Punjabi University, Patiala Syllabus for B. Tech Integrated - Ist Yr;BOS:2023 Branches: CSE/ECE/ECM/ME/CIVIL: Batch 2023 (Revised: Aug. 2023] GR IND SEMESTER & GR : APPLIED PHYSICS Course Codes: BASB1125T / BASB1225T ‘ P Credits 3 1 ° 38 Course Objective: The course is aimed at developing the basic scientific skills among students of engineering that are imperative for effective understanding of engineering subjects. Physical concepts included in this syllabus are importance for understanding various engineering and technological problems. At the end of the course, students shall be able to deal with phenomena related to oscillations, diffraction, interference, polarization, lasers and quantum mechanics. They will learn how to implement their scientific knowledge to solve real world problems. Section A Simple harmonic motion: Differential equation, Energy of simple harmonic oscillator, lissajous figures formed by superposition of two SHM, Charge oscillations in a LC circuit. Damped oscillator: Differential equation, methods of describing damping of an oscillator- logarithmic decrement, relaxation time, quality factor, Damped oscillations in a LCR circuit. Interference by division of amplitude: plane parallel thin films, colors in thin films, non-reflecting films/coatings, high reflectivity thin film coatings, Michelson interferometer. Fraunhoffer diffraction from circular aperture, double slit and a grating (normal incidence case), Rayleigh’s criteria of resolution, resolving power of telescope, microscope and grating. Polarization by double refraction, Nicol prism, Concept of plane, circular and elliptical polarization with mathematical expression. Section B Transitions between energy states, Einstein coefficients, principle and properties of laser beam, three and four level lasers, elementary description of principle, construction and operation of He-Ne laser, CO> laser, ruby laser, Nd-YAG laser and semi-conductor laser. Applications of lasers. Propagation of light through optical fiber, its geometry, numerical aperture and acceptance angle, step index and graded index fibers, Signal attenuation and dispersion (qualitative ideas). Applications of optical fibers. de-Broglie waves, velocity of de-Broglie waves, wave packets, Davison and Germer experiment tative only), wave functions, time dependent and time independent Schrodinger wave equation, expectation value, application of Schrodinger equation to particle in an infinite potential box, potential barrier (tunneling effect). Recommended Books: 1. Wave and Vibrations by HJ. Pains 2. Fundamentals of optics by Jenkins and White (McGraw Hills) 3. _Lasers- Theory and applications by Thyagarajan and Ghatak (McMillan Publishers) 4 ud for Engineers by N.K. Verma (PHI Learning Private Ltd... 5 ies for Engineering Applications by S. Puri (Narosa Publishers) Page 32 of 36Punjabi University, Patiala Syllabus for B. Tech Integrated - Ist Yr,BOS:2023 CSE/ECE/ECM/MEVCIVIL: Batch 2023 (Revised: Aug. 2023] GROUP A: SECOND SEMESTER & GROUP B: FIRST SEMESTER MANUFACTURING PROCESSES Course Code: MCEB1124T / MCEB1224T Lo T P Credits 3.0 0 30 Course Objective: The objective of this course is to have a good understanding of the basic concepts of manufacturing via engineering materials, casting, machining, forming, joining, welding and assembly, enabling the students to develop a basic knowledge of the mechanics, operation and limitations of basic machining tools. The course also introduces the concept of basic carpentry operations. At the end of the course, the students wound understand (i) the principles and science of various manufacturing processes used in industry, (ii) about foundry practice, machining, machinery, tools, equipment, metal forming, welding techniques and operations required for basic manufacturing processes, ii) understand advantages and applications of various manufacturing processes, and (iv) select an appropriate manufacturing process, based upon viability & industrial applications, and (v) the recent emerging areas in primary manufacturing processes. Section - A Introduction: Common engineering materials and their important mechanical and manufacturing properties. General classification of manufacturing processes, Importance of manufacturing processes, economics and selection of manufacturing processes. Metal Casting: Principles of metal casting, casting terminology, Patterns, their functions, types, materials and pattern allowances, Characteristics of molding sand, Types of sand molds, Types of cores, chaplets and chills; their materials and functions. Casting Defects, their causes and remedies. ‘Machining Processes: Principles of metal cutting, cutting tool materials and applications, types of single point cutting tools. Geometry of single point cutting tool. Cutting fluids and their functions, types of cutting fluids, selection of cutting fluids. Machine Tools: Introduction to Centre Lathe, parts of a lathe, lathe attachments, Operations performed on lathe, work holding devices in Lathes. Section -B to shaper and planner machines, their operations. Introduction to at cuting tools Introduction to miling and ling operations, Drting and lied operation, Sawing operations. Welding & Allied Joining Processes: Welding classification, types of welding electrodes, functions of flux and types of welding joints. Elements of Electric arc, Gas, Resistance and Thermit welding, Soldering, Brazing and Braze welding, Submerged arc welding (SAW). Applications of various welding processes. Welding defects, their causes and remedies. Metal Forming and Shearing: Hot and cold working, Types of Forging processes. Rolling, Wire drawing and extrusion processes, drawing, bending, spinning, stretching, embossing and coining. Die and punch operation, shearing, piercing and blanking, notching, lancing, bending and deep drawing operations. ‘Carpentry Operations: Woods and their types, seasoning of wood, types of joints. Recommended Books 1. Degramo, Kohser and Black. Materials and Processes in Manufacturing, 8*Edition, Prentice Hall of India, ‘New Delhi. Amstead Ostwald, and Bageman, Manufacturing Processes, John Wiley and sons, New Delhi ‘Campbell, Principles of Manufacturing, Materials and Processes, Tata Megraw HillCompany Kalpakjian, S. and Schemid, $.R., Manufacturing Engineering & Technology,Prentice Hall, New York. Groover, M.P., Fundamentals of Modern manufacturing: Materials, Processes andSystems, John Wiley and Sons Inc., New York B. S. Raghuwanshi, Workshop Technology (Part ~1 & II), Dhanpat Rai and Co., New Delhi. ‘Singh, Manufacturing Technology, Pearson Education Asia, New Delhi Khanna, O.P. and Lal, M., A Text Book of Production Technology, Dhanpat Rai na Delhi. he ge WV Ys veerPunjabi University, Patiala Syllabus for B. Tech Integrated - Ist Yr;BOS:2023 ‘CSE/ECE/ECM/MEJCIVIL: Batch 2023 [Revised: PA: SEMESTER & GR' BASIC ELECTRONICS Course Code: ECEB1123T / ECEB1223T L oT P Credits 301 0 35 Course Objective: ‘To enhance comprehension capabilities of student through understanding of electronic devices such as Diode, Transistor and FET. The student should also be able to acquire basic knowledge of Digital electronics and communication system. Section-A PN junction, Depletion layer, Barrier potential, Forward and reverse bias, Breakdown voltage, PIV, Characteristics of p-n junction diode, knee voltage, load line; and operating Point. Ideal p-n junction diode, junction capacitance, zener diode. Rectifiers and filters-Half wave, centre tap full wave and bridge rectifier, clipping and clamping circuit, voltage regulation. BIT - Introduction, Basic theory of Operation of PNP ad NPN transistor, V-I characteristics, CB, CE and CC configuration, Basic BJT Amplifiers. Introductory idea of RC multistage amplifiers. FET- Introduction, V-I characteristics and operation, UJT - Introduction, V-I characteristics and operation. Section-B Number Systems: Number systems, Conversions, Number Representations, Demorgan 's Theorem, Boolean Algebra and Arithmetic operations. Binary codes-Grey codes, Excess-3 code, BCD code, symbols and truth tables of NOT Gate, AND Gate, NAND Gate, OR Gate, NOR Gate, EX-OR Gate and EX-NOR Gate. Introduction to communication system, General block diagram, need for communication, need of ‘modulation and demodulation, Block diagram of radio transmission and reception system and function of each block. Course Learning Outcomes (CLO): After the completion of the course, the student should be able to: 1. Demonstrate the use of semiconductor diode in various applications. 2. Discuss and explain the working of transistor, their configuration and application. 3. Recognize and apply the number system and Boolean algebra. 4 3. Define the communication system and differentiate various modulation techniques. . Explain radio transmission and reception, Text Books: Milliman, J. and Halkias, C.C,, Electronic Devices and Circuits, Tata MeGraw Hill, (2007). Boylestad, R.L. and Nashelsky, L., Electronic Devices & Circuit Theory, Perason (2009). Digital Design by Morris Mano, PHI, 4th edition, 2008. Digital principles and Applications, by Malvino Leach, TMH, 2011. Electronic Communication Systems by G. Kennedy And B. Davis, Me Graw Hill, 4th Edition, (2006). Reference Books: 1. Edward Hughe, Electrical Technology, Addison-Wisley, New York. 2 Naidu and S. Kamakshaiah, Introduction to Electrical Engineering Tata McGraw Hills, New Delhi. 3. V. Deltoro, Principle of Electrical Engineering, Tata McGraw Hill, New Delhi. 4. Smith and Dorf, Circuits Devices and Systems, John Wiley and Sons. 5. § Thomas L. Gloyd, Electronics Fundamentals Circuits, Devices ae Prentice Hall International Inc. 6. B.P Lathi, Communication systems Engg., Pearsons. wpe oe Ms) Page 30 of 36Pumjbi Univerhy, Faia Syabs for B, Tach Innere - it ees Branches: CSE/ECE/ECM/ME/CIVIL: Batch 2023 [Revis 2023) ROUP A: JEMESTER & GROUP. JECOND. SEMESTER ELECTRONIC MATERIALS & COMPONENTS Course Code: ECEB1108T / ECEB1208T L oT P_ Credits 3.00060 3.0 Course Outcomes: After this course, the student will be able to understand the basic concepts regarding electronic materials, components and datasheets. ‘Section-A Resistivity and factors affecting resistivity (such as temperature, alloying and mechanical stressing) of Conducting Materials, Classification of conducting materials into low resistivity and high resistivity materials (Some examples of each and their typical applications.), Electrical characteristics and applications of these materials : Copper, silver, Gold, Bronze, Tin Lead Alloy. Electrical properties of insulating materials: Volume ity, surface resistance, dielectric loss, dielectric strength (breakdown voltage) and dielectric constant,Electrical characteristics and applications of these materials: Mica, Paper, Teflon, Ceramic. ‘Section-B Different magnetic materials; Diamagnetic, paramagnetic, ferromagnetic materials and their properties, Ferromagnetism, Ferrimagnetism, domain formation, permeability, Hysteresis curve, coercive force and residual magnetism and magnetic saturation, Soft and hard magnetic materials, their examples and typical applications. Superconductivity and piezoelectric ceramic transducer elements. Capacitors: Types of capacitors, Their constructional details and testing specifications, Capacity of parallel plate ‘capacitors, spherical capacitors, cylindrical capacitor, Energy stored in a capacitor, Concept of dielectric and its ‘effects on capacitance, dielectric constant,break down voltage. Resistors: Carbon film, metal film, carbon composition, wound and variable types (presets and potentiometers), Transformer, inductors and RF coils: RECOMMENDED BOOKS 1. Basic Electronics and Linear Circuits by NN Bhargava and Kulshreshta; Tata McGraw Hill, New Delhi 2. Electronic components and Materials by SM Dhir, Tata McGraw Hill, New Delhi 3. Electrical and Electronic Engineering Materials by SK Bhattacharya, Khanna Publishers, New Delhi 4. Electronic Engineering Materials by ML Gupta, Dhanpat Rai and Sons; New Delhi, Pesavaise ial -. \'y Av, p- N,Punjabi University, Patiala Syllabus for B. Tech Integrated - Ist Yr;BOS:2023 Branches: CSE/ECE/ECM/MEJCIVIL: Batch 2023 (Revised: Aug. 2023] GROUP A: SECOND SEMESTER & GROUP B: FIRST SEMESTER COMPUTER PROGRAMMING Course Code: CSEB1122T / CSEB1222T L oT PP Credits s 1.0 3s Course Objective: Making the students understand and learn the basics of computer how to operate it, to make familiar with the part and function of computer and its types. Second part of the course is designed to provide complete knowledge of C language. Students will be able to develop logics which will help them to create programs, applications in C. Also, by learning the basic programming constructs they can easily switch over to any other Janguage in future after completing the subject, student should be able to: ‘© Understand the meaning and basic components of a computer system, ‘© Define and distinguish Hardware and Software components of computer system, * Design an algorithmic solution for a given problem Write « maintainable C program for a given algorithm. Trace the given C program manually. Write C program for simple applications of real-life using structures and files. Section A Number System: Bit, Byte, Binary, Decimal, Hexadecimal and Octal System, Conversion from one System to another. Binary Arithmetic: Addition, Subtraction and Multiplication. Introduction to Computer Language: Machine Language, Assembly Language, Higher Level Language, Assembler, Compiler, Interpreter. Introduction to Operating System: Batch Systems, Multiprogramming, Time sharing Systems, Real Time Systems, Network Operating System and Distributed Operating System. Introduction to C: Concepts of Procedure oriented programming, Character Set, Identifiers, Keywords and Data types and storage classes. Operators and Expressions: Arithmetic, Unary, Logical, Relat Associatively and Precedence of Operators Control Structures: If, while, do-while and for loop, Nested Control! Structure, Switch-case, break and Continue statements il, Assignment and Conditional Operator, Section B Arrays: Single Dimensional, Multidimensional Arrays and Pointers, String reading/writing Funetions: Types of Functions, Call by Value and Call by reference, Recursion, Structures, File processing: Opening and closing data files, simple writing and reading in unformatted data files. Object Oriented Concepts: Comparison between C and C+, structure of C+ Program, Basic Input/ Output statements, introduction to Classes and Objects, creating a class and object, accessing class members (private, public), C++ Fundamentals Concepts (Definition with example) of : Encapsulation, Function Overloading, Single level Inheritance, Polymorphism and Friend Functions. Note: This subject is common to all branches. Only basics of C+ is covered Recommended Books: 1, E, Balagurusamy, “Programming in C”, Tata McGraw Hill 2, Yashwant Kanetkar, “Let Us C”, BPB 3. B. Ram, “Computer Fundamentals”, Wiley 4, P.K.Sinha, “Computer Fundamentals”. 3. V. Rajaraman, “Fundamentals of Computers”, PHI 6 7. 8 . Brain W. Kernigha and Dennis M. Richie: The C Programming Language, PHI . Robert Lafore, “Turbo C++" . E, Balagurusamy, “Programming in C++”, Tata McGraw Hill { A £ Page 29 of 36Punjabi University, Patiala Syllabus for B. Tech Integrated - Ist Yr;BOS:2023 Branches: CSE/ECE/ECM/MEICIVIL: Batch 2023 (Revised: Aug. 2023] ST SEMESTER & GROUP IRST SEMESTER APPLIED MATHEMATICS-I Course Code: BASB1101T Course Objective: The course is aimed at developing the basic mathematical skills among the students of engineering that are imperative for effective understanding of engineering subjects. The main objective isto inculcate the knowledge of basic concepts of Calculus, Algebra, Complex Analysis and their applications for the solutions of engineering and mathematical problems. At the end of the course, students shall be able to deal with functions of several Variables, matrices, system of linear equations, improper integrals and functions of complex variables. They shall learn how to implement their mathematical knowledge to solve real world problems. Course Content Section-A_ Matrix Algebra: Special Matrices: Hermitian matrices, Skew-Hermitian matrices, Unitary matrices and Orthogonal matrices; Rank of matrices, Rank by Echelon form; Consistency of system of homogeneous and non-homogeneous equations: Gauss Elimination method, Gauss Jordan method; Eigen values and Eigen vectors of a matrix, Elementary properties of Eigen values and Eigen vectors,Eigen values of Special Matrices, Cayley Hamilton's Theorem. Functions of several variables: Partial derivatives, Total differential, Approximation by Total Differentials, Derivatives of composite and implicit functions, Homogenous functions, Euler's theorem, Maximumand Minimum values of functions of two and three variables, Lagrange’s Method of Multipliers. Section-B ‘Complex Analysis: De Moivre's Theorem, Power and roots of complex numbers, Expansion of cos" @ , sin” in terms of cosn@ and sinn@ and vice-versa, Analytic functions, Necessary and Sufficient condition for a function to be analytic, CR-equations, Polar form of CR-equations, Harmonic functions, Conjugate of Harmonic functions, Laplace equation. Improper integrals: Improper integral of First and Second kind, Absolute convergence of Improper integrals, Comparison tests (without proof), Beta and Gamma functions and their properties. RECOMENDED BOOKS: 1. RK. Jain and S. R. K. Iyenger, Advanced Engineering Mathematics, Narosa Publishing House, New Delhi. 2. BE. Kreyzic, Advanced Engineering Mathematics, Johan Wiley & Sons, (10"Edition). 3. H.K. Dass, Advanced Engineering Mathematics, S. Chand and Company. 4. B.S. Grewal, Higher Engineering Mathematics, Khanna Publisher. Scheme of Examination ‘© English will be the medium of instruction and examination. © This course will carry 100 marks of which 50 marks shall be reserved for Internal Assessment and remaining ‘50 marks for extemal end semester examination, ‘© The duration of final written examination of this paper shall be of three hours. ‘The students shall be declared passed in the paper if he/she secures minimum 40% marks in each of the Internal Assessment and External Examinations separately. Instructions to the External Paper Setter * The External Paper will carry 50 marks and would be of three hours. The Question paper will be divided into three Sections, namely Section-A, Section-B and Section-C. There will be FIVE questions in each of the Sections A and B, of five (05) marks each. However, a question may be segregated into subparts. Section C is compulsory and contains TEN (10) sub-parts each of two (2) marks. Candidates will be required to attempt SIX questions by selecting three Questions from each Sections A& B. © The paper setter shall provide detailed marking instructions and solutions to numerical problems for evaluation purpose in the separate white envelopes provided for solutions. + The paper setters should seal the internal & external envelope properly with signatures & cello tape at proper place, lov Page 7 of 36 y* oa