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CIRCUITS
2 Table of Contents
Table of Contents
Chapter 1: Flex PCBs and its materials........................................................ 5

1.1 What is a flex PCB? ........................................................................... 5

5
1.2 Types of flex PCBs...............................................................................

1.2.1 Single-sided flexible circuit boards ..................................... 5

1.2.2 Double-sided flexible circuit boards ................................... 6
1.2.3 Multilayer flexible circuit boards ........................................ 6

1.3 Advantages of flex PCBs .................................................................. 7

1.4 Flex PCB materials............................................................................... 7
1.5 Applications of flex PCBs.................................................................. 8

Chapter 2: How to prepare the board outline............................................ 9

2.1 Board outline..................................................................................... 9

2.2 Factors affecting the thickness of flex board.............................. 9

Chapter 3. Calculating the bend radius...................................................... 10

3.1 Calculation of bend radius........................................................... 10
3.2 Static flex PCBs.............................................................................. 11
3.3 Dynamic flex PCBs....................................................................... 12
3.4 Challenges in dynamic flex PCB design...................................... 12

3.4.1 Minimum bend radius.............................................................. 12

3.4.2 Copper type and grain orientation....................................... 13
3.4.3 Layer count and neutral bend axis....................................... 13
3.5 Best practices for designing bend areas.................................... 14
3.6 Methods for increasing flexibility of flex boards...................... 14

Chapter 4: Flex routing................................................................................. 15

4.1 Guidelines for routing flex PCBs................................................ 15
4.2 Pad design for outer layers.......................................................... 17

Chapter 5: Designing and manufacturing vias in flex PCBs...................... 19

5.1 Flex via design............................................................................... 19
5.2 Via locations................................................................................... 19
5.3 Rigid-flex vias................................................................................ 19
5.4 Annular ring in flex PCBs............................................................. 20

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 Table of Contents
5.5 Plating flex circuit boards............................................................ 21
5.6 Drill to copper................................................................................
21
Chapter 6: Designing and assembling rigid-flex PCBs............................... 23
6.1 How do rigid-flex PCBs cut assembly costs?.............................. 23
6.1.1 Direct cost savings.......................... 23
6.1.2 Indirect cost savings ............................................................... 23
6.2 Materials used in rigid-flex PCBs................................................ 23
6.3 Rigid-flex design rules.................................................................. 24
6.4 Assembling flex and rigid-flex PCBs........................................... 24
6.5 Stiffeners....................................................................................... 25
6.5.1 Stiffener considerations...................................................... 25
6.6 Tear guards.................................................................................... 25
Chapter 7: Fab drawings for flex PCB.......................................................... 26
7.1 Flex PCB stack-up.......................................................................... 26
7.2 Dimensional drawing and tolerances........................................ 26
7.3 Design specifications a PCB manufacturer needs to know..... 26
7.4 Drill symbol chart......................................................................... 27
7.5 Flexibility (bend radius)............................................................... 27
7.6 Plating requirements................................................................... 27
7.7 Testing requirements................................................................... 28
7.8 Marking requirements................................................................. 28
7.9 What to include in flex drawing notes....................................... 28
7.10 Flex PCB design checklist........................................................... 29
Chapter 8: Controlled impedance in flex PCBs........................................... 30
8.1 What is controlled impedance?...................................................
30
8.2 Factors affecting impedance control in flex............................. 30
8.2.1 Physical dimensions of the traces..................................... 30
8.2.2 Dielectric properties of the material used.......................
30
8.3 Controlled impedance configurations for flex circuit boards.
30
8.3.1 Single-ended microstrip...................................................... 30
8.3.2 Edge coupled coated differential pair microstrip............ 31
8.3.3 Single-ended stripline..........................................................
8.3.4 Edge coupled differential stripline....................................
31
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4 Table of Contents
8.4 Flex PCB materials for controlled impedance............................. 33
Chapter 9: IPC standards for flex PCBs....................................................... 34
9.1 Design............................................................................................. 34
9.2 Materials........................................................................................ 34
9.3 Performance.................................................................................. 34
9.4 Quality guidelines — circuits & assembly.................................. 35
9.5 Military............................................................................................ 35

Chapter 10: Example flex stack-ups............................................................. 36

10.1 One layer flex stack-ups............................................................. 36
10.2 Multilayer flex stack-ups........................................................... 37
10.3 Rigid-flex stack-ups..................................................................... 38

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Inc., 2018
Chapter 1: Flex PCBs and its materials
1.1 What is a flex PCB?

Flex PCBs are flexible circuit boards with very thin substrates and high level of bendability,
tensile strength, and physical flexibility. These boards are also called flex boards, flex circuit
boards and flexible electronics. Flex boards can be found in almost any high-end electronic
device. These boards are widely used in medical devices and fitness wearables. Cameras and
smartphones also incorporate flex circuits.

1.2 Types of flex PCBs

Flexible PCBs are classified into single-sided, double-sided, and multi-layered boards.

1.2.1 Single-sided flexible circuit boards

Image 1: Single-sided flex circuit board

Single-sided flex boards are the most basic type. These boards consist of a single
conducting layer on a flex substrate. A flexible polyimide is laminated to a thin sheet of
copper. Holes may be drilled through the substrate to allow lead of the components to

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pass during the soldering process. A polyimide coverlay can be used for the
insulation and environmental protection of the circuit.

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1.2.2 Double-sided flexible circuit boards

Notes

Image 2: Double-sided flex circuit board

Double-sided flex PCBs have two conductive layers (one on each side of the flex substrate).
Plated through holes or vias establish electrical connection between the layers.

1.2.3 Multilayer flexible circuit boards

Image 3: Multilayer flex circuit board

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Multi-layered flex boards consist of more than two copper conductors. Like double-sided
flex PCBs, the conductive layers are interconnected through PTHs or vias. Multilayer boards
are an effective solution when confronted with design challenges such as: unavoidable
crossovers, specific impedance requirements, elimination of crosstalk, additional shielding
and high component density.

1.3 Advantages of flex PCBs

These boards have several advantages over rigid PCBs.

• Flex boards can be fabricated in different shapes. This eases out the electronic device
assembly process.
• Flexible circuitry minimizes the connection points and simplifies the assembly. Therefore,
it eliminates the chances of interconnection defects like poor solder joints. This makes
them more reliable when compared to rigid boards.
• Thinner and lightweight than their rigid counterparts.
• Offers superior resistance to vibrations and other disruptions within harsh environments.
• Flex PCBs make use of HDI technology for the miniaturization of devices.
• Better airflow and heat dissipation than many other PCBs.

1.4 Flex PCB materials

Polyimide is the material used for both flex core layers and coverlay layers. Flex substrates
offer better material properties when compared to standard FR4 rigid materials. The
thickness of flex materials is uniform throughout the substrate. These materials also offer
improved DK value ranging between 3.2 and 3.4. The lack of woven glass reinforcement
reduces variations in Dk. Typically, the thickness of the flex layers range between 1 and 5
mils.

Polyimide flex cores are cladded with rolled annealed copper. This copper is very thin and
is suitable for both dynamic and static applications. 0.5oz (0.7mils) or less copper is more
commonly used in these boards.

There are two major types of flex materials:

1. Adhesive-based - where the copper is bonded to the polyimide with acrylic adhesive.
2. Adhesive-less - where the copper is cast directly onto the polyimide.

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8
Adhesives are used to laminate the copper layer with the polyimide. The use of
adhesives may cause cracks in the copper plating within via holes because acrylic
adhesives can become soft when heated. Consequently, when designing for
adhesive-based materials, it’s important to incorporate anchors and teardrops in your
design.

Here are a few disadvantages of using adhesive based materials:

1. Cause cracks in via holes.

2. Presence of adhesives makes the copper clad laminate thicker. So, eliminating the
a adhesive bond layers make way for thinner laminates.
3. Adhesive based materials are prone to absorb moisture from the environment. H
e Hence, it is not suitable to use this type of material in a system that is exposed to
t the outside environment.
4. The core thickness of adhesive based material can reduce after the fabrication pro
c proess. This leads to dimensional errors.

To address the issues associated with adhesive based material, adhesiveless materials
are used.

Following are the features of adhesiveless materials:

1. Reduced flex thickness due to the elimination of the adhesive layers.

2. Improved flexibility due to reduced finished flex thickness.
3. Improved controlled impedance signal characteristics.
4. Better temperature ratings when compared to adhesive-based material.
5. Well-suited for harsh environment applications.

To choose the right flex material, try our PCB Material Selector.

1.5 Applications of flex PCBs

Flexible and rigid-flex PCBs were originally used within the military industry as they require
durable, reliable, lightweight 3D circuitry. Now, flex boards are found in nearly every industry.
They are used in devices we use on a daily basis—from phones to computers. They are also
found in cars, trains, and airplanes to satellites, missiles and radios. In fact, NASA’s Mars
Rover which is 140 million miles away from the earth has flexible circuits within it.

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Chapter 2: How to prepare the board outline
2.1 Board outline

The shape of a PCB depends on the design of the device that it goes into. Once the shape is
finalized, test your ideas by cutting out a piece of paper in the shape of your proposed board.
Use cardboard to represent stiffeners and rigid areas.

Image 4: Sample board outline

Start your layout by drawing the board outline on a piece of paper. Mark the location of varied
thicknesses. Now, think about preliminary component placement and determine whether those
components require stiffeners. Next, mark the stiffeners and rigid areas. This will give you a
rough outline of your upcoming board design. It is essential to calculate the bend radius so that
thicknesses could be marked precisely. If not planned properly, it will affect your board’s flexing
capabilities.

2.2 Factors affecting the thickness of flex board

Avoid unnecessary circuit thickness, which hinders flexible capabilities. The thickness of the
flex area is determined by the bend radius needed. If part of the flex circuit needs to be
be thicker, add a stiffener.
The following factors determine the required thickness of a circuit.
• Material thickness
• Copper layer count
• Base copper weight

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• Adhesive thickness
• Dielectric thickness

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10 Chapter 3: Calculating the bend radius
Bend radius is the measurement of the degree upto which the flex area of a circuit
board can bend. The minimum degree of bendability for the flex area must be
properly identified early in the design phase. This ensures your design can survive
for the required number of bends without damaging the copper. Bend radius is
calculated based on the number of layers the flex stack-up has.

Notes

Image 5: Bend radius

3.1 Calculation of bend radius

Number of layers Bend radius

1 (single-sided) Flex thickness x 6

2-layer board (double-sided) Flex thickness x 12

Multilayer board Flex thickness x 24

*thickness in mils/mm

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It is vital to know two things about flexibility: how many times the PCB will be flexing, and to
what extent the PCB will flex. The amount of times the flex board can bend determines wheth-
er the board will be a static or dynamic board. Note: Plated through-holes (PTH) should be at
least 0.5mm away from the bend area as shown in Image 5.

3.2 Static flex PCBs

A static board is considered bend-to-install and will flex less than 100 times in its lifetime.

Image 6: Static flex board

It is generally bent during the assembly process. These boards are not intended to flex during
the operation of the end product. Static boards may have a slight bend that allows the board to
fit into its packaging. The image below shows a board with static ribbon (flex PCB).

Image 7: PCB with a static ribbon

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The flex ribbon in the above example is only bent during the assembly process of the
electronic device. Once the board is installed on to the end product, the board will
remain static.

3.3 Dynamic flex PCBs

A dynamic flex is a board that is regularly flexed (during the system operation). A
dynamic board’s design needs to be more robust in nature, as flexing will occur on a
regular basis—and will need to withstand tens of thousands of bends. These PCBs
are used in very harsh conditions such as spacecraft and military applications.

Image 8: Dynamic flex board

3.4 Challenges in dynamic flex PCB design

Dynamic flex boards are capable of solving many interconnect and packaging challenges in
the applications that require repetitive flexing. The designers should ensure that the copper
circuit on these boards should not fracture during its operation. These fractures in the copper
circuits result in an open circuit.

3.4.1 Minimum bend radius

The minimum bend radius is one of the critical aspects to achieve design success. Recom-
mended minimum bend radius is 100 times the finished thickness of the dynamic flex circuit.
For example, a flex circuit with a finished thickness of 0.006” will need a 0.600” minimum
bend radius or 1.200” minimum bend diameter to ensure its reliability.

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3.4.2 Copper type and grain orientation

Flex PCBs generally use rolled annealed copper. Rolled annealed copper is created by subject-
ing electro-deposited copper to the rolled annealed process. The grain structure is transformed
from vertical to elongated horizontal structure. This improves the ductility of copper, making it
suitable for dynamic applications.

Image 9: Rolled annealed copper

RA copper is available in a variety of thicknesses ranging from ¼ ounces up to 2 ounces with ½

ounce and 1 ounce being the most commonly used.

3.4.3 Layer count and neutral bend axis

Layer count of dynamic flex boards are limited as per the IPC 2223 standard. The opti-
mum configuration is a 1-layer construction. It allows the copper circuits to be close to
the neutral bend axis (The neutral bend axis is the plane where there is minimum tension
or compression when the circuit is flexed). This ensures that the copper is subjected to
the least amount of compressive and tensile forces possible.

A 2-layer construction is permissible provided that a thin adhesiveless flex core of thick-
ness 0.001” or lesser is used between the two layers. This ensures that the distance
between the circuits and the neutral bend axis is minimum.

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14 3.5 Best practices for designing bend areas
• Avoid 90 degree bends if possible. Tighter bends increase the chance of circuit
damage. Gradual bends are safer for the circuit.
• Always measure the bend radius from the inside surface of the bend.
• Place conductors smaller than 10 mils inside the neutral bend axis, as they toler-
ate compression better than stretching.
• Avoid plated through-holes within the bend area.
• Conductors running through a bend need to be perpendicular to the bend axis.
• Use staggered conductors in multilayer circuits to increase the effectiveness of
the circuit.

3.6 Methods for increasing flexibility of flex boards

There are a couple of different methods of increasing the flexibility of a flexible circuit. The
most common method is to reduce the overall thickness of the flexible dielectric material
because its thickness directly influences the flexibility.
Notes
The second method is to reduce the copper thickness of the traces and moreover the thick-
ness of the plane layer. One way of reducing copper on a plane layer is by cross hatching
the plane. Typically, we recommend 0.015” wide signals with 0.025” spacing for the cross
hatched plane layers.

Image 10: Cross-hatched copper plane

Ground and power planes are usually cross hatched in flex PCBs in order to maintain or in-
crease the flexibility. A ground or power plane that is completely flooded doesn’t bend.

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Chapter 4: Flex routing
Routing is the process of laying copper traces between the nodes. This conductive path is
defined by placing tracks, arcs, and vias to establish a connection between two nodes.

The performance and longevity of a flexible circuit board can be directly attributed to the lay-
out of the circuitry. Keep the following points in mind while routing a flex PCB.

4.1 Guidelines for routing flex PCBs

• Always opt for a larger bend radius.

Image 11: Bend radius

• When designing multilayer flexible PCBs, stagger traces on the front and back. Stacked
traces will not only reduce the flexibility of your circuit, it will increase stress contributing
to the thinning of copper traces at the bend radius.

Image 12: Stacked and staggered

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• Use curved traces instead of traces with corners.

Image 13: Curved and sharp edged

• Traces should be perpendicular to the bend area.

Image 14: Traces perpendicular to bend area

• Trace entering a pad forms a weak spot in which the copper might get fatigued over a
point of time. It is always recommended to taper down the pads (as shown below) to-
wards the end in which they are connected to the traces.

Image 15: Non tapered and tapered pads

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• Copper is prone to be detached from the substrate due to the bending of the flex circuit. It is
vital to provide mechanical support for the exposed copper. Through-hole plating in the vias
inherently provides mechanical support to the vias in the flex region. For this reason, addi-
tional through-hole plating of up to 1.5 mils is recommended for rigid-flex and flex circuits.
Usually, SMT pads and non-plated through-holes are referred to as unsupported, and they
require additional measures to prevent detachment.

Image 16: Supported and unsupported pads

4.2 Pad design for outer layers

Pads are the exposed region of metal on a circuit board on which the component leads are
soldered. Pads are prone to lift off due to the flexible nature of the substrate. This can be avoid-
ed by incorporating anchors or spurs encapsulated with coverlay. It is also highly recommended
to make the pads as large as possible. During dynamic bending, anchors help stabilize the outer
layer.

Image 17: Anchored trace on outer flex layer

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18 It is advisable to use teardrops on all flexible PCBs. A teardrop is extra copper at
the junction of a pad and a trace. It is also used when there is a transition of cop-
per trace from thick to thin. For example, if a part of your trace width is changing
from 10 mils to 4 mils, then a teardrop is added at the transition point to reduce
any stress or hairline cracks. Teardrops can reduce and even eliminate potential
stress concentration points on the PCB.

Image 18: Tear dropped trace

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Chapter 5: Designing and manufacturing vias in flex PCBs

Most of the flex PCBs have multiple conductive layers that are electrically connected. The connec-
tion through the dielectric layers are established through vias that are either mechanically drilled or
laser drilled. IPC 6013 standard defines various considerations related to flex vias. Here are a few
points to consider:

5.1 Flex via design

Vias are at greater risk of peeling when implemented in flex designs.To reduce this risk:

• Make the annular rings as large as possible

• Vias should be tear dropped
• Adding tabs or anchors to vias will also help prevent peeling

5.2 Via locations

• Vias are not reliable in areas that will flex and bend
• In a dynamic application, flexed vias can crack very quickly
• Vias are okay over a stiffener, but vias just off the edge of a stiffener are at risk of cracking. A
minimum of 50 mils is kept from the edge of the stiffener

5.3 Rigid-flex vias

Hole to flex distance is the distance between vias and the rigid-flex transition area. The hole
to flex distance should be 50 mils for the boards that require high reliability. Sometimes,
this hole to flex distance can be 30 mils for commercial applications.

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Image 19: Hole to flex distance distance in rigid-flex board

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5.4 Annular ring in flex PCBs
Annular ring is the area of copper pad around a drilled and finished hole (copper plated
via). There should be enough copper to form a solid connection between the copper
traces and the via in a multilayer PCB.

Image 20: Annular ring

The main purpose of an annular ring is to establish a good connection between a via and
the copper trace.

Image 21: Annular ring connection between via and trace

Minimum annular ring should be 8 mils for flex PCBs.

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5.5 Plating flex circuit boards
For double-sided flexible boards, Sierra Circuits uses a pattern plating process called “pads
only plate” for plating through-holes. In order to accomplish this, we drill the flexible copper
clad dielectric material and then image the pads around the drilled holes at (drill diameter)
D + .003” or better.

After plating the holes with approximately

0.001” of copper we again image the final
circuitry pattern and the unwanted copper
is etched. An additional D + 0.014” of pad is
needed for this etching process. Below table
helps in finalizing the drill size for different
layer types.

Image 22: Hole plating in flex PCBs

Layer type Standard boards (mils) Advanced boards (mils)

Flex drill + 14 drill + 10

Outer layer rigid drill + 10 drill + 6

Inner layer rigid drill + 14 drill + 10

5.6 Drill to copper

When designing flexible boards, it is crucial to keep drill to copper in mind. Drill to copper
is the distance between a hole (via or non plated hole) and the nearest copper feature. The
flexible dielectric materials used to manufacture flex products are not as dimensionally sta-
ble as standard rigid materials. Flexible material moves, shrinks, and contracts during the
manufacturing process which makes drill to copper a critical factor when designing

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flex boards.
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22

Image 23: Drill to copper

Finished hole is the final hole obtained after metallization and surface finish.
The finished hole to copper clearance will be the drill to copper clearance including the cop-
per plating thickness. Typically, drill to copper clearance is 8 mils.

Finished hole to copper clearance = drill to copper clearance + plating thickness x 2.

So, if the drill diameter is 6 mil and the plating thickness is 1 mil, then the finished hole to
copper clearance = 6 + 1 x 2 = 8 mils.

For drill to copper, always drilled hole edge is considered. In order to maintain accuracy in
layer alignment, it is important to keep the drill to copper distance around 8 mils.

To quickly run a DFM check on your designs check out our Better DFM tool.

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Chapter 6: Designing and assembling rigid-flex PCBs
A rigid-flex PCB is a combination of rigid and flexible materials. Here, one or more flex circuits
are used to connect rigid sub-circuits. The flexible section of a rigid-flex board generally fea-
tures more than one layer.

Rigid-flex designs may be expensive to fabricate, but they can essentially save costs during
electronic system assembly.

6.1 How do rigid-flex PCBs cut assembly costs?

Using rigid-flex boards can make way for both direct and indirect cost savings. Direct cost
savings mainly comes from reduced BOM (bill of materials) and inventory. Indirect cost sav-
ings are from reduced assembly costs and improved reliability.
You can quickly validate your BOM files with our BOM Checker tool.

Let us assume that a product has 6 interconnected rigid PCBs (a power board, two control
boards, and three display boards. Interconnections among these boards would require wire
harnesses and connector pairs. Now, let us have a look at how using rigid-flex PCB could
reduce direct and indirect costs.

6.1.1 Direct cost savings

A single rigid-flex PCB with 6 rigid sections could be used to replace the entire assembly of 6
rigid boards within the electronic device. It also replaces wire harnesses and eliminates the
requirement of connector pairs. This inventory reduction leads to direct cost savings.

6.1.2 Indirect cost savings

Since there are no wiring harnesses involved in rigid-flex PCBs, the cost incurred in procure-
ment and assembly is saved. Also, no wiring harnesses mean there are no wiring errors
which increases the reliability of the product. This eases out the testing procedure which also
reduc-es the production costs.
6.2 Materials used in rigid-flex PCBs
Rigid-flex PCBs use a combination of standard rigid and flex materials. The materials include
core, prepreg, copper foil, flexible laminates, cover layers, and bond plies. The PCB material
used in flex sections can be just a few microns thick but can be reliably etched. This often
makes them preferable over rigid PCBs in satellite and aerospace applications.
No flow prepregs are one of the most critical components in rigid-flex manufacturing.

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This type of prepregs prevents the flow of epoxy resin onto the flexible sections of
your PCB. Flex materials are less dimensionally stable than the rigid materials that
they are stacked with.
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6.3 Rigid-flex design rules
All of the flex rules apply to the flex portion of rigid-flex. For the rigid portions, most
of the rules are the same as a rigid PCB. The exceptions are defined below:

• Place the flex layers in the middle of the stack-up and use an even number of
layers.
• Drill to copper should be at least 10 mils.
• To allow multilayer flex to bend in a tight radius without deformation, a technique
called “bookbinding” is used and the layers are manufactured in progressively
longer lengths around the outside bend radius.

Image 24: Bookbinding construction

• Clearly name the rigid and flex sections.

6.4 Assembling flex and rigid-flex PCBs

• Solder joints can weaken if components are in areas where the board will flex.
• If components need to be close to a flex area, consider adding stiffeners.
• If you have a stiffener or rigid area for mechanical reasons, try to place components over
the stiffener or rigid area.
• Flex circuits typically have SMT components on only one side of the board.
• Rigid-flex circuits typically are stiffened along most of their surface, with relatively small
areas left unstiffened-the hinges or flexible arms.
• Depending on component size, surface mount areas do not always require a stiffener.
• Apply stiffeners to the opposite side of SMT components.
• Apply stiffeners to the same side as connector or through-hole components.
• The pre-bake cycle eliminates any moisture the board has retained, and allows for im-
proved assembly yields and reliability. However, if boards are assembled immediately
after manufacturing, there is no need for pre-bake. Since Sierra Circuits manufactures and
assembles in-house, we eliminate the need for pre-bake.

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6.5 Stiffeners

Single sided, double sided, and multilayer flex circuits can be stiffened in specific areas by adding
localized rigid material called stiffener. This can add support for mounting components, increasing
strength, thickness and rigidity. Kapton and FR4 materials are commonly used for stiffeners. These
materials can be attached with thermally cured acrylic adhesive or pressure sensitive adhesive.
Stiffeners should overlap bared coverlay by 0.030” to relieve stress.

Image 24.1 Stiffener considerations

6.5.1 Stiffener considerations

• Maintain the same stiffener thickness when using multiple stiffeners to lower cost.
• Stiffeners should come to at least two edges of the board.
• They reinforce solder joints and increase abrasion resistance.
• Stiffeners can be used for strain relief and heat dissipation.

6.6 Tear guards

Image 24.2 Tear guards

We recommend the use of tear guards which will help to reinforce the flex material along
the inside bend radius. This will help prevent tearing of the flex material. Avoid any

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discontinuation of materials close to the bend area and try to use a liberal bend
radius avoiding sharp corners.

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26 Chapter 7: Fab drawings for flex PCB
To successfully design a flexible PCB, it is important for the designers to have a basic
understanding of the flex drawing requirements. Let us have a look at a few of these.

7.1 Flex PCB stack-up

Flexible PCB stack-up drawing will depict the thickness of each layer including the cop-
per thicknesses of the conductive layers. This should also specify which layers are of
rigid material and which layers are of flexible material including copper weights. Sierra
Circuits can assist you in designing your flex stack-up.

You can check out our Stackup Designer to get an accurate and detailed PCB stack-
up.

7.2 Dimensional drawing and tolerances

The dimensional drawing of a flexible PCB design provides the following information:

• Location of PCB stiffeners.

• Thicknesses of each section of the board and the materials to be used.
• Type of flex board (static or dynamic)
• Locations where the board rarely flexes and frequently flexes.

7.3 Design specifications a PCB manufacturer needs to know

A PCB manufacturer expects the following range of specific details from a designer:

• Class type (class 1, class 2, class 3), wiring type, and installation use requirements
• Flexible copper clad material to be used
• The cover coat material
• Minimum conductor width and spacing
• Maximum board thickness
• The minimum size of plated through holes
• Electrical test requirements
• Color of coverlay
• Color of silkscreen
• Board markings such as part number, version, and company logo
• Special packaging requirements (if any)
• Packaging and shipping needs

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7.4 Drill symbol chart

The drill symbol chart summarizes the drill hole information of the board. An example of a
drill symbol chart is shown below. The standard finished hole size is +/- 0.003″ but this is nev-
er assumed, so this measurement must be stated on your design drawing.

Image 25: Drill symbol chart

7.5 Flexibility (bend radius)

The flexibility of a flex PCB is determined by the bend radius of the flex material used. Bend
radius is the minimum angle the flex region can bend. Knowing the number of times your
flex PCB will bend is crucial in your design. If a PCB is bent more times than the design
allows for, then the copper will begin to stretch and crack.

7.6 Plating requirements

Plating the through-holes or vias is a requirement for multilayer PCBs. It is very important
to mention the type of plating that your flex board requires. The available types of plating
are:

• Panel plating: This method of plating deposits copper on the entire panel. This type of
plating is generally performed before circuit imaging.
• Pattern plating: This type of plating deposits copper on the selected areas of flexPCB.
• Pads only plating: It is a type of pattern plating. A photoresist covers the entire board

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panel exposing the pads surrounding the vias. As a result, only the vias and
• exposed pads get plated.

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7.7 Testing requirements
PCBs undergo various tests before it reaches the designer. It is important to men-
tion the physical and electrical testing requirements (test type and frequency). Over
specifying the test requirements might increase the overall circuit cost. Basic tests
include:
• Dimensional checks
• Electrical continuity
• Ionic cleanliness testing
• Flexibility check
• Plating thickness
• Insulation resistance

7.8 Marking requirements

Designers can specify the type of ink to be used for various board markings like serial num-
bering, component mounting location, stiffeners/cover locations, and panel-based marking.
The types of ink include:

• Durable white ink

• Traditional epoxy ink

7.9 What to include in flex drawing notes

• The PCB shall be fabricated to IPC-6013, class <1/2/3>, wiring type <enter your require-
ment here>, and installation use <enter your requirement here>.
• The flexible copper clad material shall be IPC-FC-241/11 preferred (or /1) (flexible adhe-
siveless copper clad dielectric material). For example, FR / AP / LF.
• The covercoat material shall be as per IPC 4203/1 <your requirement here>. Example: LPI
or Coverlay.
• The maximum board thickness shall not exceed <your requirement here> and applies
after all lamination and plating processes.
• For Rigid-flex constructions, the thickness of acrylic adhesive through the rigid portion of
the panel shall not exceed 10% of the overall construction.
• Minimum thickness of plated through-holes is 0.001”, with a minimum annular ring of 2
mils.
• Misregistration between any two layers shall not exceed ±0.005.
• Warpage shall not exceed 0.010 inch per inch.
• The thickness of copper plating in plated through-holes shall be at least 0.001mm.
• If polyimide material is used in a rigid section, the rigid material shall be GIN (Poly) as per
IPC4101/40.
• If the thickness requirement is critical then mention it in the drawing notes.
• All external conductive surfaces not covered by solder mask shall be plated with ENIG.
• Marking and identification requirements
• Electrical test requirements

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• Packaging and shipping requirements
• Apply a green LPI solder mask in the rigid sections of the board over bare copper on both
sides. All exposed metal will be <surface finish requirement here>
• Add silkscreen marking on both sides of the board using white non-conductive epoxy ink
• The PCB shall be constructed to meet a minimum flammability rating of V-0.

7.10 Flex PCB design checklist

In order to get the most out of your flex PCB, you should have a clear vision of the circuit
board’s functionality and design rules. Below are some guidelines that we have discussed
throughout the course of this design guide.

• Make annular rings as large as possible

• Vias should be tear-dropped. Teardrops can reduce potential stress concentration points
on the PCB
• Adding tabs or anchors to vias will help prevent peeling
• Vias are not reliable in areas that will bend
• Avoid vias in the flex section of dynamic boards as they are at a risk of cracking
• Vias can be used over a stiffener, but they are at the risk of cracking if placed at the edge
of a stiffener
• Vias should be placed at least 30 mils away from the rigid-flex/flex interface
• Always opt for a larger bend radius
• Use curved traces instead of traces with corners. Curved traces cause lower stress than
angled ones
• When designing multilayer flexible PCBs, utilize staggered traces on the front and back.
Stacked traces will not only reduce the flexibility of the circuit but also will increase stress
contributing to the thinning of copper circuits at the bend radius.
• Traces should also be kept perpendicular to the overall bend.
• The rigid-flex fab notes must consist of rigid notes and flex notes separately.
• The thickness of acrylic adhesive through the rigid portion of the panel shall not exceed
10% of the overall construction.
• Misregistration between any two layers shall not exceed ±0.005’’.
• Warpage shall not exceed 0.75%.
• Provide impedance trace details such as trace width, height, and impedance tolerance in
the stack-up.

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30 Chapter 8: Controlled impedance in flex PCBs

8.1 What is controlled impedance?

Controlled Impedance is the characteristic impedance of a transmission line formed
by PCB traces and its associated reference plane. It becomes very important when
high-speed signals propagate on circuit board transmission lines. In order to achieve
good signal integrity, a uniform controlled impedance is required.

8.2 Factors affecting impedance control in flex

Controlled impedance is determined by the physical dimensions of the PCB traces
and the properties of the dielectric material used. Below are the factors that affect
impedance control in flex boards.

8.2.1 Physical dimensions of the traces

1. Height of the trace

Notes 2. Width of the trace at top
3. Width of the trace at bottom
4. Difference between the width at the top of the trace and the bottom of the trace

8.2.2 Dielectric properties of the material used

1. Dielectric constant
2. Dielectric height between the trace and the reference plane

8.3 Controlled impedance configurations for flex circuit boards

Common controlled impedance configurations for flex circuit boards are:
8.3.1 Single-ended microstrip

Image 26: Single ended microstrip

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It is the most preferred controlled impedance configuration for flex circuit boards. It has
a transmission line of a single uniform conductor on the outer layer of the board. The
return path for the signal is provided by a reference plane separated by a dielectric lay-
er of height H1. This configuration allows for thinner flex construction, improved bend
capability and reduced cost.

8.3.2 Edge coupled coated differential pair microstrip

Image 27: Edge coupled coated differential pair microstrip

When a signal and its complement are transmitted on two separate traces, it is called differen-
tial signaling. These traces are called differential pairs. The traces are routed with a constant
space between them. One of the primary advantages of having edge coupled differential pairs
is that the noise on the reference plane is common to both the traces. This cancels out the
noise at the receiver end.

This technique is used for routing differential pairs and has the same arrangement as regular
microstrip routing. It is more complex due to the additional trace spacing required for the dif-
ferential pair. It consists of a differential configuration with two controlled impedance traces
on the surface, separated by a uniform distance and backed by a plane on the other side of the
laminate.
8.3.3 Single-ended stripline

Image 28: Single ended stripline 31

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32
It implements the signal trace between two ground planes in a multi-layer PCB. The
return path for a high-frequency signal trace is located above and below the signal
trace on the planes.
8.3.4 Edge coupled differential stripline

Notes
Image 29: Edge coupled differential stripline

It is similar to the single-ended stripline described above, except that we now have a pair of
conductors separated by a uniform distance between them. It is a differential configuration
with two controlled impedance traces sandwiched between two planes.

Reference planes in flex PCBs

Cross-hatched copper planes are used as reference planes in flex circuit boards. An image of
a cross-hatched plane is shown below.

Image 30: Cross-hatched copper plane

A cross hatch plane can be characterized by the ratio of cross hatch conductor width (HW)
to the cross hatch pitch (HP). The lesser the ratio, the greater the percentage of copper being
removed. A 50% copper removal would be achieved if the ratio is about 0.293. Higher the cop-
per percentage being removed in the cross hatch, the higher the increase in controlled imped-
ance when compared to the solid copper plane.

Copyright Sierra Circuits Inc.,2022

 Image 31: Hatch pitch and hatch width in flex reference

8.4 Flex PCB materials for controlled impedance

Flex PCBs are often made of polyimide flex materials. These materials are well suited for
controlled impedance designs as they offer lower Dk value, tightly controlled thickness, and
homogeneous material construction.

There are two types of polyimide materials. They are adhesive based and adhesive less mate-
rials. Both adhesiveless and adhesive based materials can be used for the controlled imped-
ance designs. However, adhesiveless materials are preferred for higher speed applications
due to its consistent results.

Advanced materials like Teflon and Teflon/Polyimide hybrids are suitable for high speed ap-
plications. These materials are more expensive than polyimide materials.

It should also be noted that standard adhesiveless polyimide materials meet the controlled
impedance design requirements while reducing the costs.

Sierra Circuits uses Dupont for flex PCBs.

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34
Chapter 9: IPC standards for flex PCBs

9.1 Design

IPC-FC-2221 Generic standard on printed board

design

IPC-FC-2222 Sectional design standard for rigid

organic printed boards

IPC-FC-2223 Sectional design standard for flexible

printed boards

Notes 9.2 Materials

IPC-4202 Flexible base dielectrics for use in

flexible printed circuitry

IPC-4203 Adhesive coated dielectric films for

use as cover sheets for flexible print-
ed circuitry and flexible adhesive
bonding films
IPC-4204 Flexible metal-clad dielectrics

9.3 Performance

IPC-6011 Generic performance specification for

printed boards

IPC-6012 Qualification and performance specifi-

cation for rigid printed boards

IPC-6013 Qualification and performance specifi-

cation for flexible printed boards

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9.4 Quality guidelines — circuits & assembly

IPC-A-600 Acceptability of circuit boards

IPC-A-610 Acceptability of printed circuit board

assemblies

IPC/EIA J-STD001 Requirements for soldered electrical

and electronic assemblies

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9.5 Military

MIL-P-50884 Military specification: Printed wiring

board, flexible or rigid-flex

MIL-PRF-31032 Performance specification: Printed

circuit board/Printed wiring board,
general specification

IPC-6013 Class C meets the same performance requirements as MIL-

PRF-31032, and is accepted by government agencies as a COTS equivalent
of the latter. If your flex circuit must meet performance requirements of
MIL-P-50884, MIL-PRF-31032 or IPC6013, follow the IPC-2223 design specifica-
tion recommendations.

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36
Chapter 10: Example flex stack-ups

10.1 One layer flex stack-ups

Notes

Copyright Sierra Circuits Inc.,2022

10.2 Multilayer flex stack-ups

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38 10.3 Rigid-flex stack-ups

Notes

A well-designed flex PCB will be lightweight, durable, easy to install, and suitable for demand-
ing applications such as wearable devices and satellites. The physical advantages of flex are
that it offers improved resistance to vibrations and movement, and it is easier to prepare for
harsh environments.

Copyright Sierra Circuits Inc.,2022

 We provide our customers with unprecedented quality,
reliability, and a single point of support. No more miscom-
munication between multiple vendors and no more delays.

We are ISO 9001:2015, ISO 13485:2016, and

MIL-PRF-31032 / 3 Flex certified.

Sierra Circuits
1108 West Evelyn Avenue Sunnyvale, CA 94086
+1 (408) 735-7137
www.protoexpress.com