Unit 5-1
Unit 5-1
Dr.Nijisha Shajil
Assistant Professor
Dept. of Biomedical Engineering, CET, SRMIST Ktr
Ph: 7299696765, email: [email protected]
Topics
• Logic families
• Propagation Delay, Fan – In and Fan – Out, Noise Margin
• RTL, TTL, ECL, CMOS
• Comparison of Logic families
• Implementation of combinational logic/sequential logic design using standard ICs
• PROM, PLA and PAL
• Basic memory, static ROM, PROM, EPROM, EEPROM, EAPROM
Syllabus
Integrated Circuits
• Integrated Circuits (IC) is a silicon semiconductor crystal, called a chip, containing the electronics
components for constructing digital gates. The various gates are interconnected inside the chip
to form the required circuit. The chip is mounted in a ceramic or plastic container and
connections are welded to external pins to form the integrated circuit.
• Digital ICs are often categorized according to the complexity of their circuits, as measured by the
number of logic gates in a single package.
Fan-out
• The fan-out of a gate specifies the number of standard loads that can be connected to the output
of the gate without degrading its normal operation. A standard load is usually defined as the
amount of current needed by an input of another gate in the same logic family.
• The output of a gate is usually connected to the inputs of other gates. Each input requires a
certain amount of current from the gate output, so that each additional connection adds to the
load of the gate.
• Loading rules are sometimes specified for a family of digital circuits. These rules give the
maximum amount of loading allowed for each output of each circuit in the family. Exceeding the
specified maximum load may cause a malfunction because the circuit cannot supply the power
demanded of it by its loads.
• The fan-out is the maximum number of inputs that can be connected to the output of a gate
and is expressed by a number. The fan-out is calculated from the amount of current available in
the output of a gate and the amount of current needed in each input of a gate.
Fan-out
• Consider the TTL gates which have the
values:
O- Output
I-Input
L-Low
H-High
Power dissipation
• The power dissipation is a parameter expressed in milliwatts (mW) and represents the amount
of power needed by the gate from the power supply.
• An IC with four gates will require from its power supply, four times the power dissipated in
each gate.
Calculation
• Supply voltage = Vcc
• Current drawn by circuit = Icc
• Power = Voltage x Current = Vcc x Icc
• The current drawn from the power supply when the output of the gate is in the high-voltage
level is termed ICCH and when the output is in the low-voltage level, the current is ICCL.
Power dissipation
• The average current is
• Example: TTL NAND gate with Vcc=5v, ICCH=1mA, ICCL=3mA. 4 NAND gates. Power dissipation?
• Ans: 40mW
Propagation Delay
• The propagation delay of a gate is the average transition-delay time for the
signal to propagate from input to output when the binary input signal
changes.
• Signals through a gate take a certain amount of time to propagate from
input to output – Propagation delay of the gate
• Propagation delay is in nanoseconds (ns).
• The sum of propagation delays through the gates is the total delay of the
circuit.
• If speed of operation is important
• Each gate must have short Propagation delay
• Digital circuit must have minimum number of gates between i/p and o/p
21BMC204J (Dr.Nijisha Shajil) 11
Unit 5: Programmable Logic Devices
Propagation Delay
• The signal-delay time between the input
and the output when the output changes
from high to low level is referred to as tPHL
• Similarly, when the output goes from low to
high level, the delay is tPLH
• It is customary to measure the time
between the 50 percent point on the input
and output transitions.
• Average of the above two terms is the
average propagation delay.
Example: Delays for a standard TTL gate are tPHL= 7 ns and tPLH = 11 ns. The average propagation
delay is?
Ans: 9 ns
Standard NAND gate tPHL= 15 ns and tPLH = 22 ns
21BMC204J (Dr.Nijisha Shajil) 12
Unit 5: Programmable Logic Devices
Noise margin
• Noise: Spurious electrical signals from industrial and other sources can
induce undesirable voltages on the connecting wires between logic circuits.
• Two types of noise:
• DC noise is caused by drift in the voltage level of a signal
• AC noise is a random pulse that maybe created by other switching signals
Noise margin
• It is calculated from the knowledge of
the voltage signal available in the output
of the gate and the voltage signal
required in the input of the gate.
• Any voltage between Vcc and VOH is high
level state, and between VOL and 0 is low
level state.
• In order to compensate for noise signal,
the circuit must be designed so that VIL is
greater than V0L and VIH is less than V0H.
RTL circuit
• The analysis of the RTL gate is simple.
• If any input of the RTL gate is high, the corresponding transistor is driven
into saturation and the output goes low, regardless of the states of the
other transistors.
• If all inputs are low at 0.2 V, all transistors are cut off because VBE < 0.6 V and
the output of the circuit goes high approaching the value of the supply
voltage Vcc
• This confirms the conditions of a NOR gate
• Note that the noise margin for low signal input is 0.6 - 0.2 = 0.4V.
DTL gate
• Each input is associated with one diode
• Diodes and 5 k ohm resistor form an AND gate
• Transistor serves as current amplifier and inverts the signal
• Low level – 0.2 V
• High level – 4 and 5 V
TTL
• The standard TTL gate was the first version in the TTL family. This basic gate
was then designed with different resistor values to produce gates with lower
power dissipation or with higher speed.
• The propagation delay of a transistor circuit that goes into saturation
depends mostly on two factors: storage time and RC time constants.
• Reducing the storage time decreases the propagation delay.
• Reducing resistor values in the circuit reduces the RC time constants and
decreases the propagation delay. But, the trade-off is higher power
dissipation because lower resistances draw more current from the power
supply.
• The speed of the gate is inversely proportional to the propagation delay.
TTL
• In the low-power TTL gate, the resistor values are higher than in the standard gate in order to
reduce the power dissipation, but the propagation delay is increased.
• In the high-speed TTL gate, resistor values are lowered to reduce the propagation delay but the
power dissipation is increased.
• The Schottky TTL gate was the next improvement in the technology. The effect of the Schottky
transistor is to remove the storage time delay by preventing the transistor from going into
saturation. This series increases the speed of operation of the circuit without an excessive
increase in power dissipation.
• The low-power Schottky TTL sacrifices some speed for reduced power dissipation
• The advanced low-power Schottky has the lowest speed- power product and is the most efficient
series. The fast TTL family is the best choice for high-speed designs.
TTL
• TTL gates come in three different types of output configuration
• Open collector output
• Totem pole output
• Three-state output
Totem Pole
• The output impedance of a gate is normally a resistive plus a capacitive
load.
• The capacitive load consists of the capacitance of the output transistor, the
capacitance of the fan-out gates and any stray wiring capacitance.
• When the output changes from the low to the high state, the output
transistor of the gate goes from saturation to cutoff and the total load
capacitance C charges exponentially from the low to the high voltage level
with a time constant equal to RC
• The TTL gate with the totem-pole output is the same as the open-collector
gate, except for the output transistor Q4 and the diode D1.
Totem pole
• For a typical operating value of C=15 pF
and RL = 4 k ohms, the propagation
delay is 35 ns for TTL open collector.
• By replacing the passive resistor RL,
the propagation delay is reduced to 10
ns.
• This configuration is Totem pole.
MOS
• The p-channel MOS consists of a lightly doped substrate of n-type silicon material.
• Two regions are heavily doped by diffusion with p-type impurities to form the source and drain.
• The region between the two p-type sections serves as the channel.
• The gate is a metal plate separated from the channel by an insulated dielectric of silicon dioxide.
• A negative voltage (with respect to the substrate) at the gate terminal causes an induced electric
field in the channel that attracts p-type carriers (holes) from the substrate.
• As the magnitude of the negative voltage on the gate increases, the region below the gate
accumulates more positive carriers, the conductivity increases and current can flow from source
to drain, provided that a voltage difference is maintained between these two terminals.
MOS
• MOS can be p-type or n-type (depending on the majority carriers).
• They can operated in enhancement mode or depletion mode depending on the state of the
channel region at zero gate voltage
• The source is the terminal through which the majority carriers enter the device. The drain is the
terminal through which the majority carriers leave the device.
• In a n-channel MOS, the source terminal is connected to the substrate and a positive voltage is
applied to the drain terminal.
• When the gate voltage is below a threshold voltage VT (about 2 V), no current flows in the
channel and the drain-to-source path is like an open circuit.
• When the gate voltage is sufficiently positive above VT, a channel is formed and n-type carriers
flow from source to drain.
• n-type carriers are negative and correspond to a positive current flow from drain to source.
21BMC204J (Dr.Nijisha Shajil) 33
Unit 5: Programmable Logic Devices
• One advantage of the MOS device is that it can be used not only as a transistor but as a resistor
as well.
• A resistor is obtained from the MOS by permanently biasing the gate terminal for conduction.
The ratio of the source-drain voltage to the channel current then determines the value of the
resistance.
• Different resistor values may be constructed during manufacturing by fixing the channel length
and width of the MOS device.
21BMC204J (Dr.Nijisha Shajil) 34
Unit 5: Programmable Logic Devices
Complementary MOS
• Complementary MOS (CMOS) circuits take
advantage of the fact that both n-channel and
p-channel devices can be fabricated on the
same substrate.
• CMOS circuits consist of both types of MOS
devices interconnected to form logic
functions.
Complementary MOS
• The basic circuit is the inverter, which consists of one p-channel transistor and one n-
channel transistor. The source terminal of the p-channel device is at VDD and the source
terminal of the n-channel device is at ground.
• The behavior of the MOS transistor:
1. The n-channel MOS conducts when its gate-to-source voltage is positive.
2. The p-channel MOS conducts when its gate-to-source voltage is negative.
3. Either type of device is turned off if its gate-to-source voltage is zero.
• Operation of the inverter: When the input is low, both gates are at zero potential. The input is at - VDD
relative to the source of the p-channel device and at 0 V relative to the source of the a-channel device. The
result is that the p-channel device is turned on and the n-channel device is turned off. Under these
conditions, there is a low-impedance path from VDD to the output and a very high-impedance path from
output to ground. Therefore. the output voltage approaches the high-level VDD under normal loading
conditions.
• When the input is high, both gates are at VDD and the situation is reversed: The p-channel device is off and
the n-channel device is on. The result is that the output approaches the low level of 0 V.
Complementary MOS
• A two-input NAND gate consists of two p-type units
in parallel and two n-type units in series.
• If all inputs are high, both p-channel transistors turn
off and both n-channel transistors turn on. The
output has a low impedance to ground and produces
a low state.
• If any input is low, the associated n -channel
transistor is turned off and the associated p-channel
transistor is turned on. The output is coupled to VDD
and goes to the high state.
Complementary MOS
• A two-input NOR gate consists of two n-type units
in parallel and two p-type units in series.
• When all inputs are low, both n-channel units are on
and both p-channel units are off. The output is
coupled to VDD and goes to the high state.
• If any input is high, the associated p-channel
transistor is turned off and the associated n-channel
transistor turns on, connecting the output to ground
and causing a low-level output.
Complementary MOS
• MOS transistors can be considered to be electronic switches that either conduct or are
open.
• Operating CMOS at a larger power-supply voltage reduces the propagation delay time
and improves the noise margin, but the power dissipation is increased.
• The propagation delay time with VDD = 5 V ranges from 5 to 20 ns depending on the type
of CMOS used. The noise margin is usually about 40 percent of the power supply voltage.
The fan-out of CMOS gates is about 30 when they are operated at a frequency of I MHz.
The fan-out decreases with an increase in the frequency of operation of the gates.
• The CMOS fabrication process is simpler than that of TTL and provides a greater packing
density. Thus more circuits can be placed on a given area of silicon at a reduced cost per
function. This property together with the low power dissipation of CMOS circuits, good
noise immunity, and reasonable propagation delay, makes CMOS the most popular
standard as a digital logic family.
21BMC204J (Dr.Nijisha Shajil) 41
Unit 5: Programmable Logic Devices
Combinational PLDs
• Combinational programmable
logic device (PLD) are
integrated circuits with
programmable gates divided
into an AND array and an OR
array to provide an AND–OR
sum‐of‐product
implementation.
• There are three major types of
combinational PLDs, differing in
the placement of the
programmable connections in
the AND–OR array.
Combinational PLDs
• The PROM has a fixed AND array constructed as a decoder and a
programmable OR array.
• The programmable OR gates implement the Boolean functions in
sum‐of‐minterms form.
• The PAL has a programmable AND array and a fixed OR array.
• The AND gates are programmed to provide the product terms for the
Boolean functions, which are logically summed in each OR gate.
• The most flexible PLD is the PLA, in which both the AND and OR arrays can
be programmed. The product terms in the AND array may be shared by any
OR gate to provide the required sum‐of‐products implementation.
21BMC204J (Dr.Nijisha Shajil) 47
Unit 5: Programmable Logic Devices
Problem: A combinational circuit is defined by the functions: F1=σ 𝑚(3,5,7) and F2=
σ 𝑚(4,5,7). Implement the circuit with a PLA having 3 inputs, 3 product terms and two
outputs.
• Simplifying the four functions to a minimum number of terms results in the following Boolean
functions:
ROM
• A read‐only memory (ROM) is
essentially a memory device in which
permanent binary information is
stored.
• The binary information must be
specified by the designer and is then
embedded in the unit to form the
required interconnection pattern.
• Once the pattern is established, it stays
within the unit even when power is
turned off and on again.
Types of ROM
• The required paths in a ROM may be programmed in four different ways.
The first is called mask programming and is done by the semiconductor
company during the last fabrication process of the unit.
• The procedure for fabricating a ROM requires that the customer fill out the
truth table he or she wishes the ROM to satisfy.
• The manufacturer makes the corresponding mask for the paths to produce
the 1’s and 0’s according to the customer’s truth table.
• This procedure is costly because the vendor charges the customer a special
fee for custom masking the particular ROM. For this reason, mask
programming is economical only if a large quantity of the same ROM
configuration is to be ordered.
PROM
• For small quantities, it is more economical to use a second type of ROM called programmable
read‐only memory, or PROM.
• When ordered, PROM units contain all the fuses intact, giving all 1’s in the bits of the stored
words.
• The fuses in the PROM are blown by the application of a high‐voltage pulse to the device
through a special pin.
• A blown fuse defines a binary 0 state and an intact fuse gives a binary 1 state
• Special instruments called PROM programmers are available commercially to facilitate the
procedure
• The hardware procedure for programming ROMs or PROMs is irreversible, and once
programmed, the fixed pattern is permanent and cannot be altered.
EAPROM
• Electronically Alterable Programmable Read-Only Memory (EAPROM) is
a non-volatile storage device where bytes or words can be erased and
reprogrammed individually during system operation.
• A form of PROM in which the contents of selected memory locations can be
changed by applying suitable electric signals.
Flash memory
• Flash memory devices are similar to EEPROMs, but have additional built‐in
circuitry to selectively program and erase the device in‐circuit, without the
need for a special programmer.
• They have widespread application in modern technology in cell phones,
digital cameras, set‐top boxes, digital TV, telecommunications, nonvolatile
data storage, and microcontrollers.
• Their low consumption of power makes them an attractive storage medium
for laptop and notebook computers.
• It has about 105 block-erase cycles