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Fremont Micro Devices Application Manual

MCU Application Note

[Rev 1.1]

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table of Contents

Chapter 1 Application design considerations............................ ................. ................................ .................. ... 5

1 Interrupt precautions ............................................... ................................................. .....................................5

2 Key-press wake-up function .......................................... .. ................................................ . .........................................6

3 EEPROM precautions ............................................... ................................................. ............ 7

4 Sleep and low power consumption ........................ .......... ....................................... ........... ................................... 8

5 Internal pull-up/pull-down resistor function ... .................................... ............. ............................. 8

6 PORTA port operation precautions ............................................ ................................................ .. ...................... 8

7 Precautions for using external crystal oscillator ............................ ............... .................................................. ............ 9

8 Precautions for using the communication interface ........................................... . ....................................... ............................. 9

9 PWM application considerations ............................. ................. ................................ .................. ............. 9

Chapter 2 Simulation Precautions.................. ............................ ..................... .......................... 10

1 Simulation tool version .............................................. .................................................. ...................................... 10

2 Simulation connection method .............................................. .................................................. ...................................... 10

3 Handling of simulation download failure ............................................ .................................................. ................................ 10

4 External power supply simulation method ............................ .................................................. ................................ 11

Chapter 3 Precautions for Burning............................................. ................................................ .. ......................... 12

1 Connect to the automatic burning machine ... ........................................ ...............................................12

2 Read back the chip check code ... ........................................ ......... ....................................... 12

3 Burner mode setting ............................................ .. ............................................... ... .........12

4 The power supply voltage of the writer ... ....................................... ..........................................13

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5 Burner burns on the board .......................................... .. ............................................... ... ..................................... 13

6 Handling of programming failure ............................ ....... ................................ .................. ............ 13

Chapter Four Precautions for using IDE............................. ................. ........................................ 14

1 Compilation error prompt .............................................. .................................................. ............ 14

2 Add header file .............................................. ................................................ .. .........................................14

3 IO functions of ICSPCLK and ICSPDAT ................................. ................................................. ..... 14

4 Turn off the watchdog during simulation ... ........................................ .........................................14

5 Project compilation failed ............................................ .. ............................................... ... .................................... 14

6 Export EEPROM file ............................................ ............................................... ... .......................... 15

7 IDE burn HEX file ................................... ................................................ .. ............................... 15

8 The check code is different after updating the IDE ........................................ . ....................................... ......................... 15

9 Library file packaging settings ............................................. ................................................ .. ...................................15

Chapter 5 Precautions for Burning Software... ......................................... ........ .................. 16

1 Burner connection ............................................ ... ................................................. ........................16

2 Import file ............................................... ................................................. ..........................................16

3 Read the check code of the chip ............................ .............. ................................... ............... ..................... 17

4 The function of each button of the writer software ........................................ . ....................................... .........................17

5 The writer software does not display the FT61F04X chip ............................... ......... ........................................................ 17

6 Description of the alarm reminder of the writer ... ...................................... ...........................................17

Chapter VI Assembly Language Programming Notes... ......................................... ........ ........... 19

1 pseudo-instruction BANKSEL ............................................. . ....................................... ..................................... 19

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2 Assembly instruction cycle ............................................ .. ............................................... ... ....................................19

3 Function description of assembly instruction ............................ ...... ................................. ................. ................ 20

4 Compilation look-up table ............................................ .................................................. .............................................. twenty one

5 LJUMP and LCALL commands ............................................. .................................................. ......................... twenty one

6 Use of labels ............................................ .. ............................................... ... ........................................ twenty one

Chapter VII C language programming precautions............................................ .. ............................................... ... ..... twenty two

1 Include header files .............................................. ................................................ .. ......................................... twenty two

2 Variable type ......................................... ...... ................................................. ....................................... twenty two

3 Variable declaration ... ............................................ ..... ....................................................... . twenty two

4 Absolute address variable .............................................. .................................................. ...................................... twenty three

Chapter 8 Precautions for Use of Specific Models.......................................... .................................................. .......... twenty four

1. FT60F01X ............................................... .. ................................................ . ....................................... twenty four

2. FT60F02X ............................................... .. ................................................ . ....................................... twenty four

3. FT60F12X/FT60F11X ............................................. .. ................................................ . ...................... twenty four

4. FT61F02X ............................................... .. ................................................ . ....................................... twenty four

5. FT61F04X ............................................... .. ................................................ . ....................................... 25

6. FT61F14X ............................................... .. ................................................ . ....................................... 25

7. FT62F08X/FT61F08X ............................................. ............ ...................................... ........... ............ 25

8. FT62F21X/FT60F21X ............................................. .. ................................................ . ............ 25

9. FT62F13X/FT61F13X ............................................. ............ ...................................... ........... ............ 25

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Chapter One Application Design Notes

1 Interrupt considerations

The interrupt vector address of the chip is 04H.

When an interrupt event occurs during the running of the program, the CPU will store the current PC value of the program on the stack, and then start from address 04H

The interrupt program is executed until the RETI instruction is executed, and the PC value in the stack is retrieved and returned to the main program to continue execution.

The interrupt protection scene and the recovery scene program are used to protect the scene information when the program enters the interruption, such as accumulator W and status register

The value of STATUS. If PCLATH is rewritten in the interrupt, a buffer register needs to be added to protect PCLATH. Such as

If the PCLATH value is not rewritten in the interrupt, the protection is not required. The procedures for protecting the site and restoring the site can ensure that the

The scene information before and after is consistent, and the main program can continue to be executed correctly after the interrupt returns.

The recommended procedures for on-site protection and restoration are as follows:

W_TMP EQU 0x70; Cache register for protecting W value (0x70-0x7F is the common interval)

S_TMP EQU 0x71; buffer register to protect STATUS value

ORG 0004H ; Pseudo-instruction, defines the entry address of the interrupt program

STR W_TMP ; Enter the interrupt program, start to protect the scene, and store the value of W in the cache

SWAPR STATUS, W; store the upper four digits and lower four digits of STATUS into W after swapping

STR S_TMP ; Store the value of W into the S_TMP cache

BANKSEL PORTA ; Set BANK to BANK0 where PORTA is located

; Interrupt handler ; Omitted interrupt handler

; Interrupt handler ; Omitted interrupt handler

INT_RET: ; Interrupt return label, start to restore scene

SWAPR S_TMP, W; swap the high and low four bits of the S_TMP buffer and store them in W

STR STATUS ; Save W value into STATUS, restore STATUS value

SWAPR W_TMP,F ; Swap the high and low four bits of W_TMP

SWAPR W_TMP,W ;Swap the high four bits and low four bits of W_TMP and store them in W

RETI ;Interrupt return

W_TMP and S_TMP need to be defined in the address range 0x70-0x7F, which is shared by all BANKs, in case they are in other BANKs

When entering the interrupt, the interrupt information will be lost.

You need to set BANK after interrupting the protection site.

If the register in BANK0 is to be processed in the interrupt handler, then BANK needs to be set in BANK0.

If the register in BANK1 is to be processed in the interrupt handler, then BANK needs to be set in BANK1.

If the bank is not set after entering the interrupt, the program will directly operate to the register in BANK0 after BANK1 enters the interrupt.

An error will occur when registering. In the same way, when BANK0 enters the interrupt, the operation to the register in BANK1 will also cause an error.

The above are the matters needing attention when programming with assembler, and there is no need to pay attention when programming with C language.

The C compiler will automatically set the interrupt protection site and restore the site program.

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2 Button wake-up function

When the application needs to save power, it usually uses sleep plus key-press wake-up. The key-on wakeup function requires this IO to have power

Level change interrupt function, the level change interrupt function of most of the FMD chips is on the PORTA port, and some chips have falling edge change

For interrupts (such as PORTA of the FT61F04X series), you need to pay attention to the level status.

The recommended wake-up procedure for interrupt-on-change is as follows:

GIE=0; //Close the total interrupt

ReadAPin = PORTA; //Read the port status and store it in the buffer, set the initial value of the level change interrupt match

PAIF =0; //Clear level change interrupt flag

IOCA2 =1; //Enable the interrupt-on-change function of PA2

PAIE =1; //Enable interrupt on level change

NOP(); //It is recommended to add 1 to 2 NOP instructions

SLEEP(); //Go to sleep

NOP(); //Need to add 1 NOP instruction after sleep

ReadAPin = PORTA; //Read the port status and store it in the buffer to eliminate the level change interrupt matching condition

PAIF =0; //Clear level change interrupt flag

IOCA2 =0; //Close the interrupt on level change function of PA2

PAIE =0; //Turn off the interrupt on level change

GIE=1; //Open the total interrupt

The following points should be paid attention to when waking up by interrupt on change:

1) The IO state of this button needs to be set in the initialization. For example, set as input port and enable internal pull-up resistor function, IO

Connect to the ground through the button series resistor. In this way, when there is no button, the level of the port is fixed at high level. When the button is pressed, the port level is changed by

High becomes low, trigger level change interrupt.

2) From reading the port status to entering sleep, the fewer instructions in between, the better.

3) The action of turning off the general interrupt GIE before sleep will make the chip continue to execute the program after SLEEP after waking up.

4) If the general interrupt GIE is not turned off before sleep, it will jump to the interrupt entry address 04H to execute the interrupt program after waking up.

After the interrupt returns, continue to execute the program after SLEEP. Therefore, it is necessary to add read port status and clear level changes in the interrupt program

The action of the interrupt flag, so as not to cause the program to repeatedly enter the level change interruption because the conditions of the port level change interruption have been matched.

The following procedures are not executed.

The recommended routine is as follows:

void interrupt ISR(void) //Interrupt function

if(PAIE && PAIF) //PA level change interrupt

ReadAPin = PORTA; //Read the port status and store it in the buffer to eliminate the on-change interrupt matching condition

PAIF = 0; //Clear level change interrupt flag

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3 EEPROM precautions

1) When using the EEPROM program, in order to prevent unstable voltage during power-on, the reading and writing of EEPROM may become unstable.

Need to add about 100ms delay before EEPROM operation. If PWRT (power-on delay) is enabled in the code option, then

The program only needs to add about 40ms delay before reading and writing EEPROM.

2) Before using EEPROM, you need to initialize the EEPROM. If any EEPROM is not used

Write the address "0xAA" twice, and subsequent programs do not operate to this address. such as:

void SYSTEM_INITIAL (void)

EEPROMwrite(0xFF,0xAA);

EEPROMwrite(0xFF,0xAA); //Write 0xAA twice at any unused address (0xFF)

3) The process of writing EEPROM data needs to follow the routine steps below:

void EEPROMwrite(unchar EEAddr,unchar Data)

GIE = 0; //Step A: Write data must close the interrupt

NOP(); //Note: When the chip is running at 1T, NOP() should be added here

while(GIE); //Step B: Wait for GIE to be 0

EEADR = EEAddr; //Step C: Write the address of EEPROM

EEDAT = Data; //Step D: Write the data to be written to EEPROM

EECON1 |= 0x34; //Step E: Set WREN1, WREN2, WREN3 three flags.

WR = 1; //Step F: Set WR to start hardware EEPROM programming

NOP(); //Note: When the chip is running at 1T, NOP() should be added here

while(WR); //Step G: Wait for the completion of EEPROM writing (the process is about 2ms)

GIE = 1; //Step H: Write complete, turn on interrupt

If the watchdog is enabled by the software, the watchdog needs to be cleared after entering the EEPROM writing program.

If part of the application has other functions to be implemented in the interrupt (such as analog PWM output), the EEPROM has been written

The interrupt cannot be closed within 2ms of the process, and the positions of step H and step G can be interchanged.

4) After writing the EEPROM data, compare the actual value of the EEPROM with the target value to be written. in case

If they are equal, the writing is successful; otherwise, the writing fails and the program can take the rewrite operation.

EEPROMwrite(0x00,0xCC); //Write 0xCC to the 00H address of EEPOM

EEReadData = EEPROMread(0x00);//Read 0x00 address EEPROM value

if(EEReadData!=0xCC) //Judge whether the actual value is equal to 0xCC

EEPROMwrite(0x00,0xCC); //Write 0xCC to the 00H address of EEPOM again

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5) If an external reset, WDT overflow reset, LVR reset or illegal command occurs during EEPROM writing

Caused by reset, then the flag bit EECON1.WRERR will be set to 1. It can be judged by reading this flag bit during power-on initialization.

Whether an abnormal situation occurs during an EEPROM writing process, and then take corresponding measures.

4 Sleep low power consumption

In some battery applications or applications that require low power consumption, the chip must use sleep to reduce the power consumption of the whole machine.

The sleep current of the FMD chip can be as low as 3uA, and as low as 0.3uA.

When entering sleep, you need to pay attention to the following aspects:

1) As far as possible, close the peripherals that are not used by the chip.

2) After the LVD/LVR function is activated, there will be a current of about 15uA. During sleep, you can choose to turn off the LVD/LVR function according to the actual situation.

Turn on after wake up from sleep.

3) Normal IO should be set according to application needs during sleep. If it is a normal output port, it should be set to a power-saving output. if

For ordinary input ports, the input port should be kept at a fixed level and cannot be in a floating state.

4) Whether FOSC is selected as INTOSC in the compilation options. If INTOSC is selected, it will cause the CLKO pin of the chip to output frequency

It is a square wave of Fosc/4, which affects the sleep current.

5) Because some chips are not fully encapsulated, these IOs need to be set to avoid floating input states.

6) The reset pin of some series of chips is multiplexed with the IO port, and when used as an input port, there is no internal pull-up and pull-down resistor. Need special attention if this

If IO is not used, it is necessary to set MCLRE in the code option to MCLR function to avoid this IO in a floating input state. Such as

PA3 of FT60F01X and PA5 of FT60F02X.

7) If the application is special, turning off the watchdog function can reduce the current by about 3uA.

5 Internal pull-up/pull-down resistor function

The internal pull-up resistor/pull-down resistor only takes effect when the IO is in the digital input port.

1) Turn off other analog functions of the IO port first (some chips are analog ports by default).

2) Set the corresponding IO as input port.

3) Turn on the corresponding pull-up resistor/pull-down resistor control switch.

4) The PORTA port of some chips also needs to set OPTION. 7=0 (/PUPA) to enable the PORTA pull-up resistor.

6 PORTA port operation precautions

PORTA is an 8-bit bidirectional port. The corresponding entry and exit direction register is the TRISA register.

Conversely, setting a bit to 0 will set the corresponding PORTA port as an output port.

When set as an output port, the output drive circuit will be turned on, and the data in the output register will be placed on the output port.

When the IO is in the input state, read PORTA, and the content of PORTA will reflect the state of the input port.

When writing on PORTA, the contents of PORTA will be written into the output register.

All write operations are a "read-change-write" process, that is, the process in which data is read, then changed, and then written to the output register.

This feature requires special attention when operating some LED digital tubes.

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In some applications, it is necessary to set the RDCTRL in the compilation option to LATCH according to the situation, and read the return from PORTA in the output state

The value is the buffer value of PORTA, not the real level value on the PAD.

7 Precautions for using external crystal oscillator

When using an external crystal oscillator, when the adjacent pins of the MCU crystal oscillator input and output high-frequency pulses, they will interfere with the crystal oscillator and cause the crystal oscillator to jitter, thereby affecting

Timing, causing timing deviation.

The specific neighboring pins are combined with the package pin map to see: For example, FT61F145-TRB, PC0 is the neighboring pin of the crystal oscillator. When using an external crystal oscillator, PC0

Do not use it as a high-frequency signal input and output IO port, see the following figure for details:

model Adjacent foot Crystal foot Adjacent foot Same model

FT60F02X PA1 PA7,PA6 VDD

FT61F02X VDD PA7,PA6 PA5

FT61F04X NC PA6,PA7 PC5

FT60F22X PA5 PA6,PA7 PB5

FT60F12X VDD PA7,PA6 PA5 FT60F11X

FT61F13X GND PC1,PC0 PB7 FT62F13X

FT62F08X PC0 PC1,PB7 GND FT61F18X

FT61F14X PC0 PC1,PB7 GND

FT64F0AX PC0 PC1,PB7 GND FT61F0AX

8 Precautions for using the communication interface

1) I2C

Plug-in FT24C02: SDA and SCL are set to open-drain output and need external pull-up

2) SPI

The external FT25C64 is connected to 4 wires, SO, SI, SCL are set as open-drain output, and external pull-up is required, and CS is driven by ordinary IO

3) USART

The direction register of TX should be set as output, and RX should be set as input

9 PWM application considerations

Although the double buffering of the period and duty cycle largely guarantees that the PWM output does not produce glitches, if the software is very close

Write cycle and duty cycle registers at the time of TIM matching, especially if the TIM clock frequency is faster than the system clock, it is possible

Unforeseen circumstances occur, resulting in the register is not the expected value, it is strongly recommended to update the period and duty cycle registers, only in TIM

The match interrupt is done inside.

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Chapter 2 Simulation Considerations

1 Simulation tool version

The simulation tool is divided into three parts, the upper computer software of the emulator (IDE), the emulator (Link), and the firmware FW of the emulator.

The version information of the IDE can be viewed in the "Menu Bar-Help-About..." of the IDE interface, such as 2.1.0.

The latest IDE software can be downloaded from the official website http://www.fremontmicro.com/.

Turn off the anti-virus software before installation. It can be installed on Disk D. The new IDE has a built-in C compiler, so you don't need to call it separately.

The version of Link is less updated, and the version silkscreen is printed on the PCB panel, such as Link_V2.5

The firmware FW version information of the emulator can be displayed in the lower right corner of the IDE after the Link is plugged into the computer, such as FW Ver: V0.0.17, one

Usually upgrade with the version of IDE. If you need to upgrade or downgrade manually, you can click "Menu Bar-Help-Update Firmware..." to update

The new firmware and update files are saved in the IDE "installation directory\Update\AppUpdate.bin".

2 Simulation connection method

1) Connect the emulator LINK to the computer, and use the jumper to select the power supply voltage for the chip in the voltage option at the upper right corner of the emulator.

2) Connect the VCC, GND, CLK, and DAT pins on the right side of the LINK to the chip VCC, GND, ICSPCLK, and ICSPDAT.

3) After opening the project, click the Build All button and the compilation options will pop up. After selecting the compilation options, click OK, the IDE can pass LINK

Download the program to the chip.

4) After the download is complete, it will automatically enter the DEBUG interface. Use the icon on the DEBUG toolbar to perform simulation debugging.

It should be noted that the emulator needs to re-power on the chip when downloading the program, so the target board cannot be connected to an external power supply, and the target board

It is best not to have a large capacitor (above 100uF) affecting the re-power on of the chip.

Do not connect ICSPCLK and ICSPDAT with other components that will affect the debugging communication level status.

3 Handling of simulation download failure

The failure of downloading in simulation debugging can be analyzed in two cases. One is the download failure when a separate chip is connected with Link, and the other is

The download failed during board debugging.

In view of the first case, the analysis is divided into the following steps:

1) Check whether the tool version is the latest.

2) Check whether the connection between Link and the chip is correct and whether the contact is good.

3) Check whether the voltage of LVR in the code option is higher than the output voltage of Link.

4) Check if the chip model is correct, replace the chip for test.

5) Check whether the communication level waveform of the chip VCC, ICSPCLK, ICSPDAT is normal.

For the second case, analyze it in the following steps:

1) Use Link to connect the chip separately, and check according to the first case. If it can be downloaded, proceed to the next step.

2) Check if there is a large capacitance exceeding 100uF between VCC and GND of the chip.

3) Check whether there are capacitive devices or other components on the CLK and DAT pins of the chip that affect the communication level.

4) Check whether the reset pin function of the chip is turned on. Set MCLRE in the compile option to PA3/PA5.

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4 External power supply simulation method

1) Change the voltage selection jump of the emulator from 3.3V/3.7V/5.0V to External.

2) Connect the external power supply VCC to the VCC of the P1 port of the emulator.

3) Connect the GND terminal of the external power supply to the GND of the P1 port of the emulator.

4) Connect the Program four wires of the emulator to the VCC, GND, ICSPCLK, ICSPDAT of the chip on the emulation board.

5) The external power supply voltage must not exceed 5.5V.

When using external power supply for simulation, the emulator needs to control the external power supply to the target board. The target board and the external power supply are not

It can be directly connected, and the connection must be controlled through the emulator.

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Chapter 3 Notes for Burning

1 Connect to automatic burner

1) The burner power supply uses 7.5V/9V power supply.

2) PROGRAM, BUSY, OK, FAIL, GND and GND on the back of the 20PIN horn socket of the writer are not marked below

Note the pins (3.3V) are respectively connected to the START, BUSY, OK, NG, GND, VCC of the serial line of the burning machine. note

Do not connect the pin marked VDD to the VCC of the machine.

3) Set the start level, BUSY level, OK level, and NG level to L effective in the setting of the burner option of the burner.

The default settings are used for all parameters.

2 Read back the chip check code

1) Place the chip on the writer according to the programming pins.

2) Tap the KEY_MODE button on the burner.

3) The burner emits a "di" prompt sound and displays "IC's checksum: XXXX" on the display.

4) If this result does not appear, you need to check whether the chip is empty or whether the chip connection is normal.

3 Burner mode setting

The writer has two major function modes: Write programming mode and Check verification mode.

After downloading the program to be verified to the writer, press and hold the KEY_MODE button until the screen of the writer displays "Write Flash",

Enter the writer function selection mode, at this time you can switch the writer mode through the red button.

There are the following modes under the Write function (the writer will automatically select the programming mode when downloading the program, it is not recommended to switch manually):

Write Flash: Programming chip HEX

Write Flash EEPROM: Programming chip HEX and EEPROM.BIN

Write Fla EEP Rcode: Burn the chip program HEX and EEPROM.BIN, burn the rolling code

Write Fla EEP Rd FOSC: burn chip program HEX and EEPROM.BIN, burn rolling code and calibrate frequency

Write Flash Rcode: Burn chip program HEX and rolling code

Write Fla Rd FOSC: Burn chip program HEX, burn rolling code and calibrate frequency

Write Fla FOSC: Burn the chip program HEX and calibrate the frequency

Write Fla EEP FOSC: Burn chip program HEX and EEPROM.BIN and calibrate frequency

Write EEPROM: Burn EEPROM.BIN

Write EEPROM R_code: Write EEPROM.BIN and rolling code

There are three modes under the Check function:

Check FOSC: Check the chip frequency (this mode will erase the chip program, you need to reprogram after checking)

Check Flash: Check procedure (only applicable when the code is not encrypted: CPB=Disable)

Check checksum num: Checksum of the chip (can be connected to the machine to automatically detect)

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4 The power supply voltage of the writer

There are two ways to power the writer:

1) It is powered by USB, and the 5V power supply is connected to the USB cable.

2) It is powered by a DC power supply with a power supply voltage of 7.5V or 9V.

5 Burner burns on the board

Connect the P1 row on the writer to the corresponding VDD, GND, CLK, DAT, FOSC right row pins and the corresponding pins on the target board

Ready to burn. Refer to the figure below for details:

Some applications require that the reserved programming port does not lead to FOSC to detect the chip frequency. At this time, it needs to be in the setting interface of the burner software

After importing the program file, uncheck the Test Frequency option below, and you can burn through four wires.

6 Processing failure

There are two situations where the programming failure can be analyzed, one is the failure when programming the chip alone, and the other is the failure when programming the board.

For the first case, the analysis is divided into the following steps:

1) Check whether the tool version is the latest and the chip model is correct.

2) Check whether the wiring between the writer and the chip is correct and whether the contact is good.

3) Check whether the voltage of LVR in the compilation option is higher than the output voltage of the writer (the option is popped on the right side of the writer's display).

4) Check whether the chip VCC, ICSPCLK, ICSPDAT communication level waveform is normal.

5) Check whether the FOSC in the compile option of the program is the external crystal oscillator mode, if the external crystal oscillator mode is adopted, and FCMEN

The clock failure detection function is disabled, which will cause the chip to fail to start and enter the programming mode.

For the second case, analyze it in the following steps:

1) Use the writer to connect the chip separately, and check according to the first situation. If it can be programmed, proceed to the next step.

2) Check if there is a large capacitance exceeding 100uF between VCC and GND of the board chip.

3) Check whether there are capacitive devices or other components on the CLK and DAT pins of the board chip that affect the communication level.

4) Check whether the reset pin function of the on-board chip is turned on. Set MCLRE in the compile option to PA3/PA5.

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Chapter 4 Notes for IDE Use

1 Compile error prompt

1) Prompt "This Language Toolsuite is not Exists" when compiling

Generally, it is caused by the C compiler is not installed or the calling path is wrong. After opening a project in the IDE directory, "menu bar

-Project-Select Language Toolsuite..." In the pop-up box, click Browse... to select the editor under the installation directory of the compiler

The translator program is fine.

2) Prompt "File not exist" or "No such file or directory" when compiling

Programming in assembly language requires including header files at the beginning of the program:

#include <header file.inc> or #include "header file.inc". Their difference lies in the location of the header file:

When using #include <header file.inc>, the compiler will look for this header file in the IDE software directory.

When using #include "header file.inc", the compiler will look for this header file in the current project directory.

2 Add header files

Users can add custom header files by including XXX.inc or include XXX.h. After the compilation is passed, the header file will show

In the Include File directory of File View. It does not currently support adding directly in Include File manually.

3 IO functions of ICSPCLK and ICSPDAT

During simulation, LINK will occupy ICSPCLK and ICSPDAT to communicate with the chip, so ICSPCLK and ICSPDAT cannot be used during simulation.

Simulate common IO functions. ICSPCLK and ICSPDAT can realize ordinary IO only after the program download is completed and the power is turned on again

Features.

4 Turn off the watchdog during simulation

During emulation, if the watchdog function is enabled, pay attention to the watchdog, otherwise a reset will be generated when the watchdog overflows, making the IDE unavailable

The correct PC value, resulting in a simulation error. It is recommended to turn off the watchdog function during simulation debugging, and then turn on the watchdog when testing the whole machine

Features.

5 Project compilation failed

1) Caused by header files.

The C language used in the IDE needs to include the header file SYSCFG.H, and the assembly language includes the chip series .inc header file.

2) Caused by the installation directory of the C compiler.

The win10 system will prohibit the IDE from modifying the files in the C compiler under the system disk. Install the C compiler on a non-system disk or mouse

Right-click the main IDE program and select Run IDE as administrator to solve this problem.

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6 Export EEPROM file

1) Open the project and select Project->Export EEPROM Data in the menu bar to generate a .bin type file.

2) Since the IDE does not support online editing of EEPROM files, it is recommended to use third-party text editing software to edit EEPROM files.

Line editing. Take UltraEdit as an example, use UltraEdit to open the file and select Edit -> Hexadecimal Function -> Hexadecimal in the menu bar

Edit, you can edit 256 bytes of EEPROM data.

7 IDE burn HEX file

At present, the project can only be compiled and downloaded through the IDE's Build All. A single HEX file can only be used to burn the chip through the burner.

The subsequent IDE will add the function of burning HEX files separately.

8 The check code is different after updating the IDE

Because the early IDE version has opened the function of LVRS=1.8V, some program compilation options use the project with LVRS=1.8V.

After compiling with the new IDE, LVRS will be upgraded to 2.0V by default. The program verification code will contain the content in the compilation options, so the verification

The code will be slightly different from the previous check code.

If the check codes differ greatly, it is recommended to check whether the C compiler is a restricted version (the compilation information will prompt Lite Mode).

9 Library file packaging settings

1) Establish project documentation.

2) Write the program to be packaged into a C file and include it in the project file.

3) After the compilation is complete, an lpp file with the same name as the C file will be generated in the project directory.

4) Include the lpp file into LIB File, delete the sub-file and recompile it.

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Chapter 5 Notes for Burning Software

1 Burner online

1) The writer is connected to the computer via a USB cable.

2) Open the writer software, the software version number will be displayed in the upper left corner of the software, such as FMDWriter V5.1.

3) The firmware version number will be displayed after DRV Ver under the FMD icon at the top right of the writer software: such as DRV Ver: V2.1.0. If not

If the version number is displayed, it means that the writer is not connected successfully. It is recommended to plug in the USB cable and reconnect it.

4) If the burner firmware version is lower, it will prompt that the firmware version has expired after connecting to the burning software.

Choose OK in the dialog box, wait for about two minutes, the burner will automatically complete the update. After the firmware update is complete, you need to

New connection, after successful reconnection, the current firmware version number will be displayed behind DRV Ver.

5) You can manually update the firmware by clicking the FMD icon at the top right of the burner software.

2 Import files

Click the "Device\Settings" button, the writer software will automatically pop up a setting option box.

After selecting the chip series and model, select Flash file and EEPROM file in the file below.

If you need to burn the program file, click Browse to select the Flash file to be burned.

If you need to burn EEPROM, click Browse to select the EEPROM file to be burned.

Select the program file separately, the writer only burns the chip program area, and does not affect the original EEPROM data of the chip.

Select the EEPROM file separately, the writer only burns the chip EEPROM area, and does not affect the original program data of the chip.

If you do not select a file, you can only read the chip data through the burning software.

After importing the file, other function settings of the burner:

1) Frequency measurement: 5% (enabled by default)

Through the chip FOSC, test whether the internal frequency deviation of the chip exceeds ±5%. If it exceeds ±5%, it is judged as an NG chip.

2) School frequency: 1% (default closed)

Through the chip FOSC test whether the internal frequency deviation of the chip exceeds ±1%, if it exceeds ±1%, the writer will calibrate the frequency to ±1%

If the chip cannot be calibrated within ±1%, it is judged as an NG chip. Because the chip factory test frequency deviation range is within ±1.5%,

Checking this option will cause some normal chips to be judged as NG because they cannot be calibrated within ±1%. Therefore, customers are not recommended to check it under normal circumstances.

Choose this option. For some special applications, if the internal frequency deviation range of the chip does not exceed ±1%, you can check this option.

3) Start value and maximum value of programming number

It is used to set the burning quantity of the burner. When the burning chip reaches the maximum value, the burner will no longer burn, and the file needs to be imported again.

4) Rolling code

Used to set the chip rolling code, which is stored in the chip EEPROM area.

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3 Read the check code of the chip

The check code of the chip can be read back through the Key_Mode button on the writer and displayed on the screen of the writer.

In addition, the writer software can also read the contents of the program area and EEPROM area of the chip.

If the chip CPB encryption is enabled, only EEPROM file can be read.

For the data read back, click Flash in IC or EEPROM in IC to view the corresponding data.

4 Function of each button of the writer software

Auto Program: The writer will execute "erase", "program burning" and "program verification" in sequence

Erase: Only erase the chip (Flash and EEPROM can be selected for erasing)

Blank Check: Only blank check the chip

Program: Only perform the programming action on the chip, do not verify whether the programming is successful

Verify: Check whether the code in the chip is correct (if CPB is enabled in the programming program, it cannot be verified)

Read: Read chip information (if the chip is encrypted, only check code and EEPROM data can be read)

Setting: Set the number of burns

Rolling Code: Rolling code setting

Calibration Frequency: Calibration frequency (after checking, the chip will automatically calibrate when the frequency offset is detected)

Test Frequency: Test frequency (after checking, the chip that detects the frequency offset will be processed as NG)

5 The writer software does not display the FT61F04X chip

After clicking the Device/Load button, a dialog box for selecting the chip model will pop up.

If there is no serial number of the current chip, you need to check:

1. Whether the writer is online normally. (Does DRV Ver show the burner firmware number?)

2. Whether the burner is a yellow version burner. Early black/blue/green programmers cannot burn chips with 4K and above capacity.

3. If it is the yellow version, please confirm whether the burner firmware number is the latest version.

6 Burner alarm prompt description

Write Flash fail: Failed to burn flash

Write UCFG fail: Failed to burn user configuration

Write EEP fail: Eeprom burning failed

Write UID fail: Failed to burn rolling code

NO Flash File: There is no burning program in the burner

No Eeprom File: There is no eeprom program in the writer

Uid Not Loaded: There is no rolling code in the burner

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ALL UIDs USED: All rolling codes have been used up

Rd CPU_STAT Err: The chip pin is connected to the wrong or poor contact

Read ICID Err: The burning chip does not match the HEX corresponding model downloaded by the burner

ICID_1T MATCH NG: FT61F14X, FT61F0AX, FT64F0AX, FT67F0AX Some versions do not support 1T work

mode

fosc check fail: The frequency measurement failed, the core frequency deviation is too large or the CLKO pin is connected incorrectly, and the contact is poor.

fosc cal fail: chip frequency calibration failed

Read FCFG Err: If it is an encryption program, it means that the password is different from the secret of the chip configuration. After confirming the passwords of both parties

Burn again; or the internal information of the chip is wrong.

No ICSeriesinfo: After the new firmware is updated, it will prompt the user to import the burning program

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Application Manual

Chapter 6 Assembly Language Programming Notes

1 pseudo-instruction BANKSEL
The pseudo-instruction BANKSEL is used to set the bank of the register, which is used to set the bank to the register behind BANKSEL

BANK.

Such as FT60F01X and FT60F02X:

BANKSEL PORTA; Because PORTA is in BANK0, the instruction is equivalent to BCR STATUS,5

BANKSEL TRISA; Because TRISA is in BANK1, the instruction is equivalent to BSR STATUS,5

In FT61F02X, there are 3 registers BANK: BANK0, BANK1, BANK2, which need to pass BIT5 of STATUS,

BIT6 to set, so one BANKSEL is equivalent to two commands.

BANKSEL PORTA is equivalent to:

BCR STATUS,5

BCR STATUS, 6

BANKSEL TRISA is equivalent to:

BSR STATUS,5

BCR STATUS, 6

This must be paid attention to when the number of instructions needs to be calculated accurately.

2 Assembly instruction cycle

The assembly instruction cycle refers to the time required to execute an assembly instruction.

According to different series of chips, the instruction cycle time will be different.

At present we have 1T, 2T, 4T instruction cycles.

The instruction cycle of 1T means that it takes 1 system clock cycle to execute an assembly instruction cycle.

The instruction cycle of 2T means that it takes 2 system clock cycles to execute an assembly instruction cycle.

The instruction cycle of 4T means that it takes 4 system clock cycles to execute an assembly instruction cycle.

For example: FT60F01X is 4T instruction cycle.

When OSCCON.IRCF[2-0]=111 is selected, the internal oscillation frequency Fosc=16M. The system clock cycle is 1/16M second.

At this time, one instruction cycle is 4*1/16M=1/4M second=0.25us. That is, it takes 0.25us to execute a NOP.

FT60F02X is 2T/4T optional instruction cycle. The 2T instruction cycle can be selected in Tsel of the code option.

When OSCCON.IRCF[2-0]=111 is selected, the internal oscillation frequency Fosc=16M. The system clock cycle is 1/16M second.

At this time, one instruction cycle is 2*1/16M=1/8M second=0.125us. That is, it takes 0.125us to execute a NOP.

Most FMD assembly instructions are single-cycle instructions, that is, one instruction occupies one instruction cycle.

Some instructions with jump PCL function are two-cycle instructions, such as LJUMP, LCALL, RET, RETI, and RETW.

Part of the judgment jump instruction is a double instruction cycle when the jump condition is met, and a single instruction cycle when the jump condition is not met. Such as BTSS,

BTSC, INCRSZ, DECRSZ.

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3 Assembly instruction function description

Mnemonic Influence sign cycle Function Description

BCR R,b NONE 1 Bit b of register R is cleared to 0

BSR R,b NONE 1 The b position of register R is 1

BTSC R,b NONE 1 or 2 If the bit b of the register R is 0, skip the next instruction. When a jump occurs, it is 2 cycles

BTSS R,b NONE 1 or 2 If the bit b of the register R is 1, skip the next instruction, and when a jump occurs, it is 2 cycles

NOP NONE 1 Null instruction

CLRWDT /PF, /TF 1 Watchdog

SLEEP /PF, /TF 1 Sleep instruction

STR R NONE 1 Store the value of accumulator W into register R

LDR R,d Z 1 Import the value of register R into accumulator W (d=W/0) or register R (d=F/1)

SWAPR R,d NONE 1 Exchange the high four bits and low four bits of register R and store them in accumulator W (d=W/0) or register R (d=F/1)

INCR R,d Z 1 The value of register R is increased by 1, and the result is stored in accumulator W (d=W/0) or register R (d=F/1)

The value of register R is increased by 1, and the result is stored in accumulator W (d=W/0) or register R (d=F/1)
INCRSZ R,d NONE 1 or 2
If the result is equal to 0, skip the next instruction, 2 cycles when a jump occurs

Add the value of accumulator W and the value of register R, and store the result in accumulator W (d=W/0) or register R (d=F/1)
ADDWR R,d C, HC, Z 1
If the result is greater than 255, then C=1

Subtract the value of accumulator W from the value of register R, and store the result in accumulator W (d=W/0) or register R (d=F/1)
SUBWR R,d C, HC, Z 1
If R>=W, then C=1

DECR R,d Z 1 The value of register R minus 1 is stored in accumulator W (d=W/0) or register R (d=F/1)

The value of register R is subtracted by 1, and the result is stored in accumulator W (d=W/0) or register R (d=F/1)
DECRSZ R,d NONE 1 or 2
If the result is equal to 0, skip the next instruction, 2 cycles when a jump occurs

ANDWR R,d Z 1 The value of register R is ANDed with the value of accumulator W, and the result is stored in accumulator W (d=W/0) or register R (d=F/1)

IORWR R,d Z 1 The value of register R is ORed with the value of accumulator W, and the result is stored in accumulator W (d=W/0) or register R (d=F/1)

XORWR R,d Z 1 The value of register R and the value of accumulator W are XORed, and the result is stored in accumulator W (d=W/0) or register R (d=F/1)

COMR R,d Z 1 The value of register R is inverted, and the result is stored in accumulator W (d=W/0) or register R (d=F/1)

RRR R,d C 1 The value of register R is shifted right with C bit, and the result is stored in accumulator W (d=W/0) or register R (d=F/1)

RLR R,d C 1 The value of register R is shifted to the left with the C bit, and the result is stored in accumulator W (d=W/0) or register R (d=F/1)

CLRW Z 1 Clear accumulator W

CLRR R Z 1 Clear register R

RETI NONE 2 Interrupt return

RET NONE 2 Subroutine return

LCALL N NONE 2 Call subroutine N

LJUMP N NONE 2 Jump to label N

LDWI I NONE 1 Import immediate data I into accumulator W

ANDWI I Z 1 The value of accumulator W is ANDed with the immediate data I, and the result is stored in accumulator W

IORWI I Z 1 The value of accumulator W is ORed with the immediate data I, and the result is stored in accumulator W

XORWI I Z 1 The value of accumulator W is XORed with the immediate value I, and the result is stored in accumulator W

RETW I NONE 2 The subroutine returns, and the immediate value I is stored in the accumulator W

ADDWI I C, HC, Z 1 The value of accumulator W is added to the immediate value I, and the result is stored in accumulator W. If the result is greater than 255, then C=1

SUBWI I C, HC, Z 1 The value of accumulator W is subtracted from the immediate value I, and the result is stored in accumulator W. If I>=W, then C=1

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4 Compilation table

Pay special attention to the processing of PCLATH when processing the table lookup function in the assembly instructions.

In the assembly, the table data is usually returned through RETW XXX. The commonly used digital tube look-up program routines are as follows:

LDR DIG_2,W ; Assign the second bit to W

LCALL GET_CODE; lookup table

STR TEMP0 ; Data is stored in TEMP0

ORG 0X300 ; Define table program address to 300H address

GET_CODE:

LDWI 0X03

STR PCLATH ; Set PCLATH=3 (follow the actual address of the form)

LDR BCD,W ; Lookup table

ADDWR PCL,F ;--GFEDCBA

RETW B'00111111' ;0

RETW B'00000110' ;1

RETW B'01011011' ;2

RETW B'01001111' ;3

RETW B'01100110' ;4

RETW B'01101101' ;5

RETW B'01111101' ;6

RETW B'00000111' ;7

RETW B'01111111' ;8

RETW B'01101111' ;9

RETW B'00000000' ;OFF

5 LJUMP and LCALL instructions

Because of the limitation of PC width, LJUMP and LCALL can only access 2KROM space at most.

When using LJUMP and LCALL instructions for chips with a program space of 2K, there is no need to consider jump errors.

When using LJUMP and LCALL to access the space above 2K for chips with a capacity of 2K or more, PCLATH needs to be set.

For chips with more than 4K program space, C language programming is recommended, and the compiler will handle it automatically.

6 Use of labels

When setting the subroutine label or position label in the assembly, you need to pay attention to adding an English colon to the label:

Without the colon, it will be recognized as a macro definition by the compiler. If there is no such macro definition in the header file, the compiler will report an error.

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Chapter 7 C language programming considerations

1 Include header files

The #include instruction must be used to include the "syscfg.h" file provided by the compiler at the beginning of the program to realize special function registers and other

It is a declaration of special symbols. There is no need to include the header file of the chip model separately, the IDE will call it automatically.

Other subroutine files and header files also need to be included in the Main file with the #include directive.

2 Variable type

The types of commonly used variables are as follows: It should be noted that char defaults to unsigned character variables.

Types of Length (bits) Mathematical expression

bit 1 Boolean variable

char 8 Character variable, the default is unsigned character variable

signed char 8 Signed character variable

unsigned char 8 Unsigned character variable

int 16 Integer variable, the default is a signed integer variable

signed int 16 Signed integer variable

unsigned int 16 Unsigned integer variable

long 32 Long integer variable, the default is a signed long integer variable

signed long 32 Signed long integer variable

unsigned long 32 Unsigned long integer variable

float twenty four Floating point

double twenty four Double precision floating point

3 Variable declaration

const: constant variable

If you add the prefix const declaration when the variable is defined, then the variable will become a constant variable, which cannot be

Its modification is usually used in the definition of a constant array.

volatile: resident memory variable

The C compiler will optimize the program, and some variables that have no practical effect in the program will be optimized.

The actual value of the variable cannot be observed. If you want the variable not to be optimized, you need to add the volatile prefix when defining the variable.

persistent: non-initialized variable

When the program is powered on and running, all defined variables will be cleared or set to initial values. But in many practical applications, the program does not run

Initialize part of the variables in sequence. At this time, you can add the persistent prefix declaration before the variable definition.

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4 Absolute address variable

Some applications need to put 8 bit variables in the same byte for batch operation, which can be done in two ways:

1) Realize by defining a bit field structure and a byte variable union:

union {

struct {

unsigned bit0: 1;

unsigned bit1: 1;

unsigned bit2: 1;

unsigned bit3: 1;

unsigned bit4: 1;

unsigned bit5: 1;

unsigned bit6: 1;

unsigned bit7: 1;

} oneBit;

unsigned char allBits;

} TESTFlag;

The operation when setting one of these bits is as follows: TESTFlag.oneBit.bit5=1; //bit5 position 1

The operation for batch resetting of bit variables is as follows: TESTFlag.allBits=0; //batch resetting of bit variables

2) Realize by defining the absolute address of the variable

volatile unsigned char TESTFlag @ 0x20; // TESTFlag is defined at address 0x20

bit TESTBit0 @((unsigned)&TESTFlag*8)+0; //TESTBit0 corresponds to the 0th bit of TESTFlag

bit TESTBit1 @((unsigned)&TESTFlag*8)+1; //TESTBit1 corresponds to the first bit of TESTFlag

bit TESTBit2 @((unsigned)&TESTFlag*8)+2; //TESTBit2 corresponds to the second bit of TESTFlag

bit TESTBit3 @((unsigned)&TESTFlag*8)+3; //TESTBit3 corresponds to the 3rd bit of TESTFlag

bit TESTBit4 @((unsigned)&TESTFlag*8)+4; //TESTBit4 corresponds to the 4th bit of TESTFlag

bit TESTBit5 @((unsigned)&TESTFlag*8)+5; //TESTBit5 corresponds to the 5th bit of TESTFlag

bit TESTBit6 @((unsigned)&TESTFlag*8)+6; //TESTBit6 corresponds to the 6th bit of TESTFlag

bit TESTBit7 @((unsigned)&TESTFlag*8)+7; //TESTBit7 corresponds to the 7th bit of TESTFlag

It should be noted that the compiler does not reserve address space for absolutely positioned variables.

The address of the variable TESTFlag in the above routine is 0x20, but the last address of 0x20 may be assigned to other by the compiler

Variables are used, so an address conflict occurs. Therefore, the absolute address of the user-defined variable needs to be prefixed when defining the variable

The volatile statement prevents the compiler from automatically optimizing the allocation address.

Such usage will reduce the efficiency of RAM usage, so it is not recommended to define absolute addresses of variables in general program design.

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Chapter 8 Precautions for Use of Specific Models

1. FT60F01X

1) Application notes of PA3:

PA3 is a unidirectional input port. When the input port is used, it must be pulled up externally

Only when PA3 is set as the reset pin, the internal weak pull-up will be turned on

FT60F011A-RB If PA3 is not used in the actual project, it should be set as the reset pin to reduce power consumption

FT60F010A-URB PA3 is not packaged and must be set as the reset pin

2. FT60F02X

1) PA0, PA1 are set to internal pull-up:

Turn off the analog function of the comparator, and set CxIN as a digital IO pin: CMCON0: CM[2:0]=111

3. FT60F12X/FT60F11X

1) CLKO:

After the E version, CLKO is mapped to PC5, and from time to time PA6

2) External crystal oscillator

Set external crystal oscillator: FOSC: XT (PA6, PA7 connect to high-speed crystal 4~20Mhz)

A, IESO: Enable (enable dual-speed clock), IRCF[2:0]=000, must be set to 000

B, IESO: Disable (Do not enable dual-speed clock), IRCF can be set freely

3) PWM

When PWM duty cycle-PWM period = 1, the level of PWM output will be reversed, and the user needs to write a program to avoid this problem

4. FT61F02X

1) PA0 PA1 PA1 PA3 setting input pull up

A, turn off the comparator CMCON0 = 0B00000111,

B, close the analog port ANSEL = 0X00;

C, set the input TRISA = 0B11111111;

D, pull up WPUA = 0xFF;

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5. FT61F04X

1) Op Amp

The op amp can only input negative voltage, if the input signal is positive voltage, it is recommended that customers use FT64F0AX

6. FT61F14X

1) PWM IO mapping [TIM1_CH2]

PB0 cannot output PWM alone, only PA1 output alone, when PB0 is set, PA1 will also output PWM

When TIM2_CH1 output is enabled, PB0 cannot be configured as TIM1_CH2 output, otherwise PB0 will output TIM2_CH1 waveform.

2) TIM4 connects to external crystal oscillator 32.769k low-power applications

If the system clock is selected as HIRC and TIM4 uses LP, the system clock cannot be turned off during sleep, and the power consumption is not small. Currently, it can be set

Set, enter sleep, system clock is set to internal 32K, TIM4 interrupt wake-up 6014 7001 6006 are the same

The starting capacitor is recommended to be 33pF

7. FT62F08X/FT61F08X

1) Note for interrupt function application:

In the C language program, the interrupt function must be reserved, otherwise the compiler will report an error

2) Sector encryption cannot read CHECKSUM

CPB is enabled, you can read CHECKSUM.

FSECPB0 If sector encryption is enabled, CHECKSUM cannot be read. Note that other sector encryption will not affect

3) ADC application notes:

1. ADC calibration, calibration must be done after register setting

2. The analog channel 1/4VDD is a resistor divider sampling. CHS[3:0] should be switched to other channels before sleep, otherwise it will consume power and conduct

The sleep current is relatively large

4) FT62F088-LRB, when used as a touch function, PC7 is occupied by the touch library, it must be left floating and cannot be used as a normal IO port

8. FT62F21X/FT60F21X

1) When P1D PWM function is output separately:

The lower 7 bits of P1DDTL cannot be 0 at the same time, for example, when P1DDTL=0X80, P1D outputs low level instead of PWM

The waveform and mapping are also the same. Currently, this can only be circumvented by software, and P1CDTH needs to be assigned.

9. FT62F13X/FT61F13X

1) PA3, PA5 are not encapsulated models, they are tied to GND, and the software should not set them high to avoid leakage

2) FT61F131B-RB, PB3 (PC0) closed, PA1 (PA4) closed, an IO port must be set as a floating input to be normal

Use another IO function, pay attention

3) When the instruction cycle is set to 4T, the EFT anti-interference characteristics of IO will be stronger

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