Dell ™

POWEREDGE ™
R710
technical guidebook
Inside the poweredge R710

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 Dell™ PowerEdge™ R710 Technical Guidebook

TABLE OF CONTENTS

Section 1. system overview 6

A. Overview / Description 6
B. Product Features Summary 6

Section 2. Mechanical 7
A. Chassis Description 7
B. Dimensions and Weight 8
C. Front Panel View and Features 8
D. Back Panel View and Features 8
E. Power Supply Indicators 9
F. NIC Indicators 9
G. Side Views and Features 9
H. Rails and Cable Management 10
I. Fans 10
J. Control Panel / LCD 11
K. Security 11
I. Cover Latch 11
II. Bezel 12
III. Hard Drive 12
IV. TPM 12
V. Power Off Security 12
VI. Intrusion Alert 12
VII. Secure Mode 12
L. USB Key 12
M. Battery 12
N. Field Replaceable Units (FRU) 12

Section 3. Electrical 13
A. Volatility 13
B. ePPID (Electronic Piece Part Identification) 13

Section 4. Power, Thermal, Acoustic 14

A. Power Efficiencies 14
B. Power Supplies 14
I. Main Power Supply 14
C. Power Supply Specifications 15
D. Environmental Specifications 16
E. Power Consumption Testing 17
F. Maximum Input Amps 17
G. Energy SMART Enablement 17
H. Acoustics 18

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 Dell™ PowerEdge™ R710 Technical Guidebook

Section 5. Block Diagram 19

Section 6. Processors 21
A. Overview / Description 21
B. Features 21
C. Supported Processors 21
D. Processor Configurations 22

Section 7. Memory 23
A. Overview / Description 23
B. DIMMs Supported 23
C. Speed 24
D. Slots / Risers 27
E. Supported Configurations 27
F. Mirroring 28
G. Advanced ECC (Lockstep) Modes 28
H. Optimizer (Independent Channel) Mode 28

Section 8. Chipset 29
A. Overview / Description 29

Section 9. BIOS 31
A. Overview / Description 31
B. Supported ACPI States 31
C. I2C (Inter-Integrated Circuit) 32

Section 10. Embedded NICs / LAN on Motherboard (LOM) 32

A. Overview / Description 32

Section 11. I/O Slots 33

A. Overview / Description 33
B. PCI Express Risers 35
C. Additional Riser Restrictions 35
D. X16 Express Card Specifications 35
E. Boot Order 35

Section 12. Storage 36

A. Overview / Description 36
B. Drives 36
I. Internal Hard Disk drives 36
II. Hard Disk Drive Carriers 37
III. Empty Drive Bays 37
IV. Diskless Configuration Support 38
V. Hard Drive LED Indicators 38
C. RAID Configurations 38

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 Dell™ PowerEdge™ R710 Technical Guidebook

D. Storage Controllers 39
I. SAS 6/iR 39
II. PERC 6i 40
E. LED Indicators 41
F. Optical Drives 41
G. Tape Drives 41

Section 13. Video 42

A. Overview / Description 42

Section 14. Audio 43

A. Overview / Description 43

Section 15. Rack Information 43

A. Overview / Description 43
B. Cable Management Arm (CMA) 43
C. Rails 44

Section 16. Operating Systems 45

A. Overview / Description 45

Section 17. Virtualization 47

A. Overview / Description 47

Section 18. Systems Management 47

A. Overview / Description 47
B. Server Management 47
C. Embedded Server Management 48
I. Unmanaged Persistent Storage 48
II. Lifecycle Controller/Unified Server Configurator 48
III. iDRAC6 Express 49
IV. iDRAC6 Enterprise 49

Section 19. Peripherals 52

A. USB peripherals 52
B. External Storage 52

Section 20. Documentation 53

A. Overview, Description, and List 53

Section 21. Packaging Options 53

appendix 54

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 Dell™ PowerEdge™ R710 Technical Guidebook

The Dell™ PowerEdge™ R710

The Dell PowerEdge R710 is designed to be the cornerstone of today’s competitive enterprise.
Engineered in response to input from IT professionals, it is the next-generation 2U rack server
created to efficiently address a wide range of key business applications. The successor to the
PowerEdge 2950 III, the R710 runs the Intel® Xeon® 5500 Series Processors and helps you lower
the total cost of ownership with enhanced virtualization capabilities, improved energy efficiency,
and innovative system management tools.

Strong IT Foundation
As an IT professional, you want a data center built to allow for organic growth and the ability to scale
based on your company’s changing requirements. You need complete solutions that allow you to
focus your time and money on managing and growing your business. Dell understands your needs and
responds with an expanding portfolio of enterprise servers, storage technologies, and services with a
single goal: to help you simplify IT.

Purposeful Design
The R710 takes advantage of Dell’s system commonality. Once your IT managers learn one system, they
understand how to manage next-generation Dell servers. Logical component layout and power supply
placement also provide a straightforward installation and redeployment experience. Featuring 18 DIMM
slots and 4 integrated network connections, the R710 delivers the critical components to virtualization
and database performance. The Intel Xeon Processor 5500 Series adapts to your software in real time,
processing more tasks simultaneously. Using Intel® Turbo Boost Technology, the R710 can increase
performance during peak usage periods. You can then help reduce operating costs and energy usage
with Intel® Intelligent Power Technology, which proactively puts your server into lower power states when
demand decreases. Increased memory slots also save money by enabling you to use smaller,
less-expensive DIMMs to meet your computing needs.

Enhanced Virtualization
Featuring Intel Xeon-based architecture, embedded hypervisors, large memory capacity, and integrated
I/O, the next-generation Dell PowerEdge R710 delivers better overall system performance and greater
virtual machine-per-server capacity. With optional factory-integrated virtualization capabilities, you get
tailored solutions – built with the latest technologies from Dell and our trusted partners – which allow
you to streamline deployment and simplify virtual infrastructures. Choose your hypervisor from market
leaders such as VMware®, Citrix®, and Microsoft®, and enable virtualization with a few mouse clicks.

Energy-Optimized Technologies
Using the latest Energy Smart technologies, the R710 reduces power consumption while increasing
performance capacity versus the previous generation servers. Enhancements include efficient power
supply units right-sized for system requirements, improved system-level design efficiency, policy-driven
power and thermal management, and highly efficient standards-based Energy Smart components. Dell's
advanced thermal control delivers optimal performance at minimal system and fan power consumption
resulting in our quietest 2U servers to date. These enhancements maximize energy efficiency across our
latest core data center servers without compromising enterprise performance.

Simplified Systems Management

Gain more control with the next-generation Dell OpenManage™ suite of management tools. These tools
provide enhanced operations and standards-based commands designed to integrate with existing
systems for effective control. Dell Management Console (DMC) helps simplify operations and creates
stability by shrinking infrastructure management to one console. This console delivers a single view and
a common data source into the entire infrastructure management. Built on Symantec® Management
Platform, it has an easily extensible, modular foundation that can provide basic hardware management
all the way up to more advanced functions, such as asset and security management. Dell Management
Console reduces or eliminates manual processes, enabling you to save time and money for more

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 Dell™ PowerEdge™ R710 Technical Guidebook

strategic technology usage. Secure, efficient, and more user friendly than its predecessors, the Dell
Unified Server Configurator (USC) delivers “Instant On” integrated manageability through a single
access point. You get quick, persistent access to the tool because it is embedded and integrated into
the system for increased flexibility and capabilities. The USC is a one-stop shop for deploying operating
systems with built-in driver installations, firmware updates, hardware configuration, and issue diagnoses.

Section 1. System Overview

A. Overview / Description
The PowerEdge R710 will lead Dell's 11th Generation PowerEdge portfolio in key areas of differentiation,
primarily:
• Virtualization
• Power, thermal, efficiency
• Systems management, and usability

B. Product Features Summary

Feature Details

Processor Nehalem EP
Front Side Bus Intel® QuickPath Interconnect (QPI) @ maximum 6.GT/s
# Procs 2S
# Cores 4 cores
L2/L3 Cache 4MB and 8MB
Chipset Tylersberg
DIMMs/Speed 18 RDIMM or UDIMM DDR3 (9 per processor)
Min/Max RAM 1GB – 144GB
Internal hard drive bay and hot-plug backplane
HD Bays Up to six 3.5" SAS or SATA drives without optional flex bay OR
Up to eight 2.5" SAS or SATA drives with optional flex bay
HD Types SAS, SATA, Near-line SAS, and SSD
Ext Drive Bay(s) Optional flex-bay expansion to support a half-height TBU
Int. HD Controller PERC 6i and SAS 6/iR
Opt. HD Controller
BIOS
Video Based on the Matrox G200 w/iDRAC
Availability
Server
Management
I/O Slots Two x8 and two x4 PCIe Gen2 slots or One x16 PCIe slot and two x4 PCIe Gen2

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 Dell™ PowerEdge™ R710 Technical Guidebook

Feature Details

RAID PERC 6i utilizing battery backed 256MB DDRII 667

NIC/LOM Broadcom 5809C (2 cards/4ports)
USB Five (two front, two rear, one internal)
Two hot-plug high-efficient 570W PSU OR
Power Supplies
Two hot-plug 870W PSUs (1+1)

Front Control The system control panel is located on the front of the system chassis to provide
Panel user access to buttons, display, and I/O interfaces
System ID Front and rear (0x0235)
Five hot-swappable
Fans Additional fan integrated into each power supply
Single processor configurations will only have four fans
Chassis 2u Rackmount

Section 2. Mechanical

A. Chassis Description
PowerEdge R710 is a 2U rackmount chassis. The updated design includes a new LCD, bezel and
hard-drive carriers. Additional changes include tool-less rack latches, a pull out tray for customer labels,
and LOM0/iDRAC MAC address; labels; support persistent storage (internal USB and SD card slots and
external SD card slots); updated power supplies and removal process.

From view 3.5" HDD Chassis (without bezel)

From view 2.5" HDD Chassis (without bezel)

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 Dell™ PowerEdge™ R710 Technical Guidebook

B. Dimensions and Weight

Height 8.64cm (3.40")
Width 44.31cm (17.44")
Depth 68.07cm (26.80")
Weight (maximum config) 26.1kg (57.54lbs)
.
C. Front Panel View and Features
Front I/O panel access including USB and VGA interfaces. The following components are located on
the front:
• Express service tag (Information tag). A slide-out panel for system identification labels
• Power on indicator, power button
• NMI indicator (Nonmaskable interrupt). A device sends an NMI to signal the processor about
hardware errors. It is used to troubleshoot software and device driver errors when using certain
operating systems
• (2) USB connectors. Connects USB devices to the system. The ports are USB 2.0 compliant
• Video connector
• LCD menu buttons. Allows you to navigate the control panel LCD menu
• LCD panel. Provides system ID, status information, and system error messages
• System identification button
• Optical drive (optional)
• Hard drives
• Flex bay

D. Back Panel View and Features

The following components are located on the rear panel of the R710 enclosure:
• (1) 15-pin VGA connector
• (1) 9-pin serial port connector
• (4) 10/100/1000 Ethernet RJ-45 connectors
• (1) Rear system ID button
• (1) Active ID Cable Management Arm external LED jack
• (2) USB ports
• (1) (Optional) iDRAC6 Enterprise RJ-45 connector
• (1) Optional) iDRAC6 Express SD module

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E. Power Supply Indicators

The PSUs on the PE R710 have one status bi-color LED: green for AC power present and amber for
a fault.

led Power Supply status

AC power is not present

AC power is present
Fault of any kind is detected
DC power is applied to the system
PSU mismatch (when hot-added/swapped)

Table: Power Supply Indicator

F. NIC Indicators

indicator indicator code

Link and activity indicators are off The NIC is not connected to the network
Link indicator is green The NIC is connected to a valid network link at 1000 Mbps
Link indicator is amber The NIC is connected to a valid network link at 1000 Mbps
Activity indicator is green blinking Network data is being sent or received

G. Side Views and Features

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 Dell™ PowerEdge™ R710 Technical Guidebook

H. Rails and Cable Management

Rack installation components such as rails are provided with the PowerEdge R710 Rack Kit. The rack
installation components are as follows: Sliding rack mount with latest generation Cable Management
Arm (CMA). When the system is installed in a rack, please observe the following guideline:

 hen the system is installed in a rack, only Dell-approved CMAs should be installed behind
W
the chassis.

Rails
• Enable the replacement of thumbscrews with slam latches on the chassis for easier stowing in
the rack.
• Include the new simple and intuitive ReadyRail™ tool-less rack interface for square-hole and
round-hole racks.
• Provide significantly improved compatibility with non-Dell racks.
• Static rails for the R610 & R710 fit in all types of four-post and two-post racks available in the
industry including four-post threaded hole racks.

CMAs
• Provide much larger vent pattern for improved airflow through the CMA.
• Include a common support tray for eliminating CMA sag.
• Replaced tie wraps with hook and loop straps to eliminate risk of cable damage during cycling.
• Maintain key feature of being fully reversible with no conversion required.

I. Fans

Fans
Five hot-swappable fans are mounted in a fan gantry that is located in the chassis between the hard
drive bay and the processors. Each fan has a blind mate 2x2 connector that plugs directly into the
planar. There is an additional fan integrated in each power supply to cool the power supply subsystem
and also provide additional cooling for the whole system. Single processor configurations will have four
fans populated.

The Embedded Server Management logic in the system monitors the speed of the fans. A fan failure
or over-temperature in the system results in a notification by iDRAC6. All system fans are pulse-width
modulated fans. Redundant cooling is supported with one fan failing at a time.

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J. Control Panel / LCD

The control panel board is connected to the planar via a 60-wire ribbon cable and a separate 5-wire
cable for USB signals only. The LCD plugs into the control panel through a 20-pin ZIF connector and
flex cable.

The system control panel is located on the front of the system chassis to provide user access to
switches, display, and I/O interfaces. Features of the system control panel are:
• ACPI-compliant power button with an integrated green power LED (controlled by ESM)
• 128x20 pixel LCD with controls
• Two navigation buttons
• One-select button
• One system ID button
• Non-Maskable-Interrupt (NMI) button (recessed)
• Ambient temperature sensor
• Two external USB 2.0 connectors (with two internal connectors dedicated for UIPS)
• 15-pin VGA connector

The LCD panel is a graphics display controlled by the BMC/ESM. Both ESM and BIOS can send error
codes and messages to the display.

The system’s LCD panel provides system information and status messages to signify when the system is
operating correctly or when the system needs attention.

The LCD backlight lights blue during normal operating conditions and lights amber to indicate an error
condition. When the system is in standby mode, the LCD backlight is off and can be turned on by
pressing the Select button on the LCD panel. The LCD backlight will remain off if the “No Message"
option is selected through the iDRAC6, the LCD panel, or other tools.

BIOS has the ability to enter a “Secure Mode" through Setup, which locks the power and NMI buttons.
When in this mode, pressing either button has no effect but does not mask other sources of NMI and
power control.

K. Security
I. Cover Latch
A tooled entry latch is provided on the top of the unit to secure the top cover to the chassis

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II. Bezel
A metal bezel is mounted to the chassis front to provide the Dell ID. A lock on the bezel is used to
protect un-authorized access to system peripherals and the control panel. System status via the LCD is
viewable even when the bezel is installed.

III. Hard Drive

The optional front bezel of the system contains a lock. A locked bezel secures the system hard drives.

IV. TPM
The TPM is used to generate/store keys, protect/authenticate passwords, and create/store digital
certificates. TPM can also be used to enable the BitLocker™ hard drive encryption feature in Windows
Server® 2008. TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding. There will be
different planar PWA part numbers to accommodate the different TPM solutions. The “Rest of World"
(ROW) version will have the TPM soldered onto the planar. The other version of the planar (post RTS
and primarily for use by China) will have a connector for a plug-in module.

V. Power Off Security

The control panel is designed such that the power switch cannot be accidentally activated. The lock on
the bezel secures the switch behind the bezel. In addition, there is a setting in the CMOS setup that
disables the power button function.
VI. Intrusion Alert
A switch mounted on the left riser board is used to detect chassis intrusion. When the cover is opened,
the switch circuit closes to indicate intrusion to ESM. When enabled, the software can provide
notification to the customer that the cover has been opened.

VII. Secure Mode

BIOS has the ability to enter a secure boot mode via Setup. This mode includes the option to lock out
the power and NMI switches on the Control Panel or set up a system password. See the 11th generation
of PowerEdge servers BIOS Specification for details

L. USB Key
The port on the control panel is for an optional USB key and is located inside the chassis. Some of the
possible applications of the USB key are:
• User custom boot and pre-boot OS for ease of deployment or diskless environments
• USB license keys for software applications like eToken™ or Sentinel Hardware Keys
• Storage of custom logs or scratch pad for portable user defined information (not hot-swappable)

M. Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH9 chip.

N. Field Replaceable Units (FRU)

The planar contains a serial EEPROM to contain FRU information including Dell part number, part
revision level, and serial number. The Advanced Management Enablement Adapter (AMEA) also
contains a FRU EEPROM. The backplane’s SEP and the power supplies’ microcontroller are also used to
store FRU data.

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Section 3. Electrical

A. Volatility
See Appendix A of this Technical Guidebook

B. ePPID (Electronic Piece Part Identification)

ePPID is an electronic repository for information from the PPID label that is stored in non-volatile RAM.
The BIOS reports the ePPID information using SMBIOS data structures. ePPID includes the following
information:
• Dell part number
• Part revision level
• Country of origin
• Supplier ID code
• Date code (date of manufacture)
• Unique sequence number

storage
COMPOnent description
location
BOARDS
Planar PWA,PLN,SV,DELL,R710 iDRAC FRU
2.5" x 8' Backplane PWA,BKPLN,SV,R710,2.5SASX8 SEP
3.5" x 6' Backplane PWA,BKPLN,SV,R710,3.5SASX6 SEP
3.5" x 4' Backplane PWA,BKPLN,SV,R710,3.5SASX4 SEP
iDRAC Enterprise PWA,RSR, SV, DELL,AMEA FRU
Power supplies
PWR SPLY,885W,RDNT,ASTEC PSU Microcontroller
870W PowerEdge™ PSU
PWR SPLY,885W,RDNT,DELTA PSU Microcontroller
PWR SPLY,598W,RDNT,ASTEC PSU Microcontroller
570W Energy Smart PSU
PWR SPLY,598W,RDNT,COLDWATT PSU Microcontroller
storage cards
PERC 6/i Integrated ASSY,CRD,PERC6I-INT,SAS,NOSLED FRU
PERC 6/E External PWA,CTL,PCIE,SAS,PERC6/E,ADPT FRU
SAS 6/iR Integrated PWA,CTL,SAS,SAS6/IR,INTG FRU

Table: ePPID Support list

Note: The fans do not have any integrated NVRAM. The PPID tables are currently scanned into a database by the system integrator.

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Section 4. Power, Thermal, Acoustic

A. Power Efficiencies
One of the main features of the 11th generation of PowerEdge servers is enhanced power efficiency.
PowerEdge R710 achieves higher power efficiency by implementing the following features:
• User-selectable power cap (subsystems will throttle to maintain the specified power cap)
• Improved power budgeting
• Accurate inlet temperature
• PSU / VR efficiency improvements
• Switching regulators instead of linear regulators
• Closed loop thermal throttling
• Increased rear venting / 3D venting
• PWM fans with an increased number of fan zones and configuration-dependent fan speeds
• Use of DDR3 memory (lower voltage compared to DDR2, UDIMM support)
• CPU VR dynamic phase shedding
• Memory VR static phase shedding
• Random time interval for system start
• Allows an entire rack to power on without exceeding the available power
• BIOS Power/Performance options page
• Active Power Controller (BIOS-based CPU P-state manager)
• Ability to power down or throttle memory
• Ability to disable a CPU core
• Ability to turn off LOMs or PCIe lanes when not being used
• Option to run PCIe at Gen1 speeds instead of Gen2

B. Power Supplies
I. Main Power Supply
The base redundant system consists of two hot-plug 570W Energy Smart (energy efficient) power
supplies in a 1+1 configuration. An 870W high-output power supply is also available. The power supplies
connect directly to the planar.
There is a power cable to connect between the planar and the backplane. PowerEdge R710 power
supplies have embedded cooling fans.
Starting with the 11th generation of PowerEdge servers (R710, R610, T610, M610, and M710), the
power supplies no longer have a FRU EEPROM. FRU data is now stored in the memory of the PSU
Microcontroller. Additionally, the PSU Firmware can now be updated by the BMC over the PMBus.
Power is “soft-switched,” allowing power cycling via a switch on the front of the system enclosure, or
via software control (through server management functions). In a single power supply configuration,
the power supply is installed in the PS1 location and a blank module (metal cover) is installed in the
PS2 location for factory consistency. Electrically, the system can operate with a single power supply in
either bay.

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C. Power Supply Specifications

AC Power supply (per power supply)

870 Watt (High Output)

Wattage
570 Watt (Energy Smart)
Voltage 90-264 VAC, autoranging, 47-63Hz
2968.6 BTU/hr maximum (High Output)
Heat Dissipation
1944.9 BTU/hr maximum (Energy Smart)
Under typical line conditions and over the entire system ambient
Maximum Inrush Current operating range, the inrush current may reach 55A per power supply
for 10ms or less.

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D. Environmental Specifications

temperature

10° to 35°C (50° to 95°F) with a maximum temperature gradation of

Operating 10°C per hour. Note: For altitudes above 2950 feet, the maximum
operating temperature is derated 1°F/550 ft.
-40° to 65°C (-40° to 149°F) with a maximum temperature gradation of
Storage
20°C per hour
Relative humidity

20% to 80% (noncondensing) with a maximum humidity gradation of

Operating
10% per hour
5% to 95% (noncondensing) with a maximum humidity gradation of
Storage
10% per hour
Maximum vibration
Operating 0.26 Grms at 5-350Hz in operational orientations
Storage 1.54 Grms at 10-250Hz in all orientations
Maximum shock

Half sine shock in all operational orientations of 31G +/- 5% with a pulse
Operating
duration of 2.6 ms +/-10%
Half sine shock on all six sides of 71G +/- 5% with a pulse duration of
Storage 2 ms +/-10%: Square wave shock on all six sides of 27G with velocity
change @ 235 in/sec or greater
Altitude

-16 to 3048 m (-50 to 10,000 ft) Note: For altitudes above 2950 feet, the
Operating
maximum operating temperature is derated 1°F/550 ft.
Storage -16 to 10,600 m (-50 to 35,000 ft)

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E. Power Consumption Testing

Feature Energy Smart PSU High Output PSU

Dimensions L-206.4 mm1 x W-67.5 mm x H-76.5 mm

Status Indicators 1 x bi-color Light Emitting Diode
Integrated Fans 1 x 60 mm
Fixed Input Plug IEC-C14
AC Cord Rating 15 Amps @ 120 VAC, 10 Amps @ 240 VAC
Input Voltage 90 – 264 VAC
Auto-ranging Yes
Line Frequency 47 – 63Hz
Maximum Inrush Current 55 Amps per supply for 10 ms or less
Hot-Swap Capability Yes
Output Power 570W 870W
Maximum Heat Dissipation 1944.9 BTU per hour 2968.6 BTU per hour
86.9 – 90.5% @ 115 VAC 85 – 88% @ 115 VAC
Efficiency (20% - 100% Load)
88 – 92% @ 230 VAC 87 – 90% @ 230 VAC
1
Does not include the power supply handle or ejection tab

F. Maximum Input Amps

Max input current (High Output): 12A @ 90 VAC, 6A @ 180 VAC

Max input current (EnergySmart): 7.8A @ 90 VAC, 3.9A @ 180 VAC

G. Energy SMART Enablement

The 11th generation of PowerEdge servers implements aspects of Dell’s new Energy Smart strategy.
Major differences include:
• Discontinuing Energy Smart-branded servers with limited configurations and instead offering
Energy Smart components on a portfolio level, such as high capacity and Energy Smart
power supplies
• Allowing customers to order either a lowest power footprint configuration or a best
performance-per-watt configuration
• Offering Energy Smart selected components such as DIMMs or hard drives, but not “cherry
picking" or screening individual manufacturers’ components based on energy consumption.

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H. Acoustics
The acoustical design of the PowerEdge R710 reflects the following:
• Adherence to Dell’s high sound quality standards. Sound quality is different from sound power
level and sound pressure level in that it describes how humans respond to annoyances in sound,
like whistles, hums, etc. One of the sound quality metrics in the Dell specification is prominence
ratio of a tone, and this is listed in the table below.
• Office environment acoustics. Compare the values for LpA in the table below and note that
they are lower than ambient noise levels of typical office environments.
• Hardware configurations affect system noise levels. Dell’s advanced thermal control provides
for optimized cooling with varying hardware configurations. Most typical configurations will
perform as listed in the table below. However some less typical configurations and components
can result in higher noise levels. For example, a system configured with a PERC6/E card will be
~
approximately twice as loud ( 9 dBA higher) in 23+/-2° C ambient.
• Noise ramp and descent at Bootup. Fan speeds hence noise levels ramp during the boot
process in order to add a layer of protection for component cooling in the case that the system
were not to boot properly.

PowerEdge R710 (2.5" and 3.5" chassis) with RK385 fans (quantity below), 2x 870-W FU096 Power
Supplies, 2.40 GHz Quad-Core E5530 CPUs (quantity below), 7x 2-GB DIMMs, 1x DVD Drive, Perc 6i
card, and 4x Hard Disk Drives (type below)
Acoustical dependence on quantities of fans, CPUs, and Hard Disk Drive type is not strong. The values
below represent therefore the performance for redundant (5x fans and 2x CPUs) as well as the
nonredundant (4x fans and 1x CPU) configurations. They also represent performance for 2.5" 10k SAS
XK112 as well as 3.5" 7.2k SATA NW340 Hard Disk Drives.

_ 2° C ambient
Condition in 23 + LwA-UL, bels LpA, dBA Tones

Standby 3.1 18 No prominent tones

Idle 5.5 39 No prominent tones
Active Hard Disk Drives 5.5 39 No prominent tones
Stressed Processor 5.5 39 No prominent tones

Definitions
Standby: AC Power is connected to Power Supply Units but system is not turned on.
Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other specific activity.
Active Hard Drives: An operating mode per ISO7779 (1999) definition 3.1.6; Section C.9 of ECMA-74
9th ed. (2005) is followed in exercising the hard disk drives.
Stressed Processor: An operating mode per ISO7779 (1999) definition 3.1.6; SPECPower set to 50%
loading is used.
LwA-UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988) and
measured in accordance with ISO7779 (1999).
LpA: The average bystander position A-weighted sound pressure level calculated per section 4.3 of
ISO9296 (1988) and measured in accordance with ISO7779 (1999). The system is placed in a
rack with its bottom at 25-cm from the floor.
Tones: Criteria of D.5 and D.8 of ECMA-74 9th ed. (2005) are followed to determine if discrete tones are
prominent. The system is placed in a rack with its bottom at 75-cm from the floor. The acoustic
transducer is at front bystander position, ref ISO7779 (1999), Section 8.6.2.

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Section 5. Block Diagram

Figure: PowerEdge R710 Main Components

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1 2 3 4 5

8 8

11

10

1. Embedded Network Interface Ports (4) 7. Heat Sink / Processor Socket

2. PCIe Gen2 Riser / Slots 8. DIMM Slots
3. Broadcom 5709c Network Interface Chip 9. Hot plug, redundant fans
4. PCIe Gen2 Riser / Slots 10. Hard drive bay, 6" x 3.5"
5. iDRAC6 Enterprise (Optional) 11. Internal SD Module
6. iDRAC6 Express / Lifecycle Controller (Embedded Hypervisor Optional)

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Section 6. Processors

A. Overview / Description
The Intel 5500 series 2S processor (Nehalem - Efficient Processor (EP)), is the microprocessor designed
specifically for servers and workstation applications. The processor features quad-core processing to
maximize performance and performance/watt for data center infrastructures and highly dense
deployments. The Nehalem-EP 2S processor also features Intel’s Core™ micro-architecture and Intel
64 architecture for flexibility in 64-bit and 32-bit applications and operating systems.

The 5500 series 2S processor (Nehalem EP) utilizes a 1366-contact Flip-Chip Land Grid Array (FC-LGA)
package that plugs into a surface mount socket. PowerEdge R710 provides support for up to two 5500
series 2S processors (Nehalem EP).

Nehalem-EP 2S Processor Features

Cache Size 32KB instruction, 32KB data, 4 or 8MB (shared)

Multi-processor Support 1-2 CPUs
Package LGA1366

Table: Nehalem-EP Features

B. Features
Key features of the 5500 series 2S processor (Nehalem EP) include:
• Four or two cores per processor
• Two point-to-point QuickPath Interconnect links at up to 6.4 GT/s
• 1366-pin FC-LGA package
• 45 nm process technology
• No termination required for non-populated CPUs (must populate CPU socket 1 first)
• Integrated three-channel DDR3 memory controller at up to 1333MHz
• Compatible with existing x86 code base
• MMX™ support
• Execute Disable Bit Intel Wide Dynamic Execution
• Executes up to four instructions per clock cycle
• Simultaneous Multi-Threading (Hyper-Threading) capability
• Support for CPU Turbo Mode (on certain SKUs)
• Increases CPU frequency if operating below thermal, power, and current limits
• Streaming SIMD (Single Instruction, Multiple Data) Extensions 2, 3, and 4
• Intel 64 Tecnology for Virtualization
• Intel VT-x and VT-d Technology for Virtualization
• Demand-based switching for active CPU power management as well as support for ACPI
P-States, C-States, and T-States

C. Supported Processors

model speed power cache cores

X5570 2.93GHz 95W 8M 4

X5560 2.80GHz 95W 8M 4
X5550 2.66GHz 95W 8M 4
E5540 2.53GHz 80W 8M 4

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model speed power cache cores

E5530 2.40GHz 80W 8M 4

E5520 2.26GHz 80W 8M 4
L5520 2.26GHz 60W 8M 4
E5506 2.13GHz 80W 4M 4
L5506 2.13GHz 60W 4M 4
E5504 2.00GHz 80W 4M 4
E5502 1.86GHz 80W 4M 2

D. Processor Configurations
Single CPU Configuration
The PowerEdge R710 is designed such that a single processor placed in the CPU1 socket will function
normally, however PowerEdge R710 systems require a CPU blank in the CPU2 socket for thermal reasons.
The system will be held in reset if a single processor is placed in the CPU2 socket.

Performance Enhancements Intel® Turbo Boost Technology

Intel Xeon 5500 Series Processor (Nehalem-EP)
®

TURBO Freq
Intel® Turbo Boost Intel® Hyper-Threading Cores / Threads BASE Freq Benefit
Technology Technology
Increases performance by increasing processor Increases performance for threading applications Core Core
Core 0Core 1
3.20 GHz up to 6%†
frequency and enabling faster speeds when delivering greater throughput and responsiveness
16
0 1
Core Core
conditions allow Core 2Core 3
for 16 concurrent
2 3 (2 socket/HT on) 2.93 GHz software threads
Normal 4C Turbo <4C Turbo

OR
Core 0

Core 0
Core 2
Core 3

Core 2
Core 3
Core 1
Core 1

Core 1

Core 1
Frequency

up to 10%
Core IDLE
Core 0IDLE 3.33 GHz
0
IDLE IDLE
IDLE IDLE
2 for 2 software
All cores All cores Fewer cores (2 socket/HT on) 2.93 GHz threads
operate operate may operate
at rated at higher at even higher
frequency frequency frequencies
Higher performance Higher performance Improves application responsiveness
on demand for threaded workloads Delivers higher processor frequency on demand

model speed power cache cores

X5570 2.93GHz 95W 8M 4

X5560 2.80GHz 95W 8M 4
X5550 2.66GHz 95W 8M 4
E5540 2.53GHz 80W 8M 4
E5530 2.40GHz 80W 8M 4
E5520 2.26GHz 80W 8M 4
L5520 2.26GHz 60W 8M 4
E5506 2.13GHz 80W 4M 4
L5506 2.13GHz 60W 4M 4
E5504 2.00GHz 80W 4M 4
E5502 1.86GHz 80W 4M 2

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CPU Power Voltage Regulation Modules (EVRD 11.1)

Voltage regulation to the 5500 series 2S processor (Nehalem EP) is provided by EVRD (Enterprise
Voltage Regulator-Down). EVRDs are embedded on the planar. CPU core voltage is not shared between
processors. EVRDs support static phase shedding and power management via the PMBus.

Section 7. Memory

A. Overview / Description
The PowerEdge R710 utilizes DDR3 memory providing a high performance, high-speed memory
interface capable of low latency response and high throughput. The PE R710 supports Registered
ECC DDR3 DIMMs (RDIMM) or Unbuffered ECC DDR3 DIMMs (UDIMM).

Key features of the PowerEdge R710 memory system include:

• Registered (RDIMM) and Unbuffered (UDIMM) ECC DDR3 technology
• Each channel carries 64 data and eight ECC bits support for up to 96GB of RDIMM memory
(with twelve 8GB RDIMMs)
• Support for up to 24GB of UDIMM memory (with twelve 2GB UDIMMs)
• Support for 1066/1333MHz single- and dual-rank DIMMs
• Support for 1066MHz quad rank DIMMs
• Single DIMM configuration only with DIMM in socket A1
• Support ODT (On Die Termination) Clock gating (CKE) to conserve power when DIMMs
are not accessed
• DIMMs enter a low-power self-refresh mode
• I2C access to SPD EEPROM for access to RDIMM thermal sensors
• Single Bit Error Correction
• SDDC (Single Device Data Correction – x4 or x8 devices)
• Support for Closed Loop
• Thermal Management on RDIMMs and UDIMMs
• Multi Bit Error Detection Support for Memory Optimized Mode
• Support for Advanced ECC mode
• Support for Memory Mirroring

B. DIMMs Supported
The DDR3 memory interface consists of three channels, with up to two RDIMMs or UDIMMs per
channel for single-/dual-rank and up to two RDIMMs per channel for quad rank. The interface uses 2GB,
4GB, or 8GB RDIMMs. 1GB or 2GB UDIMMs are also supported. The memory mode is dependent on how
the memory is populated in the system:

Three channels per CPU populated identically:

• Typically, the system will be set to run in Memory Optimized (Independent Channel) mode in
this configuration. This mode offers the most DIMM population flexibility and system memory
capacity, but offers the least number of RAS (reliability, availability, service) features.
• All three channels must be populated identically.
• Users wanting memory sparing must also populate the DIMMs in this method, but one channel
is the spare and is not accessible as system memory until it is brought online to replace a failing
channel.
• The first two channels per CPU populated identically with the third channel unused
• Typically, two channels operate in Advanced ECC (Lockstep) mode with each other by
having the cache line split across both channels. This mode provides improved RAS
features (SDDC support for x8-based memory).
• For Memory Mirroring, two channels operate as mirrors of each other — writes go to
both channels and reads alternate between the two channels.

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• One channel per CPU populated:

• This is a simple Memory Optimized mode. Mirroring is not supported.

The PowerEdge R710 memory interface supports memory demand and patrol scrubbing, single-bit
correction and multi-bit error detection. Correction of a x4 or x8 device failure is also possible with
SDDC in the Advanced ECC mode. Additionally, correction of a x4 device failure is possible in the Memory
Optimized mode. If DIMMs of different speeds are mixed, all channels will operate at the fastest common
frequency. RDIMMs and UDIMMs cannot be mixed.
• If memory mirroring is enabled, identical DIMMs must be installed in the same slots across both
channels.
• The third channel of each processor is unavailable for memory mirroring.
• The first DIMM slot in each channel is color-coded with white ejection tabs for ease of
installation.
• The DIMM sockets are placed 450 mils (11.43 mm) apart, center-to-center in order to provide
enough space for sufficient airflow to cool stacked DIMMs.
• The PE R710 memory system supports up to 18 DIMMs. DIMMs must be installed in each channel
starting with the DIMM farthest from the processor. Population order will be identified by the
silkscreen designator and the System Information Label (SIL) located on the chassis cover.
• Memory Optimized: {1, 2, 3}, {4, 5, 6}, {7, 8, 9}
• Advanced ECC or Mirrored: {2, 3}, {5, 6}, {8, 9}
• Quad Rank or UDIMM: {1, 2, 3}, {4, 5, 6}, {7, 8, 9}

C. Speed
Memory Speed Limitations
The memory frequency is determined by a variety of inputs:
• Speed of the DIMMs
• Speed supported by the CPU
• Configuration of the DIMMs

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The table below shows the memory populations and the maximum frequency achievable for that
configuration.

dimm type DImm 0 dimm 1 dimm 2 # of dimms 800 1066 1333

SR 1
DR 1
UDIMM SR SR 2
SR DR 2
DR DR 2
SR 1
DR 1
QR 1
SR SR 2
SR DR 2
DR DR 2
RDIMM QR SR 2
QR DR 2
QR QR 2
SR SR SR 3
SR SR DR 3
SR DR DR 3
DR DR DR 3
Note: For QR mixed with an SR/DR DIMM, the QR needs to be in the white DIMM connector. There is no requirement in the order of SR and DR DIMMs.

Supported

Not Supported

NOTE: For Quad Rank DIMMs mixed with Single- or Dual-Rank DIMMs, the QR DIMM needs to be in the slot with the white ejection tabs (the first DIMM slot in each channel).
There is no requirement for the order of SR and DR DIMMs

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NHM-EP Platform Memory Overview

•P
 latform capability (18 DIMMs):
– Up to 3 channels per CPU 1
– Up to 3 DIMMS per channel Up to 3
channels 2 NHM-EP NHM-EP
•M
 emory Types Supported: per CPU
– DDR 1333, 1066, and 800
– Registered (RDIMM) and unbuffered (UDIMM) 3
– Single-rank (SR), dual-rank (DR), quad-rank (QR) 1 2 3
• System memory Speed (i.e. the speed at which the memory is Up to 3
DIMMs per
actually running) is set by BIOS depending on: Channel
– CPU capability
– DIMM type(s) used (memory speed, U/RDIMM, SR/DR/QR)
– DIMM populated per channel

• All channels in a system will run at the fastest common frequency

Memory Population Scenarios

CPUs
• Maximum B/W: 10.6 GB/s

– DDR3 1333 across 3 channels

10.6
– 1 DPC (6 DIMMs) E5550
CPU CPU
– Max capacity: 48 GB+ and above
10.6

• Balanced Performance: 8.5 GB/s

– DDR3 1066 across 3 channels

8.5
– Up to 2 DIMMs per Channel E5520
CPU CPU
(DPC) (12 DIMMs) and above
8.5
– Max capacity: 96 GB+

• Maximum capacity: 6.4 GB/s

– DDR3 800 across 3 channels

6.4 All
– Up to 3 DPC (18 DIMMs total)
– Max capacity: 144 GB+ CPU CPU NHM-EP
6.4 SKUs

• RAS capabilities: Mirroring Lockstep

Channel Channel
0&1 0&1
mirror operate in
each other CPU lockstep CPU

Channel Channel
2 unused 2 unused

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D. Slots / Risers
The PowerEdge R710 has 18 DIMM slots for memory. It does not have any riser cards for DIMM population.

E. Supported Configurations

memory sockets single processor dual processor

RDIMM
memory Memory 1 2 3 physical available physical available
mode Module memory memory memory memory
Size (GB) (GB) (GB) (GB)
4 5 6

x 2 4
x x 4 8
x x x x 6 12
2GB All All
x x 4 8
x x x x 8 16
x x x x x x 12 24
x 4 8
OPTIMIZER

x x 8 16
x x x x 12 24
4GB All All
x x 8 16
x x x x 16 32
x x x x x x 24 48
x 8 16
x x 16 32
x x x x 24 48
8GBa All All
x x 16 32
x x x x 32 64
x x x x x x 48 96
x x 4 2 8 4
2GB None
mirroring
Advanced

x x x x 8 4 16 8
ECCb or

x x 8 4 16 8
4GB None
x x x x 16 8 32 16
x x 16 8 32 16
8GB None
x x x x 32 16 64 32
Table: RDIMM Memory Configurations (Each Processor)

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memory single
dual processor
UDIMM sockets processor
memory memory
mode module
size 1 2 3 physical available physical available
memory memory memory memory
4 5 6 (GB) (GB) (GB) (GB)

x 1 2
x x 2 4
1GB x x x 3 All 6 All
OPTIMIZER

x x x x 4 8
x x x x x x 6 12
x 2 4
x x 4 8
2GB x x x 6 All 12 All
x x x x 8 16
x x x x x x 12 24
None x x 2
Advanced

1GB memory sockets single processor

All dual
All processor
All
RDIMM x x x x 4
ECCa

memory Memory 1 2 3 physical available physical available

mode Module None x x 4
memory memory memory memory
Size
2GB
(GB)
All
(GB)
All
(GB)
All
(GB)
4 x 5
x x 6
x 8
None x x 2 1 4 2
Mirroring

1GB
x x x x 4 2 8 4
None x x 4 2 8 4
2GB
x x x x 8 4 16 8

Table: UDIMM Memory Configurations (Each Processor)

a
When available
b
Requires x4- or x8-based memory modules

F. Mirroring
The system supports memory mirroring if identical memory modules are installed in the two channels
closest to the processor (memory is not installed in the farthest channel). Mirroring must be enabled in
the System Setup program. In a mirrored configuration, the total available system memory is one-half of
the total installed physical memory.

G. Advanced ECC (Lockstep) Modes

In this configuration, the two channels closest to the processor are combined to form one 128-bit channel.
This mode supports Single Device Data Correction (SDDC) for both x4- and x8-based memory modules.
Memory modules must be identical in size, speed, and technology in corresponding slots.

H. Optimizer (Independent Channel) Mode

In this mode, all three channels are populated with identical memory modules. This mode permits a larger
total memory capacity but does not support SDDC with x8-based memory modules. A minimal single-
channel configuration of 1GB memory modules per processor is also supported in this mode.

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Section 8. Chipset

A. Overview / Description
The PowerEdge R710 planar incorporated the Intel 5520 chipset (code named Tylersburg) for I/O and
processor interfacing. Tylersburg is designed to support Intel's 5500 series processors (code named
Nehalem-EP), QPI interconnect, DDR3 memory technology, and PCI Express Generation 2. The
Tylersburg chipset consists of the Tylersburg-36D IOH and ICH9.

The Intel 5520 chipset (code named Tylersburg) I/O Hub (IOH)
The planar uses the The Intel® 5520 chipset (code named Tylersburg) I/O Hub (IOH)-36D IOH to provide
a link between the 5500 series 2S processor (Nehalem EP) and I/O components. The main components
of the IOH consist of two full-width QuickPath Interconnect links (one to each processor), 36 lanes of
PCI Express Gen2, a x4 Direct Media Interface (DMI), and an integrated IOxAPIC.

IOH QuickPath Interconnect (QPI)

The QuickPath Architecture consists of serial point-to-point interconnects for the processors and the
IOH. The PowerEdge R710 has a total of three QuickPath Interconnect (QPI) links: one link connecting
the processors and links connecting both processors with the IOH. Each link consists of 20 lanes
(full-width) in each direction with a link speed of up to 6.4 GT/s. An additional lane is reserved for a
forwarded clock. Data is sent over the QPI links as packets.

The QuickPath Architecture implemented in the IOH and CPUs features four layers. The Physical layer
consists of the actual connection between components. It supports Polarity Inversion and Lane Reversal
for optimizing component placement and routing. The Link layer is responsible for flow control and the
reliable transmission of data. The Routing layer is responsible for the routing of QPI data packets. Finally,
the Protocol layer is responsible for high-level protocol communications, including the implementation of
a MESIF (Modify, Exclusive, Shared, Invalid, Forward) cache coherence protocol.

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Intel Direct Media Interface (DMI)

The DMI (previously called the Enterprise Southbridge Interface) connects the Tylersburg IOH with the
Intel I/O Controller Hub (ICH). The DMI is equivalent to a x4 PCIe Gen1 link with a transfer rate of 1 Gb/s
in each direction.

PCI Express Generation 2

PCI Express is a serial point-to-point interconnect for I/O devices. PCIe Gen2 doubles the signaling bit
rate of each lane from 2.5 Gb/s to 5 Gb/s. Each of the PCIe Gen2 ports are backwards-compatible with
Gen1 transfer rates.

In the Tylersburg-36D IOH, there are two x2 PCIe Gen2 ports (1Gb/s) and eight x4 PCIe Gen2 ports (2
Gb/s). The x2 ports can be combined as a x4 link; however, this x4 link cannot be combined with any of
the other x4 ports. Two neighboring x4 ports can be combined as a x8 link, and both resulting x8 links
can combine to form a x16 link.

Intel I/O Controller Hub 9 (ICH9)

ICH9 is a highly integrated I/O controller, supporting the following functions:
• Six x1 PCIe Gen1 ports, with the capability of combining ports 1-4 as a x4 link
• These ports are unused on the PowerEdge R710
• PCI Bus 32-bit Interface Rev 2.3 running at 33MHz
• Up to six Serial ATA (SATA) ports with transfer rates up to 300 MB/s
• The PowerEdge R710 features two SATA port for optional internal optical drive or tape backup
• Six UHCI and two EHCI (High-Speed 2.0) USB host controllers, with up to twelve USB ports
• The PowerEdge R710 has eight external USB ports and two internal ports dedicated for UIPS.
Refer to the 11th generation of PowerEdge servers Hardware/BIOS Specification for the USB
assignments for each platform
• Power management interface (ACPI 3.0b compliant)
• Platform Environmental Control Interface (PECI)
• Intel Dynamic Power Mode Manager
• I/O interrupt controller
• SMBus 2.0 controller
• Low Pin Count (LPC) interface to Super I/O, Trusted Platform Module (TPM), and SuperVU
• Serial Peripheral Interface (SPI) support for up to two devices
• The PowerEdge R710’s BIOS is connected to the ICH using SPI

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Section 9. BIOS

A. Overview / Description
The PowerEdge R710 BIOS is based on the Dell BIOS core, and supports the following features:
• Nehalem-EP 2S Support
• Simultaneous Multi-Threading (SMT) support
• CPU Turbo Mode support
• PCI 2.3 compliant
• Plug n’ Play 1.0a compliant
• MP (Multiprocessor) 1.4 compliant
• Boot from hard drive, optical drive, iSCSI drive, USB key, and SD card
• ACPI support
• Direct Media Interface (DMI) support
• PXE and WOL support for on-board NICs
• Memory mirroring and spare bank support
• SETUP access through <F2> key at end of POST
• USB 2.0 (USB boot code is 1.1 compliant)
• F1/F2 error logging in CMOS
• Virtual KVM, CD, and floppy support
• Unified Server Configurator (UEFI 2.1) support
• Power management support including DBS, power inventory and multiple power profiles

The PowerEdge R710 BIOS does not support the following:

• Embedded Diagnostics (embedded in MASER)
• BIOS language localization
• BIOS recovery after bad flash (but can be recovered from iDRAC6 Express)

B. Supported ACPI States

Advanced Configuration and Power Interface – A standard interface for enabling the operating system
to direct configuration and power management.

The Nehalem processor supports the following C-States: C0, C1, C1E, C3, and C6. R710 will support all of
the available C-States.

The PowerEdge R710 will support the available P-States as supported by the specific Nehalem processors:
proc standard
qdF # frequency lfm tdp p-state notes
number tdp

1.60 Pmin+0
1.73 Pmin+1
E5502 Q1G8 1.86 80 75 Pmin+2 D-0
E5504 Q1GM 2.00 80 75 Pmin+3 D-0
L5506 Q1HG 2.13 60 52 Pmin+4 D-0
E5506 Q1GL 2.13 80 75 Pmin+4 D-0
L5520 Q1GN 2.26 60 52 Pmin+5 D-0
E5520 Q1GR 2.26 80 75 Pmin+5 D-0
E5530 Q1GK 2.40 80 75 Pmin+6 D-0

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proc standard
qdF # frequency lfm tdp p-state notes
number tdp

E5540 Q1G2 2.53 80 75 Pmin+7 D-0

X5550 Q1GJ 2.67 95 75 Pmin+8 D-0
X5560 Q1GF 2.80 95 75 Pmin+9 D-0
X5570 Q1G9 2.93 95 75 Pmin+10 D-0
W5580 Q1G6 3.20 130 98 Pmin+12 D-0

Table: Nehalem P-State Projections

C. I2C (Inter-Integrated Circuit)

What is I2C? A simple bi-directional 2-wire bus for efficient inter-integrated circuit control. All I2C-bus
compatible devices incorporate an on-chip interface which allows them to communicate directly with
each other via the I2C-bus. This design concept solves the many interfacing problems encountered
when designing digital control circuits. These I2C devices perform communication functions between
intelligent control devices (e.g., microcontrollers), general-purpose circuits (e.g., LCD drivers, remote
I/O ports, memories), and application-oriented circuits.

The PowerEdge R710, BIOS accesses the I2C through the ICH9 (Intel I/O Controller Hub 9). There are two
MUXes on ICH9’s I2C bus.
• One MUX (U_ICH_SPD) controls the DIMM SPDs through four split segments
• The other MUX (U_ICH_MAIN) controls the clock buffers, TOE, USB Hub through four split
segments.
BIOS controls both the MUXes through the two select lines using GPIO pins.

Clock chip, USB hub, and the front panel EEPROM device addresses are located on the IOH I2C bus.

Section 10. Embedded NICs / LAN on Motherboard (LOM)

A. Overview / Description
Embedded Gigabit Ethernet Controllers with TCP Offload Engine (TOE) support
Two embedded Broadcom 5709C dual-port LAN controllers are on the R710 planar as independent
Gigabit Ethernet interface devices. The following information details the features of the LAN devices.
• x4 PCI Express Gen2 capable interface
• The PowerEdge R710 operates this controller at Gen1 speed
• Integrated MAC and PHY 3072x18 Byte context memory
• 64 KB receive buffer
• TOE (TCP Offload Engine)
• iSCSI controller (enabled through an optional hardware key)
• RDMA controller (RNIC) (enabled post-RTS through an optional hardware key)
• NC-SI (Network Controller-Sideband Interface) connection for manageability
• Wake-On-LAN (WOL)
• PXE 2.0 remote boot
• iSCSI boot
• IPv4 and IPv6 support
• Bare metal deployment support

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Section 11. I/O Slots

A. Overview / Description
The PowerEdge R710 requires two PCI Express risers: Riser 1 and Riser 2. Each riser connects to the
planar through an x16 PCI Express connector.
• Riser 1 consists of two x4 slots and a third x4 slot dedicated for internal SAS storage through
the PERC 6i or SAS 6/iR.
• The default Riser 2 consists of two x8 PCI Express connectors.
• There is also an optional x16 Riser 2 that supports one x16 PCI Express card.

To ensure proper cooling, no more than two of the four expansion cards can have a power consumption
of greater than 15W (up to 25W maximum each), not including the integrated storage controller.

The system does not support hot-plug or hot-removal of PCI Express cards.

The table below provides a guide for installing expansion cards to ensure proper cooling and mechanical
fit. The expansion cards with the highest priority should be installed first using the slot priority indicated.
All other expansion cards should be installed in card priority and slot priority order.

card slot Max 25W

card type
priority priority allowed Card?

1 PERC 5/E controller 1, 3, 4 2 Y

2 PERC 6/E 3, 4, 1 2 Y
3 10Gb NIC 3, 4, 1, 2 2 Y
4 All other Dell storage cards 3, 4, 1 2 Y
5 All other NICs 2, 1 4a Nb
6 Non-Dell storage cards 1, 2 4a Nb
a
Maximum of 2 of any card whose maximum power exceeds 15w
b
Refer to the expansion card’s documentation to determine if the maximum power exceeds 15w

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Poweredge R710
PCI Express Gen2 Slots
Slot 1: Half-Length (6.6" Factory Installation) / Full-Height (x8 connector), x4 link width
Slot 2: Full-Length (12.2" Factory Installation) / Full-Height (x8 connector), x8 link width
Slot 3: Full-Length (12.2" Factory Installation) / Full-Height (x8 connector), x8 link width
Slot 4: Half-Length (6.6" Factory Installation) / Full-Height (x8 connector), x4 link width
Slot 5: Half-Length (6.6" Factory Installation) / Full-Height (x8 connector), x4 link width
Card PCIe Link Slot Max
Category Description Dell PN
Priority Width Priority Cards
Internal Storage T95
1 Dell™ PERC 6/i Integrated (Sled) Gen1 x8 Integrated 1
(Integrated Slot) 4J
Internal Storage YK8
2 Dell SAS 6/iR Integrated (Sled) Gen1 x8 Integrated 1
(Integrated Slot) 38
External Storage *Dell PERC 5/E Adapter GP2
3 Gen1 x8 Slot 4, 51 22
Controller (Test only, no factory install) 97
External Storage *Dell PERC 6/E Adapter Slot 3, 2,
4 J15 5F Gen1 x8 22
Controller (512MB) 5, 4, 1
External Storage *Dell PERC 6/E Adapter F98 Slot 3, 2,
5 Gen1 x8 22
Controller (256MB) 9F 5, 4, 1
*Intel 10GBase-T Copper Single XR9 Slot 4, 5, 1,
10Gb NIC 6 Gen1 x8 2
Port NIC (Copperpond) 97 2, 3
*Broadcom BCM57710
RK3 Slot 4, 5, 1,
10Gb NIC 7 10GBase-T Copper Single Port Gen1 x8 2
75 2, 3
NIC (Quiver)
Intel® 10GBase-SR Optical RN Slot 4, 5, 1,
10Gb NIC 8 Gen1 x8 2
Single Port NIC (BelleFontaine) 219 2, 3
External Storage M7 Slot 3, 2,
9 *Dell SAS 5/E Adapter Gen1 x8 22
Controller 78G 4, 5, 1
Internal Tape Dell SAS 5/iR Adapter UN Slot 3, 2,
10 Gen1 x8 22
Controller (for internal tape only) 939 4, 5, 1
Fibre Channel Emulex LPe12002 FC8 C85 Slot 4, 5, 1,
11 Gen2 x4 5
8 HBA Dual-Channel HBA 6M 2, 3
Fibre Channel Emulex LPe12000 FC8 C85 Slot 4, 5, 1,
12 Gen2 x4 5
8 HBA Single-Channel HBA 5M 2, 3
1
Thermal testing to determine if the PERC5 can be installed in other slots is pending.
2
A maximum of 2 nternal/external storage controllers (Dell PERC and SAS cards) are allowed in the system in addition to the integrated storage controller.

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B. PCI Express Risers

The two PowerEdge R710 PCI Express risers provide up to four expansion slots and one internal slot
as follows:
• Two x8 and two x4 PCI Express Gen2 slots, connected to the IOH
• One x4 PCI Express Gen1 slot for internal storage, connected to the IOH
• Support for three full-height 9.5" long PCI Express cards and one full-height bracket, low-profile
PCB PCI Express card
• Support for field upgrading one slot (on the center riser) to a full-length 12.2" PCI Express card
• System supports 25W maximum power for the first two cards and 15W for the third and
fourth cards
• The lower power support on the third and fourth cards is due to system thermal limitations
• An optional x16 riser to accommodate interface cards for external GPU boxes that supports a
maximum power of 25W. Use of this riser reduces the number of PCI Express slots from four
to three

C. Additional Riser Restrictions

• The riser connectors on the planar do not support plugging in a standard PCI Express card. Do
not attempt this for troubleshooting.
• Two PowerEdge R710 risers must be installed or the system will not power up.

D. X16 Express Card Specifications

The PowerEdge R710 supports x16 cards that meet the following requirements:
• Standard height (4.376")
• Maximum length of 9.5" (Half-length cards are 6.6"; Full-length cards are 12.283")
• x16 cards can only plug into the optional PowerEdge R710 x16 left riser
• Support for full bandwidth of x16 Gen2 link
• No support for hot-plug or hot-removal
• Maximum power of 25W
• The PowerEdge R710 provides +12V, +3.3V, and +3.3Vaux in accordance with Power Supply Rail
Requirements (Table 4-1 of PCIe Card Electromechanical Spec, Rev 2.0)
• The PowerEdge R710 x16 slot is not compliant with the PCI Express x16 Graphics
150W-ATX Specification
• x16 cards must be compliant with the PCI Express Card Electromechanical Specification Rev 2.0
• x16 cards must only occupy the space of one slot. Cards that occupy the space of two slots are
not supported
• The x16 card is limited to 25W initial start-up power until it is configured as a high-power
device. If no value is set for the Slot Power Limit, the card is limited to 25W. The card must then
either scale down to 25W or disable operation per PCI Express Base Spec Rev 2.0
• The x16 card must be able to support a maximum operating temperature of 55°C as defined in
the Dell PCI Environmental Spec and the PCI Express Card Electromechanical Spec. The
PowerEdge R710 provides a minimum transverse air velocity of 100 LFM (linear feet per minute)
to the x16 card.

E. Boot Order
PCIe scan order (from the BIOS HW spec v1.0)
IOH port 1,2 (PCI Express Gen1 x4) – Broadcom BCM5709C Gigabit Embedded NIC #1
IOH port 3 (PCI Express Gen1 x4) – Broadcom BCM5709C Gigabit Embedded NIC #2
IOH port 4 in Bluefish or ICH9 port1-4 in Thidwick (PCI Express Gen1 x4) – Integrated PERC6i or SAS6i
on the Riser 1
IOH port 5 (PCI Express Gen2 x4) – Slot 2 on Riser 1
IOH port 6 (PCI Express Gen2 x4) – Slot 1 on Riser 1
IOH port 7/8 (PCI Express Gen2 x8) – Slot 3 on Riser 2
IOH port 9/10 (PCI Express Gen2 x8) – Slot 4 on Riser 2
For PCI-e X16 optional left riser, IOH port 7,8,9,10 are combined into one x16 PCI-e slot.

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Section 12. Storage

A. Overview / Description
The PowerEdge R710 supports three different backplanes to support different hard drive configurations:
six 3.5" hard drives, four 3.5" hard drives, or eight 2.5" hard drives.

On each backplane are two LED indicators per drive slot with one or two mini-SAS x4 cable connectors
for connecting the backplane to the integrated SAS 6/iR or PERC 6i, and a power connector to connect
to the planar. Both Serial Attached SCSI (SAS) and Serial ATA (SATA) hard drives are supported. For
SAS/SATA mixing, two SAS drives are supported with the 3.5" backplane.

B. Drives
I. Internal Hard Disk drives
The PowerEdge R710 supports up to eight 2.5" or six 3.5" hard disk drives.
• Support for 15,000 rpm 3.5" SAS drives
• Support for 10,000 and 15,000 rpm 2.5" SAS drives
• Support for 7,200 rpm 3.5" Near Line SAS drives
• Support for 7,200 rpm 3.5" and 2.5" Enterprise SATA drives
• Support for 7,200 rpm 3.5" and 2.5" SATAu drives
• For SAS/SATA mixing, two SAS and up to six SATA drives are possible
• A pair of SAS drives must be installed in slots 0 and 1
• One mixed 2.5" and 3.5" hard drive configuration is allowed:
• A pair of 2.5" 10k rpm SAS drives must be installed with an adapter in a 3.5" hard drive
carrier in drive slots 0 and 1
• The remaining hard drives must be 3.5" hard drives and must be either all SAS or all
SATA
• Support for 25 and 50GB 2.5" solid state drives at RTS (additional solid state drive support is
Post RTS)
• SSDs require the PERC 6/i Integrated storage controller and cannot be mixed with any other
type of hard drive

2.5 HDDs
2.5" Enterprise SATA 7.2K HDs 160GB, 250GB, and 500GB
2.5" SAS 10K HDs: 73GB, 146GB, and 300GB
2.5" entry 10K SAS in 3.5" HDD carrier
2.5" SAS 15K HDs 73GB and 146GB
2.5" Enterprise SATA SSD 25GB, 50GB, and 100GB
2.5" SSD 25GB and 50GB
3.5 HDDs
160GB, 250GB, 500GB, 750GB, and
Support for 3.5" Enterprise SATA 7.2K:
1,000GB
500GB SATAu, 750GB SATAu, and
Support for 3.5" Enterprise SATAu 7.2K:
1 ,000GB SATAu
Support for 3.5" Green Enterprise SATA 5.4K 1,000GB
Support for 3.5" Near Line SAS 7.2K 500GB, 750GB, and 1,000GB
Support for 3.5" SAS 15K HDs: 146GB, 300GB, and 450GB
Table: R710 supported HDD matrix

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For mixed SAS/SATA configurations, SAS drives must be installed as a pair in drive slots 0 and 1.

One mixed 2.5" and 3.5" hard drive configuration is allowed: a pair of 2.5" 10k rpm SAS drives can be
installed with an adapter in a 3.5" hard drive carrier in drive slots 0 and 1. The remaining hard drives must
be 3.5" hard drives and must be either all SAS or all SATA.
PowerEdge
R710

Platforms 4

All 2.5" HDD SAS (or) SATA 4

All 2.5" SSD*** 4

Mixed SSD/SAS** 4

All 3.5" HDD SAT (or) SATA 4

Mixed SAS/SATA* 4

2.5" SAS in 3.5" HDD Carrier (RTS+) 4

2.5" SAS HDD in 3.5" HDD Carrier + 3.5" SATA HDDs (Mixed SAS) 4

2.5" SAS HDD in 3.5" HDD Carrier + 3.5" SATA HDDs (Mixed SAS/SATA)* 4

• SAS HDDs should be in slots 0 & 1 and min/max number of SAS HDDs is 2, rest will be SATA
HDDs and min/max number of SATA HDDs depends on the configuration.
• **No maximum for SAS HDD’s combined with SSD
• ***SSD Support requires PERC 6/i

20GB and 50GB solid state drives (SSD) support will be supported at RTS

II. Hard Disk Drive Carriers

Hard drives must use the Dell 2.5" and the 3.5" Hard Drive Disk Carriers.

Figure: 2.5" HDD Carrier

III. Empty Drive Bays

For the slots that are not occupied by drives, a carrier blank is provided to maintain proper cooling,
maintain a uniform appearance to the unit, and provide EMI shielding.

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IV. Diskless Configuration Support

The system supports diskless configuration with no storage controller (SAS 6/iR or PERC 6i) installed in
the system. A 2.5" HDD backplane is still installed in this configuration.

V. Hard Drive LED Indicators

Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED
for disk activity and the other is a bicolor (green/amber) LED for status information. The activity LED is
driven by the disk drive during normal operation. The bicolor LED is controlled by the SEP device on the
backplane. Both LEDs are used to indicate certain conditions under direction of a storage controller.

C. RAID Configurations
PowerEdge R710 Factory Configuration Summary

non-mixed Mixed SAS/ SATA

drives, all Min 2xSAS+1xSATA
sata or 2.5": Max 2xSAS + 6xSATA
config all sas 3.5": Max 2xSAS + 6xSATA
configs description
type
Min Max Min MAX
HDD HDD HDD HDD

Integrated
SAS/SATA 2.5"=1 2.5"=8
0 MSS SAS/SATA No RAID
(No RAID) 3.5"=1 3.5"=8
(SAS 6/iR)
Integrated
2.5"=1* 2.5"=8
1 MSSR0 SAS/SATA RAID 0 N/A
3.5"=1* 3.5"=8
(SAS 6/iR, PERC6/I)
Integrated
2.5"=2 2.5"=2
2 MSSR1 SAS/SATA RAID 1 N/A
3.5"=2 3.5"=2
(SAS 6/iR, PERC6/I)
Integrated
2.5"=3 2.5"=8
3 MSSR5 SAS/SATA RAID 5 N/A
3.5"=3 3.5"=8
(PERC 6/i)
Integrated
2.5"=4 2.5"=8
SAS/SATA 4 MSSR6 SAS/SATA RAID 6 N/A
3.5"=4 3.5"=8
(RAID) (PERC 6/i)
Integrated
2.5"=4 2.5"=8
5 MSSR10 SAS/SATA RAID 10
3.5"=4 3.5"=8
(PERC 6/i)
Integrated
SAS/SATA RAID 2.5"=2+2 2.5"=2+2
6 MSSR1R1
1/RAID 1 3.5"=2+2 3.5"=2+2
(SAS 6/iR, PERC 6/i)
Integrated
2.5"=2+3 2.5"=2+6
7 MSSR1R5 SAS/SATA RAID
3.5"=2+3 3.5"=2+6
1/RAID 5 (PERC 6/i)
Integrated
SAS/SATA 2.5"=3 2.5"=6
8 MSS-X SAS/SATA No RAID
(No RAID) 3.5"=3 3.5"=6
(SAS 6/iR)

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non-mixed Mixed SAS/ SATA

drives, all Min 2xSAS+1xSATA
sata or 2.5": Max 2xSAS + 6xSATA
config all sas 3.5": Max 2xSAS + 6xSATA
configs description
type
Min Max Min MAX
HDD HDD HDD HDD

Integrated
SAS/SATA RAID 2.5"=2+2 2.5"=2+2
9 MSSR1R1- X
1/RAID 1 3.5"=2+2 3.5"=2+2
(SAS 6/iR, PERC 6/i) Mixed SSD/ SAs
SAS/SATA non-mixed Min 2xSSD+1xSAS
(RAID) drives, all SSD 2.5": Max 2xSSD + 6xSAS
config Integrated
configs description
type SAS/SATA RAID 2.5"=2+3 2.5"=2+6
10 MSSR1R5-X Min Max Min MAX
1/RAID 5 3.5"=2+3 3.5"=2+6
HDD HDD HDD HDD
(PERC 6/i)
Integrated SSD 2.5"=2 2.5"=2
11 MSSR1 N/A
RAID 1 (PERC 6/i) 3.5"=N/A 3.5"=N/A

SSD Integrated SSD 2.5"=3 2.5"=

12 MSSR5 N/A
(RAID) RAID 5 (PERC 6/i) 3.5"=N/A 3.5"=N/A
Integrated SSD 2.5"=4 2.5"=8
13 MSSR10 N/A
RAID 10 (PERC 6/i) 3.5"=N/A 3.5"=N/A
Integrated
SSD/SAS SSD/SAS RAID 2.5"=2+3 2.5"=2+6
14 MSSR1R5-X
(RAID) 1/RAID 5 3.5"=N/A 3.5"=N/A
(PERC 6/i)

* Minimum of 1 hard drive for PERC6i ; and minimum of 2 for SAS6iR.

D. Storage Controllers
I. SAS 6/iR
The PowerEdge R710 internal SAS 6/iR HBA is an expansion card that plugs into a dedicated PCI
Express x8 slot (only four lanes wired). It incorporates two four-channel SAS IOCs for connection to
SAS/SATA hard disk drives. It is designed in a form factor that allows the same card to be used in R610
and T610.

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II. PERC 6i
For customers who want a hardware RAID solution, the PERC 6i is an option. The PERC 6i uses the LSI
1078 ROC (RAID on Chip) processor with a PCI Express host interface and DDR2 memory. A battery is
also available for backup.

R710 PCIe PCIe I/O

product Usage Slot RAID BBU
Support CON bracket CON

0, 1,
Internal
5, 6,
PERC 6/i Backplane Storage x4 int
Yes, Max 1 x8 No 10, 50, Yes
Integrated Storage slot x4 int
and
(HDD, SSD)
60
PERC SAS/SATA

Yes, Max 2 0, 1,
External (MD1000 5, 6,
PERC 6/E PCIe x4 ext
SAS/SATA Pompano x8 Yes 10, 50, TBBU
Adapter slot x4 ext
Storage & MD1020 and
Ridgeback) 60
Yes, Max 2
External (MD1000,
PERC 5/E PCIe x4 ext 0, 1, 5,
Legacy Pompano, x8 Yes TBBU
Adapter slot x4 ext 10, 50
Storage & MD1020
Ridgeback)
Internal
SAS HBA SAS/SATA

Backplane
SAS 6/iR Storage Storage x4 int
Yes, Max 1 x8 No 0, 1 No
Integrated (No tape slot x4 int
or SSD
support)
External
SAS 5/E PCIe x4 ext
SAS (DAS, Yes, Max 2 x8 Yes none No
Adapter slot x4 ext
Tape)
Internal
slim-line Yes, 2
SATA ports for
ICH9

On Planar
Optical Optical n/a n/a n/a x1 int n/a n/a
via chipset
and/or and/or
TBU Only TBU
(no HDD)
Internal or
LSI 2032 SCSI

External
SCSI
SCSI
LSI 2032 PCIe int
Tape/ Yes, Max 2 x8 Yes n/a n/a
Adapter slot SCSI
Legacy
ext
External
storage

Note: A maximum of 2 external storage controllers (Dell PERC or SAS cards) are allowed in the system in
addition to the integrated storage controller.

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E. LED Indicators
Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED
for disk activity and the other is a bicolor (green/amber) LED for status information. The activity LED is
driven by the disk drive during normal operation. The bicolor LED is controlled by the SEP device on the
backplane. Both LEDs are used to indicate certain conditions under direction of a storage controller.

F. Optical Drives
Optical drives are optional in all of the PowerEdge R710 systems and connect to the planar via the SATA
interface. The following internal slim-line drives are available on the PowerEdge R710: DVD-ROM and
DVD+RW. PATA (IDE) optical drives are not supported.

If an optical drive is not ordered with the system, a blank is installed in its place.

G. Tape Drives
Internal tape drives are optional in systems with the 4x3.5" or 8x2.5" backplanes. Internal SATA tape
drives connect directly to the SATA connector on the planar. Internal SCSI tape drives connect through
the LSI 2032 PCI Express SCSI adapter card.

TAPE DRIVES

Internal (RD1000 Half-Height SATA)

Internal Tape
DAT72 Half –Height SCSI
Internal Tape
One 3.5" Half-Height Tape Drive Bay
Drive Bays
External (RD1000 USB)
LTO-2L (Legacy, SCSI)
LTO-3-060 (SCSI)
LTO-3 (Legacy, SCSI)
External TBU
LTO-4-120 (Half-Height SAS)
LTO-4-120 (Full-Height SAS)
2U external TBU (PV114T)
DAT72 Half–Height SCSI
4U SAS, SCSI, iSCSI, and FC

External 2U SAS, SCSI, iSCSI, and FC

TBU/Automation ML6000 Family SAS, SCSI, and FC
2U external TBU (PV124T ) Legacy SCSI

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chassis config tape backup unit (internal)

Backplane Type Config TBU Controller TBU Cable

3.5" x 6" No TBU N/A N/A

No TBU N/A N/A
Internal for 3.5 Bay (RD 1000 Half-Height
Connects to MB XR724
SATA)
3.5" x 4" DAT72 for 3.5 Bay (Half-Height SCSI) LSI 2032 (SCSI) HBA DR017
No TBU N/A N/A
Internal for 3.5 Bay (RD 1000
Connects to MB RN694
Half-Height SATA)
2.5" x 8 DAT72 for 3.5 Bay (Half-Height SCSI) LSI 2032 (SCSI) HBA CJ176

Section 13. Video

A. Overview / Description
The PowerEdge R710 Integrated Dell Remote Access Controller 6 (iDRAC6) incorporates an integrated
video subsystem, connected to the 32-bit PCI interface of the ICH9. This logic is based on the Matrox
G200. The device only supports 2D graphics. The video device outputs are multiplexed between the
front and rear video ports. If a monitor is connected to the front video connector, it will take precedence
over the rear connection, thereby removing the display from the rear connection. The integrated video
core shares its video memory with the iDRAC6’s 128MB DDR2 application space memory. This memory
is also used for the KVM buffer.

The PowerEdge R710 system supports the following 2D graphics video modes:

resolution refresh rate (Hz) Color Depth (bit)

640 x 480 60, 72, 75, and 85 8, 16, and 32

800 x 600 56, 60, 72, 75, and 85 8, 16, and 32
1024 x 768 60, 72, 75, and 85 8, 16, and 32
1152 x 864 75 8, 16, and 32
1280 1024 60, 75, and 85 8 and 16
1280 1024 60 32

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Section 14. Audio

A. Overview / Description
No speakers supported

Section 15. Rack Information

A. Overview / Description
Rack installation components such as rails are provided with the PowerEdge R710 Rack Kit. The rack
installation components are as follows: Sliding Rack mount with latest generation Cable Management
Arm (CMA). When the system is installed in a rack, please observe the following guidelines:

Nothing should be located within 12" of the front of the unit that would restrict the airflow into the system.

Nothing should be mounted or placed behind the chassis that would restrict airflow from exiting the
system. Only Dell approved CMAs can be placed behind the chassis. All other objects should be located
at least 24" away from the rear of the chassis.

When two systems are placed back to back, the separation between the units should be at least 24" if
the exit airflow is equivalent for the two chassis. This allows the exit air to escape without creating an
extreme back pressure at the rear of one of the chassis.

B. Cable Management Arm (CMA)

Cable Type Number of cables

Mouse – USB 1
Keyboard – USB 1
Video – VGA 1
Power Cords 2
LOMs – Ethernet 1
PCI NICs 1
Total 8

Notes: • CMA supports for the maximum number of cables supported by system
• The numbers in this matrix represent the number and types of external cables required to be
supported by the CMA solution.
• This matrix is built on the practical worst case configuration in each platform based on prior
and projected take rates. Note that other combinations of adapters and associated cables exist,
but are assumed to fall within these guidelines from the standpoint of bend radius and
flexibility, cable bundling, cable volume, etc.
• PCI NIC cables are assumed to be Ethernet.
• KVM cable dongle may be used for mouse/keyboard/video.

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C. Rails
Support for tool-less installation in CEA-310-E compliant square hole 4-post racks including:
Support for Dell 2410 24U Rack
Support for Dell 4210 Rack
Support for HP/Compaq 10xxx series
Support for tooled or tool-less installation in CEA-310-E compliant round hole 4-post racks
(tool-less preferred)
Support for flush and center mount installation in CEA-310-E compliant 2-post racks (1U & 2U only)

The R710 rail supports the following racks:

Support for Dell 4210 & 2410 racks

Support for Dell 4200 & 2400 racks without CMA
Support for HP/Compaq 10XXX series racks
Support for HP/Compaq 9XXX & 7XXX series racks without CMA

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Section 16. Operating Systems

A. Overview / Description
The PowerEdge R710 supports Windows®, Linux®, and Solaris™ Operating Systems.

Windows® Support:
x86
Factory logo Test/
or INSTALLATION schedule support
INSTALLATION certification Validate
x64
Windows® Small Business Server 2008 and Essential Business Server 2008
Windows
Standard/ Hardware
x64 Yes Shipping Yes Yes
Premium Quality Labs -
Windows 2008
Windows Server® 2008 (x64 includes Hyper-V™)

Standard
Windows
Hardware
x64 Enterprise Yes Shipping Yes Yes
Quality Labs -
Windows 2008
Datacenter
Windows Server® 2008

Standard Windows
Hardware
x86 Yes Shipping Yes Yes
Quality Labs -
Enterprise Windows 2008
Windows® Web Server 2008

x86 Windows
Hardware
and Web Yes Shipping Yes Yes
Quality Labs -
x64 Windows 2008
Windows Server® 2008, SP2 (x64 includes Hyper-V™)

Standard
Windows Available in
Hardware August -
x64 Enterprise Yes Yes Yes
Quality Labs - October
Windows 2008 2009
Datacenter
Windows Server® 2008, SP2

Standard Windows Available in

Hardware August -
x86 Yes Yes Yes
Quality Labs - October
Enterprise Windows 2008 2009

Windows® Web Server 2008, SP2

Windows Available in
x86
Hardware August -
and Web Yes Yes Yes
Quality Labs - October
x64 2009
Windows 2008

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x86
Factory logo Test/
or INSTALLATION schedule support
INSTALLATION certification Validate
x64
Windows Server® 2008, R2, (x64 includes Hyper-V™)

Standard Windows Available in

Hardware November
x64 Enterprise Yes Quality Labs - 2009 - Yes Yes
Windows 2008 January
Datacenter Release 2 2010

Linux support:

Red Hat® Enterprise Linux 4.7

x86
Available in Available in
and ES/AS n/A Yes Yes
June 2009 June 2009
x64
Red Hat Enterprise Linux 5.2
x86
and Standard/AP Yes n/A Shipping Yes Yes
x64
Red Hat Enterprise Linux 5.3
x86
Available in Available in
and Standard/AP n/A Yes Yes
June 2009 June 2009
x64
Novell® SUSE® Linux Enterprise Server 10 SP2
x64 Enterprise Yes n/A Shipping Yes Yes
Novell SUSE Linux Enterprise Server 11

Available in Available in
x64 Enterprise n/A Yes Yes
June 2009 June 2009

Solaris™ 10 05/09
Available in
x64 Enterprise Drop in the box n/A Yes Yes
June 2009

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Section 17. Virtualization

A. Overview / Description
Supported embedded hypervisors:
• Microsoft® Windows Server® 2008 Hyper-V
• VMware® ESXi Version 4.0 and 3.5 update 4
• Citrix® XenServer 5.0 with Hotfix 1 or later

Section 18. Systems Management

A. Overview / Description
Dell is focused on delivering open, flexible, and integrated solutions the help our customers reduce the
complexity of managing disparate IT assets. We build comprehensive IT management solutions.
Combining Dell PowerEdge Servers with a wide selection of Dell-developed management solutions, we
provide customers choice and flexibility – so you can simplify and save in environments of any size.

To help you meet your server performance demands, Dell offers Dell OpenManage™ systems
management solutions for:
• Deployment of one or many servers from a single console
• Monitoring of server and storage health and maintenance
• Update of system, operating system, and application software

We offer IT management solutions for organizations of all sizes – priced right, sized right, and
supported right.

B. Server Management
A Dell Systems Management and Documentation DVD and a Dell Management Console DVD are included
with the product. ISO images are also available. The following sections briefly describe the content.

Dell Systems Build and Update Utility: Dell Systems Build and Update Utility assists in OS install and
pre-OS hardware configuration and updates.

OpenManage Server Administrator: The OpenManage Server Administrator (OMSA) tool provides a
comprehensive, one-to-one systems management solution, designed for system administrators to
manage systems locally and remotely on a network. OMSA allows system administrators to focus on
managing their entire network by providing comprehensive one-to-one systems management.

Management Console: Our legacy IT Assistant console is also included, as well as tools to allow access
to our remote management products. These tools include: Remote Access Service, for iDRAC, and the
BMC Management Utility.

Active Directory Snap-in Utility: The Active Directory Snap-in Utility provides an extension snap-in to
the Microsoft Active Directory. This allows you to manage Dell specific Active Directory objects. The
Dell-specific schema class definitions and their installation are also included on the DVD.

Dell Systems Service Diagnostics Tools: Dell Systems Service and Diagnostics tools deliver the latest
Dell optimized drivers, utilities, and operating system-based diagnostics that you can use to update
your system.

eDocs: The section includes Acrobat files for PowerEdge systems, storage peripheral and
OpenManage software.

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Dell Management Console DVD: The Dell Management Console is a Web-based systems management
software that enables you to discover and inventory devices on your network. It also provides advanced
functions, such as health and performance monitoring of networked devices and patch management
capabilities for Dell systems.

Server Update Utility: In addition to the Systems Management Tools and Documentation and Dell
Management Console DVDs, customers have the option to obtain Server Update Utility DVD. This
DVD has an inventory tool for managing updates to firmware, BIOS and drivers for either Linux or
Windows varieties.

C. Embedded Server Management

The PowerEdge R710 implements circuitry for the next generation of Embedded Server Management. It
is Intelligent Platform Management Interface (IPMI) v2.0 compliant. The iDRAC6 (Integrated Dell Remote
Access Controller) is responsible for acting as an interface between the host system and its management
software and the periphery devices. These periphery devices consist of the PSUs, the storage backplane,
integrated SAS HBA or PERC 6/i and control panel with semi-intelligent display.

The iDRAC6 provides features for managing the server remotely or in data center lights-out
environments.

Advanced iDRAC features require the installation of the iDRAC6 Enterprise card.

I. Unmanaged Persistent Storage

The unmanaged persistent storage consists of two ports:
• one located on the control panel board
• one located on the Internal SD Module

The port on the control panel is for an optional USB key and is located inside the chassis. Some of the
possible applications of the USB key are:
• User custom boot and pre-boot OS for ease of deployment or diskless environments
• USB license keys for software applications like eToken™ or Sentinel Hardware Keys
• Storage of custom logs or scratch pad for portable user-defined information (not hot-pluggable)

The Internal SD Module is dedicated for an SD Flash Card with embedded Hypervisor for virtualization.
The SD Flash Card contains a bootable OS image for virtualized platforms.

II. Lifecycle Controller/Unified Server Configurator

Embedded management is comprised of several pieces which are very interdependent.
• Lifecycle Controller
• Unified Server Configurator
• iDRAC6
• vFLASH

Lifecycle controller is the hardware component that powers the embedded management features. It is
integrated and tamperproof storage for system-management tools and enablement utilities (firmware,
drivers, etc.). It is flash partitioned to support multiple, future use cases.

Dell Unified Server Configurator is a 1:1 user interface exposing utilities from Lifecycle Controller. Customers
will use this interface to configure hardware, update server, run diagnostics, or deploy the operating
system. This utility resides on Lifecycle Controller. To access the Unified Server Configurator, press <F10>
key within 10 seconds of the Dell logo display during the system boot process. Current functionality
enabled by the Unified Server Configurator includes:

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feature description

Faster O/S Drivers and the installation utility are embedded on system, so no need to
Installation scour DELL.COM
Integration with Dell support automatically directed to latest versions
Faster System Updates of the Unified Server Configurator iDRAC, RAID, BIOS, NIC, and
Power Supply
Description: Ability to recover to previous “known good state” for all
Update Rollback
updatable components

More Comprehensive
Diagnostic utilities are embedded on system
Diagnostics

Detects RAID controller and allows user to configure virtual disk

Simplified Hardware and choose virtual disk as boot device, eliminating the need to
Configuration launch a separate utility and also provides configuration for iDRAC,
BIOS, and NIC/LOM.

III. iDRAC6 Express

The iDRAC6 Express is the first tier of iDRAC6 upgrades. In addition to upgrading the system with a
Lifecycle Controller, the iDRAC6 Express offers the following key features:
• Graphical web interface
• Standard-based interfaces
• Server Sensor monitoring and fault alerting
• Secure operation of remote access functions including authentication, authorization,
and encryption
• Power control and management with the ability to limit server power consumption and
remotely control server power states
• Advanced troubleshooting capabilities

For more information on iDRAC6 Express features see the table below.

IV. iDRAC6 Enterprise

The optional iDRAC6 Enterprise card provides access to advanced iDRAC6 features. The iDRAC6
Enterprise connects directly to the PowerEdge R710 planar and is mounted parallel to the planar
with stand-offs.

Key features for the iDRAC6 Enterprise include:

• Scripting capability with Dell’s Racadm command-line
• Remote video, keyboard, and mouse control with Virtual Console
• Remote media access with Virtual Media
• Dedicated network interface

Additionally, the iDRAC6 Enterprise can be upgraded by adding the vFlash Media card. This is a 1GB
Dell branded SD card that enabled a persistent 256MB virtual flash partition. In the future, vFlash will be
expanded to include additional features.

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A more detailed feature list for iDRAC6 Enterprise and vFlash is included in the table below.

iDRAC6 iDRAC6 VFlash

Feature BMC
Express Enterprise Media

Interface and Standards Support

IPMI 2.0 4 4 4 4

Web-based GUI 4 4 4

SNMP 4 4 4

WSMAN 4 4 4

SMASH-CLP 4 4 4

Racadm command-line 4 4

Conductivity
Shared/Failover Network Modes 4 4 4 4

IPv4 4 4 4 4

VLAN tagging 4 4 4 4

IPv6 4 4 4

Dynamic DNS 4 4 4

Dedicated NIC 4 4

Security & Authentication

Role-based Authority 4 4 4 4

Local Users 4 4 4 4

Active Directory 4 4 4

SSL Encryption 4 4 4

Remote Management & Remediation

Remote Firmware Update 4 4 4 4

Server power control 4 4 4 4

Serial-over-LAN (with proxy) 4 4 4 4

Serial-over-LAN (no proxy) 4 4 4

Power capping 4 4 4

Last crash screen capture 4 4 4

Boot capture 4 4 4

Serial-over-LAN 4 4 4

Virtual media 4 4

Virtual console 4 4

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iDRAC6 iDRAC6 VFlash

Feature BMC
Express Enterprise Media

Virtual console sharing 4 4

Virtual flash 4

Monitoring
Sensor Monitoring and Alerting 4 4 4 4

Real-time Power Monitoring 4 4 4

Real-time Power Graphing 4 4 4

Historical Power Counters 4 4 4

Logging Features
System Event Log 4 4 4 4

RAC Log 4 4 4

Trace Log 4 4 4

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Section 19. Peripherals

A. USB peripherals
The PowerEdge R710 supports the following USB devices:
• DVD (bootable; requires two USB ports)
• USB Key (bootable)
• Keyboard (only one USB keyboard is supported)
• Mouse (only one USB mouse is supported)

B. External Storage

external storage

EMC's AX Arrays (SCSI, FC, and iSCSI)

SAN Support EMC's CX Arrays (SCSI, FC, and iSCSI)
EqualLogic's PS5XXX Arrays (iSCSI)
OMSS X.X for MD1000

SAS Management OMSS X.X for MD1020

SW for xBOD X.X for MD3000
for MD3000i
Attachment to PV NX1950 including iSCSI and clustering support
PV NAS Attachment to Win Storage Server on PE
Attachment to EMC NS500G (S&P)
MD1000 JBOD
MD3000 RBOD
PV DAS
MD1120 2.5 SAS/SATA JBOD
MD1100 3.5 SAS/SATA JBOD
PV SAN MD3000i iSCSI RAID array
PS5000 family
EqualLogic™
PS5500 family
SAS xBOD SW OpenManage Storage Manager

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Section 20. Documentation

A. Overview, Description, and List

PowerEdge R710 and other 11G systems use the new enterprise documentation set. The following is a
summary of some of the documents slated for the PowerEdge R710 product. For the complete list of
documents, including language requirements and delivery scheduling, refer to the Documentation Matrix
and the Documentation Milestones in the InfoDev Functional Publications Plan.
• Getting Started Guide: This guide provides initial setup steps, a list of key system features, and
technical specifications. This document is required for certain worldwide regulatory submittals.
This guide is printed and shipped with the system, and is also available in PDF format on the
Dell support site.
• Hardware Owner’s Manual: This document provides troubleshooting and remove/replace
procedures, as well as information on the System Setup program, system messages, codes,
and indicators. This document is provided to customers in HTML and PDF format at the Dell
support site.
• System Information Label: The system information label documents the system board layout
and system jumper settings and is located on the system cover. Text is minimized due to space
limitations and translation considerations. The label size is standardized across platforms.
• Information Update: This is a PDF document that provides information on late changes and
issues having significant customer impact which were discovered after document signoff.
• General System Information Placemat: This is a paper document that is provided with every
system. The document provides general information about the system, including software
license agreement information and the location of the service tag.
• Rack Placemat: This is a paper document that is provided with the rack kits. The document
provides an overview of procedures for setting up the rack.

Section 21. PAckaging options

Packaging Provide packaging to support system

•W  ill not bag the server in outbound pack

• Multi-pack rails targeted to go in a box within the
Packaging should
multi-pack but investigation underway for a separate
incorporate keyboard,
box for ease of customer staging
mouse, bezel, Doc,
• Accessory tray needs a cover and icon showing contents
CDs, rails
• Doc Box – separate box within the main box containing
import documentation and software (OS, OM, etc.)

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 Dell™ PowerEdge™ R710 Technical Guidebook

Appendix
R710 Volatility Chart.

Non-
volatile Reference Type [e.g., Flash PROM,
Volatile QTY Size
ram designator EEPROM]:
RAM
Planar, Poweredge R710
System BIOS SPI Flash Y U_SPI_BIOS 1 4MB Flash EEPROM (SPI interface)
LOM Configuration Data Y U15, U16 2 512KB FLASH (NOR)
iDRAC6 Controller ROM Y U_IBMC 1 4KB ROM
iDRAC6 Controller RAM Y U_IBMC 1 8KB RAM
System CPLD Y U_CPLD 1 1200 Macro cells Internal Flash EEPROM
System CPLD Y U_CPLD 1 1KB RAM
iDRAC6 Express Internal Flash Y U_EMMC 1 1GB NAND FLASH
J_CPU(2:1)_
up to 18 DIMMs
System RAM Y CH(2:0)_ 18 *16GB
RAM
DIMM(3:1)
TPM ID EEPROM
Y U_SEEPROM 1 256B EEPROM
(Plug in module only)
TPM Binding EEPROM
Y U7261 1 256B EEPROM
(on China planar only)
U_IBMC_
iDRAC6 SDRAM Y 1 128MB DDR2 RAM
MEM
U_IBMC_
iDRAC6 FRU Y 1 4KB EEPROM
FRU
iDRAC6 Boot Block Flash Y U_IBMC_SPI 1 2MB FLASH (NOR)
Trusted Platform Module Y N U_TPM 1 128 bytes EEPROM
chipset
CMOS Y U_ICH9 1 256KB Battery backed RAM
2.5" backplane or 3.5" Backplane
Embedded Microcontroller
Storage Controller Processor Y U_SEP 1 32KB
Flash
control panel
J_USBKEY License key hard set ROM or
Internal USB Y 1 User selectable
user choice
(connector)
J_SDCARD User selectable -
Internal SD Module Y 1 1GB shipped
Secure Digital NAND Flash
(Connector)
Power Supply
Maximum
Varies by Up Embedded microcontroller
PSU Microcontroller Y supported = 2MB
flash
part number to 2 per PSU
PERC 6/i Integrated
PERC NVSRAM Config Data Y U23 1 32KB Non-volatile SRAM
PERC Firmware Y U24 1 4MB FLASH (NOR)
PERC Cache RAM Y U58-61 1 256MB RAM
FRU Y U40 1 256MB EEPROM
IBUTTON Key EEPROM Y U21 1 1KB EEPROM
CPLD Y U_CPLD 1 72 macrocells Internal Flash EEPROM
SAS 6/iR Integrated
Controller Configuration Data Y U3 1 4MB FLASH (NOR)
FRU Y U4 1 256KB EEPROM
Integrated Mirroring NVSRAM Y U1 1 32KB Non-volatile SRAM
iDRAC6 Enterprise
J_SD 1GB @ RTS,
VFlash Y 1 Larger later
Secure Digital NAND Flash
(connector)

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R710 Volatility Chart Continued.

Can user programs or operating

system write data to it during Purpose? [e.g., boot code]
normal operation?
Planar, Poweredge R710
Boot Code, System Configuration Information, EUFI
System BIOS SPI Flash No
environment
LOM Configuration Data No LAN on motherboard configuration and firmware
iDRAC6 Controller ROM No not utilized
iDRAC6 Controller RAM No iDRAC internal RAM
System CPLD No System-specific hardware logic
System CPLD No not utilized
iDRAC Operating System plus Managed System Services
No for iDRAC Operating System. Yes for
iDRAC6 Express Internal Flash Repository (i.e., Unified Server Configurator, OS drivers,
Managed System Services Repository
diagnostics, rollback versions of various programmables)
System RAM Yes System OS RAM
TPM ID EEPROM
No BIOS Identification of TPM module
(Plug in module only)
TPM Binding EEPROM
No BIOS binding of plug in module to a particulare planar
(on China planar only)
iDRAC6 SDRAM No BMC OS + VGA frame buffer
iDRAC6 FRU No Motherboard electronic product identifier
iDRAC boot loader and configuration (i.e., MAC address),
iDRAC6 Boot Block Flash No
life cycle log, and system event log
Trusted Platform Module yes Storage of encryption keys
chipset
CMOS No BIOS settings
2.5" backplane or 3.5" Backplane
Storage Controller Processor No Backplane firmware (HDD status, etc.)
control panel
Normal usage is read only software license key, but not
Internal USB Yes as allowed by OS
limited
Normal usage is embedded hypervisor OS but not
Internal SD Module Yes as allowed by OS
limited
Power Supply
Power supply operation, power telemetry data, and fault
PSU Microcontroller No
behaviors
PERC 6/i Integrated
PERC NVSRAM Config Data No Stores configuration data of HDDs
PERC Firmware No Storage Controller Firmware
PERC Cache RAM No - not directly. Storage RAID controller cache
Card product identification for system inventory
FRU No
purposes
IBUTTON Key EEPROM No Feature enablement encyrpted key
CPLD No HW control logic (i.e., power sequencing)
SAS 6/iR Integrated
Controller Configuration Data No Stores configuration data of HDDs
Card product identification for system inventory
FRU No
purposes
Integrated Mirroring NVSRAM No Stores configuration data of HDDs
iDRAC6 Enterprise
Yes - When enabled, installed, and the media
VFlash Storage of logs, user images like files, drivers, OS's, etc.
does not have the write protect switch applied

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R710 Volatility Chart Continued.

How is data input to this memory?

Planar, Poweredge R710

Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting
up the system from a floppy or OS-based executable containing the firmware file and the loader. System
System BIOS SPI Flash loaded with arbitrary data in firmware memory would not operate. Future firmware releases may add support
for recovery of a bad/corrupted BIOS ROM image via the iDRAC (administrator privilege plus specific firmware,
binary, and commands)
Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting
LOM Configuration Data up the system from a floppy or OS-based executable containing the firmware file and the loader. LOMs loaded
with arbitrary data in firmware memory would not operate.
iDRAC6 Controller ROM N/A
iDRAC6 Controller RAM iDRAC embedded system
Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting
System CPLD up the system from a floppy or OS-based executable (currently only DRMK utility support) containing the
firmware file and the loader. System loaded with arbitrary data in CPLD memory would not operate.
System CPLD Not utilized
iDRAC OS: Loading flash memory requires a vendor-provided firmware file and loader program that is executed
by booting up the system from a floppy or OS-based executable containing the firmware file and the loader.
iDRAC6 Express Internal
System loaded without a good iDRAC firmware image yields a non-functional iDRAC. Managed Services
Flash
Repository: Various partitions are loaded via vendor-provided firmware file and loader program just like iDRAC
OS.
System RAM System OS
TPM ID EEPROM
Factory load only.
(Plug in module only)
TPM Binding EEPROM
BIOS only
(on China planar only)
iDRAC6 SDRAM Embedded iDRAC OS for 108MB and 8MB for VGA frame buffer
iDRAC6 FRU Factory and iDRAC embedded OS
Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting
up the system from a floppy or OS-based executable or out-of-band firmware updates across the management
iDRAC6 Boot Block
network. Bad contents yield the iDRAC inoperable and unrecoverable in the customer environment. Note the
Flash
life cycle log is automatically updated by the iDRAC as various system component FW, HW, and SW verions are
changed.
Trusted Platform Module Using TPM-enabled operating systems
chipset
CMOS BIOS control only via input such as BIOS F2 menu user configuration settings (such as boot order)
2.5" backplane or 3.5" Backplane
Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting
Storage Controller Pro-
up the system from a floppy or OS-based executable (DRMK, USC, OS DUPs utility support) containing the firm-
cessor
ware file and the loader. Backplane loaded with bad firmware will not provide backplane and HDD status.
control panel
Internal USB Either read-only license key or OS control copies
Internal SD Module Factory load, OS run time usage, and OS updates and configuration changes.
Power Supply
Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting
up the system from a floppy or OS-based executable (Unified Server Configurator) containing the firmware file
PSU Microcontroller
and the loader. PSUs loaded with bad firmware will not provide PSU functional behavior and result in PSU system
faults.
PERC 6/i Integrated
PERC NVSRAM Config
Embedded storage firmware controls this data
Data
Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting
PERC Firmware up the system from a floppy or OS-based executable (DUPs, Unified Server Configurator) containing the firmware
file and the loader. Storage adapters loaded with bad firmware will not provide storage controller behavior.
PERC Cache RAM Embedded storage firmware controls the use of storage cache data.
FRU Factory only. Not customer updatable.
IBUTTON Key EEPROM Factory only. Not customer updatable.
CPLD Factory only. Not customer updatable.
SAS 6/iR Integrated

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R710 Volatility Chart Continued.

How is data input to this memory?

Planar, Poweredge R710

Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting
Controller Configuration
up the system from a floppy or OS-based executable (DUPs, Unified Server Configurator) containing the firmware
Data
file and the loader. Storage adapters loaded with bad firmware will not provide storage controller behavior.
FRU Factory only. Not customer updatable.
Integrated Mirroring
Embedded storage firmware controls this data
NVSRAM
iDRAC6 Enterprise
Preloaded media before installation, or remote out-of-band upload of user data (i.e., ISO images, files) or local
VFlash
server read/write capability to use like a hard disk

How is this memory write protected? How is the memory cleared?

Planar, Poweredge R710

Not possible with any utilities or applications and
System BIOS SPI Flash Software write protected
system is not functional if corrupted/removed.
Not explicitly protected but special applications
LOM Configuration Data are needed to communicate through the LOMs to Not user clearable
reprogram this ROM.
iDRAC6 Controller ROM Protected permanently by hardware Not clearable
iDRAC6 Controller RAM n/a iDRAC reset
Not possible with any utilities or applications and
System CPLD Requires special system-specific utility
system is not functional if corrupted/removed.
System CPLD It's not accessible Not clearable
Writes are proxied through a temporary iDRAC
iDRAC6 Express Internal
scratchpad RAM and not directly made from an OS or Not user clearable
Flash
OS application.
System RAM OS control Reboot or power down system
TPM ID EEPROM
HW read only Not - read only
(Plug in module only)
TPM Binding EEPROM Locked by BIOS from physical access by anyone after
N/A - BIOS control only
(on China planar only) boot
AC cycle for BMC OS and reset / power off server for
iDRAC6 SDRAM n/a
VGA frame buffer
iDRAC6 FRU Writes controlled by iDRAC embedded OS EPPID is not clearable
Not possible with any utilities or applications and
iDRAC6 Boot Block iDRAC does not function as expected if corrupted/
iDRAC embedded OS control of the write protection.
Flash removed. Lifecycle log is clearable only in a factory
environment. SEL is user clearable.
Trusted Platform Module SW write protected F2 setup option
chipset
Planar NVRAM_CLR jumper or remove AC cord, remove
cover, remove coin cell battery. Wait for 30 seconds,
CMOS N/A - BIOS only control
replace battery, cover, and then AC cord.
F2 system setup option to restore defaults
2.5" backplane or 3.5" Backplane
Not possible with any utilities or applications and
Storage Controller Embedded firmware only writeable through controlled
backplane does not function as expected if corrupted/
Processor iDRAC methods
removed.
control panel
Internal USB OS control OS control format
Internal SD Module Only by SD card write-protect switch. OS control format
Power Supply
Protected by the embedded microcontroller. Special
PSU Microcontroller keys are used by special vendor-provided utilities to N/A - not in-system clearable
unlock the ROM with various CRC checks during load.

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R710 Volatility Chart Continued.

How is this memory write protected? How is the memory cleared?

Planar, Poweredge R710

PERC 6/i Integrated
PERC NVSRAM Config
Storage controller firmware accessed only N/A - not in-system clearable
Data
PERC Firmware Write control access by storage controller firmware N/A - not in-system clearable
Storage controller firmware clearable only. Remove AC
PERC Cache RAM Storage controller firmware accessed only
AND deplete or remove backup battery.
Protected in that no iDRAC-embedded firmware writes
to this device. Although very convoluted, theoretically,
FRU N/A - not in-system clearable
IPMI I2C Master write commands would flow through to
overwrite this EEPROM
IBUTTON Key EEPROM SHA1 encryption included. Storage controller use only N/A - not in-system clearable
CPLD Only factory programmable N/A - not in-system clearable
SAS 6/iR Integrated
Controller Configuration
Write control access by storage controller firmware N/A - not in-system clearable
Data
Protected in that no iDRAC-embedded firmware writes
to this device. Although very convoluted, theoretically,
FRU N/A - not in-system clearable
IPMI I2C Master write commands would flow through to
overwrite this EEPROM
Integrated Mirroring
Storage controller firmware accessed only N/A - not in-system clearable
NVSRAM
iDRAC6 Enterprise
iDRAC-based format or local OS format or delete or
VFlash Media write protection switch or OS control
card removal and formatted on a client

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