Intel Desktop Board DH55PJ

Technical Product Specification

April 2010 Order Number: E95284-001US

The Intel Desktop Board DH55PJ may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DH55PJ Specification Update.

Revision History
Revision -001 Revision History First release of the Intel Desktop Board DH55PJ Technical Product Specification

Date April 2010

This product specification applies to only the standard Intel Desktop Board DH55PJ with BIOS identifier TCIBX10H.86A. Changes to this specification will be published in the Intel Desktop Board DH55PJ Specification Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTELS TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. All Intel desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 5937 Denver, CO 80217-9808 or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333. Intel, Core, and Pentium are trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. Copyright 2010 Intel Corporation. All rights reserved.

Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board DH55PJ.

Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop Board DH55PJ and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter 1 2 3 4 5 Description A description of the hardware used on the Intel Desktop Board DH55PJ A map of the resources of the Intel Desktop Board The features supported by the BIOS Setup program A description of the BIOS error messages, beep codes, and POST codes Regulatory compliance and battery disposal information

Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE
Notes call attention to important information.

CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DH55PJ Technical Product Specification

Other Common Notation

# GB GB/s Gb/s KB Kbit kbits/s MB MB/s Mbit Mbits/s xxh x.x V * Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) Gigabytes per second Gigabits per second Kilobyte (1024 bytes) Kilobit (1024 bits) 1000 bits per second Megabyte (1,048,576 bytes) Megabytes per second Megabit (1,048,576 bits) Megabits per second An address or data value ending with a lowercase h indicates a hexadecimal value. Volts. Voltages are DC unless otherwise specified. This symbol is used to indicate third-party brands and names that are the property of their respective owners.

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Contents
1 Product Description
1.1 Overview.......................................................................................... 9 1.1.1 Feature Summary .................................................................. 9 1.1.2 Board Layout ....................................................................... 11 1.1.3 Block Diagram ..................................................................... 13 1.2 Legacy Considerations...................................................................... 14 1.3 Online Support................................................................................ 14 1.4 Processor ....................................................................................... 14 1.5 Intel H55 Express Chipset ............................................................... 15 1.6 System Memory .............................................................................. 15 1.6.1 Memory Configurations ......................................................... 16 1.7 Graphics Subsystem ........................................................................ 18 1.7.1 Integrated Graphics .............................................................. 18 1.7.2 PCI Express x16 Graphics ...................................................... 19 1.8 USB ................................................................................................ 19 1.9 SATA Interfaces .............................................................................. 20 1.10 Legacy I/O Controller ....................................................................... 20 1.10.1 Serial Port ........................................................................... 20 1.10.2 Parallel Port......................................................................... 21 1.11 Audio Subsystem............................................................................. 21 1.11.1 Audio Subsystem Software .................................................... 21 1.11.2 Audio Connectors and Headers ............................................... 21 1.12 LAN Subsystem ............................................................................... 23 1.12.1 Intel 82578DC Gigabit Ethernet Controller.............................. 23 1.12.2 LAN Subsystem Software....................................................... 23 1.12.3 RJ-45 LAN Connector with Integrated LEDs .............................. 24 1.13 Real-Time Clock Subsystem .............................................................. 25 1.14 Hardware Management Subsystem .................................................... 25 1.14.1 Hardware Monitoring and Fan Control...................................... 25 1.14.2 Fan Monitoring ..................................................................... 26 1.14.3 Chassis Intrusion Detection.................................................... 26 1.14.4 Thermal Monitoring .............................................................. 27 1.15 Power Management ......................................................................... 28 1.15.1 ACPI.................................................................................... 28 1.15.2 Hardware Support ................................................................ 31

2 Technical Reference
2.1 Memory Resources .......................................................................... 35 2.1.1 Addressable Memory............................................................. 35 2.1.2 Memory Map........................................................................ 37

Intel Desktop Board DH55PJ Technical Product Specification

2.2 Connectors and Headers................................................................... 37 2.2.1 Back Panel Connectors .......................................................... 38 2.2.2 Component-side Connectors and Headers ................................ 39 2.3 Jumper Block .................................................................................. 49 2.4 Mechanical Considerations ................................................................ 51 2.4.1 Form Factor......................................................................... 51 2.5 Electrical Considerations ................................................................... 52 2.5.1 Power Supply Considerations ................................................. 52 2.5.2 Fan Header Current Capability................................................ 53 2.5.3 Add-in Board Considerations .................................................. 53 2.6 Thermal Considerations .................................................................... 54 2.7 Reliability ....................................................................................... 57 2.8 Environmental ................................................................................ 57

3 Overview of BIOS Features

3.1 3.2 3.3 3.4 Introduction ................................................................................... System Management BIOS (SMBIOS)................................................. Legacy USB Support ........................................................................ BIOS Updates ................................................................................. 3.4.1 Language Support ................................................................ 3.4.2 Custom Splash Screen .......................................................... 3.5 BIOS Recovery................................................................................ 3.6 Boot Options................................................................................... 3.6.1 Optical Drive Boot ................................................................ 3.6.2 Network Boot....................................................................... 3.6.3 Booting Without Attached Devices........................................... 3.6.4 Changing the Default Boot Device During POST ........................ 3.7 BIOS Security Features .................................................................... 59 61 61 62 62 63 63 64 64 64 64 64 65

4 Error Messages and Beep Codes

4.1 4.2 4.3 4.4 4.5 Speaker ......................................................................................... 67 BIOS Beep Codes ............................................................................ 67 Front-panel Power LED Blink Codes .................................................... 68 BIOS Error Messages ....................................................................... 68 Port 80h POST Codes ....................................................................... 69 75 75 76 77 79 82 83 84

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance..................................................................... 5.1.1 Safety Standards.................................................................. 5.1.2 European Union Declaration of Conformity Statement ................ 5.1.3 Product Ecology Statements................................................... 5.1.4 EMC Regulations .................................................................. 5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 5.1.6 Regulatory Compliance Marks (Board Level) ............................. 5.2 Battery Disposal Information.............................................................

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Contents

Figures
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. Major Board Components.................................................................. 11 Block Diagram ................................................................................ 13 Memory Channel and DIMM Configuration ........................................... 17 Back Panel Audio Connector Options .................................................. 22 LAN Connector LED Locations ............................................................ 24 Thermal Sensors and Fan Headers ..................................................... 27 Location of the Standby Power LED .................................................... 34 Detailed System Memory Address Map ............................................... 36 Back Panel Connectors ..................................................................... 38 Component-side Connectors and Headers ........................................... 39 Connection Diagram for Front Panel Header ........................................ 46 Connection Diagram for Front Panel USB Headers ................................ 48 Location of the Jumper Block............................................................. 49 Board Dimensions ........................................................................... 51 Localized High Temperature Zones..................................................... 55

Tables
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. Feature Summary.............................................................................. 9 Components Shown in Figure 1 ......................................................... 12 Supported Memory Configurations ..................................................... 15 LAN Connector LED States ................................................................ 24 Effects of Pressing the Power Switch .................................................. 28 Power States and Targeted System Power........................................... 29 Wake-up Devices and Events ............................................................ 30 System Memory Map ....................................................................... 37 Component-side Connectors and Headers Shown in Figure 10................ 40 Serial Port Header ........................................................................... 41 Parallel Port Header ......................................................................... 41 S/PDIF Header ................................................................................ 42 Internal Mono Speaker Header .......................................................... 42 Front Panel Audio Header for Intel HD Audio........................................ 42 Front Panel Audio Header for Passive AC 97 Audio ............................... 42 Front Panel USB Header ................................................................... 42 SATA Connectors............................................................................. 43 Processor (4-Pin) Fan Header ............................................................ 43 Front and Rear Chassis Fan Headers .................................................. 43 Chassis Intrusion Header .................................................................. 43 Processor Core Power Connector........................................................ 44 Main Power Connector...................................................................... 45 Front Panel Header .......................................................................... 46 States for a One-Color Power LED ...................................................... 47 Auxiliary Front Panel Power LED Header.............................................. 47 BIOS Setup Configuration Jumper Settings.......................................... 50 Minimum Recommended Power Supply Current Values.......................... 52 Fan Header Current Capability........................................................... 53

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Intel Desktop Board DH55PJ Technical Product Specification

29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. 43. 44. 45.

Thermal Considerations for Components ............................................. Tcontrol Values for Components ........................................................ Environmental Specifications............................................................. BIOS Setup Program Menu Bar.......................................................... BIOS Setup Program Function Keys.................................................... AcceptableDrives/Media Types for BIOS Recovery ................................ Boot Device Menu Options ................................................................ Supervisor and User Password Functions............................................. BIOS Beep Codes ............................................................................ Front-panel Power LED Blink Codes .................................................... BIOS Error Messages ....................................................................... Port 80h POST Code Ranges.............................................................. Port 80h POST Codes ....................................................................... Typical Port 80h POST Sequence........................................................ Safety Standards............................................................................. EMC Regulations ............................................................................. Regulatory Compliance Marks............................................................

55 56 57 60 60 63 64 65 67 68 68 69 70 73 75 79 83

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1
1.1
1.1.1

Product Description
Overview
Feature Summary

Table 1 summarizes the major features of the board. Table 1. Feature Summary
Form Factor Processor MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]) Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors in an LGA1156 socket: Integrated graphics processing (processors with Intel Graphics Technology) External graphics interface controller Integrated memory controller Chipset Memory Intel H55 Express Chipset consisting of the Intel H55 Platform Controller Hub (PCH) Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs Support for 1 Gb and 2 Gb memory technology Support for up to 8 GB of system memory with two DIMMs using 2 Gb memory technology Support for non-ECC memory Graphics Integrated graphics support for processors with Intel Graphics Technology: VGA DVI-D Discrete graphics support for PCI Express 2.0 x16 add-in graphics card Audio Peripheral Interfaces Intel High Definition Audio via the Realtek* ALC888S audio codec Twelve USB 2.0 ports: Six ports are implemented with stacked back panel connectors Six front panel ports are implemented with three dual-port internal headers Four internal Serial ATA (SATA) 3.0 Gb/s ports One serial port header One parallel port header One back panel PS/2 connector BIOS Intel BIOS resident in the SPI Flash device Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS

continued

Intel Desktop Board DH55PJ Technical Product Specification

Table 1. Feature Summary (continued)

Instantly Available PC Technology Support for PCI* Local Bus Specification Revision 2.3 Support for PCI Express* Suspend to RAM support Wake on PCI, PCI Express, LAN, front panel, PS/2, serial, and USB ports LAN Support Expansion Capabilities Hardware Monitor Subsystem Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel 82578DC Gigabit Ethernet Controller One PCI Express 2.0 x16 add-in card connector Two PCI Express 2.0 x1 add-in card connectors One Conventional PCI bus connector Intel Quiet System Technology (Intel QST) implemented through Intel Management Engine (Intel ME) in the Intel H55 PCH Voltage sense to detect out of range power supply voltages Thermal sense to detect out of range thermal values Three fan headers using PWM control 4-pin headers for processor, front, and rear fans 4-wire and 3-wire (linear) fan speed control support for front and rear fans Support for Platform Environmental Control Interface (PECI)

10

Product Description

1.1.2

Board Layout

Figure 1 shows the location of the major components on Intel Desktop Board DH55PJ.

Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.

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Intel Desktop Board DH55PJ Technical Product Specification

Table 2. Components Shown in Figure 1

Item/callout from Figure 1 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA BB Description Conventional PCI bus add-in card connector PCI Express x1 add-in card connector Battery PCI Express x1 add-in card connector PCI Express x16 add-in card connector Back panel connectors 12 V internal power connector (ATX12V) Rear chassis fan header LGA1156 processor socket Processor fan header DDR3 Channel A, DIMM 0 socket DDR3 Channel B, DIMM 0 socket Front chassis fan header Main power connector (2 x 12) Parallel port header Chassis intrusion header SATA connectors BIOS setup configuration jumper block Alternate front panel power LED header Front panel header Standby power LED Front panel USB headers (3) Intel H55 Express Chipset Piezoelectric speaker Serial port header S/PDIF header Front panel audio header Internal mono speaker header

12

Product Description

1.1.3

Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.

Figure 2. Block Diagram

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Intel Desktop Board DH55PJ Technical Product Specification

1.2

Legacy Considerations
No floppy drive connector No Parallel ATA (PATA) IDE drive connector

This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following:

1.3

Online Support
Visit this World Wide Web site:
http://www.intel.com/products/motherboard/DH55PJ/index.htm http://www.intel.com/support/motherboards/desktop http://www.intel.com/products/motherboard/DH55PJ/index.htm http://processormatch.intel.com http://www.intel.com/products/desktop/chipsets/index.htm http://downloadcenter.intel.com http://www.intel.com/support/motherboards/desktop/sb/CS025414.htm http://www.intel.com/support/go/buildit

To find information about

Intel Desktop Board DH55PJ Desktop Board Support Available configurations for the Intel Desktop Board DH55PJ Supported processors Chipset information BIOS and driver updates Tested memory Integration information

1.4

Processor

The board is designed to support the Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors in an LGA1156 socket. Other processors may be supported in the future. This board is designed to support processors with a maximum TDP of 95 W. See the Intel web site listed below for the most up-to-date list of supported processors.
For information about
Supported processors

Refer to:
http://processormatch.intel.com

CAUTION
Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply.

NOTE
This board has specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 52 for information on power supply requirements for this board.

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Product Description

1.5

Intel H55 Express Chipset

The Intel H55 Express Chipset consisting of the Intel H55 Platform Controller Hub (PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network, display, Conventional PCI, and PCI Express x1 interfaces. The PCH is a centralized controller for the boards I/O paths.
For information about
The Intel H55 Express Chipset Resources used by the chipset

Refer to
http://www.intel.com/products/desktop/chipsets/index.htm Chapter 2

1.6

System Memory
Two independent memory channels with interleaved mode support Support for non-ECC, unbuffered, single-sided or double-sided DIMMs with x8 organization 8 GB maximum total system memory (with 2 Gb memory technology). Refer to Section 2.1.1 on page 35 for information on the total amount of addressable memory. Minimum total system memory: 1 GB using 1 Gb x8 module Serial Presence Detect DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs

The board has two DIMM sockets and supports the following memory features:

NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency. Table 3 lists the supported DIMM configurations. Table 3. Supported Memory Configurations
DIMM Capacity 1024 MB 2048 MB 2048 MB 4096 MB Note: Configuration
(Note)

SDRAM Density 1 Gbit 1 Gbit 2 Gbit 2 Gbit

SDRAM Organization Front-side/Back-side 1 Gb x8/empty 1 Gb x8/1 Gb x8 2 Gb x8/empty 2 Gb x8/2 Gb x8

Number of SDRAM Devices 8 16 8 16

SS DS SS DS

DS refers to double-sided memory modules (containing two rows of SDRAM) and SS refers to single-sided memory modules (containing one row of SDRAM).

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Intel Desktop Board DH55PJ Technical Product Specification

For information about

Tested Memory

Refer to:
http://www.intel.com/support/motherboards/desktop/sb/CS025414.htm

1.6.1

Memory Configurations
Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used. Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.
Refer to:
http://www.intel.com/support/motherboards/desktop/sb/cs011965.htm

The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors support the following types of memory organization:

For information about

Memory Configuration Examples

16

Product Description

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel and DIMM Configuration

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Intel Desktop Board DH55PJ Technical Product Specification

1.7

Graphics Subsystem

The board supports system graphics through either Intel Graphics Technology or a PCI Express 2.0 x16 add-in graphics card.

1.7.1

Integrated Graphics

The board supports integrated graphics through the Intel Flexible Display Interface (Intel FDI) for processors with Intel Graphics Technology.

NOTE
Up to two monitors can be simultaneously enabled through the integrated graphics ports on the Intel Desktop Board DH55PJ. Environments not supported by the graphics driver (i.e., POST) can only support dual-screen display in mirrored mode, as long as one monitor is connected to the analog (VGA) port. The following table lists supported mirrored output under environments not supported by the graphics driver.
Output from POST VGA <VGA> + <DVI-D> <DVI-D> x x DVI-D

Dual-screen display support by the supplied Windows graphics drivers allows mirrored or extended-desktop configurations using either of the two monitor interfaces.

1.7.1.1

Analog Display (VGA)

The VGA port supports analog displays. The maximum supported resolution is 2048 x 1536 (QXGA) at a 75 Hz refresh rate. The VGA port is enabled for POST whenever a monitor is attached, regardless of the DVI-D connector status.

1.7.1.2

Digital Visual Interface (DVI-D)

The DVI-D port supports digital DVI displays. The maximum supported resolution is 1920 x 1200 (WUXGA) at 60 Hz refresh rate. The DVI-D port is compliant with the DVI 1.0 specification. The DVI-D port is only enabled for POST when there is no monitor attached to the VGA connector.

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Product Description

1.7.2

PCI Express x16 Graphics

The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors in an LGA1156 socket support discrete add in graphics cards via the PCI Express 2.0 x16 graphics connector: Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each direction (500 MB/s) per lane. Maximum theoretical bandwidth on interface is 8 GB/s in each direction, simultaneously, when operating in x16 mode. Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each direction (250 MB/s) per lane. Maximum theoretical bandwidth on interface is 4 GB/s in each direction, simultaneously, when operating in x16 mode.
Refer to
http://www.pcisig.com

For information about

PCI Express technology

1.8

USB

The board supports up to twelve USB 2.0 ports through two EHCI host controllers on the PCH that allow the use of EHCI-compatible drivers. The port arrangement is as follows: Six ports via stacked back panel connectors Six front panel ports via three dual-port internal headers
Refer to
Figure 9, page 38 Figure 10, page 39

For information about

The location of the USB connectors on the back panel The location of the front panel USB headers

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Intel Desktop Board DH55PJ Technical Product Specification

1.9

SATA Interfaces

The board provides four internal SATA connectors through the PCH for internal storage. The PCH provides independent SATA ports with a theoretical maximum transfer rate of 3 Gb/s per port. A point-to-point interface is used for host to device connections. The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP, Windows Vista*, and Windows 7* operating systems. For more information, see: http://www.serialata.org/.
For information about
The location of the SATA connectors

Refer to
Figure 10, page 39

1.10 Legacy I/O Controller

The Legacy I/O Controller provides the following features: One serial port One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems PS/2-style keyboard/mouse interface Intelligent power management, including a programmable wake-up event interface PCI Conventional bus power management support

The BIOS Setup program provides configuration options for the Legacy I/O controller.

1.10.1

Serial Port

The serial port is implemented as a 10-pin header on the board. The serial port supports data transfers at speeds up to 115.2 kbits/s with BIOS support.
For information about
The location of the serial port header

Refer to
Figure 10, page 39

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Product Description

1.10.2

Parallel Port

The parallel port is implemented as a 26-pin header on the board. Use the BIOS Setup program to set the parallel port mode.
For information about
The location of the parallel port header

Refer to
Figure 10, page 39

1.11 Audio Subsystem

The board supports Intel High Definition Audio via the Realtek ALC888S audio codec. The ALC888S-based audio subsystem supports the following features: Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to the users definition, or can be automatically switched depending on the recognized device type. Stereo input and output via back panel jacks Headphone and Mic in functions for front panel audio jacks A signal-to-noise (S/N) ratio of 90 dB

1.11.1

Audio Subsystem Software

Refer to
Section 1.3, page 14

Audio software and drivers are available from Intels World Wide Web site.
For information about
Obtaining audio software and drivers

1.11.2

Audio Connectors and Headers

The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio headers include the following: Front panel audio (a 2 x 5-pin header that provides headphone and mic in signals for front panel audio connectors) (yellow) S/PDIF audio header (1 x 4-pin header) (yellow) Internal mono speaker header (1 x 2 pin header) (yellow)
Refer to
Figure 10, page 39 Table 14 and Table 15, page 42 Table 12, page 42 Table 13, page 42 Section 2.2.1, page 38

For information about

The locations of the front panel audio header, S/PDIF header, and internal mono speaker header The signal names of the front panel audio header The signal names of the S/PDIF header The signal names of the internal mono speaker header The back panel audio connectors

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Intel Desktop Board DH55PJ Technical Product Specification

1.11.2.1

Analog Audio Connectivity

The available configurable back panel audio connectors are shown in Figure 4.

Item
A B C

Description
Audio line in Audio line out Mic in

Figure 4. Back Panel Audio Connector Options The back panel audio connectors are configurable through the audio device drivers.
For information about
The back panel audio connectors

Refer to
Section 2.2.1, page 38

The front panel headphone output is supported via a separate audio channel pair allowing multi-streaming audio configurations such as simultaneous 5.1 surround playback and stereo audio conferencing (through back panel speakers and front panel headset, respectively).

1.11.2.2

SPDIF Connectivity

The SPDIF header allows connectivity to coaxial or optical dongles for digital audio output.

1.11.2.3

Internal Mono Speaker Connectivity

The internal mono speaker header allows connectivity to an internal, low-power speaker for basic system sound capability. The subsystem is capable of driving a target speaker load of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms).

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Product Description

1.12 LAN Subsystem

The LAN subsystem consists of the following: Intel 82578DC Gigabit Ethernet Controller (10/100/1000 Mbits/s) RJ-45 LAN connector with integrated status LEDs
Refer to
http://downloadcenter.intel.com

For information about

LAN software and drivers

1.12.1

Intel 82578DC Gigabit Ethernet Controller

The Intel 82578DC Gigabit Ethernet Controller supports the following features: 10/100/1000 BASE-T IEEE 802.3 compliant PCI Express link Compliant to IEEE 802.3x flow control support 802.1p and 802.1q TCP, IP, and UDP checksum offload (for IPv4 and IPv6) Transmit TCP segmentation Full device driver compatibility PCI Express power management support

1.12.2

LAN Subsystem Software

Refer to
http://downloadcenter.intel.com

LAN software and drivers are available from Intels World Wide Web site.
For information about
Obtaining LAN software and drivers

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Intel Desktop Board DH55PJ Technical Product Specification

1.12.3

RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).

Item
A B

Description
Link/Activity LED (green) Link Speed LED (green/yellow)

Figure 5. LAN Connector LED Locations Table 4 describes the LED states when the board is powered up and the LAN subsystem is operating. Table 4. LAN Connector LED States
LED
Link/Activity

LED Color
Green

LED State
Off On Blinking Off

Condition
LAN link is not established. LAN link is established. LAN activity is occurring. 10 Mbits/s data rate is selected or negotiated. 100 Mbits/s data rate is selected or negotiated. 1000 Mbits/s data rate is selected or negotiated.

Link Speed

Green/Yellow

Green Yellow

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Product Description

1.13 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to 13 minutes/year at 25 C with power applied via the power supply 5V STBY rail.

NOTE
If the battery and AC power fail, date and time values will be reset and the user will be notified during POST. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.

1.14 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: Hardware monitoring and fan control Fan Monitoring Chassis intrusion detection Thermal monitoring

1.14.1

Hardware Monitoring and Fan Control

The features of the hardware monitoring and fan control include: Intel Quiet System Technology, delivering acoustically-optimized thermal management Thermal sensors in the processor and PCH, as well as near the CPU voltage regulators and system memory Monitoring of five system voltages (+5 V, +12 V, +3.3 V, Memory V-SM, and +VCCP) to detect levels above or below acceptable values Thermally monitored closed-loop fan control for all three fans that can adjust fan speed as needed

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Intel Desktop Board DH55PJ Technical Product Specification

1.14.2

Fan Monitoring

Fan monitoring can be observed via the BIOS setup user interface, Intel Desktop Utilities or third-party software.
For information about
The functions of the fan headers

Refer to
Section 1.15.2.2, page 32

1.14.3

Chassis Intrusion Detection

The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position.
For information about
The location of the chassis intrusion header

Refer to
Figure 10, page 39

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Product Description

1.14.4

Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers.

Item
A B C D

Description
Rear chassis fan header Thermal diode, located on processor die Processor fan header Front chassis fan header

Figure 6. Thermal Sensors and Fan Headers

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Intel Desktop Board DH55PJ Technical Product Specification

1.15 Power Management

Power management is implemented at several levels, including: Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: Power connector Fan headers LAN wake capabilities Instantly Available PC technology Wake from USB Power Management Event signal (PME#) wake-up support PCI Express WAKE# signal support Wake from PS/2 devices Wake from serial port

1.15.1

ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include: Plug and Play (including bus and device enumeration) Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state A Soft-off feature that enables the operating system to power-off the computer Support for multiple wake-up events (see Table 7 on page 30) Support for a front panel power and sleep mode switch

Table 5 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system. Table 5. Effects of Pressing the Power Switch
If the system is in this state Off (ACPI G2/G5 Soft off) On (ACPI G0 working state) On (ACPI G0 working state) Sleep (ACPI G1 sleeping state) Sleep (ACPI G1 sleeping state) and the power switch is pressed for Less than four seconds Less than four seconds More than six seconds Less than four seconds More than six seconds the system enters this state Power-on (ACPI G0 working state) Soft-off/Standby (note) (ACPI G1 sleeping state) Fail safe power-off (ACPI G2/G5 Soft off) Wake-up (ACPI G0 working state) Power-off (ACPI G2/G5 Soft off)

Note: System can only enter Standby state if power switch action is properly configured by the operating system.

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Product Description

1.15.1.1

System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state. Table 6 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states. Table 6. Power States and Targeted System Power
Processor Global States G0 working state G1 sleeping state Sleeping States S0 working S1 Processor stopped States C0 working C1 stop grant Device States D0 working state. D1, D2, D3 device specification specific. D3 no power except for wake-up logic. D3 no power except for wake-up logic. D3 no power except for wake-up logic. D3 no power for wake-up logic, except when provided by battery or external source. Targeted System Power (Note 1) Full power > 30 W 5 W < power < 52.5 W

G1 sleeping state G1 sleeping state G2/S5

S3 Suspend to RAM. Context saved to RAM. S4 Suspend to disk. Context saved to disk. S5 Soft off. Context not saved. Cold boot is required. No power to the system.

No power

Power < 5 W (Note 2)

No power

Power < 5 W (Note 2)

No power

Power < 5 W (Note 2)

G3 mechanical off AC power is disconnected from the computer. Notes: 1. 2.

No power

No power to the system. Service can be performed safely.

Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis power supply. Dependent on the standby power consumption of wake-up devices used in the system.

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Intel Desktop Board DH55PJ Technical Product Specification

1.15.1.2

Wake-up Devices and Events

Table 7 lists the devices or specific events that can wake the computer from specific states. Table 7. Wake-up Devices and Events
These devices/events can wake up the computer Power switch RTC alarm LAN USB PME# signal WAKE# signal PS/2 Serial Notes: S4 implies operating system support only. USB ports are turned off during S4/S5 states. from this state S1, S3, S4, S5 S1, S3, S4, S5 S1, S3, S4, S5 S1, S3 S1, S3, S4, S5 S1, S3, S4, S5 S1, S3, S4, S5 S1, S3

NOTE
The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.

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Product Description

1.15.2

Hardware Support

CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. The board provides several power management hardware features, including: Power connector Fan headers LAN wake capabilities Instantly Available PC technology Wake from USB PME# signal wake-up support WAKE# signal wake-up support Wake from PS/2 devices Wake from serial port +5 V Standby Power Indicator LED

LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line.

NOTE
The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.

1.15.2.1

Power Connector

ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages. When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computers response can be set using the Last Power State feature in the BIOS Setup programs Boot menu.
For information about
The location of the main power connector The signal names of the main power connector

Refer to
Figure 10, page 39 Table 22, page 45

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Intel Desktop Board DH55PJ Technical Product Specification

1.15.2.2

Fan Headers

The function/operation of the fan headers is as follows: The fans are on when the board is in the S0 or S1 state The fans are off when the board is in the S3, S4, or S5 state Each fan header is wired to a fan tachometer input of the hardware monitoring and fan control ASIC All fan headers support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed All fan headers have a +12 V DC connection 4-pin fan headers are controlled by Pulse Width Modulation The front fan and rear fan headers also support linear fan control on 3-wire fans
Refer to
Figure 10, page 39 Figure 6, page 27

For information about

The location of the fan headers The location of the fan headers and sensors for thermal monitoring

1.15.2.3

LAN Wake Capabilities

CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.

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Product Description

1.15.2.4

Instantly Available PC Technology

CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off and the front panel power LED will behave as configured by the BIOS S3 State Indicator option). When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 7 on page 30 lists the devices and events that can wake the computer from the S3 state. The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer. The use of Instantly Available PC technology requires operating system support and PCI 2.3 compliant add-in cards, PCI Express add-in cards, and drivers.

1.15.2.5

Wake from USB

USB bus activity wakes the computer from ACPI S1 or S3 states.

NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB and is supported by the operating system.

1.15.2.6

PME# Signal Wake-up Support

When the PME# signal on the Conventional PCI bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state.

1.15.2.7

WAKE# Signal Wake-up Support

When the WAKE# signal on a PCI Express add-in card is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state.

1.15.2.8

Wake from PS/2 Devices

PS/2 device activity can wake the computer from an ACPI S1, S3, S4, or S5 state. When the computer is in an S4 state, any key can be used to wake the computer provided a supported operating system is installed. When the computer is in the S5 state, the only PS/2 activity that will wake the computer is either the Alt-PrtScrn key combination or the Power key that is available on some keyboards. The BIOS can be used to select between either of the key combinations.

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Intel Desktop Board DH55PJ Technical Product Specification

1.15.2.9

Wake from Serial Port

Serial port activity wakes the computer from an ACPI S1 or S3 state.

1.15.2.10 +5 V Standby Power Indicator LED

The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power indicator LED on the board.

Figure 7. Location of the Standby Power LED

CAUTION
If AC power has been switched off and the standby power indicators are still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices.

34

2
2.1
2.1.1

Technical Reference
Memory Resources
Addressable Memory

The board utilizes 8 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 8 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following: BIOS/SPI Flash device (64 Mbit) Local APIC (19 MB) Direct Media Interface (40 MB) Front side bus interrupts (17 MB) PCI Express configuration space (256 MB) PCH base address registers PCI Express ports (up to 256 MB) Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI Express add-in cards (256 MB)

The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just above the 4 GB boundary. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.

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Intel Desktop Board DH55PJ Technical Product Specification

Figure 8. Detailed System Memory Address Map

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Technical Reference

2.1.2

Memory Map

Table 8 lists the system memory map. Table 8. System Memory Map
Address Range (decimal) 1024 K - 8388608 K 960 K - 1024 K 896 K - 960 K 800 K - 896 K Address Range (hex) 100000 - 1FFFFFFFF F0000 - FFFFF E0000 - EFFFF C8000 - DFFFF Size 8191 MB 64 KB 64 KB 96 KB Description Extended memory Runtime BIOS Reserved Potential available high DOS memory (open to the PCI Conventional bus). Dependent on video adapter used. Video memory and BIOS Extended BIOS data (movable by memory manager software) Extended conventional memory Conventional memory

640 K - 800 K 639 K - 640 K 512 K - 639 K 0 K - 512 K

A0000 - C7FFF 9FC00 - 9FFFF 80000 - 9FBFF 00000 - 7FFFF

160 KB 1 KB 127 KB 512 KB

2.2

Connectors and Headers

CAUTION
Only the following connectors and headers have overcurrent protection: back panel and front panel USB and PS/2. The other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computers chassis, such as fans and internal peripherals. Do not use these connectors or headers to power devices external to the computers chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. Furthermore, improper connection of USB header single wire connectors may eventually overload the overcurrent protection and cause damage to the board. This section describes the boards connectors. The connectors can be divided into these groups: Back panel I/O connectors Component-side I/O connectors and headers (see page 39)

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Intel Desktop Board DH55PJ Technical Product Specification

2.2.1

Back Panel Connectors

Figure 9 shows the location of the back panel connectors for the board.

Item A B C D E F G H I J

Description PS/2 keyboard/mouse port USB ports VGA port DVI-D connector USB ports LAN USB ports Audio line in Audio line out Mic in

Figure 9. Back Panel Connectors

NOTE
The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

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Technical Reference

2.2.2

Component-side Connectors and Headers

Figure 10 shows the locations of the component-side connectors and headers.

Figure 10. Component-side Connectors and Headers Table 9 lists the component-side connectors and headers identified in Figure 10.

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Intel Desktop Board DH55PJ Technical Product Specification

Table 9. Component-side Connectors and Headers Shown in Figure 10

Item/callout from Figure 10 A B C D E F G H I J K L M N O P Q R S Description PCI Conventional bus add-in card connector PCI Express x1 bus add-in card connector PCI Express x1 bus add-in card connector PCI Express x16 bus add-in card connector 12 V internal power connector (ATX12V) Rear chassis fan header Processor fan header Front chassis fan header Main power connector (2 x 12) Parallel port header Chassis intrusion header SATA connectors Alternate front panel power LED header Front panel header USB headers (3) Serial port header S/PDIF header Front panel audio header Internal mono speaker header

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Technical Reference

2.2.2.1

Signal Tables for the Connectors and Headers

Table 10. Serial Port Header

Pin
1 3 5 7 9

Signal Name
DCD (Data Carrier Detect) TXD# (Transmit Data) Ground RTS (Request To Send) RI (Ring Indicator)

Pin
2 4 6 8 10

Signal Name
RXD# (Receive Data) DTR (Data Terminal Ready) DSR (Data Set Ready) CTS (Clear To Send) Key (no pin)

Table 11. Parallel Port Header

Pin
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

Standard Signal Name

STROBE# AUTOFD# PD0 FAULT# PD1 INT# PD2 SLCTIN# PD3 GROUND PD4 GROUND PD5 GROUND PD6 GROUND PD7 GROUND ACK# GROUND BUSY GROUND PERROR GROUND SELECT KEY (no pin)

ECP Signal Name

STROBE# AUTOFD#, HOSACK PD0 FAULT#, PERIPHREQST# PD1 INT#, REVERSERQST# PD2 SLCTIN# PD3 GROUND PD4 GROUND PD5 GROUND PD6 GROUND PD7 GROUND ACK# GROUND BUSY#, PERIPHACK GROUND PE, ACKREVERSE# GROUND SELECT KEY (no pin)

EPP Signal Name

WRITE# DATASTB# PD0 FAULT# PD1 RESET# PD2 ADDRSTB# PD3 GROUND PD4 GROUND PD5 GROUND PD6 GROUND PD7 GROUND INTR GROUND WAIT# GROUND PE GROUND SELECT KEY (no pin)

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Intel Desktop Board DH55PJ Technical Product Specification

Table 12. S/PDIF Header

Pin
1 2 3 3

Signal Name
Ground S/PDIF out Key (no pin) +5V_DC

Table 13. Internal Mono Speaker Header

Pin
1 2

Signal Name
+

Table 14. Front Panel Audio Header for Intel HD Audio

Pin
1 3 5 7 9

Signal Name
[Port 1] Left channel [Port 1] Right channel [Port 2] Right channel SENSE_SEND (Jack detection) [Port 2] Left channel

Pin
2 4 6 8 10

Signal Name
Ground PRESENCE# (HD Audio/AC 97 detect) [Port 1] SENSE_RETURN Key (no pin) [Port 2] SENSE_RETURN

Table 15. Front Panel Audio Header for Passive AC 97 Audio

Pin
1 3 5 7 9

Signal Name
MIC MIC_BIAS FP_OUT_R NC (no connect) FP_OUT_L

Pin
2 4 6 8 10

Signal Name
AUD_GND PRESENCE# (HD Audio/AC 97 detect) AUD_GND KEY (no pin) AUD_GND

Table 16. Front Panel USB Headers

Pin
1 3 5 7 9

Signal Name
+5 VDC DD+ Ground KEY (no pin)

Pin
2 4 6 8 10

Signal Name
+5 VDC DD+ Ground No Connect

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Technical Reference

Table 17. SATA Connectors

Pin
1 2 3 4 5 6 7

Signal Name
Ground TXP TXN Ground RXN RXP Ground

Table 18. Processor (4-Pin) Fan Header

Pin
1 2 3 4

Signal Name
Ground +12 V FAN_TACH FAN_CONTROL

Table 19. Front and Rear Chassis Fan Headers

Pin
1 2 3 4

4-Wire Support
Ground +12 V FAN_TACH FAN_CONTROL

Pin
3 2 1 N/A

3-Wire Support
Ground FAN_POWER FAN_TACH N/A

Table 20. Chassis Intrusion Header

Pin
1 2

Signal Name
Intruder# Ground

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Intel Desktop Board DH55PJ Technical Product Specification

2.2.2.2

Add-in Card Connectors

The board has the following add-in card connectors: One PCI Express 2.0 x16: this connector supports simultaneous transfer speeds of up to 8 GB/s of peak bandwidth per direction. Two PCI Express 2.0 x1: each of these connectors support simultaneous transfer speeds of up to 500 MB/s of peak bandwidth per direction. One Conventional PCI (rev 2.3 compliant) connector. The Conventional PCI bus connector is bus master capable. SMBus signals are routed to the Conventional PCI bus connector. This enables Conventional PCI bus add-in boards with SMBus support to access sensor data on the desktop board. The specific SMBus signals are as follows: The SMBus clock line is connected to pin A40. The SMBus data line is connected to pin A41.

Note the following considerations for the Conventional PCI bus connector:

2.2.2.3

Power Supply Connectors

The board has the following power supply connectors: Main power a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, pins 11, 12, 23, and 24 must remain unconnected. Processor core power a 2 x 2 connector. This connector provides power directly to the processor voltage regulator and must always be used. Failure to do so will prevent the board from booting.

CAUTION
If a high power (75 W or greater) add-in card is installed in the PCI Express x16 connector, that card must also be connected directly to the power supply. Failure to do so may cause damage to the board and the add-in card. Table 21. Processor Core Power Connector
Pin
1 3

Signal Name
Ground +12 V

Pin
2 4

Signal Name
Ground +12 V

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Technical Reference

Table 22. Main Power Connector

Pin
1 2 3 4 5 6 7 8 9 10 11 12

Signal Name
+3.3 V +3.3 V Ground +5 V Ground +5 V Ground PWRGD (Power Good) +5 V (Standby) +12 V +12 V (Note) +3.3 V 2 x 12 connector detect
(Note)

Pin
13 14 15 16 17 18 19 20 21 22 23 24

Signal Name
+3.3 V 12 V Ground PS-ON# (power supply remote on/off) Ground Ground Ground 5 V (obsolete) +5 V +5 V +5 V (Note) Ground (Note)

Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

For information about

Power supply considerations

Refer to
Section 2.5.1 on page 52

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Intel Desktop Board DH55PJ Technical Product Specification

2.2.2.4

Front Panel Header

This section describes the functions of the front panel header. Table 23 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header. Table 23. Front Panel Header
Pin
1 3

Signal
HD_PWR HDA#

In/ Out
Out Out

Description
Hard disk LED pull-up to +5 V Hard disk active LED

Pin
2 4

Signal
FP_LED+ FP_LED

In/ Out
Out Out

Description
Front panel green LED Front panel yellow LED

Hard Drive Activity LED

Power LED

Reset Switch 5 7 Power 9 +5 V Power Ground FP_RESET# In Ground Reset switch

On/Off Switch 6 8 PWR# Ground In Power switch Ground

Not Connected 10 N/C Not connected

Figure 11. Connection Diagram for Front Panel Header 2.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to an internal storage device. Proper LED function requires a SATA hard drive or optical drive connected to an onboard SATA connector.

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Technical Reference

2.2.2.4.2

Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.2.2.4.3 Power LED Header

Pins 2 and 4 can be connected to a one- or two-color LED. Table 24 shows the default states for this LED. More options are available through BIOS setup. Table 24. States for a One-Color Power LED
LED State
Off Steady Lit Blink

Description
Power off/sleeping Running Standby

2.2.2.4.4

Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal.

2.2.2.5

Auxiliary Front Panel Power LED Header

Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header. Table 25. Auxiliary Front Panel Power LED Header
Pin
1 2 3

Signal Name
FP_LED+ Not connected FP_LED

In/Out
Out Out

Description
FP_LED+ FP_LED

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Intel Desktop Board DH55PJ Technical Product Specification

2.2.2.6

Front Panel USB Headers

Figure 12 is a connection diagram for the front panel USB headers.

NOTE
The +5 V DC power on the USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices.

Figure 12. Connection Diagram for Front Panel USB Headers

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2.3

Jumper Block

CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 13 shows the location of the jumper block. The 3-pin jumper block determines the BIOS Setup programs mode. Table 26 describes the jumper settings for the three modes: normal, configure, and recovery.

Figure 13. Location of the Jumper Block

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Intel Desktop Board DH55PJ Technical Product Specification

Table 26. BIOS Setup Configuration Jumper Settings

Function/Mode Normal Jumper Setting 1-2 Configuration The BIOS uses current configuration information and passwords for booting.

Configure

2-3

After the POST runs, Setup runs automatically. The maintenance menu is displayed. Note that this Configure mode is the only way to clear the BIOS/CMOS settings. Press F9 (restore defaults) while in Configure mode to restore the BIOS/CMOS settings to their default values.

Recovery

None

The BIOS attempts to recover the BIOS configuration. A recovery CD or USB flash drive is required.

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2.4
2.4.1

Mechanical Considerations
Form Factor

The board is designed to fit into a MicroATX form-factor chassis. Figure 14 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification.

Figure 14. Board Dimensions

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Intel Desktop Board DH55PJ Technical Product Specification

2.5
2.5.1

Electrical Considerations
Power Supply Considerations

CAUTION
The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the indicated parameters of the ATX form factor specification. The potential relation between 3.3 VDC and +5 VDC power rails The current capability of the +5 VSB line All timing parameters All voltage tolerances For example, for a typical system configuration of a 95 W processor (see Section 1.4 on page 14 for information on supported processors), up to 8 GB DDR3 memory, integrated graphics, one hard disk drive, one optical drive, and all board peripherals enabled, the minimum recommended power supply is about 320 W with current ratings as listed in Table 27. Table 27. Minimum Recommended Power Supply Current Values
Output Voltage Current 3.3 V 5A 5V 12 A +12 V1 10 A +12 V2 10 A -12 V 0.1 A 5 VSB 0.5 A

NOTE
+12 V1 denotes the 12 V rail at the 2 x 12 power connector +12 V2 denotes the 12 V rail at the 2 x 2 power connector
For information about
Selecting an appropriate power supply

Refer to
http://www.intel.com/support/motherboards/desktop/sb/CS -026472.htm

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2.5.2

Fan Header Current Capability

CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 28 lists the current capability of the fan headers. Table 28. Fan Header Current Capability
Fan Header
Processor fan Front chassis fan Rear chassis fan

Maximum Available Current

2.0 A 1.5 A 1.5 A

2.5.3

Add-in Board Considerations

The board is designed to provide 2 A (average) of current for each add-in board from the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board (all expansion slots filled) must not exceed the systems power supply +5 V maximum current.

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Intel Desktop Board DH55PJ Technical Product Specification

2.6

Thermal Considerations

CAUTION
Use of a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area is highly recommended.

CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.

CAUTION
The ambient temperature must not exceed the boards maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8.

CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit.

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Technical Reference

Figure 15 shows the locations of the localized high temperature zones.

Item A B C

Description Processor voltage regulator area Processor Intel H55 Express Chipset

Figure 15. Localized High Temperature Zones Table 29 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 29. Thermal Considerations for Components
Component
Processor Intel H55 Express Chipset

Maximum Case Temperature

For processor case temperature, see processor datasheets and processor specification updates 111 oC

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Intel Desktop Board DH55PJ Technical Product Specification

To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 29. This is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified as the maximum sustainable power to be dissipated by the components). When the component is dissipating less than TDP, the case temperature should be below the Maximum Case Temperature. The surface temperature at the geometric center of the component corresponds to Case Temperature. It is important to note that the temperature measurement in the system BIOS is a value reported by embedded thermal sensors in the components and does not directly correspond to the Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is Tcontrol, as shown in Table 30. Table 30. Tcontrol Values for Components
Component
Processor Intel H55 Express Chipset

Tcontrol
For processor case temperature, see processor datasheets and processor specification updates 107 oC

For information about

Processor datasheets and specification updates

Refer to
Section 1.3, page 14

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Technical Reference

2.7

Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 50 C ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 50 C. The MTBF for the board is 146,986 hours.

2.8

Environmental

Table 31 lists the environmental specifications for the board. Table 31. Environmental Specifications
Parameter Temperature Non-Operating Operating Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/second Packaged Half sine 2 millisecond Product Weight (pounds) <20 21-40 41-80 81-100 Vibration Unpackaged 5 Hz to 20 Hz: 0.01 g Hz sloping up to 0.02 g Hz 20 Hz to 500 Hz: 0.02 g Hz (flat) Packaged 5 Hz to 40 Hz: 0.015 g Hz (flat) 40 Hz to 500 Hz: 0.015 g Hz sloping down to 0.00015 g Hz Free Fall (inches) 36 30 24 18 Velocity Change (inches/sec) 167 152 136 118 -40 C to +60 C 0 C to +40 C Specification

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Intel Desktop Board DH55PJ Technical Product Specification

58

3
3.1

Overview of BIOS Features

Introduction

The board uses an Intel BIOS that is stored in a 64 Mbit (8,192 KB) Serial Peripheral Interface Flash Memory (SPI Flash) device which can be updated using a set of utilities. The SPI Flash contains the BIOS Setup program, POST, LAN EEPROM information, Plug and Play support, and other firmware. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as TCIBX10H.86A. The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below. Maintenance Main Advanced Performance Security Power Boot Exit

NOTE
The maintenance menu is displayed only when the board is in configure mode. Section 2.3 on page 49 shows how to put the board in configure mode.

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Intel Desktop Board DH55PJ Technical Product Specification

Table 32 lists the BIOS Setup program menu features. Table 32. BIOS Setup Program Menu Bar
Maintenance Clears displays processor information Main Displays and memory configuration Advanced Configures advanced features available through the chipset Performance Configures Memory and Processor overrides Security Sets passwords and security features Power Configures power management features Boot Selects boot options Exit Saves or discards changes to Setup program options

passwords and processor

Table 33 lists the function keys available for menu screens. Table 33. BIOS Setup Program Function Keys
BIOS Setup Program Function Key
<> or <> <> or <> <Tab> <Enter> <F9> <F10> <Esc>

Description
Selects a different menu screen (Moves the cursor left or right) Selects an item (Moves the cursor up or down) Selects sub-items within a field (i.e., date/time) Executes command or selects the submenu Load the default configuration values for the current menu Save the current values and exits the BIOS Setup program Exits the menu

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Overview of BIOS Features

3.2

System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information: BIOS data, such as the BIOS revision level Fixed-system data, such as peripherals, serial numbers, and asset tags Resource data, such as memory size, cache size, and processor speed Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page.

3.3

Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating systems USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2. POST begins. 3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu. 4. POST completes. 5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.) 6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used.

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Intel Desktop Board DH55PJ Technical Product Specification

3.4

BIOS Updates
Intel Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive. Intel Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive. Intel F7 switch allows a user to select where the BIOS .bio file is located and perform the update from that location/device. Similar to performing a BIOS Recovery without removing the BIOS configuration jumper.

The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site:

Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS.

NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
For information about
BIOS update utilities

Refer to
http://www.intel.com/support/motherboards/desktop/sb/C S-022312.htm.

3.4.1

Language Support

The BIOS Setup program and help messages are supported in US English.

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Overview of BIOS Features

3.4.2

Custom Splash Screen

During POST, an Intel splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrators Toolkit that is available from Intel can be used to create a custom splash screen.
Refer to
http://developer.intel.com/design/motherbd/software/itk/ http://developer.intel.com/products/motherboard/DH55PJ/t ools.htm and http://developer.intel.com/design/motherbd/software.htm

For information about

Intel Integrator Toolkit Additional Intel software tools

3.5

BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 34 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable however, it must contain the motherboard .bio file at the root level. Table 34. Acceptable Drives/Media Types for BIOS Recovery
Media Type
Optical drive connected to the SATA interface USB removable drive (a USB Flash Drive, for example) USB diskette drive (with a 1.44 MB diskette) USB hard disk drive Legacy diskette drive (with a 1.44 MB diskette) connected to the legacy diskette drive interface

Can be used for BIOS recovery?

Yes Yes No No No

For information about

BIOS recovery

Refer to
http://www.intel.com/support/motherboards/desktop/sb/ cs-023360.htm

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Intel Desktop Board DH55PJ Technical Product Specification

3.6

Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.

3.6.1

Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the optical drive is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the optical drive, the system will attempt to boot from the next defined drive.

3.6.2

Network Boot

The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed. Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.

3.6.3

Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present: Video adapter Keyboard Mouse

3.6.4

Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices. Table 35 lists the boot device menu options. Table 35. Boot Device Menu Options
Boot Device Menu Function Keys
<> or <> <Enter> <Esc>

Description
Selects a default boot device Exits the menu, and boots from the selected device Exits the menu and boots according to the boot priority defined through BIOS setup

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Overview of BIOS Features

3.7

BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode. The user password gives restricted access to view and change Setup options in the BIOS Setup program. This is the user mode. If only the supervisor password is set, pressing the <Enter> key at the password prompt of the BIOS Setup program allows the user restricted access to Setup. If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered. Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer. For enhanced security, use different passwords for the supervisor and user passwords. Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in length.

Table 36 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen. Table 36. Supervisor and User Password Functions
Password Set
Neither Supervisor only User only Supervisor and user set Note:

Supervisor Mode
Can change all options (Note) Can change all options N/A Can change all options

User Mode
Can change all options (Note)

Setup Options
None

Password to Enter Setup

None Supervisor

Password During Boot

None None

Can change a Supervisor Password limited number of options Can change all options Enter Password Clear User Password

User Supervisor or user

User Supervisor or user

Can change a Supervisor Password limited number Enter Password of options

If no password is set, any user can change all Setup options.

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4
4.1

Error Messages and Beep Codes

Speaker

The board-mounted piezoelectric speaker provides audible error code (beep code) information during POST.
For information about
The location of the onboard speaker

Refer to
Figure 1, page 11

4.2

BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the boards piezoelectric speaker to beep an error message describing the problem (see Table 37). Table 37. BIOS Beep Codes
Type Pattern Frequency/Comments
932 Hz F2 Setup/F10 Boot Menu One 0.5 second beep when BIOS is ready to Prompt accept keyboard input. BIOS update in progress Video error (no add-in graphics card installed) None On-off (1.0 second each) two times, then 2.5-second pause (off), entire pattern repeats (beeps and pause) once and the BIOS will continue to boot. On-off (1.0 second each) three times, then 2.5-second pause (off), entire pattern repeats (beeps and pause) until the system is powered off. Alternate high and low beeps (1.0 second each) for eight beeps, followed by system shut down. 932 Hz For processors requiring an add-in graphics card 932 Hz

Memory error

Thermal trip warning

High beep 2000 Hz Low beep 1500 Hz

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Intel Desktop Board DH55PJ Technical Product Specification

4.3

Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the boards front panel power LED to blink an error message describing the problem (see Table 38). Table 38. Front-panel Power LED Blink Codes
Type Pattern Note
F2 Setup/F10 Boot Menu None Prompt BIOS update in progress Off when the update begins, then on for 0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete. On-off (1.0 second each) two times, then 2.5-second pause (off), entire pattern repeats (blink and pause) until the system is powered off. On-off (1.0 second each) three times, then 2.5-second pause (off), entire pattern repeats (blinks and pause) until the system is powered off. Each beep will be accompanied by the following blink pattern: .25 seconds On, .25 seconds Off, .25 seconds On, .25 seconds Off. This will result in a total of 16 blinks. For processors requiring an add-in graphics card

Video error (no add-in graphics card installed)

Memory error

Thermal trip warning

4.4

BIOS Error Messages

Table 39 lists the error messages and provides a brief description of each. Table 39. BIOS Error Messages
Error Message
CMOS Battery Low CMOS Checksum Bad Memory Size Decreased No Boot Device Available

Explanation
The battery may be losing power. Replace the battery soon. The CMOS checksum is incorrect. CMOS memory may have been corrupted. Run Setup to reset values. Memory size has decreased since the last boot. If no memory was removed, then memory may be bad. System did not find a device to boot.

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Error Messages and Beep Codes

4.5

Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a PCI bus add-in card, often called a POST card. The POST card can decode the port and display the contents on a medium such as a seven-segment display.

NOTE
The POST card must be installed in the PCI bus connector. The following tables provide information about the POST codes generated by the BIOS: Table 40 lists the Port 80h POST code ranges Table 41 lists the Port 80h POST codes themselves Table 42 lists the Port 80h POST sequence

NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal. Table 40. Port 80h POST Code Ranges
Range
00 0F 10 1F 20 2F 30 3F 40 4F 50 5F 60 6F 70 7F 80 8F 90 9F A0 AF B0 BF C0 CF D0 DF E0 FF

Category/Subsystem
Debug codes: Can be used by any PEIM/driver for debug. Host Processors: 1F is an unrecoverable CPU error. Memory/Chipset: 2F is no memory detected or no useful memory detected. Recovery: 3F indicated recovery failure. Reserved for future use. I/O Busses: PCI, USB, ATA, etc. 5F is an unrecoverable error. Start with PCI. Reserved for future use (for new busses). Output Devices: All output consoles. 7F is an unrecoverable error. Reserved for future use (new output console codes). Input devices: Keyboard/Mouse. 9F is an unrecoverable error. Reserved for future use (new input console codes). Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error. Reserved for future use. Boot device selection. E0 EE: Miscellaneous codes. See Table 41. EF: boot/S3 resume failure. F0 FF: FF processor exception.

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Intel Desktop Board DH55PJ Technical Product Specification

Table 41. Port 80h POST Codes

POST Code
10 11 12 13

Description of POST Operation Host Processor

Power-on initialization of the host processor (Boot Strap Processor) Host processor cache initialization (including APs) Starting Application processor initialization SMM initialization

Chipset
21 Initializing a chipset component

Memory
22 23 24 25 26 27 29 Reading SPD from memory DIMMs Detecting presence of memory DIMMs Programming timing parameters in the memory controller and the DIMMs Configuring memory Optimizing memory settings Initializing memory, such as ECC init Memory testing completed

PCI Bus
50 51 52 53 57 Enumerating PCI busses Allocating resources to PCI bus Hot Plug PCI controller initialization Reserved for PCI Bus

USB
58 59 Resetting USB bus Reserved for USB

ATA/ATAPI/SATA
5A 5B Resetting PATA/SATA bus and all devices Reserved for ATA

SMBus
5C 5D Resetting SMBus Reserved for SMBus

Local Console
70 71 72 Resetting the VGA controller Disabling the VGA controller Enabling the VGA controller

Remote Console
78 79 7A Resetting the console controller Disabling the console controller Enabling the console controller

continued

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Error Messages and Beep Codes

Table 41. Port 80h POST Codes (continued)

POST Code
90 91 92 93 94 95

Description of POST Operation Keyboard (USB)

Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS/2 only)

Mouse (USB)
98 99 9A 9B Resetting mouse Disabling mouse Detecting presence of mouse Enabling mouse

Fixed Media
B0 B1 B2 B3 Resetting fixed media Disabling fixed media Detecting presence of a fixed media (hard drive detection etc.) Enabling/configuring a fixed media

Removable Media
B8 B9 BA BC Resetting removable media Disabling removable media Detecting presence of a removable media (CD-ROM detection, etc.) Enabling/configuring a removable media

BDS
Dy Trying boot selection y (y=0 to 15)

PEI Core
E0 E2 E1, E3 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN EFI_SW_PEI_PC_HANDOFF_TO_NEXT) Permanent memory found Reserved for PEI/PEIMs

DXE Core
E4 E5 E6 Entered DXE phase Started dispatching drivers Started connecting drivers

continued

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Intel Desktop Board DH55PJ Technical Product Specification

Table 41. Port 80h POST Codes (continued)

POST Code
E7 E8 E9 EB

Description of POST Operation DXE Drivers

Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs

Runtime Phase/EFI OS Boot

F4 F5 F8 F9 FA Entering Sleep state Exiting Sleep state EFI boot service ExitBootServices ( ) has been called EFI runtime service SetVirtualAddressMap ( ) has been called EFI runtime service ResetSystem ( ) has been called

PEIMs/Recovery
30 31 34 35 3F Crisis Recovery has initiated per user request Crisis Recovery has initiated by software (corrupt flash) Loading recovery capsule Handing off control to the recovery capsule Unable to recover

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Table 42. Typical Port 80h POST Sequence

POST Code
21 22 23 25 28 34 E4 12 13 50 51 92 90 94 95 EB 58 5A 92 90 94 5A 28 90 94 E7 01 00

Description
Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase Starting application processor initialization SMM initialization Enumerating PCI busses Allocating resourced to PCI bus Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Keyboard Self Test Calling Video BIOS Resetting USB bus Resetting PATA/SATA bus and all devices Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Resetting PATA/SATA bus and all devices Testing memory Resetting keyboard Clearing keyboard input buffer Waiting for user input INT 19 Ready to boot

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Intel Desktop Board DH55PJ Technical Product Specification

74

Regulatory Compliance and Battery Disposal Information

Regulatory Compliance
Safety standards European Union Declaration of Conformity statement Product Ecology statements Electromagnetic Compatibility (EMC) standards Product certification markings

5.1

This section contains the following regulatory compliance information for Intel Desktop Board DH55PJ:

5.1.1

Safety Standards

The Intel Desktop Board DH55PJ complies with the safety standards stated in Table 43 when correctly installed in a compatible host system. Table 43. Safety Standards
Standard
CSA/UL 60950-1 EN 60950-1 IEC 60950-1

Title
Information Technology Equipment Safety - Part 1: General Requirements (USA and Canada) Information Technology Equipment Safety - Part 1: General Requirements (European Union) Information Technology Equipment Safety - Part 1: General Requirements (International)

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Intel Desktop Board DH55PJ Technical Product Specification

5.1.2

European Union Declaration of Conformity Statement

We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board DH55PJ is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive). The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC, 2006/95/EC, and 2002/95/EC. etina Tento vrobek odpovd poadavkm evropskch smrnic 2004/108/EC, 2006/95/EC a 2002/95/EC. Dansk Dette produkt er i overensstemmelse med det europiske direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC. Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC, 2006/95/EC & 2002/95/EC. Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja 2002/95/EC kehtestatud nuetele. Suomi Tm tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC mryksi. Franais Ce produit est conforme aux exigences de la Directive Europenne 2004/108/EC, 2006/95/EC & 2002/95/EC. Deutsch Dieses Produkt entspricht den Bestimmungen der Europischen Richtlinie 2004/108/EC, 2006/95/EC & 2002/95/EC. 2004/108/EC, 2006/95/EC 2002/95/EC. Magyar E termk megfelel a 2004/108/EC, 2006/95/EC s 2002/95/EC Eurpai Irnyelv elrsainak. Icelandic essi vara stenst regluger Evrpska Efnahags Bandalagsins nmer 2004/108/EC, 2006/95/EC, & 2002/95/EC. Italiano Questo prodotto conforme alla Direttiva Europea 2004/108/EC, 2006/95/EC & 2002/95/EC. Latvieu is produkts atbilst Eiropas Direktvu 2004/108/EC, 2006/95/EC un 2002/95/EC noteikumiem. Lietuvi is produktas atitinka Europos direktyv 2004/108/EC, 2006/95/EC, ir 2002/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC, 2006/95/EC u 2002/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/EC, 2006/95/EC & 2002/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC, 206/95/EC i 2002/95/EC.

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Regulatory Compliance and Battery Disposal Information

Portuguese Este produto cumpre com as normas da Diretiva Europia 2004/108/EC, 2006/95/EC & 2002/95/EC. Espaol Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC. Slovensky Tento produkt je v slade s ustanoveniami eurpskych direktv 2004/108/EC, 2006/95/EC a 2002/95/EC. Slovenina Izdelek je skladen z dolobami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC. Trke Bu rn, Avrupa Birliinin 2004/108/EC, 2006/95/EC ve 2002/95/EC ynergelerine uyar.

5.1.3

Product Ecology Statements

The following information is provided to address worldwide product ecology concerns and regulations.

5.1.3.1

Disposal Considerations

This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly.

5.1.3.2

Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intels branded products to return used products to selected locations for proper recycling. Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc. Intel Product Recycling Program http://www.intel.com/intel/other/ehs/product_ecology Deutsch Als Teil von Intels Engagement fr den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermglicht, gebrauchte Produkte an ausgewhlte Standorte fr ordnungsgemes Recycling zurckzugeben. Details zu diesem Programm, einschlielich der darin eingeschlossenen Produkte, verfgbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der http://www.intel.com/intel/other/ehs/product_ecology

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Intel Desktop Board DH55PJ Technical Product Specification

Espaol Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envo, trminos y condiciones, etc. Franais Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en uvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits uss en les retournant des adresses spcifies. Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, savoir les produits concerns, les adresses disponibles, les instructions d'expdition, les conditions gnrales, etc. http://www.intel.com/in tel/other/ehs/product_ecology Malay Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul. Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb. Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos so reciclados de maneira adequada. Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Ingls) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponveis, as instrues de envio, os termos e condies, etc.

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Regulatory Compliance and Battery Disposal Information

Russian , Intel Intel (Product Recycling Program) Intel . , - http://www.intel.com/intel/other/ehs/product_ecology , , , , .. Trke Intel, evre sorumluluuna bamllnn bir paras olarak, perakende tketicilerin Intel markal kullanlm rnlerini belirlenmi merkezlere iade edip uygun ekilde geri dntrmesini amalayan Intel rnleri Geri Dnm Programn uygulamaya koymutur. Bu programn rn kapsam, rn iade merkezleri, nakliye talimatlar, kaytlar ve artlar v.s dahil btn ayrntlarn grenmek iin ltfen http://www.intel.com/intel/other/ehs/product_ecology Web sayfasna gidin.

5.1.4

EMC Regulations

The Intel Desktop Board DH55PJ complies with the EMC regulations stated in Table 44 when correctly installed in a compatible host system. Table 44. EMC Regulations
Regulation
FCC 47 CFR Part 15, Subpart B ICES-003 EN55022 EN55024 EN55022 CISPR 22 CISPR 24 VCCI V-3, V-4 KN-22, KN-24 CNS 13438

Title
Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio Frequency Devices. (USA) Interference-Causing Equipment Standard, Digital Apparatus. (Canada) Limits and methods of measurement of Radio Interference Characteristics of Information Technology Equipment. (European Union) Information Technology Equipment Immunity Characteristics Limits and methods of measurement. (European Union) Australian Communications Authority, Standard for Electromagnetic Compatibility. (Australia and New Zealand) Limits and methods of measurement of Radio Disturbance Characteristics of Information Technology Equipment. (International) Information Technology Equipment Immunity Characteristics Limits and Methods of Measurement. (International) Voluntary Control for Interference by Information Technology Equipment. (Japan) Korean Communications Commission Framework Act on Telecommunications and Radio Waves Act (South Korea) Bureau of Standards, Metrology, and Inspection (Taiwan)

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FCC Declaration of Conformity This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124 1-800-628-8686 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver. Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications to the equipment not expressly approved by Intel Corporation could void the users authority to operate the equipment. Tested to comply with FCC standards for home or office use. Canadian Department of Communications Compliance Statement This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications. Le prsent appareil numerique nmet pas de bruits radiolectriques dpassant les limites applicables aux appareils numriques de la classe B prescrites dans le Rglement sur le broullage radiolectrique dict par le ministre des Communications du Canada.

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Japan VCCI Statement Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.

Korea Class B Statement Korea Class B Statement translation: This equipment is for home use, and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas..

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5.1.5

ENERGY STAR* 5.0, e-Standby, and ErP Compliance

The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements. Intel Desktop Board DH55PJ meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply: Energy Star v5.0, category A EPEAT* Korea e-Standby European Union Energy-related Products Directive 2009 (ErP)
Refer to
http://www.intel.com/go/energystar http://www.epeat.net/ http://www.kemco.or.kr/new_eng/pg02/ pg02100300.asp http://ec.europa.eu/enterprise/policies/s ustainable-business/sustainable-productpolicy/ecodesign/index_en.htm

For information about

ENERGY STAR requirements and recommended configurations Electronic Product Environmental Assessment Tool (EPEAT) Korea e-Standby Program European Union Energy-related Products Directive 2009 (ErP)

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5.1.6

Regulatory Compliance Marks (Board Level)

Intel Desktop Board DH55PJ has the regulatory compliance marks shown in Table 45. Table 45. Regulatory Compliance Marks
Description
UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment.

Mark

CE mark. Declaring compliance to the European Union (EU) EMC directive, Low Voltage directive, and RoHS directive.

Australian Communications Authority (ACA) and New Zealand Radio Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code number, N-232. Japan VCCI (Voluntary Control Council for Interference) mark.

KCC (Korean Communications Commission) EMC certification mark. Includes adjacent KCC certification number: CPU-DH55PJ (B).

Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025. Printed wiring board manufacturers recognition mark. Consists of a unique UL recognized manufacturers logo, along with a flammability rating (solder side). China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined to be 10 years. V-0

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5.2

Battery Disposal Information

CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.

PRCAUTION
Risque d'explosion si la pile usage est remplace par une pile de type incorrect. Les piles usages doivent tre recycles dans la mesure du possible. La mise au rebut des piles usages doit respecter les rglementations locales en vigueur en matire de protection de l'environnement.

FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier br om muligt genbruges. Bortskaffelse af brugte batterier br foreg i overensstemmelse med gldende miljlovgivning.

OBS!
Det kan oppst eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier br kastes i henhold til gjeldende miljlovgivning.

VIKTIGT!
Risk fr explosion om batteriet erstts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljvrdsbestmmelserna.

VARO
Rjhdysvaara, jos pariston tyyppi on vr. Paristot on kierrtettv, jos se on mahdollista. Kytetyt paristot on hvitettv paikallisten ympristmrysten mukaisesti.

VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.

AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.

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PRECAUCIN
Existe peligro de explosin si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.

WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

ATENO
Haver risco de exploso se a bateria for substituda por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminao de baterias usadas deve ser feita de acordo com as regulamentaes ambientais da regio.

ACIAROZNA
, . , , . .

UPOZORNN
V ppad vmny baterie za nesprvn druh me dojt k vbuchu. Je-li to mon, baterie by mly bt recyklovny. Baterie je teba zlikvidovat v souladu s mstnmi pedpisy o ivotnm prosted.

. . .

VIGYZAT
Ha a telepet nem a megfelel tpus telepre cserli, az felrobbanhat. A telepeket lehetsg szerint jra kell hasznostani. A hasznlt telepeket a helyi krnyezetvdelmi elrsoknak megfelelen kell kiselejtezni.

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AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.

OSTRZEENIE
Istnieje niebezpieczestwo wybuchu w przypadku zastosowania niewaciwego typu baterii. Zuyte baterie naley w miar moliwoci utylizowa zgodnie z odpowiednimi przepisami ochrony rodowiska.

PRECAUIE
Risc de explozie, dac bateria este nlocuit cu un tip de baterie necorespunztor. Bateriile trebuie reciclate, dac este posibil. Depozitarea bateriilor uzate trebuie s respecte reglementrile locale privind protecia mediului.

. . , .

UPOZORNENIE
Ak batriu vymente za nesprvny typ, hroz nebezpeenstvo jej vbuchu. Batrie by sa mali poda monosti vdy recyklova. Likvidcia pouitch batri sa mus vykonva v slade s miestnymi predpismi na ochranu ivotnho prostredia.

POZOR
Zamenjava baterije z baterijo druganega tipa lahko povzroi eksplozijo. e je mogoe, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi.

UYARI
Yanl trde pil takldnda patlama riski vardr. Piller mmkn olduunda geri dntrlmelidir. Kullanlm piller, yerel evre yasalarna uygun olarak atlmaldr.

O
, . , . , .

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