___________________

Preface

___________________
Product description 1

SIMATIC
___________________
Safety instructions 2
Installing and connecting the
___________________
device 3
Industrial PC
SIMATIC IPC847E
___________________
Commissioning the device 4

___________________
Operating the device 5
Operating Instructions

___________________
Expanding and assigning
parameters to the device 6

___________________
Device maintenance and
repair 7

___________________
Technical specifications 8

___________________
Dimension drawings 9

___________________
Standards and approvals 10

___________________
Hardware description A

___________________
Technical support B

___________________
Markings and symbols C

___________________
List of abbreviations D

10/2018
A5E43920357-AA
Legal information
Warning notice system
This manual contains notices you have to observe in order to ensure your personal safety, as well as to prevent
damage to property. The notices referring to your personal safety are highlighted in the manual by a safety alert
symbol, notices referring only to property damage have no safety alert symbol. These notices shown below are
graded according to the degree of danger.

DANGER
indicates that death or severe personal injury will result if proper precautions are not taken.

WARNING
indicates that death or severe personal injury may result if proper precautions are not taken.

CAUTION
indicates that minor personal injury can result if proper precautions are not taken.

NOTICE
indicates that property damage can result if proper precautions are not taken.
If more than one degree of danger is present, the warning notice representing the highest degree of danger will
be used. A notice warning of injury to persons with a safety alert symbol may also include a warning relating to
property damage.
Qualified Personnel
The product/system described in this documentation may be operated only by personnel qualified for the specific
task in accordance with the relevant documentation, in particular its warning notices and safety instructions.
Qualified personnel are those who, based on their training and experience, are capable of identifying risks and
avoiding potential hazards when working with these products/systems.
Proper use of Siemens products
Note the following:

WARNING
Siemens products may only be used for the applications described in the catalog and in the relevant technical
documentation. If products and components from other manufacturers are used, these must be recommended
or approved by Siemens. Proper transport, storage, installation, assembly, commissioning, operation and
maintenance are required to ensure that the products operate safely and without any problems. The permissible
ambient conditions must be complied with. The information in the relevant documentation must be observed.

Trademarks
All names identified by ® are registered trademarks of Siemens AG. The remaining trademarks in this publication
may be trademarks whose use by third parties for their own purposes could violate the rights of the owner.
Disclaimer of Liability
We have reviewed the contents of this publication to ensure consistency with the hardware and software
described. Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the
information in this publication is reviewed regularly and any necessary corrections are included in subsequent
editions.

Siemens AG A5E43920357-AA Copyright © Siemens AG 2018.

Division Digital Factory Ⓟ 10/2018 Subject to change All rights reserved
Postfach 48 48
90026 NÜRNBERG
GERMANY
Preface

Purpose of the operating instructions

These operating instructions contain all the information you need for the installation,
electrical connection, commissioning, expansion of the SIMATIC IPC847E and to maintain
and repair the device. They are intended for the following qualified specialist personnel:
● Installation personnel
● Commissioning engineers
● IT administrators
● Service and maintenance personnel

Basic knowledge required

A solid background in electrical installation, personal computers, Microsoft operating
systems and network technology is required to understand this manual. General knowledge
in the field automation control engineering is recommended.

Range of validity of these operating instructions

These operating instructions are valid for all supplied versions of the SIMATIC IPC847E.

History
Currently released versions of these operating instructions:

Version Comments
10/2018 First edition

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 3
Preface

Security information
Siemens provides products and solutions with industrial security functions that support the
secure operation of plants, systems, machines and networks.
In order to protect plants, systems, machines and networks against cyber threats, it is
necessary to implement – and continuously maintain – a holistic, state-of-the-art industrial
security concept. Siemens' products and solutions constitute one element of such a concept.
Customers are responsible for preventing unauthorized access to their plants, systems,
machines and networks. Such systems, machines and components should only be
connected to an enterprise network or the internet if and to the extent such a connection is
necessary and only when appropriate security measures (e.g. firewalls and/or network
segmentation) are in place.
For additional information on industrial security measures that may be implemented, please
visit (http://www.siemens.com/industrialsecurity).
Siemens' products and solutions undergo continuous development to make them more
secure. Siemens strongly recommends that product updates are applied as soon as they are
available and that the latest product versions are used. Use of product versions that are no
longer supported, and failure to apply the latest updates may increase customers' exposure
to cyber threats.
To stay informed about product updates, subscribe to the Siemens Industrial Security RSS
Feed under (http://www.siemens.com/industrialsecurity).

Disclaimer for third-party software updates

This product includes third-party software. Siemens AG only provides a warranty for
updates/patches of the third-party software, if these have been distributed as part of a
Siemens software update service contract or officially released by Siemens AG. Otherwise,
updates/patches are undertaken at your own risk. You can find more information about our
Software Update Service offer on the Internet at Software Update Service
(http://www.automation.siemens.com/mcms/automation-software/en/software-update-
service).

SIMATIC IPC847E
4 Operating Instructions, 10/2018, A5E43920357-AA
Table of contents

Preface ...................................................................................................................................................... 3
1 Product description .................................................................................................................................. 11
1.1 Important instructions and manuals for operating the device .................................................11
1.2 Product highlights ...................................................................................................................13
1.3 Scope of application................................................................................................................15
1.4 External design of the device..................................................................................................16
1.4.1 Front panel ..............................................................................................................................16
1.4.2 Drive cage type A....................................................................................................................17
1.4.3 Drive cage type B....................................................................................................................18
1.4.4 Rear of the device ...................................................................................................................19
1.4.5 Interfaces and connections .....................................................................................................20
1.4.5.1 Interfaces ................................................................................................................................20
1.4.5.2 Power supply connections ......................................................................................................22
1.4.6 Operator controls ....................................................................................................................23
1.4.7 Status displays ........................................................................................................................25
1.4.7.1 System status displays ...........................................................................................................25
1.4.7.2 Status display of the Ethernet interface ..................................................................................27
1.4.7.3 Status display of redundant power supply ..............................................................................28
1.4.7.4 Status displays on removable tray for drives ..........................................................................28
1.5 Internal construction of the device ..........................................................................................29
1.6 Accessories and spare parts ..................................................................................................30
1.6.1 Hardware accessories ............................................................................................................30
1.6.2 Software accessories ..............................................................................................................33
2 Safety instructions ................................................................................................................................... 35
2.1 General safety instructions .....................................................................................................35
2.2 Note on transport and storage ................................................................................................37
2.3 Notes on mounting ..................................................................................................................38
2.4 Notes on ambient and environmental conditions....................................................................39
2.5 Information on I/O devices ......................................................................................................41
2.6 Notes on device and system extensions ................................................................................42

SIMATIC IPC847E
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Table of contents

3 Installing and connecting the device ........................................................................................................ 43

3.1 Preparing for mounting .......................................................................................................... 43
3.1.1 Scope of delivery ................................................................................................................... 43
3.1.2 Checking the delivery package .............................................................................................. 45
3.1.3 Device identification data ....................................................................................................... 46
3.2 Mounting the device ............................................................................................................... 47
3.2.1 Mounting types ....................................................................................................................... 47
3.2.2 Securing device...................................................................................................................... 48
3.3 Connecting the device ........................................................................................................... 49
3.3.1 Country-specific information on supply voltage ..................................................................... 49
3.3.2 Connection of equipotential bonding line ............................................................................... 50
3.3.3 Connecting the power supply................................................................................................. 51
3.3.3.1 Connect single power supply (AC)......................................................................................... 51
3.3.3.2 Connecting a redundant power supply (AC) .......................................................................... 53
3.3.4 Connecting I/O devices .......................................................................................................... 55
3.3.5 Connecting the device to networks ........................................................................................ 57
3.3.6 Securing the cables ............................................................................................................... 58
4 Commissioning the device ....................................................................................................................... 59
4.1 Switching on the device ......................................................................................................... 59
4.2 Configuring automatic switch-on of device ............................................................................ 59
4.3 Switching off the device ......................................................................................................... 60
5 Operating the device................................................................................................................................ 63
5.1 Opening the front door ........................................................................................................... 63
5.2 Multi-monitoring...................................................................................................................... 64
5.3 Drive configurations ............................................................................................................... 65
5.3.1 RAID systems ........................................................................................................................ 65
5.3.1.1 RAID1 system ........................................................................................................................ 65
5.3.1.2 RAID5 system ........................................................................................................................ 65
5.3.1.3 Hot-spare drive in RAID1 or RAID5 systems ......................................................................... 66
5.3.2 System with 2 drives .............................................................................................................. 66
5.4 Operating RAID systems ....................................................................................................... 67
5.4.1 Display of a defective drive of a RAID system ....................................................................... 67
5.4.2 RAID1 system: Installation options for drives ........................................................................ 67
5.4.3 RAID5 system: Installation options for drives ........................................................................ 67
5.4.4 Operating onboard RAID system ........................................................................................... 68
5.4.4.1 Configuring the onboard RAID system .................................................................................. 68
5.4.4.2 Monitoring the onboard RAID system with "Intel® Rapid Storage Technology" ................... 70
5.4.4.3 Integrating a new drive into the onboard RAID system ......................................................... 71
5.4.4.4 Integrating a hot-spare drive into the onboard RAID system................................................. 72
5.4.5 Operating the hardware RAID system ................................................................................... 73
5.4.5.1 Software and documentation for the hardware RAID system................................................ 73
5.4.5.2 Installing the hardware RAID adapter card ............................................................................ 74
5.4.5.3 Configuring the hardware RAID system ................................................................................ 77
5.4.5.4 Monitoring the hardware RAID system with "maxView Storage Manager" ........................... 80
5.4.6 Data synchronization in the RAID system ............................................................................. 82

SIMATIC IPC847E
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 Table of contents

5.5 Monitoring of the device ..........................................................................................................83

5.5.1 Monitoring functions ................................................................................................................83
5.5.2 SIMATIC IPC DiagBase ..........................................................................................................85
5.5.3 SIMATIC IPC DiagMonitor ......................................................................................................85
5.6 Remote maintenance of the device ........................................................................................86
5.6.1 Remote maintenance functions ..............................................................................................86
5.6.2 SIMATIC IPC Remote Manager .............................................................................................87
5.7 Trusted Platform Module (TPM) .............................................................................................88
6 Expanding and assigning parameters to the device................................................................................. 89
6.1 Open the device ......................................................................................................................89
6.2 Expansion cards .....................................................................................................................91
6.2.1 Usable expansion cards .........................................................................................................91
6.2.2 Installing expansion cards ......................................................................................................91
6.2.3 Removing expansion cards ....................................................................................................93
6.3 Memory modules ....................................................................................................................94
6.3.1 Usable memory modules ........................................................................................................94
6.3.2 Removing memory modules ...................................................................................................95
6.3.3 Installing memory modules .....................................................................................................96
6.4 Internal USB interface .............................................................................................................98
6.5 Graphics card..........................................................................................................................99
6.6 Drives ....................................................................................................................................100
6.6.1 Drives in drive cage type A / side panel................................................................................100
6.6.1.1 Permissible expansion for temperature range 0 to 40 °C .....................................................100
6.6.1.2 Permissible expansion for temperature range 0 to 50 °C .....................................................102
6.6.1.3 Change 2.5" and 3.5" drive in removable tray ......................................................................104
6.6.1.4 Installing a 5.25" adapter module for removable trays .........................................................107
6.6.1.5 Installing a backplane for removable tray .............................................................................109
6.6.1.6 Changing a backplane for removable tray ............................................................................112
6.6.2 Drives in drive cage type B / side panel................................................................................114
6.6.2.1 Permissible expansion for temperature range 0 to 40 °C .....................................................114
6.6.2.2 Permissible expansion for temperature range 0 to 50 °C .....................................................116
6.6.3 Change 2.5" and 3.5" drive in assembly kit for 5.25" tray ....................................................118
6.6.4 Installing a 5.25" drive...........................................................................................................122
6.6.5 Installing drives inside on the side wall of the device ...........................................................124
6.6.6 Install M.2 NVMe SSD ..........................................................................................................126

SIMATIC IPC847E
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Table of contents

7 Device maintenance and repair ............................................................................................................. 129

7.1 Repair information ................................................................................................................ 129
7.2 Maintenance intervals .......................................................................................................... 129
7.3 Removing and installing hardware ....................................................................................... 130
7.3.1 Changing the filter pad ......................................................................................................... 130
7.3.2 Replacing device fans .......................................................................................................... 131
7.3.2.1 Remove the fan cover .......................................................................................................... 131
7.3.2.2 Changing the front fan ......................................................................................................... 132
7.3.2.3 Change the fan on drive cage type A .................................................................................. 135
7.3.3 Changing the backup battery ............................................................................................... 137
7.3.4 Changing a single power supply (AC) ................................................................................. 139
7.3.5 Replacing redundant power supply (AC) module ................................................................ 140
7.3.6 Changing the enclosure of the redundant power supply (AC) ............................................. 141
7.3.7 Replacing the bus board ...................................................................................................... 143
7.3.8 Replacing the processor ...................................................................................................... 144
7.3.9 Replacing the motherboard.................................................................................................. 145
7.4 Installing operating system, software and drivers ................................................................ 147
7.4.1 Restoring or installing the operating system ........................................................................ 147
7.4.2 Installing software and drivers ............................................................................................. 147
7.5 Configuring firmware/BIOS .................................................................................................. 147
7.6 Backing up data and changing partitions ............................................................................. 147
7.7 Recycling and disposal ........................................................................................................ 147
8 Technical specifications ......................................................................................................................... 149
8.1 Applicability of technical specifications ................................................................................ 149
8.2 General technical specifications .......................................................................................... 150
8.3 Current/power requirements and power supply ................................................................... 152
8.3.1 Current and power requirements of the system components .............................................. 152
8.3.2 Technical specifications of single power supply (AC) .......................................................... 154
8.3.3 Technical specifications of redundant power supply (AC) ................................................... 154
8.4 Electromagnetic compatibility .............................................................................................. 155
8.5 Ambient conditions ............................................................................................................... 156
8.6 Technical specifications of the drives .................................................................................. 157
8.7 Technical specifications of the motherboard ....................................................................... 158
8.8 Technical specification of the hardware RAID adapter card................................................ 160
8.9 Technical specifications of graphic ...................................................................................... 160
8.10 Technical specifications of the interfaces ............................................................................ 161
8.11 Technical specifications of the telescopic rails .................................................................... 162
8.12 Technical specifications of the operating systems............................................................... 162

SIMATIC IPC847E
8 Operating Instructions, 10/2018, A5E43920357-AA
 Table of contents

9 Dimension drawings .............................................................................................................................. 163

9.1 Dimension drawing of the device ..........................................................................................163
9.2 Dimension drawing of the Tower Kit .....................................................................................164
9.3 Dimension drawing of the expansion cards ..........................................................................165
9.4 Dimension drawing of the telescope rails .............................................................................166
10 Standards and approvals ....................................................................................................................... 167
10.1 CE marking ...........................................................................................................................167
10.2 DIN ISO 9001 certificate and software license agreements .................................................168
10.3 UL approval...........................................................................................................................168
10.4 FCC (USA) ............................................................................................................................169
10.5 Canada .................................................................................................................................169
10.6 Australia / New Zealand ........................................................................................................170
10.7 Eurasion Customs Union EAC ..............................................................................................170
10.8 Korea ....................................................................................................................................170
A Hardware description ............................................................................................................................. 171
A.1 Motherboard..........................................................................................................................171
A.1.1 Layout of the motherboard....................................................................................................171
A.1.2 Position of the interfaces on the motherboard ......................................................................172
A.2 Internal interfaces .................................................................................................................173
A.2.1 Pin assignment of the internal interfaces ..............................................................................173
A.2.2 SCSI activity connector .........................................................................................................174
A.2.3 Reset .....................................................................................................................................174
A.2.4 Power button .........................................................................................................................174
A.2.5 Internal interface connector (USB 2.0) .................................................................................175
A.2.6 Internal interface connector (USB 3.0/USB 2.0) ...................................................................175
A.2.7 Power supply fan monitoring ................................................................................................176
A.2.8 Fan port .................................................................................................................................176
A.2.9 Supply for the serial ATA drives ...........................................................................................176
A.2.10 PEG interface (PCIe x16 socket) ..........................................................................................177
A.2.11 PCIe + special signal interface (PCIe x16 socket) ...............................................................179
A.3 Bus board..............................................................................................................................182
A.3.1 Slots for expansion cards on the bus board .........................................................................182
A.3.2 Interrupt assignment of the slots for expansion cards on the backplane .............................185
A.3.3 Exclusive PCI hardware interrupt .........................................................................................188
A.4 External interfaces ................................................................................................................189
A.5 System resources .................................................................................................................190
A.5.1 Currently allocated system resources...................................................................................190
A.5.2 I/O address allocation ...........................................................................................................190
A.5.3 Interrupt assignments ...........................................................................................................192
A.5.4 Memory address assignments ..............................................................................................193
A.6 Assignment of expansion interfaces to the software in the TIA Portal (CP assignment) .....193

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 9
Table of contents

B Technical support .................................................................................................................................. 195

B.1 Service and support ............................................................................................................. 195
B.2 Troubleshooting ................................................................................................................... 196
B.2.1 Problems with device functions............................................................................................ 196
B.2.2 Problems when booting the device ...................................................................................... 198
B.2.3 Problems with RAID systems............................................................................................... 199
B.2.4 Problems when using expansion cards ............................................................................... 200
C Markings and symbols ........................................................................................................................... 201
C.1 Overview .............................................................................................................................. 201
C.2 Safety ................................................................................................................................... 201
C.3 Operator controls ................................................................................................................. 201
C.4 Certificates, approvals and markings ................................................................................... 202
C.5 Interfaces ............................................................................................................................. 203
D List of abbreviations ............................................................................................................................... 205
D.1 Abbreviations ....................................................................................................................... 205
Index ...................................................................................................................................................... 209

SIMATIC IPC847E
10 Operating Instructions, 10/2018, A5E43920357-AA
Product description 1
1.1 Important instructions and manuals for operating the device

Documentation Contents Source

Operating instructions • Product description • Supplied data storage medium
• Technical specifications • Online at:
• Installation of the device SIMATIC IPC Documentation
• Operation of the device (http://www.siemens.com
• Installing and removing /simatic-ipc-doku-portal)
hardware
• Dimension drawings
Quick Install Guide Information on: • Supplied in printed form with the
• Operating Instructions of the device
device • Supplied data storage medium
• Installation of the device
• Steps for connecting the
device to the power supply
• Connecting I/O devices
• Switching the device on
Current product information • Current notes on the device • Online at:
• Changes compared with SIMATIC IPC Documentation
these operating instructions (http://www.siemens.com
/simatic-ipc-doku-portal)
Firmware/BIOs description Information on: • Supplied data storage medium
• Important firmware settings • Online at:
• Firmware settings in the Firmware/BIOS description
factory state https://support.industry.siemens.com/
• Boot modes cs/ww/en/view/109760621

Windows® operating sys- Information on: • Supplied data storage medium

tem
• Commissioning the operat- • Online at:
ing system
Microsoft® Windows® 10
• Restoring the operating
(https://support.industry.siemens.
system
com/cs/ww/en/view/109749498)
• Configuration of the operat- Microsoft® Windows® Server
ing system 2016
(https://support.industry.siemens.
com/cs/ww/en/view/109760563)

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 11
Product description
1.1 Important instructions and manuals for operating the device

Documentation Contents Source

SIMATIC IPC DiagBase Information on: • Supplied data storage medium
• Temperature monitoring • Online at:
• Fan monitoring
SIMATIC IPC DiagBase
• Monitoring drives (https://support.industry.siemens.
• Watchdog com/cs/ww/en/view/109749690)
• Operating hours counter
• Battery monitoring
SIMATIC IPC DiagMonitor Monitoring functions such as • Online at:
with SIMATIC IPC DiagBase
with additional extended func- SIMATIC IPC DiagMonitor
tions (https://support.industry.siemens.
com/cs/ww/en/view/39129913)

SIMATIC IPC Remote Man- Information on: • Online at:

ager
• Remote maintenance of SIMATIC IPC Remote Manager
SIMATIC industrial PCs (http://support.automation
(IPCs) via a management .siemens.com/WW/view/en
PC /48707158)
• Using Intel ®Active Man-
agement Technology
(Intel® AMT)
SIMATIC IPC Image & Information on: • Online at:
Partition Creator
• Backup and recovery of SIMATIC IPC Image Partition
files, directories, drive parti- Creator
tions (https://support.industry.siemens.
com/cs/de/en/view/21766418)
SIMATIC NET Industrial communication • Online at:

SIMATIC NET
(http://w3.siemens.com/mcms
/automation/en/industrial-
communications/Pages
/Default.aspx)

SIMATIC IPC847E
12 Operating Instructions, 10/2018, A5E43920357-AA
 Product description
1.2 Product highlights

1.2 Product highlights

The SIMATIC IPC847E is a powerful industrial PC in 19" rack format design (4 HE). It is
perfectly suited for PC applications with high-level industry functionality.

Device view

Note
Depending on the configuration ordered the features and illustrations described in this
manual may differ from the features of your device.

Maximum industrial compatiblity for 24-hour continuous use in industrial environments

● Maximum processor performance (in full configuration) without loss of performance
(throttling) at up to 50 °C ambient temperature
● Fully coated surfaces that repel dirt and corrosion
● Rugged all-metal housing, coated over its entire surface (blue chromated) and enameled
on the outside to protect against corrosion and dirt with high EMC compatibility
● Suitable for installation in space-saving control cabinets with a depth of only 500 mm
● Dust protection through overpressure venting concept with front-side fan and dust filter
● Protection against vibration and shock through corresponding hard drive retainer and
card hold-down mechanism

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 13
Product description
1.2 Product highlights

High productivity through fast data processing

● 8th generation Intel® processors: Xeon, Core i7, Core i5 or Core i3 up to 6 cores /
12 threads
● Graphics controller (630/P630) integrated in the processor up to 4 K Ultra HD resolution
● Maximum performance, e.g. through Intel C246 chipset, DDR4 memory with support of
dual channel technology
● High data transfer rates, e.g. via PCI Express Technology Gen 3,
USB 3.1 Gen 2 SuperSpeed + (10 Gbps), M.2 NVME SSD
● Low noise level due to variable-speed fans

High system availability thanks to minimization of standstill times

● High data security through RAID systems: Onboard RAID system or hardware RAID
system
● RAID1 system: Data mirroring onto two SATA or SAS drives, including in removable drive
bays, and optionally with additional SDD (for operating system) or hot-spare drive
● RAID5 system: Striping with parity onto three SATA or SAS drives for increased memory
capacity in removable drive bays, optionally with additional hot-spare drive
● Hot swap (swapping of drive during operation) in removable drive bays in RAID systems
● Hot-spare drive in removable drive bays in RAID systems: The rebuild process onto the
hot-spare drive starts automatically
● Fast identification and swapping of drives under error conditions through alarm LEDs for
RAID systems
● Efficient event diagnostics through the SIMATIC IPC DiagBase or DiagMonitor monitoring
software (optional)
● Remote control and remote maintenance of the device through iAMT (Intel® Active
Management Technology)
● SSD as 2.5" SATA or M.2 NVMe and ECC memory (optional)
● Replacement of the redundant power supply module during operation

Differentiated safety concepts

● Lockable front door for component protection against unauthorized access, e.g.
– Software dongle in USB connection behind the front door
– Front fan can only be replaced when front door is open
– All components inside the device can only be accessed when front door is open
● Device monitoring through operating displays on the front for Ethernet; alarms for fan,
temperature, watchdog and drives in RAID1 or RAID5 systems

SIMATIC IPC847E
14 Operating Instructions, 10/2018, A5E43920357-AA
 Product description
1.3 Scope of application

High investment protection

● Platform with embedded Intel components for long-term stability
● Availability: 3 to 6 years
● Assured spare parts availability: 5 years after product expiry
● Certified for worldwide marketing (cULus)
● Support of legacy interfaces (COM)
● Compatible installation across device generations
● Worldwide service and support

User-friendly application scenarios for commissioning, use and service

● High flexibility and expandability through integrated interfaces and up to 11 slots (PCI and
PCI Express)
● Pre-installed and activated operating system
● Fast restoration of delivery state of the operating system (with supplied data storage
medium)
● Universal use as industrial workstation or industrial server
● Gbit LAN with teaming capability (3 x LAN 10/100/1000 Mbps connections)
● Service-friendly device configuration (modifications, service), e.g. replacement of filter or
front fan without tools
● Can be used flexibly in different positions with telescopic guide support or as an industrial
tower PC

1.3 Scope of application

The SIMATIC IPC offers system integrators, cabinet designers, system engineers and
machine designers a 19" rack PC platform for high-performance applications and IT
applications on the control and cell level for:
● Process and visualization applications
● Industrial image processing
● Quality assurance and monitoring tasks
● Measurement, control and rule-based tasks
● Data acquisition and management
The SIMATIC IPC has CE certification for use in the industrial sector as well as in residential
and commercial areas and small businesses. In addition to the industrial applications,
therefore, it can also be used in building automation or in public facilities.

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 15
Product description
1.4 External design of the device

1.4 External design of the device

1.4.1 Front panel

① Fan cover of front fan with openings for ventilation of the device (locked by front door)
② System status displays (Page 25)
③ Front door: lockable, protection against unauthorized access
④ Lock
• Key vertical: open
• Key horizontal: closed
⑤ 19" mounting bracket

① USB ports
② Reset button
③ On/off button
④ Locking screw of the enclosure cover
⑤ Removable drive bays
⑥ Drive bays

See also
Interfaces (Page 20)
Operator controls (Page 23)

SIMATIC IPC847E
16 Operating Instructions, 10/2018, A5E43920357-AA
 Product description
1.4 External design of the device

1.4.2 Drive cage type A

The drive cage type A is located behind the front door.
Drives can be installed here in removable trays and are therefore easily accessible from the
outside, without opening the device.
The removable trays can be locked, thus protecting the drives from unauthorized access.

Mounting locations

(0) Mounting loca- Mounting location for 3.5" or 2.5" drive in the removable tray or for
tion 0 5.25" drive or components
(1) Mounting loca- Mounting location for 3.5" or 2.5" drive in the removable tray
tion 1
(2) Mounting loca- Mounting location for 3.5" or 2.5" drive in the removable tray
tion 2
(3) Mounting loca- Mounting location for 3.5" or 2.5" drive in the removable tray
tion 3

Components

(A) Cover or drive cover

(B) Blanking plate
(C) Removable tray
(D) Cover
(E) Lock of the removable tray

Additional information
Technical notes and information on the rated conditions are available in the section Drives in
drive cage type A / side panel (Page 100).

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 17
Product description
1.4 External design of the device

1.4.3 Drive cage type B

The drive cage type B is located behind the front door.
In drive cage type B, drives are permanently installed inside and cannot be accessed
externally.
The drives are very well protected against vibration and oscillation ("vibration-damped drive
cage") in this drive cage.

Drive bays

(0) Mounting location 0 Mounting location for 3.5" or 2.5" drive in a shock-proof/vibration-
proof fixture or for 5.25" drive or components

(1) Mounting location 1 Mounting location for 3.5" or 2.5" drive in a shock-proof/vibration-
proof fixture or for 5.25" drive or components

(2) Mounting location 2 Mounting location for 3.5" or 2.5" drive in a shock-proof/vibration-
proof fixture or for 5.25" drive or components

Components

(A) Cover or drive cover

(B) Cover

Additional information
Technical notes and information on the rated conditions are available in the section Drives in
drive cage type B / side panel (Page 114).

SIMATIC IPC847E
18 Operating Instructions, 10/2018, A5E43920357-AA
 Product description
1.4 External design of the device

1.4.4 Rear of the device

① Opening, prepared for Kensington lock

② Fixing screws for strain reliefs
③ Power supply connections (Page 22) (here: redundant power supply)
④ Air outlet
⑤ Connection for functional ground, see "Connection of equipotential bonding line
(Page 50)"
⑥ Interfaces (Page 20)
⑦ Fixing screws for strain relief (here: redundant power supply)
⑧ Slots for expansion cards on the bus board (Page 182)

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 19
Product description
1.4 External design of the device

1.4.5 Interfaces and connections

1.4.5.1 Interfaces

Note
You can find detailed information on interfaces under "External interfaces (Page 189)".

Interfaces at rear of device

① COM2 X31 Serial interface 2 (V.24), 9-pin D-sub socket (optional)

(optional)
② Audio X90 UAJ connector for audio devices, 2.5 mm jack socket
③ COM1 X30 Serial interface 1 (V.24), 9-pin D-sub socket
④ DVI X70 Connection for monitor with DVI-D interface
⑤ 2 x DPP X71/X72 Connections for DisplayPort:
• Connection for monitors with DisplayPort interface
• Connection for monitors with VGA interface via DP to VGA
adapter, see Hardware accessories (Page 30)
• Connector for monitors with DVI interface via DP-DVI-D
adapter, see Hardware accessories (Page 30)
⑥ 3 x Ethernet Connections for Ethernet RJ45 for 10/100/1000 Mbps
Ethernet X1/P1 is iAMT-capable
The Ethernet interfaces are numbered on the enclosure. The
numbering by the operating system can differ.
⑦ 2 x USB USB 3.1 GEN 2 Type C high current, backwards compatible with
X61/X63 USB 3.0/2.0/1.1
⑧ 2 x 2 USB USB 3.1 GEN 2 Typ A high current, backwards compatible with
X60/X62/X64/X65 USB 3.0/2.0/1.1

SIMATIC IPC847E
20 Operating Instructions, 10/2018, A5E43920357-AA
 Product description
1.4 External design of the device

Interfaces of the optional graphics card

① 3 x Mini DisplayPort

You can find information about the optional graphics card under "Technical specifications of
graphic (Page 160)".
Further connection options for monitors to this interface:
● Hardware accessories (Page 30)

Interfaces at front of device

The interfaces at the front of device are located behind the front door.

① 2 × USB 3.1 Gen 1 Connections for USB devices, backward compatible with USB
3.0/2.0/1.1

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 21
Product description
1.4 External design of the device

1.4.5.2 Power supply connections

Socket for power plug Sockets for power plugs

Single power supply Redundant power supply

SIMATIC IPC847E
22 Operating Instructions, 10/2018, A5E43920357-AA
 Product description
1.4 External design of the device

1.4.6 Operator controls

WARNING
Risk of electric shock
The buttons and switches described in the following do not fully disconnect the device from
the line voltage.
You also need to the notes and information under "Switching off the device (Page 60)".

On/Off switch
The following figures show the location of the on/off switch on the rear of the device for
devices with simple or redundant power supply.

On/Off switch On/Off switch

Single power supply Redundant power supply

① On/Off switch

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 23
Product description
1.4 External design of the device

On/off switch and reset button

The On/off button ① and the reset button ② are located on the front of the device behind
the front door. The On/off button starts and shuts down the operating system. The reset
button is for the emergency when the device can no longer be operated.
Additional information is available in "Switching on the device (Page 59)" and "Switching off
the device (Page 60)".

① On/off button
② Reset button for emergencies

Alarm reset button (redundant power supply)

The alarm reset button is only available for devices with redundant power supply.
Use the alarm reset button to switch off the signal tone of the redundant power supply in the
event of an error.

① Alarm reset button

SIMATIC IPC847E
24 Operating Instructions, 10/2018, A5E43920357-AA
 Product description
1.4 External design of the device

1.4.7 Status displays

1.4.7.1 System status displays

The status displays for the system are located on the front of the device. They provide
information on the status of the device components.

Item Status display Meaning Color Description

① POWER Operating mode of the OFF Switched off or disconnected from the mains
PC YELLOW Idle state or shut down
GREEN PC in operation
② HDD Access to hard disk OFF No access
GREEN Access
③ ETHERNET 1 Ethernet status display OFF • No connection
ETHERNET 2 No data traffic
④ •
ETHERNET 3
⑤ GREEN Data traffic

⑥ WATCHDOG Watchdog status OFF Not activated

GREEN Activated
RED Expired
⑦ TEMP Temperature status OFF No error
RED Possible causes:
• CPU temperature is critical
• Device temperature is critical

⑧ FAN Fan status OFF No error

RED Possible causes:
• Front fan faulty
• Fan on drive cage type A faulty
• Fan of simple power supply faulty (non-
redundant power supply)

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 25
Product description
1.4 External design of the device

Item Status display Meaning Color Description

⑨ HDD3 ALARM HDD alarm in combina- OFF RAID is OK
HDD2 ALARM tion with RAID and A RED LED is lit up The associated drive is not OK
⑩ monitoring software.
HDD1 ALARM All RED LEDs are RAID synchronization running, RAID is not
⑪ HDD0 ALARM
The number of the HDD flashing OK
alarm corresponds to
⑫ the number of mounting The hard disk newly integrated in case of
locations of drives, see error is synchronized with an existing hard
"Drive cage type A disk.
(Page 17)" and "Drive All RED LEDs are lit RAID is not OK
cage type B (Page 18)". up The faulty drive could not be localized by the
monitoring software. It may be possible to
detect the defective drive with the RAID soft-
ware.
Information is available at "RAID1 system
(Page 65)", "RAID5 system (Page 65)" or
"Hot-spare drive in RAID1 or RAID5 systems
(Page 66)".

SIMATIC IPC847E
26 Operating Instructions, 10/2018, A5E43920357-AA
 Product description
1.4 External design of the device

1.4.7.2 Status display of the Ethernet interface

The Ethernet interfaces are numbered on the enclosure to identify them clearly.
The numbering by the operating system can differ.

Status display Meaning Status Meaning of the status

LED 1 Connection status OFF • No cable connected
• Cable disabled
• Interface disabled
GREEN • Active cable connected
GREEN flashing • Data transfer active
LED 2 Data transmission rate OFF • 10 Mbps
GREEN • 100 Mbps
YELLOW • 1000 Mbps

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 27
Product description
1.4 External design of the device

1.4.7.3 Status display of redundant power supply

Status display Meaning Status Meaning of the status

Status LED (see Status of the power OFF • Module is out of service, no redundancy in
marking) supply module effect.
GREEN • The module is in operation and function-
ing.
• Redundancy is in effect when both mod-
ules are operating.
RED • Module failed, no redundancy in effect.

1.4.7.4 Status displays on removable tray for drives

Item Status Meaning Status Meaning of the status

display
① Power Status of the OFF • Device switched off
removable tray
• Power supply not connected
• No drive installed
Lit • Device is switched on and a drive is in-
stalled

② Activity Status of the Flashes • Drive is active

drive
OFF • Drive is not active

SIMATIC IPC847E
28 Operating Instructions, 10/2018, A5E43920357-AA
 Product description
1.5 Internal construction of the device

1.5 Internal construction of the device

① Power supply, single or redundant

② Motherboard with slots for memory modules
③ Drive cage
④ Guide rail for long expansion cards
⑤ Heat sink; connected via 2 heat pipes to the heat sink of the processor ⑦ for heat transfer
⑥ Motherboard
⑦ Heat sink of the processor
⑧ Rod with card holders for expansion cards
⑨ Bus board with slots for expansion cards
⑩ On the enclosure: Numbering of slots for expansion cards

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 29
Product description
1.6 Accessories and spare parts

1.6 Accessories and spare parts

1.6.1 Hardware accessories

Accessories from Siemens are available for your device. These are not included in the scope
of delivery.

Obtaining accessories from the SIEMENS Industry Mall

You can find additional information in the online ordering system Industry Mall
(https://mall.industry.siemens.com).

Accessories available for order

Name Description Article number

Retainer for The retainer is a mechanical safety device 6ES7648-1AA00-0XK0
locking the inter- for the internal USB interface. It optimizes
nal USB inter- the protection of an internal USB memory
face stick against loads caused by vibration and
shock during transportation or operation.
This increases the reliability and operational
safety of the device.

Tower Kit You can use the Tower Kit to convert the 6ES7648-1AA01-0XC0
for device into an industrial Tower PC. This step
expands the operating range beyond the
SIMATIC IPCs
control cabinet.
Components of the Tower Kit:
• Cover
• Feet
• Accessories: Screws and rubber feet

SIMATIC IPC847E
30 Operating Instructions, 10/2018, A5E43920357-AA
 Product description
1.6 Accessories and spare parts

Name Description Article number

Low profile re- The removable tray makes for quick and 6ES7648-0EH00-1BA0
movable rack simple replacement of a 2.5" or 3.5" drive
unit without having to open the device or remove
it from the control cabinet. The result is the
following advantages for service and
maintenance, data backup and data trans-
fer:
• Replacement of a failed hard disk in
operation ("hot-swap")
• Downloading different system states or
operating systems from different hard
drives during a short period of time.
• Simplified data backup by copying, for
example, to a backup hard drive.
• Simple transportation of backup data
• Separate data storage and archiving
possible
Filter pad Filter pad for fan cover on the device front, A5E37019277
package with 10 filter pads
DP to DVI-D Graphics adapter cable, DisplayPort to DVI 6ES7648-3AF00-0XA0
adapter

DP to VGA Graphics adapter cable, DisplayPort to VGA 6ES7648-3AG00-0XA0

adapter

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 31
Product description
1.6 Accessories and spare parts

Name Description Article number

mDP adapter Connection of dual-head adapter to the
optional graphics card possible with the
following adapters:
• mDP to VGA adapter 6ES7648-3AL00-0XA0

Mini DisplayPort to VGA

• mDP to DVI-D adapter 1 adapter 6ES7648-3AK00-0XA0

3 adapters 6ES7648-3AK00-1XA0
Mini DisplayPort to DVI, available as
single-pack or 3-pack

• mDP-DP adapter * 1 adapter 6ES7648-3AJ00-0XA0

3 adapters 6ES7648-3AJ00-1XA0
Mini DisplayPort to DisplayPort, availa-
ble as single-pack or 3-pack

* Component of the optional graphics card

SIEMENS spare parts services

Information on ordering, the provision and delivery of spare parts can be found under
"Industry Online Support: Spare parts services
(http://support.automation.siemens.com/WW/view/en/16611927)".

SIMATIC IPC847E
32 Operating Instructions, 10/2018, A5E43920357-AA
 Product description
1.6 Accessories and spare parts

1.6.2 Software accessories

The following software products, among others, can be additionally ordered for your device:

Software Description
SIMATIC IPC Image & Partition Cre- SIMATIC IPC Image & Partition Creator enables easy backup
ator and quick recovery of individual data and files, complete hard
disks and other data storage media.
The intuitive user interface provides disk and partition man-
agement functions.
SIMATIC IPC DiagMonitor In addition to the local monitoring options,
SIMATIC IPC DiagMonitor offers options for remote monitor-
ing of IPCs, communication with other systems, worldwide
alerts and creation of custom monitoring applications.
SIMATIC IPC Remote Manager The SIMATIC IPC Remote Manager enables the use of Intel®
Active Management Technology (Intel AMT).
By using remote access to SIMATIC IPCs, system or program
errors can be corrected from a control room (without on-site
presence), for example, and program updates and firm-
ware/BIOS settings can be performed.
Access is possible even if the operating system no longer
starts.

Further information on the software products and references to the online catalog and
ordering system (Industry Mall) can be found on the SIMATIC IPC software
(http://www.automation.siemens.com/mcms/pc-based-automation/en/industrial-
pc/expansion_components_accessories) homepage.

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 33
Product description
1.6 Accessories and spare parts

SIMATIC IPC847E
34 Operating Instructions, 10/2018, A5E43920357-AA
Safety instructions 2
2.1 General safety instructions

WARNING
The installer of the system is responsible for the safety of a system in which the device is
integrated.
There is a risk of malfunction which could result in death or serious injury.
• Ensure that only suitably qualified personnel perform the work.

Risk of physical injury

CAUTION
Risk of physical injury
The device is heavy, may fall down, injure persons and be damaged.
• Use the handles on the front panel to carry and lift the device.

Risk due to electric shock

WARNING
Risk of electric shock
The on/off button and on/off switch do not fully disconnect the device from the mains.
There is also a risk of fire if the device or connecting lines are damaged.
• Always fully disconnect the device from the mains voltage before performing work on
the device or when the device will not be used over an extended period of time.
• For control cabinet mounting: Use a central, easily accessible AC circuit breaker close
to the device, if possible.

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 35
Safety instructions
2.1 General safety instructions

Risk of lightning strikes

DANGER
Risk of lightning strikes
A lightning flash may enter the mains cables and data transmission cables and jump to a
person.
Death, serious injury and burns may result.
• Disconnect the device from the power supply in good time when a thunderstorm is
approaching.
• Do not touch power cables and data transmission cables during a thunderstorm.
• Keep sufficient distance from electric cables, distributors, systems, etc.

Avoiding functional restrictions

NOTICE
Possible functional restrictions in case of non-validated plant operation
The device is tested and certified on the basis of the technical standards. In rare cases,
functional restrictions can occur during plant operation.
Validate the correct functioning of the plant to avoid functional restrictions.

Use in industrial environments

Note
Use in an industrial environment without additional protective measures
This device was designed for use in a normal industrial environment according to
IEC 60721-3-3.

ESD directive
Electrostatic sensitive devices can be labeled with an appropriate symbol.

NOTICE
Electrostatic sensitive devices (ESD)
The device contains electronic components that may be destroyed by electrostatic charges.
This can result in malfunctions and damage to the machine or plant.
Take corresponding precautionary measures before you open the device.

SIMATIC IPC847E
36 Operating Instructions, 10/2018, A5E43920357-AA
 Safety instructions
2.2 Note on transport and storage

2.2 Note on transport and storage

Damage caused by transportation and storage

NOTICE
Damage to the device during transport and storage
If a device is transported or stored without packaging, shocks, vibrations, pressure and
moisture may impact the unprotected unit. Damaged packaging indicates that ambient
conditions have already had a massive impact on the device and it may be damaged.
This may cause the device, machine or plant to malfunction.
• Keep the original packaging.
• Pack the device in the original packaging for transportation and storage.

WARNING
Electric shock and fire hazard due to damaged device
A damaged device can be under hazardous voltage and trigger a fire in the machine or
plant. A damaged device has unpredictable properties and states.
Death or serious injury could occur.
• Avoid installing and commissioning a damaged device.
• Label the damaged device and keep it locked away. Send off the device for immediate
repair.

Damage from condensation

NOTICE
Damage from condensation
If the device is subjected to low temperatures or extreme fluctuations in temperature during
transportation, moisture could occur on or inside the HMI device (condensation).
Moisture can cause a short-circuit in electrical circuits and damage the device.
• Store the device in a dry place.
• Bring the device to room temperature before starting it up.
• Do not expose the device to direct heat radiation from a heating device.
• If condensation develops, wait approximately 12 hours or until the device is completely
dry before switching it on.

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 37
Safety instructions
2.3 Notes on mounting

2.3 Notes on mounting

Fire protection enclosure

Note
The device meets the requirements for fire protection enclosures in accordance with
IEC/EN/UL 61010-2-201. It can therefore be installed without an additional fire protection
cover.

Rack mounting

Note
Rack-mount instructions
• Elevated operating temperature
If installed in a closed or multi-unit rack, the operating ambient temperature may be
greater than the room temperature. Install the device in an environment recommended by
the manufacturer.
• Reduced air flow
When installing the device in a rack, ensure that the air flow required for safe operation of
the device is guaranteed.
• Mechanical load
Mounting of the equipment in the rack should be such that a hazardous condition is not
caused due to an uneven mechanical load.
• Circuit overload
When connecting the devices to the power supply, observe the rated values specified on
the nameplate of the devices.
• Reliable grounding
Reliable grounding of rack-mounted equipment should be ensured.

Device in the control cabinet

DANGER
Electrocution risk when control cabinet is open
When you open the control cabinet, there may be dangerous voltages at certain areas or
components possibly caused by other devices.
Touching these areas or components can cause death or serious bodily injury.
• Always disconnect the cabinet from the mains before opening it.
• Ensure that the power to the control cabinet cannot be turned on accidentally.

SIMATIC IPC847E
38 Operating Instructions, 10/2018, A5E43920357-AA
 Safety instructions
2.4 Notes on ambient and environmental conditions

2.4 Notes on ambient and environmental conditions

Approvals

WARNING
Voided approvals
If the following conditions are not met when installing the system, the UL 61010-2-201,
EN 61010-2-201 approvals are voided and there is a risk of overheating and personal
injury.
• You should observe the following information on ambient and environmental conditions.

Ambient and environmental conditions

NOTICE
Ambient conditions and chemical resistance
Unsuitable environmental conditions can cause faults or damage the device.
Failure to comply nullifies the warranty in accordance with IEC/EN/UL 61010-2-201.
• Operate the device only in closed rooms.
• Only operate the device in the ambient conditions specified in the technical
specifications.
• Observe the permitted mounting positions of the device.
• Do not obstruct the venting slots of the device.
• When the device is operated in severe environments which are subject to caustic vapors
or gases, ensure sufficient clean air is provided.
• Clean the enclosure surface with a damp cloth and make sure that no water enters the
device.

When you plan your project, you should make allowances for:
● The climatic and mechanical environmental conditions specified in the operating
instructions.
● Do not operate the device in severe environments which are subject to caustic vapors or
gases.
● Avoid extreme ambient conditions such as heat.
● Do not expose the device to direct sunlight or other powerful light sources.
● Install the device in such a way that it poses no danger.
● Always maintain a minimum clearance of 50 mm to the area of the ventilation slots and
do not cover the ventilation slots of the enclosure.
● Ensure that there is a distance of at least 50 cm at the back of the device, depending on
wiring.

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 39
Safety instructions
2.4 Notes on ambient and environmental conditions

● You can install the device without an additional fire protection enclosure. It meets the
requirements for fire protection enclosures in accordance with IEC/EN/UL 61010-2-201.
● The device conforms to IP 41 degree of protection on the front. Ensure that the
installation opening for the device is splash-proof in areas which may be subject to splash
water.

High frequency radiation

CAUTION
Immunity to RF interference
The device has an increased immunity to RF radiation according to the specifications on
electromagnetic compatibility in the technical specifications.
High frequency radiation above the specified immunity limits can result in malfunctioning of
the device.
Persons are injured and the plant is damaged.
• Avoid high-frequency radiation.
• Remove radiation sources from the environment of the device.
• Switch off radiating devices.
• Reduce the radio output of radiating devices.
• Read the information on electromagnetic compatibility.
• Read the information in the technical specifications.

SIMATIC IPC847E
40 Operating Instructions, 10/2018, A5E43920357-AA
 Safety instructions
2.5 Information on I/O devices

2.5 Information on I/O devices

CAUTION
Fault caused by I/O devices
The connection of I/O devices can cause faults in the device.
The result may be personal injury and damage to the machine or plant.
• Only connect I/O devices which are approved for industrial applications in accordance
with EN 61000-6-2 and IEC 61000-6-2.
• I/O devices that are not hotplug-capable may only be connected after the device has
been disconnected from the power supply.

NOTICE
Damage through regenerative feedback
Regenerative feedback of voltage to ground by a connected or installed component can
damage the device.
Connected or built-in I/Os, for example, a USB drive, are not permitted to supply any
voltage to the device.
Regenerative feedback is generally not permitted.

Note
When measuring the counter emf, remember the following:
• The IPC in question must be turned off and the power supply connector must be plugged
in.
• During the measurement, all cables from the plant to the IPC should be connected.
• All other components in the plant must be active.

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 41
Safety instructions
2.6 Notes on device and system extensions

2.6 Notes on device and system extensions

Device and system extensions

CAUTION
Fire hazard due to overheating of the device
Expansion cards generate additional heat. The device can overheat or cause a fire.
• Observe the safety and installation instructions for the expansion cards.
• Observe the max. permissible power consumption values.

NOTICE
Damage caused by device and system extensions
Device and system expansions may contain faults and affect the entire device, machine or
plant. They may also violate safety rules and regulations regarding radio interference
suppression.
If you install or replace device or system expansions and damage your device, the warranty
is voided.
• Always disconnect the power plug before you open the device.
• Only install device or system expansions designed for this device.
• Observe the information on "Electromagnetic compatibility" provided in the technical
specifications.

Contact your technical support team or the point of sale to find out which device and system
expansions are suitable for installation.

Limitation of liability
● All technical specifications and approvals of the device only apply if you use expansion
components that have a valid CE approval (CE mark).
● Observe the installation instructions for expansion components in the associated
documentation.
● UL approval of the device only applies when the UL-approved components are used
according to their "Conditions of Acceptability".
● We are not liable for functional limitations caused by the use of third-party devices or
components.

SIMATIC IPC847E
42 Operating Instructions, 10/2018, A5E43920357-AA
Installing and connecting the device 3
3.1 Preparing for mounting

3.1.1 Scope of delivery

Device and hardware for the device

● Rack PC SIMATIC IPC847E
● Power supply cable (country-specific): 1 power supply cable *
For redundant power supply: 2 power supply cables *
● Strain reliefs: 1 strain relief for USB and LAN interfaces, 2 removable cable ties
● Power supply connector lock:
1 strain relief if AC power supply was ordered
2 strain reliefs if redundant power supply was ordered
● Keys for front door: 2 keys
● For device with drive cage type A:
2 keys for removable trays
● Self-adhesive enclosure feet: 4 units
* if ordered with power supply cable

Supplied data storage medium

On the supplied data storage medium (read only) you will find:
● Software and tools to recover your ordered Microsoft® Windows® operating system
● Device drivers for installation in operating systems
● SIMATIC IPC847E Quick Install Guide
● SIMATIC IPC847E Operating Instructions
● Product information
● Firmware/BIOS description
● Operating instructions for your ordered Microsoft® Windows® operating system on this
device

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 43
Installing and connecting the device
3.1 Preparing for mounting

Operating system
Depending on the ordered device configuration, the device is equipped with or without one of
the following installed operating systems.
You can find information on ordered Microsoft® Windows® operating systems under:
Important instructions and manuals for operating the device (Page 11) or Technical
specifications of the operating systems (Page 162).

Installed software
● Monitoring software SIMATIC IPC DiagBase (only with installed Microsoft® Windows®
operating system)
You will find the latest information on additional software for your device under: Software
accessories (Page 33)

Printed documents
● SIMATIC IPC847E Quick Install Guide
● Product Information "Important notes on your device"
● SIMATIC IPC/PG Quality Control Report

SIMATIC IPC847E
44 Operating Instructions, 10/2018, A5E43920357-AA
 Installing and connecting the device
3.1 Preparing for mounting

3.1.2 Checking the delivery package

WARNING
Electric shock and fire hazard due to damaged device
Damaged devices due to improper storage or transport may lead to personal injury and/or
substantial damage to equipment.
You should observe the warnings in "Note on transport and storage (Page 37)".

Procedure
1. Check the delivery unit for any signs of visible transport damage.
If any transport damage is present at the time of delivery, lodge a complaint at the
shipping company in charge. Have the shipper confirm the transport damage
immediately.
2. Unpack the device at its installation location.
Remove the transport lock in the door of the type A drive cage.
3. Keep the original packaging in case you have to transport the unit again.
4. Check the scope of delivery (Page 43) and any accessories (Page 30) you may have
ordered for completeness and damage.
Please inform the delivery service immediately if the package contents are incomplete or
damaged or do not correspond with your order. Fax the enclosed form "SIMATIC IPC/PG
Quality Control Report".
5. Please keep the documentation in a safe place. It is required for initial commissioning and
is part of the device.
6. Note down the Device identification data (Page 46).

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Installing and connecting the device
3.1 Preparing for mounting

3.1.3 Device identification data

The device can be clearly identified with the help of this identification data in case of repairs
or loss.
The following illustrations are examples. The data of your device may differ from the data in
these examples.

Rating plate
The nameplate is located on the inside of the front door.

COA label
The COA label (Certificate of Authenticity) is located inside the front door.

Note
The COA label is only available for devices delivered with Microsoft® Windows® operating
system installed.

Example: COA label for the Microsoft® Windows® 10 operating system:

See also
Important instructions and manuals for operating the device (Page 11)

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3.2 Mounting the device

3.2 Mounting the device

3.2.1 Mounting types

Note
If the device is permanently installed, mounted on telescopic rails or operated as tower, it
must not be subjected to vibration stress during operation. In these cases, use only SSDs
and not HDDs as drives.

Horizontal: Mounting with cabinet brackets

The device can be installed horizontally in control cabinets and 19" rack systems.
This installation type meets the requirements in accordance with IEC60297-3-100.

Horizontal: Mounting on telescopic rails

The device can be installed horizontally in control cabinets and 19" rack systems.
When telescopic rails are used for mounting, the device can be withdrawn fully from the
cabinet or rack. Note the information in "Technical specifications of the telescopic rails
(Page 162)".

Horizontal: Mounting on device base

This installation type meets the requirements in accordance with IEC60297-3-100.

Vertical: Mounting on device base

For vertical operation, mount the device on a horizontal base made of metal and secure it
against falling.
The following are available from Rittal device bases (https://www.rittal.com/de-
de/product/list.action?categoryPath=/PG0001/) for this purpose (Rittal Type TE 7000.620,
Rittal Type VR 5501.655, Rittal Type DK 5501.655). You should also observe the information
of the manufacturer of the device bases.

Vertical: with tower kit

For the vertical operation of the device with a tower kit, the device has a cover and feet. The
tower kit can be ordered as an option , see "Hardware accessories (Page 30)".

Additional information
You can also find additional information in the QIG (Quick Installation Guide), which comes
with your device.

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3.2 Mounting the device

3.2.2 Securing device

WARNING
Dangerous voltage and fire hazard
Improper actions during installation and assembly may lead to personal injury and/or
substantial damage to equipment.
You should observe the installation and assembly notes under:
• Notes on mounting (Page 38)
• Notes on ambient and environmental conditions (Page 39)

DANGER
Electrocution risk when control cabinet is open
When you open the control cabinet, there may be a dangerous voltage at certain areas or
components.
Touching these areas or components can cause death or serious bodily injury.
• Always disconnect the cabinet from the mains before opening it.
• Ensure that the power to the control cabinet cannot be turned on accidentally.

CAUTION
Risk of physical injury
The device is too heavy to be mounted exclusively with the 19-inch brackets of the front
panel.
The device may fall down, injure people and get damaged.
• Secure the device using additional measures. The mounting screws of the telescopic
rails may not protrude more than 5 mm into the device.
• Use the brackets on the front panel to carry and lift the unit.

Mounting holes
Detailed information on the position of the mounting holes for angle brackets or telescopic
rails can be found here: Dimension drawing of the telescope rails (Page 166) and Technical
specifications of the telescopic rails (Page 162).

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3.3 Connecting the device

3.3 Connecting the device

3.3.1 Country-specific information on supply voltage

USA and Canada

Supply voltage 120 V / 230 V / 240 V

Ensure that the power cords used are rated for the maximum current input and ambient
temperature of the device and meet the requirements of the following standards:
● ANSI/UL 817
● CSA C22.2 No. 21
Ensure that the device connectors, connection sockets and connection materials are rated
for the maximum current input and ambient temperature of the device and meet the
requirements of the following standards:
● ANSI/UL 498 and CSA C22.2 No. 42
● CSA C22.2 No. 182.1
● CSA C22.2 No. 182.2
● CSA C22.2 No. 182.3

For countries other than the USA and Canada

Supply voltage 230 V AC

This device is supplied with a safety-tested power cord and may only be connected to a
grounded SCHUKO socket outlet.
If you do not use the power cord, use a flexible cable that is rated for the maximum current
input and ambient temperature of the device and complies with the safety regulations of the
country in which the device is installed.
The power supply cord and the plug connector must bear the prescribed markings.

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Installing and connecting the device
3.3 Connecting the device

3.3.2 Connection of equipotential bonding line

A low-impedance earth connection ensures that interference signals generated by external
power supply cables, signal cables or other cables to the I/O devices are safely discharged
to earth.
The connection for functional earthing on a device has a large surface, makes contact over a
large area and is marked with the following symbol.

You can find information on the position of the functional earthing connection under "Rear of
the device (Page 19)".

Requirement
● T20 screwdriver
● Equipotential bonding conductor with a minimum cross section of 2.5 mm2

Procedure
1. Make the connection for functional ground via an equipotential bonding line to the
equipotential bonding rail or grounding bar of the control cabinet in which the device is
installed.

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3.3 Connecting the device

3.3.3 Connecting the power supply

3.3.3.1 Connect single power supply (AC)

WARNING
Injury to persons or damage to property when operated on an incorrect power supply
system
If you connect the device to an unsuitable power supply, the device receives voltages and
currents that are too high or too low.
Injuries to persons, malfunctions or a damage to the device can result.
• The permissible rated voltage of the device must match the local supply voltage.
• Operate the device only in grounded power supply networks (TN networks in
accordance with VDE 0100 Part 100 or IEC 60364-1).
• Operation in non-grounded or impedance-grounded networks is not permitted.

WARNING
Risk of electric shock
The on/off button and on/off switch do not fully disconnect the device from the mains.
There is also a risk of fire if the device or connecting lines are damaged.
• Always fully disconnect the device from the mains voltage before performing work on
the device or when the device will not be used over an extended period of time.
• For control cabinet mounting: Use a central, easily accessible AC circuit breaker close
to the device, if possible.

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3.3 Connecting the device

Requirement
● You have observed the information under "Country-specific information on supply voltage
(Page 49)".

Procedure
1. Turn the on-off switch off (position "0"). Information on the position of the on/off switch is
available in "Operator controls (Page 23)".
2. Insert the power cable in the corresponding electrical socket. Information on the position
of the socket is available in "Power supply connections (Page 22)".
3. Insert the power cable in the electrical socket.
4. Switch the on/off switch to on (position | ).

Attach latch for power plug

To prevent unintentional removal of the power cable, you secure the plug as follows:

1. Remove the retaining screw ①.

2. Screw on the latch for the power plug
②.

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3.3 Connecting the device

3.3.3.2 Connecting a redundant power supply (AC)

WARNING
Injury to persons or damage to property when operated on an incorrect power supply
system
If you connect the device to an unsuitable power supply, the device receives voltages and
currents that are too high or too low.
Injuries to persons, malfunctions or a damage to the device can result.
• The permissible rated voltage of the device must match the local supply voltage.
• Operate the device only in grounded power supply networks (TN networks in
accordance with VDE 0100 Part 100 or IEC 60364-1).
• Operation in non-grounded or impedance-grounded networks is not permitted.

WARNING
Risk of electric shock
The on/off button and on/off switch do not fully disconnect the device from the mains.
There is also a risk of fire if the device or connecting lines are damaged.
• Always fully disconnect the device from the mains voltage before performing work on
the device or when the device will not be used over an extended period of time.
• For control cabinet mounting: Use a central, easily accessible AC circuit breaker close
to the device, if possible.

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3.3 Connecting the device

Requirement
● You have observed the information under "Country-specific information on supply voltage
(Page 49)".

Procedure
1. Switch the on/off switch off (position 0). Information on the position of the on-off switch is
available under "Operator controls (Page 23)".
2. Connect the power cable to the two sockets. Information on the position of the sockets is
available in "Power supply connections (Page 22)".
3. Connect the power cable to the sockets.
4. Switch the on/off switch to on (position | ).
The status display on the power supply modules light up green.

Note
If only one of the power supply modules works, a warning signal sounds. You turn off the
warning signal by pressing the alarm reset button on the working power supply module.
You can find information on the position of the alarm reset button under "Operator
controls (Page 23)".

Attach latch for power plug

To prevent unintentional removal of the power cable, you secure the plug on the device as
follows:

1. Remove the two retaining screws ①.

2. Screw the power plug latches ② using the two
fixing screws ①.

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3.3 Connecting the device

3.3.4 Connecting I/O devices

CAUTION
Fault caused by I/O devices
The improper connection of I/O devices can cause faults in the device.
The result may be personal injury and damage to the machine or plant.
You should observe the warnings relating to the connection of I/O devices in "Information
on I/O devices (Page 41)".

Procedure

Note
Use the original connections of the I/O to be connected without adapters or extensions.

1. Connect the I/O devices to the respective interfaces. Information on the position of the
interfaces is available in "Interfaces and connections (Page 20)".
2. Secure the cables (Page 58) with strain relief if needed.

Connecting audio devices

Depending on the function, a UAJ connector has 2-4 contact surfaces.
Depending on the function or standard, the assignment of the contacts varies.
The audio controller of the device recognizes the assignments of the contacts of the UAJ
connector in accordance with the connected audio device and is automatically configured.
You can connect the following audio devices to the UAJ connection:
● Audio device with line out
● Audio device with line in
● Headphones
● Microphone
● Headset (with headphones and microphone) with the following standards:
– OMTP: Standard for audio devices from Nokia, etc.
– CTIA: Standard for audio devices from Apple®

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3.3 Connecting the device

Connecting several monitors (multi-monitoring)

You will find up to six ports on the rear of the device for connecting monitors. Three of these
interfaces are connected to the motherboard. When an optional graphics card is installed,
the other three interfaces are connected to the graphics card. Parameter assignment is
performed by means of the Control Panel in Windows®.
The IPC is factory set for multi-monitoring. If needed, you can configure the multi-monitoring
function and the output of the boot screen in the firmware settings, see "Multi-monitoring
(Page 64) ".
The following table shows the various connection options of the monitors to the interfaces of
the device.

Motherboard Graphics card (optional)

DPP1 DPP2 DVI-D mDPP1 mDPP2 mDPP3
Monitor 1 DP X - - - - -
DVI X 1) - - - - -
VGA X 2) - - - - -
Monitor 2 DP - X - - - -
DVI - X 1) - - - -
VGA - X 2) - - - -
Monitor 3 DP - - - - - -
DVI - - X - - -
VGA - - - - - -
Monitor 4 DP - - - X 3) - -
DVI - - - X 4) - -
VGA - - - X 5) - -
Monitor 5 DP - - - - X 3) -
DVI - - - - X 4) -
VGA - - - - X 5) -
Monitor 6 DP - - - - - X 3)
DVI - - - - - X 4)
VGA - - - - - X 5)

1) - via DP to DVI-D adapter

2) - via DP to VGA adapter
3) - via mDP to DP adapter
4) - via mDP to DVI-D adapter
5) - via mDP to VGA adapter

You can find additional information about the optional graphics card under "Technical
specifications of graphic (Page 160)".

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3.3 Connecting the device

3.3.5 Connecting the device to networks

The following options are available for integrating the device into existing or planned system
environments and networks.

Ethernet
Wake on LAN and Remote Boot are supported.
You can use the integrated Ethernet interfaces (10/100/1000 Mbps) for communication and
data exchange with automation devices, such as SIMATIC S7.
You need the "SOFTNET S7" software package for this.

PROFINET
PROFINET can be operated via:
● Standard Ethernet interfaces (RT)

SIMATIC NET
Use this software package to create, operate and configure an innovative network for Field &
Control level. Additional information is available under SIMATIC NET
(http://w3.siemens.com/mcms/automation/en/industrial-
communications/Pages/Default.aspx).
The software package and the documentation are not included in the scope of delivery

Additional information
You can find additional information on the Internet at: Technical support
(https://support.industry.siemens.com/cs/ww/en/)

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Installing and connecting the device
3.3 Connecting the device

3.3.6 Securing the cables

The strain relief provided is used to prevent accidental loosening of the interface cables from
the device.

Requirement
● I/O devices are connected to the respective interfaces.
● TORX T10 screwdriver

Procedure

1. Screw the strain relief ① onto the de-

vice with the fastening screw ②.

2. Insert the detachable cable ties in the

respective openings of the strain relief
and fasten the cables with the cable
ties.

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Commissioning the device 4
4.1 Switching on the device

Requirement
● The power supply is connected. (Page 51)

Procedure
1. Toggle the on-off switch (for redundant power supply: both on/off switches) on the rear of
the device (position | ).
2. Press the on/off button at the front of the device behind the front panel door. Information
on the position of the switch and button can be found at "Operator controls (Page 23)".

Commissioning the installed Windows® operating system

You can find information on first startup of the device and commissioning the installed
Windows® operating system in the documentation on the supplied data storage medium.
See also "Important instructions and manuals for operating the device (Page 11)" for more
on this.

4.2 Configuring automatic switch-on of device

In the firmware settings you can specify that the device automatically starts up again after a
separation from the mains voltage of at least 20 ms as soon as the mains voltage is
available again.
Configure this function with the firmware setting:
● State After G3
You can find information on this in the detailed firmware/BIOS description, see "Important
instructions and manuals for operating the device (Page 11)".
The exact minimum required downtime of the mains voltage is dependent on the device
equipment and the application.

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Commissioning the device
4.3 Switching off the device

4.3 Switching off the device

Shutting down the operating system

For active operating system:

● Shut down the operating system properly.

For inactive operating system

● Briefly press the on/off button. Information on the position of the button is available under
"Operator controls (Page 23)".

Result
The "POWER" operating display is lit yellow.
The device is switched off but not fully disconnected from the line voltage.

Fully disconnecting the device from the line voltage

WARNING
Risk of electric shock
The on/off button and on/off switch do not fully disconnect the device from the mains.
There is also a risk of fire if the device or connecting lines are damaged.
• Always fully disconnect the device from the mains voltage before performing work on
the device or when the device will not be used over an extended period of time.
• For control cabinet mounting: Use a central, easily accessible AC circuit breaker close
to the device, if possible.

● Shut down the operating system and unplug the power plug from the rear of the device,
see "Power supply connections (Page 22)".
The device is switched off and fully disconnected from the mains voltage. No trickle current
is flowing.

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4.3 Switching off the device

Hardware reset
With the hardware reset, you can restart the device if it does not respond to keyboard or
mouse input. Any running operating system will not shut down safely.

NOTICE
Data loss
If a hardware reset is performed, the device undergoes a hard reboot.
• Data in the main memory is deleted.
• Data on the data storage media may be lost.
• The device may be damaged.
Perform a hardware reset only in the case of an emergency.

Hardware reset with on-off button:

● Press the on/off button for more than 4 seconds.
– The unit switches off.
– Press the power button again to turn the device back on.

Hardware reset with reset button:

● Press the reset button.
– The device switches off and on again.
Information on the position of the buttons is available under "Operator controls (Page 23)".

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4.3 Switching off the device

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Operating the device 5
5.1 Opening the front door

Procedure
1. Open the front door with the key.
2. Pull the front door to the side.

See also
Notes on device and system extensions (Page 42)

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Operating the device
5.2 Multi-monitoring

5.2 Multi-monitoring
You can operate several monitors on one device at the same time. Read the information in
the corresponding section under "Connecting I/O devices (Page 55)".

Note
Information on graphics cards which support multi-monitoring can be obtained from your
local representative, see "Service and support (Page 195)".

Procedure
1. Install a suitable graphics card, see "Graphics card (Page 99)".
2. Configure the function "Multi-monitoring" in the firmware settings of the device. You can
find information on this in the detailed firmware/BIOS description, see "Important
instructions and manuals for operating the device (Page 11)".

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5.3 Drive configurations

5.3 Drive configurations

5.3.1 RAID systems

5.3.1.1 RAID1 system

An RAID1 system works on the principle of "data mirroring on two drives".
In the event of a defective drive the RAID1 system can continue to work on the remaining
drive and thus achieves a high level of availability.

RAID1 system with associated software

If you have ordered a RAID1 system with pre-installed operating system, the RAID1 system
is monitored with the installed diagnostics software SIMATIC IPC DiagBase or DiagMonitor.
The following software is available to monitor the RAID1 system:
● Onboard RAID system (Page 68):
Intel® Rapid Storage Technology
● Hardware RAID system (Page 73):
maxView Storage Manager

See also
Installing drives inside on the side wall of the device (Page 124)
Drive cage type A (Page 17)

5.3.1.2 RAID5 system

A RAID5 system works on the principle of "striping with parity".
In the event of a defective drive or cable problems the RAID5 system can continue to work
on the remaining drives and thus achieves a high level of availability.

RAID5 system with associated software

If you have ordered a RAID5 system with pre-installed operating system, the RAID5 system
is monitored with the installed diagnostics software SIMATIC IPC DiagBase or DiagMonitor.
The following software is available to monitor the RAID5 system:
● Onboard RAID system (Page 68):
Intel® Rapid Storage Technology
● Hardware RAID system (Page 73):
maxView Storage Manager

See also
Drive cage type A (Page 17)
Installing drives inside on the side wall of the device (Page 124)

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Operating the device
5.3 Drive configurations

5.3.1.3 Hot-spare drive in RAID1 or RAID5 systems

A hot spare drive is a drive included in the device as spare.
If you have ordered a device with a hot-spare drive, your device is equipped with this hot-
spare drive in the factory state.
If a defective drive is detected in the RAID1 or RAID5 system, the hot-spare drive is
automatically integrated instead of the defective drive during operation and assumes its
function.
Data synchronization to the hot-spare drive starts automatically.

See also
Integrating a hot-spare drive into the onboard RAID system (Page 72)
Data synchronization in the RAID system (Page 82)

5.3.2 System with 2 drives

You can order the device as a system with two drives. For information on hard disk capacity,
refer to your order documentation.
When the device ships, the second drive is then connected to SATA port 1 and not yet set
up. You have the option of backing up your data to this drive.
You can find information on how to boot the device from the second drive in the detailed
firmware/BIOS description, see "Important instructions and manuals for operating the device
(Page 11)".

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5.4 Operating RAID systems

5.4 Operating RAID systems

5.4.1 Display of a defective drive of a RAID system

A defective drive is displayed in conjunction with RAID at the following locations:
● System status displays (Page 25) on the front of the device
● SIMATIC IPC DiagBase or SIMATIC IPC DiagMonitor monitoring software
● For onboard RAID system:
"Intel® Rapid Storage Technology", see "Monitoring the onboard RAID system with
"Intel® Rapid Storage Technology" (Page 70)".
● For hardware RAID system:
"maxView Storage Manager", see "Monitoring the hardware RAID system with "maxView
Storage Manager" (Page 80)".

5.4.2 RAID1 system: Installation options for drives

The two hard disks required for a RAID1 system may be installed in SIMATIC IPC847E at
the following locations:
● For onboard RAID system:
– Drive cage type A, see "Drives in drive cage type A / side panel (Page 100)"
– Drive cage type B, see "Drives in drive cage type B / side panel (Page 114)"
– inside on the side wall of the device, see "Installing drives inside on the side wall of the
device (Page 124)"
● For hardware RAID system:
– Drive cage type A, see "Drives in drive cage type A / side panel (Page 100)"

5.4.3 RAID5 system: Installation options for drives

The hard disks required for a RAID5 system may be installed for SIMATIC IPC847E at the
following locations:
● For onboard RAID system:
– Drive cage type A, see "Drives in drive cage type A / side panel (Page 100)"
– Drive cage type B, see "Drives in drive cage type B / side panel (Page 114)"
– inside on the side wall of the device, see "Installing drives inside on the side wall of the
device (Page 124)"
● For hardware RAID system:
– Drive cage type A, see "Drives in drive cage type A / side panel (Page 100)"

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5.4 Operating RAID systems

5.4.4 Operating onboard RAID system

5.4.4.1 Configuring the onboard RAID system

If you ordered a device with an onboard RAID system, the onboard RAID system is pre-
configured by default.
If you subsequently set up an onboard RAID system, you still have to configure it.

Requirement
● The drives required for the onboard RAID system are installed in the device, see:
– RAID1 system: Installation options for drives (Page 67)
– RAID5 system: Installation options for drives (Page 67)

Navigation in the firmware of the onboard RAID system

Action Key
• Select entry (then confirm selection) • Arrow keys on the keyboard

• Confirm selection • <Return> key

• Back to previous window • <Esc> key

Setting up an onboard RAID system (Create Volume)

1. Switch on the device or restart the device.
2. After starting the device, immediately press the <Esc> key and keep it pressed as soon
as the message "Press ESC for boot options" appears.
3. Use the arrow keys of the keyboard to select "Device Management" from the firmware
selection menu and confirm your selection.
4. Select the entry "Intel <R> Rapid Storage Technology" from the "Devices List".
5. Select "Create RAID Volume".
6. In the next window, enter a name for the RAID system.
7. Select "RAID Level" and select "RAID1" or "RAID5" in the following selection window,
depending on which RAID system you want to set up.
A list of available drives is displayed.

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5.4 Operating RAID systems

8. Under "Select Disks" select the drives ① that you want to integrate into your RAID
system and confirm your selection.

– The integrated drive is given a check mark in the list ②.

– You can find the assignment of the drive to the mounting location in the drive bay in
front of the drive model name, see ③.
9. Select "Create Volume".
In the next window, the details of the RAID system (RAID volume) that you have just set
up are displayed.
The onboard RAID system is set up.
10.Press the <Esc> key several times in succession until you reach the "Main Page" of the
firmware/BIOS menu.

Note
Confirm "Exit Discarding Changes" message with "YES"
If the warning message "Exit Discarding Changes" is displayed when exiting the
firmware/BIOS menu with the <Esc> key, confirm this message with "Yes".
The settings made are still saved and you can exit the firmware/BIOS menu.

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Operating the device
5.4 Operating RAID systems

5.4.4.2 Monitoring the onboard RAID system with "Intel® Rapid Storage Technology"

Open software for monitoring the "Intel® Rapid Storage Technology" onboard RAID system
1. Select "Start > Programs > Start > Intel".

Display status of the onboard RAID system (faulty drive)

1. Select the "Status" tab.
In the "Storage System View" area on the right side of the window, you will find
information on:
– a defective drive
– a/the functioning drives

Example display status of a RAID1 system:

Creating a report on the onboard RAID system

1. Select the "Help" tab.
2. Select "System Report" > "Save".

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5.4 Operating RAID systems

5.4.4.3 Integrating a new drive into the onboard RAID system

The RAID system is configured in the delivery state so that a new drive must be integrated
manually when a defective drive was replaced.
You can also configure the RAID system in such a way that the new drive is automatically
mounted when the defective drive is replaced.
RAID systems with a hot-spare drive are configured so that the hot-spare drive is
automatically integrated in the event of an error.

Configure "Automatic integration of a new drive" (before replacing a defective drive)

NOTICE
Risk of data loss
If a new drive is automatically integrated, the new drive is not checked for partition
information or existing data.
All partitions and data of the new drive are deleted without warning.
• Insert only a brand new drive or a drive that is configured as a replacement drive.
• Refer to the controller documentation for instructions on setting up replacement drives.

1. Select "Start" > "Intel" > "Intel Rapid Storage Technology".

2. Select the "Preferences" menu.
3. Go to the "Automatic Rebuild" area and activate the "Auto-rebuild on hot plug" option.

Configure "Manual integration of a new drive" (before replacing a defective drive)

The RAID system is configured in the delivery state so that a new drive must be integrated
manually when a defective drive was replaced.
You can configure the manual integration of the drive or check the settings yourself.
1. Select "Start" > "Intel" > "Intel Rapid Storage Technology".
2. Select the "Preferences" menu.
3. Go to the "Automatic Rebuild" area and deactivate the "Auto-rebuild on hot plug" option.

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5.4 Operating RAID systems

Manual integration of the replaced drive (in the event of an error)

You can manually integrate a replaced drive in the onboard RAID system as follows:
● In the running system (without restarting the device)
● After switching off the device
Integrating a replaced drive in the running system (without restarting the device):
1. Select "Start" > "Intel" > "Intel Rapid Storage Technology".
2. Select the "Status" menu.
The new drive is displayed on the right-hand side of the program window in the "Storage
System View" area.
If the new drive is not displayed, click the icon "Run Hardware Scan now".
3. Click on the RAID volume in the "Storage System View" area on the right-hand side of the
program window.
4. In the "Manage" menu, click on the link "Rebuild to another Disk".
5. Select the newly integrated drive in the next dialog and click "Rebuild".
The RAID system data synchronization (Page 82) is started.

5.4.4.4 Integrating a hot-spare drive into the onboard RAID system

The RAID system is configured in the delivery state in such a way that a new hot-spare drive
is automatically integrated.
If the automatic integration of a drive in the RAID system is deactivated or if the hot-spare
drive was replaced for a RAID system, then you have to integrate the new drive manually.

Requirement
A new drive was used in the RAID system.

Procedure
1. Select "Start" > "Intel" > "Intel Rapid Storage Technology".
2. Click "Run Hardware Scan now".
The new drive is found and displayed.
3. Select the new drive under "Storage system view" and select "Mark as Spare" under
"Manage disk".
4. Confirm the warning message in the "Mark as Spare" window with "Yes".

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5.4 Operating RAID systems

5.4.5 Operating the hardware RAID system

5.4.5.1 Software and documentation for the hardware RAID system

Note
Hardware RAID
The "Hardware RAID" function described below is only available as of a later stage of
delivery.
Contact your local SIEMENS representative.

When ordering a device with hardware RAID system, all required software is already
installed on your device when it is delivered.
You can find the following in the "Drivers\RAID-AHCI\Adaptec" directory of the supplied data
storage medium:
● "Microsemi Adaptec Smart HBA & RAID - Installation And User's Guide" with
comprehensive information on installing and configuring the hardware RAID adapter card
● "Adaptec maxView Storage Manager" software and the corresponding User's Guide
● "ARCCONF Command Line Utility User's Guide" with information on the "ARCCONF"
tool, which you can use to configure the hardware RAID adapter card on the command
line level

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5.4 Operating RAID systems

5.4.5.2 Installing the hardware RAID adapter card

If you have ordered a device with hardware RAID system, the hardware RAID adapter card
is already installed in the delivery state.
If you want to subsequently operate your device as a hardware RAID system, you need to
install a hardware RAID adapter card.

Requirement
● 4 GB main memory
● T10 screwdriver
● Components for installing the hardware RAID adapter card. Information on these
components can be obtained from your local SIEMENS representative.

① Capacitor block cable with plug

② Capacitor block
③ Hardware RAID adapter card
"Microsemi Adaptec SmartRAID 3151-4i ("Controller", "Host Bus Adapter")"
④ Adapter cable: Numbered connections to the drives
⑤ Adapter cable: Connection to the hardware RAID adapter card

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5.4 Operating RAID systems

NOTICE
Capacitor block must be discharged
The original Siemens spare part is supplied with discharged capacitor block.
When you remove or install a charged capacitor block, the Hardware RAID adapter card
may be damaged. Data loss may result.
Remove or install a capacitor block only in completely discharged condition.
Discharge an installed capacitor block as follows:
1. Shut down the operating system properly.
2. Fully disconnect the device from the line voltage, see "Switching off the device
(Page 60)".
3. Wait at least 10 minutes.
If the capacitor is not discharged, a yellow LED close to the connector lights up.
4. Only remove the connector when the yellow LED is extinguished.

Procedure
1. Open the device, read the important information on this under "Open the device
(Page 89)".
2. Follow the instructions under "Installing expansion cards (Page 91)".
Note the following:
– You can find information on the slot of the hardware RAID adapter card under "Slots
for expansion cards on the bus board (Page 182)".
– Leave the slot in front of the hardware RAID adapter card free.
3. Connect the numbered connectors of the adapter cable ④ to the corresponding drives
available.
The numbers of the connections correspond to the numbers of the drive mounting
locations, see "Drive cage type A (Page 17)".
Loosen the screw connection of the power supply unit, if necessary, and ensure that the
connector lock engages.
4. Run the connection of the adapter cable ⑤ to the front of the device and from there to
the hardware RAID adapter card.

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5.4 Operating RAID systems

5. Insert the capacitor block into the appropriate holder on the guide rail for long expansion
cards and fasten it with a cable tie as shown (see also "Internal construction of the device
(Page 29)").

6. Insert the connector of the capacitor block cable at the marked position ①.

7. Insert the adapter cable at the marked position ②.

Make sure that the connector latch audibly engages.
8. Close the device.
9. Configure the installed hardware RAID adapter card.

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5.4 Operating RAID systems

5.4.5.3 Configuring the hardware RAID system

If you ordered a device with hardware RAID system, the hardware RAID adapter card is
already installed and configured in the delivery state.
If you subsequently install a hardware RAID adapter card, you then need to configure the
hardware RAID system. Proceed as follows for this:
● First set up a RAID system in the firmware of the hardware RAID adapter card (Array
Configuration).
● Then configure the settings of the hardware RAID adapter card (Configure Controller
Settings)

Requirement

Note
For a hardware RAID system, integrate only drives of the type A drive bay.

● The drives required for the RAID system are installed in the device, see:
– RAID1 system: Installation options for drives (Page 67)
– RAID5 system: Installation options for drives (Page 67)
● A hardware RAID adapter card is installed, see "Installing the hardware RAID adapter
card (Page 74)".

Navigation in the firmware of the hardware RAID adapter card

Action Key
• Select entry • Arrow keys on the keyboard

• Confirm selection • <Return> key

Exception: Exception:
– Confirm selection when integrating drives: – <Space> keyboard

• Back to previous window • <Esc> key

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5.4 Operating RAID systems

Setting up the hardware RAID system (Array Configuration)

1. Switch on the device or restart the device.
2. After starting the device, immediately press the <Esc> key and keep it pressed as soon
as the message "Press ESC for boot options" appears.
3. Use the arrow keys of the keyboard to select "Device Management" from the firmware
selection menu and confirm your selection.
4. Select the hardware RAID adapter card "MSCC Smart RAID 3151-4i" in the "Devices
List".
The firmware of the hardware RAID adapter card is open.
Refer to the previous section, "Navigation in the firmware of the hardware RAID adapter
card" for information on selecting and saving settings.
5. Select "Array Configuration".
6. Select "Create Array".
A list of available drives is displayed.
7. Select the drives ① from the list that you want to integrate into your RAID system and
press the Space key.
You can find information on the mounting locations of the drives under "Permissible
expansion for temperature range 0 to 40 °C (Page 100)".

– The integrated drive is given a check mark in the list ②.

– You can find the assignment of the drive to the mounting location in the drive bay in
the entry "Bay:..." ③.
8. Select [Proceed to next Form].
9. Select "RAID Level" and select "RAID1" or "RAID5" in the following selection window,
depending on which RAID system you want to set up.
10.Select [Proceed to next Form].
11.Under "Logical Drive Label", enter a name for your RAID system.
12.Select [Submit Changes] to save your settings.
The message "Logical Drive Creation Successful" is displayed in the next window.
13.Select [Back to Main Menu].

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5.4 Operating RAID systems

Configuring hardware RAID adapter card settings (Configure Controller Settings)

1. After setting up the RAID system, select "Configure Controller Settings" from the main
menu.
2. Select "Modify Controller Settings".
Check or change the values of the following firmware entries:

Firmware entry Value

Configured Physical Drive Write Cache State <Disabled>
Controller Cache <Enabled>

3. Select [Submit Changes] to save your settings.

4. Select [Back to Main Menu].
5. Finish the process by pressing the <ESC> key repeatedly.
6. Select [Exit Descarding Changes]: Yes

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5.4 Operating RAID systems

5.4.5.4 Monitoring the hardware RAID system with "maxView Storage Manager"
Using the " maxView Storage Manager" software, you can monitor your hardware RAID
system and display important information for system diagnostics.
The first time "maxView Storage Manager" is called, Internet Explorer opens and a warning
message is displayed.
Start by installing the security certificate of the website.

Requirement
● 4 GB main memory
● The operating system is restarted.
● The operating system is protected with a user name and password.
● You have administrator rights.

Operating system
● Microsoft® Windows® Server 2016
● Microsoft® Windows®10

Warning message the first time "maxView Storage Manager" is called

1. Open the Internet Explorer.
2. Open "maxView Storage Manager" with the link on your desktop.

A warning message appears about the security certificate of the website.

Install the security certificate.

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5.4 Operating RAID systems

Installing a security certificate

1. For the security certificate warning message, select the option:
"Continue to this website (not recommended)".
2. In the "maxView Storage Manager" login dialog, enter the user name and password of
your Windows login.
"maxView Storage Manager" is open in the Internet Explorer.
The warning symbol and the information about the certificate error appear in the address
line of the Internet Explorer.
3. Click the warning symbol.

4. Click on "Show certificates" in the "Certificate is invalid" warning message.

5. In the "General" tab, click on "Install certificate...".
6. Select "Local computer" as the storage location and confirm your selection with "Next".
7. Confirm the warning message that follows.
8. Select the option "Place all certificates in the following store" and specify the storage
location for the certificate.
9. Select the "Trusted Root Certification Authorities" option and click "OK" > "Next" >
"Finish".
10.Close Internet Explorer and then reopen it.
The certificate is now installed and the "maxView Storage Manager" is set up.
The user interface of "maxView Storage Manager" is now available in Internet Explorer.

Monitoring the hardware RAID system with "maxView Storage Manager"

You can find detailed information on using "maxView Storage Manager" in the user guide for
the software, see "Software and documentation for the hardware RAID system (Page 73)".

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5.4 Operating RAID systems

5.4.6 Data synchronization in the RAID system

NOTICE
Danger of incorrect operations on machine and plant: delayed system reaction during data
synchronization
Data is synchronized if a drive fails.
The system can respond with a delay depending on the size of the drive and system load.
In extreme cases, the execution of keyboard, mouse or touch screen commands may be
briefly delayed.
The result may be faulty operations of the machine or plant.
• Do not operate safety-critical functions during synchronization of a drive. Stable system
statuses are only achieved after successful completion of synchronization.

Duration of data synchronization

The synchronization process may take quite some time, e.g. several hours, with extremely
high drive load even days.
Guide value for the duration of data synchronization:
● < 3 h with 90% HDD system load and RAID5 with HDD 1 TB.
In addition, system performance may be limited in the case of a manually started
maintenance operation until completion of the maintenance phase.

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5.5 Monitoring of the device

5.5 Monitoring of the device

5.5.1 Monitoring functions

You can monitor the following device functions with the SIMATIC DiagBase or SIMATIC
DiagMonitor software:

Monitoring Description Status display and actions

Temperature monitor- • Monitoring of high and low temperature limits and • Status display "TEMP (Page 25)"
ing cable break of the temperature sensors • Closed-loop speed control of the
• For this, temperature sensors record the temperature device fans, the power supply fan
at critical points of the device, e.g. at the processor. and the fan of the optional graphics
• The temperature thresholds are defined for the indi- card
vidual temperature sensors. • Temperature alarm is output.
• With SIMATIC IPC DiagBase or SIMATIC IPC Diag-
Monitor, actions are triggered when the temperature
thresholds are exceeded.
Fan monitoring • Monitoring of underspeed and failure of a fan as well • Status display "FAN (Page 25)"
as cable break of the tachometer cable • Fan alarm is output.
The operation of the fan is monitored at the following
positions:
• Front panel
• Processor
• Triple head graphics card
• Power supply (not redundant)
• Drive cage type A
Watchdog • Monitoring of the system status and message as to • Status display "WATCHDOG
whether a station is still operational. (Page 25)"
• If the watchdog is not operated within a configured Depending on the setting, the following
monitoring time, a watchdog alarm is output. actions are initiated:
• A change to the monitoring time is effective immedi- • Reset on: A hardware reset is car-
ately. ried out
• Reset off: No action is carried out
• The device is restarted.
• The device is shut down.

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5.5 Monitoring of the device

Monitoring Description Status display and actions

Monitoring of the • Monitoring of the charge status of the buffer battery • If a critical or error status occurs, an
voltages (CMOS) alarm is output.
• When the first warning threshold is reached, the • Acoustic alarm for the redundant
backup battery will run for at least 1 more month. power supply
• For the redundant power supply, monitoring is per-
formed to check whether both power inputs are ac-
tive and the power supply fans are operating.
Drive monitoring • Determination of the status of the drives (HDD and • Status display "HDDx ALARM
SSD) with SMART functionality even in RAID sys- (Page 25)"
tems (RAID status) • SMART status of the hard drives
• The status of an inactive hot swap drive is not dis- • The following statuses, for example,
played. are displayed in a RAID system:
"Normal", "OK", "Degraded", error
"Rebuild", rebuilding

Software for device monitoring

You can find information on the monitoring software and its documentation under:
● SIMATIC IPC DiagBase (Page 85) for monitoring and alarm output locally on the device
● SIMATIC IPC DiagMonitor (Page 85) for monitoring and alarm output via the network
SIMATIC DiagBase or SIMATIC DiagMonitor also controls the status displays of the IPC,
see: System status displays (Page 25).

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5.5 Monitoring of the device

5.5.2 SIMATIC IPC DiagBase

If you have ordered your device with a Microsoft® Windows® operating system, the
SIMATIC IPC DiagBase monitoring software is installed.
Information on the software and documentation of SIMATIC IPC DiagBase can be found
under:
● SIMATIC IPC DiagBase
(https://support.industry.siemens.com/cs/ww/de/view/109749690/en)
● Important instructions and manuals for operating the device (Page 11)

5.5.3 SIMATIC IPC DiagMonitor

The SIMATIC IPC DiagMonitor monitoring software can be ordered optionally.
If a device is ordered with SIMATIC IPC DiagMonitor, the software is included with the
device in the delivery state.
Information on the software and documentation of SIMATIC IPC DiagMonitor can be found
under:
● SIMATIC IPC DiagMonitor
(https://support.industry.siemens.com/cs/ww/de/view/39129913/en)
● Important instructions and manuals for operating the device (Page 11)

Note
SIMATIC IPC DiagMonitor only supports the device hardware as of version 5.1.0.
Older versions do not support the device hardware.

See also
Software accessories (Page 33)

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5.6 Remote maintenance of the device

5.6 Remote maintenance of the device

5.6.1 Remote maintenance functions

Remote maintenance of the devices is carried out using Intel® Active Management
Technology (iAMT), which is integrated in the hardware and firmware of the computer, and
with the SIMATIC IPC Remote Manager software.
Through remote access to SIMATIC IPCs, system or program errors can be eliminated,
program updates can be performed and firmware/BIOS settings can be made from a control
room (without on-site presence). Access is possible even if the operating system no longer
starts.
Several remote maintenance functions of iAMT are listed as examples below:

Function Description
Remote operation With KVM Redirection, you can control SIMATIC IPCs remotely even if
(keyboard video mouse they have no operating system or a defective operating system.
redirection) A KVM remote session is always possible with the KVM server integrat-
ed in the firmware. This allows you to restart the IPC and change firm-
ware/BIOS settings remotely.
Remote power manage- SIMATIC IPCs can be turned on and off and restarted from another PC.
ment
IDE redirection An ISO file on the Help Desk PC can be integrated and used on the
SIMATIC IPC as a DVD drive.
An ISO file contains a memory image of the content of a CD or DVD
structured in the ISO 9660 format.
Remote booting A SIMATIC IPC can be booted remotely from a bootable ISO file made
available by another PC.

Requirement
The following requirements must be met for use of the remote maintenance functions:
● A device with a processor with iAMT technology
● A configured management engine (ME)
● The computer must be connected to the power supply system and the network

Configuring iAMT
You configure iAMT with Intel® Management Engine BIOS Extension (MEBx) in the
firmware.
You can find information on this in the detailed firmware/BIOS description, see Important
instructions and manuals for operating the device (Page 11).

Software for remote maintenance of the device

You can find information about the software for remote maintenance of the device and its
documentation under:
● SIMATIC IPC Remote Manager (Page 87)

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5.6 Remote maintenance of the device

5.6.2 SIMATIC IPC Remote Manager

The software for remote maintenance of your SIMATIC IPC Remote Manager device can be
ordered as an option.
You can find information on the software and documentation of SIMATIC IPC Remote
Manager under:
● SIMATIC IPC Remote Manager
(http://support.automation.siemens.com/WW/view/en/48707158)
● Important instructions and manuals for operating the device (Page 11)

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5.7 Trusted Platform Module (TPM)

5.7 Trusted Platform Module (TPM)

Depending on the ordered configuration of your device, a Trusted Platform Module according
to Standard TPM V2.0 may be available. The Trusted Platform Module is a chip that
enhances your device with security functions. This provides an improved protection from
manipulation of the device.

NOTICE
Import restrictions for the Trusted Platform Module
Use of the Trusted Platform Module is subject to legal restrictions in some countries and is
not permitted there.
• Always observe the respective import restrictions of the country in which the device will
be used.

Activate Trusted Platform Modules

You can find information on activating the Trusted Platform Module in the detailed
firmware/BIOS description, see "Important instructions and manuals for operating the device
(Page 11)".

See also
Support for TPM 2.0 (https://support.microsoft.com/en-us/)

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Expanding and assigning parameters to the device 6
6.1 Open the device

WARNING
Risk due to unauthorized opening and improper repairs or expansions
Improper procedure when carrying out expansions may result in substantial damage to
equipment or endanger the user.
If you install or exchange system expansions and damage your device, the warranty
becomes void.
For this reason, please observe the information in "Notes on device and system extensions
(Page 42)".

WARNING
Malfunctions and electric shock
Improper intervention in the device endangers operational reliability and may damage the
device.
The results are personal injuries and damage to the plant.
Take the following precautions:
• Always disconnect the power plug before you open the device.
• Close the device after every intervention.

NOTICE
Electrostatic sensitive devices (ESD)
The device contains electronic components that may be destroyed by electrostatic charges.
This can result in malfunctions and damage to the machine or plant.
Take corresponding precautionary measures before you open the device.

Requirement
● The front door is open; see "Opening the front door (Page 63)".
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● All connection cables are unplugged.
● T10 screwdriver

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6.1 Open the device

Procedure

1. Remove the captive

screw ①.
2. Push the enclosure
cover back.
3. Lift up and remove
the enclosure
cover.

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6.2 Expansion cards

6.2 Expansion cards

6.2.1 Usable expansion cards

Expansion cards that comply with the following standards are supported:
● PCI; Rev 2.3
Expansion cards with 3.3 V and 5 V supply voltage can be operated
● PCIe; Gen. 1, Gen. 2, Gen. 3

See also
Slots for expansion cards on the bus board (Page 182)

6.2.2 Installing expansion cards

Note
Requirements for expansion cards
• You can find the permitted dimensions for expansion cards under "Dimension drawing of
the expansion cards (Page 165)". If the permissible height is exceeded, contact
problems, malfunctions and installation difficulties cannot be ruled out.
• The accessory pack of the device includes three long card retainers for expansion cards
with low overall height. Use these instead of the card retainers installed in the device.
• Long PCI/PCIe expansion cards must be equipped with an extender so that they can be
introduced into the guide rails.
Long expansion cards are only supported in a device with a standard enclosure.
• You can find information on which expansion card you can install in a given slot under
"Slots for expansion cards on the bus board (Page 182)".

Requirement
● You are familiar with the information on expansion cards and the conditions of use of
expansion cards, see "Useable expansion cards (Page 91)".
● The device is open, see important information in "Open the device (Page 89)".

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6.2 Expansion cards

Procedure

1. Loosen the cable holder ③.

2. Hold the bar with the card
retainer ① on both ends and
remove it by pulling it upwards.
The bar is latched on both ends.
3. Remove the slot bracket ④ for the
required slot.
4. Insert the expansion card into the
free slot ⑥.
5. Secure the expansion card with the
screw ⑤.
6. Reinstall the rod with the card
retainer ①.
7. Detach the card retainer in question
and place it on the expansion card in
the slo ⑥.
8. Secure the card retainer with the
locking screw ②.
If you are installing a short
expansion card, remove the locking
screw from the card retainer and
install it in the opposite hole.
If you are installing a low-profile
expansion card, use the longer card
holder for mounting (included in
product package).
9. Secure the cables with the cable
holder ③.
10.Close the device.

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6.2 Expansion cards

6.2.3 Removing expansion cards

Requirement
● The device is open, see important information in "Open the device (Page 89)".

Procedure

1. Loosen the cable holder ④.

2. Hold the latched bar with the card
retainer ① on both ends and
remove it by pulling it upwards.
3. Disconnect all cables and the
screw ② of the expansion card you
wish to remove.
4. Remove the expansion card from the
slot ③.
5. If you do not wish to install a new
expansion card, install the
corresponding slot bracket with the
screw ②.

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6.3 Memory modules

6.3 Memory modules

6.3.1 Usable memory modules

Combination options for memory modules

You can equip each device with 1, 2 or 4 memory modules of the same capacity. It is not
allowed to combine three different memory modules or mix of memory capacities.
This allows you to expand Rack PC memory up to 64 GB, of which you can use approx.
3.2 GB for the operating system and applications in case of 32-bit operating systems.
Depending on the number of memory modules used, these are plugged into defined slots on
the motherboard.
The slots are labeled on the motherboard.

Combination Channel A (external) Channel B Maximum

option expansion
Slot X19 Slot X190 Slot X20 Slot X200
DIMM1-1 DIMM1-2 DIMM2-1 DIMM2-2
Combination 1 4 GB / 8 GB / 16 GB 16 GB
Combination 2 4 GB / 8 GB / 16 GB 4 GB / 8 GB / 16 GB 32 GB
Combination 3 Combinations of three memory modules are not permitted
Combination 4 4 GB / 8 GB / 16 GB 4 GB / 8 GB / 16 GB 4 GB / 8 GB / 16 GB 4 GB / 8 GB / 16 GB 64 GB

Usable memory modules

● DIMM DDR4 memory modules
● Memory transaction rate 2666 MT/sec "unbuffered"
● "without ECC" or "with ECC"

Conditions of use of memory modules

● Memory is operated in dual-channel mode if two modules are installed.
● Only modules of the same module organization 2Rx8 or 1Rx8 may be used per channel.
● If expansion cards with their own memory, such as graphics cards, with 256 MB or more
are used, the memory that can be used for an operating system or applications may be
less than 64 GB.
● Memory modules with ECC and without ECC may not be used in mixed operation.
● Memory module with ECC can only be used in connection with Xeon processor.
● In case of operating errors, it may be sufficient to remove one or two memory modules or
to use a memory module with lower capacity so that the physical memory expansion on
the motherboard and the reserved memory of the expansion card do not overlap.

See also
Open the device (Page 89)

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6.3 Memory modules

6.3.2 Removing memory modules

Requirement
● The device is open, see important information in "Open the device (Page 89)".
● If necessary, the expansion cards may be removed for easier access to the memory
modules, see "Replacing the bus board (Page 143)".

Procedure
1. If you remove several memory modules, remove them one after the other in the following
order:
– Memory module 1: Slot DIMM 1-2
– Memory module 2: Slot DIMM 1-1
– Memory module 3: Slot DIMM 2-2
– Memory module 4: Slot DIMM 2-1
The slots of the memory modules are labeled on the motherboard.
2. Open the two latches at the sides of the memory module evenly. Remove the memory
module from the slot.

3. Close the device.

Display of a changed memory configuration

A new memory configuration is detected automatically. The allocation of the "base memory
and extended memory" is automatically displayed when you switch on the device.

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6.3.3 Installing memory modules

Requirement
● You have noted the information on combination options and the conditions of use of
memory modules under "Usable memory modules (Page 94)".
● The device is open, see important information in "Open the device (Page 89)".
● If necessary, the expansion cards may be removed for easier access to the memory
modules, see "Replacing the bus board (Page 143)".

Procedure
1. If you install several memory modules, install them one after the other in the following
order:
– Memory module 1: Slot DIMM 2-1
– Memory module 2: Slot DIMM 1-1
– Memory module 3: Slot DIMM 2-2
– Memory module 4: Slot DIMM 1-2
The slots of the memory modules are labeled on the motherboard.
2. Remove the memory module from its packaging.
Hold it by the upper edges only.
When inserting the base, note the marked cutout must match up with the coding of the
base.

3. Open the two locks on the left and right of the slot.
4. Insert the memory module in the slot perpendicular to the motherboard.

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5. Evenly press on both sides of the memory module to avoid tilting until the two locks
audibly engage.
The memory module is inserted correctly if less than 1 mm of the gold contacts is visible
evenly across the entire length of the module.
6. Close the device.

Display of a changed memory configuration

A new memory configuration is detected automatically. The allocation of the "base memory
and extended memory" is automatically displayed when you switch on the device.

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6.4 Internal USB interface

6.4 Internal USB interface

Requirement
● The device is open, see important information regarding this under Open the device
(Page 89).
● Optional retainer for locking the internal USB interface, see "Hardware accessories
(Page 30)".
● Screwdriver TX10

Procedure
1. Screw the guide rail of the retainer into place in the enclosure as shown in the figure.
2. Connect the USB stick.
3. Slide the retainer in the direction of the USB stick.
4. Secure the retainer by turning the screw on the guide rail.

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6.5 Graphics card

6.5 Graphics card

You can find information on the requirements of a graphics card under "Technical
specifications of graphic (Page 160)".
You can find information on the slot of the graphics card under "Slots for expansion cards on
the bus board (Page 182)".
Information on graphics cards which support multi-monitoring can be obtained from your
local representative, see "Service and support (Page 195)".

Requirement
● An original spare part
● You have noted down the firmware/BIOS settings, since the configuration data of the
device can be deleted if the expansion card is changed.
You can find information on this in the detailed firmware/BIOS description, see "Important
instructions and manuals for operating the device (Page 11)".

Removing the graphics card

You can find information on removing the graphics card under "Removing expansion cards
(Page 93)".

Installing the graphics card

You can find information on installing the graphics card under "Installing expansion cards
(Page 91)".

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6.6 Drives

6.6.1 Drives in drive cage type A / side panel

6.6.1.1 Permissible expansion for temperature range 0 to 40 °C

Note
Also read the information in Mounting types (Page 47).

You can install the following drives in the Type A drive cage at various mounting locations.
You can find information on the mounting locations under:
● Drive cage type A (Page 17)

Installation options
The following representations give you an overview of the installation options for drives.

① Drive in removable tray via

5.25" adapter
② Drive in removable tray
③ Fan on drive cage type A. The
fan is only required when more
than two drives are installed.
④ Drive type "SATA, SATA En-
terprise and SAS Enterprise" is
possible

⑤ Additional drive mount-

ed on the right side
panel on the drive bay
plate.
⑥ Drive type "SATA,
SATA-Enterprise" is
possible

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Ambient temperature 0 - 40 °C
Drive configuration Mode
Non-RAID system X
RAID1 system X
RAID5 system X
RAID1 system with hot spare drive X
RAID5 system with hot spare drive X

Maximum number of drives per drive type

(in the removable tray or internally on the side panel of the device)

Ambient temperature 0 * - 40 °C
Drive type Front Side panel
SATA (2.5" and 3.5" size) 4 2
SATA Enterprise (2.5" and 3.5" size) 4 2
SAS Enterprise (3.5" size) 4 2

* 0 °C minimum permissible temperature for SATA hard disk drive

5°C minimum permissible temperature for SATA Enterprise hard disk drives

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6.6.1.2 Permissible expansion for temperature range 0 to 50 °C

Note
Also read the information in Mounting types (Page 47).

You can install the following drives in the Type A drive cage at various mounting locations.
You can find information on the mounting locations under:
● Drive cage type A (Page 17)

Installation options
The following representations give you an overview of the installation options for drives.

① Drive in removable tray via

5.25" adapter
② Drive in removable tray
③ Fan on drive cage type A. The
fan is only required when more
than two drives are installed.
④ Drive type "SATA" is possible

④ Drive type "SATA" is

possible
⑤ Additional drive mount-
ed on the right side
panel on the drive bay
plate.

The maximum permitted power loss of the expansion cards is 80 W.

Ambient temperature 0 - 50 °C
Drive configuration Mode
Non-RAID system X
RAID1 system X
RAID5 system X
RAID1 system with hot spare drive X
RAID5 system with hot spare drive X

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Maximum number of drives per drive type

(in the removable tray or internally on the side panel of the device)

Ambient temperature 0 - 50 °C
Drive type Front Side panel
SATA (2.5" and 3.5" size) 4 2
SATA Enterprise (2.5" and 3.5" size) - -
SAS Enterprise (3.5" size) - -

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6.6.1.3 Change 2.5" and 3.5" drive in removable tray

You can find information on the correct mounting location for 2.5" drives and 3.5" drives in
the drive cage in "Permissible expansion for temperature range 0 to 40 °C (Page 100)" and
"Permissible expansion for temperature range 0 to 50 °C (Page 102)".

NOTICE
Risk of damaging the drive and data loss
Drives in the removable drive bays can only be replaced during operation in connection
with RAID1 and RAID5 (hot swap).
When you remove the drive while data is being written to it, you may damage the drive and
destroy data.
• Only remove the removable tray from the device when the drive is inactive, see "Status
displays on removable tray for drives (Page 28)".
• Observe the ESD guidelines.

Requirement
● The device is equipped with the drive cage type A.
● An original spare part, i.e. a drive approved for this device, see notes under "Hardware
accessories (Page 30)".
● If there is no RAID system: The device is fully disconnected from the line voltage, see
"Switching off the device (Page 60)".
● The device you wish to replace is inactive.
● When replacing an HD: T10 screwdriver
● When replacing an SSD: T8 screwdriver

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Procedure
1. Open the front panel (Page 63).
2. Open the lock of the removable tray with the appropriate key.

3. Reach into the notch ① in the bracket of the removable tray and pull out the bracket in
the direction of the arrow up to a slight resistance.

The removable tray is pushed out of the drive cage slightly levering.
4. Now grip the removable tray from the front in the middle at the top and bottom, and pull
the removable tray completely out of the device.
5. Loosen the highlighted screws on the bottom of the removable tray and remove the drive.
The figure on the left shows an HDD as the drive and the figure on the right shows an
SSD.

6. Carefully insert the new drive into the removable tray.

Take care not to touch the contacts of the drive when you do this.
7. Fasten the new drive with the screws to the base of the removable tray.
Only use the original screws.
8. Carefully insert the removable tray into the drive cage of the device again.
9. Fold the tray bracket out of the removable tray as far as it will go and slide the removable
tray fully into the drive cage.
Ensure that the removable tray fits tightly in the drive cage.

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10.Close the tray bracket.

11.Lock the removable tray with the key.

Note
The removable tray must always be locked to ensure reliable operation of the devices
with removable trays.

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6.6.1.4 Installing a 5.25" adapter module for removable trays

You can find information on the correct mounting location for this adapter module can be
found in "Permissible expansion for temperature range 0 to 40 °C (Page 100)" and
"Permissible expansion for temperature range 0 to 50 °C (Page 102)".

Requirement
● The device is equipped with the drive cage type A.
● There is no drive or any other component in the mounting location for 5.25" components.
● An original spare part, that is a 5.25" adapter module approved for this device, see notes
in "Hardware accessories (Page 30)".
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● The device is open, see important information in "Open the device (Page 89)".

Procedure
1. Unlock the drive mounting bar together with the blanking plate by pressing laterally
against the surfaces ① and push the drive mounting bar forward from the device in the
direction of the arrow.

2. Remove the blanking plate.

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3. Push the 5.25" adapter for the removable racks from the front into the drive cage.

4. Attach the data cables to the desired connectors on the motherboard or the hardware
RAID controller and to the adapter module.
5. Connect the power supply.
6. Close the device.

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6.6.1.5 Installing a backplane for removable tray

The backplane is installed from inside at the back end of the drive cage type A and is
equipped with interfaces for data cable to the motherboard.
This enables the convenient connection of the data cables from the motherboard to the drive
in the removable tray at these interfaces.

Requirement
● The device is equipped with the type A drive cage, see "Permissible expansion for
temperature range 0 to 40 °C (Page 100)" and "Permissible expansion for temperature
range 0 to 50 °C (Page 102)".
● An original spare part, that is a backplane approved for this device, see notes in
"Hardware accessories (Page 30)".
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● The device is open, see important information in "Open the device (Page 89)".

Procedure
1. Press the locks ① of the cover ② together inside the device and keep them pressed.

2. Push the locks to the front in the direction of the arrow.

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3. Remove the cover ② upwards at an angle at the front of the device.

4. Remove the blanking plates ③ which may be located to the right of the cover at the front
of the drive cage.
5. Remove all existing removable trays until the drive cage is freely accessible.
6. Insert the backplane ④ into the drive bay from the front and snap it into place at the
back.

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Check the following:

– The backplane lies flat at the back in the drive cage.
– All centering openings ⑤ of the backplane lie in the centering pins.
– The backplane is clipped in behind the latches ⑥.
– All backplanes lie exactly underneath each other, vertically aligned, when viewed from
above ⑦.

7. Reinstall the required blanking plates or removable trays.

8. Insert the cover ② into the front of the device.
9. At the backplane, connect the data cables with the corresponding interfaces on the
motherboard or the hardware RAID controller.
10.Connect the power supply.
11.Close the device.

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6.6.1.6 Changing a backplane for removable tray

The backplane is installed from inside at the back end of the drive cage type A and is
equipped with interfaces for data cable to the motherboard.
This enables the convenient connection of the data cables from the motherboard to the drive
in the removable tray at these interfaces.

Requirement
● The device is equipped with the type A drive cage, see "Permissible expansion for
temperature range 0 to 40 °C (Page 100)" and "Permissible expansion for temperature
range 0 to 50 °C (Page 102)".
● An original spare part, that is a backplane approved for this device, see notes in
"Hardware accessories (Page 30)".
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● The device is open, see important information in "Open the device (Page 89)".

Procedure
1. Note the assignment of all data cables to the motherboard and disconnect all data cables
①.

2. Unlock the backplane by pressing firmly in the direction of the arrow on the latching lugs
② and press the ejector ③.

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3. Remove the unlatched backplane board ④ by turning it upwards from the brackets and
removing it from the drive cage.

See also
Installing a backplane for removable tray (Page 109)

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6.6.2 Drives in drive cage type B / side panel

6.6.2.1 Permissible expansion for temperature range 0 to 40 °C

Note
If the device is permanently installed, mounted on telescopic rails or operated as tower, it
can only be subjected to the vibration stresses described below during operation.
The restrictions do not apply to the use of SSD.
The maximum permitted power loss of the expansion cards is 80 W.

You can install the following drives in the Type B drive cage at various mounting locations.
You can find information on the mounting locations under:
● Drive cage type B (Page 18)

Installation options
The following representations give you an overview of the installation options for drives.

① Drive in drive bay for internal

rugged installation
② Drive type "SATA, SATA-
Enterprise" is possible

If drives are installed in one of the mounting locations, these may be exposed to the
following vibration stresses during operation:
● 10 ... 58 Hz: 0.075 mm
● 58 ... 500 Hz: 5 m/s2

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Vibrations above 500 Hz are not permitted.

③ Additional drive mounted

on the side panel on the
drive bay plate.
④ Drive type "SATA, SATA
Enterprise" is possible

If drives are mounted on the side panel, these may be exposed to the following vibration
stresses during operation:
● 10 .... 58 Hz: 0.045 mm
● 58 ... 300 Hz: 3 m/s²

Ambient temperature 0 - 40 °C
Drive configuration Mode
Non-RAID system X
RAID1 system X
RAID5 system X
RAID1 system with hot spare drive X
RAID5 system with hot spare drive X

Maximum number of drives per drive type

(in drive cage type B or internally on the side panel of the device)

Ambient temperature 0 * - 40 °C
Drive type Front Side panel
SATA 3 2
SATA Enterprise 2 2

* 0 °C minimum permissible temperature for SATA hard disk drive

5°C minimum permissible temperature for SATA Enterprise hard disk drives

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6.6.2.2 Permissible expansion for temperature range 0 to 50 °C

Note
If the device is permanently installed, mounted on telescopic rails or operated as tower, it
can only be subjected to the vibration stresses described below during operation.
The restrictions do not apply to the use of SSD.
The maximum permitted power loss of the expansion cards is 80 W.

You can install the following drives in the Type B drive cage at various mounting locations.
You can find information on the mounting locations under:
● Drive cage type B (Page 18)

Installation options
The following representations give you an overview of the installation options for drives.

① Drive in drive bay for internal

rugged installation
② Drive type "SATA" is possible

If drives are installed in one of the mounting locations, these may be exposed to the
following vibration stresses during operation:
● 10 ... 58 Hz: 0.075 mm
● 58 ... 500 Hz: 5 m/s2

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Vibrations above 500 Hz are not permitted.

③ Additional drive mounted

on the side panel on the
drive bay plate.
④ Drive type "SATA" is pos-
sible

If drives are mounted on the side panel, these may be exposed to the following vibration
stresses during operation:
● 10 ... 58 Hz: 0.045 mm
● 58 ... 300 Hz: 3 m/s2

Ambient temperature 0 - 50 °C
Drive configuration Mode
Non-RAID system X
RAID1 system X
RAID5 system X
RAID1 system with hot spare drive X
RAID5 system with hot spare drive -

Maximum number of drives per drive type

(in drive cage type B or internally on the side panel of the device)

Ambient temperature 0 - 50 °C
Drive type Front Side panel
SATA 3 2
SATA Enterprise - -

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6.6.3 Change 2.5" and 3.5" drive in assembly kit for 5.25" tray
You can find information on the correct mounting location for drives with a assembly kit for
type A drive cage in "Permissible expansion for temperature range 0 to 40 °C (Page 100)"
and "Permissible expansion for temperature range 0 to 50 °C (Page 102)", for type B drive
cage under "Permissible expansion for temperature range 0 to 40 °C (Page 114)" and
"Permissible expansion for temperature range 0 to 50 °C (Page 116)".

NOTICE
Risk of damaging the drive and data loss
When you remove the drive while data is being written to it, you may damage the drive and
destroy data.
• Only remove the removable tray from the device when the drive is inactive, see "Status
displays on removable tray for drives (Page 28)".
• Observe the ESD guidelines.

Requirement
● An original spare part, i.e. an "Assembly Kit HDD/SDD for 5.25" tray" approved for this
device.
● If there is no RAID system: The device is fully disconnected from the line voltage, see
"Switching off the device (Page 60)".
● The device is open, see important information in "Open the device (Page 89)".
● When replacing an HD: T10 screwdriver
● When replacing an SSD: T8 screwdriver

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Procedure
1. Remove all power supply and data cables from the drive.
2. Unlock the drive mounting bar ② together with the drive cover ③ by pressing sideways
against the surfaces ① and push the drive mounting bar forward out of the device in the
direction of the arrow.

3. Remove the left and right drive mounting bars ② and the drive bay cover ③ from the
drive.
Note:
The drive mounting bars are labeled with "L" and "R" and must be remounted in the same
way on the "left" and "right", see corresponding marking on drive bay cover ③.

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4. Loosen the four screws ④ and remove the drive from the drive bay ⑤.

Figure 6-1 Drive bay with HDD

Figure 6-2 Drive bay with SSD

5. Install the new drive in the drive bay ⑤. Ensure that the new drive faces upwards.
6. Fasten the new drive with four screws ④. Start at the hole marked with "1" on the drive
bay.

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7. Attach the left and right drive mounting bars ②.

8. Slide the drive bay evenly into the guide rail of the drive cage 3/4 to the rear without tilting
it left or right.
9. Insert the drive bay cover ③ between the drive mounting bars ②. The pins must lock
into the openings on the left and right.

10.Push the drive bay in fully and evenly on the left and the right until you hear it click into
the drive cage.
11.Connect the power and data cables to the drive.

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6.6.4 Installing a 5.25" drive

You can find information on the correct mounting location for 5.25" drives in a type A drive
cage under "Permissible expansion for temperature range 0 to 40 °C (Page 100)" and
"Permissible expansion for temperature range 0 to 50 °C (Page 102)", for type B drive cage
in "Permissible expansion for temperature range 0 to 40 °C (Page 114)" and "Permissible
expansion for temperature range 0 to 50 °C (Page 116)".

Requirement
● There is no drive or any other component in the mounting location for 5.25" components.
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● The device is open, see important information in "Open the device (Page 89)".
● T10 screwdriver

Procedure
1. Unlock the drive mounting bar together with the blanking plate by pressing laterally
against the surfaces ① and push the drive mounting bar forward from the device in the
direction of the arrow.

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2. Remove the drive mounting bars ③ together with the blanking plate ② from the front
from the mounting location.

3. Remove the left and right drive mounting bars ③ and the blanking plate ②.
Note:
The drive mounting bars are labeled "L" and "R" and have to be installed in the same way
again on the "left" and "right".
4. Screw the right and left drive mounting bars to the new drive.
Take care not to touch the contacts of the drive when you do this. The blanking plate is
no longer required.
5. Push the new drive with the drive mounting bars in the guide rail on the left and right into
the drive cage evenly at the back without tilting until it snaps into place.

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6.6.5 Installing drives inside on the side wall of the device

You can internally mount up to two drives (2.5" and 3.5") on one drive bay plate on the right
side panel of the device (viewed from the front panel).

Requirement
● An original spare part, i.e. a drive bay plate approved for this device with an appropriate
drive.
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● The device is open, see important information in "Open the device (Page 89)".

Procedure
1. Screw the drive to the drive bay plate at the highlighted holes.

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2. Hold the drive support base at the position ① or at the position ② inside on the side
panel of the enclosure.
Then tighten the drive support base from the outside at the marked points.

The SATA connectors are always located at the top ③.

3. Connect the data cables to the desired connectors on the motherboard and on the drive
(position ③).
4. Connect the power supply.
5. Close the device.

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6.6.6 Install M.2 NVMe SSD

Note
An M.2 NVMe SSD cannot be operated in a RAID system.

The M.2 NVMe SSD is plugged onto a PCIe adapter card and then onto the bus board using
this adapter card.

Requirement
● M.2 NVMe SSDs key M with a max. length of 110 mm
● PCIe adapter card
● Cross-tip screwdriver P1

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Procedure
1. Plug the M.2 NVMe SSD at a slight angle from above (see figure) into the direct plug
socket of the PCIe adapter card provided for it.

2. Carefully press down the M.2 NVMe SSD and secure it on the PCIe adapter card with the
screw.

3. Install the PCIe adapter card in the corresponding slot on the bus board.
– Read the information under "Slots for expansion cards on the bus board (Page 182)"
and "Installing expansion cards (Page 91)".

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7.1 Repair information

WARNING
Risk due to unauthorized opening and improper repairs or expansions
Improper procedure when carrying out expansions may result in substantial damage to
equipment or endanger the user.
If you install or exchange system expansions and damage your device, the warranty
becomes void.
For this reason, please observe the information in "Notes on device and system extensions
(Page 42)".

7.2 Maintenance intervals

To maintain high system availability, we recommend the preventative replacement of those
PC components that are subject to wear. The table below indicates the intervals for this
replacement.

Component Replacement interval

Drives 3 years
Backup battery 5 years
Fan 3 years
Filter pad Depending on the degree of soiling

Note
All drives are monitored with the SIMATIC DiagBase or SIMATIC DiagMonitor software on
the basis of their SMART status.
As soon as the Smart status of the SSD goes to "Not OK", a message is generated in
SIMATIC DiagBase or SIMATIC DiagMonitor or during a system start of the device. You
should then back up your data and replace the drive.

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7.3 Removing and installing hardware

7.3 Removing and installing hardware

7.3.1 Changing the filter pad

Requirement
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● The fan cover has been removed; see "Remove the fan cover (Page 131)".
● An original spare part, i.e. a filter pad of the same type.

Procedure
1. Remove the filter pad from the fan cover.
2. Insert the new filter pad into the fan cover. It is inserted loosely in the fan cover. When
you insert the filter pad, make sure it lies evenly in the fan cover.
3. Replace the fan cover.

See also
Maintenance intervals (Page 129)

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7.3 Removing and installing hardware

7.3.2 Replacing device fans

7.3.2.1 Remove the fan cover

Requirement
● The front door is open. Read the information under "Opening the front door (Page 63)".
● Information on the position of the fan cover of the front fan is available under "Front panel
(Page 16)".

Procedure

1. Open the front door at least at an

angle of approx. 45°.
2. Take hold of the recessed grip of
the fan cover ①.
3. Open the fan cover in the
direction of the arrow and remove
it.

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7.3.2.2 Changing the front fan

Requirement
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● The fan cover has been removed; see "Remove the fan cover (Page 131)".
● An original spare part, that is a front fan of the same type.

Procedure
1. Press the locks ① together and keep them pressed.
2. Lift the fan support slightly upwards and remove it to the front from the front of the
enclosure.

3. Put down the fan support with the openings facing down (fan is above).
4. Press on the clip on the small fan cable plug connector ② and remove the connector
from the larger adapter plug,

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7.3 Removing and installing hardware

5. Press on the side of the clips ③ and loosen the adapter plug from the cable holder.
6. Loosen the locking latches ④ of the fan support one after the other at the front and rear
and remove the fan.

7. Loosen the locking latches ⑤ of the holder for the adapter plugs ⑥ and remove the
holder.

8. Take the new fan and place the holder for the adapter plug ⑥ on the new fan as seen in
the figure and snap the holder into place.

9. Then place the new fan on the fan support.

Use the highlighted positions as a guide. Notch in fan support ⑦ and holder for adapter
plug ⑥.
10.Snap the fan into place at the locking latches of the fan support ④.

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7.3 Removing and installing hardware

11.Install the larger adapter plug in the holder for the adapter plug ⑥. Press on the side of
the clips ③ of the larger adapter plug.
12.Insert the small fan cable connector ② in the larger adapter connector again.
13.Place the fan support with the new fan on the front of the device.

See also
Maintenance intervals (Page 129)

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7.3 Removing and installing hardware

7.3.2.3 Change the fan on drive cage type A

This fan is only installed in the removable tray (drive cage type A) for configurations with
RAID and the hard disk type "Enterprise".

Requirement
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● The device is open, see important information in "Open the device (Page 89)".
● The adapter module removable trays is removed, see "Installing a 5.25" adapter module
for removable trays (Page 107)".
● An original spare part, i.e. a fan of the same type.

Procedure
1. Detach the fan cable from the motherboard.
2. Press the upper and lower lock ① on the fan support and remove the fan support from
the drive cage.

The fan holder is labeled as follows:

– At the top with "Top"
– At the bottom with arrows which indicate the direction of rotation and air flow of the
fan.

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3. Put down the fan support as shown.

4. Bend the locking latches ② of the fan support slightly outwards and remove the fan from
the fan support.
5. Place the new fan in the fan support as shown.
6. Guide the fan cable through the cable outlet ③.
7. Finally, snap the new fan completely into place in the locking latches ②.
8. Mount the fan support on the drive cage (see above).
9. Connect the fan cable to the motherboard.

See also
Maintenance intervals (Page 129)

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7.3 Removing and installing hardware

7.3.3 Changing the backup battery

WARNING
Risk of explosion and release of harmful substances
Improper use and handling of lithium batteries can result in an explosion of the batteries.
Explosion of the lithium batteries and the resulting release of harmful substances can cause
severe physical injury. Damaged batteries jeopardize the function of the device.
• Replace spent batteries promptly. See information in "Maintenance intervals
(Page 129)".
• Replace the lithium battery only with an identical battery or types recommended by the
manufacturer.
• Do not throw lithium batteries into fire, do not solder on the cell body, do not recharge,
do not open, do not short-circuit, do not reverse polarity, do not heat above 100 °C and
protect from direct sunlight, moisture and condensation.

Requirement
● An original spare part, i.e. a backup battery of the same type (article number of lithium
battery: A5E00331143)
● You have noted the firmware settings as the configuration data of the device is deleted
when the battery is replaced
You can find information on this in the detailed firmware/BIOS description, see "Important
instructions and manuals for operating the device (Page 11)".
● The device is open, see important information in "Open the device (Page 89)".
● You have observed the local regulations relating to the disposal of used batteries.

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7.3 Removing and installing hardware

Procedure
1. Remove the expansion cards, if necessary. You can find information on this under
"Removing expansion cards (Page 93)".
2. Remove the battery from socket.

3. Press the new battery into the socket applying slight pressure.
4. Close the device.
5. Check the firmware settings.

See also
Hardware accessories (Page 30)

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7.3 Removing and installing hardware

7.3.4 Changing a single power supply (AC)

Note
Conversion from a single power supply (AC) to a redundant power supply (AC) and vice
versa is not possible.

Requirement
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● The device is open, see important information in "Open the device (Page 89)".
● An original spare part, i.e. a single power supply of the same type.
● T10 screwdriver
● Diagonal cutter

Procedure
1. Disconnect the cables from the drives and the motherboard.
2. Remove the cable ties securing the power cables in the enclosure.
3. Remove the four fixing screws that are marked in the figure below.

4. Pull the power supply upward and out of the housing.

5. Install the new power supply.
6. Fasten the power supply with the screws shown.
7. Connect the cables to the drives and the motherboard.
8. Use cable ties to reattach the power supply cables to the enclosure.
9. Close the device.
10.Check the safe state of the device.
11.Switch on the power supply.

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7.3 Removing and installing hardware

7.3.5 Replacing redundant power supply (AC) module

If a module of the redundant power supply is defective, you can continue to operate the
device until the device can be shut down in a controlled manner.
The replacement of one of the two modules of the redundant power supply can be performed
without shutting down the device.

Requirement
● An original spare part, i.e. a module of the redundant power supply of the same type.
● Cross-tip screwdriver P1

Procedure

1. Use the status display ① to determine which module is defective (status display at the
top of the module is lit red or is not lit).
2. Switch off the defective module using the on/off switch ②.
3. Disconnect the defective module from the line voltage, see "Switching off the device
(Page 60)".
To do so, unplug the power cord from the socket ③ of the defective module.
4. Remove the highlighted screw of the defective module ④.
5. Pull out the defective module at the handle.
6. Install the new module and fasten it with the previously loosened screw.
7. Plug the power cord into the socket of the newly inserted module ③.
8. Check the safe state of the device.
9. Switch on the module again with the on/off switch ② (status display on top of module is
lit green).

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7.3 Removing and installing hardware

7.3.6 Changing the enclosure of the redundant power supply (AC)

Note
Conversion from a single power supply (AC) to a redundant power supply (AC) and vice
versa is not possible.

Requirement
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● The device is open, see important information regarding this under "Open the device
(Page 89)".
● An original replacement part, i.e. the enclosure of a redundant power supply of the same
type.
● Both modules of the redundant power supply are removed, see "Replacing redundant
power supply (AC) module (Page 140)".
● Short Phillips screwdriver P1

Procedure
1. Remove the cable ties securing the power cables in the enclosure.
2. Disconnect the cables from the drives and the motherboard.
3. Unscrew the marked screw ① inside the device enclosure.

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7.3 Removing and installing hardware

4. Unscrew the screws at the 4 marked positions on the inside of the redundant power
supply enclosure.

5. Remove the housing of the redundant power supply from the back of the device.
6. Install the new enclosure and secure it at the appropriate places.
7. Re-insert the two modules of the redundant power supply and close the device.

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7.3 Removing and installing hardware

7.3.7 Replacing the bus board

Requirement
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● The device is open, see important information in "Open the device (Page 89)".
● T10 screwdriver

Procedure - Removal

1. Remove the expansion cards from

the slots, see "Removing expansion
cards (Page 93)".
2. Pull all connectors out of the bus
board.
3. Remove the screws marked in the
figure.
4. Pull the bus board from the mother-
board.

Procedure - Installation
Proceed in the reverse order for the installation.

See also
Bus board (Page 182)

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7.3 Removing and installing hardware

7.3.8 Replacing the processor

Requirement
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● The device is open, see important information in "Open the device (Page 89)".
● An original spare part, i.e. a processor of the same type.
Only an approved processor is permitted to be installed on the motherboard.

NOTICE
Damage to the processor
If the processor is operated with a higher clock frequency than permitted, it can be
destroyed or cause loss of data.
• Operate the processor only at a clock frequency that is equal to or less than the
permitted clock frequency.

Procedure
1. Remove the bus board, see "Replacing the bus board (Page 143)".
2. Remove the heat sink of the processor.
3. Unlock the socket and lift the socket cover.

4. Remove the processor.

5. Place the new processor in the socket.
During positioning, make sure to take the highlighted arrow on the processor into
consideration.
6. Lock the processor in place.
7. Install the heat sink of the processor again.
8. Install the bus board again.

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7.3 Removing and installing hardware

7.3.9 Replacing the motherboard

Requirement
● The device is fully disconnected from the line voltage, see "Switching off the device
(Page 60)".
● The device is open, see important information in "Open the device (Page 89)".
● An original spare part, that is a motherboard of the same type, see notes in "Hardware
accessories (Page 30)".
The motherboard as spare part is supplied without processor and memory modules.
● You have noted the firmware settings as the configuration data of the device is deleted
when the motherboard is replaced.
You can find information on this in the detailed firmware/BIOS description, see "Important
instructions and manuals for operating the device (Page 11)".
● Hexagon bolt screwdriver for COM1 interface and DVI-D interface
● Hexagon bolt screwdrivers (5 mm and 5.5 mm) for hexagon bolts on which the bus board
is placed and fastened
● Screwdriver T10 for fixing screws of the motherboard

Procedure
1. Remove the following components one after the other:
– The expansion cards from the slots, see "Removing expansion cards (Page 93)".
– The bus board, see "Replacing the bus board (Page 143)".
– The heat sink of the processor, see "Replacing the processor (Page 144)".
2. Note the assignment of all lines to the motherboard, and then remove all cables from the
motherboard.
3. Unscrew the hexagon bolts of the COM1 port and the DVI-D port on the back of the
device, see "Interfaces (Page 20)".
4. Unscrew the hexagon bolts on which the bus board was placed and fastened, and
remove the other fixing screws of the motherboard.
5. Remove the motherboard and insert a new one.
6. Fasten the COM1 interface and the DVI-D interface with the previously released hexagon
bolts.
7. Fasten the new motherboard with the previously loosened hexagon bolts and fixing
screws.
8. Reconnect the cables at the correct positions on the motherboard.

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7.3 Removing and installing hardware

9. Install the following components one after the other:

– Heat sink of the processor
– Bus board
– Expansion cards, see "Installing expansion cards (Page 91)".
10.Update the firmware settings to match the version of the motherboard. Please note during
the update whether you are operating a device with or without a RAID system.

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7.4 Installing operating system, software and drivers

7.4 Installing operating system, software and drivers

7.4.1 Restoring or installing the operating system

Information on restoring or reinstalling the operating system you ordered with the device can
be found in the detailed operating system description, see "Important instructions and
manuals for operating the device (Page 11)".

7.4.2 Installing software and drivers

On the supplied USB stick (read only), you will find the "Documentation and Drivers" suite
which you can use to install all supplied software and drivers.

Procedure
1. Insert the provided USB stick into the device.
2. Start the "Documentation and Drivers" suite from the USB flash drive by executing the
"START_DocuAndDrivers.CMD" file.
3. Install the desired software and drivers.

7.5 Configuring firmware/BIOS

You can find information on configuring firmware/BIOS and on the firmware settings in the
delivery state in the "Firmware/BIOS description
(https://support.industry.siemens.com/cs/ww/en/view/109760621)".

Note
If your IPC does not boot, for example because a BIOS update crashed, contact your local
SIEMENS representative.

You can find information on "BIOS Recovery" and "ME Update" under "Pin assignment of the
internal interfaces (Page 173)".

7.6 Backing up data and changing partitions

We recommend the "SIMATIC IPC Image & Partition Creator" software to back up data
under Windows®, which supports the hardware of the device as of version 3.5.3.
You will find detailed information on this software in: "SIMATIC IPC Image & Partition
Creator (https://support.industry.siemens.com/cs/ww/en/view/21766418)".

7.7 Recycling and disposal

The devices described in these operating instructions can be recycled thanks to their low
level of pollutants. Contact a certified disposal service company for electronic scrap for
environmentally sound recycling and disposal of your old device, and dispose of it according
to the relevant regulations in your country.

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Technical specifications 8
8.1 Applicability of technical specifications

Note
The following technical specifications only apply under the following conditions:
• The device is in good working order.
• The fan cover and filter pad are installed.
• The device is closed.
• The connected I/O devices meet the requirements for the respective area of application
(interference emission according to EN 61000-6-3 / IEC 61000-6-3, immunity to
interference according to EN 61000-6-2 / IEC 61000-6-2).

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8.2 General technical specifications

8.2 General technical specifications

See the note in "Applicability of technical specifications (Page 149)".

Article number 6AG4114-3...-.... (for details, refer to the ordering documentation)

Dimensions 481.4 x 176.6 x 446.6 (W × H × D in mm)
Detailed dimensional specifications can be found in "Dimension drawing of the device
(Page 163)".
Weight 15 up to 23 kg; depending on the equipment
Supply voltage (UN) Single power supply: 100 V AC to 240 V AC (-15%; +10%)
Redundant power supply: 2 × 100 V AC to 240 V AC (-15%; +10%)
Input current Single power supply:
• Continuous current at 100 V: ≤ 6 A
• Continuous current at 230 V: ≤ 3 A
• At startup ≤ 80 A for 3.6 ms
Redundant power supply:
• Continuous current at 100 V: ≤ 5 A
• Continuous current at 230 V: ≤ 2.5 A
• At startup ≤ 80 A for 3.6 ms for each module
Information on the dimensioning of fuses in higher-level system circuits
A fuse that is designed for a typical tripping current of 6.3 A is integrated in the power
supply unit of the IPC. The pulse currents during startup are also taken into account
by the "time lag" type. In the case of a fault, this fuse ensures the correct disconnec-
tion of the device from the power supply system.
It is recommended that a fuse of at least 6.3 A, plus the power demand of the other
devices that are also supplied via this circuit, be used for protection of the higher-
level power supply circuit. The tripping characteristic of the higher-level protection
must take into account the starting currents of both the IPC and the other devices.
Frequency of the supply voltage 50 to 60 Hz, min. 47 Hz to max. 63 Hz, sinusoidal
Power consumption with maximum Single power supply ≤ 290 W with 89% efficiency
configuration and 255 W secondary Redundant power supply ≤ 290 W with 88% efficiency
Power loss, heat emission Single power supply: 290 W = 290 J/s = 0.27 BTU/s
Redundant power supply: 290 W = 290 J/s = 0.27 BTU/s
Current output (DC) Single power supply:
• +5 V/25 A, +3.3 V/20 A

190 W permitted in total

• +12 V1/14 A, +12 V2/11 A
• -12 V/0.1 A, +5 Vaux/2 A
Redundant power supply:
• +5 V/20 A, +3.3 V/20 A

100 W permitted in total

• +12 V1/16 A, +12 V2/16 A
• -12 V/0.5 A, +5 Vaux/3 A
The total power of all voltages may not exceed 255 W.

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8.2 General technical specifications

Noise emission • < 55 dB(A) at 25 °C according to DIN EN ISO 7779

all drives in operation, high load on CPU
• < 45 dB(A) at 25 °C according to DIN EN ISO 7779
all drives in operation, low load on CPU
• < 35 dB(A) at 25 °C according to DIN EN ISO 7779
Fan profile silent, idle desktop, drives are not active, standard AC power supply
Degree of protection • IP 41 (front) with closed front door 1
• IP 20 on the rear according to EN 60529
Dust protection With closed front door
Filter class G2 EN 779; particles > 0.5 mm are 99% retained
Safety
Protection class Protection class I compliant with IEC 61140
Degree of pollution Device is designed for environments with pollution degree 2
Transient overvoltage Device is designed for connection to supply with overvoltage category II (transient
overvoltages up to 2500 V)
Safety regulations • IEC 61010-2-201
• EN 61010-2-201
• UL 61010-2-201
• CSA C22.2 No 61010-2-201

1Only with protected installation, see "Notes on ambient and environmental conditions
(Page 39)"

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8.3 Current/power requirements and power supply

8.3 Current/power requirements and power supply

8.3.1 Current and power requirements of the system components

Maximum current values

Component Voltage
+3.3 V +5 V +12 V +12 V2 -12 V 5 Vaux
Motherboard Core i3 processor 1.53 A 3.44 A 1.3 A 3.3 A 0A 0.28 A
with cooling 1
Motherboard Core i5 /i7 proces- 1.53 A 3.44 A 1.3 A 5A 0A 0.28 A
sor with cooling 1
Motherboard Xeon processor 1.53 A 3.44 A 1.3 A 7.5 A 0A 0.28 A
with cooling 1
SSD SATA (typical) 0.8 A
Hard disk drive 1 SATA (typical 0.6 A 0.3 A
values)
Hard disk drive 1 SATA type 0.5 A 0.7 A
Enterprise (typical values)
M.2 NVMe SSD 2.24 A
Internal fan 0.25 A
Triple Head graphics card 3.3 A 1.5 A
Single currents AC, max. permit- 20 A 2 25 A 2 14 A 11 A 0.1 A 2.0 A 3
ted
Single currents AC redundant, 20 A 2 20 A 2 16 A 16 A 0.5 A 3.0 A
max. permitted
Total power consumption, per- 255 W
missible
Efficiency of the simple power Approx. 88% (230 V AC), approx. 88% (120 V AC)
supply 1
Efficiency of the redundant pow- Approx. 89% (230 V AC), approx. 87% (120 V AC)
er supply 1
1 Depends on the selected device configuration
2 The accumulated power of the +5 V and + 3.3 V voltage may not exceed 190 W with ATX power
supply and 100 W with ATX redundant.
3 2.5 A for 10 seconds

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8.3 Current/power requirements and power supply

Typical power values

Component Current consumption Power consumption

(AC-SV, U=230 V)
Base device Core i3 0.39 A 89 W
Base device Core i3 SATA En- 0.43 A 97 W
terprise
Base device Core i5/i7 0.46 A 103 W
Base device Core i5/i7 SATA 0.48 A 109 W
Enterprise
Base device Xeon 0.53 A 120 W
Base device Xeon SATA Enter- 0.56 A 126 W
prise
1 × hard disk drive SATA 0.03 A 7.3 W
2 × hard disk drives SATA 0.07 A 14.7 W
3 × hard disk drives SATA 0.1 A 22.0 W
1 × hard disk drive SATA/SAS 0.05 A 12.1 W
type Enterprise
2 × hard disk drives SATA/SAS 0.11 A 24.2 W
type Enterprise
3 × hard disk drives SATA/SAS 0.16 A 36.3 W
type Enterprise
1 × SSD 2.5" drive SATA 0.02 A 3.6 W
1 x M.2 NVMe SSD 0.03 A 5.9 W
Triple Head graphics card 0.14 A 32.8 W
Hardware RAID controller 0.07 A 15 W

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8.3 Current/power requirements and power supply

8.3.2 Technical specifications of single power supply (AC)

Output voltage

Voltage Maximum current Voltage stability

+12 V 11 A ± 5%
+12 V 14 A ± 5%
–12 V 0.1 A ± 10%
+5 V 25 A 1 ± 5%
+3.3 V 20 A 1 ± 5%
+5 Vaux 2A 2 +5%, -3%

1 The total output of the +5 V and +3.3 V voltage must be ≤ 190 W.

2 2.5 A for 10 seconds
The total power of all voltages is max. 400 W.

8.3.3 Technical specifications of redundant power supply (AC)

Output voltage

Voltage Maximum current Voltage stability

+12 V 16 A 2 ± 5%
+12 V 16 A 2 ± 5%
–12 V 0.5 A ± 10%
+5 V 20 A 1 ± 5%
+3.3 V 20 A 1 ± 5%
+5 Vaux 3.0 A +5%, -3%

1 The total output of the +5 V and +3.3 V voltage must be ≤ 100 W.

2 The total current of the +12 V voltage must be ≤ 25 A.
The total power of all voltages is max. 350 W.

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8.4 Electromagnetic compatibility

8.4 Electromagnetic compatibility

See the note in "Applicability of technical specifications (Page 149)".

Interference emission EN 61000-6-3; EN 61000-6-4

CAN/CSA CISPR22 Class B, EN 55032 Class B; FCC Class A; KN 32 Class B
EN 61000-3-2 class D, EN 61000-3-3
Immunity to interference EN 61000-6-1; EN 61000-6-2; KN 35
Interference immunity on power ± 2 kV; according to IEC 61000-4-4; burst
lines ± 1 kV; according to IEC 61000-4-5; surge symm
± 2 kV; according to IEC 61000-4-5; surge symm
Noise immunity on signal lines ± 2 kV; according to IEC 61000-4-4; burst; length > 3 m
± 1 kV; according to IEC 61000-4-4; burst; length < 3 m
± 2 kV; according to IEC 61000-4-5; burst; length > 30 m
Immunity to discharges of static ± 6 kV contact discharge (according to IEC 61000-4-2)
electricity ± 8 kV air discharge; (according to IEC 61000-4-2)
Immunity to RF interference • 10 V/m; 80 up to 2700 MHz

80% AM to IEC 61000-4-3

• 3 V/m; 2.7 to 6 GHz

80% AM to IEC 61000-4-3

• 10 V; 10 kHz up to 80 MHz
80% AM to IEC 61000-4-6
Magnetic field 100 A/m; 50 Hz; 60 Hz (according to IEC 61000-4-8)

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8.5 Ambient conditions

8.5 Ambient conditions

See the note in "Applicability of technical specifications (Page 149)".

Climatic ambient conditions

Temperature Tested according to IEC 60068-2-2; IEC 60068-2-1; IEC 60068-2-14
Operation +0 °C up to +50 °C 1
Gradient: ≤ 10 K/h; no condensation
Storage/transport –20 °C up to +60 °C
Gradient: ≤ 20 K/h; no condensation
Relative humidity Tested according to IEC 60068-2-78; IEC 60068-2-30
Operation 5% up to 85% at 30 °C; no condensation
Gradient: ≤ 10 K/h; no condensation
Storage/transport 5% up to 95% at 25 °C to 55 °C; no condensation
Gradient: ≤ 20 K/h; no condensation
Atmospheric pressure
Operation 1080 up to 689 hPa,
corresponds to an altitude of –1000 m to 3000 m
Storage/transport 1080 up to 660 hPa,
Corresponds to an altitude of -1000 m to 3500 m
Mechanical ambient conditions
Vibration Tested according to IEC 60068-2-6; 10 cycles
Operation 2 10 to 58 Hz: 0.0375 mm, 58 Hz to 500 Hz: 4.9 m/s2
Storage/transport 5 up to 8.51 Hz; amplitude 3.5 mm; 8.51 up to 500 Hz: 9.8 m/s2
Resistance to shock Tested in accordance with IEC 60068-2-27
Operation 2 Half-sine: 50 m/s2, 30 ms, 100 shocks per axis
Storage/transport Half-sine; 250 m/s2; 6 ms; 1000 shocks per axis
Special features
Quality assurance In accordance with ISO 9001

1 Limits depend on the device equipment:

At +5 °C up to +40 °C without restriction; for information for extended ambient tempera-
ture for type A drive cages see "Permissible expansion for temperature range 0 to 40 °C
(Page 100)" and "Permissible expansion for temperature range 0 to 50 °C (Page 102)"
and for type B drive cages see "Permissible expansion for temperature range 0 to 40 °C
(Page 114)" and "Permissible expansion for temperature range 0 to 50 °C (Page 116)".
2 The device must be free of any mechanical faults when disk drives are installed in the
removable tray.

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8.6 Technical specifications of the drives

8.6 Technical specifications of the drives

See the note in "Applicability of technical specifications (Page 149)".
Information on the drives is available in your order documents.

Maximum number 6 (depends on the selected configuration)

HDD HDD types (Native Command Queuing is supported):
• 3.5" SATA, 6 GB/s; 1000 GB
• 3.5" SATA, Enterprise, 6 GB/s; 1000 GB and 2000 GB
• 3.5" SAS, Enterprise, 6 GB/s; 2000 GB
SSD SSD types (flash memory):
• 2.5" SATA, 6 GB/s; 480 GB
• 2.5" SATA, 6 GB/s; 960 GB
M.2 NVMe SSD M.2-2280 key M, PCIe Gen3 x4 *; 512 GB and 1024 GB

* You can find the maximum theoretical data rate of a PCIe lane in the technical specifications of the device

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Technical specifications
8.7 Technical specifications of the motherboard

8.7 Technical specifications of the motherboard

See the note in "Applicability of technical specifications (Page 149)".

Chipset Intel® GL82 C246 PCH

Processor • Intel® Core i3-8100 *

4C/4T, 3.6 GHz, 6 MB cache

• Intel® Core™ i5-8500
6C/6T, 3.0 (4.1) GHz, 9 MB cache, iAMT
• Intel® Core™ i7-8700
6C/12T, 3.2 (4.6) GHz, 12 MB cache, iAMT
• Intel® Xeon® Processor E-2176G
6C/12T, 3.7 (4.7) GHz, 12 MB cache, iAMT
RAID (on-board) Intel® PCH with Intel® Rapid Storage Technology
Slots for memory modules 4 x DIMM slots for DDR4 2666, expandable to 64 GB
Main memory 4 up to 64 GB, DDR4 SDRAM PC4-2666T
Max. of 3.2 GB can be used for 32-bit versions of operating system and applications;
see order documents for equipment
Power consumption per PCI slot, • 5 V / 5 A or 3.3 V / 7 A
maximum permitted
• 12 V / 0.5 A
• 3.3 Vaux / 0.4 A
Power consumption per PCIe slot • 3.3 V / 3 A
with x4 expansion card, maximum
• 12 V / 2.1 A
permitted
• 3.3 Vaux / 0.4 A
Power consumption per PCIe slot • 3.3 V / 3 A
with x16 expansion cards, max.
• 12 V / 2.1 A
permissible
• 3.3 Vaux / 0.4 A
Power loss per slot with max. am- ≤ 30 W
bient air temperature 50 °C, per-
missible
Power loss of all slots with max. ≤ 80 W
ambient air temperature 50 °C, In sum, the current for 3.3 Vaux may not exceed 1.2 A.
permissible

* Main memory interface 2400 MT/s

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8.7 Technical specifications of the motherboard

Expansion cards

Expansion card slots Bus board variant 1 with 9 expansion slots:

• 7 × PCI
• 2 × PCIe x16 (8 lanes); Gen 3.0
Bus board variant 2 with 11 expansion slots:
• 3 × PCI
• 1 × PCIe x16 (8 lanes); Gen 3.0*
• 2 × PCIe x16 (4 lanes); Gen 3.0*
• 1 x PCIe x16 (4 lanes); Gen 3.0**
• 2 × PCIe x16 (4 lanes, via PCIe switch); Gen 3.0**
• 2 x PCIe x4 (4 lane, via PCIe switch); Gen 3.0**
Bus board variant 3 with 11 expansion slots:
• 3 × PCI
• 1 × PCIe x16 (16 lanes); Gen 3.0*
• 1 x PCIe x16 (4 lanes); Gen 3.0**
• 2 x PCIe x16 (1 lane); Gen 3.0**
• 2 × PCIe x16 (4 lanes, via PCIe switch); Gen 3.0**
• 2 x PCIe x4 (4 lanes, via PCIe switch); Gen 3.0**
* PCIe bus of the CPU
** PCIe bus of the PCH

For information on this, see "Slots for expansion cards on the bus board (Page 182)".

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Technical specifications
8.8 Technical specification of the hardware RAID adapter card

8.8 Technical specification of the hardware RAID adapter card

See the note in "Applicability of technical specifications (Page 149)".

Controller • SAS Hardware RAID Controller, PCIe x8, RAID 1, 5

• Type: Microsemi ASR3151-4i (independent processor, 1024 MB DDR3 cache)
Adapter • 1 × Mini SAS HD adapter (SFF-8643 for 4 drives)
Maximum theoretical controller • 12 Gbps per port
data rate
Memory • Maintenance-free buffer unit for onboard cache memory

8.9 Technical specifications of graphic

See the note in "Applicability of technical specifications (Page 149)".

Graphic controller • Intel® UHD Graphics 630 (GT2)

integrated in processor:
Intel® Core™ i3-8100

Intel® Core™ i5-8500

Intel® Core™ i7-8700
• Intel® UHD Graphics P630 (GT2)
integrated in processor:
Intel® Xeon® Processor E-2176G
Graphics memory Dynamic Video Memory Technology, uses 32 MB in main memory
Resolutions/frequencies/colors • DVI up to 1920 × 1200 pixels at 60 Hz; color depth up to 32-bit/pixel
• DisplayPort up to 4096 × 2304 pixels at 60 Hz; color depth up to 32-bit/pixel
• VGA (VGA via DP to VGA adapter) up to 2560 × 1600 pixels at 60 Hz; color
depth up to 32 bits/pixel
Graphics card (optional) PCIe x16; triple head
You can find information on connection options for monitors with adapters under
"Connecting I/O devices (Page 55)".
• Type: Quadro P400, 2 GB graphics memory
• Maximum resolution:
– 3x DisplayPort 4096 x 2160 at 60 Hz; 32-bit color depth or
– 1x DisplayPort 5120 × 2880 at 60 Hz; 32-bit color depth
– DVI 1920 × 1200 at 60 Hz; 32-bit color depth
– VGA 2048 × 1536 at 60 Hz; 32-bit color depth

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8.10 Technical specifications of the interfaces

8.10 Technical specifications of the interfaces

Observe the information in "Applicability of technical specifications (Page 149)" and use only
original connections of the I/O to be connected.

COM 1 Serial interface 1 (V.24); 9-pin SUB-D socket

COM 2 (optional) Serial port 2 (V.24), 9-pin SUB-D socket
DisplayPort V1.2 1 2 x connection of a digital monitor
DVI-D Connection of a digital monitor with DVI interface
3 × Mini DisplayPort with triple Connection of three digital or analog monitors using adapter cable for DPP, DVI or
head graphics card (optional) VGA
USB 3.1 Gen 2, Type A USB 3.1 SuperSpeed+ backward compatible with USB 3.0/2.0/1.1
• Back of device:
4 × 900 mA / high current 2
USB 3.1 Gen 2, Type C 3 USB 3.1 Gen 2 / Gen 1, 3.0/2.0/1.1
• Back of device:
2 × 1500 mA / high current 2
USB 3.1 Gen 1 (USB 3.0 old), USB 3.1 SuperSpeed backward compatible with USB 3.0/2.0/1.1
Type A
• Front of device:
2 × 900 mA / high current 2
Ethernet 3 × Ethernet interface (RJ45), 10/100/1000 Mbps
1 x Ethernet 1: Intel® Jacksonville i219-LM
• AMT-capable4
2 x Ethernet 2, 3: Intel® Springville i210-AT
Wake on LAN, Remote Boot and the Teaming modes are supported:
• Adapter Fault Tolerance (AFT)
• Adaptive Load Balancing (ALB)
• IEEE 802.3ad Dynamic Link Aggregation (DLA)
• Static Link Aggregation (SLA)
• Switch Fault Tolerance (SFT)
Audio Realtek ALC255, 6-channel DAC support
• Micro
• Line In
• Line out: 2 W at 4 Ω

1 An analog monitor can be used with an adapter cable (optional).

2 In total ≤ 3 A
3 Maximum cable length must be less than 3 m.
The maximum cable length is determined by the attenuation of the cable and the maximum data rate of the connection.
Use the original connections of the I/O to be connected without adapters or extensions.
4 AMT and teaming cannot be used simultaneously on the Ethernet interface.

See also
Dimension drawing of the device (Page 163)

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Technical specifications
8.11 Technical specifications of the telescopic rails

8.11 Technical specifications of the telescopic rails

Ultimate load per pair ≥ 30 kg

Full extraction length ≥ 470 mm
Rail thickness ≤ 9.7 mm
Mounting screws M5 x 6 mm
The mounting screws of the telescopic rails may not protrude by more than 5 mm into
the enclosure.

See also
Dimension drawing of the telescope rails (Page 166)

8.12 Technical specifications of the operating systems

Depending on the ordered device configuration, the device is equipped with or without one of
the following installed operating systems.
● Microsoft® Windows® 10 Enterprise 2016 LTSB, 64-bit, Multi-Language*
● Microsoft® Windows® Server 2016 Standard Edition incl. 5 Clients, 64-bit, Multi-
Language*
*Multi-Language User Interface (MUI): 5 languages (English, German, French, Spanish,
Italian)
You can find information on ordered Microsoft® Windows® operating systems under:
Important instructions and manuals for operating the device (Page 11).

Boot mode and partitions in the delivery state

Delivery state for Windows® 10 and Windows® Server 2016
In the delivery state, Windows® 10 and Windows® Server 2016 boot in UEFI mode.
The following table lists the partitioning for data storage media ≥ 200 GB in GPT mode:

Partition Name Size File system

First Boot 260 MB FAT32
Second MSR 128 MB None
Third System 160 GB NTFS, not compressed
Fourth WinRE 500 MB NTFS, not compressed
Fifth Data Remainder NTFS, not compressed

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Dimension drawings 9
9.1 Dimension drawing of the device

Note
IEC 60297-3-100
The systems meets the requirements for 4 HE according to IEC 60297-3-100.

Front view and top view

1) At top when installed vertically. All dimensions in mm.

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Dimension drawings
9.2 Dimension drawing of the Tower Kit

9.2 Dimension drawing of the Tower Kit

Front view and top view

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 Dimension drawings
9.3 Dimension drawing of the expansion cards

9.3 Dimension drawing of the expansion cards

①L Length of expansion card

Device with standard enclosure: 312

All dimensions in mm
The figure below shows the maximum size of the PCI/PCI Express expansion card that can
be installed, without slot bracket and retainer.

PCI PCIe Meaning

DIM A 106.68 mm 111.15 mm Lower edge of expansion card to upper edge of module
DIM B 111.94 mm 116.4 mm Lower edge of expansion card to lower edge of retainer
DIM C 113.44 mm 117.9 mm Lower edge of expansion card to retainer
DIM D 123.54 mm 128.0 mm Lower edge of expansion card to bottom of device cover

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Dimension drawings
9.4 Dimension drawing of the telescope rails

9.4 Dimension drawing of the telescope rails

Dimensions for bore holes for telescopic rails

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Standards and approvals 10
10.1 CE marking
The device meets the general and safety-related requirements of the following directives and
conforms to the harmonized European standards (EN) published in the official gazettes of
the European Union:
● 2014/30/EU "Electromagnetic Compatibility Directive" (EMC Directive)
The device is designed for the following areas of application corresponding to the CE
marking:

Area of application Requirement for

Interference emission Immunity to interfer-
ence
Industry EN 61000-6-4 EN 61000-6-2
Residential and commercial areas and small EN 61000-6-3 EN 61000-6-1
businesses

The devices are compliant with EN 61000-3-2 (Transient currents) and EN 61000-3-3
(Voltage fluctuation and Flicker).
● 2014/35/EU "Electrical equipment for use within specific voltage limits" (Low-Voltage
Directive)
Conformance with this standard has been verified according to EN 61010-2-201.
● 2011/65/EU "Restriction of the use of certain hazardous substances in electrical and
electronic equipment" (RoHS Directive)

EC Declaration of Conformity
The associated declaration of conformity is available on the Internet at the following address:
Rack PC certificates
(http://support.automation.siemens.com/WW/view/en/10805674/134200).

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Standards and approvals
10.2 DIN ISO 9001 certificate and software license agreements

10.2 DIN ISO 9001 certificate and software license agreements

ISO 9001 certificate

The Siemens quality management system for our entire product creation process
(development, production and sales) meets the requirements of ISO 9001.
This has been certified by DQS (the German society for the certification of quality
management systems).

Software license agreements

If the device is supplied with preinstalled software, you must observe the corresponding
license agreements.

10.3 UL approval
The following approvals are available for the device:
● Underwriters Laboratories (UL) in accordance with Standard UL 61010-2-201 Second
Edition, File E115352 (I.T.E)
● Canadian National Standard CAN/CSA-C22.2 No. 61010-2-201 Second Edition

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10.4 FCC (USA)

10.4 FCC (USA)

USA
Federal Commu- This equipment has been tested and found to comply with the limits for a Class
nications Commis- A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed
sion to provide reasonable protection against harmful interference when the equip-
Radio Frequency ment is operated in a commercial environment. This equipment generates, uses,
Interference and can radiate radio frequency energy and, if not installed and used in accord-
Statement ance with the instruction manual, may cause harmful interference to radio com-
munications. Operation of this equipment in a residential area is likely to cause
harmful interference in which case the user will be required to correct the inter-
ference at his own expense.
Shielded Cables Shielded cables must be used with this equipment to maintain compliance with
FCC regulations.
Modifications Changes or modifications not expressly approved by the manufacturer could
void the user’s authority to operate the equipment.
Conditions of This device complies with Part 15 of the FCC Rules. Operation is subject to the
Operations following two conditions: (1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.

Responsible party for Supplier's Declaration of Conformity

Siemens Industry, Inc.
Digital Factory - Factory Automation
5300 Triangle Parkway, Suite 100
Norcross, GA 30092
USA
mail to: [email protected] (mailto: [email protected])

10.5 Canada

CANADA
Canadian Notice This Class B digital apparatus complies with Canadian ICES-003.
Avis Canadien Cet appareil numérique de la classe B est conforme à la norme NMB-003 du
Canada.

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Standards and approvals
10.6 Australia / New Zealand

10.6 Australia / New Zealand

AUSTRALIA / NEW ZEALAND

This product meets the requirements of the standard EN 61000-6-3 Generic standards -
Emission standard for residential, commercial and light-industrial environments.
This product meets the requirements of the standard EN 61000-6-3 Generic standards -
Emission standard for residential, commercial and light-industrial environments.

10.7 Eurasion Customs Union EAC

Identification for Eurasion Customs Union

● EAC (Eurasian Conformity)
● Customs union of Russia, Belarus and Kazakhstan
● Declaration of conformity according to Technical Regulations of the Customs Union (TR
CU)

10.8 Korea

KOREA
This product meets the requirements of Korean certification.
This product satisfies the requirement of the Korean Certification (KC Mark).
이 기기는 업무용(A급) 전자파 적합기기로서 판매자 또는 사용자는 이 점을 주의하시기
바라며 가정 외의 지역에서 사용하는 것을 목적으로 합니다.

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Hardware description A
A.1 Motherboard

A.1.1 Layout of the motherboard

The motherboard consists of these main components: Processor and chipset, four slots for
memory modules, internal and external interfaces, Flash BIOS and the backup battery.

① Slots for memory modules

② Processor
③ Slot for the bus board
④ Backup battery

Technical features of the motherboard

Technical features of the motherboard can be found under "Technical specifications of the
motherboard (Page 158)".

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Hardware description
A.1 Motherboard

A.1.2 Position of the interfaces on the motherboard

1 Audio UAJ (X90) 8 Front fan 17 USB 3.0 (internal)

1x type A
2 COM1 (X30) 9 SATA 5 (Port 5) 18 Unlock ME
3 COM2 (X31) 10 SATA 4 (Port 4) 19 BIOS Recovery
4 DVI-D (X70) 11 SATA 3 (Port 3) 20 On-off button
5 DPP (X71/X72) 12 SATA 2 (Port 2) 21 Reset button
6 LAN 1 (X1 P1) 13 SATA 1 (Port 1) 22 CPU Power
LAN 2 (X2 P1) 14 SATA 0 (Port 0)
LAN 3 (X3 P1) 15 Status indicator on
front
On-off button
Reset button
7 USB 3.1 16 USB 3.0 behind
(X60-X65) front door
4x type A 2x type A
2x type C

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A.2 Internal interfaces

A.2 Internal interfaces

A.2.1 Pin assignment of the internal interfaces

Interface Position Description

Memory Internal DIMM socket, 64-/ 72-bit
Bus expansion Internal Bus expansion socket, used by PCIe bus and
special signals
Power supply Internal 4-pin 12 V ATX power connector (CPU-VRM
supply)
BIOS Recovery 1 Internal Replace jumper on pins 3-4 to run BIOS Recov-
ery
Unlock ME 1 Internal Replace jumper on pins 1-2 to change locked ME
Fan monitoring Internal Monitoring of power supply fan, 8-pin, pin header
SATA Internal, e.g., 7-pin SATA connector
hard disk
Connection for PS serial ATA Internal Voltage supply for serial ATA

Connection for device fan Internal Power supply, device fan monitoring (controlled),
4-pin, pin header
Connection of SCSI activity Internal SCSI activity connector
LED Type JST B2B-PH-SM3-TB
Input for SCSI drive activity display
Internal USB3/USB2 interface Internal For connecting the USB cable to the front panel
of the computer
Internal USB2 interface Internal Connection for USB interfaces on slot cover
Port 80 connector Internal Connection for Port 80 / mode switch
COM2 Internal Connection for COM2 on slot cover (see external
interfaces)
Reset Type JST B2B-PH-SM3-TB
Power button Type JST B2B-PH-SM3-TB
PEG interface (PCIe x16 sock- Transfer interface between motherboard and bus
et) board
PCIe+special signal interface
(PCIe x16 socket)
1 A special USB stick is required (not included in scope of delivery; contact your local SIEMENS
representative).

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Hardware description
A.2 Internal interfaces

A.2.2 SCSI activity connector

Type JST B2B-PH-SM3-TB

Pin Name Meaning

1 NC -
2 SCSI HD_N 0-V level means that the SCSI interface is active

A.2.3 Reset

Type JST B2B-PH-SM3-TB

NOTICE
Observe safety information
Only use this interface for maintenance purposes. You should observe the warnings in
"Open the device (Page 89)".

Pin Name Meaning

1 GND Ground
2 Reset Input, 0 V level means reset

A.2.4 Power button

Type JST B2B-PH-SM3-TB

NOTICE
Observe safety information
Only use this interface for maintenance purposes. You should observe the warnings in
"Open the device (Page 89)".

Pin Name Meaning

1 EXT_PWRBTN Input, 0 V level means Power button pressed
2 GND Ground

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A.2 Internal interfaces

A.2.5 Internal interface connector (USB 2.0)

Pin Name Meaning

1 VCC + 5 V (fused)
2 VCC + 5 V (fused)
3 -Data USB1 Data channel, bidirectional
4 -Data USB3 Data channel, bidirectional
5 +Data USB1 Data channel, bidirectional
6 +Data USB3 Data channel, bidirectional
7 GND Ground
8 GND Ground
9 GND Ground
10 Key –

A.2.6 Internal interface connector (USB 3.0/USB 2.0)

Pin Name Meaning

USB3 (USB3/USB 2.0 contacts)
A1 VCC + 5 V (fused)
A2 SSRX- Data input USB3
A3 SSRX+ Data input USB3
A4 GND Ground
A5 SSTX- Data output USB3
A6 SSTX+ Data output USB3
A7 GND Ground
A8 -Data Data channel USB2, bidirectional
A9 +Data Data channel USB2, bidirectional
A10 Reserved + 5 V (fused) or ground
USB2 (USB 2.0 contacts)
B1 -Data Data channel USB2
B2 +Data Data channel USB2
B3 GND Ground
B4, 5 NC Open
B6 GND Ground
B7, 8 NC Open
B9 VCC + 5 V (fused)
B10 NC Open

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Hardware description
A.2 Internal interfaces

A.2.7 Power supply fan monitoring

Pin Name Meaning

1 Reserved -
2 Reserved PWM,
speed setting ATX AC-SV
3 Reserved -
4 Tacho signal Input monitoring signal
5 PS_Status Input status of redundant PS
6 Reserved Reserved for fan failure of redundant PS
7 Quittung_Status Output; Acknowledgment of acoustic alarm signal of redundant
power supply (signal is open when module is switched on)
8 Ground -

A.2.8 Fan port

Pin Name Meaning

1 GND Ground
2 VCC +12 V fused
3 Tacho signal Input monitoring signal
4 PWM Output speed setting

A.2.9 Supply for the serial ATA drives

Pin Name Meaning

1 +12 V Output power supply
2 GND Ground
3 GND Ground
4 +5 V Output power supply
5 +3.3 V Output power supply

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A.2 Internal interfaces

A.2.10 PEG interface (PCIe x16 socket)

Signal Pin Pin Signal

P12V B1 A1 P12V
P12V B2 A2 P12V
P12V B3 A3 P12V
GND B4 A4 GND
SMB_CLK2 B5 A5 n.c.
SMB_DATA2 B6 A6 n.c.
GND B7 A7 n.c.
P3V3 B8 A8 n.c.
n.c. B9 A9 P3V3
AUX_3V B10 A10 P3V3
WAKE2 B11 A11 PCIE_RESET_L
n.c. B12 A12 GND
GND B13 A13 PCIE0_ECLK
PCIEX16_TX_P(15) B14 A14 PCIE0_ECLK_N
PCIEX16_TX_N(15) B15 A15 GND
GND B16 A16 PCIEX16_RX_P(15)
SDVO_CTRLCLK B17 A17 PCIEX16_RX_N(15)
GND B18 A18 GND
PCIEX16_TX_P(14) B19 A19 n.c.
PCIEX16_TX_N(14) B20 A20 GND
GND B21 O21 PCIEX16_RX_P(14)
GND B22 A22 PCIEX16_RX_N(14)
PCIEX16_TX_P(13) B23 A23 GND
PCIEX16_TX_N(13) B24 A24 GND
GND B25 A25 PCIEX16_RX_P(13)
GND B26 A26 PCIEX16_RX_N(13)
PCIEX16_TX_P(12) B27 A27 GND
PCIEX16_TX_N(12) B28 A28 GND
GND B29 A29 PCIEX16_RX_P(12)
n.c. B30 A30 PCIEX16_RX_N(12)
SDVO_CTRLDATA B31 A31 GND
GND B32 A32 n.c.
PCIEX16_TX_P(11) B33 A33 n.c.
PCIEX16_TX_N(11) B34 A34 GND
GND B35 A35 PCIEX16_RX_P(11)
GND B36 A36 PCIEX16_RX_N(11)
PCIEX16_TX_P(10) B37 A37 GND
PCIEX16_TX_N(10) B38 A38 GND
GND B39 A39 PCIEX16_RX_P(10)
GND B40 A40 PCIEX16_RX_N(10)

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A.2 Internal interfaces

Signal Pin Pin Signal

PCIEX16_TX_P(9) B41 A41 GND
PCIEX16_TX_N(9) B42 A42 GND
GND B43 A43 PCIEX16_RX_P(9)
GND B44 A44 PCIEX16_RX_N(9)
PCIEX16_TX_P(8) B45 A45 GND
PCIEX16_TX_N(8) B46 A46 GND
GND B47 A47 PCIEX16_RX_P(8)
MCH_CFG_20 B48 A48 PCIEX16_RX_N(8)
GND B49 A49 GND
PCIEX16_TX_P(7) B50 A50 n.c.
PCIEX16_TX_N(7) B51 A51 GND
GND B52 A52 PCIEX16_RX_P(7)
GND B53 A53 PCIEX16_RX_N(7)
PCIEX16_TX_P(6) B54 A54 GND
PCIEX16_TX_N(6) B55 A55 GND
GND B56 A56 PCIEX16_RX_P(6)
GND B57 A57 PCIEX16_RX_N(6)
PCIEX16_TX_P(5) B58 A58 GND
PCIEX16_TX_N(5) B59 A59 GND
GND B60 A60 PCIEX16_RX_P(5)
GND B61 A61 PCIEX16_RX_N(5)
PCIEX16_TX_P(4) B62 A62 GND
PCIEX16_TX_N(4) B63 A63 GND
GND B64 A64 PCIEX16_RX_P(4)
GND B65 A65 PCIEX16_RX_N(4)
PCIEX16_TX_P(3) B66 A66 GND
PCIEX16_TX_N(3) B67 A67 GND
GND B68 A68 PCIEX16_RX_P(3)
GND B69 A69 PCIEX16_RX_N(3)
PCIEX16_TX_P(2) B70 A70 GND
PCIEX16_TX_N(2) B71 A71 GND
GND B72 A72 PCIEX16_RX_P(2)
GND B73 A73 PCIEX16_RX_N(2)
PCIEX16_TX_P(1) B74 A74 GND
PCIEX16_TX_N(1) B75 A75 GND
GND B76 A76 PCIEX16_RX_P(1)
GND B77 A77 PCIEX16_RX_N(1)
PCIEX16_TX_P(0) B78 A78 GND
PCIEX16_TX_N(0) B79 A79 GND
GND B80 A80 PCIEX16_RX_P(0)
n.c. B81 A81 PCIEX16_RX_N(0)
n.c. B82 A82 GND

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 Hardware description
A.2 Internal interfaces

A.2.11 PCIe + special signal interface (PCIe x16 socket)

Signal Pin Pin Signal

N12V B1 A1 AUX_5V
P12V B2 A2 P12V
P12V B3 A3 P12V
GND B4 A4 GND
PCI_INT_N(7) B5 A5 PCI_INT_N(6)
PCI_INT_N(5) B6 A6 PCI_INT_N(8)
P5V B7 A7 P5V
PCI_REQ_N(4) B8 A8 P5V
PCI_REQ_N(3) B9 A9 PCI_GNT_N(4)
GND B10 A10 PCI_GNT_N(3)
PCI0_PCLK B11 A11 AUX_3V
GND B12 A12 PLT_RST_N_BUFF
PCI1_PCLK B13 A13 GND
GND B14 A14 PCI_GNT_N(1)
PCI_REQ_N(1) B15 A15 PCI_GNT_N(2)
PCI_REQ_N(2) B16 A16 GND
P5V B17 A17 PME
PCI_AD(31) B18 A18 PCI_AD(30)
PCI_AD(29) B19 A19 P3V3
GND B20 A20 PCI_AD(28)
PCI_AD(27) B21 O21 PCI_AD(26)
PCI_AD(25) B22 A22 GND
P3V3 B23 A23 PCI_AD(24)
PCI_CBE_N(3) B24 A24 n.c.
PCI_AD(23) B25 A25 P3V3
GND B26 A26 PCI_AD(22)
PCI_AD(21) B27 A27 PCI_AD(20)
PCI_AD(19) B28 A28 GND
P3V3 B29 A29 PCI_AD(18)
PCI_AD(17) B30 A30 PCI_AD(16)
PCI_CBE_N(2) B31 A31 P3V3
GND B32 A32 FRAME
IRDY B33 A33 GND
P3V3 B34 A34 TRDY
DEVSEL B35 A35 GND
GND B36 A36 STOP
PLOCK B37 A37 P3V3
PERR B38 A38 SMB_CLK1
P3V3 B39 A39 SMB_DAT1
SERR B40 A40 GND

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Hardware description
A.2 Internal interfaces

Signal Pin Pin Signal

P3V3 B41 A41 PAR
PCI_CBE_N(1) B42 A42 PCI_AD(15)
PCI_AD(14) B43 A43 P3V3
GND B44 A44 PCI_AD(13)
PCI_AD(12) B45 A45 PCI_AD(11)
PCI_AD(10) B46 A46 GND
GND B47 A47 PCI_AD(9)
PCI_AD(8) B48 A48 PCI_CBE_N(0)
PCI_AD(7) B49 A49 P3V3
P3V3 B50 A50 PCI_AD(6)
PCI_AD(5) B51 A51 PCI_AD(4)
PCI_AD(3) B52 A52 GND
GND B53 A53 PCI_AD(2)
PCI_AD(1) B54 A54 PCI_AD(0)
P5V B55 A55 P5V
P5V B56 A56 P5V
P5V B57 A57 PCIE_1X4X
AUX_5V B58 A58 GND
WAKE1 B59 A59 PLT_RST_N_PCIE4X
GND B60 A60 PS_ON
GND B61 A61 PS_PWRGD
n.c. B62 A62 GND
n.c. B63 A63 GND
GND B64 A64 PCIE_TX_P(1)
GND B65 A65 PCIE_TX_N(1)
PCIE_RX_P(1) B66 A66 GND
PCIE_RX_N(1) B67 A67 GND
GND B68 A68 PCIE1_ECLK
GND B69 A69 PCIE1_ECLK_N
PCIE_TX_P(2) B70 A70 GND
PCIE_TX_N(2) B71 A71 GND
GND B72 A72 PCIE_RX_P(2)
GND B73 A73 PCIE_RX_N(2)
PCIE_TX_P(3) B74 A74 GND
PCIE_TX_N(3) B75 A75 GND
GND B76 A76 PCIE_RX_P(3)
GND B77 A77 PCIE_RX_N(3)
PCIE_TX_P(4) B78 A78 GND
PCIE_TX_N(4) B79 A79 GND
GND B80 A80 PCIE_RX_P(4)
RESERVE1 *) B81 A81 PCIE_RX_N(4)
RESERVE2 *) B82 A82 GND

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A.2 Internal interfaces

NOTICE
Note for bus modules with PCIe switch
As long as no modules are plugged into the PCIe slots behind a PCIe switch, the IRQs are
not used by the PCIe switch, but the display only shows that these IRQs would be used if
modules were plugged in.
The PCIe switch is displayed in Windows® Device Management as "PCI standard PCI-to-
PCI bridge".

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Hardware description
A.3 Bus board

A.3 Bus board

A.3.1 Slots for expansion cards on the bus board

The bus board is designed as a link between the motherboard and the expansion cards. It is
mounted using six screws.
Power is directly supplied to the expansion cards via the bus board connection.

Note
The maximum permitted power loss of the expansion cards is 80 W.

The bus board is available in three versions.

Variant 1: 9 slots

Bus board Slot Specification

① PCI
• Rev. 2.3
②
• PCI bus primary
③
• Master-capable

④ PCIe x16
• Gen. 3
⑤
• Active lanes: 8

⑥ PCI
• Rev. 2.3
⑦
• PCI bus primary
⑧
• Master-capable
⑨

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A.3 Bus board

Variant 2: 11 slots

Bus board Slot Specification

① PCI
• Rev. 2.3
②
• PCI bus primary
③
• Master-capable

④ PCIe x16
• Gen. 3
⑤
• Active lanes: 4

⑥ PCIe x16
• Gen. 3
• Active lanes: 8

⑦ PCIe x16
• Gen. 3
⑧
• Active lanes: 4
⑨
⑩ PCIe x4
• Gen. 3
⑪
• Active lanes: 4

Variant 3: 11 slots

Bus board Slot Specification

① PCI
• Rev. 2.3
②
• PCI bus primary
③
• Master-capable

④ PCIe x16
• Gen. 3
• Active lanes: 16

⑤ PCIe x16
• Gen. 3
⑥
• Active lanes: 1

⑦ PCIe x16
• Gen. 3
⑧
• Active lanes: 4
⑨
⑩ PCIe x4
• Gen. 3
⑪
• Active lanes: 4

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Hardware description
A.3 Bus board

PCIe slots of the optional expansion cards

You can use optionally available expansions in the following slots.
Abbreviations of the optional expansion cards
● Graphics: Graphics card
● HWR: Hardware RAID adapter card
● M.2: Adapter card for M.2 NVMe SSD modules

Bus board Combination option Identification Number of the slot

number
Variant 1 A5E42684818 4 5 6 7 8 9
Graphics Graphics
M.2 M.2
HWR HWR
Graphics + M.2 M.2 Graphics
Graphics + HWR HWR Graphics
HWR + M.2 M.2 HWR
Variant 2 A5E42684838
Graphics + M.2 + HWR Graphics M.2 HWR
(up to 3 expansion cards can be
inserted simultaneously)
Variant 3 A5E42684848
Graphics + M.2 + HWR Graphics M.2 HWR
(up to 3 expansion cards can be
inserted simultaneously)

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 Hardware description
A.3 Bus board

A.3.2 Interrupt assignment of the slots for expansion cards on the backplane

Note
All system resources (hardware addresses, memory allocation, interrupt allocation, DMA
channels) are dynamically assigned by the firmware or the operating system based on the
hardware equipment, drivers, installed expansion cards and connected external devices.
The assignment is made automatically and depends on the requested resources of the
connected devices and installed components. Due to this configuration dependency, clear
statements can only be made by determining them in relation to the system in the final
configuration.
The resources can be viewed in Windows as follows:
1. Press the "Windows® key" and "R" simultaneously.
2. Enter the "msinfo32" command in the "Open" field.
3. Click "OK" to confirm.

Variant 1: 9 slots (2 x PEG / 7 x PCI)

You can find information about this bus board version under "Slots for expansion cards on
the bus board (Page 182)".

Slot Con- Slot 1 Slot 2 Slot 3 Slot 4 Slot 5 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10 Slot 11
nector PCI PCI PCI PEG PEG PCI PCI PCI PCI Not used Not used
Type Gen3 Gen3
8 Lane 8 Lane
Host De- PCH PCH PCH PEG PEG PCH PCH PCH PCH
vice Port 8 Port 8 Port 8 0:1:1 0:1:0 Port 20 Port 20 Port 20 Port 20
PCI Dev PCI PCI Dev PCI Dev PCI Dev PCI Dev PCI Dev
0 Dev 1 2 12 13 14 15
Bus Primary A Primary B
APIC Inter-
rupt
INT A PIRQ D PIRQ A PIRQ B PIRQ B PIRQ A PIRQ D PIRQ A PIRQ B PIRQ C
INT B PIRQ A PIRQ B PIRQ C PIRQ C PIRQ B PIRQ A PIRQ B PIRQ C PIRQ D
INT C PIRQ B PIRQ C PIRQ D PIRQ D PIRQ C PIRQ B PIRQ C PIRQ D PIRQ A
INT D PIRQ C PIRQ D PIRQ A PIRQ A PIRQ D PIRQ C PIRQ D PIRQ A PIRQ B
Organiza-
tional Pins
Request Req0 Req1 Req2 Req0 Req1 Req2 Req3
(B18)
Grant (A17) Gnt0 Gnt1 Gnt2 Gnt0 Gnt1 Gnt2 Gnt3
ID (A26) AD16 AD17 AD18 AD28 AD29 AD30 AD31

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Hardware description
A.3 Bus board

Variant 2: 11 slots (3 x PEG / 5 x PCI / 3 x PCI)

You can find information about this bus board version under "Slots for expansion cards on
the bus board (Page 182)".

Slot Con- Slot 1 Slot 2 Slot 3 Slot 4 Slot 5 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10 Slot 11
nector PCI PCI PCI PEG PEG PEG PCIe PCIe PCIe PCIe PCIe
Type Gen3 Gen3 Gen3 Gen3 Gen3 Gen3 Gen3 Gen3
4 Lane 4 Lane 8 Lane 4 Lane 4 Lane* 4 Lane* 4 Lane* 4 Lane*
Host De- PCH PCH PCH PEG PEG PEG PCH PCH PCH PCH PCH
vice Port 8 Port 8 Port 8 0:1:2 0:1:1 0:1:0 Port 21 Port 9 Port 9 Port 9 Port 9
PCI PCI PCI (0:1B.04) Packet Packet Packet Packet
Dev 0 Dev 1 Dev 2 Switch Switch Switch Switch
Dev 0 Dev 1 Dev 2 Dev 3
(0:1D.0) (0:1D.1) (0:1D.2) (0:1D.3)
Bus Primary A
APIC Inter-
rupt
INT A PIRQ D PIRQ A PIRQ B PIRQ B PIRQ C PIRQ A PIRQ A PIRQ D PIRQ C PIRQ B PIRQ A
INT B PIRQ A PIRQ B PIRQ C PIRQ C PIRQ D PIRQ B PIRQ B PIRQ A PIRQ D PIRQ C PIRQ B
INT C PIRQ B PIRQ C PIRQ D PIRQ D PIRQ A PIRQ C PIRQ C PIRQ B PIRQ A PIRQ D PIRQ C
INT D PIRQ C PIRQ D PIRQ A PIRQ A PIRQ B PIRQ D PIRQ D PIRQ C PIRQ B PIRQ A PIRQ D
Organiza-
tional Pins
Request Req0 Req1 Req2
(B18)
Grant (A17) Gnt0 Gnt1 Gnt2
ID (A26) AD16 AD17 AD18

*Slot is connected via PCIe Gen3 PCIe2PCIe switch to the PCH.

These slots only support Auto mode, i.e. plugged modules and PCe2PCIe switch negotiate
the PCIe type Gen1, 2 or 3.

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A.3 Bus board

Variant 3: 11 slots (1 x PEG / 7 x PCI / 3 x PCI)

Slot Con- Slot 1 Slot 2 Slot 3 Slot 4 Slot 5 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10 Slot 11
nector PCI PCI PCI PEG PCIe PCIe PCIe PCIe PCIe PCIe PCIe
Type Gen3 Gen3 Gen3 Gen3 Gen3 Gen3 Gen3 Gen3
16 Lane 1 Lane 1 Lane 4 Lane 4 Lane* 4 Lane* 4 Lane* 4 Lane*
Host Device PCH PCH PCH PEG PCH PCH PCH PCH PCH PCH PCH
Port 8 Port 8 Port 8 0:1:0 Port 19 Port 20 Port 21 Port 9 Port 9 Port 9 Port 9
PCI Dev 0 PCI Dev 1 PCI Dev (0:1B.2) (0:1B.03 (0:1B.0 Packet Packet Packet Packet
2 ) 4) Switch Switch Switch Switch
Dev 0 Dev 1 Dev 2 Dev 3
(0:1D.0) (0:1D.1) (0:1D.2) (0:1D.3)
Bus Primary A
APIC Inter-
rupt
INT A PIRQ D PIRQ A PIRQ B PIRQ A PIRQ C PIRQ D PIRQ A PIRQ D PIRQ C PIRQ B PIRQ A
INT B PIRQ A PIRQ B PIRQ C PIRQ B PIRQ D PIRQ A PIRQ B PIRQ A PIRQ D PIRQ C PIRQ B
INT C PIRQ B PIRQ C PIRQ D PIRQ C PIRQ A PIRQ B PIRQ C PIRQ B PIRQ A PIRQ D PIRQ C
INT D PIRQ C PIRQ D PIRQ A PIRQ D PIRQ B PIRQ C PIRQ D PIRQ C PIRQ B PIRQ A PIRQ D
Organiza-
tional Pins
Request Req0 Req1 Req2
(B18)
Grant (A17) Gnt0 Gnt1 Gnt2
ID (A26) AD16 AD17 AD18

*Slot is connected to the PCH via PCIe Gen3 PCIe2PCIe switch.

These slots only support Auto mode, i.e. plugged modules and PCe2PCIe switch negotiate
the PCIe type Gen1, 2 or 3.

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Hardware description
A.3 Bus board

A.3.3 Exclusive PCI hardware interrupt

Applications demanding a high-performance interrupt require a high-speed hardware
interrupt reaction. The PCI hardware interrupt should be used only by one resource in order
to ensure high-speed reaction of the hardware.

Setting an exclusive interrupt on the device

All system resources (hardware addresses, memory allocation, interrupt allocation, DMA
channels) are dynamically assigned by the firmware or the operating system based on the
hardware equipment, drivers, installed expansion cards and connected external devices.
The assignment is made automatically and depends on the requested resources of the
connected devices and installed components. Due to this configuration dependency, clear
statements can only be made by determining them in relation to the system in the final
configuration.
The resources can be viewed in Windows as follows:
1. Press the "Windows® key" and "R" simultaneously.
2. Enter the "msinfo32" command in the "Open" field.
3. Click "OK" to confirm.

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 Hardware description
A.4 External interfaces

A.4 External interfaces

Note
Interface specification
The data of all external interfaces listed below correspond to the respective interface
specifications and the intended use.

Interface Connector Description Assignment

COM X30, X31 9-pin standard plug
(±12 V)

USB 3.1 Type A X60, X62, USB3 Port 0, 1; USB2 Port 0, 1 interface side
X64, X65 (3.3 V; 900 mA; up to 10 Gbps)

USB 3.1 Type C X61, X63 USB3 Port 0, 1; USB2 Port 0, 1 interface side
(5 V; 1.5 A to 3.0 A; up to 10 Gbps)

Ethernet 1, 2 and X4, X2, X3 RJ45

3 (up to 1 Gbps)

DVI-D X70 24-pin DVI-D female connector

(3.3 V; 500 mA)

DPP X71, X72 20-pin DisplayPort connector

Audio X90 (bot- 4-pin 3.5 mm UAJ jack

tom)

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Hardware description
A.5 System resources

A.5 System resources

A.5.1 Currently allocated system resources

All system resources (hardware addresses, memory configuration, allocation of interrupts,
DMA channels) are assigned dynamically by the Windows® operating system, depending on
the hardware configuration, drivers and connected external devices. You can view the
current configuration of system resources or possible conflicts with Windows®:
1. Press the "Windows® key" and "R" simultaneously.
The "Run" dialog box opens.
2. Enter "msinfo32" in the "Open" field.
3. Confirm your entry with "OK".

A.5.2 I/O address allocation

The table describes the assignment of the I/O addresses in the delivery state of the device.

I/O address (hex) Size Description of the basic function Possible alternative
from to (bytes function
)
0000 0000 0000 0CF7 415 PCI Express Root Complex
0000 0020 0000 0021 2 Programmable Interrupt Controller
0000 0024 0000 0025 2 Programmable Interrupt Controller
0000 0028 0000 0029 2 Programmable Interrupt Controller
0000 002C 0000 002D 2 Programmable Interrupt Controller
0000 002E 0000 002F 2 Motherboard resources
0000 0030 0000 0031 2 Programmable Interrupt Controller
0000 0034 0000 0035 2 Programmable Interrupt Controller
0000 0038 0000 0039 2 Programmable Interrupt Controller
0000 003C 0000 003D 2 Programmable Interrupt Controller
0000 0040 0000 0043 4 System timer
0000 004E 0000 004F 1 Motherboard resources
0000 0050 0000 0053 4 System timer
0000 0061 0000 0061 1 Motherboard resources
0000 0063 0000 0063 1 Motherboard resources
0000 0065 0000 0065 1 Motherboard resources
0000 0067 0000 0067 1 Motherboard resources
0000 0070 0000 0070 1 Motherboard resources
0000 0070 0000 0070 1 System CMOS/real time clock
0000 0080 0000 0080 1 Motherboard resources
0000 0092 0000 0092 1 Motherboard resources

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A.5 System resources

I/O address (hex) Size Description of the basic function Possible alternative
from to (bytes function
)
0000 00A0 0000 00A1 2 Programmable Interrupt Controller
0000 00A4 0000 00A5 2 Programmable Interrupt Controller
0000 00A8 0000 00A9 2 Programmable Interrupt Controller
0000 00AC 0000 00AD 2 Programmable Interrupt Controller
0000 00B0 0000 00B1 2 Programmable Interrupt Controller
0000 00B2 0000 00B3 2 Motherboard resources
0000 00B4 0000 00B5 2 Programmable Interrupt Controller
0000 00B8 0000 00B9 2 Programmable Interrupt Controller
0000 00BC 0000 00BD 2 Programmable Interrupt Controller
0000 00F0 0000 00F0 2 Numeric data processor
0000 02F8 0000 02FF 8 COM 2
0000 03F8 0000 03FF 8 COM 1
0000 04D0 0000 04D1 2 Programmable Interrupt Controller
0000 0680 0000 069F 32 Motherboard resources
0000 0D00 0000 FFFF 768 PCI Express Root Complex
0000 164E 0000 164F 255 Motherboard resources
0000 1800 0000 18FE 255 Motherboard resources
0000 1854 0000 1857 2 Motherboard resources
0000 2000 0000 20FE 255 Motherboard resources

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Hardware description
A.5 System resources

A.5.3 Interrupt assignments

The functions are assigned different interrupts, depending on the operating system. APIC
mode is used.
The table describes the assignment of the interrupts in the delivery state of the device.

X Interrupt in APIC mode

1 Host PCI-IRQ A to H is assigned to IRQ 16 to 23 permanently in APIC mode.
A specific assignment cannot be forced.
PCI / PCIe cards and the on-board PCI / PCIe devices require PCI interrupt channels. These
interrupt channels can be shared and are plug-and-play compatible. That is, several devices
can share the same interrupt. The IRQ is assigned automatically.

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A.6 Assignment of expansion interfaces to the software in the TIA Portal (CP assignment)

A.5.4 Memory address assignments

The table describes the assignment of the memory addresses in the delivery state of the
device.

Address Size Description of the basic function Possible alternative

from to (bytes) function
FED1 0000 FED1 7FFF 4k Motherboard resources
FED8 0000 FED1 8FFF 4k Motherboard resources
FED9 0000 FED1 9FFF 5k Motherboard resources
E000 0000 EFFF FFFF 8k Motherboard resources
FED2 0000 FED3 FFFF 8k Motherboard resources
FED9 0000 FED9 3FFF 2k Motherboard resources
FED4 5000 FED8 FFFF 5k Motherboard resources
FEE0 0000 FEEF FFFF 8k Motherboard resources
FED0 0000 FED0 03FF High precision event timer
D000 0000 FD69 FFFF 1k Motherboard resources
FD60 0000 FD6C FFFF 1.7 GB Motherboard resources
FD6F 0000 FDFF FFFF 2 GB Motherboard resources
FE00 0000 FE01 FFFF 1 GB Motherboard resources
FE20 0000 FE07 FFFF 3 GB Motherboard resources
FF00 0000 FFFF FFFF 8 GB Motherboard resources
FE01 0000 FE01 0FFF 4k SPI flash Controller

A.6 Assignment of expansion interfaces to the software in the TIA Portal

(CP assignment)
The table below shows the correlation between enclosure labeling of the IPC expansion slots
and the labeling that is used during assignment of interfaces to the software in the TIA
Portal.

Enclosure labeling TIA Portal

1 X100
2 X101
3 X102
4 X103
5 X104
6 X105
7 X106
8 X107
9 X108
10 X109
11 X110

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Hardware description
A.6 Assignment of expansion interfaces to the software in the TIA Portal (CP assignment)

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Technical support B
B.1 Service and support
You can find additional information and support for the products described on the Internet at
the following addresses:
● Technical support (https://support.industry.siemens.com/cs/ww/en/)
● Support request form (http://www.siemens.com/automation/support-request)
● After Sales Information System SIMATIC IPC/PG (http://www.siemens.com/asis)
● SIMATIC Documentation Collection (http://www.siemens.com/simatic-tech-doku-portal)
● Your local representative (http://www.automation.siemens.com/mcms/aspa-
db/en/Pages/default.aspx)
● Training center (http://sitrain.automation.siemens.com/sitrainworld/?AppLang=en)
● Industry Mall (https://mall.industry.siemens.com)
When contacting your local representative or Technical Support, please have the following
information at hand:
● Article number of the device (MLFB)
● BIOS version for industrial PC or image version of the device
● Other installed hardware
● Other installed software

Tools & downloads

Please check regularly if updates and hotfixes are available for download to your device. The
download area is available on the Internet at the following link:
After Sales Information System SIMATIC IPC/PG (http://www.siemens.com/asis)

SIMATIC IPC847E
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Technical support
B.2 Troubleshooting

B.2 Troubleshooting

B.2.1 Problems with device functions

Problem Cause Remedy

The device is not operational No power supply • Check the power supply, the power cable and
the power plug.
• Check to see if the on-off switch is in the correct
position.
Device is being operated outside • Check the ambient conditions.
the specified ambient conditions
• After transport in cold weather do not turn the
power on until after a waiting period of approxi-
mately 12 hours.
The monitor remains dark The monitor is switched off Switch on the monitor.
The monitor is in "power save" Press any key on the keyboard.
mode
The brightness button has been set Increase brightness using the brightness button.
to dark Detailed information can be found in the operating
manual for the monitor.
The power cord or the monitor • Check if the power cord is properly connected to
cable is not connected. the monitor and to the system unit or to the
grounded shockproof power outlet.
• Check to make sure the monitor cable is properly
connected to the system unit and the monitor.
Contact your technical support team if the screen
still remains dark after all these controls and
measures.
The mouse pointer does not The mouse driver is not loaded Check whether the mouse driver is properly installed
appear on the screen and available when you start the user program.
Detailed information about the mouse driver is avail-
able in the corresponding documentation.
Mouse not connected • Check to make sure that the mouse cable is
properly connected to the system unit.
• If you use an adapter or extension cable for the
mouse cable make sure to check these connec-
tions as well.
Contact your technical support team if the mouse
pointer still does not appear on the screen after
these controls and measures.
Time and/or date of the PC is 1. Open the firmware configuration menu. To do
not correct this, press the <F2> key during the boot opera-
tion.
2. Set the date and the time in the "Main" tab.

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 Technical support
B.2 Troubleshooting

Problem Cause Remedy

Time and date are wrong even The backup battery is dead. Replace the backup battery.
after correctly setting them in
the firmware (BIOS)
USB device not responding USB ports are deactivated in the Use a different USB port or activate the port.
firmware (BIOS)
Operating system does not support Activate the firmware setting "PS/2 Emulation" in the
XHCI firmware (BIOS) under "Advanced > USB Configura-
tion".
USB-2.0/3.0 device connected Activate the USB.
although USB-2.0/3.0 is deactivat-
ed
Operating system does not support • Activate the firmware setting "Legacy USB Sup-
the USB interfaces port" in the firmware (BIOS) under "Advanced >
USB Configuration".
• For other devices, you need the USB device
drivers for the required operating system.

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Technical support
B.2 Troubleshooting

B.2.2 Problems when booting the device

Problem Cause Remedy

After changing the hard disk, RAID system does not have high- Change the boot priority in the firmware (BIOS) un-
the system does not boot from est boot priority der "Boot > Boot device".
the RAID system
• Permit RAID system in the boot priority
• Give RAID system top boot priority
After changing the hard disk, System was booted without func- Reboot the system with a functioning hard disk.
"Unused" is indicated for the tioning drive. The removable tray
relevant SATA port. might not be fully pushed in.
Computer does not boot or The boot medium is not approved Set the boot priority to "Enabled" in the firmware
"Boot device not found" is (BIOS) under "Boot > Boot device".
displayed. The boot device is not in first place Change the boot priority in the firmware (BIOS) un-
of the boot priority in the BIOS der "Boot > Boot device".
setup
The boot data storage medium is Activate UEFI mode in the firmware (BIOS).
set up with GPT, and UEFI boot is
deactivated in the firmware (BIOS)
The startup of a Windows The settings in the boot loader file Restore the Windows® operating system.
operating system located on a "BCD" are incorrect or damaged. You can find the files and descriptions needed for
GPT data storage medium is this on the supplied data storage medium.
aborted with the following
error message:
"Status: 0xc0000225 Info: The
boot selection failed because
a required device is inacces-
sible"

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198 Operating Instructions, 10/2018, A5E43920357-AA
 Technical support
B.2 Troubleshooting

B.2.3 Problems with RAID systems

Problem Cause Remedy

The RAID software reports the RAID is not activated The messages have no negative effect on the opera-
following errors: tion of the device and can be ignored.
• The RAID plug-in failed to Acknowledge the messages.
load, because the drive is RAID is activated Install the software again with the help of the sup-
not installed. plied data storage medium.
• The Serial ATA plug-in
failed to load, because the
driver is not installed cor-
rectly.
• The Intel® Storage Con-
sole was unable to load a
page for the following rea-
son:
– A plug-in did not pro-
vide a page for the se-
lected device
– A plug-in failed to load

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 199
Technical support
B.2 Troubleshooting

B.2.4 Problems when using expansion cards

Problem Cause Remedy

The device crashes during • Redundant I/O addresses Check your computer configuration:
startup
• Redundant hardware interrupts • If the computer configuration corresponds to the
and/or DMA channels delivery state, contact your technical support
• Signal frequencies or signal team.
levels are not adhered to • In the case of a change in the configuration,
• Different pin assignment restore the delivery state. To do this, remove the
expansion card and restart the device. If the error
no longer occurs, the expansion card was the
cause of the fault. Replace this with a Siemens
expansion card or contact the supplier of the ex-
pansion card.
If the device still crashes, contact your technical
support team.
Insufficient output of an external Use a powerful power supply.
power supply, e.g. UPS
The device does not start up A counter voltage is fed into the Clarify the following with the supplier of the compo-
or switches off immediately device by connected or installed nent:
expansion cards
• The component can be operated without an
external power supply.
• The component can be reconfigured so that it
only uses the external power supply or that of the
device.

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Markings and symbols C
C.1 Overview
The following tables show all the symbols which may be found on your SIMATIC industrial
PC, SIMATIC industrial monitor or SIMATIC Field PG in addition to the symbols which are
explained in the operating instructions.
The symbols on your device may vary in some details from the symbols shown in the
following tables.

C.2 Safety

Symbol Meaning Symbol Meaning

Warning, observe the supplied docu- Lock is closed
mentation.

Attention, radio equipment Lock is open

Disconnect the power plug before Opening for Kensington lock

opening

Attention ESD (Electrostatic sensitive Warning of hot surface

device)

C.3 Operator controls

Symbol Meaning Symbol Meaning

On/off switch, without electrical isola-
tion

On/off switch, without electrical isola-

tion

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 201
Markings and symbols
C.4 Certificates, approvals and markings

C.4 Certificates, approvals and markings

The following table shows symbols relating to certificates, approvals and markings which
may be on the device. You can find more information in the operating instructions for your
device:

Symbol Meaning Symbol Meaning

Approved for Australia and New Zea- Marking for the Eurasian Customs
land Union

Approved for China Test mark of Factory Mutual Re-

search

CE markings for European countries Marking of Federal Communications

Commission for the USA

EFUP (Environment Friendly Use Approved for Korea

Period) marking for China

Test mark of the Underwriters La- Disposal information, observe the

boratories local regulations.

Approval for India

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202 Operating Instructions, 10/2018, A5E43920357-AA
 Markings and symbols
C.5 Interfaces

C.5 Interfaces

Symbol Meaning Symbol Meaning

Connection to the power supply PS/2 mouse interface

Protective conductor terminal PS/2 keyboard-interface

Connection for functional earthing Multimedia Card Reader

(equipotential bonding line)

DisplayPort interface Smart Card Reader

DVI port Line In

LAN interface, not approved for con- Line Out

necting WAN or telephone

Serial port Microphone input

USB port Universal Audio Jack

USB 2.0 high-speed port Headphone output

USB 3.0 super-speed port

USB 3.1 SuperSpeedPlus interface

SIMATIC IPC847E
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Markings and symbols
C.5 Interfaces

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204 Operating Instructions, 10/2018, A5E43920357-AA
List of abbreviations D
D.1 Abbreviations

Abbrevia- Term Meaning

tion
AC Alternating current Alternating current
AHCI Advanced Host Controller Interface Standardized controller interface for
SATA devices. This is supported in Mi-
crosoft Windows XP as of SP1 and IAA
driver.
APIC Advanced Programmable Interrupt Controller Extended programmable interrupt con-
troller
AWG American Wire Gauge US standard for the cable diameter
CE Communauté Européenne (CE symbol) The product is in conformance with all
applicable EC directives
CLK Clock pulse Clock signal for controllers
CMOS Complementary Metal Oxide Semiconduc- Complementary metal oxide semicon-
tors ductors
COA Certificate of authentication Microsoft Windows Product Key
COM Communications Port Term for the serial interface
CP Communication Processor Communication computer
CPU Central Processing Unit CPU
CSA Canadian Standards Association Canadian organization for tests and
certifications according to own or bi-
national standards (with UL / USA)
standards
DC Direct Current DC current
DRAM Dynamic Random Access Memory
DMA Direct Memory Access Direct memory access
DOS Disk Operating System Operating system without GUI
DPP DisplayPort New powerful digital monitor port
DQS Deutsche Gesellschaft zur Zertifizierung von
Qualitätsmanagement mBH
DVI / DVI- Digital Visual Interface Digital display interface without VGA
D signals
DVI-I Digital Visual Interface Digital display interface with digital and
VGA signals
ECP Extended capability port Extended parallel port
EFI Extensible Firmware Interface
ESD Components sensitive to electrostatic charge
EN European standard
HDD Hard Disk Drive Hard disk drive

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 205
List of abbreviations
D.1 Abbreviations

Abbrevia- Term Meaning

tion
HU Height unit
I/O Input/Output Data input/output on computers
iAMT Intel® Active Management Technology
IEC International Electrotechnical Commission
IP Ingress Protection Degree of protection
IRQ Interrupt Request Interrupt request
LPT Line Printer Printer port
mDPP mini DisplayPort Digital monitor interface
MUI Multilanguage User Interface Language localization in Windows
NEMA National Electrical Manufacturers Association Syndicate of manufacturers of electrical
components in the USA
NTFS New Technology File System Secure file system for Windows versions
(2000, XP, 7)
OPC OLE for Process Control Standardized interface for industrial
processes
PCI Peripheral Component Interconnect High-speed expansion bus
PCIe Peripheral Component Interconnect express High-speed serial, differential full-duplex
PtP interface with high data rate.
PFC Power Factor Correction Harmonic suppression for operation on
public networks.
PIC Programmable Interrupt Controller Programmable interrupt controller
PXE Preboot Execution Environment Software for running new PCs without
hard disk data via the network
RAID Redundant Array of Independent Disks Redundant drive array
SATA Serial Advanced Technology Attachment
SDRAM Synchronous DRAM
SMART Self Monitoring Analysis and Reporting Hard disk error diagnostics program
Technology
SJT Service [Grade] Junior (Hard Service) Ther- PVC armored cable
moplastic
SNMP Simple Network Management Protocol Network protocol
SSD Solid State Drive
TPM Trusted Platform Module
UEFI Unified Extensible Firmware Interface
UL Underwriters Laboratories Inc. US organization for tests and certifica-
tions according to own or binational
standards (with CSA / Canada) stand-
ards.
USB Universal Serial Bus
V.24 ITU-T standardized recommendation for
data transfer via serial ports
VCC Positive supply voltage of integrated
circuits

SIMATIC IPC847E
206 Operating Instructions, 10/2018, A5E43920357-AA
 List of abbreviations
D.1 Abbreviations

Abbrevia- Term Meaning

tion
VGA Video Graphics Array Video adapter which meets industrial
standard
WD Watchdog Program monitoring with error detection
and alarming.

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Operating Instructions, 10/2018, A5E43920357-AA 207
List of abbreviations
D.1 Abbreviations

SIMATIC IPC847E
208 Operating Instructions, 10/2018, A5E43920357-AA
Index

A D
Accessories Data backup, 147
Hardware, 30 Data exchange, 57
Software, 33 Degree of protection, 151
Alarm reset button, 24 Device fan, 130, 132, 135
Ambient and environmental conditions, 39 Maintenance interval, 129
Angle brackets Removing and installing, 130, 132, 135
Mounting holes, 48 DiagBase, (SIMATIC IPC DiagBase)
APIC mode, 192 DiagMonitor, (SIMATIC IPC DiagMonitor)
Approval, (EAC) Dimension drawing
Approvals, 39 Expansion card, 165
Assignment Dimension drawings, 163, 164
I/O addresses, 190 DisplayPort
Memory addresses, 193 Position of the interface, 20
Audio devices Documentation, 11
Connecting, 55 DPP, (DisplayPort)
Australia, 170 Drive
drive in the removable tray, 104
install internally on the side panel of the device, 124
B Drive cage
Removal, 119
Backup battery
Drive cage type A
Maintenance interval, 129
Installation options for drives, 100, 102
Bus board
Numbering of the mounting locations, 17
Installation, 182
Drive cage type B
Removing, 143
Installation options for drives, 114, 116
Numbering of the mounting locations, 18
Drives
C
Installation in drive cage type A, 100, 102
Canada, 169 Installation in drive cage type B, 114, 116
CE marking, 167 Maintenance interval, 129
Certificates, 167 Dust protection, 151
Approvals, 168 DVI
Change drive Position of the interface, 20
in mounting kit for 5.25" slot, 118
Install 5.25" adapter module for removable tray, 107
COA label, 46 E
COM interface
EAC, 170
Technical specifications, 161
EC Declaration of Conformity, 167
COM2
Electrostatic sensitive devices, 36
Position of the interface, 20
Ethernet, 57
Condensation, 37
Position of the interface on the device, 20
Connecting monitors, 56
Expansion cards
Connection of equipotential bonding, 50
Mounting, 91
Connections, (Interfaces)
Removing, 93

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 209
Index

Slots on motherboard, 159 Image & Partition Creator, 147

usable expansion cards, 91 Immunity to interference, 40
Industry Mall, 30
Interfaces
F at the front of the device, 21
On the device rear, 20
Fan, (Device fan), (Device fan), (Device fan)
IRQ assignment, 192
Fan cover
IT communication, 57
Acceptance, 131
Front fan, 16
FCC, 169
L
Filter pad
Maintenance interval, 129 Labeling, 170
Fire protection enclosure, 38 Korea, 170
Front door, (Fan cover) LAN, ( Ethernet)
Opening, 63 LEDs, (Status displays)
Functional ground Limitation of liability, 42
Equipotential bonding, 50 Lock for power plug
Redundant power supply, 54
Single power supply, 52
G
Graphic controller, 160
M
Graphics card, 160
Graphics memory, 160 Main memory, 158
Manuals, 11
Marking
H EC Declaration of Conformity, 167
Memory addresses
Hardware interrupt
Assignment, 193
Assigning, 188
Memory modules
Hardware reset, 61
Combination options, 94
Headphones
Conditions of use, 94
Connecting, 55
Installing, 96
Headset
Removing, 95
Connecting, 55
Slots on motherboard, 158
High frequency radiation
usable memory modules, 94
Immunity to interference, 40
Microphone
Hot swap
Connecting, 55
Changing the drive in the removable tray, 104
Monitoring software, (SIMATIC IPC
Hot-spare drive
DiagBase), (SIMATIC IPC DiagMonitor)
Integrating, 72
Motherboard
Hot-spare drive
Changing, 145
For RAID1 and RAID5 systems, 66
Mounting
horizontally on device base, 47
vertically on device base, 47
I
vertically with tower kit, 47
I/O addresses with cabinet brackets, 47
Assignment, 190 with telescopic rails, 47
I/O devices Mounting holes, 48
Connecting, 55 Multi-monitoring, 56, 64
Safety instructions, 41
Identification data, 46

SIMATIC IPC847E
210 Operating Instructions, 10/2018, A5E43920357-AA
 Index

N Redundant power supply

Lock for power plug, 54
NCQ, 157
Output voltage, 154
New Zealand, 170
Sockets for power plugs, 22
Redundant power supply (AC)
Changing, 141
O
Remote maintenance software, (SIMATIC IPC Remote
On/off button, 24 Manager)
On/Off switch, 23 Remote Manager, (SIMATIC IPC Remote Manager)
Onboard RAID system Removable tray
Show faulty drive, 70 Changing the backplane board, 112
Open Installing the backplane board, 109
Device, 90 Removal
Open the device, 90 Device fan, 130, 132, 135
Operating system Drive cage, 119
Initial commissioning, 59 Reset button, 24
Installed on delivery, 44, 162 RS232, (COM1)
Shutdown, 60
Output voltage
Redundant power supply, 154 S
Single power supply, 154
Safety instructions
Ambient and environmental conditions, 39
Device and system extensions, 42
P
General, 35
Packaging I/O devices, 41
Checking, 45 Mounting, 38
PIC mode, 192 Transportation and storage, 37
Power requirements, 152 Scope of delivery, 43
Power supply Checking, 45
Connecting a redundant power supply, 53 SCSI interface, 174, 174
Connecting a single power supply, 51 Securing the cables, 58
Processor, 158 SIMATIC IPC DiagBase, 85
Changing, 144 SIMATIC IPC DiagMonitor, 85
PROFINET, 57 SIMATIC IPC Image & Partition Creator, (Image &
Protection class, 151 Partition Creator)
SIMATIC IPC Remote Manager, 87
SIMATIC NET, 57
R SIMATIC S7, 57
Single power supply
RAID, 198, 199
Lock for power plug, 52
RAID system
Output voltage, 154
Automatically integrating a new drive, 71
Socket for power plug, 22
Data synchronization, 82
Single power supply (AC)
Display of the defective drive, 67
Changing, 139
Integrating a new drive manually, 72, 72
Software products, 33
RAID1 system, 65, 65
Installed on delivery, 44
Hot-spare drive, 66
Spare parts, 30
Installation options for drives, 67, 67
Spare parts services, 32
RAID5 system, 65, 65
Status displays
Hot-spare drive, 66
for the system, 25
Rating plate, 46
Storage, 37
Rear of the device, 19
Strain relief, 58

SIMATIC IPC847E
Operating Instructions, 10/2018, A5E43920357-AA 211
Index

Supply voltage
For countries other than the USA and Canada, 49
USA and Canada, 49
Switching off
Disconnecting the device from the line voltage, 60
Forced shutdown, (Hardware reset)
Hardware reset, 61
Shutting down the operating system, 60
Switching on
Configure automatic startup, 59
Switching on the device, 59
System resources, 190
I/O address allocation, 190
System with two drives, (System with 2 drives)

T
Telescopic rails
Mounting holes, 48
Technical specifications (basic configuration), 162
TPM, (Trusted Platform Module)
Transportation, 37
Trusted Platform Module, 88

U
Uninterruptible power supply
Changing the module of the redundant power
supply, 140
USB 3.1
Position of the interfaces, 20, 20

V
vibration-damped drive cage, 18

SIMATIC IPC847E
212 Operating Instructions, 10/2018, A5E43920357-AA