MTC assignment

Last date 20th November

❖ QUESTION 1

• Discuss the different mechanical properties of materials, such as tensile strength, hardness,
ductility, and toughness.
✓ ANSWER

Mechanical properties tell us how materials respond to different forces, helping engineers pick the
right materials for specific uses. Here’s a quick look at key properties, how they’re tested, and why
they matter:

### 1. **Tensile Strength**

- **Definition**: This measures how much force a material can handle when being pulled before it
breaks.

- **Test**: A sample is stretched in a machine until it breaks, measuring the maximum force it
withstands.

- **Application**: Strong materials like steel are used in structures like bridges or cables that need
to resist heavy pulling forces.

### 2. **Hardness**

- **Definition**: Hardness shows how resistant a material is to dents, scratches, or wear.

- **Test**: An indenter is pressed into the material’s surface, and the size of the dent is measured.

- **Application**: Hard materials, like tool steel, are ideal for gears and cutting tools that face
constant friction.

### 3. **Ductility**

- **Definition**: Ductility measures how much a material can stretch or deform without breaking.

- **Test**: A sample is stretched to see how far it can go before snapping.

- **Application**: Ductile materials, like copper, are good for flexible parts, like wires, and for
structures that need to absorb impacts.

### 4. **Toughness**
 - **Definition**: Toughness is a material’s ability to absorb energy and resist breaking under
impact.

- **Test**: The material is hit with a heavy object, and the energy absorbed before it breaks is
measured.

- **Application**: Tough materials, like some steels, are used in high-impact areas, like armor or
construction equipment.

By understanding these properties, engineers can ensure structures are safe, durable, and suited to
their intended function.

❖ QUESTION 2
• Explain how defects can be intentionally introduced into materials to improve their
properties (e.g., doping of semiconductors).
• Discuss the role of defects in materials for energy storage, catalysis, and other applications.
• Explain the challenges associated with defects in materials and strategies for mitigating their
negative effects.
✓ ANSWER

Defects in materials can be intentionally added to improve performance in various ways. Here’s a
quick overview:

### 1. **Intentionally Adding Defects**

- **How It Works**: Adding specific defects, like doping (adding small amounts of other elements),
can improve properties. For example, doping in semiconductors adjusts their conductivity, making
them better for electronics.

### 2. **Role of Defects in Applications**

- **Energy Storage**: Defects create spaces in battery materials that can store more ions, boosting
capacity.

- **Catalysis**: Defects provide active sites on catalysts, increasing reaction rates and efficiency.

### 3. **Challenges of Defects**

- **Issues**: Uncontrolled defects can weaken materials, causing them to break down faster.

- **Solutions**: Strategies include carefully controlling defect amounts, using coatings, or

By managing defects, engineers enhance material performance while reducing drawbacks, making
materials more efficient and durable for specific applications.
 ❖ QUESTION 3

• Explain the difference between intrinsic and extrinsic semiconductors and the
concept of doping.
• Describe the fabrication processes for semiconductor devices (e.g., wafer
fabrication, lithography).
• Discuss the challenges and future trends in semiconductor materials and device
technology.

✓ ANSWER

Here’s an overview of intrinsic and extrinsic semiconductors, how semiconductor devices are made,
and current challenges and trends in the field.

### 1. **Intrinsic vs. Extrinsic Semiconductors and Doping**

- **Intrinsic Semiconductors**: These are pure semiconductors (like silicon) that conduct a small
amount of electricity naturally.

- **Extrinsic Semiconductors**: These are semiconductors that have been "doped," meaning small
amounts of other elements are added to improve conductivity.

- **N-type doping** introduces extra electrons (negative charge carriers).

- **P-type doping** creates holes (positive charge carriers).

- **Doping** is essential for adjusting a semiconductor’s electrical properties, making them more
efficient for electronics.

### 2. **Semiconductor Fabrication Processes**

- **Wafer Fabrication**: Pure silicon is made into thin wafers that form the base for building
circuits.

- **Lithography**: A light-sensitive material (photoresist) is patterned with UV light to define tiny

- **Etching**: Chemical or plasma etching removes unwanted material to shape the circuit paths.

- **Doping**: Specific areas are doped to create conductive regions necessary for transistors.

- **Deposition**: Layers of materials (like metals) are added for pathways and insulating layers.

- **Packaging**: The wafers are cut into individual chips and protected for use in devices.

### 3. **Challenges and Future Trends**

- **Challenges**:

- **Miniaturization**: Making components even smaller increases heat and power density,
complicating manufacturing.
 - **Materials Limitations**: Silicon may reach physical limits, driving the search for new materials
like graphene.

- **Cost and Complexity**: Advanced fabrication processes are expensive and require precision
control.

- **Future Trends**:

- **New Materials**: Alternatives like graphene and silicon carbide may improve performance.

- **Quantum Computing**: Emerging tech may lead to revolutionary chip designs.

- **3D Integration**: Stacking chip layers could increase computing power without taking up
more space.

Advances in semiconductor technology are essential for faster, more powerful, and efficient devices,
with ongoing research aimed at overcoming current limitations.