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Conduction Heat Transfer - Unsteady

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10 views

Conduction Heat Transfer - Unsteady

Uploaded by

karthik
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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Unsteady Conduction Heat Transfer

Unsteady Heat Conduction


• Many heat transfer problems are time dependent
• Cooling of a Hot Object Electronics Cooling
• Solidification process Heating an ingot in a furnace
• Heat treatment

• Unsteady or transient conduction heat transfer occurs when the temperature


within a material changes with respect to time
• In unsteady conduction, the temperature distribution within a material changes over time due to an
initial temperature difference, changes in boundary conditions, or variations in heat generation or
absorption
• Unsteady conduction is encountered in a wide range of applications, including the cooling of
electronic devices, transient heating or cooling of fluids, and thermal response during phase
transitions like freezing
• The objective of unsteady heat conduction analysis is develop procedures for determining the time
dependence of the temperature distribution within a solid during a transient process, as well as for
determining heat transfer between the solid and its surroundings
• The nature of the procedure depends on assumptions that may be made for the process
Lumped System analysis

• In heat transfer analysis, some bodies are


observed to behave like a “lump” whose
interior temperature remains essentially
uniform at any times during a heat
transfer process
• The essence of the lumped capacitance
method is the assumption that the
temperature of the solid is spatially
uniform at any instant during the transient
process
• This assumption implies that temperature
gradients within the solid are negligible
• Lumped system analysis assumes a uniform temperature distribution throughout the body,
which implies that the conduction heat resistance is zero
• From Fourier’s law, heat conduction in the absence of a temperature gradient implies the
existence of infinite thermal conductivity. Such a condition is clearly impossible
• However, the condition is closely approximated if the resistance to conduction within the
solid is small compared with the resistance to heat transfer between the solid and its
surroundings
• In general, the smaller the physical size of the body, the more realistic the assumption of a
uniform temperature throughout
• The transient temperature response in lumped system analysis is determined by formulating
an overall energy balance on the solid
• Consider a body of arbitrary shape of mass m, volume V,
surface area As, density ρ, and specific heat cp initially at a
uniform temperature Ti

• At time t = 0, the body is placed into a medium at


temperature T∞, and heat transfer takes place between the
body and its environment, with a heat transfer coefficient h

• We assume lumped system analysis to be applicable, so that


the temperature remains uniform within the body at all
times and changes with time only, T =T(t)

𝑇ℎ𝑒 𝑖𝑛𝑐𝑟𝑒𝑎𝑠𝑒 𝑖𝑛 𝑡ℎ𝑒


𝐻𝑒𝑎𝑡 𝑡𝑟𝑎𝑛𝑠𝑓𝑒𝑟 𝑖𝑛𝑡𝑜
= 𝑒𝑛𝑒𝑟𝑔𝑦 𝑜𝑓
𝑡ℎ𝑒 𝑏𝑜𝑑𝑦 𝑑𝑢𝑟𝑖𝑛𝑔 𝑑𝑡
𝑡ℎ𝑒 𝑏𝑜𝑑𝑦 𝑑𝑢𝑟𝑖𝑛𝑔 𝑑𝑡

h𝐴𝑠 𝑇∞ − 𝑇 𝑑𝑡 = 𝑚𝑐𝑝 𝑑𝑇
• The temperature of body the at any time t is given by:
𝑇 𝑡 − 𝑇∞ ℎ𝐴𝑠
= 𝑒 −𝑏𝑡 where 𝑏=
𝑇𝑖 − 𝑇∞ 𝜌𝑉𝑐𝑝

• b is a positive quantity with dimension 𝑠 −1 , reciprocal of b


has time unit (usually s), and is called the time constant
• A large value of b indicates that the
body approaches the environment
temperature in a short time
• The larger the value of the exponent
b, the higher the rate of decay in
temperature
• Since b is inversely proportional to
the mass and the specific heat of the
body, it takes longer to heat or cool a
larger mass, especially when it has a
large specific heat
Criteria for Lumped System Analysis
• Under steady-state conditions the surface energy balance

• The Biot number (Bi) provides a measure of the temperature


drop in the solid relative to the temperature difference between
the surface and the fluid
• If Bi <<1, the resistance to conduction within the solid is much less than the resistance to
convection across the fluid boundary layer and assumption of a uniform temperature distribution
is reasonable
𝒉𝑳𝒄
• The criteria to be satisfied for the applicability of lumped system analysis is: 𝑩𝒊 = ≤ 𝟎. 𝟏
𝒌
𝑽
• 𝑳𝒄 = Lc becomes half-thickness L for a plane wall of thickness 2L, ro/2 for a long cylinder, and
𝑨𝒔
ro/3 for a sphere where ro is the radius. Lc is called characteristic length
A diecast component has a mass of 1.2 kg and density 7150 kg/m3 with surface area of 0.075
m2. The thermal conductivity of the material is 95 W/mK and the specific heat is 385 J/kg K.
It comes out of the machine at 345°C and is exposed to air at 20°C with a convective heat
transfer coefficient of 56.8 W/m2K. Determine (i) The temperature of the part after 5 minutes
(ii) The time required to reach 50°C (iii) The time constant.
ℎ𝐿 𝑉 1.2
𝐵𝑖 = 𝑐 where 𝐿𝑐 = = = 0.00224 < 0.1
𝑘 𝐴 7150×0.075
Lumped system analysis is valid
𝑇 𝑡 − 𝑇∞ ℎ𝐴𝑠 ℎ𝐴𝑠 56.8×0.075
= 𝑒 −𝑏𝑡 𝑏= = 𝑏= = 9.2208 × 10−3 𝑠 −1
𝑇𝑖 − 𝑇∞ 𝜌𝑉𝑐𝑝 𝑚𝑐𝑝 1.2×385

i. Time constant = 1Τ𝑏 = 108.45 𝑠 𝑇 𝑡 = 5 − 20 −3 ×5×60


=𝑒 −9.2208×10
ii. Temperature of the part after 5 minutes:
345 − 20

𝑇 = 40.44℃
• The time required to reach 50°C

50 − 20 −9.2208×10 −3 𝑡
=𝑒
345 − 20

𝑡 = 258.37𝑠 = 4.31 𝑚𝑖𝑛

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