0% found this document useful (0 votes)
21 views6 pages

2 Sa 1741

Uploaded by

208020
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
21 views6 pages

2 Sa 1741

Uploaded by

208020
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 6

DATA SHEET

SILICON POWER TRANSISTOR

2SA1741
PNP SILICON EPITAXIAL TRANSISTOR
FOR HIGH-SPEED SWITCHING

The 2SA1741 is a power transistor developed for high-speed PACKAGE DRAWING (UNIT: mm)
switching and features a high hFE at low VCE(sat). This transistor is
ideal for use as a driver in DC/DC converters and actuators.
In addition, a small resin-molded insulation type package
contributes to high-density mounting and reduction of mounting
cost.

FEATURES
• High hFE and low VCE(sat):
hFE ≥ 100 (VCE = −2 V, IC = −1 A)
VCE(sat) ≤ 0.3 V (IC = −3 A, IB = −0.15 A)
• Full-mold package that does not require an insulating board or
bushing when mounting.
Electrode Connection
1. Base
2. Collector
3. Emitter
.
ABSOLUTE MAXIMUM RATINGS (Ta = 25°°C)

Parameter Symbol Ratings Unit

Collector to base voltage VCBO −100 V

Collector to emitter voltage VCEO −60 V

Emitter to base voltage VEBO −7.0 V

Collector current (DC) IC(DC) −5.0 A

Collector current (pulse) IC(pulse)* −10 A

Base current (DC) IB(DC) −2.5 A

Total power dissipation PT (Tc = 25°C) 25 W

Total power dissipation PT (Ta = 25°C) 2.0 W

Junction temperature Tj 150 °C

Storage temperature Tstg −55 to +150 °C

* PW ≤ 300 µs, duty cycle ≤ 50%

The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.

Document No. D16125EJ1V0DS00 (1st edition)


Date Published April 2002 N CP(K)
© 2002
Printed in Japan
2SA1741

ELECTRICAL CHARACTERISTICS (Ta = 25°°C)

Parameter Symbol Conditions MIN. TYP. MAX. Unit


Collector to emitter voltage VCEO(SUS) IC = −3.0 A, IB = −0.3 A, L = 1 mH −60 V
Collector to emitter voltage VCEX(SUS) IC = −3.0 A, IB1 = −IB2 = −0.3 A, −60 V
VBE(OFF) = 1.5 V, L = 180 µH, clamped

Collector cutoff current ICBO VCB = −60 V, IE = 0 −10 µA


Collector cutoff current ICER VCE = −60 V, RBE = 50 Ω, Ta = 125°C −1.0 mA
Collector cutoff current ICEX1 VCE = −60 V, VBE(OFF) = 1.5 V −10 µA
Collector cutoff current ICEX2 VCE = −60 V, VBE(OFF) = 1.5 V, −1.0 mA
Ta = 125 °C
Emitter cutoff current IEBO VEB = −5.0 V, IC = 0 −10 µA
DC current gain hFE1* VCE = −2.0 V, IC = −0.5 A 100
DC current gain hFE2* VCE = −2.0 V, IC = −1.0 A 100 400
DC current gain hFE3* VCE = −2.0 V, IC = −3.0 A 60
Collector saturation voltage VCE(sat)1* IC = −3.0 A, IB = −0.15 A −0.3 V
Collector saturation voltage VCE(sat)2* IC = −4.0 A, IB = −0.2 A −0.5 V
Base saturation voltage VBE(sat)1* IC = −3.0 A, IB = −0.15 A −1.2 V
Base saturation voltage VBE(sat)2* IC = −4.0 A, IB = −0.2 A −1.5 V
Collector capacitance Cob VCB = −10 V, IE = 0, f = 1.0 MHz 130 pF
Gain bandwidth product fT VCE = −10 V, IC = −0.5 A 80 MHz
Turn-on time ton IC = −3.0 A, RL = 17 Ω, 0.3 µs
IB1 = −IB2 = −0.15 A, VCC ≅ −50 V
Storage time tstg 1.5 µs
Refer to the test circuit.
Fall time tf 0.3 µs

* Pulse test PW ≤ 350 µs, duty cycle ≤ 2%

hFE CLASSIFICATION
Marking M L K
hFE2 100 to 200 150 to 300 200 to 400

TYPICAL CHARACTERISTICS (Ta = 25°°C)


Total Power Dissipation PT (W)

IC Derating dT (%)

Case Temperature TC (°C)


Case Temperature TC (°C)

2 Data Sheet D16125EJ1V0DS


2SA1741

Single pulse

Collector Current IC (A)

Collector Current IC (A)


Collector to Emitter Voltage VCE (V) Collector to Emitter Voltage VCE (V)
Transient Thermal Resistance Rth

Without heatsink

With infinite heatsink

Pulse Width (s)


Collector Current IC (A)
Collector Current IC (A)

Collector to Emitter Voltage VCE (V) Collector to Emitter Voltage VCE (V)

Data Sheet D16125EJ1V0DS 3


2SA1741

Pulse test
Pulse test
Collector Current IC (A)

DC Current Gain hFE


Single pulse

Base to Emitter Voltage VBE (V) Collector Current IC (A)


Pulse test

Collector Saturation Voltage VCE(sat) (V)


Pulse test
Pulse test
DC Current Gain hFE

Collector Current IC (A) Collector Current IC (A)

Pulse test
Base Saturation Voltage VBE(sat) (V)

Gain Bandwidth Product fT (MHz)

Collector Current IC (A) Collector Current IC (A)

4 Data Sheet D16125EJ1V0DS


2SA1741

5HIHUWRWKHWHVWFLUFXLW
&ROOHFWRU&DSDFLWDQFH&RE S)

6WRUDJH7LPHWVWJ µV
)DOO7LPHWI µV
&ROOHFWRUWR%DVH9ROWDJH9&% 9 &ROOHFWRU&XUUHQW,& $

SWITCHING TIME (ton, tstg, tf) TEST CIRCUIT

Base current
waveform

Collector current
waveform

Data Sheet D16125EJ1V0DS 5


2SA1741

• The information in this document is current as of July, 2001. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4

You might also like