Qualcomm® Snapdragon™ 410E (APQ 8016E) processor Device Specification Introduction

B
H A Memory support
APQ8016
EBI LPDDR2/LPDDR3
Chipset & RFFE I/Fs Processors
ARM Quad Connectivity SDC1 eMMC MCP
Cortex – A53 mP
WGR7640 SPMI
Internal memory
SSBI (4) Serial buses
MIPI_RFFE (5)
SSBI(x2)
Status & control dsc Discrete stat & ctl
dsc Display

MDP
dsc
4-ln MIPI_DSI
GNSS
GNSS ADC RPM Cortex M3 mP
RxLO circuits
GNSS CAMIF timing I2C
Rx circuits

switch
WLAN DACs

BB t/r
Application-specific C 4-ln MIPI_CSI
RF front-end GNSS WLAN ADCs
receiver 2-ln MIPI_CSI external
Air interfaces I2C I2C sources
Qcamera
web cam
SMB1360
GNSS Gen8C Video / VFE
E Battery
GPS, Galileo, many codecs, Qtv, charger
Glonass, Beidou Qcamcorder, system
Connectivity Qvideophone D power

WCN processing Multimedia Input

BLSP (x6)
UART

T
pwr mgt

AR
UIM WLAN / BT / FM Adreno 3D graphics

C
data

I2
I2C
WCN3620 dsc

I
SP
FM Output
FM

SSBI SPI supply

Rx SSBI Audio / codec digital
Rx voltages pwr mgt
FM RF & BB
Support & I/Os

data
Indicators
& clk SD/ Low Power Audio
dsc
MMC extra SPI chip selects User Vibration
BT

Bluetooth (LPA)
WLAN/BT

SSBI
front-end

SSBI F
RFFE

interfaces motor
WLAN / BT RF & BB Rx BB SDC2 Cam flash
(switched)
WLAN

WLAN RF command Audio

WLAN command GPIOs / PWR & GND codec Audio
G devices
Keypad Keypad SPMI IC-level others
I2C power-on
dsc interfaces
HS USB w/ PHY
Internal functions Thermal sensors
PM8916
Dual-voltage UIM (x3) Resource & pwr mgt GP clock & pdm outs General from
clks
hskeeping sensors

debug
Security & QFPROM JTAG/QDSS/ENET
SPI
Other peripherals/sensors I2C Mode/config/resets Clock generation
Accelerometer Pressure Ambient light
Geomagnetic Proximity Haptics
Gyros Temperature Near field comm

Figure 1-1 APQ8016E functional block diagram and example application

LM80-P0436-7 Rev. C MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 10