RFIC 2024

IEEE Radio Frequency Integrated Circuits Symposium

Washington, DC, USA
June 16-18, 2024
STEERING COMMITTEE
General Chair
RFIC 2024 Call for Papers
Danilo Manstretta, Univ. of Pavia The 2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2024) is the premier forum focused
[email protected]
exclusively on presenting the latest research results in RF, millimeter-wave, and wireless integrated circuits.
Technical Program Chair
Francois Rivet, Univ. Bordeaux Continuing in 2024: RFIC has expanded its focus to include systems, applications, and interactive demonstrations,
[email protected] including mobile systems for 5G and beyond, radar, imaging, satellite communications, terahertz, biomedical, and
Technical Program Vice-Chair optoelectronic systems.
Mohyee Mikhemar, Broadcom
[email protected] Technical Areas: The symposium solicits papers describing original work in all areas related to RF, mm-Wave, THz,
Student Papers Chair and wireless systems and ICs. Work must be demonstrated through IC hardware results and measurements.
Amin Arbabian, Stanford University • Wireless Radios and Systems-on-Chip: innovative circuit and system-on-chip concepts related to software-
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defined radio, interference cancellation, full-duplex, cellular/WiFi, GPS, low-power radio circuits for sensors,
Workshops Chair
IoT and biomedical applications, radio architectures suitable for energy harvesting, wake-up receivers, etc.
Mona Hella, Rensselaer Polytechnic Inst.
[email protected] • Sub-D band mm-Wave Circuits: >20GHz <110GHz circuits for wireless communication, including phase shifters,
Workshops Vice-Chair phased arrays, beamformers, MIMO transceivers, and other systems for 5G applications.
Steven Turner, BAE Systems
• Radar, Imager, and Sensor: integrated and vehicular radar, imaging, spectroscopy, MEMs-based sensors and
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actuators, and sensing circuits at RF through THz frequencies.
Publication Chair
Jennifer Kitchen, ASU • Transmitters and Power Amplifiers: for RF through mm-Wave, D-band, and higher frequencies, power
[email protected] amplifiers, drivers, modulators, digital transmitters, advanced TX circuits, linearization, and efficiency
Publication Vice-Chair enhancement techniques.
Jane Gu, UC Davis
• Front-End Circuits: LNAs, mixers, VGAs, T/R switches, integrated FEM, amplifiers, filters, and demodulators.
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Publicity Chair • Wireline, Optical, Quantum and Mixed-Signal Circuits: baseband and RF converters (ADC/DAC), sub-
Vito Giannini, Uhnder sampling/over-sampling circuits, converters for digital beamforming or emerging architectures, power (DC-DC)
[email protected] converters for RF applications, conversion techniques for wireline or optical connectivity (I/O transceivers and
Transactions Chair-JSSC CDRs), silicon photonics, quantum computing ICs, hardware security, and AI applied to RF circuits.
Kenichi Okada, Tokyo Inst. Of Tech.
• Oscillators and Frequency Synthesizers: for RF through mm-Wave frequencies, D-band and higher, VCOs,
[email protected]
Transactions Chair-TMTT injection-locking frequency dividers/multipliers, PLLs, DLLs, MDLLS, DDS, LO drivers, and frequency dividers.
Debopriyo Chowdhury, Broadcom • Device/Packaging/Modeling and Testing Technologies: RF device technology (both silicon and compound
[email protected] semiconductors), MEMs, integrated passives, photonic, reliability, packaging, modeling and testing, EM
Systems & Applications Chair modeling/co-simulation, built-in-self-test (BIST), 3D ICs, and novel THz solutions.
Yao-Hong Liu, IMEC
[email protected] • D-band Circuits: >110GHz circuits and SOCs for wireless communication, including transceivers, transmitters,
Panel Sessions Chair and other systems for 6G applications.
Hossein Hashemi, USC • RFIC System Applications: system-level innovations in RFICs with application to 5G and beyond, radar, imaging,
[email protected] satellite communications, terahertz, biomedical, and optoelectronic systems. May include interactive
Industry Chair demonstration and presentation of complete systems based on new or previously published chips. Additional details
Oren Eliezer, Samsung can be found on the RFIC website.
[email protected]
Asia Pacific Liaison Format and Location: The 2024 symposium is planned as an in-person conference. Events will be held at the Walter
Xiang Gao, Zhejiang Univ. E. Washington Convention Center in Washington, DC. RFIC 2024 starts on Sunday, June 16, 2024, with a large
[email protected] selection of workshops followed by two plenary talks and a reception featuring our top industry and student papers.
European Liaison Monday and Tuesday, June 17-18 will comprise oral presentations, panel sessions and student event.
Gernot Hueber, United Micro Technology
[email protected] Microwave Week 2024: RFIC 2024 kicks off Microwave Week. The week continues with the International
Secretary Microwave Symposium and then the ARFTG Microwave Measurement Conference. This week is the world’s largest
Margaret Szymanowski, Crane Aero.&El. and most important gathering of RF and microwave professionals in the field with more than 9000 participants.
[email protected] Industry Exhibition: A three-day Exhibition typically showcases more than 900 Exhibitors who represent the state-
Submission Website Chair of-the-art of the industry covering everything needed for RF and microwave design. More on the format of the 2024
Joseph Cali, BAE Exhibition is found on both RFIC and IMS websites.
[email protected]
RFIC Website Chair Electronic Submission Deadlines
Michael Oakley, Raytheon Manuscript in PDF format: January 9, 2024
[email protected] Final Manuscripts for the RFIC Digest: March 4, 2024
Conference Manager All submissions must be made at rfic-ieee.org in pdf form.
Elsie Vega Cabrera, IEEE MCE
[email protected]
Sponsored by the IEEE MTT-S, EDS, and SSCS
rfic-ieee.org
Author Registration and Paper Submission Steps: Presentation Format:
1. All papers must be submitted via the website: rfic-ieee.org. • Oral Presentation Papers: Authors will be given 20 minutes
2. Author registration form: title, author(s) and affiliation(s), and to describe novel circuit and system techniques, measurement
statement of exclusivity. This form also includes an abstract of results, and potential impact to the RFIC community.
30-50 words (description of the subject, its importance, and • Interactive Demonstration Papers: Select papers from the
how the work contributes to the field). This information is RFIC System Applications area will be presented in poster
required and must be submitted via the website: rfic-ieee.org. format along with functional hardware demonstration.
3. Authors must use the template provided on the website to All Authors must provide a PDF version of the presentation
format their manuscript. The manuscript may not exceed 4 material for registered attendees to download during and
pages total and the file size must be less than 2 MB. For after the symposium.
PDF files, use Distiller and select “embed all fonts”. Please
note that we do not accept “*.doc” or “*.docx” files. Visa Requirements: Due to the short timeframe between
4. Authors must adhere to specific guidelines to ensure that the paper acceptance and RFIC, contact authors should provide their
submission complies with our DOUBLE-BLIND REVIEW name as it shows on their passport and correct mailing address.
PROCESS. Details are provided on rfic-ieee.org. Pay close Student SUPERPASS: RFIC enthusiastically invites
attention to how authors should cite their previous work. participation from students at all levels to attend Microwave
5. Submission deadline: 9 January 2024 Week. All students will be offered the opportunity to purchase a
Submissions will be acknowledged instantly. Late submissions SUPERPASS allowing access to RFIC, IMS, ARFTG, all
will not be considered. workshops, technical lectures, panels, and more. SUPERPASS
Authors of accepted papers will be required to submit a final prices are significantly discounted to encourage participation.
manuscript for publication, including a clear die photo of the work Best Student Paper Award: A student paper award
described in the manuscript. contest will be held as part of RFIC. Student papers will be
Paper Selection Criteria: All submissions must be in reviewed in the same manner as all other papers. To be
English. Papers will be selected based on the following factors: considered, the author must have been a full-time student (9
hours/term graduate, 12 hours/term undergraduate) during the
• Originality: The paper must be unique, significant, and state-of-
time the work was performed and be the lead author and
the-art. Are references to existing literature included?
presenter of the paper. The email address of the student’s advisor
• Quantitative content: The papers should give an explicit
must be supplied during submission time and will be used to
description of the work with supporting data.
verify student eligibility. Complimentary registration will be
• Quality: Clarity of the writing and figures. What is the context given to the student finalists. Finalists will present a poster or a
of the contribution to previous work? demo at the Sunday’s Symposium Showcase.
• Interest to attendees: Why should this work be reported at the
RFIC Symposium? Industry Best Paper Award: An industry paper award
contest will be held as part of RFIC. Industry papers will be
Clearances: Authors must obtain all required company and reviewed in the same manner as all other conference papers.
government clearances prior to submitting a paper. A statement of Only papers with an industrial first author and presenter will be
clearance, signed by the submitting author, must accompany the qualified for the Industry Best Paper Award. Selected finalists
final manuscript for the paper to be considered for publication. will also present a poster or a demo at the Sunday’s Symposium
Double Submission: Authors who do not properly cite their Showcase.
previous work, including concurrent IMS or other conference Invited Journal Articles: Select authors will be invited to
submissions, or who submit an RFIC manuscript to two or more submit an expanded manuscript to the RFIC special issue in
publications without informing the editor/TPC chair that the paper IEEE Journal of Solid-State Circuits. In addition, all authors are
is concurrently under review by another publication will be invited to submit an expanded version of their papers to a special
reported to IEEE and may be banned from future publications. issue of IEEE Transactions of Microwave Theory & Techniques.
Notification: Authors will be notified of decisions on 22
February 2024. Authors of accepted papers will receive copyright
release forms and instructions for publication and presentation.
Final manuscripts for publication must be received by 4 March
2024.

Photos Courtesy of the Walter E. Washington Convention Center.