SM SOLUTION

INTERNSHIP REPORT

Submitted by

NAME ROLL NO
R.DHARUN RAJ 22DG10
S.DIVAKAR 22DG12
R.P.GAYATHRI 22DG13
I.S.PRASANTH 22DG32

Under the guidance of

Mr. N.SRIDHAR
In partial fulfilment of the requirement for the award of
DIPLOMA IN ELECTRONICS AND
COMMUNICATION ENGINEERING

STATE BOARD OF TECHNICAL EDUCATION

GOVERNMENT OF TAMILNADU

MAY- 2024

DEPARTMENT OF ELECTRONICS AND COMMUNICATION

ENGINEERING

PSG POLYTECHNIC COLLEGE

(Autonomous and an ISO 9001:2015 certified Institution)

COIMBATORE – 641 004

 PSG POLYTECHNIC COLLEGE

(Autonomous and an ISO 9001:2015 certified Institution)

DEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING

COIMBATORE-641 004

CERTIFICATE
This is to certify that the Internship report entitled
SM SOLUTION
has been submitted by

NAME ROLL NO
R.DHARUN RAJ 22DG10
S.DIVAKAR 22DG12
R.P.GAYATHRI 22DG13
I.S.PRASANTH 22DG32

DEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING

of the State Board of Technical Education,

Government of Tamil Nadu.
during the academic year 2023 - 24

….………………………… …………………………….
Mr.N. SRIDHAR Mrs.D.JAYASHREE
Faculty guide HOD In-Charge

Certified that the candidate was examined by us in the Internship viva voce examination held
on …………….

Internal Examiner External Examiner

 ACKNOWLEDGEMENT

First and foremost, I would like to thank the Almighty God for giving us the strength,
knowledge, ability and opportunity to undergo this internship study and to persevere and
complete it with satisfaction.

We are ineffably indebted to our Principal Dr . B. GIRIRAJ for giving us this

opportunity and encouraging us to accomplish this internship.

We acknowledge with deep sense of reverence, special gratitude towards our HoD
Incharge Mrs D. JAYASREE, Department of Electronics and
CommunicationEngineering for her guidance, inspiration and suggestions in our quest for
knowledge.

We are highly indebted to Faculty guide Mr N.SRIDHAR , Department of

Electronics and Communication Engineering , for his valuable guidance and constant
supervision.

We are highly indebted to Faculty guide Mrs G.SATHYABAMA, Department of

Electronics and Communication Engineering , for her valuable guidance and constant
supervision. Without his able guidance, this project would not have been possible, and we
shall eternally be grateful to her for her assistance.

We would like to express our special gratitude and thanks to Mr V.GOWSALYA,

Technical Staff for giving us such attention and time.

We would like to express our gratitude towards our parents for their tremendous
contribution in helping us reach this stage in our life. This would not have been possible
without their unwavering and unselfish love, cooperation and encouragement given to us at all
times.

Any omission in this brief acknowledgement does not mean lack of gratitude.

III
 ABSTRACT

This report delves into the intricate process of PCB (Printed Circuit Board) design and
assembly, essential components in modern electronics manufacturing. It outlines the step-by-step
methodology for designing PCBs, including schematic creation, layout design, and the selection of
appropriate materials and components. Emphasis is placed on design considerations such as signal
integrity, thermal management, and manufacturability. The assembly process is also thoroughly examined,
covering component placement, soldering techniques, and quality control measures. By exploring both the
design and assembly phases, this report aims to provide a comprehensive understanding of the challenges
and best practices in creating reliable and efficient PCBs. The findings and recommendations presented
herein are intended to guide engineers and manufacturers in optimizing their PCB design and assembly
processes for enhanced performance and cost-effectiveness.

IV
 TABLE OF CONTENT

S.NO CHAPTER PG.NO

ACKNOWLEDGEMENT………………………………………………
….
ABSTRACT…………………………………………………….
……………
LIST OF
FIGURES…………………………………………………………
1. INTRODUCTOIN……………………………………………….
………….
1.1 Industry Profile
1.2 Products Manufacturing
2. ELECTRICAL AND ELECTRONIC COMPONENT…
2.1 ELECTRIAL COMPONENTS
2.2 ELECTRONIC COMPONENTS
3. PRINTED CIRCUIT
BOARD…………………………………………………….
3.1 PRINTED CIRCUIT BOARD
3.2 TYPES OF PCB USED IN INDUSTRY
3.3 DIP (DUAL IN LINE-PACKAGE) SOLDERING
4. DESIGNING OF
PROTOTYPE…………………………………………………
4.1 WORKING PRINCIPAL
4.2 CONSTRUCTION AND IMPLEMENTATION
4.3 SPECIFICATIONS AND PERFORMANCE
5. MACHINES AND VOLTAGE
TRANSFORMERS……………………………..
5.1 MACHINES
5.2 TYPES OF MACHINES
5.3 VOLTAGE TRANSFORMERS
6. MINIPROJECT………………………………………………………………
…….
7. CONCLUSION…………………………………………………………………
……
BIBLIOGRAPHY………………………………………………………………
……