Aptitude Test: Electronic Components, Function,

Manufacturing Processes, and Applications

Section A: Electronic Components and Their Functions

1.

Resistors:

2.
1. Which of the following is NOT a function of a resistor in an electrical circuit? a) Limit
current flow
b) Control voltage levels
c) Provide a reference voltage
d) Store electrical energy
3.

Capacitors:

4.

1. A capacitor is used in an RC filter to: a) Block high-frequency signals

b) Store and release energy
c) Amplify signals
d) Control current flow

5.

Transistors:

6.

1. Which of the following statements about bipolar junction transistors (BJTs) is NOT
correct? a) A BJT can be used as an amplifier or a switch.
b) The BJT has three terminals: emitter, base, and collector.
c) The base current controls the current between the collector and emitter.
d) BJTs are primarily used in high-frequency applications like RF circuits.

7.

Diodes:

8.

1. A Zener diode is primarily used for: a) Rectification

b) Voltage regulation
c) Signal amplification
d) Current limiting

9.
 Inductors:

10.

1. An inductor stores energy in the form of: a) Electric field

b) Magnetic field
c) Electric charge
d) Mechanical stress

Section B: Manufacturing Processes of Electronic

Components

1.

Resistor Manufacturing:

2.

1. Thick-film resistors are primarily manufactured by: a) Vapor deposition of metallic

films
b) Printing resistive materials on a ceramic substrate
c) Etching semiconductor wafers
d) Bonding thin-film layers onto silicon substrates

3.

Capacitor Manufacturing:

4.

1. What is the typical material used as the dielectric in ceramic capacitors? a) Silicon
dioxide
b) Tantalum oxide
c) Barium titanate
d) Aluminum oxide

5.

Semiconductor Fabrication:

6.

1. Which process is commonly used to create integrated circuits on semiconductor

wafers? a) Electroplating
b) Photolithography
c) Annealing
d) Sputtering

7.
 MEMS Manufacturing:

8.

1. What is the most common method used for fabricating MEMS components like
sensors or actuators? a) Photolithography
b) Thermal oxidation
c) Molecular beam epitaxy
d) Chemical vapor deposition (CVD)

9.

Soldering Process:

10.

1. What is the primary purpose of the soldering process in electronic component

assembly? a) To protect components from corrosion
b) To form a mechanical and electrical connection between components
c) To reduce the overall resistance of the circuit
d) To ensure that the circuit operates at high frequency

Section C: Applications of Electronic Components

1.

Transistor Applications:

2.

1. Which of the following is a common application of a Field Effect Transistor (FET) in a

MEMS system? a) Amplifying signals
b) Voltage regulation in power supplies
c) Switching in logic circuits
d) Signal mixing in RF circuits

3.

Diode Applications:

4.

1. Light Emitting Diodes (LEDs) are used in a variety of applications. Which of the
following is NOT a typical application for LEDs? a) Display screens
b) Fiber optic communication
c) High-efficiency power conversion
d) Lighting and indicators

5.
 Capacitor Applications:

6.

1. In power supplies, electrolytic capacitors are commonly used for: a) Filtering noise
from high-frequency signals
b) Stabilizing voltage and smoothing output
c) Amplifying weak signals
d) Blocking DC current

7.

Inductor Applications:

8.

1. Inductors are commonly used in power supplies and signal processing systems.
Which of the following is NOT a primary use of inductors? a) Energy storage in
magnetic fields
b) Filtering and smoothing signals
c) Increasing voltage levels
d) Limiting high-frequency noise

9.

Microelectromechanical Systems (MEMS) Sensors:

10.

1. A MEMS accelerometer is commonly used to detect: a) Light intensity

b) Angular velocity
c) Acceleration and vibration
d) Magnetic fields

Section D: Advanced Topics in Electronics and Microsystems

1.

MOSFET Characteristics:

2.

1. In a MOSFET, the gate terminal: a) Controls the current flow between the source
and drain
b) Is directly connected to the source
c) Supplies power to the transistor
d) Acts as the emitter in a typical BJT configuration

3.
 MEMS Sensors:

4.

1. Which of the following is a key advantage of MEMS sensors compared to traditional

sensors? a) Lower power consumption
b) High cost of fabrication
c) Larger size and bulk
d) Limited sensitivity range

5.

Thin-Film Deposition:

6.

1. Which of the following thin-film deposition techniques is widely used in the

fabrication of electronic components in MEMS devices? a) Molecular beam epitaxy
(MBE)
b) Atomic layer deposition (ALD)
c) Chemical vapor deposition (CVD)
d) All of the above

7.

Silicon Photonics:

8.

1. In the context of silicon photonics, what is typically used to modulate light signals in
an optical communication system? a) Silicon photodiodes
b) Silicon waveguides
c) Electro-optic modulators
d) Light-emitting diodes (LEDs)

9.

Power Electronics in MEMS:

10.

1. In a MEMS-based power converter, the function of the switching transistor is to: a)

Directly increase voltage levels
b) Control the flow of current based on a duty cycle
c) Filter out noise from the power signal
d) Provide a stable ground reference for the system

Answers:
 1. d) Store electrical energy
2. b) Store and release energy
3. d) BJTs are primarily used in high-frequency applications like RF circuits.
4. b) Voltage regulation
5. b) Magnetic field
6. b) Printing resistive materials on a ceramic substrate
7. c) Barium titanate
8. b) Photolithography
9. a) Photolithography
10. b) To form a mechanical and electrical connection between components
11. b) Voltage regulation in power supplies
12. c) High-efficiency power conversion
13. b) Stabilizing voltage and smoothing output
14. c) Increasing voltage levels
15. c) Acceleration and vibration
16. a) Controls the current flow between the source and drain
17. a) Lower power consumption
18. d) All of the above
19. c) Electro-optic modulators
20. b) Control the flow of current based on a duty cycle

Aptitude Test: Electronic Components, Function,

Manufacturing Processes, and Applications (1-50)

Section A: Electronic Components and Their Functions

1.

Which of the following components is used to limit current in a circuit? a)

Capacitor
b) Resistor
c) Inductor
d) Diode

2.
3.

What is the primary purpose of a diode in a power supply circuit? a) To

store energy
b) To rectify AC to DC
c) To increase voltage
d) To regulate current

4.
5.

The function of a transistor is to: a) Amplify signals

b) Store charge
c) Act as a capacitor
d) Provide a direct path for current

6.
7.

Which type of capacitor is most commonly used for filtering in power

supplies? a) Ceramic
b) Tantalum
c) Electrolytic
d) Film

8.
9.

In a circuit, an inductor is used to: a) Block DC current

b) Amplify the signal
c) Store energy in a magnetic field
d) Provide a path for current

10.
11.

A Zener diode is designed to operate in which region? a) Forward bias only

b) Reverse breakdown region
c) Cutoff region
d) Saturation region

12.
13.

What is the primary purpose of a varactor diode? a) Signal amplification

b) Voltage regulation
c) Frequency tuning
d) Rectification

14.
15.

In a Bipolar Junction Transistor (BJT), which current controls the

current between the collector and emitter? a) Collector current
b) Base current
c) Emitter current
d) Gate current

16.
17.
Which component is used for regulating voltage in a power supply
system? a) Inductor
b) Zener diode
c) Resistor
d) Capacitor

18.
19.

What is the basic function of a transformer? a) To convert DC to AC

b) To step up or step down AC voltage
c) To amplify signals
d) To store energy

20.
21.

Which of the following is the main advantage of using a metal-oxide-

semiconductor field-effect transistor (MOSFET)? a) High switching speed
b) Low power consumption
c) High voltage gain
d) High frequency response

22.
23.

A Light Emitting Diode (LED) emits light when: a) The diode is reverse
biased
b) Current flows through the diode in the reverse direction
c) The diode is forward biased
d) The diode is in a high-voltage state

24.
25.

What is the key difference between a PNP and an NPN transistor? a)

Current flows in the opposite direction
b) PNP transistors have a higher current gain
c) The type of material used in the collector
d) NPN transistors use holes as charge carriers, while PNP transistors use
electrons

26.
27.

Which of the following is NOT a type of resistor? a) Carbon film

b) Wire-wound
c) Tantalum
d) Metal oxide
 28.
29.

What type of inductor is commonly used in power supplies? a) Air core

inductor
b) Ferrite core inductor
c) Toroidal inductor
d) All of the above

30.
31.

The main function of a capacitor in an AC circuit is to: a) Provide energy

storage
b) Block DC signals and pass AC signals
c) Regulate voltage levels
d) Amplify the signal

32.
33.

Which of the following is the primary purpose of a Schottky diode? a)

Rectification with low forward voltage
b) Voltage regulation
c) Signal amplification
d) High-frequency switching

34.
35.

An operational amplifier (op-amp) is primarily used in which of the

following applications? a) Analog signal amplification
b) Power regulation
c) Signal rectification
d) Digital signal processing

36.
37.

What is the main advantage of using a photodiode in optical

communication systems? a) Low forward voltage
b) Fast switching time
c) Direct conversion of light to electrical signal
d) High current handling capacity

38.
39.
 Which of the following materials is commonly used to fabricate a
thermistor? a) Copper
b) Silicon
c) Carbon
d) Manganese oxide

40.

Section B: Manufacturing Processes of Electronic

Components

1.

Which of the following is NOT a method used for fabricating

semiconductors? a) Photolithography
b) Chemical vapor deposition (CVD)
c) Electroplating
d) Molecular beam epitaxy (MBE)

2.
3.

What is the purpose of the photolithography process in semiconductor

fabrication? a) To deposit thin films on a wafer
b) To etch patterns on the wafer surface
c) To create high-quality crystals
d) To improve thermal conductivity

4.
5.

In the fabrication of a silicon wafer, what is the purpose of doping? a) To

create high-frequency properties
b) To increase the mechanical strength of the wafer
c) To introduce impurities that modify the electrical properties
d) To remove defects from the wafer surface

6.
7.

Which of the following methods is used for thin-film deposition of

materials on a substrate? a) Chemical vapor deposition (CVD)
b) Atomic layer deposition (ALD)
c) Sputtering
d) All of the above

8.
 9.

Which of the following is a key advantage of using plasma etching in

microelectronics? a) Precise patterning of very small features
b) Ability to use a large variety of materials
c) Low cost and easy to implement
d) High temperature resistance

10.
11.

What is the typical material used for a MEMS (Micro-Electro-

Mechanical Systems) actuator? a) Copper
b) Silicon
c) Gallium arsenide
d) Teflon

12.
13.

What is the principle behind electroplating used in electronics

manufacturing? a) Deposition of metals through electrochemical processes
b) Depositing thin layers using a high-pressure vapor stream
c) Spraying materials onto a heated substrate
d) Sputtering material from a solid target using ionized gases

14.
15.

What does the CMP (Chemical Mechanical Planarization) process in

semiconductor fabrication accomplish? a) Removes excess material
b) Reduces surface roughness to ensure planarization
c) Deposits conductive layers
d) Increases the wafer's electrical conductivity

16.
17.

**Which of the following is the typical substrate used for the manufacture of
ceramic capacitors? a) Silicon
b) Glass
c) Ceramic materials
d) Aluminum

18.
19.

In the context of MEMS manufacturing, bulk micromachining refers to:

a) Etching material from the wafer to form structures
 b) Creating thin-film layers on the wafer
c) Assembling MEMS components into a final device
d) Bonding MEMS layers together

20.

Section C: Applications of Electronic Components

1.

Which of the following is a common application of a photodiode? a) Radio

frequency amplification
b) Signal detection in optical systems
c) Power regulation in DC circuits
d) Filtering in AC circuits

2.
3.

What is the primary use of inductors in radio-frequency circuits? a)

Frequency modulation
b) Signal amplification
c) Signal filtering
d) Voltage regulation

4.
5.

In power supply systems, why are electrolytic capacitors commonly used?

a) High energy storage capacity
b) Low cost
c) High capacitance value
d) Ability to handle high voltage

6.
7.

Which type of transistor is widely used for switching applications in

digital circuits? a) Bipolar junction transistor (BJT)
b) Field-effect transistor (FET)
c) Metal-oxide-semiconductor field-effect transistor (MOSFET)
d) Junction field-effect transistor (JFET)

8.
9.
What is the primary application of a diode bridge rectifier in power
circuits? a) To step up or step down the voltage
b) To convert AC to DC
c) To filter noise in signals
d) To amplify low-level signals

10.
11.

What is the function of a capacitor in a signal coupling application? a) To

filter high-frequency noise
b) To block DC signals and pass AC signals
c) To store and release energy
d) To regulate voltage

12.
13.

Which electronic component is primarily used to protect circuits from

voltage spikes and transient surges? a) Diode
b) Resistor
c) Inductor
d) Zener diode

14.
15.

A MOSFET is commonly used in: a) Audio amplification

b) Power regulation circuits
c) High-speed switching applications
d) Signal demodulation

16.
17.

Which of the following is a common application of MEMS

accelerometers? a) Vibration monitoring in industrial equipment
b) Noise filtering in audio systems
c) Image processing in cameras
d) Sensing pressure in hydraulic systems

18.
19.

Which component is most commonly used in power factor correction

circuits? a) Capacitors
b) Resistors
c) Inductors
d) Diodes
 20.

Section D: Advanced Topics in Electronics and Microsystems

1.

What is the primary advantage of using silicon carbide (SiC) in power

electronic devices? a) High efficiency at low temperatures
b) High breakdown voltage and thermal conductivity
c) Low cost of fabrication
d) Better performance at high frequencies

2.
3.

**Which of the following is a key challenge in MEMS fabrication? a)

Achieving mechanical precision at small scales
b) Maintaining high yield during mass production
c) Integrating mechanical and electrical components
d) All of the above

4.
5.

In MEMS, piezoelectric materials are used for: a) Generating electricity

from mechanical strain
b) Creating magnetic fields
c) Amplifying sound signals
d) Storing energy for later use

6.
7.

What is the main function of a Microcontroller in MEMS devices? a)

Signal amplification
b) Data processing and control
c) Power regulation
d) Sensing environmental parameters

8.
9.

What is the main function of a digital-to-analog converter (DAC) in a

signal processing circuit? a) Convert an analog signal to a digital signal
b) Convert a digital signal to an analog signal
c) Amplify weak analog signals
d) Filter unwanted noise from signals
 10.
11.

Which of the following is typically used for temperature sensing in

MEMS systems? a) Thermistor
b) Capacitor
c) Diode
d) Inductor

12.
13.

What is the main challenge in nanoelectronics when compared to

traditional semiconductor devices? a) High power consumption
b) Quantum effects and unpredictability
c) Large size and low integration
d) Lack of suitable materials

14.
15.

Which of the following is a key feature of organic semiconductors used in

flexible electronics? a) Ability to operate at high temperatures
b) Ability to be easily printed on flexible substrates
c) High carrier mobility
d) Low cost of production

16.
17.

The most common method of integrating MEMS components with

electronics is: a) Wafer bonding
b) Flip-chip technology
c) Direct electrical bonding
d) All of the above

18.
19.

Which of the following micromachining techniques is primarily used for

cutting or shaping small structures on semiconductor wafers? a) Laser
micromachining
b) Wet etching
c) Dry etching
d) All of the above

20.
Answers:

1. b) Resistor
2. b) To rectify AC to DC
3. a) Amplify signals
4. c) Electrolytic
5. c) Store energy in a magnetic field
6. b) Reverse breakdown region
7. c) Frequency tuning
8. b) Base current
9. b) Zener diode
10. b) To step up or step down AC voltage
11. b) Low power consumption
12. c) The diode is forward biased
13. a) Current flows in the opposite direction
14. c) Tantalum
15. d) All of the above
16. b) Block DC signals and pass AC signals
17. a) Rectification with low forward voltage
18. a) Analog signal amplification
19. c) Direct conversion of light to electrical signal
20. d) Manganese oxide

These first 50 questions cover the core concepts of electronic components, their
functions, manufacturing processes, and applications. This is the start of a very
comprehensive 500-question test that spans many important concepts in electrical
engineering and MEMS. Let me know if you would like the next set of 50 or if you'd
like to modify any questions.

Aptitude Test: Electronic Components, Functions,

Manufacturing Processes, and Applications

Section A: Basic Electronic Components and Functions

1.

Which of the following components is used to limit current in a circuit?

2.
1. a) Resistor
2. b) Capacitor
3. c) Inductor
4. d) Diode
Answer: a) Resistor
3.
What is the primary function of a diode in an electrical circuit?

4.

1. a) To store energy
2. b) To rectify AC to DC
3. c) To amplify signals
4. d) To reduce current
Answer: b) To rectify AC to DC

5.

Which of the following is an active electronic component?

6.

1. a) Resistor
2. b) Capacitor
3. c) Transistor
4. d) Inductor
Answer: c) Transistor

7.

What is the main application of a Zener diode?

8.

1. a) Voltage regulation
2. b) Signal amplification
3. c) Current limiting
4. d) Rectification
Answer: a) Voltage regulation

9.

The primary function of a capacitor is to:

10.

1. a) Store energy in an electric field

2. b) Store energy in a magnetic field
3. c) Control current
4. d) Regulate voltage
Answer: a) Store energy in an electric field

11.

Which of the following is used to amplify electrical signals?

 12.

1. a) Transistor
2. b) Resistor
3. c) Capacitor
4. d) Inductor
Answer: a) Transistor

13.

Which of the following is the key characteristic of a Field-Effect

Transistor (FET)?

14.

1. a) It is controlled by current at the gate

2. b) It is controlled by voltage at the gate
3. c) It is a current-controlled device
4. d) It requires high input current to operate
Answer: b) It is controlled by voltage at the gate

15.

Which of the following components is used to store charge in a circuit?

16.

1. a) Capacitor
2. b) Resistor
3. c) Inductor
4. d) Diode
Answer: a) Capacitor

17.

What type of component is a MOSFET?

18.

1. a) Voltage-controlled switch
2. b) Current-controlled switch
3. c) Voltage amplifier
4. d) Current amplifier
Answer: a) Voltage-controlled switch

19.

In a BJT (Bipolar Junction Transistor), the current between the collector

and the emitter is controlled by the current flowing into the:
 20.

1. a) Emitter
2. b) Base
3. c) Gate
4. d) Collector
Answer: b) Base

21.

The primary purpose of an inductor in a circuit is to:

22.

1. a) Store energy in a magnetic field

2. b) Store energy in an electric field
3. c) Regulate current flow
4. d) Amplify signals
Answer: a) Store energy in a magnetic field

23.

What is the function of a resistor in an electrical circuit?

24.

1. a) To store energy
2. b) To limit current
3. c) To amplify signals
4. d) To convert AC to DC
Answer: b) To limit current

25.

Which of the following is the primary function of a transistor?

26.

1. a) Amplify signals
2. b) Rectify AC to DC
3. c) Store charge
4. d) Regulate voltage
Answer: a) Amplify signals

27.

A light-emitting diode (LED) emits light when:

28.
 1. a) Reverse biased
2. b) Forward biased
3. c) In a high-temperature state
4. d) When current is cut off
Answer: b) Forward biased

29.

Which of the following is the primary characteristic of a Schottky diode?

30.

1. a) High-speed switching
2. b) High forward voltage drop
3. c) Low reverse recovery time
4. d) High current handling
Answer: c) Low reverse recovery time

31.

Which of the following components is used to regulate voltage in

electronic circuits?

32.

1. a) Zener diode
2. b) Capacitor
3. c) Inductor
4. d) Resistor
Answer: a) Zener diode

33.

Which of the following is a semiconducting material commonly used to

make diodes?

34.

1. a) Gallium arsenide
2. b) Silicon
3. c) Iron
4. d) Copper
Answer: b) Silicon

35.

What type of transistor is most commonly used in digital logic circuits?

36.
 1. a) NPN transistor
2. b) PNP transistor
3. c) Field-effect transistor (FET)
4. d) Bipolar junction transistor (BJT)
Answer: c) Field-effect transistor (FET)

37.

What is the function of a transformer in an electrical circuit?

38.

1. a) To increase or decrease voltage

2. b) To amplify signals
3. c) To store energy
4. d) To filter high-frequency noise
Answer: a) To increase or decrease voltage

39.

A capacitor is commonly used in an AC circuit to:

40.

1. a) Block DC signals and pass AC signals

2. b) Amplify the signal
3. c) Store charge
4. d) Regulate current flow
Answer: a) Block DC signals and pass AC signals

Section B: Manufacturing Processes of Electronic

Components

1.

Which of the following is the first step in semiconductor fabrication?

2.

1. a) Doping
2. b) Lithography
3. c) Etching
4. d) Deposition
Answer: b) Lithography

3.
The process of doping in semiconductor fabrication is used to:

4.

1. a) Modify the electrical properties of the material

2. b) Deposit metal layers onto the wafer
3. c) Form patterns on the semiconductor surface
4. d) Increase the mechanical strength of the wafer
Answer: a) Modify the electrical properties of the material

5.

Which of the following processes is used for creating very fine patterns on
a silicon wafer?

6.

1. a) Etching
2. b) CVD (Chemical Vapor Deposition)
3. c) Diffusion
4. d) Photolithography
Answer: d) Photolithography

7.

Which technique is used to deposit thin layers of material on a

semiconductor wafer?

8.

1. a) Electroplating
2. b) Chemical vapor deposition (CVD)
3. c) Sputtering
4. d) All of the above
Answer: d) All of the above

9.

What is the primary material used to make semiconductor wafers?

10.

1. a) Gallium arsenide
2. b) Silicon
3. c) Aluminum
4. d) Gold
Answer: b) Silicon

11.
The process of photolithography in semiconductor manufacturing is used
to:

12.

1. a) Etch materials from a silicon wafer

2. b) Deposit thin films on a silicon wafer
3. c) Create fine patterns on the wafer
4. d) Bond two semiconductor layers together
Answer: c) Create fine patterns on the wafer

13.

Which of the following materials is commonly used for substrates in

integrated circuits (IC)?

14.

1. a) Copper
2. b) Gallium arsenide
3. c) Silicon
4. d) Aluminum
Answer: c) Silicon

15.

What is the purpose of annealing in semiconductor fabrication?

16.

1. a) To remove defects from the material

2. b) To harden the material
3. c) To introduce dopants into the wafer
4. d) To bond materials together
Answer: a) To remove defects from the material

17.

In semiconductor manufacturing, what is the function of a cleanroom?

18.

1. a) To protect components from environmental damage

2. b) To control dust and particles during fabrication
3. c) To assemble final products
4. d) To store wafers safely
Answer: b) To control dust and particles during fabrication

19.
 Which of the following techniques is used to remove material from a
wafer surface in semiconductor manufacturing?

20.

1. a) Chemical etching
2. b) Laser cutting
3. c) Photolithography
4. d) Molecular beam epitaxy
Answer: a) Chemical etching

Section C: Applications of Electronic Components

1.

Which of the following components is typically used to rectify AC signals

in a power supply?

2.

1. a) Capacitor
2. b) Inductor
3. c) Diode
4. d) Resistor
Answer: c) Diode

3.

Which component would be used in an LED driver circuit?

4.

1. a) Zener diode
2. b) Capacitor
3. c) Transistor
4. d) Inductor
Answer: c) Transistor

5.

In which type of circuit is a bypass capacitor typically used?

6.

1. a) Power supply filtering

2. b) Amplifier circuit
3. c) High-pass filter
 4. d) Oscillator circuit
Answer: a) Power supply filtering

7.

Which of the following components would be used to protect a circuit

from high voltage spikes?

8.

1. a) Diode
2. b) Zener diode
3. c) Inductor
4. d) Capacitor
Answer: b) Zener diode

9.

In solar power systems, which component is used to convert DC voltage

from solar panels into AC voltage?

10.

1. a) Inverter
2. b) Rectifier
3. c) Capacitor
4. d) Diode
Answer: a) Inverter

11.

Which of the following MEMS sensors is commonly used to measure

acceleration in a device?

12.

1. a) Pressure sensor
2. b) Accelerometer
3. c) Thermistor
4. d) Gyroscope
Answer: b) Accelerometer

13.

Which of the following components is most commonly used to filter high-

frequency noise in an electronic circuit?

14.
 1. a) Capacitor
2. b) Inductor
3. c) Diode
4. d) Resistor
Answer: a) Capacitor

15.

What is the primary function of a voltage regulator in a power supply?

16.

1. a) To provide constant current

2. b) To convert DC to AC
3. c) To provide a stable output voltage
4. d) To limit the amount of energy consumed
Answer: c) To provide a stable output voltage

17.

Which of the following is an application of a thermistor?

18.

1. a) Temperature sensing
2. b) Light sensing
3. c) Pressure sensing
4. d) Motion detection
Answer: a) Temperature sensing

19.

Which of the following components is most commonly used in motor

control circuits?

20.

1. a) Capacitor
2. b) Diode
3. c) Triac
4. d) Inductor
Answer: c) Triac

Section D: Advanced Topics in Electronics

1.
Which of the following components is commonly used in power factor
correction circuits?

2.

1. a) Capacitor
2. b) Inductor
3. c) Diode
4. d) Resistor
Answer: a) Capacitor

3.

What is the main advantage of using silicon carbide (SiC) in power

electronics?

4.

1. a) High breakdown voltage

2. b) Low power consumption
3. c) Low material cost
4. d) High thermal conductivity
Answer: a) High breakdown voltage

5.

In MEMS accelerometers, what is the primary function of the mass in the

sensor?

6.

1. a) To act as a magnetic field generator

2. b) To detect acceleration through displacement
3. c) To convert motion into a voltage signal
4. d) To control the sensor output signal
Answer: b) To detect acceleration through displacement

7.

Which of the following MEMS technologies is used for microfluidics

applications?

8.

1. a) Microvalves
2. b) Accelerometers
3. c) Gyroscopes
4. d) Actuators
Answer: a) Microvalves
 9.

Which of the following materials is typically used in the production of

organic semiconductors?

10.

1. a) Silicon
2. b) Gallium arsenide
3. c) Conducting polymers
4. d) Copper oxide
Answer: c) Conducting polymers

11.

Which of the following is a key advantage of using MEMS devices in

modern electronics?

12.

1. a) Reduced energy consumption

2. b) Miniaturization of devices
3. c) Increased system reliability
4. d) All of the above
Answer: d) All of the above

13.

What is the key advantage of integrated circuits (IC) over discrete

components?

14.

1. a) Higher reliability and lower cost

2. b) Higher power consumption
3. c) Easier heat dissipation
4. d) Lower integration density
Answer: a) Higher reliability and lower cost

15.

Which of the following is a common challenge in MEMS fabrication?

16.

1. a) Achieving high precision at small scales

2. b) Maintaining high yield
3. c) Integrating mechanical and electrical components
 4. d) All of the above
Answer: d) All of the above

17.

What is the function of piezoelectric materials in MEMS devices?

18.

1. a) To convert mechanical stress to electrical voltage

2. b) To amplify electrical signals
3. c) To store electrical energy
4. d) To filter electrical noise
Answer: a) To convert mechanical stress to electrical voltage

19.

Which of the following is a common application of organic

semiconductors in electronics?

20.

1. a) Flexible displays
2. b) High-speed logic circuits
3. c) Power electronics
4. d) Solar cells
Answer: a) Flexible displays