SC200L-EM

Hardware Design

Smart module series

Rev:1.0

Date: 2020-9-21

Status：Controlled Documents

www.quectel.com
 SC200L Hardware Design

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 SC200L Hardware Design

About the Document

Revision History

Revision Date Author Description

1.0 2020-9-21 Jeffrey/Andy Initial

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Contents

About the Document ................................................................................................................................ 3

Contents .................................................................................................................................................... 4

1 Introduction ....................................................................................................................................... 6
1.1. Safety Information .................................................................................................................... 6

2 Product Concept ............................................................................................................................... 8

2.1. General Description .................................................................................................................. 8
2.2. Evaluation Board ...................................................................................................................... 9

3 Application Interfaces ..................................................................................................................... 10

3.1. General Description ................................................................................................................ 10
3.2. Pin Assignment ........................................................................................................................11
3.3. Pin Description ....................................................................................................................... 12
3.4. Power Supply ......................................................................................................................... 23
3.4.1. Decrease Voltage Drop ................................................................................................ 23
3.4.2. Decrease Voltage Drop ................................................................................................ 23
3.4.3. Reference Design for Power Supply ............................................................................ 25
3.5. Turn on and off Scenarios ...................................................................................................... 26
3.5.1. Turn on Module Using the PWRKEY ........................................................................... 26
3.5.2. Turn off Module ............................................................................................................ 28
3.6. Power Output ......................................................................................................................... 28
3.7. Battery Charge and Management .......................................................................................... 29
3.8. USB Interface ......................................................................................................................... 30
3.9. UART Interfaces ..................................................................................................................... 33
3.10. (U)SIM Interface ..................................................................................................................... 34
3.11. SD Card Interface ................................................................................................................... 36
3.12. GPIO Interfaces ...................................................................................................................... 38
3.13. I2C Interfaces ......................................................................................................................... 40
3.14. SPI Interfaces ......................................................................................................................... 40
3.15. ADC Interface ......................................................................................................................... 41
3.16. LCM Interface ......................................................................................................................... 42
3.17. Touch Panel Interface ............................................................................................................. 44
3.18. Camera Interface .................................................................................................................... 45
3.19. Sensor Interfaces ................................................................................................................... 49
3.20. Audio Interface ....................................................................................................................... 50
3.20.1 Microphone interface reference circuit ............................................................................ 51
3.20.2 Handset interface reference circuit.................................................................................. 52
3.20.3 Headphone interface reference circuit ............................................................................ 52
3.20.4 Speaker interface reference circuit .................................................................................. 53
3.20.5 Audio signal design considerations ................................................................................. 53
3.21. Emergency Download Interface ............................................................................................. 54

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4 Wi-Fi and BT................................................................................................................................... 55

4.1. Wi-Fi Overview ....................................................................................................................... 55
4.1.1 Wi-Fi Performance ....................................................................................................... 55
4.2 BT Overview ........................................................................................................................... 56
4.2.1 BT Performance ........................................................................................................... 57

5 GNSS ................................................................................................................................................ 58
5.1 GNSS Performance ................................................................................................................ 58
5.2 GNSS RF Design Guidelines ................................................................................................. 59

6 Antenna Interfaces .......................................................................................................................... 60

6.1 Main/Rx-diversity Antenna Interfaces ..................................................................................... 60
6.1.1 Main and Rx-diversity Antenna Interfaces Reference Design ...................................... 62
6.1.2 Reference Design of RF Layout ..................................................................................... 62
6.2 Wi-Fi/BT Antenna Interface .................................................................................................... 64
6.3 GNSS Antenna Interface ........................................................................................................ 65
6.3.1 Recommended Circuit for Passive Antenna ................................................................ 66
6.3.2 Recommended Circuit for Active Antenna ................................................................... 66
6.4 Antenna Installation ................................................................................................................ 67
6.4.1 Antenna Requirements ................................................................................................ 67
6.4.2 Recommended RF Connector for Antenna Installation ................................................ 68

6 Electrical, Reliability and Radio Characteristics .......................................................................... 70

7.1 Absolute Maximum Ratings .................................................................................................... 70
7.2 Power Supply Ratings ............................................................................................................ 70
7.3 Operation and Storage Temperatures..................................................................................... 71
7.4 Current Consumption ............................................................................................................. 71
7.5 RF Output Power .................................................................................................................... 74
7.6 RF Receiving Sensitivity ......................................................................................................... 76
7.7 Electrostatic Discharge ........................................................................................................... 77

7 Mechanical Dimensions.................................................................................................................. 78
8.1 Mechanical Dimensions of the Module ................................................................................... 78
8.2 Recommended Footprint ........................................................................................................ 80
8.3 Top and Bottom Views of the Module ..................................................................................... 81

8 Storage, Manufacturing and Packaging ........................................................................................ 82

8.1 Storage ................................................................................................................................... 82
9.2 Manufacturing and Soldering .................................................................................................. 82
9.3 Packaging ............................................................................................................................... 84

9 Appendix A References .................................................................................................................. 86

10 Appendix B GPRS Coding Schemes ............................................................................................. 91

11 Appendix C GPRS Multi-slot Classes ............................................................................................ 92

12 Appendix D EDGE Modulation and Coding Schemes .................................................................. 94

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1 Introduction
This document defines the SC200L module and its air interfaces and hardware interfaces which are
connected with customers’ application.

1.1. Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating SC200L module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for
customers’ failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.

Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.

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The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

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2 Product Concept

2.1. General Description

SC200L is a series of 4G Smart LTE module based on UNISOC platform and Android operating system,
and provides industrial grade performance. Its general features are listed below:
 Support LTE-FDD, LTE-TDD, WCDMA, EDGE, GSM and GPRS coverage.
 Support short-range wireless communication via Wi-Fi 802.11a/b/g/n and BT4.2 LE.
 Integrate GPS/GLONASS/BeiDou satellite positioning systems.
 Support multiple audio and video codecs.
 Built-in high performance Mail-T820 graphics processing unit.
 Provide multiple audio and video input/output interfaces as well as abundant GPIO interfaces.

SC200L module is available in three variants: SC200L-CE, SC200L-EM, SC200L-WF.

Table 1：SC200L-EM frequency bands

Mode Frequency band

LTE-FDD B1/B2/B3/B5/B7/B8/B20/B28

LTE-TDD B38/B39/B40/B41(200 MHz)

WCDMA B1/B2/B5/B8

GSM 850/900/1800/1900 MHz

CE: 2412-2472 MHz

Wi-Fi 802.11b/g/n
FCC: 2412-2462 MHz

BT 4.2 LE 2402~2480 MHz

GPS: 1575.42 ±1.023 MHz

GNSS GLONASS: 1597.5~1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz

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2.2. Evaluation Board

To help customers design and test applications with Quectel SC200L modules, Quectel supplies an
evaluation kit, which includes an evaluation board, a USB to RS232 converter cable, a USB T data cable,
a power adapter, an earphone and antennas. For details, please refer the document [1]

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3 Application Interfaces

3.1. General Description

SC200L is an SMD type module with 146 LCC pins and 128 LGA pins. The following chapters provide the
detailed description of pins/interfaces listed below.

 Power supply
 USB interface
 UART interfaces
 (U)SIM interfaces
 GPIO interfaces
 I2C interface
 SPI interfaces
 ADC interfaces
 LCM interfaces
 Touch panel interface
 Camera interfaces
 Sensor interfaces
 Audio interfaces
 Emergency download interface

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3.2. Pin Assignment

The following figure shows the pin assignment of SC200Lmodule.

Figure 1: Pin Assignment (Top View)

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3.3. Pin Description

The following tables show the SC200L’s pin definition.

Table 4: I/O Parameters Definition

Type Description

AI Analog input

AO Analog output

DI Digital input

DO Digital output

IO Bidirectional

OD Open drain

PI Power input

PO Power output

The following tables show the SC200L’s pin definition and electrical characteristics.

Table 5: Pin Description

Power supply

DC
Pin Name Pin No. I/O Description Comment
Characteristics
Power supply for Vmax=4.2V It must be provided
PI/P
VBAT_BB 1, 2 module’s baseband Vmin=3.55V with sufficient current
O
part Vnorm=3.8V up to 3.0A.
Vmax = 4.20 V It is suggested to use
Power supply for
VBAT_RF 145, 146 PI Vmin = 3.50 V a TVS for external
module’s RF part.
Vnorm = 3.80 V circuit.
Power supply for
1.85V output power Vnorm=1.85V external GPIO’s pull
LDO1_1V85 111 PO
supply IOmax=100mA up circuits and level
shift circuit.

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Power supply for

sensors, cameras,
1.8V output power Vnorm = 1.80 V
LDO2_1V8 125 PO and I2C pull-up
supply IOmax = 500 mA
circuits.

Power supply for

2.80V output power Vnorm = 2.80 V
LDO4_2V8 156 PO LCD, touch screen
supply IOmax = 200 mA
and sensors
Power supply for
Vnorm = 2.80 V
LDO3_2V8 129 PO 输出 2.80 V camera AVDD and
IOmax = 150 mA
AFVDD。

GND

Pin Name Pin No.

3、7、12、15、27、51、62、69、76、78、85、86、88、89、120、122、130、132、
135、140、143、144、162、171、172、176、187、188、189、190、191、202、
203、204、206、207、208、209、210、211、212、213、214、215、216、217、
GND
218、219、220、221、222、223、224、226、227、228、229、230、231、233、
234、235、236、237、238、240、241、243、244、245、247、248、250、251、
255、256、258、259、261、266、268、269、271、272、273、274

Audio Interfaces

DC
Pin Name Pin No. I/O Description Comment
Characteristics
Microphone input for
MIC1_P 4 AI
channel 1 (+)
Microphone input for
MIC1_N 5 AI
channel 1 (-)
icrophone input for
MIC2_P 6 AI
headset (+)
icrophone input for
MIC2_N 148 AI
headset (-)

EAR_P 8 AO Earpiece output (+)

EAR_N 9 AO Earpiece output (-)

SPK_P 10 AO Speaker output (+)

SPK_N 11 AO Speaker output (-)

Headphone right
HPH_R 136 AO
channel output
Headphone No need to be
HPH_REF 137 AO
reference ground grounded.

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Headphone left
HPH_L 138 AO
channel output
Headset insertion
HS_DET 139 AI The default is high.
detection
Headphone
HPMIC_DET 150 AI microphone
detection
Microphone bias1 VO = 2.20~3.00 V
MIC_BIAS1 147 PO
voltage Vnorm = 2.50 V
Microphone input for
MIC3_P 152 AI secondary
microphone (+)
Microphone input for
MIC3_N 151 AI secondary
microphone (-)
Microphone bias2 VO = 2.20~3.00 V
MIC_BIAS2 149 PO
voltage Vnorm = 2.80 V

USB Interface

DC
Pin Name Pin No. I/O Description Comment
Characteristics
Vmax=9.2V Used for USB 5V
USB_VBUS 141、142 PI USB power supply Vmin=4.5V power input and USB
Vnorm=5.00V detection.
AI/A USB differential data
USB_DM 13
O bus (-) USB 2.0 standard 90Ω differential
AI/A USB differential data compliant. impedance.
USB_DP 14
O bus (+)
USB ID detection of
USB_ID 16 DI High level by default.
the input

(U)SIM Interface

DC
Pin Name Pin No. I/O Description Comment
Characteristics
Active low.
If it is not used, keep
it open. This function
(U)SIM2 card plug VILmax=0.48V
USIM2_DET 17 DI is turned on by
detection VIHmin=1.39V
default.
It can be used as
ordinary GPIO.

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VOLmax =
It cannot be
(U)SIM2 card reset 0.1 × USIM2_VDD
USIM2_RST 18 DO multiplexed into a
signal VOHmin =
Generic GPIOs.
0.9 × USIM2_VDD
VOLmax =
It cannot be
(U)SIM2 card clock 0.1 × USIM2_VDD
USIM2_CLK 19 DO multiplexed into a
signal VOHmin =
Generic GPIOs.
0.9 × USIM2_VDD
VILmax =
0.3 × USIM2_VDD
VIHmin =
It cannot be
(U)SIM2 card data 0.7 × USIM2_VDD
USIM2_DATA 20 IO multiplexed into a
signal VOLmax =
Generic GPIOs.
0.1 × USIM2_VDD
VOHmin =
0.9 × USIM2_VDD
1.80 V (U)SIM:
Vmax = 1.85 V
Either 1.8V or 2.95V
(U)SIM2 card power Vmin = 1.75 V
USIM2_VDD 21 PO (U)SIM card is
supply 2.95 V (U)SIM:
supported.
Vmax = 3.1 V
Vmin = 2.90 V
Active low.
If it is not used, keep
it open. This function
U)SIM1 card plug VILmax = 0.48 V
USIM1_DET 22 DI is turned on by
detection VIHmin = 1.39 V
default.
It can be used as
ordinary GPIO.
VOLmax =
It cannot be
(U)SIM1 card reset 0.1 × USIM1_VDD
USIM1_RST 23 DO multiplexed into a
signal VOHmin =
Generic GPIOs.
0.9 × USIM1_VDD
VOLmax =
It cannot be
(U)SIM1 card clock 0.1 × USIM1_VDD
USIM1_CLK 24 DO multiplexed into a
signal VOHmin =
Generic GPIOs.
0.9 × USIM1_VDD

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VILmax =
0.3 × USIM1_VDD
VIHmin =
It cannot be
(U)SIM1 card data 0.7 × USIM1_VDD
USIM1_DATA 25 IO multiplexed into a
signal VOLmax =
Generic GPIOs.
0.1 × USIM1_VDD
VOHmin =
0.9 × USIM1_VDD
1.80 V (U)SIM:
Vmax = 1.85 V
Either 1.8V or 2.95V
(U)SIM1 card power Vmin = 1.75 V
USIM1_VDD 26 PO (U)SIM card is
supply 2.95 V (U)SIM:
supported 。
Vmax = 3.1 V
Vmin = 2.90 V

UART Interfaces

DC
Pin Name Pin No. I/O Description Comment
Characteristics
UART0 transmit VOLmax = 0.20 V
UART0_TXD 34 DO
data VOHmin = 1.46 V
VILmax = 0.48 V
UART0_RXD 35 DI UART0 receive data
VIHmin = 1.39 V
UART0 clear to VILmax = 0.48 V
UART0_CTS 36 DI
send VIHmin = 1.39 V
1.85V power domain,
UART0 request to VOLmax = 0.20 V
UART0_RTS 37 DO If it is not used, keep
send VOHmin = 1.46 V
it open.
UART1 receive
VILmax = 0.48 V
DBG_RXD 93 DI data.Debug port by
VIHmin = 1.39 V
default.
UART1 transmit
VOLmax = 0.20 V
DBG_TXD 94 DO data.Debug port by
VOHmin = 1.46 V
default.

SD Card Interface

DC
Pin Name Pin No. I/O Description Comment
Characteristics
3.00V output power Vnorm = 3.00 V
SD_VDD 38 PO Power supply for SD.
supply IOmax = 400 mA
1.8 V SD card：
VOLmax = 0.19 V
1.8V/2.95V output VOHmin = 1.58 V 50 Ω single-ended
SD_CLK 39 DO
power supply 3.0 V SD card： impedance.
VOLmax = 0.31 V
VOHmin = 2.61V

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1.8 V SD card：
VILmax = 0.53 V
VIHmin = 1.30 V
VOLmax = 0.19 V
Command signal of VOHmin = 1.58 V
SD_CMD 40 IO
SD card 3.0 V SD card：
VILmax = 0.87 V
VIHmin = 2.17 V
VOLmax = 0.31 V
VOHmin = 2.61 V

SD_DATA0 41 IO 1.8 V SD card：

VILmax = 0.53 V
SD_DATA1 42 IO VIHmin = 1.30 V
High speed VOLmax = 0.19 V
SD_DATA2 43 IO bidirectional digital VOHmin = 1.58 V
signal lines of SD 3.0 V SD card：
card VILmax = 0.87 V
SD_DATA3 44 IO VIHmin = 2.17 V
VOLmax = 0.31 V
VOHmin = 2.61 V
SD card insert
SD card insertion VILmax = 0.48 V
SD_DET 45 DI detection signal.
detection VIHmin = 1.39 V
Active low.

Touch Panel (TP) Interface

DC
Pin Name Pin No. I/O Description Comment
Characteristics
1.85V power domain
Interrupt signal of VILmax = 0.48 V
TP_INT 30 DI Can be used as
TP VIHmin = 1.39 V
ordinary GPIO.
1.85V power domain
VOLmax = 0.20 V Active low, Can be
TP_RST 31 DO Reset signal of TP
VOHmin = 1.46 V used as ordinary
GPIO.
I2C clock signal of
TP_I2C_SCL 47 OD 1.85V power domain,
TP
Can be used as
I2C data signal of
TP_I2C_SDA 48 OD ordinary GPIO.
TP

LCM Interface

DC
Pin Name Pin No. I/O Description Comment
Characteristics

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Adjust the backlight 1.85V power domain.

VOLmax = 0.20 V
PWM 29 DO brightness. Can be used as
VOHmin = 1.46 V
PWM control signal. ordinary GPIO.
1.85V power domain.
VOLmax = 0.20 V
LCD_RST 49 DO LCD reset signal Can be used as
VOHmin = 1.46 V
ordinary GPIO.
1.85V power domain.
LCD tearing effect VILmax = 0.48 V
LCD_TE 50 DI Can be used as
signal VIHmin = 1.39 V
ordinary GPIO.
MIPI DSI clock
DSI_CLK_N 52 AO
signal (-)
MIPI DSI clock
DSI_CLK_P 53 AO
signal (+)
MIPI DSI data 0
DSI_LN0_N 54 AO
signal (-)
MIPI DSI data 0
DSI_LN0_P 55 AO
signal (+)
MIPI DSI data 1
DSI_LN1_N 56 AO
signal (-)
MIPI DSI data 1
DSI_LN1_P 57 AO
signal (+)
MIPI DSI data 2
DSI_LN2_N 58 AO
signal (-)
MIPI DSI data 2
DSI_LN2_P 59 AO
signal (+)
MIPI DSI data 3
DSI_LN3_N 60 AO
signal (-)
MIPI DSI data 3
DSI_LN3_P 61 AO
signal (+)

Camera Interfaces

DC
Pin Name Pin No. I/O Description Comment
Characteristics
CAMERA MIPI
CSI1_CLK_N 63 AI
clock signal (-)
CAMERA MIPI clock
CSI1_CLK_P 64 AI
signal (+)
CAMERA MIPI data
CSI1_LN0_N 65 AI
0 signal (-)
CAMERA MIPI data
CSI1_LN0_P 66 AI
0 signal (+)
CAMERA MIPI data
CSI1_LN1_N 67 AI
1 signal (-)

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CAMERA MIPI data

CSI1_LN1_P 68 AI
1 signal (+)
CAMERA MIPI
CSI0_CLK_N 70 AI
clock signal (-)
CAMERA MIPI clock
CSI0_CLK_P 71 AI
signal (+)
CAMERA MIPI data
CSI0_LN0_N 72 AI
0 signal (-)
CAMERA MIPI data
CSI0_LN0_P 73 AI
0 signal (+)
Clock signal of VOLmax = 0.20 V
MCAM_MCLK 74 DO 1.85V power domain
camera VOHmin = 1.46 V
Clock signal of VOLmax = 0.20 V
SCAM_MCLK 75 DO
camera VOHmin = 1.46 V
Reset signal of VOLmax = 0.20 V
MCAM_RST 79 DO
camera VOHmin = 1.46 V
Power down signal VOLmax = 0.20 V
MCAM_PWDN 80 DO
of camera VOHmin = 1.46 V
1.85V power domain
Reset signal of VOLmax = 0.20 V
SCAM_RST 81 DO Can be used as
camera VOHmin = 1.46 V
ordinary GPIO.
Power down signal VOLmax = 0.20 V
SCAM_PWDN 82 DO
of camera VOHmin = 1.46 V
I2C clock signal of
CAM_I2C_SCL 83 OD
camera
I2C data signal of
CAM_I2C_SDA 84 OD
camera

Keypad Interfaces

DC
Pin Name Pin No. I/O Description Comment
Characteristics
Turn on/off the VILmax = 0.60 V Pull-up to VBAT
PWRKEY 114 DI
module VIHmin = 1.30 V internally.Active low.
Off by default and
VILmax = 0.60 V can be enabled via
RESET_N 225 DI Reset the module
VIHmin = 1.30 V software
configuration.
If it is not used, keep
VILmax = 0.48 V it open.Cannot be
VOL_UP 95 DI Volume up
VIHmin = 1.39 V pull up. 1.85V power
domain
If it is not used, keep
VILmax = 0.48 V
VOL_DOWN 96 DI Volume down it open.1.85V power
VIHmin = 1.39 V
domain

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RGB LED light interface

Connect to the
LED control negative pole of LED,
RGB_B 249 AI
negative the maximum current
is 27.7 mA.
Connect to the
LED control negative pole of LED,
RGB_R 252 AI
negative the maximum current
is 27.7 mA.
Connect to the
LED control negative pole of LED,
RGB_G 253 AI
negative the maximum current
is 27.7 mA.

SENSOR_I2C Interfaces

DC
Pin Name Pin No. I/O Description Comment
Characteristics
SENSOR_I2C_ I2C clock signal for
91 OD 1.85V power
SCL external sensor
domain,Can be used
SENSOR_I2C_ I2C data signal for
92 OD as ordinary GPIO.
SDA external sensor

Universal I2C interface

General peripheral
I2C4_SDA 167 OD 1.85V power domain.
I2C data signal
General peripheral
I2C4_SCL 168 OD 1.85V power domain.
I2C clock signal

ADC interface

DC
Pin Name Pin No. I/O Description Comment
Characteristics
General ADC Maximum input
ADC 128 AI
interface voltage 1.2 V 。

Charge Interface

DC
Pin Name Pin No. I/O Description Comment
Characteristics
Battery voltage Maximum input
BAT_SNS 133 AI
detection voltage is 4.2V.
Connect the fuel
Fuel gauge
CS_M 183 AI gauge to ground
detection negative
when not in use.

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Connect the fuel

Fuel gauge
CS_P 184 AI gauge to ground
detection positive
when not in use.
10 kΩ NTC is
supported by default,
and a 10 kΩ NTC
resistor must be
Battery temperature connected to ground.
BAT_THERM 134 AI
detection If it is not used, an
external 10 kΩ
resistor must be
connected to the
ground.
Battery type Input range: 0~1.2 V,
BAT_ID 185 AI
detection floating if not used 。

Antenna interface

DC
Pin Name Pin No. I/O Description Comment
Characteristics
AI/
ANT_MAIN 87 ANT_MAIN
AO

ANT_DRX 131 AI ANT_DRX

50Ω impedance
GNSS Antenna
ANT_GNSS 1) 121 AI
interface
AI/ Wi-Fi/BT Antenna
ANT_WIFI/BT 77
AO interface

GPIO interface

DC
Pin Name Pin No. I/O Description Comment
Characteristics

GPIO_87 33 IO GPIO

GPIO_86 90 IO GPIO

GPIO_85 97 IO GPIO VILmax = 0.48 V

VIHmin = 1.39 V
GPIO_88 98 IO GPIO
VOLmax = 0.20 V
GPIO_139 99 IO GPIO VOHmin = 1.46 V

GPIO_136 100 IO GPIO

GPIO_135 101 IO GPIO

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GPIO_134 102 IO GPIO

GPIO_11 103 IO GPIO

GPIO_10 104 IO GPIO

GPIO_138 105 IO GPIO

Can be reused as
GPIO_121 106 IO GPIO
EXTINT11

GPIO_52 107 IO GPIO

GPIO_53 108 IO GPIO

GPIO_54 109 IO GPIO

GPIO_55 110 IO GPIO

Can be reused as
GPIO_122 112 IO GPIO
EXTINT12

GPIO_33 113 IO GPIO

Can be reused as
GPIO_130 115 IO GPIO
EXTINT13
Can be reused as
GPIO_93 116 IO GPIO
EXTINT8
Can be reused as
GPIO_90 117 IO GPIO
EXTINT5
Can be reused as
GPIO_92 118 IO GPIO
EXTINT7
Can be reused as
GPIO_91 119 IO GPIO
EXTINT6

GPIO_32 123 IO GPIO

GPIO_129 124 IO GPIO

GRFC interface

DC
Pin Name Pin No. I/O Description Comment
Characteristics

GRFC_7 260 DO RF control output It cannot be

multiplexed into a
GRFC_5 262 DO RF control output Generic GPIO.

Other pins

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DC
Pin Name Pin No. I/O Description Comment
Characteristics
Pull down
Force the module to USB_BOOT to GND
VILmax = 0.48 V
USB_BOOT 46 DI enter emergency will force the module
VIHmin = 1.39 V
download mode enter emergency
download mode.
Connected to the
VO = 1.80~3.30 V
VIB_DRV_P 28 PO Motor drive positive terminal of
IOmax = 100 mA
the motor.

Reserved Interfaces

Pin Name Pin No. Comment

32、126、127、153、154，155、157、158、159、160、
161、163、164、165、166、169、170、173、174、175、
Keep these pins
RESERVED 177、178、179、180、181、182、186、192、193、194、
open.
195、196、197、198、199、200、201、205、232、239、
242、246、254、257、263、264、265、267、270

NOTES
1)
SC200L-WF does not support GNSS.

3.4. Power Supply

3.4.1. Decrease Voltage Drop

SC200L provides two VBAT_RF pins and two VBAT_BB pins for connecting with an external power
supply. The VBAT_RF pins are used for the RF part of the module and the VBAT_BB pins are used for
the baseband part of the module.

3.4.2. Decrease Voltage Drop

The power supply range of the module is 3.50V~4.20V, and the recommended value is 3.80V. The power
supply performance, such as load capacity, voltage ripple, etc. directly influences the module’s
performance and stability. Under ultimate conditions, the transient peak current of the module may surge
up to 3A. If the supply voltage is not enough, there will be voltage drops, and if the voltage drops below
3.1V, the module will be turned off automatically. Therefore, please make sure the input voltage will never
drop below 3.1V.

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Figure 2: Voltage Drop Sample

To decrease voltage drop, a bypass capacitor of about 100µF with low ESR (ESR=0.7Ω) should be used,
and a multi-layer ceramic chip capacitor (MLCC) should also be reserved due to its ultra-low ESR. It is
recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array and
place these capacitors close to VBAT_BB/RF pins. The main power supply from an external application
has to be a single voltage source and can be expanded to two sub paths with star structure. The width of
VBAT_BB trace should be no less than 3 mm. In principle, the longer the VBAT trace is, the wider it will
be.

In addition, in order to get a stable power source, it is suggested to use a TVS and place it as close to the
VBAT_BB/RF pins as possible to increase voltage surge withstand capability. The following figure shows
the star structure of the power supply.

Figure 3: Star Structure of the Power Supply

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3.4.3. Reference Design for Power Supply

The power design for the module is very important, as the performance of the module largely depends on
the power source. The power supply of SC200L should be able to provide sufficient current up to 3A at
least. If the voltage drop between the input and output is not too high, it is suggested to use an LDO to
supply power for the module. If there is a big voltage difference between the input source and the desired
output (VBAT), a buck converter is recommended.

The following figure shows a reference design for +5V input power source.

MIC29502WU U1
DC_IN VBAT
2 IN OUT 4
GND

ADJ
EN

C2 R1 R2
C1 100K
1

1%
470 μF 100 nF 51K R4 C3 C4
470R
R3
470 μF 100 nF
47K
1%

Figure 4: Reference Circuit of Power Supply

NOTES

1. It is suggested that customers should switch off the power supply for the module in an abnormal
state, and then switch on the power to restart the module.
2. The module supports the battery charging function by default. If the above power supply design is
adopted, please make sure the charging function is disabled by software or connect VBAT to
Schottky diode in series to avoid the reverse current to the power supply chip.

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3.5. Turn on and off Scenarios

3.5.1. Turn on Module Using the PWRKEY

The module can be turned on by driving the PWRKEY pin to a low level for at least 2.5s. PWRKEY pin is
pulled to VBAT internally. It is recommended to use an open drain/collector driver to control the PWRKEY.
A simple reference circuit is illustrated in the following figure.

R3
PWRKEY

1K
>2.5 s
R1
Q1
Turn on pulse 4.7K

R2

47K

Figure 5: Turn on the Module Using Driving Circuit

The other way to control the PWRKEY is by using a button directly. A TVS component is indispensable to
be placed nearby the button for ESD protection. A reference circuit is shown in the following figure.

Figure 6: Turn on the Module Using Keystroke

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The turning on the scenario is illustrated in the following figure.

Figure 7: Timing of Turning on Module

NOTES
1. When the module is powered on for the first time, its timing of turning on may be different from that
shown above.
2. Make sure that VBAT is stable before pulling down the PWRKEY pin. The recommended time
between them is no less than 30ms. PWRKEY pin cannot be pulled down all the time.

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3.5.2. Turn off Module

Set the PWRKEY pin low for at least 1s, and then choose to turn off the module when the prompt window
comes up.
It can also be forced to restart by pulling down the PWRKEY key for a long time (more than 7 seconds).
The restart sequence diagram is as follows:

Figure 8: Restart timing diagram

3.6. Power Output

SC200L supports the output of regulated voltages for peripheral circuits. During application, it is
recommended to use parallel capacitors (33pF and 10pF) in the circuit to suppress high-frequency noise.

Table 6: Power Description

Pin Name Default Voltage (V) Driving Current (mA) IDLE

LDO1_1V85 1.85 100 KEEP

LDO2_1V8 1.80 500 /

LDO3_2V8 2.80 150 /

LDO4_2V8 2.80 200 KEEP

SD_VDD 3.00 400 /

USIM1_VDD 1.80/2.95 50 /

USIM2_VDD 1.80/2.95 50 /

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3.7. Battery Charge and Management

SC200L module can recharge batteries. The battery charger in the SC200L module supports trickle
charging, constant current charging and constant voltage charging modes.

 Trickle charging: There are two steps in this mode. When the battery voltage is between 1.1V
and 2.05V, a 70mA trickle charging current is applied to the battery. When the battery voltage is
charged up and is between 2.05V and 3.05V, the charging current can be set to 450mA
maximally.
 Constant current mode (CC mode): When the battery is increased to between 3.05V and 4.18V,
the system will switch to CC mode. The charging current is 0.9A when an adapter is used for battery
charging, and the maximum charging current is 450mA for USB charging.
 Constant voltage mode (CV mode): When the battery voltage reaches the final value 4.18V, the
system will switch to CV mode and the charging current will decrease gradually. When the battery
level reaches 100%, the charging is completed.

Table 7: Description of charging interface

Pin Name Pin No. I/O Description Comment

Battery voltage
BAT_SNS 133 AI The maximum input voltage is 4.50 V.
detection
Fuel gauge detection Connect the fuel gauge to ground
CS_M 183 AI
negative when not in use.
Fuel gauge detection Connect the fuel gauge to ground
CS_P 184 AI
positive when not in use.
10 kΩ NTC is supported by default,
and a 10 kΩ NTC resistor must be
Battery temperature
BAT_THERM 134 AI connected to ground. If it is not used,
detection
an external 10 kΩ resistor must be
connected to the ground.
Input range: 0~1.2 V, if not used, leave
BAT_ID 185 AI Battery type detection
it open.

SC200L module supports battery temperature detection in the condition that the battery integrates a
thermistor (47KΩ 1% NTC thermistor with a B-constant of 3380KΩ by default; the thermistor is connected
to VBAT_THERM pin. If the VBAT_THERM pin is not connected, there will be malfunctions such as
battery charging failure, battery level display error, etc.

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A reference design for the battery charging circuit is shown below.

Figure 9: Reference Design for Battery Charging Circuit

Mobile devices such as mobile phones and handheld POS systems are powered by batteries. When
different batteries are utilized, the charging and discharging curve has to be modified correspondingly so
as to achieve the best effect.
If the thermistor is not available in the battery, or adapter is utilized for powering the module, then there is
only a need for VBAT and GND connection. In this case, the system may mistakenly judge that the battery
temperature is abnormal, which will cause battery charging failure. In order to avoid this, VBAT_THERM
should be connected to GND via a 10KΩ resistor. If VBAT_THERM is unconnected, the system will be
unable to detect the battery, making the battery cannot be charged.

VBAT_SNS pin must be connected. Otherwise, the module will have abnormalities in voltage detection,
as well as an associated power on/off and battery charging and discharging issues.

The SC200L series module supports current-type current meter by default, and conducts current
sampling through a 20 mΩ sampling resistor R2.

3.8. USB Interface

SC200L contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0
specification and supports high speed (480Mbps) and full-speed (12Mbps) modes. The USB interface is
used for AT command communication, data transmission, software debugging and firmware upgrade.

The following table shows the pin definition of the USB interface.

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Table 8: Pin Definition of USB Interface

Pin Name Pin No. I/O Description Comment

Vmax = 9.20 V
USB_VBUS 141、142 PI USB power supply Vmin = 4.50 V
Vnorm = 5.00 V
USB 2.0 differential data
USB_DM 13 AI/AO
bus (-) USB 2.0 standard compliant.
USB differential data bus 90Ω differential impedance.
USB_DP 14 AI/AO
(+)
USB ID detection of the
USB_ID 16 DI
input

For USB 2.0 interface design, it is recommended that USB_ID should be directly connected to the
USB_ID pin of an external USB port for USB ID detection. When a device inserts an external USB port, if
it pulls down the USB_ID pin of the module, the module will enter the Host mode.

Figure 10: USB Interface Reference Design (OTG is not Supported)

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2 AGND
PGND
PGND
3
9
Figure 11: USB OTG Interface Reference Design

In order to ensure USB performance, please comply with the following principles while designing a USB
interface.

 It is important to route the USB signal traces as differential pairs with total grounding. The impedance
of USB differential trace is 90Ω.
 Keep the ESD protection devices as close as possible to the USB connector. Pay attention to the
influence of junction capacitance of ESD protection devices on USB data lines. Typically, the
capacitance value should be less than 2pF.
 Do not route signal traces under crystals, oscillators, magnetic devices, and RF signal traces. It is
important to route the USB differential traces in inner-layer with ground shielding on not only the
upper and lower layers but also the right and left sides.
 Make sure the trace length difference of USB 2.0 is not exceeding 0.7 mm.

Table 9: USB Trace Length Inside the Module

PIN Signal Length (mm) Length Difference (DP-DM)

13 USB_DM 17.67
0.17
14 USB_DP 17.50

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3.9. UART Interfaces

SC200L provides two UART interfaces:

 UART0: 4-wire UART interface, hardware flow control supported.

 UART1（DEBUG）: 2-wire UART interface; used for debugging by default.

The UART interface pin definition is as follows:

Table 10: Pin Definition of UART Interfaces

Pin Name Pin No I/O Description Comment

UART0_TXD 34 DO UART0 transmit data

UART0_RXD 35 DI UART0 receive data

UART0_CTS 36 DI UART0 clear to send

1.8V power domain.
UART0_RTS 37 DO UART0 request to send If unused, keep it open.

UART1 receive data.

DBG_RXD 93 DI
Debug port by default.
UART2 transmit data.
DBG_TXD 94 DO
Debug port by default.

UART0 is a 4-wire UART interface with 1.85V power domain. A level translator should be used if
customers’ application is equipped with a 3.3V UART interface.

Figure 12: Reference Circuit with Level Translator Chip (for UART5)

The following figure is an example of a connection between SC200L and PC. A voltage level translator
and an RS-232 level translator chip are also recommended to be added between the module and PC. The

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following figure shows the reference design.

Figure 13: RS-232 Level Match Circuit (for UART0)

NOTE

Please note that the CTS and RTS pins of the serial port hardware flow control are directly connected,
and pay attention to the input and output directions.

3.10. (U)SIM Interface

SC200L provides 2 (U)SIM interfaces that meet ETSI and IMT-2000 requirements. Dual SIM Card Dual
Standby is supported by default. Both 1.8V and 2.95V (U)SIM cards are supported, and the (U)SIM card
interfaces are powered by the internal power supply of the SC200L module.

Table 11: Pin Definition of (U)SIM Interfaces

Pin Name Pin No I/O Description Comment

Active Low. If it is not used, keep it

(U)SIM2 card plug open.Enabled by default via
USIM2_DET 17 DI
detection software.It can be multiplexed into
a generic GPIO.
(U)SIM2 card reset It cannot be multiplexed into a
USIM2_RST 18 DO
signal generic GPIO.
(U)SIM2 card clock It cannot be multiplexed into a
USIM2_CLK 19 DO
signal generic GPIO.
(U)SIM2 card data It cannot be multiplexed into a
USIM2_DATA 20 IO
signal generic GPIO.

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(U)SIM2 card power Either 1.8V or 2.95V (U)SIM card is

USIM2_VDD 21 PO
supply supported.
Active Low. If it is not used, keep it
(U)SIM1 card plug open.Enabled by default via
USIM1_DET 22 DI
detection software.It can be multiplexed into
a generic GPIO.
(U)SIM1 card reset It cannot be multiplexed into a
USIM1_RST 23 DO
signal generic GPIO.
(U)SIM1 card clock It cannot be multiplexed into a
USIM1_CLK 24 DO
signal generic GPIO.
(U)SIM1 card data It cannot be multiplexed into a
USIM1_DATA 25 IO
signal generic GPIO.
(U)SIM1 card power Either 1.8V or 2.95V (U)SIM card is
USIM1_VDD 26 PO
supply supported.

SC200L supports (U)SIM card hot-plug via the USIM_DET pin. A reference circuit for (U)SIM interface
with an 8-pin (U)SIM card connector is shown below.

Figure 14: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector

If there is no need to use USIM_DET, please keep this pin open. The following is a reference circuit for
(U)SIM interface with a 6-pin (U)SIM card connector.

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Figure 15: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector

In order to ensure good performance and avoid damage of (U)SIM cards, please follow the criteria listed
below during (U)SIM circuit design:

 Keep placement of (U)SIM card connector as close to the module as possible. Keep the trace length
of (U)SIM card signals as less than 200 mm as possible.
 Keep (U)SIM card signals away from RF and VBAT traces.
 A filter capacitor shall be reserved for USIM_VDD, and its maximum capacitance should not exceed
1μF. The capacitor should be placed near to (U)SIM card.
 To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and
shield them with ground. USIM_RST also needs ground protection.
 In order to offer good ESD protection, it is recommended to add a TVS diode array with parasitic
capacitance not exceeding 50pF. The 22Ω resistors should be added in series between the module
and (U)SIM card so as to suppress EMI spurious transmission and enhance ESD protection. Please
note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector.
 The 22pF capacitors should be added in parallel on USIM_DATA, USIM_VDD, USIM_CLK and
USIM_RST signal lines so as to filter RF interference, and they should be placed as close to the
(U)SIM card connector as possible.

3.11. SD Card Interface

SC200L SD Card Interface supports the SD 3.0 protocol. The pin definition of the SD card interface is
shown below.

Table 12: Pin Definition of SD Card Interface

I/O
Pin Name Pin No Descrip Comment Pin Name
tion

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High-speed digital clock

SD_CLK 39 DO
signal of SD card

SD_CMD 40 IO Command signal of SD card

SD_DATA0 41 IO
50Ω characteristic impedance
SD_DATA1 42 IO High-speed bidirectional
digital signal lines of SD
SD_DATA2 43 IO card

SD_DATA3 44 IO

SD_DET 45 DI SD card insertion detection Active low

SD_VDD 38 PO 3V output power supply Power supply for SD card

A reference circuit for the SD card interface is shown below.

SD_VDD

SD_DATA2 R7 33R 1 P1-DAT2

SD_DATA3 R8 33R 2
P2-CD/DAT3
SD_CMD R9 33R 3 P3-CMD
4 P4-VDD
R10 33R 5
SD_CLK P5-CLK
6
P6-VSS
SD_DATA0 R11 33R 7 P7-DAT0
R12 33R 8
SD_DATA1 P8-DAT1
R13 1K 9
SD_DET DETECTIVE
GND
10 GND
C1 C2 D8 11
Module D1 D2 D3 D4 D5 D6 D7 GND
4.7 μF 33 pF 12 GND
13 GND

SD Card Connector

Figure 16: Reference Circuit for SD Card Interface

SD_VDD is a peripheral driver power supply for an SD card. The maximum drive current is 500mA.
Because of the high drive current, it is recommended that the trace width is 0.5 mm or above. In order to
ensure the stability of drive power, a 4.7μF and a 33pF capacitor should be added in parallel near the SD
card connector.

CMD, CLK, DATA0, DATA1, DATA2, and DATA3 are all high-speed signal lines. In PCB design, please
control the characteristic impedance of them to 50Ω, and do not cross them with other traces. It is

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recommended to route the trace on the inner layer of PCB and keep the same trace length for CLK, CMD,
DATA0, DATA1, DATA2 and DATA3. CLK needs separate ground shielding.
Layout guidelines:
 Control impedance to 50Ω ±10% and ground shielding is required.
 The total trace length difference between CLK and other signal line traces like CMD and DATA
should not exceed 1 mm.

Table 13: SD Card Trace Length Inside the Module

Pin No. Signal Length (mm)

39 SD_CLK 43.50

40 SD_CMD 42.82

41 SD_DATA0 45.92

42 SD_DATA1 46.24

43 SD_DATA2 43.97

44 SD_DATA3 45.62

3.12. GPIO Interfaces

SC200L has abundant GPIO interfaces with a power domain of 1.85V. The pin definition is listed below.

Table 14: Pin Definition of GPIO Interfaces

Pin Name Pin No GPIO Default state Comment

GPIO_87 33 GPIO_87 IN/PD 1)

GPIO_86 90 GPIO_86 IN/PU

GPIO_85 97 GPIO_85 OUT/Hiz

GPIO_88 98 GPIO_88 IN/PU

GPIO_139 99 GPIO_139 IN/PU

GPIO_136 100 GPIO_136 IN/PU

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GPIO_135 101 GPIO_135 IN/PU

GPIO_134 102 GPIO_134 IN/PD

GPIO_11 103 GPIO_11 IN/PD

GPIO_10 104 GPIO_10 IN/PD

GPIO_138 105 GPIO_138 IN/PU

Can be reused as
GPIO_121 106 GPIO_121 OUT/L
EXTINT11

GPIO_52 107 GPIO_52 IN/PU

GPIO_53 108 GPIO_53 IN/PD

GPIO_54 109 GPIO_54 IN/PD

GPIO_55 110 GPIO_55 IN/PD

Can be reused as
GPIO_122 112 GPIO_122 IN/PD
EXTINT12

GPIO_33 113 GPIO_33 IN/PD

Can be reused as
GPIO_130 115 GPIO_130 IN/PD
EXTINT13
Can be reused as
GPIO_93 116 GPIO_93 IN/PD
EXTINT8
Can be reused as
GPIO_90 117 GPIO_90 IN/PU
EXTINT5
Can be reused as
GPIO_92 118 GPIO_92 IN/PD
EXTINT7
Can be reused as
GPIO_91 119 GPIO_91 IN/PD
EXTINT6

GPIO_32 123 GPIO_32 IN/PD

GPIO_129 124 GPIO_129 IN/PD

NOTE

1. 1) PD: pull-down; PU: pull-up; IN: input; OUT: output; L: low level; H: high level; Hiz: high
impedance.
2. For detailed configuration of GPIO, please refer to document [3].
3. External inputs with hardware mechanical jitter, such as buttons and OTG ID pins, must be
selected as GPIO that can be multiplexed into EXTINT functions.

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4. For the EN pin of flash, switch charging, DC/DC and other chips, please select the PD's GPIO
control by default.
5. When ordinary GPIO is used as an input interrupt, edge wakeup is not supported when the system
sleeps, only level wakeup is supported.

3.13. I2C Interfaces

SC200L module provides four I2C interfaces. As an open-drain signal, the I2C interfaces need a pull-up
resistor on its external circuit, and the recommended power domain is 1.85V.

Table 15: Pin Definition of I2C Interfaces

I/O
Pin Name Pin No Descripti Comment Pin Name
on
I2C clock signal of touch
TP_I2C_SCL 47 OD
panel
Used for touch panel
I2C data signal of touch
TP_I2C_SDA 48 OD
panel

CAM_I2C_SCL 83 OD I2C clock signal of camera

Used for camera
CAM_I2C_SDA 84 OD I2C data signal of camera

General peripheral I2C

I2C4_SCL 168 OD
clock signal
For external equipment
General peripheral I2C
I2C4_SDA 167 OD
data signal
I2C clock signal for
SENSOR_I2C_SCL 91 OD
external sensor
Used for external sensor
I2C data signal for
SENSOR_I2C_SDA 92 OD
external sensor

3.14. SPI Interfaces

SC200L provides three SPI interfaces, which are multiplexed from UART and GPIO interfaces. These
interfaces can only support the master mode. SPI interfaces can be used for fingerprint recognition.

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Table 16: Pin Definition of SPI Interfaces

Pin Name Pin No I/O Description Comment

GPIO_52 107 DO SPI2 chip select signal Multiplexed as SPI2_CSN

GPIO_53 108 DO SPI2 data output Multiplexed as SPI2_DO

GPIO_54 109 DI SPI2 data input Multiplexed as SPI2_DI

GPIO_55 110 DO SPI2 clock signal Multiplexed as SPI2_CLK

GPIO_93 116 DO SPI0 clock signal Multiplexed as SPI0_CLK

GPIO_90 117 DO SPI0 chip select signal Multiplexed as SPI0_CSN

GPIO_92 118 DI SPI0 data input Multiplexed as SPI0_DI

GPIO_91 119 DO SPI0 data output Multiplexed as SPI0_DO

GPIO_139 99 DO SPI1 chip select signal Multiplexed as SPI1_CSN

GPIO_136 100 DO SPI1 data output Multiplexed as SPI1_DO

GPIO_135 101 DI SPI1 data input Multiplexed as SPI1_DI

GPIO_134 102 DO SPI1 clock signal Multiplexed as SPI1_CLK

3.15. ADC Interface

SC200L supports a analog-to-digital converter (ADC) interface, and the pin definition is shown below.

Table 17: Pin Definition of ADC Interfaces

I/O
Pin Name Pin No Descripti Comment Pin Name
on
The maximum input voltage is
ADC 128 AI Generic ADC
1.2V.

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3.16. LCM Interface

SC200L provides an LCM interface, which is MIPI_DSI standard compliant. The interface supports
high-speed differential data transmission and supports HD+ display (1440x720 @60fps). The pin
definition of the LCM interface is shown below.

Table 18: Pin Definition of LCM Interface

Pin Name Pin No I/O Description Comment

1.80 V output;Provide
Vnorm = 1.80 V
LDO2_1V8 125 PO enable signal for external
IOmax = 500 mA
LCD I/O port power supply
2.80V output power supply Vnorm = 2.80 V
LDO4_2V8 156 PO
for LCD VCC IOmax = 200 mA
Adjust the backlight 1.85 V voltage domain
PWM 29 DO brightness,PWM control Can be used as ordinary
signal GPIO
1.85 V voltage domain
LCD_RST 49 DO LCD reset signal Can be used as ordinary
GPIO
1.85 V voltage domain
LCD_TE 50 DI LCD tearing effect signal Can be used as ordinary
GPIO

DSI_CLK_N 52 AO LCD MIPI clock signal (-)

DSI_CLK_P 53 AO LCD MIPI clock signal (+)

DSI_LN0_N 54 AO LCD MIPI data signal 0 (-)

DSI_LN0_P 55 AO LCD MIPI data signal 0 (+)

DSI_LN1_N 56 AO LCD MIPI data signal 1 (-)

DSI_LN1_P 57 AO LCD MIPI data signal 1 (+)

DSI_LN2_N 58 AO LCD MIPI data signal 2 (-)

DSI_LN2_P 59 AO LCD MIPI data signal 2 (+)

DSI_LN3_N 60 AO LCD MIPI data signal 3 (-)

DSI_LN3_P 61 AO LCD MIPI data signal 3 (+)

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A reference circuit for the LCM interface is shown below.

Figure 17: Reference Circuit Design for LCM Interface

MIPI is high-speed signal lines. It is recommended that common-mode filters should be added in series
near the LCM connector, so as to improve protection against electromagnetic radiation interference.
It is recommended to read the LCM ID register through MIPI when compatible design with other displays
is required. If several LCM models share the same IC, it is recommended that the LCM module factory
burn the OTP register to distinguish different screens. Customers can also select the LCD_ID pin of LCM
to connect the ADC pin of the SC200L module.
The external backlight driving circuit needs to be designed for LCM, and a reference circuit design is
shown in the following figure. The backlight brightness adjustment can be realized by the PWM pin of the
SC200L module by adjusting the duty ratio.

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Figure 18: Reference Design for External Backlight Driving Circuit

3.17. Touch Panel Interface

SC200L provides one I2C interface for connection with Touch Panel (TP), and also provides the
corresponding power supply and interrupt pins. The definitions of TP interface pins are illustrated below.

Table 19: Pin Definition of Touch Panel Interface

Pin Name Pin No I/O Description Comment

2.80V output power supply Vnorm = 2.80 V

LDO4_2V8 156 PO
for TP VDD IOmax = 200 mA
1.8V output power supply Vnorm = 1.80 V
LDO2_1V8 125 PO
for TP I/O power IOmax = 500 mA
1.85 V voltage domain
TP_INT 30 DI Interrupt signal of TP Can be used as ordinary
GPIO
1.85 V voltage domain
TP_RST 31 DO Reset signal of TP Can be used as ordinary
GPIO

TP_I2C_SCL 47 OD I2C clock signal of TP 1.85 V voltage domain, can

be used as ordinary GPIO
without external pull-up
TP_I2C_SDA 48 OD I2C data signal of TP Can be used for other I2C
devices

A reference circuit for the TP interface is shown below.

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Figure 19: Reference Circuit Design for TP Interface

NOTE
The touch screen uses LDO4_2V8 power supply by default (normally open). LDO4_2V8 can output 200
mA current。

3.18. Camera Interface

Based on the standard MIPI CSI video input interface, the SC200L module supports two cameras (2-lane
+ 1-lane), Front-camera 1-lane MIPI, can support up to 2 MP photography; rear-camera 2-lane MIPI, can
support up to 8 MP photography.The video and photo quality is determined by various factors such as the
camera sensor, camera lens quality, etc.

Table 20: Pin Definition of Camera Interface

Pin
Pin Name I/O Description Comment
No
1.8V output power supply for Vnorm = 1.80 V
LDO2_1V8 125 PO
DOVDD of camera IOmax = 500 mA
2.80V output power supply for Vnorm = 2.80 V
LDO3_2V8 129 PO
AVDD and AFVDD of camera IOmax = 150 mA

CSI1_CLK_N 63 AI CAMERA MIPI clock signal (-)

CSI1_CLK_P 64 AI CAMERA MIPI clock signal (+)

CSI1_LN0_N 65 AI CAMERA MIPI data0 signal (-)

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CSI1_LN0_P 66 AI CAMERA MIPI data0 signal (+)

CSI1_LN1_N 67 AI CAMERA MIPI data1 signal (-)

CSI1_LN1_P 68 AI CAMERA MIPI data1 signal (+)

CSI0_CLK_N 70 AI CAMERA MIPI clock signal (-)

CSI0_CLK_P 71 AI CAMERA MIPI clock signal (+)

CSI0_LN0_N 72 AI CAMERA MIPI data0 signal (-)

CSI0_LN0_P 73 AI CAMERA MIPI data0 signal (+)

MCAM_MCLK 74 DO Clock signal of camera 1.85 V voltage domain

SCAM_MCLK 75 DO Clock signal of camera

MCAM_RST 79 DO Reset signal of camera

MCAM_PWDN 80 DO Power down signal of camera

1.85 V voltage domain
SCAM_RST 81 DO Reset signal of camera Can be used as
ordinary GPIO
SCAM_PWDN 82 DO Power down signal of camera

CAM_I2C_SCL 83 OD I2C clock signal of camera

CAM_I2C_SDA 84 OD I2C clock signal of camera

The following is a reference circuit design for cameras.

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4.7μF

4.7μF
1 μF

1 μF

Rear camera connector

Front camera connector

Figure 20: Reference Circuit Design for Cameras

NOTE

CSI1 is used for the rear camera, and CSI0 is used for the front camera.

Design considerations:

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 Special attention should be paid to the pin definition of LCM/camera connectors. Assure the SC200L
and the connectors are correctly connected .
 MIPI is high speed signal lines, supporting maximum data rate up to 1.5Gbps. The differential
impedance should be controlled to 100Ω. Additionally, it is recommended to route the trace on the
inner layer of PCB, and do not cross it with other traces. For the same group of DSI or CSI signals, all
the MIPI traces should keep the same length. In order to avoid crosstalk, a distance of 1.5 times the
trace width among MIPI signal lines is recommended. During impedance matching, do not connect
GND on different planes so as to ensure impedance consistency.
 It is recommended to select a low capacitance TVS for ESD protection and the recommended
parasitic capacitance should be below 1pF.
 Route MIPI traces according to the following rules:
a) The total trace length should not exceed 75mm;
b) Control the differential impedance to 100Ω ±10%;
c) Control intra-lane length difference within 0.5mm;
d) Control inter-lane length difference within 1.3 mm.

Table 1: MIPI Trace Length Inside the Module

Pin Name Pin No Length (mm) Length Difference (P-N)

52 DSI_CLK_N 53.88
0.03
53 DSI_CLK_P 53.91

54 DSI_LN0_N 54.05
-0.36
55 DSI_LN0_P 53.69

56 DSI_LN1_N 52.10
-0.08
57 DSI_LN1_P 52.02

58 DSI_LN2_N 55.63
-0.18
59 DSI_LN2_P 55.45

60 DSI_LN3_N 55.39
-0.45
61 DSI_LN3_P 55.84

63 CSI1_CLK_N 16.03
-0.09
64 CSI1_CLK_P 15.94

65 CSI1_LN0_N 14.36
-0.36
66 CSI1_LN0_P 14.00

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67 CSI1_LN1_N 17.46
0.37
68 CSI1_LN1_P 17.83

70 CSI0_CLK_N 18.24
-0.44
71 CSI0_CLK_P 17.80

72 CSI0_LN0_N 18.64
0.15
73 CSI0_LN0_P 18.79

3.19. Sensor Interfaces

SC200L module supports communication with sensors via I2C interfaces, and it supports ALS/PS,
compass, G-sensor, and gyroscopic sensors.

Table 22: Pin Definition of Sensor Interfaces

Pin Name Pin No I/O Description Comment

I2C clock signal for external 1.85 V voltage domain

SENSOR_I2C_SCL 91 OD
sensor Can be used for other
I2C data signal for external I2C devices,Can be
SENSOR_I2C_SDA 92 OD
sensor used as ordinary GPIO

GPIO_52 107 DI Light sensor interrupt signal

Compass sensor interrupt

GPIO_54 109 DI
signal
Accelerate sensor interrupt
GPIO_55 110 DI
signal
Gyroscope sensor interrupt
GPIO_53 108 DI
signal

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3.20. Audio Interface

SC200L module provides three analog input channels and three analog output channels. The following
table shows the pin definition.

Table 23: Pin Definition of Audio Interfaces

Pin Name Pin No I/O Description Comment

MIC1_P 4 AI Main microphone input (+)

MIC1_N 5 AI MIC reference ground

Headphone microphone
MIC2_P 6 AI
input (+)
Headphone microphone
MIC2_N 148 AI
input (-)

MIC_BIAS2 149 PO Microphone bias voltage 2

Secondary microphone input

MIC3_P 152 AI
(+)
Secondary microphone input
MIC3_N 151 AI
(-)

MIC_BIAS1 147 PO Microphone bias voltage 1

EAR_P 8 AO Earpiece output (+)

EAR_N 9 AO Earpiece output (-)

SPK_P 10 AO Speaker output (+)

SPK_N 11 AO Speaker output (-)

Headphone right channel

HPH_R 136 AO
output
Headphone reference No need to connect to
HPH_REF 137 AO
ground ground
Headphone left channel
HPH_L 138 AO
output

HS_DET 139 AI Headset insertion detection The default is high

Headphone microphone
HPMIC_DET 150 AI
detection

 The module has three sets of audio inputs, including three sets of differential input channels
 The output voltage range of two MIC_BIAS is programmable between 2.2V and 3.0V, and the

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maximum output current is 2mA.

 The earpiece interface uses differential output.
 The loudspeaker interface uses the differential output as well. The output channel is available with a
Class-D amplifier whose output power is 0.8W when load is 8Ω.
 The headphone interface features stereo left and right channel output, and headphone insert
detection function is supported.

3.20.1 Microphone interface reference circuit

Figure 21: Main microphone reference circuit

Figure 22: Auxiliary microphone reference circuit

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3.20.2 Handset interface reference circuit

C2
33 pF
R1
EAR_P
C1 0R

100 pF R2
EAR_N
0R
C3 D1 D2
GND
33 pF
Module

Figure 23: Earpiece output interface reference circuit

3.20.3 Headphone interface reference circuit

C10

C4
C3

C5
33 pF
NM

33 pF
33 pF

Figure 24: Headphone interface reference circuit

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3.20.4 Speaker interface reference circuit

Figure 25: Speaker interface reference circuit

3.20.5 Audio signal design considerations

It is recommended to use the electret microphone with dual built-in capacitors (e.g. 10pF and 33pF) for
filtering out RF interference, thus reducing TDD noise. The 33pF capacitor is applied for filtering out RF
interference when the module is transmitting at EGSM900. Without placing this capacitor, TDD noise
could be heard. The 10pF capacitor here is used for filtering out RF interference at DCS1800. Please note
that the resonant frequency point of a capacitor largely depends on the material and production technique.
Therefore, customers would have to discuss with their capacitor vendors to choose the most suitable
capacitor for filtering out high-frequency noises.

The severity degree of the RF interference in the voice channel during GSM transmitting largely
depends on the application design. In some cases, EGSM900 TDD noise is more severe; while in other
cases, DCS1800 TDD noise is more obvious. Therefore, a suitable capacitor should be selected based
on the test results. Sometimes, even no RF filtering capacitor is required.

In order to decrease radio or other signal interference, RF antennas should be placed away from
audio interfaces and audio traces. Power traces cannot be parallel with and also should be far away from
the audio traces.

The differential audio traces must be routed according to the differential signal layout rule.

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3.21. Emergency Download Interface

USB_BOOT is an emergency download interface. Pull the pin to ground during power-up will force the
module to enter emergency download mode.There is an emergency option when failures such as
abnormal start-up or running occur. For the convenient firmware upgrade and debugging in the future,
please reverse this pin. The reference circuit design is shown below.

Figure 26: Reference Circuit Design for Emergency Download Interface

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4 Wi-Fi and BT
SC200L provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth (BT) functions. The
interface impedance is 50Ω. External antennas such as PCB antenna, sucker antenna, and ceramic
antenna can be connected to the module via the interface, so as to achieve Wi-Fi and BT functions.

4.1. Wi-Fi Overview

SC200L supports 2.4GHz band WLAN wireless communication based on IEEE 802.11 b/g/n
standard protocols. The maximum data rate is up to 72.2Mbps. The features are as below

 Support Wake-on-WLAN (WoWLAN)

 Support ad hoc mode
 Support WAPI SMS4 hardware encryption
 Support AP mode
 Support Wi-Fi Direct
 Support MCS 0-7 for HT20

4.1.1 Wi-Fi Performance

The following table lists the Wi-Fi transmitting and receiving performance of the SC200L module.：

Table 2: Wi-Fi Transmitting Performance

Standard Rate Output Power

802.11b 1 Mbps 16 dBm ±2.5 dB

802.11b 11 Mbps 16 dBm ±2.5 dB

802.11g 6 Mbps 15 dBm ±2.5 dB

2.4 GHz
802.11g 54 Mbps 14 dBm ±2.5 dB

802.11n HT20 MCS0 15 dBm ±2.5 dB

802.11n HT20 MCS7 13 dBm ±2.5 dB

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Table 3: Wi-Fi Receiving Performance

Standard Rate Sensitivity

802.11b 1 Mbps -89

802.11b 11 Mbps -85

802.11g 6 Mbps -89

2.4 GHz
802.11g 54 Mbps -74

802.11n HT20 MCS0 -88

802.11n HT20 MCS7 -69

Referenced specifications are listed below:：

 IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY,
June 2007
 IEEE Std 802.11b, IEEE Std 802.11d, IEEE Std 802.11e, IEEE Std 802.11g, IEEE Std 802.11i:
IEEE 802.11-2007 WLAN MAC and PHY, June 2007

4.2 BT Overview
SC200L module supports BT4.2 (BR/EDR+BLE) specification, as well as GFSK, 8-DPSK, π/4-DQPSK
modulation modes.

 Maximally support up to 7 wireless connections.

 Maximally support up to 3.5 PICONETs at the same time.
 Support one SCO (Synchronous Connection Oriented) or eSCO connection.

The BR/EDR channel bandwidth is 1MHz, and can accommodate 79 channels.

Table 27: BT Data Rate and Version

Version Data rate Maximum Application Throughput Comment

1.2 1 Mbit/s > 80 Kbit/s

2.0+EDR 3 Mbit/s > 80 Kbit/s

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3.0+HS 24 Mbit/s Reference 3.0 + HS

4.0 24 Mbit/s Reference 4.0 LE

Referenced specifications are listed below:：

 Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1+ EDR/3.0/3.0 +

HS, August 6, 2009
 Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009

4.2.1 BT Performance

Table 28: BT Transmitting and Receiving Performance

Transmitter Performance

Packet Types DH5 2-DH5 3-DH5

Transmitting Power 8±2 dB 7±2 dB 7±2 dB

Receiver Performance

Packet Types DH5 2-DH5 3-DH5

Receiving Sensitivity -90 -90 -84

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5 GNSS
SC200L integrates a Unisoc GNSS engine (GEN 8C) which supports multiple positioning and
navigation systems including GPS, GLONASS, and BeiDou. With an embedded LNA, the module
provides greatly improved positioning accuracy.

5.1 GNSS Performance

The following table lists the GNSS performance of the SC200L module in conduction mode.

Table 29: GNSS Performance

Parameter Description Typ. Unit

Cold start -147 dBm

Sensitivity (GNSS) Reacquisition -156 dBm

Tracking -156 dBm

Cold start 30 s

TTFF (GNSS) Warm start 23 s

Hot start 5 s

Static Drift (GNSS) CEP-50 <2.5 m

Note

SC200L-WF NOT SUPPORT GNSS。

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5.2 GNSS RF Design Guidelines

Bad design of antenna and layout may cause reduced GPS receiving sensitivity, longer GPS positioning
time, or reduced positioning accuracy. In order to avoid this, please follow the reference design rules as
below:

6 Maximize the distance between the GNSS RF part and the GPRS RF part (including trace routing
and antenna layout) to avoid mutual interference.
7 In user systems, GNSS RF signal lines and RF components should be placed far away from
high-speed circuits, switched-mode power supplies, power inductors, the clock circuit of single-chip
microcomputers, etc.
8 For applications with a harsh electromagnetic environment or with high requirement on ESD
protection, it is recommended to add ESD protection diodes for the antenna interface. Only diodes
with ultra-low junction capacitance such as 0.5pF can be selected. Otherwise, there will be effects
on the impedance characteristic of the RF circuit loop or attenuation of the bypass RF signal may be
caused.
9 Control the impedance of either feeder line or PCB trace to 50Ω, and keep the trace length as short
as possible.
10 Refer to Chapter 6.3 for the GNSS reference circuit design.

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6 Antenna Interfaces
SC200L provides four antenna interfaces for the main antenna, Rx-diversity/MIMO antenna, GNSS
antenna and Wi-Fi/BT antenna, respectively. The antenna ports have an impedance of 50Ω.

6.1 Main/Rx-diversity Antenna Interfaces

The pin definition of main/Rx-diversity antenna interfaces is shown below. :

Table30: Pin Definition of Main/Rx-diversity Antenna Interfaces

Pin Name Pin No. I/O Description Comment

ANT_MAIN 87 IO Main antenna

50Ω impedance
ANT_DRX 131 AI Diversity antenna

The operating frequencies of SC200L are listed in the following tables

Table31: SC200L-CE Operating Frequencies

3GPP Band Receive Transmit Unit

EGSM900 925~960 880~915 MHz

DCS1800 1805~1880 1710~1785 MHz

WCDMA B1 2110~2170 1920~1980 MHz

WCDMA B8 925~960 880~915 MHz

LTE-FDD B1 2110~2170 1920~1980 MHz

LTE-FDD B3 1805~1880 1710~1785 MHz

LTE-FDD B5 869~894 824~849 MHz

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LTE-FDD B8 925~960 880~915 MHz

LTE-TDD B34 2010~2025 2010~2025 MHz

LTE-TDD B38 2570~2620 2570~2620 MHz

LTE-TDD B39 1880~1920 1880~1920 MHz

LTE-TDD B40 2300~2400 2300~2400 MHz

LTE-TDD B41 2535~2675 2535~2675 MHz

Table32: SC200L-EM* Operating Frequencies

3GPP Band Receive Transmit Unit

GSM850 869~894 824~849 MHz

EGSM900 925~960 880~915 MHz

DCS1800 1805~1880 1710~1785 MHz

PCS1900 1930~1990 1850~1910 MHz

WCDMA B1 2110~2170 1920~1980 MHz

WCDMA B2 1930~1990 1850~1910 MHz

WCDMA B5 869~894 824~849 MHz

WCDMA B8 925~960 880~915 MHz

LTE-FDD B1 2110~2170 1920~1980 MHz

LTE-FDD B2 1930~1990 1850~1910 MHz

LTE-FDD B3 1805~1880 1710~1785 MHz

LTE-FDD B5 869~894 824~849 MHz

LTE-FDD B7 2620~2690 2500~2570 MHz

LTE-FDD B8 925~960 880~915 MHz

LTE-FDD B20 791~821 832~862 MHz

LTE-FDD B28(A + B) 758~803 703~748 MHz

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LTE-TDD B38 2570~2620 2570~2620 MHz

LTE-TDD B39 1880~1920 1880~1920 MHz

LTE-TDD B40 2300~2400 2300~2400 MHz

LTE-TDD B41 2496~2690 2496~2690 MHz

NOTE

“*” means under development.

6.1.1 Main and Rx-diversity Antenna Interfaces Reference Design

A reference circuit design for main and Rx-diversity antenna interfaces is shown as below. A π-type
matching circuit should be reserved for better RF performance. The π-type matching components
(R1/C1/C2, R2/C3/C4) should be placed as close to the antennas as possible and are mounted
according to the actual debugging. The C1, C2, C3, and C4 are not mounted and a 0Ω resistor is
mounted on R1 and R2 respectively by default.

Figure 27: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces

6.1.2 Reference Design of RF Layout

For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50Ω. The
impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,

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height from the reference ground to the signal layer (H), and the clearance between RF traces and
grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic
impedance. The following are reference designs of microstrip line or coplanar waveguide with different
PCB structures.

Figure 27: Microstrip Design on a 2-layer PCB

Figure 28: Coplanar Waveguide Design on a 2-layer PCB

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Figure 29: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)

Figure 30: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)

In order to ensure RF performance and reliability, the following principles should be complied with in RF
layout design:

 Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to
50Ω.
 The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully
connected to ground.
 The distance between the RF pins and the RF connector should be as short as possible, and all the
right-angle traces should be changed to curved ones.
 There should be clearance under the signal pin of the antenna connector or solder joint.
 The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground could help to improve RF performance. The distance between
the ground vias and RF traces should be no less than two times as wide as RF signal traces (2 x W).

For more details about the RF layout, please refer to the document [3].

6.2 Wi-Fi/BT Antenna Interface

The following tables show the pin definition and frequency specification of the Wi-Fi/BT antenna
interface.

Table 4: Pin Definition of Wi-Fi/BT Antenna Interface

Pin Name Pin No. I/O Description Comment

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ANT_WIFI/BT 77 IO Wi-Fi/BT antenna interface 50Ω impedance

Table 5: Wi-Fi/BT Frequency

Type Frequency Unit

CE: 2412-2472 MHz

Wi-Fi (2.4GHz) MHz
FCC: 2412-2462 MHz

BT4.2 LE 2402~2480 MHz

A reference circuit design for Wi-Fi/BT antenna interface is shown as below. C1 and C2 are not mounted
and a 0Ω resistor is mounted on R1 by default.

Figure28: Reference Circuit Design for Wi-Fi/BT Antenna

6.3 GNSS Antenna Interface

Table 35: Pin Definition of GNSS Antenna Interface

Pin Name Pin No. I/O Description Comment

ANT_GNSS 121 AI GNSS antenna interface 50Ω impedance

Table 36: GNSS Frequency

Type Frequency Unit

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GPS 1575.42 ±1.023 MHz

GLONASS 1597.5~1605.8 MHz

BeiDou 1561.098 ±2.046 MHz

NOTE

SC200L-WFnot support GNSS。

6.3.1 Recommended Circuit for Passive Antenna

GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A
reference circuit design is given below.

Figure 29: Reference Circuit Design for GNSS Passive Antenna

NOTE

When the passive antenna is placed far away from the module (that is, the antenna trace is long), it is
recommended to add an external LNA circuit for better GNSS receiving performance, and the LNA
should be placed close to the antenna.

6.3.2 Recommended Circuit for Active Antenna

The active antenna is powered by a 56nH inductor through the antenna's signal path. The common
power supply voltage ranges from 3.3V to 5.0V. Although featuring low power consumption, the
active antenna still requires stable and clean power supplies. It is recommended to use
high-performance LDO as the power supply. A reference design of the GNSS active antenna is
shown below.

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Figure 30: Reference Circuit Design for GNSS Active Antenna

6.4 Antenna Installation

6.4.1 Antenna Requirements

The following table shows the requirement on the main antenna, RX-diversity antenna, Wi-Fi/BT
antenna and a GNSS antenna.

Table 37: Antenna Requirements

Type Requirements

VSWR:> ≤ 2
Gain (dBi): 1
Max Input Power (W): 50
Input Impedance (Ω): 50
Polarization Type: Vertical
GSM/WCDMA/LTE Insertion Loss: < 1dB
(GSM850、EGSM900、WCDMA B5/B8、LTE B5/B8/B20/B28A/B28B)
Insertion Loss ：< 1.5 dB
(DCS1800、PCS1900、WCDMA B1/B2、LTE B1/B2/B3/B34/B39)
Insertion Loss ：< 2 dB
(LTE-FDD B7、LTE-TDD B38/B40/B41)
VSWR: ≤ 2
Gain (dBi): 1
Wi-Fi/BT
Max Input Power (W): 50
Input Impedance (Ω): 50

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Polarization Type: Vertical

Insertion Loss: < 1dB
Frequency range: 1559MHz~1609MHz
Polarization: RHCP or linear
VSWR: < 2 (Typ.)
GNSS
Passive Antenna Gain: > 0dBi
Active Antenna Noise Figure: < 1.5dB
Active Antenna Total Gain: < 17dBi (Typ.)

6.4.2 Recommended RF Connector for Antenna Installation

If an RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector

provided by HIROSE.

Figure 31: Dimensions of the U.FL-R-SMT Connector (Unit: mm)

U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.

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Figure 32: Mechanicals of U.FL-LP Connectors

The following figure describes the space factor of mated connector.

Figure 33: Space Factor of Mated Connectors (Unit: mm)

For more details, please visit http://www.hirose.com。

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6 Electrical, Reliability and Radio

Characteristics

7.1 Absolute Maximum Ratings

The following table lists the maximum withstand voltage/current of some pins of the module:

Table 6: Absolute Maximum Ratings

Parameter Min. Max. Unit

VBAT -0.3 6.0 V

USB_VBUS -0.3 16.0 V

Peak Current of VBAT 0 3.0 A

Voltage on Digital Pins -0.3 1.98 V

7.2 Power Supply Ratings

Table 7: SC200L Module Power Supply Ratings

Parameter Description Conditions Min. Typ. Max. Unit

The actual input voltages

must stay between the
VBAT 3.50 3.80 4.20 V
minimum and maximum
VBAT values
Voltage drop
Maximum power control level
during transmitting 800 mV
at EGSM900
burst
Peak supply Maximum power control level
IVBAT 1.80 3.0 A
current (during at EGSM900

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transmission slot)

USB_VBUS 4.50 5.0 9.20 V

7.3 Operation and Storage Temperatures

The operating temperature is listed in the following table.

Table 8: Operation and Storage Temperatures

Parameter Min. Typ. Max. Unit

Operating temperature range

1) -30 +25 +75 ºC

Storage Temperature Range -40 +90 ºC

NOTE
1)
Within the operation temperature range, the module is 3GPP compliant.

7.4 Current Consumption

The values of current consumption are shown below.

Table 9: SC200L-CE Current Consumption

Parameter Description Conditions Min Typ.

OFF state Power down 350 μA

Sleep (USB disconnected) @DRX=2 3.5 mA

GSM/GPRS supply
IVBAT Sleep (USB disconnected) @DRX=5 3 mA
current
Sleep (USB disconnected) @DRX=9 3 mA

WCDMA supply Sleep (USB disconnected) @DRX=6 4.7 mA

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current Sleep (USB disconnected) @DRX=7 3.7 mA

Sleep (USB disconnected) @DRX=8 3.5 mA

Sleep (USB disconnected) @DRX=9 3 mA

Sleep (USB disconnected) @DRX=5 6.5 mA

Sleep (USB disconnected) @DRX=6 4.8 mA

LTE-FDD supply
current
Sleep (USB disconnected) @DRX=7 4.2 mA

Sleep (USB disconnected) @DRX=9 3.8 mA

Sleep (USB disconnected) @DRX=5 6.2 mA

Sleep (USB disconnected) @DRX=6 4.8 mA

LTE-TDD supply
current
Sleep (USB disconnected) @DRX=7 4.2 mA

Sleep (USB disconnected) @DRX=9 3.8 mA

EGSM900 @ PCL 5 260 mA

EGSM900 @ PCL 12 125 mA

EGSM900 @ PCL 19 90 mA
GSM voice call
DCS1800 @ PCL 0 200 mA

DCS1800 @ PCL 7 115 mA

DCS1800 @ PCL 15 85 mA

B1 @ max power 620 mA

WCDMA voice call
B8 @ max power 580 mA

EGSM900 (1UL/4DL) @ PCL 5 250 mA

EGSM900 (2UL/3DL) @ PCL 5 380 mA

EGSM900 (3UL/2DL) @ PCL 5 425 mA

GPRS data transfer
EGSM900 (4UL/1DL) @ PCL 5 470 mA

DCS1800 (1UL/4DL) @ PCL 0 190 mA

DCS1800 (2UL/3DL) @ PCL 0 260 mA

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DCS1800 (3UL/2DL) @ PCL 0 305 mA

DCS1800 (4UL/1DL) @ PCL 0 330 mA

EGSM900 (1UL/4DL) @ PCL 8 325 mA

EGSM900 (2UL/3DL) @ PCL 8 580 mA

EGSM900 (3UL/2DL) @ PCL 8 860 mA

EGSM900 (4UL/1DL) @ PCL 8 730 mA

EDGE data transfer
DCS1800 (1UL/4DL) @ PCL 2 230 mA

DCS1800 (2UL/3DL) @ PCL 2 370 mA

DCS1800 (3UL/2DL) @ PCL 2 435 mA

DCS1800 (4UL/1DL) @ PCL 2 450 mA

B1 (HSDPA) @ max power 620 mA

B8 (HSDPA) @ max power 530 mA

WCDMA data transfer
B1 (HSUPA) @ max power 520 mA

B8 (HSUPA) @ max power 500 mA

LTE-FDD B1 @ max power 670 mA

LTE-FDD B3 @ max power 670 mA

LTE-FDD B5 @ max power 510 mA

LTE-FDD B8 @ max power 590 mA

LTE data transfer LTE-TDD B34 @ max power 290 mA

LTE-TDD B38 @ max power 240 mA

LTE-TDD B39 @ max power 234 mA

LTE-TDD B40 @ max power 370 mA

LTE-TDD B41 @ max power 440 mA

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Table 10: SC200L-EM Current Consumption

Paramete
Description Conditions Min Typ.
r

IVBAT OFF state Power down 350 μA

7.5 RF Output Power

The following table shows the RF output power of SC200L module.

Table 41: SC200L-CE RF Output Power

Frequency Max. Min.

EGSM900 33 dBm ±2 dB 5 dBm ±5 dB

DCS1800 30 dBm ±2 dB 0 dBm ±5 dB

WCDMA B1 24 dBm +1/-3 dB < -49 dBm

WCDMA B8 24 dBm +1/-3 dB < -49 dBm

LTE-FDD B1 23 dBm ±2 dB < -39 dBm

LTE-FDD B3 23 dBm ±2 dB < -39 dBm

LTE-FDD B5 23 dBm ±2 dB < -39 dBm

LTE-FDD B8 23 dBm ±2 dB < -39 dBm

LTE-TDD B34 23 dBm ±2 dB < -39 dBm

LTE-TDD B38 23 dBm ±2 dB < -39 dBm

LTE-TDD B39 23 dBm ±2 dB < -39 dBm

LTE-TDD B40 23 dBm ±2 dB < -39 dBm

LTE-TDD B41 23 dBm ±2 dB < -39 dBm

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Table 42: SC200L-EM RF Output Power

Frequency Max. Min.

GSM850 33 dBm ±2 dB 5 dBm ±5 dB

EGSM900 33 dBm ±2 dB 5 dBm ±5 dB

DCS1800 30 dBm ±2 dB 0 dBm ±5 dB

PCS1900 30 dBm ±2 dB 0 dBm ±5 dB

WCDMA B1 24 dBm +1/-3 dB < -49 dBm

WCDMA B2 24 dBm +1/-3 dB < -49 dBm

WCDMA B5 24 dBm +1/-3 dB < -49 dBm

WCDMA B8 24 dBm +1/-3 dB < -49 dBm

LTE-FDD B1 23 dBm ±2 dB < -39 dBm

LTE-FDD B2 23 dBm ±2 dB < -39 dBm

LTE-FDD B3 23 dBm ±2 dB < -39 dBm

LTE-FDD B5 23 dBm ±2 dB < -39 dBm

LTE-FDD B7 23 dBm ±2 dB < -39 dBm

LTE-FDD B8 23 dBm ±2 dB < -39 dBm

LTE-FDD B20 23 dBm ±2 dB < -39 dBm

LTE-FDD B28(A + B) 23 dBm ±2 dB < -39 dBm

LTE-TDD B38 23 dBm ±2 dB < -39 dBm

LTE-TDD B39 23 dBm ±2 dB < -39 dBm

LTE-TDD B40 23 dBm ±2 dB < -39 dBm

LTE-TDD B41 23 dBm ±2 dB < -39 dBm

NOTE

1. In GPRS 4 slots TX mode, the maximum output power is reduced by 3dB. This design conforms to
the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.

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2. “*” means under development.

7.6 RF Receiving Sensitivity

The following table shows the RF receiving sensitivity of SC200L module.

Table 44: SC200L-EM RF Receiving Sensitivity

Frequency Primary Diversity SIMO 3GPP (SIMO)

GSM850 -108 / / -102.4 dBm

EGSM900 -108 / / -102.4 dBm

DCS1800 -108 / / -106.7 dBm

PCS1900 -107 / / -103.7 dBm

WCDMA B1 -108 -110 / -104 dBm

WCDMA B2 -107.5 -109.5 / -108 dBm

WCDMA B5 -111 -111.5 / -108 dBm

WCDMA B8 -109.5 -111 / -96.3 dBm

LTE-FDD B1 (10 MHz) -98 -99 -101.5 -93.3 dBm

LTE-FDD B2 (10 MHz) -97 -98.3 -99.6 -94.3 dBm

LTE-FDD B3 (10 MHz) -98.1 -98.7 -101 -93.3 dBm

LTE-FDD B5 (10 MHz) -100 -101 -103 -96.3 dBm

LTE-FDD B7 (10 MHz) -96.5 -99 -101.4 -96.3 dBm

LTE-FDD B8 (10 MHz) -98 -100.6 -102.5 -96.3 dBm

LTE-FDD B20 (10 MHz) -99.4 -96.6 101.5 -96.3 dBm

LTE-FDD B28 (10 MHz) -99.4 -97.2 -101.5 -94.3 dBm

LTE-TDD B38 (10 MHz) -97.1 -98.3 -100.6 -94.3 dBm

LTE-TDD B39 (10 MHz) -98.4 -97.6 -102.4 -96.3 dBm

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LTE-TDD B40 (10 MHz) -97.4 -98.9 -100.9 -96.3 dBm

LTE-TDD B41 (10 MHz) -96.2 -97.5 -100.2 -94.3 dBm

NOTE

“*” means under development.

7.7 Electrostatic Discharge

The module is not protected against electrostatic discharge (ESD) in general. Consequently, it should be
subject to ESD handling precautions that are typically applied to ESD sensitive components. Proper ESD
handling and packaging procedures must be applied throughout the processing, handling and operation
of any application that incorporates the module.

The following table shows the electrostatic discharge characteristics of SC200L module.

Table 11: ESD Characteristics ( Temperature: 25 ºC, Humidity: 45%)

Tested Points Contact Discharge Air Discharge Unit

VBAT, GND +/-5 +/-10 KV

All Antenna Interfaces +/-5 +/-10 KV

Other Interfaces +/-0.5 +/-1 KV

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7 Mechanical Dimensions
This chapter describes the mechanical dimensions of the module. All dimensions are measured in
millimeter (mm), and the tolerances for dimensions without tolerance values are ±0.05 mm.

8.1 Mechanical Dimensions of the Module

Pin 1

Top view Side view

Figure 34: SC200L Module Top and Side Dimensions

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Pin 1

Figure 35: SC200L Module Bottom Dimensions (Top View)

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8.2 Recommended Footprint

Figure36: Recommended Footprint (Top View)

NOTES

1. For easy maintenance of the module, keep about 5 mm between the module and other components
on the host PCB.
2. All RESERVED pins should be kept open and MUST NOT be connected to ground.。

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8.3 Top and Bottom Views of the Module

Figure37: Top View of the Module

Figure 38: Bottom View of the Module

NOTE

These are renderings of SC200L module. For authentic dimension and appearance, please refer to the
module that you receive from Quectel.

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8 Storage, Manufacturing and Packaging

8.1 Storage

SC200L is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are shown
as below.
1. Recommended storage conditions: temperature 23 ± 5 °C, and relative humidity 35% ~ 60%.储

2. Under the recommended storage conditions, the module can be stored in a vacuum sealed bag
for 12 months.

3. Under workshop conditions with a temperature of 23 ±5 °C and a relative humidity of less than
60%, the workshop life of the module after unpacking is 168 hours 1). Under this condition, the
module can be directly subjected to reflow production or other high-temperature operations.
Otherwise, the module needs to be stored in an environment with a relative humidity of less than
10% (for example, a moisture-proof cabinet) to keep the module dry.

4. If the module is in the following conditions, the module needs to be pre-baked to prevent the
PCB from blistering, cracks and delamination after the module absorbs moisture and is then
soldered at high temperature:

 The storage temperature and humidity do not meet the recommended storage conditions
 The module failed to complete production or storage according to Article 3 above after
unpacking;
 Leakage of vacuum packaging, bulk materials;
 Before returning the module for repair.

5. Baking treatment of the module:

 It needs to be baked at a high temperature of 120 ±5 °C for 8 hours;

 The second-baked module must be soldered within 24 hours after baking, otherwise it still
needs to be stored in a dry box.

9.2 Manufacturing and Soldering

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Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil for the module is recommended to be 0.18 mm~0.20 mm. It is recommended to
slightly reduce the amount of solder paste for LGA pads, thus avoiding short-circuit. For more details,
please refer to document [5].

It is suggested that the peak reflow temperature is 238~246 ºC, and the absolute maximum reflow
temperature is 246 ºC. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted after reflow soldering for the other side of PCB has
been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below:

Temp. (°C)
Reflow Zone
Max slope: Cooling down slope:
2~3 °C/s C -1.5 ~ -3 °C/s
246
238
220
B D
200
Soak Zone

150 A

100
Max slope: 1~3 °C/s

Figure 39: Recommended Reflow Soldering Thermal Profile

Table 12: Recommended Thermal Profile Parameters

Factor Recommendation

Soak Zone

Max slope 1 to 3 °C/sec

Soak time (between A and B: 150 °C and 200 °C) 70 to 120 sec

Reflow Zone

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Max slope 2~3 °C/s

Reflow time (D: over 220 °C) 45~70 s

Max temperature 238 °C ~ 246 °C

Cooling down slope -1.5 ~ -3 °C/s

Reflow Cycle

Max reflow cycle 1

9.3 Packaging

SC200L is packaged in tape and reel carriers, and sealed in the vacuum-sealed bag. It is not
recommended to open the vacuum package before using the module for actual production. Each reel is
380 mm in diameter and contains 200 modules. The following figures show the package details,
measured in mm.

Figure 40: Tape Dimensions（Unit: mm）

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Figure 41: Reel Dimensions (Unit: mm)

Table 13: Reel Packaging

Model
MOQ for MP Minimum Package: 200pcs Minimum Package × 4=800pcs
Name
Size: 405 mm × 390 mm × 83 mm Size: 425 mm × 358 mm × 410 mm
SC200L 200 N.W: TBD N.W: TBD
G.W: TBD G.W: TBD

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9 Appendix A References

Table 14: Related Documents

SN Document Name Remark

[1] Quectel_Smart_EVB_G2_User_Guide Smart EVB G2 user guide

[2] Quectel_SC200L_Reference_Design SC200L reference design

[3] Quectel_SC200L_GPIO_Configuration SC200L GPIO Configuration

[4] Quectel_RF_Layout_Application_Note RF layout application note

[5] Quectel_Module_Secondary_SMT_User_Guide Module secondary SMT user guide

Table 15: Terms and Abbreviations

Abbreviation Description

ADC Analog-to-Digital Converter

AMR Adaptive Multi-rate

AP Access Point

bps Bits per Second

CS Coding Scheme

CSD Circuit Switched Data

CSI Camera Serial Interface

CTS Clear to Send

DC Dual Carrier

DRX Discontinuous Reception

DSI Display Serial Interface

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DSP Digital Signal Processor

EDGE Enhanced Data Rate for GSM Evolution

EFR Enhanced Full Rate

EGSM Enhanced GSM

ESD Electrostatic Discharge

ESR Equivalent Series Resistance

FDD Frequency Division Duplex

FR Full Rate

GMSK Gaussian Minimum Shift Keying

GNSS Global Navigation Satellite System

GPIO General Purpose Input/Output

GPRS General Packet Radio Service

GPS Global Positioning System

GPU Graphics Processing Unit

GRFC Generic RF control

GSM Global System for Mobile Communications

HR Half Rate

HSDPA High Speed Downlink Packet Access

HSPA High Speed Packet Access

HSPA+ High-Speed Packet Access+

HSUPA High Speed Uplink Packet Access

IC Integrated Circuit

I/O Input/Output

I2C Inter-Integrated Circuit

Imax Maximum Load Current

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Inorm Normal Current

LCC Leadless Chip Carrier

LCD Liquid Crystal Display

LCM LCD Module

LDO Low Dropout Regulator

LE Low Energy

LED Light Emitting Diode

LGA Land Grid Array

LNA Low Noise Amplifier

LTE Long-Term Evolution

MIPI Mobile Industry Processor Interface

NFC Near Field Communication

NTC Negative Temperature Coefficient

OTP One Time Programable

PCB Printed Circuit Board

PDU Protocol Data Unit

PWM Pulse Width Modulation

PSK Phase Shift Keying

QAM Quadrature Amplitude Modulation

QPSK Quadrature Phase Shift Keying

RF Radio Frequency

RTC Real Time Clock

RTS Request to Send

Rx Receive

SAW Surface Acoustic Wave

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SD Card Secure Digital Card

SMS Short Message Service

SPI Serial Peripheral Interface

TDD Time-Division Duplex

TP Touch Panel

TVS Transient Voltage Suppressor

Tx Transmit

UART Universal Asynchronous Receiver & Transmitter

UMTS Universal Mobile Teleco mmunications System

USB Universal Serial Bus

(U)SIM (Universal) Subscriber Identity Module

VBAT Voltage at Battery (Pin)

Vmax Maximum Voltage Value

Vnorm Normal Voltage Value

Vmin Minimum Voltage Value

VI Voltage Input

VIHmax Maximum Input High Level Voltage Value

VIHmin Minimum Input High Level Voltage Value

VILmax Maximum Input Low Level Voltage Value

VILmin Minimum Input Low Level Voltage Value

VImax Absolute Maximum Input Voltage Value

VImin Absolute Minimum Input Voltage Value

VO Voltage Output

VOHmax Maximum Output High Level Voltage Value

VOHmin Minimum Output High Level Voltage Value

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VOLmax Maximum Output Low Level Voltage Value

VOLmin Minimum Output Low Level Voltage Value

WCDMA Wideband Code Division Multiple Access

WLAN Wireless Local Area Network

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10 Appendix B GPRS Coding Schemes

Table 16: Description of Different Coding Schemes

Scheme CS-1 CS-2 CS-3 CS-4

Code Rate 1/2 2/3 3/4 1

USF 3 3 3 3

Pre-coded USF 3 6 6 12

Radio Block excl. USF and BCS 181 268 312 428

BCS 40 16 16 16

Tail 4 4 4 –

Coded Bits 456 588 676 456

Punctured Bits 0 132 220 –

Data Rate Kb/s 9.05 13.4 15.6 21.4

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11 Appendix C GPRS Multi-slot Classes

Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot
classes are product dependent, and determine the maximum achievable data rates in both the uplink and
downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots,
while the second number indicates the amount of uplink timeslots. The active slots determine the total
number of slots the GPRS device can use simultaneously for both uplink and downlink communications.

The description of different multi-slot classes is shown in the following table.

Table 17: GPRS Multi-slot Classes

Multislot Class Downlink Slots Uplink Slots Active Slots

1 1 1 2

2 2 1 3

3 2 2 3

4 3 1 4

5 2 2 4

6 3 2 4

7 3 3 4

8 4 1 5

9 3 2 5

10 4 2 5

11 4 3 5

12 4 4 5

13 3 3 NA

14 4 4 NA

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15 5 5 NA

16 6 6 NA

17 7 7 NA

18 8 8 NA

19 6 2 NA

20 6 3 NA

21 6 4 NA

22 6 4 NA

23 6 6 NA

24 8 2 NA

25 8 3 NA

26 8 4 NA

27 8 4 NA

28 8 6 NA

29 8 8 NA

30 5 1 6

31 5 2 6

32 5 3 6

33 5 4 6

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12 Appendix D EDGE Modulation and

Coding Schemes

Table 18: EDGE Modulation and Coding Schemes

Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot

MCS-1 GMSK C 8.80 kbps 17.60 kbps 35.20 kbps

MCS-2 GMSK B 11.2 kbps 22.4 kbps 44.8 kbps

MCS-3 GMSK A 14.8 kbps 29.6 kbps 59.2 kbps

MCS-4 GMSK C 17.6 kbps 35.2 kbps 70.4 kbps

MCS-5 8-PSK B 22.4 kbps 44.8 kbps 89.6 kbps

MCS-6 8-PSK A 29.6 kbps 59.2 kbps 118.4 kbps

MCS-7 8-PSK B 44.8 kbps 89.6 kbps 179.2 kbps

MCS-8 8-PSK A 54.4 kbps 108.8 kbps 217.6 kbps

MCS-9 8-PSK A 59.2 kbps 118.4 kbps 236.8 kbps

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FCC Certification Requirements.

According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a

mobile device.

And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna

installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements

of 2.1091.

2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body

and must not transmit simultaneously with any other antenna or transmitter.

3.A label with the following statements must be attached to the host end product: This device contains

FCC ID: XMR2021SC200LEM.

4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF

radiation, maximum antenna gain (including cable loss) must not exceed:

❒ GSM850 :≤8.446 dBi

❒ GSM1900 :≤10.03dBi
❒ WCDMA Band II/ LTE Band2/ LTE Band7/ LTE Band38/ LTE Band41 : ≤9.416 dBi
❒ WCDMA Band V/ LTE Band5 ≤8.000dBi

5. This module must not transmit simultaneously with any other antenna or transmitter

6. The host end product must include a user manual that clearly defines operating requirements and

conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.

For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is

required to satisfy the SAR requirements of FCC Part 2.1093

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If the device is used for other equipment that separate approval is required for all other operating

configurations, including portable configurations with respect to 2.1093 and different antenna

configurations.

For this device, OEM integrators must be provided with labeling instructions of finished products.

Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a

permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2

Certification (labeling requirements) above). The OEM manual must provide clear instructions

explaining to the OEM the labeling requirements, options and OEM user manual instructions that are

required (see next paragraph).

For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible

when installed in the host, or (2) if the host is marketed so that end users do not have straightforward

commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC

ID: XMR2021SC200LEM” or “Contains FCC ID: XMR2021SC200LEM” must be used. The host OEM

user manual must also contain clear instructions on how end users can find and/or access the module

and the FCC ID.

The final host / module combination may also need to be evaluated against the FCC Part 15B criteria

for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.

The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the

user that changes or modifications not expressly approved by the party responsible for compliance

could void the user's authority to operate the equipment. In cases where the manual is provided only in

a form other than paper, such as on a computer disk or over the Internet, the information required by

this section may be included in the manual in that alternative form, provided the user can reasonably be

expected to have the capability to access information in that form.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

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(1) This device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
operate the equipment.

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