0% found this document useful (0 votes)
8 views

Buld 741 T 4

Uploaded by

Jawad Ahmad
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
8 views

Buld 741 T 4

Uploaded by

Jawad Ahmad
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 14

BULD741T4

Datasheet

High voltage fast-switching NPN power transistor

Features
• High voltage capability
TAB
• Low spread of dynamic parameters
2 3 • Minimum lot-to-lot spread for reliable operation
1
• Very high switching speed
DPAK

C(2, TAB) Applications


• Electronic ballast for fluorescent lighting
• Switch mode power supplies
B(1)

Description
The BULD741T4 is manufactured using high voltage multi-epitaxial planar technology
E(3)
to enhance switching speeds and high voltage capability.
SC06960_TAB

Thanks to an increased intermediate layer, it has an intrinsic ruggedness which


enables the transistor to withstand a high collector current level during breakdown
condition, without using the transil protection usually necessary in typical converters
for lamp ballast.

Product status link

BULD741T4

Product summary

Order code BULD741T4


Marking BULD741
Package DPAK
Packing Tape and reel

DS5049 - Rev 3 - July 2022 www.st.com


For further information contact your local STMicroelectronics sales office.
BULD741T4
Electrical ratings

1 Electrical ratings

Table 1. Absolute maximum rating

Symbol Parameter Value Unit

VEBO Emitter-base voltage (IC = 0 A, IB = 2 A, tP < 10 ms) V(BR)EBO V

VCES Collector-emitter voltage (VBE = 0 V) 1050 V

VCEO Collector-emitter voltage (IB = 0 A) 400 V

IC Collector current 2.5 A

ICM Collector peak current (tP < 5 ms) 5 A

IB Base current 1.5 A

IBM Base peak current (tP < 5 ms) 3 A

PTOT Total power dissipation at TC = 25 °C 30 W

Tstg Storage temperature range -65 to 150 °C

TJ Maximum operating junction temperature 150 °C

Table 2. Thermal data

Symbol Parameter Value Unit

RthJC Thermal resistance, junction-to-case 4.16 °C/W

DS5049 - Rev 3 page 2/14


BULD741T4
Electrical characteristics

2 Electrical characteristics

TC = 25 °C unless otherwise specified.

Table 3. Electrical characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

ICES Collector cut-off current VCE = 1050 V, VBE = 0 V 0.2 10 µA

ICEO Collector cut-off current VCE = 400 V, IB = 0 A 10 250 µA

Collector-emitter sustaining
VCEO(sus) (1) IC = 10 mA, IB = 0 A 400 450 V
voltage
Emitter-base breakdown
V(BR)EBO IC = 0 A, IE = 1 mA 15 19 24 V
voltage
IC = 0.7 A, IB = 0.14 A 0.15 0.5
Collector-emitter saturation
VCE(sat) (1) V
voltage IC = 2 A, IB = 0.6 A 0.5 1.5

VBE(sat) (1) Base-emitter saturation voltage IC = 2 A, IB = 0.6 A 1.1 1.5 V

IC = 0.1 A, VCE = 5 V 48 70 100


hFE (1) DC current gain
IC = 0.45 A, VCE = 3 V 25 35 50

Resistive load VCC = 125 V, IC = 1 A,


ts Storage time IB(on) = -IB(off) = 0.2 A, 2.5 3.5 μs

tf Fall time tp= 300 μs, VBE(off) = -5 V 350 500 ns

L= 2 mH, C= 1.8 nF,


EAR Repetitive avalanche energy 5 mJ
VBE(off)= -5 V

1. Pulsed: Pulse duration = 300 μs, duty cycle ≤1.5%.

DS5049 - Rev 3 page 3/14


BULD741T4
Electrical characteristics (curves)

2.1 Electrical characteristics (curves)

Figure 1. Safe operating area Figure 2. Derating curve

Figure 3. Output characteristics Figure 4. Reverse biased safe operating area

Figure 5. DC current gain (VCE = 3 V) Figure 6. DC current gain (VCE = 5 V)

DS5049 - Rev 3 page 4/14


BULD741T4
Electrical characteristics (curves)

Figure 7. Base-emitter saturation voltage Figure 8. Collector-emitter saturation voltage

Figure 9. Resistive load switching on times (hFE = 5) Figure 10. Resistive load switching on times (hFE = 10)

Figure 11. Resistive load switching off times (hFE = 5) Figure 12. Resistive load switching off times (hFE = 10)

DS5049 - Rev 3 page 5/14


BULD741T4
Test circuits

3 Test circuits

Figure 13. Resistive load switching test circuit

Figure 14. Energy rating test circuit

DS5049 - Rev 3 page 6/14


BULD741T4
Package information

4 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

4.1 DPAK (TO-252) type C package information

Figure 15. DPAK (TO-252) type C package outline

0068772_C_31

DS5049 - Rev 3 page 7/14


BULD741T4
DPAK (TO-252) type C package information

Table 4. DPAK (TO-252) type C mechanical data

mm
Dim.
Min. Typ. Max.

A 2.20 2.30 2.38


A1 0.90 1.01 1.10
A2 0.00 0.10
b 0.72 0.85
b4 5.13 5.33 5.46
c 0.47 0.60
c2 0.47 0.60
D 6.00 6.10 6.20
D1 5.15 5.40 5.65
E 6.50 6.60 6.70
E1 4.70 4.85 5.00
e 2.186 2.286 2.386
H 9.80 10.10 10.40
L 1.40 1.50 1.70
L1 2.90 REF
L2 0.90 1.25
L3 0.51 BSC
L4 0.60 0.80 1.00
L6 1.80 BSC
θ1 5° 7° 9°
θ2 5° 7° 9°
V2 0° 8°

DS5049 - Rev 3 page 8/14


BULD741T4
DPAK (TO-252) type C package information

Figure 16. DPAK (TO-252) recommended footprint (dimensions are in mm)

FP_0068772_31

DS5049 - Rev 3 page 9/14


BULD741T4
DPAK (TO-252) packing information

4.2 DPAK (TO-252) packing information

Figure 17. DPAK (TO-252) tape outline

10 pitches cumulative
tolerance on tape +/- 0.2 mm

Top cover P0 D P2
T tape
E

F
K0 W
B1 B0

For machine ref. only A0 P1 D1


including draft and
radii concentric around B0
User direction of feed

Bending radius
User direction of feed

AM08852v1

DS5049 - Rev 3 page 10/14


BULD741T4
DPAK (TO-252) packing information

Figure 18. DPAK (TO-252) reel outline

40mm min.
access hole
at slot location
B

D C

N
A

Tape slot G measured


in core for at hub
Full radius tape start
2.5mm min.width

AM06038v1

Table 5. DPAK (TO-252) tape and reel mechanical data

Tape Reel

mm mm
Dim. Dim.
Min. Max. Min. Max.

A0 6.8 7 A 330
B0 10.4 10.6 B 1.5
B1 12.1 C 12.8 13.2
D 1.5 1.6 D 20.2
D1 1.5 G 16.4 18.4
E 1.65 1.85 N 50
F 7.4 7.6 T 22.4
K0 2.55 2.75
P0 3.9 4.1 Base qty. 2500
P1 7.9 8.1 Bulk qty. 2500
P2 1.9 2.1
R 40
T 0.25 0.35
W 15.7 16.3

DS5049 - Rev 3 page 11/14


BULD741T4

Revision history

Table 6. Document revision history

Date Revision Changes

20-Dec-2006 1 Initial release.


09-Jul-2007 2 Updated package names in page 1, added figure 4, updated figure 12 and 13.
Removed obsolete order code BULD741-1 and updated Section 4.1 DPAK (TO-252) type C
15-Jul-2022 3 package information.
Minor text changes.

DS5049 - Rev 3 page 12/14


BULD741T4
Contents

Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
4 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
4.1 DPAK (TO-252) type C package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 DPAK (TO-252) packing information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

DS5049 - Rev 3 page 13/14


BULD741T4

IMPORTANT NOTICE – READ CAREFULLY


STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names
are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2022 STMicroelectronics – All rights reserved

DS5049 - Rev 3 page 14/14

You might also like