Energy Dissipation and Path Instabilities in Dynamic Fracture of Silicon Single Crystals
Energy Dissipation and Path Instabilities in Dynamic Fracture of Silicon Single Crystals
Energy Dissipation and Path Instabilities in Dynamic Fracture of Silicon Single Crystals
T. Cramer,1 A. Wanner,2 and P. Gumbsch1
1
Max-Planck-Institut f ür Metallforschung, Seestrasse 92, 70174 Stuttgart, Germany
2
Institut f ür Metallkunde, Universität Stuttgart, Seestrasse 71, 70174 Stuttgart, Germany
(Received 10 January 2000)
Brittle fracture usually proceeds at crack driving forces which are larger than those needed to create
the new fracture surfaces. This surplus can lead to faster crack propagation or to the onset of additional
dissipation mechanisms. Dynamic fracture experiments on silicon single crystals reported here show
several distinct transitions between different dissipation mechanisms. Cleavage fracture is followed by
the propagation of a faceted crack front, which is finally followed by a path instability and the propa-
gation of multiple cracks. The fracture surface qualitatively corresponds to the mirror, mist, and hackle
morphology of amorphous materials. However, the corresponding fracture mechanisms, which remain
largely unknown in the amorphous materials, can clearly be identified here.
An external load acting on a precracked body exerts a constant equal to the specific surface energy 2g of the two
driving force on the crack. This driving force is equivalent fracture surfaces created by the advancing crack.
to the mechanical energy release per unit crack advance, Fracture experiments on amorphous materials such as
the energy release rate G [1]. In an ideally brittle material polymethylmetacrylate (PMMA) and glass have revealed
crack extension takes place if the crack is supplied with a that cracks do not propagate faster than about 共0.4 0.5兲cR
driving force larger than the specific energy 2g required [4,5]. These experiments also show that the fracture sur-
to create the fracture surfaces [1,2]. This threshold driv- faces are only smooth and mirrorlike if the driving force is
ing force is called the critical energy release rate Gc . In close to Gc . If the driving force is increased and the crack
general, the driving force is not only a function of the ge- thus exceeds a critical velocity yc , the fracture surfaces be-
ometry of the body and of the external forces but also a come rougher and exhibit a so-called mist and hackle mor-
function of the shape, size, and orientation of the crack phology [6]. Below yc , Eq. (1) has recently been shown to
itself. Hence, the driving force may change and rise to appropriately describe the observed behavior [7]. Above
levels well above Gc as the crack length l increases dur- yc , microscopic bifurcations were proposed as the expla-
ing propagation. Interestingly, such supercritical fracture nation for the lower than expected terminal crack velocity
is observed in many practical cases and, from the experi- [7]. The bifurcations are predicted to result from a dy-
mentalist’s point of view, can be realized more easily than namic crack branching instability [8].
crack extension under an approximately constant driving So far most of the fundamental studies in this field have
force just above the threshold Gc . dealt with amorphous materials, where a propagating crack
How does the crack respond to a driving force that is can easily deviate from its original plane and thus form
significantly larger than required? How is the surplus of a rough fracture surface due to the absence of long-range
supplied energy “spent”? Continuum mechanical consid- order. In contrast, brittle crystalline materials exhibit well-
erations have so far only answered these questions for the defined cleavage planes, which render the formation of a
specific case of a crack propagating along a straight path rough fracture surface more difficult. Hence, the following
[3]. According to these considerations, a straight crack question arises: What is limiting the velocity of cracks in
is expected to attain increasingly higher velocities for in- brittle crystalline materials?
creasing energy release rates. The crack velocity asymp- The dynamics of fast fracture in brittle crystalline ma-
totically reaches an upper bound which is equal to the terials has been addressed experimentally only in very
Rayleigh wave velocity cR , the velocity of acoustic sur- few studies. Interestingly, most studies gave significantly
face waves. For a straight crack propagating at a velocity higher values of 共0.7 0.9兲cR for the terminal crack veloc-
y below cR , the dynamic fracture energy, G共y兲, can be ex- ities [9–13]. However, a correlation between the fracture
pressed as: surface morphology and the crack dynamics has not been
µ ∂ attempted yet and the origin of the terminal velocity in
y crystalline materials remains unclear.
G共y兲 苷 G共l, s兲 1 2 , (1)
cR The purpose of this paper is to provide a detailed time-
resolved analysis of the brittle fracture characteristics of
where the energy release rate G共l, s兲 is the static, time- single crystalline silicon and a correlation with the fracture
independent energy flux into the crack tip which represents surface morphology. This correlation and the quantitative
the geometry of the specimen and the applied stress s. In analysis by continuum theory allows one to clearly identify
the simplest case, the dynamic fracture energy G共y兲 is a specific energy dissipating mechanisms.
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VOLUME 85, NUMBER 4 PHYSICAL REVIEW LETTERS 24 JULY 2000
FIG. 3. Trench cut into the end of the mirror zone of a speci-
men fractured at Gs 苷 41 J兾m2 using a focussed ion beam
(FIB). The crack propagated from the bottom to the top of
the image on 兵111其 cleavage facets.
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VOLUME 85, NUMBER 4 PHYSICAL REVIEW LETTERS 24 JULY 2000
is fully described by the continuum mechanical solution, material with only one type of cleavage system like GaAs,
Eq. (1), under the assumption of a constant fracture energy where the 兵110其 planes are the only cleavage planes, one
which corresponds to the surface energy of the two (110) would expect to reach very high terminal velocities before
surfaces. Second, at intermediate overloads the crack the crack can make use of alternative paths.
propagates on two sets of 兵111其 planes, which results In general, the dynamic fracture process can be sepa-
in a faceted fracture surface and leads to the increased rated into two different regimes: a first regime at low
fracture energy (triangles in Fig. 2). The size of the overloads, where the behavior of the crack is material-
facets increases with increasing G. Because the faceting independent in the sense that it is fully described by lin-
does not change the total surface energy significantly ear elastic continuum mechanics once the surface energy
g共111兲
[ cos共35 ± 艐 g共110兲 [19]], it is concluded that the crack must and the elastic properties of the material are known, and
兲
spend the additional energy by emitting phonons. Whether a second regime, where material-specific dissipation pro-
this radiation is connected with the formation of the rims cesses dominate. Future investigation must focus on the
between the two 兵111其 fracture surfaces or whether it is mechanisms which govern the latter to further advance our
connected with the mixed mode I-III loading on the 兵111其 understanding of catastrophic failure in materials.
facets is unclear. The onset of the faceting can not be Financial support from Deutsche Forschungsgemein-
identified on the fracture surfaces, which indicates that the schaft through grant Gu 367/8 is gratefully acknowledged.
faceting may grow continuously out of small disturbances
of a planar crack.
The third mode is only observed at the highest over-
loads, where the specimens exhibit rough hackle zones.
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