SAA7113
SAA7113
DATA SHEET
SAA7113H
9-bit video input processor
Product specification 1999 Jul 01
File under Integrated Circuits, IC22
Philips Semiconductors Product specification
CONTENTS
1 FEATURES
2 APPLICATIONS
3 GENERAL DESCRIPTION
4 QUICK REFERENCE DATA
5 ORDERING INFORMATION
6 BLOCK DIAGRAM
7 PINNING
8 FUNCTIONAL DESCRIPTION
8.1 Analog input processing
8.2 Analog control circuits
8.3 Chrominance processing
8.4 Luminance processing
8.5 Synchronization
8.6 Clock generation circuit
8.7 Power-on reset and CE input
8.8 Multi-standard VBI data slicer
8.9 VBI-raw data bypass
8.10 Digital output port VPO7 to VPO0
8.11 RTCO output
8.12 RTS0, RTS1 terminals
9 BOUNDARY SCAN TEST
9.1 Initialization of boundary scan circuit
9.2 Device identification codes
10 LIMITING VALUES
11 THERMAL CHARACTERISTICS
12 CHARACTERISTICS
13 TIMING DIAGRAMS
14 APPLICATION INFORMATION
15 I2C-BUS DESCRIPTION
15.1 I2C-bus format
15.2 I2C-bus detail
16 I2C-BUS START SET-UP
17 PACKAGE OUTLINE
18 SOLDERING
18.1 Introduction to soldering surface mount
packages
18.2 Reflow soldering
18.3 Wave soldering
18.4 Manual soldering
18.5 Suitability of surface mount IC packages for
wave and reflow soldering methods
19 DEFINITIONS
20 LIFE SUPPORT APPLICATIONS
21 PURCHASE OF PHILIPS I2C COMPONENTS
1999 Jul 01 2
Philips Semiconductors Product specification
1 FEATURES
• Four analog inputs, internal analog source selectors,
e.g. 4 × CVBS or 2 × Y/C or (1 × Y/C and 2 × CVBS)
• Two analog preprocessing channels in differential
CMOS style for best S/N-performance
• Fully programmable static gain or automatic gain control
• Standard ITU 656 YUV 4 : 2 : 2 format (8-bit) on VPO
for the selected CVBS or Y/C channel
output bus
• Switchable white peak control
• Enhanced ITU 656 output format on VPO output bus
• Two built-in analog anti-aliasing filters containing:
• Two 9-bit video CMOS Analog-to-Digital Converters – active video
(ADCs), digitized CVBS or Y/C-signals are available on
– raw CVBS data for INTERCAST applications
the VPO-port via I2C-bus control
(27 MHz data rate)
• On-chip clock generator
– decoded VBI data
• Line-locked system clock frequencies
• Boundary scan test circuit complies with the “IEEE Std.
• Digital PLL for horizontal sync processing and clock 1149.b1 - 1994” (ID-Code = 1 7113 02B)
generation, horizontal and vertical sync detection
• I2C-bus controlled (full read-back ability by an external
• Requires only one crystal (24.576 MHz) for all standards controller, bit rate up to 400 kbits/s)
• Automatic detection of 50 and 60 Hz field frequency, • Low power (<0.5 W), low voltage (3.3 V), small package
and automatic switching between PAL and NTSC (QFP44)
standards
• Power saving mode by chip enable input
• Luminance and chrominance signal processing for
• 5 V tolerant digital I/O ports
PAL BGHI, PAL N, combination PAL N, PAL M,
NTSC M, NTSC N, NTSC 4.43, NTSC-Japan and • Detection of copy protected input signals according to
SECAM the macrovision standard. Can be used to prevent
unauthorized recording of pay-TV or video tape signals.
• User programmable luminance peaking or aperture
correction
• Cross-colour reduction for NTSC by chrominance comb 2 APPLICATIONS
filtering • Notebook (low power consumption)
• PAL delay line for correcting PAL phase errors • PCMCIA card application
• Brightness Contrast Saturation (BCS) and hue control • AGP based graphics cards
on-chip
• Image processing
• Real-time status information output (RTCO)
• Video phone applications
• Two multi functional real-time output pins controlled by
• Intercast and PC teletext applications
I2C-bus
• Security applications.
• Multi-standard VBI-data slicer decoding World Standard
Teletext (WST), North-American Broadcast Text
System (NABTS), closed caption, Wide Screen
Signalling (WSS), Video Programming System (VPS),
Vertical Interval Time Code (VITC) variants
(EBU/SMPTE) etc.
1999 Jul 01 3
Philips Semiconductors Product specification
5 ORDERING INFORMATION
TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
SAA7113H QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 × 10 × 1.75 mm SOT307-2
1999 Jul 01 4
Philips Semiconductors Product specification
6 BLOCK DIAGRAM
4
AI11 VBI DATA BYPASS
5 ANALOG UPSAMPLING FILTER
AI1D PROCESSING
7 12 to 15,
AI12 AND 19 to 22 VPO7
bypass OUTPUT
9 to
AOUT ANALOG-TO- FORMATTER
43 VPO0
AI21 DIGITAL
UV
44 CONVERSION CHROMINANCE
AI2D CIRCUIT Y
1
AI22 C/CVBS
AD2 AD1 AND
6 BRIGHTNESS CONTRAST
AGND SATURATION CONTROL
SAA7113H
CON
38 31
TDI TEST CLOCKS
37 XTAL
CONTROL BLOCK CLOCK 32
TCK
39 FOR GENERATION XTALI
SYNCHRONIZATION
TMS BOUNDARY CIRCUIT
8 CIRCUIT
TRST SCAN TEST
AND POWER-ON 17
36 LFCO LLC
TDO SCAN TEST CONTROL
18 29 33 34 16 28 30 35 26 27 25 10 11 40
MHB323
1999 Jul 01 5
Philips Semiconductors Product specification
7 PINNING
1999 Jul 01 6
Philips Semiconductors Product specification
1999 Jul 01 7
Philips Semiconductors Product specification
34 VDDDE2
35 VSSDE2
handbook, full pagewidth
42 VDDA2
41 VSSA2
44 AI2D
39 TMS
36 TDO
43 AI21
37 TCK
38 TDI
AI22 1 40 CE 33 VDDDA
VSSA1 2 32 XTALI
VDDA1 3 31 XTAL
AI11 4 30 VSSDA
AI1D 5 29 VDDDI
AI12 7 27 RTS1
TRST 8 26 RTS0
AOUT 9 25 RTCO
VDDA0 10 24 SCL
VSSA0 11 23 SDA
VPO1 21
VPO0 22
VPO7 12
VPO6 13
VPO5 14
VPO4 15
VSSDE1 16
LLC 17
VDDDE1 18
VPO3 19
VPO2 20
MHB324
1999 Jul 01 8
Philips Semiconductors Product specification
MGD138
6
handbook, full pagewidth
V
(dB)
0
−6
−12
−18
−24
−30
−36
−42
0 2 4 6 8 10 12 14
f (MHz)
1999 Jul 01 9
Philips Semiconductors Product specification
TV line
handbook, halfpage controlled
analog line blanking handbook, halfpage
analog input level ADC input level
255
maximum
+3 dB
GAIN CLAMP
0 dB
range 9 dB 0 dB
60
(1 V (p-p) 18/56 Ω)
1 −6 dB
minimum
HCL
HSY MGL065 MHB325
1999 Jul 01 10
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Philips Semiconductors
9-bit video input processor
TEST
SELECTOR 9
AOUT
AND
BUFFER
2
VSSA1
41
VSSA2 AOSL (1 : 0)
1
AI22
ANALOG
44 SOURCE CLAMP ANTI-ALIAS BYPASS
AI2D AMPLIFIER ADC2
SWITCH CIRCUIT FILTER SWITCH
43 DAC9
AI21
3
VDDA1
42 FUSE (1 : 0)
VDDA2
7
AI12
ANALOG
5 SOURCE CLAMP ANTI-ALIAS BYPASS
AI1D AMPLIFIER ADC1
SWITCH CIRCUIT FILTER SWITCH
4 DAC9
AI11
FUSE (1 : 0)
11
VERTICAL
MODE CLAMP GAIN ANTI-ALIAS
BLANKING
CONTROL CONTROL CONTROL CONTROL
CONTROL
6 CROSS MULTIPLEXER
AGND
Product specification
SAA7113H
MHB326
Fig.6 Analog input processing using the SAA7113H as differential front-end with 9-bit ADC.
Philips Semiconductors Product specification
gain 9
AMPLIFIER DAC
ANTI-ALIAS FILTER
ADC
9
LUMA/CHROMA DECODER
1 0
NO ACTION VBLK
1 0
HOLDG
1 0
X
1 0
HSY
0 1
>254
0 1 1 0 1 0
<4 <1 >254
X=0 X=1
1 0
>248
1 0
X
1 0
HSY
1 0
Y
X = system variable; Y = (IAGV − FGVI) > GUDL; VBLK = vertical blanking pulse;
HSY = horizontal sync pulse; AGV = actual gain value; FGV = frozen gain value.
1999 Jul 01 12
Philips Semiconductors Product specification
ADC
1 0
NO BLANKING ACTIVE VBLK
1 0 1 0
HCL HSY
1 0 0 1 1 0
CLL SBOT WIPE
MGC647
WIPE = white peak level (254); SBOT = sync bottom level (1); CLL = clamp level [60 Y (128 C)];
HSY = horizontal sync pulse; HCL = horizontal clamp pulse.
1999 Jul 01 13
Philips Semiconductors Product specification
• Loop filter chrominance gain control (PAL/NTSC For NTSC colour standards the chrominance comb filter
standards only) can be used to eliminate crosstalk from luminance to
• Loop filter chrominance PLL (only active for PAL/NTSC chrominance (cross-colour) for vertical structures.
standards) The comb filter can be switched off if desired.
The embedded line delay is also used for SECAM
• PAL/SECAM sequence detection, H/2-switch
recombination (cross-over switches).
generation
• Increment generation for DTO1 with divider to generate The resulting signals are fed to the variable Y-delay
compensation and the output interface, which contains the
stable subcarrier for non-standard signals.
VPO output formatter and the output control logic,
The chrominance comb filter block eliminates crosstalk see Fig.10.
between the chrominance channels in accordance with the
PAL standard requirements.
MGD147
6
handbook,
V full pagewidth
(dB)
0
−6
(1)
−12 (2)
(3)
(4)
−18
−24
−30 (4)
(1)
(3)
−36 (2)
−42
−48
−54
0 0.54 1.08 1.62 2,16 2.7
f
(MHz)
1999 Jul 01 14
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Philips Semiconductors
9-bit video input processor
LUM CHR AD2BYP AD1BYP
SECAM
PROCESSING
sequential
8 UV signals
TRST
37
TCK QUADRATURE LEVEL
38 TEST LOW-PASS
TDI DEMODULATOR ADJUSTMENT,
CONTROL CHBW0
39 BLOCK CHBW1 BRIGHTNESS, 12, 13, 14,
TMS
CONTRAST, 15, 19, 20,
36
TDO AND 21, 22 VPO7
PHASE Y OUTPUT
SUBCARRIER SATURATION to
DEMODULATOR FORMATTER
GENERATION CONTROL VPO0
RESET SUBCARRIER AND
AMPLITUDE UV INTERFACE
INCREMENT
DETECTOR
GENERATION GAIN
VDDDE1 18 AND
HUEC BURST GATE CONTROL
VDDDI 29 DIVIDER ACCUMULATOR AND Y-DELAY COMB
POWER-ON UV
COMPENSATION FILTERS
VDDDA 33 CONTROL LOOP FILTER
15
SECAM
VDDDE2 34 RECOMBINATION
MHB328
LUM Y
Product specification
SAA7113H
Fig.10 Chrominance circuit, text slicer, VBI-bypass, output formatting, power and test control.
Philips Semiconductors Product specification
8.4 Luminance processing The high frequency components of the luminance signal
can be peaked (control for sharpness improvement via
The 9-bit luminance signal, a digital CVBS format or a
I2C-bus subaddress 09H, see Table 36) in two band-pass
luminance format (S-VHS, HI8), is fed through a
filters with selectable transfer characteristic. This signal is
switchable prefilter. High frequency components are
then added to the original (unpeaked) signal. For the
emphasized to compensate for loss. The following
resulting frequency characteristics see Figs 11 to 18.
chrominance trap filter (f0 = 4.43 or 3.58 MHz centre
A switchable amplifier achieves common DC amplification,
frequency set according to the selected colour standard)
because the DC gains are different in both chrominance
eliminates most of the colour carrier signal. It should be
trap modes. The improved luminance signal is fed to the
bypassed via I2C-bit BYPS (subaddress 09H, bit 7) for
BCS control located in the chrominance processing block,
S-video (S-VHS, HI8) signals.
see Fig.19.
MGD139
18
handbook, full pagewidth
VY
(dB)
(1)
6 (2)
(4)
(3)
−6 (1)
(2)
(4)
(3)
−18
−30
0 2 4 6 8
fY (MHz)
(1) 43H. (2) 53H. (3) 63H. (4) 73H.
Fig.11 Luminance control SA 09H, 4.43 MHz trap/CVBS mode, prefilter on, different aperture band-pass centre
frequencies.
1999 Jul 01 16
Philips Semiconductors Product specification
MGD140
18
handbook, full pagewidth
VY
(dB)
6
(1)
(2)
(3)
(4)
−6 (4)
(3)
(2)
(1)
−18
−30
0 2 4 6 8
fY (MHz)
Fig.12 Luminance control SA 09H, 4.43 MHz trap/CVBS mode, prefilter on, different aperture factors.
MGD141
18
handbook, full pagewidth
VY
(dB)
6
(1)
(2)
(4)
(3)
−6
(1)
(2)
(4)
(3)
−18
−30
0 2 4 6 8
fY (MHz)
(1) 03H. (2) 13H. (3) 23H. (4) 33H.
Fig.13 Luminance control SA 09H, 4.43 MHz trap/CVBS mode, prefilter off, different aperture band-pass centre
frequencies.
1999 Jul 01 17
Philips Semiconductors Product specification
MGD142
18
handbook, full pagewidth
VY
(dB) (1)
(2)
6 (3)
(4)
−6
−18
−30
0 2 4 6 8
fY (MHz)
Fig.14 Luminance control SA 09H, Y/C mode, prefilter on, different aperture factors.
MGD143
18
handbook, full pagewidth
VY
(dB)
(1)
(2)
(3)
−6 (4)
−18
−30
0 2 4 6 8
fY (MHz)
Fig.15 Luminance control SA 09H, Y/C mode, prefilter off, different aperture factors.
1999 Jul 01 18
Philips Semiconductors Product specification
MGD144
18
handbook, full pagewidth
VY
(dB)
6 (1)
(2)
(1)
(4)
(3) (2)
(4)
(3)
−6
−18
−30
0 2 4 6 8
fY (MHz)
Fig.16 Luminance control SA 09H, 3.58 MHz trap/CVBS mode, prefilter on, different aperture band-pass centre
frequencies.
MGD145
18
handbook, full pagewidth
VY
(dB)
6
(1)
(2) (4)
(3) (3)
(4) (2)
(1)
−6
−18
−30
0 2 4 6 8
fY (MHz)
Fig.17 Luminance control SA 09H, 3.58 MHz trap/CVBS mode, prefilter on, different aperture factors.
1999 Jul 01 19
Philips Semiconductors Product specification
MGD146
18
handbook, full pagewidth
VY
(dB)
(1)
(2) (1)
(4) (2)
(3) (4)
−6 (3)
−18
−30
0 2 4 6 8
fY (MHz)
Fig.18 Luminance control SA 09H, 3.58 MHz trap/CVBS mode, prefilter off, different aperture band-pass centre
frequencies.
1999 Jul 01 20
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Philips Semiconductors
9-bit video input processor
LUM Y
LUMINANCE CIRCUIT
WEIGHTING
VARIABLE
CHROMINANCE AND
PREFILTER BAND-PASS
TRAP ADDING
FILTER
STAGE
FINE PHASE
DETECTOR
10 VDDA0
COARSE CLOCK
11 VSSA0
SYNCHRONIZATION CIRCUIT DAC6 GENERATION
CIRCUIT 40
AUFD CE
VNOI0 HSB (7 : 0)
I2C-BUS CONTROL VNOI1 HSS (7 : 0) HPLL
HTC (1 : 0) FIDT FSEL HLCK HTC (1 : 0) HTC (1 : 0)
INCS
DISCRETE CRYSTAL 32
I2C-BUS LOOP FILTER XTALI
VERTICAL
COUNTER TIME CLOCK
INTERFACE PROCESSOR 2 31
OSCILLATOR 2 GENERATOR XTAL
24 23 26 27
MHB329
Product specification
SAA7113H
Fig.19 Luminance and sync processing.
Philips Semiconductors Product specification
DIVIDER DIVIDER
1/2 1/2 LLC2
MHB330
CLOCK FREQUENCY (MHz) A missing clock, insufficient digital or analog VDDA0 supply
voltages (below 2.8 V) will initiate the reset sequence; all
XTAL 24.576
outputs are forced to 3-state (see Fig.21).
LLC 27
It is possible to force a reset by pulling the Chip Enable
LLC2 (internal) 13.5
(CE) to ground. After the rising edge of CE and sufficient
LLC4 (internal) 6.75 power supply voltage, the outputs LLC and SDA return
LLC8 (virtual) 3.375 from 3-state to active, while RTS0, RTS1 and RTCO
remain in 3-state and have to be activated via I2C-bus
programming (see Table 2).
1999 Jul 01 22
Philips Semiconductors Product specification
POC V POC V
DDA DDD
ANALOG DIGITAL
CLOCK
PLL
LLC
POC POC RES
LOGIC DELAY
CE
RESINT
CLK0
CE
XTAL
LLCINT
RESINT
LLC
RES
(internal
reset) 20 to 200 µs 896 LCC
some ms 128 LCC MHB331
PLL-delay digital delay
<1 ms
CE = chip enable input; XTAL = crystal oscillator output; LLCINT = internal system clock;
RESINT = internal reset; LLC = line-locked clock output.
1999 Jul 01 23
Philips Semiconductors Product specification
8.8 Multi-standard VBI data slicer Several standards can be selected per VBI line.
The supported VBI data standards are described in
The multi-standard data slicer is a Vertical Blanking
Table 3.
Interval (VBI) and Full Field (FF) video data acquisition
block. In combination with software modules the slicer The programming of the desired standards is done via
acquires most existing formats of broadcast VBI and FF I2C-bus subaddresses 41H to 57H
data. (LCR2[7 : 0] to LCR24[7 : 0]); see detailed description in
Chapter 8.10. To adjust the slicers processing to the
The implementation and programming model of the
signals source, there are offsets in horizontal and vertical
multi-standard VBI data slicer is similar to the text slicer
direction available via the I2C-bus in subaddresses 5BH
built in the “Multimedia Video Data Acquisition Circuit
(bits 2 to 0), 59H (HOFF10 to HOFF0) and 5BH (bit 4),
SAA5284”.
5AH (VOFF8 to VOFF0). The formatting of the decoded
The circuitry recovers the actual clock phase during the VBI data is done within the output interface to the
clock-run-in-period, slices the data bits with the selected VPO-bus. For a detailed description of the sliced data
data rate, and groups them into bytes. The clock format see Table 17.
frequency, signals source, field frequency and accepted
error count must be defined via the I2C-bus in
subaddress 40H, AC1: bits D7 to D4.
1999 Jul 01 24
Philips Semiconductors Product specification
MGG067
6
V full pagewidth
handbook,
(dB)
0
−6
−12
−18
−24
−30
−36
−42
−48
−54
0 2 4 6 8 10 12 14
f (MHz)
1999 Jul 01 25
Philips Semiconductors Product specification
Note
1. The number of valid bytes per line can be less for the sliced data format if standard not recognized (wrong standard
or poor input signal).
For each LCR value from 2 to 23 the data type can be The recommended values are 07H for 50 Hz sources and
programmed individually. LCR2 to LCR23 refer to line 0AH for 60 Hz sources, to accommodate line number
numbers. The selection in LCR24 values is valid for the conventions as used for PAL, SECAM and
rest of the corresponding field. The upper nibble contains NTSC standards; see Tables 8 to 11.
the value for field 1 (odd), the lower nibble for field 2
(even). The relationship between LCR values and line
numbers can be adjusted via VOFF8 to VOFF0 (located in
subaddresses 5BH, bit 4 and 5AH, bits 7 to 0).
1999 Jul 01 26
Philips Semiconductors Product specification
Some details about data types: see I2C-bus section subaddresses 06H, 07H and 10H
• Active video (data type 15) component YUV 4 : 2 : 2 and Tables 33, 34 and 46.
signal, 720 active pixels per line. Format and nominal Format and nominal levels are given in Fig.24 and
levels are given in Fig.23 and Table 13. Table 15.
• Test line (data type 6), is similar to decoded YUV-data • Sliced data (various standards, data types 0 to 5 and
as in active video, with two exceptions: 8 to 14).
The format is given in Table 17.
– vertical filter (chrominance comb filter for NTSC
standards, PAL-phase-error correction) within the The data type selections by LCR are overruled by setting
chrominance processing is disabled VIPB (subaddress 11H bit 1) to logic 1. This setting is
mainly intended for device production tests. The VPO-bus
– peaking and chrominance trap are bypassed within
the luminance processing, if I2C-bus bit VBLB is set. carries the upper or lower 8 bits of the two ADCs
This data type is defined for future enhancements; it depending on the ADLSB (subaddress 13H bit 7) setting.
could be activated for lines containing standard test The output configuration is done via MODE3 to MODE0
signals within the vertical blanking period; currently settings (subaddress 02H bits 3 to 0, see Table 27). If the
the most sources do not contain test lines. YC-mode is selected, the VPO-bus carries the multiplexed
output signals of both ADCs, in CVBS-mode the output of
This data type is available only in lines with VREF = 0, only one ADC. No timing reference codes are generated in
see I2C-bus detail section, Table 45. this mode.
Format and nominal levels are given in Fig.23 and
Table 13. Note: The LSBs (bit 0) of the ADCs are available on
pins RTS0 or RTS1. See Chapter 15, subaddress 12H for
• Raw samples (data type 7) oversampled CVBS-signal
details.
for intercast applications; the data rate is 27 MHz.
The horizontal range is programmable via The SAV/EAV timing reference codes define start and end
HSB7 to HSB0, HSS7 to HSS0 and HDEL1 to HDEL0; of valid data regions.
The generation of the H-bit and consequently the timing of During horizontal blanking period between EAV and SAV
SAV/EAV corresponds to the selected data format. H = 0 the ITU-blanking code sequence ‘-80-10-80-10-...’ is
during active data region. For all data formats excluding transmitted.
data type 7 (raw data), the length of the active data region
The position of the F-bit is constant according to ITU 656
is 1440 LLC. For the YUV 4 : 2 : 2 formats (data
(see Tables 6 and 7).
types 15 and 6) every clock cycle within this range
contains valid data, see Table 13. The V-bit can be generated in four different ways
(see Tables 6 and 7) controlled via OFTS1 and OFTS0
The sliced data stream (various standards, data types
(subaddress 10H, bits 7 and 6), VRLN (subaddress 10H,
0 to 5 and 8 to 14; see Table 17) contains also invalid
bit 3) and LCR2 to LCR24 (subaddresses 41H to 57H).
cycles marked as 00H.
F and V bits change synchronously with the EAV code.
The length of the raw data region (data type 7) is
programmable via HSB7 to HSB0 and HSS7 to HSS0
(subaddresses 06H and 07H; see Fig.24).
1999 Jul 01 27
Philips Semiconductors Product specification
1999 Jul 01 28
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1999 Jul 01
Philips Semiconductors
Table 8 Relationship of LCR to line numbers in 525 lines/60 Hz systems (part 1)
Product specification
SAA7113H
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1999 Jul 01
Philips Semiconductors
Table 11 Relationship of LCR to line numbers in 625 lines/50 Hz systems (part 2)
FOFF 5B, D7
FISET 40, D7
Product specification
SAA7113H
Philips Semiconductors Product specification
U-COMPONENT V-COMPONENT
Equations for modification to the YUV levels via BCS control I2C-bus bytes BRIG, CONT and SATN.
Luminance:
CONT
Y OUT = Int ------------------ × ( Y – 128 ) + BRIG
71
Chrominance:
SATN
UV OUT = Int ----------------- × ( C R, C B – 128 ) + 128
64
It should be noted that the resulting levels are limited to 1 to 254 in accordance with ITU-601/656 standard.
Fig.23 YUV 4 : 2 : 2 levels on the 8-bit VPO-bus (data types 6 and 15).
Table 13 YUV data format on the 8-bit VPO-bus (data types 6 and 15)
TIMING TIMING
BLANKING BLANKING
REFERENCE 720 PIXELS YUV 4 : 2 : 2 DATA REFERENCE
PERIOD PERIOD
CODE CODE
... 80 10 FF 00 00 SAV CB0 Y0 CR0 Y1 CB2 Y2 ... CR718 Y719 FF 00 00 EAV 80 10 ...
1999 Jul 01 31
Philips Semiconductors Product specification
+255 +255
handbook, full pagewidth
+209 white
+199 white
LUMINANCE
LUMINANCE
+71 black
+60 black shoulder +60 black shoulder = black
SYNC SYNC
a. For sources containing 7.5 IRE black b. For sources not containing black level
level offset (e.g. NTSC - M). offset.
Fig.24 Raw data levels on the 8-bit VPO-bus (data type 8).
1999 Jul 01 32
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1999 Jul 01
Philips Semiconductors
Table 17 Sliced data format on the 8-bit VPO-bus (data types 0 to 5 and 8 to 14)
NAME EXPLANATION
SAV start of active data; see Tables 5 to 7
SDID sliced data identification: NEP(1), EP(2), SDID5 to SDID0, freely programmable via I2C-bus subaddress 5EH, D5 to D0, e. g. to be used as
source identifier
DC Dword count: NEP(1), EP(2), DC5 to DC0; DC is inserted for software compatibility reasons to SAA7112, but does not represent any relevant
information for SAA7113H applications.
DC describes the number of succeeding 32-bit words:
DC = 1⁄4(C + n), where C = 2 (the two data identification bytes IDI1 and IDI2) and n = number of decoded bytes according to the chosen text
standard. As the sliced data are transmitted nibble wise, the maximum number of bytes transmitted (NBT) starting at IDI1 results to:
NBS = (DC × 8) − 2
DC can vary between 1 and 11, depending on the selected data type.
Note that the number of bytes actually transmitted can be less than NBT for two reasons:
33
Notes
1. Inverted EP (bit 7); for EP see note 2.
2. Even parity (bit 6) of bits 5 to 0.
3. Odd parity (bit 7) of bits 6 to 0.
Product specification
SAA7113H
Philips Semiconductors Product specification
8.11 RTCO output Table 19 Digital output control via RTS1 (enabled by bits
RTSE13 to RTSE10 = 0)
The real-time control and status output signal contains
serial information about the actual system clock DOT
(increment of the HPLL), subcarrier frequency, increment OEYC VPO7 TO VPO0
(RTS1)
and phase (via reset) of the FSC-PLL and PAL sequence
0 0 Z
bit. The signal can be used for various applications in
external circuits, e.g. in a digital encoder to achieve clean 1 0 active
encoding. The SAA7113H supports RTC level 3.1 (see 0 1 Z
external document “RTC Functional Description”, 1 1 Z
available on request).
These two pins are multi functional inputs/output The SAA7113H has built in logic and 5 dedicated pins to
controlled by I2C-bus bits RTSE03 to RTSE00 and support boundary scan testing which allows board testing
RTSE13 to RTSE10, located in subaddress 12H; without special hardware (nails). The SAA7113H follows
see Tables 49 and 50. the “IEEE Std. 1149.1 - Standard Test Access Port and
Boundary-Scan Architecture” set by the Joint Test Action
The RTS0 terminal can be strapped to ground via a 3.3 kΩ Group (JTAG) chaired by Philips.
resistor to change the I2C-bus slave address from default
4AH/4BH to 48H/49H (the strapping information is read The 5 special pins are Test Mode Select (TMS), Test
only during the reset sequence). Clock (TCK), Test Reset (TRST), Test Data Input (TDI)
and Test Data Output (TDO).
The RTS1 terminal can be configured as Data Output to
3-state (DOT) input by RTSE13 to RTSE10 = 0000 to The BST functions BYPASS, EXTEST, INTEST,
control the VPO port (bits 7 to 0) via hardware according SAMPLE, CLAMP and IDCODE are all supported
to Table 19. (see Table 20). Details about the JTAG BST-TEST can be
found in the specification “IEEE Std. 1149.1”. A file
containing the detailed Boundary Scan Description
Language (BSDL) description of the SAA7113H is
available on request.
INSTRUCTION DESCRIPTION
BYPASS This mandatory instruction provides a minimum length serial path (1 bit) between TDI and TDO
when no test operation of the component is required.
EXTEST This mandatory instruction allows testing of off-chip circuitry and board level interconnections.
SAMPLE This mandatory instruction can be used to take a sample of the inputs during normal operation of
the component. It can also be used to preload data values into the latched outputs of the
boundary scan register.
CLAMP This optional instruction is useful for testing when not all ICs have BST. This instruction addresses
the bypass register while the boundary scan register is in external test mode.
IDCODE This optional instruction will provide information on the components manufacturer, part number and
version number.
INTEST This optional instruction allows testing of the internal logic (no support for customers available).
USER1 This private instruction allows testing by the manufacturer (no support for customers available).
1999 Jul 01 34
Philips Semiconductors Product specification
9.1 Initialization of boundary scan circuit When the IDCODE instruction is loaded into the BST
instruction register, the identification register will be
The TAP (Test Access Port) controller of an IC should be
connected between TDI and TDO of the IC.
in the reset state (TEST_LOGIC_RESET) when the IC is
The identification register will load a component specific
in functional mode. This reset state also forces the
code during the CAPTURE_DATA_REGISTER state of
instruction register into a functional instruction such as
the TAP controller and this code can subsequently be
IDCODE or BYPASS.
shifted out. At board level this code can be used to verify
To solve the power-up reset, the standard specifies that component manufacturer, type and version number.
the TAP controller will be forced asynchronously to the The device identification register contains 32 bits,
TEST_LOGIC_RESET state by setting the TRST pin numbered 31 to 0, where bit 31 is the most significant bit
LOW. (nearest to TDI) and bit 0 is the least significant bit (nearest
to TDO); see Fig.25.
9.2 Device identification codes
A device identification register is specified in “IEEE Std.
1149.1b-1994”. It is a 32-bit register which contains fields
for the specification of the IC manufacturer, the IC part
number and the IC version number. Its biggest advantage
is the possibility to check for the correct ICs mounted after
production and determination of the version number of ICs
during field service.
1999 Jul 01 35
Philips Semiconductors Product specification
10 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); all ground pins connected together and all supply
pins connected together.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VDDD digital supply voltage −0.5 +4.6 V
VDDA analog supply voltage −0.5 +4.6 V
ViA input voltage at analog inputs −0.5 VDDA + 0.5 V
(4.6 max)
VoA output voltage at analog output −0.5 VDDA + 0.5 V
ViD input voltage at digital inputs and outputs outputs in 3-state −0.5 +5.5 V
VoD output voltage at digital outputs outputs active −0.5 VDDD + 0.5 V
∆VSS voltage difference between VSSA(all) and VSS(all) − 100 mV
Tstg storage temperature −65 +150 °C
Tamb operating ambient temperature 0 70 °C
Tamb(bias) operating ambient temperature under bias −10 +80 °C
Vesd electrostatic discharge all pins note 1 −2000 +2000 V
Note
1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.
11 THERMAL CHARACTERISTICS
1999 Jul 01 36
Philips Semiconductors Product specification
12 CHARACTERISTICS
VDDD = 3.0 to 3.6 V; VDDA = 3.1 to 3.5 V; Tamb = 25 °C; unless otherwise specified.
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
13 TIMING DIAGRAMS
t PD
t OHD;DAT
tSU tHD
RTS1 (DOT)
,,,
tOHD
VPO
tPDZ
,,, tPD MHB334
1999 Jul 01 41
Philips Semiconductors Product specification
28 × 1/LLC
157 × 1/LLC
processing delay CVBS->VPO(2)
RTS0/1 (PLIN)(1)
4/LLC
RTS0/1 HS
(1) PLIN is switched to outputs RTS0 and/or RTS1 via I2C-bus bits RTSE13 to RTSE10 and/or RTSE03 to RTSE00.
(2) See Table 21.
1999 Jul 01 42
Philips Semiconductors Product specification
RTS0/1 HREF
RTS0/1 VREF
VRLN = 1(1)
RTS0/1 VREF
VRLN = 0(1)
499 × 2/LLC
RTS0/1 VS
RTS0/1 ODD
RTS0/1 V123(3)
RTS0/1 FID(2)
(a) 1st field
310 311 312 313 314 315 316 317 318 319 320 335 336 337
input CVBS
RTS0/1 HREF
RTS0/1 VREF
VRLN = 1(1)
RTS0/1 VREF
VRLN = 0(1)
67 × 2/LLC
RTS0/1 VS
RTS0/1 ODD
RTS0/1 V123(3)
RTS0/1 FID(2)
MHB336
(b) 2nd field
HREF: selectable on RTS0 and/or RTS1 via I2C-bus bits RTSE03 to RTSE00 and/or RTSE13 to RTSE10 = 7H.
ODD: selectable on RTS0 and/or RTS1 via I2C-bus bits RTSE03 to RTSE00 and/or RTSE13 to RTSE10 = AH.
VS: selectable on RTS0 and/or RTS1 via I2C-bus bits RTSE03 to RTSE00 and/or RTSE13 to RTSE10 = BH.
V123: selectable on RTS0 and/or RTS1 via I2C-bus bits RTSE03 to RTSE00 and/or RTSE13 to RTSE10 = CH.
VREF: selectable on RTS0 and/or RTS1 via I2C-bus bits RTSE03 to RTSE00 and/or RTSE13 to RTSE10 = EH.
FID: selectable on RTS0 and/or RTS1 via I2C-bus bits RTSE03 to RTSE00 and/or RTSE13 to RTSE10 = FH.
(1) VREF range short or long can be programmed via I2C-bus bit VRLN.
The luminance peaking and the chrominance trap are bypassed during VREF = 0 if I2C-bus bit VBLB is set to logic 1.
The chrominance delay line (chrominance-comb filter for NTSC, phase error correcting for PAL) is disabled during VREF = 0.
(2) FID changing line number and polarity programmable via VSTA8 to VSTA0 and FIDP, see Table 52.
(3) The inactive going edge of the V123-signal indicates whether the field is odd or even. If HREF is active during the falling edge of V123, the
field is odd. If HREF is inactive during the falling edge of V123, the field is even. The specific position of the slope is dependent on the
internal processing delay and may change a few clock cycles from version to version.
Fig.29 Vertical timing diagram for 50 Hz [nominal input signal, VNL in normal mode (VNOI = 00), HPLL in VCR
or fast mode (HTC = 01 or 11)].
1999 Jul 01 43
Philips Semiconductors Product specification
input CVBS
RST0/1 HREF
VRLN = 1(2)
RTS0/1 VREF
VRLN = 0(2)
RTS0/1 VREF
520 × 2/LLC
RTS0/1 VS
RTS0/1 ODD
RTS0/1 V123(4)
RTS0/1 FID(3)
259 260 261 262 263 264 265 266 267 268 269 270 271 280 281 282
(262) (263) (264) (265) (266) (267) (268) (269) (270) (271) (272) (273) (274) (283) (284) (285)(1)
input CVBS
RTS0/1 HREF
81 × 2/LLC
RTS0/1 VS
RTS0/1 ODD
RTS0/1 V123(4)
RTS0/1 FID(3)
MHB337
(b) 2nd field
HREF: selectable on RTS0 and/or RTS1 via I2C-bus
bits RTSE03 to RTSE00 and/or RTSE13 to RTSE10 = 7H.
ODD: selectable on RTS0 and/or RTS1 via I2C-bus bits RTSE03 to RTSE00 and/or RTSE13 to RTSE10 = AH.
VS: selectable on RTS0 and/or RTS1 via I2C-bus bits RTSE03 to 00 and/or RTSE13 to RTSE10 = BH.
V123: selectable on RTS0 and/or RTS1 via I2C-bus bits RTSE03 to RTSE00 and/or RTSE13 to RTSE10 = CH.
VREF: selectable on RTS0 and/or RTS1 via I2C-bus bits RTSE03 to RTSE00 and/or RTSE13 to RTSE10 = EH.
FID: selectable on RTS0 and/or RTS1 via I2C-bus bits RTSE03 to RTSE00 and/or RTSE13 to RTSE10 = FH.
(1) Line numbers in parenthesis refer to ITU line counting.
(2) VREF range short or long can be programmed via I2C-bus bit VRLN.
The luminance peaking and the chrominance trap are bypassed during VREF = 0 if I2C-bus bit VBLB is set to logic 1.
The chrominance delay line (chrominance-comb filter for NTSC, phase error correcting for PAL) is disabled during VREF = 0.
(3) FID changing line number and polarity programmable via VSTA8 to VSTA0 and FIDP, see Table 52.
(4) The inactive going edge of the V123-signal indicates whether the field is odd or even. If HREF is active during the falling edge of V123, the
field is odd. If HREF is inactive during the falling edge of V123, the field is even. The specific position of the slope is dependent on the internal
processing delay and may change a few clock cycles from version to version.
Fig.30 Vertical timing diagram for 60 Hz [nominal input signal, VNL in normal mode (VNOI = 00), HPLL in VCR
or fast mode (HTC = 01 or 11)].
1999 Jul 01 44
Philips Semiconductors Product specification
14 APPLICATION INFORMATION
VDDDE1
VDDDE2
n.c. n.c. n.c.
VDDDA
VDDA0
VDDA1
VDDA2
100 nF
VDDDI
100 nF
TRST
TMS
TDO
VSSA
TCK
TDI
VSSD
10 3 42 39 38 36 37 8 18 34 29 33
R10 C4
AI22
1
18 Ω 47 nF
R4
VSSA 56 Ω
R9 C3
AI21 VPO7
43 12
18 Ω 47 nF VPO6
13
R3
VPO5
14
VSSA 56 Ω VPO4
15
R8 C2 VPO3
AI12 19
7
18 Ω VPO2
47 nF 20
R2 VPO1
21
VPO0
VSSA 56 Ω 22
R7 C1
AI11
4
18 Ω 47 nF
R1 SAA7113H
VSSA 56 Ω RTCO
R5 CE 25
VDDD 40 RTS1
1 kΩ 27
SCL RTS0
24 26
SDA
23 AOUT
9
C19 LLC
AI1D
5 17
47 nF
VSSA C20
AI2D
44
47 nF
XTAL
31
Q1
(24.576 MHz) XTALI
32
10
L1 11 2 41 6 16 28 30 35
µH
VSSA0
VSSA1
VSSA2
AGND
VSSDE1
VSSDI
VSSDA
VSSDE2
MHB349
C16 C17 C18
1 nF 10 pF 10 pF
1999 Jul 01 45
Philips Semiconductors Product specification
MHB338
L = 10 µH ± 20%
C= C=
10 pF 1 nF
15 I2C-BUS DESCRIPTION
data transferred
(n bytes + acknowledge) MHB339
1999 Jul 01 46
Philips Semiconductors Product specification
data transferred
(n bytes + acknowledge) MHB340
Notes
1. The SAA7113H supports the ‘fast mode’ I2C-bus specification extension (data rate up to 400 kbits/s).
2. If more than one byte DATA is transmitted the subaddress pointer is automatically incremented.
1999 Jul 01 47
Philips Semiconductors Product specification
1999 Jul 01 48
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1999 Jul 01
Philips Semiconductors
Table 24 I2C-bus receiver/transmitter overview
Chroma hue control 0D HUEC7 HUEC6 HUEC5 HUEC4 HUEC3 HUEC2 HUEC1 HUEC0
Chroma control 0E CDTO CSTD2 CSTD1 CSTD0 DCCF FCTC CHBW1 CHBW0
Chroma gain control 0F ACGC CGAIN6 CGAIN5 CGAIN4 CGAIN3 CGAIN2 CGAIN1 CGAIN0
Format/delay control 10 OFTS1 OFTS0 HDEL1 HDEL0 VRLN YDEL2 YDEL1 YDEL0
Output control 1 11 GPSW1 CM99 GPSW0 HLSEL OEYC OERT VIPB COLO
Output control 2 12 RTSE13 RTSE12 RTSE11 RTSE10 RTSE03 RTSE02 RTSE01 RTSE00
Output control 3 13 ADLSB (1) (1) OLDSB FIDP (1) AOSL1 AOSL0
Reserved 14 (1) (1) (1) (1) (1) (1) (1) (1)
Product specification
Reserved 18 to 1E (1) (1) (1) (1) (1) (1) (1) (1)
SAA7113H
Status byte (read only, 1F INTL HLVLN FIDT GLIMT GLIMB WIPA COPRO RDCAP
OLDSB = 0)
Status byte (read only, 1F INTL HLCK FIDT GLIMT GLIMB WIPA SLTCA CODE
OLDSB = 1)
Reserved 20 to 3F (1) (1) (1) (1) (1) (1) (1) (1)
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1999 Jul 01
Philips Semiconductors
SUB-
Sliced data identification code 5E (1) (1) SDID5 SDID4 SDID3 SDID2 SDID1 SDID0
SDID
Reserved 5F (1) (1) (1) (1) (1) (1) (1) (1)
Note
1. All unused control bits must be programmed with logic 0 to ensure compatibility to future enhancements.
Product specification
SAA7113H
Philips Semiconductors Product specification
CONTROL BITS D3 TO D0
FUNCTION(1)
MODE 3 MODE 2 MODE 1 MODE 0
Mode 0: CVBS (automatic gain) from AI11 (pin 4) 0 0 0 0
Mode 1: CVBS (automatic gain) from AI12 (pin 7) 0 0 0 1
Mode 2: CVBS (automatic gain) from AI21 (pin 43) 0 0 1 0
Mode 3: CVBS (automatic gain) from AI22 (pin 1) 0 0 1 1
Mode 4: reserved 0 1 0 0
Mode 5: reserved 0 1 0 1
Mode 6: Y (automatic gain) from AI11 (pin 4) + C (gain adjustable via 0 1 1 0
GAI28 to GAI20) from AI21 (pin 43); note 2
Mode 7: Y (automatic gain) from AI12 (pin 7) + C (gain adjustable via 0 1 1 1
GAI28 to GAI20) from AI22 (pin 1); note 2
Mode 8: Y (automatic gain) from AI11 (pin 4) + C (gain adapted to Y gain) 1 0 0 0
from AI21 (pin 43); note 2
Mode 9: Y (automatic gain) from AI12 (pin 7) + C (gain adapted to Y gain) 1 0 0 1
from AI22 (pin 1); note 2
Modes 10 to 15: reserved 1 1 1 1
Notes
1. Mode select (see Figs 35 to 42).
2. To take full advantage of the YC-modes 6 to 9 the I2C-bus bit BYPS (subaddress 09H, bit 7) should be set to logic 1
(full luminance bandwidth).
1999 Jul 01 51
Philips Semiconductors Product specification
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Philips Semiconductors Product specification
Fig.35 Mode 0; CVBS (automatic gain). Fig.36 Mode 1; CVBS (automatic gain).
Fig.37 Mode 2; CVBS (automatic gain). Fig.38 Mode 3; CVBS (automatic gain).
I2C-bus bit BYPS (subaddress 09H, bit 7) should be set to logic 1 I2C-bus bit BYPS (subaddress 09H, bit 7) should be set to logic 1
(full luminance bandwidth). (full luminance bandwidth).
Fig.39 Mode 6; Y + C (gain channel 2 adjusted via Fig.40 Mode 7; Y + C (gain channel 2 adjusted via
GAI2). GAI2).
I2C-bus bit BYPS (subaddress 09H, bit 7) should be set to logic 1 I2C-bus bit BYPS (subaddress 09H, bit 7) should be set to logic 1
(full luminance bandwidth). (full luminance bandwidth).
Fig.41 Mode 8; Y + C (gain channel 2 adapted to Y Fig.42 Mode 9; Y + C (gain channel 2 adapted to Y
gain). gain).
1999 Jul 01 53
Philips Semiconductors Product specification
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Philips Semiconductors Product specification
SIGN BIT
DECIMAL GAIN CONTROL BITS D7 TO D0
(SA 03, D1)
VALUE (dB)
GAI28 GAI27 GAI26 GAI25 GAI24 GAI23 GAI22 GAI21 GAI20
0... ≈−3 0 0 0 0 0 0 0 0 0
...117... ≈0 0 0 1 1 1 0 1 0 1
...511 ≈6 1 1 1 1 1 1 1 1 1
1999 Jul 01 55
Philips Semiconductors Product specification
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Philips Semiconductors Product specification
Note
1. Not to be used with bypassed chrominance trap.
1999 Jul 01 57
Philips Semiconductors Product specification
CONTROL BITS D7 TO D0
OFFSET
BRIG7 BRIG6 BRIG5 BRIG4 BRIG3 BRIG2 BRIG1 BRIG0
255 (bright) 1 1 1 1 1 1 1 1
128 (CCIR level) 1 0 0 0 0 0 0 0
0 (dark) 0 0 0 0 0 0 0 0
CONTROL BITS D7 TO D0
GAIN
CONT7 CONT6 CONT5 CONT4 CONT3 CONT2 CONT1 CONT0
1.999 (maximum) 0 1 1 1 1 1 1 1
1.109 (CCIR level) 0 1 0 0 0 1 1 1
1.0 0 1 0 0 0 0 0 0
0 (luminance off) 0 0 0 0 0 0 0 0
−1 (inverse luminance) 1 1 0 0 0 0 0 0
−2 (inverse luminance) 1 0 0 0 0 0 0 0
1999 Jul 01 58
Philips Semiconductors Product specification
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
Note
1. The numbers given in parenthesis refer to ITU line counting.
Table 47 Output format selection OFTS0 and OFTS1 SA 10 (D7 and D6); see Tables 6 and 7
1999 Jul 01 61
Philips Semiconductors Product specification
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
Note
1. Analog-to-digital converter selection via MODE3 to MODE0 (subaddress 02H; see Figs 35 to 38).
1999 Jul 01 65
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1999 Jul 01
Philips Semiconductors
15.2.21 SUBADDRESS 15H
2nd 3
Product specification
SAA7113H
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1999 Jul 01
Philips Semiconductors
15.2.22 SUBADDRESS 16H
2nd 3
Product specification
SAA7113H
Philips Semiconductors Product specification
1999 Jul 01 68
Philips Semiconductors Product specification
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Philips Semiconductors Product specification
Note
1. The assignment of the upper and lower nibbles to the corresponding field depends on the setting of FOFF
(subaddress 5B, D7); see Table 62.
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
Note
1. X = don’t care.
1999 Jul 01 72
Philips Semiconductors Product specification
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Philips Semiconductors Product specification
17 PACKAGE OUTLINE
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2
c
y
X
33 23
34 22 ZE
E HE
A A2 (A 3)
A1
wM
θ
bp
Lp
pin 1 index
L
44 12
detail X
1 11
wM ZD v M A
e bp
D B
HD v M B
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
95-02-04
SOT307-2
97-08-01
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
18.5 Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE REFLOW(1)
BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, SMS not suitable(2) suitable
PLCC(3), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(3)(4) suitable
SSOP, TSSOP, VSO not recommended(5) suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Jul 01 77
Philips Semiconductors Product specification
19 DEFINITIONS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1999 Jul 01 78
Philips Semiconductors Product specification
NOTES
1999 Jul 01 79
Philips Semiconductors – a worldwide company
Argentina: see South America Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +31 40 27 82785, Fax. +31 40 27 88399
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +64 9 849 4160, Fax. +64 9 849 7811
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Norway: Box 1, Manglerud 0612, OSLO,
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, Tel. +47 22 74 8000, Fax. +47 22 74 8341
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Pakistan: see Singapore
Belgium: see The Netherlands Philippines: Philips Semiconductors Philippines Inc.,
Brazil: see South America 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA, Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102 Tel. +48 22 612 2831, Fax. +48 22 612 2327
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Portugal: see Spain
Tel. +1 800 234 7381, Fax. +1 800 943 0087 Romania: see Italy
China/Hong Kong: 501 Hong Kong Industrial Technology Centre, Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +7 095 755 6918, Fax. +7 095 755 6919
Tel. +852 2319 7888, Fax. +852 2319 7700 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Colombia: see South America Tel. +65 350 2538, Fax. +65 251 6500
Czech Republic: see Austria Slovakia: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Slovenia: see Italy
Tel. +45 33 29 3333, Fax. +45 33 29 3905 South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
Finland: Sinikalliontie 3, FIN-02630 ESPOO, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +358 9 615 800, Fax. +358 9 6158 0920 Tel. +27 11 471 5401, Fax. +27 11 471 5398
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, South America: Al. Vicente Pinzon, 173, 6th floor,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 04547-130 SÃO PAULO, SP, Brazil,
Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +55 11 821 2333, Fax. +55 11 821 2382
Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Spain: Balmes 22, 08007 BARCELONA,
Hungary: see Austria Tel. +34 93 301 6312, Fax. +34 93 301 4107
India: Philips INDIA Ltd, Band Box Building, 2nd floor, Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Tel. +91 22 493 8541, Fax. +91 22 493 0966 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Indonesia: PT Philips Development Corporation, Semiconductors Division, Tel. +41 1 488 2741 Fax. +41 1 488 3263
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Ireland: Newstead, Clonskeagh, DUBLIN 14, Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
Tel. +353 1 7640 000, Fax. +353 1 7640 200 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, Tel. +66 2 745 4090, Fax. +66 2 398 0793
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
20124 MILANO, Tel. +39 02 67 52 2531, Fax. +39 02 67 52 2557 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
Tel. +82 2 709 1412, Fax. +82 2 709 1415 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +1 800 234 7381, Fax. +1 800 943 0087
Tel. +60 3 750 5214, Fax. +60 3 757 4880 Uruguay: see South America
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Vietnam: see Singapore
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Middle East: see Italy Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Printed in The Netherlands 545006/01/pp80 Date of release: 1999 Jul 01 Document order number: 9397 750 04567