6806800m67l Atca f140 Iu - 1404488896
6806800m67l Atca f140 Iu - 1404488896
Trademarks
Artesyn Embedded Technologies, Artesyn and the Artesyn Embedded Technologies logo are trademarks and service marks of
Artesyn Embedded Technologies, Inc.© 2014 Artesyn Embedded Technologies, Inc. All other product or service names are the
property of their respective owners.
Intel® is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
Java™ and all other Java-based marks are trademarks or registered trademarks of Oracle America, Inc. in the U.S. and other countries.
Microsoft®, Windows® and Windows Me® are registered trademarks of Microsoft Corporation; and Windows XP™ is a trademark of
Microsoft Corporation.
PICMG®, CompactPCI®, AdvancedTCA™ and the PICMG, CompactPCI and AdvancedTCA logos are registered trademarks of the PCI
Industrial Computer Manufacturers Group.
UNIX® is a registered trademark of The Open Group in the United States and other countries.
Notice
While reasonable efforts have been made to assure the accuracy of this document, Artesyn assumes no liability resulting from any
omissions in this document, or from the use of the information obtained therein. Artesyn reserves the right to revise this document
and to make changes from time to time in the content hereof without obligation of Artesyn to notify any person of such revision or
changes.
Electronic versions of this material may be read online, downloaded for personal use, or referenced in another document as a URL to
an Artesyn website. The text itself may not be published commercially in print or electronic form, edited, translated, or otherwise
altered without the permission of Artesyn.
It is possible that this publication may contain reference to or information about Artesyn products (machines and programs),
programming, or services that are not available in your country. Such references or information must not be construed to mean that
Artesyn intends to announce such Artesyn products, programming, or services in your country.
Contact Address
Artesyn Embedded Technologies Artesyn Embedded Technologies
Marketing Communications Lilienthalstr. 17-19
2900 S. Diablo Way, Suite 190 85579 Neubiberg/Munich
Tempe, Arizona 85282 Germany
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
1.2 Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
1.3 Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.4 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
1.4.1 Blade Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
1.5 Product Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.2 Unpacking and Inspecting the Blade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.3 Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2.3.1 Environmental Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.3.2 Thermal Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.3.3 Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2.4 Rear Transition Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2.5 Blade Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.5.1 SATA Drive Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.6 Blade Installation and Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.6.1 Installing the Blade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2.6.2 Removing the Blade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
2.7 AMC Module Installation and Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2.8 Installing and Removing SFP Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
2.8.1 Installing an SFP Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
2.8.2 Removing an SFP Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
2.9 Installing and Removing QSFP+ Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
2.9.1 Installing QSFP+ transceiver modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
2.9.2 Removing QSFP+ Transceiver Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.2.1 LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
3.3 Faceplate Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
3.4 Backplane Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
3.4.1 Zone 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
3.4.2 Zone 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
3.4.3 Zone 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
3.5 Module Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
3.5.1 AMC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
3.5.2 Memory DIMM Socket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
3.5.3 SAS/SATA Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
3.5.4 Embedded USB Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
3.5.5 Processor COP Header . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
3.5.6 Asset JTAG Header . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
3.5.7 H8S Console and Programming Header . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
3.6 Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
5 U-Boot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Sicherheitshinweise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Overview of Contents
This manual is divided into the following chapters and appendices.
Introduction gives an overview of the features of the product, standard compliances,
mechanical data, and ordering information.
Hardware Preparation and Installation outlines the installation requirements, hardware
accessories, and installation procedures.
Controls, LEDs, and Connectors describes external interfaces of the board. This include
connectors, LEDs, and mechanical switches.
Functional Description includes a block diagram and functional description of major
components of the product.
U-Boot describes the boot firmware.
Replacing the Battery contains the procedures for replacing the battery.
Related Documentation provides a listing of related product documentation,
manufacturer’s documents, and industry standard specifications.
Safety Notes summarizes the safety instructions in the manual.
Sicherheitshinweise is a German translation of the Safety Notes chapter.
Abbreviations
This document uses the following abbreviations:
Abbreviation Description
ATCA Advanced Telecom Computing Architecture
AMC Advanced Mezzanine Card
BITS Building Integrated Timing Supply
BIX Base Interface Switch
BP Backplane
BT Block Transfer
CCB Core Complex Bus
Abbreviation Description
CFM Cubic Feet per Minute
CGM Clock Generator Module
DDR3 Dual Data Rate 3
DIMM Dual In-line Memory Module
DRAM Dynamic Random Access Memory
ECC Error Correction Code
EHCI Enhanced Host Controller Interface
FIX Fabric Interface Switch
FP Face Plate
HSC Hot Swap Controller
IPMB Intelligent Platform Management Bus
IPMC Intelligent Platform Management Controller
IPMI Intelligent Platform Management Interface
JTAG Joint Test Action Group
LBC Local Bus Controller
LED Light-emitting diode
LFM Linear Feed per Minute
LPC Low Pin Count
LVDS Low-Voltage Differential Signals
LVPECL Low-Voltage Positive Emitter Coupled Logic
MCP Machine Check Processor
M-LVDS Multipoint Low-Voltage Differential Signals
MMC Module Management Controller
MMF Multi Mode Fiber
PBC Port Bypass Circuit
PCI Peripheral Component Interconnect Bus
PCIE PCI Express
PCI-SIG PCI Special Interest Group
Abbreviation Description
PICMG PCI Industrial Computer Manufacturers Group
PIC Programmable Interrupt Controller
POL Point Of Load
PrAMC Processor Advanced Mezzanine Card
PSU Power Supply Unit
QSFP+ Quad Small Form Factor Pluggable Plus
RTC Real Time Clock
RTM Rear Transition Module
SATA Serial AT Attachment (high speed serial interface standard for
storage devices)
SCSP Stacked Chip Scale Package
SDRAM Synchronous Dynamic Random Access Memory
SFP Small Form Factor Pluggable
SFP+ Small Form Factor Pluggable Plus
SGMII Serial Gigabit Media Independent Interface
SMF Single Mode Fiber
SP Service Processor
SPD Serial Present Detect
SPI Serial Peripheral Interface
SRAM Static Random Access Memory
SSD Solid State Disk
SSU Synchronization Supply Unit
TSEC Triple Speed Ethernet Controller
UART Universal Asynchronous Receiver / Transmitter
UDE Unconditional Debug Event
USB Universal Serial Bus
VLP Very Low Profile
XAUI 10 Gigabit Attachment Unit Interface
Conventions
The following table describes the conventions used throughout this manual.
Notation Description
0x00000000 Typical notation for hexadecimal numbers (digits are
0 through F), for example used for addresses and
offsets
0b0000 Same for binary numbers (digits are 0 and 1)
bold Used to emphasize a word
Screen Used for on-screen output and code related elements
or commands in body text
Courier + Bold Used to characterize user input and to separate it
from system output
Reference Used for references and for table and figure
descriptions
File > Exit Notation for selecting a submenu
<text> Notation for variables and keys
[text] Notation for software buttons to click on the screen
and parameter description
... Repeated item for example node 1, node 2, ..., node
12
. Omission of information from example/command
. that is not necessary at the time being
.
.. Ranges, for example: 0..4 means one of the integers
0,1,2,3, and 4 (used in registers)
| Logical OR
Notation Description
Indicates a hazardous situation which, if not avoided,
could result in death or serious injury
Summary of Changes
This manual has been revised and replaces all prior editions.
1.1 Features
The ATCA-F140 is a hub board as defined in PICMG 3.0 Revision 3.0 Advanced TCA Base
Specification and PICMG 3.1 Revision 1.0 Specification Ethernet/Fiber Channel for AdvancedTCA
Systems. It supports several Base and Fabric Channel Ethernet interfaces to the Zone 2
backplane. It also supports 1Gb, 10Gb, and 40Gb Ethernet uplinks to the front panel and to a
Rear Transition Module (RTM) through the Zone 3 connector.
Broadcom Ethernet switches and PHYs are used for the base and fabric channels. The entire
board is managed by a Freescale P2020 QorIQ Integrated Processor.
The ATCA-F140 provides one AMC bay. This bay is designed to support a processor AMC
module for additional applications processing capabilities on the board.
See the list below for the key features of the ATCA-F140:
Single slot ATCA form factor (280 mm x 322 mm)
Freescale P2020 QorIQ Integrated Processor for the on board service processor functions
Two DDR3 memory DIMM slots; each of which can support up to 2 GB of DDR3 SDRAM
with ECC for a total memory capacity of 4 GB
Two redundant banks of 32 MB Boot Flash memory
2 GB embedded USB Flash module for User Flash memory
Onboard SATA connector for a 2.5" SATA drive with selectable interface to either the
service processor or the processor AMC
Real time clock
RJ-45 UART Console interface to service processor on front panel
RJ-45 10/100/1000 BaseTx Ethernet Management port on the front panel for P2020 QorIQ
Integrated Processor
Broadcom BCM56334 managed switch device for the Base Channel (24 1G-SGMII and four
10G-XAUI ports)
Two Fabric Channel 40G (QSFP+) uplink ports on the front panel
Multiple 1 GbE SGMII and 10 GbE XAUI ports routed to Zone 3 connectors for base and
fabric uplink channels on RTM
Two 40G ports routed to Zone 3 connectors for fabric uplink on RTM
Stratum 3 Telco clock option with master/slave sync and 5 inter-shelf sync connectors on
front panel along with 2 BITS/SSU front panel connectors
One AMC bay for application processor support
IPMC functionality for the board management by the Shelf Management Controller
Standard Description
UL/CSA No. 60950-1 Legal safety requirements
EN 60950-1
IEC 60950-1 CB Scheme
UL/CSA No. 60950-1
ANSI T1.319-2002 ANSI Fire Spread Criteria
NEBS GR-63-CORE
AT&T Document ATT-TP-76200 Network Equipment Power, Grounding, Environmental,
and Physical Design Requirements
ETSI Acoustic Noise ETS 300 753 ETSI acoustic noise requirements
Class 3.1
ETSI Stationary Use: EN 300 019-2-3 ETSI stationary use requirements (temperature-con-
Class 3.1 trolled locations
ETSI Storage EN 300 019-2-1 Class ETSI storage requirements in system level (not
1.2 temperature- controlled storage locations)
ETSI Transportation: EN 300 019-2-2 ETSI public transportation requirement on system level
Class 2.3
Telcordia GR-1089-CORE Electromagnetic Compatibility and Electrical Safety -
Generic Criteria for Network Telecommunications Equip-
ment
Telcordia GR-63-CORE NEBS Requirements: Physical Protection
Telcordia SR-3580 NEBSCriteria Level 3
Standard Description
EN55022 Class A (EU) EMC requirements (legal) on system level (predefined
EN 55024 (EU) Artesyn system)
FCC 47 CFR Part 15 Subpart B (US),
Class A
AS/NZS CISPR 22 Class A (Austra-
lia/New Zealand)
VCCI Class A (Japan)
Verizon Document Telecommunications Carrier Group NEBS Checklist
VZ.NEBS.TE.NPI.2004.015: NEBS
Checklist
To fulfill the requirements of Telcordia GR-1089,R4-14, use Shielded Twisted Pair (STP) cables
grounded at both ends to connect to the Ethernet ports.
The product has been designed to meet the directive on the restriction of the use of certain
hazardous substances in electrical and electronic equipment (RoHS) Directive 2011/65/EU.
Data Value
Dimensions 30 mm x 351 mm x 312 mm (8U form factor)
Weight 2.8 kg
Accessory Description
RTM-ATCA-F140 RTM for the ATCA-F140 with SFP and SFPP sockets
SFP-MM-SX-LC 1G Single Form Factor (SFP) module - 850NM, SX, LC connector
SFPP-MM-SR-LC 10 G Single Form Factor Plus (SFPP) module - 850NM, SR, LC connector
SFPP-SM-LR-LC 10G Single Form Factor Plus (SFPP) module -1310NM, LR, LC connector
SFPP-CO-RJ-45-3M 10G copper Single Form Factor Plus (SFPP) modules with molded cable - 3M
CABLE-OPT-F102-5M Optical cable for multi-mode, SFP and SFPP connections (5M)
CABLE-COP-QSFPP-3M 40G QSFP+direct attach, molded cable for ATCA-F140 (3M)
QSFPP-40G-SR4-MOD- 40G QSFP+ module for the ATCA-F140 - 40GBASE-SR4
ULE
CABLE-OPT-QSFPP-5M 40G QSFP+ optical cable for ATCA-F140 (5M)
CABLE-B-OPT-QSFPP- 40G QSFP+ optical cable break-out for ATCA-F140 (5M)
5M
Accessory Description
HDD-500G-SATA Direct mount 500GB HDD for ATCA-F125 & ATCA-F140, high durability -
SATA
PRAMC-7311 AMC with INTEL COREI7 Processor, 4GB DDR3 - mid size
SW-WR-PRAMC-7311 CD with WR PNE 3.0 and BBS for the PRAMC-7311, single blade license
2.1 Overview
This chapter provides the information that you need to install the ATCA-F140 and its
accessories into your AdvancedTCA system. Removal procedures are also included.
Damage of Circuits
Electrostatic discharge and incorrect installation and removal of the blade can damage
circuits or shorten its life.
Before touching the product make sure that you are working in an ESD-safe environ-
ment or wearing an ESD wrist strap or ESD shoes. Hold the product by its edges and do
not touch any components or circuits.
Shipment Inspection
2. Check for damage and report any damage or differences to customer service.
The blade is thoroughly inspected before shipment. If any damage occurs during transporta-
tion or any items are missing, please contact customer service immediately.
Environmental Damage
Improper disposal of used products may harm the environment.
Always dispose of used products according to your country’s legislation and manufac-
turer’s instructions.
2.3 Requirements
This section shows the environmental and power requirements of the ATCA-F140.
Operating temperatures refer to the temperature of the air circulating around the blade, and
not to component temperatures.
If you integrate the blade in your own non-Artesyn system, please contact your local sales
representative for further safety information.
Blade Damage
High humidity and condensation on the blade surface may cause it to short circuit.
Do not operate the blade outside the specified environmental limits. Make sure the
blade is completely dry and there is no moisture on any surface before applying power.
Do not operate the blade below -5°C.
Contact your Artesyn sales representative for current information on the detailed thermal
information including airflow and resistance of the blade.
System Overheating
Cooling Vents
– Improper cooling can lead to system damage and can void the manufacturer's
warranty.
– To ensure proper cooling and undisturbed airflow through the system, do not
obstruct the ventilation openings of the system. Make sure that the fresh air supply
is not mixed with hot exhaust from other devices.
Personal Injury
During operation, hot surfaces may be present on the heat sinks and the components
of the product.
To prevent injury from hot surface, do not touch any of the exposed components or
heatsinks on the product when handing. Use the handle and face plate, where
applicable, or the board edge when removing the product from the enclosure.
Characteristic Value
Rated Voltage -48VDC to -60VDC, US and -48VDC,
Canada
Operating Voltage -39VDC to -72VDC, US and -39VDC to
-60VDC, Canada
Max. power consumption of ATCA-F140 with SATA 200W max, 135W typ
drive and RTM-ATCA-F140 no AMC installed
Max. power consumption of ATCA-F140 with SATA 170W max, 110W typ
drive (without RTM-ATCA-F140) no AMC installed
The RTMs are not hot-swappable. Before installation, make sure that no front blade is
installed in its respective slot, or that the front blade is powered-down. For further details
about the RTM installation, refer to the installation and use guide of the respective RTM.
Product Malfunction
Switches marked as “reserved” may carry production-related functions and can cause
the product to malfunction if the setting is changed.
Do not change settings of switches marked as “reserved”.
Product Damage
Setting/resetting the switches during operation can cause damage to the product.
Check and change switch settings before installing the product.
Product Damage
Too much force may damage the reset switch.
Use minimal force when pressing the reset switch.
The blade must only be installed into the proper slot type of shelf, hub blades in hub slots,
payload blades in blade slots. The proper slots may vary by system type. Refer to the system's
documentation for information which slots these are in your particular configuration.
Damage of Circuits
Electrostatic discharge and incorrect blade installation and removal can damage
circuits or shorten its life.
Before touching the blade or electronic components, make sure that you are working in
an ESD-safe environment.
Damage of the blade
Incorrect installation of the blade can cause damage to the blade.
Only use handles when installing/removing the blade to avoid damage/deformation to
the face plate and/or PCB.
The following procedure describes the installation of the blade in a hub slot that does not have
an RTM. It assumes that your system is powered. If your system is powered down, you can
disregard the blue LED and thus skip its respective step. In this case it is a purely mechanical
installation.
If there is a Rear Transition Module (RTM) to install, install and secure the RTM first as
described in the RTM-ATCA-F140 Installation and Use Guide, then install the front blade. If an
RTM is already installed, make sure that the RTM faceplate screws are fully tightened to
secure the RTM to the shelf.
1. Visually inspect the blade and backplane connectors for damage or bent pins before
attempting to insert a board. If any connector damage or pin damage in observed, stop
before inserting the blade and send the damaged item through proper repair channels.
2. Ensure that the top and bottom ejector handles are in the outward position by squeezing
the lever and the latch together.
3. Insert blade into the shelf by placing the top and bottom edges of the blade in the card
guides of the shelf. Make sure that the guiding module of shelf and blade are aligned
properly.
4. Apply equal and steady pressure to the blade to carefully slide the blade into the shelf until
you feel resistance. Continue to gently push the blade until the blade connectors engage.
5. Squeeze the lever and the latch together and hook the lower and the upper handle into the
shelf rail recesses.
6. Fully insert the blade and lock it to the shelf by squeezing the lever and the latch together
and turning the handles towards the face plate.
If you feel that you need an abnormal amount of force during blade insertion to insert the
blade into the slot, please extract the blade, then carefully inspect the blade and slot for
problems to prevent damage.
If your shelf is powered, as soon as the blade is connected to the backplane power pins, the
blue LED is illuminated.
When the blade is completely installed, the blue LED starts to blink. This indicates that the
blade has announced its presence to the shelf management controller.
If an RTM is connected to the front blade, make sure that the handles of both the RTM and the
front blade are closed in order to power up the blade’s payload.
7. Wait until the blue LED is switched off, then tighten the face plate screws which secure the
blade to the shelf. When the blue LED is switched OFF and the green LED shows "IS" (in
service) is switched ON, this indicates that the payload has been powered up and that the
blade is active.
This section describes how to remove the blade from an AdvancedTCA system.
Damage of circuits
Electrostatic discharge and incorrect blade installation and removal can damage
circuits or shorten its life.
Before touching the blade or electronic components, make sure that you are working in
an ESD-safe environment.
The following procedure describes how to remove the blade from a system. It assumes that the
system is powered. If the system is powered down, you can disregard the blue LED and skip the
respective step. In that case it is a purely mechanical procedure.
1. Unlatch the lower handle from the face plate by squeezing the lever and the latch together
and turning the handle outward. Do not rotate the handle fully outward. The blue LED
blinks indicating that the blade power-down process is ongoing.
Data Loss
Removing the blade with the blue LED still blinking causes data loss.
Wait until the blue LED is steadily lit before removing the blade.
2. Wait until the blue LED is illuminated permanently. Unfasten the screws of the faceplate,
then unlatch the upper handle and rotate both handles fully outward until the blade is
detached from the shelf.
If the LED continues to blink, it is possible that the upper layer software has rejected the blade
extraction request.
Damage of Circuits
Electrostatic discharge and incorrect installation and removal of the blade can damage
circuits or shorten its life.
Before touching the blade or electronic components, make sure that you are working in
an ESD-safe environment.
Installation Procedure
This procedure assumes that the AdvancedATCA system is powered. If your system is powered
down, you can disregard the instructions regarding the blue LED.
1. If the AMC bay is occupied by an AMC filler panel, remove the filler panel.
2. Make sure that the AMC module handle is in the extracted position: pulled outward, away
from the face plate.
3. Using your thumb, apply equal and steady pressure on the face plate as necessary to
carefully slide the AMC module into the guide rails.
4. Continue pushing the module gently along the guide rails until the module is fully engaged
with the connector. Avoid using excessive force.
5. Wait for the blue LED to glow. The blue LED glows when the AMC module is completely
engaged with the connector.
6. Press module handle inwards towards the face plate to lock the AMC module into the AMC
bay.
7. Wait for the blue LED to perform a series of long blinks. The blue LED blinks when the handle
is locked in position indicating module detection and activation by the carrier board.
8. Observe blue LED status/activity. The module is fully installed when the blue LED stops
blinking and stays OFF.
Removal Procedure
This procedure assumes that the AdvancedATCA system is powered. If your system is powered
down, you can disregard the instructions regarding the blue LED.
1. Remove any cables that are connected to the AMC module face plate connectors.
2. Gently pull the module latch outwards, approximately 3 mm away from its locked position.
3. Wait for the blue LED to perform short blinks, and then glow steadily.
Data Loss
Removing the blade with the blue LED still blinking causes data loss.
Wait until the blue LED is steadily lit, before removing the blade.
4. Once the blue LED glows steadily, gently pull the AMC module handles outwards to
disconnect the module from the AMC connectors. Continue to gently slide the module
outwards along the guide rails.
Eye Damage
Optical SFP modules may emit laser radiation when no cable is connected.
Avoid staring into open apertures to avoid damage to your eyes.
Personal Injury and Damage of the board, RTM and SFP Modules
Installing and using SFP modules which are not fully certified and which do not meet all
relevant safety standards may damage the board, RTM and the SFP modules and may
lead to personal injury.
Only use and install SFP modules which are fully certified and which meet all relevant
safety standards.
Personal Injury
Optical SFP modules may be classified as laser products. When installing and using any
of these SFP modules, the regulations which correspond to the respective laser class
apply to the whole board and RTM. Non-compliance with these regulations may lead to
personal injury.
When installing and using optical SFP modules which are classified as laser products,
make sure to comply to the respective regulations.
SFP modules can be installed/removed while the board and RTM is both powered and or pow-
ered off. The presence and also the type of SFP modules is automatically detected.
The maximum power consumption of each SFP module should be 1W. The maximum power
consumption of each SFP+ module should be 1.5W.
1. Slide the SFP module into the slot until it locks into position.
The SFP/SFP+ module will only fully insert if installed in the proper orientation. If it does not
fully insert, rotate it 180 degrees and re-install.
The optical port plug protects the sensitive optical fibres against dirt and damage. Dirt
and damage can render the SFP module inoperable.
Only remove the optical plug when you are ready to connect a cable to the SFP module.
When no cable is connected, cover the port with an optical port plug.
2. Open the SFP latch. Note that the latch mechanism of your SFP module may be
3. Grasp the SFP module and carefully slide it out of the slot.
The optical port plug protects the sensitive optical fibres against dirt and damage. Dirt
and damage can render the SFP module inoperable.
Only remove the optical plug when you are ready to connect a cable to the SFP module.
When no cable is connected, cover the port with an optical port plug.
Eye Damage
Optical QSFP+ modules may emit laser radiation when no cable is connected.
Avoid staring into open apertures to avoid damage to your eyes.
Personal Injury and Damage of the board, RTM and QSFP+ Modules
Installing and using QSFP+ modules which are not fully certified and which do not meet
all relevant safety standards may damage the board, RTM and the QSFP+ modules and
may lead to personal injury.
Only use and install QSFP+ modules which are fully certified and which meet all relevant
safety standards.
Personal Injury
Optical QSFP+ modules may be classified as laser products. When installing and using
any of these QSFP+ modules, the regulations which correspond to the respective laser
class apply to the whole board and RTM. Non-compliance with these regulations may
lead to personal injury.
When installing and using optical QSFP+ modules which are classified as laser products,
make sure to comply to the respective regulations.
For QSFP+ transceivers with a pull-tab, make sure that the identifier label is on top.
4. Firmly press the front of the QSFP+ transceiver to full push the transceiver in the module’s
transceiver socket. Make sure that it is fully engaged to prevent it from being accidentally
disconnected.
5. For optical QSFP+ modules, reinstall the dust plug into the portal. Do not remove it until the
network interface cable will be attached.
1. For optical QSFP+ transceivers, disconnect the network interface cable from the QSFP+
transceiver connector.
3. Do the following steps to remove QSFP+ transceivers with a pull tab latch:
Install the dust plug into the transceiver’ optical bore.
Hold the tab and pull the receiver gently to release the transceiver from the socket.
Slide the transceiver from the socket.
3.2 Faceplate
This section describes the details of the ATCA-F140 faceplate LEDs.
3.2.1 LEDs
The following table describes the functions of the front panel LEDs.
Table 3-2 Service Processor Ethernet RJ45 Connector Pin Assignment (J9)
Table 3-3 Service Processor Serial RS232 RJ45 Connector (J1) (continued)
Contact Contact
Number Function Number Function
1 GND 38 GND
2 TX2n 37 TX1n
3 TX2p 36 TX1p
4 GND 35 GND
5 TX4n 34 TX3n
6 TX4p 33 TX3p
7 GND 32 GND
8 ModselL 31 LPMode
9 ResetL 30 Vcc1
10 VccRx 29 VccTx
11 SCL 28 IntL
12 SCA 27 ModPrsL
13 GND 26 GND
14 RX3p 25 RX4p
15 RX3n 24 RX4n
16 GND 23 GND
17 RX1p 22 RX2p
18 RX1n 21 RX2n
Contact Contact
Number Function Number Function
19 GND 20 GND
Contact Contact
Number Function Number Function
1 GND 11 GND
2 TX_FAULT 12 RX-
3 TX_DISABLE 13 RX+
4 I2C_SDA 14 GND
5 I2C_SCL 15 VCCr (+3.3V)
6 MOD_ABS 16 VCCt (+3.3V)
7 RS0 17 GND
8 LOS 18 TX+
9 RS1 19 TX-
10 GND 20 GND
3.4.1 Zone 1
The following table shows the pinout assignment for the Zone 1 ATCA power connector.
3.4.2 Zone 2
The following table shows the pinout assignment for the Zone 2 ATCA connectors.
J20
Row Column A Column B Column C Column D Column E Column F Column G Column H
1 CLK1A+ CLK1A- CLK1B+ CLK1B- CLK2A+ CLK2A- CLK2B+ CLK2B-
J21
Row Column A Column B Column C Column D Column E Column F Column G Column H
1 FIX_P11_TX2+ FIX_P11_TX2- FIX_P11_RX2+ FIX_P11_RX2- FIX_P11_TX3+ FIX_P11_TX3- FIX_P11_RX3+ FIX_P11_RX3-
J22
Row Column A Column B Column C Column D Column E Column F Column G Column H
1 FIX_P6_TX2+ FIX_P6_TX2- FIX_P6_RX2+ FIX_P6_RX2- FIX_P6_TX3+ FIX_P6_TX3- FIX_P6_RX3+ FIX_P6_RX3-
J23
Row Column A Column B Column C Column D Column E Column F Column G Column H
1 FIX_P1_TX2+ FIX_P1_TX2- FIX_P1_RX2+ FIX_P1_RX2- FIX_P1_TX3+ FIX_P1_TX3- FIX_P1_RX3+ FIX_P1_RX3-
J24
Row Column A Column B Column C Column D Column E Column F Column G Column H
1 BIX_P7_DA+ BIX_P7_DA- BIX_P7_DB+ BIX_P7_DB- BIX_P7_DC+ BIX_P7_DC- BIX_P7_DD+ BIX_P7_DD-
3.4.3 Zone 3
The position of the zone 3 connectors is specified in the ATCA Rear Transition Module I/O
Specification JETIS L1.3-601. The connector pinouts are listed in the following table.
J30
Row Column A Column B Column C Column D Column E Column F Column G Column H
1 +12V_RTM RTM_INT_L SynchE_CLK_ SynchE_CLK_ RTM_REF_CL RTM_PS1_L BIX_P20_RTM BIX_P20_RTM
O+ O- K _TX+ _TX-
10
J31
Row Column A Column B Column C Column D Column E Column F Column G Column H
1 BIX_XG0_TX2+ BIX_XG0_TX2- BIX_XG0_RX2+ BIX_XG0_RX2- BIX_XG0_TX3+ BIX_XG0_TX3- BIX_XG0_RX3+ BIX_XG0_R
X3-
J31
Row Column A Column B Column C Column D Column E Column F Column G Column H
4 BIX_XG1_TX0+ BIX_XG1_TX0- BIX_XG1_RX0+ BIX_XG1_RX0- BIX_XG1_TX1+ BIX_XG1_TX1- BIX_XG1_RX1+ BIX_XG1_R
X1-
J32
Row Column A Column B Column C Column D Column E Column F Column G Column H
1 FIX_P15_TX2+ FIX_P15_TX2- FIX_P15_RX2+ FIX_P15_RX2- FIX_P15_TX3+ FIX_P15_TX3- FIX_P15_RX3 FIX_P15_RX3
+ -
J32
Row Column A Column B Column C Column D Column E Column F Column G Column H
9 RTM_SCL RTM_SDA SPI_CS2_L RTM_RST_L RTM_SW_CLOS RTM_PWRGOOD BIX_P19_RTM BIX_P19_RTM
ED_L _TX+ _TX-
AMC Bay
Pin Signal Pin Signal Pin Signal Pin Signal Pin Signal
1 GND 35 Unused 69 AMC_RX7- (to 103 AMC_TX10+ (to 137 GND
82571EB) RTM)
AMC Bay
Pin Signal Pin Signal Pin Signal Pin Signal Pin Signal
16 GND 50 AMC_TX5+ (to 84 +12V 118 Unused 152 GND
82571EB)
19 GND 53 AMC_RX5+ (to 87 AMC_RX8- (to RTM) 121 Unused 155 GND
82571EB)
20 AMC_TX1+ (to 54 AMC_RX5- (to 88 AMC_RX8+ (to 122 GND 156 Unused
FIX_GE3) 82571EB) RTM)
25 GND 59 AMC_TX6+ (to 93 AMC_RX9- (to RTM) 127 Unused 161 GND
82571EB)
28 GND 62 AMC_RX6+ (to 96 AMC_TX9- (to RTM) 130 Unused 164 GND
82571EB)
29 AMC_TX2+ (to 63 AMC_RX6- (to 97 AMC_TX9+ (to 131 GND 165 TCK
SATA mux) 82571EB) RTM)
32 AMC_RX2+ (to 66 AMC_TX7- (to 100 AMC_RX10+ (to 134 GND 168 TDO
SATA mux) 82571EB) RTM)
AMC Bay
Pin Signal Pin Signal Pin Signal Pin Signal Pin Signal
34 GND 68 AMC_RX7+ (to 102 AMC_TX10- (to 136 TCLKC+ 170 GND
82571EB) RTM)
2 GND 37 DQ27 72 +1.5V 107 GND 142 GND 177 A8 212 DM5
4 DQ1 39 CB0 74 CAS# 109 DQ57 144 NU 179 +1.5V 214 GND
5 GND 40 CB1 75 +1.5V 110 GND 145 GND 180 A3 215 DQ46
6 DQS0# 41 GND 76 CS1# 111 DQS7# 146 DQ22 181 A1 216 DQ47
7 DQS0 42 DQS8# 77 ODT1 112 DQS7 147 DQ23 182 +1.5V 217 GND
8 GND 43 DQS8 78 +1.5V 113 GND 148 GND 183 +1.5V 218 DQ52
9 DQ2 44 GND 79 NU 114 DQ58 149 DQ28 184 CK0 219 DQ53
10 DQ3 45 CB2 80 GND 115 DQ59 150 DQ29 185 CK0# 220 GND
11 GND 46 CB3 81 DQ32 116 GND 151 GND 186 +1.5V 221 DM6
12 DQ8 47 GND 82 DQ33 117 SA0 152 DM3 187 EVENT# 222 NU
13 DQ9 48 VTT 83 GND 118 SCL 153 NU 188 A0 223 GND
14 GND 49 VTT 84 DQS4# 119 SA2 154 GND 189 +1.5V 224 DQ54
15 DQS1# 50 CKE0 85 DQS4 120 VTT 155 DQ30 190 BA1 225 DQ55
16 DQS1 51 +1.5V 86 GND 121 GND 156 DQ31 191 +1.5V 226 GND
17 GND 52 BA2 87 DQ34 122 DQ4 157 GND 192 RAS# 227 DQ60
18 DQ10 53 ERROUT 88 DQ35 123 DQ5 158 CB4 193 CS0# 228 DQ61
20 GND 55 A11 90 DQ40 125 DM0 160 GND 195 ODT0 230 DM7
22 DQ17 57 +1.5V 92 GND 127 GND 162 NU 197 +1.5V 232 GND
24 DQS2# 59 A4 94 DQS5 129 DQ7 164 CB6 199 GND 234 DQ63
25 DQS2 60 +1.5V 95 GND 130 GND 165 CB7 200 DQ36 235 GND
26 GND 61 A2 96 DQ42 131 DQ12 166 GND 201 DQ37 236 +3.3V
27 DQ18 62 +1.5V 97 DQ43 132 DQ13 167 NC 202 GND 237 SA1
28 DQ19 63 CK1 98 GND 133 GND 168 RESET# 203 DM4 238 SDA
29 GND 64 CK1# 99 DQ48 134 DM1 169 CKE1 204 NU 239 GND
30 DQ24 65 +1.5V 100 DQ49 135 NU 170 +1.5V 205 GND 240 VTT
31 DQ25 66 +1.5V 101 GND 136 GND 171 A15 206 DQ38
32 GND 67 Vrefca 102 DQS6# 137 DQ14 172 A14 207 DQ39
33 DQS3# 68 Par_In 103 DQS6 138 DQ15 173 +1.5V 208 GND
34 DQS3 69 +1.5V 104 GND 139 GND 174 A12 209 DQ44
Contact Contact
Number Description Number Description
1 TCK 2 JTAG_EN_L (GND on
cable)
3 TDO 4 GND
5 TMS 6 GND
7 TRST_L 8 GND
9 TDI 10 GND
11 No Pin Key 12 Reserved
Contact Contact
Number Description Number Description
13 GND 14 AUTO_WRITE_L
15 GND 16 DIO1
17 GND 18 DIO2
19 GND 20 DIO3
Contact Contact
Number Description Dir Number Description Dir
1 H8S_TXD Out 2 H8S_MD1 In
3 GND N/A 4 Pull down Out
5 H8S_RXD IN 6 H8S_MD2# In
7 GND NA 8 Pull down Out
3.6 Switches
Mechanical switches are provided for debug configuration only. All switches settings are OFF
by default. Setting any switches to the ON state may conflict with normal board operation.
4.2 Processor
The ATCA-F140 utilizes a Freescale P2020 QorIQ processor. The speed grade used on the ATCA-
F140 is 1.0 GHz.
4.3 Memory
Each DIMM module has a serial presents detect (SPD) SROM that provides all necessary
information (such as speed, size and type) to the boot firmware. The SPD SROM is read using
the I2C bus that is connected to the processor.
This external interrupt is steered through the PIC of P2020 QorIQ Integrated Processor to
the IRQ_OUT signal.
The IRQ_OUT signal from the interrupt controller is then automatically detected by the
DDR controller, which immediately causes main memory to enter self-refresh mode.
1ms after the interrupt signal (IRQ_L[11]) the FPGA asserts the reset signal for at least
50ms.
Read persistent memory bit in FPGA.
Initialize main memory but do not clear persistent memory area.
4.4 IPMI
The IPMI function of the ATCA-F140 is implemented using the Artesyn common ATCA base
IPMI design. This building block is based on the Pigeon Point Systems IPMI implementation
using the Renesas HD64F2166 microcontroller which is part of the H8S controller family. The
IPMI building block implementation provides the following features:
Two IPMB interfaces to the backplane
One local IPMB interface for onboard IPMI
One I2C/IPMB interface for intelligent or non-intelligent RTMs
One private I2C interface for non-intelligent I2C devices
Serial UART (SIPL) and KCS/LPC interfaces to the P2020 service processor
Analog voltage sensor inputs
Service processor boot flash fall over selection
Watch-dog timer
Temperature Thresholds
Non
Device Non Critical Critical Recoverable Sensor Type
Air Inlet Component Side 45C 55C 72C LM75
1
BIX (BCM56334) 55C 70C 115C LM75
FIX (BCM56846) 55C 70C 110C On-die thermal diodes
Service Processor 55C 65C 115C LM75
(P2020)
Stratum Clock Oscillator 50C 55C 85C LM75
4.5 FPGA
A Xilinx XC3S400A Spartan 3A family FPGA is used on the board to provide a combination of
glue logic functions and telecom clock support functions. These functions include the
following:
Local Bus Interface
Local Bus Decoder
Low pin count interface between Host and IPMC
Interrupt Routing Unit
Reset Controller
Local Bus to SPI Interface
Telecom Clocking Support
The SPI device chain also includes the SPI devices for the BCM8727 and BCM84740 microcode
so they can be upgraded by the service processor.
There are six different modes of operation for the serial configuration PROM:
FPGA Configuration - The FPGA automatically controls the CSO_B, CCLK and MOSI pins
and reads the configuration data over DIN. Whether the configuration data is supplied by
SPI Flash 1 or 2 is determined by the routing of the CSO_B signal which is controlled by the
IPMC. AUX_SS1 and AUX_SS2 are deasserted by virtue of the fact the FPGA is not
configured.
FPGA Configuration Flash programming - A SPI controller in the FPGA (driven by the service
processor over the local bus) controls CSO_B, CCLK and MOSI, and monitors DIN. The IPMC
controls the chip select routing to determine which of SPI Flash 1 or 2 is programmed.
AUX_SS1 and AUX_SS2 are deasserted by the SPI controller.
BCM8727 microcode Flash programming - The same SPI controller in the FPGA is used as
with configuration Flash programming, but now AUX_SS1 is driven instead of CSO_B
(which is deasserted), allowing SPI Flash 3 to be programmed.
BCM84740 microcode Flash programming - The same SPI controller in the FPGA is used as
with configuration Flash programming, but now AUX_SS2 is driven instead of CSO_B
(which is deasserted), allowing SPI Flash 4 to be programmed.
BCM8727 microcode loading - The SPI port from the BCM8727 is routed to AUX_CS, CCLK,
MOSI and DIN pins in the FPGA to allow the microcode to be read from SPI Flash 3.
BCM84740 microcode loading - The SPI port from the BCM84740 devices are routed to
AUX_CS, CCLK, MOSI and DIN pins in the FPGA to allow the microcode to be read from SPI
Flash 4.
For example, in order to update the firmware in both devices, the user could boot from Flash
device #1 and update Flash device #2. Then the user must switch the active boot bank and boot
from Flash device #2, which would then enable writes to Flash device #1. At this point, the
board has successfully booted the updated firmware image in Flash device #2, so it is safe to
allow the firmware update of Flash device #1.
BOOT
SELECT Chip Select Mapping Boot Device Write Protection
Low BOOT_FLASH_0_L = SP_CS0_L Boot Flash #1 Boot Flash #1 = Write Protected
BOOT_FLASH_1_L = SP_CS1_L Boot Flash #2 = Not Write Protected
High BOOT_FLASH_0_L = SP_CS1_L Boot Flash #2 Boot Flash #1 = Not Write Protected
BOOT_FLASH_1_L = SP_CS0_L Boot Flash #2 = Write Protected
In case of an IPMC firmware upgrade, the BOOT_BANK signal stays unchanged. After IPMC
firmware update is finished, the IPMC reads the status of BOOT_BANK before driving it again.
During debugging, it is possible to disconnect the BOOT_BANK signal driven by IPMC and
select its value by a mechanical switch setting.
Some of the 1GbE SGMII ports from the BCM56334 have the option of being routed through
muxes to two different destinations as seen in the block diagram above. The ATCA-F140 board
uses 2 channel or 4 channel high speed broadband 2:1 multiplexer/demultiplexer switches to
perform this function. The select pins for these mux/demux switches are routed to the FGPA.
Through the P2020 local bus interface, the service processor can program registers in the
FPGA to route the SGMII ports to the desired destination.
The BCM8727 PHY is a two port XAUI to 10Gb SFI PHY that provides the interface between two
of the Base Switch 10GbE stacking ports and the front panel SFP+ modules. The BCM8727
requires an external SPI flash device of at least 16 Kbytes to load microcode into the device. An
AT25128B or equivalent SPI flash device will be used for this purpose.
Twelve of the 40Gbps ports are routed to the backplane switch fabric support of a fourteen slot
chassis. Two 40Gbps uplink interfaces from the switch are routed to the Zone 3 connectors for
use by an RTM. Two other 40Gbps uplink ports are routed to BCM84740PHYs to provide two
QSFP+ uplinks on the front panel. The P2020 service processor communicates with the
BCM56846 through the PCI Express interface to initialize and manage the switch.
Two 1G-SGMII ports are routed to the backplane for switch fabric support of the two extra slots
in a sixteen slot chassis, or optionally, to the TopSync device and Fabric Channel 1. One 1G-
SerDes port is routed to AMC port 1. One 1G-SGMII port is routed to update channels 3 and 4
to form a Fabric switch-to-AMC cross-connect with the other switch board across the
backplane.
Table 4-4 Fabric Switch Mapping (Default AXP1440 Chassis Configuration) (continued)
Table 4-4 Fabric Switch Mapping (Default AXP1440 Chassis Configuration) (continued)
Each SFP+ module's I2C signals are routed to the BCM8727 PHY which provides two separate
SFP+ I2C interfaces. The service processor uses these I2C interfaces, accessed through the PHY
management port, to read the module's on-board EEPROM information to determine type and
vendor specific information.
The SFP+ module receptacles are designed to support standard SFP+ modules as well as direct
attach copper SFP+ modules.
Each QSFP+ module's I2C signals are routed to the corresponding BCM84740 PHY. The service
processor uses these I2C interfaces, accessed through the PHY management port, to read the
module's on-board EEPROM information to determine type and vendor specific information.
QSFP+ status and control registers can also be accessed through the I2C interface.
The ATCA-F140 board is designed to be compatible with QSFP+ modules up to Power Level 2,
corresponding to a maximum power of 2W each.
The ATCA-F140 routes AMC ports 8-11 directly to the RTM for support of PCI Express
controllers on future versions of RTMs.
The ATCA-F140 provides current limited power control to the AMC. An electronic circuit
breaker device is used to control the 12V payload power and 3.3V management power to the
AMC as well as providing current limiting.
The 82571EB uses an external SPI flash device to store configuration data, MAC addresses, etc.
An Atmel AT25128B device is used for this purpose.
The HDD can be accessed by either the service processor or the PrAMC processor depending
on the state of the onboard SATA mux. The mux is controlled by an output of the IPMC which
sets the selection bit during E-keying initialization. By default, the mux is configured to
connect the SATA drive to the service processor.
A BITS is typically an output-only device that provides a precision timing reference, known as
the T[3] clock, to shelf-level products that use this for synchronizing the local telecom clocks.
An SSU is similar to a BITS but can in turn synchronize itself to a linecard derived reference
known as a T[4] clock.
The ATCA-F140 provides dual T1/E1 interfaces to support both BITS and SSU operation.
The following figure illustrates the clock flow in a system employing a BITS or SSU.
A software controlled reset register within the FPGA provides software controlled resets to the
FIX, BIX and PHY functions. The FPGA also implements a last reset register to capture the
source of the last reset generated on the board. The various onboard devices get reset by the
sources as shown in the following table.
Reset Output
MOD_PHY_RST_L
TELCO_RST_L
RTM_RST_L
BITS_RST_L
PHY_RST_L
BIX_RST_L
FIX_RST_L
HRST_L
SRST_L
FPGA
AMC
Reset Source
BRD_PWROK Yes No Yes Yes Yes Yes Yes Yes No Yes Yes
PAYLOAD_RST_L Yes No Yes Yes Yes Yes Yes Yes No Yes Yes
PB_RST_L Yes No Yes Yes Yes Yes Yes Yes No Yes Yes
HRST_REQ_L Yes No No No No No No No No No No
COP_HRESET_L Yes No Yes Yes Yes Yes Yes Yes No Yes Yes
COP_SRESET_L No No No No No No No No No No
AMC_EN No No No No No No No No No No No
AMC_PWR_GOOD No No No No No No No No Yes No No
Software Control in FPGA No No Yes Yes Yes Yes Yes Yes No No Yes
The request output signal HRESET_REQ_L of the P2020 QorIQ Integrated Processor indicates
to the board that a condition requiring the assertion of HRST_L has been detected.
HRESET_REQ_L may be activated by a watchdog timer inside the P2020 QorIQ Integrated
Processor, a boot sequence failure or by software. HRESET_REQ_L may occur at any time
synchronous to the core complex bus clock and stays active until HRST_L is asserted.
The soft reset input signal SRST_L causes a machine check interrupt to both e500 cores of the
P2020 QorIQ Integrated Processor. SRST_L need not to be asserted during a hard reset. SRST_L
may be asserted at any time completely asynchronously.
An output signal READY from each core indicates to the board that the cores have completed
the reset operation and are not in a power-down state. This information is monitored by the
IPMC.
4.12.1.2 Memory
The registers of the registered DIMM(s) will be reset in parallel to the HRST_L signal of the
P2020 QorIQ Integrated Processor.
The interrupt sources are collected by the onboard FPGA. This FPGA includes an interrupt
source register, which reflects the actual interrupt status. The interrupt inputs of the FPGA are
mapped to the IRQ[11:0] signals, which are connected to the P2020 QorIQ Integrated
Processor.
P2020
Interrupt Source Port Signal Source Type Voltage IRQ
BCM56334 INTA P2020 PCIE 1 INTA Internal 0
BITS Framer 1 INT_L BITS1_INT_L Direct Active Low OD 3.3 1
DS26503
BITS Framer 2 INT_L BITS2_INT_L Direct Active Low OD 3.3 2
DS26503
DIMMs EVENT_L DIMM_EVENT_L Direct Active Low OD 3.3 3
SIL3531A SATA INTA P2020 PCIE 2 INTA Internal 4
RTM FPGA INT_L RTM_INT_L Direct Active Low LVTTL 3.3 5
TopSync INTREQ_L CLOCK_INT_L FPGA Active Low LVTTL 3.3 6
ACS9510 (ORed)
ACS8595 INT_L
BIX Octal PHY 1 IRQ_L 1-8 COPPER_PHY_INT FPGA Active Low LVTTL 3.3 7
BCM54680-1 _L (ORed)
BIX Octal PHY 2 IRQ_L 1-8
BCM54680-2
BIX PHY 3 IRQ_L 1
BCM54616S-1
TopSync PHY IRQ_L 1
BCM54616S-2
Front Panel PHY IRQ_L 1
BCM54616S-3
P2020 – UC2 PHY IRQ_L 1
BCM54616S-4
BCM56846 INTA P2020 PCIE 3 INTA Internal 8
P2020
Interrupt Source Port Signal Source Type Voltage IRQ
Dual Optical PHY LASI1_L- 1-2 OPTICAL_PHY_INT FPGA Active Low LVTTL 3.3 9
BCM8727 LASI2_L _L (ORed)
When the Asset JTAG programming cable is installed on the header, the payload power bypass
enable signal is grounded, enabling the +12V payload power supply and each of the onboard
point of load supplies. This allows all of the JTAG devices to be accessed regardless of the state
of the power control CPLD.
5.1 Overview
This product uses the U-Boot, a boot loader software based on the GNU Public License. It
boots the blade and is the first software to be executed on after it is powered on.
Its main functions are:
Initialize the hardware
Pass boot parameters to the Linux kernel
Starting the Linux kernel
Update Linux kernel and U-boot images
This section describes U-Boot features and procedures that are specific to the ATCA-F140. For
general information on U-Boot, see http://www.denx.de/wiki/UBoot/WebHome.
1. Connect the console interface connector of the ATCA-F140 to the serial interface connector
of the computer.
2. Configure the terminal software to use the access parameters that are specified in U-Boot.
By default, the access parameters are as follows:
Baud rate: 9600
Flow control: XON/XOFF
PC ANSI
8 data bits
No parity
1 stop bit
These serial access parameters are the default values. These can be changed from within U-
Boot. The console port of the F140 blade also supports the baud rates of 38400 and 115200.
For details refer to the U-boot documentation.
If you want to disable the auto-boot feature of U-boot and make sure that U-Boot directly
enters into the command line interface mode after the next reboot/power up, enter the
following command:
setenv bootdelay -1
saveenv
This procedure assumes that the ATCA-F140 is connected to a TFTP server and that the U-Boot
command nfsboot has been defined. The external TFTP server must be connected using the
ATCA-F140 face plate connector "ETH5", which is the Ethernet management interface. Any
other interfaces, such as the base or fabric interfaces, are not yet functional at this stage of the
boot phase, as the corresponding drivers are not initialized yet.
1. Execute the following commands to specify the IP addresses of the ATCA-F140 and the TFTP
server by entering the following commands:
setenv ipaddr <IP address of ATCA-F140>
setenv serverip <IP address of TFTP server>
2. Specify the names of the Linux kernel image and the NFS root directory.
setenv bootfile <Linux kernel image file name>
setenv rootpath <NFS root directory>
setenv blobfile <dtb file name>
4. Depending on your network configuration, you may have to specify a gateway IP address
and a netmask. Use the following commands:
setenv gatewayip <gateway IP>
setenv netmask <netmask>
This procedure assumes that the U-Boot command ramboothas been defined and that the
RAM disk image is stored on an external TFTP server that is connected to the ATCA-F140.
During each boot process, the image is downloaded from the TFTP server into the main
memory of the blade. The external TFTP server must be connected using the ATCA-F140 face
plate connector "ETH5", which is the Ethernet management interface. Any other interfaces,
such as the base or fabric interfaces, are not yet functional at this stage of the boot phase, as
the corresponding drivers are not initialized yet.
1. Specify the IP address of the ATCA-F140 and the TFTP server that contains the RAM disk:
setenv ipaddr <IP address of ATCA-F140>
setenv serverip <IP address of TFTP server>
2. Depending on your network configuration, you may have to specify a gateway IP address
and a netmask. Use the following commands:
setenv gatewayip <gateway IP>
This section describes how to configure U-boot to boot a Linux kernel stored in the boot flash
and to mount the root file system in the user flash. The procedure uses the U-Boot script
flashboot, which has been predefined by Artesyn.
Generally, there is a fixed link between the U-Boot firmware and the kernel image in the
respective boot flash. This means that when the U-Boot in a particular flash is executed, it
subsequently boots the kernel image in the same flash.
If necessary, however, you can select the kernel to boot manually using the following
commands:
setenv kerneladdr e0000000 (for the kernel in the currently active boot flash)
setenv kerneladdr e2000000 (for the kernel in the currently stand-by boot flash).
Each of the two U-Boot firmware images in the two flashes holds a separate set of U-Boot
environmental variables/boot parameters. Therefore, after switching to another boot flash,
you may need to reconfigure the boot parameters/environmental variables of the new U-
Boot image according to your needs.
If the Linux OS running on the ATCA-F140 indicates a kernel panic and you wish to analyze the
cause, then you can issue a reset (using the face plate button for example) and subsequently
analyze kernel log files. Because of the persistent memory feature, these log files are still
available in the memory.
1. Issue a reset.
2. Connect to U-Boot. For more information, see Accessing U-Boot on page 101.
3. Using the kernel memory map, find the memory addresses of the kernel logs.
4. To display the kernel logfile at any of these memory addresses, enter the following
command: .printf (<memory address>)
The persistent memory feature can also be useful in the storage of application-specific data.
Use the standard U-Boot variable pram to reserve a memory region (at the end of the physical
memory). This allows the reserved region to not be overwritten by U-Boot. U-Boot reports less
memory to the Linux kernel (through the mem parameter) so that Linux will not use it either.
Regardless which of the two boot flashes is selected as the currently active boot device (using
IPMI), the start address is always mapped to 0xE0000000.
Offset Description
0x0 Magic word: 0xAA55FCE0
0x4 CRC32 checksum over the POST result string
Offset Description
0x8 POST result string. This is a zero-terminated string based on the
following XML-like
syntax:[<T=tag>[<E>Error_description</E>]*</T>]*
tag identifies the device that was tested. If no POST error was
detected, then the closing tag </T> follows
immediately after the opening tag.
Error_Description contains an error description of the
corresponding <T> tag. Note that the <T> tags can be nested, if for
example several subtests are performed in one device. See the
following example.
<T=FPGA></T>
<T=DRAM><E>Address line</E></T>
<T=PCI><T=BIX></T><T=FIX2></T><T=FIX1></T></T>
<T=SPI><T=BEXT></T></T>
<T=I2C><T=CTRL1></T><T=CTRL2></T></T>
<T=MDIO><T=PHY0></T><T=PHY1></T><T=PHY2><
/T><T=PHY3></T></T>
Information about the POST status can also be obtained by reading the SYS FW PROGRESS IPMI
sensor. Depending on the POST status, the sensor holds the following values.
Table 5-4 Post Results in SYS FW PROGRESS IPMI Sensor Reading Data
Value Description
0x01 No memory detected
0x02 Memory error. The address and data line test failed.
0x0b U-boot image CRC mismatch detected
0x0D Wrong CPU speed
0xfd Artesyn specific POST error code. For more
information, see Table "SYS FW PROGRESS IPMI
Sensor - POST Error Event Codes" on page 110.
0x00 One of the remaining POST errors was detected.
Table 5-5 SYS FW PROGRESS IPMI Sensor - POST Error Event Codes
Device Description
CPU Check PLL configuration (PORPLLSR register).
Check device configuration (PORDEVSR register)
FPGA Register sanity check. The version code is checked. It
must not be 0x00 or 0xFF.
DRAM Address line and data-line test.
Switch devices The PCI interface is checked as follows:
Check for configuration space access
(vendor/device ID)
Perform walking-one test on first memory-
mapped register
Base interface Data test on LED register page 0, offset 0x12
extender/SPI
I2C buses Check whether bus addresses 0x50,0x51, 0x52 are
accessible on bus 0 and 0x50, 0x6E on bus 1.
Device Description
RTC Checks whether the second counter is advancing.
Compares the number of CPU ticks in one second
against the expected system clock frequency (66 MHz)
MDIO/PHY Attempts to read model and device ID from PHY address
0..3
TSEC network port The PHY for each TSEC port is configured to loop back
mode, 100 and 1000 MBPS, and 10000 loop back
packets are sent and verified.
Boot flash Flash devices are sent into CFI query mode and the
query string is verified.
RTM Check connectivity of 10G repeater devices on RTM
Value Description
off Disables POST altogether
always POST is executed after all types of blade resets
hard POST is executed only after hard resets. A hard reset is a
reset of the entire payload and can be issued by the
following reset sources:
Watchdog inside CPU
Boot sequence failure
Software
Face plate reset key
A hard reset is NOT an CPU internal reset, such as a reset
issued through the U-Boot command reset or the
Linux command reboot.
You can start the POST execution manually by invoking the following command at the U-Boot
command line interface: .post_all()
As you can see from the syntax, this command invokes an underlying C function which starts
the POST execution. This command can be invoked at any time and it is independent of the
environment variable post_enable.
Command Description
bparams_set Allows to configure IPMI system boot options
hreset Issues a hard reset on the ATCA-F140. A hard reset resets the
entire payload.
bootsel 0|1|switch Selects the boot flash which the ATCA-F140 is to boot from after
the next restart. 0 selects boot flash 0, 1 selects boot flash 1, and
switch selects the currently not selected boot flash, i.e. switches
between the boot flashes.
It is recommended that you update the U-boot firmware using the BBS/Linux or the shelf
manager. Refer to the respective documentation for further details.
When updating the U-Boot image, the U-Boot boot parameters are not updated. They remain
as they were before the update. The boot parameters are stored separately from the U-Boot
image in a memory area within each boot flash. See also Table "Linux Devices" on page 107.
Each of the two U-Boot firmware images in the two flashes holds a separate set of U-Boot
environmental variables/boot parameters. Therefore, after switching to another boot flash,
you may need to reconfigure the boot parameters/environmental variables of the new U-
Boot image according to your needs.
1. Connect to U-boot. For more information, see Accessing U-Boot on page 101.
2. Specify the IP address of the ATCA-F140 and the TFTP server by entering the following
commands:
setenv ipaddr <IP address of ATCA-F140>
setenv serverip <IP address of TFTP server>
3. Depending on your network configuration, you may have to specify a gateway IP address
as well as a netmask:
setenv gatewayip <gateway IP>
setenv netmask <netmask>
protect off 2:252-258 addresses to the currently stand-by U-Boot bank, while
protect off 1:252-258 addresses the currently active U-Boot bank.
6. Erase the following flash area in the currently stand-by U-Boot bank:
erase e3f80000 e3ffffff
........ done
Erased 4 sectors
The currently stand-by U-boot bank is always mapped to the start address 0xE2000000,
while the currently active U-boot bank is always mapped to 0xE0000000.
If you wish to set a particular U-boot bank into the active state, then you need to set the
System Boot Options Parameter #96 (bit 0) appropriately and reboot. If this bit is set to 0,
then U-boot bank 1 will be active after the next reboot. If the bit is set to 1, then U-boot bank
2 will be active. Note that depending on the blade’s IPMI firmware version, the switch
between the U-boot banks may be effective immediately.
7. Copy the image from the RAM to the currently stand-by U-boot bank:
cp.b $loadaddr e3f80000 80000
Copy to Flash...
done
8. Make stand-by U-boot active and vice versa, by entering the following command:
bootsel switch
9. In order to boot the new U-Boot, reset the blade.
Board/System Damage
Incorrect replacement of lithium batteries can result in a hazardous explosion.
Therefore, replace the battery as described in this chapter.
Data Loss
If the battery voltage drops below the minimum required level, the RTC time will be
lost.
Therefore, replace the battery before seven years of actual battery use have elapsed.
Data Loss
Replacing the battery will result in RTC data loss. The RTC will have to be re-initialized
after the battery is replaced.
Data Loss
Installing another battery type other than what is mounted at board delivery may cause
limited operation. This is because other battery types may be specified for other
environments or may have a shorter lifespan. Therefore, only use the same type of
lithium battery as is already installed.
Replacement Procedure
2. Install the new battery following the "positive" and "negative" signs.
Organization Document
PICMG ATCA Base Specification Revision 3.0
Ethernet/Fiber Channel Specification Revision 1.0
Advanced Mezzanine Card Base Specification Revision 2.0
This section provides warnings that precede potentially dangerous procedures throughout
this manual. Instructions contained in the warnings must be followed during all phases of
operation, service, and repair of this equipment. You should also employ all other safety
precautions necessary for the operation of the equipment in your operating environment.
Failure to comply with these precautions or with specific warnings elsewhere in this manual
could result in personal injury or damage to the equipment.
Artesyn intends to provide all necessary information to install and handle the product in this
manual. Because of the complexity of this product and its various uses, we do not guarantee
that the given information is complete. If you need additional information, ask your Artesyn
representative.
The product has been designed to meet the standard industrial safety requirements. It must
only be used in its specific area of office telecommunication industry, industrial control, and
development. It must not be used in safety critical components, life supporting devices or on
aircraft.
Keep away from live circuits inside the equipment. Operating personnel must not remove
equipment covers. Only factory authorized service personnel or other qualified service
personnel is allowed to remove equipment covers for internal subassembly or component
replacement or any internal adjustment.
Do not install substitute parts or perform any unauthorized modification of the equipment or
the warranty may be voided. Contact your local Artesyn representative for service and repair
to make sure that all safety features are maintained.
Artesyn and our suppliers take significant steps to make sure that there are no bent pins on the
backplane or connector damage to the boards prior to leaving the factory. Bent pins caused by
improper installation or by inserting boards with damaged connectors could void the Artesyn
warranty for the backplane or boards.
This product operates with dangerous voltages that can cause injury or death. Use extreme
caution when handling, testing, and adjusting this equipment and its components.
EMC
FCC Class A
This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules, EN55022. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instruction manual, can cause
harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which
case the user is required to correct the interference at his own expense.
Use only shielded cables when connecting peripherals to assure that appropriate radio
frequency emissions compliance is maintained. Installed blades must have the face plates
installed and all vacant slots in the shelf must be covered.
For applications where this product is provided without a face plate, or where the face plate has
been removed, your system chassis/enclosure must provide the required electromagnetic
interference (EMI) shielding to maintain EMC compliance.
Board products are tested in a representative system to show compliance with the above
mentioned requirements. A proper installation in a compliant system maintains the required
performance.
As soon as you modify the product or change the default configuration you are responsible for
complying with all relevant regulatory standards.
VCCI
This is a Class A product based on the standard of the Voluntary Control Council for
Interference by Information Technology Interference (VCCI). If this equipment is used in a
domestic environment, radio disturbance can arise. When such trouble occurs, the user is
required to take corrective actions.
Installation
Damage of Circuits
Electrostatic discharge and incorrect installation and removal of the product can damage
circuits or shorten its life.
Before touching the product make sure that you are working in an ESD-safe environment or
wearing an ESD wrist strap or ESD shoes. Hold the product by its edges and do not touch any
components or circuits.
Blade Damage
Incorrect installation of the blade can cause damage of the blade,
Only use handles when installing/removing the blade to avoid damage/deformation to the
face plate and/or PCB.
Data loss
Removing the blade with the blue LED still blinking causes data loss. Wait until the blue LED is
permanently illuminated before removing the blade.
System Damage
The intra-building port(s) of the equipment or subassembly is suitable for connection to
intrabuilding or unexposed wiring or cabling only. The intra-building port(s) of the equipment
or subassembly MUST NOT be metallically connected to interfaces that connect to the OSP or
its wiring. These interfaces are designed for use as intra-building interfaces only (Type 2 or
Type 4 ports as described in GR-1089) and require isolation from the exposed OSP cabling. The
addition of Primary Protectors is not sufficient protection in order to connect these interfaces
metallically to OSP wiring.
Operation
Blade Damage
High humidity and condensation on the blade surface causes short circuits. Do not operate the
blade outside the specified environmental limits. Make sure the blade is completely dry and
there is no moisture on any surface before applying power. Do not operate the blade below -
5°C.
Configuration Switches/Jumpers
Product Malfunction
Switches marked as “Reserved” might carry production-related functions and can cause the
product to malfunction if their setting is changed.
Do not change settings of switches marked as “reserved”.
Product Damage
Setting/resetting the switches during operation can cause damage to the product.
Check and change switch settings before you install the product.
Product Damage
Too much force may damage the reset switch.
Use minimal force when pressing the reset switch.
Blade Damage
The RJ-45 connector(s) on the face plate are twisted-pair Ethernet (TPE) or E1/T1/J1 interfaces.
Connecting an E1/T1/J1 line to an Ethernet connector may damage the product.
Make sure that TPE connectors near your working area are clearly marked as network
connectors.
Verify that the length of an electric cable connected to a TPE bushing does not exceed 100
meters.
Make sure the TPE bushing of the system is connected only to safety extra low voltage
circuits (SELV circuits).
If in doubt, ask your system administrator.
AMC Module
Hot Swap
Data Loss
Removing the product with the blue LED still blinking causes data loss.
Wait until the blue LED is permanently illuminated before removing the product.
SFP/SFP+/QSFP+ Modules
Personal Injury
Optical SFP/SFP+/QSFP+ modules may be classified as laser products. When installing and
using any of these SFP/SFP+/QSFP+ modules, the regulations which correspond to the
respective laser class apply to the whole RTM. Not complying to these regulations may lead to
personal injury.
When installing and using optical SFP/SFP+/QSFP+ modules which are classified as laser
products, make sure to comply to the respective regulations.
Eye Damage
Optical SFP/SFP+/QSFP+ modules may emit laser radiation when no cable is connected. This
laser radiation is harmful to your eyes.
Do not look into the optical lens at any time.
Battery
Data Loss
Installing another battery type than the one that is mounted at product delivery may cause
data loss since other battery types may be specified for other environments or may have a
shorter lifetime.
Only use the same type of lithium battery as is already installed.
Environment
Environmental Damage
Improperly disposing of used products may harm the environment.
Always dispose of used products according to your country’s legislation and manufacturer’s
instructions.
Dieses Kapitel enthält Hinweise, die potentiell gefährlichen Prozeduren innerhalb dieses
Handbuchs vorrangestellt sind. Beachten Sie unbedingt in allen Phasen des Betriebs, der
Wartung und der Reparatur des Systems die Anweisungen, die diesen Hinweisen enthalten
sind. Sie sollten außerdem alle anderen Vorsichtsmaßnahmen treffen, die für den Betrieb des
Systems innerhalb Ihrer Betriebsumgebung notwendig sind. Wenn Sie diese
Vorsichtsmaßnahmen oder Sicherheitshinweise, die an anderer Stelle diese Handbuchs
enthalten sind, nicht beachten, kann das Verletzungen oder Schäden am System zur Folge
haben.
Artesyn ist darauf bedacht, alle notwendigen Informationen zum Einbau und zum Umgang mit
dem System in diesem Handbuch bereit zu stellen. Da es sich jedoch bei dem System um ein
komplexes Produkt mit vielfältigen Einsatzmöglichkeiten handelt, können wir die
Vollständigkeit der im Handbuch enthaltenen Informationen nicht garantieren. Falls Sie
weitere Informationen benötigen sollten, wenden Sie sich bitte an die für Sie zuständige
Geschäftsstelle von Artesyn.
Das Produkt erfüllt die für die Industrie geforderten Sicherheitsvorschriften und darf
ausschließlich für Anwendungen in der Telekommunikationsindustrie, im Zusammenhang mit
Industriesteuerungen und in der Entwicklung verwendet werden. Es darf nicht in
sicherheitskritischen Anwendungen, lebenserhaltenden Geräten oder in Flugzeugen
verwendet werden.
Einbau, Wartung und Betrieb dürfen nur von durch Artesyn ausgebildetem oder im Bereich
Elektronik oder Elektrotechnik qualifiziertem Personal durchgeführt werden. Die in diesem
Handbuch enthaltenen Informationen dienen ausschließlich dazu, das Wissen von
Fachpersonal zu ergänzen, können dieses jedoch nicht ersetzen.
Halten Sie sich von stromführenden Leitungen innerhalb des Systems fern. Entfernen Sie auf
keinen Fall die Systemabdeckung. Nur werksseitig zugelassenes Wartungspersonal oder
anderweitig qualifiziertes Wartungspersonal darf die Systemabdeckung entfernen, um
Systemkomponenten zu ersetzen oder andere Anpassungen vorzunehmen.
Installieren Sie keine Ersatzteile oder führen Sie keine unerlaubten Veränderungen am System
durch, sonst verfällt die Garantie. Wenden Sie sich für Wartung oder Reparatur bitte an die für
Sie zuständige Geschäftsstelle von Artesyn. So stellen Sie sicher, dass alle
sicherheitsrelevanten Aspekte beachtet werden.
Dieses Produkt wird mit gefährlichen Spannungen betrieben, die zu Verletzungen und Tod
führen können. Seien Sie im Umgang mit dem Produkt und beim Testen und Anpassen des
Produktes und seiner Komponenten äußerst vorsichtig.
EMV
FCC Class A
Das Produkt wurde getestet und erfüllt die für digitale Geräte der Klasse A gültigen Grenzwerte
gemäß den FCC-Richtlinien Abschnitt 15 bzw. EN 55022 Klasse A. Diese Grenzwerte sollen
einen angemessenen Schutz vor Störstrahlung beim Betrieb des Produkts in Geschäfts-,
Gewerbe- sowie Industriebereichen gewährleisten. Das Produkt arbeitet im
Hochfrequenzbereich und erzeugt Störstrahlung. Bei unsachgemäßem Einbau und anderem
als in diesem Handbuch beschriebenen Betrieb können Störungen im Hochfrequenzbereich
auftreten.
Diese Einrichtung kann im Wohnbereich Funkstörungen verursachen; in diesem Fall kann vom
Betreiber verlangt werden, angemessene Maßnahmen durchzuführen und dafür
aufzukommen.
Benutzen Sie zum Anschließen von Peripheriegeräten ausschließlich abgeschirmte Kabel. So
stellen Sie sicher, dass ausreichend Schutz vor Störstrahlung vorhanden ist. Die Blades müssen
mit der Frontblende installiert und alle freien Steckplätze müssen mit Blindblenden abgedeckt
sein.
Änderungen, die nicht ausdrücklich von Artesyn erlaubt sind, können Ihr Recht das System zu
betreiben zunichte machen.
Wenn dieses Produkt ohne Frontblende ausgeliefert wird oder wenn die Frontblende entfernt
wird, muss Ihr System die notwendigenSchutzmechnismen gegen elektromagnetische
interferenzen bereitstellen, um die Einhaltung der eletromagnetischen Verträglichkeit des
Systems zu gewährleisten.
Sobald Sie das Produkt oder seine Standardkonfiguration verändern, müssen Sie dafür sorgen,
dass alle relevanten Richtlinien eingehalten werden.
VCCI
Das Produkt ist eine Einrichtung der Klasse A gemäß dem Standard des Voluntary Control
Council for Interference von Information Technology Interference (VCCI). Wird das Produkt in
Wohngegenden betrieben, können Störungen im Hochfrequenzbereich auftreten. In einem
solchen Fall ist der Benutzer verpflichtet, entsprechende Gegenmaßnahmen zu ergreifen.
Installation
Datenverlust
Wenn Sie das Blade deinstallieren, obwohl die blaue Hot-Swap-LED noch blinkt, kann dies zu
Datenverlust führen. Warten Sie daher, bis die blaue LED durchgehend leuchtet, bevor Sie das
Blade deinstallieren
Operation
Schaltereinstellungen
AMC-Module
Eingeschränkte Betriebstemperaturbereich
Werden AMC-Module auf dem Blade installiert, deren Betriebstemperaturbereiche kleiner sind
als der Betriebstemperaturbereich des Blades selber, so führt dies zu einer Einschränkung des
Betriebstemperaturbereiches des Blades. Stellen Sie sicher, dass sich die
Betriebstemperaturbereiche des Blades sowie installierter AMCModuleinnerhalb erlaubter
Bereiche bewegen.
Hot Swap
Datenverlust
Wenn Sie das Produkt ausbauen, obwohl die blaue Hot-Swap LED noch blinkt, kann dies zu
Datenverlust führen.
Warten Sie daher, bis die blaue LED durchgehend leuchtet, bevor Sie das Produkt ausbauen.
SFP/SFP+ Modules
Gefahr von Verletzungen sowie von Beschädigung des RTMs und SFP/SFP+-Modulen
Die Installation und der Betrieb von SFP/SFP+-Modulen, welche nicht zertifiziert sind und
welche nicht den Sicherheitsstandards entsprechen, kann Verletzungen zur Folge haben sowie
zur Beschädigung des RTMs und von SFP/SFP+-Modulen führen.
Verwenden Sie daher nur SFP/SFP+-Module, die zertifiziert sind und die den
Sicherheitsstandards entsprechen.
Verletzungsgefahr
Optische SFP/SFP+-Module können als Laserprodukte klassifiziert sein. Wenn Sie solche
SFP/SFP+-Module installieren und betreiben, so gelten die entsprechenden Bestimmungen für
Laserprodukte für das gesamte RTM. Werden diese Bestimmungen nicht eingehalten, so
können Verletzungen die Folge sein.
Wenn Sie SFP/SFP+-Module betreiben, die als Laserprodukte klassifiziert sind, stellen Sie
sicher, dass die entsprechenden Bestimmungen für Laserprodukte eingehalten werden.
Batterie
Datenverlust
Wenn Sie einen anderen Batterietyp installieren als der, der bei Auslieferung des Produktes
installiert war, kann Datenverlust die Folge sein, da die neu installierte Batterie für andere
Umgebungsbedingungen oder eine andere Lebenszeit ausgelegt sein könnte.
Verwenden Sie daher den gleichen Batterietyp, der bei Auslieferung des Produktes installiert
war.
Umweltschutz
Umweltverschmutzung
Falsche Entsorgung der Produkte schadet der Umwelt.
Entsorgen Sie alte Produkte gemäß der in Ihrem Land gültigen Gesetzgebung und den
Empfehlungen des Herstellers.