ELEC - MATH Board Exam Reviewer - ELEC & Math
ELEC - MATH Board Exam Reviewer - ELEC & Math
■
2
dy x +5 xy +4 y
Original DE equation: =
2 dx 2 (
d x ln x x 1
− + ¿
4 2 x x= X ) → store ‘B’
dx x
2 dy
5. Substitute x, y, and into original DE equation
−x dx
■ E.g. choice: a ¿ C= −ln ( x) dy
2(x +2 y) x +y
2. Assign values for variables except for C ■ dx
=? 1
■ E.g. Let x = 1.1, y = 2.2 x ln x
dC dC ■ If not equal to 1, choose a different choice then
3. In the choice, solve for and . To solve for
dx dy dy
solve for y and
dC/dy, interchange x and y in calculator dx
● Euler’s Method ○ h: given interval
○ 1st Order Linear DE: ○ x: start at 0
■ Y =Y + MA : X=X + A where ● Simpson’s 1/3 Rule: Unlike trapezoidal rule which makes
dy use of 1st-order polynomials, this method uses 2nd-order
● M = equation polynomial approximation method
dx ○
x 1−x 2 ● Advanced Mathemetics (Laplace Transform)
● A=step= (15 is enough for step
15 ○ [Caltech] Recall:
∞
between x1 and x2, but to get a more accurate
F (s )=L[f (t )]=∫ ❑f (t)e
−st
answer, use a value bigger than 15). dt
○ 2nd Order Linear DE: 0
● Bisection’s Method: for approximating the root of a given ■ Use kernel s=5
equation based on the number of iterations ■ Replace limits 0 → ∞ with 0 → 8
1. Mode 7: Table → input equation ○ Laplace transform of f(t)
2. Start: 1, End: 2, Step: (End-Start)÷2iterations ■ Step 1: Store the transform value of
8
3. The answer is going to be a range where f(x) will
change sign (from + to - or vice-versa). ∫ ❑ f (t) e−5 t dt → A
■ If you do the iterations high enough, the range of 0
values will be smaller and smaller until such time ■ Step 2: Substitute the value of s (kernel) to the
where the start and end value of the range are choices then divide by A. The answer should be
equal close to 1
● Newton’s Method: for approximating the root of a given ○ Inverse Laplace transform of F(s)
equation ■ Step 1: Assign value of s (s = 5) to F(s) and store
f (x ) to A
○ X =X −¿ ■ Step 2: Get a choice and take its Laplace
f '( x ) transform
● Trapezoidal Rule: useful method in solving the area under ■ Step 3: Compare (which will give 1)
a curve by dividing into little trapezoids
h ● Advanced Mathemetics (Z Transform)
○ A=A + ¿ ∞
2
○ A: always starts at 0 ○ ∫
[Caltech] Recall: X (Z )=[f (t)]= ❑ f (t )e
− st
dt
0
Legend
------------------- → TOPIC/TITLE
------------------- → Don’t know yet if I have to study this (i.e. is this going to be part of the exam?)
Topics I need to restudy when Boards come
(topics not easy to remember)
● MATH
○ Algebra 2 ■ When do you use each type of distribution?
■ Binomial expansion and sum of coefficients ○ Discrete Math
○ Probability and Statistics ■ Negation vs Dual
■ Binomial Distribution ■ Properties of Relations (Reflexive, etc.)
■ Poisson Distribution ■ Properties of Functions (Surjective, etc.)
■ Expectation of values ○ Diff Eq 1 and 2 Caltech
■ Percentile Rank ■ Z-transform
■ Expectation
● ELECTRONICS
○ Electric and Magnetic Field terms/formulas
○ Kinds of resistors, capacitors and inductors
●
CONSTANTS TO NOTE:
● Mass of Earth: 5.972 ×1 024 kg 1
● Speed of light: c= =3 ×1 08 m/s
● Radius of Earth: 6.371 ×1 06 m √ μ0 ε 0
○ For EST: Use 6,370 km
● Mass of moon: 7. 34767309× 1 022 kg ● Earth’s magnetic field: 5 ×1 0−5 T
● Radius of moon: 1.7371 ×1 06 m ● Refrigerator magnet: 5 ×1 0−3 T
● Mass of Sun: 1.989 ×1 030 kg ● Bar magnet: 0.001 T - 0.01 T
● Radius of Sun: 6.96340 ×1 08 m ● Strong neodymium: 1−2 T
● Room Temperature:
● Distance of Earth to moon:
8 ○ ELEX: 300K (27oC)
384,400 km∨3.844 ×1 0 m ○ Math: always given
● Distance of Earth to Sun: ○ GEAS: 293K (20oC)
11
149.6 million km∨1.496 ×1 0 m ○ EST: 290K (17oC)
ELEC: Electronics
● Electricity/Magnetism ○ A constant current is sent through a helical coil. The
○ Curie temperature: the temperature at which a coil tends to get shorter (magnetic field is
magnetic material loses its ferromagnetic properties concentrated on the center of helix thus the coil tends
○ Resistivity Table of Resistivity to get shorter)
■ Copper (least resistive) < Aluminum < Iron < ○ Ionization current: motion of ion charges in a liquid
Manganin < Lead < Nichrome < Semiconductors or gas
(most resistive) ○ Conduction in metals is only due to majority carriers,
■ Thus, copper is the most conductive or least which are electrons. Electrons and holes are
resistive responsible for conduction in a semiconductor
○ When a magnet enters a coil and a voltage is induced, ○ Atomic radius of copper atom: 1.17 Angstroms
the process is known as Flux linkage ○ Skin depth
○ What electromagnetic define has a flexible cone? → ■ the depth below the surface of the conductor at
a speaker which the current density has fallen to 1/e (about
○ The induced emf of a condcutor cutting flux lines is 0.37) of JS.
√
directly proportional to the rate of cutting 2
○ An electric field is most directly related to the force ■ Skindept h= where
acting on a test charge ω μo σ
● ω: frequency in Hz (2πf)
● μ0: permeability of free space (constant 33) ● Leakage resistance of capacitor: resistance
● σ: conductivity (Mho/m or Siemens/m) in parallel with capacitor plates
● Conductivity is constant, the skin depth will ■ In case of ideal capacitor, they produce true/real
change for a certain frequency power only
√
S1 σ ● The quantity that represents an ideal
○ = 2 capacitor dissipating 0 W of power is
S2 σ1 true/real power
■ Convection is the current flowing through an ■ A 1 μF capacitor will store 1C or 6.24×1024
insulating medium (not Radiation or Conduction) electrons
■ The current in a metal at any frequency is due to ■ Class I capacitors:
Conduction current only (no Displacement ● class of ceramic capacitors which are stable
current), which depends on the mobility of the temperature-compensating capacitors
carriers ● have linear characteristics with properties
● Only at high frequencies and when medium independent of frequency over the normal
is air, the conduction is due to displacement range
current ○ Best elemental conductor: Silver (Ag). We only use
■ Maxwell’s equation cannot be represented in Copper (Cu) which is the 2nd best conductor, because
Static form it’s cheaper
■ For electricity to do work the electrons must low ■ Silver: 1 ,59 × 10−8 Ωm
from a higher to a lower electron voltage
■ Copper: 1.7 ×1 0−8 Ωm
● Circuit Elements ■ Gold: 2.4 × 10−8 Ωm
○ Resistors ■ Aluminum: 2.65 ×1 0−8 Ωm
■ Some Resistor Terminologies ○ Most conductive substance: Salt-solution or salt-
■ A meter-sensitivity control in a test equipment water
would probably be a linear-taper potentiometer ○ Inductors
■ Indiabix: Suppose a 1-kΩ resistor will dissipate ■ Indiabix: A major feature of a pot-core winding
1.05 W, and you have many 1-W resistors of all is its large inductance in a small volume
common values. If there’s room for 20-percent ● Not efficiency adjustment
resistance error, the cheapest solution is to use ○ Battery
two 2.2 kΩ, 1-W resistors in parallel ■ A nickel-cadmium cell has an operating voltage
● This is better than one 1-kΩ, 1-W resistor of about 1.25 V
(even if manufacturers allow for a 10- ■ The average fully-charged voltage of a lead-acid
percent margin of safety) storage cell is 2.06 V
■ Aluminum has greater resistivity than copper
(thus it is less conductive) ● DC/AC Circuits
■ Maximum allowable change in resistance for a ○ The maximum voltage output from a voltage divider
given Resistor wattage ratings for 1000-hour is equal to the voltage supply (when the other resistor
rated load life test: is 0Ω)
● For a ⅛ Wattage rating resistor, the ○ In a series-connected string of holiday ornament
maximum allowable change is 12% bulbs, if one bulb gets shorted out, the current in the
● For everything else, the maximum allowable string will go up.
change is 10% ○ The effective value of an RF current and the heating
■ Electrical resistivity of ferrites vs metals value of the current are the same.
● Ferrites have resistivities typically 10⁶ times ○ The derivative of a sine wave is a representation of
that of metals the rate of change, and not necessarily “shifted in
■ Indiabix: A light-dependent resistor is a phase by 1/2 cycle from the sine wave”
photoresistive device ○ A wiring differs form a schematic diagram in that a
■ Boella Effect: the reduction of the effective wiring diagram shows component values
resistance of a resistor (In high valued carbon- (schematic diagram only shows the components)
composition resistors) when operated at VHF or [Left: Schematic diagram, Right: Wiring diagram]
higher frequencies due to dielectric losses
● additional internally distributed capacitances
between the conducting particles of the
resistor forms a kind of noise which lowers
the effective value of the resistance as the
frequency increases
○ Capacitors
■ Most older types of paper capacitors have been
replaced by plastic film type capacitors ○ Resonant/Tank Circuits
■ An air capacitor is normally a variable type ■ A parallel tank/resonant circuit will have very
● It has oil as dielectric thus variable little effect on final filter current
■ Leaky capacitor: ● This is because a parallel tank is a current
● more current and reduced voltage due to less rejector (open circuit effect)
dielectric medium ■ A series tank/resonant circuit will have great
effect on final filter current
■ The Q of a coil is affected by: Coil resistance, ○ Diode Capacitance: the total capacitance (capacitance
Skin effect, and Frequency between the terminals and electrodes) and the internal
■ Networks voltage variable capacitance of the junction
● L-network: a simple inductor-capacitor (LC) ■ Also called Junction capacitance
circuit that can be used to match a wide ■ capacitance associated with the charge variation
range of impedances in RF circuits in the depletion layer
● Pi-L network: A Phase Inverter Load ○ White LED has the highest intensity (or brightness)
network. A network consisting of two usually operating at 4V @ 20mA
inductors and two capacitors ○ Standard Current value for all LEDs are always at
○ provides the greatest harmonic 20mA
suppression ○ Triboelectric effect: flow of electrons due to friction
■ Similar to Thermionic Emission (heat), and
● Semiconductors Photoelectric Effect (light)
○ A hole in a semiconductor is defined as the
incomplete part of an electron-pair bond
■ NOT a free proton (protons do not flow freely)
■ A hole does not exist in conductors, only in
semiconductors
○ The strength of semi-conductor crystals comes from
electron-pair bonds
○ Atoms within a semiconductor crystal are held ○ A Diode audio limiter circuit can cause
together by covalent bonds objectionable signal distortion
■ The sharing of electrons in a silicon crystal is ■ It does NOT rectify the audio to reduce distortion
called covalent bonding (rectifying does not help in reducing distortion)
○ Carbon is a semiconductor, but we don’t use it much ○ A increase in temperature decreases the width of the
because the valence electron is only in the 2nd layer depletion layer
so it will require higher energy (eV) to release it ○ Clipper/Clamper
○ Recombination does NOT produces new electron- ■ Clippers are commonly used to provide transient
hole pairs (in fact it reduces it) protection
○ The very commonly used processes called “planar”
and “mesa” are sub-categories of Diffused junction ● BJT/FET
■ Diffused junction: a method of producing P-type ○ BJT
and N-type regions in semiconductor material ■ Indiabix: In a BJT, the barrier potential is 0.7 V
○ Semiconductors vs Vacuum tubes across each depletion layer
■ Semiconductor devices are smaller in size and ■ Power dissipation in a transistor is the product of
lighter weight the collector current (IC) and collector to emitter
■ They have lower working voltages voltage (VCE)
■ BUT, they cannot withstand high voltages (i.e. ■ NPN transistor is faster than PNP transistor
reverse bias) because electrons are faster than holes
○ Crystal Set ■ In a properly biased NPN transistor, most of the
■ Also called as Crystal Radio Recevier electrons from the emitter pass through the base
■ A passive receiver that doesn’t need a to the collector.
battery/external power. It gets power from the ● It doesn’t recombine in the emitter itself
radio signal it receives to produce sound ■ In a transistor, the operating point is determined
● Passive receiver: does not produce power, graphically by getting the intersection of the DC
thus the output of and AC load lines
○ Thermal Runaway: higher/increased temperature in a
conductor means more heat, which means less
resistivity (R) and higher conductance (G), thus
higher current (I). This higher current produces
higher temperature. This loops until such time when
the device breaks down
○ Band gap energy (in eV) when wavelength is given:
1.24 μm
E g=
λ
● Diodes
○ The maximum forward current for silicon diode
rectifiers is 600mA. ■ Indiabix: Derating Factor: For a BJT, for every
○ Capacitance when diode is Reverse Biased depends 1°C rise in ambient temperature the power
on: dissipation must be reduced by 2.5 mW so that
■ Width of depletion region the transistor is safe
■ Cross-sectional area of PN-junction ○ FET
■ Type of semiconductor material ■ Indiabix: The normal operation of JFET is
constant current region (major portion of drain
characteristics ID is constant)
■ Indiabix: Small signal amplifier operation is in ○ DC/AC Generators and Motors
constant current region of characteristics ■ Generators
○ Since electrons have a higher mobility through a ● All generators are AC initially
conductor compared to holes, NPN in BJT and ● The more conductors (Z), the smoother the
JFET’s N-channel are more efficient conductor 2 pϕNZ
compared to their P counterparts (PNP, P-channel) DC → emf =
c
■ Motors
● Industrial Electronics
● AC series motors are built with as few turns
○ Power Supply
as possible to reduce reactance
■ The Transformer is the most expensive device in
● In Hysteresis motors (single-phase motor),
a voltage regulator if it gets broken
the rotor has no teeth or winding
○ Feedback/Oscillators
● A synchronous motor working at leading
■ The three basic elements of all electrical systems
power factor can be used as a phase
are Sense, Decide, Act
advancer
■ “Building Blocks” in an electric system refer to
● In a motor, back emf serves to decrease the
portions of the system that for purposes of
current in the armature
systems analysis can be thought of as boxes with
○ Filters
inputs, outputs, and power supply connections,
■ This is a LPF: Low Pass Filter (even if there is a
without studying circuit details inside
capacitor and a resistor in parallel)
○ Types of Rectifiers
● This is a Series Resonant circuit with a
parallel resistor
d=
| A x 1 +B y 1 +C
√ A 2+ B 2 |
○ Radius of Curvature: R = ¿ ¿
1
■ Curvature: C =
R
■ Line: Ax+By+C = 0, pt (x1,y1)
○ Conic Sections: locus of a point which moves so
that its distance from a fixed point is in constant
ratio to its distance from a fixed straight line
■ Parts:
● Principal axis: divides conic
symmetrically
● Focal point/focus: Fixed point
○ Distance to from point on conic to
focal pocus: f
● Directrix: Fixed straight line
○ dist. from point on conic to
directrix: d
f
■ Eccentricity: e=
d
● The measure of uncircleness -- higher e
means more conic, lower e means more
circular
■ Equation: Ax2+Bxy+Cy2+Dx+Ey+F = 0
Horizontal/vertical axis: Ax2+Cy2+Dx+Ey+F = 0
● If principal axis is inclined, Bxy remains
■ How to determine the Conic - use
Discriminant
○ Conics special properties
■ LINE: Eccentricity: e=∞
■ ELLIPSE: d 1 +d 2=2 a
● Has 2 foci, 2 directrix
f a c
● Eccentricity: e= = =
d D a
● Semi-major axis is the longest
Perimeter
Area
-----
-----
P=2 π
A=πab
√
a 2+ b2
2
-----
-----
P=2 πr
A=π r
2
● Differential Calculus ■ Exponent: 0 0 , 1∞ , ∞ 0
○ Finding the equation of the tangent line about a ■ Note: 0 ∞=0 still
point or line: ■ Use L’Hospital’s rule to solve indeterminate
■ Derivative = tangent = slope only forms
d ○ Discontinuity
[ y]
dy dθ ■ Point
● Slope in polar form: =¿ ■ Removable
dx d
[ x] ■ Jump
dθ ■ Essential
where y=r sin θ , x=r cos θ ○ Some differentiation formulas to take note
1. Substitute given r into x and y ^ du du
2. Take derivative of x and y with ■ f ' (lo g e u)= =
respect to θ uln (e ) u
3. Solve for dy/dx du
■ f ' (lo g a u)=
■ To get equation of the line, use point-slope uln (a)
form y− y o=m(x−x 0 ) ■ In hyperbolic functions (e.g. sinh(x),
○ Maxima/Minima/Point of Inflection: cosh(x), etc.), the derivatives are all the
■ Maxima/Minima: first derivative=0 same as the functions without hyperbolic,
■ Point of Inflection: second derivative=0 except for cosh(x) and sech(x) where the
○ In angles, make sure that your calculator is set to sign is inverted.
radians ○ For maximum/minima problems with muiltiple
○ Indeterminate forms: variables: take the partial derivatives and equate
0 ∞ to 0:
■ Fraction: , ■ E.g. get the maximum of P=
0 ∞ 2 2
■ 0×∞ 18 xy−x y−x y :
■ dP dP
→ = =0
■ Subtraction: ∞−∞ dx dy
Then solve for x and y
√
dS= 1+( ) dx
2
dy ; then integrate
dx
√( )
x2 ❑
dy 2 Moment of Volume: M = ∫ ❑ ρV g ∙ rdV
■ In terms of x: S=∫ ❑ 1+ dx ■
x
dx ❑
1
Assume ρ=1, g=1: M = ∫ dV ∙d
∫ √ ( )
y2
dx 2 MX M
■ In terms of y: S= ❑ 1+ dy ○ Centroid: y= ; x= Y
y1
dy A A
∫ √ ( )
θ2
2 dr
2 ○ Moment of Intertia:
■ In terms of θ: S= ❑ r + dθ ■ Always choose a strip that
θ1
dθ is parallel to axis of
○ Pappus-Guildin Theorems rotation
■ Surface Area: 2 πR ⋅ S ■ Mass moment of Inertia:
√
x2 2
I = ∫ dA ×d
( )
2
dy
SA=∫ ❑2 πR 1+ dx ■ Area moment of Inertia:
dx 2
1x
I = ∫ y dA
If about x-axis: R= y ● “Second moment of inertia”
If about y-axis: R=x ○ Hydrostatic Force/Pressure:
■ Volume: ■ Hydrostatic Pressure: P= ρgh=γ h
❑
where γ = ρg = specific weight
Volume=∫ ❑ 2 πR ⋅dA h = surface level to centroid of body
❑
b F
■ Hydrostatic Force: Note that P= =ρg h
■ Mean/Average:
∫ ❑ f (x )dx A
Average= a ● use horizontal strip (i.e. parallel to surface
b−a level so all the forces felt by the strip are
● Integral Calculus 2 uniform), and formula will be integral.
○ Moment F= ∫ ρ g h dA= ∫ γ h dA
■ Moment of Area: ● Be careful if the given value is γ or just ρ
❑ ○ Work in pumping a liquid out of container:
M =∫ ❑ ρ A g ∙ rdA Since W =Fd
❑
W =mg h (force on the liquid is the weight of
Assume
the liquid), and d=h= distance from centroid to surface
ρ=1, g=1: M =¿ ∫ of container
dA ×d W =∫ ρg h V = ∫ γ h dV
Δxf
● My=¿∫ ○ Work in Springs: W = ∫ ❑ kxdx
( y U − y L )dx Δxi
Note: Δx must be difference in lengths (not just
1
● Mx=¿∫ ( yU + y L )(dy ) the position of the spring along x)
2 ○ Work in chain/rope:
1 W =¿( ∫ W load +W rope−ωy )dy
¿ ( yu + y L )( y u− y L )
2 ■ ω: weight per unit length
1 2 2 ■ Wrope: initial weight of rope
¿ ( yu − y L )
2
● Trigonometric Identities
θ −θ θ −θ
e −e e +e
sin h θ=¿ , cos hθ=¿
2 2
● Differential Equations ○ Linear: no product between variable and
○ Orthogonal Trajectories: family of curves which differential variable (e.g. yy’)
intersects every member of a given family of curves ● Linear in y: y '+ P(x ) y =Q(x)
at right angles Solution: y e ∫ Pdx= ∫ Q e ∫ Pdx dx +C
1. Isolate constants in the equation
2. Differentiate implicitly with respect to x so we 5. Bernoulli’s DE
can eliminate constant C ● DE that can be reduced to linear form by a
3. Isolate y’ in equation to get slope. suitable substitution. In the form:
4. Get negative reciprocal. These are the n
orthogonal trajectories y ' + P( x ) y =Q( x) y
5. To get DE of orthogonal trajectories, just ○ If n ≥ 2: Bernoulli’s DE (up to
integrate ∞)
○ Things to note: ○ If n=1: Variable-Separable DE
dy ○ If n=0: Linear DE
■ y '= ● Solution to Bernoulli’s DE:
dx
(1−n ) (1−n) ∫ Pdx (1−n )∫ Pdx
d y e =(1−n) ∫ Q e dx+C
■ Implicit differentiation: ( y)= y '
dx
○ Caltech: [See Caltech Section in this gdoc on Page 6] 6. Higher-Order DE (2nd order and up)
○ Solution to Differential Equations (D.E.): ● Homogenous: solution R(x )=0
1. Variable-Separable DE ○ Just get the roots or ‘transient response’
● Test: Check if you can rearrange the terms Roots Solution
of the DE in 2 groups, each containing only m x m x
1 variable
Real and distinct (m1, m2) y=C 1 e 1 +C 2 e 2
m x m x
● f (x)dx + g( y )dy=0 Real and repeating (m1 multiplicity 2) y=C 1 e 1 +C 2 x e 1
Solution: ∫ f (x )dx + ∫ g ( y)dy =C ax
Complex y=e (C 1 cosbx + C2 sinbx
2. 1st Order Homogenous DE ● Non-Homogenous: solution R(x )≠ 0
● All of the terms have the same degree ○ General Solution:
● Test if DE is homogenous: replace x and y y (x )= y c (x)+ y p ( x) where yC is the
by λx and λy, it will be written in the form: complementary solution and yP is the
n
F ( λx , λy )=λ F ( x , y ) particular solution
○ n must be an integer ■ y C : same as Homogenous solution
● If homogenous: Solve by letting y=ux (let R(x) = 0)
Thus dy =udx+ xdu ■ y P : R (x)≠ 0, note the form of the
Then solve like Variable-Separable DE ‘forced response’
Forced response Solution
3. Exact DE 3x
3x
● A DE which is the result of a simple 7e y p= A e (follow the form)
differentiation in the form of: 4 3 2
4 y p= A x + B x +C x + Dx + E
M (x , y )dx+ N (x , y )dy=0 x +3 x +1
Follow highest order
dM dN
● Test for Exactness: ≡ 8 sin 3 x y p= Asin 3 x + Bcos 3 x
dy dx
● A given DE may not be integrable, but it 5 cos 2 x y p= Asin 2 x +Bcos 2 x
may become integral when it is multiplied
by a function: called Integrating Factor (IF)
∫ Pdx
IF=e where
dM dN dN dM ○ Other Differential Equations:
− −
dy dx or dx dy ■ Ricatti Equation:
P= P= 2
N M y '=P (x) y + Q(x) y + R( x )
whichever of the 2 will simplify ■ Tricomi Equation: y uxx + u yy = 0
M (x , y )(IF )dx + N ( x , y )(IF )dy=0 ■ Airy Equation:
● If exact: solve like Variable-separable DE G ' ' - yG = 0 , or y ' ' ± k 2 xy = 0
■ Logistic or Verhulst Equation:
4. 1st Order Linear DE
● Linear DE is where dependent variable (y) is
y ' = Ay - B y 2
linear degree). x can be any complicated ● A special type of Bernoulli equation (a kind
function of generalization of the equation for
● Linear test: exponential growth but with a maximum
○ Linear: variable (y) must be 1st degree value for the population)
○ Linear: diff. variable (y’) must be 1st ■ Bessel Equation:
2 2 2
degree x y ' ' + xy ' + ( x - v ) y = 0
● v is a given number (real and non-negative)
■ Legendre Equation: ○ 2-dimensional Laplace or 2-dimensional
(1- x 2) y ' ' - 2 x y’ + n ¿+1 ¿ y = 0 Poisson:
2 2
■ Laguerre Equation: 2 d u d u
● xy ' ' + ¿- x ¿ y ' + ny = 0
■ ∇ u= 2 + 2 = 0
dx dy
■ Sturm-Liouville Equation: ○ 3-dimensional Laplace:
[ p (x) y ' ]' + ¿ + λ r ( x)¿ y = 0 2 2
d u d u d u
2
● involves a parameter λ ■ 2
+ 2
+ 2
=0
■ Cauchy-Riemann Equation: u x = v y and u y = -
dx d y dz
vx
● f (z) = u(x , y) + iv(x , y) should satisfy
the Cauchy – Riemann equations to be
analytic ○ Differential Equations - Classifications
■ Euler-Cauchy Equation: x y ' ' + axy ' + by1st
2
= 0Order DE Linear Semi-Linear Quasi-linear Non-li
1 1
■
2
Duffing Equation: y ' ' + ω o y + β y = 0 3 y or x ✓ ✗ (must not have) ✓ or ✗
y’1 or x’1 ✓ ✓ ✓
1 2 ✗
■ Rayleigh Equation: y ' ' - μ ¿ - y ' ) y ' + y yy’
= or xx’
3 ydy or xdx
✗ (must not have)
✗ (must not have) ✓
0
● μ>0 ○ Differential Equations - Applications
■ Clairaut Equation: y = xy ' + g( y ') dP
2
d u d u
2 ■ Natural Growth: =kP
■ Helmholtz Equation: + + v
2
u = 0 dt
2 2
dx d y dP
■ Shifted Natural Growth: =kP+ C
■ Van der Pol equation: y ' ' - μ ¿ - y 2) y ' + y = 0 dt
■ Partial Differential Equations: ● C affects growth rate but it’s constant
A u xx + Bu yy + C u yy = ■ Radioactive Decay
■ Investments
F (x , y , u ,u x ,u y )
dQ
● Hyperbolic: B2 - 4 AC >0 ■ Mixing Problems: =Ri Ci−R o C o
dt
○ E.g. Wave equation:
2 R: volume flow rate [gal/min]
○ 1-dimensional wave: utt = c u xx C - concentration of flow rate, inflow or
2 outflow, per volume [lbs/gal]
d u
○ 2-dimensional wave: utt = c 2( 2
+ ■ Limited Exponential Growth
dx dP
2
d u =k (M −P)
2)
dt
dy ● where k and M are constants
● Parabolic: B2 - 4 A C=0 ● High growth in the start, Low growth in the
○ E.g. Heat equation end (think of learning curve)
du 2 dP
2d u ■ Logistic Growth: =kP (M −P)
○ 1-dimensional heat: =c dt
dt dt
2
● Low growth at start and end, and high
● Elliptic: B - 4 AC <0
2
growth in the middle
○ E.g. Laplace equation, Poisson equation
● Advanced Mathematics 1
○ Complex Numbers z̄ is the conjugate of of z
■ Forms: ■ Matrix/Matrices
● Rectangular: z=x + jy ● Cofactor: determinants of submatrices
● Polar: r ∠ θ associated with particular entries in the
● Trigonometric: z=r (cosθ+ jsinθ) original square matrix
● Minor
or z=rcisθ ● Basketweave Method: For getting the
● Exponential: z=r e jθ determinant of a 2x2 or 3x4 matrix ONLY
■ Operations of Complex numbers:
● Addition: (x 1+ x2 )+ j( y 1 + y 2 )
● Subtraction: (x 1−x 2)+ j( y 1− y 2 )
● Multiplication: r 1 r 2 ∠(θ1 +θ2 )
r1
● Division: ∠(θ 1−θ2 )
r2 ● Pivotal Element Method: In getting the
○ Better to use exponential form when determinant of a matrix of order n>3:
multiplying and subtracting complex Pivotal Element Method - 4x4
numbersc 1. Choose a pivotal element (preferrably 1
■ Power and Roots of Complex Numbers so easier solution). If no 1 is present,
● ¿
use any element aij in the matrix and
( 1n ( θ+ 2 πk ) )
1
divide the row/column it belongs in it
● √n r ∠ θ=( r ∠ θ )1 / n=r n ∠ such that that element becomes 1.
k=0: principal root Balance the determinant by multiplying
k=1: 2nd root … the matrix by aij
k=n-1: nth root 2. Find the pivotal row and column
■ Logarithms of Complex numbers 3. Determinant =
● ln (x+ jy)=ln ( r e jθ ) =ln(r)+ jθ ¿
where i and j are the row and column
E.g. log (−5+ 2 j) (−3+ 4 j) locations respectively
ln (|−3+ 4 j|) + j arg (−3+4 j ) ● Eigenvalues: special set of scalars associated
shortcut: = with the system of linear equations
ln (|−5+2 j|) + jarg (−5+ 4 j ) ○ [ A ] x=λx where
= 0.84−0.07 j A: square matrix
■ Trigonometric and Hyperbolic λ: eigenvalue of A
jθ − jθ θ −θ
e +e e +e ○ Eigenvalue of a square matrix:
● cos θ=¿ , cos hθ=¿ | A−Iλ|=0
2 2
jθ − jθ θ −θ E.g. Find eigenvalue of
e −e e −e
● sin θ=¿ , sin h θ=¿
2j 2 2 4 2-λ 4
=
● cos (ix)=cos h x 0 3 0 3-λ
● sin(ix)=isin h x (2-λ)(3-λ)-0 = 6-5λ+λ2=0 → λ=2,3
■ Locus of a Complex number:
Let z1 and z2 be fixed points in the complex ● Eigenvectors: vectors (non-zero) that do not
plane (i.e. can be real or imaginary) change the direction when any linear
● |z−z 1|−|z−z 2|=k transformation is applied. It changes by only
a scalar factor
○ If k ≠|z 1−z 2| : hyperbola ○ Eigenspace (of vector x) consists of a
○ If k =|z 1−z 2| : straight line joining z1 set of all eigenvectors with the
and z2 equivalent eigenvalue collectively with
the zero vector
● |z−z 1|+|z −z2|=k ● Wronskian of Function
○ If k ≠|z 1−z 2| : ellipse ○ W (f (x ), g(x ), h(x))=¿
○ If k =|z 1−z 2| : straight line f(x) g(x) h(x)
|z−z 1| f’(x) g’(x) h’(x)
● =k or |z−z 1|=k |z−z 2| f’’(x) g’’(x) h’’(x)
|z−z 2| ○ [Caltech]: Get the determinant of the
○ If k ≠ 1: circle matrix above and assume a value of x,
○ If k =1: ⊥ bisector of z1 and z2 then just divide by the choices
● |z + z|+|z−z|=k : square
● Advanced Mathematics 2
○ Z-transform T0 / 2
2
■ Z-transform of a discrete-time signal x[n] is
defined as the power series:
b n=ℑ[c n]= ∫ ❑ x (t)sin ( 2 πn f 0 t ) dt
T 0 −T /2 0
∞
○ Fourier Transform
X ( z)= ∑ ❑ x (n)z −n
where ■ See Fourier Transform section in EST
n=−∞
■ Convolution:
● Kernel: z−n t
n=0
2 2 5 7 ■ A taylor series expansion where a = 0
● E.g. X ( z)=z + + +
z z 2 z3 ■ Also should be in powers of x
∞
○ ROC: enite z-plane except z=0 & z=∞. xn
Because if z=0, the last 3 terms ○ Fibonacci Sequence: ∑ ❑ f n (0) n!
n=0
approach infinity, and if z=∞, the
○ Laplace Transform
first term approaches ■ In engineering, this is used for analysis of Linear
infinity Time-Invariant (LTI) systems such as electrical
■ Z-transform Properties
circuits, harmonic oscillators, optical devices,
● Linearity: and mechanical systems
ax (n)+by (n)↔ aX (z )+ bY (z ) ● LTI:
−n
● Shifting: x (n−n0 )↔ z X (z ) 0
Ax1 (t)→[ Linear System ]→ Ay 1 (t)
Multiply z−n 0 ● Linear + Time Invariant (will not change wrt
time)
○ E.g. x (n−2) ↔ z −2 X ( z) ∞
● Time Reversal: X (−n)↔ X (z −1 ) F (s )=L[f (t )]=∫ ❑f (t)e
−st
■ dt
● Multiplication by exponential: 0
n −st −(a + jb)t −at − jbt
a x (n) ↔ X (az ) (z becomes az) ● e =e =e e where
−at
−zdX ( z ) e : damping factor
● Derivative: nx (n)↔ − jbt
dz e : oscillation factor
● Z-transform of dirac-delta: Z [δ(n)]→1 ■ Important Laplace transforms:
■ Funding the Radius of Convergence (ROC) ● Laplace of multipliying t: differentiate in s
● |a z −1|< 1 if n ∈ [1,∞) L[t¿¿ n f (t)]→ ¿ ¿
● Laplace of dividing t: integrate in s
● |a z −1|> 1 if n ∈ (-∞,-1] ∞
1
○ Fourier Series L[ f (t )]→ ∫ ❑[ F (s)]ds
■ A technique for expressing a periodic function in t s
terms of sinusoids ● Laplace of an integral: divide by s:
● by Jean Baptiste Fourier t
1
a ∞
nπx nπx L[∫ ❑ f (τ)dt ]→ F (s )
■ f (x)= 0 + ∑ ❑[an cost + bn sin ] 0 s
2 n =1 L L ● Laplace of a derivative: multiply by s:
or df (t)
∞ ○ L[ ]→ sF (s )−f (0)
x (t)=c 0+ ∑ ❑[an cost 2 πn f 0 t +bn sin 2 π f o t] dt
n=1 ○
where: 2
d f (t) 2
1
❑ L[ ]→ s F ( s)−sf (0)−f ' (0)
c 0= ∫❑ x(t)dt → DC/average value
T0 T
dt
2
0 ○ General:
T 0 /2 n
2 d f (t) n n−1 n−2
a n=ℜ[c n ]= ∫ ❑ x (t)cos ( 2 πn f 0 t ) dt
T 0 −T /2
L[
dt
n
]→ s F( s)−s f (0)−s
0
● Note: un (t )=u(t−n)
○ E.g. u3 (t )=u(t−3) ● 2nd Shifting Theorem (shift in time
domain):
● Laplace of dirac-delta: L[δ (t)]→1 (same −as
as Z-transform) L[f ( t−a)u (t−a)]→e F(s)
○ ∫ f (t)δ (t−a)=f (a) ● Steady state of f(t): lim sF (s)
s→0
■ Laplace Transform Properties ○ Find F(s) first from f(t) then multiply by
● First Shifting Theorem: (shift in Laplace s then get limit as s approaches 0
domain) ○ Gamma Function
○ L[e ±at f (t)]→ F ( s ∓ a) ■ Γ ( x)=(x−1)! where x: whole number
at 1 ■ Γ ( x+1)=xΓ (x) where x: (+) fraction
■ E.g. e →
s−a Γ (x +1)
(s−a) ■ Γ ( x)= where x: (-) fraction
at
■ E.g. e cos kt → x
¿¿ ■ Γ (1) = 1
1
■ Γ ( )=√ π
2
Z-Tranform Table
Laplace Tranform Table
● Engineering Data Analysis/Probability
○ Fundamental Principle of Counting: ○ Standard Deviation (sd): √ variance
■ N=m× n ○ Coefficient of Variation (CV):
■ N=m+ n σ sx std . dev
○ Statistics: involves the methods of collecting, CV = ∨ × 100 %= × 100
processing, analyzing, and summarizing data in order
μ μ mean
○ Probability
to provide answers or solutions to an inquiry
■ Population Sample ■ Probability of event: P E ≤ 1 ALWAYS
● How many samples do we need? ■ Binomial Distribution
N ● P ¿n Cr ¿ where
● Slovin’s Formula: n= ○ p: probability of success
1+ N ¿ ¿
○ n: no. of samples ○ q = 1-p: probability of failure
○ N: total population ○ Conditions: outcome are independent,
○ err = error margin / margin of error constant; only 2 possible outcomes for
■ Sampling methods an event
X −λ
● Probability Sampling
■ Poisson’s distribution: P x =
λ e where
○ Simple random sampling X!
○ Systematic sampling ● Limiting case of Binomial distribution when
○ Stratified sampling N (# of trials) gets very large and p (prob of
○ Cluster sampling success) is small
○ Multistage sampling ● Keyword: “Poisson”, “average”
● Non-probability sampling ● λ=np=¿ mean
○ Convenience sampling
● X = # of successes
○ Quota sampling
■ Conditional probability
○ Snowball sampling
■ Kinds of Data: Qualitative & Quantitative P(B ∩ A )
● P B ∨ A=
■ Levels of Measurements P ( A)
● Nominal - variables are categorical and ○ Others
non-numeric + no sense of ordering ■ T-tests (based on Student’s distribution): for
○ Qualitative determining if the differences between
○ E.g. Jersey numbers samples mean is significant.
● Ordinal Level - variables are categorical m
also, but ordering is important ■ Expectation: E= ∑ ❑ P n xn
○ Qualitative n=1
○ Strongly disagree -- strongly agree ● Average amount a player can win/lose on
● Interval - one unit differs from another unit one play in a game
by a certain amount of degree ■ Odds
○ Quantitative P (success)
○ E.g. Celcius scale, IQ level ● Odds for an event to occur:
P (failure)
● Ratio - one unit has so many times as much
of the property as does another unit. It has a ● Odds against an event to occur:
meaningful (unique and arbitrary) absolute, P (failure)
fixed zero point and allows all arithmetic P (success)
operations ○ Coefficient of Skewness
○ Quantitative 3 ( x−Median)
○ E.g. height,weight,energy,charge ■ S K median =
■ Measures of Central Tendency Sd
● Measures of Location ( x−Mode)
■ S K mode=
Σ(values) Sd
○ Mean: average x=
N ○ Kurtosis:
○ Median: find the middle value ■ K=¿ Σ ¿ ¿
○ Mode: most frequent ● If K < 3: Platykurtic: flat-topped curve
¿h ● If K = 3: Mesokurtic: normal
○ Percentiles: Pn=N ∙ ● If K > 3: Leptokurtic: high-peaked curve
100
¿h
○ Quartiles: Q n=N ∙
4
¿h
○ Deciles: D n=N ∙
10
● Measures of Dispersion
○ Range: max−min
○ Interquartile range: IQR=Q 3−Q 1
○ Variance: Σ ¿ ¿ ○ Some problems:
■ How many different 5-letter words can be ○ 1 C 1 for letter I (only letter I has 3 alike
formed from the word DEFINITION (i.e. total letters)
number of combinations:) ● 2 alike, 2 alike, 1 diff:
● All different: (7 C 5) ×5 !=2520 5!
(2 C 2)(5 C 1)( )=¿ 150
● 2 alike, 3 different: 2 ! 2!
5! ○ 2 C 2 for letter both letter I and N (both
(2 C 1)(6 C 3)( )=2400
2! have 2 alike letters)
○ 2 C 1 for either I or N ● 3 alike, 2 different:
● 3 alike, 2 different: 5!
(1 C 1)(1C 1)( )=10
5! 3 ! 2!
(1 C 1)(6 C 2)( )=300
3! ○ 1 C 1 for letter I (3 alike), 1 C 1 for letter
N (2 alike)
● Total: 5380
● Electromagnetics (Math)
○ Vector Analysis: branch of mathematics that deals ○ Identities:
with quantites that have both magnitude and direction ■ ¿(curl(V ))=0
E.g. Let vector a=a x i+a y j+ a z k ● Because curl(V) gets the vector representing
■ √
Vector magnitude: |a|= a x +a y +a z
2 2 2 the perpendicular of the 2 vectors (sinθ), and
Divergence gets the projection (cosθ) so the
a vector answer must be 0
■ ^=
Unit vector: a
|a| magnitude of vector ■ curl (grad (U ))=0
● |a ^|=1 (ALWAYS) ● Because grad(U) gets only the changes in
○ Scalar multiplication: c |a|=√ ¿ ¿ every axis only (i,j,k). Using the right-hand
rule for each unit vector with itself will
○ Dot product: A ∙ B=| A||B|cosθ result to 0
A ∙B ■ Laplacian(f )=¿(Grad (U ))
■ Scalar projection: | A B|=|A|cosθ=
|B| ○ Electromagnetism: interaction of electric
(vector A projected onto B thus scalar only) currents/fields and magnetic fields
■ Vector projection: vector ■ Electrostatics: deals with the properties of
Multiply | A B| and the unit vector of B stationary or slow-moving electric charges
Q1 Q2 1
A∙ B ● Coulomb’s Law: F=k , k=
∗B r
2 4 π εo
|B |
A B=| A B| ^B=
|B|
( A ∙ B)∗B
A B=¿ 2
|B|
○ Cross product: A × B=| A||B|sinθ
■ Use Right-hand rule for direction [See ELEC: Electricity/Magnetism
Fundamentals]
■ Volume of Parallelepiped: V =| A ∙(B × C)|
Q1 Q2
● Order of the vectors don’t matter In vector notation: F 12=k 2
a12
○ Del or Nabla: ∇=
d d
i+ j+ k
d |a12|
dx dy dz ● Gauss’ Law: (See below)
df df df ■ Magnetostatics: study of magnetic fields in
○ Gradient: ∇ f (x , y , z )= i+ j+ k systems (usually permanent magnets or DC
dx dy dz currents) → where currents are steady
■ Describes the changes in a particular axis only ● Biot-Savart Law (See below)
■ Input scalar, Output vector ● Ampere’s Circuital Law: (See below)
d d d
○ Divergence: divf =∇ ∙ f = f ^+ f ^ + f ^
dx i dy j dz k ● Maxwell’s Equation (time-varying fields)
■ Rate of outward flow ○ Faraday’s law: time-verying magnetic fields
■ Input vector, Output scalar produce an electric field (voltage) or emf. This is
○ Curl: curl f =∇ × f equal to rate of change of flux linkage.
Let ■ Faraday’s Law: When the magnetic flux
f (x , y , z)=P( x , y , z )+Q(x , y , z)+ R(x , y , z ) linking a circuit changes, an electromotive
force (emf) is induced in the circuit
proportional to the rate of change of the flux
linkage
dΦ d (BA) di
■ emf =−N =−N =−L
dt dt dt
−d
■ Integral form: ∮C E ∙ dl= ∫A B∙ dS
dt
∇×f = ( dRdy − dQdz )i−( dRdx − dPdz ) j+( dQdx − dPdy ) k ■ Differential form: ∇ × E=
−d B
dt
■ Input vector, Output vector
● The induced magnetic field inside any
○ Laplacian: Δ f (x , y , z )=∇ 2 f =∇ ∙ ∇ f
loop of wire always acts to keep the
( )
■ Dynamic electricity Fs Q
● Flow of electric charges E= =k 2
○ Also called Electric current
q r
● transfer is continuous; cyclic (unit: V/m or N/C)
● Only for closed circuits V
■ E=
r
● Current (A), Work, Energy, Power (in ■ Electric Flux lines flow from Positive to
Electromagnetics) Negative charge: Positive charge (+) flow
○ Charge carriers: free electrons flowing through outward, while Flux lines for negative charge (-)
conductor for closed circuit flow inward
○ Motion of electrons caused by: ■ Parallel-plate capacitors (Electric field intensity
■ Collision of Positive ions and electrons between two oppositely charged particles)
■ Attractive and repulsive forces σ
○ Current (A) ● E= (see Gauss’ law)
ε0
Q Q
■ I= (C / s∨ A) ● From Surface charge density: σ = ,
t A
■ Conventional current (or hole flow): positive to
Q Q
negative; E= =
Electron flow: negative pushes away, positive A ε 0 (4 π R2 )ε 0
attracts
● Hole flow flows in opposite direction as that ○ Electric Flux: Φ E =E( A⊥ )cosθ=E( A area )
of electron flow (Φ E ∨Ψ ; unit: C) → Measure or flow of Electric
● Electron flow must give the same voltage field PERPENDICULAR through a given area
drop as that using the conventional flow. ● Parallel E and Area = 0 Flux
○ Keeping safe: ● Perpendcular E and Area = maximum Flux
■ >10 mA: dangerous, temp paralysis
○ E: Electric field strength ○ n: electron concentration [/m3]
○ A: area of surface ○ p: hole concentration [/m3]
2
○ µn/µp: mobility of electron/hole [
m ]
V⋅s
■ where v Fermi =
Fermi energy
m√
2 EF
: fermi speed and EF is the
○ Some notes on drift velocity: ■ F=Q(E+ v × B)=BIl sin θ
■ Relationship of drift velocity and electron speed: d l Q
through using the Fermi speed: Since v= ∨ and I =
eE eE d t t t
● v d= τ= Q: charge
m m v Fermi E: electric field
■ Relationship of drift velocity to speed of light: V: drift velocity
the drift velocity of electrons is very small B: magnetic field
compared to the speed of light ■ Direction is by Left-hand Fleming’s rule
● Drift velocity ~ 2x10-4 m/s ■ For finding the force on a current-carrying wire
○ assuming copper wire with 10A current ■ Motional electric field strength: E=v × B
● Speed of light: 3x108 m/s ○ Moving conductor in a magnetic field:
BΔA BlΔx
● Hysteresis ■ emf =Blv = = where
Δt Δt
○ Hysteresis: dependence of the state of a system on its emf: voltage induced in conductor terminals as
history it’s moving in an external magnetic field
■ Hysteresis: characteristic of a magnetic material (direction: positive to negative)
whereby a change in magnetization lags the B: magnetic field density
application of a magnetizing force l: length of conductor
■ Hysteresis: lag between cause and effect v: relative speed of conductor
○ Coercivity: magnetizing field (H) needed to ■ Derivation:
demagnetize a fully magnetic material From Faraday’s Law for a straight conductor
○ Retentivity/Remanence: magnetizing field strength
(H) retained in a material after the absence of a dΦ d (BA)
of length l: emf = =
magnetic field dt dt
■ Also called residual magnetization (when a d (BlvΔt)
magnet is “magnetized” it has remanence) But Δ A=vΔt (l) , thus ¿ =Blv
■ Units: Tesla (in SI units) or Gauss (in cgs units)
Δt
■ Direction is by Right-hand Fleming’s rule
■ Magnetic materials that are used to prepare
■ B, l and v (drift velocity) are all perpendicular to
permanent magnets should have high retentivity
each other.
● Sample Problems
○ A small 1-mm-diameter circular loop is at the center
of a large 20-cm-diameter loop. Both loops lie in the
same plane. The current in outer loop changes from 2
A to 10 A in 5 seconds. What is the induced current
in the inner loop if its resistance is 1 ohm?
−dΦ −Δ(BA)
■ emf = =
dt Δt
μ0 I π d2 μ0 (I )
BA= ( )= ¿ I*2.5x10-12
● Other formulas 2r 4 2 (20 cm)
−12 −12
Voltage Induced in a Conductor −2.5 ×1 0 ( I ) −2.5 ×1 0 (10−2)
○ Lorentz’ Force emf = = =
■ Also called electromagnetic force; it is the force
t 5
−12
a current-carrying conductor is subjected to when emf −4.5 ×1 0 V
I= = =−4.5 pA
it is placed in an external electric field E and R 1Ω
magnetic field B
ELEC: Electrical Elements
● Resistors ○ Generates negligible noise than carbon-
https://www.electricaltechnology.org/2015/01/resistor-types-resistors- composition resistors
fixed-variable-linear-non-linear.html ○ Has less reactance than a wirewound
○ Applications: type
■ Resist electric current ○ have negative temperature coefficient
■ Used for voltage division values
■ Used for biasing transistors ● Best high-frequency performance
■ Used for power dissipation ● Lower power handling compared to Carbon-
■ Bleeding charge (bleeder resistors) in parallel composition and Wire-wound
with filter capacitors to not damage the supply ● Low to medium resistances only
■ Used for current dissipation ■ IC (Integrated Circuit) resistors
■ Used for impedance matching for amplifiers ● Resistance is controlled by the thickness and
■ Resistance does not depend on size and shape of the types and concentrations of impurities
resistor added
○ All resistors can be placed in 2 categories: ● Least power handling among all types of
■ Fixed resistors due to its small size
■ Variable ● Can be fit in a semiconductor chip
○ Kinds of Fixed resistors
○ Resistors’ schematics
√
N 1 V 1 I2 Z circuit (core) which forms a shell
■ = = = 1 =n (turns around the windings
N 2 V 2 I1 Z2 ○ Magnetic losses in practical transformers
ratio) ■ Also called as core losses or iron losses
■ Ideal transformer: ■ Copper loss: loss due to resistance in
● no losses P¿ =Pout material itself resulting to loss of power in
○ terms of heat
■ Dielectric loss: the dissipation of energy through
V 1 I 1 cos θ1=V 2 I 2 cos θ 2
the movement of charges in an alternating
● 0o phase shift between primary and electromagnetic field as polarisation switches
secondary circuits direction
dΦ ■ Hysteresis loss: work done by the
■ emf =E=N
dt magnetising force (H) against the internal
E=NωΦ max cos (ωt ) friction of the molecules of the coil that
produces heat
Nω N (2 πf ) ● Also represents the area under the
Erms = Φ max= Φmax
√2 √2 hysteresis loop
Erms =4.44 Nf Φ max ● Pb=η B Max fV
n
● Dielectrics
https://automationforum.co/what-is-a-dielectric-and-what-are-the-types-of-
dielectric-materials/
○ An insulating or poor conducting material
■ However, when an electric field E is applied,
the material becomes polarized
■ creates an internal electric field that reduces
the overall field within the dielectric itself
○ Examples of dielectrics (for capacitors)
■ Air: ε =1.00059 ○ Dielectric strength: maximum voltage required to
■ Ceramic: ε between 6 and 8000 produce a dielectric breakdown through the
■ Plastic material
■ Mica ■ Higher dielectric strength = better insulator
■
V breakdown
Dielectric strengt h=
t h ickne s s of sample
■ Material with highest dielectric strength
used on capacitors: Mica (118 MV/m)
○ Note on Dielectrics
■ Inserting a dielectric on a capacitor increases ● This is the major factor limiting the high
its charge it can store/ its capacitance :-) frequency performance of active devices like
■ Dissipation factor: defined as the ratio of the transistors and vacuum tubes
energy dissipated to the energy stored in the ● Multiplied by the gain of the device [See
dielectric Miller Capacitance section]
● Dissipation factor value that is equal to
the power factor of the dielectric → less
than 0.1
■ Absorption current: dielectric current is
proportional to the rate of accumulation of
electric charges within the dielectric?
■ Miller Capacitance
● The parasitic capacitance between the input
and output electrodes of inverting
amplifying devices, such as between the
base and collector of transistors
■ Circuit Breaker: an automatic device for stopping
the flow of current in an electric circuit as a
safety measure
● have internal switch mechanisms that can be
tripped by an unsafe surge of electricity, thus
reusable as opposed to fuses
○ Relays vs Solenoids
■ Solenoid: acts as a temporary magnet when
● Switches current is passing through it
○ Switches: device that opens or completes a ● Solenoids are electromagnetic actuators.
circuit Electrical current moves the actuator
○ Kinds of Switches ● used for control the flow of Hydraulic or
■ SPST: Single Pole Single Throw pneumatic fluid via electrical control circuit
● Simple ON-and-OFF switch because of ● Note: The electron activation of a movable
1 input and 1 output terminal shaft is the basis for solenoids
● Batteries
○ Battery: a collection of one or more cells that
converts chemical energy (chemical reactions in
a battery cell) into electrical energy (flow of
■ DPDT: Double Pole Double Throw electrons)
● 2 inputs and 4 output terminals; each ■ All batteries are made up of three basic
input has 2 corresponding outputs that it components: anode, cathode, and some kind
can connect to of electrolyte (a substance that chemically
● With 2 inputs, it can connect to 4 reacts with the anode and cathode)
different outputs. It can reroute a circuit ■ Capacity of a battery cell: measured by the
into 2 different modes of operation amount of current that can be supplied over
time (i.e. total charge Q)
● Cell capacity: area under the discharge
curve
● Unit: Watt-hours [Wh] which is a
measure of stored energy
○ Kinds of Battery
○ Fuse vs Circuit Breakers ■ Primary Battery: disposable batteries
■ Fuse: an electrical safety device that operates to ● Designed to be used once and discarded
provide overcurrent protection of an electrical when exhausted
circuit. ● Generates DC via Chemical activity:
● Its essential component is a metal wire or chemical reactions are not reversible
strip that melts when too much current flows (only discharding possible)
through it, thereby stopping or interrupting ■ Secondary Battery: rechargeable batteries
the current ● Can be recharged and used multiple
● Made of pieces of metal when overheated times
● Generates DC chemically: chemical ■ What does V mean in a battery? The number
reactions are reversible (both charging of volts is the amount of energy given to an
and discharging are possible) electronic circuit (E.g. With a 12V device,
● E.g. Lead-acid battery 12 volts are always “given” from the
○ What do we mean by a 150Ah battery? [For battery)
Beginners]
ELEC: DC Circuits, AC Circuits, TransReso
● DC Fundamentals ● Voltage equations inside supernodes
○ DC vs AC ● Equations for dependent sources
■ DC flows in one direction only, AC flows in ■ Step 3: Use Cramer’s Rule (or calculator)
both direction periodically ○ Mesh Analysis
■ DC is NOT frequency dependent, AC is ■ Step 0: NONE
■ DC Can be stored while AC cannot ■ Step 1: Label all meshes
○ Types of DC (min. no. of equations = no. of nodes)
■ Continuous DC: stable DC value # of distinct meshes (e.g. IA, IB, 2A)
■ Pulsating DC: DC current that has changing - # of recycled meshes (e.g. IB + 6)
voltage value - # of known meshes (e.g. 2A)
○ Series vs Parallel + # of new dependent source variables
■ Series: same current & power, voltage is ■ Step 2: Write KVL equations
divided ● For regular meshes
■ Parallel: same voltage, current and power is ● For unshared current sources
divided ● Current equation for shared current
● Branch = parallel sources
● Total power dissipated by source is the ● Equation for dependent sources
sum of individual branch powers ● ‘Mentally’ remove all current sources
○ Basic Ohm’s law: V =IR and find unused loops (called loops)
2 ■ Step 3: Use Cramer’s Rule (or calculator)
2 V
○ Joule’s Power law: P=IV =I R=
R
○ Millman’s Theorem
■ Theorem that allows you to find the value of
voltage in a branch of a parallel circuit with
multiple voltage sources
■ Wye-to-Delta:
○ Numerator is sum of product of
adjacent devices (SAME)
○ Denominator is just the device at
the opposite side of the center ‘n’
V1 V2 Vn
+ +...+ ○ Node-sum/opposite
R 1 R2 Rn
=V (voltage across all branches) Resistor Network Capacitor Network
1 1 1
+ +...+ 1 1 1
R 1 R2 Rn + +
■ NOTE: Do not include load resistor R1 R 2 + R 2 R 3+ R 1 R3 1 C 1 C 2 C 2 C 3 C 1 C 3
Ra = =
■ If load resistor is included in simplified sub- R1 Ca 1
circuit, its series voltage VNx is 0V (since it
C1
is alone)
● Millman’s Theorem | DC Network 1 1 1
+ +
Analysis | Electronics Textbook R1 R 2 + R 2 R 3+ R 1 R3 1 C 1 C 2 C 2 C 3 C 1 C 3
○ Reciprocity Theorem Rb = =
R2 Cb 1
C2
1 1 1 1
+ +
R1 R 2+ R 2 R 3 + R 1 R3 1 C 1 C 2 C 2 C 3 C 1 C 3 Ra Rc 1 CaCc
Rc = = R 2= =
R3 Cc 1 Ra + R b+ R c C2 1 1 1
+ +
C3 Ca Cb Cc
■ Delta-to-Wye 1
● Numerator is the product of two Ra Rb CaCb
1
resistors that are delta-adjacent to the R 3= =
device Ra + R b+ Rc C3 1 1 1
+ +
● Denominator is sum of all resistive Ca Cb Cc
devices
● Adjacent/sum
○ Other concepts:
■ Wheatstone bridge: When 5 resistors/
Resistor Network Capacitor Network capacitors are connected in such a way that
1 the ratio of 2 resistances/capacitances in one
Rb Rc 1 C bCc
side to the other side is equal, then the
R 1= = potential difference across the middle
Ra + R b+ R c C1 1 1 1 resistor/capacitor is zero and we can
+ +
Ca Cb Cc remove that device
● AC Fundamentals
○ Alternating waveforms
■ Sine/cosine wave, Triangular wave,
Complex waves
■ Square wave: Made up of sine waves of the
fundamental frequency and all the odd
harmonics
● Basically a rectangular wave that has a
duty cycle of 50%
■ Sawtooth wave: Made up of sine waves of
the fundamental frequency and all the
harmonics (odd+even)
● Characterized by a faster rise time than
fall time (or vice versa)
○ AC values
■ Instantaneous value: v=V m sinΦ
v=V m sinωt
● Use radians for sin
■ Peak/max value: V M =V P
■ Peak-to-peak value: difference between
maximum and minimum value in a cycle
V MM =V PP
■ Half-wave rectifiers vs Full-wave rectifiers
(always assume FULL-WAVE)
■ Unless otherwise stated, all sine-wave ac
measurements are in rms values.
Half-wave rectifier Full-wave rectifier
RMS/effective value VM VM
(VRMS) 2 √2
VM 2V M
Average/DC value (VDC)
π π
Ripple voltage (Vr(rms))
0.386 V M 0.308 V M
V r (rms)=√ V RMS 2−V DC 2
Ripple factor (R) 121 % 48 %
V r (rms) ● Series and Parallel AC Circuits
r= x 100 % ○ Resistive vs Reactive circuits
V DC ■ Resistive: V and I are in phase
Form factor (F.F.) ■ Reactive: ELI the ICE MAN
V RMS ● ELI: Voltage leads current in inductive
F . F .= x 157 % 111 % circuit (by 90o or ¼ of a cycle)
V DC ● ICE: Current leads voltage in capacitive
100 % circuit (by 90o or ¼ of a cycle)
Peak factor (P.F.) ○ Series R-L-C Circuits (use Impedance Z)
VM ■ Reactance (X):
P . F .= x 200% 141% ● Inductor: X L = jωL (+ y-axis)
V RMS
1
100 % ● Capacitor: X C = =− jwC
[See Power Supplies: Rectifiers]
jwC
○ Other formulas (- y-axis)
1 ● Calculate the impedance:
■ V DC = ( V on t on+ V off t off ) Z=R+ jX =R+ j(X L −X C )
T
■ Positive inductive reactance,
where T = period=t on +t off negative capacitive reactance
■ √
Ripple factor (R) r = F F 2−1 where ○ Impedance: |Z|= R2 +¿ ¿ √
FF: Form Factor
○ Current (IRMS, IDC, IM, etc.): divide AC voltage by
load resistance R
θdegrees =ta n
−1
( X L −X C
R )=co s
−1 R
|Z| ( )
○ Other techniques:
■ Adding and subtracting AC Waveforms:
(must be same frequency)
● Convert them first to Phasor domain
Then use Phasor Addition
1. Polar form → rectangular form
● ■ Current IT is same, voltage is different:
A ∠ Φ= A[cosΦ+ jsinΦ]=x+ yj |V T |= √V R2+ ¿ ¿
( RZ )
2. Add the waveforms in their rectangular
forms ● V R=I × R=V T ← voltage div.
3. Convert the final waveform to polar
form ● V L=I × X L
V C =I × X C
● A=√ x 2 + y 2 and Φ=tan
−1
( xy ) ●
● Note: VR + VL + VC ≠ VT (mathematical
sum). Rather, it is a vector sum.
● A ∠ Φ= Asin ( wt +Φ )
■ Phase angles in series RLC:
4. Or, use calculator directly to add them: ● IL, IC and IR in phase since series
● CMPLX Mode ● VL and VC are not in phase
● Input waveforms in polar form ( ○ 90o phase between R (resistance)
A ∠ Φ) and X (reactance)
○ make sure the angles are in degrees ○ 180o between inductive and
(convert radians to degrees) capacitive load
■ AC sinusoid ⇔ phasor/complex form: ● XL and XC are 180o out of phase
●
VM
v=V M sin(ωt +Φ1 )=V rms ∠Φ 1= ∠Φ 1
√2
(use the RMS value! Vrms)
■ AC sinusoidal waveform plust constant:
● E.g. v=100+25 sin ( ωt )
● v rms= √ effec tiv e1 +effectiv e 2
√ ( )
2
2 25
● v rms= 10 0 + =101.55
√2
■ CASIO / DISCO
○ Parallel R-L-C Circuits (use Admittance Y)
● Used for t=∞ or f =0
■ Susceptance (B)
● CASIO - at AC, Capacitor - Short,
1
Inductor - Open ● Inductor: BL = (- y-axis)
● DISCO - at DC, Inductor = Short, jωL
Capacitor - Open ● Capacitor: BC = jωC (+ y-axis)
❑
1 1
■ Admittance: Y =G+ jB=
Z
■ P= ∫ ❑ p (t)dt
T T
1 ■
● Conductance: G=
R 1 1
1 P= V M I M cosΦ= V M I M cos ( Φ v −Φ i )
● Susceptance: B= =BC −B L 2 2
X IM
2
( B −B
G )
2
θdegrees = -ta n−1 C L ■ Q=I rms ℑ {Z }
● =-
○ Power Triangle:
co s−1 ( GY )
(note the negative!)
■ Voltage VT is same, current is different
|I T|=√ I R2 +¿ ¿
V
● I R =V × G=
R
● I C =V × BC
● I L =V × BL P R
■ Phase angles in parallel RLC: ■ Power Factor: pf =cosθ=¿ =
● VL, VC, and VR in phase since parallel
S Z
● IL and IC in NOT phase ● Leading: θ< 0(Quadrant IV )
○ 90o phase between R (resistance) ○ θ< 0means circuit is capacitive
and X (reactances) ■ Capacitive = -Q reactive power
○ 180o between inductive and ○ Capacitive: current is leading with
capacitive load respect to the voltage
( )
−1 I C −I L ● Lagging: θ> 0(Quadrant I )
○ Φ=tan ○ θ> 0means circuit is inductive
IR
o
■ Inductive = +Q reactive power
● XL and XC are 180 out of phase ○ Inductive: current is lagging with
● In phase diagram, the capacitive and respect to the voltage
inductive parts are just interchanged ● Power factor correction
from that of a series RLC phase diagram
○ Note that X =X 1− X 2
X =R(tan θ1−tanθ 2)
■ X1 is the given reactance in the
circuit, and X2 is the reactance of
the device that you are going to add
■ X is the reactance of the device you
are looking for
■ cosθ1is the p.f. of the circuit w/o
the added device, and cosθ2 is p.f.
of the circuit with the device
● Power factor correction (part 2)
● Powers of AC (Real, Reactive, Complex) ○ For an inductive circuit (i.e. lagging
○ Real Power: P=I 2 R (unit: Watts, W) p.f.) we add a capacitor to increase the
■ Power from source that is actually consumed p.f. to unity or something higher value
by load ○ Note that Q=Q 1−Q 2
2 ○ RC circuits
V
=P tan(θ1 )−P tan (θ2)
X
2
V (2 πfC)=P tan(θ1 )−P tan (θ2 )
P (tan θ1 −tan θ2 )
○ C= 2
2 πf ∙ V
● Power factor correction
2 2
R❑ + X
X1= ■ Charging phase
R tan ( cos−1 ( p f new ) )−X −t
V RC
○ Negative X → capacitor ● Current: i= (e )
○ Positive X → inductor R
−t
Q X ●
■ Reactive Factor: rf =sinθ= = v C ,c h arging=V (1−e RC )
S Z ■ Discharge phase
−t
● First Order (RL & RC) and 2nd Order ● v C ,disc h arge =V e RC
(RLC) Transient Circuits
○ Transient: momentary variation in current, ○ RLC circuits (2nd Order)
voltage, or frequency 2nd order equation:
○ Exponentially rising curve: y= y i(1−e
−t / τ
) av ' '(t)+bv ' (t)+ cv (t)=f (t)
−t /τ ■ Case I: Natural/Transient response (right
Exponentially falling curve: y= y f (e )
side is set to 0)
■ Method of Assumption of Solution: Assume a
● S-equation: a s2 +bs +c=0 and
solution to the variable inside derivative
● Get discriminant of s-equation:
(v ¿ ¿ c∨i L )¿ to be A e−st
○ Case 1: D>0 : s1 , s 2real and
t
■ x= , τ :time constant distinct roots
τ s1 t s t
v N (t )= A1 e + A2 e 2 (overdamped)
L
● RL circuits: τ = ○ Case 2: D=0: s 1=s 2
R s1 t s2 t
● RC circuits: τ =RC v N (t)= A1 e + A2 t e (critically damped)
● RLC circuits ○ Case 3: D<0 : s1 , s 2 complex
○ Total discharge time: 5 τ conjugate roots ( s=σ + jω)
■ If there are two time constants (e.g. 2 inductors σt
v N (t)=e (B ¿ ¿ 1 cos (wt )+B 2 sin (wt ))¿
with different L values), then the one giving the
(underdamped)
smaller tau will dominate
Note: Euler’s identity: e− jw=cosw− jsinw (use radians)
■ y :variable in question (current I, voltage v)
● y i :initial value (for rising curve)
● y f : final/maximum value (falling curve) ■ Case II: Forced/Steady-state response
○ RL circuits: 1. Find equations in circuit (2 or more)
using KVL or any other method
2. Find differential equation in terms of
continuity variable
3. Solve for coefficients using initial
values/initial conditions
R
● Series and Parallel Resonant Circuits 1
○ Resonance: tendency of a system to absorb more
● f L =f r− BW
2
energy when the frequency of its oscillations ○ Thus f r=Q (BW )
matches the system’s natural frequency
○ Resonant Circuit: also called tank circuit (LC) ● Notes on bandwidth:
or Flywheel ○ Selectivity: describes the ability of
■ Flywheel effect: ability of LC circuit to that circuit to respond to certain
supply complete sine wave when the input to frequencies while rejecting all
the tank is only a pulse others.
○ Electric resonance: happens when XL = XC ○ The greater the selectivity, the
○ Series Resonance Circuit lesser the bandwidth
○ The less selective a filter is, the
steeper the slope of its curves at the
cutoff frequencies
√
X L XC 1 L
○ Qfactor , series = = =
R R R C
■ Qfactor provides voltage
magnification for series resonance
fr
■ Bandwidth: BW = =f −f
Q H L
● Bandwidth: range of freq over which at Practical Parallel Resonance Circuit
least half of the maximum power and
current is provided
1
● f H =f r + BW
2
Series Parallel
Acceptor circuit Rejector circuit
Other name
Voltage Magnifier Current magnifier
Impedance Z minimum maximum
Reactance Acts as short (X=0) Acts as open ( X =∞ )
Max/min value Vsupply= VR (max) Imin = IR (min)
1
Resonant freq f R=
2 π √ LC
Q−factor=
X
1 L
RS C √
Q-factor
Q factor , ser= Q R B
factor ,∥¿= = ¿
■ Use Impedance Transformation to convert X = XL or XC R X G
RL series impedance to parallel impedance
2 2 VC VL Q
RS + X L Qfactor , ser== factor ,∥¿=
I C
=
IL
¿
● R P= VT VT I T
IT
RS
2 2 fR
RS + X L Bandwidth BW BW = or f R =Q(BW )
● X L, eq = Q
XL
● This makes practical parallel resonant ○ Some notes on Resonant Circuits
circuits solvable ■ At any resonant frequency, the voltage across the
■ Other formulas for Practical Resonance two series reactive components is 0
circuits (Resistor in series in inductor, both ● Because XL=XC (180o phase apart), they
in parallel with a capacitor): cancel each other out and thus the
● Resonant freq: impedance is purely resistive and
f r=
1
2 π √ LC
1−
√
R S2 L
C
Z dynamic =
L
minimum
■ Parallel LC combinations are used more
often in tuned amplifier circuits than Series
LC combinations
● Dynamic resistance:
RC ● Since Tuned = Parallel LC
○ If R increases, the dynamic ● A parallel tuned LC circuit can be used
resistance decreases and vice-versa to couple energy from one circuit to
○ The dynamic resistance is also the another
input impedance of the parallel ■ Resonant frequency of parallel circuit is the
resonance circuit same as a series circuit using the same
components when there is no resistance (i.e.
Summary of Series and Parallel Resonant Circuits LC or tank circuits)
ELEC: Solid State Devices [Semiconductors,
BJTs, FETs, Special Services]
● Band Gap Theory: Conductors, Insulators
and Semiconductors
○ Band gaps: opposes movement of valence
electron outside the system
■ Band gaps are measured in eV (electron-
volts) → 1 eV =1.60 x ×1 0−19 J
○ The only electrons affected by force in an atom
are the valence electrons
■ Need to exceed energy gap to convert ● Semiconductor Fundamentals
valence e- to free electrons ○ Group 6: Carbon, Silicon, Germanium
● Energy gap to exceed is proportional to ■ Carbon alone cannot be used as semiconductor,
valence e- (more valence e- = higher but it’s allotropes can (e.g. Graphene w/c is 100
energy gap to exceed) times faster than Silicon)
○ Kinds of semiconductors:
■ Intrinsic/pure semiconductor: # free e_ = # holes
(+ charges)
● semiconductor permits flow of electricity in
both directions
○ Current flow is due to holes and
electrons (at room temp)
○ Major parts of the current in an intrinsic
semiconductor are due to conduction-
band electrons
○ Conductors ● Functions as a conductor with high
■ Have 1-3 valence e- resistance, not as a switch
■ Almost no band gap ● The Fermi level for the intrinsic
■ PTC (Positive Temp Coeff): higher semiconductor lies in the middle of band gap
temperature means higher resistivity ● E.g. pure silicon
■ Superconductors: only happen when the ■ Extrinsic/impure semiconductor:
resistivity is really really low, which ● Functions as a switch due to impurities
happens when the temperature is close to ● N-type (negatively charged):
absolute 0 ○ # free e_ is more than # holes (+5)
○ Insulators ○ Pentavalent atoms (5 valence)
■ Have high resistance, doesn’t permit current ■ Donor atoms
● Atoms tightly bound to one another ○ E.g. Phosphorus, Arsenic, Antimony
■ Thick band gap (PArSb) 5+
■ Have 5-8 valence e- ● P-type (positively charged):
■ Have NTC (Negative Temp Coeff): higher ○ # free e_ is less than # holes (+3)
temperature means less resistivity ○ Trivalent atoms (3 valence)
■ E.g. wood,glass,ceramic, plastic ■ Acceptor atoms
○ Semiconductors ○ E.g. Boron, Indium, Gallium (BInG)
■ Semiconductors: 4 valence, little band gap ■ Some notes on intrinsic vs extrinsic
● Eg = 1.1eV (Si) semiconductors:
● Eg = 0.67eV (Ge) ● The impurity level in a semiconductor
● Eg = 1.42eV (GaAs) (exstrinsicness) is about 1 atom for 108
■ Semiconductors have resistivity that lies atoms of pure semi-conductor
between that of conductors and insulators (intrinsicness)
■ Acts as an insulator at room temperature ● At very high temperatures, extrinsic
○ Direct vs Indirect Band Gap semiconductors become intrinsic
■ Direct Band Gap (DBP): top of the valence because band-to-band transition
band and the bottom of conduction band dominates over impurity ionization
occur at the same value of momentum
● E.g. GaAs, GaAsP, GaP
■ Indirect Band Gap (IBP): top of the valence
band and bottom of conduction band occur
at different values of momentum
● E.g. Silicon (Si) and Germanium (Ge)
■ Electron emission: process when an electron
escapes from a metal surface
● Photoemission/photoelectric effect:
emission of electrons when
electromagnetic radiation (i.e. light) hits
a material
○ Most widely used electron emission
process
○ The amount of photelectric
● Doping emission depends on intensity of
○ Doping: introducing impurities to a incident radiation (not on
semiconductor to change it from intrinsic to frequency)
extrinsic ● Thermionic emission: electrons
■ Doping a semiconductor in a good crystal emission due to heat or by virtue of its
introduces allowed energy states within the temperature
band gap, but very close to the energy band ○ In practice, thermionic emission is
that corresponds to the dopant type. most widely used
● Electron donor impurities (n-type) ○ The thermal energy given to
create states near the conduction band carriers (called thermions)
○ Fermi level of n-type (when added overcomes the work barrier of the
with more donor atoms) gets closer material
to conduction band ○ Used in vacuum tubes (predecessor
● Electron acceptor impurities (p-type) of diodes/transistors)
create states near the valence band ● Secondary emission: ejection of
○ Fermi level of p-type (when added secondary particles (e.g. electrons) from
with more acceptor atoms) gets a material that is bombarded by a beam
closer to valence band of charged particles
● How much dope? 1 dopant for every 1- ○ Secondary emission is NOT always
million atoms decremental (it can be useful)
■ Other results of doping: ○ useful in photomultiplier tubes
● Because doping increases the number of since the secondary electrons will
charge carriers, it increases the make the device more sensitive
conductivity of the semiconductor ● Field Effect emission:
○ This reduces the energy gap ● Thermal carrier generation: formation
between the conduction band and of holes and free electrons which
valence band increases with temperature
○ Higher doping means thinner ■ Diffusion length: the average length a carrier
depletion region moves between generation and
● Characterizes the breakdown voltage of recombination
a diode: higher doping level means ● Semiconductor materials that are
lower breakdown voltage heavily doped have greater
■ Kinds of Doping: recombination rates and consequently,
● Interstitial: “foreign” atoms squeezed have shorter diffusion lengths
between regular crystal sites ● Diffusion lengt h=√ Dτ
● Substitutional: “foreign” atoms
occupying the sites of host atoms ● Common semiconductor materials
○ Device building blocks: Combination of See links:
semiconductors: ■ PROPERTIES of Ge, Si, and GaAs at 300 K
■ Metal-semiconductor ■ Properties of Silicon (Si), Germanium (Ge), and Gallium
● Copper-Sulfide (CuS) Arsenide (GaAs) at 300
■ PN junction ● Properties of Silicon
● Diodes ○ Germanium
● BJT (Bipolar Junction Transistor) ■ Lowest forward voltage drop in diodes
● FETs (Field-Effect Transistor) ● Vthreshold,Ge ≃ 0.3V
■ Heterojunction ■ Intrinsic resistivity: ρ¿ =60 Ω ∙ cm
● Gallium-Arsenide (GaAs) ■ Effective density of states in conduction band:
● Gallium-Phosphite (GaP) N C ,≥¿=1.04 ×1 0 25
m3 ¿
● Indium-Antimonide (InSb)
■ Fermi level energy band gap: 0.72 eV
■ Metal-Oxide-Semiconductor (MOS)
○ Silicon
● Metal + insulator + semiconductor
● CMOS (Complementatry MOS) ■ Vthreshold,Si ≃ 0.7V
■ Intristic resistivity: ρ Si =60,000 Ω∙ cm
○ Some terms: ■ N C , Si =2.8 ×1 0 m
25 3
■ Work barrier - The amount of energy required to
emit an electron from the surface of a metal ■ Fermi level energy band gap: 1.09 eV
■ Most commonly used
○ Gallium Arsenide (GaAs): ○ Some formulas
■ Vthreshold,GaAs ≃ 1.2V ■ # of majority or minority carriers after doping:
2
■ Intrinsic resistivity: ρ¿ =1 08 Ω∙ cm np=ni where
■ N C , GaAs=1.04 × 1 0 m
23 3 ● n: density of majority carrier [/m3]
● p: density of minority carrier [/m3]
■ Disadvantage: very expensive ● ni: density of intrinsic carrier before doping
○ Selenium [/m3]
■ Vthreshold, Se ≃ 1.0V
● Diodes/Diode Applications
○ Di (two) + Electrodes (terminals)
○ Diode: Non-linear devices, unidirectional device
○ P-type + N-type material = semiconductor device
■ PN-junction will form -- Diffusion of
electrons and hole carriers to their opposite
side.
● Note: PN junction will form only when
P and N-types are combined. It is not
found in all semiconductor materials
(e.g. intrinsic semiconductors)
● The frequency at which a PN-junction
will work effectively depends on:
- The type of semiconductor material
- Cross-sectional area of junction
- Capacitance when reverse bias, zero
forward current till the forward
voltage reaches cut in value
● Low forward resistance, high reverse
resistance
■ Recombination happens then depletion
region is formed, preventing any further
electron transfer unless putting a forward
bias on the junction.
● Depletion region = Space-charge layer
○ Diodes
■ + terminal: Anode
■ – terminal:
Cathode
■ Biasing:
● Forward Bias:
Negative
terminal of source attached to N-type,
and positive terminal attached to P-type,
thus thinning of depletion region and
greater flow of current
● Reverse Bias: Opposite case, thus
thickening of depletion region
○ When in reverse bias, both holes and
electrons move away from junction
which thickens the depletion region
○ Peak-Inverse Voltage (PIV): maximum
voltage that the diode can take/block
before being destroyed
○ Diode Models (VD: diode voltage)
■ 1st approximation: Ideal model:
● Forward bias: VD = 0 and ID>0
● Reverse bias: VD < 0 and ID=0
● Functions as an ideal switch
■ 2nd approximation: Practical model:
● Forward bias: VD=VK and ID>0
○ VK = 0.7V for Silicon
○ VK = 0.3V for Germanium
○ VK = 1.4V for GaAs
● Reverse bias: VD<VK and ID=0 ■ Positive and Negative clamping
○ ID is leakage current ● Positive clamping: shifts the waveform
○ May result to breakdown region down ABOVE a reference voltage
■ 3rd approximation: Piecewise-linear model: ○ Capacitor charges during negative half-
● Increasing current will increase the voltage cycle
drop ● Negative clamping: shifts the waveform
● 0.7V + IDR down BELOW a reference voltage;
○ Capacitor charges during positive half-
cycle
( ) ( )
VD VD
I D =I S e −1 =I S e −1
kT T
η η( ) ■ Rectifiers
q 11600 ● Half-wave rectifier
kT ○ PIV = VM
■ Thermal voltage: V t =
q ● Full-wave rectifier
If not given, use VT = 26mV ○ Center-tapped
● IS: reverse saturation current ■ PIV = 2VM
● VD: voltage across diode ○ Bridge-type: higher power rating than
● η: non-ideality factor of diode center-tapped
○ η = 1: Germanium ■ PIV = VM
○ η = 2: Silicon ■ DC and AC Sources (Load-line analysis) -
● k: Boltzmann’s constant [constant 25] continue this
● q: electron charge [constant 23]
● T: temperature in Kelvins ○ Types of Diodes
○ Room temp: in ELEC 27oC or 300K https://en.wikipedia.org/wiki/Diode#Shockley_diode_equation
■ Effect of Temperature on:
● On reverse saturation current: the reverse
saturation current in a Silicon PN diode
doubles every 10oC in Temp.
I S 2 (T ¿ ¿2−T )/1 0 C ¿ o
=2 1
I s1
● On Saturation voltage:
● On Threshold voltage:
V TH 2=V TH 1(1+ kΔT ) where
○ k: temperature coefficient of
semiconductor
ksilicon: -2 mV/oC
kGermainium: -2.5 mV/oC
■ Effect of Voltage on Temperature:
○ Diode Applications ■ Avalanche diode
■ Series and Parallel Clipping ■ Constant-current diode
● Series Clipper: diode in series with input ■ Crystal diode
○ Negative clipper: Clips negative cycle, ■ Gunn diode [See EST
positive-half remains ■ Hot-carrier diode: used as VHF and UHF mixers
○ Positive clipper: Clips positive cycle, and detectors
negative-half remains ■ Light-emitting diode (LED)
● Parallel Clipper: diode in parallel with input ● Emits light when current flows through it
■ Dual combination clipping ○ Electrical energy turns to light
○ Electrons recombine with holes, ● Has 2 doped regions (p and n region)
releasing energy in the form of photons separated by an intrinsic layer
● Called Photoelectric effect: free e- gives ● Characteristics
light or Electroluminescence ○ High reverse breakdown voltage
● In LEDs: the cooler the environment, the ○ Low capacitance
higher an LED's light output will be. Higher ● Application
temperatures generally reduce light output ○ High voltage rectifier
● Red and Green LEDs are common → ○ RF switching
memorize the voltage drops! ○ photodiodes/photodetector
Material Wavelength Color V @ 20mA ■ Schottky diode
GaAs 850-940 nm Infra-Red 1.2 V ● no charge storage and thus almost zero
GaAsP 630-660 nm Red 1.8 V ! reverse recovery time
GaAsP 605-620 nm Amber 2.0 V ● Compared to an ordinary semiconductor
(Orange) diode, a Schottky diode has
○ a lower cut in voltage (0.3V compared
GaAsP:N 585-595 nm Yellow 2.2 V
to 0.7 of ordinary diodes)
AlGaP 550-570 nm Green 3.5 V !
○ A higher reverse saturation current (due
SiC 430-505 nm Blue 3.6 V to high electron concentration in metals)
GaInN 450 nm White 4.0 V ■ Super barrier diode
● Some notes: Silicon is not suitable for the ■ Gold-doped diode
fabrication of LEDs because it’s an Indirect ■ Snap off or Step-recovery diode
Band Gap semiconductor [See Band Gap ■ Stabistor or Forward Reference diode
Theory] ■ Transient voltage suppression diode (TVS)
○ e- must undergo a momentum change as ■ Tunnel diode or Esaki diode
well as a change in energy. So, energy ■ Varicap or Varactor diode
is released as heat along with the light. ● A diode whose internal capacitance varies
■ Laser diode with the variation of the reverse voltage
■ Thermal diode ○ Used in storing the charge
■ Photodiode ○ Always works in reverse bias
● a transducer that takes light energy (photons) ○ Voltage-dependent capacitance
and converts it into electrical energy in the ● Used in Tuning because of the voltage-
form of reverse current dependent capacitance
● Has opposite function as LEDs: Since ● Transition Capacitance formula:
forward current in LEDs create light, light in C0
photodiodes create reverse current
( | |)
n
○ C T (V R ) = V where
1+ R
V TH
■ V0: max capacitance
■ VR: reversed bias voltage
■ VT: threshold voltage (0.7V)
○ Also called photodetector/photosensor 1
○ Illumination→ionized covalent bonds→ ■ n= if diffused junction
3
generation of hole and electron pairs 1
■ Electron-hole pairs are formed ■ n= if alloy junction
when photons of energy more than 2
1.1eV hits the diode ■ Zener diode
■ An increase in illumination for a ● Used in voltage regulator/voltage reference
photodiode decreases its resistance circuits [See Power Supplies: Regulators
(not increasing its current) Section]
○ Photon enters the depletion region→ ○ Output voltage is equal to Zener
free electrons and hole are produced→ Voltage VZ despite variations in the
current input voltage V
■ Photon absorption intensity is ● Zener Breakdown
proportional to photon energy ● Resistor is used to limit current in the diode
● Has 3 layers: P-layer, intrinsic layer (in ■ 7-segment display
between) and N-layer ● 7-segments (a-g) each an LED to form part
● Operates in reverse bias condition: P-side of a numerical digit
connected to negative terminal and v.v. ● Forward bias (FB) a pin to light a segment
■ PIN diode ● usually driven by an IC: 7-segment
● Has 3 layers: P-layer, Intrinsic layer, N-layer decoder/driver (e.g. CMOS 4511, TTL
7447)
● 2 types
○ Common Cathode (CC): all Cathode
connections of the LED segments are
joined together to Logic 0 or GND
■ To light an individual segment, ■ To light an individual segment,
apply a Logic 1 to forward bias the apply a Logic 0 to the individual
individual Anode terminal Cathode terminal
■ more popular as many logic circuits
can sink more current than they can
source
■ Applications:
● Used as voltage amplifier
● Used in moving coil microphones
Preamplifiers
● Used in VHF and UHF radio frequency (RF)
amplifiers [See Radio Frequency section]
○ VHF: Very-high frequency [30MHz-
300MHz]
○ UHF: Ultra-high frequency [300MHz-
3GHz]
■ Formulas:
V o V CB V CB RC
● AV =¿ = ≈ =α
V i V EB 0.7 V RE
Io IC
● A I =¿ = = α ≃1
Ii I E
○ At common base: I C ≃ I E
V BE 0.7 V
● Input current: I E = = (at
RE RE
constant output voltage VCB)
V CB V CB
● Output resistance: Ro =¿ = (at
IC IR L
● Amplifier Classes
○ Divided into two groups: (1)
■ Classically controlled conduction angle
amplifiers: Class A, AB, B and C ■ Combine Class A and Class B amplifiers to
● defined by the length of their conduction achieve a greater efficiency than Class A
state over some portion of the output (≃60%) but lower distortion than
waveform Class B
● operation lies between fully ON and fully ● Achieved by biasing both transistors so they
OFF conduct when the signal is close to zero (in
● Most commonly constructed amplifier Class B, non-linearities happen at zero
classes crossings)
● E.g. Audio Amplifiers ■ Q-point slightly above x-axis (lower part of the
■ Switching amplifiers: Class D, E, F, G, S, and T load-line)
● Use digital circuits and pulse-width ● Conduction angle is between 180o to 360o
modulation (PWM) ■ Using small bias voltage provided by series
● switch between ‘fully ON’ (saturation) and diodes and resistors
‘fully OFF’ (cutoff) only
● Uses RLC resonators or multiple power 3. Class B amplifier
supplies to reduce power loss
[ ]
2
○ Swiching Amplifiers: see link: https://www.electronics- V CE(max )−V CE(min)
tutorials.ws/amplifier/amplifier-classes.html η=ηmax
V CE(max ) +V CE(min)
Summary:
θ (conduction ■ If Class A transformer coupled power
Class η (max) Q-point Distortion amplifier, then ηmax = 50%. Transformer
angle)
30% couple increases the efficiency (η) of the
(50% if amplifier, and it is only used for class A
A 360o Above cutoff Low amplifiers because Class A amplifiers have
transformer
coupled) low efficiency
● FET (Field Effect Transistors)
○ FET: Feld Effect Transistor
■ Non-linear devices
■ Unidirectional and voltage controlled
■ FETs are: Voltage-Controlled Current Sources
(VCCS) devices
● They will turn ON only if there is voltage
applied to the Gate
● VCCS: input is voltage, output is current
■ FET are active devices (they have amplifier
configurations [See FET Configurations])
■ Unipolar device that depends only on the
conduction of electrons (N-channel) or holes (P-
channel)
■ Mostly used in:
● Integrated circuits (ICs) because of their fast
switching times (compared to BJTs) and
their small size
● Digital circuits (for the same reason).
○ Parts of FET: Source, Gate, Drain
■ Source ←→ Emitter (in BJT)
● emits majority charge carriers (input)
■ Gate ←→ Base (in BJT)
● controls the flow of carriers by applying the
voltage input
■ Drain ←→ Collector (in BJT)
● collects majority charge carriers (output)
○ BJT vs FET
BJT FET
Current-controlled Voltage-controlled
(requires biasing current to turn ON) (requires biasing voltage to turn O
Larger Zi (input impedance)
Smaller Zi (input impedance)
Due to presence of dielectric on input side, it
[1-3 kΩ]
[in MΩ]
o (input impedance) Low Zo
Draws more current at input, and can cause
Draws little to no current at input, thus
loading
(low power consumption)
(high power consumption)
High gain at output Low gain at output
(BJT are current-amplifiers) (FET are Transconductance ampli
For amplification
For stabilization
[BJT: See Amplifier Classes]
Slow switching time Fast switching time
Temperature dependent Better Heat stability
Smaller size
Larger size
(thus FETs are used in ICs)
Cheaper Costly
(around P5.00-15.00) (around P25.00-50.00)
Less widely used More widely used
○ The only thing restricting the current ID
○ Types of FETs is the depletion region
● VP: pinch-off voltage
○ Voltage at which the channel closes/
saturates due to the depletion region
○ At this voltage, no current flows in the
drain (ID = 0)
○ Regions of Operations (Assuming N-channel JFET)
■ Pinch-off region:
● Also called Cut-off region for JFET
○ FET is turned OFF/open
● VGS ≫ 0, to drive to Pinch-off
● Drain- source channel resistance (RDS) is at
maximum, thus ID = 0
■ Ohmic region:
● Also called Linear region
○ as input voltage increases, output
current increases
■ JFET: Junction FET ○ JFET will act as a voltage controlled
● N-channel FET: channel is doped with donor resistor
impurities ● Happens when VGS = 0
○ flow of current through the channel is ● Drain current (ID) has a linear response to
negative (electrons, e-) changes in the Drain-source voltage (VDS)
○ P-substate ■ Saturation region
● P-channel FET: channel is doped with ● Also called Active region for JFET
acceptor impurities ○ FET is turned ON/closed
○ Flow of current through the channel is ● Current ID is maximum (flowing from drain
positive (holes) to source)
○ N-substate ○ FET becomes a good conductor
■ MOSFET: Metal-oxide Semiconductor FET ○ ID is controlled by VGS, while VDS has
● Also called Insulated Gate FET (IGFET) little or no effect
● D-MOSFET (Depletion MOSFET), E- ● In saturation, the effective channel length of
MOSFET (Enhancement MOSFET) a MOSFET decreases with increase in drain
voltage (VDS)
○ FET construction ■ Breakdown region
● Happens when VDS is very high which causes
a drastic increase in ID due to breakdown of
drain-source channel
● Cannot control and limit maximum current
( )
2
the main channel V GS
● Thus, JFETs are known as Depletion-mode
I D =I DSS 1− where
VP
devices
● Because FETs are voltage-controlled VP = VGS(off): pinch-off voltage
devices, no current flows into the Gate VGS: gate-to-source voltage
(IG=0) IDSS: drain-to-source current at
■ Voltage is applied at the Gate (VGS) to control saturation (maximum)
flow of current (ID). As VGS increases, the ID: drain current
effective width of the channel decreases, thus ID (range from 0: pinch-off
decreases and the channel resistance RDS to IDSS: saturation)
increases ■ V GS=V G−V S=V G −I D RS
● N-channel: VGS must be negative ● In some cases (check the circuit!), VG = 0
● P-channel VGS must be positive since the gate is connected to ground. If
■ Terms: there’s a source, get the thevenin voltage VTH
● IDSS: maximum drain-current (ID) when VGS
■ Because JFET has a very large input impedance ● The voltage drop across source resistance
(RG ≈ ∞), Gate current: IG = 0 and ID = IS (RS) provides the biasing voltage VGG on the
2 I DSS V GS V gate, thus no external source is needed
■ gm = (1− ) = gmo (1− GS ) ○ Thus called Self-Bias
|V P| VP VP ● Use KVL around gate-source and drain-
where source loops, and Shockley’s equation to
2 I DSS solve for values
● gmo: gm for VGS = 0 → gmo =
|V P|
■ Derivation of gm: transconductance
gm is the derivative of ID with respect to VGS:
d (I D ) d
gm = = ¿
d (V GS) d (V GS )
V GS 1
¿ 2 I DSS (1− )(0− )
VP VP
1 V GS
¿ 2 I DSS (0− + 0+ 2 )
VP VP ● Characteristic curve: use Shockley’s Eq’n to
2 I DSS V GS plot curve.
¿ (1− )=¿ ● Load-line: Plot the points ID = IDSS/2, and
−V P VP VGS = -(IDSS/2)RS. OR solve for IDQ and VGSQ
2 I DSS V GS
(1− ) ■ Voltage Divider Bias Circuit
|V P| VP ● Applicable to all FETs
Δ V GS 1 ○ if JFET/D-MOSFET: use Shockley’s
■ Channel resistance: R DS = = [
( )
2
Δ I D gm V GS
Equation → I D = I DSS 1−
input VP
]
output ○ if E-MOSFET: use current equation
for E-MOSFETs → I D =
● FET Biasing 2
○ Like BJT, Transistor Biasing is to establish a known k ( V GS −V TH )
( )
Q-point for the FET to work efficiently and produce R2
an undistorted output signal ● By voltage division: V G =V DD .
○ DC Biasing: For DC, replace capacitors with open R 1+ R 2
■ Fixed Bias Circuit This VG provides the biasing for the circuit
● Circuit where there’s a fixed gate voltage ○ No thevenin equivalent circuit
(VGG) thus called Fixed bias ○ R1 resistor facilitates larger adjustments
○ ensures that the VGS is always negative of the DC bias points and permits use of
(if N-channel) or positive (if P-channel) larger valued RS
but no current is drawn from the battery, ● Current across gate resistors:
thus still IG = 0 V DD
● Use KVL around gate-source and drain- I R 1=I R 2= (since IG = 0)
source loops, and Shockley’s equation to R 1+ R 2
solve for values ● Use Voltage division (on Gate side), KVL
around gate-source and drain-source loops to
solve for values
■ Self-Bias Circuit
● Most common method for biasing a JFET
○ Self-biasing of a JFET stabilizes the Q-
point against any change in its
parameters like gm (transconductance)
● FET - MOSFET
○ MOSFET: Metal-Oxide Semiconductor FET
■ Operate the same as JFETs but have the Gate
terminal electrically isolated from the conductive
channel (insulating layer is with SiO2)
● Thus also called IGFET: Insulated Gate FET
● Higher input impedances than JFETs (JFETs
have “medium” input impedances)
● Characteristic curve: use Shockley’s Eq’n ■ Unidirectional and voltage-controlled
● Load-line: use KVL equation around gate- ■ Both positive and negative input voltages (VG)
source loop: VGS = VG - IDRS can be applied
then draw the load-line ● Negative input VG: Depletion mode
At VGS = +VG, ID = 0 ● Positive input VG: Enhancement mode
At VGS = 0 , ID = V G /R S
○ Based on this formula, the Q-point can
be altered based on the value of source
resistance (RS) → the greater the RS, the
lower the drain current (ID) and thus a
lower Q-point
( )
2
V GS
I D =I DSS 1−
V GS (OFF )
○ In Depletion-mode, VGS < 0, ID gets
lower than IDSS (until it reaches 0) ● FET Configurations
● D-MOSFET can function in both ○ Common Source
Enhacement-mode and Depletion-mode ■ Most widely used FET configuration
■ Analogous to Common Emitter in BJT
■ Used in Audio frequency amplifiers and in high-
input impedance pre-amps and stages
■ Characteristics:
● Medium input and output impedance
● Inverts the input signal and amplifies it (180o
out-of-phase)
● Medium current gain and voltage gain, high
power gain
● High thermal instability
■ Parameters
● Source is common [usually grounded VS=0]
● Input: Gate (VG), VGS, IG = 0
● Output: Drain (VD>0), VDS, ID
○ Common Gate
■ Analogous to Common Base in BJT
■ Used in high frequency circuits or in impedance
matching circuits where a low input impedance
needs to be matched to a high output impedance
■ Parameters:
● Gate is common [VG=0]
■ Enhancement-only MOSFET ● Input: Source (VS>0), VSG, IS
● Has Enhancement only as its function (since ● Output: Drain (VDG>0), ID
D-MOSFET ■ Characteristics:
can either be ● Low input impedance, High output
in Depletion- impedance
mode or ● Input and output in-phase (0o) → Non-
inverting amplifier
● Input and output in-phase (like common
collector)
● High voltage gain, Low current gain, Low
power gain
Enhancement-mode)
● For E-MOSFET, the substrate extends all the way to the
SiO2 layer, and no channels are doped between the Source
and the Drain
○ Channel is induced in these MOSFETs when we have
VGS > VGS(Th)
○ Common Drain
■ Analogous to Common Collector in BJT
● Thus, Common Drain is also called Source
follower/voltage follower because the
Source voltage (output) follows the Gate ○ Cascode Amplifier
voltage (input) ■ amplifier consisting of a Common emitter (CE)
■ Characteristics: input stage that drives a common base (CB)
● high input impedance, low output impedance output stage.
■ advantages include high gain and low noise
● Voltage buffer [voltage gain ≈
■ employed in high frequency sections
1], High current gain, low power
■ Useful in reducing the Miller effect capacitance.
gain
● Input and output in-phase (0o)
■ Parameters:
● Drain is common [VD=0]
● Input: Gate (VG), VGD, IG = 0
● Output: Source (VSD>0), IS
○ Work function
■ The amount of additional photon energy required
to emit an electron from the surface of a metal
■ the minimum energy required by the fastest
electron at 0 K to escape from the metal surface
○ Digital - composed of the devices found ○ Surface barrier
in an Analog Hall-effect sensor, with ■ hinder the guest molecules from entering the
the addition of a Schmitt trigger in order pore space and significantly slow down the mass
to give the digital output states (ON or transfer
OFF) ■ influence the uptake of molecules into porous
■ Schmitt trigger provides hysteresis materials; hence acting as additional mass
or 2 different threshold values transfer resistance at the outer crystal surfaces
■ Example: Hall-effect switches
○ Automation Systems
■ The digitizing technology that uses an electric
field radiated from the tablet and picked up by a
cursor is electrostatic.
ELEC: Industrial Electronics I
● Power Supplies: Transformers VM
○ Power Supply: Transformer → Rectifier → Filter P . F .= × 100 %
→ Regulator
V RMS
○ Transformer: converts AC voltage/current to Rectifier Efficiency (η):
higher or lower values (DC component of input 2
DC output power I DC R L
is ignored by the transformer) η= = 2 max: 40.6% max: 81.2%
AC input power I RMS (R D + R L )
Where RD: diode resistance
fIN 2fIN
Output frequency Bonus: 3-phase rectifier (output
frequency is still 2fIN )
○ Half-wave rectifier
■ Simplest kind of rectifier (1 diode only)
■ PIV = VM
○ Full-wave rectifier
■ Bridge-type full-wave rectifier
● Most used due to its efficiency and
simplicity
● PIV = VM
○ Formulas (ideal transformers) ■ Center-tapped full-wave rectifier
■ PIN = POUT ● PIV = 2VM
N 1 V 1 I2
= = = 1
N 2 V 2 I1
●
Z
Z2 √
Current is inversely proportional to
number of turns to conserve power in
both sides
○ Some notes on transformers:
■ To improve mutual coupling between
primary and secondary circuit, the magnetic
core must have low reluctance
■ High leakage transformers are of small
Voltage Ampere (Power) rating
○ RC Filters
■ Enhanced C-filter because a resistor is in
series with capacitor which further reduces
ripple voltage
○ DC operation of RC filter:
' RL
■ V DC = V where
R + RL DC
VDC: DC voltage generateed across C1
V’DC: DC voltage generated across C2 and load
○ AC operation of RC filter
' XC
■ V r (rms) ≈ V
R r (rms)
■ For a full-wave rectifier with ac ripple at 120
1.3
Hz: X C =
1000 C
○
( )
V o =V ref 1+
R2
R1
+ I adj R2
Typical values: Vref = 1.25V
Iadj = 100μA
R = 240Ω
R2 = 500 KΩ
○ Range: 1.2V to 37V
○ Has the highest dissipation
○ Types of Thyristors
■ Silicon-Controlled Rectifiers (SCRs):
● Thyristor that’s optimized for high power
switching
● Highest power load
■ Silicon-Controlled Switch (SCS):
● Thyristor with two gates and optimized for
faster turn off time
■ Characteristic curve:
● Better as a switch than a rectifier
● VP: triggering voltage/peak point voltage
● Has 4 terminals: Anode, Anode Gate, Gate,
(stable)
and Cathode
● IP: peak point emitter current - current which
○ Anode Gate: can be used to turn on/off
triggers the UJT; inversely proportional to
the SCS with the proper voltage levels
VBB (interbase voltage)
■ Silicon-Unilateral Switch (SUS)
○ Low value
■ Silicon-Bilateral Switch (SBS)
● VV: valley point voltage -increases with an
■ Gate Turn Off (GTOs)
increase in VBB
● Thyristor that can be turned on and off using
● IV: valley point current - also increases with
the same gate
an increase in VBB
● However, GTOs can’t handle high power
● Can have negative resistances because of
(no maximum power load)
potentiometer
● Operation:
● Emitter current never exceeds IEO to the left
○ In a GTO, anode current begins to fall
of peak point
when gate current is negative peak at
■ Some notes on UJTs:
time t = storage period ts
■ Light-Activated SCR (LASCR)
● An SCR that can be activated by light
● It is recommended to use UJT oscillator for
gate-triggering of thyristors mainly because
it provides sharp firing pulses
● A positive voltage applied to the gate of a
reverse biased SCR increases the reverse
leakage current into the anode
○ Diac
■ Diode that conducts current only after its
breakover voltage has been reached momentarily
■ Diac → “Diode” in AC thus it conducts current
in both directions
■ Construction: 2 anode terminals and n-material
are attached to terminal ends of Diac
● No polarity
○ Shockley Diode
■ Four-layer semiconductor diode (3 PN junctions)
■ Construction is similar to thyristor except
without the Gate terminal
■ Characteristic curve:
● Upper half is similar to that of SCR - once
the voltage exceeds the VBR (forward
breakover voltage), the Diac will start
conducting
○ Breakover voltage is fixed (you don’t
have much control on changing it)
● In the negative half-cycle the the Diac will
do the same thing except that the negative
breakover voltage (-VBR) should now be
exceeded
○ Triac
■ “Triode” in AC hence a 3-terminal version of a
Diac (conducts current in either direction)
● Unlike Diac, the breakover voltage of the
Triac can be manipulated through the gate
current
● Thus: Triac combines the advantages of an
SCR (controllable breakover voltage) and
Diac (conducts current in both directions)
● It is the uncontrolled electronic switch ○ Phototransistor
employed in power electronic converters ■ A semiconductor device that detects light and
● Between a Triac and an SCR, a Triac is best adjusts the current flowing between emitter and
suited for controlling power in AC circuits collector according to the level of light it
receives
● Think of it as the base connected to a light-
bulb or LDR (light-dependent resistor)
○ Opto-isolator
■ Electronic component that transfers electric
signals between two isolated circuits by using
light.
● Uses phototransistors, LASCR, LASCS to
do this
● Light signals are unaffected by the other
■ SCR vs TRIAC construction signals around them
● Triacs have 3 terminals also (Gate, Anode1, ■ Prevent high-voltages from affecting the system
Anode 2) but the Gate is connected to an N- receiving the signal
material which connects to a p-material in ● High voltage = high fields which may affect
the triac the output at different parts of the circuit
(e.g. false triggering, false readings , etc.
● Power Electronics 1: DC-to-DC converters
○ Chopper ■ Parallel regulators
■ Static power electronics device which converts ■ Shunt regulators
fixed DC voltage/power to variable DC
voltage/power ● Power Electronics 1: AC-to-DC converters
● Variable: higher/lower rating ○ Power Supply
● Similar to a transformer but this is a circuit ■ Uses diodes in converting AC to DC
■ Works by “chopping” - turning a switch on and ■ See Section on Power Supply
off continuously which controls the voltage ○ Phase Controlled Rectifier (PCR)
coming to the load ■ Converts AC to DC with through the use of
■ Chopper circuit classes Thyristors/SCRs as rectifiers instead of diodes
● Class A chopper: operates at 1st quadrant which grants the advantage of regulating the
○ Buck, Step down output voltage
● Class B chopper: operates at 2nd quadrant ● Output is regulated by adjusting the firing
○ Boost, Step up angle (α) or delay
● Class C chopper: operates at 1st/2nd ■ Types of PCRs
quadrant ● Single-Phase Semi-converters
○ Buck - Boost ○ Combination of 2 thyristors/SCRs and 2
● Class D chopper: operates at 1st/3rd diodes and used to eliminate negative
quadrant voltage occurence at the load
■ Kinds of Chopper circuits ○ You can choose when in the wave you
● Buck Converter - a DC-to-DC power want to start conducting (thanks to the
converter which steps down voltage from SCRs) but not when to stop conducting
input to output (due to diodes)
T on VM
○ V o (ave)= δ (V s -V c h op) = (V s - ○ V o (ave)= (1+cos α )
T π
V c h op) α: firing angle (in radians)
where VO(ave): average output voltage
𝛿 : duty cycle
VS: source voltage
VChop: chopper voltage
● Single-Phase Full-converters
○ Same circuit configuration and formula
as a Single-Phase Semi-converter but
now it consists purely thyristors/SCRs
● Boost Converter - a DC-to-DC power ○ You can choose when in the wave you
converter that steps up voltage from input to want to start/stop conducting because
output circuit is only composed of SCRs
VS VM
○ V o (ave)= ○ V o (ave)= (1+cos α )
1−δ π
○ DC regulators
● Power Electronics 2: Inverters
○ Opposite of rectifiers - changes DC to AC
○ Switchin devices: transistors, diodes, SCRs, SCS
○ Kinds of Inverters
■ Half-bridge Inverter
● Makes use of two switching devices and two
DC power sources to produce AC voltage
and current
○ The two sources are in opposite
polarities and they are switched on or
off when they are needed
○ Only one of the two switching devices
are ON at a time thus creating an AC
signal
Vs
● V o (rms)= , VS: DC source voltage
2
○ Generates less voltage because of the
1/2
● V o (ave)=0
√
sin 2 α
●
π −α +
2
V o (rms)=V M
2π
√
more complex but more efficient (~96%)
sin 2 α
2 π−α +
● V 2
V o (rms)= M
2 π
■ Full-wave controller
● Controls both half-cycles of the AC wave
● Also called the Single-phase Bidirectional
controller
● Composed of 2 SCRs instead of having a
diode, thus controls the firing angle α
○ LPS vs SMPS:
■ LPS output has less ripple voltage than SMPS
● SMPS uses a lot of switches which are
frequency-dependent thus the ripple
becomes large
■ LPS output is more immune to Electromagnetic
Interference (EMI)
● SMPS switch at high frequencies thus
avoiding EMI
■ SMPS is smaller in size
■ SMPS has greater power handling than LPS
● The components inside are designed for high
voltage/current
ELEC: Industrial Electronics II
● Feedback systems: Fundamentals ● Voltage is sampled and connected in series
○ Feedback: one in which the output signal is sampled with input signal thus voltages add up (input
and fed back to the input to form an error signal that and feedback signals are voltages)
drives the system ○ Works as a Voltage amplifier
○ This is the electronics side of Feedback/Control V out
Systems (types/applications/etc.) For the mathematics ● Transfer gain: AV =
V¿
such as solving for the Gain H(s) of a system, [See
MATH: Feedback/Control Systems (Math)]
○ Types
■ Positive feedback: the set point and output values
are added together by the controller as the
feedback is “in-phase” with the input
● Also called regenerative feedback
A
● A pos feedback =
1−βA ■ Voltage-shunt feedback
● Effects: ● Also called shunt-shunt feedback
○ Increased gain of the system ● Voltage is sampled and connected in parallel
○ Greater noise and distortion with input signal thus feeding current
○ Narrow bandwidth ○ Works as a Transresistance - ratio of
○ Unstable gain output voltage to input current
■ Negative feedback: the set point and output V out
values are subtracted together by the controller as ● Rm =
the feedback is “out-of-phase” with the input I¿
● Also called degenerative feedback
A
● Negative feedback: A¬feedback =
1+ βA
● Effects:
○ Improves stability (Lower noise and
distortion)
○ Gain desensitization: output signal
becomes less sensitive to small ■ Current-shunt feedback
variations from input signal ● Also called current-current feedback
○ Wider bandwidth ● Current is sampled and connected in
■ Due to lower gain, there is greater parallel/shunt with input signal thus current
frequency response: BW =f R /Q adds up (input and feedback signals are
currents)
■ Bad at higher frequencies
○ Works as a Current Amplifier
(amplifier may turn into oscillator)
○ I/O Impedance modification: Z can be I out
● Ai=
modified to achieve maximum power I¿
transfer ( R L=R TH )
■ Current-series feedback
○ Sampling methods
● Also called series-series feedback
■ Voltage/shunt sampling: connecting the output
● Current is sampled and connected in series
voltage as input to the feedback network
with input signal thus feeding voltage to the
■ Current/series sampling: connecting the output
input
current as input to the feedback network
○ Works as a Transconductance amplifier
○ Mixing methods
■ Shunt or Current mixing: feedback signal is in I out
● G m=
parallel to the input signal thus adding up their V¿
current
■ Series or Voltage mixing: same idea but in
series-voltage
○ Feedback Topology (sampling + mixing
combination)
■ Voltage-series feedback
● Also called voltage-voltage feedback
● Feedback Amplifiers ● Positive feedback: provides path from output
to input
■ Relaxation Oscillators
○ Oscillator Requirements:
■ Barkhausen Criterion
1. The magnitude of the overall gain around
the loop should be unity |β A|=1
● If β A=1, output level is fixed in
amplitude (self-sustained)
○ Some terms: ● If β A <1, the oscillation dies out
Sout ● If β A >1, the osciallion starts to grow
■ Open loop gain: A=¿ to no limit which will cause multiple
S source distortion and noise
S out A 2. The net phase-shift around the loop must be
■ Closed-loop Gain: A= = 0 or a positive integer multiple of 2π radians
S ¿ 1+ βA
● Also called Gain without feedback or 360o
● Use Sin because there is feedback ○ Kinds of Oscillators
Sf ■ LC Oscillators
■ β= - called as feedback ratio 1. Hartley Oscillator - uses two inductive coils
S out with a parallel capacitor to form its
●Part of the output signal that is fed back to resonance tank circuit producing sinusoidal
the input oscillations
● 1+ βA : called as ‘Sacrifice factor’, ○ Used for low frequency region
‘Desensitivity factor’ or ‘feedback factor’ 1
○ f R=
which determines how much gain a system 2 π √ LT C
receives
○ Feed-back topologies
■ For a series connection at input or output, the
resistance is increased by the sacrifice factor
(1+ βA)→ multiply
■ For a parallel/shunt connection at input or output,
the resistance is decreased by the sacrifice factor
(1+ βA) → divide
OUTPUT+INPUT
Feedback Topology Input Impedance 2. Colpitts Oscillator - uses two capacitors in
Output Impedance
series with a parallel inductor to form its
Zo resonance tank circuit producing sinusoidal
Voltage-Series Zi (1+ βA)
increased (1+ βA) oscillations
decreased ○ 2 Capacitors and 1 inductor in parallel
Zi Zo ○ Used in 100kHz to 500MHz
Voltage-Shunt ○ Improved performance in high-
(1+ βA) (1+ βA) frequency region due to the capacitors
decreased decreased
1
Zi ○ f R=
Current-Shunt Z o (1+ βA) 2 π √ L CT
(1+ βA) increased
decreased Ci C o
■ C T =¿
Current-Series Zi (1+ βA) Z o (1+ βA) Ci C o
increased increased
● Feedback: Oscillators
○ Oscillators: electronic circuits that generate
continuous periodic waveform at a precise frequency
■ Uses positive feedback with amplifier
A
■ Oscillator gain: AWF =
1−βA
○ Types of Oscillators
■ Feedback Oscillators 3. Clapp Oscillator - similar to Colpitts
● Amplifier circuit: to sustain oscillation Oscillator, however the single inductor in
● Wave shaping network: to adjust the shape Colpitts is replaced by a series LC-
and frequency of signal connection
○ LC to Resonance ○ 3 Capacitors and 1 inductor
○ RC circuits ○ The LC series improves frequency
○ Crystal oscillators stability (than Colpitts) and eliminates
transistor parameters on operation of
circuit
1
○ f R=
2 π √ L1 C T
1 1 1 1
■ = + +
Ceq C 1 C2 C 3
2. RC-Phase Shift Oscillator: uses property of
RC filters to cause a phase-shift, and by
using multiple filters, a feedback circuit with
exactly 180o phase shift can be produced
○ In circuit, each stage produces 60o phase
shift
○ Used for low frequency
Rf
○ A=−29 ¿−
Rs
1
4. Armstrong Oscillator - composed by 1 ○ f R=
transformer and 1 capacitor 2 πRC √ 6
● Microelectronics Fundamentals
○ Microelectronics - field of electronics that utilizes ○ Integrated circuit (IC): a miniaturized electronic
tiny/micro components to manufacture electronics circuit that has been manufactured in the surface of a
○ History of Microelectronics thin substrate of a semiconductor material
■ 1925: Vacuum Tube Era ■ Also called microcircuit, microchip, Silicon chip,
● Vacuum tubes were used for radios, TV, or chip
telephone equipment, and computers but ■ Consisting mainly of semiconductor devices as
they were expensive, bulky, and fragile, and passive components
energy-hungry ■ integration of multiple tiny MOS/FET transistors
● ARPANet (product of National Defense of into a small chip
US) uses vacuum tubes ● FETs are mostly used because it can act as
■ 1947: Point Contact Transistors both resistor and capacitor (for a circuit)
● Made by Big 3: Walter Brattain, John ● Also because of its small size and fast
Bardeen, and William Shockley (Bell Labs) switching speed
● Marks the start of microelectronics era ■ Advantage: Cost, compactness, high speed, low
■ 1949: BJT Bipolar Junction Transistor power requirement, reliability, ease of
● Made by William Shockley of Bell Labs maintenance, modular construction
■ 1952: Bell Labs patents Transistor Technology ■ Disadvantage:
● Bell Labs technology symposia and ● Inductors are impractical: Devices using ICs
licensing of transistor patents encourages must generally be designed to work w/o
semiconductor development inductors. Fortunately, RC oscillator circuits
■ 1954: Texas Instruments makes moves are capable of doing most things that LC
● Texas Instruments produced the first circuits can do. Thus ICs do not contain
commercially-available silicon transistor inductors
■ 1958: Jack Kilby’s IC ○ ICs need to be small but inductors are
● He produced a microcircuit with both active bulky because of the loops and wounds
and passive components fabricated from but
semiconductor materials (Germanium) ● Megapower is impossible: More power
○ He called it “Solid Circuit” means more heat, but ICs can only handle so
○ Has 2300+ transistors inside of it much heat
● This marks the start of IC era ○ Component Density (Note: the more transistors or
● Jack Kilby gates/chip, the greater the processing power)
○ Father of Integrated Circuits ■ Small Scale Integration (SSI): <12 gates/chip
○ from Texas Instruments as part of RND ■ Medium Scale Integration (MSI): 12-100 gates
team per chip
○ Initially from US Air Force ■ Large Scale Integration (LSI):100-100000 gate
■ 1958: Robert Noyce’s IC per chip
● He produced an IC made up of silicon which ■ Very Large Scale Integration (VLSI): 100,000-
is more thermally stable than Germanium 1M gates per chip
○ 6 months after Jack Kilby’s IC ■ Ultra Large Scale Integration (ULSI): >1M gates
● Robert Noyce: from Fairchild per chip
Semiconductor (rival of Texas Instruments) ○ Types of ICs
○ Apollo 11’s circuitry is made from ■ Linear/Analog IC
Robert Noyce’s IC which made ● Inputs and outputs can take on range of
Fairchild Semiconductor boom values and output are proportional to input
■ 1965: Moore’s Law ● Used in space, vehicles, radars,
● Moore’s Law: The no of transistors on a oscilloscopes, etc.
microchip doubles every 2 years though the ■ Digital IC
cost of computers is halved/maintained ● Input and output are limited to high (1) and
○ This applies until the year 2018 low (0) only
● Made by Gordon Moore ● Used in microprocessors, computers, digital
■ 1971: Intel 4004 watches, calculators, etc.
● This is the First Microprocessor ■ Mixed IC
● Moore-Noyce created Integrated Electronics ● Combination of analog and digital IC in one
or Intel (Gordon Moore & Robert Noyce) IC
● It has the same capability as a 3000 ft3 ● Used for analog-to-digital conversion and
ENIAC vice versa, or clock/timing ICs
■ 1978: Intel 8086 - first 32 bit Micrprocessor ○ Types of ICs based on manufacturing
○ Note 8086 → x86 processing system ■ Film ICs
(same OS as 32-bit system) ● Passive components (e.g. resistors) are
■ 1989: Intel 486 - First Microprocessor with 1 integrated but the diodes and transistors are
Million transistors
● connected as separate components to form a ● The active, passive and interconnections
single and complete circuit between them are formed on a silicon chip
● Combination of integrated and discrete ● Mono: built on a single crystal
components ● Most common type of IC because of
■ Monolithic ICs reliability and low cost
■ Hybrid ICs 4. Dope the silicon wafers with impurity ions (Ion
● Also called multi-chip IC implantation
● More than 1 individual chips are connected ● Mask the wafer using photoresistive layers
on a single chip then bombard the wafer with a beam of ions
○ Active components: diffused transistors 5. Dielectric deposition: add multiple layers of
and diodes dielectric one atomic layer at a time
○ Passive components: diffused resistors ● This reduces leakage current from gate
or capacitors terminal to the channel itself
● Connected by metallized patterns 6. Photolithography: used in microfabrication to
● Used for high-power applications (5-50 W); pattern parts on a thin film or the bulk of a
better performance than monolithic IC substrate/wafer
● also called optical lithography or UV
○ How ICs are made lithography
1. Extract Silicon (Si) from sand then purify it ● uses light to transfer a geometric pattern
● Sand has a high percentage of silica (SiO2) from a photomask/optical mask to a
2. Covert the purified Silicon to molten state by photosensitive (light-sensitive) area on the
Czochralski process substrate
● Czochralski process: a method of crystal ○ where essentially etching/printing of the
growth used to obtain single crystals of circuit for IC happens
semiconductors (e.g. Si, Ge and GaAs), 7. Metal deposition: form a pool of melted metal on
metals (e.g. Pd, Pt, Ag, Au), salts and the surface of a metallic substrate into which
synthetic gemstones metal powder is injected using a gas stream
3. Slicing into Silicon wafers ○ Some ICs
● Cut using diamond sawblades into 12in ■ 7400 IC: has four 2-input NAND gates
diameters ■ 7411 IC: has three 3-input NAND gates
○ Computer Parts
[See ELEC: Microprocessors]
● OP-AMP
○ Op-amp: Operation-Amplifiers
■ 3-terminal linear devices that are used to amplify
signals
■ Used in signal conditioning, filtering, oscillators,
and instrumentation
■ input: (V+, V--) and output Vout
■ ideal for DC
| |
A differential it’s currents
○ CMRR=20 log I ¿(off )
A commonmode ○ I B 1∧I B 2 =I ¿(bias) ±
2
● The higher, the better (∞ for ○ The midpoint of IB1 and IB2 is the input
ideal op-amp) thus Acm must be as bias current, and the range of IB1 and IB2
low as possible to reduce noise is the input offset current
● Note: VC: common mode voltage
ACVC: noise voltage
■ Output voltage:
● For ideal op-amp: V o =A d ¿
● For practical op-amp: V o =A d ¿
○ Ad: differential gain,
○ Acm: common-mode gain (finite value
for practical op-amps)
■ Power Supply Rejection Ratio (PSRR)
● ratio of the change in supply voltage to the ■ Input offset voltage: differential DC voltage
equivalent (differential) output voltage it required between the op-amp inputs to force the
produces differential output (V+-V-) to 0 V
● ability to reject noise or ripple occurring at ● Also defined as the input voltage that would
the input side due to the change in input produce the same output error voltage in a
offset voltage with respect to the change in perfect differential amplifier
power supply voltage V error
○ ● V offset =
Ad
( )
2 2
ΔV Supply A V ■ Maximum peak-to-peak (MPP): maximum peak-
PSRR (dB)=10 lo g 10 2
dB
ΔV Out to-peak output of the amplifier without clipping
(twice the supply voltage)
ΔV ¿(offset ) Ideal: MPP=2V CC =2 V EE
○ PSRR= (if unitless)
VS Real:
■ Slew-rate: maximum rate of voltage change that MPP=2(V CC −0.7 V )=2(V EE−0.7 V )
can be generated by the op-amp’s output ■ Unity gain frequency/Unity gain Bandwidth
circuitry ● Frequency of a signal at which the voltage
Δ V o A CL V ¿ gain is 1.
● Slew rate = = =2 π f max V p ● GBP= Aopen−loop f cutoff where
Δt Δt
where GBP: Gain-Bandwidth Product
○ fmax: highest undistorted frequency
○ VP: peak value of output sine wave ○ Operational Amplifier (Basic Parts)
■ Differential Amplifier: V ¿ =V d =V +¿−V −¿¿ ¿
■ Voltage Amplifier: A V ¿ =V o
■ Push-pull Amplifier −¿ −¿−0
V
● A power amplifier that is used to supply V out − ¿= V ¿→
high power to the load. It consists of 2
Rf Ri
transistors in which one is NPN and another Rf −¿¿
is PNP. One transistor pushes the output on V out =(1+ )V
Ri
a positive half-cycle and the other pulls on a
I+ = 0. Using KCL:
negative half cycle. +¿ +¿ +¿
○ Ideal op-amp analysis (golden rules) V V V
V 1− ¿ + V 2− ¿ + V 3− ¿
■ I −¿=0 ¿ and I +¿=0 ¿ R1 R2 R3
■ V −¿=V =0
¿ (inverting
and non-inverting input are
+ ¿¿
■
● ACL=1 → Vo = Vin
Summing amplifier (adder op-amp)
V out =¿ (1 +
Rf
Ri (
) RT
V 1 V 2 V3
+ +
R1 R2 R3 )
● The sum between the voltages is amplified
● Inverting Summer:
Vo R
=- f
If one input only: ACL =
V¿ R¿
V V V
(
ACL=¿ - R f 1 + 2 + 3
R1 R2 R3 )
If there is a series resistor along the non-
inverting input (such as the image above),
use Superposition theorem:
+¿ ¿
V = V1¿
■ Subtractor Op-amp amplifier
● The difference between the voltages is
amplified
V
● Non-inverting Summer: ● By voltage division:
(
+¿=
R2
R1+ R 2)V 2¿
■ V o =(V 1−V 2)
(
R 2 −R f
R1 + R2 Ra )
Use KCL: I- = 0 thus IRf = IRi ■ Schmitt Trigger
● circuit that adds hysteresis to the input-
output transition threshold with the help of
positive feedback
○ Hysteresis: two different threshold ○ Take the integral of the input, then
voltage levels for rising and falling edge divide by negative RC
(Vth+ and Vth-) ● We use a capacitor for the feedback mainly
○ Hysteresis is desirable in Schmitt for the steady state error to be made zero.
Trigger because it prevents noise from Until Voutput does not match with Vreference, the
causing false triggering capacitor charges or discharges to change
● Essentially a a Bi-stable Multivibrator: its output voltage value so as to match load
output remains in either states indefinitely. voltage value with reference voltage
For the output to change state, the input ■ Op-amp Differentiator: Output is proportional to
signal must change (or trigger) appropriately the change in applied voltage
● the feedback occurs on a resistor and the in-
series element is a capacitor (High-pass)
● Effects:
○ Input Square wave becomes spikes
○ Input Triangular wave becomes
rectangular
○ Input Sine wave becomes cosine wave
■ Op-amp Integrator
● The feedback occurs on a capacitor and the
● V o =− ( ddtV ) R C
i
f
■ Ammeter
● Measures current in series (in a cut)
● An ammeter only has a range of values it
can read for a circuit
○ Anything greater than this and the
ammeter will break
● Can be made using a galvanometer in
parallel with a low resistance (Ammeter
shunt)
● Ammeter Shunt: a resistor RSh in parallel
with the meter which increases the
maximum current that the ammeter can take
○ It allows for measurement of a wide
range of currents
○ The lower the shunt resistance RSh, the
the greater the range of the ammeter
readings, but the more sensitive the
ammeter becomes
Rm
○ R s h=
m−1
● Ayrton Shunt:
○ uses a manual selector to choose the
appropriate resistor network
■ Used for ammeters with various
levels of sensitivity (while still
having a large range of values)
● Ideal ammeter is…
○ Zero resistance
○ High sensitivity
○ Ayron shunt with a wide range of values
■ Voltmeter R¿
● Measures voltage in parallel ○ Deflection factor: D=
R¿ + R U
● Has a resistor in series which limits the
amount of current passing through RIN: input resistance
RU: unknown/measured resistance
■ Measured from left-to-right, thus
the greater the measured resistance,
the less deflection
● D=1: short-circuit (no resistor
added)
● D=0: open circuit (probes are
not connected)
● Some notes
● Voltage goes directly to PMMC (RM) ○ The ff. may cause a major error in an
● Ideal Voltmeter has… ohmmeter reading:
○ Infinite input impedance (so no current ■ A small voltage between points
comes through) or large internal under test.
resistance ■ A slight change in switchable
○ High sensitivity internal resistance, or
● Some notes: ■ A slight error in range switch
○ When troubleshooting with an ammeter selection
or voltmeter, start with the highest scale ■ A small change in the resistance to
and adjust down to a lower scale be measured will NOT cause a
■ Meters have logarithmic scale. major error in an ohmmeter reading
Thus values have greater difference
in the last ⅓ of the scale than in the
first ⅓ of the scale.
■ The pointer is most accurate in the
last one-third of the scale.
○ VU Meter: Volume Unit meter
■ Also called Standard Volume
indicator (SVI)
■ A VU meter is essentially a
voltmeter calibrated to give a
reading of 0VU when fed with a ● Loading Error: error in measurement caused
sine wave tone by the meter exerting extra load into the
■ a device displaying a representation circuit it’s attempting to measure
of the signal level in audio
equipment ○ AC Meters
■ Measures sound, decibels, power ■ AC Voltmeters
● Measures AC voltage using a DC voltmeter
■ Ohmmeter by using a rectifier (half-wave or full-wave)
● Measures resistance and measuring the ripple
● Basic Ohmmeter circuit: ○ Since voltage cannot go directly to
○ When a resistance is measured, the PMMC
current will vary
○ Varying the potentiometer can be done
to get a more accurate reading on the
resistance
● Peak-detector circuits
○ AC voltmeters that detect the peak
● Ohmmeter markings: value of an AC sinusoidal wave
○ Rightmost side: No resistor is added to ■ Uses only a diode and a capacitor
ohmmeter circuit: 0Ω (short circuit) ■ Negative peak can be obtained by
○ Midscale: resistor is equal to reversing the direction of the diode
potentiometer inside
○ Leftmost side: no current
gets through: ∞ ohms (open
circuit)
● The meter movement in an illumination
meter measures current
■ Logic Probe: best for checking a TTL logic
circuit (not DMM or Voltmeter)
■ The general approach used by automated
computer test equipment is providing a standard
○ Used for large AC signals stimulus to each portion of the computer and
○ Simple peak detectors have voltage verifying the response and repeating for all parts
drops. To accurately measure the peak, of the system under test
use a precision rectifier (super diode) as
it behaves as an ideal diode ○ Safety protocols
■ Voltmeter and Ammeter
● Shorting the terminals of a VOM (voltmeter)
can cause burns, fire, or an explosion
■ When measuring high voltages with a voltmeter,
ensure that the voltmeter and leads are rated for
use at the voltages to be measured
■ When repairing circuit board assemblies, it is
most important to wear safety goggles
○ Digital Multimeter ■ When soldering or working with CMOS
■ a test instrument used to measure electrical electronics products or equipment, a wrist strap
values including voltage, current and resistance must have less than 100,000 Ω of resistance to
■ include functions enabling measurement of prevent static electricity
capacitance, frequency, continuity (with a buzzer ■ Preferred method of cleaning solder from plated
to facilitate easy measurements when looking at through circuit board holes: using a vacuum
the circuit board), temperature, and transistor device
functionalities ●
■ ½ digit on a DMM: a partial extended accuracy
on lower part of the range
● It is NOT a smaller physical readout on the
left side of the display
○ Electrostatic Meter
■ measure voltage, field, and charge without
transferring the static charge to the instrument
● sense the presence of a charge on the surface
of an object
● eliminate the need to modify parameters due
to changing loads
■ Advantage: it can detect AC voltages
○ Other devices
■ Oscilloscope
● The oscilloscope is used to display electrical
signals in the time domain
● CANNOT measure velocity of light with the
aid of a light emitting diode
● CANNOT measure energy
■ Spectrum Analyzer
● Spectrum analyzer is used to display
electrical signals in the frequency domain
■ A typical frequency counter is usually accurate to
6 digits or more.
● It has a digital readout
■ Thermocouple: Gets warm when current flows
through it
■ Utility meter: a device that measures the amount
of electric energy consumed by a residence, a
business, or an electrically powered device
● A utility meter’s motor speed works directly
from the number of watts being used at the
time
● Utility meter readout unit: Energy
■ Illumination meter
● Also called Lux/Light meters
○ Used to measure amount of light
● Tests and Measurements: DC/AC Bridges ● A modified Wheatstone bridge used for
○ DC Bridges: used for measuring the unknown finding resistances below 1Ω
electrical resistance ○ Because of the low resistance value, it
■ Notes on DC Bridges: takes into consideration the resistance of
● Bridge circuits rely on rely on sensitive null- the leads that connect the elements
voltage meters to compare 2 voltages for ● Makes use of a movable lead placed at an
equality arbitrary location
○ To achieve balance: the detector current
R1 R3
must be 0 or =
R2 R4
■ Wheatstone Bridge
● Bridge network that could be used to find
small changes in resistance
● Uses 2 resistors, a potentiometer, and the
element to be detected
R1 R3
● Bridge balance: = or R1 R 4 =R 2 R3
R2 R4
○ Vo = 0 (element to be detected)
● Note: if there is a degree of uncertainty for
the resistances (e.g. R1 = 500 ± 0.5% Ω), the ● Operation:
percentage limiting error for the unknown ○ Forms a Wheatstone Bridge from the
resistance will be the sum of percentages of wires (Faulty cable, Sound cable,
the known resistances Galvanometer, potentiometers)
○ E.g. The known resistances are correct ○ When the bridge is balanced (such that
to ± 0.2%. Accuracy of unknown the galvanometer reading is 0) by
resistance: ± 0.6% (just multiple by 3) adjusting the potentiometers R1 and R2:
■ Slide-Wire Bridge
R1 Rg+ Ry
● Also used for finding unknown resistances ■ = or
but using high precision resistors and R2 Rx
resistive wires R 1+ R 2 R g + R y + R x
● Called so because it makes use of a sliding =
contact connected to a resistive wire R2 Rx
● Operation: ■ If r is the resistance of each cable,
○ As the sliding contact is moved, the then we get R x + R y + Rg =2r
voltage within the wire is changed (due R2
to division of voltage) ● R x= (2 r )
○ The variation is done until the bridge is R 1+ R 2
balanced, which can be used to measure ■ Since the resistance is proportional
the resistance (in terms of the ratio with to the length of the cable:
the precision resistor) R2
● L x= (2 l)
R1 + R2
○ When the bridge is balanced, the ratio
between the potentiometer values R1
and R2 are noted and turned to finding
the distance of the Earth fault (Lx)
■ Varley Loop
● Same operation as the Murray loop but uses
fixed resistors for R1, R2. A potentiometer S1
is inserted in the Faulty cable
■ Kelvin Bridge
● Uses a capacitor in parallel with a
potentiometer on the opposite side of the
RL-series
○ In the diagram: Z1 Z x =Z2 Z 3
● Operation:
○ Switch K is initially connected to 1
(GND) then the potentiometer S1 is
adjusted such that the meter reading is
R1 Rg+ Ry
0. Thus, =
R 2 R x+ S 1
■ If we let R3=R g + R y, then ■ Hays Bridge
● Also called Opposite Angle Bridge
R (R + R )−R1 S 1
R x= 2 3 x ● Used to find inductance and resistance in
R 1+ R 2 coils and for coils where resistance take up
○ When K is switched to position 2 and only a small part and has a Q-factor greater
the bridge is balanced by varying S than 10
(assume a value S2), then ○ If Q>10, then the circuit has a high
■ R1 S 2=R2 ( R3 + R x ) inductance and low resistance
● preferred for the measurement of inductance
○ If we put this in the first equation (when
having high Q-factor
K was in position 1), then we have
R1 ● In the diagram: Z1 Z x =Z2 Z 3
■ R x= ( S −S ) and
R 1+ R 2 1 2
Rx
■ L x= where r is the resistance of
r
the cable per meter
○ AC Bridges: AC BRIDGE
■ Introduction to AC Bridges:
● All AC Bridges are similar in construction to
Wheatstone Bridge
● Note: Impedance in AC is complex ■ Wien Bridge
● Balanced bridge: Product of opposite ● Used for measuring capacitors or for
branches (with respect to the detector) detecting frequencies
should be equal ● Resonant frequency is set by the capacitance
■ R ± jX (positive X: inductive, and resistance values in the circuit
negative X: capacitive) ○ In the diagram: Z1 Z 4=Z 2 Z3
○ Sum of Phase angles of opposite legs is
constant: θ1 +θ 4=θ2 +θ 3
■ Similar Angle Bridge
● Also known as Capacitance Comparison
Bridge
● Bridge network used to measure the
capacitance of a capacitive circuit
○ Involves a series-RC on the opposite
side of the capacitor we are measuring
○ In the diagram: Z1 Z x =Z2 Z 3
■ Maxwell Bridge
● Used to find the value of unknown
inductance
● Energy Conversion: DC Generators
■ Schering Bridge ○ Energy Conversion: change in energy from one form
● Used for measuring capacitors and their to another
insulating properties when the phase angle is ■ Also called Enercon (ENERgy COnversion) (see
nearly 90o (almost purely reactive, Energy Conversion: DC/AC Motors for the parts
capacitive, inductive and almost no of a motor)
resistance) ○ DC Generators: convert mechanical energy to
electricity in the form of DC current
■ Works based on principle of Faraday’s law
■ The conductor is present within a closed lane; the
induced current will flow in the lane and in the
DC generator, field coils will generate an emf as
well as the armature conductors are turnd into the
field. Thus, an electromagnetic induced emf will
be generated within the armature’s conductor and
the path of induced current, provided by
Fleming’s right-hand-rule.
2 pΦNZ
○ Notes on Bridges ○ emf = [both for motors/generators]
■ Bridges can measure Resistance, Resistance & c
Capacitance, and Resistance & Inductance. ■ Z: no of conductors
However, it cannot measure all 3 parameters at ■ Φ: flux per pole
the same time ■ N: no. of rotations (rev/s)
■ P: no. of PAIRS of poles
■ c: no. of parallel paths through the winding
between positive and negative brushes
(dependent upon winding type)
● Lap winding: clap = 2p
Wave winding: cwave = 2
○ Armature winding classifications
■ Lap-winding: winding in which successive coils
overlap each other;
Lap Winding Simplex and Duplex Lap Winding
● the finishing end of one coil is connected to
one commutator segment and the starting
end of the next coil situated under the same
pole and connected with same commutator
segment
○ clap = 2p (p: no of pairs of poles)
● Advantages and disadvantages:
○ Used in applications of high current and
low voltage (E.g. dynamo, welding
generator machine)
■ Parallel coils/paths = higher
operating current
○ Less emf compared to wave winding.
To give same emf, it requires more
windings which will cost more
○ less efficient utilization of space in the
armature slots
● Types
○ Type 1: Simple Lap Winding: the
number of parallel path between the
brushes is equal to the number of poles
○ Type 2: Duplex Lap Winding: the
number of parallel path between the
brushes is twice the number of poles
to be possible
Y =±m
C
Commutator
m = 1: simple lap winding Y C =2(always)
Pitch (YC)
m=2: duplex lap winding
● Series-Wound Generator
○ Field winding is connected in series
with armature winding thus the full
Lap winding Wave winding current is carried by the field winding
Resultant ○ Using KCL: I a=I =I f
Y R=Y B−Y F =2m Y R=Y B +Y F
Pitch (YP) ○ Using KVL: E=V + I (R a + Rf )
Average Pitch Y B +Y F Z Y B +Y F Z ±2
(YA) Y A= =Y P= Y A = =
2 P 2 P
Must always be an
integer for the winding
● Ia2Ra: armature losses
● IfV: shunt winding losses
● C: iron, friction, and windage losses
■ Stator
● the stationary part of the motor -- this
includes the motor casing, as well as two or
more permanent magnet pole pieces
○ External magnetic fields is usually
produced by high-strength permanent ● Conductors are placed in slots over the
magnets drum-shaped armature surface and
○ “Stat”or → Stationary connected to one another by front and back
■ Field Magnets: part of a generator that produces connections at coil ends
the magnetic field ● Parts can be preformed and insulated thus
● Part of the stator less cost
■ Axle: center of rotation ● Voltage induced is larged because each
■ Brushes winding placed on the armature slots
■ Commutator: a ring attachment, connected to surrounds the entire core
the armature of a motor or generator, through ○ DC Motors
which electrical connection is made and which ■ Types of DC Motors by their Field Excitation
ensures that the current flows as DC ● Note: The DC Motor circuits are the same
● Connects to the brush contact which circuits as the Separately Excited Generator,
connects to the supply except the current is now flowing into the
● Its purpose is to change the direction of the mechanical part/ Armature device (Ia)
current to the rotor as it spins (to ensure DC instead of flowing out of the Armature
flow) device
■ Rotor/Armature: ● Separately Excited Motor
● the component of an electric machine which ○ The presence of a separate DC Supply
rotates and carries AC as the Exciter makes it much costlier
○ “Rot”or → Rotates ○ By KVL: Eb =V −I a R a where
● Produces the EMF Eb: back emf [unit: V]
V: load voltage [unit: V]
Ia: armature current [unit: A]
Ra: armature resistance [unit: Ω]
■ By KVL: Eb =V −I a R a−I R s
■ By KCL: I =I a + I f
■ Speed Regulation:
● The percentage rise in the speed of the motor
when the mechanical load is removed
■ Self-Excited Motor ● Important factor for DC motors
( )
● Shunt Wound Motor N NL −N FL
● By KVL: Eb =V −I a R a ○ % N reg =¿ x 100%
N FL
where
N: speed (FL: full load, NL: no load)
○ AC Motors
■ Synchronous Motor vs Asynchronous Motor
● Asynchronous: also called Induction Motor
Synchronous Motor Asynchronous Motor
Type of Single Excited
Doubly Excited Machine
Excitation Machine
armature winding is
energized from an AC stator winding is
Supply
● Series Wound Motor source and its field energized from an
System
○ Entire Armature current is equal thus it winding from a DC AC source.
creates faster speed (for the motor) source
■ Thus, high initial torque for DC 120 f
Rotor Sr =S s = Nr< N S
Series motor Speed Sr p
○ By KCL: I =I a (no load RPM)
○ By KVL: Eb =V −I ( Ra + R s) Needs additional power Does not need
Additional
source to initially rotate additional power
power
the motor to NS (not self- source (self-starting
source
starting) torque)
Slip rings
Required Not required
and brushes
Cost More costly Less Costly
Motor
Speed with Constant speed all Decreases with
respect to throughout increasing load
load
can be operated with operates only at a
● Compound Motor lagging and leading lagging power factor;
Operation
○ Long Shunt Motor power by changing its which becomes
■ By KCL: I =I f + I a excitation poorer at high loads
■ BY KVL on right loop: can be used for power
factor correction in used for driving
Eb =V −I a (R a+ R s )
Usage addition to supplying mechanical loads
torque to drive only
mechanical loads
Efficiency More efficient Less efficient
■ AC Motors based on Induction Motor types (note
that these are both Asynchronous motors)
Single-phase Induction 3-phase Induction
motor motor
Supply Single-phase supply 3-phase supply
Starting
Low High
torque
○ Short Shunt Motor Power
Low High
factor
Repairs Easy to repair Difficult to repair ■ For the same size, the single-phase induction
Simple in construction, Complex in motors develop about 50% of the output as that
Cost and of three phase induction motors
reliable and economical construction and
construction ● Thus they are less efficient
(less costly) coxstly
Efficiency ● Thus they are less reliable
Less efficient More efficient ■ The speed of a DC motor is directly proportional
(η)
Mostly used in domestic to back emf and is inversely proportional to flux
Mostly used in Eb 1
Application appliances (e.g. grinders,
industrial processes per pole. Because Eb = V - I → Sr ∝ ∝
fans, compressors) Φ I
ELEC: Industrial Electronics III
● Filters: Introduction ■ Usually the combination of the magnitude plot
○ Filters: circuits capable of passing (or amplifying) (frequency) and the phase plot (phase shift)
certain frequencies while attenuating other ■ Separated into 2 areas:
frequencies ● Pass-band: frequency range which ar
■ can extract important frequencies from signals unaltered or receive little to no attenuation
that also contain undesirable or irrelevant ○ Also represents the Bandwidth of the
frequencies signal
■ Filters can also affect the phase of the signal ● Stop-band: frequency range that are greatly
(i.e.g phase shift) attenuated
■ Used in the following areas: ■ Cut-off point fC
● Radio comms: Filters enable radio receivers ● Also called Corner frequency or Breakpoint
to only "see" the desired signal while frequency or -3dB point
rejecting all other signal ● Frequency point wherein R=X C resulting
● Power supplies (see Power Supplies: Filter) to a gain of -3dB (20 log (Vout/Vin)) or
● Audio electronics: A crossover network is a 70.7% of the input signal value
network of filters used to channel low- ○ Thus the output is not half of the input
frequency audio to woofers, mid-range signal
frequencies to midrange speakers, and high-
frequency sounds to tweeters ● Low-pass Filter (LPF)
● Analog-to-digital conversion: Filters are ○ Low-pass filter (LPF)
placed in front of an ADC input to minimize ■ Passes frequencies lower than its cutoff
aliasing frequency fC and attenuates/stops frequencies
○ Kinds of Filters higher than it
■ Passive filters: ■ Also called high-cut filter, treble-cut filter (audio
● Includes only passive components: resistor, applications)
capacitor, inductors, etc. and have no ■ Output is obtained across:
amplifying components ● For RC: across capacitor (As f increases, XC
● the output signal has a smaller amplitude gets lower so no signal passes)
than its corresponding input signal because ● For RL: across resistor (As f increases, XL
of the passive design (i.e. gain is less than increases, so greater voltage is across L and
unity) no voltage is across R at high f)
○ this is for all passive RC filters ○ Passive RC Low-pass filter
● Most responsive to frequencies ranging from ■ Made using simple RC for low frequency
100Hz-300MHz applications (f < 100kHz) and made using RLC
● At lower frequencies, the inductance or circuits for high frequency applications (f >
capacitance would have to be quite large 100kHz)
● upper-frequency limit is due to the effect of
parasitic capacitances and inductances
■ Active filters:
● uses active components (op-amps,
transistors etc.) thus having amplifying
components
● in addition to resistors and capacitors, but
not inductors)
√ ( ) √ ( )
2 2
f f
1+ 1+
○ RC Integrator
fc fc
■ essentially a Low-pass filter circuit operating in where f: input frequency
the time domain that converts a square wave fC: cutoff frequency
“step” response input signal into its integral: a V out
triangular shaped waveform output ○ At very low frequency f<fC: ≃ AF
■ Output is formed due to the capacitor’ charges
V¿
and discharges V out A F
○ At cut-off frequency: f=fC: =
■ if τ =RC is is long compared to the time period V ¿ √2
T of the input, the output will be triangular in V out
shape ○ At very high frequency f<fC: > AF
● the higher the input frequency the lower will V¿
be the output amplitude compared to that of ■ after ƒC the gain decreases at a
the input constant rate as the frequency
■ Can be made using Op-amps (active filter) or increases (when the frequency is
simple RC filters (passive) so long as the input is increased tenfold [one decade], the
a square-wave voltage gain is divided by 10)
1
■ Cut-off frequency: f c= (fC→ ∞)
2 πRC
● In practice, the filter response does not
extend to infinity but is limited by the
electrical characteristics of the components
used
■ Phase-shift:
Φ=tan−1 (
1
2 πfRC
)=tan−1
1
ωτ ( )
● Phase angle of the output leads that of the
input as the frequency gets higher
● Phase shift is equal to +45o at frequency ƒC
● AV =
V out
=
AF
( f )
f
C
order filters only
■ Even-order: consists of only second-order filters
√ (f )
V¿ 2 Odd-order: consists of 1 first-order filter at the
f beginning then fill the remaining with second-
1+
C
order filters
where f: input frequency ■ As the order of the filter increases so to does its
fC: cutoff frequency accuray: the difference between the actual stop
band response and the theoretical stop band
V out response also increases
○ At very low frequency f<fC: < AF
V¿
○ The cut-off or corner frequency of the
LPF is higher than the cut-off frequency
of the HPF
● The output continues at maximum gain until
the higher cutoff frequency fH is reached
where the output decreases at a rate of -
20dB/Decade (6dB/Octave) attenuating any
high frequency signals
● Resonant Peak:
○ Point of maximum output gain and the
geometric mean of the two -3dB points
○ f R =√ f L × f H
1
● Band-pass filter (BPF) ● Cut-off frequencies: f=
○ Band-pass filter (BPF) 2 πRC
■ passes frequencies signals within a certain ● Phase-shift: Since 2nd-order circuit, the
band/spread/range of frequencies without phase-shift will be twice that of the low-pass
distorting the input signal or introducing extra or high-pass filter alone (180o)
noise ○ Since the first subcircuit is a high-pass
● band of frequencies: Bandwidth filter, the phase angle of the output
signal leads that of the input by +90o up
○ BW =f H −f L (higher and lower
to the resonant frequency fR where the
frequency cut-offs) phase shift is 0o [in-phase]
● can be used to isolate or filter out certain ○ Phase shift lags behind the input by -90o
frequencies that lie within a particular band as the output frequency increases
or range of frequencies because the 2nd subcircuit is a low-pass
filter
○ Passive Band-pass filter ○ Buffering Individual Filter Stages
■ can be made by connecting together a low pass ● In practice, the input reactance of the high-
filter with a high pass filter pass subcircuit would affect the frequency
● High-pass filter first then low-pass filter, so response of the low-pass subcircuit
the output is obtained across the capacitor of (components connected in series or parallel)
the low-pass filter and vice versa
● Thus they are 2nd-order filters because of ● Thus a buffer can be used to isolate the two
the presence of two reactive components subcircuits
■ Bode-plot characteristics:
● signal is attenuated at low frequencies with
the output increasing at a slope of
+20dB/Decade (6dB/Octave) until the lower
cutoff frequency fL is reached
■ In the picture above: this is a Band-Pass Filter
(even if the low-pass filter and high-pass filter
segments are not easily seen) ○ Band-stop filter → Divider
● BPF: output is taken across the resistor ○ Active Band-stop filter
● This is a Series RLC circuit
○ Languages
■ High-Level language: program statements are
NOT closely related to the internal
characteristics of the computer
● E.g. coding languages (Python, C++, etc.),
Assembly Language (JMP, BRK, etc.)
■ Low-Level language: program statements closely
related to internal characteristics of computer
● Machine Code/Binary language (1s and 0s)
○ Microcontrollers
■ A single Integrated circuit (IC) that is
typically used for a specific application and
designed to implement certain tasks
○ Microprocessors vs Microcontrollers:
Microprocessor: memory and I/O output
component is connected
externally
Microcontroller: memory and I/O output
component is connected
internally
Microprocessor Microcontroller
Connected externally Connected internally
High cost Cheaper
(due to requirement of extra (components are readily available
components) in the controller)
High Power consumption and
Less power consumption
dissipation
Clock speed: above 1 GHz 20 MHz−120 MHz
Have integrated Math Coprocessor No math coprocessors
(can easily do float-point (needs softwares to perform float-
calculations) point calculations)
Intended for general applications Made for specific applications
● Electronic Control Systems
● Galvanometers to Ammeter and Voltmeter
○ Galvanometer to Ammeter
■ https://circuitglobe.com/galvanometer.html
■ Connect a low resistance (called shunt resistor) in parallel with the galvanometer
○ Galvanometer to Voltmeter
■
● Logic System
○ 2 Types: Combinational Logic and Sequential Logic
○ Combinational Logic Circuits
■ Output is based purely on the combination of its
input (memoryless)
■ Half-adder: adds 2 numbers and produces a Sum
bit and a Carry bit as the output
■ Boolean Postulates/Laws:
Postulate/Law Using OR (+) Using AND (•)
Structure is closed Structure is closed with
Closure
with respect to + respect to •
Commutative x + y= y + x x ∙ y= y ∙ x
x ∙( y+ z) x +( y ∙ z)
Distributive
¿(x ∙ y)+(x ∙ z) ¿(x + y )∙(x+ z )
Complementary x + x '=1 x ∙ x '=0
Idempotent Law x + x=x x ∙ x=x
Annulment Law or
Domination Law
x +1=1 x ∙ 0=0 ■ Full-adder: A half-adder device with a Carry-in
Identity Law x +0=x x ∙ 1=x (cin) as input aside from the 2 numbers added
Involution Law or
Double Negation
(x ' )'=x or ¬¬ x=x
■ Decoder: takes binary input and converts it to
decimal output
■ Full Subtactor: a combinational circuit that
performs subtraction involving three bits, namely
A (minuend), B (subtrahend), and Bin (borrow-in)
It produces two outputs: D (difference) and Bout
(borrow out)
■ Encoder: converts decimal input to binary value ■ Comparator: compares the magnitude of 2 binary
digits
● Only gives one of 3 outputs (A>B, A=B, or
A<B)
● JK Flip-flop (JK: Jack Kilby) a gated SR
Flip-flop that solves the invalid condition
where both S and R are 1
J K Clk Q
0 0 ↑ Q0 (No change)
0 1 ↑ 0
○ Sequential Logic Circuits 1 0 ↑ 1
■ Output is based on input and also on the past 1 1 ↑ Ǭ0 (toggle)
outputs of the logic device (memory)
■ Types:
● Synchronous Sequential: changes in the state
of memory elements are synchronized by a
clock signal
● Asynchronous Sequential: memory elements
and output values change states whenever
there is a change in input value (i.e. not
necessarily with the clock pulse)
○ Also called Self-timed circuits ● D Flip-flop: Output state follows the state of
○ Notes: the D-input (↑: rising edge of clock)
■ Remember that binary is read from right to left ○ Why not just go for a buffer? Because
(LSB to MSB), whilst the counter output is left for a D Flip-flop, it will wait for the
to right. clock cycle before it gets the data
Clk D Q Description
● Logic Devices ↑ 0 0 Reset (Q=0)
○ Latch vs Flip-flops ↑ 1 1 Set (Q=1)
■ Flip-flops: clock-triggered
■ Latch: level-triggered, outputs instantly change
only when inputs change
○ Flip flops: circuit with 2 stable states and can be used
to store state information
■ Building blocks in storing memory
■ Types ● T Flip-flop: Output state toggles each time a
● SR (Set-Reset) Flip-flop clock transition occurs
○ Logic 1 on Set will Set (Q=1) ○ Similar to Inverter but it only toggles
Logic 1 on Reset will Reset (Q=0) during a clock cycle
○ Recall: Flip-flops are with CLK input, Clk T Q Description
but they are essentially Latches ↑ 0 1 Set (Q=1)
○ 2 cross-coupled NOR gate (NOR Latch ↑ 1 0 Reset (Q=0)
if latch) or 2 cross-coupled NAND gate
(NAND Latch if latch)
S R Q Ǭ
0 0 No change
0 1 0 1
1 0 1 0
1 1 Invalid ● Master-slave Flip-flop: combination of 2 JK
Flip-flops in a series configuration with the
slave having an inverted clock pulse
○ The basis for shift registers (since the
Slave follows what the Master says)
● State Machines
○ State Machines: a mathematical abstraction used to
design algorithms. It reads a set of inputs and changes
to a different state based on those inputs.
■ Modulo Counter (MOD counter): counter where ■ 2 Kinds: Mealy and Moore machines
you can set the total number of output states ○ Mealy Machine: output depends on both present state
● counter that resets at a chosen number and current input
S Input S’ Output
S0 1 S1 0
S0 0 S2 0
S1 1 S0 0
S1 0 S2 1
S2 1 S1 0
S2 0 S2 0
● Comparison of Logic
Paramenter RTL DTL HTL TTL ECL MOS CMOS
Basic Gate NOR NAND NAND NAND OR-NOR NAND NOR-NAND
Fan Out 5 8 10 10-20 25 20 20-50
Power Dissipation per Gate 12 mW 8-12 mW 55 mW 10-22 mW 40-55 mW 0.2-10 mW 0.025-1.01 mW
Noise Immunity Medium Good Excellent Very Good Poor Medium Very Good
Propagation Delay 12 nS 30 nS 4 nS 10 nS 1-2 nS 300 nS 70 nS
Clock Rate 8 MHz 72 MHz 4 MHz 35 MHz 60+ MHz 2 MHz 10 MHz
Speed * Power 144 300 ~ 100 100 60 70
Noise Margin 0.4 V 0.2 V 3V
Number of Functions High Fairly High Medium Very High High Low Low