This is a preview of "IPC 7525B-2011". Click here to purchase the full version from the ANSI store.

IPC-7525B
®

Stencil Design Guidelines

Developed by the Stencil Design Task Group (5-21e) of the Assembly

and Joining Processes Committee (5-20) of IPC

Supersedes: Users of this publication are encouraged to participate in the

IPC-7525A - February 2007 development of future revisions.
IPC-7525 - May 2000
Contact:

IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
This is a preview of "IPC 7525B-2011". Click here to purchase the full version from the ANSI store.
October 2011 IPC-7525B

Table of Contents
1 PURPOSE ................................................................. 1 3.2 Aperture Design ................................................ 4
1.1 Terms and Definitions ....................................... 1 3.2.1 Aperture Size ..................................................... 4
1.1.1 *Aperture ............................................................. 1 3.2.2 Aperture Size versus Board Land Size
1.1.2 *Area Ratio ......................................................... 1 for Tin Lead Solder Paste ................................. 8
1.1.3 *Aspect Ratio ...................................................... 1 3.2.3 Aperture Size versus Board Land Size
for Lead Free Solder Paste ............................... 9
1.1.4 Border ................................................................ 1
3.2.4 Glue Aperture Chip Component ..................... 10
1.1.5 Enclosed Print Head .......................................... 1
3.2.5 Glue Apertures for Combination of Chip
1.1.6 Etch Factor ........................................................ 1 Components and Leaded Devices ................... 10
1.1.7 Relief Etch ......................................................... 1 3.2.6 Relief Etch with Glue Stencils ....................... 11
1.1.8 Fiducials ............................................................. 1 3.3 Mixed Technology Surface-Mount/
1.1.9 Fine-Pitch BGA ................................................. 1 Through-Hole (Intrusive Soldering) ............... 11
1.1.10 Fine-Pitch Technology (FPT) ............................ 1 3.3.1 Solder Paste Volume ........................................ 11
1.1.11 Foil ..................................................................... 1 3.4 Mixed Technology Surface-Mount/
Flip Chip .......................................................... 13
1.1.12 Frame ................................................................. 1
3.4.1 Two-Print Stencil for Surface-Mount/
1.1.13 Intrusive Soldering ............................................ 1
Flip Chip .......................................................... 13
1.1.14 *Land ................................................................... 1
3.5 Step Stencil Design ......................................... 13
1.1.15 Modification ....................................................... 1
3.5.1 Step-Down Stencil ........................................... 14
1.1.16 *Overprinting ....................................................... 2
3.5.2 Step-Up Stencil ............................................... 14
1.1.17 *Pad ..................................................................... 2
3.5.3 Step Stencil for Enclosed Print Heads ........... 14
1.1.18 Squeegee ............................................................ 2
3.5.4 Relief-Etch Stencil .......................................... 14
1.1.19 Squeegee Direction ........................................... 2
3.6 Fiducials ........................................................... 14
1.1.20 Standard BGA ................................................... 2
3.6.1 Global Fiducials .............................................. 14
1.1.21 *Stencil ................................................................ 2
3.6.2 Local Fiducials ................................................ 14
1.1.22 Step Stencil ........................................................ 2 3.7 Rework and Repair Stencils ........................... 14
1.1.23 *Surface-Mounting Technology (SMT) .............. 2 3.7.1 Mini Stencils ................................................... 14
1.1.24 *Through-Hole Technology (THT) .................... 2 3.7.2 Repair Tool for Printing Paste Directly
1.1.25 Transfer Efficiency ............................................ 2 on the Component ........................................... 15
1.1.26 Ultra-Fine Pitch Technology ............................. 2
4 STENCIL FABRICATION ........................................ 15
2 APPLICABLE DOCUMENTS .................................... 2 4.1 Foils ................................................................. 15
2.1 IPC ..................................................................... 2 4.2 Frames ............................................................. 15
4.3 Stencil Border .................................................. 15
3 STENCIL DESIGN ..................................................... 3
3.1 4.4 Stencil Fabrication Technologies .................... 15
Stencil Data ....................................................... 3
3.1.1 4.4.1 Chemical Etch ................................................. 15
Data Format ....................................................... 3
3.1.2 4.4.2 Laser-Cut Stencils ........................................... 16
Gerber® Format ................................................ 3
3.1.3 4.4.3 Electroform ...................................................... 16
Aperture List ..................................................... 3
3.1.4 4.4.4 Hybrid .............................................................. 16
Solder Paste Layer ............................................ 3
3.1.5 4.4.5 Trapezoidal Apertures ..................................... 16
Data Transfer ..................................................... 3
3.1.6 4.4.6 Additional Options .......................................... 16
Panelized Stencils .............................................. 3
3.1.7 Step-and-Repeat ................................................. 3 5 STENCIL MOUNTING ............................................. 16
3.1.8 Image Orientation/Rotation ............................... 3 5.1 Location of Image on Metal ........................... 16
3.1.9 Image Location .................................................. 4 5.2 Centering ......................................................... 16
3.1.10 Identification ...................................................... 4 5.3 Additional Design Guidelines ......................... 16

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IPC-7525B October 2011

6 STENCIL ORDERING ............................................. 16 Figure 3-13 Print Only Mode 15 mil Thick Stencil .............. 10
Figure 3-14 Glue Stencil With Glue Reservoir .................... 10
7 STENCIL USER’S INSPECTION/VERIFICATION .. 17
Figure 3-15 Through-Hole Solder Paste Volume ................ 11
8 STENCIL CLEANING .............................................. 17 Figure 3-16 Overprint Without Step .................................... 12

9 END OF LIFE .......................................................... 17 Figure 3-17 Overprint With Step (Squeegee Side) ............. 12
Figure 3-18 Overprint With Step (Contact/Board Side) ...... 12
APPENDIX A: EXAMPLE ORDER FORM ................ 19 Figure 3-19 Two-Print Through-Hole Stencil ....................... 13

Figures Figure 3-20 Two-Print Stencil for Mixed Technology .......... 13

Figure 3-21 Print With Step ................................................. 13
Figure 3-1 4 mil Thick Stencil Tin Lead and Lead Free ..... 6
Figure 3-22 Step Down ....................................................... 14
Figure 3-2 5 mil Thick Stencil Tin Lead and Lead Free ..... 6
Figure 3-23 Step Up ............................................................ 14
Figure 3-3 6 mil Thick Stencil Tin Lead and Lead Free ..... 7
Figure 3-24 BTC .................................................................. 15
Figure 3-4 8 mil Thick Stencil Tin Lead and Lead Free ..... 7
Figure 3-25 BGA .................................................................. 15
Figure 3-5 Cross-Sectional View of A Stencil ..................... 8
Figure 4-1 Trapezoidal Apertures ...................................... 16
Figure 3-6 Home Plate Aperture Design ............................. 8
Figure 3-7 Bow Tie Aperture Design ................................... 9
Tables
Figure 3-8 Oblong Aperture Design .................................... 9
Table 3-1 Stencil Use Clauses ............................................ 4
Figure 3-9 Aperture Design for Cylindrical Components
and Chip Components (All Corners Rounded) .. 9 Table 3-2 General Aperture Design Guideline Examples
for Selective Surface-Mount Devices (Tin Lead
Figure 3-10 Window Pane Design for Ground Plane ........... 9
Solder Paste) ...................................................... 5
Figure 3-11 Glue Stencil Aperture Design .......................... 10
Table 3-3 Process Window for Intrusive Soldering -
Figure 3-12 Chip Component and SOIC Present Maximum Limits Desirable ................................ 11
on Board .......................................................... 10

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October 2011 IPC-7525B

Stencil Design Guidelines

1 PURPOSE
This document provides a guide for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is
intended as a guideline only. Much of the content is based on the experience of stencil designers, fabricators, and users.
Printing performance depends on many different variables and therefore no single set of design rules can be established.

1.1 Terms and Definitions All terms and definitions used throughout this handbook are in accordance with IPC-T-50.
Definitions noted with an asterisk (*) are quoted from IPC-T-50. Other specific terms and definitions, essential for the dis-
cussion of the subject, are provided below.

1.1.1 *Aperture An opening in the stencil foil.

1.1.2 *Area Ratio The ratio of the area of aperture opening to the area of aperture walls.

1.1.3 *Aspect Ratio The ratio of the width of the aperture to the thickness of the stencil foil.

1.1.4 Border Peripheral tensioned mesh, either polyester or stainless steel, which keeps the stencil foil flat and taut. The
border connects the foil to the frame.

1.1.5 Enclosed Print Head A stencil printer head that holds, in a single replaceable component, the squeegee blades and
a pressurized chamber filled with solder paste.

1.1.6 Etch Factor Etched Depth/Lateral; Etch in a chemical etching process.

1.1.7 Relief Etch Also known as Etch Relief and Under Etch. Adding an under etch of the foil to create a pocket for raised
features, labels, or a multi-print function.

1.1.8 Fiducials Reference marks on the stencil foil (and other board layers) for aligning the board and the stencil when
using a vision system in a printer.

1.1.9 Fine-Pitch BGA Ball grid array (BGA) with less than 1 mm [39 mil] pitch. Also known as chip scale package (CSP)
when the package size is no more than 1.2X the area of the original die size.

1.1.10 Fine-Pitch Technology (FPT) A surface-mount assembly technology with component terminations on centers less
than or equal to 0.625 mm [24.61 mil].

1.1.11 Foil The sheet used to create the stencil.

1.1.12 Frame A frame may be made of tubular or cast aluminum to which a tensioned mesh (border) is permanently
bonded using an adhesive.

1.1.13 Intrusive Soldering A process in which the solder paste for the through-hole components is applied using the sten-
cil. The through-hole components are inserted and reflow-soldered together with the surface-mount components. Also known
as Paste-In-Hole, Pin-In-Hole, or Pin-In-Paste Soldering.

1.1.14 *Land A portion of a conductive pattern usually used for the connection and/or attachment of components.

1.1.15 Modification The process of changing an aperture in size or shape.