SIM7600E_SIM7600E-H _Hardware

Design_V1.02
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Document Title SIM7600E_SIM7600E-H _Hardware Design

Version 1.02

Date 2022-11-03

Status Released

Document Control ID SIM7600E_SIM7600E-H _Hardware Design _V1.02

General Notes
SIMCom offers this information as a service to its customers to support the application and
engineering efforts that use the products designed by SIMCom. The information provided is based
on the requirements specifically from the customers. SIMCom has not undertaken any independent
search for additional relevant information, including any information that may be in the customer’s
possession. Furthermore, the system validation of the product designed by SIMCom within a larger
electronic system remains the responsibility of the customer or the customer’s system integrator.
All specifications supplied herein are subject to change without notice.

Copyright
This document contains the proprietary technical information which is the property of SIMCom
Limited, copying of this document, giving it to others, the using or communication of the contents
thereof are forbidden without the official authority by SIMCom. Offenders are liable to the
payment of the damages. All rights are reserved in the event of grant of a patent or the registration
of a utility model or design. All specifications supplied herein are subject to change without notice

Copyright © SIMCom Wireless Solutions Co., Ltd. 2022

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Contents

Contents............................................................................................................................................... 3

Table Index.......................................................................................................................................... 5

Figure Index........................................................................................................................................ 7

Revision History..................................................................................................................................8

1 Introduction..................................................................................................................................9
1.1 Product Outline....................................................................................................................... 9
1.2 Hardware Interface Overview...............................................................................................10
1.3 Hardware Block Diagram..................................................................................................... 11
1.4 Functional Overview.............................................................................................................12

2 Package Information................................................................................................................. 14
2.1 Pin Assignment Overview.................................................................................................... 14
2.2 Pin Description......................................................................................................................16
2.3 Mechanical Information........................................................................................................20
2.4 Footprint Recommendation.................................................................................................. 20

3 Interface Application.................................................................................................................22
3.1 Power Supply........................................................................................................................ 22
3.1.1 Power Supply Design Guide..........................................................................................23
3.1.2 Recommended Power Supply Circuit............................................................................24
3.1.3 Voltage Monitor............................................................................................................. 24
3.2 Power on/Power off/Reset Function.....................................................................................25
3.2.1 Power on........................................................................................................................ 25
3.2.2 Power off........................................................................................................................ 26
3.2.3 Reset Function................................................................................................................27
3.3 UART Interface.....................................................................................................................28
3.3.1 UART Design Guide......................................................................................................28
3.3.2 RI and DTR Behavior.................................................................................................... 29
3.4 USB Interface........................................................................................................................30
3.5 USIM Interface..................................................................................................................... 31
3.5.1 USIM Application Guide............................................................................................... 31
3.6 PCM Interface.......................................................................................................................34
3.6.1 PCM timing....................................................................................................................34
3.6.2 PCM Application Guide.................................................................................................36
3.7 SD Interface.......................................................................................................................... 36
3.8 I2C Interface......................................................................................................................... 37
3.9 SDIO Interface...................................................................................................................... 38
3.10 SPI Interface...................................................................................................................... 38
3.11 Network status................................................................................................................... 38
3.12 Flight Mode Control..........................................................................................................39
3.13 Other interface................................................................................................................... 40
3.13.1 Sink Current Source................................................................................................... 40
3.13.2 ADC............................................................................................................................41
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3.13.3 LDO............................................................................................................................ 41

4 RF Specifications........................................................................................................................42
4.1 GSM/UMTS/LTE RF Specifications....................................................................................42
4.2 GSM /UMTS/LTE Antenna Design Guide...........................................................................44
4.3 GNSS.................................................................................................................................... 45
4.3.1 GNSS Technical specification....................................................................................... 45
4.3.2 GNSS Application Guide...............................................................................................46

5 Electrical Specifications............................................................................................................ 48
5.1 Absolute maximum ratings...................................................................................................48
5.2 Operating conditions.............................................................................................................48
5.3 Operating Mode.................................................................................................................... 49
5.3.1 Operating Mode Definition............................................................................................49
5.3.2 Sleep mode..................................................................................................................... 50
5.3.3 Minimum functionality mode and Flight mode.............................................................50
5.4 Current Consumption............................................................................................................51
5.5 ESD Notes.............................................................................................................................52

6 SMT Production Guide............................................................................................................. 53

6.1 Top and Bottom View of MODULE.................................................................................... 53
6.2 Label Information................................................................................................................. 54
6.3 Typical SMT Reflow Profile.................................................................................................54
6.4 Moisture Sensitivity Level (MSL)........................................................................................55
6.5 Stencil Foil Design Recommendation.................................................................................. 56

7 Packaging....................................................................................................................................57

Appendix............................................................................................................................................59
A. Reference Design....................................................................................................................... 59
B. Coding Schemes and Maximum Net Data Rates over Air Interface......................................... 60
C. Related Documents.....................................................................................................................62
D. Terms and Abbreviations........................................................................................................... 64
E. Safety Caution.............................................................................................................................66

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Table Index
Table 1: Module frequency bands.......................................................................................................................... 9
Table 2: General features..................................................................................................................................... 12
Table 3: Pin definition..........................................................................................................................................15
Table 4: IO parameters definition........................................................................................................................ 16
Table 5: Pin description........................................................................................................................................16
Table 6: VBAT pins electronic characteristic.......................................................................................................22
Table 7: Recommended Zener diode list..............................................................................................................23
Table 8: Power on timing and electronic characteristic....................................................................................... 26
Table 9: Power off timing and electronic characteristic.......................................................................................27
Table 10: RESET pin electronic characteristic.................................................................................................... 28
Table 11: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V)....................................................31
Table 12: USIM electronic characteristic 3.0V mode (USIM_VDD=2.95V)......................................................31
Table 13: Amphenol USIM socket pin description.............................................................................................. 33
Table 14: PCM format..........................................................................................................................................34
Table 15: PCM timing parameters....................................................................................................................... 35
Table 16: MMC/SD electronic characteristic (SD_DATA0-SD_DATA3，SD_CLK and SD_CMD) *.............36
Table 17: NETLIGHT pin status..........................................................................................................................39
Table 18: FLIGHTMODE pin status....................................................................................................................39
Table 19: Sink current electronic characteristic................................................................................................... 40
Table 20: ADC1 and ADC2 electronic characteristics......................................................................................... 41
Table 21: Electronic characteristic....................................................................................................................... 41
Table 22: Conducted transmission power............................................................................................................ 42
Table 23: Operating frequencies.......................................................................................................................... 42
Table 24: E-UTRA operating bands..................................................................................................................... 43
Table 25: Conducted receive sensitivity.............................................................................................................. 43
Table 26: Reference sensitivity (QPSK).............................................................................................................. 43
Table 27: Trace loss..............................................................................................................................................44
Table 28: Recommended TVS............................................................................................................................. 45
Table 29: Absolute maximum ratings.................................................................................................................. 48
Table 30: Recommended operating ratings..........................................................................................................48
Table 31: 1.8V Digital I/O characteristics*..........................................................................................................48
Table 32: Operating temperature..........................................................................................................................49
Table 33: Operating mode Definition.................................................................................................................. 49
Table 34: Current consumption on VBAT Pins (VBAT=3.8V)........................................................................... 51
Table 35: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%).............................. 52
Table 36: The description of label information....................................................................................................54
Table 37: Moisture Sensitivity Level and Floor Life........................................................................................... 55
Table 38: Tray size............................................................................................................................................... 58
Table 39: Small Carton size................................................................................................................................. 58
Table 40: Big Carton size.....................................................................................................................................58
Table 41: Coding Schemes and Maximum Net Data Rates over Air Interface....................................................60
Table 42: Related Documents.............................................................................................................................. 62
Table 43: Terms and Abbreviations......................................................................................................................64

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Table 44: Safety Caution......................................................................................................................................66

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Figure Index
Figure 1: MODULE block diagram..................................................................................................................... 11
Figure 2: Pin assignment overview...................................................................................................................... 14
Figure 3: Dimensions (Unit: mm)........................................................................................................................ 20
Figure 4: Footprint recommendation (Unit: mm)................................................................................................ 21
Figure 5: VBAT voltage drop during burst emission (GSM/GPRS)....................................................................22
Figure 6: Power supply application circuit.......................................................................................................... 23
Figure 7: Linear regulator reference circuit......................................................................................................... 24
Figure 8: Switching mode power supply reference circuit.................................................................................. 24
Figure 9: Reference power on/off circuit............................................................................................................. 25
Figure 10: Power on timing sequence..................................................................................................................25
Figure 11: Power off timing sequence................................................................................................................. 27
Figure 12: Reference reset circuit........................................................................................................................ 27
Figure 13: UART full modem.............................................................................................................................. 28
Figure 14: UART null modem............................................................................................................................. 28
Figure 15: Reference circuit of level shift............................................................................................................29
Figure 16: RI behaviour（SMS and URC report）.............................................................................................29
Figure 17: RI behaviour（voice call）................................................................................................................30
Figure 18: USB reference circuit......................................................................................................................... 30
Figure 19: USIM interface reference circuit........................................................................................................ 32
Figure 20: Amphenol SIM card socket................................................................................................................ 33
Figure 21: PCM_SYNC timing............................................................................................................................34
Figure 22: EXT codec to MODULE timing........................................................................................................ 34
Figure 23: Module to EXT codec timing............................................................................................................. 35
Figure 24: Audio codec reference circuit............................................................................................................. 36
Figure 25: SD reference circuit............................................................................................................................ 37
Figure 26: I2C reference circuit........................................................................................................................... 37
Figure 27: NETLIGHT reference circuit............................................................................................................. 38
Figure 28: Flight mode switch reference circuit.................................................................................................. 39
Figure 29: ISINK reference circuit...................................................................................................................... 40
Figure 30: Antenna matching circuit (MAIN_ANT)........................................................................................... 44
Figure 31: Antenna matching circuit (AUX_ANT)............................................................................................. 45
Figure 32: Active antenna circuit......................................................................................................................... 46
Figure 33: Passive antenna circuit (Default)........................................................................................................46
Figure 34: Top and bottom view of MODULE....................................................................................................53
Figure 35: Label information............................................................................................................................... 54
Figure 36: The ramp-soak-spike reflow profile of MODULE.............................................................................55
Figure 37: packaging diagram..............................................................................................................................57
Figure 38: Tray drawing.......................................................................................................................................57
Figure 39: Small carton drawing..........................................................................................................................58
Figure 40: Big carton drawing............................................................................................................................. 58
Figure 41: Reference design.................................................................................................................................59

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Revision History

Data Version Description of change Author

Ma Honggang
2017-10-11 1.00 Original
Gao Fan

Modify Table2,Table15,Table 8,Table16, Table21,

Table 26
Gao Fan
2017-11-23 1.01 Modify Figure 4,Figure 10
Yuan Shijie
Modify 3.13.3 LDO output voltage 2.85V by default.
Rename VDD_EXT to VDD_AUX

2022-11-03 1.02 Update uart rate. Liu Wang Rong

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1 Introduction

This document describes the electronic specifications, RF specifications, interfaces, mechanical

characteristics and testing results of the SIMCom MODULE. With the help of this document and
other software application notes/user guides, users can understand and use MODULE to design and
develop applications quickly.

1.1 Product Outline

Aimed at the global market, the MODULE support GSM, WCDMA, LTE-TDD and LTE-FDD.
Users can choose the MODULE according to the wireless network configuration. The supported
radio frequency bands are described in the following table.

Table 1: Module frequency bands

Module
Standard Frequency
SIM7600E SIM7600E-H
EGSM 900MHz  
GSM
DCS1800MHz  
BAND1  
WCDMA BAND5  
BAND8  
LTE-FDD B1  
LTE-FDD B3  
LTE-FDD B5  
LTE-FDD
LTE-FDD B7  
LTE-FDD B8  
LTE-FDD B20  
LTE TDD B38  
LTE-TDD LTE TDD B40  
LTE TDD B41  
Category CAT1 CAT4
GNSS  

With a small physical dimension of 30*30*2.9 mm and with the functions integrated, the
MODULE can meet almost any space requirement in users’ applications, such as smart phone,
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PDA, industrial handheld, machine-to-machine and vehicle application, etc.

1.2 Hardware Interface Overview

The interfaces are described in detail in the next chapters include:

● Power Supply
● USB Interface
● UART Interface
● MMC/SD Interface
● SDIO Interface
● USIM Interface
● GPIO
● ADC
● LDO Power Output
● Current Sink Source
● PCM Interface
● SPI Interface
● I2C Interface

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1.3 Hardware Block Diagram

The block diagram of the MODULE is shown in the figure below.

Figure 1: MODULE block diagram

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1.4 Functional Overview

Table 2: General features

Feature Implementation
Power supply Single supply voltage 3.4～4.2V
Power saving Current in sleep mode : <5mA
Radio frequency bands Please refer to the table 1
GSM/GPRS power class:
--EGSM900: 4 (2W)
--DCS1800: 1 (1W)
EDGE power class:
Transmitting power --EGSM900: E2 (0.5W)
--DCS1800: E1 (0.4W)
UMTS power class:
--WCDMA :3 (0.25W)
LTE power class: 3 (0.25W)
GPRS multi-slot class 12
EDGE multi-slot class 12
UMTS R99 speed: 384 kbps DL/UL
HSPA+: 5.76 Mbps(UL), 42 Mbps(DL)
Data Transmission
TD-HSDPA/HSUPA: 2.2 Mbps(UL), 2.8 Mbps(DL)
Throughput
LTE CAT 1: 10 Mbps(DL)
LTE CAT 1: 5 Mbps(DL)
LTE CAT 4 ：150 Mbps (DL)
LTE CAT 4 ：50 Mbps (UL)
GSM/UMTS/LTE main antenna.
Antenna UMTS/LTE auxiliary antenna
GNSS antenna
GNSS engine (GPS,GLONASS and BD)
GNSS
Protocol: NMEA
MT, MO, CB, Text and PDU mode
SMS SMS storage: USIM card or ME(default)
Transmission of SMS alternatively over CS or PS.
USIM interface Support identity card: 1.8V/ 3V
Support SAT class 3, GSM 11.14 Release 98
USIM application toolkit
Support USAT
Phonebook management Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN
Support PCM interface
Audio feature Only support PCM master mode and short frame sync, 16-bit linear data
formats
A full modem serial port by default
UART interface Baud rate: 300bps to 3.6Mbps(default:115200bps)
Autobauding baud rate: 9600,19200,38400,57600,115200bps
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Can be used as the AT commands or data stream channel
Support RTS/CTS hardware handshake
Multiplex ability according to GSM 07.10 Multiplexer Protocol
MMC/SD Support MMC and SD cards with 2.85 V on SD port
SDIO Support SDIO with 1.8 V only on SDIO port
USB USB 2.0 high speed interface

Firmware upgrade Firmware upgrade over USB interface or FOTA

Size:30*30*2.9m
Physical characteristics
Weight:5.7 g
Normal operation temperature: -30°C to +80°C
Temperature range Extended operation temperature: -40°C to +85°C*
Storage temperature -45°C to +90°C
*Note: Module is able to make and receive voice calls, data calls, SMS and make
GPRS/UMTS/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly
from the 3GPP specifications if the temperature is outside the normal operating temperature
range and still within the extreme operating temperature range.

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2 Package Information

2.1 Pin Assignment Overview

All functions of the MODULE will be provided through 87 pads that will be connected to the
customers’ platform. The following Figure is a high-level view of the pin assignment of the
MODULE.

Figure 2: Pin assignment overview

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Table 3: Pin definition

Pin No. Pin name Pin No. Pin name

1 GND 2 GND
3 PWRKEY 4 RESET
5 GND 6 SPI_CLK
7 SPI_MISO 8 SPI_MOSI
9 SPI_CS 10 GND
11 USB_VBUS 12 USB_DN
13 USB_DP 14 GND
15 VDD_1V8 16 USB_ID
17 USIM_DATA 18 USIM_RST
19 USIM_CLK 20 USIM_VDD
21 SD_CMD 22 SD_DATA0
23 SD_DATA1 24 SD_DATA2
25 SD_DATA3 26 SD_CLK
27 SDIO_DATA1 28 SDIO_DATA2
29 SDIO_CMD 30 SDIO_DATA0
31 SDIO_DATA3 32 SDIO_CLK
33 GPIO3 34 GPIO6
35 HSIC_STROBE 36 HSIC_DATA
37 GND 38 VBAT
39 VBAT 40 GND
41 GND 42 NC (RESERVED)
43 GND 44 VDD_AUX
45 ISINK 46 ADC2
47 ADC1 48 SD_DET
49 STATUS 50 GPIO43*
51 NETLIGHT 52 GPIO41
53 USIM_DET 54 FLIGHTMODE
55 SCL 56 SDA
57 GND 58 GND
59 AUX_ANT 60 GND
61 GND 62 VBAT
63 VBAT 64 GND
65 GND 66 RTS
67 CTS 68 RXD

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69 RI 70 DCD
71 TXD 72 DTR
73 PCM_OUT 74 PCM_IN
75 PCM_SYNC 76 PCM_CLK
77 GND 78 GND
79 GNSS_ANT 80 GND
81 GND 82 MAIN_ANT
83 COEX1* 84 COEX2
85 BOOT_CFG0* 86 COEX3*
87 GPIO77
NOTE: Before the normal power up, GPIO43 ， COEX1, COEX3 and BOOT_CFG0
cannot be pulled up.

2.2 Pin Description

Table 4: IO parameters definition

Pin type Description

PI Power input
PO Power output
AI Analog input
AIO Analog input/output
I/O Bidirectional input /output
DI Digital input
DO Digital output
DOH Digital output with high level
DOL Digital output with low level
PU Pull up
PD Pull down

Table 5: Pin description

Default
Pin name Pin No. Description Comment
status
Power supply
38,39, Power supply, voltage range:
VBAT PI
62,63 3.4～4.2V.
LDO power output for other
external circuits with Max
150mA current output. Its
output voltage is 2.85V by If unused, keep it
VDD_AUX 44 PO
default.（The voltage can be open.
configured from 1.7V to 3.05V
by AT command）.
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1.8 output with Max 50mA If unused, keep it
current output for external open.
VDD_1V8 15 PO
circuit, such as level shift
circuit.
1,2,5,
10,14,37
,40,41,4
GND 3,57,58, Ground
60,61,64
,65,77,7
8,80,81
System Control
System power on/off control The high voltage is
PWRKEY 3 DI,PU
input, active low. 0.8V;
RESET has been
System reset control input, pulled up to 1.8V via
RESET 4 DI, PU
active low. 40Kohm resistor
internally.
SD interface
SD_CMD 21 DO SDIO command
SD_DATA0 22 I/O
SD_DATA1 23 I/O SDIO data If unused, keep them
SD_DATA2 24 I/O open.

SD_DATA3 25 I/O
SD_CLK 26 DO SDIO clock
USIM interface

USIM Card data I/O, which has

been pulled up via a 10KR
USIM_DATA 17 I/O,PU resistor to USIM_VDD
internally. Do not pull it up or
down externally.
USIM_RST 18 DO USIM Reset All lines of USIM
interface should be
USIM_CLK 19 DO USIM clock protected against
ESD.

Power output for USIM card,

its output Voltage depends on
USIM_VDD 20 PO USIM card type automatically.
Its output current is up to
50mA.
SPI interface
SPI_CLK 6 DO SPI clock output
This function is not
SPI_MISO 7 DI SPI master in/slave out data supported yet .
SPI_MOSI 8 DO SPI master out/slave in data If unused, please keep
them open.
SPI_CS 9 DO SPI chip-select output
USB
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Valid USB detection input with

USB_VBUS 11 DI,PD
3.0~5.25V detection voltage

Negative line of the differential,

USB_DN 12 I/O
bi-directional USB signal.
Positive line of the differential,
USB_DP 13 I/O
bi-directional USB signal.
USB_ID 16 DI High-speed USB ID input Keep it open.
UART interface
RTS 66 DOH Request to send
CTS 67 DI,PU Clear to Send
RXD 68 DI,PU Receive Data
If unused, keep them
RI 69 DOH Ring Indicator
open.
DCD 70 DOH Carrier detects
TXD 71 DOH Transmit Data
DTR 72 DI,PU DTE get ready
I2C interface
If unused, keep open,
SCL 55 DO I2C clock output
or else pull them up
via 4.7KΩ resistors to
SDA 56 I/O I2C data input/output 1.8V.
SDIO interface
SDIO_DATA1 27 I/O SDIO data1
SDIO_DATA2 28 I/O SDIO data2
SDIO_CMD 29 DO SDIO command
For WLAN solution
SDIO_DATA0 30 I/O SDIO data0
SDIO_DATA3 31 I/O SDIO data3
SDIO_CLK 32 DO SDIO clock
HSIC interface
HSIC_STROB DO
35 HSIC strobe wakeup
E Reserved
HSIC_DATA 36 I/O HSIC data
PCM interface
PCM_OUT 73 DO PCM data output.
PCM_IN 74 DI PCM data input. If unused, please keep
PCM_SYNC 75 DO PCM data frame sync signal. them open.
PCM_CLK 76 DO PCM data bit clock.
GPIO
LED control output as network If unused, keep them
NETLIGHT 51 DO
status indication. open.
Flight Mode control input. DO NOT PULL UP
High level(or open): Normal GPIO43 DURING
FLIGHTMODE 54 DI,PU NORMAL POWER
Mode
Low level: Flight Mode UP!

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Operating status output.
High level: Power on and
STATUS 49 DO
firmware ready
Low level: Power off
GPIO41 52 IO GPIO
GPIO43 50 IO GPIO

GPIO3 33 IO GPIO

GPIO6 34 IO GPIO
Default: GPIO
Optional: SD card detecting
SD_DET 48 IO input.
H: SD card is removed
L: SD card is inserted
Default: GPIO
Optional: USIM card detecting
USIM_DET 53 IO input.
H: USIM is removed
L: USIM is inserted
GPIO77 87 IO GPIO
RF interface
MAIN _ANT 82 AIO MAIN antenna soldering pad
GNSS_ANT 79 AI GNSS antenna soldering pad
AUX_ANT 59 AI Auxiliary antenna soldering pad
Other interface
ISINK 45 PI Ground-referenced current sink.
Analog-digital converter input If unused, please keep
ADC1 47 AI
1 them open.
Analog-digital converter input
ADC2 46 AI
2
COEX1 83 I/O If unused, keep them
open.
COEX2 84 I/O RF synchronizing between DO NOT PULL UP
Wi-Fi and LTE. COEX1 AND COEX2
COEX3 86 I/O DURING NORMAL
POWER UP!
Do place 2 test points
Boot configuration input.
for debug.
Module will be forced into
DO NOT PULL UP
BOOT_CFG0 85 DI,PD USB download mode by
BOOT_CFG0
connect 85 pin to VDD_1V8
DURING NORMAL
during power up.
POWER UP!
NC 42 No connection. Keep it open

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2.3 Mechanical Information

The following figure shows the package outline drawing of MODULE.

Figure 3: Dimensions (Unit: mm)

2.4 Footprint Recommendation

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Figure 4: Footprint recommendation (Unit: mm)

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3 Interface Application

3.1 Power Supply

The power supply pins of MODULE include 4 pins (pin 62&63, pin 38&39) named VBAT.
The 4 VBAT pads supply the power to RF and baseband circuits directly. On VBAT pads, the ripple
current up to 2A typically, due to GSM/GPRS emission burst (every 4.615ms), may cause voltage
drop. So the power supply for these pads must be able to provide sufficient current up to more than
2A in order to avoid the voltage drop is more than 300mV.
The following figure shows the VBAT voltage ripple wave at the maximum power transmit phase.

Figure 5: VBAT voltage drop during burst emission (GSM/GPRS)

Note: The test condition: The voltage of power supply for VBAT is 3.8V, Cd=100 µF tantalum
capacitor (ESR=0.7Ω) and Cf=100nF (Please refer to Figure 6—Application circuit).

Table 6: VBAT pins electronic characteristic

Symbol Description Min. Typ. Max. Unit

VBAT Module power voltage 3.4 3.8 4.2 V
IVBAT(peak) Module power peak current in normal mode. - 2 - A
IVBAT(average) Module power average current in normal mode Please refer to the table 34
IVBAT(sleep) Power supply current in sleep mode
IVBAT(power-off) Module power current in power off mode. - - 20 uA

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3.1.1 Power Supply Design Guide

Make sure that the voltage on the VBAT pins will never drop below 3.4V, even during a transmit
burst, when current consumption may rise up to 2A. If the voltage drops below 3.4V, the RF
performance may be affected.
Note: If the power supply for VBAT pins can support up to 2A, using a total of more than 300uF
capacitors is recommended, or else users must using a total of 1000uF capacitors typically, in
order to avoid the voltage drop is more than 300mV.
Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band
can be used for EMC.
These capacitors should be put as close as possible to VBAT pads. Also, users should keep VBAT
trace on circuit board wider than 2 mm to minimize PCB trace impedance. The following figure
shows the recommended circuit.

Figure 6: Power supply application circuit

In addition, in order to guard for over voltage protection, it is suggested to use a zener diode with
5.1V reverse zener voltage and more than 500mW power dissipation.
Note: customer could only power pin 62, 63 or only power pin 38, 39, for these pins are
connected inside the MODULE.

Table 7: Recommended Zener diode list

No. Manufacturer Part Number Power dissipation Package

1 On semi MMSZ5231BT1G 500mW SOD123
2 Prisemi PZ3D4V2H 500mW SOD323
3 Vishay MMSZ4689-V 500mW SOD123
4 Crownpo CDZ55C5V1SM 500mW 0805

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3.1.2 Recommended Power Supply Circuit

It is recommended that a switching mode power supply or a linear regulator power supply is used.
It is important to make sure that all the components used in the power supply circuit can resist a
peak current up to 2A.
The following figure shows the linear regulator reference circuit with 5V input and 3.8V output.

Figure 7: Linear regulator reference circuit

If there is a big voltage difference between input and output for VBAT power supply, or the
efficiency is extremely important, then a switching mode power supply will be preferable. The
following figure shows the switching mode power supply reference circuit.

Figure 8: Switching mode power supply reference circuit

Note: The Switching Mode power supply solution for VBAT must be chosen carefully against
Electro Magnetic Interference and ripple current from depraving RF performance.

3.1.3 Voltage Monitor

To monitor the VBAT voltage, the AT command “AT+CBC” can be used.

For monitoring the VBAT voltage outside or within a special range, the AT command
“AT+CVALARM” can be used to enable the under-voltage warning function.
If users need to power off MODULE, when the VBAT voltage is out of a range, the AT command
“AT+CPMVT” can be used to enable under-voltage power-off function.
Note: Under-voltage warning function and under-voltage power-off function are disabled by
default. For more information about these AT commands, please refer to Document [1].

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3.2 Power on/Power off/Reset Function

3.2.1 Power on

MODULE can be powered on by pulling the PWRKEY pin down to ground.

The PWRKEY pin has been pulled up with a diode to 1.8V internally, so it does not need to be
pulled up externally. It is strongly recommended to put a100nF capacitor, an ESD protection diode,
close to the PWRKEY pin as it would strongly enhance the ESD performance of PWRKEY pin.
Please refer to the following figure for the recommended reference circuit.

Figure 9: Reference power on/off circuit

Note: Module could be automatically power on by connecting PWRKEY pin to ground via 0R
resistor directly.

The power-on scenarios are illustrated in the following figure.

Figure 10: Power on timing sequence

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Table 8: Power on timing and electronic characteristic

Ty
Symbol Parameter Min. Max. Unit
p.
The time of active low level impulse of PWRKEY
Ton 100 500 - ms
pin to power on MODULE
The time from power-on issue to STATUS pin output 12 13 -
Ton(status) s
high level(indicating power up ready )
Ton(uart) The time from power-on issue to UART port ready 11 12 - s
Ton(vdd_aux) The time from power-on issue to VDD_AUX ready 2.5 - s
Ton(usb) The time from power-on issue to USB port ready 11 12 - s
VIH Input high level voltage on PWRKEY pin 0.6 0.8 1.8 V
VIL Input low level voltage on PWRKEY pin -0.3 0 0.5 V

3.2.2 Power off

The following methods can be used to power off MODULE.

● Method 1: Power off MODULE by pulling the PWRKEY pin down to ground.
● Method 2: Power off MODULE by AT command “AT+CPOF”.
● Method 3: over-voltage or under-voltage automatic power off. The voltage range can be set by
AT command “AT+CPMVT”.
● Method 4: over-temperature or under-temperature automatic power off.

Note: If the temperature is outside the range of -30~+80℃, some warning will be reported via
AT port. If the temperature is outside the range of -40~+85℃, MODULE will be powered off
automatically.

For details about “AT+CPOF” and “AT+CPMVT”, please refer to Document [1].

These procedures will make MODULE disconnect from the network and allow the software to
enter a safe state, and save data before MODULE be powered off completely.
The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.

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Figure 11: Power off timing sequence

Table 9: Power off timing and electronic characteristic

Time value
Symbol Parameter Unit
Min. Typ. Max.
The active low level time pulse on PWRKEY pin to
Toff 2.5 -- -- s
power off MODULE
The time from power-off issue to STATUS pin output low
Toff(status) 25 26 - s
level(indicating power off )*
Toff(uart) The time from power-off issue to UART port off 14 15 - s
Toff(usb) The time from power-off issue to USB port off 27 28 - s
Toff-on The buffer time from power-off issue to power-on issue 0 - - s
*Note: The STATUS pin can be used to detect whether MODULE is powered on or not. When
MODULE has been powered on and firmware goes ready, STATUS will be high level, or else
STATUS will still low level.

3.2.3 Reset Function

MODULE can be reset by pulling the RESET pin down to ground.

Note: This function is only used as an emergency reset, when AT command “AT+CPOF” and
the PWRKEY pin all have lost efficacy.
The RESET pin has been pulled up with a 40KΩ resistor to 1.8V internally, so it does not need to
be pulled up externally. It is strongly recommended to put a100nF capacitor and an ESD protection
diode close to the RESET pin. Please refer to the following figure for the recommended reference
circuit.

Figure 12: Reference reset circuit

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Table 10: RESET pin electronic characteristic

Symbol Description Min. Typ. Max. Unit

The active low level time impulse on RESET pin to
Treset 50 100 500 ms
reset MODULE
VIH Input high level voltage 1.17 1.8 2.1 V
VIL Input low level voltage -0.3 0 0.8 V

3.3 UART Interface

MODULE provides a 7-wire UART (universal asynchronous serial transmission) interface as DCE
(Data Communication Equipment). AT commands and data transmission can be performed through
UART interface.

3.3.1 UART Design Guide

The following figures show the reference design.

Figure 13: UART full modem

Figure 14: UART null modem

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The MODULE UART is 1.8V voltage interface. If user’s UART application circuit is 3.3V voltage
interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR
provided by Texas Instruments is recommended. The following figure shows the voltage matching
reference design.

Figure 15: Reference circuit of level shift

To comply with RS-232-C protocol, the RS-232-C level shifter chip should be used to connect
MODULE to the RS-232-C interface, for example SP3238ECA, etc.
Note: MODULE supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200,
38400, 57600, 115200, 230400, 460800, 921600, 3200000, 3686400bps. The default band rate is
115200bps.

3.3.2 RI and DTR Behavior

The RI pin can be used to interrupt output signal to inform the host controller such as application
CPU.
Normally RI will keep high level until certain conditions such as receiving SMS, or a URC report
coming, and then it will change to low level. It will stay low until the host controller clears the
interrupted event with “AT+CRIRS” AT command.

Figure 16: RI behaviour（SMS and URC report）

Normally RI will be kept at a high level until a voice call, then it will output periodic rectangular
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wave with 5900ms low level and 100ms high level. It will output this kind of periodic rectangular
wave until the call is answered or hung up.

Figure 17: RI behaviour（voice call）

Note: For more details of AT commands about UART, please refer to document [1] and [22].

DTR pin can be used to wake MODULE from sleep. When MODULE enters sleep mode, pulling
down DTR can wake MODULE.

3.4 USB Interface

The MODULE contains a USB interface compliant with the USB2.0 specification as a peripheral,
but the USB charging function is not supported.
MODULE can be used as a USB device. MODULE supports the USB suspend and resume
mechanism which can reduce power consumption. If there is no data transmission on the USB bus,
MODULE will enter suspend mode automatically, and will be resumed by some events such as
voice call, receiving SMS, etc.

Figure 18: USB reference circuit

Because of the high bit rate on USB bus, more attention should be paid to the influence of the
junction capacitance of the ESD component on USB data lines. Typically, the capacitance should
be less than 1pF. It is recommended to use an ESD protection component such as ESD9L5.0ST5G
provided by On Semiconductor (www.onsemi.com ).
D3 is suggested to select the diode with anti-ESD and voltage surge function, or customer could
add a ZENER diode for surge clamping. The recommend diodes please refer to table 7.

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Note：The USB_DN and USB_DP nets must be traced by 90Ohm+/-10% differential impedance.

3.5 USIM Interface

MODULE supports both 1.8V and 3.0V USIM Cards.

Table 11: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V)

Symbol Parameter Min. Typ. Max. Unit

USIM_
LDO power output voltage 1.75 1.8 1.95 V
VDD

VIH High-level input voltage 0.65*USIM_VDD - USIM_VDD +0.3 V

VIL Low-level input voltage -0.3 0 0.35*USIM_VDD V

VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V

VOL Low-level output voltage 0 0 0.45 V

Table 12: USIM electronic characteristic 3.0V mode (USIM_VDD=2.95V)

Symbol Parameter Min. Typ. Max. Unit

USIM_
LDO power output voltage 2.75 2.95 3.05 V
VDD

VIH High-level input voltage 0.65*USIM_VDD - USIM_VDD +0.3 V

VIL Low-level input voltage -0.3 0 0.25*USIM_VDD V

VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V

VOL Low-level output voltage 0 0 0.45 V

3.5.1 USIM Application Guide

It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST

(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the USIM
peripheral circuit should be close to the USIM card socket. The following figure shows the 6-pin
SIM card holder reference circuit.

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Figure 19: USIM interface reference circuit

Note: USIM_DATA has been pulled up with a 10KΩ resistor to USIM_VDD in MODULE. A
100nF capacitor on USIM_VDD is used to reduce interference. For more details of AT
commands about USIM, please refer to document [1].USIM_CLK is very important signal, the
rise time and fall time of USIM_CLK should be less than 40ns, otherwise the USIM card might
not be initialized correctly.

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Recommended USIM Card Holder

It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by
Amphenol. User can visit http://www.amphenol.com for more information about the holder.

Figure 20: Amphenol SIM card socket

Table 13: Amphenol USIM socket pin description

Pin Signal Description

C1 USIM_VDD USIM Card Power supply.
C2 USIM_RST USIM Card Reset.
C3 USIM_CLK USIM Card Clock.
C5 GND Connect to GND.
C6 VPP
C7 USIM_DATA USIM Card data I/O.

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3.6 PCM Interface

MODULE provides a PCM interface for external codec, which can be used in master mode with
short sync and 16 bits linear format.

Table 14: PCM format

Characteristics Specification

Line Interface Format Linear(Fixed)

Data length 16bits(Fixed)
PCM Clock/Sync Source Master Mode(Fixed)
PCM Clock Rate 2048 KHz (Fixed)
PCM Sync Format Short sync(Fixed)
Data Ordering MSB
Note: For more details about PCM AT commands, please refer to document [1].

3.6.1 PCM timing

MODULE supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec.

Figure 21: PCM_SYNC timing

Figure 22: EXT codec to MODULE timing

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Figure 23: Module to EXT codec timing

Table 15: PCM timing parameters

Parameter Description Min. Typ. Max. Unit

T(sync) PCM_SYNC cycle time – 125 – μs
T(synch) PCM_SYNC high level time – 488 – ns
T(syncl) PCM_SYNC low level time – 124.5 – μs
T(clk) PCM_CLK cycle time – 488 – ns
T(clkh) PCM_CLK high level time – 244 – ns
T(clkl) PCM_CLK low level time – 244 – ns
PCM_SYNC setup time high before falling edge
T(susync) – 122 – ns
of PCM_CLK
PCM_SYNC hold time after falling edge of
T(hsync) – 366 – ns
PCM_CLK
PCM_IN setup time before falling edge of
T(sudin) 60 – – ns
PCM_CLK
PCM_IN hold time after falling edge of
T(hdin) 60 – – ns
PCM_CLK
T(pdout) Delay from PCM_CLK rising to PCM_OUT valid – – 60 ns
Delay from PCM_CLK falling to PCM_OUT
T(zdout) – – 60 ns
HIGH-Z

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3.6.2 PCM Application Guide

The following figure shows the external codec reference design.

Figure 24: Audio codec reference circuit

3.7 SD Interface

MODULE provides a 4-bit SD/MMC interface with clock rate up to 200 MHz, The voltage of
MMC/SD interface is 2.85V, which is compatible with SDIO Card Specification (version 3.0) and
Secure Digital (Physical Layer Specification, version 3.0).It supports up to 32GB SD cards.

Table 16: MMC/SD electronic characteristic (SD_DATA0-SD_DATA3 ， SD_CLK and

SD_CMD) *

Symbol Parameter Min. Typ. Max. Unit

VIH High-level input voltage 0.65*2.85 - 2.85+0.3 V

VIL Low-level input voltage -0.3 0 0.25*2.85 V

VOH High-level output voltage 2.85-0.4 2.85 2.85 V

VOL Low-level output voltage 0 0 0.45 V

Note:
*Be different from SD_DATA0-SD_DATA3 ， SD_CLK and SD_CMD ， SD_DET is 1.8V
operation voltage.

Customer should provide 2.85V for SD card and the current should more than 350mA. ESD/EMI
components should be arranged beside SD card socket. Refer to the following application circuit.

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Figure 25: SD reference circuit

SD card layout guide lines:

● Protect other sensitive signals/circuits from SD card signals.
● Protect SD card signals from noisy signals (clocks, SMPS, etc.).
● Up to 200 MHz clock rate, 50 Ω nominal, ±10% trace impedance
● CLK to DATA/CMD length matching < 1 mm
● 15–24 Ω termination resistor on clock lines near MODULE
● Total routing length < 50 mm recommended
● Routing distance from MODULE clock pin to termination resistor < 5 mm
● Spacing to all other signals = 2x line width
● Bus capacitance < 15 pF

3.8 I2C Interface

MODULE provides a I2C interface compatible with I2C specification, version 5.0, with clock rate
up to 400 kbps. Its operation voltage is 1.8V.

The following figure shows the I2C bus reference design.

Figure 26: I2C reference circuit

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Note ： SDA and SCL do not have pull-up resistors in MODULE. So, 2 external pull up resistors
are needed in application circuit.
“AT+CRIIC and AT+CWIIC” AT commands could be used to read/write register values of the
I2C peripheral devices. For more details about AT commands please refer to document [1].

3.9 SDIO Interface

MODULE provides a 4 bit 1.8V SDIO interface for WLAN solution.

The default WLAN MODULE is W58, and the application need software support.
Note: Only CAT4 MODULE support this function.

3.10 SPI Interface

MODULE provides a SPI interface as a master only. Its operation voltage is 1.8V, and its clock rate
is up to 26 MHz.
Note：This function is not supported yet. For detail information please contact FAE.

3.11 Network status

The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the
following figure.

Figure 27: NETLIGHT reference circuit

Note: The value of the resistor named “R” depends on the LED characteristic.

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Table 17: NETLIGHT pin status

NETLIGHT pin status Module status

Always On Searching Network; Call Connect(include VOLTE,SRLTE)
200ms ON, 200ms OFF Data Transmit; 4G registered;
800ms ON, 800ms OFF 2G/3G registered network
OFF Power off ;Sleep
Note: NETLIGHT output low level as “OFF”, and high level as “ON”.

3.12 Flight Mode Control

The FLIGHTMODE pin can be used to control MODULE to enter or exit the Flight mode. In
Flight mode, the RF circuit is closed to prevent interference with other equipments and minimize
current consumption. Bidirectional ESD protection component is suggested to add on
FLIGHTMODE pin, its reference circuit is shown in the following figure.

Figure 28: Flight mode switch reference circuit

Table 18: FLIGHTMODE pin status

FLIGHTMODE pin status Module operation

Input Low Level Flight Mode: RF is closed
AT+CFUN=0: RF is closed
Input High Level
AT+CFUN=1:RF is working

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3.13 Other interface

3.13.1 Sink Current Source

The ISINK pin is VBAT tolerant and intended to drive some passive devices, such as LCD
backlight and white LED, etc. Its output current can be up to 40mA and be set by the AT command
“AT+ CLEDITST”.

Table 19: Sink current electronic characteristic

Symbol Description Min. Typ. Max. Unit

VISINK Voltage tolerant 0.5 - VBAT V
IISINK Current tolerant 0 - 40 mA

ISINK is a ground-referenced current sink. The following figure shows its reference circuit.

Figure 29: ISINK reference circuit

Note: The sinking current can be adjusted to meet the design requirement through the AT
command “AT+ CLEDITST =<0>, <value>”.The “value” ranges from 0 to 8, on behalf of the
current from 0mA to 40mA by 5mA step.

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3.13.2 ADC

MODULE has 2 dedicated ADC pins named ADC1 and ADC2.They are available for digitizing
analog signals such as battery voltage and so on. These electronic specifications are shown in the
following table.

Table 20: ADC1 and ADC2 electronic characteristics

Characteristics Min. Typ. Max. Unit

Resolution – 15 – Bits
Conversion time – 442 – ms
Input Range 0.1 1.7 V
Input serial resistance 1 – – MΩ
Note: “AT+CADC” and “AT+CADC2” can be used to read the voltage of the ADC1 and ADC2
pins, for more details, please refer to document [1].

3.13.3 LDO

MODULE has a LDO power output, named VDD_AUX. its output voltage is 2.85V by default,
Users can switch the LDO on or off by the AT command “AT+CVAUXS” and configure its output
voltage by the AT command “AT+CVAUXV”.

Table 21: Electronic characteristic

Symbol Description Min. Typ. Max. Unit

VVDD_AUX Output voltage 1.7 2.85 3.05 V
IO Output current - - 150 mA
Note：For more details of AT commands about VDD_AUX, please refer to document [1].

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4 RF Specifications

4.1 GSM/UMTS/LTE RF Specifications

Table 22: Conducted transmission power

Frequency Power Min.

EGSM900 33dBm ±2dB 5dBm ± 5dB
DCS1800 30dBm ±2dB 0dBm ± 5dB
EGSM900 (8-PSK) 27dBm ±3dB 5dBm ± 5dB
DCS1800 (8-PSK) 26dBm +3/-4dB 0dBm ±5dB
WCDMA B1 24dBm +1/-3dB <-50dBm
WCDMA B5 24dBm +1/-3dB <-50dBm
WCDMA B8 24dBm + 1/-3dB <-50dBm
LTE-FDD B1 23dBm +/-2.7dB <-40dBm
LTE-FDD B3 23dBm +/-2.7dB <-40dBm
LTE-FDD B5 23dBm +/-2.7dB <-40dBm
LTE-FDD B7 23dBm +/-2.7dB <-40dBm
LTE-TDD B8 23dBm +/-2.7dB <-40dBm
LTE-FDD B20 23dBm +/-2.7dB <-40dBm
LTE-TDD B38 23dBm +/-2.7dB <-40dBm
LTE-TDD B40 23dBm +/-2.7dB <-40dBm
LTE-TDD B41 23dBm +/-2.7dB <-40dBm

Table 23: Operating frequencies

Frequency Receiving Transmission

EGSM900 925～960MHz 880～915 MHz
DCS1800 1805～1880 MHz 1710～1785 MHz
WCDMA B1 2110～2170 MHz 1920～1980 MHz
WCDMA B5 869～894 MHz 824～849 MHz
WCDMA B8 925～960 MHz 880～915 MHz
The LTE Operating frequencies are shown in the following table 24.
Note: Operating frequencies of LTE TDD B41 for the MODULE is 100MHz BW, 2555～2655 MHz
GPS 1574.4 ～1576.44 MHz -
GLONASS 1598 ～1606 MHz -
BD 1559 ～1563 MHz

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Table 24: E-UTRA operating bands

E-UTRA Duplex
Uplink (UL) operating band Downlink(DL) operating band
operating band Mode
1 1920 ~1980 MHz 2110 ~2170 MHz FDD
3 1710 ~1785 MHz 1805 ~1880 MHz FDD
5 824～849 MHz 869～894MHz FDD
7 2500~2570MHz 2620~2690MHz FDD
8 880 ~915 MHz 925 ~960 MHz FDD
20 832~862MHz 791~ 821 FDD
38 2570 ~2620 MHz 2570 ~2620 MHz TDD
40 2300 ~2400 MHz 2300 ~2400 MHz TDD
41 2496 ~2690 MHz 2496 ~2690 MHz TDD

Table 25: Conducted receive sensitivity

Frequency Receive sensitivity(Typical) Receive sensitivity(MAX)

EGSM900 < -109dBm 3GPP
DCS1800 < -109dBm 3GPP
WCDMA 2100 < -110dBm 3GPP
WCDMA 900 < -110dBm 3GPP
WCDMA 800 < -110dBm 3GPP
LTE FDD/TDD See table 26. 3GPP

Table 26: Reference sensitivity (QPSK)

E-UTRA 3GPP standard Test value 3GPP standard

Duplex
band 1.4 MHz 3MHz 5MHz 10MHz 10 MHz 15 MHz 20 MHz
1 - - -100 -97 -101 -95.2 -94 FDD
3 -101.7 -98.7 -97 -94 -99 -92.2 -91 FDD
5 -103.2 -100.2 -98 -95 -99 FDD
7 -98 -95 -97 -93.2 -92 FDD
8 -102.2 -99.2 -97 -94 -102 FDD
20 -97 -94 -97 -91.2 -90 FDD
38 - - -100 -97 -101 -95.2 -94 TDD
40 - - -100 -97 -101 -95.2 -94 TDD
41 - - -99 -96 -101 -94.2 -93 TDD

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4.2 GSM /UMTS/LTE Antenna Design Guide

Users should connect antennas to MODULE’s antenna pads through micro-strip line or other types
of RF trace and the trace impedance must be controlled in 50Ω. SIMCom recommends that the
total insertion loss between the antenna pads and antennas should meet the following requirements:

Table 27: Trace loss

Frequency Loss
700MHz-960MHz <0.5dB
1710MHz-2170MHz <0.9dB
2300MHz-2650MHz <1.2dB

To facilitate the antenna tuning and certification test, a RF connector and an antenna matching
circuit should be added. The following figure is the recommended circuit.

Figure 30: Antenna matching circuit (MAIN_ANT)

In above figure, the components R1, C1, C2 and R2 are used for antenna matching, the values of
components can only be achieved after the antenna tuning and usually provided by antenna vendor.
By default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component
D1 is a TVS for ESD protection, and it is optional for users according to application environment.
The RF test connector is used for the conducted RF performance test, and should be placed as close
as to the MODULE’s MAIN_ANT pin. The traces impedance between MODULE and antenna
must be controlled in 50Ω.

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Figure 31: Antenna matching circuit (AUX_ANT)

In above figure, R3, C3, C4 and R4 are used for auxiliary antenna matching. By default, the R3, R4
are 0Ωresistors, and the C3, C4 are reserved for tuning. D2 is a TVS for ESD protection, and it is
optional for users according to application environment.
Two TVS are recommended in the table below.

Table 28: Recommended TVS

Package Part Number Vender

0201 LXES03AAA1-154 Murata
0402 LXES15AAA1-153 Murata

Note ： SIMCom suggests the LTE auxiliary antenna to be kept on, since there are many high
bands in the designing of LTE-TDD, such as band38, band40 and band41. Because of the high
insert loss of the RF cable and layout lines, the receiver sensitivity of these bands above will have
risk to meet the authentication without the diversity antenna. For more details about auxiliary
antenna design notice, please refer to document [25].

4.3 GNSS

MODULE merges GNSS (GPS/GLONASS/BD) satellite and network information to provide a

high-availability solution that offers industry-leading accuracy and performance. This solution
performs well, even in very challenging environmental conditions where conventional GNSS
receivers fail, and provides a platform to enable wireless operators to address both location-based
services and emergency mandates.

4.3.1 GNSS Technical specification

 Tracking sensitivity: -159 dBm（GPS）/-158 dBm（GLONASS）/-159 dBm（BD）

 Cold-start sensitivity: -148 dBm
 Accuracy (Open Sky): 2.5m (CEP50)
 TTFF (Open Sky) : Hot start <1s, Cold start<35s
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 Receiver Type: 16-channel, C/A Code
 GPS L1 Frequency: 1575.42±1.023MHz
 GLONASS: 1597.5~1605.8 MHz
 BD: 1559.05~1563.14 MHz
 Update rate: Default 1 Hz
 GNSS data format: NMEA-0183
 GNSS Current consumption : 100mA (GSM/UMTS/LTE Sleep ,in total on VBAT pins)
 GNSS antenna: Passive/Active antenna

Note: If the antenna is active type, the power should be given by main board because there is no
power supply on the GPS antenna pad. If the antenna is passive, it is suggested that the external
LNA should be used.

4.3.2 GNSS Application Guide

Users can adopt an active antenna or a passive antenna to MODULE. If using a passive antenna, an
external LNA is a must to get better performance. The following figures are the reference circuits.

Figure 32: Active antenna circuit

Figure 33: Passive antenna circuit (Default)

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In above figures, the components C1, L1 and L2 are used for antenna matching. Usually, the values
of the components can only be achieved after antenna tuning and usually provided by antenna
vendor. C2 is used for DC blocking. L3 is the matching component of the external LNA, and the
value of L3 is determined by the LNA characteristic and PCB layout. Both VDD of active antenna
and V_LNA need external power supplies which should be considered according to active antenna
and LNA characteristic. LDO/DCDC is recommended to get lower current consuming by shutting
down active antennas and LNA when GNSS is not working.
GNSS can be tested by NMEA port. NMEA sentences can be obtained through UART or USB
automatically. NMEA sentences include GSV, GGA, RMC, GSA, and VTG. Before using GNSS,
user should configure MODULE in proper operating mode by AT command. Please refer to related
documents for details. MODULE can also get position location information through AT directly.
Note: GNSS is closed by default and can be started by AT+CGPS. The AT command has two
parameters, the first is on/off, and the second is GNSS mode. Default mode is standalone mode.
AGPS mode needs more support from the mobile telecommunication network. Please refer to
document [24] for more details.

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5 Electrical Specifications

5.1 Absolute maximum ratings

Absolute maximum rating for digital and analog pins of MODULE are listed in the following table:

Table 29: Absolute maximum ratings

Parameter Min. Typ. Max. Unit

Voltage at VBAT -0.5 - 6.0 V
Voltage at USB_VBUS -0.5 - 5.85 V
Voltage at digital pins
-0.3 - 2.1 V
(RESET,SPI,Keypad,GPIO,I2C,UART,PCM)
Voltage at digital pins (SD,USIM) -0.3 - 3.05 V
Voltage at PWRKEY -0.3 - 1.8

5.2 Operating conditions

Table 30: Recommended operating ratings

Parameter Min. Typ. Max. Unit

Voltage at VBAT 3.4 3.8 4.2 V
Voltage at USB_VBUS 3.0 5.0 5.25 V

Table 31: 1.8V Digital I/O characteristics*

Parameter Description Min. Typ. Max. Unit

VIH High-level input voltage 1.17 1.8 2.1 V

VIL Low-level input voltage -0.3 0 0.63 V

VOH High-level output voltage 1.35 - 1.8 V

VOL Low-level output voltage 0 - 0.45 V

High-level output current(no

IOH - 2 - mA
pull down resistor)
Low-level output current(no pull
IOL - -2 - mA
up resistor)
Input high leakage current (no
IIH - - 1 uA
pull down resistor)

IIL Input low leakage current(no -1 - - uA

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pull up resistor)
*Note: These parameters are for digital interface pins, such as SPI, GPIOs (NETLIGHT,
FLIGHTMODE, STATUS, USIM_DET, SD_DET), SDIO, I2C, UART, PCM, COEXn, and
BOOT_CFG0.

The operating temperature of MODULE is listed in the following table.

Table 32: Operating temperature

Parameter Min. Typ. Max. Unit

Normal operation temperature -30 25 80 ℃
Extended operation temperature* -40 25 85 ℃
Storage temperature -45 25 +90 ℃
*Note: Module is able to make and receive voice calls, data calls, SMS and make GSM/
UMTX/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from the 3GPP
specifications if the temperature is outside the normal operating temperature range and still
within the extreme operating temperature range.

5.3 Operating Mode

5.3.1 Operating Mode Definition

The table below summarizes the various operating modes of MODULE product.

Table 33: Operating mode Definition

Mode Function
In this case, the current consumption of MODULE will be reduced to
GSM /UMTS/LTE
the minimal level and the MODULE can still receive paging message
Sleep
and SMS.
GSM/UMTS/LTE Software is active. Module is registered to the network, and the
Idle MODULE is ready to communicate.
Normal operation

Connection between two subscribers is in progress. In this case, the

GSM/UMTS/LTE
power consumption depends on network settings such as DTX off/on,
Talk
FR/EFR/HR, hopping sequences, and antenna.
Module is ready for data transmission, but no data is currently sent or
GPRS/EDGE/
received. In this case, power consumption depends on network
UMTS/LTE Standby
settings.

GPRS/EDGE/ There is data transmission in progress. In this case, power

UMTS/LTE consumption is related to network settings (e.g. power control level);
Data transmission uplink/downlink data rates, etc.
AT command “AT+CFUN=0” AT+CSCLK=1 can be used to set the
Minimum functionality
MODULE to a minimum functionality mode without removing the
mode
power supply. In this mode, the RF part of the MODULE will not

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work and the USIM card will not be accessible, but the serial port and
USB port are still accessible. The power consumption in this mode is
lower than normal mode.
AT command “AT+CFUN=4” or pulling down the FLIGHTMODE
pin can be used to set the MODULE to flight mode without removing
Flight mode the power supply. In this mode, the RF part of the MODULE will not
work, but the serial port and USB port are still accessible. The
power consumption in this mode is lower than normal mode.
Module will go into power off mode by sending the AT command
“AT+CPOF” or pull down the PWRKEY pin, normally. In this mode
Power off
the power management unit shuts down the power supply, and
software is not active. The serial port and USB are is not accessible.

5.3.2 Sleep mode

In sleep mode, the current consumption of MODULE will be reduced to the minimal level, and
MODULE can still receive paging message and SMS.
Several hardware and software conditions must be satisfied together in order to let MODULE enter
into sleep mode:
1. UART condition
2. USB condition
3. Software condition
Note: Before designing, pay attention to how to realize sleeping/waking function and refer to
Document [26] for more details.

5.3.3 Minimum functionality mode and Flight mode

Minimum functionality mode ceases a majority function of MODULE, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality
levels.

● AT+CFUN=0: Minimum functionality

● AT+CFUN=1: Full functionality (Default)
● AT+CFUN=4: Flight mode

If MODULE has been set to minimum functionality mode, the RF function and USIM card
function will be closed. In this case, the serial port and USB are still accessible, but RF function
and USIM card will be unavailable.
If MODULE has been set to flight mode, the RF function will be closed. In this case, the serial port
and USB are still accessible, but RF function will be unavailable.
When MODULE is in minimum functionality or flight mode, it can return to full functionality by
the AT command “AT+CFUN=1”.

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5.4 Current Consumption

The current consumption is listed in the table below.

Table 34: Current consumption on VBAT Pins (VBAT=3.8V)

GNSS
GNSS supply current
@ -140dBm，Tracking Typical:35mA
(AT+CFUN=0,with USB connection)
GSM sleep/idle mode
GSM/GPRS supply current Sleep mode@ BS_PA_MFRMS=2 Typical: 2.8mA
(GNSS off，without USB connection) Idle mode@ BS_PA_MFRMS=2 Typical: 18mA
UMTS sleep/idle mode
WCDMA supply current Sleep mode @DRX=9 Typical: 3.3mA
(GNSS off，without USB connection) Idle mode @DRX=9 Typical: 17.5mA
LTE sleep/idle mode
LTE supply current Sleep mode Typical: 4.6mA
(GNSS off，without USB connection) Idle mode Typical: 17.5mA
GSM Talk
EGSM900 @power level #5 Typical: 220mA
DCS1800 @power level #5 Typical: 162mA
UMTS Talk
WCDMA B1 @Power 24dBm Typical: 540mA
WCDMA B5 @Power 24dBm Typical: 530mA
WCDMA B8 @Power 24dBm Typical: 385mA
GPRS
EGSM900( 1 Rx,4 Tx ) @power level #5 Typical: 230mA
DCS1800( 1 Rx,4 Tx ) @power level #0 Typical: 195mA
EGSM900( 3Rx, 2 Tx ) @power level #5 Typical: 370mA
DCS1800( 3Rx, 2 Tx ) @power level #0 Typical: 275mA
EDGE
EGSM900( 1 Rx,4 Tx ) @power level #8 Typical: 400mA
DCS1800( 1 Rx,4 Tx ) @power level #2 Typical: 300mA
EGSM900( 3Rx, 2 Tx ) @power level #8 Typical: 320mA
DCS1800( 3Rx, 2 Tx ) @power level #2 Typical: 230mA
HSDPA data
WCDMA B1 @Power 24dBm Typical: 478mA
WCDMA B5 @Power 24dBm Typical: 480mA
WCDMA B8 @Power 24dBm Typical: 430mA
LTE data
@5Mbps 22.3dBm Typical: 577mA
LTE-FDD B1 @10Mbps 22.4dBm Typical: 590mA
@20Mbps 22.4dBm Typical: 630mA
@5Mbps 22.2dBm Typical: 479mA
LTE-FDD B3 @10Mbps 22.1dBm Typical: 498mA
@20Mbps 22.1dBm Typical: 530mA
LTE-FDD B5 @5Mbps 22.2dBm Typical: 610mA

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@10Mbps 22.1dBm Typical: 600mA
@20Mbps 22.1dBm Typical: 630mA
@5Mbps 22.2dBm Typical: 650mA
LTE-FDD B7 @10Mbps 22.1dBm Typical: 650mA
@20Mbps 22.1dBm Typical: 630mA
@5Mbps 22.8dBm Typical: 644mA
LTE-FDD B8
@10Mbps 22.8dBm Typical: 646mA
@5Mbps 21.8dBm Typical: 579mA
LTE-TDD B20 @10Mbps 21.8dBm Typical: 590mA
@20Mbps 21.8dBm Typical: 600mA
@5Mbps 21.8dBm Typical: 370mA
LTE-TDD B38 @10Mbps 21.8dBm Typical: 380mA
@20Mbps 21.8dBm Typical: 403mA
@5Mbps 21.5dBm Typical: 407mA
LTE-TDD B40 @10Mbps 21.7dBm Typical: 416mA
@20Mbps 21.7dBm Typical: 444mA
@5Mbps 21.6dBm Typical: 390mA
LTE-TDD B41 @10Mbps 21.7dBm Typical: 396mA
@20Mbps 21.7dBm Typical: 420mA

5.5 ESD Notes

MODULE is sensitive to ESD in the process of storage, transporting, and assembling. When
MODULE is mounted on the users’ mother board, the ESD components should be placed beside
the connectors which human body may touch, such as USIM card holder, audio jacks, switches,
keys, etc. The following table shows the MODULE ESD measurement performance without any
external ESD component.

Table 35: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)

Part Contact discharge Air discharge

VBAT,GND +/-6K +/-12K
Antenna port +/-5K +/-10K
USB +/-4K +/-8K
UART +/-3K +/-6K
Other PADs +/-3K +/-6K

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6 SMT Production Guide

6.1 Top and Bottom View of MODULE

Figure 34: Top and bottom view of MODULE

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6.2 Label Information

Figure 35: Label information

Table 36: The description of label information

No. Description
A LOGO

B Module part number

C Project name

D Serial number

E International mobile equipment identity

F QR code

6.3 Typical SMT Reflow Profile

SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
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a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.

Figure 36: The ramp-soak-spike reflow profile of MODULE

Note: For more details about secondary SMT, please refer to the document [21].

6.4 Moisture Sensitivity Level (MSL)

MODULE is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC

J-STD-033. If the prescribed time limit is exceeded, users should bake MODULE for 192 hours in
drying equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.

Table 37: Moisture Sensitivity Level and Floor Life

Moisture Sensitivity Level Floor Life (out of bag) at factory ambient≤30°C/60% RH or as

(MSL) stated
1 Unlimited at ≦30℃/85% RH
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.
NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.

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6.5 Stencil Foil Design Recommendation

The recommended thickness of stencil foil is more than 0.15mm.

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7 Packaging

MODULE support tray packaging.

Figure 37: packaging diagram

Module tray drawing：

Figure 38: Tray drawing

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Table 38: Tray size

Length（±3mm） Width（±3mm） Number

242.0 161.0 15
Small carton drawing：

Figure 39: Small carton drawing

Table 39: Small Carton size

Length（±10mm） Width（±10mm） Height（±10mm） Number

270 180 120 15*20=300
Big carton drawing：

Figure 40: Big carton drawing

Table 40: Big Carton size

Length（±10mm） Width（±10mm） Height（±10mm） Number

380 280 280 300*4=1200
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Appendix

A. Reference Design

Refer to < SIM7600 Reference Design V1.X.pdf > for the details.

Figure 41: Reference design

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B. Coding Schemes and Maximum Net Data Rates over Air Interface

Table 41: Coding Schemes and Maximum Net Data Rates over Air Interface

Multislot definition(GPRS/EDGE)
Slot class DL slot number UL slot number Active slot number
1 1 1 2
2 2 1 3
3 2 2 3
4 3 1 4
5 2 2 4
6 3 2 4
7 3 3 4
8 4 1 5
9 3 2 5
10 4 2 5
11 4 3 5
12 4 4 5
GPRS coding scheme Max data rata（4 slots） Modulation type
CS 1 = 9.05 kb/s / time slot 36.2 kb/s GMSK
CS 2 = 13.4 kb/s / time slot 53.6 kb/s GMSK
CS 3 = 15.6 kb/s / time slot 62.4 kb/s GMSK
CS 4 = 21.4 kb/s / time slot 85.6 kb/s GMSK
EDGE coding scheme Max data rata（4 slots） Modulation type
MCS 1 = 8.8 kb/s/ time slot 35.2 kb/s GMSK
MCS 2 = 11.2 kb/s/ time slot 44.8 kb/s GMSK
MCS 3 = 14.8 kb/s/ time slot 59.2 kb/s GMSK
MCS 4 = 17.6 kb/s/ time slot 70.4 kb/s GMSK
MCS 5 = 22.4 kb/s/ time slot 89.6 kb/s 8PSK
MCS 6 = 29.6 kb/s/ time slot 118.4 kb/s 8PSK
MCS 7 = 44.8 kb/s/ time slot 179.2 kb/s 8PSK
MCS 8 = 54.4 kb/s/ time slot 217.6 kb/s 8PSK
MCS 9 = 59.2 kb/s/ time slot 236.8 kb/s 8PSK
HSDPA device category Max data rate（peak） Modulation type
Category 1 1.2Mbps 16QAM,QPSK
Category 2 1.2Mbps 16QAM,QPSK
Category 3 1.8Mbps 16QAM,QPSK
Category 4 1.8Mbps 16QAM,QPSK
Category 5 3.6Mbps 16QAM,QPSK
Category 6 3.6Mbps 16QAM,QPSK
Category 7 7.2Mbps 16QAM,QPSK
Category 8 7.2Mbps 16QAM,QPSK

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Category 9 10.2Mbps 16QAM,QPSK
Category 10 14.4Mbps 16QAM,QPSK
Category 11 0.9Mbps QPSK
Category 12 1.8Mbps QPSK
Category 13 17.6Mbps 64QAM
Category 14 21.1Mbps 64QAM
Category 15 23.4Mbps 16QAM
Category 16 28Mbps 16QAM
Category 17 23.4Mbps 64QAM
Category 18 28Mbps 64QAM
Category 19 35.5Mbps 64QAM
Category 20 42Mbps 64QAM
Category 21 23.4Mbps 16QAM
Category 22 28Mbps 16QAM
Category 23 35.5Mbps 64QAM
Category 24 42.2Mbps 64QAM
HSUPA device category Max data rate（peak） Modulation type
Category 1 0.96Mbps QPSK
Category 2 1.92Mbps QPSK
Category 3 1.92Mbps QPSK
Category 4 3.84Mbps QPSK
Category 5 3.84Mbps QPSK
Category 6 5.76Mbps QPSK
LTE-FDD device category
Max data rate（peak） Modulation type
(Downlink)
Category 1 10Mbps QPSK/16QAM/64QAM
Category 2 50Mbps QPSK/16QAM/64QAM
Category 3 100Mbps QPSK/16QAM/64QAM
Category 4 150Mbps QPSK/16QAM/64QAM
LTE-FDD device category
Max data rate（peak） Modulation type
(Uplink)
Category 1 5Mbps QPSK/16QAM
Category 2 25Mbps QPSK/16QAM
Category 3 50Mbps QPSK/16QAM
Category 4 50Mbps QPSK/16QAM

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C. Related Documents

Table 42: Related Documents

NO. Title Description

SIM7500_SIM7600 Series_AT
[1] AT Command Manual
Command Manual_V1.xx
ITU-T Draft new
[2] Serial asynchronous automatic dialing and control
recommendationV.25ter
Digital cellular telecommunications (Phase 2+); AT command
[3] GSM 07.07
set for GSM Mobile Equipment (ME)
[4] GSM 07.10 Support GSM 07.10 multiplexing protocol
Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment
[5] GSM 07.05
(DTE – DCE) interface for Short Message Service (SMS)
and Cell Broadcast Service (CBS)
Digital cellular telecommunications system (Phase 2+);
Specification of the SIM Application Toolkit for the
[6] GSM 11.14
Subscriber Identity Module – Mobile Equipment (SIM – ME)
interface
Digital cellular telecommunications system (Phase 2+);
[7] GSM 11.11 Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
Digital cellular telecommunications system (Phase 2+);
[8] GSM 03.38
Alphabets and language-specific information
Digital cellular telecommunications system (Phase 2) ；
[9] GSM 11.10 Mobile Station (MS) conformance specification ； Part 1:
Conformance specification
Digital cellular telecommunications system (Release 5);
[10] 3GPP TS 51.010-1
Mobile Station (MS) conformance specification
Electromagnetic Compatibility (EMC) for mobile terminals
[11] 3GPP TS 34.124
and ancillary equipment.
Electromagnetic Compatibility (EMC) for mobile terminals
[12] 3GPP TS 34.121
and ancillary equipment.
Technical Specification Group Radio Access Network;
[13] 3GPP TS 34.123-1 Terminal conformance specification; Radio transmission and
reception (FDD)
User Equipment (UE) conformance specification; Part 3:
[14] 3GPP TS 34.123-3
Abstract Test Suites.
Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
IMT-2000. Third Generation cellular networks; Part 2:
[15] EN 301 908-02 V2.2.1
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article
3.2 of the R&TTE Directive
Electromagnetic compatibility and Radio Spectrum Matters
(ERM); Electromagnetic Compatibility (EMC) standard for
[16] EN 301 489-24 V1.2.1 radio equipment and services; Part 24: Specific conditions for
IMT-2000 CDMA Direct Spread (UTRA) for Mobile and
portable (UE) radio and ancillary equipment
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[17] IEC/EN60950-1(2001) Safety of information technology equipment (2000)
Digital cellular telecommunications system (Release 5);
[18] 3GPP TS 51.010-1
Mobile Station (MS) conformance specification
[19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria
Directive of the European Parliament and of the Council of
27 January 2003 on the restriction of the use of certain
[20] 2002/95/EC
hazardous substances in electrical and electronic equipment
(RoHS)
[21] Module Module secondary SMT Guidelines
secondary-SMT-UGD-V1.xx
[22] SIM7X00 This document describes how to use UART interface of
Series_UART_Application SIMCom modules.
Note_V1.xx
SIM7100_SIM7500_SIM7600
Series_USB
[23] USB AUDIO Application Note
AUDIO_Application
Note_V1.xx
[24] SIM7X00 GPS Application Note
Series_GPS_Application
Note_V1.xx
[25] Antenna design guidelines for Antenna design guidelines for diversity receiver system
diversity receiver system
[26] SIM7100_SIM7500_SIM7600 Sleep Mode Application Note
_Sleep Mode_Application
Note_V1.xx

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D. Terms and Abbreviations

Table 43: Terms and Abbreviations

Abbreviation Description
ADC Analog-to-Digital Converter
ARP Antenna Reference Point
BER Bit Error Rate
BTS Base Transceiver Station
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DRX Discontinuous Reception
DSP Digital Signal Processor
DTE Data Terminal Equipment (typically computer, terminal, printer)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
EVDO Evolution Data Only
FCC Federal Communications Commission (U.S.)
FD SIM fix dialing phonebook
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GNSS Global Navigation Satellite System
GPRS General Packet Radio Service
GPS Global Positioning System
GSM Global Standard for Mobile Communications
HR Half Rate
HSPA High Speed Packet Access
I2C Inter-Integrated Circuit
IMEI International Mobile Equipment Identity
LTE Long Term Evolution
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MT Mobile Terminated
NMEA National Marine Electronics Association
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCS Personal Communication System, also referred to as GSM 1900
RF Radio Frequency
RMS Root Mean Square (value)

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RTC Real Time Clock
SIM Subscriber Identification Module
SMS Short Message Service
SPI serial peripheral interface
SMPS Switched-mode power supply
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
TX Transmit Direction
UART Universal Asynchronous Receiver & Transmitter
VSWR Voltage Standing Wave Ratio
SM SIM phonebook
NC Not connect
EDGE Enhanced data rates for GSM evolution
HSDPA High Speed Downlink Packet Access
HSUPA High Speed Uplink Packet Access
ZIF Zero intermediate frequency
WCDMA Wideband Code Division Multiple Access
VCTCXO Voltage control temperature-compensated crystal oscillator
USIM Universal subscriber identity module
UMTS Universal mobile telecommunications system
UART Universal asynchronous receiver transmitter

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E. Safety Caution

Table 44: Safety Caution

Marks Requirements
When in a hospital or other health care facility, observe the restrictions about the use
of mobiles. Switch the cellular terminal or mobile off, medical equipment may be
sensitive and not operate normally due to RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to
prevent interference with communication systems. Forgetting to think much of these
instructions may impact the flight safety, or offend local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any
electrical equipment in potentially explosive atmospheres can constitute a safety
hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios,
computers or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
networks and cannot be guaranteed to connect in all conditions, especially with a
mobile fee or an invalid SIM card. While you are in this condition and need emergent
help, please remember to use emergency calls. In order to make or receive calls, the
cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to
deactivate those features before you can make an emergency call.
Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.

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Contact us:
Shanghai SIMCom Wireless Solutions Ltd.
Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R. China
200335
Tel：+86 21 3235 3300
Fax：+86 21 3235 3020
URL：www.simcomm2m.com

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