DDR4 DIMM

Available in Press-fit, SMT and Through-hole mounting, Sockets,

DDR4 DIMM sockets offer significant assembly- Halogen-free
processing compatibility and cost savings in high-speed 78726 Vertical, Through hole
server memory applications 78730 Vertical, SMT
Meeting JEDEC specifications, Molex’s Vertical Press-fit, SMT and Through 78731 Vertical, Press-fit
hole DDR4 DIMM sockets support *UDIMMs, RDIMMs and LRDIMM memory
applications for data, computing, telecommunication and networking
servers with higher data speed and lower operating voltage than DDR3.
The new Press-fit DDR4 DIMM socket offers benefits of lower cost of
operation (clean, solderless process); elimination of added heat-cycle that
can cause stress to the PCB or degrade electronic components; ease-of-
application and connection-failure traceability, rework and termination
quality inspection; repair capability and more.
Other termination styles suit specific applications that give greater PCB real
estate cost savings. These include Series 78726 Through hole and 78730
SMT sockets with a highly compact socket footprint.
Molex’s DDR4 sockets feature high dimensional stability and excellent
compatibility in halogen-free and lead-free technologies. The use of less
moisture-sensitive, high-temperature housing material minimizes blistering
on the connector during high, IR-reflow processing temperatures for non
press-fit sockets. Reduced yield losses with the use of Molex DDR4 sockets
add to greater customer cost savings.
For more information, visit our website at: www.molex.com/link/ddr4.html.

Halogen-free DDR4 DIMM Sockets in

Press-fit (top), SMT (center) and Through
hole (bottom) configurations

Features and Benefits

Reduced connector footprint of 6.50mm (max.) (W) Provides increased PCB space and cost savings
by 162mm (L)

Robust and more ergonomic latch design Improves rip-out force and vibration resistance; makes
socket easy to use

Profiled contact terminals Eliminate stress caused to housing during terminal

insertion and prevents housing warpage; anti-stubbing

Moisture-resistant, high-temperature housing material Gives added dimensional stability to connector with
reduced yield loss and increased cost-savings. Able to
withstand infrared (IR), lead-free and wave soldering
temperatures

High connector durability Supports up to 25 mating cycles

Step-and-ramp feature (on connector housing and Reduces insertion force of module without engaging all
memory module) gold fingers at the same time during module insertion

*U
 DIMMs: Unbuffered DIMMs offer the fastest memory speeds, lowest latencies, and (relatively) low power consumption but are
limited in capacity though.
RDIMM: Registered DIMMs, with their registers, are able to buffer the Address and Command signals between the DRAMs and the
memory controller thus increasing the amount of memory that a server can support, however, with increased power consumption
and memory latency.
LRDIMM: Load Reduced DIMMs use a buffer to reduce memory loading to a single load on all DDR signals, allowing for greater
density but at the highest power usage
 DDR4 DIMM
Specifications Sockets,
Halogen-free

Reference Information Mechanical Physical

Packaging: Tray Module Insertion Force: 106.8N max Housing: Halogen-free,
UL File No.: TBA Module Rip-out Force: 9.10 kgf min. high-temperature Nylon,
CSA File No.: TBA Compliant-pin Insertion Force to PCB: glass-filled, UL94V-0 (both
Use With: 4.50kgf max. socket and latch)
Compliant-pin Retention Force to PCB: Contact: Copper Alloy
JEDEC MO-310A memory modules
0.30kg min. Plating:
Designed In: Millimeter
Module Unmating Force: 2.02 kgf min. Contact Area
RoHS: Yes Terminal Retention Force: — Refer to tables below
Halogen Free: Yes 0.30 kgf (contact) Solder Tail Area
Glow Wire Compliant: No 13.3N (forklock) — Refer to tables below
Electrical Latch Actuation Force: Underplating
Voltage (max.): 29V AC (RMS)/DC 3.50 kgf max per latch — Refer to tables below
Current (max.): 0.75A per pin Durability: 25 cycles PCB Thickness: Refer to table below
Low Level Contact (for through hole and
Resistance (max.): 10 milliohms Press-fit versions only)
Dielectric Withstanding Operating Temperature: -55 to +85°C
Voltage: 500V AC
Insulation Resistance
(min.): 1 megohm

Applications

Data/Computing
– High-end computing
– Personal computers
Telecommunications/Networking
– Infrastructure
– Networking

Servers Networking systems

Product Features
Key differences between DDR3 and DDR4 DIMM Sockets

Features DDR3 DIMM Sockets DDR4 DIMM Sockets

Pitch 1.00mm 0.85mm

Module Thickness 1.27mm 1.40mm

Circuits 240 288

Key from Module Center 12.00mm 5.15mm

Voltage 1.5V 1.2V

Electrical Performance 800 – 1600Mbps 1600 – 3200Mbps

 DDR4 DIMM
Product Features Sockets,
Halogen-free
Press-Fit Pitch Sizes

DDR3 pitch size DDR4 Pitch size

DDR4 uses a smaller pitch and via hole diameter than DDR3 Press-fit versions

SMT Footprint

DDR3 pitch size DDR4 Pitch size

DDR4 uses a smaller pitch and footprint size than DDR3 SMT versions

Through Hole Pitch Sizes

DDR3 pitch size DDR4 Pitch size

DDR4 uses a smaller pitch and via hole diameter than DDR3 Through hole versions
 DDR4 DIMM
Product Features Sockets,
Differences in socket dimensions Halogen-free

165mm (max.)

26.00mm
2.4mm (max.) Seating Plane (max.)

141mm (max.) 7.75mm

max.
DDR3 DIMM Socket

162mm (max.)

21.30mm
2.4mm (max.) Seating Plane (max.)

142mm (max.) 6.50mm

max.
DDR4 DIMM Socket

DDR4 has a narrower connector width and mounted height than DDR3 versions

Product Features
DDR3 and DDR4 memory modules differences

Module Thickness:
1.27mm
Two
DDR3 DIMM Module notches for
240 circuits, 1.00mm pitch Very Low
Profile (VLP)
and Low
Profile (LP)
modules

Module Thickness:
1.40mm
Single
notch for
DDR4 DIMM Module
both VLP
288 circuits, 0.85mm pitch
0.5mm step and
LP modules

Step and ramp feature on both sides of memory module helps maintain the 0.5mm step
same insertion force to the socket when inserted

DDR3 and DDR4 Memory Module Differences

 DDR4 DIMM
Product Features Sockets,
Socket Housing Halogen-free

One of 3 socket Recessed Flush

forklocks for terminal soldertail
robust design of design
PCB retention the minimizes
socket accidental
reduces damage to
exposure terminal
of due to
terminal bending
from
physical
damage
Underside of SMT Recessed soldertail Soldertails of the SMT
version DDR4 DIMM terminals of the SMT DDR4 DDR4 DIMM socket are
Socket showing DIMM Socket flush with the connector
housing and soldertail edge (width) on both
design sides

Ergonomically designed latches

Stepped latch
design improves
thumb-grip
for easy latch
opening Though compact,
each latch
delivers an
actuation force
of up to 3.50 kgf

Ergonomically designed latches of the DDR4 DIMM Sockets

in open (left) and closed (right) positions
 DDR4 DIMM
Ordering Information Sockets,
Halogen-free
Through Hole Versions
Housing Latch Recommended PCB
Order No. Plating Product Specification
Color Color Thickness (mm)
78726-1002 1.57
78726-1003 Black 2.36
78726-1026 3.00
78726-1040 Black 1.57
78726-1004 1.57
Off-white
78726-1005 2.36
78726-1027 3.00
78726-1006 1.57
78726-1007 Black 2.36
78726-1028 3.00 0.76μm (30μ") Gold (Au) on contact;
Off-white 2.54μm (100μ") Tin (Sn) on soldertails; PS-78726-001
78726-1008 1.57 1.27μm (50μ") Nickel (Ni) underplate
78726-1009 Off-white 2.36
78726-1029 3.00
78726-1010 1.57
78726-1011 Blue 2.36
78726-1030 3.00
78726-1044 Blue 1.57
78726-1022 1.57
Off-white
78726-1023 2.36
78726-1031 3.00
78726-1045 1.57
78726-1012 1.57
Black
78726-1013 2.36
78726-1032 Black 3.00
78726-1014 1.57
78726-1015 Off-white 2.36
78726-1033 3.00
78726-1016 1.57
78726-1017 Black 2.36
78726-1034 3.00 0.38μm (15μ”) Gold (Au) on contact;
2.54μm (100μ”) Tin (Sn) on soldertails; PS-78726-002
78726-1048 Off-white 1.57 1.27μm (50μ”) Nickel (Ni) underplate
78726-1018 1.57
Off-white
78726-1019 2.36
78726-1035 3.00
78726-1020 1.57
78726-1021 Blue 2.36
78726-1036 3.00
Blue
78726-1024 1.57
78726-1025 Off-white 2.36
78726-1037 3.00

SMT Versions
Housing Latch
Order No. Plating Product Specification
Color Color
78730-1002 Black
Black 0.76μm (30μ") Gold (Au) on contact;
78730-1003 Off-white
2.54μm (100μ") Tin (Sn) on soldertails; PS-78730-001
78730-1004 Black 1.27μm (50μ") Nickel (Ni) underplate
Off-white
78730-1005 Off-white

Press-Fit Version
Housing Latch Recommended PCB Product
Order No. Plating
Color Color Thickness (mm) Specification

0.76μm (30μ”) Gold (Au) on contact; 0.38

78731-1002 Black Black 2.40 to 1.52μm (15-60μ”) Tin (Sn) on soldertails; PS-78731-001
1.27μm (50μ”) Nickel (Ni) underplate

www.molex.com/link/ddr4.html
Order No. 987650-9721 Rev. 2 Printed in USA/KC/2014.02 ©2014 Molex