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Emi Shielding Final PDF Form.

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sanjanariaraj
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1.

INTRODUCTION

The use of electronic devices has increased rapidly in recent times. Advancements in

nanotechnology led to a reduction in the size of electronic components which also increased the

density of packing of electronic devices. The widespread use of these densely packed electronic

devices results in an increase in the emission of harmful electromagnetic radiation by these devices.

1.1 Electromagnetic Interference (EMI)

EMI is unwanted noise or interference in an electrical path or circuit caused by an outside source. It

is also known as radio frequency interference. EMI can cause electronics to operate poorly,

malfunction or stop working completely. EMI not only degrades the performance of electrical

equipment but also decreases the lifetime of components and increases the financial cost to maintain

equipment. A common example of EMI is when a cell phone is placed near powered audio

equipment or speakers, and it causes a noise or series of beeps to be heard.

1.2 Electromagnetic Waves

An electromagnetic wave travels in free space with the velocity of light. These waves are oscillations

in the electric and magnetic field perpendicular to each other and perpendicular to the direction of

energy and wave propagation, forming a transverse wave. The electromagnetic wave is characterized

by either its frequency of oscillation (number of oscillations per sec in Hz) or its wavelength.

(distance travelled for one cycle/oscillation in nm).

Electromagnetic waves of different frequency are called by different names since they have

different sources and effects on matter. The different types of electromagnetic waves are grouped

under electromagnetic spectrum. Electromagnetic waves are emitted by electrically charged


particles undergoing acceleration, and these waves can subsequently interact with other charged

particles, exerting force on them. EM waves carry energy.

Figure 1: EM wave going in z direction with electric field along x direction and magnetic field

along y direction

1.3 Electromagnetic Spectrum

The electromagnetic spectrum is the full range of electromagnetic radiation, organized

by frequency or wavelength. The spectrum is divided into separate bands, with different names for

the electromagnetic waves within each band. From low to high frequency these are:

 Radio waves

 microwaves

 infrared

 visible light

 ultraviolet

 X-ray and

 gamma rays
The electromagnetic waves in each of these bands have different characteristics, such as how they

are produced, how they interact with matter, and their practical applications.

Radio waves, at the low-frequency end of the spectrum, have the lowest photon energy and the

longest wavelengths—thousands of kilometers, or more. They can be emitted and received

by antennas, and pass through the atmosphere, foliage, and most building materials.

Gamma rays, at the high-frequency end of the spectrum, have the highest photon energies and the

shortest wavelengths—much smaller than an atomic nucleus.

Figure 2: Electromagnetic Spectrum

2. CONDITIONS FOR OCCURRENCE OF ELECTROMAGNETIC

INTERFERENCE:

EMI is a phenomenon that may occur when an electronic device is exposed to an electromagnetic

(EM) field. Any device that has electronic circuitry can be susceptible to EMI. With the ever-
increasing use of the electromagnetic spectrum and the more complex and sophisticated electronic

devices, issues of EMI are attracting attention.

Consider a source, a path, and a receptor. The electromagnetic energy from the source propagates

through the path and interferes with the operation of the receptor. All three must exist to have an

EMI problem. The path can be conducted, radiated, inductive, or coupled with a capacitor or

with electrostatic discharges, or a combination of any of the above. Therefore, to understand the

effects of EMI, consider two factors: Emissions and immunity (also known as susceptibility).

Emissions are a measure of electromagnetic energy from a radiofrequency source. Immunity

concerns the degree of interference from an external electromagnetic energy source on the operation

of the electronic device. The device will be immune below a certain level of EMI and become

susceptible above that level.

2.1 Coupling Mechanism in EMI

The basic arrangement to understand EMI, comprising of noise emitter or source, coupling path and

victim, receptor or sink is shown in the figure 2. It can be observed that there are four basic coupling

mechanisms namely:

i. Conductive

ii. Capacitive

iii. Magnetic Or Inductive, And

iv. Raditrive.

Any coupling path can be broken down into one or more of these coupling mechanisms working

together. For example the lower path in the diagram (figure 4) involves inductive, conductive and
capacitive modes. Among these coupling mechanisms the radiative coupling is more important in

critical systems like electronics, aircrafts and Radars.

Figure 4: Illustration of the coupling mechanisms that lead to EMI

3. SOURCES OF EMI

The sources of EMI can be broadly split into two categories: naturally occurring and human-made.

There are some sources in the natural world that can produce powerful enough electric fields to

affect electronic devices. Lightning can produce strong electrostatic discharges and magnetic pulses.

Solar storms and solar flares emit highly charged particles that can cause problems with satellite and

terrestrial communications. Cosmic radiation has been known to cause problems in electronics.
Human-made EMI can come from many places. High-power radio and electrical sources can cause

unwanted EMI. Malfunctioning or improperly designed consumer devices can cause EMI in other

devices. Using an electromagnetic pulse to intentionally induce EMI faults in victim devices is also a

possible offensive action.

Figure 3 shows the sources of EMI in daily life.

Figure 3: Sources of EMI in Daily Life

4. EMI in different systems and need for shielding


The EM radiations emerging from an electronic device can interfere with other neighboring

electronic devices like TVs and mobile phones interfere with each other. This leads to the

degradation of device performance. EMI also causes device malfunction, and health-related issues

in human beings. Therefore, a higher need for increased EMI SE with the advent of 5G

communication technology. There is a growing need for shielding materials with higher

requirements in terms of reliability, flexibility, weight, and EMI shielding performance.

4.1 EMI in Electronic Devices

All electronic devices are sources of radio and microwaves (electromagnetic waves) particularly

instruments like mobile phones which operate in these frequencies. When these EM waves are

incident on neighboring electronic devices, the electrons in the metals (good conductors which have

large number of free electrons) interact with the electric field of the incident radiation. This

interaction is of serious concern as it interferes with the functioning of the electronics and causes

malfunctioning of the device.

The EM waves interfere unfavorably with the functioning of electronic devices hence it is necessary

to shield these electronic devices from such interference of EM waves. The electromagnetic

interference (EMI) problem is growing with the increase in the use of mobile phones and the

introduction of 5G technology, and requirements of EMI shielding materials are becoming more

stringent. Multifuntional materials with higher EMI SE are the need of the hour.

4.2 EMI in Aircraft

Electromagnetic interference (EMI) is a potential threat to electronic devices in an aircraft. It occurs

due to the conducted or radiated EM waves. The electromagnetic (EM) radiation caused by

electrostatic discharge can interfere with other external EM signals (EMI) or with the EM radiation
from neighboring components. The source of EM radiation may be within the aircraft or an external

source. Ignition systems, data, and power lines, ac-powered window heaters, radio and radar

transmitters light switches are some of the internal sources. External sources could be WiFi

networks, weaponized EM pulse, lightning strikes, and auroras. EMI disrupts the functioning of

critical electronic components in an aircraft causing disastrous outcomes; hence affecting shielding

of these devices from such disturbance becomes very essential.

Figure 5: EMI from external sources suspected cause for the 1998 crash of Swissair Flight 111,

4.3 EMI issues in Radar systems

Radar systems play an important role in detecting objects and providing information on their

location, speed, and trajectory. Radar systems are particularly vulnerable to EMI, as their signal

transmission and reception are particularly sensitive to external interference. EMI can come from a

variety of sources, such as power lines, nearby lightning strikes, and even the sun. In environments
with strong electromagnetic interference (EMI), it can be difficult for radar systems to accurately

detect and transmit information

5. MECHANISM OF EMI SHIELDING

EMI shielding can be achieved in the following ways:

i. Reflection

ii. Absorption or

iii. Multiple Internal Reflections

The incident EM signal suffers one or more of the above which reduces the incident energy of the

radiation . Shielding Efficiency (SE) indicates quantitatively the difference in intensity between the

incident and transmitted EM waves.

An EM wave is comprised of two fields namely the electric and magnetic components. According to

Maxwell, at high frequencies, the magnetic and electric fields of the EM wave are closely associated

with each other. Since the EM wave cannot exist without one of the components, it is sufficient to

attenuate either the electric field or the magnetic field. Therefore, EMI shielding can be achieved by

the attenuation of either the electric field or the magnetic field components.

A material with high electrical conductivity shields the electric component of the EM wave whereas

a material with high magnetic permeability prevents the transmission of magnetic component. In

metals (conductors) the attenuation of the EM wave is dependent on electrical conductivity, material

thickness, complex permittivity and permeability, and its geometric structure.

However metals suffer from disadvantages like corrosion, weight and high cost. Recently metals are

being replaced with composite materials owing to their light weight and specifically due to ease with
which desired electrical, thermal and mechanical properties can be tailored into them by means of

additives called fillers.

5.1 Factors influencing Shielding Mechanism

 The shielding mechanism in a composite material is based the interaction of one or both of

the fields with the shielding material. EMI SE depends on many factors such as

 Surface electrical conductivity of the material

 Electrical conductivity of the filler

 Connectivity of the filler

 Aspect ratio (length to thickness ratio) of the fillers

 Dielectric constant

 Concentration of the fillers

 Dielectric permittivity

 Magnetic permeability

 ]hysteresis losses

 Thickness of the shielding material,

 Frequency of the radiation,

 Surface area of the shielding material and

 Structure of the material

5.2 EMI Shielding by Reflection

The primary phenomenon responsible for EMI shielding is the reflection of EM waves thereby

preventing the transmission of incident waves. In conductive materials (metals), EMI shielding is

achieved by the interaction of the electric field of the incident EM radiation with the surface charges
of the conductor and leads to reflection of the incident radiation due to impedance mismatch

between the shielding material and the surrounding region.

The direct reflection of incident radiation can be increased by increasing the conductivity of the

shielding material or by reducing the impedance mismatch thereby reducing the transmission of EM

waves. In addition to primary reflection, multiple internal reflections also reduce the transmission of

incident EM waves. The schematic representation of EMI shielding is represented in Figure 6.

In polymer composites, EMI SE by reflection mechanism can be increased by adding conducting

filers like CNTs, MXene, ]reduced graphene oxide (rGO), or graphene. This increases the

conductivity of polymer composites by forming connecting (percolating) structures and providing a

conductive path. Reflection can be improved by increasing the density of cells in cellular structured

nanocomposite at a constant volume fraction of fillers thereby increasing the number of interfaces

for reflection of EM waves.

The residual EM waves that are transmitted through the interface undergo attenuation due to

dielectric and magnetic losses, and the remnant intensity is transmitted through the shielding

material.

Reflection of 90% of the incident waves can be presently achieved by these methods and available

materials.But the reflected EM radiation produces secondary EM pollution. The secondary EM

waves affectthe health of living organisms as well as the stability of neighboring precision

equipment. Reflection mechanism is also undesirable for maintaining low detectability (stealth),else

the reflected secondary EM waves get detected by a nearby radar.


Incident
radiation

Reflected
radiation
Transmitted
radiation

Figure 6: Mechanisms involved in EMI shielding.

5.3 EMI Shielding by absorption

Secondary EMI pollution can be mitigated if the shielding mechanism is predominantly absorption

based. The absorption of EM radiation is based on the absorption of the electric field by the

dielectric loss that occurs in the shielding material or due to the hysteresis, resonance, and eddy

current losses in the material. Magnetic materials predominantly cause absorption due to loss in EM

energy by hysteresis, eddy current, polarization, and ferromagnetic losses. Generally, more than one

mechanism is involved in absorption-based EMI shielding. Absorption-dominated shielding of EM

radiation is achieved by designing NCs with controlled magnetic and dielectric loss to produce high

attenuation. Controlling the mass concentration and localization of fillers, designing the surface

morphology and the interfaces also improves the absorption of EM radiation. Morphology of the

nanocomposite also plays a vital role in SEA. Stacked layers absorb EM waves effectively.
Recent studies proved that excellent absorption shielding efficiency (ASE) can be achieved by

controlled microstructures. Multi-layered structures having an impedance mismatch gradient is an

effective method to increase ASE

3D percolating structures and foam-like structures also reduce reflection-dominant EMI SE and

improve the ASE provided the thickness should be similar to that of NCs with fillers (dielectric and

magnetic). The absorbed EM wave is dissipated by inducing eddy current losses leading to the

generation of heat energy through the interaction of incident EM radiation with the electric and

magnetic dipoles present in the shielding materials.

The structural design of composite shielding materials offers great possibilities to enhance

absorption-dominated EMI shielding. The segregated, layered, and foam structures are

predominately applied to improve absorption dominant EMI SE. The cellular structure (porous)

dissipates the incident energy by increasing the travel distance resulting in enhanced absorption of

EM waves.

The segregated structures form 3D conductive networks which lower the percolation threshold due

to which the incident EM wave is reflected, scattered, and absorbed efficiently. The EM pollution

can be effectively prevented by using absorption-dominated EMI shielding materials.

6. MEASUREMENT OF EMI SE

The EMI shielding effectiveness (SE) is the ratio of power incident on the shielding material to the

power transmitted through it, and it is also expressed in dB. A material with an EMI SE between

10–30 dB is unsuitable for shielding of EM radiation.

SET =10 log


( )
Pi
Pt
Where

Pi - Incident power

Pt - Transmitted power

Shielding arises due to the absorption and reflection of EM waves.

SETotal =SE A+ SER

SETotal −Total Shielding Efficiency

SE A −Absorption Efficiency

; SER −Reflection Efficiency

A material with EMI SE of greater than 30 dB will attenuate 99.9% of incident radiation and is

highly suitable for shielding application.

7. PROPERTIES REQUIRED FOR EMI SHIELDING

The properties required fora shielding material to produce a high EMI SE depends on the type of

mechanism. The shielding materials have to be designed with high absorption efficiency (SE A) as the

reflection mechanism resulting in a high degree of secondary EM pollution. A good shielding

material should be an electrical conductor which causes ohmic loss in the incident wave. It should

possess suitable magnetic properties to induce attenuation due to hysteresis losses. In recent times,

researchers have fabricated composite materials with unique properties which support multiple

internal reflections, and absorption by dielectric and magnetic losses Thermal and mechanical

stability are also important for shielding materials. High thermal conductivity serves to dissipate the
heat. Fracture toughness, mechanical strength (tensile and compressive), wear resistance and impact

strength are also vital.

7.1 EPOXY AND ITS APPLICATIONS IN AIRCRAFT, SPACECRAFT AND

ELECTRONIC PACKAGING

Epoxy is widely used as a matrix in aircraft, aerospace, and electronic packaging due to its excellent

adhesion with most NFs, remarkable chemical and corrosion resistance, low shrinkage, and it has a

low tendency to emit volatile organic compounds during solidification.

The desirable properties of the epoxy resin can be further enhanced by the addition of suitable

nanofillers at a certain percentage. For instance, an improvement in mechanical strength, heat

resistance, electrical conductivity, and an increase in EMI SE of epoxy was achieved while

reinforcing epoxy with CNF.

High efficiency in EMI shielding and heat removal is desirable in packaging materials. Polymeric

nanocomposites (NCs) possess the most desirable properties like lightweight, noncorrosive,

economical, ease of processing, and tunable properties compared to metals, and hence, they are

reliable for EMI shielding applications.

8. RECENT DEVELOPMENTS IN EMI SHIELDING

In recent times, researchers are developing novel/hybrid structures to counter the problem of EMI.

These nanocomposite structures are classified as nanocomposites with

i. NP dispersion – 1 or more types of nanoparticles are used eg ironoxide, carbon black

ii. ID fillers – nanofibers which have high aspect ratio are used.

iii. 2D fillers – laminar structures are formed


iv. 3D structures – foams, cellular, porous structures are incorporated into the NCs

v. Hybrid structures (comprising of combinations of two or more of the above said structures

vi. Syntactic foams and

vii. MXenes

Examples:

Nanocomposites with 3D structures: A novel nanocomposite material prepared for electromagnetic

shielding is shown below. It consists of honeycomb structured GO loaded with FeNi alloy NPs

which had amino groups attached to it. This structure was then fabricated into polymer called epoxy

through vacuum-assisted impregnation. It exhibited good EMI SE. This was because of the presence

of a honeycomb structure and enhancement in electrical conductivity.

EM wave passing through the honeycomb (rGH), induced current in the walls of rGH resulting in

resistive losses. The increased path of EM waves due to multiple reflections and scattering within the

honeycomb structures led to further attenuation of the waves. The magnetic FeNi present in the

nanocomposite causes hysteresis loss leading to further absorption of incident waves. Further the

difference in electrical conductivity between the EPR and the conductive rGH results in loss due to

interfacial polarization. The EMI SE was due to a combination of multiple reflection, scattering,

ohmic loss, hysteresis loss, and polarization loss.


Figure 7: Mechanism of EMI shielding in rGH@FeNi, EP NC

8.1 Epoxy Based Syntactic Foams for EMI shielding

Syntactic foams are composite materials prepared by dispersing mechanically hollow microspheres

in a matrix which can be a polymer, metal or ceramic. These fillers have a closed cell structure.

Commonly used hollow spheres can be micro glass balloons.

These hollow microfillers make the polymer matrix porous and light weight. glass is nonconducting

and should be coated with a conducting material. The conductivity of the composite can also be

increased by dispersing microspheres made of conducting materials also. Use of syntatic foams is a

novel method to enhance the conductivity and EMI shielding of polymers like epoxy.

8. 2 MXenes for EMI shielding


MXenes are increasingly used in recent times for EMI shielding. MXenes are 2D materials MXenes

are derived from MAX phase where M is a metal (early transition- say Ti, Mo, W etc) A is from 13-

15 th period and X can be either C or N. The The most common Ti based MXenes are a mixture of Ti,

Al and carbon black. The EM waves passing through a shielding material containing

Mxene fillers undergo reflection due to impedance mismatch material and the surrounding medium.

They possess multilayered laminar structure which serves to attenuate the wave by multiple internal

reflections. The surface of MXenes contains large number of electric and magnetic dipoles and the

incident EM waves are converted to heat by interaction with these dipoles.

9. CONCLUSION

Materials with EMI shielding efficiency greater than 30 dB are highly preferable for shielding

applications according to the literature. The shielding materials with high conductivity can prevent

the electrical component of the EM wave, whereas the magnetic component is effectively suppressed

by the high magnetic permeability of the materials.

A high EMI SE with heat conductivity and electrical insulation are concluded as desirable

characteristics for electronic packaging materials. The foam-like and 3D percolating structures

support the absorption-dominant EMI shielding with minimal reflection. The random orientation of

the dispersed graphene platelets supports EMI shielding by reflection, whereas the absorption is

dominant for the epoxy-based composites containing orderly aligned graphene platelets.

It can be concluded from the above discussion that EMI SE by absorption can be enormously

increased by considering the following factors while designing the nanocomposite, which include:

Incorporating 3D structures (cage-like structures) to increase multiple reflections and thereby

increase the path of the EM wave within the composite causing an increase in absorption
 A highly conductive 3D network for conduction of the electric field will result in ohmic

losses

 The impedance mismatch at the interface between the polymer matrix and the 3D network

will lead to an increase in reflection and

 Impedance mismatch will also cause charge accumulation at the interface (space charge

polarization) causing dielectric loss;

 Incusion of magnetic nanoparticles will attenuate the wave due to hysteresis losses.
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