A Division of Optoelectronics

Silicon Photodiode

PDB-C171SM
SMD Si Photodiode

The PDB-C171SM is a 7.7mm2 BLUE enhanced PIN silicon photodiode assembled in a compact
water clear surface-mount package. The device ideal for high-speed response applications with
moisture sensitivity classification level of 4.

Applications Features
Photointerrupters Compact Surface Mount
Oximeter Sensors High Speed
Barcode Photocunductive
Glucometers Available in Tape and Reel

www.advancedphotonix.com / +1 805 987 0146 PASSION FOR PHOTONICS

DS PDB-C171SM Rev. A
 A Division of Optoelectronics
Silicon Photodiode

Absolute Maximum Ratings

Parameter Symbol Min Max Unit

Reverse Voltage VR - 60 V

Operating Temperature TOP -40 +80 ºC

Storage Temperature TSTG -40 +100 ºC

Package -

Typical Electro-Optical Specifications at TA=23 ºC

Parameter Test Conditions Symbol Min Typ Max Unit

Breakdown Voltage Ibias=10μA VBD 60 - - V

Responsivity λ=900nm R950 0.60 0.68 - A/W

Responsivity λ=1050nm R1050 - 0.3 - A/W

Wavelength Range - λ 400 - 1050 nm

Dark Current Vbias=10V ID - 2 30 nA

Capacitance Vbias=3V; f=1MHz C - 25 - pF

Rise Time RL= 1KΩ, VR=10V, λ=820nm TR - 100 - ns

Noise Equivalent Power 950nm VR=10V NEP - 4x10-14 - W/ √ Hz

Spectral Response

0.8

0.7
Responsivity (A/W)

0.6

0.5

0.4

0.3

0.2

0.1

0.0
350 450 550 650 750 850 950 1050 1150

Wavelength (nm)

www.advancedphotonix.com / +1 805 987 0146 PASSION FOR PHOTONICS

DS PDB-C171SM Rev. A
 A Division of Optoelectronics
Silicon Photodiode

Mechanical Specifications
Units are in mm

Reflow Profile Soldering

Recommendation

Wave Not Advised -

IR Oven Reflow Allowed See Reflow Profile

Forced Convection
Recommended See Reflow Profile
Reflow

Convection Reflow Recommended See Reflow Profile

Vapor Phase Reflow Recommended See Reflow Profile

Manual Allowed 260ºC for 3 seconds max

Moisture Sensitivity
4 J-STD-033
Level

www.advancedphotonix.com / +1 805 987 0146 PASSION FOR PHOTONICS

DS PDB-C171SM Rev. A
 A Division of Optoelectronics
Silicon Photodiode

Care and handling instructions

Your optoelectronic components are packaged • Optoelectronic components in plastic packages
and shipped in opaque, padded containers to avoid should be given special care. Clear plastic
ambient light exposure and damage due to shock from packages are more sensitive to environmental
dropping or jarring. stress than those of black plastic. Storing devices
in high humidity can present problems when
Care must be taken to avoid exposure to high ambient soldering. Since the rapid heating during soldering
light levels, particularly from tungsten sources or stresses the wire bonds and can cause wire to
sunlight. bonding pad separation, it is recommended that
devices in plastic packages to be baked for 24
• These components can be rendered inoperable hours at 85°C.
if dropped or sharply jarred. The wire bonds are
delicate and can become separated from the • The leads on the photodiode SHOULD NOT
BE FORMED. If your application requires
bonding pads when the component is dropped or
lead spacing modification, please contact
otherwise receives a sharp physical blow.
Advanced Photonix Applications group at
• Most windows on photodiodes are either silicon [email protected] before
or quartz. They should be cleaned with isopropyl forming a product’s leads. Product warranties
alcohol and a soft (optical grade) pad. could be voided.

• Photodiode exposure to extreme high or low • Most devices are provided with wire or pin leads for
storage temperatures can affect the subsequent installation in circuit boards or sockets. Observe
performance. Maintain a non-condensing the soldering temperatures and conditions
environment for optimum performance and specified below:
lifetime.
• Soldering Iron: Soldering 30 W or less
• All devices are considered ESD sensitive. • Temperature at tip of iron 300°C or lower.
The photodiodes are shipped in ESD protective • Dip Soldering: Bath Temperature: 260±5°C.
packaging. When unpacking and using these • Immersion Time: within 5 Sec.
products, anti-ESD precautions should be • Soldering Time: within 3 Sec.
observed. • Vapor Phase Soldering, Reflow Soldering:
DO NOT USE
• Photodiode packages and/or operation may
be impaired if exposed to CHLOROETHENE,
THINNER, ACETONE, TRICHLOROETHYLENE
or any harsh chemicals.

Legal Disclaimer
Information in this data sheet is believed to be correct
and reliable. However, no responsibility is assumed for
possible inaccuracies or omission. Specifications are
subject to change without notice.

Most of our standard catalog products

are RoHS Compliant. Please contact
us for details.

www.advancedphotonix.com / +1 805 987 0146 PASSION FOR PHOTONICS

DS PDB-C171SM Rev. A