD
1%51K C3 A3
C OUT
B Q600
LIN_PWM_FREQ IN
R618 1%
R619 100K
E GND 1%
1K C623
C625 10n C624

0.1u 0.1u

Figure. Q-Coin Moter IC Schematic

Figure. Vibrator Block Diagram

Copyright © 2010 LG Electronics. Inc. All right reserved. - 63 - LGE Internal Use Only
Only for training and service purposes

͑
3. TECHNICAL BRIEF

3.17 Compass Sensor

If a customer buy the application SW, The Sensor Support a Eletric Compass function
U1 : AMI304 IC used I2C interface to MSM7227

VREG_MOTION_3.0V VREG_MSMP_2.6V

C704

C706
10n

470n

U1
3
2
1

PROX_COMPASS_I2C_SCL
AVDD
GNDA
DVDD

4 12
SCL SDA PROX_COMPASS_I2C_SDA
5 11
NC1 DRDY COMPASS_DRDY
6 10
ADDR VPP
GNDS
VREG
INT
7
8

Figure. Compass Sensor Schematic

LGE Internal Use Only - 64 - Copyright © 2010 LG Electronics. Inc. All right reserved.
͑ Only for training and service purposes
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
͑
 3. TECHNICAL BRIEF

Figure. Compass Sensor Block Diagram

Copyright © 2010 LG Electronics. Inc. All right reserved. - 65 - LGE Internal Use Only
Only for training and service purposes
͑
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
3. TECHNICAL BRIEF

3.18 Motion Sensor

According to tilt the cell phone, the screen is had rotated automatically.
U503 : KR3DH IC used I2C interface to MSM7227

VREG_MOTION_3.0V

0.1u
C541
10u
C540

2.2K

2.2K
U503
14
15
16

R518

R519
VDD
RESERVED2
GND4

13 1
GND3 VDD_IO
12 2
GND2 NC1
11 3
MOTION_INT INT1 NC2
10 4
RESERVED1 SCL_SPC MOTION_I2C_SCL
9 5
SDA_SDI_SDO

INT2 GND1
SDO_SA0
CS
8
7
6

MOTION_I2C_SDA

Figure. Motion Sensor Schematic

Figure. Compass Sensor Block Diagram

LGE Internal Use Only - 66 - Copyright © 2010 LG Electronics. Inc. All right reserved.
͑ Only for training and service purposes
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
͑
 3. TECHNICAL BRIEF

3.19 Main Features

3.19.1. LG-P500h
LG-P500h Main Features

- DOP Type design

- UMTS 2100 + UMTS 1900 + UMTS 850 + GSM 900 + DCS 1800 + PCS 1900 + GSM850 based
GSM/GPRS/EDGE/UMTS
- HSDPA 7.2Mbps
- TFT Main LCD(3.2’ HVGA, 320 x 480)
- Capacitive/Electrostatic Touch Window
- 3M AF Camera
- 3.5Phi Stereo Headset & Speaker phone
- Mobile XMF –Mobile DLS / Scaleable Polyphony
- MP3/AMR/AAC/AAC/WAV/WMA decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth and HS-USB
- Supports WLAN(802.11b, 802.11g)
- Supports FM Radio
- 1500 mAh (Li-Ion)

Copyright © 2010 LG Electronics. Inc. All right reserved. - 67 - LGE Internal Use Only
Only
͑ for training and service purposes
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
͑
3. TECHNICAL BRIEF

3.19.2. LG-P500h
LG-P509 Main component (bottom)

WLAN
GPS

Logic

PMIC

RF

Main Board Bottom

LGE Internal Use Only - 68 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

͑
 3. TECHNICAL BRIEF

3.19.2. LG-P500h
LG-P509 Main component (bottom & Sub carrier)

Camera

SD memory
Vibrator
soket

Main Board Bottom & Sub carrier

Copyright © 2010 LG Electronics. Inc. All right reserved. - 69 - LGE Internal Use Only
Only for training and service purposes

͑
3. TECHNICAL BRIEF

3.19.2. LG-P500h
LG-P509 Main component (Top)

Power key

Side Volume key

Dome key

Main Board Top

LGE Internal Use Only - 70 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

͑
 3. TECHNICAL BRIEF

3.19.3. RF of LG-P500h

X200 FL1012

FL1003

FL1005
FL1006
FL1
U1001
U1003

FL1001
FL1009

FL2 FL1002
G

U1005 FL1010 U2 SW1001 FL1008 U1002

Reference Description Reference Description

U1001 RTR6285 FL1009 WCDMA (II) TX SAW Filter

U1002 GSM PAM/FEM module FL1012 WCDMA (II) RX SAW Filter

U1003 WCDMA PAM(I, V) FL1010 WCDMA (II) Duplexer

U2 External LNA(I, II ,V) FL1002 DCS/PCS RX Dual SAW Filter

X200 TCXO FL1001 EGSM/850 RX Dual SAW Filter

FL1006 WCDMA (I) TX SAW Filter U1005 WCDMA PAM(II)

FL1003 WCDMA (I) RX SAW Filter SW1001 RF Antenna connector

FL1008 WCDMA (I) Duplexer FL2 WCDMA (V) DuplexerG

FL1 WCDMA (V) RX SAW FILTER FL1005 WCDMA (V) TX SAW FILTER

Copyright © 2010 LG Electronics. Inc. All right reserved. - 71 - LGE Internal Use Only
Only for training and service purposes
͑
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
3. TECHNICAL BRIEF

3.19.4. BaseBand of LG-P500h

LG-P509

U602
U301

CN601

FL603

U601

U1007

CN200

U202 U503

Reference Description Reference Description

U301 Memory U1007 Charge pump

U200 MSM7227 U503 Motion sensor

U602 Q-coin Motor drive amp CN200 J-TAG CONN.

FL603 MDDI filter CN601 LCD CONN.

U601 Level shifter U502 GPS D flip-flop

LGE Internal Use Only - 72 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

͑
 3. TECHNICAL BRIEF

3.19.5. Power and Logic of LG-P500h

LG-P509

X400

U403

U1

J1

U404

Q400 CN401

Reference Description Reference Description

U403 PM7540 Q400 Charging IC

U1 Digital Compass CN401 Battery Conn.

J1 SIM connector X400 Sleep X-tal

U404 Fuel gauge IC

Copyright © 2010 LG Electronics. Inc. All right reserved. - 73 - LGE Internal Use Only
Only for training and service purposes

͑
3. TECHNICAL BRIEF

3.19.6. Audio of LG-P500h

LG-P509

CN1 IC500 CN600 U502

Reference Description Reference Description

CN1 Touch Conn. CN600 Camera conn.

CN2 Sub FPCB B2B conn. U502 Headset Bias LDO

IC500 Audio Sub system G

G G

LGE Internal Use Only - 74 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

͑
 XU{yv|islGzovv{punG
4. TROUBLE SHOOTING

͢͟ TROUBLE SHOOTING
4. TROUBLE SHOOTING

4.1 RF Component

X200
VCTCXO

FL1006
FL1005 FL1003 U1001 W2100 Tx saw filter
W850 Tx saw filter W2100 Rx saw filter
RF Transceiver

FL1
W850 Rx saw filter

U1003
W2100/W850
FL1012
W1900 Rx saw filter
PAM

U2 FL1002 FL1001
WCDMA LNA DCS/PCS EGSM/850

FL1009 FL2 Rx saw filter Rx saw filter

W1900 Tx saw filter W850 Duplexer

FL1008
FL1010
W2100 Duplexer
W1900 Duplexer U1002
U1005
FEM
W1900
SW1001
PAM
RF SW

G G

Copyright © 2010 LG Electronics. Inc. All right reserved. - 75 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G

FL1007
GPS Rx saw filter

U1004
GPS LNA

RF component (WCDMA / GSM)

Reference Description Reference Description

U1001 RTR6285(Transceiver) FL1001 EGSM/850 Rx saw filter

U1002 GSM TX Module U2 WCDMA (I, IV)

(FEM + GSM/EDGE PAM) LNA

U1003 WCDMA Dual (I,VIII) PAM U1005 WCDMA (IV) PAM

FL1006 WCDMA (I) TX SAW Filter X200 VCTCXO(19.2MHz)

FL1003 WCDMA (I) RX SAW Filter U1004 GPS LNA

FL1008 WCDMA (I) Duplexer FL1007 GPS SAW Filter

FL1009 WCDMA (IV) TX SAW Filter

FL1012 WCDMA (IV) RX SAW Filter SW1001 RF Antenna Connector

FL1010 WCDMA (IV) Duplexer

FL1002 DCS/PCS Rx saw filter

LGE Internal Use Only - 76 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G
4.2 SIGNAL PATH

WCDMA I and II and V Band TX Signal PATH

D2. WCDMA 2100 TX PATH
E2. WCDMA 1900 TX PATH
F2. WCDMA 850 TX PATH
G1. COMMON TX/RX PATH

Copyright © 2010 LG Electronics. Inc. All right reserved. - 77 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G

WCDMA I and II and V Band RX Signal PATH

D1. WCDMA 2100 RX PATH
E1. WCDMA 1900 RX PATH
F2. WCDMA 850 TX PATH
F1. COMMON TX/RX PATH

LGE Internal Use Only - 78 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G

GSM850/GSM900/DCS/PCS’s RX/TX Signal PATH

A. GSM850/GSM900/DCS1800/PCS1900 RX PATH
B. GSM850/GSM900/DCS1800/PCS1900 TX PATH
C. COMMON TX/RX PATH

Copyright © 2010 LG Electronics. Inc. All right reserved. - 79 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G

4.3 Checking TCXO Block

The output frequency (19.2MHz) of TCXO (X200) is used as the reference one of RTR6285 and PM7540 internal
VCO.

TP3
TP2

TP1

TP1
TP1
TCXO Circuit
VREG_TCXO_2.85V

C205 C206

1n 0.1u

R205 100
TP2 1
X200
3 C207 330p
RTR_TRK_LO_ADJ VCONT OUT TCXO_PM_19.2MHZ

2 4 C210 330p
C208 GND VCC TCXO_RTR_19.2MHZ
Clesed to TCXO
10n
19.2MHz TP3
KT3225L19200DCW28RA0
FFA Rev.C(220Ohm@100MHz)
1.0T VREG_MSMA_2.6V
R208 220

TP2
C220 0.1u

TCXO_EN
1
5
VCC
TP3
4 R209 33
U201 USBH_SYSCLK
C221 330p 2
GND

R210 100K

Schematic of the Crystal Part (19.2MHz)

LGE Internal Use Only - 80 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

Check TP1
VCC of TCXO

No
VCC ≥ 2.85V Check the PM7540

Yes

Check TP2

No
2.4V ≥ Voltage ≥ 0.4V Check the MSM7227

Yes

Check TP3

No Check soldering and

19.2 MHz Signal
components

Yes

TCXO is OK

Copyright © 2010 LG Electronics. Inc. All right reserved. - 81 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G
4.4 Checking GSM TX Module(GSM PAM + FEM) Block

ANT_SEL2

ANT_SEL1
ANT_SEL3

ANT_SEL0
VBATT(TP1)

LGE Internal Use Only - 82 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 XU{yv|islGzovv{punG G
4. TROUBLE SHOOTING
G

R1006
GSM_PA_RAMP
2.2K

C1024
39p

28
27
26
25
24
23
GND11
GND10
GND9
GND8
GND7
GND6
44
PGND16
43
PGND15
42
R6 PGND14
1 41
DCS_PCS_TX DCS_PCS_IN PGND13
47 2
GND1
DCS(1710-1785 MHz) 3
GSM_IN
7dB
130

130

4
R4

R5

PCS(1850-1910 MHz) VAPC

5 22
VBATT GND5
6 21
BS2 GND4
7
BS1
U1002 GND3
20
R7 8 19
GSM_TX _TXEN GND2
18
75 ANT
17
GSM850(824-849MHz) WCDMA3
29 16
R16

R15

11dB
91

91

GSM900(880-915MHz) PGND1 WCDMA2

30 15
PGND2 WCDMA1
31
PGND3
32
PGND4
2mm TP1 33
34
PGND5
40
PGND6 PGND12

PGND7
PGND8
PGND9
+VPWR_RF

MODE
39

TEMP
0603 PGND11

RX4
RX3
RX2
RX1
0603 C1045 1n 38
C1043 C1044 PGND10
1608

C1047 1n
10u 47p
9
10
11
12
13
14

35
36
37
C1048 1n
C1051 1n

ANT_SEL3
ANT_SEL2
ANT_SEL0
ANT_SEL1

TP1
Schematic of the Antenna Switch Block

Copyright © 2010 LG Electronics. Inc. All right reserved. - 83 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

Check ANT_SEL 0, 1, 2, 3
High Level

No
1.2V < Voltage < 3V Check the TP1(VBATT)

Yes

Check the Logic in each mode

LGE Internal Use Only - 84 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.5 Checking WCDMA Block

START

1. Check TCXO 19.2MHz

2. Check FEM Block

Refer to 1.4

3. Check RF Tx Level

4. Check PAM Block

Refer to 1.5.4

5. Check RF Level

6. Ro-download SW & Cal.

Copyright © 2010 LG Electronics. Inc. All right reserved. - 85 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G
4.5.1Checking TCXO Block

Refer to 1.3
4.5.2. Checking FEM Block

Refer to 1.4
4.5.3. Checking RF TX Level

TP4

TP3

TP2

TP1

Test Point (TX Level)

LGE Internal Use Only - 86 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

GND
3 4
G3 G4
1
ANT COMMON
2
SW1001

TP1 C1005 33p

L11 L1004
DNI 18n

WCDMA_1900_RTX

WCDMA_2100_RTX
28
27
26
25
24
23
WCDMA_850_RTX
GND11
GND10
GND9
GND8
GND7
GND6 44
PGND16
43
PGND15
42
PGND14
1 41
DCS_PCS_IN PGND13
2
GND1
3
GSM_IN
4
VAPC
5 22
VBATT GND5
6 21
BS2 GND4
7
BS1
U1002 GND3
20
8 19
_TXEN GND2
18
ANT
17
WCDMA3
29 16
PGND1 WCDMA2
30 15
PGND2 WCDMA1
31
PGND3
32
PGND4
33
PGND5
34 40
PGND6 PGND12
PGND7
PGND8
PGND9
MODE

39
TEMP

PGND11
RX4
RX3
RX2
RX1

38
PGND10
9
10
11
12
13
14

35
36
37

Near to 12 Pin Near to 4 PinNear to 12 Pin

+VPWR_RF

TP2 C1079
6
FL2

1 C12
C1075
0.001uF
C1076
330p
C1077
10u

ANT RX

TP4
100p
8.2p
DNI 3 L1130

TP3
L1021 TX
C1081 18n
6.8n
2
GND1 GND6
8
5
FL1005
W850
U1003 L1025 C1153 C1084
4 9 C1078 C1083 GND
GND2 GND5 14 1 4 1
5 7 OUT_BAND_V IN_BAND_V OUT IN
3n
GND3 GND4 13 2
33p 1.5n G2 G1
22p
12
GND3 VMODE_0
3
PA_R0 3 2
33p WCDMA_850_TX_OUT
VCC2_2 VMODE_1 PA_R1 C1086
11 4 L1026
L1020 GND2 VCC2_1
836.5 MHz,881.5 MHz L1022 10 5 DNI DNI
DNI OUT_BAND_I VEN_BAND_V PA_ON1
10n 836.5MHz
Band 5
9 6
PGND2
PGND1

WCDMA_850_RTX

TP4
GND1 VEN_BAND_I
R1022 R1023 8 7
CPL_OUT IN_BAND_I PA_ON0
33 18

TP2
PDET_IN FL1006
16
15

TP3 W2100
3
C1929 C1096 C1087 L1027 3.3n C1088
C1094 C1095 G3
R1163

4 1
DNI

FL1008 OUT IN
C1090
R1178

G2 G1 15p
6 1 C1089
100p 100p 100p 100p 33p WCDMA_2100_TX_OUT
ANT RX
0

5 2
12p 1950MHz
3 3.3p L1030 C1092
TX
L1035 L1031 L1033 DNI 1.5n
L1029
2.7n DNI
R11

2 9 DNI
15

GND1 GND6 5.6n

4 8
GND2 GND5 +VPWR_RF
5 7
GND3 GND4
Near to 10 Pin Near to 1 Pin
C13
WCDMA_2100_RTX

Band I
100p

L1120
TP3 L1040 C1102 C1103 C1104
DNI 2.2u 33p 1n

TP4 W1900
2.4n U1005
11
C1111 C1112 PGND FL1009
10 1 3
L1151 C1154

TP2
1.5p 1.5p VCC2 VCC1
9 2 C1108 33p 4
G3
1 C1109
RFOUT RFIN OUT IN
8 3 3n 4.7n
CPL_IN VMODE_1 PA_R1 G2 G1 33
L1041 FL1010 7 4 5 2 WCDMA_1900_TX_OUT
6 1 GND VMODE_0 PA_R0
6 5 L1150 C1110
WCDMA_1900_RTX ANT RX CPL_OUT VEN PA_ON2
1.5n DNI 1880MHz 100
3
C1113 C1114 C1115
R1027

TX
49.9

C1117 100p 100p 100p

C1116 2 9
DNI 0.5p
4
GND1
GND2
GND6
GND5
8 WCDMA 1900 Tx (1850-1910MHz)
5 7
GND3 GND4 0603
1880,1960MHz

Band 2

Copyright © 2010 LG Electronics. Inc. All right reserved. - 87 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

For testing, Max power output is needed.

Check ANT_SEL 0, 1, 2
(High, Low, Low)

Yes
Check TP1 Over 21dBm? RF Tx Level is OK

No

Yes
Check TP2 Over 21dBm? Check TX Module

No

Yes
Check TP3 Over 21dBm? Check Duplexer

No

Yes
Check TP4 Over 7dBm? Check RTR6285

No

Check PAM Block

Refer to 1.5.4

RTR6285 Maximun output Power = 7dBm

RTR6285 minimun output Power = -80dBm

LGE Internal Use Only - 88 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G
4.5.4. Checking PAM Block

PAM control signal

W_PA_ON (W_1900_PA_ON(C1115), W_2100_PA_ON(C1095) and W_850_PA_ON(C1096)) :

PAM Enable

W_PA_RO: PAM Gain Control

W_PA_ON must be HIGH (over 2.6V)

Copyright © 2010 LG Electronics. Inc. All right reserved. - 89 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G
PAM IN/OUT Signal :

When PAM is under the operation of high power mode (WCDMA_PA_R0(C1929):Low),

PAM OUT power must be over 21 dBm

PAM IN power must be under 10 dBm

TP2

TP3

TP1

LGE Internal Use Only - 90 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

Near to 12 Pin Near to 4 PinNear to 12 Pin

+VPWR_RF

TP3 C1079
6
FL2

1 C12
C1075
0.001uF
C1076
330p
C1077
10u

ANT RX
100p
8.2p
DNI 3 L1130

TP2 TP1
L1021 TX
C1081 18n
6.8n
2
GND1 GND6
8
5
FL1005
W850
U1003 L1025 C1153 C1084
4 9 C1078 C1083 GND
GND2 GND5 14 1 4 1
5 7 OUT_BAND_V IN_BAND_V OUT IN
3n
GND3 GND4 13 2
33p 1.5n G2 G1
22p
12
GND3 VMODE_0
3
PA_R0 3 2
33p WCDMA_850_TX_OUT
VCC2_2 VMODE_1 PA_R1 C1086
11 4 L1026
L1020 GND2 VCC2_1
836.5 MHz,881.5 MHz L1022 10 5 DNI DNI
DNI OUT_BAND_I VEN_BAND_V PA_ON1
10n 836.5MHz
Band 5
9 6

PGND2
PGND1
WCDMA_850_RTX GND1 VEN_BAND_I
R1022 R1023 8 7

TP1
CPL_OUT IN_BAND_I PA_ON0
33 18

TP3
PDET_IN FL1006

16
15
C1094 C1929 C1096 C1095
C1087 L1027 3.3n
G3
3
C1088 W2100

R1163
4 1

DNI
FL1008 OUT IN
C1090

R1178
G2 G1 15p
6 1 C1089
100p 100p 100p 100p 33p WCDMA_2100_TX_OUT
ANT RX

0
5 2
12p 1950MHz
3 3.3p L1030 C1092
TX
L1035 L1031 L1033 DNI 1.5n
L1029
2.7n DNI

R11
2 9 DNI

15
GND1 GND6 5.6n
4 8
GND2 GND5 +VPWR_RF
5 7
GND3 GND4
Near to 10 Pin Near to 1 Pin
C13
WCDMA_2100_RTX

100p

Band I L1120 L1040 C1102

2.2u
C1103
33p
C1104
DNI 1n

TP1
2.4n U1005

C1111 C1112
11
10
PGND
1
FL1009
3
W1900
L1151 C1154

TP3
1.5p 1.5p VCC2 VCC1
9 2 C1108 33p 4
G3
1 C1109
RFOUT RFIN OUT IN
8 3 3n 4.7n
CPL_IN VMODE_1 PA_R1 G2 G1 33
L1041 FL1010 7 4 5 2 WCDMA_1900_TX_OUT
6 1 GND VMODE_0 PA_R0
6 5 L1150 C1110
WCDMA_1900_RTX ANT RX CPL_OUT VEN PA_ON2
1.5n DNI 1880MHz 100
3
C1113 C1114 C1115

R1027
TX

49.9
C1117 100p 100p 100p
C1116 2 9
DNI 0.5p
4
GND1
GND2
GND6
GND5
8 WCDMA 1900 Tx (1850-1910MHz)
5 7
GND3 GND4 0603
1880,1960MHz

Band 2

Copyright © 2010 LG Electronics. Inc. All right reserved. - 91 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

Set the phone Tx is On and

PDM is 210

Yes
Check TP3 Over 21dBm? RF Tx Level is OK

No

Yes
Check TP2 PA_RO ≥ 2.6V Check MSM7227

No

Yes
Check TP1 Over 10 dBm? Check RTR6285

No

Change the board

LGE Internal Use Only - 92 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
4.5.5. Checking RF Rx Level

4.5.5. Checking RF Rx Level

Bias

TP5

TP4

TP3

TP2

TP1

Test Point (RF Rx Level)

Copyright © 2010 LG Electronics. Inc. All right reserved. - 93 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

ANT1002
GND
3 4
ANT1003 G3 G4
1
ANT COMMON
2
SW1001

R1004
TP1
C1003

3.3n C1005 33p

15p
C1009
R1005
8.2n
C1007 0.75p
L11 L1004
100p
DNI 18n

R1006
GSM_PA_RAMP
2.2K

C1024
39p

28
27
26
25
24
23
GND11
GND10
GND9
GND8
GND7
GND6
44
PGND16
43
PGND15
42
R6 PGND14
1 41
DCS_PCS_TX DCS_PCS_IN PGND13
47 2
GND1
DCS(1710-1785 MHz) 3
GSM_IN
7dB
130

130

4
R4

R5

PCS(1850-1910 MHz) VAPC

5 22
VBATT GND5
6 21
BS2 GND4
7
BS1
U1002 GND3
20
R7 8 19
GSM_TX _TXEN GND2
18
75 ANT
17
GSM850(824-849MHz) WCDMA3
29 16
R16

R15

11dB
91

91

GSM900(880-915MHz) PGND1 WCDMA2

30 15
PGND2 WCDMA1
31
PGND3
32
PGND4
33
2mm 34
PGND5
40
PGND6 PGND7 PGND12
PGND8
PGND9
+VPWR_RF
MODE

39
TEMP

0603 PGND11
RX4
RX3
R X2
RX1

0603 C1045 1n 38
C1043 C1044 PGND10
1608

C1047 1n
10u 47p
9
10
11
12
13
14

35
36
37

C1048 1n
C1051 1n

ANT_SEL3
ANT_SEL2
ANT_SEL0
ANT_SEL1

FL2
TP2 C1079
6 1 C12
ANT RX
100p
8.2p
DNI 3 L1130
L1021 TX
C1081 18n
6.8n
2 8
GND1 GND6
4 9
GND2 GND5
5 7
GND3 GND4

836.5 MHz,881.5 MHz

WCDMA_850_RTX
Band 5

TP2 C1090
6
FL1008
1
ANT RX
12p
3
TX
L1035 L1031
2.7n DNI 2 9
GND1 GND6
4 8
GND2 GND5
5 7
GND3 GND4
C13
WCDMA_2100_RTX

100p

Band I L1120
DNI

TP2 L1041
6
FL1010
1
WCDMA_1900_RTX ANT RX
1.5n
3
TX

C1117 C1116 2 9
DNI 0.5p GND1 GND6
4 8
GND2 GND5
5 7
GND3 GND4

1880,1960MHz

Band 2

LGE Internal Use Only - 94 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

VREG_TCXO_2.85V

0603
C20 R14
R9

10n 0 DNI
TP4 L1042
RX_WCDMA_1900_M
5.6n
5

1
2 3
C15 FL1012
G1 O1
RFGNDH2

RFGNDH1

VCC

VGS

NC
1
LNA_GAIN_CONTROL IN C1122 C1123
G2 O2
4.7p 1.2p DNI
6 17 C1128 5 4
C1728

C27 TP3 7
RFINM

RFINH
BGA735L16RFOUTM
PGND

16
L10 DNI DNI
1960MHz L1048
RX_WCDMA_1900_P
2.2n 5.6n
10p U2 R24 C28
C25

TP3
8 15 C10
L9 RFGNDM1 RFOUTH RX_WCDMA_2100
12p

TP4
22p 10n 33p 3.3n
9 14
RFGNDM2 RFOUTL L6 R12
L5 RX_WCDMA_1900_SE
2.7n DNI
TP4
3.3n
C36
RFINL

RREF
VEN2

VEN1

C23
RX_WCDMA_850_P
10p
1.2p
10

11

12

13

C22
R18 5 4
L7 C14
22p
TP3
R10

L4000 L8
0

G2 O2
L2 27K IN DNI
1n 1 G1 O1 22n
27p FL1
C24 2 3
8.2n C1148 C1928 881.5MHz C37
R8
0

0.5p DNI RX_WCDMA_850_M

22p C26
1.2p
2.7p INTER_RX_SW_SEL_1

INTER_RX_SW_SEL_2

Bias
VDD_RX
0.1u

100p

1K
C1067

C1068

L1017 L1018
R1019

2n C1069 3.9p
WB2100_MIX_INM
0603

1.8n

2 3
FL1003
C1071 33p C1072 33p 1 G1 O1
RX_WCDMA_2100_LNA_OUT
W2100 RX(2110 - 2170 MHz)
IN C1070
G2 O2
DNI
5 4
R1029
DNI C1073

R1021
DNI
C1080 3.9p
L1019
TP5
RX_WCDMA_1900_LNA_OUT 2140MHz WB2100_MIX_INP
DNI 1.8n

Copyright © 2010 LG Electronics. Inc. All right reserved. - 95 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

Set the phone Rx is On

No
Check BIAS over 2.1V Check bias block soldering

Yes

No
Check TP1 Signal exist? Check RF Switch (M/S)

Yes

No
Check TP2 Signal exist? Check TX Module Refer 1.4

Yes

No
Check TP3 Signal exist? Check Duplexer

Yes

No
Check TP4 Signal exist? Check LNA

Yes

No
Check TP5 Signal exist? Check RTR6285 and Rx SAW filter

Yes

Change the board

LGE Internal Use Only - 96 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.6 Checking GSM Block

Start

1. Check TCXO Block

2. Check ANT_SW Module

3. Check RF TRX Level

4. Ro-download SW & Cal.

Copyright © 2010 LG Electronics. Inc. All right reserved. - 97 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G

2,3

LGE Internal Use Only - 98 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G
4.6.1 Checking TCXO Block

Refer to 1.3

4.6.2 Checking FEM Block

Refer to 1.4

4.6.3 Checking RF TX level

TP2

TP3
TP1

Copyright © 2010 LG Electronics. Inc. All right reserved. - 99 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

ANT1002
GND
3 4
ANT1003 G3 G4
1
ANT COMMON
2
SW1001

R1004 C1003

3.3n
TP1C1005 33p
15p
C1009
R1005
8.2n
C1007 0.75p
L11 L1004
100p
DNI 18n

R1006
GSM_PA_RAMP
2.2K

C1024
39p

28
27
26
25
24
23
GND11
GND10
GND9
GND8
GND7
GND6
44
PGND16
43
PGND15
R6
TP3 1
PGND14
42
41
DCS_PCS_TX DCS_PCS_IN PGND13
47 2
GND1
DCS(1710-1785 MHz) 3
GSM_IN
7dB
130

1 30

4
R4

R5

PCS(1850-1910 MHz) VAPC

5 22
VBATT GND5
6 21
BS2 GND4
U1002
R7
TP2 7
8
BS1 GND3
20
19
GSM_TX _TXEN GND2
18
75 ANT
17
GSM850(824-849MHz) WCDMA3
29 16
R16

R15

11dB
91

91

GSM900(880-915MHz) PGND1 WCDMA2

30 15
PGND2 WCDMA1
31
PGND3
32
PGND4
33
2mm 34
PGND5
40
PGND6 PGND12
PGND7
PGND8
PGND9

+VPWR_RF
MODE

39
TEMP

0603 PGND11
RX4
RX3
RX2
RX1

0603 C1045 1n 38
C1043 C1044 PGND10
1608

C1047 1n
10u 47p
9
10
11
12
13
14

35
36
37

C1048 1n
C1051 1n

ANT_SEL3
ANT_SEL2
ANT_SEL0
ANT_SEL1

Schematic of GSM/DCS/PCS Tx Block

LGE Internal Use Only - 100 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

Check TCXO Block Refer to 1.3

No
Check TP1 Yes GSM/DCS/PCS Tx is OK
If GSM over 31 dBm?
If DCS/PCS over 28 dBm? Check other part
No

Check TP2, 3 Yes Check ANT SW Block (ASM+EDGR PAM)

If GSM(TP2) under 6 dBm?
If DCS/PCS(TP3) over 6 dBm? Refer to 1.4
No

No Problem
Check RTR & PAD Check soldering and components

Still exist Problem

Change the board

Copyright © 2010 LG Electronics. Inc. All right reserved. - 101 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G
4.6.4 Checking RF Rx Block

TP2

TP1

LGE Internal Use Only - 102 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

GND
3 4
G3 G4
1

TP2
ANT COMMON
2
SW1001

TP1
C1005 33p
C1004
RX_GSM_850_P
2.2p
L1002
L11 L1004 DNI L1003 L1005
DNI 18n 82n 18n GSM(869-894 MHz)
C1014 FL1001
4 7
IN_881_5 OUT_881_5_1 C1016
33p 6
OUT_881_5_2
9
RX_GSM_850_M
2.2p
C1021 OUT_942_5_1
WCDMA_1900_RTX 1 8
IN_942_5 OUT_942_5_2 C1023
33p RX_GSM_900_P
WCDMA_2100_RTX 2
GND1 GND3
5
4.7p
3 10
L1006 GND2 GND4 GSM(925-960 MHz)
28
27
26
25
24
23

WCDMA_850_RTX 881.5MHz,942.5MHz L1008 L1007

DNI
82n 18n
GND11
GND10
GN D 9
GND8
GND7
GND6

44
PGND16
43
PGND15 C1025
42
PGND14 RX_GSM_900_M
1 41
DCS_PCS_IN PGND13 4.7p
2
GND1
3
GSM_IN
4
VAPC
5 22
VBATT GND5 C1036
6 21
BS2 GND4 RX_DCS_P
7
BS1
U1002 GND3
20 5.6n
8 19 L1009
_TXEN GND2 DCS(1805-1880 MHz)
18 27n L1011 L1010
ANT
17 0.5p 22n
WCDMA3 FL1002
29 16 C1039
PGND1 WCDMA2 33p 4 7
30 15 IN_1842_5 OUT_1842_5_1 C1040
PGND2 WCDMA1 6
31 OUT_1842_5_2 RX_DCS_M
PGND3 9 5.6n
32 OUT_1960_1
PGND4 C1041 33p 1 8
33 IN_1960 OUT_1960_2
PGND5
34 40
PGND6 PGND12 C1042
PGND7
PGND8
PGND9

2 5
MODE

39
TEMP

GND1 GND3
PGND11 L1012 RX_PCS_P
RX4
RX3
RX2
RX1

3 10
38 GND2 GND4
PGND10 DNI 1842.5MHz,1960MHz 6.8n
9
10
11
12
13
14

35
36
37

L1014
L1013 PCS(1930-1990 MHz)
DNI
12n

C1052

RX_PCS_M
6.8n

Schematic of GSM/DCS/PCS Rx Block

Copyright © 2010 LG Electronics. Inc. All right reserved. - 103 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

Set the phone Rx is On

No
Check TP1 Signal exist? Check RF Switch (M/S)

Yes

No
Check TP2 Signal exist? Check FEM Block Refer 1.4

Yes

Change the board

LGE Internal Use Only - 104 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G
4.7 GPS/WIFI/BT RF Component

ANT1005

ANT1006

FL1007

U1004

RF Component(GPS)

Reference Description
ANT1005 ANTENNA PAD
connected to Carrier type antenna
ANT1006 GND PAD
FL1007 GPS SAW FILTER
U1004 GPS LNA

Copyright © 2010 LG Electronics. Inc. All right reserved. - 105 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G

"/5

"/5

6

RF component (WiFi / BT )

Reference Description
ANT1 ANTENNA PAD
connected to Carrier type antenna
ANT2 GND PAD
U500 WiFi / BT module

LGE Internal Use Only - 106 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G
4.8 GPS/WIFI/BT SIGNAL PATH

GPS Signal PATH (main board bottom)

GPS Rx PATH

Copyright © 2010 LG Electronics. Inc. All right reserved. - 107 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G

WiFi / BT Signal PATH

WiFi / BT Tx and Rx PATH

LGE Internal Use Only - 108 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G
4.9 GPS/WIFI/BT Trouble shooting
4.9.1 A-GPS Block

TP2

TP1

Copyright © 2010 LG Electronics. Inc. All right reserved. - 109 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

DIVERSITY_IN

L1028
ANT1005 ANT1006 C1091 FL1007
1 3
4
IN
OUT
6 5.6n Near To LNA
47p G
OUT_NON

L1034 L1032
TP1L1036
G1

G2

C1093 C1097
DNI DNI R1025
2

L12 DNI DNI VREG_RF_2.7V

100p 3.3n 12
C1098 C1099
18p 0.1u

1
RF_IN
L1039
GND VDD 100p
R1026 3 5
GPS_MODE 2
S_D FIL_OUT
4
GPS_IN
1K
TP2 U1004
C1107 C1105
C1106
6.8p DNI
8.2n

Schematic of the A-GPS block

Set the phone GPS is ON

No
Check TP1 About 2.7V? Check power LRC filter soldering

Yes

No
Check TP2 About 2.6V? Check SW and NV item

Yes

Change the board

LGE Internal Use Only - 110 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G
4.9.2 WLAN/BT/FM Block

START

1. Check the Power

2. Check the Clock

3. Check the Module

Component Change

Copyright © 2010 LG Electronics. Inc. All right reserved. - 111 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

Wi-Fi&BT&FM MODULE
Must Check Schematic
ANT2
C17 ANT1

RF_IN_OUT
47p
L4 C16
DNI
DNI TP13
WLAN_HOST_WAKEUP
TP11
BT_UART_RXD
TP3
BT_UART_RTS
TP1
BT_UART_CTS
TP9
BT_UART_TXD

54
53
52
51

50
49
48
47
46
GND1
GND2
GND3
GND4

WL_HOST_WAKE_B
BT_UART_TXD
BT_UART_CTS_N
BT_UART_RTS_N
BT_UART_RXD
1
RF_IN_OUT ANT
45
BT_PCM_CLK BT_PCM_CLK
2 44
close to 3 3
GND5 BT_PCM_OUT
43
BT_PCM_DIN
VDD_WL_PA BT_PCM_SYNC BT_PCM_SYNC
42
BT_PCM_IN BT_PCM_DOUT
TP8 4
C18 C32 WLAN_CMD SDIO_CMD
0603

TP7 5 41
10uF 0.1u WLAN_CLK SDIO_CLK VDD_BT_PA VREG_MSMP_2.6V
6
WLAN_SDIO[3] SDIO_D3
7 40
WLAN_SDIO[2]
8
SDIO_D2 U500 S_CLK_IN
39
SLEEP_CLK C7 C9

WLAN_SDIO[1] SDIO_D1 GND6 8pF 2.2u

9 38 C1 0.001uF
WLAN_SDIO[0] SDIO_D0 FM_ANT FM_ANT

TP4 10 37 TP5
WLAN_RESET_N WL_RST_N BT_GPIO_0 BT_WAKEUP
11 36 TP12
WL_WAKE_B BT_GPIO_1 BT_HOST_WAKEUP
TP10 12 35
R1 WLAN_REG_ON REG_ON BT_GPIO_3
13 34
+VPWR VBAT_IN BT_GPIO_4
L1 33
0 BT_GPIO_7
C34 4.7uF 14
SR_VLX1
3.3uH 15 32
C5 C2 SR_VLX1BB F_CLK_IN CLK_IN
31
4.7uF 0.1uF F_CLK_OUT
ANLG_1P2_OUT
DIG_1P2_OUT

VIN_1P2VLDO
LNLDO2_OUT
SR_VOUTBB
SR_VLX2BB

VDDIO_SD

BT_RST_N
XTAL_PU

BT_SDA
BT_SCL
AUDIO1
AUDIO2
VDDIO

GND7
L3
4.7u
16
17

18

19

20

21
22
23
24

25
26
27
28
29
30
0603

C31 C8
TP6
BT_RESET_N
0603

1u
0.1u
FM_R
VREG_MSMP_2.6V
FM_L

C19
close to 17
10uF

C30
C33 C6
0603

4.7uF 2.2uF
0.1u
CLK_REQ

+VPWR
TCXO LDO 26MHz TCXO
VDD_TCXO

U501

4 1
VIN VOUT VDD_TCXO 26MHz
3 2
PGND

X500
CLK_REQ STBY GND
VCC GND
4 2
100K

C535 1n
2.2u

C533
0603

CLK_IN OUT NC
1u
0603

3 1
0603 TG-5010LH-87N
C534
R506

C536
0603
1u

[Figure] Schematic of WiFi/BT module

LGE Internal Use Only - 112 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G

TP2

TP1
TP3

΅ΖΤΥ͑ΡΠΚΟΥ͑͵ΖΤΔΣΚΡΥΚΠΟ

΅ΖΤΥ͑ΡΠΚΟΥ ͿΖΥ͑ΟΒΞΖ ͵ΖΤΔΣΚΡΥΚΠΟ

΅΁͢ ͜·΁Έ΃ ΁ΠΨΖΣ͑ΗΠΣ͑ͳ΅͠ΈΚͷΚ͑ͳͳ͑ΔΠΣΖ͑ΒΟΕ͑ΈΚͷΚ͑ΡΠΨΖΣ͑ͲΞΡ͙͑͟·͑ͳΒΥΥ͚
΅΁ͣ ·΃Ͷ͸ΐ;΄;΁ΐͣͧ͟· ΁ΠΨΖΣ͑ΗΠΣ͑ͳ΅͑ΡΠΨΖΣ͑ͲΞΡ͙͑ͣͧ͟͟·͚
΅΁ͤ ·΃Ͷ͸ΐ;΄;΁ΐͣͧ͟· ΁ΠΨΖΣ͑ΗΠΣ͑ΙΠΤΥ͑ΚΟΥΖΣΗΒΔΖ͙͑ͣͧ͟·͚

Copyright © 2010 LG Electronics. Inc. All right reserved. - 113 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

START

No
TP1 1, 2, 3 is OK? Check the power block

Yes

SDIO OK? Yes

Module check
UART OK?

No

Board change

LGE Internal Use Only - 114 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

XU{yv|islGzovv{punG G
G
Main clock part
Main clock part
+VPWR TCXO LDO 26MHz TCXO
TP1 VDD_TCXO

U501
TP2
TP1 4
3
VIN VOUT
1
2
VDD_TCXO X500
26MHz
PGND

CLK_REQ STBY GND

VCC GND
TP2
C535 1n
4 2
100K

5
2.2u

C533 CLK_IN OUT NC

0603

3 1
1u
0603

0603 TG-5010LH-87N
C534
R506

C536
0603
1u

TP2

TP1

CLK_IN

Copyright © 2010 LG Electronics. Inc. All right reserved. - 115 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING XU{yv|islGzovv{punG G
G

{j TG ZWWWiGOi“œŒ›––›G{Œš›Œ™PG
{j T ZWWWiGOi“œŒ›––›G{Œš›Œ™PG

- Bluetooth RF Test procedure

1. Set phone to Bluetooth test-mode.

- Blue tooth ON: Enter Test Mode(277634#*#) Æ Module test set Æ BT DUT Æ BT DUT ON
2. Insert a phone in a TEMCELL (in case of radiation test)
3. Set ‘discover’ after push menu button of the tester and select the link analyzer.
4. After ‘set test mode’, confirm the connection state.
5. Measure the power of full channel after hopping mode is selected to ‘ON’
6. You can select wanted test cases after getting an optimized power
7. Blue tooth On/Off
- Menu KeyÆsettingsÆWireless controlsÆBluetoothÆTurn on/Turn off

LGE Internal Use Only - 116 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.10 Power ON Troubleshooting

Power On sequence of P500h
P509 is :
Power key press Æ KPD_PWR_N go to low Æ PM7540 Power Up Æ VREG_MSMC1_1.2V(C433),
VREG_MSMC2_1.2V(C434), VREG_MSME_1.8V(C435), VREG_MSMP_2.7V(C453), VREG_MSMA_2.6V(C452),
VREG_TCXO_2.85V(C457) power ON Æ Phone booting and PS_HOLD(D404) go to High

z›ˆ™›G
START

Battery voltage higher than No uv

iˆ››Œ™ G–“›ˆŽŒUGŽŒ™G jˆ•ŽŒG–™GŠˆ™Ž•ŽG›ŒG
Change or charging the Battery G
3.70V(OCV)?
›ˆ•GZU^W}Ovj}Pf iˆ››Œ™
Yes
€lz
No
VA20 hight to low when key pness? uv Check correctly working powerkey
}hYWGŽG›–G“–ž
XUGjŒŠ’GŠ–™™ŒŠ›“ Gž–™’•ŽG G
Yes
žŒ•G’Œ G—™Œššf G G G —–žŒ™G’Œ G G G G

VMSMC1_1.2V, VMSMC2_1.2V, No
€lz
VMSMP_2.6V, VMSME_1.8V, VTCXO_2.85V, Change the Main board
VMSMA_2.6V power up?
}tztjX†XUY}SG}tztjY†XUY}SG
Yes uv
}tztw†YU]}SG}tztl†XU_}SG G
jˆ•ŽŒG›ŒGtˆ•G‰–ˆ™‹G
is}{jv†YU_\}SG
clock OK? GG No
Change the Main board
X1:19.2M
}tzth†YU]}G—–žŒ™Gœ—fG
Yes
€lz
uv
Redownload SW image
pšGŠ“–Š’G–’fG
XGaGX`UYtG jˆ•ŽŒG›ŒGtˆ•G‰–ˆ™‹G

€lz

yŒ‹–ž•“–ˆ‹GšžG”ˆŽŒG

Copyright © 2010 LG Electronics. Inc. All right reserved. - 117 - LGE Internal Use Only
Only for training and service purposes

͑
4. TROUBLE SHOOTING

TP1 : KPD_PWR_N go to low

͑ Internal Use Only

LGE - 118 - Copyright © 2010 LG Electronics. Inc. All right reserved.
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑ Only for training and service purposes
͑
 4. TROUBLE SHOOTING

PS_HOLD

VTCXO_2.85V
VMSMP_2.6V

VMSME_1.8V
VMSMA_2.6V

VMSMC1_1.2V

VMSMC2_1.2V

͑
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
͑

Copyright © 2010 LG Electronics. Inc. All right reserved. - 119 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.11 Charging Trouble shooting

u-USB Connector
TA OVP Circuit
REV.E_CHANGED_0517

VCHG_VBUS
CN4

6
FL400 U400

2mm
7
8
1
VBUS 2mm 1
IN OUT
1
IN1 OUT1
7 2mm
2 2 8
MAX_DM GND1 GND2 IN2 OUT2
3
MAX_DP 4
4 IC1
USB_ID 3 5
5 OVLO IC2

PGND
GND
9

22p

1u
D400

1u
10
C402
ZD400

6
9
11
22p

C403

C404
FL1013

C405
6

TA
P6

2 4
P2 P4
1 3

(5.1V)
P1 P3
5 P5

10.04.08 Changed Rev.C

ISNS_P
VCHG_VBUS
R400

Q400
0.1

Main ISNS_M
DRAIN_B
10
2mm
1% 1 9
Battery 2
NC1
COLLECTOR
COLLECTOR_B
EMITTER
8
3 7
+VPWR SOURCE BASE CHG_CTL_N
4 6
VBAT DRAIN NC2
5
GATE BATT_FET_N
+VPWR_RF|+VPWR

2mm +VPWR_RF C407

100u
C408
10n
1608
C409 10V
1608
10u 2009.11.16 changed

Charging Current Flow

Charging Procedure Troubleshooting Setup

- Connect TA or u-USB Cable - Connect TA and battery to the phone
- Control the charging current by PM7540 IC
- Charging current flows into the battery

Check Point Troubleshooting Procedure

- Connection of TA or USB Cable - Check the charger (TA or USB Cable) connector
- Charging current path(NUS5530MIN) - Check the OVP Circuit
- Battery - Check the charging current Path
- Check the battery

LGE Internal Use Only - 120 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

Check the pin and battery

Connect terminals of I/O connector

No
Connection OK? Change I/O connector

Yes

Is the u- USB Cable) No

voltage 4.8V (or 5.0V)? Change TA (or u-USB cable)

Yes

Is it charging properly Yes

After turning on? END

No

Check PMIC SMT status by X-ray

Exchange PMIC or Change the main
board and Retest

Charger Troubleshooting Flow

Copyright © 2010 LG Electronics. Inc. All right reserved. - 121 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4. 12 3M AF Camera trouble
3M camera control signals are generated by ISX005 and MSM7227.

START

Check the camera Conn.

and reconnect the camera

Yes
Camera is OK? END

No

No MSM 7227 output signal check

MCLK(TP1), PCLK(TP2),
Reset(TP3), Standby(TP4)
Yes

No Check IOVDD(TP5),
DVDD(TP6), AVDD(TP7)
Yes

No
Check the EMI Filter(FL601, FL602)

Yes

Change the camera Change the Filter(FL601, FL602)

Yes
Camera is OK END

No

Change the Main board

LGE Internal Use Only - 122 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

͑
 4. TROUBLE SHOOTING

AF24
GPIO_0 CAM_RESET_N
GPIO_1 AE25
CAM_PWDN MSM7227
AE24
GPIO_2 MOTION_I2C_SCL
GPIO_3 AC22 MOTION_I2C_SDA
AB22
GPIO_4 CAM_DATA[0]
AE21
GPIO_5 CAM_DATA[1]
AF23
GPIO_6 CAM_DATA[2]
AC21
GPIO_7 CAM_DATA[3]
AE23
GPIO_8 CAM_DATA[4]
GPIO_9 AC23
CAM_DATA[5]
GPIO_10 AF22
CAM_DATA[6]
GPIO_11 AF21
CAM_DATA[7]
AE20
GPIO_12 CAM_PCLK
AB21
GPIO_13 CAM_HSYNC
GPIO_14 AF20
AC20
CAM_VSYNC
R211
TP1
GPIO_15 CAM_MCLK
AF9 47
GPIO_16 MUIC_I2C_SCL
GPIO_17 U12 AUDIO&MOTION_I2C_SDA C222 C223
GPIO_18 AE10
DNI 7.5p
W9
GPIO_19 MUIC_I2C_SDA
AF10
GPIO_20 MUIC_INT
GPIO_21 AC11
AC12
GPIO_22 PA_ON1
GPIO_23 Y12 WLAN_REG_ON
AB12
GPIO_24 PM_INT_N
W12
GPIO_25 PS_HOLD
GPIO_26 W13 HS_MIC_BIAS_EN
AB13
GPIO_27 AUDIO&MOTION_I2C_SCL
Y13
GPIO_28 LIN_PWM_FREQ
U13
GPIO_29 EARJACK_SENSE
GPIO_30 AC13
LNA_GAIN_CONTROL
GPIO_31 Y14
COMPASS_DRDY
GPIO_32 AC14
KEY_COL[0]
GPIO_33 AE14
KEY_COL[1]
GPIO_34 W14
GPIO_35 AB15
GPIO_36 AC15 KEY_COL[2]
GPIO_37 Y15 KEY_ROW[1]
GPIO_38 AF15 KEY_ROW[0]
GPIO_39 AB16 MOTION_INT
GPIO_40 AC16 DIVERSITY_LNA_EN
GPIO_41 W15
REV.E_CHANGED_0517
GPIO_42 U15 BT_WAKEUP

7.5pF
EMI FILTER
10
5
G1
G2

FLT_CAM_DATA[0] INOUT_A4 INOUT_B4 CAM_DATA[0]

4 6
FLT_CAM_DATA[1] INOUT_A3 INOUT_B3 CAM_DATA[1]
3 7
FLT_CAM_DATA[2] INOUT_A2 INOUT_B2 CAM_DATA[2]
2 8
FLT_CAM_DATA[3] INOUT_A1 INOUT_B1 CAM_DATA[3]
1 9
FL600

1608

7.5pF
10
5
G1
G2

FLT_CAM_DATA[4] INOUT_A4 INOUT_B4 CAM_DATA[4]

4 6
FLT_CAM_DATA[5] INOUT_A3 INOUT_B3 CAM_DATA[5]
3 7
FLT_CAM_DATA[6] INOUT_A2 INOUT_B2 CAM_DATA[6]
2 8
FLT_CAM_DATA[7] INOUT_A1 INOUT_B1 CAM_DATA[7]
1 9
FL601
1608
7.5pF
10
5
G1
G2

INOUT_A4 INOUT_B4
4 6
INOUT_A3 INOUT_B3
3 7
FLT_CAM_VSYNC INOUT_A2 INOUT_B2 CAM_VSYNC
2 8
FLT_CAM_HSYNC INOUT_A1 INOUT_B1 CAM_HSYNC
1 9
FL602

1608

Copyright © 2010 LG Electronics. Inc. All right reserved. - 123 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

CAM_AVDD_2.7V CAM_DVDD_1.2V CAM_IOVDD_2.6V

FB601 FB602 FB600

120 120 120

TP6 TP5
TP7

2.2K

2.2K
C605 C604
C606 4.7u 4.7u
4.7u
CN600

R603

R604
1 34 CAM_AF_2.8V
CAM_MCLK
TP2
R605 12
2
3
33
32
CAM_PCLK 4 31
5
6
30
29
TP3
CAM_RESET_N
7 28
FLT_CAM_DATA[0]
8 27
FLT_CAM_DATA[1] CAM_I2C_SDA
9 26 FB603
FLT_CAM_DATA[2] CAM_I2C_SCL
10 25 120
FLT_CAM_DATA[3]
11 24
FLT_CAM_DATA[4] FLT_CAM_VSYNC
12 23
FLT_CAM_DATA[5] FLT_CAM_HSYNC
FLT_CAM_DATA[6]
13
14
22
21
TP4
FLT_CAM_DATA[7] CAM_PWDN
15 20
16 19
17 18

C608 VA607

0.1u
1uF
10u
33p

C613

C614

C615

͑
LGE Internal Use Only
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑ - 124 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
͑
 4. TROUBLE SHOOTING

4. 13 Main LCD trouble

Main LCD control signals are generated by MSM7227. Those signal’s path are :
MSM7227 -> LCD Module

START

Press END key to tun the power On

No Follow the Power ON

Is the circuit powered?
trouble shooting
Yes
Disconnect and reconnect
LCD connector

Yes
LCD display OK?

No

Yes Check Power

Change the LCD module VREG_LCD_1.8V(TP1)
VREG_LCD_2.8V(TP2)
No

Yes Change the Main board

The LCD works

END

Copyright © 2010 LG Electronics. Inc. All right reserved. - 125 - LGE Internal Use Only
Only for training and service purposes

͑
4. TROUBLE SHOOTING

3.2" HVGA LCD Connector

VREG_LCD_1.8V VREG_LCD_2.8V

CN601
1 24

LCD_RESET_N
TP2 2 23
FL6031 5
P1 P5 MDDI_P_DATA_P
TP1 3 22
2
3
P2 P6
6
7
MDDI_P_DATA_M
P3 P7 MDDI_P_STB_P
4 8
4 21 P4 P8 MDDI_P_STB_M
LCD_MAKERID_LOW

G1
G2
5 20

9
10
LCD_VSYNC_O
6 19

7 18

8 17

WLED7 WLED6
9 16

WLED5 WLED4
10 15

WLED3 WLED2
11 14

WLED1 WLED_PWR
12 13
C616 C617
D600 2.2u 2.2u
6 1

5 2 C4
4.7u
4 3
ZD1

LGE Internal Use Only

͑ - 126 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
͑
 4. TROUBLE SHOOTING

4.14 Proximity Sensor on/off trouble

Proximity Sensor is worked as below :
Send Key click Î Phone number click Î Call connected Î Object moved at the sensor
Î Control the screen’s on/off operation automatically

START

Send Key click & call connected

Object moved at the Proximity Sensor

Yes
LCD off?

No

Check PROXI_SDA / No
SCL output & Prox_out Change the Proximity Sensor U700

No

No
Work well? Chang the main board

Yes

END

Measurement
VREG_MSMP_2.6V
VREG_PROX_2.6V
PROX_OUT
PROX_COMPASS_I2C_SCL / SDA

Copyright © 2010 LG Electronics. Inc. All right reserved. - 127 - LGE Internal Use Only
Only for training and service purposes

͑
4. TROUBLE SHOOTING

VREG_MSMP_2.6V

VREG_PROX_2.8V

R701 R702 R700

4.7Kohms 4.7Kohms
U700 10
8 1 R703
PROX_COMPASS_I2C_SCL SCL LEDA
10
TP1 7 2 C705
PROX_COMPASS_I2C_SDA SDA LEDC
10u
TP2 6 3
VIO VCC

5 VOUT 4
GND PROX_OUT
TP3
C707 C708 C709

0.1u 4.7u
1u

LGE Internal Use Only - 128 - Copyright © 2010 LG Electronics. Inc. All right reserved.
͑ Only for training and service purposes
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
͑
 4. TROUBLE SHOOTING

4.15 Motion Sensor on/off trouble

Motion Sensor is worked as below :
Accelerometer Sensor function On Î Tilt the phone (90˚) Î The screen is had rotated automatically.

START

Accelerometer Sensor function On

Tilt the phone

Yes
The screen is ratated

No

No
MOTION_INT output Change the Main board

Yes

Check mation_I2C_SDA / SCL No

output Change the Motion Sensor U503

Yes

No
Work well? Change the Main board

Yes

END

Measurement
VREG_MSMP_3.0V
MOTION_INT
MOTION_I2C_SDA / SCL

͑
Copyright © 2010 LG Electronics. Inc. All right reserved.
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
- 129 - LGE Internal Use Only
Only for training and service purposes
͑
4. TROUBLE SHOOTING

VREG_MOTION_3.0V

0.1u
C541
10u

C540

2.2K

2.2K
14 U503
15
16

R518

R519
VDD
RESERVED2
GND4

13 1
GND3 VDD_IO
12 2
GND2 NC1
11 3
MOTION_INT TP1 10
INT1 NC2
4
RESERVED1 SCL_SPC MOTION_I2C_SCL
9 5
SDA_SDI_SDO

INT2 GND1
TP2
SDO_SA0
CS
8
7
6

MOTION_I2C_SDA
TP3

LGE Internal Use Only - 130 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

͑
 4. TROUBLE SHOOTING

4.16 Compass Sensor on/off trouble

Compass Sensor is worked as below :
Compass Sensor function On

START

Compass Sensor function On

Chang the position of thr phone

Yes
The direction is correct?

No

Check the COMPASS_DRDY & No

PROX_COMPASS_I2C_SDA Change the Compass Sensor U1
/ SCL output
Yes

No
Work well? Chang the main board

Yes

END

Measurement
VREG_MSMP_2.6V
VREG_MOTION_3.0V
PROX_COMPASS_I2C_SCL / SDA
COMPASS_DRDY

Copyright © 2010 LG Electronics. Inc. All right reserved. - 131 - LGE Internal Use Only
Only for training and service purposes

͑
 4. TROUBLE SHOOTING

VREG_MOTION_3.0V VREG_MSMP_2.6V

C704
C706

10n
470n

U1
3
2
1

PROX_COMPASS_I2C_SCL
AVDD
GNDA
DVDD

TP3
4
TP2
12
SCL SDA PROX_COMPASS_I2C_SDA
5 11
NC1 DRDY COMPASS_DRDY
6
ADDR VPP TP1
10
GNDS
VREG
INT
7
8

LGE Internal Use Only - 132 - Copyright © 2010 LG Electronics. Inc. All right reserved.
͑ Only for training and service purposes
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
͑
 4. TROUBLE SHOOTING

4.17 Q coin Motor

Q coin Motor is worked as below :
touch touch-window Î Vibration feedback
U601 : Used the PWM pulse

START

Reboot

Yes
Work well? END

No

Output of U602 OK? Yes

(L42-L18) Change the Q coin Motor(VB700)

No

VREG_MOTOR_3.3V(C624) is 3.3V? Yes

LIN_PWM_FREQ(U602)is working? Check an U602 SMT status by X-ray, Exchange it

No

Check SW

Measurement
VREG_MOTOR_3.3V
LIN_PWM_FREQ
MTR_N_2sub/MTR_P_2sub
Measurement
VREG_MOTOR_3.3V
LIN_PWM_FREQ
MTR_N_2sub/MTR_P_2sub

Copyright © 2010 LG Electronics. Inc. All right reserved. - 133 - LGE Internal Use Only
Only for training and service purposes

͑
4. TROUBLE SHOOTING

VREG_MOTOR_3.3V VREG_MOTOR_3.3V

R612 100K

1%
U602

BYPASS GND
C1 B2

_SHUTDOWN VO- MTR_P_2sub

B1 A1
R614 R615 R616
1% IN+ VO+ MTR_N_2sub
1%51K C2 B3
4.7Kohms 1K
R617 TP1
IN- VDD
1%51K C3 A3
C OUT
TP2
B Q600
LIN_PWM_FREQ IN
R618 1% 100K
R619
E GND 1%
1K C623
C625 10n C624

0.1u 0.1u

VB700
15n
L3

TP4
MTR_N_2sub
2
15n
L1

TP3
MTR_P_2sub
1
VA4

VA3

LGE Internal Use Only - 134 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

Copyright © 2010 LG Electronics. Inc. All right reserved. - 135 - LGE Internal Use Only
Only for training and service purposes

͑
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
5. DOWNLOAD
5. DOWNLOAD

5. DOWNLOAD
DOWNLOAD

LG-P500h

LG-P500h

LGE Internal
LGE Internal Use
Use Only
Only --164
136 -- Copyright
Copyright © 2010
© 2010 LGLG Electronics.Inc.
Electronics. Inc.All
Allright
rightreserved.
reserved.
Only
Only forfor trainingand
training andservice
servicepurposes
purposes
 5.5.DOWNLOAD
DOWNLOAD

LG-P500h

LG-P500h

LG-P500h

Copyright © 2010
Copyright 2010LG
LGElectronics.
Electronics.Inc.
Inc.AllAllright reserved.
right reserved. --165
137 -- LGEInternal
LGE InternalUse
UseOnly
Only
Only for training
Only training and
andservice
servicepurposes
purposes
 DOWNLOAD
5. DOWNLOAD

LG-P500h

LG-P500h

LGE Internal
Internal Use
UseOnly
Only -- 166
138 - Copyright
Copyright © 2010
© 2010 LGLG Electronics.Inc.
Electronics. Inc.All
Allright
rightreserved.
reserved.
Only
Only forfor trainingand
training andservice
servicepurposes
purposes
 5.5.DOWNLOAD
DOWNLOAD

LG-P500h

LG-P500h

LG-P500h

Copyright © 2010
Copyright 2010LG
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 DOWNLOAD
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LG-P500h

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reserved.
Only
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training andservice
servicepurposes
purposes
 5.5.DOWNLOAD
DOWNLOAD

Copyright © 2010
Copyright 2010LG
LGElectronics.
Electronics.Inc.
Inc.AllAllright reserved.
right reserved. --169
141 -- LGEInternal
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 DOWNLOAD
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reserved.
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training andservice
servicepurposes
purposes
 5.5.DOWNLOAD
DOWNLOAD

Copyright © 2010
Copyright 2010LG
LGElectronics.
Electronics.Inc.
Inc.AllAllright reserved.
right reserved. --171
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servicepurposes
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 DOWNLOAD
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Copyright © 2010
© 2010 LGLG Electronics.Inc.
Electronics. Inc.All
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rightreserved.
reserved.
Only
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training andservice
servicepurposes
purposes
 5.5.DOWNLOAD
DOWNLOAD

Copyright © 2010
Copyright 2010LG
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Inc.AllAllright reserved.
right reserved. --173
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servicepurposes
purposes
 DOWNLOAD
5. DOWNLOAD

LG-P500h
LG-P500h

LG-P500h

LG-P500h
LG-P500h

LG-P500h

LG-P500h LG-P500h

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reserved.
Only
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training andservice
servicepurposes
purposes
 5.5.DOWNLOAD
DOWNLOAD

LG-P500h LG-P500h

LG-P500h

LG-P500h LG-P500h

LG-P500h LG-P500h

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Copyright 2010LG
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Inc.AllAllright reserved.
right reserved. --175
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 DOWNLOAD
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LG-P500h LG-P500h

LG-P500h

LG-P500h

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reserved.
Only
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training andservice
servicepurposes
purposes
 6. BLOCK DIAGRAM

6. BLOCK DIAGRAM
System HW Block Diagram All System
BT_UART BT &
MDDI Interface MDDI Interface Bluetooth v2.1 Wi-Fi
BT_PCM
TOUCH I2C WLAN_SDIO Wi-Fi 802.11b/g
Capacitive Touch FM_L&R
3.2" HVGA LINE_L& R FM Radio
FM_L&R
(Melpas + LGIT) TOUCH INT FM
320*480 TCXO_ F_CLK_IN
LBEH19UNBC-338
26MHz
CLK_REQ GSM & WCDMA
LCD Backlight IC TX_IQ, PRX_IQ PRX_IQ
BL_I2C RF I/F FEM
FEM
AAT2862 DRX_IQ DRX_IQ (SKY77544)
(SKY77544)
GPIO59 SBDTTransceiver
Transceiver
(RTR6285)
(RTR6285)TCXO GPS
Fuel
FuelGauge
Gauge
FUEL_I2C GPS
(MAX17040G))
(MAX17040G
DDR SDRAM(4G) EBI1 (DDR)
MCP(Micron) NAND FRESH (4G) EBI2 (NAND) LIN_PWM_FREQ
GPIO_28 Q-Motor
Q-Motor
MT29C4G96MAZAPCJA-5 IT
MSM7227 MIC MIC
(WHVM-1030Q10)
(WHVM-1030Q10)

CAM I/F RTR_TRK_LO_ADJ TCXO_RTR_19.2MHz

CAM 3M TCXO_19.2MHz TCXO_PM_19.2MHz
CAM_I2C
(Kyocera) Speaker &
EAR1_OP&ON RCV_P & N Receiver
LINE_ON&OP LINE_OP, LINE_ON SPK_RCVP, N
Digital Compass COMPASS_I2C HPH_R, HPH_L
Audio Sub
COMPASS_INT HPH_L&R WM9093ECS-R EAR_L, R 3.5 pi
(AMI304) AUDIO_I2C
GPIO_27 Earjack
MOTION Sensor I2C
MOTION_I2C PROX_I2C Prox Sensor
Back Key (KR3DM) MOTION_INT (GP2AP002S00F) TCXO_IN

Send Key QTKEY_I2C

USIM USIM I/F KPD_PWR_N PWR/End Key
USIM
Home Key Key COL, Key ROW PMIC_SSBI
GPIO106 SBDT_SSBI
AMUX_OUT
Menu Key MMC HKAIN2 AMUX_OUT SIM
PM_INT_N USIM
GPIO24 MSM_INT_N
GPIO36 ~ 38
GPIO25 PS_HOLD PS_HOLD
Volume Key
I2C RESIN_N
MUIC_I2C
PM7540 Backlight_Key
UART3 Key
UART3 KPD_DRV_N KeyLED
LED
Connector
5pin_USB
Connector
5pin_USB

USBPHY JTAG MPP3,4

MUIC
MUIC PON_RESET_N
(TS5USBA)
(TS5USBA)
USBH DM & DP JTAG_PS_HOLD
REMOTE_PWR_ON nJTAG_RESOUT
Array TP JTAG(TCK,TDI,TDO…) JTAG CONN.
UART3_TX/RX

Main Board Sub FPCB

Copyright © 2010 LG Electronics. Inc. All right reserved. - 149 - LGE Internal Use Only
Only for training and service purposes
 6. BLOCK DIAGRAM

RF Block Diagram

LGE Internal Use Only - 150 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 6. BLOCK DIAGRAM

Copyright © 2010 LG Electronics. Inc. All right reserved. - 151 - LGE Internal Use Only
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 5. DOWNLOAD

Audio Block Diagram

3.5Ȱ
qˆŠ’

1.8V LDO
RP103K181D

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 5. DOWNLOAD

WiFi/BT/FM Radio Block Diagram

mt†y
spul†y†pw h|kpvY
mt†s 3.5䑀㢨
spul†s†pw h|kpvX FM_ANT Ear Jack
mt†hu{
~shu†ovz{†~hrl|w

lˆ™‘ˆŠ’
lˆ™‘ˆŠ’
nwpv`[ ~shu†ovz{†~hrl|w

~†~hrl†i
~shu†jtk
nwpv]Z zkpv†jtk

~shu†jsr
nwpv]Y zkpv†jsr hu{
~shu†yln†vu
nwpvYZ yln†vu

~shu†ylzl{†u
nwpv`Z ~s†yz{†u

~shu†zkpv‚ZaW„
nwpv‚][a]^„ zkpv‚ZaW„

LBEH19UNBC
MSM7227

i{†|hy{†{k
nwpv[] i{†|hy{†yk

i{†|hy{†yk
nwpv[\ i{†|hy{†{k

i{†|hy{†j{z
nwpv[[ i{†|hy{†yz{†u

i{†|hy{†y{z
nwpv[Z i{†|hy{†j{z†u

i{†ylzl{†u
nwpvXYZ i{†yz{†u

i{†wjt†z€uj
nwpv^W i{†wjt†z€uj SLEEP_CLK(LPO Clock:
32.768KHz)
i{†wjt†kpu
nwpv]` i{†wjt†v|{
z†jsr†pu
PM7540
i{†wjt†kv|{
nwpv]_ i{†wjt†pu
32.768KHz
i{†wjt†jsr
nwpv^X i{†wjt†jsr
i{†~hrl|w
nwpv[Y i{†nwpv†W CLK_IN 26MHz
m†jsr†pu
nwpv_Z
i{†ovz{†~hrl|w
i{†nwpv†X
TCXO

Copyright © 2010 LG Electronics. Inc. All right reserved. - 153 - LGE Internal Use Only
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LGE Internal Use Only - 154 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
ANT1002

GND
3 4

L L
ANT1003 G3 G4
1
ANT COMMON
2
SW1001

R1004 U1001
C1003
C1004
2.7n C1005 33p 26 64
10p RX_GSM_850_P TX_ON 2
RF_ON TX_IP
63
TX_I_P
C1009 2.2p TCXO_RTR_19.2MHZ TCXO TX_IN
C1007 R1005 L1002 20 66
0.0082uH RTR6285_SSBI SBDT TX_QP C1010
56p 1p L11 L1004 DNI L1003 L1005 65 0603
DNI 18n 82n 18n GSM(869-894 MHz) C1011 100p 55
TX_QN 68p

C1014 FL1001 GSM_TX LB_RF_OUT1 0603

C1012 100p 57 5 C1013 10n TX_I_M
4 7 WCDMA_850_TX_OUT LB_RF_OUT2 VTUNE1
IN_881_5 OUT_881_5_1 C1016 24 C1015 10n
33p 6 VTUNE2 TX_Q_P

K K
OUT_881_5_2 RX_GSM_850_M C1017 33p 56 9 C1018 1n
9 2.2p DCS_PCS_TX HB_RF_OUT1 VTUNE_GPS
R1006 C1021 OUT_942_5_1 C1020 33p 58
WCDMA_1900_RTX 1 8 WCDMA_1900_TX_OUT HB_RF_OUT2 C1019
GSM_PA_RAMP IN_942_5 OUT_942_5_2 C1023 C1022 33p 59 11
2.2K WCDMA_2100_TX_OUT HB_RF_OUT3 PRX_QP RX0_Q_P 68p
0603
33p RX_GSM_900_P 12
WCDMA_2100_RTX 2
GND1 GND3
5
4.7p 30
PRX_QN
14
RX0_Q_M
C1024 3 10 RX_WCDMA_850_P WPRXLBP PRX_IP RX0_I_P TX_Q_M
39p L1006 GND2 GND4 GSM(925-960 MHz) 31 13

28
27
26
25
24
23
WCDMA_850_RTX 881.5MHz,942.5MHz L1008 L1007 RX_WCDMA_850_M WPRXLBN PRX_IN RX0_I_M
DNI 32
82n 18n RX_WCDMA_1900_P WPRXHBP

GND11
GND10
GN D 9
GND8
GND7
GND6
44 33 15
PGND16 RX_WCDMA_1900_M WPRXHBN DRX_QP RX1_Q_P
43 16
PGND15 C1025 DRX_QN RX1_Q_M GND
42 41 17
R6 PGND14 RX_GSM_900_M WDRXLB DRX_IP RX1_I_P
1 41 18

0.1u

0.1u

0.1u

0.1u
DCS_PCS_TX DCS_PCS_IN PGND13 4.7p RX1_I_M

22 p

22 p

22 p

22 p
DRX_IN
47 2 40 0603
GND1 WDRXHB1
DCS(1710-1785 MHz) 3
GSM_IN
39
WDRXHB2 NC
19

C1027

C1029

C1031
7dB AWS_RXDIV_LNA_OUT
EUSY0344001

C1028

C1030

C1032

C1033

C1034
J J
130

130
4
R4

R5
PCS(1850-1910 MHz) VAPC
5 22 50 67
VBATT GND5 C1036 RX_GSM_850_P GCELL_INP DAC_IREF DAC_REF
6 21 51
BS2 GND4 RX_DCS_P RX_GSM_850_M GCELL_INN
VREG_RF_2.7V
7
BS1
U1002 GND3
20 5.6n VDDA1_1
3 FB3
R7 8 19 L1009 48 4 R1010 2.2 0
GSM_TX _TXEN GND2
18 DCS(1805-1880 MHz) RX_GSM_900_P 49
EGSM_INP VDDA1_2
6 +2.7V

0.1u
75 27n L1011 L1010
ANT RX_GSM_900_M EGSM_INN VDDA1_3

1n
17 R1012 10
GSM850(824-849MHz) WCDMA3
0.5p 22n VDDA1_4
10
0603 C1160
29 16 FL1002 46 22
R16

R15

11dB C1039 4.7u

91

91

GSM900(880-915MHz) PGND1 WCDMA2 RX_DCS_P DCS_INP VDDA1_5

C1038
30 15 33p 4 7
C1040 47 53

C1037
IN_1842_5 OUT_1842_5_1
PGND2 WCDMA1 6 RX_DCS_M DCS_INN VDDA1_6
31
PGND3 OUT_1842_5_2
9 5.6n RX_DCS_M VDDA1 : Pin 3,4,6,10,22,53 = +2.7V VDC
32 OUT_1960_1 44 1
PGND4 C1041 33p 1 8 RX_PCS_P GPCS_INP VDDA2_1
33
2mm IN_1960 OUT_1960_2 45 7 0603
PGND5 RX_PCS_M GPCS_INN VDDA2_2
VDDA2 : Pin 1,7,8,21,25,27,37,43,54,60,61,62 = +2.1V VDC
34
PGND6 PGND12
40
C1042
8 R1015 0 VDD_RX
+2.1V

PGND7
PGND8
PGND9
+VPWR_RF VDDA2_3
2 5 R1016 FB2

MODE
39 10

TEMP
42 21

I I
GND1 GND3
0603 PGND11 L1012 RX_PCS_P GPS_IN VDDA2_4 VREG_SMPS_2.1V

RX4
RX3
R X2
RX1
0603 C1045 1n 38 3 10 C1046 33p 52 25
GND2 GND4 0
C1043 C1044 PGND10 DNI 1842.5MHz,1960MHz 6.8n PDET_IN PDET_IN VDDA2_5
1608

C1047 1n R1018 12K 68 27 10 R1017

TX_RBIAS VDDA2_6 VSNS_RF_SMPS

0.1u
10u 47p

10u
9
10
11
12
13
14

35
36
37
C1048 1n L1014 0603
L1013 PCS(1930-1990 MHz) 1% 0603 C1162
C1051 1n DNI 38 37
12n RX_WCDMA_1900_SE WPRXSE1 VDDA2_7
36 43 4.7u

0603C1049

C1050
WPRXSE2 VDDA2_8 VREG_SMPS_2.1V|VSNS_RF_SMPS
C1052 RX_WCDMA_2100

1608
54
ANT_SEL3 VDDA2_9

WPRXSE2_OUT
WPRXSE1_OUT
60
ANT_SEL2 RX_PCS_M VDDA2_10
6.8n

WB_MX_INM
WB_MX_INP
61
ANT_SEL0 VDDA2_11
Near To RTR 62
ANT_SEL1

VDDM
VDDA2_12

PGND

0.1u

4.7u

0.1u

4.7u

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u
L1015
ANTENNA SWITCH MODULE LOGIC(SKY77544)

69

34
35

28
29

23
GPS_IN

0603
C1163

0603
C1054

C1056
H H
10u

C1053

C1055

C1057

C1058

C1059

C1060

C1061

C1062

C1063
100p
ANT_SEL0 ANT_SEL1 ANT_SEL2 ANT_SEL3

1005
L1016

1005
WB2100_MIX_INP
WB2100_MIX_INM
5.6n
GSM850/GSM900 TX LOW HIGH LOW LOW RX_WCDMA_2100_LNA_OUT

DCS1800/PCS1900 TX HIGH HIGH LOW LOW

RX_WCDMA_1900_LNA_OUT

PCS1900 RX LOW LOW LOW (X) HIGH VREG_MSMP_2.6V

DCS1800 RX LOW HIGH LOW (X) HIGH

0603
C1064 C1065 C1066
22p 100p 0.1u
GSM900 RX HIGH HIGH LOW (X) HIGH

GSM850 RX HIGH LOW LOW (X) HIGH

G G
GSM Quad
W2100 HIGH LOW LOW LOW

W900(W850) LOW LOW HIGH LOW

W1700 HIGH LOW HIGH LOW

VDD_RX
WCDMA RX 2100 LNA Circuit WCDMA Triple Near to 12 Pin Near to 4 PinNear to 12 Pin
0.1u

100p

1K

+VPWR_RF

F F
C1067

C1068

L1017 L1018 C1075 C1076 C1077

R1019

C1069 3.9p FL2 10u

2n WB2100_MIX_INM 0.001uF 330p
0603

1.8n C1079
6 1 C12
ANT RX
2 3 100p
FL1003 8.2p
C1071 33p C1072 33p 1 G1 O1 DNI 3 L1130
RX_WCDMA_2100_LNA_OUT L1021 TX
W2100 RX(2110 - 2170 MHz)
IN C1070
C1081 18n
W850
G2 O2 FL1005
DNI 6.8n
R1029 5 4 2 8
GND1 GND6 U1003 L1025 5
C1153 C1084
DNI C1073 4 9 C1078 C1083 GND
GND2 GND5 14 1 4 1
DNI L1019 5 7 OUT_BAND_V IN_BAND_V OUT IN
3n
GND3 GND4 13 2
33p 1.5n G2 G1
R1021 C1080 3.9p 22p GND3 VMODE_0 PA_R0 33p
RX_WCDMA_1900_LNA_OUT 2140MHz WB2100_MIX_INP 12 3 3 2 WCDMA_850_TX_OUT
DNI VCC2_2 VMODE_1 PA_R1 C1086
1.8n 11 4 L1026

E E
L1020 GND2 VCC2_1
836.5 MHz,881.5 MHz L1022 10 5 DNI DNI
DNI OUT_BAND_I VEN_BAND_V PA_ON1
10n 836.5MHz
Band 5
9 6

PGND2
PGND1
WCDMA_850_RTX GND1 VEN_BAND_I
R1022 R1023 8 7
CPL_OUT IN_BAND_I PA_ON0
33 18
PDET_IN FL1006

16
15
C1094 C1929 C1096 C1095
C1087 L1027 3.3n
G3
3
C1088 W2100

R1163
4 1

D NI
FL1008 OUT IN
C1090

LNA for the GPS

R1178
G2 G1 15p
6 1 C1089
100p 100p 100p 100p 33p WCDMA_2100_TX_OUT
ANT RX

0
5 2
12p 1950MHz
DIVERSITY_IN 3 3.3p L1030 C1092
TX
L1035 L1031 L1033 DNI 1.5n
L1029
2.7n DNI

R11
2 9 DNI

15
GND1 GND6 5.6n
4 8

D D
GND2 GND5 +VPWR_RF
5 7
L1028 GND3 GND4
ANT1005 ANT1006 C1091 FL1007 C13 Near to 10 Pin Near to 1 Pin
1 3 WCDMA_2100_RTX
4
IN
OUT
6 5.6n Near To LNA
47p G
OUT_NON 100p

L1034 L1032 Band I L1120 L1040 C1102 C1103 C1104

G1

G2

C1093 L1036
6.8n C1097 R1025 DNI 2.2u 33p
DNI 1n
2

L12 DNI DNI VREG_RF_2.7V 2.4n U1005

100p 3.3n
C1098
12
C1111 C1112
11
10
PGND
1 3
FL1009 W1900
C1099 VCC2 VCC1 L1151 C1154
18p 0.1u 1.5p 1.5p 9 2 C1108 33p 4
G3
1 C1109
RFOUT RFIN OUT IN
8 3 3n 4.7n
CPL_IN VMODE_1 PA_R1 G2 G1 33
L1041 FL1010 7 4 5 2 WCDMA_1900_TX_OUT
PA_R0
1

6 1 GND VMODE_0
L1150 C1110

C C
6 5
PA_ON2
RF_IN

L1039 WCDMA_1900_RTX ANT RX CPL_OUT VEN

GND VDD 100p 1.5n DNI 1880MHz 100
R1026 3 5 3
GPS_MODE S_D FIL_OUT GPS_IN VREG_TCXO_2.85V C1113 C1114 C1115

R1027
TX

49.9
1K 2 4
C1117 100p 100p 100p
U1004 C1116 2 9 0603
C1105
C1107
6.8p DNI
C1106
8.2n
DNI 0.5p
4
GND1
GND2
GND6
GND5
8
C20 R14
R9
WCDMA 1900 Tx (1850-1910MHz)
5 7
GND3 GND4
DNI
0603
10n 0
L1042
1880,1960MHz
RX_WCDMA_1900_M
5.6n
Band 2

1
2 3
C15 FL1012
G1 O1

RFGNDH2

RFGNDH1

VCC

VGS

NC
1
LNA_GAIN_CONTROL IN C1122 C1123
G2 O2
4.7p 1.2p DNI

B B
R19 6 17 C1128 5 4
C1728 1960MHz
RFINM PGND L1048
DIVERSITY_LNA_EN DNI DNI
FL1011 C27 L10
3
0 7 BGA735L16RFOUTM 16 RX_WCDMA_1900_P
RFINH
G3 2.2n 5.6n
C1118 33p 1 4 C1119 10p 1 6 C1120 10p C1121 33p U2
DIVERSITY_IN IN OUT RFIN RFOUT C11 C25 10p R24 C28
8 15 C10
G1 G2 L9 RFGNDM1 RFOUTH RX_WCDMA_2100
2 5 2 5 R1030 27K AWS_RXDIV_LNA_OUT 12p
EN 100p 22p 10n 33p 3.3n
C1127 L1043 U1006 RREF 9 14
L1045 RFGNDM2 RFOUTL L6 R12
3 4
L5 RX_WCDMA_1900_SE
L1044 DNI 2140 MHz 2n GS VCC DNI
L1110 2.7n DNI
PGND

3.3n
3.6n DNI C36

RFINL

RREF
VEN2

VEN1
C23
C1129 7 RX_WCDMA_850_P
C1130 10p
1.2p

10

11

0 12

13
C22
R18 5 4
100p 22p L7 C14

R10
L4000 L8
10n G2 O2

A AWS DIVERSITY A
L2 27K IN DNI
1n 1 G1 O1 22n
VREG_TCXO_2.85V 27p FL1
C24 2 3
8.2n C1148 C1928 881.5MHz C37

R8
0
0.5p DNI RX_WCDMA_850_M
22p C26
1.2p
2.7p INTER_RX_SW_SEL_1

INTER_RX_SW_SEL_2

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

Copyright © 2010 LG Electronics. Inc. All right reserved. - 155 - LGE Internal Use Only
Only for training and service purposes
7. CIRCUIT DIAGRAM

12 11 10 9 8 7 6 5 4 3 2 1

L L

ARM9&ARM11 JTAG
MODE[3:0]
0000 : Native, ARM9 on PJTAG, ARM11 on AJTAG
0001 : Native, ARM9 + ARM11 on PJTAG

nJTAG_RESOUT
K

nPON_RST
MIC_BIAS

VREG_MSMA_2.6V

47 p
TCXO Circuit
C201C202 C203

D200

D201
47p 0.1u 22u

51 C200
VREG_TCXO_2.85V
VREG_MSMP_2.6V
C204
GND|MIC_1N (MIC_1N)

J J
2.2n C205 C206

GSM_PA_DAC_REF
USBH_DM

MDDI_P_DATA_P
MDDI_P_DATA_M
USBH_DP
USBH_SYSCLK
VREG_MSMP_2.6V

MDDI_P_STB_P
MDDI_P_STB_M

VBAT_SENSE; PM7540 (B3)mpp17

MSM_TCK R200
1n 0.1u

GSM_PA_RAMP
1 0K

TRK_LO_ADJ

MSM_TRSTN
VCHG_VBUS

PMIC_TCXO

SLEEP_CLK

MSM_RTCK
HS_MIC

AMUX_OUT
MIC_1N
MIC_1P

LINE_ON
LINE_OP

1K

MSM_TMS

MSM_TDO

RX0_Q_M

RX1_Q_M
DAC_REF
FM_R

MSM_TDI

RX0_Q_P

RX1_Q_P
RCV_N

HPH_R
RCV_P
FM_L

10 K
HPH_L

RX0_I_M

RX1_I_M
TX_Q_M

RX0_I_P

RX1_I_P

PA_ON0
TX_Q_P

HS_MIC
TX_I_M
TX_I_P

TX_ON

PA_R0
R201
R202
X200

R203
C207 330p

R204
R205 100 1 3
RTR_TRK_LO_ADJ VCONT OUT TCXO_PM_19.2MHZ

2 .2 K
2 4 C210 330p
C208 GND VCC TCXO_RTR_19.2MHZ
Clesed to TCXO

DNI
0.1u

6040
C219
0.1u
0.1u
0.1u
0.1u
1uF

1uF

0.1u
10n
19.2MHz
KT3225L19200DCW28RA0
TP200 FFA Rev.C(220Ohm@100MHz)
C211
1.0T
C212
C213
C214
C215
C216
C217
C218

0 .1 u

E15 R206
R208 220

Y 3 R 207
VREG_MSMA_2.6V

AB19

AF11
AF12
AF13
AF14
B10
C10

H10
J10

B13
B14
B15
C13
C14

W 17

AB6
AC9
AE9
W11

AA6

AA2
AA3
AB2
AB3
AB5

B11
C220 0.1u
B5
B6
C5
C6
B7
C7
E7
F7
E8
F8

B9
C9

H9

F5
F6
H8

U3
M2

Y2

R3
R2
P3
P2
R6

G3
G2
H3
H2
J3
J2
K3
K2

T8
M3

W6
W2
N2
N3
N6

G5
G6
C4
LINE_R_IP
LINE_R_IN
LINE_L_IP
LINE_L_IN
MIC1P
MIC1N
MIC2P
MIC2N
AUXIP
AUXIN

LINE_OP
LINE_ON
EAR1_OP
EAR1_ON
AUXOUT
HPH_R
HPH_L

CCOMP
MIC_BIAS
HPH_VREF

USBPHY_SYSCLK
USBPHY_DP
USBPHY_DN
USBPHY_ID
USBPHY_VBUS
USBPHY_REXT

RESIN_N
RESOUT_N

WDOG_EN
MODE_0
MODE_1
MODE_2
MODE_3

TCXO
TRK_LO_ADJ
SLEEP_CLK

TDI
TMS
TRST_N
TDO
TCK
RTCK

MDDI_DATA_P
MDDI_DATA_N
MDDI_STB_P
MDDI_STB_N

LCDC_PCLK

I_OUT_P
I_OUT_N
Q_OUT_P
Q_OUT_N
DAC_REF

I_IP_CH0
I_IM_CH0
Q_IP_CH0
Q_IM_CH0
I_IP_CH1
I_IM_CH1
Q_IP_CH1
Q_IM_CH1

TX_ON
TX_AGC_ADJ

PA_ON0
PA_RANGE0
PA_PWR_CTL
PA_PWR_CTL_M
GSM_BG_REF

HKAIN0
HKAIN1
HKAIN2
5

I I
1
VCC
TCXO_EN
4 R209 33
U201 USBH_SYSCLK
U22 C221 330p 2
SDRAM_DATA[0] EBI1_DQ_0 GND
U23 AF24
SDRAM_DATA[1] EBI1_DQ_1 GPIO_0 CAM_RESET_N
U25 AE25 3
SDRAM_DATA[2] EBI1_DQ_2 GPIO_1 CAM_PWDN
T22 AE24
SDRAM_DATA[3] EBI1_DQ_3 GPIO_2 MOTION_I2C_SCL
T23 AC22
SDRAM_DATA[4] EBI1_DQ_4 GPIO_3 MOTION_I2C_SDA
R20 AB22
SDRAM_DATA[5] EBI1_DQ_5 GPIO_4 CAM_DATA[0]
R23 AE21 R210 100K
SDRAM_DATA[6] EBI1_DQ_6 GPIO_5 CAM_DATA[1]
R22 AF23
SDRAM_DATA[7] EBI1_DQ_7 GPIO_6 CAM_DATA[2]
T26 AC21
SDRAM_DATA[8] EBI1_DQ_8 GPIO_7 CAM_DATA[3]
R25 AE23
SDRAM_DATA[9] EBI1_DQ_9 GPIO_8 CAM_DATA[4]
P19 AC23
SDRAM_DATA[10] EBI1_DQ_10 GPIO_9 CAM_DATA[5]
R26 AF22

GPS D FLIP-FLOP
SDRAM_DATA[11] EBI1_DQ_11 GPIO_10 CAM_DATA[6]
P26 AF21
SDRAM_DATA[12] EBI1_DQ_12 GPIO_11 CAM_DATA[7]

H H
N20 AE20
SDRAM_DATA[13] EBI1_DQ_13 GPIO_12 CAM_PCLK
N19 AB21
SDRAM_DATA[14] EBI1_DQ_14 GPIO_13 CAM_HSYNC
N26 AF20
SDRAM_DATA[15] EBI1_DQ_15 GPIO_14 CAM_VSYNC
M23 AC20 R211
SDRAM_DATA[16] EBI1_DQ_16 GPIO_15 CAM_MCLK
M22 AF9 47
SDRAM_DATA[17] EBI1_DQ_17 GPIO_16 MUIC_I2C_SCL
M26 U12
SDRAM_DATA[18] EBI1_DQ_18 GPIO_17 AUDIO&MOTION_I2C_SDA C222 C223
L26 AE10
SDRAM_DATA[19] EBI1_DQ_19 GPIO_18 DNI 7.5p
M19 W9
SDRAM_DATA[20] EBI1_DQ_20 GPIO_19 MUIC_I2C_SDA
L20 AF10 VREG_TCXO_2.85V
SDRAM_DATA[21] EBI1_DQ_21 GPIO_20 MUIC_INT
L23 AC11
SDRAM_DATA[22] EBI1_DQ_22 GPIO_21
L19 AC12
SDRAM_DATA[23] EBI1_DQ_23 GPIO_22 PA_ON1
L22 Y12 WLAN_REG_ON
SDRAM_DATA[24] EBI1_DQ_24 GPIO_23
K26 AB12 U202
SDRAM_DATA[25] EBI1_DQ_25 GPIO_24 PM_INT_N
K19 W12
SDRAM_DATA[26] EBI1_DQ_26 GPIO_25 PS_HOLD 1 6
J22 W13 TRK_LO_ADJ D VCC
SDRAM_DATA[27] EBI1_DQ_27 GPIO_26 HS_MIC_BIAS_EN
J23 AB13
SDRAM_DATA[28] EBI1_DQ_28 GPIO_27 AUDIO&MOTION_I2C_SCL 2 5
J20 Y13 PMIC_TCXO CP NC Clesed to NC7SZ74L8X
SDRAM_DATA[29] EBI1_DQ_29 GPIO_28 LIN_PWM_FREQ
K20 U13

G G
SDRAM_DATA[30] EBI1_DQ_30 GPIO_29 EARJACK_SENSE 3 4 R212 2K
J26 AC13 GND Q RTR_TRK_LO_ADJ
SDRAM_DATA[31] EBI1_DQ_31 GPIO_30 LNA_GAIN_CONTROL
Y14 C225
GPIO_31 COMPASS_DRDY C224 C226
V20 AC14 33p
SDRAM_ADDR[0] EBI1_ADR_0 GPIO_32 KEY_COL[0]
AA26 AE14 0.1u 33n
SDRAM_ADDR[1] EBI1_ADR_1 GPIO_33 KEY_COL[1]
SDRAM_ADDR[2] W23 EBI1_ADR_2 GPIO_34 W14
SDRAM_ADDR[3] Y22 EBI1_ADR_3 GPIO_35 AB15
SDRAM_ADDR[4] T17 EBI1_ADR_4 GPIO_36 AC15 KEY_COL[2]
SDRAM_ADDR[5] Y23 EBI1_ADR_5 GPIO_37 Y15 KEY_ROW[1]
SDRAM_ADDR[6] Y26 EBI1_ADR_6 GPIO_38 AF15 KEY_ROW[0]
SDRAM_ADDR[7] AA25 EBI1_ADR_7 GPIO_39 AB16 MOTION_INT
SDRAM_ADDR[8] AA23 EBI1_ADR_8 GPIO_40 AC16 DIVERSITY_LNA_EN

U200
SDRAM_ADDR[9] AB25 EBI1_ADR_9 GPIO_41 W15
REV.E_CHANGED_0517

ARM9&ARM11 JTAG
SDRAM_ADDR[10] AB26 EBI1_ADR_10 GPIO_42 U15 BT_WAKEUP
SDRAM_ADDR[11] V23 AC2
EBI1_ADR_11 GPIO_43 BT_UART_RTS
SDRAM_ADDR[12] AC26 AC3
EBI1_ADR_12 GPIO_44 BT_UART_CTS
SDRAM_ADDR[13] W22 AC6
EBI1_ADR_13 GPIO_45 BT_UART_RXD
AD2

F F
GPIO_46 BT_UART_TXD
T19 L9
SDRAM_CKE0 EBI1_CKE0 GPIO_47 MSM_USIM_CLK VREG_MSMP_2.6V
R19 L3
SDRAM_CKE1 EBI1_CKE1 GPIO_48 R26 MSM_USIM_RST CN200
W26 L8 17 18
SDRAM_DCLK0 EBI1_DCLK GPIO_49 MICROSD_DET_N
W25 L2
SDRAM_DCLK1 EBI1_DCLKB GPIO_50 0 MSM_USIM_DATA
AB23 AD3 1 14
nSDRAM_WE EBI1_WE_N GPIO_51 MMC_DATA[3]
U20 EBI1_CS0_N GPIO_52 AE3
MMC_DATA[2] UART3_RX
nSDRAM_CS0
U19 AE4 2 13
nSDRAM_CS1 EBI1_CS1_N GPIO_53 MMC_DATA[1]
SDRAM_BA0
AC25 EBI1_BA_0 GPIO_54 AB7
MMC_DATA[0] MSM_TCK
V19 AE2 3 12
SDRAM_BA1 EBI1_BA_1 GPIO_55 MMC_CMD
SDRAM_DQS0
U26 EBI1_DQS_0 GPIO_56 AF4
MMC_CLK MSM_TDI MSM_TMS
P20 U9 4 11
SDRAM_DQS1 EBI1_DQS_1 GPIO_57 GPS_MODE
SDRAM_DQS2
L25 EBI1_DQS_2 GPIO_58 U8 JTAG_PS_HOLD MSM_TRSTN
H26 U2 5 10
SDRAM_DQS3 EBI1_DQS_3 GPIO_59 RTR6285_SSBI
SDRAM_DQM0
V26 EBI1_DM_0 GPIO_60 V2
CAM_I2C_SCL nJTAG_RESOUT MSM_TDO
N25 V3 6 9
SDRAM_DQM1 EBI1_DM_1 GPIO_61 CAM_I2C_SDA
SDRAM_DQM2
M20 EBI1_DM_2 GPIO_62 AB8
WLAN_CLK MSM_RTCK

10K
E E
J25 W8 7 8
SDRAM_DQM3 EBI1_DM_3 GPIO_63 WLAN_CMD
nSDRAM_RAS
T20 EBI1_RAS_N GPIO_64 Y9
WLAN_SDIO[3] UART3_TX
N17 V8 15 16
nSDRAM_CAS WLAN_SDIO[2]

R213
EBI1_CAS_N GPIO_65
AD26 V9 C227
nRESETOUT EBI1_RESOUT_N GPIO_66 WLAN_SDIO[1]
R214 W20 AB9
EBI1_CAL GPIO_67 WLAN_SDIO[0] 0.1u
49.9 V6
GPIO_68 BT_PCM_DOUT
E23 V5
EBI2_DATA[0] EBI2_DATA_0 GPIO_69 BT_PCM_DIN
D25 W3
EBI2_DATA[1] EBI2_DATA_1 GPIO_70 BT_PCM_SYNC
C25 W5
EBI2_DATA[2] EBI2_DATA_2 GPIO_71 BT_PCM_CLK
B23 AB17
EBI2_DATA[3] EBI2_DATA_3 GPIO_72_GRFC_9 ANT_SEL3
C23 Y16
EBI2_DATA[4] EBI2_DATA_4 GPIO_73_GRFC_8 ANT_SEL2
D26 AC17
EBI2_DATA[5] EBI2_DATA_5 GPIO_74_GRFC_7 ANT_SEL1
C26 AE17
EBI2_DATA[6] EBI2_DATA_6 GPIO_75_GRFC_6 ANT_SEL0
F25 W16
EBI2_DATA[7] EBI2_DATA_7 GPIO_76_GRFC_5
B24 AF17
EBI2_DATA[8] EBI2_DATA_8 GPIO_77_GRFC_4 MMC_COVER_DETECT
E26 AC18
EBI2_DATA[9] INTER_RX_SW_SEL_2

NEST JIG
EBI2_DATA_9 GPIO_78_GRFC_3

Array TP
C24 U16
EBI2_DATA[10] EBI2_DATA_10 GPIO_79_GRFC_2

D D
C22 Y17
EBI2_DATA[11] EBI2_DATA_11 GPIO_80_GRFC_1
E21 AF18
EBI2_DATA[12]
C21
EBI2_DATA_12 GPIO_81_GRFC_0
AC19
INTER_RX_SW_SEL_1 2010.01.18 updated
EBI2_DATA[13] EBI2_DATA_13 GPIO_82 LCD_BL_EN
B22 MPM Port Y18 VBAT VCHG_VBUS
EBI2_DATA[14] EBI2_DATA_14 GPIO_83 BT_HOST_WAKEUP
EBI2_BUSY0_N
EBI2_ADR_10
EBI2_ADR_11
EBI2_ADR_12
EBI2_ADR_13
EBI2_ADR_14
EBI2_ADR_15
EBI2_ADR_16

B21 M5
EBI2_DATA[15] EBI2_DATA_15 GPIO_84 FUEL_I2C_SCL
EBI2_ADR_2
EBI2_ADR_3
EBI2_ADR_4
EBI2_ADR_5
EBI2_ADR_6
EBI2_ADR_7
EBI2_ADR_8
EBI2_ADR_9

EBI2_CS0_N
EBI2_CS1_N
EBI2_CS4_N
EBI2_CS5_N
EBI2_CS6_N
EBI2_CS7_N

UAT200
EBI2_ADR_0
EBI2_ADR_1

EBI2_WE_N
EBI2_OE_N
EBI2_UB_N
EBI2_LB_N
EBI2_CLK

GPIO_132
GPIO_131
GPIO_130
GPIO_129
GPIO_128
GPIO_127
GPIO_126
GPIO_125
GPIO_124
GPIO_123
GPIO_122
GPIO_121
GPIO_120
GPIO_119
GPIO_118
GPIO_117
GPIO_116
GPIO_115
GPIO_114
GPIO_113
GPIO_112
GPIO_111
GPIO_110
GPIO_109
GPIO_108
GPIO_107
GPIO_106
GPIO_105
GPIO_104
GPIO_103
GPIO_102
GPIO_101
GPIO_100
GPIO_99
GPIO_98
GPIO_97
GPIO_96
GPIO_95
GPIO_94
GPIO_93
GPIO_92
GPIO_91
GPIO_90
GPIO_89
GPIO_88
GPIO_87
GPIO_86
GPIO_85

2.5G 3G
WIPER
TS_LR
TS_LL
TS_UR
TS_UL

1
GND GND
R215 100 2
UART3_RX RX RX
R216 1K TP201 R217 100 3
UART3_RX UART3_TX TX TX
F18
C18
C20
E20
H17
F20
B20
F21
B25
B18
H15
C16
B16
F17
J15
E17
J16

F23
F22
H23
J17
J18
H20
F26
H19
B19
C19
L16
G25

D2
E2
E3
F2
F3

L14
C11
J13
J14
H14
H13
F16
C15
AB20
AF19
AE19
E12
F11
F12
E11
J12
H12
J11
H11
B12
C12
F13
AF5
AF16
AF8
AE16
W10
T11
Y10
G26
M17
H18
H16
B17
C17
Y11
W18
AB18
R11
AE6
AC7
AF6
AC8
AF7
AE8
M9
M8
M6

4
NC1 VCHAR
R218 100 5
TOUCH_Y1YD
TOUCH_X2XL
TOUCH_Y2YU
TOUCH_X1XR

R219 1K TP202 REMOTE_PWR_ON ON_SW ON_SW

UART3_TX 6
VBAT VBAT
R220 7
10 0 K

NC2 PWR
TP203 8
REMOTE_PWR_ON NC3 URXD
9
NC4 UTXD
10

C C
DSR
11
RTS
12
CTS
nWE2
nOE2
nUB2
nLB2
NAND_FLASH_READY

PA_ON2
PROX_OUT

PROX_COMPASS_I2C_SCL

TCXO_EN

LCD_RESET_N
LCD_MAKERID_LOW

MLCD_VSYNC_O

WLAN_HOST_WAKEUP
WLAN_RESET_N
TOUCH_INT

TOUCH_I2C_SCL

LCD_BL_I2C_SCL
UART3_TX
PA_R1
nNAND_FLASH_CS

UART3_RX
BT_RESET_N

PROX_COMPASS_I2C_SDA

FUEL_I2C_SDA

VA200

VA201

VA202
PMIC_SSBI

TOUCH_I2C_SDA

LCD_BL_I2C_SDA

VA203

VA204

VA205
FFA

B B

A A

12 11 10 9 8 7 6 5 4 3 2 1

LGE Internal Use Only - 156 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM

12 11 10 9 8 7 6 5 4 3 2 1

L L

K K

MSM7227 Power Part MCP (4G NAND FLASH +4G DDR SDRAM)

VREG_MSME_1.8V

VREG_MSME_1.8V

VREG_MSMP_2.6V

VREG_MSMA_2.6V
VREG_AUX2_2.9V
IF YOU USE LCDC : P8 - 1.8V

USB_3.3V
For Artwork

EBI2_DATA[9]
J J

SDRAM_DATA[15]
SDRAM_DATA[25]

SDRAM_DATA[18]

SDRAM_DATA[12]
GSM_PA_RAMP

RTR6285_SSBI
TRK_LO_ADJ

0
C300 0.1u

C301 0.1u

R29
VREG_MSME_1.8V

AG8
AG9

B27

C27

D 27

E27

F27

G27

H27

J27

K27

L27

M27

N27

P27

R27

T27

U27

V27

W27

Y27

E13

E18

N11

H22
AA5

F14
E16
B1

C1

D1

E1

F1

G1

H1

J1

K1

L1

M1

N1

P1

R1

T1

U1

V1

W1

Y1

T9
U5

N5
NC_65
NC_66
NC_67
NC_68
NC_69
NC_70
NC_71
NC_72
NC_73
NC_74
NC_75
NC_76
NC_77
NC_78
NC_79
NC_80
NC_81
NC_82
NC_83
NC_84
NC_85
NC_86
NC_87
NC_88
NC_89
NC_90
NC_91
NC_92
NC_93
NC_94
NC_95
NC_96
NC_97
NC_98
NC_99
NC_100
NC_101
NC_102
NC_103
NC_104

RSVD1
RSVD2

VDD_P8

VDD_P9

VDD_P10

VDD_QFUSE_PRG

VDD_SNS_C1
VDD_SNS_C2

VDD_USBPHY_2P6
VDD_USBPHY_3P3
C3
VDD_A1 VREG_MSMA_2.6V
B4 GND1 C8
VDD_A2

100K
E14 GND2 E6

DNI
VDD_A3
F10 GND3 F9
VDD_A4
F15 GND4 J5
VDD_A5

I I

C302
R300
F19 GND5 J6
VDD_A6
G22 GND6 K5
VDD_A7
K22 GND7 K6
VDD_A8
L6 GND8 N8 TP300 N1 K4
VDD_A9 EBI2_DATA[0] IO0 A0 SDRAM_ADDR[0]
L13 GND9 VDD_A10 P9 N2 L1
EBI2_DATA[1] IO1 A1 SDRAM_ADDR[1]
L15 GND10 VDD_A11 R5 N3 L2
EBI2_DATA[2] IO2 A2 SDRAM_ADDR[2]
M12 GND11 VDD_A12 R8 M5 L3
EBI2_DATA[3] IO3 A3 SDRAM_ADDR[3]
M13 GND12 VDD_A13 T2 P7 C2
EBI2_DATA[4] IO4 A4 SDRAM_ADDR[4]
M14 GND13 M6 D2
EBI2_DATA[5] IO5 A5 SDRAM_ADDR[5]
M15 B2 N6 E1
GND14 VDD_C1_1 VREG_MSMC1_1.25V EBI2_DATA[6] IO6 A6 SDRAM_ADDR[6]
M16 GND15 VDD_C1_2 B3 R301 M8 D3
EBI2_DATA[7] IO7 A7 SDRAM_ADDR[7]
P2 E2
N12 GND16 VDD_C1_3 B26
VSNS_MSMC1_1.25V EBI2_DATA[8] IO8 A8 SDRAM_ADDR[8]
N13 GND17 VDD_C1_4 C2 0 P3 D4
EBI2_DATA[9] IO9 A9 SDRAM_ADDR[9]
N14 GND18 VDD_C1_5 E19 N4 K3
EBI2_DATA[10] IO10 A10 SDRAM_ADDR[10]
N15 GND19 VDD_C1_6 G23 P4 F2
EBI2_DATA[11] IO11 A11 SDRAM_ADDR[11]
P5 F1

H
N16 J19

H
GND20 VDD_C1_7 EBI2_DATA[12] IO12 A12 SDRAM_ADDR[12]
N22 GND21 VDD_C1_8 K9 N7 M3
EBI2_DATA[13] IO13 A13 SDRAM_ADDR[13]
P6 GND22 VDD_C1_9 K23 M7 J3
EBI2_DATA[14] IO14 BA0 SDRAM_BA0

100K
P11 GND23 VDD_C1_10 L12 N8 K2
EBI2_DATA[15] IO15 BA1 SDRAM_BA1
P12 GND24 VDD_C1_11 L17 B6
nNAND_FLASH_CS CE#
P13 GND25 M11 TP301 B3 L4
VDD_C1_12 nOE2 RE# DQ0 SDRAM_DATA[0]
P14 GND26 N23 TP302 B7 L5

R302
VDD_C1_13 nWE2 WE#2 DQ1 SDRAM_DATA[1]
P15 GND27 VDD_C1_14 P23 B4 L6
nUB2 CLE DQ2 SDRAM_DATA[2]
P16 GND28 VDD_C1_15 U11 C4 L7
nLB2 ALE DQ3 SDRAM_DATA[3]

U200
P17 GND29 VDD_C1_16 U17 C3 K8
nRESETOUT WP# DQ4 SDRAM_DATA[4]
P22 GND30 VDD_C1_17 W19 C6 L8
NAND_FLASH_READY R_B# DQ5 SDRAM_DATA[5]
R12 GND31 VDD_C1_18 Y20 K7
DQ6 SDRAM_DATA[6]
R13 GND32 VDD_C1_19 AB11 K5
DQ7 SDRAM_DATA[7]
R14 GND33 AE26 VREG_MSME_1.8V B5 K6
VDD_C1_20 VCC1 DQ8 SDRAM_DATA[8]

2.2u
1uF
R15 GND34 VDD_C1_21 AF2 N5 G7
VCC2 DQ9 SDRAM_DATA[9]
R16 GND35 VDD_C1_22 AF3
U301 DQ10
J6
SDRAM_DATA[10]

C313

C314
R17 GND36 VDD_C1_23 AF25 C5 J5
VSS6 DQ11 SDRAM_DATA[11]
T12 GND37 VDD_C1_24 AF26 P6 H6
VSS7 DQ12 SDRAM_DATA[12]

G G
T13 GND38 H5
DQ13 SDRAM_DATA[13]
T14 Y8 B8 J4
GND39 VDD_C2_1 VREG_MSMC2_1.25V VREG_MSME_1.8V VDD6 DQ14 SDRAM_DATA[14]
T15 GND40 VDD_C2_2 AC5 R303 D1 G3
VDD1 DQ15 SDRAM_DATA[15]

2.2u

4.7u
0.1u

1uF
T16 GND41 AC10 H1 G4
VDD_C2_3 VSNS_MSMC2_1.25V VDD2 DQ16 SDRAM_DATA[16]
U14 GND42 0 H10 F4
VDD3 DQ17 SDRAM_DATA[17]

C 305

C306

C307

C 308
V22 AE12 P8 E4
GND43 VDD_MDDI VREG_MSME_1.8V VDD4 DQ18 SDRAM_DATA[18]
Y6 GND44 R304 M1 F5
REV.C_0408_CHANGED VDD5 DQ19 SDRAM_DATA[19]
H3
Y19 GND45 VDD_P1_1 K25
VSNS_MSME_1.8V DQ20 SDRAM_DATA[20]
AA22 GND46 VDD_P1_2 M25 0 B9 H4
VSS8 DQ21 SDRAM_DATA[21]
AB10 GND47 VDD_P1_3 P25 C1 E6
VSS1 DQ22 SDRAM_DATA[22]
AB14 GND48 VDD_P1_4 T25 H9 F7
VSS2 DQ23 SDRAM_DATA[23]
AE5 GND49 VDD_P1_5 V25 J1 F6
VSS3 DQ24 SDRAM_DATA[24]
AE13 GND50 VDD_P1_6 Y25 P9 D5
VSS4 DQ25 SDRAM_DATA[25]
M2 E8
VSS5 DQ26 SDRAM_DATA[26]
B8 GND_A1 VDD_P2_1 E22 D6
DQ27 SDRAM_DATA[27]
D3 GND_A2 VDD_P2_2 E25 J10 D8
VREG_MSME_1.8V VDDQ0 DQ28 SDRAM_DATA[28]
E5 GND_A3 VDD_P2_3 H25 K9 D7
VDDQ1 DQ29 SDRAM_DATA[29]

F F

2.2u
0.1u
10n

1uF
E9 GND_A4 L9 C8
VDDQ5 DQ30 SDRAM_DATA[30]
H5 T5 M10 C7
GND_A5 VDD_P3_1 VREG_MSMP_2.6V VDDQ3 DQ31 SDRAM_DATA[31]

C309

C310

C311

C312
H6 GND_A6 VDD_P3_2 Y5 N9
VDDQ4
J8 GND_A7 VDD_P3_3 AE7 C9 J2
VDDQ2 CS0# nSDRAM_CS0
J9 GND_A8 VDD_P3_4 AE11 D10 F3
VDDQ7 CS1# nSDRAM_CS1
K8 GND_A9 VDD_P3_5 AE15 E9 G8
VDDQ6 CK SDRAM_DCLK0
N9 GND_A10 VDD_P3_6 AE18 F10 H8
VDDQ8 CK# SDRAM_DCLK1
P5 GND_A11 G9
VDDQ9
P8 GND_A12 AD25
VDD_P4_1
R9 GND_A13 VDD_P4_2 AE22 J9 E3
VSSQ0 CKE0 SDRAM_CKE0
T3 GND_A14 K10 B2
VSSQ1 CKE1 SDRAM_CKE1
T6 GND_A15 VDD_P7_1 E10 L10 K1
VSSQ2 WE#1 nSDRAM_WE
U6 GND_A16 VDD_P7_2 L5 M9 G2
VSSQ3 RAS# nSDRAM_RAS
N10 H2
VSSQ4 CAS# nSDRAM_CAS
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
NC_16
NC_17
NC_18
NC_19
NC_20
NC_21
NC_22
NC_23
NC_24
NC_25
NC_26
NC_27
NC_28
NC_29
NC_30
NC_31
NC_32
NC_33
NC_34
NC_35
NC_36
NC_37
NC_38
NC_39
NC_40
NC_41
NC_42
NC_43
NC_44
NC_45
NC_46
NC_47
NC_48
NC_49
NC_50
NC_51
NC_52
NC_53
NC_54
NC_55
NC_56
NC_57
NC_58
NC_59
NC_60
NC_61
NC_62
NC_63
NC_64
C10 J8
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7
NC_8
NC_9

VSSQ5 DM0 SDRAM_DQM0

D9 G6
VSSQ6 DM1 SDRAM_DQM1

E
E10 F8

E
VSSQ7 DM2 SDRAM_DQM2
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
A27
AA1
AA27
AB1
AB27
AC1
AC27
AD1
AD27
AE1
AE27
AF1
AF27
AG1
AG10
AG11
AG12
AG13
AG14
AG15
AG16
AG17
AG18
AG19
AG2
AG20
AG21
AG22
AG23
AG24
AG25
AG26
AG27
AG3
AG4
AG5
AG6
AG7
F9 E7
VSSQ8 DM3 SDRAM_DQM3
G10
VSSQ9

LOCK

DNU0
DNU1
DNU2
DNU3
DNU4
DNU5
DNU6

DQS3
DQS2
DQS1
DQS0
RFU1
RFU2
DNU
NC4
NC6
VREG_MSMC1_1.25V

B1
B10
G1
M4
P1
P10

A2
A9
A10
R1
R2
R9
R10

E5
H7
G5
J7
MDDI_P_DATA_P
MDDI_P_DATA_M
MDDI_P_STB_P
MDDI_P_STB_M
USBH_SYSCLK

2010.01.25 updated
USBH_DM
USBH_DP

SDRAM_DQS3
SDRAM_DQS2
SDRAM_DQS1
SDRAM_DQS0
D D

Cap for MSM7227 Power

C C
VREG_MSMC1_1.25V VREG_MSMC2_1.25V
FFA Rev.D 10u -> 22u

VREG_MSME_1.8V VREG_MSMA_2.6V VREG_MSMP_2.6V

0.1u

0.1u
1 0u
0.1u

0.1u

0.1u

0.1u

0.1u

0.1u
22u

10n

10n

10n

10u

10n

10u

10n

10u

10n
1n
1n

1n

1n

1n

1n

1n
1608

1608

1608

1608
1608
C315

C316

C317

C318

C319

C320

C322

C323

C324

C325

C326

C327

C328

C329

C330

C331

C332

C333

C335

C336

C337

C338

C339

C340

C341

C342

B B

A A

12 11 10 9 8 7 6 5 4 3 2 1

Copyright © 2010 LG Electronics. Inc. All right reserved. - 157 - LGE Internal Use Only
Only for training and service purposes
7. CIRCUIT DIAGRAM

12 11 10 9 8 7 6 5 4 3 2 1

L L

MUIC

K K
+VPWR

VCHG_VBUS

u-USB Connector C401

0.1u

Battery Charging Circuit

0.1u
C400
TA OVP Circuit
REV.E_CHANGED_0517

B1
VSUPPLY
VCHG_VBUS E1 C4
CN4 VBUS UART_TX UART3_TX
E2 C3
MAX_DM DM UART_RX UART3_RX
6 E3

J J
FL400 U400 MAX_DP DP ISNS_P
VCHG_VBUS
2mm
7 D3 D4

VBUS 2mm 2mm

USB_ID ID USB_DM USBH_DM
8 E4
USB_DP USBH_DP

R400
1 1 7 Q400

0.1
1 IN OUT IN1 OUT1
2
3
MAX_DM GND1 GND2
2
IN2 OUT2
8
R401 2.2K A3
R2_2K
IC1
AUDIO_L
D1
C1
ISNS_M
1% 1
DRAIN_B
10
9
2mm
MAX_DP AUDIO_R NC1 COLLECTOR_B
4 4 A4 2 8
IC1 COLLECTOR EMITTER
USB_ID 3 5 MIC
3 7
5 C2
OVLO IC2 +VPWR SOURCE BASE CHG_CTL_N

PGND
DSS

GND
9 B3 4 6
MUIC_INT VBAT DRAIN NC2

22p
_INT

1u
D400 5

1u
10
C402 GATE BATT_FET_N

ZD400
+VPWR_RF|+VPWR

6
9
11 A1 A2
22p CLDO SDA MUIC_I2C_SDA

2mm

C403

C404
FL1013 B2

C405
SCL MUIC_I2C_SCL
6

D2 +VPWR_RF C407 C408

P6

GND 100u 10n

ISET

R403

R404

R405
2 4

R20
P2 P4
1608
1 3
C409 10V
P1 P3 C48 1608

B4
10n 10u 2009.11.16 changed
5 P5

4.7K

4.7Kohms
2K

2K
I 10.04.08 Changed Rev.C
I
VREG_MSMP_2.6V

SC2

H H

G G
VBAT +VPWR VREG_MSME_1.8V USB 3.3V LDO
Trace Can Handle 80mA

PM7540
+VPWR

Fuel Gauge IC & Battery Conn.

U401
Place close to PM7540 pins
C410 0.1u 4 1
VIN VOUT USB_3.3V
0.1u 3 2

PGND
C411 USB_3.3V_EN STBY GND
C413 0.1u
C412
0.1u
ISNS_M
ISNS_P

C415 C414
33p

5
1n
C417 0.1u
0.1u 0603

F F
C418
+VPWR

C419 0.1u
C420 0.1u
VCOIN

REV.C_0408_CHANGED
C421 0.1u REV.C_0408_CHANGED
R407
0.1u
Route together

VCHG_VBUS C422
BATT_FET_N
CHG_CTL_N

4.7
VOLTAGE DETECTOR REMOVED
2.2u

N7, N9 0.5mm

VBAT
VBAT
1K
10K

1uF
R 408

0.3mm 0.3mm VREG_MSMP_2.6V VBAT

Local Ground Plan
C425
1n
1n +VPWR +VPWR_AUDIO
C424

C426
C 46 1
R425

C427 10u

2mm
1608 Place in PM7540 room at shield edge
These CAPs close to inductors
close to each other
VREG_MSMP_2.6V

80.6K
R 409
B11
L13

B10

K12
F12
F13
J12

M10

D12

4 .7 u

4.7u

4 .7 u

4.7u
C428
E2
D2
L1
D1
C1
C2
E4
F2

N9
N7

B9
D6

B8
D7

G2

1n

1n

1n

1n

L400
10u
2.2u
VCHG
CHG_CTL_N
USB_VBUS
USB_CTL_N
ISNS_P
ISNS_M
BAT_FET_N
VBAT
VCOIN
V_BACKUP

VDD_ANA
VDD_C1_E
VDD_C2_PA
VDD_GP2
VDD_GP6
VDD_MSME2
VDD_MSMP
VDD_RF1
VDD_RF2
VDD_RUIM
VDD_L_SPKR
VDD_R_SPKR
VDD_TCXO
VDD_WLAN

E
C437 1n
Turbo Mode E

15 0
C433

C434

C435

C436

D402
C429

C430

C431

C432

M7

2mm

15 0
PCB_REVISION MPP_1 3

D401
C438 10u

R410

470K
N5 K1 4
1K MPP_2 VSW_5V R413 2
D8 J1 VBAT_SENSE
REMOTE_PWR_ON R414 MPP_3 VREG_5V
L401 4.7u R415

R 411
1
0.6mm
470Kohms

R 41 2
B12 N8 VBAT_TEMP
MPP_4 VSW_MSMC1 VREG_MSMC1_1.25V
D4 M8 U404 10K CN401
MSM_USIM_RST MPP_5 VREG_MSMC1 VSNS_MSMC1_1.25V L402 4.7u 1%
0.6mm
A1 N6

2.2K

2.2K
SIM_RST MPP_6 VSW_MSMC2 VREG_MSMC2_1.25V REV.C_0408_CHANGED

680Kohms
L12 M6 3 2 C439
USB_3.3V_EN VSNS_MSMC2_1.25V

R416
MPP_7 VREG_MSMC2 VDD CELL

0.6mm
M11 N10 L403 4.7u 0.1u
GSM_PA_DAC_REF MPP_8 VSW_MSME VREG_MSME_1.8V
K8 M9 C440
MSM_USIM_CLK VSNS_MSME_1.8V

R417

R418
MPP_9 VREG_MSME

0.5mm
K9 N4 L404 4.7u 5

ZD401
SIM_CLK MPP_10 VSW_PA VREG_SMPS_2.1V 10n SEO
K5 M4 6
MSM_USIM_DATA
C441 MPP_11 VREG_PA VSNS_RF_SMPS EO Aloha 091209
K6 8 1

D 4 03
SIM_IO MPP_12 FUEL_I2C_SDA SDA CTG
M3 A2 7 4 C442 C443
0.1u

VBAT_TEMP MPP_13 VREG_GP1 VREG_LCD_1.8V FUEL_I2C_SCL SCL GND

PGND
N1 J13 1u 1u
MPP_14 VREG_GP2 VREG_LCD_2.8V
N3 N12
MPP_15 VREG_GP3 VREG_MOTION_3.0V 09.11.12 added

9
M5 A9
MPP_16 VREG_GP4
B3 B13 REV.C_0408_CHANGED
VBAT_SENSE MPP_17 VREF_GP5 VREG_AUX2_2.9V

D D
D5 E13 SERIAL RESISTOR REMOVED
MPP_18 VREG_GP6 VREG_PROX_2.8V 09.12.17 added
F4 K13
MPP_19 VREG_MMC CAM_AF_2.8V

Must Check Battery Conn. Pin Map

G4 A11
MPP_20 VREG_MSMA VREG_MSMA_2.6V
J2 G13 C444 2.2u
K2
MPP_21
U403 VREG_MSME2
H13
MPP_22 VREG_MSMP VREG_MSMP_2.6V
A8
VREG_RFRX1 VREG_RF_2.7V
H2 A10
USB_ID VREG_RFRX2
L2 A3
USB_D_P VREG_RFTX VREG_HPVDD_1.8V
M2 N11
USB_D_M VREG_RUIM1 VREG_RUIM_3.0V
H4 E12
USB_OE_N VREG_SYNT VREG_TOUCH_3.0V
C1930

J4 D13
USB_DAT VREG_TCXO VREG_TCXO_2.85V
1u

K4 M1
USB_SE0 VREG_USB
G1
VREG_WLAN VREG_MMC_3.0V
J10 G12
4 .7 u

4 .7 u

VREG_MSMP_2.6V SBST MIC_BIAS

H10 C446 C447 C448 C3 C450 C451 C454 C455 C456 C457 C40 C45
SBCK 1%
TP400 K10 A12 R423 121K
PMIC_SSBI SBDT_SSBI REF_ISET 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 1u 1u 1u

C C
TP401 D10 A13
C452

C453

PM_INT_N MSM_INT_N REG_GND

C13 C458 0.1u
REF_BYP
B6
SPKR_IN_L_M
B7 H12
SPKR_IN_L_P TCXO_IN TCXO_PM_19.2MHZ
A6 D9 TP402
VREG_MSMP_2.6V SPKR_OUT_L_M TCXO_EN TCXO_EN
A7 G10 R424 51
SPKR_OUT_L_P TCXO_OUT PMIC_TCXO
B4 Place crystal and load caps close to PM7540
SPKR_IN_R_P
B5 M13 C459 10pF
SPKR_IN_R_M XTAL_IN
A4 N13
Rev.1.1

32.768KHz

SPKR_OUT_R_P XTAL_OUT
1

A5
X400

SPKR_OUT_R_M CITIZEN -> NDK

R426

150K

R1 SLEEP_CLK
K7
SLEEP_CLK Route together
2

B2 M12 C460 10pF

VIDEO_IN AMUX_OUT AMUX_OUT
PCB_REVISION B1
VIDEO_OUT
NX3215SA

N2 C12
KPD_PWR_N
430Kohms

VIB_DRV_N KPD_PWR_N
E1 F10 D404
R427

R2 BACKLIGHT_KEY F1
KPD_DRV_N PON_RESET_N
E10
nPON_RST
LCD_DRV_N PS_HOLD PS_HOLD
H1
REV.1.0_0624_CHANGED FLSH_DRV_N
REV.E_CHANGED_0517

B B
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
GND19
GND20
GND21
GND22
GND23
GND24
GND25
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9

JTAG_PS_HOLD
C462
R428
E5
E6
E7
E8
E9
F5
F6
F7
F8
F9
G5
G6
G7
G8
G9
H5
H6
H7
H8
H9
J5
J6
J7
J8
J9

HKAIN0 : PCB Revision Check ADC DNI

REV R1 R2 ADC
200K
A&F 150K 10K 0.16V

B&G 150K 47K 0.62V

C&H 150K 68K 0.81V

D&I 150K 100K 1.04V

E&J 150K 150K 1.30V

Rev.1.0 150K 300K 1.73V

Rev.1.1 150K 430K 1.93V

Rev.1.2 150K 680K 2.13V

A A

12 11 10 9 8 7 6 5 4 3 2 1

LGE Internal Use Only - 158 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM

12 11 10 9 8 7 6 5 4 3 2 1

L L

Wi-Fi&BT&FM MODULE
K Must Check Schematic K
ANT2
C17 ANT1

RF_IN_OUT
47p
L4 C16

Audio SUB SYSTEM

DNI
DNI TP13
WLAN_HOST_WAKEUP
TP11
BT_UART_RXD
TP3
BT_UART_RTS
TP1
BT_UART_CTS +VPWR_AUDIO
TP9
BT_UART_TXD

J J

54
53
52
51

50
49
48
47
46
GND1
GND2
GND3
GND4

WL_HOST_WAKE_B
BT_UART_TXD
BT_UART_CTS_N
BT_UART_RTS_N
BT_UART_RXD
1

10u
39p
RF_IN_OUT ANT

1u
45
BT_PCM_CLK BT_PCM_CLK
2 44 C505 47p
close to 3

C502

C504
C503
GND5 BT_PCM_OUT BT_PCM_DIN
3 43
VDD_WL_PA BT_PCM_SYNC BT_PCM_SYNC
42 C506 47p
BT_PCM_IN BT_PCM_DOUT
TP8 4
C18 C32 WLAN_CMD SDIO_CMD
0603

TP7 5 41
10uF 0.1u WLAN_CLK SDIO_CLK VDD_BT_PA VREG_MSMP_2.6V
6
WLAN_SDIO[3]

D4
SDIO_D3
7 40
WLAN_SDIO[2]
8
SDIO_D2 U500 S_CLK_IN
39
SLEEP_CLK C7 C9

SVDD
WLAN_SDIO[1] SDIO_D1 GND6 8pF 2.2u
9 38 C1 0.001uF
WLAN_SDIO[0] SDIO_D0 FM_ANT FM_ANT C5
OUT+ SPK_RCV+
D5
TP4 10 37 TP5 OUT- SPK_RCV-
WLAN_RESET_N WL_RST_N BT_GPIO_0 BT_WAKEUP C2
11 36 TP12 HPH_R C507 1u
IN1-
WL_WAKE_B BT_GPIO_1 BT_HOST_WAKEUP C508 1u C1
TP10 12 35 HPH_L IN1+

I I
R1 WLAN_REG_ON REG_ON BT_GPIO_3 A2
13
VBAT_IN BT_GPIO_4
34
C509 33n R1171 2.2K D2
IC500 HPL
A1
EAR_L
+VPWR
L1 33 LINE_OP IN2- HPR EAR_R
0 BT_GPIO_7 C510 33n R1170 2.2K D1
C34 4.7uF 14 LINE_ON IN2+
SR_VLX1
3.3uH 15 32
C5 C2 SR_VLX1BB F_CLK_IN CLK_IN R1177 10 D3

0.1u

0.1u
C511 1u
4.7uF 0.1uF
31 RCV_P IN3-
F_CLK_OUT R1176 10 C3 B5

ANLG_1P2_OUT
C514 1u
RCV_N IN3+ CPVDD

DIG_1P2_OUT

VIN_1P2VLDO
A3

LNLDO2_OUT
SR_VOUTBB
CPVSS

SR_VLX2BB

C512

C513
VDDIO_SD

BT_RST_N
A4

XTAL_PU
CP

BT_SDA
BT_SCL
AUDIO1
AUDIO2
VDDIO
A5

GND7
L3 VREG_MSMP_2.6V CN

HPVDD
C515 2.2u

BIAS

GND
4.7u

SDA
SCL

20

20
16
17

18

19

20

21
22
23
24

25
26
27
28
29
30

4.7K
4.7K
C518 C519

B3
B2

B1

C4

B4

R502

R503
2.2u 2.2u

R504
R505
C522

H H
AUDIO&MOTION_I2C_SCL C523
DNI
AUDIO&MOTION_I2C_SDA 2.2u

0603
C31 C8
TP6
BT_RESET_N

0603
1u
0.1u
FM_R
VREG_MSMP_2.6V VREG_HPVDD_1.8V
FM_L

C19
close to 17
10uF

C30
C33 C6

0603
4.7uF 2.2uF
0.1u

G G
CLK_REQ

+VPWR
TCXO LDO 26MHz TCXO
VDD_TCXO

U501

4 1
VIN VOUT VDD_TCXO 26MHz
3 2
PGND

X500
CLK_REQ STBY GND

F F
VCC GND
4 2
100K

C535 1n
2.2u

C533
0603

CLK_IN OUT NC
1u
0603

3 1
0603 TG-5010LH-87N
C534
R 506

C536
0603
1u

3.5pi Ear Jack Connector

E E
VREG_MSMP_2.6V

U502

4 1
VIN VOUT 10.04.08 Changed Rev.C
3 2

PGND
HS_MIC_BIAS_EN STBY GND
C537 C538 VREG_MSMP_2.6V
10u 33p

5
C539
2.2u

Q601
R507

2.2K
EARJACK_SENSE

R1168
D D

1M
R1169

47K

G
MIC FM_ANT
EAR_R
R509 12
FB500
1800
M6_GND 2
M1_R 3
M4D-DETECT 6

changed 12/28
FB501
1800
R515 12 M3_DETECT 5
EAR_L
FB502 1800 M4_L 4
HS_MIC J2
M5_MIC 1

MIC_BIAS

C MIC1
C542
47p
C543
47p
C544
33p
C545
47pF
L504
270n
R520

10K
R521

10K
C
1800

D 500

D501

D502

D 503

D504
FB700 1
MIC_1P OUT
EAR_SENSE STATE
2
G1
3 LOW(DEFAULT) UNMATING
1800 G2
FB701 4
G3 HIGH MATING
MIC_1N 5
PWR
6
G4
2009.11.16 added
2
C700 VA615C702 C703
33p 33p 33p
1

B B

A A

12 11 10 9 8 7 6 5 4 3 2 1

Copyright © 2010 LG Electronics. Inc. All right reserved. - 159 - LGE Internal Use Only
Only for training and service purposes
7. CIRCUIT DIAGRAM

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L
BACKLIGHT CHARGE PUMP 3M CAMERA L
LGIT_1/4'' SVCY0024801(C3AA-Y314A)

CAMERA EMI FILTER

CAM_AVDD_2.7V CAM_DVDD_1.2V CAM_IOVDD_2.6V

+VPWR
Rev.E Changed _ 0517
7.5pF
FB602 FB600
C600 C601

K K

4.7ohms
120 120

FB601

10
1u 1u

5
2.2u

G1
G2
2. 2u
FLT_CAM_DATA[0] CAM_DATA[0]

24

22

21
INOUT_A4 INOUT_B4

2
4 6
FLT_CAM_DATA[1] CAM_DATA[1]

C607
INOUT_A3 INOUT_B3

C2+

C1+

C1-

C2-
3 7

2.2K

2.2K
VREG_MSMP_2.6V C605 FLT_CAM_DATA[2] INOUT_A2 INOUT_B2 CAM_DATA[2]
C604

C602
7 1 2 8
IN1 OUT WLED_PWR C606 4.7u FLT_CAM_DATA[3] INOUT_A1 INOUT_B1 CAM_DATA[3]
4.7u 1 9
4.7u FL600
23 12 CN600

R603

R604
IN2 BL1 WLED1
13 1 34 CAM_AF_2.8V 1608
BL2
14
WLED2 CAM_MCLK 2 33
BL3 WLED3
15 R605 12 3 32
BL4
19
WLED4 CAM_PCLK 4 31
7.5pF

J J
BL5 WLED5
R600 R601 U1007 18 5 30
BL6 WLED6
6

10
17 29
4.7K 4.7K CAM_RESET_N

5
BL7_AUX1 WLED7
16 7 28
FLT_CAM_DATA[0]

G1
G2
BL8_AUX2
5 10 8 27
LCD_BL_EN EN LDOA VREG_MOTOR_3.3V FLT_CAM_DATA[1] CAM_I2C_SDA FLT_CAM_DATA[4] INOUT_A4 INOUT_B4 CAM_DATA[4]
9 26 FB603 4 6
FLT_CAM_DATA[2] CAM_I2C_SCL FLT_CAM_DATA[5] INOUT_A3 INOUT_B3 CAM_DATA[5]
9 10 25 120 3 7
LDOB CAM_AVDD_2.7V FLT_CAM_DATA[3] FLT_CAM_DATA[6] INOUT_A2 INOUT_B2 CAM_DATA[6]
3 11 24 2 8
LCD_BL_I2C_SDA SDA FLT_CAM_DATA[4] FLT_CAM_VSYNC FLT_CAM_DATA[7] INOUT_A1 INOUT_B1 CAM_DATA[7]
8 12 23 1 9
LDOC CAM_DVDD_1.2V FLT_CAM_DATA[5] FLT_CAM_HSYNC
13 22 FL601
4 11
FLT_CAM_DATA[6] 14 21
LCD_BL_I2C_SCL SCL LDOD CAM_IOVDD_2.6V FLT_CAM_DATA[7] CAM_PWDN 1608
15 20
7.5pF

AGND
PGND
C609 C610 C611 C612 16 19

EP
2.2u 2.2u 4.7uF 2.2u 17 18

I I
R602

100K

10
6
20
25

5
C608 VA607

0.1u

G1
G2
1uF
10 u
33p
INOUT_A4 INOUT_B4
4 6
INOUT_A3 INOUT_B3
3 7
FLT_CAM_VSYNC

C613

C614

C615
INOUT_A2 INOUT_B2 CAM_VSYNC
2 8
FLT_CAM_HSYNC INOUT_A1 INOUT_B1 CAM_HSYNC
1 9
FL602

1608

H H
KEY BACKLIGHT LED
3.2" HVGA LCD Connector
G +VPWR
REV.E_CHANGED_0517
VREG_LCD_1.8V VREG_LCD_2.8V
LEVEL SHIFT G
CN601
1 24

LCD_RESET_N
2 23
LD1 LD4 LD3 LD2
FL6031 5
P1 P5 MDDI_P_DATA_P
2 6
3 22 P2 P6 MDDI_P_DATA_M
3 7
P3 P7 MDDI_P_STB_P
4 8
4 21 P4 P8 MDDI_P_STB_M VREG_LCD_1.8V VREG_MSMP_2.6V
LCD_MAKERID_LOW

G1
G2
5 20

9
10
F F
LCD_VSYNC_O
6 19
U601
R1174

R1172

R1173

R1175

1 6
1

7 18 VCCA VCCB

2 5
LCD_VSYNC_O A B MLCD_VSYNC_O
8 17

WLED7 WLED6 3 4
9 16 GND OE_

WLED5 WLED4
BACKLIGHT_KEY 10 15

WLED3 WLED2
11 14

WLED1 WLED_PWR
12 13

E E
C1931 C616 C617
2.2u
D600 2.2u 2.2u
6 1

5 2 C4
4.7u
4 3

ZD1
MAIN-SUB CONNECTOR
D D
Q-coin MOTOR
CN2
1 24

2 23

VCOIN VREG_MMC_3.0V

USIM Socket
3 22
VREG_MSMP_2.6V MICROSD_DET_N
4 21

MMC_COVER_DETECT MMC_CMD
5 20
VREG_MOTOR_3.3V VREG_MOTOR_3.3V MMC_DATA[0]
6 19
VREG_RUIM_3.0V
VREG_RUIM_3.0V MMC_DATA[1] MMC_CLK

C C
7 18

MMC_DATA[2] MMC_DATA[3]
R612 100K 8 17
1%
U602
9 16
5.1Kohms

MTR_N_2sub MTR_P_2sub
R611

BYPASS GND 10 15
C1 B2
VCC GND D601
1 5 _SHUTDOWN VO- MTR_P_2sub 11 14
SIM_RST RST VPP 1 6 B1 A1
2 6 SPK_RCV+ SPK_RCV-
CLK I_O SIM_CLK R614 R615 R616
SIM_CLK 3 7
SIM_IO 1% IN+ VO+ 12 13
RESERVED1 RESERVED2 1%51K C2 B3
MTR_N_2sub
4 8 2 5 4.7Kohms 1K
1ohms

C622 R617
L600

GND2 GND1
10 9 IN- VDD
J1 33pF 1%51K C3 A3
3 4

B B
C OUT
SIM_IO SIM_RST
B Q600
C618 C619 C620 C621 LIN_PWM_FREQ IN
33p 33p 33p R618 1% 100K
0.1u R619
E GND 1%
1K C623
C625 10n C624

0.1u 0.1u

A A
OJ600 OJ601

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

LGE Internal Use Only - 160 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L L

K K

POWER KEY HOT KEY VOLUME SIDEKEY TOUCH

2010.01.20 updated VREG_TOUCH_3.0V

J KEY_COL[0] KEY_COL[1]
KEY_ROW[0]
R610
R25
470
470
1
2
CN3
J
KEY_ROW[1] 3
R613 470
KEY_COL[2] 4
KB701 KB702

HALL IC(N.A)
CN5

KPD_PWR_N R3 R2
2
MENU CN1
1 KEY_ROW[0] G1 G2 4.7Kohms 4.7Kohms
VA2 KB703 0603
KB704

VA609

VA610
1 10

VA1
2 9
SEND HOME 3 8
TOUCH_I2C_SCL
KEY_ROW[1] 4 7

I I
TOUCH_INT TOUCH_I2C_SDA
5 6

EVLC5S01033
0603 G3 G4
SEVY0008101

VA611 VA612 VA613 VA614 REV.C_0408_CHANGED

H H

G G

DOCKING Digital Compass Proximity Sensor Acceleration Sensor

Must Check Schematic
F VREG_MOTION_3.0V VREG_MSMP_2.6V VREG_MSMP_2.6V F
VREG_PROX_2.8V VREG_MOTION_3.0V

C704
C706

10n
470n

0.1u
R701 R702 R700
C541
10u
4.7Kohms 4.7Kohms

C540
E E
U700 10
8 1 R703
PROX_COMPASS_I2C_SCL SCL LEDA
10
7 2 C705
PROX_COMPASS_I2C_SDA SDA LEDC
U1 10u
6 3
3
2
1

VIO VCC
PROX_COMPASS_I2C_SCL
AVDD
GNDA
DVDD

2.2K

2.2K
5 VOUT 4
4
SCL SDA 12 GND PROX_OUT U503
PROX_COMPASS_I2C_SDA
5
NC1 DRDY 11 KR3DH
6
COMPASS_DRDY
10

R518

R519
ADDR VPP

VDD
RESERVED2
GND4
C707 C708 C709
GNDS
VREG
INT

0.1u 4.7u
1u
GND3 VDD_IO

D D
7
8

GND2 NC1

MOTION_INT INT1 NC2

RESERVED1 SCL_SPC MOTION_I2C_SCL

SDA_SDI_SDO
INT2 GND1

SDO_SA0
CS
MOTION_I2C_SDA

C C

REV.E_CHANGED_0517

B B

A A

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

Copyright © 2010 LG Electronics. Inc. All right reserved. - 161 - LGE Internal Use Only
Only for training and service purposes
7. CIRCUIT DIAGRAM

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L L
LGP500_SUB_PCB_Rev A
K K

J J

I I

Main2Sub B2B VIBRATOR(Q-Motor) BACK-UP BATTERY Micro SD Socket

VREG_MMC_3.0V VREG_MSMP_2.6V

H 1
CN1
24
VREG_MMC_3.0V
H
2 23
VB700

15n
L3
VCOIN
3 22 MTR_N_2sub

15n
2
VREG_MSMP_2.6V

L1
MMC_CD
BAT1
4 21 MTR_P_2sub
1 R709
MMC_CMD

220K
MMC_COVER_DETECT VCOIN

47K

47K

47K

47K

47K
VA4

VA3
5 20 1K
MMC_DATA[0]

R 710

220K
C701 S700
6 19 1u GND

R707

R706

R705

R704

R703

R700
MMC_DATA[1]

G G
MMC_CLK
7 18 MMC_DATA[2] DAT2
MMC_DATA[2] MMC_DATA[3] MMC_DATA[3] CD_DAT3
8 17 MMC_CMD CMD
VDD
9 16 MMC_CLK CLK

SPEAKER PAD
MTR_N_2sub MTR_P_2sub VSS
10 15 MMC_CD CARD_DETECT
MMC_DATA[0] DAT0
11 14 MMC_DATA[1] DAT1
SPK_RCV+ SPK_RCV-
COVER_DETECT1
12 13 MMC_COVER_DETECT
C705
1u

F F
ENBY0034101 CN701
33n
L2

VA701

VA702

VA700

VA703

VA704

VA705

VA706
GB042-24P-H10-E3000 1
SPK_RCV+
33n
L4

2
SPK_RCV-
VA1

VA2

E E

D D

C C

B B

A A

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

LGE Internal Use Only - 162 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 8. BGA Pin Map

8. BGA
8. BGA PINPin
MAP Map

MCP

͑
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
Copyright © 2010 LG Electronics. Inc. All right reserved. - 163 - LGE Internal Use Only
͑ for training and service purposes
Only
8. BGA Pin Map

MSM7227

͑
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
͑

LGE Internal Use Only - 164 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 8. BGA Pin Map

RTR6285(Top View)

͑
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
͑
Copyright © 2010 LG Electronics. Inc. All right reserved. - 165 - LGE Internal Use Only
Only for training and service purposes
8. BGA Pin Map

PM7540(PMIC)

͑
ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ͑
͑

LGE Internal Use Only - 166 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT

R703 C705

R1169 R702

R700
C708
C709
C707
R701

Q601
U700 CN 5
R1 1 6 8

R1175
C1931
VA611 VA613

VA612 VA614

R1172 R1173
LD1

LD2
KB702 KB704 LD4 LD3 KB 7 0 3 KB701
R1174

C201 C202 MIC1 : Microphone

VA615

FB700
FB701 MIC1
- no far-end voice
C203
- no voice recording

LG-P500h_MAIN_SPFY0233701-1.1_PLACE_TOP

Copyright © 2010 LG Electronics. Inc. All right reserved. - 167 - LGE Internal Use Only
Only for training and service purposes
 Only for training and service purposes
Copyright © 2010 LG Electronics. Inc. All right reserved. - 168 - LGE Internal Use Only
LG-P500h_MAIN_SPFY0233701-1.1_PLACE_BOT
CN4
- no Serial Connection. ANT1002
ANT1003

- no USB Connection.
D 400
ZD 400

CN4 : I/O conn.

FL400

FL1013
C402

C 4 03 C 405
E
C400

D
IC1 C
B
U 40 0
C404

C401

C1007
R 1005

- no USB/Serial Connection R1004

C 1009

- RF Sensitivity & TX Power

C48
R20

R401
R405
R403
R404

C 1003
- no Booting - no Service
IC1 : MUIC U1005 : PAM
C 408
D403

R 11 C 439
C1115
C1114
C1113

R6

R5
SW1001

L11
R4 R 413
ZD401

C1005
CN401

R1027
R400

R409
Q400

C 1117
C407

R7 L1004 R 416

R15
U 1005

C1116
L10 41
C409

R 16

- RF Sensitivity & TX Power

C1112
U1002
R415

- no Battery Charge
C 1043 FL1010 C 440
C 1048
R 418

L1040
R 412
R410

U404
D401

C 1090

- no Service

C1044
FL1008
R 417

C1103
C1104
C 1045
R 411

C1111
C1102
Q400 : Charging IC
C 1047 C 1051 C 1108

C13
C11
C 443 C 442

L1035
L1031
L1120
C1081
C 1079 L1021 C 1109 L115 0

U1002 : FEM&GSM PAM

C 23 C 25
R 1006 C 1110

L9

L1002
L1006
L1009
L1012
C27

C1014
C1021
C1039
C1041
L1110
L5

L1151
FL2

FL1009

L2
C 22

C1024
C1154

C24
C26
FL1001 FL1002

C12
C 20

R1178

U2
L1022 L1 029
C622
C620

R8

C1077
L1130

R18
- no power On

R14
R9
L1003 L1008 L1011 L10 14 R 10 C 1089
R 611

- RF Sensitivity & TX Power

L1016
C1078
L1020 C 1075 L1033

L7
L10

C14
R24
C1128

C1016
C1004
C1025
C1023
C1040
C1036
C1052
C1042
C 15

C1928
C1148
D601

CN401 : Battery Conn.

L1015
L1005 L1007 L1010 L1013 C 28 C 10

- no Service

C1728
C 1034 L6

FL1012

R12
C619
C618

R1022 R1023 R1163

R1021
U1003
R1029
C 1033

C1046
C1094 C1929
C 1122 R 215
C 1060

U1001 : Transceiver

C1095
C 1058 C 1011 L1042
L600
R216

C1123
C 1059 C 1017 L1048
C 10 83 J1
C 1057

C1096
V A 203

L1027
L1030

C1076
C1087
C 1012 C 37

- No SIM
L1026

L8
FL1
C 621

L4000
C 1092 C 1020 C 36 L 1025
V A 201
C 1088 C 1022 L1018 C 10 69

U1001
FL10 03 C 10 72

J1 : SIM Conn.

C1070
- no Service
L1 019 C 1080

FL1005
R219

C 10 73
VA204

F L10 06
C 1015 R 1015 C 1153

C1019 C1010
V A 205
R218 VA202 R217 VA200

C1049
R1019
R 1017 C 1055

C1162
L1017 C1071
C 1 160 C 1 086 R 408

- no Power On

C1062
C1061
R 1018 C 1067
C 1 050 C 1084
FB3 C 424

C1068
R 101 0

C1056
C 1038 R 407
R 1 016 FB2

C1054

C1066
C1065
C1064
C1053
C 1037
C 1163

C1063
C1028
C1027
C1013
C1030
C1029
C1018
C1032
C1031
R 1012

X200 : 19.2Mhz X-tal - RF Sensitivity & TX Power

C706
C704

- no Service
R 213 R 200 C 200 C 541 C 206 C 205 C 210 C 221 R 21 0 TP202 TP201 TP203

14
C225
C 227

C224
R 5 19 R 518

C207
X200 U1
U1003 : PAM

R602
R600
R601
- no LCD backlight

CN200
U201
U202

C602

8
7
C 600 U503
R 205 C 208 R 209 R 208 C 220

C226
R212
U1007 : ChargePump
C 610
R 203
C 611
U1007

C601
C 612

C540
C 323 R207
R 303 R 26

- no Service
C 609

C320
C219
C 3 25 C 316

C333
C315
D 200 R 29 C 412 C 417

C324
C335
C336
C337
R 301 C 1930 C 437

C607
U 601 C 326 C 2 04 C 703

C213
C211
C 432

C338
C 411

- no Power On
D 201

C438
C428

D402
- no Servive
L404 L400

L
J

Y
V
T
P
K
F
E
B
A

U
R
N
H
D
C

M
G

W
C 214 C 413

AF
AE
AB
AA

AG
AD
AC
C 436

1
C 212

L
J
K
F
E
B
A

N
H
D
C

M
G

R202
C339
C340

ZD1
- no Booting

1
C 702

- no Power On

C430
L402

C434
C 216

R201
C341
C342
C 447
C 700

C4
U403 : PMIC
C 422

U200 : DBB
C 21 5

C429
L401

C433
C 410

13
12
C 217
U403
C 415

R19
C 218

FL603
TP400
C 431 C 454

TP402
R 204
L403

U200

TP401
C 435 C 452
C 32 9 C 330

TP200
13
CN601
C 30 0 C 455 R 423
C 427

R214
R220
R424
- no Display
C 458

D600
R 206 C 441

24
C 425 C 460 C 459
C 301 R 304

R211
C222
C453
C420
C419
C421
C418

R426
R427
C 426

C457
C450
R414
C 322 C 462
X400

C223
CN601 : LCD Conn.

C616
27
C 319 C 40
R 425

C318
C317
C451
C448
C444
C446
C456

C414
C3

U401
C 332 C 461

C617
D404

C328
C 331 R 428

L
F

K
E
B
A

H
D
C

P
R
N
C 30
C 327

C34

TP301
L1
C 308

L3

TP300
C6
R 506

C2
R1

C33
C19
C 311 C5
C 1129 C 1120

C8
C31

Q600

L1043
L1045
U501

C1121
U1006
TP3

C1119
L1039
C1106
R 1030

C533
R 302 TP TP1

C534

R619
R617
R614
C 1130 C 1105 TP11
C 1099 C 302

TP4TP109
TP8
U301
R 1025

- no FM Radio
R 300

C625
R618
R615

FL1011
TP7

TP6
C 1098

TP302
U1004
C 1 127 L1036 C 536 C 535

- no Booting

R616
C623
C624
- no BT Connection

C18
CN3

10
C 1093
U500
L1028 X 500
C 32
U602

FL1007
U301 : Memory

R1026

C1097
U500 : BT+FM Radio Module

L1044 C1118
C 1 107 R 612 C 306 C 307 C 312 C 314 C 309 C 305 C9 C7
L1034 C 1091 L1032 C 606
TP13

C313

FB601
C 310 R 603 R 604 FB 602 C 605 FB 600 C604 TP1T
2P5 C1 VA609 VA1 VA610
R 610 R 25 R 613
VA2

C16
C 503 C 502

- no touch sensing
L4 C 17

R1176
R1177
C 5 04
C 523 C 519 C 45

34

L12
FL602
C 514

R605
C608
VA607
CN1 : Touch Connector

C515
C506
C505
13
21
C 511

C518
10

11
10

FB603
54
CN1

C509
FL601 FL600

6
5
A N T1005

C522

C615
IC500
- no Camera
CN2

1A
B
E

CN600
C510

D
R1170 R1171
R 509

C613
R2 R3

C614
R515
C543
D501
R 505

42
C 542

CN600 : 3M Camera DOP Connector - no GPS/WiFi/Motor

ANT1

C513
C512
C50820
C507
R 504

17
18
R 521
D504 D500
A N T1 006
FB 501 R 520 R 502

C537
CN2 : GPS,WIFI,Motor Connector
FB 500 R 503

C539
ANT2
R 507

- no Sound

C538
U502
J2 : 3.5pi Ear-Jack - no Sound

L504
D503

FB502
D502
Signal Distributor

C545
C 544 IC500 : Audio AMP Sub System &
J2
9. PCB LAYOUT
9. PCB LAYOUT

VA3

VA4

VA 1

VA702

R706
VA2 C701 VA701 VA705

VA700
R705
R709 R707 R704

R710

VA703

C706

VA704

VA706
R700

R703
C705

BAT1

LG-P500h_F_SUB_SPCY0242301-1.1_TOP

Copyright © 2010 LG Electronics. Inc. All right reserved. - 169 - LGE Internal Use Only
Only for training and service purposes
9. PCB LAYOUT

VB700
CN701

L3

L1
L2 L4

S700

CN1

LG-P500h_F_SUB_SPCY0242301-1.1_BOT

LGE Internal Use Only - 170 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 10. RF CALIBRATION

10. RF CALIBRATION

10.1 Configuration of Tachyon

10.1.1 Configuration of directory

LG-P500h/ LG-P500h
LG-P500h
LG-P500h
LG-P500h
LG-P500h

Copyright © 2010 LG Electronics. Inc. All right reserved. - 171 - LGE Internal Use Only
Only for training and service purposes
10. RF CALIBRATION

10.1.2 Description of basic folders

F o ld e r D e s c rip tio n
Tachyon Exe file and MFC dll, UI dll is present.
Common dll files.
Common
(XML Data I/O , Auto Test Logic, Tachyon Logic Control, Communication)
Envirement files.
Config
(Port configuration, Loss adjust)
Instrument Tester control dll.
Model files is present.
Model (Model -> Solution (Qualcomm, EMP, ADI, INFINEON) -> MODEL
NAME(LGGW620, LGSH470, ..) -> BUYER NAME(SKT, TEL, VIVO, …)
OCX Conponent files.
PhoneCmd Phone communication file
Report Files is present.
Report
(Cal data, test data)

10.1.3 Description of configuration files

F ile D e s c rip tio n

There are imformations to calibrate.
‘MODEL NAME’_Calibration.XML
It consist of calibration items.
‘MODEL NAME’_CallSetup.XML There are imformations to call.
It consists of default values.
‘MODEL NAME’_NV.INI
It is written when ‘cal&auto’ is begun.
‘MODEL NAME’_Sequence.XML It is described a testing procedures.

LGE Internal Use Only - 172 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 10. RF CALIBRATION

10.2 How to use Tachyon

10.2.1 Model selection
Follow the procedure before start calibration & auto test

a. Click the icon, in tool bar. Then, you can see the below screen.

b. Select Model “LGP500h”

Copyright © 2010 LG Electronics. Inc. All right reserved. - 173 - LGE Internal Use Only
Only for training and service purposes
10. RF CALIBRATION

c. Select the model : You should select “LGP500h”

d. Select the buyer (must be double clicked) Then, you can see “PASS” in Config File Check.

e. Click select button

LGE Internal Use Only - 174 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 10. RF CALIBRATION

10.2.2 Start cal & auto

a. Click calibration & autotest button, in Tool bar.

b. Calibration & autotest will be executed in order.

1) Precede Action.
- NV write
- Test command send.
2) Calibration
3) Auto test
4) After action
- Phone reset
- Change UE to AMSS

Copyright © 2010 LG Electronics. Inc. All right reserved. - 175 - LGE Internal Use Only
Only for training and service purposes
11. STAND ALONE TEST

11. STAND ALONE TEST

Hidden Menu Start

Start shortcut keys: 3845#*500#

Hidden Menu List

Start the desired menu: Menu, click

Version Info
Classified Information representation

Factory Reset
Format SD Card : SD Card Data reset
Factory Reset : Changing the Factory
Delete Userdata : Disabled

LGE Internal Use Only - 176 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 11. STAND ALONE TEST

Device Test List

Auto All Test :
-> Auto All Test menu click
-> Continuous information on the menu, giving you ability test

Auto All Test Result

Auto All Test Result
-> From the factory with the ability to view the results screen

Device Test List

Auto All Test : Device functionality testing at the factory to use
Auto All Test Result : Test Result
LCD Test : Display test(Color)
Proximity Test : Proximity Sensor
Vibrator Test : Vibrator test
Camera Test : Camera & Cam test
Sound Test : Sound test
RTC Test : Date/Time Setting
Touch Test : Display touch test
Motion Sensor test : Motion Sensor test
External Memory Test : SD Card Write test
Compass Test : Compass Test
GPS Test : GPS Test
IRT Test : N/A

Copyright © 2010 LG Electronics. Inc. All right reserved. - 177 - LGE Internal Use Only
Only for training and service purposes
11. STAND ALONE TEST

LCD Test List

Manual Test : Click on the following screen
Automatic Test : Automatically, without clicking

- White Display
- Black Display
- Red,Green, Blue, White Display
- Red,Green, Blue, White Display 2

Proximity Test
Phone contact with your fingers in the top of the sensor
determine the sensor response

- Away 1
- Near 0

Vibrator test
A case-by-state vibration tests

LGE Internal Use Only - 178 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 11. STAND ALONE TEST

Camera test
Menu features disabled
This feature is part of Auto All Test replaced by
-> Auto All Test
-> Camera test
-> Cam test

Sound test
Ring : Ringtone test
Effect Sound :
Message Tone :
Loop Back test : Mic & Speak loop Back test
Audio CAL Tool : Setting

-> Ring menyujung Enabled

RTC test
Date & time : setting

Copyright © 2010 LG Electronics. Inc. All right reserved. - 179 - LGE Internal Use Only
Only for training and service purposes
11. STAND ALONE TEST

Touch test
Finger Print : Free mode test
Grid Touch Test : Block mode on touch point mode test
Touch Key Test : key test
Grid Touch Color Change
Block Touch Test

Motion Sensor test

Motion Sensor test
-> 4 Check the operation of the sensor in the direction of lean

External Memory Test

SD Card test
-> Write a test check of the SD Card memory

LGE Internal Use Only - 180 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 11. STAND ALONE TEST

Key / Compass Test

SD Card : Check Recognition
SIM Card : Check Recognition
Up/Down key : Check Recognition
End Call key : Check Recognition
Menu key : Check Recognition
Home key : Check Recognition
Back key : Check Recognition
Search key : Check Recognition
Compass test

GPS Test
GPS test : GPS check recognition

ELT Test
Automatic Mode
Manual Mode :

Copyright © 2010 LG Electronics. Inc. All right reserved. - 181 - LGE Internal Use Only
Only for training and service purposes
11. STAND ALONE TEST

ELT Test
Automatic Mode : LCD Automatic on/off test
-> time setting

ELT Manual Test

LCD Backlight
Ringtone
Vibrator
Camera
Audio Loopback
-> test on the device is working
(The ability to use plant)

LGE Internal Use Only - 182 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW

ACGM01 Location Description

SMJY00 MTAD00 MBJZ01 ABFZ01 Bracket Assembly
SJMY00 Motor,DC
SVLM00 ABFZ00
EBR00 PCB Assembly,Flexible
SUSY00 Speaker Module
ACGM00 Cover Assembly,Rear
EAA00 Antenna,PIFA
MBJZ00 SMZY00 Touch Window Assembly
AKAC00 Keypad Assembly,Main
SVLM00 LCD,Module-TFT
AKAC00 ACGM01 Cover Assembly,Front
MTAD00 Tape,Window
MBJZ00 Button
MBJZ01 Button
EBR01 SPKY01 ACGM00 ABFZ00 Bracket Assembly
ABFZ01
EBR01 PCB Assembly,Main
ACKA00 Can Assembly,Shield
EBP00 ADCA00 Dome Assembly,Metal
EBR00 SPKY00 PCB,Sidekey
SUSY00 SJMY00
EBP00 Camera Module
SPKY00
SPKY01 PCB,Sidekey
SUMY00 Microphone,Condenser
GMEY00 GMEY00 Screw,Machine
ADCA00 EAA00 GMZZ00 SCREW MACHINE
ACKA00
MBFZ00 MBFZ00 Bracket
SBPL00 Rechargeable Battery,Lithium Ion
SUMY00 SBPL00
ACQ00 Cover Assembly,Battery
GMZZ00 ACQ00

Copyright © 2010 LG Electronics. Inc. All right reserved. - 183 - LGE Internal Use Only
Only for training and service purposes
LGE Internal Use Only - 184 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Mechanic component> by SBOM standard on GCSC

Location
Level Description Part Number Spec Remark
No.

1 AGQ000000 Phone Assembly - AGQ86291501 LGP500H.AVIVBK BK:Black -

2 ACQ100400 Cover Assembly,EMS - ACQ85324601 LGP500H.AVIVBK BK:Black -

3 ABFZ01 Bracket Assembly - ABFZ0027801 LG-P500 ORF ZZ:Without Color -

3 ACGM00 Cover Assembly,Rear - ACGM0169610 LG-P500H SS:SHINE SILVER -

4 MDJ000000 Filter MFBZ0024401 COMPLEX LG-P500 ZZ:Without Color FILTER, MIC_REAR

COMPLEX LG-P500 ORF ZZ:Without Color MOLD, Silicone

4 MEG000000 Holder MHGZ0035901
Rubber K-770, , , , ,

4 MCQ000000 Damper MPBZ0318301 COMPLEX LG-P500 ZZ:Without Color PAD, CAMERA

4 MCQ000002 Damper MPBZ0318501 COMPLEX LG-P500 ZZ:Without Color PAD, MOTOR

4 MCQ000001 Damper MPBZ0326101 COMPLEX LG-P500 ZZ:Without Color PAD, CONN_LCD

COMPLEX LG-P500 BL:Blue TAPE,
4 MJN061100 Tape,Protect MTAB0447002
PROTECTION_REAR_B_2
4 MCR000000 Decor MDAY0085204 COMPLEX LG-P500 ORF BK:Black 3.2 Mega Pixels Printed

COMPLEX LG-P500 ORF SS:SHINE SILVER MOLD, PC

4 MCK063300 Cover,Rear MCJN0126901
LUPOY GP-2102, , , , ,

4 MBK070300 Can,Shield MCBA0085901 COMPLEX LG-P500 ORF ZZ:Without Color PRESS,STS,

COMPLEX LG-P500 BL:Blue TAPE,
4 MJN061101 Tape,Protect MTAB0447102
PROTECTION_REAR_C_2
COMPLEX LG-P500 ORF ZZ:Without Color COMPLEX,
4 MKC009400 Window,Camera MWAE0064901
(empty), , , , ,

4 MJN000000 Tape MTAZ0353001 COMPLEX LG-P500 ZZ:Without Color TAPE, MIC

COMPLEX LG-P500 ZZ:Without Color TAPE,

4 MJN089300 Tape,Window MTAD0133101
WINDOW_CAMERA

3 ACQ003400 Cover Assembly,Bar - ACGV0021801 LG-P500 ORF BK:Black -

4 AKAC00 Keypad Assembly,Main AKAC0018601 LG-P500 ORF ZZ:Without Color -

4 ACGM01 Cover Assembly,Front - ACGK0170701 LG-P500 ORF ZZ:Without Color -

COMPLEX LG-P500 ORF ZZ:Without Color MOLD, Silicone

5 MEG000000 Holder MHGZ0036001
Rubber K-770, , , , ,

5 MCQ043300 Damper,LCD MPBG0118401 COMPLEX LG-P500 ZZ:Without Color PAD, LCD

COMPLEX LG-P500 ZZ:Without Color TAPE,

5 MJN061100 Tape,Protect MTAB0451701
PROTECTION_VOL

COMPLEX LG-P500 ZZ:Without Color TAPE,

5 MJN061101 Tape,Protect MTAB0451901
PROTECTION_PWR

5 MTAD00 Tape,Window MTAD0134201 COMPLEX LG-P500 ZZ:Without Color TAPE, MAIN_WINDOW

Copyright © 2010 LG Electronics. Inc. All right reserved. - 185 - LGE Internal Use Only
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.
COMPLEX LG-P500 ORF SS:SHINE SILVER MOLD, PC
5 MBJZ00 Button MBJZ0041201
LUPOY SC-1004A, , , , ,

COMPLEX LG-P500 ORF SS:SHINE SILVER MOLD, PC

5 MBJZ01 Button MBJZ0041301
LUPOY SC-1004A, , , , ,

COMPLEX LG-P500 ORF BK:Black MOLD, PC LUPOY SC-

5 MCK032700 Cover,Front - MCJK0134701
2302, , , , ,

6 MFEZ00 Frame MFEZ0037101 COMPLEX LG-P500 ORF ZZ:Without Color PRESS, STS, , , , ,

6 MICE001 INSERT,NUT MICE0016901 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,

6 MICE00 INSERT,NUT MICE0016909 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,

COMPLEX LG-P500 ORF ZZ:Without Color COMPLEX,

5 MCR000000 Decor MDAY0086601
(empty), , , , ,

5 MDJ000000 Filter MFBZ0024201 COMPLEX LG-P500 ZZ:Without Color FILTER_SPEAKER

5 MDS000000 Gasket MGAZ0109001 COMPLEX LG-P500 ZZ:Without Color Gasket_ESD

COMPLEX LG-P500 ZZ:Without Color TAPE,

5 MJN000000 Tape MTAZ0353301
RUBBER_PROXIMITY

4 MHK000000 Sheet MSAZ0074801 COMPLEX LG-P500 ZZ:Without Color SHEET_LCD_COG

COMPLEX LG-P500 ZZ:Without Color TAPE,

4 MJN061100 Tape,Protect MTAB0447401
PROTECTION_BAR

COMPLEX LG-P500 ZZ:Without Color TAPE,

4 MJN061102 Tape,Protect MTAB0450301
PROTECTION_WINDOW

COMPLEX LG-P500 ZZ:Without Color TAPE,

4 MJN061101 Tape,Protect MTAB0447201
PROTECTION_KEYPAD

4 ABFZ00 Bracket Assembly - ABFZ0026601 LG-P500 ORF ZZ:Without Color -

5 MJN000001 Tape MJN67672601 COMPLEX LG-P500 ZZ:Without Color TAPE, BRACKET_SIDE

5 MBFZ00 Bracket MBFZ0053801 COMPLEX LG-P500 ORF ZZ:Without Color PRESS, STS, , , , ,

5 MTAZ00 Tape MTAZ0353101 COMPLEX LG-P500 ZZ:Without Color TAPE, BRACKET_LCD

5 ACKA00 Can Assembly,Shield - ACKA0032401 LG-P500 ORF ZZ:Without Color -

COMPLEX GS505 TMO ZZ:Without Color COMPLEX, (empty),
6 MEZ000900 Label,After Service MLAB0006701
,,,,
6 MCQ000000 Damper MCQ66465901 COMPLEX LG-P500 ZZ:Without Color PAD, CAN_SHIELD

6 MCBA00 Can,Shield MCBA0089101 COMPLEX LG-P500 ORF ZZ:Without Color PRESS, STS, , , , ,

6 MTAZ01 Tape MTAZ0347201 COMPLEX LG-P500 ZZ:Without Color TAPE, CAMERA_BACK

6 MTAZ00 Tape MTAZ0366501 COMPLEX LG-P500 ZZ:Without Color TAPE, CAMERA_SIDE

5 ADCA00 Dome Assembly,Metal ADCA0117901 LG-P500 ORF ZZ:Without Color -

COMPLEX LG-P500 ORF ZZ:Without Color COMPLEX,

5 MDJ000000 Filter MFBZ0031701
(empty), , , , ,

6 SC2 Can Assembly,Shield - ABM73436401 LGP500.AORFZY ZZ:Without Color -

LGE Internal Use Only - 186 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.

7 MDQ000000 Frame MFEZ0045301 COMPLEX LG-P500 ORF ZZ:Without Color PRESS,Ni,

7 MBK070300 Can,Shield MCBA0103101 COMPLEX LG-P500 ORF ZZ:Without Color PRESS,Ni,

5 MEZ000000 LABEL MLAZ0038301 LG-VX6000 SV,ZZ,PID Label 4 Array

BH + 1.4mM 4mM MSWR FZB N - ARIMA

3 GMEY00 Screw,Machine GMEY0013901
COMMUNICATIONS CORP.

111111,3.5 mm,1.5 mm,MSWR3 ,N ,+ ,- ,NYLOK Coating

3 GMZZ00 SCREW MACHINE GMZZ0019003
(ZnB-BLACK)
COMPLEX LG-VS660 VRZ ZZ:Without Color PRESS, STS, , , ,
3 MBFZ00 Bracket MBFZ0059701
,
2 MEZ002100 LABEL,APPROVAL MLAA0062320 GU280 OREBK BK,ZZ,COMPLEX, (empty), , , , ,

LGP500H.AVIVBK ZZ:Without Color LGP500H VIV Brazil

1 AGF000000 Package Assembly APAY0151823
Packing

1 AAD000000 Addition Assembly - AAD85597901 LGP500H.AVIVBK BK:Black -

2 ACQ00 Cover Assembly,Battery - ACQ85319907 LGP500.AORFZY BK:Black -

3 MCK004100 Cover,Battery MCJA0119607 COMPLEX LG-P509 BK:Black MOLD,PC LUPOY SC-1004A,

COMPLEX LG-P500 ZZ:Without Color

3 MJN061100 Tape,Protect MTAB0448101
TAPE_GUIDE_COVER_BATTERY

Manual LGP500H.AVIVBK ZZ:Without Color LGP500H manual assy for

2 AFN053800 - AFN75252824
Assembly,Operation VIV

COMPLEX LGP500H.AVIVBK ZZ:Without Color Brazil Leaflet

3 MBM062600 Card,Quick Reference MBM63198501
for LGP500H

Copyright © 2010 LG Electronics. Inc. All right reserved. - 187 - LGE Internal Use Only
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST

12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Main component> by SBOM standard on GCSC

Location
Level Description Part Number Spec Remark
No.
MMAGR02GUECA-2MBTN 2GBYTE 2.7VTO3.6V MICRO SD
IC,Memory Card,
2 EAN011400 EAN61826701 CARD 15.0x11.0x1.0MM TR 8P MicroSD Card 2GB
MICRO SD
SAMSUNG ELECTRONICS CO., LTD.

WHVM-1030Q10 2 V,65 mA,10 *3.0T,3V, WOOSUNG G&T

4 SJMY00 Motor,DC SJMY0007116
CO.,LTD

4 EBR00 PCB Assembly,Flexible - EBR72701001 LG-P500 FLEXIBLE 1.0

PCB Assembly,
5 SACE00 - EBR72700601 LGP500.AORFBK FLEXIBLE 1.0
Flexible,SMT

PCB Assembly,
6 SACC00 - EBR72700701 LGP500.AORFBK FLEXIBLE 1.0
Flexible,SMT Bottom
HK1005 18NJ-T 18NH 5% 0V 8A 3.1GOHM 350mHZ 300m
7 L1,L3 Inductor,Multilayer,Chip ELCH0001032 NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO.,LTD
GB042-24P-H10-E3000 24P 0.40MM STRAIGHT PLUG SMD
7 CN1 Connector,BtoB ENBY0034101
R/TP 1M - LS Mtron Ltd.

LL1005-FHL33NJ 33NH 5% 0V 200mA 1OHM 1.7GHZ 10

7 L2,L4 Inductor,Multilayer,Chip ELCH0001417
NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.

SCHB1B0201 Micro-SD 8P ANGLE SMD R/TP - ALPS

7 S700 Socket,Card ENSY0023802
ELECTRIC KOREA CO.,LTD.

PCB Assembly,
6 SACD00 - EBR72700801 LGP500.AORFBK FLEXIBLE 1.0
Flexible,SMT Top
SPCY0242301 POLYI Multi - 0.25 LG-P500
7 EAX010700 PCB,Flexible SPCY0242301 OREBK,FLEXIBLE,F,POLYI,0.25 mm,MULTI-3 LG
Innotek.com

VA1,VA2,
VA3,VA4,
VA700,
VA701,
ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE SMD
7 VA702, Varistor SEVY0004301
R/TP INNOCHIPS TECHNOLOGY
VA703,
VA704,
VA705,
VA706

EECEP0F333YD GM750 SFRTN Backup

7 BAT1 Module,Assembly SMZY0026701 Capacitor,0.03F,3.8pi,Module Assembly PANASONIC
INDUSTRIAL KOREA CO., LTD

R703,R704,
MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP - ROHM
7 R705,R706, Resistor,Chip ERHZ0000486
Semiconductor KOREA CORPORATION
R707

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005

7 C706 Capacitor,Ceramic,Chip ECCH0017601
R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

MCR01MZP5J224 220KOHM 5% 1/16W 1005 R/TP - ROHM

7 R700,R710 Resistor,Chip ERHZ0000445
Semiconductor KOREA CORPORATION

LGE Internal Use Only - 188 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.
C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005
7 C701 Capacitor,Ceramic,Chip ECZH0001215
R/TP - TDK KOREA COOPERATION

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP

7 C705 Capacitor,Ceramic,Chip ECCH0004904
- MURATA MANUFACTURING CO.,LTD.

MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP - ROHM

7 R709 Resistor,Chip ERHY0000241
Semiconductor KOREA CORPORATION

ISDT-181230-08W-04 ASSY,8 ohm,91 dB,1812

4 SUSY00 Speaker Module SUSY0028914
mm,3.0T,20mm,WIRE GoerTek Inc.

4 EAA010400 Antenna,Helical SNMF0066301 HIR-02A16-0000AA DUAL -5DB 50OHM 5 E.M.W CO., LTD.

4 EAA00 Antenna,PIFA EAA62385801 HIR-02A62-0000AA MULTI -5DB 3:1 E.M.W CO., LTD.

TSMC-P304A Captive TSM Assembly,3.2" ,; ,Module Assembly

4 SMZY00 Touch Window Assembly SMZY0029602
LG INNOTEK.,LTD.

TX08D42VM0BAA
4 SVLM00 LCD,Module-TFT SVLM0041401 Main,3.2,HVGA,49.52x77.83x1.9t,16.7M,TFT,TM,S6D05A1(Sa
msung),Bending Type, HITACHI DISPLAYS.,LTD

3 EBR01 PCB Assembly,Main - EBR72673401 LG-P500h MAIN 1.0

PCB
4 EBR071500 - EBR72701401 LG-P500 MAIN 1.0
Assembly,Main,Insert

SPKY0093201 POLYI Double DOUBLE 0.15 LG-P500

5 SPKY00 PCB,Sidekey SPKY0093201
TMO,SIDEKEY,E,POLYI,0.15 mm,DOUBLE LG Innotek.com

C3AA-Y314C C3AA-Y314C 3M AF, Sony(1/5"), 8.5x8.5x5.4t,

5 EBP00 Camera Module EBP61301801
FPCB 3.5mm, 90degree LG INNOTEK CO., LTD

SPKY0093401 POLYI Double DOUBLE 0.15 LG-P500

5 SPKY01 PCB,Sidekey SPKY0093401
TMO,SIDEKEY,E,POLYI,0.15 mm,DOUBLE LG Innotek.com

PCB Assembly,
4 EBR071800 - EBR72673501 LG-P500h MAIN 1.0
Main,SMT

5 SAD010000 Software,Mobile SAD32751001 V10a - CENTRAL AND SOUTH AMERICA QCT -

PCB Assembly,
5 EBR071700 - EBR72673601 LG-P500h MAIN 1.0
Main,SMT Top

SPFY0233701 FR-4 - LX-BUMP 10 0.8 LG-P500

6 EAX010000 PCB,Main SPFY0233701 TMO,MAIN,F,FR-4,0.8 mm,LX-BUMP 10 UNITECH PRINTED
CIRCUIT BOARD CORP.

SPM0410LR5H-QB SPM0410LR5H-QB,UNIT,42
6 SUMY00 Microphone,Condenser SUMY0010610 dB,4.72*3.76*1.25,mems TDMA Improve KNOWLES
ACOUSTICS

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005

6 C1931 Capacitor,Ceramic,Chip ECCH0000198
R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD.

GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C

6 C202,C708 Capacitor,Ceramic,Chip ECZH0003103
1005 R/TP - MURATA MANUFACTURING CO.,LTD.

MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP - ROHM

6 R1169 Resistor,Chip ERHZ0000287
Semiconductor KOREA CORPORATION

Copyright © 2010 LG Electronics. Inc. All right reserved. - 189 - LGE Internal Use Only
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.
R1172,
R1173, MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHM
6 Resistor,Chip ERHZ0000434
R1174, Semiconductor KOREA CORPORATION
R1175

LD1,LD2, SSC-WH107 WHITE 2.7~3.1 20mA 100~230mcd x, y 64mW

6 LED,Chip EDLH0014803
LD3,LD4 1608 R/TP 2P - SEOUL SEMICONDUCTOR CO.,LTD

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM

6 R701,R702 Resistor,Chip ERHY0000254
Semiconductor KOREA CORPORATION

FB700, BLM15HD182SN1 1800 1.0x0.5x0.5MM SMD R/TP 2P

6 Filter,Bead SFBH0008102
FB701 MURATA MANUFACTURING CO.,LTD.

GP2AP002S00F GP2AP002S00F,8,R/TP SHARP

6 U700 IC,Proximity EUSY0376201
CORPORATION.

MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHM

6 R700,R703 Resistor,Chip ERHZ0000402
Semiconductor KOREA CORPORATION

CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608

6 C705 Capacitor,Ceramic,Chip ECCH0007803
R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

VA611,
VA612, EVLC5S01033 EVLC5S01033,5.5 V, ,SMD ,0603 AMOTECH
6 Varistor SEVY0008101
VA613, CO., LTD.
VA614

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005

6 C706 Capacitor,Ceramic,Chip ECCH0017601
R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

SI1305-E3 P-CHANNEL MOSFET -8V +-8 -0.92A 0.28OHM

6 Q601 FET EQFP0004501 340mW SOT323 R/TP 9P VISHAY INTERTECHNOLOGY
ASIA PTE LTD

ICVS0305500FR ICVS0305500FR,5.6 V,M ,SMD ,0603 SIZE

6 VA615 Varistor SEVY0007902
INNOCHIPS TECHNOLOGY

F980J226MMA 22 uF,6.3V,M,L_ESR,1608,R/TP NICHICON

6 C203 Capacitor,TA,Conformal ECTH0001903
CORPORATION, EAST JAPAN SALES OFFICE

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP

6 C705 Capacitor,Ceramic,Chip ECCH0004904
- MURATA MANUFACTURING CO.,LTD.

MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP - ROHM

6 R1168 Resistor,Chip ERHZ0000407
Semiconductor KOREA CORPORATION

MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP -

6 C201 Capacitor,Ceramic,Chip ECCH0000122
ROHM Semiconductor KOREA CORPORATION

PCB Assembly,
5 EBR071600 - EBR72673701 LG-P500h MAIN 1.0
Main,SMT Bottom

C1005C0G1H8R2CT000F 8.2pF 0.25PF 50V NP0 -

6 C1079 Capacitor,Ceramic,Chip ECZH0000846
55TO+125C 1005 R/TP - TDK KOREA COOPERATION

C1005C0G1H560JT000F 56pF 5% 50V NP0 -55TO+125C

6 C1007 Capacitor,Ceramic,Chip ECZH0000841
1005 R/TP - TDK KOREA COOPERATION

SAFEA1G88KB7F00 1880 1.4*1.1*0.5 SMD R/TP 5P

6 FL1009 Filter,Saw SFSY0034701
MURATA MANUFACTURING CO.,LTD.

SAFEB1G96FL0F00 1960 1.4*1.1*0.6 SMD R/TP 5P

6 FL1012 Filter,Saw SFSY0034601
MURATA MANUFACTURING CO.,LTD.

LGE Internal Use Only - 190 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.
SAFEB881MFM0F00 881.5 1.4X1.1X0.6 SMD R/TP 5P
6 FL1 Filter,Saw SFSY0030001
MURATA MANUFACTURING CO.,LTD.

SAFEB836MAL0F00 836.5 1.4X1.1X0.6 SMD R/TP 5P

6 FL1005 Filter,Saw SFSY0029901
MURATA MANUFACTURING CO.,LTD.

FL600,
ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H SMD R/TP
6 FL601, Filter,EMI/Power SFEY0011401
INNOCHIPS TECHNOLOGY
FL602

SAYFP836MAJ0F00 881500000 869 to 894 836500000 824 to

6 FL2 Filter,Duplexer,DCN SDDY0005201 849 2.4 1.8 2.5x2.0x0.55 DUAL SMD R/TP - MURATA
MANUFACTURING CO.,LTD.

KR3DH NONE NONE LGA R/TP 16P - ST

6 U503 IC,Acceleration Sensor EUSY0408701
MICROELECTRONICS ASIA PACIFIC PTE LTD.

C1122, C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -

6 Capacitor,Ceramic,Chip ECCH0000701
C36,C37 55TO+125C 1005 R/TP - TDK CORPORATION

GRM1555C1H2R7B 2.7pF 0.1PF 50V NP0 -55TO+125C 1005

6 C26 Capacitor,Ceramic,Chip ECCH0000175
R/TP - MURATA MANUFACTURING CO.,LTD.
ACMD-7407 ACMD-7407,1880 MHz,1960 MHz,2.8 dB,3.2
dB,55 dB,50 dB,2.5*2.0*0.95,SMD,FBAR,Band2 Rx unbal.
6 FL1010 Filter,Duplexer,PCS SDPY0004701
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE.
LIMITED
MCR01MZP5F6803 680KOHM 1% 1/16W 1005 R/TP - ROHM
6 R416 Resistor,Chip ERHZ0000537
Semiconductor KOREA CORPORATION

LQG15HS2N4S02D 2.4NH 0.3NH 0V 300mA 0.15OHM 6GHZ

6 L1040 Inductor,Multilayer,Chip ELCH0003828 8 NON SHIELD 1 1X0.5X0.5MM R/TP MURATA
MANUFACTURING CO.,LTD.

C1111, C1005C0G1H1R5CT000F 1.5pF 0.25PF 50V NP0 -

6 Capacitor,Ceramic,Chip ECZH0000822
C1112 55TO+125C 1005 R/TP - TDK KOREA COOPERATION

SKY77197 28.25 dBm,40 %,A,-36 dBc,27

6 U1003 IC,Power Amplifier SMPY0021701 dB,4x5x0.85,SMD,3G Dual PAM Band 1+5 w/
coupler,LGA,R/TP,14, SKYWORKS SOLUTIONS INC.

SKY77702-12 28.6 dBm,36 %,10 mA,-34 dBc,27

dB,3.0*3.0*1.0,SMD,USPCS,WBNAD 2,CPL,3
6 U1005 IC,Power Amplifier SMPY0022801 MODE,3.2V~4.2V,-35dBc at 28.6dBm
2nd,28.6dBm,595mA,1,SMD,R/TP,10 SKYWORKS
SOLUTIONS INC.
HK1005 3N3S-T 3.3NH 0.3NH 0V 8A 8GOHM 100mHZ 300m
6 L5 Inductor,Multilayer,Chip ELCH0001034 NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO.,LTD
1005GC2T18NJLF 18NH 5% 0V 200mA 0.65OHM 1.6GHZ 8
6 L1130 Inductor,Multilayer,Chip ELCH0001052 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

1005GC2T5N6SLF 5.6NH 0.3NH 0V 300mA 0.27OHM 3.2GHZ

L1042,
6 Inductor,Multilayer,Chip ELCH0001054 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
L1048
ELECTRONICS LTD.

LL1005-FHL1N0S 1NH 0.3NH 0V 500mA 0.1OHM 20GHZ 8

6 L7 Inductor,Multilayer,Chip ELCH0001403
NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.

L1025, LL1005-FHL1N5S_ 1.5NH 0.3NH 0V 500mA 0.13OHM 12GHZ

6 Inductor,Multilayer,Chip ELCH0001404
L1041 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.

Copyright © 2010 LG Electronics. Inc. All right reserved. - 191 - LGE Internal Use Only
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.
LQG15HS3N0S02D 3NH 0.3NH 0V 300mA 0.17OHM 6GHZ 8
C1084,
6 Inductor,Multilayer,Chip ELCH0003820 NON SHIELD 1 1.0X0.5X0.5MM R/TP MURATA
L1151
MANUFACTURING CO.,LTD.

1005GC2T8N2J00 8.2NH 5% 0V 250mA 0.37OHM 2.8GHZ 8

6 C1009 Inductor,Multilayer,Chip ELCH0004705 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

6 C1110 Resistor,Chip ERHY0003301 MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP - ROHM.

MCR01MZP5F4303 430KOHM 1% 1/16W 1005 R/TP - ROHM

6 R427 Resistor,Chip ERHZ0000284
Semiconductor KOREA CORPORATION

MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP - ROHM

6 FB2,FB3 Resistor,Chip ERHZ0000401
Semiconductor KOREA CORPORATION

CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C 1005

6 C14 Capacitor,Ceramic,Chip ECCH0000117
R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 R611 Resistor,Chip ERHZ0000530 MCR01MZP5J512 5.1KOHM 5% 1/16W 1005 R/TP - ROHM.

MCR01MZP5F2702 27KOHM 1% 1/16W 1005 R/TP - ROHM

6 R1030,R18 Resistor,Chip ERHY0000137
Semiconductor KOREA CORPORATION

C1130,C20,
C208,C309,
C316,C318,
C320,C331, MCH153CN103KK 10nF 10% 16V X7R -55TO+125C 1005
6 Capacitor,Ceramic,Chip ECCH0000155
C336,C340, R/TP - ROHM Semiconductor KOREA CORPORATION
C408,C440,
C48,C625,C
704

R201,R203,
MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP - ROHM
6 R213,R408, Resistor,Chip ERHZ0000405
Semiconductor KOREA CORPORATION
R520,R521

C1005,
C1014,
C1017,
C1020,
C1021,
C1022,
C1039,
C1041,
C1071,
C1072,
C1083,
C1087, C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C
6 Capacitor,Ceramic,Chip ECZH0000830
C1103, 1005 R/TP - TDK KOREA COOPERATION
C1108,
C1118,
C1121,
C1153,
C225,C412,
C538,C544,
C608,C618,
C619,C621,
C622,C700,
C702,C703,
R24

LGE Internal Use Only - 192 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.
GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C
6 C202,C708 Capacitor,Ceramic,Chip ECZH0003103
1005 R/TP - MURATA MANUFACTURING CO.,LTD.

L1018, LL1005-FHL1N8S 1.8NH 0.3NH 0V 500mA 0.14OHM 12GHZ

6 Inductor,Multilayer,Chip ELCH0001412
L1019 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM

6 R600,R601 Resistor,Chip ERHZ0000485
Semiconductor KOREA CORPORATION

R205,R215, MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP - ROHM

6 Resistor,Chip ERHY0009503
R217,R218 Semiconductor KOREA CORPORATION

C1013, C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C 0603

6 Capacitor,Ceramic,Chip ECCH0009106
C1015 R/TP - TDK CORPORATION

D400,D500,
D501,D502, ESD9B5.0ST5G ESD9B5.0ST5G,SOD-923,5 V,300
6 Diode,TVS EDTY0010101
D503,D504, mW,R/TP,15pF SCG HONG KONG SAR LTD.
ZD1

C1005C0G1H6R8CT000F 6.8pF 0.5PF 50V NP0 -55TO+125C

6 C1107 Capacitor,Ceramic,Chip ECCH0001001
1005 R/TP - TDK KOREA COOPERATION

1005GC2T10NJLF 10NH 5% 0V 250mA 0.42OHM 2.5GHZ 8

6 L1022 Inductor,Multilayer,Chip ELCH0001048 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

LBEH19UNBC-338 2.3VTO5.5V LGA 54P 9.0x7.8x1.3MM

6 U500 Module,WLAN SMZY0024901
MURATA MANUFACTURING CO.,LTD.

MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP -

6 C201 Capacitor,Ceramic,Chip ECCH0000122
ROHM Semiconductor KOREA CORPORATION

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP

6 C705 Capacitor,Ceramic,Chip ECCH0004904
- MURATA MANUFACTURING CO.,LTD.

R1016, BLM15AG100PN1 10ohm 1.0x0.5x0.55 SMD R/TP 2P

6 Filter,Bead SFBH0007102
R1017 MURATA MANUFACTURING CO.,LTD.

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005

6 C1931 Capacitor,Ceramic,Chip ECCH0000198
R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD.

R1006,
R1170,
R1171,
R204,R401, MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP - ROHM
6 Resistor,Chip ERHZ0000443
R417,R418, Semiconductor KOREA CORPORATION
R507,R518,
R519,R603,
R604

MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP - ROHM

6 R415 Resistor,Chip ERHZ0000203
Semiconductor KOREA CORPORATION

C1076,
C1005X7R1H331KT000F 0.33nF 10% 50V X7R -55TO+125C
6 C207,C210, Capacitor,Ceramic,Chip ECCH0000137
1005 R/TP - TDK KOREA COOPERATION
C221

C1069, GRM1555C1H3R9C 3.9pF 0.25PF 50V NP0 -55TO+125C

6 Capacitor,Ceramic,Chip ECCH0000195
C1080 1005 R/TP - MURATA MANUFACTURING CO.,LTD.

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM

6 R701,R702 Resistor,Chip ERHY0000254
Semiconductor KOREA CORPORATION

Copyright © 2010 LG Electronics. Inc. All right reserved. - 193 - LGE Internal Use Only
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.

6 FL1007 Filter,Saw SFSY0027101 B7742 - - - - 5P EPCOS PTE LTD.

C1065,
C1068,
C1094,
C1095,
C0603C0G1H101JT00NN 100pF 5% 50V X7R -55TO+125C
6 C1096, Capacitor,Ceramic,Chip ECCH0009103
0603 R/TP - TDK CORPORATION
C1113,
C1114,
C1115,
C1929

R1176, MCR01MZP5F10R0 10OHM 0.1% 1/16W 1005 R/TP - ROHM

6 Resistor,Chip ERHZ0000206
R1177 Semiconductor KOREA CORPORATION

NLSV1T244-D 0.9~4.5V - LEVEL SHIFTER - R/TP 6P - SCG

6 U601 IC,TTL EUSY0391601
HONG KONG SAR LTD.

C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C 1005

6 R1005 Capacitor,Ceramic,Chip ECZH0000802
R/TP - TDK KOREA COOPERATION

MCR01MZP5J180 18OHM 5% 1/16W 1005 R/TP - ROHM

6 R1023 Resistor,Chip ERHZ0000428
Semiconductor KOREA CORPORATION

C1028,
C1030,
C1032,
C1034,
C1038,
C1049,
C1053,
C1055,
C1057,
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -55TO+85C
6 C1058, Capacitor,Ceramic,Chip ECCH0009101
0603 R/TP - TDK CORPORATION
C1059,
C1060,
C1061,
C1062,
C1063,
C1066,
C1067,
C224,C30,
C31,C32

CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608

6 C705 Capacitor,Ceramic,Chip ECCH0007803
R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

CIG21L3R3MNE 0H 20% - 800mA 0.22OHM - - SHIELD

Inductor,Wire
6 L1 ELCP0012101 2X1.25X1MM NONE - SAMSUNG ELECTRO-MECHANICS
Wound,Chip
CO., LTD.

MCH155CN222KK 2.2nF 10% 50V X7R -55TO+125C 1005

6 C204 Capacitor,Ceramic,Chip ECCH0000147
R/TP - ROHM.

C1011,
C1012,
C11,C1129, C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C 1005
6 Capacitor,Ceramic,Chip ECZH0000813
C12,C13, R/TP - TDK KOREA COOPERATION
L1015,
L1039,L12

MCR01MZP5J200 20OHM 5% 1/16W 1005 R/TP - ROHM

6 R502,R503 Resistor,Chip ERHZ0000435
Semiconductor KOREA CORPORATION

LGE Internal Use Only - 194 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.
C33,C34, C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -55TO+85C
6 Capacitor,Ceramic,Chip ECCH0006201
C606 1608 R/TP - TDK CORPORATION

GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603

6 C1046 Capacitor,Ceramic,Chip ECZH0025916
R/TP - MURATA MANUFACTURING CO.,LTD.

MCR006YZPF1202 12KOHM 1% 1/20W 0603 R/TP - ROHM

6 R1018 Resistor,Chip ERHY0009555
Semiconductor KOREA CORPORATION

SDB310Q 340mV 30V 200mA 1A 0SEC 150mW EMD2 R/TP

6 D402 Diode,Switching EDSY0011901
2P 1 AUK CORP

R210,R220,
MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP - ROHM
6 R300,R302, Resistor,Chip ERHZ0000204
Semiconductor KOREA CORPORATION
R612,R619

C1018,
C1037,
C1045,
C1047, GRM033R71C102K 1nF 10% 16V X7R -55TO+125C 1608
6 Capacitor,Ceramic,Chip ECZH0025920
C1048, R/TP - MURATA MANUFACTURING CO.,LTD.
C1051,
C414,
C535

6 C537 Capacitor,TA,Conformal ECTH0004801 TCM0J106M8R 10 uF,6.3V,M,STD,1608,R/TP ROHM.

VA611,
VA612, EVLC5S01033 EVLC5S01033,5.5 V, ,SMD ,0603 AMOTECH
6 Varistor SEVY0008101
VA613, CO., LTD.
VA614

C1,C1075,
C1104,
C205,C317,
C319,C324,
C328,C332, MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005 R/TP
6 Capacitor,Ceramic,Chip ECCH0000143
C337,C342, - ROHM Semiconductor KOREA CORPORATION
C425,C426,
C429,C430,
C431,C432,
C437

R202,R216,
R219,R414,
6 Resistor,Chip ERHY0003201 MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP - ROHM.
R425,R615,
R618

AAT2862 AAT2862,TQFN34,24,R/TP,3x4x0.8 Advanced

6 U1007 IC,Sub PMIC EUSY0378001
Analogic Technologies HK Limited

MCH155A080DK 8pF 0.25PF 50V NP0 -55TO+125C 1005

6 C7 Capacitor,Ceramic,Chip ECCH0000109
R/TP - ROHM Semiconductor KOREA CORPORATION

GB042-34S-H10-E3000 34P 0.4MM STRAIGHT SOCKET

6 CN600 Connector,BtoB ENBY0040301
SMD R/TP 1M - LS Mtron Ltd.

R25,R610, MCR006YZPF4700 470OHM 1% 1/20W 0603 R/TP - ROHM

6 Resistor,Chip ERHY0009541
R613 Semiconductor KOREA CORPORATION

C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005

6 C701 Capacitor,Ceramic,Chip ECZH0001215
R/TP - TDK KOREA COOPERATION

Copyright © 2010 LG Electronics. Inc. All right reserved. - 195 - LGE Internal Use Only
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.
C4,C433,
CV105X5R475M10AT 4.7uF 20% 10V X5R -55TO+85C 1608
6 C434,C435, Capacitor,Ceramic,Chip ECCH0007802
R/TP - KYOCERA CORP.
C436,C5

IC,Digital Baseband MSM7227 0VTO0V 0W BGA R/TP 560P - QUALCOMM

6 U200 EUSY0392302
Processor,3G INCORPORATED.

1005GC2T3N3S00 3.3NH 0.3NH 0V 300mA 0.19OHM 4.5GHZ

6 C10,L1036 Inductor,Multilayer,Chip ELCH0004709 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

D200,D201, KDS114E 900mV 30V 100mA 1A 0SEC 100mW ESC R/TP 2P

6 Diode,Switching EDSY0010501
D401,D404 1 KEC CORPORAITION

TS5USBA33402YZPR TS5USBA33402,WCSP,20,R/TP,MUIC
6 IC1 IC,Analog Multiplexer EUSY0372001
TEXAS INSTRUMENTS KOREA LTD, HONGKONG BRANCH.

SAFEB2G14FB0F00 - - - - 2P MURATA MANUFACTURING

6 FL1003 Filter,Saw SFSY0028201
CO.,LTD.

R1025, MCR01MZP5F12R0 12OHM 1% 1/16W 1005 R/TP - ROHM

6 Resistor,Chip ERHZ0000348
R509,R515 Semiconductor KOREA CORPORATION

MCR01MZP5J910 91 ohm,1/16W,J,1005,R/TP ROHM

6 R15,R16 Resistor,Chip ERHZ0000517
Semiconductor KOREA CORPORATION

R1,R26,
6 R29,R301, Wire Pad,Short SAFP0000501 LG-VS760 VRZ
R303,R304

FB600,
HB-1M1005-121JT 120 1.0x0.5x0.5MM SMD R/TP 2P
6 FB602, Filter,Bead SFBH0009901
CERATECH CORPORATION
FB603

SKY77544 MHz,MHz,POLA EDGE QUAD TX

6 U1002 RF Module SMRH0006201 MODULE,SP9T,6.0*6.0*1.0,28p, SKYWORKS SOLUTIONS
INC.

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005 R/TP -

6 C1088 Capacitor,Ceramic,Chip ECCH0000112
ROHM Semiconductor KOREA CORPORATION

MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP -

6 C1024,C502 Capacitor,Ceramic,Chip ECCH0000120
ROHM Semiconductor KOREA CORPORATION

NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TP

6 FL400 Filter,EMI/Power SFEY0015301
MURATA MANUFACTURING CO.,LTD.

CPI2520LZ4R7ME 4.7UH 20% 0V 900mA 0.3OHM 0HZ 0

Inductor,Wire
6 L401,L402 ELCP0008005 SHIELD 2.5X2X1MM NONE R/TP SAMWHA CAPACITOR
Wound,Chip
CO, LTD.

C1050,
GRM188R60J106M 10000000
C1077,
6 Capacitor,Ceramic,Chip ECCH0005604 pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATA
C1163,
MANUFACTURING CO.,LTD.
C18,C19

LQG15HS8N2J02 8.2NH 5% - 300mA 0.24OHM 3.7KHZ 8

6 C1106,L2 Inductor,Multilayer,Chip ELCH0003838 SHIELD 1 1.0X0.5X0.55MM R/TP MURATA
MANUFACTURING CO.,LTD.

MCR01MZP5J151 150OHM 5% 1/16W 1005 R/TP - ROHM

6 R411,R412 Resistor,Chip ERHZ0000420
Semiconductor KOREA CORPORATION

74LVC1G79GM 1.65~5.5V - D FLIP-FLOP SOT R/TP 6P -

6 U202 IC,TTL EUSY0408201
STC CORP.

LGE Internal Use Only - 196 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.
KJA-PH-0-0176 1P 4P ANGLE R/TP 4mM BLACK 6P - KSD
6 J2 Jack,Phone ENJE0007601
CO., LTD

MCR01MZP5J120 12OHM 5% 1/16W 1005 R/TP - ROHM

6 R605 Resistor,Chip ERHZ0000410
Semiconductor KOREA CORPORATION

FB700, BLM15HD182SN1 1800 1.0x0.5x0.5MM SMD R/TP 2P

6 Filter,Bead SFBH0008102
FB701 MURATA MANUFACTURING CO.,LTD.
MT29C4G96MAZAPCJA-5 IT FBGA ,137 ,ETC
,4G(LB/256Mx16)
6 U301 IC,MCP,NAND EUSY0426801
NAND+4G(DDR400/16Mx4x32*2_2CS_2CKE) SDRAM ,;
,IC,MCP MICRON SEMICONDUCTOR ASIA PTE LTD.
R10,R1015,
PCB ASSY,MAIN,
6 R14,R19, SAFP0000401 LG-LU3000 LGTBK,MAIN,A,
PAD SHORT
R8

MCR01MZP5J510 51OHM 5% 1/16W 1005 R/TP - ROHM

6 R200 Resistor,Chip ERHZ0000490
Semiconductor KOREA CORPORATION

GB042-24S-H10-E3000 24P 0.40MM STRAIGHT SOCKET

6 CN2,CN601 Connector,BtoB ENBY0034201
SMD R/TP 1M - LS Mtron Ltd.

C1078,
C22,C24, MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005 R/TP -
6 Capacitor,Ceramic,Chip ECCH0000115
C25,C402, ROHM Semiconductor KOREA CORPORATION
C403

GRM1555C1H3R3C 3.3pF 0.25PF 50V NP0 -55TO+125C

6 C1089 Capacitor,Ceramic,Chip ECCH0000180
1005 R/TP - MURATA MANUFACTURING CO.,LTD.

1005GC2T82NJ00 89NH 5% 0V 150mA 2.1OHM 700MHZ 8

6 L1008 Inductor,Multilayer,Chip ELCH0004717 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

C1027,
C1029,
GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C 0603
6 C1031, Capacitor,Ceramic,Chip ECCH0009216
R/TP - MURATA MANUFACTURING CO.,LTD.
C1033,
C1064

MCR01MZP5J202 2KOHM 5% 1/16W 1005 R/TP - ROHM

6 R403,R404 Resistor,Chip ERHZ0000437
Semiconductor KOREA CORPORATION

R1027, MCR01MZP5F49R9 49.9OHM 1% 1/16W 1005 R/TP - ROHM

6 Resistor,Chip ERHY0000104
R214 Semiconductor KOREA CORPORATION

C1010, GRM0335C1E680J 68pF 5% 25V X7R -55TO+125C 0603

6 Capacitor,Ceramic,Chip ECCH0009206
C1019 R/TP - MURATA MANUFACTURING CO.,LTD.

LQG15HS2N2S02 2.2NH 0.3NH - 300mA 0.12OHM 6KHZ 8

6 L10 Inductor,Multilayer,Chip ELCH0003832 SHIELD 1 1.0X0.5X0.55MM R/TP MURATA
MANUFACTURING CO.,LTD.

BU28TD4WNVX SSON004,4,R/TP,2.8V 150mA Single

IC,LDO Voltage
6 U501 EUSY0407101 LDO,IC,LDO Voltage RegulatorIC,LDO Voltage Regulator
Regulator
ROHM.

LL1005-FHL3N3S LL1005-FH3N3S,3.3 nH,S ,1005 ,R/TP ,

6 L1027 Inductor,Multilayer,Chip ELCH0001405
TOKO, INC.

6 R207 Wire Pad,Open SAFO0000501 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI

Copyright © 2010 LG Electronics. Inc. All right reserved. - 197 - LGE Internal Use Only
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.
L1004, 1005GC2T18NJ00 18NH 5% 0V 200mA 0.65OHM 1.6GHZ 8
6 L1005, Inductor,Multilayer,Chip ELCH0004714 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
L1007 ELECTRONICS LTD.

MCR01MZP5F2003 200KOHM 1% 1/16W 1005 R/TP - ROHM

6 R428 Resistor,Chip ERHY0000161
Semiconductor KOREA CORPORATION

MAX17040G DFN,8,R/TP,Fuel gauge,IC,CMOSIC,CMOS

6 U404 IC,A/D Converter EUSY0242303
MAXIM INTEGRATED PRODUCTS INC.

Inductor,Wire Wound, MIP2520D4R7M 4.7UH 30% 0V 1.1A 0.11OHM 0HZ 0 SHIELD

6 L3 ELCP0008001
chip 2.5X2X1MM NONE R/TP FDK CORPORATION.

MCR01MZP5J750 75OHM 5% 1/16W 1005 R/TP - ROHM

6 R7 Resistor,Chip ERHZ0000509
Semiconductor KOREA CORPORATION

1005GC2T5N6S00 5.6NH 0.3NH 0V 300mA 0.27OHM 3.2GHZ

6 L1016 Inductor,Multilayer,Chip ELCH0004718 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

L1017, LQG15HS2N0S02 LQG15HS2N0S02,2 nH,S,1005,R/TP,Chip

6 Inductor,Multilayer,Chip ELCH0003844
L1043 coil MURATA MANUFACTURING CO.,LTD.

C1036,
HK1005 5N6S-T 5.6NH 0.3NH 0V 8A 5.7GOHM 150mHZ
C1040,
6 Inductor,Multilayer,Chip ELCH0001036 300m NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN
L1028,
CO.,LTD
L1029

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005

6 C706 Capacitor,Ceramic,Chip ECCH0017601
R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

C1003,
C1119,
MCH155A100D 10pF 0.25PF 50V NP0 -55TO+125C 1005
6 C1120, Capacitor,Ceramic,Chip ECCH0000110
R/TP - ROHM Semiconductor KOREA CORPORATION
C23,C27,
C459,C460
HK1005 1N5S-T 1.5NH 0.3NH 0V 8A 13GOHM 50mHZ 300m
6 C1092 Inductor,Multilayer,Chip ELCH0001033 NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO.,LTD
MCH155A180J 18pF 5% 50V NP0 -55TO+125C 1005 R/TP -
6 C1098 Capacitor,Ceramic,Chip ECCH0000113
ROHM Semiconductor KOREA CORPORATION

R1172,
R1173, MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHM
6 Resistor,Chip ERHZ0000434
R1174, Semiconductor KOREA CORPORATION
R1175

GRM1555C1H7R5D 7.5pF C0G TYPE(No X7R) MURATA

6 C223 Capacitor,Ceramic,Chip ECCH0010501
MANUFACTURING CO.,LTD.

BU33TD4WNVX SSON004,4,R/TP,3.3V 150mA Single

IC,LDO Voltage
6 U401 EUSY0407201 LDO,IC,LDO Voltage RegulatorIC,LDO Voltage Regulator
Regulator
ROHM.

GU075-5P-SD-E1500 5P 0.65MM ANGLE RECEPTACLE DIP

6 CN4 Connector,I/O ENRY0010501
R/TP - LS Mtron Ltd.

MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP -

6 R409 Resistor,Chip ERHZ0000318
ROHM Semiconductor KOREA CORPORATION

TCTAL1A107M8R 0.0001F 20% 10V 50UA -55TO+125C

6 C407 Capacitor,TA,Conformal ECTH0002703
0OHM 3.2x1.6x1.1 NONE SMD R/TP ROHM CO.,LTD.

LGE Internal Use Only - 198 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.
VA200,
VA201,
VA202, ICVL0518400V500FR 18V 0% 40F 1.0*0.5*0.55 NONE SMD
6 Varistor SEVY0004401
VA203, R/TP INNOCHIPS TECHNOLOGY
VA204,
VA205

1005GC2T2N7SLF 2.7NH 0.3NH 0V 300mA 0.17OHM 5.5GHZ

L1035,L6,
6 Inductor,Multilayer,Chip ELCH0001056 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
R1004
ELECTRONICS LTD.

MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP - ROHM

6 R506 Resistor,Chip ERHY0009506
Semiconductor KOREA CORPORATION

C1102, GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C 1608

6 Capacitor,Ceramic,Chip ECCH0005602
C602,C607 R/TP - MURATA MANUFACTURING CO.,LTD.

1005GC2T22NJ00 22NH 5% 0V 200mA 0.8OHM 1.5GHZ 8

6 L1010 Inductor,Multilayer,Chip ELCH0004711 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

MCR01MZP5J131 130OHM 5% 1/16W 1005 R/TP - ROHM

6 R4,R5 Resistor,Chip ERHZ0000415
Semiconductor KOREA CORPORATION

RF2815 3.3*2.1*1.0,FILTER+GPS LNA+FILTER

6 U1004 IC,RF Amplifier SMZY0025501
MODULE,GPS, RF MICRO DEVICES INC

AMI304 QFN,12,R/TP,Geomagnetic Sensor,IC,A/D

6 U1 IC,A/D Converter EUSY0418501
ConverterIC,A/D Converter AICHI STEEL CORPORATION

AXT614124 14P 0.4MM STRAIGHT HEADER SMD R/TP 1M -

6 CN200 Connector,BtoB ENBY0045901
BJ PANASONIC ELECTRONIC PARTS CO.,LTD

6 R11 Resistor,Chip ERHY0000181 MCR01MZP5F15R0 15 ohm,1/16W,F,1005,R/TP ROHM.

MS-156C NONE STRAIGHT SOCKET SMD T/REEL AU

6 SW1001 Connector,RF ENWY0008701
50OHM 400mDB HIROSE KOREA CO.,LTD

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005

6 C534 Capacitor,Ceramic,Chip ECCH0007804
R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 R400 Resistor,Chip ERHZ0003901 MCR10EZHFLR100 0.1OHM 1% 1/4W 2012 R/TP - ROHM.

LL1005-FHL22NJ 22NH 5% 0V 300mA 0.7OHM 2.1GHZ 10

6 L8 Inductor,Multilayer,Chip ELCH0001413
NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
MCR01MZP5F1213 121KOHM 1% 1/16W 1005 R/TP -
6 R423 Resistor,Chip ERHZ0004201
ROHM.
Inductor,Wire Wound, MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ 0
6 L403,L404 ELCP0008004
Chip SHIELD 2.0X1.6X1.0MM NONE R/TP FDK CORPORATION.

HK100527NJ 27NH 5% 0V 8A 2.3GOHM 470mHZ 300m NON

6 L1009 Inductor,Multilayer,Chip ELCH0005005
SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN CO.,LTD

VA1,VA2,
VA3,VA4,
VA700,
VA701,
ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE SMD
6 VA702, Varistor SEVY0004301
R/TP INNOCHIPS TECHNOLOGY
VA703,
VA704,
VA705,
VA706

Copyright © 2010 LG Electronics. Inc. All right reserved. - 199 - LGE Internal Use Only
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.
VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5
6 D600,D601 Diode,TVS EDTY0009801
PROTEK DEVICES INC.

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C 1005

6 C400,C401 Capacitor,Ceramic,Chip ECCH0000182
R/TP - MURATA MANUFACTURING CO.,LTD.
HK1005 4N7S-T 4.7NH 0.3NH 0V 8A 6GOHM 120mHZ 300m
6 C1154 Inductor,Multilayer,Chip ELCH0001035 NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO.,LTD
C1005C0G1H120JT000F 12pF 5% 50V NP0 -55TO+125C
6 C1090,C28 Capacitor,Ceramic,Chip ECZH0000816
1005 R/TP - TDK KOREA COOPERATION

TCSCM0J106MJAR 10 uF,6.3V,M,L_ESR,1608,R/TP
6 C613 Capacitor,TA,Conformal ECTH0003701
SAMSUNG ELECTRO-MECHANICS CO., LTD.

Connector,Terminal 04-9247-003-017-829+ 3,2.5 mm,STRAIGHT,Gold,Twin

6 CN401 ENZY0029201
Block contact KYOCERA ELCO KOREA SALES CO.,LTD.

TPA6202A1ZQVR BGA,8,R/TP,Class AB SPK Amp,IC,Audio

6 U602 IC,Audio Amplifier EUSY0404001 AmplifierIC,Audio Amplifier TEXAS INSTRUMENTS KOREA
LTD, HONGKONG BRANCH.

MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP - ROHM

6 R1010 Resistor,Chip ERHZ0000456
Semiconductor KOREA CORPORATION

FB601, MCR01MZP5J4R7 4.7OHM 5% 1/16W 1005 R/TP - ROHM

6 Resistor,Chip ERHZ0000488
R407 Semiconductor KOREA CORPORATION

SAWEN881MCN0F00 881.5MHz, 1960MHz 1.8*1.4*0.5 SMD

6 FL1001 Filter,Saw,Dual SFSB0001802
R/TP 10P MURATA MANUFACTURING CO.,LTD.

C1023, C1005C0G1H4R7CT000F 4.7pF 0.25PF 50V NP0 -

6 Capacitor,Ceramic,Chip ECZH0000839
C1025,C15 55TO+125C 1005 R/TP - TDK KOREA COOPERATION

C1042,
C1052, 1005GC2T6N8J00 1005GC2T6N8J00,6.8 nH,J ,1005 ,R/TP ,
6 Inductor,Multilayer,Chip ELCH0004713
L1021, PILKOR ELECTRONICS LTD.
L1032

ICMEF112P900M COMMON MODE NOISE FILTER 0HZ 0F

6 FL1013 Filter,EMI/Power SFEY0016301
0H SMD R/TP INNOCHIPS TECHNOLOGY

PM7540 -0.5~18 N/A 0W CSP R/TP 137P - QUALCOMM

6 U403 IC,PMIC EUSY0342201
INCORPORATED.

CL10A226MQ8NRNE 22uF 20% 6.3V X5R -55TO+85C 1608

6 C315 Capacitor,Ceramic,Chip ECCH0017501
R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP - ROHM

6 R602 Resistor,Chip ERHZ0000406
Semiconductor KOREA CORPORATION

C533,C536, CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -45TO+85C

6 Capacitor,Ceramic,Chip ECCH0017301
C8 0603 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.

MCR006YZPJ000 0OHM 5% 1/20W 0603 R/TP - ROHM

6 R1178 Resistor,Chip ERHY0009501
Semiconductor KOREA CORPORATION

C1109,
MCR01MZP5J330 33OHM 5% 1/16W 1005 R/TP - ROHM
6 R1022, Resistor,Chip ERHZ0000463
Semiconductor KOREA CORPORATION
R209

GRM033R60J333K 33nF 10% 6.3V X5R -55TO+85C 0603

6 C226 Capacitor,Ceramic,Chip ECCH0009203
R/TP - MURATA MANUFACTURING CO.,LTD.

LGE Internal Use Only - 200 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.

SAFEB2G14AL0F00 2140
MHz,1.4*1.1*0.6,SMD,2110M~2170M,IL 3.5,5pin,U-U,50-
6 FL1011 Filter,Saw SFSY0039301 50,W-BAND I Rx
DIVERSITY,2140,1.4*1.1*0.6,SMD,R/TP,2140,1.4*1.1*0.6,SM
D,R/TP MURATA MANUFACTURING CO.,LTD.

C1116,
C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -55TO+125C
6 C1148, Capacitor,Ceramic,Chip ECZH0001002
1005 R/TP - TDK KOREA COOPERATION
L1011

PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1

6 ZD401 Diode,TVS EDTY0008601
PROTEK DEVICES INC.

PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK DEVICES

6 D403 Diode,TVS EDTY0008606
INC.

MCR01MZP5F5102 51KOHM 1% 1/16W 1005 R/TP - ROHM

6 R616,R617 Resistor,Chip ERHZ0000295
Semiconductor KOREA CORPORATION

MCR01MZP5J470 47OHM 5% 1/16W 1005 R/TP - ROHM

6 R211,R6 Resistor,Chip ERHZ0000483
Semiconductor KOREA CORPORATION

KT3225L19200DCW28RA0 19.2MHZ 2PPM 2.8V

6 X200 Oscillator,VCTCXO EXSK0008901
0.0x0.0x0.0MM NONE SMD R/TP KYOCERA CORP.

MCR01MZP5F4703 470KOHM 1% 1/16W 1005 R/TP - ROHM

6 R410,R413 Resistor,Chip ERHZ0000288
Semiconductor KOREA CORPORATION

LQG15HS3N6S02D 3.6NH 0.3NH 0V 300mA 0.18OHM 6GHZ

6 L1044 Inductor,Multilayer,Chip ELCH0003816 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP MURATA
MANUFACTURING CO.,LTD.

LK1005R27-T LK1005R27-T,270 nH,M ,1005 ,R/TP ,CHIP

6 L504 Inductor,Multilayer,Chip ELCH0010402
TAIYO YUDEN CO.,LTD

BGA735 -0.3~3.6 2.7-3.0 NA 0W 0W NA 0 TSLP R/TP 16P -

6 U2 IC,RF Amplifier EUSY0365001
INFINEON TECHNOLOGIES (ASIA PACIFIC) PTE LTD.

NC7SV00P5X_NL SC70 ,5 PIN,R/TP ,Single 2-Input NAND

6 U201 IC,MCP,NOR EUSY0216301
Gate FAIRCHILD SEMICONDUCTOR

MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP - ROHM

6 R1019 Resistor,Chip ERHY0009504
Semiconductor KOREA CORPORATION

HB-1T1005-221JT 220 ohm 1.0*0.5*0.5 SMD R/TP 2P

6 R208 Filter,Bead SFBH0009601
CERATECH CORPORATION

PSD12-LF 12V 13.3 25.9V 21A 500W SOD323 R/TP 2P 1

6 ZD400 Diode,TVS EDTY0008602
PROTEK DEVICES INC.

SAFEB1G95KA0F00 1950 1.4*1.1*0.6 SMD R/TP 5P

6 FL1006 Filter,Saw SFSY0028101
MURATA MANUFACTURING CO.,LTD.

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C 1005

6 C1099 Capacitor,Ceramic,Chip ECCH0002001
R/TP - TDK CORPORATION

WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P -

6 IC500 IC,Audio Sub System EUSY0403901
WOLFSON MICROELECTRONICS PLC

GCA26C-8S-H15-E1500 SIM 8P ANGLE SMD R/TP - LS

6 J1 Card Socket ENSY0024701
Mtron Ltd.

MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP - ROHM

6 R1026 Resistor,Chip ERHZ0000404
Semiconductor KOREA CORPORATION

Copyright © 2010 LG Electronics. Inc. All right reserved. - 201 - LGE Internal Use Only
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.
C1004, C1005C0G1H2R2CT000F 2.2pF 0.25PF 50V NP0 -
6 Capacitor,Ceramic,Chip ECCH0000901
C1016 55TO+125C 1005 R/TP - TDK KOREA COOPERATION

BGA711L7 -0.3~3.6 2.7-3.0 NA 0W 0W NA 0 TSLP R/TP 7P -

6 U1006 IC,RF Amplifier EUSY0365401
INFINEON TECHNOLOGIES (ASIA PACIFIC) PTE LTD.

RTR6285 1.8VTO3V,2.7VTO3V 500mW QFN R/TP 68P -

6 U1001 IC,Tx/Rx EUSY0344001
QUALCOMM INCORPORATED.

MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHM

6 R700,R703 Resistor,Chip ERHZ0000402
Semiconductor KOREA CORPORATION

MAX14528 MAX14528,TDFN,8,R/TP,Programmable OVP

6 U400 IC,Voltage Detector EUSY0374601
MAXIM INTEGRATED PRODUCTS INC.

MCR006YZPJ202 2KOHM 5% 1/20W 0603 R/TP - ROHM

6 R212 Resistor,Chip ERHY0009592
Semiconductor KOREA CORPORATION

GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608 R/TP

6 C404 Capacitor,Ceramic,Chip ECZH0003503
- MURATA MANUFACTURING CO.,LTD.

NUS5530MN P-CHANNEL MOSFET -20V 20 -3.9A 0.07OHM

6 Q400 FET EQFP0008601
1.3W TSOP6 R/TP 8P ON SEMICONDUCTOR

NX3215SA 32.768KHZ 20PPM 0F NONE SMD R/TP NIHON

6 X400 Crystal EXXY0026801
DEMPA KOGYO CO.,LTD.
CPI2012NHL2R2MT 2.2UH 20% - 800mA 0.25OHM - -
Inductor,Wire Wound,
6 L400 ELCP0011901 SHIELD 2X1.25X1MM NONE - SAMWHA CAPACITOR CO,
Chip
LTD.
BU18TD4WNVX SSON004,4,R/TP,1.8V 150mA Single
IC,LDO Voltage
6 U502 EUSY0407501 LDO,IC,LDO Voltage RegulatorIC,LDO Voltage Regulator
Regulator
ROHM.

MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP - ROHM

6 R426 Resistor,Chip ERHZ0000222
Semiconductor KOREA CORPORATION

LL1005-FHL10NJ 10NH 5% 0V 400mA 0.3OHM 3.6GHZ 9

6 L9 Inductor,Multilayer,Chip ELCH0001409
NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.

MCH153CN333KK 33nF 10% 16V X7R -55TO+125C 1005

6 C509,C510 Capacitor,Ceramic,Chip ECCH0000161
R/TP - ROHM Semiconductor KOREA CORPORATION

KRC402E NPN 30V 0V 50V 100mA 500mA 50 100mW ESM

6 Q600 TR,Bipolar EQBN0012401
R/TP 3P KEC CORPORAITION

ICMEF214P101MFR ICMEF214P101MFR,SMD,ESD Common

6 FL603 Filter,EMI/Power SFEY0015901
mode Filter INNOCHIPS TECHNOLOGY

51338-9873 10P 0.40MM STRAIGHT FEMALE SMD R/TP

6 CN1 Connector,BtoB ENBY0058601
1.5M - HANKOOK MOLEX

LL1005-FHL82NJ 82NH 5% 0V 200mA 1.9OHM 970MHZ 10

6 L1003 Inductor,Multilayer,Chip ELCH0001425
NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.

MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP - ROHM

6 R424 Resistor,Chip ERHY0000105
Semiconductor KOREA CORPORATION

SAWEN1G84CN0F00 1842.5MHz, 1960MHz 1.8*1.4*0.5 SMD

6 FL1002 Filter,Saw,Dual SFSB0001902
R/TP 10P MURATA MANUFACTURING CO.,LTD.

GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C 1005

6 C706 Capacitor,Ceramic,Chip ECZH0001217
BK-DUP - MURATA MANUFACTURING CO.,LTD.

6 R206 Resistor,Chip ERHY0024201 MCR01MZP5F6041 6040 ohm,1/16W,F,1005,R/TP ROHM.

LGE Internal Use Only - 202 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Remark
No.

SAYFP1G95AA0B00 SAYFP1G95AA0B00,1950 MHz,2140

MHz,1.8 dB,2.4 dB,52 dB,43
6 FL1008 Filter,Duplexer,IMT SDMY0001901
dB,2.5*2.0*0.55,SMD,Band1,2520size,SAW,Rx unbal MURATA
MANUFACTURING CO.,LTD.

GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C 0603

6 C1044 Capacitor,Ceramic,Chip ECZH0025917
R/TP - MURATA MANUFACTURING CO.,LTD.

LQG15HS12NJ02D 12NH 5% 0V 300mA 0.28OHM 3GHZ 8

6 L1013 Inductor,Multilayer,Chip ELCH0003819 NON SHIELD 1 1.0X0.5X0.5MM R/TP MURATA
MANUFACTURING CO.,LTD.

TG-5010LH-87N 26MHZ 2.5PPM 2.8V 32.0x25.0x10.0MM -

6 X500 Oscillator,TCXO EXST0001901
SMD R/TP EPSON TOYOCOM CORP

Copyright © 2010 LG Electronics. Inc. All right reserved. - 203 - LGE Internal Use Only
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST

12.3 Accessory Note: This Chapter is used for reference, Part order is ordered
by SBOM standard on GCSC

Location
Level Description Part Number Spec Remark
No.
KCA-ET-8-0020 KCA-ET-8-0020 Micro USB, 1.2M KSD CO.,
2 EBX000000 Accessory,Data Cable SGDY0016701
LTD

EMB-LGE004MSKB 3mW 16OHM 115DB 85HZTO126HZ 1M

2 EAB010200 Earphone,Stereo SGEY0003744 BLACK 3.5 L TYPE STEREO 4POLE PLUG - CRESYN
CO.,LTD

Rechargeable LGIP-400N-WW-LGC 3.7 V,1500 mAh,1

2 SBPL00 SBPL0102301
Battery,Lithium Ion CELL,PRISMATIC,PRISMATIC,BLACK, LG Chem,LTD.

STA-U12BR 90Vac~264Vac 5.1V 700mA 5060 GOST NONE

2 EAY060000 Adapters SSAD0036001
NONE - SUNLIN ELECTRONICS CO.,LTD

LGE Internal Use Only - 204 - Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes