Parameter Analysis of Different SRAM Cell Topologi
Parameter Analysis of Different SRAM Cell Topologi
net/publication/297893912
Parameter Analysis of different SRAM Cell Topologies and Design of 10T SRAM
Cell at 45nm Technology with Improved Read Speed
CITATIONS READS
4 1,595
2 authors, including:
Nikhil Saxena
University of Cincinnati
22 PUBLICATIONS 74 CITATIONS
SEE PROFILE
All content following this page was uploaded by Nikhil Saxena on 09 September 2018.
Abstract
Read stability and write ability, or SNM (static noise margin) in total, of a SRAM cell
is the effective tool to determine the practicability of the cell. Leakage current, read speed
and read stability are few of the constrained parameters desired for any practical SRAM
cell. The aim of this paper is to analyze the read behaviour of the multiple SRAM cell
structures using cadence tool at 45nm technology and to compare the cells for read
operation while keeping the read and write access time and the supply voltage as low as
possible. In particular, the leakage currents, leakage power and read behaviour of each
SRAM cells are examined . A 10T SRAM cell implementation is proposed here that results
in reduced leakage power and leakage current, at the same time with increased read
stability in comparision with the conventional 6T SRAM cell as well as 7T, 8T and 9T
SRAM cells. As a result, the 10T SRAM always consumes lowest leakage power and
leakage current; improve read stability as compared to the 6T, 7T, 8T and 9T SRAM
cells. This paper is aimed to reduce the leakage power, leakage current and improve the
read behaviour of the different SRAM cell structures using cadence tool at 45nm
technology while keeping the read and write access time and the power as low as
possible.
Keywords: SRAM Cell, Leakage Current, Leakage Power, Read Stability, Low Power
1. Introduction
The proposed SRAM topology in this paper uses a multiple 10T structure that is aimed
to produce faster read operation without disturbing the basic cell [1]. In case of
conventional 6T SRAM, the read operation is performed by asserting the word line high
and accessing the latch by access transistors. Due to static noise the read operation may
lead to disturbance and corruption of the data stored in the cell,
WL
BL M3 M5 BLB
M1 M2
Q
M4 M6
In conventional 6T cell, the read operation is quite a slow process, due to undesirable
time the access transistors takes for activation to access the latch. Delayed read operation
in SRAM does mean time required to respond to a particular operation (read or write)
would be quite large resulting in increased leakage power over this long period of time in
the idle circuit. This reduction in the performance makes the cell objectionable for use in
the practical applications [2].
WL
BL M3 M5 BLB
M1 M2
Q
M4 M6
M7
Also, the static noise margin (SNM) [3, 4] dramatically declines as the supply voltage is
reduced. Reduced supply voltages may lead to data corruption and invalid data sensing
from the cell, which would be an undesirable situation for practical designs. Another
disadvantage of supply voltage reduction is delay in read operation which reduces the
speed performance of the cell. On the other hand higher supply voltage leads to larger
leakage power making the cell again inefficient. In the basic memory element i.e. cross-
coupled inverters, the two nMOS transistors (NM4, NM6) are expected to have more
strength as compared to the access transistors for proper read operation.
In 7T SRAM cell structure an additional transistor placed in the ground path of a 6T
SRAM cell to reduce leakage while the cell is in standby mode. In the standby mode, the
bottom transistor is intended to cut-off the ground path and to eliminate the leakage paths
through the inverter transistor sources but this cell cannot increase the read speed [5].
RWL
WWL
WBL WBLB
M3 M5
RBL
M1 M2
Q
M4 M6 M8
M7
The data stability and functionality of a 6T and 7T SRAM cells mostly depends on the
sizing of transistors. The stability of a 6T and 7T SRAM cells are characterized by the ratio
(β) of the size of the pull-down transistors to the access transistors. Higher β leads to
enhanced data stability at the expense of increased leakage power and larger cell area. To
overcome the problem of data storage destruction during the read operation, an 8T cell
implementation was used, for which separate write/read bit and word signal lines are used
to separate the data retention element and the data output element. Such a cell
implementation provides a read-disturb-free operation [6].
WL
BL M3 M5 BLB
M1 M2
Q
M4 M6
M8 M9
WL M7
For simultaneously reducing leakage power and enhancing data stability a 9T SRAM
cell is used. In a 9T SRAM cell the data is completely isolated from the bit lines during a
read operation. The read SNM of such circuit is thereby enhanced as compared to a
conventional 6T SRAM cell. In an idle 9T SRAM cell, the cells are placed into a super cut-
off sleep mode, thereby reducing the leakage power consumption [7].
However in case of SRAM, switching OFF the circuit does mean losing the data, and
unfortunately it is a compulsion to keep the cell ON even in the idle state. This situation is
a major challenge in reducing the leakage current as we have no option but to keep the
circuit ON. To overcome the limitations mentioned above, the proposed SRAM cell has
been designed with a different read process which reduces the time required to read the cell
and also reduces the chance of data corruption of cell by isolating it from the external read
circuitry [8]. The efficiency of the cell is enhanced by designing it to work with lower
supply voltages, which helps in further reduction of the leakage power.
WL
VDD
PM0 PM1
NM0 Q
Qb
BL NM1
NM2 NM3
BLB
REB
PM2
PM3
Rdout
NM5
RE NM4
In this design, a transmission gate is used for Read purpose. The additional signal REB
is an inversion signal of read word line (WL). It controls the additional transistor PM3 of
the transmission gate [10]. While the WL and REB are asserted and once the transmission
gate is ON, a stored node is connected to Q. Thus a stored value at Q is being transferred to
or read through inverter.
One of the major advantages of this design is that it is not necessary to prepare a
precharge circuit as sense amplifier as required in 6T SRAM cell because the stored value
is directly passed through transmission gate. A charge/discharge power on the Rdout is
consumed only when the Rdout is changed [11]. Consequently, no power is dissipated on
the Rdout if an upcoming data is the same as the previous state. The design reduces a
bitline power in both cases that the consecutive “0”s and consecutive “1”s are read out
[12].
The layout of the new 10T SRAM structure has been designed using Cadence Virtuoso
tool with the aim of minimum area requirement. This makes the cell more efficient in
terms of area as well as power. Figure 6 shows the layout of 10T SRAM cell.
According to the write waveform, Q and QBar (QB) depend on Bit Line (BL) and Bit
Libe Bar (BLB) respectively. When write line (WL) is at high voltage (say, 1 V) then
output Q depends on BL and QB depends upon BLB. The write 1 delay, 120 ps, is less
than the write 0 delay 110 ps in revealed waveforms.
According to read waveform, as the inverter is connected directly with memory element
before the access transistor to make the read operation independent on access transistors
and buffer is connected to inverter output consequently the read buffer is connected to
circuit for robust and fast read operation at low voltage. The read output depends on read
enable (RE) and read enable bar (REB) which are kept at opposite voltages. The interval at
which both WL and RE are high, the read will occur. Hence the circuit becomes
independent of bit lines and gives disturb free read operation. The read delay in the circuit
is 50 ps.
3. Power Consumption
Power consumed in any circuit can be due to a number of parameters like sub-threshold
leakage, temperature and also at larger supply voltage (Vdd) [13, 14]. The 6T SRAM
Cell has more sub-threshold leakage as compared to 10T SRAM Cell due to read-disturb
free circuit. The disturb-free read circuit, connected to output node Q before access
transistor, reduces the delay and leakage throughout the read cycle since the circuit
becomes independent of access transistors and hence does not depend on bit lines.
.
Figure 10. Power Versus Vdd Curve of 10T Cell
During the read cycle high voltage is stored at node Q, the transistor NM4 shows the
leakage since it becomes off. Variation of power consumption with respect to supply
voltage is plotted in Figure 17. The overall circuit leakage power is reduced to 19.09 nW.
The leakage power waveform is shown in Figure 11.
4. Simulation Results
The sim ulation of the 10T SRAM cell is performed with Cadence virtuoso tool at 45
nm technology. Calculation of different parameters is summarized in table 1. Results show
that delay is improved to 13% and power has been reduced up to 36% with disturb-free
read operation. The most important observation of this cell is that the read delay operation
has been reduced up to 54% which can be clearly observed from table I, thus making the
read operation very fast.
Supply
2 700 mv 700 mv 700 mv 700 mv 700 mv
Voltage
19.1
3 Power 16.8 nw 24.4nw 18.1nw 12.1 nw
nw
Figure 12. Waveform for Write Operation of 6T, 7T, 8T, 9T and 10T SRAM
Cells
The SRAM cell here has been simulated using Cadence Virtuoso tool at 45nm
technology. These results are compared with the performance results of the conventional
6T SRAM cell. With the accomplishment of the objectives of the research work, the results
reveal that 10T SRAM cell consisting a read disturb free circuit improves the read delay
and increases the SNM of the cell hence provides better performance and high speed. The
power consumption of 10T structure has also been analyzed by varying the temperature
and supply voltage of the cell which shows stable and desired level of power consumption.
Figure 13. Waveform of Read Operation of 6T, 7T, 8T, 9T and 10T SRAM
Cells
Figure 14. Waveform of Read Operation of 6T, 7T, 8T, 9T and 10T SRAM
Cells
Figure 17. Power Versus Vdd Curves of 6T, 7T, 8T, 9T and 10T SRAM Cell
5. Conclusion
This paper compared the performance parameters of five SRAM cell topologies, which
include the conventional 6T, 7T, 8T, 9T and the proposed 10T SRAM cell
implementations. In particular, the leakage currents, leakage power and read behaviour of
each SRAM cells are being analyzed. The conventional 6T, 7T and 8T SRAM cells are the
most area efficient have least transistor count. However, the leakage power becomes large
and the read stability decreases due to undesirable time the basic latch consumes to read
the cell during read operation, moreover the cell data is prone to corruption due to external
noise. Even though 9T SRAM cell would simultaneously reduce leakage power and
enhance data stability but it shows no much improvement of leakage in comparision to 8T
SRAM cell. To circumvent this problem the 10T SRAM cell design has been proposed in
this research work, in which a dedicated inverter and transmission gate are appended as a
single-end read port. The results show that the 10T SRAM always consumes lowest
leakage power and leakage current; improve read stability as compared to the 6T, 7T, 8T
and 9T SRAM cells.
References
[1] A. Agarwal, Hai Li and K. Roy, “DRG-Cache: A Data Retention Gated ground Cache for Low Power”,
Proceedings of the 39th Design Automation Conference, (2002) August, pp. 473–478.
[2] K. Takeda, Y. Hagihara, Y. Aimoto, M. Nomura, Y. Nakazawa, T. Ishii and H. Kobatake, “A Read-
Static-Noise-Margin-Free SRAM Cell for Low-VDD and High-Speed Applications”, IEEE Journal Of
Solid-State Circuits, vol. 41, no. 1, (2006).
[3] S. Birla, R. K. Singh and M. Pattnaik, “Static Noise Margin Analysis of Various SRAM Topologies”,
IACSIT International Journal of Engineering and Technology, vol. 3, no. 3, (2011).
[4] E. Glocker, D. Schmitt-Landsiedel and S. Drapatz, “Countermeasures against NBTI degradation on 6T-
SRAM cells, Copernicus Publications”, Adv. Radio Sci., vol. 9, (2011), pp. 255–261.
[5] S. Birla, R. K. Singh and M. Pattnaik, “Static Noise Margin Analysis of Various SRAM Topologies”,
IACSIT International Journal of Engineering and Technology, vol. 3, no. 3, (2011).
[6] D.-M. Kwai, “Standby Current Reduction of Compilable SRAM Using Sleep Transistor and Source
Line Self Bias”, IEEE, (2006).
[7] K. Zhang, U. Bhattacharya, Z. Chen, F. Hamzaoglu, D. Murray, N. Vallepalli, Y. Wang, B. Zheng and
M. Bohr, “SRAM Design on 65-nm CMOS Technology With Dynamic Sleep Transistor for Leakage
Reduction”, IEEE Journal Of Solid-State Circuits, vol. 40, no. 4, (2005).
[8] D. Kim, G. Chen, M. Fojtik, M. Seok, D. Blaauw and D. Sylvester, “A 1.85fW/bit Ultra Low Leakage
10T SRAM with Speed Compensation Scheme”, University of Michigan, Ann Arbor, MI USA.
[9] F. Hamzaoglu, K. Zhang, Y. Wang, H. J. Ahn, U. Bhattacharya, Z. Chen, Y. G. Ng, A. Pavlov, K. Smits
and M. Bohr,0 “A 3.8 GHz 153 Mb SRAM Design With Dynamic Stability Enhancement and Leakage
Reduction in 45 nm High-k Metal Gate CMOS Technology”, IEEE Journal Of Solid-State Circuits, vol.
44, no. 1, (2009).
[10] G. Shamanna, B. Kshatri, R. Gaurav, Y. S. Tew, P. Marfatia, Y. Raghavendra and V. Naik, “Process
Technology and Design Parameter Impact on SRAM Bit-Cell Sleep Effectiveness”, IEEE, (2010).
[11] A. Nourivand,, C. Wang and M. O. Ahmad, “An Adaptive Sleep Transistor Biasing Scheme for Low
Leakage SRAM”, IEEE, (2007).
[12] S. Okumura, S. Yoshimoto, K. Yamaguchi, Y. Nakata, H. Kawaguchi and M. Yoshimoto, “7T SRAM
Enabling Low-Energy Simultaneous Block Copy”, IEEE, (2010).
[13] K. Flautner, N. S. Kim, S. Martin, D. Blaauw and T. Mudge, “Drowsy Caches: Simple Techniques for
Reducing Leakage Power”, Proceedings of the 29th Annual International Symposium on Computer
Architecture (ISCA.02), IEEE, (2002).
[14] N. Kr. Shukla, M. Pattnaik and R. K.Singh, “Analysis of the Data Stability and Leakage Power in the
Various SRAM Cells Topologies”, International Journal of Engineering Science and Technology, vol. 2,
no. 7, (2010), pp. 2936-2944.