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Nanometer

Lecture note

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0% found this document useful (0 votes)
8 views

Nanometer

Lecture note

Uploaded by

balaj42005
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 22

6/8/2018

ECE4740:
Digital VLSI Design
Lecture 3: Nanometer MOSFETs

75

It’s not that complicated…

Body effect revisited

76

1
6/8/2018

Body effect revisited

• Again: What is the impact of VB to VT?

+
S VGS D
G
-

n+ n+

n-channel Depletion
Region
p-substrate

77

Body effect revisited (cont’d)


• Let us lower VB (such that VB<VS)
• Equivalent with reducing VBS=VB-VS or
increasing VSB=VS-VB
+
S VGS D
G
-

n+ n+

n-channel Depletion
Region
p-substrate

B
reduces potential in
p –substrate
78

2
6/8/2018

Body effect revisited (cont’d)


• Means we need larger VG
to form n-channel!
• Threshold voltage
VT increases S
-
+
V GS
G
D

n+ n+

n-channel Depletion
Region
p-substrate

79

Other explanation
• If we lower VB, then depletion region at
source and drain grows  think reverse
biased pn-junctions (diodes)
• Charge gets pulled S
-
+
V GS
G
D

out of channel
n+ n+
to depletion region
n-channel Depletion
• Requires larger VGS p-substrate
Region

to undo that effect B

80

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6/8/2018

Summary of body effect


• Reducing VB such that VB<VS is equivalent
to reducing VBS or increasing VSB
• VSB means threshold voltage VT
• VSB means threshold voltage VT
• Opposite behavior for VBS

81

The graph
0.9

0.85

0.8

0.75
(V)

0.7
VVT (V)

0.65
T

0.6

0.55

0.5

0.45

0.4
-2.5 -2 -1.5 -1 -0.5 0
V (V)
-VSB=VBS (V)BS

increasing VSB reduces VBS ,


which increases VT
82

4
6/8/2018

Why should we care?


• The body effect can be used to
– Make switching faster (reducing VT)
– Reduce static power consumption
due to leakage (increasing VT):

• normal operation:
 connect B with S
• standby operation:
 lower VBS

83
Image taken from: http://www.eeherald.com/section/design-guide/Low-Power-VLSI-Design.html

Today’s devices are tiny!

Short-channel effects

84

5
6/8/2018

Modern transistors are tiny

10nm likely to be the realistic limit


for standard Si based devices
85
Image taken from: https://theglobalscientist.com/2014/04/07/the-next-big-step-in-computers-what-can-physics-offer-us/

How about short-channel devices?

-4
L<0.25µm
x 10
2.5

VGS= 2.5 V
early saturation
2

VGS= 2.0 V
1.5
linear relation
ID (A)

1
VGS= 1.5 V for fixed VDS

0.5 VGS= 1.0 V

0
0 0.5 1 1.5 2 2.5
VDS (V)
86

6
6/8/2018

Velocity saturation
• Velocity of carriers
saturates due to
scattering (collisions)

• For L=0.25µm
NMOS, only VDS2V
is sufficient to reach
velocity saturation

87
Image taken from: http://ic.sjtu.edu.cn/ic/dic/wp-content/uploads/sites/10/2013/04/CMOS-VLSI-design.pdf

Effects of velocity saturation

10 • Short-channel device
enters saturation
before VDS=VGS-VT
• Saturation current
IDS(sat) shows linear
dependence with VGS
0

• Vsat more pronounced in NFET than PFET


88

7
6/8/2018

(First-order model)

• Carrier velocity can be modeled as:

• We can redo the calculations for the resistive


and saturation region (not important)
89

Improved FET models this term


lowers the
carrier
mobility
• Resistive (linear) region: VGS-VT>VDSat

• (Velocity) saturation region: VGS-VT<VDSat

VDSat=κ(VGT)*VGT, VGT=VGS-VT 90

8
6/8/2018

ID vs. VGS characteristics


-4
x 10 x 10
-4
6 2.5

5
2

4
linear
quadratic 1.5
ID (A)

ID (A)
3

1
2

0.5
1
quadratic
0 0
0 0.5 1 1.5 2 2.5 0 0.5 1 1.5 2 2.5
VGS (V) VGS (V)

long channel short channel


91

Short-channel PFET
• Once, again: polarities of all voltages and
currents reversed
-4
x 10
0
V GS = -1.0V

-0.2
V GS = -1.5V

-0.4
ID (A)

V GS = -2.0V
-0.6

-0.8
V GS = -2.5V

-1
-2.5 -2 -1.5 -1 -0.5 0
VDS (V)
92
Image taken from: http://spongebobia.com/spongebob-captures/gallery.php?prod=009b

9
6/8/2018

What happens if VGS<VT?

Subthreshold conduction

93

Another look at ID vs. VGS curves


-4
long channel short channel
x 10 x 10
-4
6 2.5

5
2

4 linear
quadratic 1.5
ID (A)

ID (A)

1
2

1 0.5
quadratic
0 0
0 0.5 1 1.5 2 2.5 0 0.5 1 1.5 2 2.5
VGS (V) VGS (V)

current does not drop


abruptly to 0 for VGS<VT 94

10
6/8/2018

Subthreshold conduction (leakage)


• FETs are conducting partially for VGS<VT
• Parasitic bipolar transistor

n+ n+

Body
• Two diode equations:

95

Subthreshold conduction (cont’d)

• Undesirable effect: 10-2


linear region
– Current flowing when
transistor should be quadratic region
off
• Affects dynamic subthreshold
circuits (DRAMs) exponential
region
• Affects static power
consumption 10-12 VT
WHY?
0 0.5 1 1.5 2 2.5
VGS (V)
96

11
6/8/2018

They will affect the dynamic behavior!

FET capacitances
and resistances

97

MOSFET capacitance model


G

CGS CGD

S D

CSB CGB CDB

B
• We are typically interested in modeling this
as a single capacitance CG
Image taken from: http://bwrcs.eecs.berkeley.edu/Classes/icdesign/ee141_f10/Lectures/Lecture11- 98
MOS_Cap_Delay-6up.pdf

12
6/8/2018

Gate capacitance*
polysilicon gate

Source Drain
W
n+ xd xd n+

gate-bulk
Ld
overlap
lateral top view
diffusion
gate oxide
tox
n+ L n+ overlap capacitances;
no big deal in deep
cross section submicron technology!
*The gate capacitance is necessary to form the channel; all other capacitances are parasitic and not needed.
Image taken from: http://bwrcs.eecs.berkeley.edu/Classes/icdesign/ee141_f10/Lectures/Lecture11- 99
MOS_Cap_Delay-6up.pdf

C’s depend on operation regime!


VGS<VT VGS>VT+VDS VGS<VT+VDS
G G G

CGC CGC CGC


S D S D S D

Region CGB CGS CGD CG


Subthreshold CoxWL 0 0 CoxWL + 2CoW
Linear 0 CoxWL/2 CoxWL/2 CoxWL + 2CoW
Saturation 0 2/3CoxWL 0 2/3CoxWL + 2CoW
Co=overlap cap.
often ignored
• Important regions are saturation and subtreshold
100

13
6/8/2018

Junction (diffusion) capacitances

• Caused by reverse-biased source-body


and drain-body pn-junctions
• Nonlinear (voltage N A+ channel-stop implant

dependent) side wall


source
W
ND

bottom

xj side wall
channel
Image taken from: LS substrate NA
http://bwrcs.eecs.berkeley.edu/Classes/icdesign/ee141_f10 101
/Lectures/Lecture11-MOS_Cap_Delay-6up.pdf

Parasitic resistances

• Drain-source on resistance (RDSon)


Polysilicon gate
Drain
contact
LD
W

n+ n+

Drain

channel resistance Body parasitic resistance


from channel to
contact RC

102

14
6/8/2018

Challenges of deep-submicron devices

Nanometer transistors

103

Threshold variations
• For deep submicron devices, threshold voltage
becomes function of (small) L, W, and VDS

• Depletion regions of source and drain junction


cannot be ignored anymore VT
– parts of gate already depleted
Long-channel threshold
– reduces VT

L
104

15
6/8/2018

Threshold variations (cont’d)


• Increasing VD increases width of drain
pn-junction depletion region
– decreases VT: approximate model VT=VT0 – λdVDS
– known as drain-induced barrier lowering (DIBL)
– Not that critical for digital circuits
VT

• If VDS exceeds certain low V DS threshold


voltage: D-S shortened
– called punch-through
– permanent device damage!
VDS
105

Gate leakage
• High electric field can cause tunneling
through gate oxide (insulator)
• Becomes an issue for L=100nm and below
(static power consumption)

high capacitance

http://ixbtlabs.com/articles2/intel-65nm/
106

16
6/8/2018

Hot carrier effects


• Threshold voltage drifts over time
• Electrons (and holes) can tunnel into the
gate oxide at 1V/µm
– VT increases for NMOS
– VT decreases for PMOS

• Causes long-term reliability issues


107

CMOS latch-up

• Parasitic bipolar transistors


– If one of the bipolar transistors is forward
biased, current flows into other BJT
– Positive feedback  circuit fails
• Rnwell and Rpwell must be minimized!
– provide additional well and substrate
contacts close to source connections 108
Image taken from: https://en.wikipedia.org/wiki/Latch-up

17
6/8/2018

They will be very useful later

Pass transistors

109

Pass transistor*
• We assumed that VS is on GND
• What if VS>0? E.g., transistor passing VDD

• If VG-VT<VS then
VG=VDD NFET is off
G • NMOS cannot pull
VD=VDD
S D
Vout? higher than VDD-VTn
• PMOS pull no lower
than |VTp|
110
*You should think that there is a big resistor pulling D down to ground.

18
6/8/2018

Pass transistor (cont’d)


• NMOS cannot pull higher than VDD-VTn
• Simple formula for NMOS:

VG=VDD
G

D S
Vin Vout?

• NFET is a bad pull up (max VDD-VT)


• PFET is a bad pull down (min VT)
111

Pass-transistor delay
VG=VDD
G

D S
Vin Vout
time constant:
Ron
Vin
Cload
but they can be very
cheap switches!

• Pass transistors can be slow,


especially if load capacitance is large
112

19
6/8/2018

Things to remember

Recap MOSFET

113

Recap: MOSFET
NMOS
saturation region

linear region

quadratic increase in VGS


for long channel FETs,
linear for short channels

FET almost off if VGS<VT


VGS-VT=VDS

114

20
6/8/2018

Things to remember: NFET/NMOS


• FETs are “switches”; almost off when VGS<VT
• Operating regimes
– linear (resistive) regime: VGS-VT>VDS
– saturation regime: VGS-VT<VDS
• Channel-length modulation
• Short-channel effects: velocity saturation
– transistor earlier in saturation regime
– VGS has linear relationship on ID
• Subthreshold conduction 
115

Square law equations of long NMOS

• Linear (resistive or triode) regime


VGS > VT
VDS < VGS-VT

• Saturation regime
VGS > VT
VDS > VGS-VT

• Subthreshold regime
VGS < VT
116

21
6/8/2018

117

22

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