Emi Shielding Final PDF Form.
Emi Shielding Final PDF Form.
INTRODUCTION
The use of electronic devices has increased rapidly in recent times. Advancements in
nanotechnology led to a reduction in the size of electronic components which also increased the
density of packing of electronic devices. The widespread use of these densely packed electronic
devices results in an increase in the emission of harmful electromagnetic radiation by these devices.
EMI is unwanted noise or interference in an electrical path or circuit caused by an outside source. It
is also known as radio frequency interference. EMI can cause electronics to operate poorly,
malfunction or stop working completely. EMI not only degrades the performance of electrical
equipment but also decreases the lifetime of components and increases the financial cost to maintain
equipment. A common example of EMI is when a cell phone is placed near powered audio
An electromagnetic wave travels in free space with the velocity of light. These waves are oscillations
in the electric and magnetic field perpendicular to each other and perpendicular to the direction of
energy and wave propagation, forming a transverse wave. The electromagnetic wave is characterized
by either its frequency of oscillation (number of oscillations per sec in Hz) or its wavelength.
Electromagnetic waves of different frequency are called by different names since they have
different sources and effects on matter. The different types of electromagnetic waves are grouped
Figure 1: EM wave going in z direction with electric field along x direction and magnetic field
along y direction
by frequency or wavelength. The spectrum is divided into separate bands, with different names for
the electromagnetic waves within each band. From low to high frequency these are:
Radio waves
microwaves
infrared
visible light
ultraviolet
X-ray and
gamma rays
The electromagnetic waves in each of these bands have different characteristics, such as how they
are produced, how they interact with matter, and their practical applications.
Radio waves, at the low-frequency end of the spectrum, have the lowest photon energy and the
by antennas, and pass through the atmosphere, foliage, and most building materials.
Gamma rays, at the high-frequency end of the spectrum, have the highest photon energies and the
INTERFERENCE:
EMI is a phenomenon that may occur when an electronic device is exposed to an electromagnetic
(EM) field. Any device that has electronic circuitry can be susceptible to EMI. With the ever-
increasing use of the electromagnetic spectrum and the more complex and sophisticated electronic
Consider a source, a path, and a receptor. The electromagnetic energy from the source propagates
through the path and interferes with the operation of the receptor. All three must exist to have an
EMI problem. The path can be conducted, radiated, inductive, or coupled with a capacitor or
with electrostatic discharges, or a combination of any of the above. Therefore, to understand the
effects of EMI, consider two factors: Emissions and immunity (also known as susceptibility).
concerns the degree of interference from an external electromagnetic energy source on the operation
of the electronic device. The device will be immune below a certain level of EMI and become
The basic arrangement to understand EMI, comprising of noise emitter or source, coupling path and
victim, receptor or sink is shown in the figure 2. It can be observed that there are four basic coupling
mechanisms namely:
i. Conductive
ii. Capacitive
iv. Raditrive.
Any coupling path can be broken down into one or more of these coupling mechanisms working
together. For example the lower path in the diagram (figure 4) involves inductive, conductive and
capacitive modes. Among these coupling mechanisms the radiative coupling is more important in
3. SOURCES OF EMI
The sources of EMI can be broadly split into two categories: naturally occurring and human-made.
There are some sources in the natural world that can produce powerful enough electric fields to
affect electronic devices. Lightning can produce strong electrostatic discharges and magnetic pulses.
Solar storms and solar flares emit highly charged particles that can cause problems with satellite and
terrestrial communications. Cosmic radiation has been known to cause problems in electronics.
Human-made EMI can come from many places. High-power radio and electrical sources can cause
unwanted EMI. Malfunctioning or improperly designed consumer devices can cause EMI in other
devices. Using an electromagnetic pulse to intentionally induce EMI faults in victim devices is also a
electronic devices like TVs and mobile phones interfere with each other. This leads to the
degradation of device performance. EMI also causes device malfunction, and health-related issues
in human beings. Therefore, a higher need for increased EMI SE with the advent of 5G
communication technology. There is a growing need for shielding materials with higher
All electronic devices are sources of radio and microwaves (electromagnetic waves) particularly
instruments like mobile phones which operate in these frequencies. When these EM waves are
incident on neighboring electronic devices, the electrons in the metals (good conductors which have
large number of free electrons) interact with the electric field of the incident radiation. This
interaction is of serious concern as it interferes with the functioning of the electronics and causes
The EM waves interfere unfavorably with the functioning of electronic devices hence it is necessary
to shield these electronic devices from such interference of EM waves. The electromagnetic
interference (EMI) problem is growing with the increase in the use of mobile phones and the
introduction of 5G technology, and requirements of EMI shielding materials are becoming more
stringent. Multifuntional materials with higher EMI SE are the need of the hour.
due to the conducted or radiated EM waves. The electromagnetic (EM) radiation caused by
electrostatic discharge can interfere with other external EM signals (EMI) or with the EM radiation
from neighboring components. The source of EM radiation may be within the aircraft or an external
source. Ignition systems, data, and power lines, ac-powered window heaters, radio and radar
transmitters light switches are some of the internal sources. External sources could be WiFi
networks, weaponized EM pulse, lightning strikes, and auroras. EMI disrupts the functioning of
critical electronic components in an aircraft causing disastrous outcomes; hence affecting shielding
Figure 5: EMI from external sources suspected cause for the 1998 crash of Swissair Flight 111,
Radar systems play an important role in detecting objects and providing information on their
location, speed, and trajectory. Radar systems are particularly vulnerable to EMI, as their signal
transmission and reception are particularly sensitive to external interference. EMI can come from a
variety of sources, such as power lines, nearby lightning strikes, and even the sun. In environments
with strong electromagnetic interference (EMI), it can be difficult for radar systems to accurately
i. Reflection
ii. Absorption or
The incident EM signal suffers one or more of the above which reduces the incident energy of the
radiation . Shielding Efficiency (SE) indicates quantitatively the difference in intensity between the
An EM wave is comprised of two fields namely the electric and magnetic components. According to
Maxwell, at high frequencies, the magnetic and electric fields of the EM wave are closely associated
with each other. Since the EM wave cannot exist without one of the components, it is sufficient to
attenuate either the electric field or the magnetic field. Therefore, EMI shielding can be achieved by
the attenuation of either the electric field or the magnetic field components.
A material with high electrical conductivity shields the electric component of the EM wave whereas
a material with high magnetic permeability prevents the transmission of magnetic component. In
metals (conductors) the attenuation of the EM wave is dependent on electrical conductivity, material
However metals suffer from disadvantages like corrosion, weight and high cost. Recently metals are
being replaced with composite materials owing to their light weight and specifically due to ease with
which desired electrical, thermal and mechanical properties can be tailored into them by means of
The shielding mechanism in a composite material is based the interaction of one or both of
the fields with the shielding material. EMI SE depends on many factors such as
Dielectric constant
Dielectric permittivity
Magnetic permeability
]hysteresis losses
The primary phenomenon responsible for EMI shielding is the reflection of EM waves thereby
preventing the transmission of incident waves. In conductive materials (metals), EMI shielding is
achieved by the interaction of the electric field of the incident EM radiation with the surface charges
of the conductor and leads to reflection of the incident radiation due to impedance mismatch
The direct reflection of incident radiation can be increased by increasing the conductivity of the
shielding material or by reducing the impedance mismatch thereby reducing the transmission of EM
waves. In addition to primary reflection, multiple internal reflections also reduce the transmission of
filers like CNTs, MXene, ]reduced graphene oxide (rGO), or graphene. This increases the
conductive path. Reflection can be improved by increasing the density of cells in cellular structured
nanocomposite at a constant volume fraction of fillers thereby increasing the number of interfaces
The residual EM waves that are transmitted through the interface undergo attenuation due to
dielectric and magnetic losses, and the remnant intensity is transmitted through the shielding
material.
Reflection of 90% of the incident waves can be presently achieved by these methods and available
waves affectthe health of living organisms as well as the stability of neighboring precision
equipment. Reflection mechanism is also undesirable for maintaining low detectability (stealth),else
Reflected
radiation
Transmitted
radiation
Secondary EMI pollution can be mitigated if the shielding mechanism is predominantly absorption
based. The absorption of EM radiation is based on the absorption of the electric field by the
dielectric loss that occurs in the shielding material or due to the hysteresis, resonance, and eddy
current losses in the material. Magnetic materials predominantly cause absorption due to loss in EM
energy by hysteresis, eddy current, polarization, and ferromagnetic losses. Generally, more than one
radiation is achieved by designing NCs with controlled magnetic and dielectric loss to produce high
attenuation. Controlling the mass concentration and localization of fillers, designing the surface
morphology and the interfaces also improves the absorption of EM radiation. Morphology of the
nanocomposite also plays a vital role in SEA. Stacked layers absorb EM waves effectively.
Recent studies proved that excellent absorption shielding efficiency (ASE) can be achieved by
3D percolating structures and foam-like structures also reduce reflection-dominant EMI SE and
improve the ASE provided the thickness should be similar to that of NCs with fillers (dielectric and
magnetic). The absorbed EM wave is dissipated by inducing eddy current losses leading to the
generation of heat energy through the interaction of incident EM radiation with the electric and
The structural design of composite shielding materials offers great possibilities to enhance
absorption-dominated EMI shielding. The segregated, layered, and foam structures are
predominately applied to improve absorption dominant EMI SE. The cellular structure (porous)
dissipates the incident energy by increasing the travel distance resulting in enhanced absorption of
EM waves.
The segregated structures form 3D conductive networks which lower the percolation threshold due
to which the incident EM wave is reflected, scattered, and absorbed efficiently. The EM pollution
6. MEASUREMENT OF EMI SE
The EMI shielding effectiveness (SE) is the ratio of power incident on the shielding material to the
power transmitted through it, and it is also expressed in dB. A material with an EMI SE between
Pi - Incident power
Pt - Transmitted power
SE A −Absorption Efficiency
A material with EMI SE of greater than 30 dB will attenuate 99.9% of incident radiation and is
The properties required fora shielding material to produce a high EMI SE depends on the type of
mechanism. The shielding materials have to be designed with high absorption efficiency (SE A) as the
material should be an electrical conductor which causes ohmic loss in the incident wave. It should
possess suitable magnetic properties to induce attenuation due to hysteresis losses. In recent times,
researchers have fabricated composite materials with unique properties which support multiple
internal reflections, and absorption by dielectric and magnetic losses Thermal and mechanical
stability are also important for shielding materials. High thermal conductivity serves to dissipate the
heat. Fracture toughness, mechanical strength (tensile and compressive), wear resistance and impact
ELECTRONIC PACKAGING
Epoxy is widely used as a matrix in aircraft, aerospace, and electronic packaging due to its excellent
adhesion with most NFs, remarkable chemical and corrosion resistance, low shrinkage, and it has a
The desirable properties of the epoxy resin can be further enhanced by the addition of suitable
resistance, electrical conductivity, and an increase in EMI SE of epoxy was achieved while
High efficiency in EMI shielding and heat removal is desirable in packaging materials. Polymeric
nanocomposites (NCs) possess the most desirable properties like lightweight, noncorrosive,
economical, ease of processing, and tunable properties compared to metals, and hence, they are
In recent times, researchers are developing novel/hybrid structures to counter the problem of EMI.
ii. ID fillers – nanofibers which have high aspect ratio are used.
v. Hybrid structures (comprising of combinations of two or more of the above said structures
vii. MXenes
Examples:
shielding is shown below. It consists of honeycomb structured GO loaded with FeNi alloy NPs
which had amino groups attached to it. This structure was then fabricated into polymer called epoxy
through vacuum-assisted impregnation. It exhibited good EMI SE. This was because of the presence
EM wave passing through the honeycomb (rGH), induced current in the walls of rGH resulting in
resistive losses. The increased path of EM waves due to multiple reflections and scattering within the
honeycomb structures led to further attenuation of the waves. The magnetic FeNi present in the
nanocomposite causes hysteresis loss leading to further absorption of incident waves. Further the
difference in electrical conductivity between the EPR and the conductive rGH results in loss due to
interfacial polarization. The EMI SE was due to a combination of multiple reflection, scattering,
Syntactic foams are composite materials prepared by dispersing mechanically hollow microspheres
in a matrix which can be a polymer, metal or ceramic. These fillers have a closed cell structure.
These hollow microfillers make the polymer matrix porous and light weight. glass is nonconducting
and should be coated with a conducting material. The conductivity of the composite can also be
increased by dispersing microspheres made of conducting materials also. Use of syntatic foams is a
novel method to enhance the conductivity and EMI shielding of polymers like epoxy.
are derived from MAX phase where M is a metal (early transition- say Ti, Mo, W etc) A is from 13-
15 th period and X can be either C or N. The The most common Ti based MXenes are a mixture of Ti,
Al and carbon black. The EM waves passing through a shielding material containing
Mxene fillers undergo reflection due to impedance mismatch material and the surrounding medium.
They possess multilayered laminar structure which serves to attenuate the wave by multiple internal
reflections. The surface of MXenes contains large number of electric and magnetic dipoles and the
9. CONCLUSION
Materials with EMI shielding efficiency greater than 30 dB are highly preferable for shielding
applications according to the literature. The shielding materials with high conductivity can prevent
the electrical component of the EM wave, whereas the magnetic component is effectively suppressed
A high EMI SE with heat conductivity and electrical insulation are concluded as desirable
characteristics for electronic packaging materials. The foam-like and 3D percolating structures
support the absorption-dominant EMI shielding with minimal reflection. The random orientation of
the dispersed graphene platelets supports EMI shielding by reflection, whereas the absorption is
dominant for the epoxy-based composites containing orderly aligned graphene platelets.
It can be concluded from the above discussion that EMI SE by absorption can be enormously
increased by considering the following factors while designing the nanocomposite, which include:
increase the path of the EM wave within the composite causing an increase in absorption
A highly conductive 3D network for conduction of the electric field will result in ohmic
losses
The impedance mismatch at the interface between the polymer matrix and the 3D network
Impedance mismatch will also cause charge accumulation at the interface (space charge
Incusion of magnetic nanoparticles will attenuate the wave due to hysteresis losses.
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