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SGM61230

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146 views17 pages

SGM61230

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© © All Rights Reserved
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SGM61230

4.5V to 28V Input, 3A Output,


Synchronous Step-Down Converter
GENERAL DESCRIPTION FEATURES
The SGM61230 is a synchronous step-down converter ● Wide 4.5V to 28V Input Voltage Range
with a wide input voltage range of 4.5V to 28V. This ● 3A Continuous Output Current
device can deliver up to 3A to the output over a wide ● Integrated 66mΩ/36mΩ Power MOSFETs
input voltage. It is an easy-to-use device with power ● Low Quiescent Current: 25μA (TYP)
switches and peak current mode control compensation ● Shutdown Current: 2μA (TYP)
all integrated in a small 6-pin package. A typical 5ms
● 5ms Internal Soft-Start Time
soft-start ramp is also included to minimize the inrush
● Fixed 410kHz Switching Frequency
current.
● Pulse Skip Mode and PWM Mode
This device employs cycle-by-cycle peak current limit, ● Peak Current Mode Control
output over-voltage protection and thermal shutdown ● Internal Loop Compensation
with auto recovery. The current limit is implemented for ● Over-Current Protection for Both MOSFETs
both switches and has foldback feature to prevent
● Output Over-Voltage Protection
overheating (and thermal shutdown) when an output
● Adjustable Input Under-Voltage Lockout
short is detected. Auto recovery after over-current,
● Thermal Shutdown with Auto Recovery
output short, overheating or over-voltage fault maintains
● Available in a Green TSOT-23-6 Package
the system operational with no shutdown.

This converter has a fixed 410kHz switching frequency


that minimizes the EMI noise problems. However the
APPLICATIONS
actual frequency drops during PSM (pulse skip mode) 12V Distributed Power Supply Buses
to maximize efficiency at light load. It also drops in Industrial and Consumer Applications
some fault conditions. White Goods
The SGM61230 is available in a Green TSOT-23-6 Audio Equipment
package. Set Top Boxes
Digital Television Printers

TYPICAL APPLICATION

VIN BOOT
VIN
CBOOT
CIN VOUT
SW
L
SGM61230 COUT
RFB1

EN FB
GND
RFB2

Figure 1. Typical Application Circuit

SG Micro Corp NOVEMBER 2020 – REV. A


www.sg-micro.com
4.5V to 28V Input, 3A Output,
SGM61230 Synchronous Step-Down Converter

PACKAGE/ORDERING INFORMATION
SPECIFIED
PACKAGE ORDERING PACKAGE PACKING
MODEL TEMPERATURE
DESCRIPTION NUMBER MARKING OPTION
RANGE
SGM61230 TSOT-23-6 -40℃ to +125℃ SGM61230XTN6G/TR CE9XX Tape and Reel, 3000

MARKING INFORMATION
NOTE: XX = Date Code.
YYY X X
Date Code - Week
Date Code - Year
Serial Number

Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.

ABSOLUTE MAXIMUM RATINGS OVERSTRESS CAUTION


Input Voltage Range .......................................... -0.3V to 30V Stresses beyond those listed in Absolute Maximum Ratings
EN and BOOT-SW Voltages ................................ -0.3V to 6V may cause permanent damage to the device. Exposure to
SW Voltage ........................................................ -0.3V to 30V absolute maximum rating conditions for extended periods
SW (20ns transient) Voltage ................................. -5V to 30V may affect reliability. Functional operation of the device at any
FB Voltage ........................................................ -0.3V to 3.5V conditions beyond those indicated in the Recommended
Package Thermal Resistance Operating Conditions section is not implied.
TSOT-23-6, θJA ........................................................ 123℃/W
Junction Temperature .................................................+150℃ ESD SENSITIVITY CAUTION
Storage Temperature Range ....................... -65℃ to +150℃ This integrated circuit can be damaged by ESD if you don’t
Lead Temperature (Soldering, 10s) ............................+260℃ pay attention to ESD protection. SGMICRO recommends that
ESD Susceptibility all integrated circuits be handled with appropriate precautions.
HBM ............................................................................. 2000V Failure to observe proper handling and installation procedures
CDM ............................................................................ 1500V can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
RECOMMENDED OPERATING CONDITIONS integrated circuits may be more susceptible to damage
Input Voltage Range ............................................4.5V to 28V because very small parametric changes could cause the
EN and BOOT-SW Voltages ............................. -0.1V to 5.5V device not to meet its published specifications.
SW Voltage ........................................................ -0.1V to 28V
FB Voltage ........................................................... -0.1V to 3V DISCLAIMER
Operating Ambient Temperature Range ...... -40℃ to +125℃ SG Micro Corp reserves the right to make any change in
Operating Junction Temperature Range ...... -40℃ to +125℃ circuit design, or specifications without prior notice.

SG Micro Corp NOVEMBER 2020


www.sg-micro.com
2
4.5V to 28V Input, 3A Output,
SGM61230 Synchronous Step-Down Converter

PIN CONFIGURATION
(TOP VIEW)

GND 1 6 BOOT

SW 2 5 EN

VIN 3 4 FB

TSOT-23-6

PIN DESCRIPTION
PIN NAME TYPE DESCRIPTION

1 GND – Device Ground Reference Pin.

Switching Node. Connection point of the internal converter lower and upper power MOSFETs.
2 SW O
Connect this pin to the output inductor and the bootstrap capacitor.
Input Supply Voltage Pin. VIN powers the internal control circuitry and the power converter.
Decouple this pin for very high frequency and high di/dt transitions, with small and high
3 VIN –
frequency ceramic capacitors placed as close as possible between VIN and GND pins. Input
under-voltage is protected by a UVLO comparator.
Feedback (Sense) Pin for Output Voltage and Programming. It is normally regulated at
4 FB I
0.603V. Tap an output feedback resistor divider to this pin.
Device Enable Pin. Device will operate if EN voltage is high and will shut down if it is low.
5 EN I Device will be enabled if this pin is left float. EN pin can be used to increase the UVLO
thresholds.
Bootstrap Pin. Place a 0.1µF capacitor (CBOOT) between BOOT and SW pins close to the
6 BOOT O device to provide the required drive voltage for the high-side switch. Do not place any series
resistor with CBOOT.
NOTE: O = Output, I = Input.

SG Micro Corp NOVEMBER 2020


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3
4.5V to 28V Input, 3A Output,
SGM61230 Synchronous Step-Down Converter

ELECTRICAL CHARACTERISTICS
(TJ = -40℃ to +125℃, VIN = 4.5V to 28V, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input Voltage Range VIN 4.5 28 V
Non-Switching Quiescent Current IQ VEN = 5V, VFB = 1V 25 µA
Shutdown Supply Current ISD EN = GND 2 µA
VIH Rising 1.19 1.33
EN Terminal Input Threshold V
VIL Falling 0.93 1.10
IIL VEN = 0.5V 0.45
EN Terminal Leakage Current μA
IIH VEN = 1.5V 1.44
Feedback and Error Amplifier
Feedback Voltage VFB VIN = 12V, TJ = +25℃ 0.585 0.603 0.620 V
Power Stage
High-side FET On-Resistance RDSON_HS VBOOT - VSW = 5V 66 116 mΩ
Low-side FET On-Resistance RDSON_LS VIN = 12V 36 63 mΩ
Current Limit
High-side Current Limit ILIM_HS Maximum inductor peak current, TJ = +25℃ 3.4 4.0 4.6 A
Low-side Current Limit ILIM_LS Maximum inductor valley current, TJ = +25℃ 3.4 A
Input Under-Voltage Lockout
Rising VIN 4.1 4.5
UVLO Threshold Voltage VUVLO V
Falling VIN 3.4 3.7
UVLO Hysteresis VUVLO_HYS 400 mV
Over-Temperature Protection
Thermal Shutdown TSHDN Rising Temperature 165 ℃
Thermal Shutdown Hysteresis THYS 10 ℃
Oscillator
Switching Frequency fSW 340 410 480 kHz
Timing Requirements
Soft-Start Time tSS 5 ms

SG Micro Corp NOVEMBER 2020


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4
4.5V to 28V Input, 3A Output,
SGM61230 Synchronous Step-Down Converter

TYPICAL PERFORMANCE CHARACTERISTICS


TJ = +25℃, VIN = 4.5V to 28V, unless otherwise noted.

Quiescent Current vs. Junction Temperature Shutdown Current vs. Junction Temperature
60 6
VIN = 12V VIN = 12V

50 5

Shutdown Current (μA)


Quiesecent Current (μA)

40 4

30 3

20 2

10 1

0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (℃) Junction Temperature (℃)

RDSON_HS vs. Junction Temperature RDSON_LS vs. Junction Temperature


140 140
VIN = 12V VIN = 12V
120 120

100 100
RDSON_HS (mΩ)

RDSON_LS (mΩ)

80 80

60 60

40 40

20 20

0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (℃) Junction Temperature (℃)

Efficiency vs. Output Current Feedback Voltage Production Distribution


100 25
12660 Samples
90
1 Production Lot
Percentage of Converters (%)

80 20
70
Efficiency (%)

60 15
50
40 10
30
20
5
VIN = 12V
10
VOUT = 5.0V VIN = 24V
0
0
0.001 0.01 0.1 1 10
0.593
0.594
0.595
0.596
0.597
0.598
0.599
0.600
0.601
0.602
0.603
0.604
0.605
0.606
0.607
0.608
0.609
0.610
0.611

Output Current (A)


VFB (V)

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4.5V to 28V Input, 3A Output,
SGM61230 Synchronous Step-Down Converter

TYPICAL PERFORMANCE CHARACTERISTICS (continued)


TJ = +25℃, VIN = 4.5V to 28V, unless otherwise noted.

Line Regulation Load Regulation


0.5 0.5
0.4 0.4
0.3 0.3
Line Regulation (%)

Load Regulation (%)


0.2 0.2
0.1 0.1
0.0 0.0
-0.1 -0.1
-0.2 -0.2
-0.3 -0.3
VIN = 12V
-0.4 -0.4 VIN = 24V
-0.5 -0.5
6 8 10 12 14 16 18 20 22 24 26 28 0.0 0.5 1.0 1.5 2.0 2.5 3.0
Input Voltage (V) Output Current (A)

Switching Frequency vs. Ambient Temperature Feedback Voltage vs. Ambient Temperature
440 0.608
VIN = 12V VIN = 12V

430 0.606
Switching Frequency (kHz)

Feedback Voltage (V)

420 0.604

410 0.602

400 0.600

390 0.598

380 0.596
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Ambient Temperature (℃) Ambient Temperature (℃)

UVLO Threshold Voltage vs. Junction Temperature EN Terminal Input Threshold vs. Junction Temperature
4.4 1.6
VIN = 28V
4.3 1.5
EN Terminal Input Threshold (V)
UVLO Threshold Voltage (V)

4.2 Rising VIN 1.4

4.1 1.3
VIH
4.0 1.2

3.9 1.1

3.8 Falling VIN 1.0 VIL

3.7 0.9

3.6 0.8
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (℃) Junction Temperature (℃)

SG Micro Corp NOVEMBER 2020


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4.5V to 28V Input, 3A Output,
SGM61230 Synchronous Step-Down Converter

TYPICAL PERFORMANCE CHARACTERISTICS (continued)


TJ = +25℃, VIN = 24V, VOUT = 5V, CIN = 10μF, COUT = 2 × 22μF, unless otherwise noted.

Input Voltage Ripple Output Voltage Ripple

EN = Floating, IOUT = 600mA EN = Floating, IOUT = 0mA


AC Coupled

200mV/div
AC Coupled

20mV/div
VIN
VOUT

10V/div
10V/div
VSW VSW

Time (2μs/div) Time (4ms/div)

Output Voltage Ripple Output Voltage Ripple

EN = Floating, IOUT = 10mA EN = Floating, IOUT = 100mA


20mV/div

AC Coupled

20mV/div
VOUT AC Coupled
VOUT

10V/div
10V/div

VSW
VSW

Time (40μs/div) Time (4μs/div)

Output Voltage Ripple Output Voltage Ripple

EN = Floating, IOUT = 1.5A EN = Floating, IOUT = 3A


20mV/div

20mV/div

AC Coupled
AC Coupled
VOUT VOUT
10V/div

10V/div

VSW VSW

Time (2μs/div) Time (2μs/div)

SG Micro Corp NOVEMBER 2020


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4.5V to 28V Input, 3A Output,
SGM61230 Synchronous Step-Down Converter

TYPICAL PERFORMANCE CHARACTERISTICS (continued)


TJ = +25℃, VIN = 24V, VOUT = 5V, CIN = 10μF, COUT = 2 × 22μF, unless otherwise noted.

Power On Power Off


RLOAD = 500Ω RLOAD = 500Ω

10V/div
VIN

10V/div
VIN

2V/div
VOUT

2V/div
VOUT

Time (5ms/div) Time (50ms/div)

Turn On Turn Off

RLOAD = 500Ω RLOAD = 500Ω


10V/div

10V/div
VIN VIN

EN
2V/div

2V/div
EN
VOUT
2V/div

2V/div
VOUT

Time (2ms/div) Time (10ms/div)

Load Transient Response

IOUT = 0.75A to 2.25A, 0.25A/μs


100mV/div

AC Coupled
VOUT
1A/div

IOUT

Time (200μs/div)

SG Micro Corp NOVEMBER 2020


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4.5V to 28V Input, 3A Output,
SGM61230 Synchronous Step-Down Converter

FUNCTIONAL BLOCK DIAGRAM


VIN

OV HS Current
Sensor

Voltage Thermal
UVLO Boot Regulator BOOT
Reference Sensor

+ HS Current HS Driver
Comparator and
- Limit
FB

Slope
Control Logic SW
Compensation
Soft-Start

Oscillator
LS Driver

EN
LS Current Limit

SGM61230

GND

Figure 2. Block Diagram

SG Micro Corp NOVEMBER 2020


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4.5V to 28V Input, 3A Output,
SGM61230 Synchronous Step-Down Converter

DETAILED DESCRIPTION
Overview maximize power and limit the maximum peak current in
The SGM61230 is a 28V/3A synchronous step-down high-side and valley current in low-side, the device
converter with over-current, short-circuit and thermal keeps in cycle-by-cycle limit to obtain the system’s
shutdown with auto recovery. Figure 2 shows the power request. The SGM61230 does not shut down
simplified block diagram of the SGM61230. The two until the device heats and then goes to thermal
integrated MOSFET switches of the power stage shutdown. The load increase, the output voltage goes
(66mΩ high-side and 36mΩ low-side) can provide up to low, if the output voltage drops to 20%, the device will
3A of continuous current with high efficiency. go into short protection. It reduces current limit
threshold and the switching frequency goes down due
The device is powered up when VIN exceeds the UVLO
to reduce power dissipation and device goes into
threshold (4.1V TYP). At no load and with no switching,
thermal shutdown. When the output current is low
the typical operating current is 25μA and when the
enough, the device goes into PFM mode.
device is disabled by EN pin, it is only 2µA (TYP). The
internal loop compensation minimizes the BOM cost and Pulse Skip Mode (PSM) and PWM Mode
simplifies the design. The inrush current is also limited In light load, OVP does not occur and the device can
by an internal 5ms soft-start ramp. operate in the normal PWM mode, but to improve light
load efficiency, the device is designed to skip some
Operating Principle
pulses by entering to the PSM mode. When the peak
Peak current mode (PCM) control is used in the
current is lower than 500mA typically, the device enters
SGM61230 to regulate the output voltage. VOUT is
PSM. In PSM, when the output voltage is detected to
sensed by the external resistor divider on the FB pin
be above the internal voltage reference level of the
and compared to the internal 0.603V reference voltage
error amplifier, the high-side MOSFET is kept off for a
by a trans-conductance error amplifier. The error
few cycles (skipping clock pulses) by clamping current
amplifier (EA) output (current) is fed to the internal
reference until the output voltages are discharged
compensation components between the EA output and
below the internal voltage reference level. Note that the
GND to generate a voltage that is used as the peak
integrated current comparator operates based on the
current reference for comparing with the sensed
peak inductor current and the average load current may
high-side switch current. The output of this comparator
vary depending on the output filters and load type.
(COMP) can reset the flipflop that controls the switches.
This flipflop receives fixed frequency clock pulses from Enable Pin and UVLO Adjustment
the internal 410kHz oscillator. In the normal operation The EN pin can be used to turn the device on and off or
the high-side switch is turned on in the beginning of to change the UVLO thresholds. The device is enabled
each switching cycle. The current in the high-side when the EN pin voltage exceeds its high threshold. A
switch starts to rise until the peak current reference is low EN voltage disables the device brings it to the
reached that resets the flipflop. This will turn off the low-quiescent (IQ) state.
high-side switch and turn on the low-side switch. The
The EN pin is internally pulled up by a small current
low-side switch stays on until the end of the cycle.
source (IP) so the device is enabled if EN pin is floated.
Slope Compensation An open drain or open collector output can be used to
Peak current mode-controlled devices in general are control the EN pin.
subject to sub-harmonic oscillation instability at higher
VIN is monitored by the internal under-voltage lockout
duty cycles (typically > 50%). To avoid this instability a
circuit and if it is below UVLO threshold, the device is
compensating ramp signal is used. The ramp starts
disabled. The internal UVLO has a 400mV hysteresis. If
from zero in the beginning of each cycle with a specific
higher thresholds are needed, EN pin can be used as
slop and is added to the sensed high-side switch
shown in Figure 3.
current before it is compared to the peak current
reference. The EN pull-up current is used to set the hysteresis.
The pull-up current is increased by IIH - IIL when the EN
Anti-High-Overload Mode pin exceeds its high threshold. Use Equations 1 and 2
The SGM61230 supports overload mode. When the to calculate the R1 and R2 values for the desired UVLO
output current continues overload while the system low (VUV_L) and high (VUV_H) thresholds.
power up or in turbo mode, the SGM61230 exports the
SG Micro Corp NOVEMBER 2020
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4.5V to 28V Input, 3A Output,
SGM61230 Synchronous Step-Down Converter

DETAILED DESCRIPTION (continued)


VUV _ H × VIL − VUV _ L × VIH (1) voltage begins to rise from near 0V to slightly above
R1 =
IIH × VIH − IIL × VIL 0.603V with a ramp time of 5ms. The lower of VREF and
this ramp is used as reference for the error amplifier,
R1 × VIL (2) therefore during startup the ramp provides a soft-start
R2 =
VUV _ L − VIL + R1 × IIH for the output. The soft-start is needed to avoid high
where: inrush currents caused by rapid increase of output
IIL = 0.45μA (TYP) voltage across output capacitors and the load. Without
IIH= 1.44μA (TYP) a soft-start the current limiting protections could trigger
VIL = 1.10V (TYP) that interrupts the monotonic rising of the load voltage
VIH = 1.19V (TYP) that may result in instability or improper system
initialization.
VIN
SGM61230 Bootstrap Voltage (BOOT)
To power the upper switch gate driver, a voltage higher
R1 IIL IH = IIH - IIL than VIN is needed. Bootstrapping technique is used to
provide this voltage from the switching node by using a
0.1µF bootstrap capacitor between SW and BOOT pins
along with an internal bootstrap diode. The voltage is
internally regulated for driving the high-side switch. An
EN
X5R or X7R ceramic capacitor is recommended for
CBOOT to have stable capacitance against temperature
R2 and voltage variations. To improve drop out, the device
is designed to operate at 100% duty cycle.
Output Short-Circuit Protection
When the output voltage down to 20% of set value, the
Figure 3. Adjustable VIN Under-Voltage Lockout device goes into short-circuit mode, and a foldback
mode will limit the current output. The high-side peak
Output Voltage Programming current limit to 2.4A (TYP) and the valley current limit to
The output voltage is set by a resistor divider between 1.4A (TYP), then it avoids the device thermal shutdown
VOUT and GND that is tapped to the FB pin. It is by the power dissipation.
recommended to use resistors with 1% tolerance or
better because it directly affects the output accuracy. A short-circuit is detected when VFB falls below 0.12V
Use Equation 3 and Figure 1 to calculate the output (TYP). In this condition the current limits of both
voltage. To improve efficiency at light load consider switches are internally reduced to less than half of the
larger resistors. Start with 100kΩ for the upper resistor normal value (foldback). This will reduce the constant
(RFB1). Note that if RFB1||RFB2 is too high, the FB pin output current during an output short and prevents
leakage current and other noises can easily affect the overheating. During the soft-start period there is no
accuracy and performance of the regulator. foldback and the current limits are normal.

R  (3)
Output Over-Voltage Protection (OVP)
VOUT =VFB ×  FB1 + 1 An over-voltage protection is included in the device to
 RFB2 
minimize the output voltage overshoots that may occur
Internal Voltage Reference and Soft-Start after recovery from an output fault or a large unloading
The SGM61230 device has an internal 0.603V transient. The FB pin voltage is compared with the OVP
reference (VREF) to program the output at the desired thresholds. If the VFB exceeds 108% of the VREF, the
level. The output voltage is determined by the high-side switch is forced to turn off. When the VFB falls
reference voltage seen by the error amplifier. When the below 104%, the high-side switch is allowed to turn on
converter starts (or is enabled), an internal ramp again.

SG Micro Corp NOVEMBER 2020


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11
4.5V to 28V Input, 3A Output,
SGM61230 Synchronous Step-Down Converter

DETAILED DESCRIPTION (continued)


Over-Current Protection (OCP) low-side current-limit (ILIM_LS). If the inductor valley
The device is protected from over-current conditions by current exceeds the low-side current limit, the high-side
cycle-by-cycle current limiting on both high-side and MOSFET will not turn on in the next cycle and the
low-side MOSFETs. low-side MOSFET continues to conduct (cycle skipped).
The high-side switch turns on again when the valley
High-side MOSFET Over-Current Protection
current falls below ILIM_LS at the start of another cycle
The internal peak current mode controller provides an
(Figure 4).
inherent current limiting capability for the high-side
switch on a cycle-by-cycle basis. When high-side During an over-current fault, the above limits cause
switch current exceeds peak current limit threshold, cycle skipping that slows down the switching frequency
high-side switch is turned off, until the next cycle. and reduces the output voltage (due to reduced duty
cycle).
Low-side MOSFET Over-Current Protection
The low-side MOSFET current is also monitored for Thermal Shutdown
over-current protection. Normally this MOSFET If the junction temperature exceeds +165℃ (TYP), the
sources current to the load (source to drain direction) device is forced to stop switching. It will recover
while the inductor current is decreasing. At the end of automatically when TJ falls below the recovery threshold.
each cycle, this current is compared to the preset
IL

ILIM_HS

ILIM_LS

High-side
MOSFET
Skip pulse when IL is Skip pulse when IL is
higher than ILIM_LS higher than ILIM_LS

Low-side
MOSFET

T T T T
Note: T = 1/fSW

Figure 4. Over-Current Protection for MOSFETs

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4.5V to 28V Input, 3A Output,
SGM61230 Synchronous Step-Down Converter

APPLICATION INFORMATION

BOOT

CBOOT
SGM61230 0.1μF
VIN = 24V L VOUT = 5V, 3A
VIN SW
10μH
R1 C1 C2 C3 C4 RFB1
500kΩ 10μF 0.1μF 22μF 22μF 100kΩ

EN FB

R2 RFB2
100kΩ GND 13.3kΩ

Figure 5. A Reference Design for 5V, 3A Application

Design Requirements
 A 10pF feedforward capacitor is optioned to improve the response.
 When the output is shorted, a large input capacitor is required to ensure that the output voltage ripple is lower than
1V, otherwise the device may not be stable.
 To reduce the output ripple and keep the device stable, the output capacitor must be large. The recommended
value should not be lower than 22μF + 22μF, and a 100μF output capacitor will be very helpful for reducing ripple.
 0.1% RFB1, RFB2 will be chosen to improve the output voltage precision, if it is needed.
 In order to obtain a small VOUT ripple, it is recommended that the VIN is higher than 7V when the VOUT is 5V, and the
VIN is lower than 20V when the VOUT is 1.8V.

Layout Guide
Layout guide schematic for PCB Layout.
J1
TP1
VIN 8V~28V
VIN 3 6
VIN BOOT
C4
100μF/35V C1 C2 R4 0.1μF
10μF 0.1μF J3
Optional 510kΩ SGM61230 L TP2
VOUT
5 2 VOUT
EN SW
10μH 5A
J2
TP3 C5 C6 C7
GND
SW 22μF 22μF NC 5V/3A
4 1
EN FB GND
2 TP4 TP5
R2 100kΩ J4
JP1 1 GND GND GND
R1 499Ω
R5 R3
105kΩ 13.3kΩ C3
10pF

Figure 6. Schematic for PCB Layout

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4.5V to 28V Input, 3A Output,
SGM61230 Synchronous Step-Down Converter

APPLICATION INFORMATION (continued)

Figure 7. PCB Top Layer Figure 8. PCB Bottom Layer

REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (NOVEMBER 2020) to REV.A Page


Changed from product preview to production data ............................................................................................................................................. All

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14
PACKAGE INFORMATION

PACKAGE OUTLINE DIMENSIONS


TSOT-23-6

0.95 0.69
D

E1 E 2.59

0.99

RECOMMENDED LAND PATTERN (Unit: mm)

θ
A1 0.25 c
A2

Dimensions Dimensions
Symbol In Millimeters In Inches
MIN MAX MIN MAX
A 1.000 0.043
A1 0.000 0.100 0.000 0.004
A2 0.700 0.900 0.028 0.039
b 0.300 0.500 0.012 0.020
c 0.080 0.200 0.003 0.008
D 2.850 2.950 0.112 0.116
E 1.550 1.650 0.061 0.065
E1 2.650 2.950 0.104 0.116
e 0.950 BSC 0.037 BSC
L 0.300 0.600 0.012 0.024
θ 0° 8° 0° 8°

SG Micro Corp TX00038.001


www.sg-micro.com
PACKAGE INFORMATION

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

P2 P0

W
Q1 Q2 Q1 Q2 Q1 Q2
B0
Q3 Q4 Q3 Q4 Q3 Q4

Reel Diameter

P1 A0 K0

Reel Width (W1)

DIRECTION OF FEED

NOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL


Reel Width
Reel A0 B0 K0 P0 P1 P2 W Pin1
Package Type W1
Diameter (mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
(mm)

DD0001
TSOT-23-6 7″ 9.5 3.20 3.10 1.10 4.0 4.0 2.0 8.0 Q3

SG Micro Corp TX10000.000


www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS

NOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF CARTON BOX

Length Width Height


Reel Type Pizza/Carton
(mm) (mm) (mm)

7″ (Option) 368 227 224 8


DD0002

7″ 442 410 224 18

SG Micro Corp TX20000.000


www.sg-micro.com

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